Fiber Optics V23833-Fx105-B001 V23833-Fx105-B002 XFP 1310 nm Small Form Factor Module 10 Gigabit Pluggable Transceiver Compatible with XFP MSA Rev. 3.1 Preliminary Data Sheet Features Standards • • • • • Compatible with IEEE 802.3ae™-2002 Compatible with Fibre Channel 10GFC Draft 3.5 Compatible with ITU-T G.693 11/2001 Compatible with XFP MSA Rev. 3.1 Compatible with Telcordia GR-253-CORE File: 2115 Optical • • • • • • • • • IEEE Ethernet: Serial 1310 nm 10GBASE-LR T11 Fibre Channel: Serial 1310 nm 1200-SM-LL-L ITU-T G.693: VSR2000-2R1 Telcordia: SR1 Transmission distance 2 m up to 10 km Uncooled directly modulated Distributed Feedback (DFB) laser at 1310 nm According to XFP MSA Rev. 3.1 LC connector, single mode fiber Full duplex transmission mode Ordering Information Part Number Chassis/Signal Grounding Concept Standard V23833-F0105-B001 Separated Ethernet/Fibre Channel V23833-F9105-B001 Separated Multi-Protocol V23833-F0105-B002 Common Ethernet/Fibre Channel V23833-F9105-B002 Common Multi-Protocol Preliminary Product Information 1 2004-06-04 V23833-Fx105-B001 V23833-Fx105-B002 Applications Monitoring and Control • • • • • • • • • • • • • Laser safety shut off Supply voltage 5 V / 3.3 V / 1.8 V Transmit power Received power RSSI Module temperature Laser bias current Tx_DIS Mod_NR Mod_DeSel Interrupt Mod_ABS P_Down/RST Rx_Los Mechanical • Color coded blue for 1310 nm • Belly-to-belly applications • Latching mechanism with low insertion force Electrical • • • • • • • Hot pluggable Power supply 5 V / 3.3 V / 1.8 V Total power consumption: < 3.5 W max. XFI electrical interface External reference clock (transmit data synchronization B/64) Management and control via 2-wire interface 30 pin connector, 0.8 mm pitch Applications • • • • • • • • 10GBE, 10GFC, OC-192/STM-64 and G.709 transmission systems for short range Integration on PCI card, with eventually mid-board mounting Belly-to-belly for high density applications Enterprise and campus network applications Storage applications Backplane and switch applications Aggregation point for lower date rate XFP evaluation kit V23833-F9909-Z001 available upon request Preliminary Product Information 2 2004-06-04 V23833-Fx105-B001 V23833-Fx105-B002 Pin Configuration Pin Configuration 1 GND 30 GND 2 VEE5 29 TD+ 3 MOD_DESEL 28 TD− 4 INTERRUPT 27 GND 5 TX_DIS 26 GND 6 VCC5 25 REFCLK− 7 GND 24 REFCLK+ 8 VCC3 23 GND 9 VCC3 22 VCC2 10 SCL 21 P_DOWN/RST 11 SDA 20 VCC2 12 MOD_ABS 19 GND 13 MOD_NR 18 RD+ 14 RX_LOS 17 RD− 15 GND 16 GND Bottom of Board (As viewed through top of board) Figure 1 Top of Board File: 2304 XFP Transceiver Electrical Pad Layout Preliminary Product Information 3 2004-06-04 V23833-Fx105-B001 V23833-Fx105-B002 Pin Configuration Connector Pin Assignments Pin No. Signal Name Pin No. Signal Name 1 GND 30 GND 2 VEE5 29 TD+ 3 MOD_DESEL 28 TD– 4 INTERRUPT 27 GND 5 TX_DIS 26 GND 6 VCC5 25 REFCLK– 7 GND 24 REFCLK+ 8 23 GND 9 VCC3 VCC3 22 VCC2 10 SCL 21 P_DOWN 11 SDA 20 VCC2 12 MOD_ABS 19 GND 13 MOD_NR 18 RD+ 14 RX_LOS 17 RD– 15 GND 16 GND Preliminary Product Information 4 2004-06-04 V23833-Fx105-B001 