Fiber Optics Small Form Factor Single Mode 1300 nm Multirate up to 2.5 Gbit/s Transceiver 2x10 Pinning with LC™ Connector, with Collar V23818-N15-L6xx Features • • • • • • • • • • • • • • • • • 1) Small Form Factor transceiver Multisource 2x10 footprint, SFF MSA compliant1) Small footprint for high port density RJ-45 style LC™ connector system Half the size of SC Duplex 1x9 transceiver Compliant with SDH STM-16 / SONET OC-48 standards Suitable for multirate applications up to 2.5 Gbit/s Single power supply (3.3 V) Extremely low power consumption, 600 mW typical Loss of optical signal indicator Tx and Rx power monitor functions Laser disable, LVTTL input LVPECL differential inputs and outputs For distance of up to 15 km on single mode fiber (SMF) Class 1 FDA and IEC laser safety compliant UL 94 V-0 certified Compliant with FCC (Class B) and EN 55022 File: 1119 Current MSA documentation can be found at www.infineon.com/fiberoptics LC™ is a trademark of Lucent Part Number Voltage Signal Detect Operating Temperature Input Output V23818-N15-L616 3.3 V LVPECL –40...80°C DC DC V23818-N15-L653 3.3 V LVTTL 0...70°C AC AC V23818-N15-L656 Data Sheet –40...80°C 1 2003-09-10 V23818-N15-L6xx Pin Configuration Pin Configuration Tx MS HL HL 20 19 18 17 16 15 14 13 12 11 TOP VIEW Rx MS HL 1 2 3 4 5 6 7 8 9 10 HL File: 1335 Figure 1 Pin Connect Diagram Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 MS HL 1) Symbol Level/Logic Description PDBias DC current Ground Ground PIN photo detector bias current Receiver signal ground Receiver signal ground Not connected Not connected Receiver signal ground Receiver power supply Receiver optical input level monitor Receiver data out bar Receiver data out Transmitter power supply Transmitter signal ground Transmitter disable Transmitter data in Transmitter data in bar Transmitter signal ground Laser diode bias current monitor Laser diode bias current monitor Laser diode optical power monitor Laser diode optical power monitor Mounting studs Housing leads VEEr VEEr NC NC VEEr VCCr SD RD– RD+ VCCt VEEt TDis TD+ TD– VEEt BMon– BMon+ PMon– PMon+ Ground Power supply LVTTL or LVPECL output1) LVPECL output LVPECL output Power supply Ground LVTTL input LVPECL input LVPECL input Ground DC voltage DC voltage DC voltage DC voltage LVPECL output active high for V23818-N15-L616. LVTTL output active high for V23818-N15-L653/L656. Data Sheet 2 2003-09-10 V23818-N15-L6xx Pin Configuration VEEr / VEEt Connect pins 2, 3, 6, 12 and 16 to signal ground. VCCr / VCCt A 3.3 V DC power supply must be applied at pins 7 and 11. A recommended power supply filter network is given in the termination scheme. Locate power supply filtering directly at the transceiver power supply pins. Proper power supply filtering is essential for good EMI performance. TD+ / TD– Transmitter data LVPECL level inputs. For V23818-N15-L653/L656 terminated and AC coupled internally. For V23818-N15-L616 use termination and coupling as shown in the termination scheme. RD– / RD+ Receiver data LVPECL level outputs. For V23818-N15-L653/L656 biased and AC coupled internally. For V23818-N15-L616 use termination and coupling as shown in the termination scheme. TDis A logical LVTTL high input will disable the laser. To enable the laser, an LVTTL low input must be applied. Leave pin unconnected if feature not required. SD LVTTL output for V23818-N15-L653/L656. LVPECL output for V23818-N15-L616. A logical high output indicates normal optical input levels to the receiver. Low optical input levels at the receiver result in an LVTTL low output. Signal Detect can be used to determine a definite optical link failure; break in fiber, unplugging of a connector, faulty laser source. However