PESD12VV1BL Very low capacitance bidirectional ESD protection diode Rev. 1 — 3 April 2012 Product data sheet 1. Product profile 1.1 General description Very low capacitance bidirectional ElectroStatic Discharge (ESD) protection diode designed to protect one signal line from the damage caused by ESD and other transients. The device is housed in a leadless ultra small DFN1006-2 (SOD882) Surface-Mounted Device (SMD) plastic package. 1.2 Features and benefits Bidirectional ESD protection of one line Low diode capacitance Cd = 17 pF Rated peak pulse power: PPPM = 290 W Ultra low leakage current IRM < 1 nA ESD protection up to 30 kV IEC 61000-4-2; level 4 (ESD) IEC 61000-4-5 (surge); IPPM = 7.8 A AEC-Q101 qualified 1.3 Applications Computers and peripherals Audio and video equipment Cellular handsets and accessories Portable electronics Communication systems 1.4 Quick reference data Table 1. Quick reference data Tamb = 25 C unless otherwise specified. Symbol Parameter VRWM reverse standoff voltage Cd diode capacitance Conditions f = 1 MHz; VR = 0 V Min Typ Max Unit - - 12 V - 17 25 pF 2. Pinning information Table 2. Pinning Pin Description 1 cathode 2 cathode Simplified outline 1 2 Graphic symbol 1 2 sym045 Transparent top view PESD12VV1BL NXP Semiconductors Very low capacitance bidirectional ESD protection diode 3. Ordering information Table 3. Ordering information Type number Package Name PESD12VV1BL DFN1006-2 Description Version leadless ultra small plastic package; 2 terminals; body 1.0 0.6 0.5 mm SOD882 4. Marking Table 4. Marking codes Type number Marking code PESD12VV1BL MW 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter PPPM rated peak pulse power Min Max Unit [1] - 290 W IPPM rated peak pulse current [1] - 7.8 A Tj junction temperature - 150 C Tamb ambient temperature 55 +150 C Tstg storage temperature 65 +150 C [1] Conditions tp = 8/20 s Device stressed with ten non-repetitive current pulses (8/20 s exponential decay waveform according to IEC 61000-4-5 and IEC 61643-321). Table 6. ESD maximum ratings Tamb = 25 C unless otherwise specified. Symbol VESD [1] Product data sheet Conditions electrostatic discharge voltage Min Max Unit - 30 kV machine model - 400 V MIL-STD-883 (human body model) - 10 kV IEC 61000-4-2 (contact discharge) [1] Device stressed with ten non-repetitive ESD pulses. Table 7. PESD12VV1BL Parameter ESD standards compliance Standard Conditions IEC 61000-4-2; level 4 (ESD) > 15 kV (air); > 8 kV (contact) MIL-STD-883; class 3B (human body model) > 8 kV All information provided in this document is subject to legal disclaimers. Rev. 1 — 3 April 2012 © NXP B.V. 2012. All rights reserved. 2 of 12 PESD12VV1BL NXP Semiconductors Very low capacitance bidirectional ESD protection diode 001aaa631 IPP 001aaa630 120 100 % 90 % 100 % IPP; 8 μs IPP (%) 80 e−t 50 % IPP; 20 μs 40 10 % 0 10 20 30 30 ns 40 t (μs) Fig 1. t tr = 0.7 ns to 1 ns 0 60 ns 8/20 s pulse waveform according to IEC 61000-4-5 and IEC 61643-321 Fig 2. ESD pulse waveform according to IEC 61000-4-2 6. Characteristics Table 8. Characteristics Tamb = 25 C unless otherwise specified. Symbol Parameter Min Typ Max Unit VRWM reverse standoff voltage - - 12 V IRM reverse leakage current VRWM = 12 V - <1 10 nA VBR breakdown voltage IR = 5 mA 14.6 15.7 16.8 V Cd diode capacitance f = 1 MHz; VR = 0 V - 17 25 pF VCL clamping voltage IPP = 1 A [1] - - 22 V IPPM = 7.8 A [1] - - 38 V IR = 10 A [2] - 0.7 - rdyn PESD12VV1BL Product data sheet Conditions dynamic resistance [1] Device stressed with 8/20 s exponential decay waveform according to IEC 61000-4-5 and IEC 61643-321. [2] Non-repetitive current pulse, Transmission Line Pulse (TLP) tp = 100 ns; square pulse; ANS/IESD STM5-1-2008. All information provided in this document is subject to legal disclaimers. Rev. 1 — 3 April 2012 © NXP B.V. 2012. All rights reserved. 3 of 12 PESD12VV1BL NXP Semiconductors Very low capacitance bidirectional ESD protection diode aaa-002723 103 &G S) PPP (W) 102 10 1 10-4 10-3 10-2 tp (μs) Tamb = 25 C Fig 3. 959 f = 1 MHz; Tamb = 25 C Rated peak pulse power as a function of square pulse duration; typical values Fig 4. Diode capacitance as a function of reverse voltage; typical values IPPM IPP −VCL −VBR −VRWM IR IRM −IRM −IR VRWM VBR VCL − + −IPP −IPPM Fig 5. 006aab325 V-I characteristics for a bidirectional ESD protection diode PESD12VV1BL Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 3 April 2012 © NXP B.V. 2012. All rights reserved. 