REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device types 03 and 04. Technical and editorial changes throughout. 96-02-05 M. A. FRYE B Drawing updated to reflect current requirements. -ro 01-01-12 R. MONNIN C Changes to IIB and IIO in table I. -lgt 01-02-26 R. MONNIN D Drawing updated to reflect current requirements. -rrp 07-05-02 R. M. HEBER E Update drawing to current MIL-PRF-38535 requirements. Removed class M references. -rrp 14-01-22 C. SAFFLE REV SHEET REV SHEET REV STATUS REV E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY RICK OFFICER STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http://www.landandmaritime.dla.mil CHECKED BY RAJESH PITHADIA APPROVED BY THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A MICHAEL FRYE DRAWING APPROVAL DATE 95-07-10 REVISION LEVEL E MICROCIRCUIT, LINEAR, DUAL/QUAD, RAIL-TORAIL, LOW POWER, OPERATIONAL AMPLIFIER, MONOLITHIC SILICON SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 5962-95666 1 OF 11 5962-E104-14 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 95666 Federal stock class designator \ RHA designator (see 1.2.1) 01 Q C A Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 TLV2252M Dual, rail-to-rail, low power, operational amplifiers 02 03 TLV2254M TLV2252AM 04 TLV2254AM Quad, rail-to-rail, low power, operational amplifiers Dual, rail-to-rail, low power, operational amplifiers with enhanced VIO Quad, rail-to-rail, low power, operational amplifiers with enhanced VIO 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter C D H P 2 Descriptive designator GDIP1-T14 or CDIP2-T14 GDFP1-F14 or CDFP2-F14 GDFP1-F10 or CDFP2-F10 GDIP1-T8 or CDIP2-T8 CQCC1-N20 Terminals 14 14 10 8 20 Package style Dual-in-line Flat pack Flat pack Dual-in-line Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95666 A REVISION LEVEL E SHEET 2 1.3 Absolute maximum ratings. 1/ Supply voltage range (VDD) ........................................................................ +8.0 V dc 2/ Differential input voltage (VID) ..................................................................... ±VDD 3/ Input voltage range (VIN) ............................................................................. -VDD – 0.3 V to +VDD Input current, each input (IIN) ...................................................................... +5.0 mA to –5.0 mA Output current (IOUT) .................................................................................. +50.0 mA to –50.0 mA Total current into +VDD ................................................................................ +50.0 mA to –50.0 mA Total current out of –VDD ............................................................................ Duration of short-circuit current at or below +25°C ...................................... Maximum power dissipation (PD): 5/ Case C and 2 ........................................................................................... Case D and H ........................................................................................... Case P ..................................................................................................... Storage temperature range (TSTG) ............................................................. Lead temperature (soldering 10 seconds) ................................................... Maximum junction temperature (TJ) ............................................................ +50.0 mA to –50.0 mA Unlimited 4/ 1375 mW 700 mW 1050 mW -65°C to +150°C +260°C +150°C Thermal resistance, junction-to-case (θJC) .................................................. See MIL-STD-1835 1.4 Recommended operating conditions. Supply voltage (±VDD) ................................................................................. 