PHILIPS XC7SET14

XC7SET14
Inverting Schmitt trigger
Rev. 01 — 31 August 2009
Product data sheet
1. General description
XC7SET14 is a high-speed Si-gate CMOS device. It provides an inverting buffer function
with Schmitt trigger action. This device is capable of transforming slowly changing input
signals into sharply defined, jitter-free output signals.
2. Features
n Symmetrical output impedance
n High noise immunity
n ESD protection:
u HBM JESD22-A114E: exceeds 2000 V
u MM JESD22-A115-A: exceeds 200 V
u CDM JESD22-C101C: exceeds 1000 V
n Low power dissipation
n Balanced propagation delays
n SOT353-1 and SOT753 package options
n Specified from −40 °C to +125 °C
3. Applications
n Wave and pulse shapers
n Astable multivibrators
n Monostable multivibrators
4. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range Name
Description
Version
XC7SET14GW
−40 °C to +125 °C
TSSOP5
plastic thin shrink small outline package; 5 leads;
body width 1.25 mm
SOT353-1
XC7SET14GV
−40 °C to +125 °C
SC-74A
plastic surface-mounted package; 5 leads
SOT753
XC7SET14
NXP Semiconductors
Inverting Schmitt trigger
5. Marking
Table 2.
Marking codes
Type number
Marking code[1]
XC7SET14GW
gF
XC7SET14GV
g14
[1]
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
6. Functional diagram
2
A
Y
4
2
4
Y
mna024
mna023
Fig 1. Logic symbol
A
mna025
Fig 2. IEC logic symbol
Fig 3. Logic diagram
7. Pinning information
7.1 Pinning
XC7SET14
n.c.
1
A
2
GND
3
5
VCC
4
Y
001aak132
Fig 4. Pin configuration SOT353-1 and SOT753
7.2 Pin description
Table 3.
Pin description
Symbol
Pin
Description
n.c.
1
not connected
A
2
data input
GND
3
ground (0 V)
Y
4
data output
VCC
5
supply voltage
XC7SET14_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 31 August 2009
2 of 14
XC7SET14
NXP Semiconductors
Inverting Schmitt trigger
8. Functional description
Table 4.
Function table
H = HIGH voltage level; L = LOW voltage level
Input
Output
A
Y
L
H
H
L
9. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VCC
supply voltage
VI
input voltage
IIK
input clamping current
VI < −0.5 V
IOK
output clamping current
VO < −0.5 V or VO > VCC + 0.5 V
IO
output current
−0.5 V < VO < VCC + 0.5 V
[1]
Min
Max
Unit
−0.5
+7.0
V
−0.5
+7.0
V
−20
-
mA
-
±20
mA
-
±25
mA
ICC
supply current
-
75
mA
IGND
ground current
−75
-
mA
Tstg
storage temperature
−65
+150
°C
-
250
mW
total power dissipation
Ptot
Tamb = −40 °C to +125 °C
[2]
[1]
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2]
For both TSSOP5 and SC-74A packages: above 87.5 °C the value of Ptot derates linearly with 4.0 mW/K.
10. Recommended operating conditions
Table 6.
Recommended operating conditions
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
Min
Typ
4.5
Max
VCC
supply voltage
VI
input voltage
0
VO
output voltage
0
Tamb
ambient temperature
−40
+25
XC7SET14_1
Product data sheet
5.0
Unit
5.5
V
-
5.5
V
-
VCC
V
+125
°C
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 31 August 2009
3 of 14
XC7SET14
NXP Semiconductors
Inverting Schmitt trigger
11. Static characteristics
Table 7.