it is not a detection of a bad link due to data-related errors. MS Mounting studs are provided for transceiver mechanical attachment to the circuit board. They also provide an optional connection of the transceiver to the equipment chassis ground. The holes in the circuit board must be tied to chassis ground. HL Housing leads are provided for additional signal grounding. The holes in the circuit board must be included and tied to signal ground. Data Sheet 3 2003-09-10 V23818-N15-L6xx Pin Configuration PDBias Connect pin 1 to VCC through a bias resistor, of a value not exceeding 2 kΩ, as shown in Figure 2 to monitor PIN photo detector bias current. Leave pin floating if not used. Typical behaviour is shown in Figure 3 and Figure 4 using a 2 kΩ load. VCC ≤ 2 kΩ Vbias Pin 1 Figure 2 Data Sheet File: 1307 Photo Detector Bias Interface 4 2003-09-10 V23818-N15-L6xx Pin Configuration Typical Responsitivity of PIN Photo Detector Bias Current Monitor Photo Detector Monitor Current (µA) 400 300 200 100 0 0 100 200 300 400 Received Optical Power (µW) Figure 3 File: 1308 Linear Response Photo Detector Monitor Current (µA) 400 300 200 100 0 −30 −24 −18 −12 Received Optical Power (dBm) Figure 4 Data Sheet −6 0 File: 1309 Logarithmic Response 5 2003-09-10 V23818-N15-L6xx Pin Configuration BMon– / BMon+ The DC voltage measured across pins 17 and 18 is proportional to the laser bias current. Use the equation: Ibias = Vbias /10 Ω Use this output to monitor laser performance and EOL conditions. A schematic and typical behaviour are shown in Figure 5 and Figure 6. Ibias @ ambient 25°C < 60 mA. Leave pins floating if function is not required. VCC Pin 18 3 kΩ 10 Ω Pin 17 3 kΩ VEE File: 1310 Figure 5 Bias Monitor – Transceiver Internal 0.36 BMon Output Voltage (V) 0.32 0.28 0.24 0.2 0.16 0.12 0.08 0.04 0 0 10 20 30 40 50 60 70 Temperature (˚C) File: 1312 Figure 6 Data Sheet Typical Variations of Bias Monitor Voltage over Temperature 6 2003-09-10 V23818-N15-L6xx Pin Configuration PMon– / PMon+ The DC voltage that can be measured across pins 19 and 20 is proportional to the laser monitor diode current through a 200 Ω resistor in its path. This output remains constant and can be used to monitor correct operation of laser control circuitry, a deviation indicates faulty behaviour. A schematic and typical behaviour are shown in Figure 7 and Figure 8. The SFF MSA defines that Vmon must be in the range of 0.01 V and 0.2 V. The Infineon OC-48 transceiver has a nominal range of 0.04 to 0.08 V. Leave pins unconnected if feature is not required. VCC Pin 20 3 kΩ 200 Ω Pin 19 3 kΩ R VEE File: 1311 Figure 7 Power Monitor – Transceiver Internal 0.08 PMon Output Voltage (V) 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0.00 0 10 20 30 40 50 60 70 Temperature (˚C) File: 1313 Figure 8 Data Sheet Typical Behaviour of Power Monitor Voltage over Temperature 7 2003-09-10 V23818-N15-L6xx Description Description The Infineon 2.5 Gigabit single mode transceiver – part of the Infineon Small Form Factor transceiver family – is based on and compliant to ITU-T G.957 STM-16, S-16.1 and SONET OC-48 SR-1. This transceiver is also suitable for multirate applications. The performance at lower datarates may vary from application to application and is link dependent. Refer to Infineon Application Note 97 for more information. The appropriate fiber optic cable is 9 µm single mode fiber with LC connector. The Infineon OC-48 single mode transceiver is a single unit comprised of a transmitter, a receiver, and an LC receptacle. This design frees the customer from many alignment and PC board layout concerns. This transceiver supports the LC connectorization concept, which competes with UTP/ CAT 5 