Fiber Optics V23818-K15-B57 SFP - Small Form-factor Pluggable Single Mode 1300 nm 1.0625 Gbit/s Fibre Channel 1.25 Gigabit Ethernet Transceiver with LC™ Connector Features • Small Form-factor Pluggable (SFP) transceiver • Fully SFP MSA compliant1) • Advanced release mechanism – Easy access, even in belly to belly applications – Grip for easy access – no tool is needed – Color coded blue (single mode) File: 1115 • Excellent EMI performance • RJ-45 style LC™ connector system • Single power supply (3.3 V) • Low power consumption • Small size for high channel density • UL-94 V-0 certified • ESD Class 1C per JESD22-A114-B (MIL-STD 883D Method 3015.7) • Compliant with FCC (Class B) and EN 55022 • For distances of up to 10 km • Class 1 FDA and IEC laser safety compliant • AC/AC Coupling according to SFP MSA • Recommendation: Infineon Cage one-piece design V23838-S5-N1 for press fit and/or solderable • SFP evaluation board V23818-S5-V2 available upon request 1) Current MSA documentation can be found at www.infineon.com/fiberoptics LC™ is a trademark of Lucent Data Sheet 1 2003-04-25 V23818-K15-B57 Pin Configuration Pin Configuration 20 VEET 1 VEET 19 TD− 2 Tx Fault 18 TD+ 3 Tx Disable 17 VEET 4 MOD-DEF(2) 16 VCCT 5 MOD-DEF(1) 15 VCCR 6 MOD-DEF(0) 14 VEER 7 Rate Select 13 RD+ 8 LOS 12 RD− 9 VEER 11 VEER 10 VEER Bottom of transceiver (as viewed through top of transceiver) Top of transceiver Figure 1 Data Sheet File: 1306 SFP Transceiver Electrical Pad Layout 2 2003-04-25 V23818-K15-B57 Pin Configuration Pin Description Pin No. Name Logic Level Function 1 VEET N/A Transmitter Ground1) 2 Tx Fault LVTTL Transmitter Fault Indication2) 8) 3 Tx Disable LVTTL Transmitter Disable3) 4 MOD-DEF(2) LVTTL Module Definition 24) 8) 5 MOD-DEF(1) LVTTL Module Definition 15) 8) 6 MOD-DEF(0) N/A Module Definition 06) 8) 7 Rate Select N/A Not connected 8 LOS LVTTL Loss Of Signal7) 8) 9 N/A Receiver Ground1) N/A Receiver Ground1) 11 VEER VEER VEER N/A Receiver Ground1) 12 RD– LVPECL Inv. Received Data Out9) 13 RD+ LVPECL Received Data Out9) 14 N/A Receiver Ground1) N/A Receiver Power N/A Transmitter Power 17 VEER VCCR VCCT VEET N/A Transmitter Ground1) 18 TD+ LVPECL Transmit Data In10) 19 TD– LVPECL Inv. Transmit Data In10) 20 VEET N/A Transmitter Ground1) 10 15 16 1) 2) 3) 4) 5) 6) 7) 8) 9) 10) Common transmitter and receiver ground within the module. A high signal indicates a laser fault of some kind and that laser is switched off. A low signal switches the transmitter on. A high signal or when not connected switches the transmitter off. MOD-DEF(2) is the data line of two wire serial interface for serial ID. MOD-DEF(1) is the clock line of two wire serial interface for serial ID. MOD-DEF(0) is grounded by the module to indicate that the module is present. A low signal indicates normal operation, light is present at receiver input. A high signal indicates the received optical power is below the worst case receiver sensitivity. Should be pulled up on host board to VCC by 4.7 - 10 kΩ. AC coupled inside the transceiver. Must be terminated with 100 Ω differential at the user SERDES. AC coupled and 100 Ω differential termination inside the transceiver. Data Sheet 3 2003-04-25 V23818-K15-B57 Description Description The Infineon Fibre Channel / Gigabit Ethernet single mode transceiver – part of Infineon Small Form Factor transceiver family – is based on the Physical Medium Depend (PMD) sublayer and baseband medium, type 1000 Base-LX (long wavelength) compliant to IEEE Std 802.3 and Fibre Channel FC-PI (Rev. 13) 100-SM-LC-L. The appropriate fiber optic cable is 9 µm single mode fiber with LC™ connector. Link Length as Defined by IEEE and Fibre Channel Standards Fiber Type Reach min.1) typ. Unit max.2) at 1.0625 Gbit/s 9 µm, SMF 2 50 µm, 500 MHz*km 0.5 550 62.5 µm, 200 MHz*km 0.5 550 10,000 meters meters at 1.25 Gbit/s 9 µm, SMF 2 