Static characteristics
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
VOH
25 °C
Conditions
HIGH-level
VI = VT+ or VT−; VCC = 4.5 V
output voltage
IO = −50 µA
IO = −8.0 mA
VOL
LOW-level
VI = VT+ or VT−; VCC = 4.5 V
output voltage
IO = 50 µA
IO = 8.0 mA
VI = 5.5 V or GND;
VCC = 0 V to 5.5 V
−40 °C to +85 °C −40 °C to +125 °C Unit
Min
Typ
Max
Min
Max
Min
Max
4.4
4.5
-
4.4
-
4.4
-
V
3.94
-
-
3.8
-
3.70
-
V
-
0
0.1
-
0.1
-
0.1
V
-
-
0.36
-
0.44
-
0.55
V
-
-
0.1
-
1.0
-
2.0
µA
II
input leakage
current
ICC
supply current VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
1.0
-
10
-
40
µA
∆ICC
additional
per input pin; VI = 3.4 V;
supply current other inputs at VCC or GND;
IO = 0 A; VCC = 5.5 V
-
-
1.35
-
1.5
-
1.5
mA
CI
input
capacitance
-
1.5
10
-
10
-
10
pF
XC7SET14_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 31 August 2009
4 of 14
XC7SET14
NXP Semiconductors
Inverting Schmitt trigger
11.1 Transfer characteristics
Table 8.
Transfer characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V). See Figure 7 and Figure 8.
Symbol Parameter
positive-going
threshold
voltage
VT+
VT−
negative-going
threshold
voltage
VH
hysteresis
voltage
25 °C
Conditions
−40 °C to +85 °C −40 °C to +125 °C Unit
Min
Typ
Max
Min
Max
Min
Max
VCC = 4.5 V
-
-
2.0
-
2.0
-
2.0
V
VCC = 5.5 V
-
-
2.0
-
2.0
-
2.0
V
VCC = 4.5 V
0.5
-
-
0.5
-
0.5
-
V
VCC = 5.5 V
0.6
-
-
0.6
-
0.6
-
V
VCC = 4.5 V
0.4
-
1.4
0.4
1.4
0.35
1.4
V
VCC = 5.5 V
0.4
-
1.6
0.4
1.6
0.35
1.6
V
12. Dynamic characteristics
Table 9.
Dynamic characteristics
GND = 0 V. For waveform see Figure 5. For test circuit see Figure 6.
Symbol Parameter
propagation
delay
tpd
[1]
−40 °C to +85 °C −40 °C to +125 °C Unit
Min
Typ
Max
Min
CL = 15 pF
-
4.1
7.0
1.0
8.0
1.0
9.0
ns
CL = 50 pF
-
5.9
8.5
1.0
10.0
1.0
11.0
ns
-
13
-
-
-
-
-
pF
A to Y;
VCC = 4.5 V to 5.5 V
power
per buffer;
dissipation
VI = GND to VCC
capacitance
CPD
25 °C
Conditions
Max
Min
Max
[1]
[2]
[3]
tpd is the same as tPLH and tPHL.
[2]
Typical values are measured at VCC = 5.0 V.
[3]
CPD is used to determine the dynamic power dissipation PD (µW).
PD = CPD × VCC2 × fi + ∑(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V.
XC7SET14_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 31 August 2009
5 of 14
XC7SET14
NXP Semiconductors
Inverting Schmitt trigger
13. Waveforms
VM
A input
tPHL
tPLH
VM
Y output
mna033
Measurement points are given in Table 10.
Fig 5. The input (A) to output (Y) propagation delays
Table 10.
Measurement points
Type number
Input
XC7SET14
Output
VI
VM
VM
GND to 3.0 V
1.5 V
0.5 × VCC
VCC
PULSE
GENERATOR
VI
VO
DUT
CL
RT
mna101
Test data is given in Table 11.
Definitions for test circuit:
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
Fig 6. Load circuitry for switching times
Table 11.
Test data
Type
XC7SET14
Input
Load
VI
tr, tf
CL
3.0 V
≤ 3.0 ns
15 pF, 50 pF
XC7SET14_1
Product data sheet
Test
tPLH, tPHL
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 31 August 2009
6 of 14
XC7SET14
NXP Semiconductors
Inverting Schmitt trigger
13.1 Transfer characteristic waveforms
VO
VI
VT+
VH
VT−
VH
VT−
VO
VI
VT+
mna027
mna026
Fig 7. Transfer characteristic
Fig 8.
mna404
5
ICC
(mA)
The definitions of VT+, VT− and VH
mna405
8
ICC
(mA)
4
6
3
4
2
2
1
0
0
0
Fig 9.
