XC7SET14 Inverting Schmitt trigger Rev. 01 — 31 August 2009 Product data sheet 1. General description XC7SET14 is a high-speed Si-gate CMOS device. It provides an inverting buffer function with Schmitt trigger action. This device is capable of transforming slowly changing input signals into sharply defined, jitter-free output signals. 2. Features n Symmetrical output impedance n High noise immunity n ESD protection: u HBM JESD22-A114E: exceeds 2000 V u MM JESD22-A115-A: exceeds 200 V u CDM JESD22-C101C: exceeds 1000 V n Low power dissipation n Balanced propagation delays n SOT353-1 and SOT753 package options n Specified from −40 °C to +125 °C 3. Applications n Wave and pulse shapers n Astable multivibrators n Monostable multivibrators 4. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version XC7SET14GW −40 °C to +125 °C TSSOP5 plastic thin shrink small outline package; 5 leads; body width 1.25 mm SOT353-1 XC7SET14GV −40 °C to +125 °C SC-74A plastic surface-mounted package; 5 leads SOT753 XC7SET14 NXP Semiconductors Inverting Schmitt trigger 5. Marking Table 2. Marking codes Type number Marking code[1] XC7SET14GW gF XC7SET14GV g14 [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 6. Functional diagram 2 A Y 4 2 4 Y mna024 mna023 Fig 1. Logic symbol A mna025 Fig 2. IEC logic symbol Fig 3. Logic diagram 7. Pinning information 7.1 Pinning XC7SET14 n.c. 1 A 2 GND 3 5 VCC 4 Y 001aak132 Fig 4. Pin configuration SOT353-1 and SOT753 7.2 Pin description Table 3. Pin description Symbol Pin Description n.c. 1 not connected A 2 data input GND 3 ground (0 V) Y 4 data output VCC 5 supply voltage XC7SET14_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 31 August 2009 2 of 14 XC7SET14 NXP Semiconductors Inverting Schmitt trigger 8. Functional description Table 4. Function table H = HIGH voltage level; L = LOW voltage level Input Output A Y L H H L 9. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VCC supply voltage VI input voltage IIK input clamping current VI < −0.5 V IOK output clamping current VO < −0.5 V or VO > VCC + 0.5 V IO output current −0.5 V < VO < VCC + 0.5 V [1] Min Max Unit −0.5 +7.0 V −0.5 +7.0 V −20 - mA - ±20 mA - ±25 mA ICC supply current - 75 mA IGND ground current −75 - mA Tstg storage temperature −65 +150 °C - 250 mW total power dissipation Ptot Tamb = −40 °C to +125 °C [2] [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] For both TSSOP5 and SC-74A packages: above 87.5 °C the value of Ptot derates linearly with 4.0 mW/K. 10. Recommended operating conditions Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ 4.5 Max VCC supply voltage VI input voltage 0 VO output voltage 0 Tamb ambient temperature −40 +25 XC7SET14_1 Product data sheet 5.0 Unit 5.5 V - 5.5 V - VCC V +125 °C © NXP B.V. 2009. All rights reserved. Rev. 01 — 31 August 2009 3 of 14 XC7SET14 NXP Semiconductors Inverting Schmitt trigger 11. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter VOH 25 °C Conditions HIGH-level VI = VT+ or VT−; VCC = 4.5 V output voltage IO = −50 µA IO = −8.0 mA VOL LOW-level VI = VT+ or VT−; VCC = 4.5 V output voltage IO = 50 µA IO = 8.0 mA VI = 5.5 V or GND; VCC = 0 V to 5.5 V −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ Max Min Max Min Max 4.4 4.5 - 4.4 - 4.4 - V 3.94 - - 3.8 - 3.70 - V - 0 0.1 - 0.1 - 0.1 V - - 0.36 - 0.44 - 0.55 V - - 0.1 - 1.0 - 2.0 µA II input leakage current ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 1.0 - 10 - 40 µA ∆ICC additional per input pin; VI = 3.4 V; supply current other inputs at VCC or GND; IO = 0 A; VCC = 5.5 V - - 1.35 - 1.5 - 1.5 mA CI input capacitance - 1.5 10 - 10 - 10 pF XC7SET14_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 31 August 2009 4 of 14 XC7SET14 NXP Semiconductors Inverting Schmitt trigger 11.1 Transfer characteristics Table 8. Transfer characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). See Figure 7 and Figure 8. Symbol Parameter positive-going threshold voltage VT+ VT− negative-going threshold voltage VH hysteresis voltage 25 °C Conditions −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ Max Min Max Min Max VCC = 4.5 V - - 2.0 - 2.0 - 2.0 V VCC = 5.5 V - - 2.0 - 2.0 - 2.0 V VCC = 4.5 V 0.5 - - 0.5 - 0.5 - V VCC = 5.5 V 0.6 - - 0.6 - 0.6 - V VCC = 4.5 V 0.4 - 1.4 0.4 1.4 0.35 1.4 V VCC = 5.5 V 0.4 - 1.6 0.4 1.6 0.35 1.6 V 12. Dynamic characteristics Table 9. Dynamic characteristics GND = 0 V. For waveform see Figure 5. For test circuit see Figure 6. Symbol Parameter propagation delay tpd [1] −40 °C to +85 °C −40 °C to +125 °C Unit Min Typ Max Min CL = 15 pF - 4.1 7.0 1.0 8.0 1.0 9.0 ns CL = 50 pF - 5.9 8.5 1.0 10.0 1.0 11.0 ns - 13 - - - - - pF A to Y; VCC = 4.5 V to 5.5 V power per buffer; dissipation VI = GND to VCC capacitance CPD 25 °C Conditions Max Min Max [1] [2] [3] tpd is the same as tPLH and tPHL. [2] Typical values are measured at VCC = 5.0 V. [3] CPD is used to determine the dynamic power dissipation PD (µW). PD = CPD × VCC2 × fi + ∑(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V. XC7SET14_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 31 August 2009 5 of 14 XC7SET14 NXP Semiconductors Inverting Schmitt trigger 13. Waveforms VM A input tPHL tPLH VM Y output mna033 Measurement points are given in Table 10. Fig 5. The input (A) to output (Y) propagation delays Table 10. Measurement points Type number Input XC7SET14 Output VI VM VM GND to 3.0 V 1.5 V 0.5 × VCC VCC PULSE GENERATOR VI VO DUT CL RT mna101 Test data is given in Table 11. Definitions for test circuit: CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to output impedance Zo of the pulse generator. Fig 6. Load circuitry for switching times Table 11. Test data Type XC7SET14 Input Load VI tr, tf CL 3.0 V ≤ 3.0 ns 15 pF, 50 pF XC7SET14_1 Product data sheet Test tPLH, tPHL © NXP B.V. 2009. All rights reserved. Rev. 01 — 31 August 2009 6 of 14 XC7SET14 NXP Semiconductors Inverting Schmitt trigger 13.1 Transfer characteristic waveforms VO VI VT+ VH VT− VH VT− VO VI VT+ mna027 mna026 Fig 7. Transfer characteristic Fig 8. mna404 5 ICC (mA) The definitions of VT+, VT− and VH mna405 8 ICC (mA) 4 6 3 4 2 2 1 0 0 0 Fig 9. 1 2 3 4 V (V) 5 I Typical characteristics; VCC = 4.5 V 0 4 VI (V) 6 Fig 10. Typical transfer characteristics; VCC = 5.5 V XC7SET14_1 Product data sheet 2 © NXP B.V. 2009. All rights reserved. Rev. 01 — 31 August 2009 7 of 14 XC7SET14 NXP Semiconductors Inverting Schmitt trigger 14. Application information The slow input rise and fall times cause additional power dissipation, which can be calculated using the following formula: Padd = fi × (tr × ∆ICC(AV) + tf × ∆ICC(AV)) × VCC where: Padd = additional power dissipation (µW); fi = input frequency (MHz); tr = input rise time (ns); 10 % to 90 %; tf = input fall time (ns); 90 % to 10 %; ∆ICC(AV) = average additional supply current (µA). Average additional ICC differs with positive or negative input transitions, as shown in Figure 11. For XC7SET14 used in relaxation