V23833-Fx105-B002 Pin Configuration Pin Description Signal Name Level I/O Pin No. Management and Monitoring Ports MOD_DESEL LVTTL I 3 Description Module De-select: when “L” allows the module to respond to 2-wire serial interface command. “H” active INTERRUPT LVTTL O 4 Interrupt: indicates presence of an important condition which can be read on the 2-wire serial interface. “H” active TX_DIS LVTTL I 5 Transmitter Disable: transmitter laser source is turned off. “H” active SCL LVTTL I 10 2-wire Interface Clock SDA LVTTL I 11 2-wire Interface Data MOD_ABS LVTTL O 12 Module Absent: indicating the modules not present. “H” active MOD_NR LVTTL O 13 Module not ready: module operational fault RX_LOS LVTTL O 14 Receiver Loss Of Signal Indicator P_DOWN LVTTL I 21 Power Saving Mode: places the module in the stand-by condition. Active “H”. During the falling edge set the module reset I 28 Transmitter Inverted Data Input Transmit Functions TD– CML TD+ CML Receive Functions RD– CML I 29 Transmitter Not-inverted Data Input O 17 Receiver Data Output Inverted RD+ CML O 18 Receiver Data Output Not-inverted REFCLK+ PECL I 24 Reference Clock Not-inverted Input REFCLK– DC Power GND PECL I 25 Reference Clock Inverted Input 0V – 1,7,15,16,19, 23,26,27,30 Ground connection for both signal and chassis on the module VCC5 VCC3 VCC2 +5 V I 6 Positive power supply, nominal +3.3 V I 8,9 Positive power supply, nominal +1.8 V I 20,22 Positive power supply, nominal Preliminary Product Information 5 2004-06-04 V23833-Fx105-B001 V23833-Fx105-B002 Description Description System Block Diagram XFP Module Connector D C´ C RX CDR A B´ B TX CDR ASIC/SerDes Host Board File: 2306 Figure 2 Optical Interface Standard Specifications • • • • • IEEE 802.3ae™-2002 clause 52, 10GBASE-LR Fibre Channel 10GFC Draft 3.5, 1200-SM-LL-L ITU-T G.693: VSR2000-2R1 Telcordia: SR1 XFP MSA Rev. 3.1 Fiber Type Minimum Modal Bandwidth at 1310 nm (MHz*km) Operating Range (meters)1) B1.1 SMF 10 2 to 10,000 B1.3 SMF 10 2 to 10,000 1) Operating range as defined by IEEE and Fibre Channel standards. Longer reach possible depending upon link implementation. A loopback connector is supported. Electrical Interface Standard Specifications • IEEE 802.3ae™-2002 clause 45 & 47 • XFP MSA Rev. 3.1 Preliminary Product Information 6 2004-06-04 V23833-Fx105-B001 V23833-Fx105-B002 Description Environment: Thermal Management Recommendations Operating air inlet temperature: 0°C - 50°C Operating Airflow: 200 LFM (1.5 m/s) Operating Humidity: 85% RH non-condensing Maximum operating case temperature is 70°C as defined by UL 1950. Module can withstand and operate within specification with case temperature of 75°C for up to 96 hrs/yr. Transceiver requires airflow parallel to cooling fins. Maximum airflow required per XFP MSA is 3 m/s. Fibers and Connectors The transceiver LC features a duplex receptacle and is designed for single mode LC cables, 0° polished end face (PC). 