1
2
3
4 V (V) 5
I
Typical characteristics; VCC = 4.5 V
0
4
VI (V)
6
Fig 10. Typical transfer characteristics; VCC = 5.5 V
XC7SET14_1
Product data sheet
2
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 31 August 2009
7 of 14
XC7SET14
NXP Semiconductors
Inverting Schmitt trigger
14. Application information
The slow input rise and fall times cause additional power dissipation, which can be
calculated using the following formula:
Padd = fi × (tr × ∆ICC(AV) + tf × ∆ICC(AV)) × VCC where:
Padd = additional power dissipation (µW);
fi = input frequency (MHz);
tr = input rise time (ns); 10 % to 90 %;
tf = input fall time (ns); 90 % to 10 %;
∆ICC(AV) = average additional supply current (µA).
Average additional ICC differs with positive or negative input transitions, as shown in
Figure 11.
For XC7SET14 used in relaxation oscillator circuit, see Figure 12.
Note to the application information:
1. All values given are typical unless otherwise specified.
mna058
200
∆ICC(AV)
(µA)
150
positive-going
edge
100
negative-going
edge
50
0
0
2
4
VCC (V)
6
Linear change of VI between 0.1VCC to 0.9VCC
Fig 11. Average additional ICC
XC7SET14_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 31 August 2009
8 of 14
XC7SET14
NXP Semiconductors
Inverting Schmitt trigger
R
C
mna035
1
1
f = --- ≈ ------------------------T 0.60 × RC
Fig 12. Relaxation oscillator using the XC7SET14
XC7SET14_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 31 August 2009
9 of 14
XC7SET14
NXP Semiconductors
Inverting Schmitt trigger
15. Package outline
TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm
E
D
SOT353-1
A
X
c
y
HE
v M A
Z
5
4
A2
A
(A3)
A1
θ
1
Lp
3
L
e
w M
bp
detail X
e1
0
1.5
3 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1)
E(1)
e
e1
HE
L
Lp
v
w
y
Z(1)
θ
mm
1.1
0.1
0
1.0
0.8
0.15
0.30
0.15
0.25
0.08
2.25
1.85
1.35
1.15
0.65
1.3
2.25
2.0
0.425
0.46
0.21
0.3
0.1
0.1
0.60
0.15
7°
0°
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
SOT353-1
REFERENCES
IEC
JEDEC
JEITA
MO-203
SC-88A
EUROPEAN
PROJECTION
ISSUE DATE
00-09-01
03-02-19
Fig 13. Package outline SOT353-1 (TSSOP5)
XC7SET14_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 31 August 2009
10 of 14
XC7SET14
NXP Semiconductors
Inverting Schmitt trigger
Plastic surface-mounted package; 5 leads
SOT753
D
E
B
y
A
X
HE
5
v M A
4
Q
A
A1
c
1
2
3
Lp
detail X
bp
e
w M B
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
bp
c
D
E
e
HE
Lp
Q
v
w
y
mm
1.1
0.9
0.100
0.013
0.40
0.25
0.26
0.10
3.1
2.7
1.7
1.3
0.95
3.0
2.5
0.6
0.2
0.33
0.23
0.2
0.2
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
SOT753
JEITA
SC-74A
EUROPEAN
PROJECTION
ISSUE DATE
02-04-16
06-03-16
Fig 14. Package outline SOT753 (SC-74A)
XC7SET14_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 31 August 2009
11 of 14
XC7SET14
NXP Semiconductors
Inverting Schmitt trigger
16. Abbreviations
Table 12.
Abbreviations
Acronym
Description
CDM
Charged Device Model
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
17. Revision history
Table 13.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
XC7SET14_1
20090831
Product data sheet
-
-
XC7SET14_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 31 August 2009
12 of 14
XC7SET14
NXP Semiconductors
Inverting Schmitt trigger
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
18.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
XC7SET14_1
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 01 — 31 August 2009
13 of 14
XC7SET14
NXP Semiconductors
Inverting Schmitt trigger
20. Contents
1
2
3
4
5
6
7
7.1
7.2
8
9
10
11
11.1
12
13
13.1
14
15
16
17
18
18.1
18.2
18.3
18.4
19
20
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Recommended operating conditions. . . . . . . . 3
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
Transfer characteristics . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 5
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Transfer characteristic waveforms. . . . . . . . . . . 7
Application information. . . . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Contact information. . . . . . . . . . . . . . . . . . . . . 13
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 31 August 2009
Document identifier: XC7SET14_1