SN54HC245, SN74HC245 OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCLS131D − DECEMBER 1982 − REVISED AUGUST 2003 D Wide Operating Voltage Range of 2 V to 6 V D High-Current 3-State Outputs Drive Bus Lines Directly or Up To 15 LSTTL Loads D Low Power Consumption, 80-μA Max ICC D Typical tpd = 12 ns D ±6-mA Output Drive at 5 V D Low Input Current of 1 μA Max SN54HC245 . . . J OR W PACKAGE SN74HC245 . . . DB, DW, N, NS, OR PW PACKAGE (TOP VIEW) 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 A2 A1 DIR VCC OE 1 VCC OE B1 B2 B3 B4 B5 B6 B7 B8 A3 A4 A5 A6 A7 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 B1 B2 B3 B4 B5 A8 GND B8 B7 B6 DIR A1 A2 A3 A4 A5 A6 A7 A8 GND SN54HC245 . . . FK PACKAGE (TOP VIEW) description/ordering information These octal bus transceivers are designed for asynchronous two-way communication between data buses. The control-function implementation minimizes external timing requirements. The devices allow data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so that the buses are effectively isolated. ORDERING INFORMATION PACKAGE† TA PDIP − N SN74HC245N Tube of 25 SN74HC245DW Reel of 2000 SN74HC245DWR SOP − NS Reel of 2000 SN74HC245NSR HC245 SSOP − DB Reel of 2000 SN74HC245DBR HC245 Tube of 70 SN74HC245PW Reel of 2000 SN74HC245PWR Reel of 250 SN74HC245PWT CDIP − J Tube of 20 SNJ54HC245J SNJ54HC245J CFP − W Tube of 85 SNJ54HC245W SNJ54HC245W LCCC − FK Tube of 55 SNJ54HC245FK SNJ54HC245FK TSSOP − PW −55°C to 125°C † TOP-SIDE MARKING Tube of 20 SOIC − DW 40°C to 85°C −40°C ORDERABLE PART NUMBER SN74HC245N HC245 HC245 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright © 2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN54HC245, SN74HC245 OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCLS131D − DECEMBER 1982 − REVISED AUGUST 2003 FUNCTION TABLE INPUTS OE DIR OPERATION L L B data to A bus L H A data to B bus H X Isolation logic diagram (positive logic) DIR 1 19 A1 OE 2 18 B1 To Seven Other Channels absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±70 mA Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54HC245, SN74HC245 OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCLS131D − DECEMBER 1982 − REVISED AUGUST 2003 recommended operating conditions (see Note 3) SN54HC245 VCC Supply voltage VCC = 2 V VIH VCC = 4.5 V High-level High level input voltage VCC = 6 V MIN NOM MAX 2 5 6 Input voltage VO Output voltage TA 5 6 3.15 4.2 0 0 Input transition rise/fall time 2 4.2 VCC = 2 V Δt/Δv MAX 3.15 VCC = 6 V VI NOM 1.5 VCC = 4.5 V Low-level Low level input voltage MIN 1.5 VCC = 2 V VIL SN74HC245 0.5 1.35 1.35 1.8 1.8 0 VCC 0 V VCC V 1000 VCC = 4.5 V 500 500 VCC = 6 V 400 400 −55 125 −40 V VCC 1000 Operating free-air temperature V V 0.5 VCC UNIT 85 ns °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VOH TEST CONDITIONS TA = 25°C MIN TYP SN54HC245 MAX MIN MAX SN74HC245 MIN 2V 1.9 1.998 1.9 1.9 IOH = −20 20 μA 4.5 V 4.4 4.499 4.4 4.4 6V 5.9 5.999 5.9 5.9 IOH = −6 mA 4.5 V 3.98 4.3 3.7 3.84 6V 5.48 5.8 5.2 5.34 VI = VIH or VIL IOH = −7.8 mA IOL = 20 μA VOL VCC VI = VIH or VIL IOL = 6 mA IOL = 7.8 mA MAX UNIT V 2V 0.002 0.1 0.1 0.1 4.5 V 0.001 0.1 0.1 0.1 6V 0.001 0.1 0.1 0.1 4.5 V 0.17 0.26 0.4 0.33 6V 0.15 0.26 0.4 0.33 V II DIR or OE VI = VCC or 0 6V ±0.1 ±100 ±1000 ±1000 nA IOZ A or B VO = VCC or 0 6V ±0.01 ±0.5 ±10 ±5 μA 8 160 80 μA 10 10 10 pF ICC Ci VI = VCC or 0, DIR or OE IO = 0 6V 2 V to 6 V POST OFFICE BOX 655303 3 • DALLAS, TEXAS 75265 3 SN54HC245, SN74HC245 OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCLS131D − DECEMBER 1982 − REVISED AUGUST 2003 switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER tpd ten FROM (INPUT) TO (OUTPUT) VCC A or B B or A OE tdis OE tt A or B A or B A or B TA = 25°C MIN SN54HC245 MIN MAX SN74HC245 TYP MAX MIN MAX 2V 40 105 160 130 4.5 V 15 21 32 26 6V 12 18 27 22 2V 125 230 340 290 4.5 V 23 46 68 58 6V 20 39 58 49 2V 74 200 300 250 4.5 V 25 40 60 50 6V 21 34 51 43 2V 20 60 90 75 4.5 V 8 12 18 15 6V 6 10 15 13 UNIT ns ns ns ns switching characteristics over recommended operating free-air temperature range, CL = 150 pF (unless otherwise noted) (see Figure 1) PARAMETER tpd ten tt FROM (INPUT) A or B OE TO (OUTPUT) VCC B or A A or B A or B TA = 25°C MIN SN54HC245 MIN MAX SN74HC245 TYP MAX MIN MAX 2V 54 135 200 170 4.5 V 18 27 40 34 6V 15 23 34 29 2V 150 270 405 335 4.5 V 31 54 81 67 6V 25 46 69 56 2V 45 210 315 265 4.5 V 17 42 63 53 6V 13 36 53 45 UNIT ns ns ns operating characteristics, TA = 25°C PARAMETER Cpd 4 TEST CONDITIONS Power dissipation capacitance per transceiver POST OFFICE BOX 655303 No load • DALLAS, TEXAS 75265 TYP 40 UNIT pF SN54HC245, SN74HC245 OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS SCLS131D − DECEMBER 1982 − REVISED AUGUST 2003 PARAMETER MEASUREMENT INFORMATION VCC PARAMETER Test Point From Output Under Test S1 ten RL CL (see Note A) RL tPZH tdis S2 1 kΩ tPZL tPHZ tPLZ 1 kΩ tpd or tt −− Output Control (Low-Level Enabling) 50% LOAD CIRCUIT CL S1 S2 50 pF or 150 pF Open Closed Closed Open Open Closed Closed Open Open Open 50 pF 50 pF or 150 pF VCC Input 50% 50% 0V tPLH In-Phase Output 50% 10% tPHL 90% VOH 50% 10% V OL tf 90% tr tPHL Out-of-Phase Output 90% tPLH 50% 10% 50% 10% 90% VOH tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES 0V tPZL VOL tf VCC 50% Output Waveform 1 (See Note B) tPLZ 10% tPZH Input 50% 10% 90% VCC 90% 50% 10% 0 V tr Output Waveform 2 (See Note B) ≈VCC ≈VCC 50% VOL tPHZ 50% 90% VOH ≈0 V tf VOLTAGE WAVEFORM INPUT RISE AND FALL TIMES VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS NOTES: A. CL includes probe and test-fixture capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. D. The outputs are measured one at a time with one input transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 27-May-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) 5962-8408501VRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type Purchase Samples 5962-8408501VSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type Purchase Samples POST-PLATE N / A for Pkg Type Purchase Samples 84085012A ACTIVE LCCC FK 20 1 TBD 8408501RA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type Purchase Samples 8408501SA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type Purchase Samples JM38510/65503BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type Contact TI Distributor or Sales Office JM38510/65503BSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type Contact TI Distributor or Sales Office SN54HC245J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type Contact TI Distributor or Sales Office SN74HC245DBLE OBSOLETE SSOP DB 20 TBD Call TI SN74HC245DBR ACTIVE SSOP DB 20 2000 SN74HC245DBRE4 ACTIVE SSOP DB 20 SN74HC245DBRG4 ACTIVE SSOP DB SN74HC245DW ACTIVE SOIC SN74HC245DWE4 ACTIVE SN74HC245DWG4 Call TI Replaced by SN74HC245DBR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples SN74HC245DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office