scls131e_oa

PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
5962-8408501VRA
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-8408501VR
A
SNV54HC245J
5962-8408501VSA
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-8408501VS
A
SNV54HC245W
84085012A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
84085012A
SNJ54HC
245FK
8408501RA
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
8408501RA
SNJ54HC245J
8408501SA
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
8408501SA
SNJ54HC245W
JM38510/65503BRA
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
65503BRA
JM38510/65503BSA
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
65503BSA
M38510/65503BRA
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
65503BRA
M38510/65503BSA
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
65503BSA
SN54HC245J
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN54HC245J
SN74HC245DBLE
OBSOLETE
SSOP
DB
20
TBD
Call TI
Call TI
-40 to 85
SN74HC245DBR
ACTIVE
SSOP
DB
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC245
SN74HC245DBRG4
ACTIVE
SSOP
DB
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC245
SN74HC245DW
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC245
SN74HC245DWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC245
SN74HC245DWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC245
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
10-Jun-2014
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
SN74HC245DWR
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC245
SN74HC245DWRE4
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC245
SN74HC245DWRG4
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC245
SN74HC245N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
SN74HC245N
SN74HC245N3
OBSOLETE
PDIP
N
20
TBD
Call TI
Call TI
-40 to 85
SN74HC245NE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
SN74HC245N
SN74HC245NSR
ACTIVE
SO
NS
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC245
SN74HC245NSRE4
ACTIVE
SO
NS
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC245
SN74HC245PW
ACTIVE
TSSOP
PW
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC245
SN74HC245PWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC245
SN74HC245PWLE
OBSOLETE
TSSOP
PW
20
TBD
Call TI
Call TI
-40 to 85
SN74HC245PWR
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 85
HC245
SN74HC245PWRE4
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC245
SN74HC245PWRG4
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC245
SN74HC245PWT
ACTIVE
TSSOP
PW
20
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC245
SNJ54HC245FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
84085012A
SNJ54HC
245FK
SNJ54HC245J
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
8408501RA
SNJ54HC245J
SNJ54HC245W
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
8408501SA
SNJ54HC245W
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54HC245, SN54HC245-SP, SN74HC245 :
• Catalog: SN74HC245, SN54HC245
• Military: SN54HC245
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
• Space: SN54HC245-SP
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
Addendum-Page 4