AS1117 800mA Low Dropout Regulator SCSI-II Active Terminator FEATURES APPLICATIONS • Guaranteed 800mA Output • Three Terminal Adjustable Or Fixed 1.5V, 2.5V, 3V, 3.3V & 5V • Very Low Quiescent Current • Low Dropout Voltage Of 1.2 Volts At Full Load • Extremely Tight Load And Line Regulation • Very Low Temperature Coefficient • Logic-Controlled Electronic Shutdown • Internal Overcurrent Limiting & Thermal Overload Protection • Surface Mount Package SOT-223, TO-252, TO-220, SOT-89, TO-263, & SO-8 • SCSI-II Active Terminator • Portable/ Palm Top / Notebook Computers • Battery Chargers • Disk Drives • Portable Consumer Equipment • Portable Instrumentation • SMPS Post-Regulator PRODUCT DESCRIPTION The AS1117 is a low power positive-voltage regulator designed to meet 800mA output current and comply with SCSI-II specifications with a fixed output voltage of 2.85V. This device is an excellent choice for use in battery-powered applications, as active terminators for the SCSI bus, and portable computers. The AS1117 features very low quiescent current and very low dropout voltage of 1.2V at a full load and lower as output current decreases. AS1117 is available as an adjustable or fixed 1.5V, 2.5V, 3.0V, 3.3V, and 5.0V output voltages. The AS1117 is offered in a 3-pin surface mount package SOT-223, TO-252, TO-220 and TO-263. The output capacitor of 10µF or larger is needed for output stability of AS1117 as required by most of the other regulator circuits. ORDERING INFORMATION TO-220 3-PIN AS1117U AS1117U-X TO-263 3-PIN AS1117T AS1117T-X SOT-223 3-PIN AS1117M3 AS1117M3-X PLASTIC SOIC 8 PIN AS1117S AS1117S-X TO-252 DPAK AS1117R AS1117R-X Oper. Temp. Range -40°C to +85°C -40°C to +85°C X= Output Voltage (X = 1.5V, 2.5V, 3.0V, 3.3V, 5.0, or Blank for Adjustable) PIN CONNECTIONS 8-Pin Surface Mount (S) TO-220-3 (U) GND 1 8 VIN N/C 2 7 VIN VOUT 3 VOUT 4 AS1117 6 5 VIN SOT-223 (M3) TO-263-3 (T) AS1117 AS1117 1 2 3 N/C 1 2 AS1117 AS1117 3 1 2 3 1 2 3 ADJ/GND VOUT V IN ADJ/GND V OUT VIN Top View Top View TO-252 (R) ADJ/GND V OUT VIN ADJ/GND VOUT V IN Top View Front View Front View Rev. 10/6/00 AS1117 ABSOLUTE MAXIMUM RATINGS Power Dissipation..........................................Internally Limited Lead Temp. (Soldering, 5 Seconds) ................................ 260°C Storage Temperature Range ............................ -65° to +150°C Operating Junction Temperature Range AS1117 .................................................. -40C° to +125°C Input Supply Voltage ......................................-20V to +20V ESD Rating ............................................................2KV Min ELECTRICAL CHARACTERISTICS at VIN = VOUT +1, Ta=25°C, CL =3.3µf, unless otherwise specified. Limits in Boldface apply over the full operating temperature range. Min Max IOUT = 10mA, VIN = 4.85V 0≤IOUT≤800mA, 4.25≤VIN≤10V 1.500 1.485 1.470 1.515 1.530 V IOUT = 10mA, VIN = 4.85V 0≤IOUT≤800mA, 4.25≤VIN≤10V 2.500 2.475 2.450 2.525 2.550 V IOUT = 10mA, VIN = 4.85V 0≤IOUT≤800mA, 4.75≤VIN≤10V 3.000 2.970 2.940 3.030 3.060 V IOUT = 10mA, VIN = 5.0V 0≤IOUT≤800mA, 4.75≤VIN≤10V 3.300 3.267 3.234 3.333 3.366 V IOUT = 10mA, VIN = 7.0V 0≤IOUT≤800mA, 6.50≤VIN≤12V 5.000 4.950 4.900 5.050 5.100 V IOUT = 10mA, (VIN – VOUT) = 2V 10≤ IOUT≤800mA, 1.4≤(VIN -VIN) ≤10V (Note 1) 1.250 1.238 1.225 1.262 1.270 0.05 V 4.50V ≤VIN≤12V, VOUT = 3.00, IOUT = 0 4.80V ≤VIN≤12V, VOUT = 3.30, IOUT = 0 6.50V ≤VIN≤15V, VOUT = 5.00, IOUT = 0 0≤IOUT≤800mA, VIN = 4.50V, VOUT = 3.00 0≤IOUT≤800mA, VIN = 4.80V, VOUT = 3.30 0≤IOUT≤800mA, VIN = 6.50V, VOUT = 5.00 IL = 100mA IL = 500mA IL = 800mA 4.25V ≤VIN≤6.5V 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.05 1.10 5.00 7.00 7.00 10.00 12.00 12.00 15.00 1.10 1.15 1.20 10.00 (VIN-VOUT) = 5V 1000 1200 mA 25°C,30mS Pulse 0.01 0.1 %/W 60 75 dB 0.03 % Parameter 1.5V Version Output Voltage 2.5V Version Output Voltage 3.0V Version Output Voltage 3.3V Version Output Voltage 5.0V Version Output Voltage All Output Options Reference Voltage Output Voltage Temperature Stability Line Regulation Load Regulation Dropout Voltage ( Note 2) Quiescent Current Current Limit Thermal Regulation Ripple Rejection Long Term Stability RMS Output Noise Thermal Resistance AS1117 Typ Conditions fRIPPLE = 120Hz, (Vin-VOUT) = 3V, VRIPPLE = 1Vp-p 125°C, 1000Hrs % of Vout, 10Hz≤f≤10kHz Junction to case, at tab Units % mV mV V mA 0.003 % 15 °C/W° Note 1: Output temperature coefficient is defined as the worst case voltage change divided by the total temperature range Note 2: Dropout voltage is defined as the input to output differential at which the output voltage drops 100mV below its nominal value measured at 1V differential at very low values of programmed output voltage, the minimum input supply voltage of 2V ( 2.3V over temperature) must be taken into account. Note 3: Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied. excluding load or line regulation effect. Rev. 10/6/00 AS1117 APPLICATION NOTES EXTERNAL CAPACITOR To ensure the stability of the AS1117 an output capacitor of at least 10µF (tantalum)or 50µF (aluminum) is required. The value may change based on the application requirements on the output load or temperature range. The capacitor equivalent series resistance (ESR) will effect the AS1117 stability. The value of ESR can vary from the type of capacitor used in the applications. The recommended value for ESR is 0.5Ω. The output capacitance could increase in size to above the minimum value. The larger value of output capacitance as high as 100µF can improve the load transient response. Maximum Junction Temperature range: TJ = Tambient (max) + PD* thermal resistance (Junction-toambient) Maximum Junction temperature must not exceed the 125°C. 50 X 50 mm 35 X 17 mm SOLDERING METHODS The AS1117 SOT-223 package is designed to be compatible with infrared reflow or vapor-phase reflow soldering techniques. During soldering the non-active or mildly active fluxes may be used. The AS1117 die is attached to the heatsink lead which exits opposite the input, output, and ground pins. Hand soldering and wave soldering should be avoided since these methods can cause damage to the device with excessive thermal gradients on the package. The SOT-223 recommended soldering method are as follows: vapor phase reflow and infrared reflow with the component preheated to within 65°C of the soldering temperature range. 16 X 10 mm Fig. 1. Substrate Layout for SOT-223 THERMAL CHARACTERISTICS The thermal resistance of AS1117 is 15°C/W from junction to tab and 31 °C/W from tab to ambient for a total of 46 °C/W from junction to ambient. The AS1117 features the internal thermal limiting to protect the device during overload conditions. Special care needs to be taken during continuos load conditions the maximum junction temperature does not exceed 125 °C. Taking the FR-4 printed circuit board and 1/16 thick with 1 ounce copper foil as an experiment (fig.1 & fig.2), the PCB material is effective at transmitting heat with the tab attached to the pad area and a ground plane layer on the backside of the