solutions. It is compatible with RJ-45 style backpanels for fiber-to-the-desktop applications while providing the advantages of fiber optic technology. The transmission distance is up to 15 km. The module is designed for low cost LAN, WAN, and up to 2.5 Gbit/s applications. It can be used as the network end device interface in mainframes, workstations, servers, and storage devices, and in a broad range of network devices such as bridges, routers, hubs, and local and wide area switches. This transceiver operates at up to 2.5 Gbit/s from a single power supply (+3.3 V). The full differential data inputs and outputs are LVPECL compatible. Data Sheet 8 2003-09-10 V23818-N15-L6xx Description Functional Description This transceiver is designed to transmit serial data via single mode fiber. BMonBMon+ Automatic Shut-Down Tx Coupling Unit TDis 3k TDTD+ Laser Driver 10 Power Control 200 PMonPMon+ RDRD+ SD 3k e/o Laser o/e 3k Monitor Rx Coupling Unit Receiver Single Mode Fiber o/e PDBias Figure 9 3k File: 1357 Functional Diagram The receiver component converts the optical serial data into an electrical data (RD+ and RD–). The Signal Detect output (SD) shows whether an optical signal is present. The transmitter part converts electrical LVPECL compatible serial data (TD+ and TD–) into optical serial data. The module has an integrated shutdown function that switches the laser off in the event of an internal failure. Reset is only possible if the power is turned off, and then on again. (VCCt switched below VTH). The transmitter contains a laser driver circuit that drives the modulation and bias current of the laser diode. The currents are controlled by a power control circuit to guarantee constant output power of the laser over temperature and aging. The power control uses the output of the monitor PIN diode (mechanically built into the laser coupling unit) as a controlling signal, to prevent the laser power from exceeding the operating limits. Data Sheet 9 2003-09-10 V23818-N15-L6xx Description Regulatory Compliance Feature Standard Comments ESD: Electrostatic Discharge to the Electrical Pins EIA/JESD22-A114-B (MIL-STD 883D Method 3015.7) Class 1C Immunity: Against Electrostatic Discharge (ESD) to the Duplex LC Receptacle EN 61000-4-2 IEC 61000-4-2 Discharges ranging from ±2 kV to ±15 kV on the receptacle cause no damage to transceiver (under recommended conditions). Immunity: Against Radio Frequency Electromagnetic Field EN 61000-4-3 IEC 61000-4-3 With a field strength of 3 V/m, noise frequency ranges from 10 MHz to 2 GHz. No effect on transceiver performance between the specification limits. Emission: Electromagnetic Interference (EMI) FCC 47 CFR Part 15, Class B EN 55022 Class B CISPR 22 Noise frequency range: 30 MHz to 18 GHz (13.97) *) .550 *) min. pitch between SFF transceiver according to MSA. Dimensions in (mm) inches Figure 10 Data Sheet File: 1501 Transceiver Pitch 10 2003-09-10 V23818-N15-L6xx Technical Data Technical Data Absolute Maximum Ratings Parameter Symbol Limit Values min. Package Power Dissipation Unit max. 0.9 W 4 V VEE–0.5 V 5 V 85 °C Hand Lead Soldering Temp/Time 260/10 °C/s Wave Soldering Temp/Time 260/10 °C/s Aqueous Wash Pressure < 110 psi VCC–VEE Supply Voltage VCC+0.5 Data Input Levels VIDpk-pk Differential Data Input Voltage Swing Storage Ambient Temperature –40 Exceeding any one of these values may destroy the device immediately. Data Sheet 11 2003-09-10 V23818-N15-L6xx Technical Data Recommended Operating Conditions Parameter Symbol Limit Values min. Ambient Temperature1), 2) TAMB Ambient Temperature1), 3) Power Supply Voltage VCC–VEE typ. max. 0 70 –40 80 3.14 3.3 Unit °C 3.46 V 110 mA –1165 –880 mV 500 3200 mV –1810 –1475 mV 120 ps 