PESDxS1UL series Unidirectional ESD protection diodes Rev. 3 — 25 October 2011 Product data sheet 1. Product profile 1.1 General description Unidirectional ElectroStatic Discharge (ESD) protection diodes in a SOD882 leadless ultra small Surface Mounted Device (SMD) plastic package designed to protect one signal line from the damage caused by ESD and other transients. 1.2 Features and benefits Ultra small SMD plastic package ESD protection of one line Max. peak pulse power: PPP = 150 W Low clamping voltage: VCL = 20 V AEC-Q101 qualified Ultra low leakage current: IRM < 700 nA ESD protection up to 30 kV IEC 61000-4-2; level 4 (ESD) IEC 61000-4-5; (surge); IPP up to 15 A 1.3 Applications Computers and peripherals Audio and video equipment Parallel ports Communication systems High-speed data lines 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter VRWM reverse standoff voltage Conditions Min Typ Max Unit PESD3V3S1UL - - 3.3 V PESD5V0S1UL - - 5.0 V PESD12VS1UL - - 12 V PESD15VS1UL - - 15 V - - 24 V PESD3V3S1UL - 207 300 pF PESD5V0S1UL - 152 200 pF PESD12VS1UL - 38 75 pF PESD15VS1UL - 32 70 pF PESD24VS1UL - 23 50 pF PESD24VS1UL Cd diode capacitance f = 1 MHz; VR = 0 V PESDxS1UL series NXP Semiconductors Unidirectional ESD protection diodes 2. Pinning information Table 2. Pinning Pin Description 1 cathode 2 anode Simplified outline Graphic symbol [1] 1 1 2 2 sym035 Transparent top view [1] The marking bar indicates the cathode. 3. Ordering information Table 3. Ordering information Type number PESD3V3S1UL Package Name Description - leadless ultra small plastic package; 2 terminals; SOD882 body 1.0 0.6 0.5 mm PESD5V0S1UL Version PESD12VS1UL PESD15VS1UL PESD24VS1UL 4. Marking Table 4. PESDXS1UL_SER Product data sheet Marking codes Type number Marking code PESD3V3S1UL G1 PESD5V0S1UL G2 PESD12VS1UL G3 PESD15VS1UL G4 PESD24VS1UL G5 All information provided in this document is subject to legal disclaimers. Rev. 3 — 25 October 2011 © NXP B.V. 2011. All rights reserved. 2 of 15 PESDxS1UL series NXP Semiconductors Unidirectional ESD protection diodes 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions PPP peak pulse power tp = 8/20 s [1] Min Max Unit IPP peak pulse current tp = 8/20 s [1] - 150 W PESD3V3S1UL - 15 A PESD5V0S1UL - 15 A PESD12VS1UL - 5 A PESD15VS1UL - 5 A PESD24VS1UL - 3 A Tj junction temperature - 150 C Tamb ambient temperature 65 +150 C Tstg storage temperature 65 +150 C [1] Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5. Table 6. ESD maximum ratings Symbol Parameter VESD Conditions Min Max Unit PESD3V3S1UL - 30 kV PESD5V0S1UL - 30 kV PESD12VS1UL - 30 kV PESD15VS1UL - 30 kV PESD24VS1UL - 23 kV - 10 kV electrostatic discharge voltage PESDxS1UL series [1] Product data sheet MIL-STD-883 (human body model) Device stressed with ten non-repetitive ESD pulses. Table 7. PESDXS1UL_SER IEC 61000-4-2 (contact discharge) [1] ESD standards compliance Standard Conditions IEC 61000-4-2; level 4 (ESD) > 15 kV (air); > 8 kV (contact) MIL-STD-883; class 3B (human body model) > 8 kV All information provided in this document is subject to legal disclaimers. Rev. 3 — 25 October 2011 © NXP B.V. 2011. All rights reserved. 3 of 15 PESDxS1UL series NXP Semiconductors Unidirectional ESD protection diodes 001aaa631 IPP 001aaa630 120 100 % 90 % 100 % IPP; 8 μs IPP (%) 80 e−t 50 % IPP; 20 μs 40 10 % 0 10 20 30 30 ns 40 t (μs) Fig 1. t tr = 0.7 ns to 1 ns 0 60 ns 8/20 s pulse waveform according to IEC 61000-4-5 Fig 2. ESD pulse waveform according to IEC 61000-4-2 6. Characteristics Table 8. Characteristics Tamb = 25 C unless otherwise specified Symbol Parameter Conditions VRWM reverse standoff voltage PESD3V3S1UL IRM VBR Product data sheet Typ Max Unit - - 3.3 V PESD5V0S1UL - - 5.0 V PESD12VS1UL - - 12 V PESD15VS1UL - - 15 V PESD24VS1UL - - 24 V reverse leakage current PESD3V3S1UL VRWM = 3.3 V - 0.7 2 A PESD5V0S1UL VRWM = 5.0 V - 0.1 1 A PESD12VS1UL VRWM = 12 V - <1 50 nA PESD15VS1UL VRWM = 15 V - <1 50 nA PESD24VS1UL VRWM = 24 V - <1 50 nA 5.2 5.6 6.0 V breakdown voltage IR = 5 mA PESD3V3S1UL PESDXS1UL_SER Min [1] PESD5V0S1UL 6.4 6.8 7.2 V PESD12VS1UL 14.7 15.0 15.3 V PESD15VS1UL 17.6 18.0 18.4 V PESD24VS1UL 26.5 27.0 27.5 V All information provided in this document is subject to legal disclaimers. Rev. 3 — 25 October 2011 © NXP B.V. 2011. All rights reserved. 