substrate. Refer to table 1 for the results of the experiment. The thermal interaction from other components in the application can effect the thermal resistance of the AS1117. The actual thermal resistance can be determined with experimentation. AS1117 power dissipation is calculated as follows: PD = (VIN - VOUT)(IOUT) Rev. 10/6/00 AS1117 Table 1. TOTAL PC BOARD AREA TOPDIDE COPPER AREA BACKSIDE COPPER AREA THERMAL RESISTANCE JUNCTION TO AMBIENT 2500mm 2500mm 2500mm 2500mm 2500mm 1600mm 2500mm 2500mm 1600mm 900mm 900mm 2500mm 1250mm 950mm 2500mm 1800mm 600mm 1250mm 915mm 600mm 240mm 240mm 2500mm 2500mm 2500mm 0 0 1600mm 0 0 0 900mm 0 46°C/W°° 47°C/W°° 49°C/W°° 51°C/W°° 53°C/W°° 55°C/W°° 58°C/W°° 59°C/W°° 67°C/W°° 72°C/W°° 85°C/W°° VIN IN AS1117 OUT VIN C1 IN AS1117 C1 ADJ R1 ADJ IADJ 50uA VOUT OUT vREF R 1 LOAD VOUT= VREF(1+R2/R1) +IADJ R2 800mA Current output l C2 R2 Typical Adjustable Regulator Rev. 10/6/00 AS1117 PACKAGE DRAWING TO-263-3L (T) 0.405 ± 0.005 (10.287 ± 0.127) 0.176± 0.005 (4.470 ± 0.127) 0.050 ± 0.002 (1.270 ± 0.051) 0.055 (1.397) 0.356 ± 0.005 (9.042 ± 0.127) 0.600 +- 0.025 (15.24 ± 0.635) 0.103 BSC (2.616) 0.050 (1.270) 0.032 +- 0.001 (0.813 +- 0.025) 0.015 (0.381 ++- 0° 8° 0.003 0.074) 0.100 (2.540 ± ± 0.010 0.254) Rev. 10/6/00 AS1117 PACKAGE DRAWING SOT-223-3L (M3) 0.124 0.116 0.146 0.295 0.130 0.264 0.041 0.033 0.0905 NOM 0.181 NOM 0.146 0.130 0.0040 0.0008 0.264 0.248 16°C 10°C 16°C 10°C Max 0.033 0.025 0.014 0.010 16°C 10°C Rev. 10/6/00 AS1117 PACKAGE DRAWING TO-220-3L (U) 0.151D ± 0.002 (3.835 D ± 0.051) 0.180 ± 0.005 (4.572 ± 0.127) 0.408 ± 0.013 (10.36 ± 0.33) 0.110 ± 0.010 (2.794 ± 0.254) 0.050 ± 0.002 (1.270 ± 0.051) 0.250 ± 0.010 (6.350 ± 0.254) Tapered 1o 2 Sides 0.340 ± 0.010 (8.636 ± 0.254) 0.150 MIN (3.81 MIN) 0.540 ± 0.015 (13.720 ± 0.381) 0.050 TYP (1.27 TYP) 0.200 ± 0.010 (5.080 ± 0.254) SEATING PLANE 1.020 ± 0.015 (25.910 ± 0.381) 7o Typ. 0.410 (10.41) 0.015 ± 0.010/-0.015 (2.667± 0.254/-0.381) 0.100 ± 0.010 (2.540 ± 0.254) 0.032 ± 0.005 (0.813 ± 0.127) 0.015 ± 0.010/-0.002 (0.381± 0.254/-0.051) Rev. 10/6/00 AS1117 PACKAGE DRAWING 8-PIN SOIC (S) 4.0 (0.158) 3.8 (0.150) 5.2 (0.205) 4.6 (0.181) 6.2 (0.244) 5.8 (0.228) Pin 1 1.27 (0.50) BSC 1.75 (0.069) 1.35 (0.053) 0.78 (0.031) 0.61 (0.024) 5.0 (0.197) 4.8 (0.188) 0.37 (0.015) BSC 45° 0.77 (0.030) 0.64 (0.025) 7 °(4 PLCS) 3°-6° 0.56 (0.022) 0.49 (0.019) 0.45 (0.018) 0.35 (0.014) 0.20 (0.008) 0.10 (0.004) 0.22 (0.009) 0.19 (0.007) 7 °(4 PLCS) Rev. 10/6/00 AS1117 PACKAGE DRAWING TO-252-3L (R) -A- E b2 -B- A A1 C1 L2 A 4 SEATING PLANE D 1 2 L3 L1 3 H L -C- b .010 M A M c b1 3 PLCS C A 8 e e1 NOTES D1 1. 2. 3. 4. Refer To Applicable Symbol List. Dimensions And Tolerancing Per Ansi Y14.5m - 1982. Lead Dimension Uncontrolled in L 3. Tab Contour Optional Within Dim. b 2 & L2 And E1 & D1 5. D1 & E1 Establishes A Minimum Mounting Surface for Terminal 4. 6. L is the Termal Length for Soldering. 7. Controlling Dimension: Inch 8. 2 Mils Suggested For Postive Contact At Mounting. E1 TERM 4 BACK VIEW A-A S Y M B O L MIN MAX MIN MAX A 0.086 0.094 2.184 2.3876 INCHES MM A1 0.035 0.045 0.889 1.143 b 0.025 0.035 0.635 0.889 b1 0.300 0.045 7.620 1.143 b2 0.205 0.215 5.207 5.461 c 0.018 0.023 0.457 0.5842 c1 0.018 0.023 0.457 0.5842 D 0.235 0.245 5.969 6.223 D1 0.170 - 4.318 - E 0.250 0.265 6.350 6.731 E1 0.170 - 4.318 e 0.098 e1 - N O T E 4 4,5 4,5 2.489 0.180 4.572 H 0.370 0.410 9.398 L 0.020 - 0.508 10.414 - L1 0.025 0.040 0.635 1.016 L2 0.035 0.050 0.889 1.270 4 L3 0.045 0.060 1.143 1.524 3 6 Rev. 10/6/00