BAP70AM Silicon PIN diode array Rev. 2 — 7 September 2010 Product data sheet 1. Product profile 1.1 General description Four planar PIN diode array in SOT363 small SMD plastic package. 1.2 Features and benefits High voltage current controlled RF resistor for RF attenuators Low diode capacitance Very low series inductance Low distortion 1.3 Applications RF attenuators (SAT) TV applications Car radio applications 2. Pinning information Table 1. Discrete pinning Pin Description 1 anode diode 1 Simplified outline 2 cathode diode 2 3 anode diode 3 / cathode diode 4 4 anode diode 4 5 cathode diode 3 6 anode diode 2 / cathode diode 1 Graphic symbol 6 5 4 6 5 1 2 3 1 2 4 3 sym118 3. Ordering information Table 2. Ordering information Type number Package BAP70AM Name Description Version - plastic surface-mounted package; 6 leads SOT363 BAP70AM NXP Semiconductors Silicon PIN diode array 4. Marking Table 3. Marking Type number Marking code Description BAP70AM N9* * = - : made in Hong Kong * = p : made in Hong Kong * = t : made in Malaysia 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VR reverse voltage IF forward current Ptot total power dissipation Tstg Tj Conditions Min Max Unit - 50 V - 100 mA - 300 mW storage temperature −65 +150 °C junction temperature −65 +150 °C Tsp = 90 °C 6. Thermal characteristics Table 5. BAP70AM Product data sheet Thermal characteristics Symbol Parameter Rth(j-sp) thermal resistance from junction to solder point Conditions All information provided in this document is subject to legal disclaimers. Rev. 2 — 7 September 2010 Typ Unit 260 K/W © NXP B.V. 2010. All rights reserved. 2 of 8 BAP70AM NXP Semiconductors Silicon PIN diode array 7. Characteristics Table 6. Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VF forward voltage IF = 50 mA - 0.9 1.1 V IR reverse current VR = 50 V - - < 100 nA Cd diode capacitance see Figure 1; f = 1 MHz; VR = 0 V - 570 - fF VR = 1 V - 400 - fF diode forward resistance rD VR = 5 V - 270 - fF VR = 20 V - 200 250 fF - 77 100 Ω see Figure 2; f = 100 MHz; IF = 0.5 mA IF = 1 mA - 40 50 Ω IF = 10 mA - 5.4 7 Ω IF = 100 mA - 1.4 1.9 Ω τL charge carrier life time when switched from IF = 10 mA to IR = 6 mA; RL = 100 Ω; measured at IR = 3 mA - 1.25 - μs LS series inductance IF = 100 mA; f = 100 MHz - 0.6 - nH 001aaa461 600 mce007 103 rD (Ω) Cd (fF) 500 102 400 10 300 1 10−1 200 0 5 10 15 20 1 f = 1 MHz; Tj = 25 °C. Fig 1. f = 100 MHz; Tj = 25 °C. Diode capacitance as a function of reverse voltage; typical values BAP70AM Product data sheet 102 10 IF (mA) VR (V) Fig 2. Diode forward resistance as a function of forward current; typical values All information provided in this document is subject to legal disclaimers. Rev. 2 — 7 September 2010 © NXP B.V. 2010. All rights reserved. 3 of 8 BAP70AM NXP Semiconductors Silicon PIN diode array 8. Package outline Plastic surface-mounted package; 6 leads SOT363 D E B y X A HE 6 5 v M A 4 Q pin 1 index A A1 1 2 e1 3 c bp Lp w M B e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E e e1 HE Lp Q v w y mm 1.1 0.8 0.1 0.30 0.20 0.25 0.10 2.2 1.8 1.35 1.15 1.3 0.65 2.2 2.0 0.45 0.15 0.25 0.15 0.2 0.2 0.1 OUTLINE VERSION REFERENCES IEC SOT363 Fig 3. JEDEC JEITA SC-88 EUROPEAN PROJECTION ISSUE DATE 04-11-08 06-03-16 Package outline SOT363 BAP70AM Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 7 September 2010 © NXP B.V. 2010. All rights reserved. 4 of 8 BAP70AM NXP Semiconductors Silicon PIN diode array 9. Abbreviations Table 7. Abbreviations Acronym Description PIN P-type, Intrinsic, N-type SMD Surface Mounted Device RF Radio Frequency SAT SATellite 10. Revision history Table 8. Revision history Document ID Release date Data sheet status Change notice Supersedes BAP70AM v.2 20100907 Product data sheet - BAP70AM v.1 Modifications: BAP70AM v.1 BAP70AM Product data sheet • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors • • Legal texts have been adapted to the new company name where appropriate Table 3 on page 2: Marking code has been updated to current situation. 20061120 Product data sheet - All information provided in this document is subject to legal disclaimers. Rev. 2 — 7 September 2010 - © NXP B.V. 2010. All rights reserved. 5 of 8 BAP70AM NXP Semiconductors Silicon PIN diode array 11. Legal information 11.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 11.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 11.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. BAP70AM Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 7 September 2010 © NXP B.V. 2010. All rights reserved. 6 of 8 BAP70AM NXP Semiconductors Silicon PIN diode array Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond 11.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 12. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BAP70AM Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 7 September 2010 © NXP B.V. 2010. All rights reserved. 7 of 8 BAP70AM NXP Semiconductors Silicon PIN diode array 13. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 8 9 10 11 11.1 11.2 11.3 11.4 12 13 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description . . . . . . . . . . . . . . . . . . . . . Features and benefits . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 1 2 2 2 3 4 5 5 6 6 6 6 7 7 8 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 7 September 2010 Document identifier: BAP70AM