5,000 50 µm, 400/500 MHz*km 2 550 62.5 µm, 500 MHz*km 2 550 1) 2) Minimum reach as defined by IEEE and Fibre Channel Standards. A 0 m link length (loop-back connector) is supported. Maximum reach as defined by IEEE and Fibre Channel Standards. Longer reach possible depending upon link implementation. The Infineon SFP single mode transceiver is a single unit comprised of a transmitter, a receiver, and an LC™ receptacle. This transceiver supports the LC™ connectorization concept. It is compatible with RJ-45 style backpanels for high end datacom and telecom applications while providing the advantages of fiber optic technology. The module is designed for low cost SAN, LAN, WAN, Fibre Channel and Gigabit Ethernet applications. It can be used as the network end device interface in mainframes, workstations, servers, and storage devices, and in a broad range of network devices such as bridges, routers, hubs, and local and wide area switches. This transceiver operates at 1.0625 and 1.25 Gbit/s from a single power supply (+3.3 V). The full differential data inputs and outputs are LVPECL compatible. Data Sheet 4 2003-04-25 V23818-K15-B57 Description Functional Description of SFP Transceiver This transceiver is designed to transmit serial data via single mode cable. Tx Fault Automatic Shut-Down TxDis LEN TD− TD+ Tx Coupling Unit Laser Driver e/o Laser Power Control o/e Single Mode Fiber Monitor RD− RD+ LOS Receiver MOD-DEF EEPROM Rx Coupling Unit o/e File: 1353 Figure 2 Functional Diagram The receiver component converts the optical serial data into LVPECL compatible electrical data (RD+ and RD–). The Loss Of Signal (LOS) shows whether an optical signal is not present (lost). The transmitter converts LVPECL compatible electrical serial data (TD+ and TD–) into optical serial data. Data lines are differentially 100 Ω terminated. The transmitter contains a laser driver circuit that drives the modulation and bias current of the laser diode. The currents are controlled by a power control circuit to guarantee constant output power of the laser over temperature and aging. The power control uses the output of the monitor PIN diode (mechanically built into the laser coupling unit) as a controlling signal, to prevent the laser power from exceeding the operating limits. Single fault condition is ensured by means of an integrated automatic shutdown circuit that disables the laser when it detects laser fault to guarantee the laser Eye Safety. The transceiver contains a supervisory circuit to control the power supply. This circuit makes an internal reset signal whenever the supply voltage drops below the reset threshold. It keeps the reset signal active for at least 140 milliseconds after the voltage has risen above the reset threshold. During this time the laser is inactive. Data Sheet 5 2003-04-25 V23818-K15-B57 Description A low signal on TxDis enables transmitter. If TxDis is high or not connected the transmitter is disabled. The information which kind of SFP module has been plugged into an SFP port can be read through the MOD-DEF interface. The information is stored in an I2C-EEprom inside the SFP Transceiver. Regulatory Compliance Feature Standard Comments ESD: Electrostatic Discharge to the Electrical Pins EIA/JESD22-A114-B (MIL-STD 883D method 3015.7) Class 1C Immunity: Against Electrostatic Discharge (ESD) to the Duplex LC Receptacle EN 61000-4-2 IEC 61000-4-2 Discharges ranging from ±2 kV to ±15 kV on the receptacle cause no damage to transceiver (under recommended conditions). Immunity: Against Radio Frequency Electromagnetic Field EN 61000-4-3 IEC 61000-4-3 With a field strength of 3 V/m, noise frequency ranges from 10 MHz to 2 GHz. No effect on transceiver performance between the specification limits. Emission: Electromagnetic Interference (EMI) FCC 47 CFR Part 15, Class B EN 55022 Class B CISPR 22 Noise