4 of 12 PESD12VV1BL NXP Semiconductors Very low capacitance bidirectional ESD protection diode ESD TESTER Rd 450 Ω RG 223/U 50 Ω coax 4 GHz DIGITAL OSCILLOSCOPE 10x ATTENUATOR Cs 50 Ω DUT (DEVICE UNDER TEST) IEC 61000-4-2 network Cs = 150 pF; Rd = 330 Ω vertical scale = 20 V/div horizontal scale = 50 ns/div vertical scale = 2 kV/div horizontal scale = 10 ns/div GND GND unclamped +8 kV ESD pulse waveform (IEC 61000-4-2 network) clamped +8 kV ESD pulse waveform (IEC 61000-4-2 network) vertical scale = 20 V/div horizontal scale = 50 ns/div vertical scale = 2 kV/div horizontal scale = 10 ns/div GND GND unclamped -8 kV ESD pulse waveform (IEC 61000-4-2 network) Fig 6. clamped -8 kV ESD pulse waveform (IEC 61000-4-2 network) aaa-002726 ESD clamping test setup and waveforms PESD12VV1BL Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 3 April 2012 © NXP B.V. 2012. All rights reserved. 5 of 12 PESD12VV1BL NXP Semiconductors Very low capacitance bidirectional ESD protection diode 7. Application information The device is designed for the protection of one bidirectional data or signal line from surge pulses and ESD damage. The device is suitable on lines where the signal polarities are both, positive and negative with respect to ground. line to be protected ESD protection diode GND aaa-002737 Fig 7. Application diagram Circuit board layout and protection device placement Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT) and surge transients. The following guidelines are recommended: 1. Place the device as close to the input terminal or connector as possible. 2. Minimize the path length between the device and the protected line. 3. Keep parallel signal paths to a minimum. 4. Avoid running protected conductors in parallel with unprotected conductors. 5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and ground loops. 6. Minimize the length of the transient return path to ground. 7. Avoid using shared transient return paths to a common ground point. 8. Use ground planes whenever possible. For multilayer PCBs, use ground vias. 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. PESD12VV1BL Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 3 April 2012 © NXP B.V. 2012. All rights reserved. 6 of 12 PESD12VV1BL NXP Semiconductors Very low capacitance bidirectional ESD protection diode 9. Package outline 0.50 0.46 0.62 0.55 2 0.30 0.22 0.65 0.30 0.22 1 0.55 0.47 cathode marking on top side (if applicable) Dimensions in mm Fig 8. 1.02 0.95 03-04-17 Package outline DFN1006-2 (SOD882) 10. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 10000 PESD12VV1BL [1] PESD12VV1BL Product data sheet DFN1006-2 (SOD882) 4 mm pitch, 8 mm tape and reel -315 For further information and the availability of packing methods, see Section 14. All information provided in this document is subject to legal disclaimers. Rev. 1 — 3 April 2012 © NXP B.V. 2012. All rights reserved. 7 of 12 PESD12VV1BL NXP Semiconductors Very low capacitance bidirectional ESD protection diode 11. Soldering 1.3 0.7 R0.05 (8×) solder lands 0.6 0.7 0.8 (2×) (2×) (2×) 0.9 solder resist solder paste occupied area 0.3 (2×) Dimensions in mm 0.4 (2×) 0.5 (2×) sod882_fr Reflow soldering is the only recommended soldering method. Fig 9. PESD12VV1BL Product data sheet Reflow soldering footprint DFN1006-2 (SOD882) All information provided in this document is subject to legal disclaimers. Rev. 1 — 3 April 2012 © NXP B.V. 2012. All rights reserved. 8 of 12 PESD12VV1BL NXP Semiconductors Very low capacitance bidirectional ESD protection diode 12. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes PESD12VV1BL v.1 20120403 Product data sheet - - PESD12VV1BL Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 3 April 2012 © NXP B.V. 2012. All rights reserved. 9 of 12 PESD12VV1BL NXP Semiconductors Very low capacitance bidirectional ESD protection diode 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 13.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. PESD12VV1BL Product data sheet Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. All information provided in this document is subject to legal disclaimers. Rev. 1 — 3 April 2012 © NXP B.V. 2012. All rights reserved. 10 of 12 PESD12VV1BL NXP Semiconductors Very low capacitance bidirectional ESD protection diode No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] PESD12VV1BL Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 3 April 2012 © NXP B.V. 2012. All rights reserved. 11 of 12 PESD12VV1BL NXP Semiconductors Very low capacitance bidirectional ESD protection diode 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Application information. . . . . . . . . . . . . . . . . . . 6 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 Quality information . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 Packing information . . . . . . . . . . . . . . . . . . . . . 7 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 3 April 2012 Document identifier: PESD12VV1BL