Philips Semiconductors Product specification Thyristors sensitive gate GENERAL DESCRIPTION Glass passivated, sensitive gate thyristors in a plastic envelope, intended for use in general purpose switching and phase control applications. PINNING - SOT82 PIN QUICK REFERENCE DATA SYMBOL VDRM, VRRM IT(AV) IT(RMS) ITSM PARAMETER MAX. MAX. MAX. UNIT BTA151Repetitive peak off-state voltages Average on-state current RMS on-state current Non-repetitive peak on-state current 500R 500 650R 650 800R 800 V 7.5 12 100 7.5 12 100 7.5 12 100 A A A PIN CONFIGURATION SYMBOL DESCRIPTION 1 cathode 2 anode 3 gate tab BTA151 series a anode 1 2 k g 3 LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL PARAMETER CONDITIONS VDRM, VRRM Repetitive peak off-state voltages IT(AV) IT(RMS) ITSM I2t dIT/dt IGM VGM VRGM PGM PG(AV) Tstg Tj Average on-state current RMS on-state current Non-repetitive peak on-state current half sine wave; Tmb ≤ 109 ˚C all conduction angles half sine wave; Tj = 25 ˚C prior to surge t = 10 ms t = 8.3 ms t = 10 ms ITM = 20 A; IG = 50 mA; dIG/dt = 50 mA/µs I2t for fusing Repetitive rate of rise of on-state current after triggering Peak gate current Peak gate voltage Peak reverse gate voltage Peak gate power Average gate power over any 20 ms period Storage temperature Operating junction temperature MIN. MAX. UNIT - -500R -650R -800R 5001 6501 800 V - 7.5 12 A A - 100 110 50 50 A A A2s A/µs -40 - 2 5 12 5 0.5 150 125 A V V W W ˚C ˚C 1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the thyristor may switch to the on-state. The rate of rise of current should not exceed 15 A/µs. September 1997 1 Rev 1.200 Philips Semiconductors Product specification Thyristors sensitive gate BTA151 series THERMAL RESISTANCES SYMBOL PARAMETER Rth j-mb Thermal resistance junction to mounting base Thermal resistance in free air junction to ambient Rth j-a CONDITIONS MIN. TYP. MAX. UNIT - - 1.3 K/W - 60 - K/W STATIC CHARACTERISTICS Tj = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT IGT IL IH VT VGT Gate trigger current Latching current Holding current On-state voltage Gate trigger voltage ID, IR Off-state leakage current VD = 12 V; IT = 0.1 A VD = 12 V; IGT = 0.1 A VD = 12 V; IGT = 0.1 A IT = 23 A VD = 12 V; IT = 0.1 A VD = VDRM(max); IT = 0.1 A; Tj = 125 ˚C VD = VDRM(max); VR = VRRM(max); Tj = 125 ˚C 0.25 - 2 10 7 1.4 0.6 0.4 0.1 4 40 16 1.75 1.5 0.5 mA mA mA V V V mA MIN. TYP. MAX. UNIT 50 200 - 130 1000 2 - V/µs V/µs µs - 70 - µs DYNAMIC CHARACTERISTICS Tj = 25 ˚C unless otherwise stated SYMBOL PARAMETER CONDITIONS dVD/dt Critical rate of rise of off-state voltage VD = 67% VDRM(max); Tj = 125 ˚C; exponential waveform Gate open circuit RGK = 100 Ω ITM = 40 A; VD = VDRM; IG = 0.1 A; dIG/dt = 5 A/µs VD = 67% VDRM(max); ITM = 20 A; VR = 25 V; dITM/dt = 30 A/µs; dVD/dt = 50 V/µs; RGK = 100 Ω tgt tq Gate controlled turn-on time Circuit commutated turn-off time September 1997 2 Rev 1.200 Philips Semiconductors Product specification Thyristors sensitive gate 15 BTA151 series Ptot / W conduction angle degrees 30 60 90 120 180 10 Tmb(max) / C BT151 form factor 120 105.5 4 2.8 2.2 1.9 1.57 BT151 100 time T Tj initial = 25 C max 1.9 2.2 112 2.8 ITSM IT a = 1.57 a ITSM / A 80 4 60 118.5 5 40 20 0 0 1 2 3 4 5 IT(AV) / A 6 7 125 8 0 Fig.1. Maximum on-state dissipation, Ptot, versus average on-state current, IT(AV), where a = form factor = IT(RMS)/ IT(AV). 