120 mA 1580 nm Transmitter ICCt Data Input High Voltage DC/DC VIH–VCC VIDpk-pk Differential Data Input Voltage Supply Current Tx Swing AC/AC 4) Data Input Low Voltage DC/DC Data Input Rise/Fall Time VIL–VCC ti Receiver Supply Current Rx ICCr Input Center Wavelength λRx 1) 2) 3) 4) 1260 Ambient operating temperature requires a 2 ms–1 airflow over the device. For V23818-N15-L653. For V23818-N15-L616/L656. External coupling capacitors required only for V23818-N15-L616. The electro-optical characteristics described in the following tables are valid only for use under the recommended operating conditions. Data Sheet 12 2003-09-10 V23818-N15-L6xx Technical Data Transmitter Electro-Optical Characteristics Transmitter Symbol Limit Values min. typ. Unit max. Output Power (Average) PO –5 0 dBm Center Wavelength λC 1266 1360 nm Spectral Width (–20 dB) σ 1 nm Side Mode Suppression Ratio SMSR 30 dB Extinction Ratio (Dynamic) ER 8.2 dB Optical Eye Mask ED Reset Threshold for VCCt 1) VTH tDEL JGEp-p JGERMS VTDH VTDL tASS tDAS Power on Delay 1) Jitter Generation2) TDis Assert Voltage LVTTL TDis Deassert Voltage LVTTL TDis Assert Time 3) TDis Deassert Time 4) 1) 2) 3) 4) Compliant with ITU-T G.957 2.2 2.99 30 V ms 0.04 0.1 UI 0.004 0.01 UI 2.0 V 0.8 V 0.4 1 ms 0.06 10 µs Laser power is shut down if power supply is below VTH and switched on if power supply is above VTH after tRES. Jitter Generation under worst case conditions reaches a maximum value of 0.06 UI pk-pk/0.006 UI RMS. Shown maximum values as according to standards. TDis assertion to laser shutdown. TDis reassertion to laser startup. Jitter The transceiver is specified to meet the SONET Jitter performance as outlined in ITU-T G.958 and Bellcore GR-253. Jitter Generation is defined as the amount of jitter that is generated by the transceiver. The Jitter Generation specifications are referenced to the optical OC-48 signals. If no or minimum jitter is applied to the electrical inputs of the transmitter, then Jitter Generation can simply be defined as the amount of jitter on the Tx optical output. The SONET specifications for Jitter Generation are 0.01 UI RMS, maximum and 0.1 UI pk-pk, maximum. Both are measured with a 12 kHz - 20 MHz filter in line. A UI is a Unit Interval, which is equivalent to one bit slot. At OC-48, the bit slot is 400 ps, so the Jitter Generation specification translates to 4 ps RMS, max. and 40 ps pk-pk, max. Data Sheet 13 2003-09-10 V23818-N15-L6xx Technical Data Receiver Electro-Optical Characteristics Receiver Symbol Limit Values min. Sensitivity (Average Power) 1) Saturation (Average Power) Signal Detect Assert Level 2) Signal Detect Deassert Level 3) Signal Detect Hysteresis Signal Detect Assert Time 2) Signal Detect Deassert Time3) Data Output High Voltage DC/DC 4) PIN PSAT PSDA PSDD PSDA –PSDD tASS tDAS VOH–VCC typ. Unit max. –19 0 dBm dBm –19 –30 dBm dBm 3 dB 0.1 ms 0.35 ms –1110 –650 mV Differential Data Output Voltage Swing AC/AC 4) VODpk-pk 1000 2000 mV Data Output Low Voltage DC/DC4) VOL–VCC –1800 –1300 mV Signal Detect Output High Voltage LVPECL 5), 6) VSDH–VEE VCC VCC mV –1200 –820 Signal Detect Output Low Voltage LVPECL 5), 6) VSDL–VEE VCC VCC –1900 –1580 Signal Detect Output High Voltage LVTTL 5), 7) VSDH Signal Detect Output Low Voltage LVTTL 5), 7) VSDL 0.5 V Photo Detector Bias Responsivity 8) PDBiasRES 0.5 1.0 A/W Photo Detector Bias Offset PDBiasOFF 5 15 µA Reflectance PREF –27 dB 1) 2) 3) 4) 5) 6) 2.4 mV V –33 Minimum average optical power at which the BER is less than 1x10–10. Measured with a 223–1 NRZ PRBS. An increase in optical power above the specified level will cause the Signal Detect to switch from a low state to a high state (high active output). A decrease