oscillator circuit, see Figure 12. Note to the application information: 1. All values given are typical unless otherwise specified. mna058 200 ∆ICC(AV) (µA) 150 positive-going edge 100 negative-going edge 50 0 0 2 4 VCC (V) 6 Linear change of VI between 0.1VCC to 0.9VCC Fig 11. Average additional ICC XC7SET14_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 31 August 2009 8 of 14 XC7SET14 NXP Semiconductors Inverting Schmitt trigger R C mna035 1 1 f = --- ≈ ------------------------T 0.60 × RC Fig 12. Relaxation oscillator using the XC7SET14 XC7SET14_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 31 August 2009 9 of 14 XC7SET14 NXP Semiconductors Inverting Schmitt trigger 15. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm E D SOT353-1 A X c y HE v M A Z 5 4 A2 A (A3) A1 θ 1 Lp 3 L e w M bp detail X e1 0 1.5 3 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(1) e e1 HE L Lp v w y Z(1) θ mm 1.1 0.1 0 1.0 0.8 0.15 0.30 0.15 0.25 0.08 2.25 1.85 1.35 1.15 0.65 1.3 2.25 2.0 0.425 0.46 0.21 0.3 0.1 0.1 0.60 0.15 7° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT353-1 REFERENCES IEC JEDEC JEITA MO-203 SC-88A EUROPEAN PROJECTION ISSUE DATE 00-09-01 03-02-19 Fig 13. Package outline SOT353-1 (TSSOP5) XC7SET14_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 31 August 2009 10 of 14 XC7SET14 NXP Semiconductors Inverting Schmitt trigger Plastic surface-mounted package; 5 leads SOT753 D E B y A X HE 5 v M A 4 Q A A1 c 1 2 3 Lp detail X bp e w M B 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp c D E e HE Lp Q v w y mm 1.1 0.9 0.100 0.013 0.40 0.25 0.26 0.10 3.1 2.7 1.7 1.3 0.95 3.0 2.5 0.6 0.2 0.33 0.23 0.2 0.2 0.1 OUTLINE VERSION REFERENCES IEC JEDEC SOT753 JEITA SC-74A EUROPEAN PROJECTION ISSUE DATE 02-04-16 06-03-16 Fig 14. Package outline SOT753 (SC-74A) XC7SET14_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 31 August 2009 11 of 14 XC7SET14 NXP Semiconductors Inverting Schmitt trigger 16. Abbreviations Table 12. Abbreviations Acronym Description CDM Charged Device Model DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model 17. Revision history Table 13. Revision history Document ID Release date Data sheet status Change notice Supersedes XC7SET14_1 20090831 Product data sheet - - XC7SET14_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 31 August 2009 12 of 14 XC7SET14 NXP Semiconductors Inverting Schmitt trigger 18. Legal information 18.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 18.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 18.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 18.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 19. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] XC7SET14_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 31 August 2009 13 of 14 XC7SET14 NXP Semiconductors Inverting Schmitt trigger 20. Contents 1 2 3 4 5 6 7 7.1 7.2 8 9 10 11 11.1 12 13 13.1 14 15 16 17 18 18.1 18.2 18.3 18.4 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Recommended operating conditions. . . . . . . . 3 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4 Transfer characteristics . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Transfer characteristic waveforms. . . . . . . . . . . 7 Application information. . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Contact information. . . . . . . . . . . . . . . . . . . . . 13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 31 August 2009 Document identifier: XC7SET14_1