1000 10 100 Number of half cycles at 50Hz 1000 Fig.4. Maximum permissible non-repetitive peak on-state current ITSM, versus number of cycles, for sinusoidal currents, f = 50 Hz. BT151 ITSM / A 1 25 BT151 IT(RMS) / A 20 dI T /dt limit 15 100 10 I TSM IT 5 time T Tj initial = 25 C max 10 10us 100us 0 0.01 10ms 1ms 0.1 1 surge duration / s T/s Fig.2. Maximum permissible non-repetitive peak on-state current ITSM, versus pulse width tp, for sinusoidal currents, tp ≤ 10ms. 15 IT(RMS) / A 10 Fig.5. Maximum permissible repetitive rms on-state current IT(RMS), versus surge duration, for sinusoidal currents, f = 50 Hz; Tmb ≤ 109˚C. BT151 1.6 109 C VGT(Tj) VGT(25 C) BT151 1.4 10 1.2 1 5 0.8 0.6 0 -50 0 50 Tmb / C 100 0.4 -50 150 Fig.3. Maximum permissible rms current IT(RMS) , versus mounting base temperature Tmb. September 1997 0 50 Tj / C 100 150 Fig.6. Normalised gate trigger voltage VGT(Tj)/ VGT(25˚C), versus junction temperature Tj. 3 Rev 1.200 Philips Semiconductors Product specification Thyristors sensitive gate 3 IGT(Tj) IGT(25 C) BTA151 series 30 BT151 Tj = 125 C Tj = 25 C 25 2.5 Vo = 1.06 V Rs = 0.0304 ohms typ 20 2 1.5 15 1 10 0.5 5 0 -50 0 50 Tj / C 100 0 150 Fig.7. Normalised gate trigger current IGT(Tj)/ IGT(25˚C), versus junction temperature Tj. 3 BT151 IT / A IL(Tj) IL(25 C) 0 0.5 max 1 VT / V 1.5 2 Fig.10. Typical and maximum on-state characteristic. 10 BT145 2.5 BT151 Zth j-mb (K/W) 1 2 0.1 1.5 P D 1 tp 0.01 0.5 t 0 -50 0 50 Tj / C 100 0.001 10us 150 IH(Tj) IH(25 C) 1ms 10ms tp / s 0.1s 1s 10s Fig.11. Transient thermal impedance Zth j-mb, versus pulse width tp. Fig.8. Normalised latching current IL(Tj)/ IL(25˚C), versus junction temperature Tj. 3 0.1ms 10000 BT151 dVD/dt (V/us) 2.5 1000 2 RGK = 100 Ohms 1.5 100 1 gate open circuit 0.5 0 -50 0 50 Tj / C 100 10 150 50 100 150 Tj / C Fig.12. Typical, critical rate of rise of off-state voltage, dVD/dt versus junction temperature Tj. Fig.9. Normalised holding current IH(Tj)/ IH(25˚C), versus junction temperature Tj. September 1997 0 4 Rev 1.200 Philips Semiconductors Product specification Thyristors sensitive gate BTA151 series MECHANICAL DATA Dimensions in mm Net Mass: 0.8 g 2.8 2.3 mounting base 7.8 max 3.75 3.1 2.5 1) 2.54 max 11.1 max 1.2 15.3 min 1 2 3 0.5 4.58 2.29 0.88 max 1) Lead dimensions within this zone uncontrolled. Fig.13. SOT82; pin 2 connected to mounting base. Notes 1. Refer to mounting instructions for SOT82 envelopes. 2. Epoxy meets UL94 V0 at 1/8". September 1997 5 Rev 1.200 Philips Semiconductors Product specification Thyristors sensitive gate BTA151 series DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 1997 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. September 1997 6 Rev 1.200