in optical power below the specified level will cause the Signal Detect to switch from a high state to a low state. Load is 100 Ω differential. Internal Load is 510 Ω to GND, no external load necessary. Signal Detect is a high active output. High level means signal is present, low level means loss of signal. For V23818-N15-L616. Data Sheet 14 2003-09-10 V23818-N15-L6xx Eye Safety 7) 8) For V23818-N15-L653/L656. Monitor current needs to be sunk to VCC. Eye Safety This laser based single mode transceiver is a Class 1 product. It complies with IEC 60825-1 and FDA 21 CFR 1040.10 and 1040.11. The transceiver has been certified with FDA under accession number 9520890. To meet laser safety requirements the transceiver shall be operated within the Absolute Maximum Ratings. Attention: All adjustments have been made at the factory prior to shipment of the devices. No maintenance or alteration to the device is required. Tampering with or modifying the performance of the device will result in voided product warranty. Note: Failure to adhere to the above restrictions could result in a modification that is considered an act of “manufacturing”, and will require, under law, recertification of the modified product with the U.S. Food and Drug Administration (ref. 21 CFR 1040.10 (i)). Laser Data Wavelength 1300 nm Total Output Power (as defined by IEC: 7 mm aperture at 14 mm distance) < 2 mW Total Output Power (as defined by FDA: 7 mm aperture at 20 cm distance) < 180 µW Beam Divergence 6° FDA IEC Complies with 21 CFR 1040.10 and 1040.11 Class 1 Laser Product File: 1401 Figure 11 Required Labels Indication of laser aperture and beam 20 19 18 17 16 15 14 13 12 11 Tx Top view Rx 1 2 3 4 5 6 7 8 9 10 File: 1334 Figure 12 Data Sheet Laser Emission 15 2003-09-10 V23818-N15-L6xx EMI-Recommendations EMI-Recommendations To avoid electromagnetic radiation exceeding the required limits please take note of the following recommendations. When Gigabit switching components are found on a PCB (multiplexers, clock recoveries etc.) any opening of the chassis may produce radiation also at chassis slots other than that of the device itself. Thus every mechanical opening or aperture should be as small as possible. On the board itself every data connection should be an impedance matched line (e.g. strip line, coplanar strip line). Data, Datanot should be routed symmetrically, vias should be avoided. A terminating resistor of 100 Ω should be placed at the end of each matched line. An alternative termination can be provided with a 50 Ω resistor at each (D, Dn). In DC coupled systems a thevenin equivalent 50 Ω resistance can be achieved as follows: for 3.3 V: 125 Ω to VCC and 82 Ω to VEE, for 5 V: 82 Ω to VCC and 125 Ω to VEE at Data and Datanot. Please consider whether there is an internal termination inside an IC or a transceiver. In certain cases signal GND is the most harmful source of radiation. Connecting chassis GND and signal GND at the plate/bezel/chassis rear e.g. by means of a fiber optic transceiver may result in a large amount of radiation. Even a capacitive coupling between signal GND and chassis may be harmful if it is too close to an opening or an aperture. If a separation of signal GND and chassis GND is not planned, it is strongly recommended to provide a proper contact between signal GND and chassis GND at every location where possible. This concept is designed to avoid hotspots. Hotspots are places of highest radiation which could be generated if only a few connections between signal and chassis GND exist. Compensation currents would concentrate at these connections, causing radiation. By use of Gigabit switching components in a design, the return path of the RF