SN74HC245DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office SN74HC245DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office SN74HC245N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type Contact TI Distributor or Sales Office Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 27-May-2010 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) SN74HC245N3 OBSOLETE PDIP N 20 TBD SN74HC245NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) SN74HC245NSR ACTIVE SO NS 20 2000 SN74HC245NSRE4 ACTIVE SO NS 20 SN74HC245NSRG4 ACTIVE SO NS SN74HC245PW ACTIVE TSSOP SN74HC245PWE4 ACTIVE SN74HC245PWG4 Lead/ Ball Finish Call TI MSL Peak Temp (3) Samples (Requires Login) Call TI Samples Not Available CU NIPDAU N / A for Pkg Type Contact TI Distributor or Sales Office Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples SN74HC245PWLE OBSOLETE TSSOP PW 20 SN74HC245PWR ACTIVE TSSOP PW 20 2000 SN74HC245PWRE4 ACTIVE TSSOP PW 20 2000 SN74HC245PWRG3 PREVIEW TSSOP PW 20 2000 TBD Call TI Samples Not Available SN74HC245PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office SN74HC245PWT ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples SN74HC245PWTE4 ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples SN74HC245PWTG4 ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples SNJ54HC245FK ACTIVE LCCC FK 20 1 TBD SNJ54HC245J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type Contact TI Distributor or Sales Office SNJ54HC245W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type Contact TI Distributor or Sales Office TBD Call TI Replaced by SN74HC245PWR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office Addendum-Page 2 Call TI Call TI POST-PLATE N / A for Pkg Type Contact TI Distributor or Sales Office PACKAGE OPTION ADDENDUM www.ti.com 27-May-2010 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54HC245, SN54HC245-SP, SN74HC245 : • Catalog: SN74HC245, SN54HC245 • Military: SN54HC245 • Space: SN54HC245-SP NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Military - QML certified for Military and Defense Applications Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 27-May-2010 • Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 20-Jul-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74HC245DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74HC245DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74HC245NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1 SN74HC245PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 20-Jul-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74HC245DBR SN74HC245DWR SSOP DB 20 2000 346.0 346.0 33.0 SOIC DW 20 2000 346.0 346.0 41.0 SN74HC245NSR SO NS 20 2000 346.0 346.0 41.0 SN74HC245PWR TSSOP PW 20 2000 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DLP® Products www.dlp.com Communications and Telecom www.ti.com/communications DSP dsp.ti.com Computers and Peripherals www.ti.com/computers Clocks and Timers www.ti.com/clocks Consumer Electronics www.ti.com/consumer-apps Interface interface.ti.com Energy www.ti.com/energy Logic logic.ti.com Industrial www.ti.com/industrial Power Mgmt power.ti.com Medical www.ti.com/medical Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Space, Avionics & Defense www.ti.com/space-avionics-defense RF/IF and ZigBee® Solutions www.ti.com/lprf Video and Imaging www.ti.com/video Wireless www.ti.com/wireless-apps Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2010, Texas Instruments Incorporated