30-pin Connector The module interface connector is a 30-pin, printed circuit board edge connection with a 0.8 mm pitch. The appropriate mating connector for the customer PCB is a 30-pin SMT, dual row, right angled, edge connector, 0.8 mm pitch (TycoAmp part number 788862C or equivalent). Cage/Heatsink Requirement The cage/heatsink assembly required to mount the XFP module is defined by the MSA. Preliminary Product Information 7 2004-06-04 V23833-Fx105-B001 V23833-Fx105-B002 Description Regulatory Compliance Feature Standard Comments ESD: Electrostatic Discharge to the Electrical Pins (HBM) EIA/JESD22-A114-B (MIL-STD 883D Method 3015.7) Class 1a (> 500 V) Immunity: Against Electrostatic Discharge (ESD) to the Module Receptacle EN 61000-4-2 IEC 61000-4-2 Discharges ranging from ±2 kV to ±15 kV to the front end / faceplate / receptacle cause no damage to module (under recommended conditions). Immunity: Against Radio Frequency Electromagnetic Field EN 61000-4-3 IEC 61000-4-3 With a field strength of 3 V/m, noise frequency ranges from 10 MHz to 2 GHz. No effect on module performance between the specification limits. Emission: Electromagnetic Interference (EMI) FCC 47 CFR Part 15, Class B EN 55022 Class B CISPR 22 Noise frequency range: 30 MHz to 40 GHz Radiated emission does not exceed specified limits when measured inside a shielding enclosure with MSA conform cutout. Preliminary Product Information 8 2004-06-04 V23833-Fx105-B001 V23833-Fx105-B002 Technical Data Technical Data Absolute Maximum Ratings Parameter Symbol Limit Values Unit min. max. –20 85 °C 0 50 °C 0 80 °C 0 6 V 0 4 V Supply Voltage +1.8 V TS TA TC V5 V3 Vaps 0 2 V Static Discharge Voltage, All Pins STd –500 500 V Average Receive Optical Power RxP max 1.5 dBm Storage Ambient Temperature1) Operating Ambient Temperature1) 2) Operating Case Temperature1) 2) Supply Voltage +5.0 V Supply Voltage +3.3 V 1) 2) Non condensing. With specified airflow (see “Environment: Thermal Management Recommendations”). Exceeding any one of these values may permanently destroy the device. Recommended Operating Conditions Parameter Symbol Values min. Operating Case Temperature1) 2) TC Transceiver Total Power Consumption P Supply Voltage +5.0 V VCC5 ICC5 VCC3 ICC3 VCC aps ICC aps Supply Current +5.0 V Supply Voltage +3.3 V Supply Current +3.3 V Supply Voltage +1.8 V Supply Current +1.8 V 1) 2) typ. 0 4.75 3.14 1.71 Unit max. 70 °C 2.5 3.5 W 5 5.25 V t.b.d. mA 3.47 V t.b.d. mA 1.89 V t.b.d. mA 3.3 1.8 With specified airflow (see “Environment: Thermal Management Recommendations”). Worst case thermal location (see Figure 15). Preliminary Product Information 9 2004-06-04 V23833-Fx105-B001 V23833-Fx105-B002 Technical Data Optical Characteristics (VCC5 = 4.75 V to 5.25 V, VCC3 = 3.14 V to 3.47 V, VCC aps = 1.71 V to 1.89 V, TC = 0°C to 70°C) Parameter Symbol Values min. typ. Unit max. Transmitter Launch Power in OMA minus TDP PO-OMA –6.2 Average Launch Power PO-Avg –8.2 –1 0.5 dBm Center Wavelength Range λC-Tx 1290 1310 1330 nm Spectral Width (–20 dB) σI 0.5 0.6 nm Side Mode Suppression Ratio SMSR 30 Extinction Ratio ER 3.5 Relative Intensity Noise12OMA RIN Optical Modulation Amplitude (OMA) OMA Transmitter and Dispersion Penalty TDP 3.2 dB Average