4 of 15 PESDxS1UL series NXP Semiconductors Unidirectional ESD protection diodes Table 8. Characteristics …continued Tamb = 25 C unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit Cd diode capacitance f = 1 MHz; VR = 0 V PESD3V3S1UL - 207 300 pF PESD5V0S1UL - 152 200 pF PESD12VS1UL - 38 75 pF PESD15VS1UL - 32 70 pF - 23 50 pF IPP = 1 A - - 8 V IPP = 15 A - - 20 V IPP = 1 A - - 9 V IPP = 15 A - - 20 V IPP = 1 A - - 19 V IPP = 5 A - - 35 V IPP = 1 A - - 23 V IPP = 5 A - - 40 V IPP = 1 A - - 36 V IPP = 3 A - - 70 V PESD3V3S1UL IR = 1 mA - - 400 PESD5V0S1UL IR = 1 mA - - 80 PESD12VS1UL IR = 1 mA - - 200 PESD15VS1UL IR = 1 mA - - 225 PESD24VS1UL IR = 0.5 mA - - 300 PESD24VS1UL VCL PESD3V3S1UL PESD5V0S1UL PESD12VS1UL PESD15VS1UL PESD24VS1UL rdif PESDXS1UL_SER Product data sheet [2] clamping voltage differential resistance [1] Pulse test: tp 300 s; duty cycle 0.02. [2] Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5. All information provided in this document is subject to legal disclaimers. Rev. 3 — 25 October 2011 © NXP B.V. 2011. All rights reserved. 5 of 15 PESDxS1UL series NXP Semiconductors Unidirectional ESD protection diodes 001aaa726 104 001aaa193 1.2 PPP PPP (W) PPP(25°C) 103 0.8 102 0.4 10 102 10 1 0 103 0 tp (μs) 50 100 150 200 Tj (°C) Tamb = 25 C Fig 3. Peak pulse power as a function of exponential pulse duration; typical values Fig 4. 001aaa727 240 Cd (pF) Relative variation of peak pulse power as a function of junction temperature; typical values 001aaa728 50 Cd (pF) 200 40 160 30 (1) 120 20 (2) (1) (2) 80 10 40 (3) 0 0 1 2 3 4 5 0 5 10 15 VR (V) 20 25 VR (V) f = 1 MHz; Tamb = 25 C f = 1 MHz; Tamb = 25 C (1) PESD3V3S1UL; VRWM = 3.3 V (1) PESD12VS1UL; VRWM = 12 V (2) PESD5V0S1UL; VRWM = 5.0 V (2) PESD15VS1UL; VRWM = 15 V (3) PESD24VS1UL; VRWM = 24 V Fig 5. Diode capacitance as a function of reverse voltage; typical values PESDXS1UL_SER Product data sheet Fig 6. Diode capacitance as a function of reverse voltage; typical values All information provided in this document is subject to legal disclaimers. Rev. 3 — 25 October 2011 © NXP B.V. 2011. All rights reserved. 6 of 15 PESDxS1UL series NXP Semiconductors Unidirectional ESD protection diodes I 001aaa729 10 IRM IRM(25°C) (1) −VCL −VBR −VRWM (2) V −IRM −IR 1 − + P-N 10−1 −100 −50 −IPP 0 50 100 150 Tj (°C) 006aaa407 (1) PESD3V3S1UL; VRWM = 3.3 V (2) PESD5V0S1UL; VRWM = 5.0 V IR is less than 15 nA at 150 C for: PESD12VS1UL; VRWM = 12 V PESD15VS1UL; VRWM = 15 V PESD24VS1UL; VRWM = 24 V Fig 7. Relative variation of reverse leakage current as a function of junction temperature; typical values PESDXS1UL_SER Product data sheet Fig 8. V-I characteristics for a unidirectional ESD protection diode All information provided in this document is subject to legal disclaimers. Rev. 3 — 25 October 2011 © NXP B.V. 2011. All rights reserved. 7 of 15 PESDxS1UL series NXP Semiconductors Unidirectional ESD protection diodes ESD TESTER 450 Ω Rd RG 223/U 50 Ω coax 10× ATTENUATOR 4 GHz DIGITAL OSCILLOSCOPE 50 Ω Cs note 1 Note 1: IEC 61000-4-2 network Cs = 150 pF; Rd = 330 Ω D.U.T. (DEVICE UNDER TEST) vertical scale = 200 V/div horizontal scale = 50 ns/div vertical scale = 20 V/div horizontal scale = 50 ns/div PESD24VS1UL GND PESD15VS1UL GND GND PESD12VS1UL GND PESD5V0S1UL GND PESD3V3S1UL GND unclamped +1 kV ESD voltage waveform (IEC 61000-4-2 network) clamped +1 kV ESD voltage waveform (IEC 61000-4-2 network) GND GND vertical scale = 10 V/div horizontal scale = 50 ns/div vertical scale = 200 V/div horizontal scale = 50 ns/div unclamped −1 kV ESD voltage waveform (IEC 61000-4-2 network) clamped −1 kV ESD voltage waveform (IEC 61000-4-2 network) 006aaa682 Fig 9. ESD clamping test setup and waveforms PESDXS1UL_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 25 October 2011 © NXP B.V. 2011. All rights reserved. 8 of 15 PESDxS1UL series NXP Semiconductors Unidirectional ESD protection diodes 7. Application information The PESDxS1UL series is designed for protection of one unidirectional data line from the damage caused by ESD and surge pulses. The PESDxS1UL series may be used on lines where the signal polarities are either positive or negative with respect to ground. The PESDxS1UL series provides a surge capability of 150 W for an 8/20 s waveform. line to be protected (positive signal polarity) line to be protected (negative signal polarity) PESDxS1UL PESDxS1UL ground ground unidirectional protection of one line 006aaa681 Fig 10. Application diagram Circuit board layout and protection device placement Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT) and surge transients. The following guidelines are recommended: 1. Place the PESDxS1UL as close to the input terminal or connector as possible. 