current must also be considered. Thus a split GND plane of Tx and Rx portion may result in severe EMI problems. A recommendation is to connect the housing leads to signal GND. However, in certain applications it may improve EMI performance by connecting them to chassis GND. The cutout should be sized so that all contact springs make good contact with the face plate. Please consider that the PCB may behave like a waveguide. With an εr of 4, the wavelength of the harmonics inside the PCB will be half of that in free space. In this scenario even the smallest PCBs may have unexpected resonances. Data Sheet 16 2003-09-10 V23818-N15-L6xx Recommended Termination Schemes Recommended Termination Schemes BMon+ BMon− 18 17 Laser Driver VEEt 12,16 TD+ 14 100 Ω TD− 15 TDis 13 VCCt 11 VCCr 7 SD 8 VCC SerDes VCC C6 C8 SerDat Out + C7 SerDat Out − ECL/ PECL Driver TDis L1 VCC 3.3 V R5 19 R4 20 PMon− PMon+ 2x10 DC/DC Transceiver C1 SFF Transceiver Signal Detect Serializer/ Deserializer L2 C3 C10 C2 SD 1 PDBias RD− 9 RD+ RD+ 10 VEEr C4 SerDat In − R1 RD− C9 C5 SerDat In + Receiver PLL etc. 2,3,6 R3 Limiting Amplifier R2 PreAmp C1/2/3 = 4.7 ... 10 µF C4/5/6/7 = 100 nF C8/9/10 = Design criterion is the resonance frequency only. The self resonant frequency of the capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory. = 1 ... 4.7 µH L1/2*) R1 = 100 Ω (depending on SerDes chip used, ensure proper 50 Ω termination to VEE or 100 Ω differential is provided. Check for termination inside of SerDes chip). R2/3 = 150 Ω R4/5 = Biasing (depends on SerDes chip). Place R1/4/5 close to SerDes chip. Place R2/3 close to Infineon transceiver. *) The inductors may be replaced by appropriate Ferrite beads. File: 1390 Figure 13 Data Sheet 17 2003-09-10 V23818-N15-L6xx Recommended Termination Schemes BMon+ VCC SerDes 18 12,16 TD+ 14 100 Ω TD− 15 TDis 13 VCCt 11 VCC SerDat Out + C4 SerDat Out − TDis L1 VCC 3.3 V C1 SFF Transceiver VCCr Serializer/ Deserializer L2 7 C3 C6 C2 SD 8 SD R1 Signal Detect 1 PDBias Limiting Amplifier RD− 9 RD+ 10 VEEt SerDat In − C5 SerDat In + Receiver PLL etc. 2,3,6 R3 PreAmp ECL/ PECL Driver R6 Laser Driver VEEt R2 17 R4 19 R5 20 BMon− PMon− PMon+ 2x10 AC/AC Transceiver C1/2/3 C4/5/6 = 4.7 ... 10 µF = Design criterion is the resonance frequency only. The self resonant frequency of the capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory. *) = 1 ... 4.7 µH L1/2 R1/2/3/4 = Depends on SerDes chip used, ensure proper 50 Ω termination to VEE or 100 Ω differential is provided. Check for termination inside of SerDes chip. R5/6 = Biasing (depends on SerDes chip). Place R1/2/3/4/5/6 close to SerDes chip. *) The inductors may be replaced by appropriate Ferrite beads. File: 1391 Figure 14 Data Sheet 18 2003-09-10 V23818-N15-L6xx Package Outlines Package Outlines a) recommended bezel position Drawing shown is 2x10 pinning with collar Dimensions in mm [inches] File: 1213 Figure 15 Data Sheet 19 2003-09-10 V23818-N15-L6xx Revision History: 2003-09-10 Previous Version: 2001-11-01 Page DS1 Subjects (major changes since last revision) Document completely revised; “Preliminary Data” removed; V23818-N15-L613 deleted V23818-N15-L616 and V23818-N15-L656 added For questions on technology, delivery and prices please contact the Infineon Technologies Offices in Germany or the Infineon Technologies Companies and Representatives worldwide: see our webpage at http://www.infineon.com. Edition 2003-09-10 Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81541 München, Germany © Infineon Technologies AG 2003. All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide. Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. 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