Launch Power of OFF Transmitter PO-OFF –30 dBm Optical Return Loss Tolerance ORLT 12 dB Transmitter Reflectance REFTx –12 dB Eye Mask Definition dBm dB 5 dB –128 dB/Hz –5.2 dBm According to IEEE and Fibre Channel Receiver Loss Of Signal Hysteresis PIN-S PIN PIN-max PLOSa PLOSh Receiver Reflectance REFRx Center Wavelength Range λC-Rx Stressed Receiver Sensitivity 1) Sensitivity in OMA Average Receive Power Loss Of Signal Assert Level 1) 1 –10.3 dBm –12.6 dBm 0.5 dBm –17 –13 dBm 2 4 dB –12 dB 1355 nm 1260 Receiver sensitivity, which is defined for an ideal input signal is informative only. Preliminary Product Information 10 2004-06-04 V23833-Fx105-B001 V23833-Fx105-B002 Technical Data Electrical DC Characteristics (VCC5 = 4.75 V to 5.25 V, VCC3 = 3.14 V to 3.47 V, VCC aps = 1.71 V to 1.89 V, TC = 0°C to 70°C) Parameter Symbol Values min. typ. Unit max. 3.3 V CMOS I/O DC Characteristics (Management, Logic and Monitoring Ports) External Pull-up Resistor for Open Drain Rpullup 10 22 kΩ Output High Voltage1) Voh Vol Vih Vil Ipd 2.4 3.5 V 0.4 V 2 V 0.8 V 10 µA Vin_diff 400 2000 mV p-p Differential Input Amplitude (pk-pk)4) TD+/– 240 1640 mV p-p diff Differential Output Amplitude (pk-pk)5) RD+/– 680 1700 mV p-p diff Output Low Voltage1) Input High Voltage Input Low Voltage Input Pull-up Current2) 0 –10 0 LVPECL I/O Characteristics (REFCLK+/–) Differential Input Voltage (pk-pk)3) XFI I/O DC Characteristics (TD+/–; RD+/–) 1) 2) 3) 4) 5) Rpull-up = 10 kΩ to 3.3 V. Vin = 3.3 V. AC coupled in transceiver. AC coupled input at host board. AC coupled output at host board. Preliminary Product Information 11 2004-06-04 V23833-Fx105-B001 V23833-Fx105-B002 Technical Data Electrical AC Characteristics (VCC5 = 4.75 V to 5.25 V, VCC3 = 3.14 V to 3.47 V, VCC aps = 1.71 V to 1.89 V, TC = 0°C to 70°C) Parameter Symbol Values Unit min. typ. max. 10.3125 10.75 Gbit/s 500 ppm 120 Ω XFI Input AC Characteristics (TD+/–) Baud Rate TD+/– 9.95 Baud Rate Tolerance TDtol –500 Differential Input Impedance ZIN 80 Differential Return Loss1) |S11| 8 Input Differential Skew Total Jitter 2) 3) Deterministic Jitter3) TSKEWIN 100 dB t.b.d. ps TJTD 0.61 UI pp TJTD 0.2 UI pp 10.75 Gbit/s 100 ppm XFI Output AC Characteristics (RD+/–) Baud Rate RD+/– 9.95 Baud Rate Tolerance RDtol –100 Rise and Fall Times4) tr , tf 24 Output Differential Skew TSKEWOUT Output Differential Impedance ZOUT ps t.b.d. 80 Differential Output Return Loss1) |S22| 10.3125 100 ps 120 8 Ω dB Total Jitter5) TJRD 0.34 UI Deterministic Jitter5) DJRD 0.18 UI LVPECL Input AC Characteristics (REFCLK+/–) REFCLK+/– Frequency6) REFCLK+/– Frequency7) REFCLK+/– Frequency Tolerance REFCLK+/– Duty Cycle REFCLK+/– Rise and Fall Time4) Preliminary Product Information fREF fREF fTOLREF tW tr , tf 12 164.1328 MHz 164.3554 MHz –100 100 ppm 40 60 % 200 1250 ps 2004-06-04 V23833-Fx105-B001 V23833-Fx105-B002 Technical Data Electrical AC Characteristics (cont’d) (VCC5 = 4.75 V to 5.25 V, VCC3 = 3.14 V to 3.47 V, VCC aps = 1.71 V to 1.89 V, TC = 0°C to 70°C) Parameter Symbol Values min. typ. Unit max. 2 3.3 V CMOS I/O AC Characteristics