frequency range: 30 MHz to 18 GHz Data Sheet 6 2003-04-25 V23818-K15-B57 Technical Data Technical Data Absolute Maximum Ratings Parameter Symbol Limit Values min. Unit max. Package Power Dissipation 0.9 W Data Input Levels VCC+0.5 V 5 V 85 °C VCC max 5.5 V ECL-Output Current Data 50 mA VIDpk-pk Differential Data Input Voltage Swing Storage Ambient Temperature –40 Exceeding any one of these values may destroy the device immediately. Recommended Operating Conditions Parameter Symbol Limit Values min. Ambient Temperature Power Supply Voltage TAMB VCC–VEE 0 VIDpk-pk λC typ. Unit max. 70 °C 3.6 V 500 3200 mV 1260 1580 nm 3.1 3.3 Transmitter Differential Data Input Voltage Swing Receiver Input Center Wavelength The electro-optical characteristics described in the following tables are valid only for use under the recommended operating conditions. Data Sheet 7 2003-04-25 V23818-K15-B57 Technical Data Transmitter Electro-Optical Characteristics Transmitter Symbol Limit Values min. Launched Power (Average)1) PO –9.5 Optical Modulation Amplitude 2) OMA 180 Center Wavelength λC 1285 Spectral Width (RMS) typ. Unit max. –3 dBm µW 1350 nm σI 2.5 nm Relative Intensity Noise RIN –120 dB/Hz Extinction Ratio (Dynamic) ER Total Tx Jitter TJ Optical Rise/Fall Time3) tR, tF Reset Threshold 4) VTH tRES Reset Time Out 4) 9 53 Supply Current 1) 2) 3) 4) dB 130 ps 260 ps 2.5 2.75 2.99 V 140 240 300 ms 80 150 mA Into single mode fiber, 9 µm diameter. Fibre Channel PI Standard. Measured without filter (20% - 80%). Laser power is shut down if power supply is below VTH and switched on if power supply is above VTH after tRES. Data Sheet 8 2003-04-25 V23818-K15-B57 Technical Data Receiver Electro-Optical Characteristics Receiver Symbol Limit Values min. Sensitivity (Average Power)1) Saturation (Average Power) PIN PSAT Min. Optical Modulation Amplitude 2) OMA Loss Of Signal (LOS) Assert Level 3) PLOSA Loss Of Signal (LOS) Deassert Level 4) PLOSD typ. max. –20 –3 –37 0.5 dBm dBm 15 Loss Of Signal (LOS) Hysteresis PLOSA –PLOSD Unit µW dBm 1 –22 dBm 6 dB Loss Of Signal (LOS) Assert Time tASS 100 µs Loss Of Signal (LOS) Deassert Time tDAS 100 µs Receiver 3 dB Cut-off Frequency 2) 1.5 GHz Receiver 10 dB Cut-off Frequency 2) 3 GHz Differential Data Output Voltage VODpk-pk 600 Swing 5) 1200 mV Return Loss of Receiver ORL Output Data Rise/Fall Time tR , tF 12 Supply Current 6) 1) 2) 3) 4) 5) 6) dB 90 200 ps 130 mA Minimum average optical power at which the BER is less than 1x10–12. Measured with a 27–1 NRZ PRBS. Fibre Channel PI Standard. An increase in optical power above the specified level will cause the LOS output to switch from a high state to a low state. A decrease in optical power below the specified level will cause the LOS to change from a low state to a high state. AC/AC for data. Load 50 Ω to GND or 100 Ω differential. For dynamic measurement a tolerance of 50 mV should be added. Supply current excluding Rx output load. Data Sheet 9 2003-04-25 V23818-K15-B57 Technical Data Timing of Control and Status I/O Parameter Symbol Limit Values min. Unit Condition max. Tx Disable Assert Time t_off 10 µs Time from rising edge of Tx Disable to when the optical output falls below 10% of nominal. Tx Disable Negate Time t_on 1 ms Time from falling edge of Tx Disable to when the modulated optical output rises above 90% of nominal. Time to Initialize, t_init Including Reset of Tx Fault 300 Tx Fault Assert Time t_fault 100 Tx Disable to Reset t_reset From power on or negation of Tx Fault using Tx Disable. µs 10 Time from fault to Tx Fault on. Time Tx Disable must be held high to reset Tx Fault. LOS Assert Time t_loss_on 100 Time from LOS state to Rx LOS assert. LOS Deassert Time t_loss_off 100 Time from non-LOS state to Rx LOS deassert. I2C Bus Clock Rate f_i2cbus_ clock 100 Data Sheet kHz 10 2003-04-25 V23818-K15-B57 Eye Safety Eye Safety This