PACKAGE MATERIALS INFORMATION www.ti.com 14-Jan-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN65LVDS387DGGR TSSOP DGG 64 2000 330.0 24.4 8.4 17.3 1.7 12.0 24.0 Q1 SN65LVDS389DBTR TSSOP DBT 38 2000 330.0 16.4 6.9 10.2 1.8 12.0 16.0 Q1 SN65LVDS391DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SN65LVDS391PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN75LVDS387DGGR TSSOP DGG 64 2000 330.0 24.4 8.4 17.3 1.7 12.0 24.0 Q1 SN75LVDS389DBTR TSSOP DBT 38 2000 330.0 16.4 6.9 10.2 1.8 12.0 16.0 Q1 SN75LVDS391DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SN75LVDS391PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jan-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN65LVDS387DGGR TSSOP DGG 64 2000 367.0 367.0 45.0 SN65LVDS389DBTR TSSOP DBT 38 2000 367.0 367.0 38.0 SN65LVDS391DR SOIC D 16 2500 367.0 367.0 38.0 SN65LVDS391PWR TSSOP PW 16 2000 367.0 367.0 35.0 SN75LVDS387DGGR TSSOP DGG 64 2000 367.0 367.0 45.0 SN75LVDS389DBTR TSSOP DBT 38 2000 367.0 367.0 38.0 SN75LVDS391DR SOIC D 16 2500 367.0 367.0 38.0 SN75LVDS391PWR TSSOP PW 16 2000 367.0 367.0 35.0 Pack Materials-Page 2