for I C Signals (SDA; SCL) SCL Clock Frequency SCL Period Low SCL Period High Bus Free Time8) Start Condition Setup Time Stop Condition Setup Time Start Condition Hold Time Data Hold Time Data Setup Time SDA and SCL Rise and Fall Time 1) 2) 3) 4) 5) 6) 7) 8) fSCL tLOW tHIGH tBUF tSU_START tSU_STOP tH_START tH_DATA tSU_DATA tr , tf 0 400 kHz 1.3 µs 0.6 µs 1.3 µs 0.6 µs 0.6 µs 0.6 µs 0 µs 100 ns 300 ns 100 MHz - 5.5 GHz above 5.5 GHz see XFP MSA 3.1. Not defined at crossing point. Per XFP MSA 3.1 table 17, 1 UI = 96.97 ps. 20%, 80%. Per XFP MSA 3.1 table 19, 1 UI = 96.97 ps. 10 GBE data rate. 10 GFC data rate. Between stop and start condition. Preliminary Product Information 13 2004-06-04 V23833-Fx105-B001 V23833-Fx105-B002 Technical Data Timing Parameters for XFP Management Parameter Symbol Values min. Unit max. TX_DIS Assert Time1) t_off 10 µs TX_DIS Negate Time2) t_on 2 ms Time to Initialize3) t_init 300 ms INTERRUPT Assert Delay4) Interrupt_on 200 ms INTERRUPT Negate Delay5) Interrupt_off 500 µs P_DOWN/RST Assert Delay6) P_Down/RST_on 100 µs MOD_NR Assert Delay7) Mod_nr_on 1 ms MOD_NR Negate Delay8) Mod_nr_off 1 ms P_DOWN Reset Time9) 10 RX_LOS Assert Delay10) RX_LOS Negate Delay 1) 2) 3) 4) 5) 6) 7) 8) 9) 10) 11) 11) µs t_loss_on 100 µs t_loss_off 100 µs Rising edge of TX_DIS to fall of output signal below 10% of nominal. Falling edge of TX_DIS to rise of output signal above 90% of nominal. From power on or hot plug after supply or from falling edge of P_DOWN/RST. From occurrence of the condition triggering INTERRUPT. From clear on read INTERRUPT flags. From power down initiation. From occurrence of fault to assertion of MOD_NR. From clearance of signal to negation of MOD_NR. Min. length of P_DOWN assert to initiate reset. From occurrence of loss of signal to assertion of RX_LOS. From occurrence of presence of signal to negation of RX_LOS. Preliminary Product Information 14 2004-06-04 V23833-Fx105-B001 V23833-Fx105-B002 Eye Safety Eye Safety This laser based single mode transceiver is a Class 1 product. It complies with IEC 60825-1/A2: 2001 and FDA performance standards for laser products (21 CFR 1040.10 and 1040.11) except for deviations pursuant to Laser Notice 50, dated July 26, 2001. CLASS 1 LASER PRODUCT To meet laser safety requirements the transceiver shall be operated within the Absolute Maximum Ratings. Note: All adjustments have been made at the factory prior to shipment of the devices. No maintenance or alteration to the device is required. Tampering with or modifying the performance of the device will result in voided product warranty. Failure to adhere to the above restrictions could result in a modification that is considered an act of “manufacturing”, and will require, under law, recertification of the modified product with the U.S. Food and Drug Administration (ref. 21 CFR 1040.10 (i)). Laser Emission Data Wavelength 1310 nm Maximum total output power (as defined by IEC: 7 mm aperture at 14 mm distance) 15.6 mW / 11.9 dBm Beam divergence (full angle) / NA (half angle) 11° / 0.1 rad FDA IEC Complies with 21 CFR 