2. The path length between the PESDxS1UL and the protected line should be minimized. 3. Keep parallel signal paths to a minimum. 4. Avoid running protected conductors in parallel with unprotected conductors. 5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and ground loops. 6. Minimize the length of the transient return path to ground. 7. Avoid using shared transient return paths to a common ground point. 8. Ground planes should be used whenever possible. For multilayer PCBs, use ground vias. 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. PESDXS1UL_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 25 October 2011 © NXP B.V. 2011. All rights reserved. 9 of 15 PESDxS1UL series NXP Semiconductors Unidirectional ESD protection diodes 9. Package outline 0.50 0.46 0.62 0.55 2 0.30 0.22 0.65 0.30 0.22 1.02 0.95 1 0.55 0.47 cathode marking on top side (if applicable) Dimensions in mm 03-04-17 Fig 11. Package outline SOD882 10. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 10000 PESD3V3S1UL SOD882 4 mm pitch, 8 mm tape and reel -315 PESD5V0S1UL PESD12VS1UL PESD15VS1UL PESD24VS1UL [1] PESDXS1UL_SER Product data sheet For further information and the availability of packing methods, see Section 14. All information provided in this document is subject to legal disclaimers. Rev. 3 — 25 October 2011 © NXP B.V. 2011. All rights reserved. 10 of 15 PESDxS1UL series NXP Semiconductors Unidirectional ESD protection diodes 11. Soldering 1.3 0.7 R0.05 (8×) solder lands 0.6 0.7 0.8 (2×) (2×) (2×) 0.9 solder resist solder paste occupied area 0.3 (2×) Dimensions in mm 0.4 (2×) 0.5 (2×) sod882_fr Reflow soldering is the only recommended soldering method. Fig 12. Reflow soldering footprint SOD882 PESDXS1UL_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 25 October 2011 © NXP B.V. 2011. All rights reserved. 11 of 15 PESDxS1UL series NXP Semiconductors Unidirectional ESD protection diodes 12. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes PESDXS1UL_SER v.3 20111025 Product data sheet - PESDXS1UL_SER v.2 Modifications: • • • • • • Section 1.2 “Features and benefits”: updated Table 7: updated Table 8: added pulse conditions for breakdown voltage VBR Section 8 “Test information”: added Section 11 “Soldering”: added Section 13 “Legal information”: updated PESDXS1UL_SER v.2 20090820 Product data sheet - PESDXS1UL_SER v.1 PESDXS1UL_SER v.1 20060331 Product data sheet - - PESDXS1UL_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 25 October 2011 © NXP B.V. 2011. All rights reserved. 12 of 15 PESDxS1UL series NXP Semiconductors Unidirectional ESD protection diodes 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. Definition [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 13.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. 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No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. PESDXS1UL_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 25 October 2011 © NXP B.V. 2011. All rights reserved. 13 of 15 PESDxS1UL series NXP Semiconductors Unidirectional ESD protection diodes Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] PESDXS1UL_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 25 October 2011 © NXP B.V. 2011. All rights reserved. 14 of 15 NXP Semiconductors PESDxS1UL series Unidirectional ESD protection diodes 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Application information. . . . . . . . . . . . . . . . . . . 9 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 Quality information . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Packing information . . . . . . . . . . . . . . . . . . . . 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Contact information. . . . . . . . . . . . . . . . . . . . . 14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 25 October 2011 Document identifier: PESDXS1UL_SER