laser based single mode transceiver is a Class 1 product. It complies with IEC 60825-1 and FDA 21 CFR 1040.10 and 1040.11. To meet laser safety requirements the transceiver shall be operated within the Absolute Maximum Ratings. Attention: All adjustments have been made at the factory prior to shipment of the devices. No maintenance or alteration to the device is required. Tampering with or modifying the performance of the device will result in voided product warranty. Note: Failure to adhere to the above restrictions could result in a modification that is considered an act of “manufacturing”, and will require, under law, recertification of the modified product with the U.S. Food and Drug Administration (ref. 21 CFR 1040.10 (i)). Laser Data Wavelength 1300 nm Total Output Power (as defined by IEC: 7 mm aperture at 14 mm distance) < 2 mW Total Output Power (as defined by FDA: 7 mm aperture at 20 cm distance) < 195 µW Beam Divergence 6° FDA IEC Complies with 21 CFR 1040.10 and 1040.11 Class 1 Laser Product File: 1401 Figure 3 Required Labels Indication of laser aperture and beam 20 Tx Top view Rx 11 Figure 4 Data Sheet File: 1333 Laser Emission 11 2003-04-25 V23818-K15-B57 Application Notes Application Notes EMI-Recommendations To avoid electromagnetic radiation exceeding the required limits please take note of the following recommendations. When Gigabit switching components are found on a PCB (multiplexers, clock recoveries etc.) any opening of the chassis may produce radiation also at chassis slots other than that of the device itself. Thus every mechanical opening or aperture should be as small as possible. On the board itself every data connection should be an impedance matched line (e.g. strip line, coplanar strip line). Data, Datanot should be routed symmetrically, vias should be avoided. A terminating resistor of 100 Ω should be placed at the end of each matched line. An alternative termination can be provided with a 50 Ω resistor at each (D, Dn). In DC coupled systems a thevenin equivalent 50 Ω resistance can be achieved as follows: for 3.3 V: 125 Ω to VCC and 82 Ω to VEE, for 5 V: 82 Ω to VCC and 125 Ω to VEE at Data and Datanot. Please consider whether there is an internal termination inside an IC or a transceiver. In certain cases signal GND is the most harmful source of radiation. Connecting chassis GND and signal GND at the plate/bezel/chassis rear e.g. by means of a fiber optic transceiver/cage may result in a large amount of radiation. Even a capacitive coupling between signal GND and chassis may be harmful if it is too close to an opening or an aperture. If a separation of signal GND and chassis GND is not planned, it is strongly recommended to provide a proper contact between signal GND and chassis GND at every location where possible. This concept is designed to avoid hotspots. Hotspots are places of highest radiation which could be generated if only a few connections between signal and chassis GND exist. Compensation currents would concentrate at these connections, causing radiation. By use of Gigabit switching components in a design, the return path of the RF current must also be considered. Thus a split GND plane of Tx and Rx portion may result in severe EMI problems. The cutout should be sized so that all contact springs of the cage make good contact with the face plate. For the SFP transceiver a connection of the SFP cage pins to chassis GND is recommended. If no separate chassis GND is available on the users PCB the pins should be connected to signal GND. In this case take care of the notes above. Please consider that the PCB may behave like a waveguide. With an εr of 4, the wavelength of the harmonics inside the PCB will be half of that in free space. In this scenario even the smallest PCBs may have unexpected resonances. Data Sheet 12 2003-04-25 V23818-K15-B57 Application