1040.10 and 1040.11 Class 1 Laser Product File: 1401 Figure 3 Required Labels Laser Emission Tx Top view Rx File: 1333 Figure 4 Laser Emission Preliminary Product Information 15 2004-06-04 V23833-Fx105-B001 V23833-Fx105-B002 Application Notes Application Notes Host Board Layouts Dimensions in mm Figure 5 File: 2508 XFP Host Board Mechanical Layout Detail Z see Figure 6. Preliminary Product Information 16 2004-06-04 V23833-Fx105-B001 V23833-Fx105-B002 Application Notes Dimensions in mm Figure 6 File: 2509 XFP Host Board Mechanical Layout, Detail Z Preliminary Product Information 17 2004-06-04 V23833-Fx105-B001 V23833-Fx105-B002 Application Notes Dimensions in mm Figure 7 File: 2510 Recommended Single Sided Bezel Design Dimensions in mm Figure 8 File: 2511 Recommended Double Sided Mounting Bezel Design Preliminary Product Information 18 2004-06-04 V23833-Fx105-B001 V23833-Fx105-B002 Application Notes Mechanical File: 2512 Figure 9 PCI Card Application Preliminary Product Information 19 2004-06-04 V23833-Fx105-B001 V23833-Fx105-B002 Application Notes Dimensions in mm Figure 10 File: 2513 XFP Transceiver Connector Illustration Preliminary Product Information 20 2004-06-04 V23833-Fx105-B001 V23833-Fx105-B002 Application Notes Top View 16 17 18 19 20 21 22 Toward ASIC 23 24 25 26 GND 15 RX_LOS 14 MOD_NR 13 MOD_ABS 12 SDA 11 SCL 10 GND RD− RD+ GND VCC2 P_DOWN/RST VCC3 9 VCC3 8 GND 7 VCC5 6 TX_DIS 5 INTERRUPT 4 MOD_DESEL 3 VEE5 2 GND 1 VCC2 GND Toward Bezel REFCLK+ REFCLK− GND 27 GND 28 TD− 29 TD+ 30 GND File: 2514 Figure 11 Host PCB XFP Pinout Preliminary Product Information 21 2004-06-04 V23833-Fx105-B001 V23833-Fx105-B002 Application Notes Host Board Host +5 V 4.7 µH VCC5 1) Host +3.3 V 4.7 µH 0.1 µF xx µF VCC3 1) 0.1 µF Host +1.8 V 22 µF 4.7 µH 0.1 µF xx µF VCC2 XFP Connector 22 µF 0.1 µF XFP Module 1) 0.1 µF 22 µF 0.1 µF xx µF 1) Design criterion of the capacitor used is the resonant frequency and its value must be in the order of the nominal data rate. Use of single layer capacitors recommended. Short trace lengths are mandatory. Figure 12 File: 2305 Recommended Host Board Supply Filtering Network Preliminary Product Information 22 2004-06-04 V23833-Fx105-B001 V23833-Fx105-B002 Package Outlines Package Outlines Dimensions in mm Figure 13 File: 2206 Mechanical Dimensions Revision code Laser class Description Part number Country of origin Optional marking (MS/ES) Dimensions in mm Figure 14 WW: week of production nnnnnnnn: serial number File: 2402 Label Description Preliminary Product Information 23 2004-06-04 V23833-Fx105-B001 V23833-Fx105-B002 Package Outlines Dimensions in mm Figure 15 File: 2207 XFP Temperature Reference Point Preliminary Product Information 24 2004-06-04 V23833-Fx105-B001 V23833-Fx105-B002 Revision History: 2004-06-04 Previous Version: none Page DS0 Subjects (major changes since last revision) Edition 2004-06-04 Published by Infineon Technologies AG, St.-Martin-Strasse 53, 81669 München, Germany © Infineon Technologies AG 2004. All Rights Reserved. Attention please! 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