Notes The SFP transceiver can be assembled onto the host board together with all cages and host board connectors complying with the SFP multi source agreement. Infineon Proposes Host board connector: Tyco Electronics Part Number: 1367073-1 Cage: Infineon Technologies Part Number: V23838-S5-N1 Cage SFP Host board connector File: 1502 Figure 5 Data Sheet 13 2003-04-25 V23818-K15-B57 Application Notes Handling Notes INSTALLING FRONT BEZEL DOOR IS CLOSED SFP CAGE PUSH HOST PCB REMOVING STEP 1 FRONT BEZEL RO TA T SFP CAGE E ˚ 90 DOOR HOST PCB STEP 2 PULL File: 1504 Figure 6 Data Sheet Installing and Removing of SFP-Transceiver 14 2003-04-25 V23818-K15-B57 Application Notes EEPROM Serial ID Memory Contents Data Address 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 - 35 36 37 - 39 40 - 55 56 57 - 59 60 - 61 62 63 64 65 66 67 68 - 83 84 - 91 92 - 94 95 96 - 127 Data Sheet Hex 03 04 07 00 00 00 02 12 00 0D 01 01 0D 00 0A 64 37 37 00 00 00 00 00 1A 69 55 00 MSA Name/Description Transceiver type Extended identifier Connector type Reserved SONET OC-48 SONET OC-3/12 Gigabit Ethernet FC reach/technology FC technology FC media FC speed Encoding Nominal bit rate Reserved Length (9 µm) x 1 km Length (9 µm) x 100 m Length (50 µm) x 10 m Length (62.5 µm) x 10 m Length (copper) x 1 m Reserved Vendor name Reserved Vendor IEEE OUI Vendor part number Vendor revision Vendor revision Wavelength Reserved Check code (0 to 62) Reserved Transceiver options Upper bit rate margin (%) Lower bit rate margin (%) Vendor serial number Vendor date code Diagnostic / SFF-8472 compliance Check code (64-94) Vendor specific data 15 Content/Value SFP Serial ID LC Infineon AG 00-03-19 V23818-K15-B57 Infineon production code 1.0 1310 Tx Disable, Tx Fault, LOS Not implemented 2003-04-25 V23818-K15-B57 Application Notes Single Mode 1300 nm SFP Transceiver, AC/AC TTL 1 µH 1) Design criterion of the capacitor used is the resonant frequency and its value must be in the order of the nominal data rate. Use of single layer capacitors recommended. Short trace lengths are mandatory. VCCT xx 1) 0.1 µF VEET 1 µH 3.3 V VCCR xx 1) 0.1 µF 10 µF 0.1 µF 10 µF VEER Host Board SFP Module Figure 7 File: 1304 Recommended Host Board Supply Filtering Network Infineon SFP Transceiver 3.3 V 1 µH 10 µF Protocol VCC 1 µH 0.1 µF 16 xx 1) Protocol VCC VCCT 4.7 to 10 kΩ 0.1 µF 17 4.7 to 10 kΩ Tx Disable Tx Fault Tx Disable Tx Fault TD– 0.01 µF 100 Ω Laser Driver TD+ VEET 0.01 µF 15 Protocol IC xx 1) 4.7 to 10 kΩ SerDes IC VCCR 10 µF 0.1 µF 14 RD+ 0.01 µF RD– 0.01 µF 100 Ω Preamp & Quantizer LOS LOS 3.3 V VEER PLD / PAL 4.7 to 10 kΩ 4.7 to 10 kΩ 4.7 to 10 kΩ MOD-DEF(0) MOD-DEF(1) MOD-DEF(2) 1) Design criterion of the capacitor used is the resonant frequency and its value must be in the order of the nominal data rate. Use of single layer capacitors recommended. Short trace lengths are mandatory. File: 1305 Figure 8 Data Sheet Example SFP Host Board Schematic 16 2003-04-25 V23818-K15-B57 Package Outlines Package Outlines 13.4 [.528] 16.1 REF [.636] 55.9 [2.200] 8.5 [.334] 12.5 [.492] 13.7 [.538] 10.4 [.411] 6.25 [.246] Dimensions in mm [inches] File: 1207 Figure 9 Data Sheet 17 2003-04-25 V23818-K15-B57 Revision History: 2003-04-25 Previous Version: 2002-05-06 Page DS1 Subjects (major changes since last revision) Document completely revised For questions on technology, delivery and prices please contact the Infineon Technologies Offices in Germany or the Infineon Technologies Companies and Representatives worldwide: see our webpage at http://www.infineon.com. Edition 2003-04-25 Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81541 München, Germany © Infineon Technologies AG 2003. All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide. Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life-support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.