2.7 V dc to 8.0 V dc Input voltage range (VIN) ............................................................................. -VDD to +VDD – 1.3 V Common-mode input voltage (VIC) .............................................................. -VDD to +VDD – 1.3 V Ambient operating temperature (TA) ........................................................... -55°C to +125°C 1/ 2/ 3/ 4/ 5/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. All voltage values, except differential voltages, are with respect to –VDD. Differential voltages are at the noninverting input with respect to the inverting input. Excessive current flows if the input is brought below –VDD – 0.3 V. The output may be shorted to either supply. Temperature and/or supply voltages must be limited to ensure that the maximum dissipation rating is not exceeded. Above TA = +25°C, derate by the following factors; cases C and 2 at 11.0 mW/°C, case D and H at 5.5 mW/°C, and case P at 8.4 mW/°C. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95666 A REVISION LEVEL E SHEET 3 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 as specified herein, or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95666 A REVISION LEVEL E SHEET 4 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55°C ≤ TA ≤ +125°C unless otherwise specified VIO VDD = ±1.5 V, VIC = 0 V, Group A subgroups Device type Limits 1/ 1 01,02 Max 1500 03,04 850 01,02 1750 03,04 1000 01,02 1500 03,04 850 01,02 1750 03,04 1000 All 1000 Min Input offset voltage RS = 50 Ω, VOUT = 0 V 2,3 1 VDD = ±2.5 V, VIC = 0 V, RS = 50 Ω, VOUT = 0 V 2,3 Input offset current IIO 2 VDD = ±1.5 V, VIC = 0 V, Unit µV pA RS = 50 Ω, VOUT = 0 V, TA = +125°C 1000 VDD = ±2.5 V, VIC = 0 V, RS = 50 Ω, VOUT = 0 V, TA = +125°C Input bias current IIB 2 VDD = ±1.5 V, VIC = 0 V, All 1000 pA RS = 50 Ω, VOUT = 0 V, TA = +125°C 1000 VDD = ±2.5 V, VIC = 0 V, RS = 50 Ω, VOUT = 0 V, TA = +125°C Common-mode input voltage range VICR 1 VDD = 3 V, |VIO| ≤ 5 mV, RS = 50 Ω VDD = 5 V, |VIO| ≤ 5 mV, RS = 50 Ω All 0 to 2 2,3 0 to 1.7 1 0 to 4 2,3 0 to 3.5 V See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95666 A REVISION LEVEL E SHEET 5 TABLE I. Electrical performance characteristics – Continued. Test High level output voltage Symbol Conditions -55°C ≤ TA ≤ +125°C unless otherwise specified VOH VDD = 3 V, Group A subgroups Device type 1 All 2.8 VDD = 3 V, IOH = -150 µA 1 2.8 VDD = 5 V, 1 4.9 2,3 4.8 VDD = 5 V, IOH = -150 µA 1 4.8 VDD = 3 V, VIC = 1.5 V, 1 IOH = -75 µA VOL Min 2.9 2,3 IOH = -75 µA Low level output voltage Limits 1/ IOL = 500 µA VDD = 3 V, VIC = 1.5 V, All Unit Max V 150 2,3 165 1,2,3 300 mV IOL = 1 mA 150 VDD = 5 V, VIC = 2.5 V, IOUT = 1 mA 300 VDD = 5 V, VIC = 2.5 V, IOUT = 1 mA Large-signal differential voltage amplification AVD 1 VDD = 3 V, VIC = 1.5 V, 2/ VOUT = 1 V to 2 V, All 100 2,3 10 1 100 2,3 10 V/mV RL = 100 kΩ VDD = 5 V, VIC = 2.5 V, 2/ VOUT = 1 V to 4 V, RL = 100 kΩ See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95666 A REVISION LEVEL E SHEET 6 TABLE I. Electrical performance characteristics – Continued. Test Common-mode rejection ratio Symbol Conditions -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type CMRR VDD = 3 V, VOUT = 1.5 V, 1 All VIC = 0 V to 1.7 V, Limits 1/ Min 65 2,3 60 1,2,3 70 Unit Max dB RS = 50 Ω VDD = 5 V, VOUT = 2.5 V, VIC = 0 V to 2.7 V, RS = 50 Ω Supply voltage rejection ratio (∆VDD / ∆VIO) kSVR 1,2,3 VDD = 2.7 V to 8 V, All 80 dB VIC = VDD / 2, no load 80 VDD = 4.4 V to 8 V, VIC = VDD / 2, no load Supply current (both channels) Slew rate at unity gain IDD SR 1,2,3 01,03 125 no load 02,04 250 VDD = 5 V, VOUT = 2.5 V, 01,03 125 no load 02,04 250 VDD = 3 V, VOUT = 1.5 V, 4 VDD = 3 V, RL = 100 kΩ, 2/ VOUT = 0.8 V to 1.4 V, All 0.07 5,6 0.05 4 0.07 5,6 0.05 µA V/µs CL = 100 pF VDD = 5 V, RL = 100 kΩ, 3/ VOUT = 1.25 V to 2.75 V, CL = 100 pF 1/ The algebraic convention, whereby the most negative value is a minimum and the most positive is a maximum, is used in this table. Negative current shall be defined as conventional current flow out of a device terminal. 2/ Referenced to 1.5 V. 3/ Referenced to 2.5 V. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95666 A REVISION LEVEL E SHEET 7 Device types 01,03 Case outlines H P 02,04 2 C and D 2 Terminal number 1 Terminal symbol NC OUTPUT 1 NC OUTPUT 1 NC 2 OUTPUT 1 -INPUT 1 OUTPUT 1 -INPUT 1 OUTPUT 1 3 -INPUT 1 +INPUT 1 NC +INPUT 1 -INPUT 1 4 +INPUT 1 -VDD / GND NC +VDD +INPUT 1 5 -VDD / GND +INPUT 2 -INPUT 1 +INPUT 2 NC 6 +INPUT 2 -INPUT 2 NC -INPUT 2 +VDD 7 -INPUT 2 OUTPUT 2 +INPUT 1 OUTPUT 2 NC 8 OUTPUT 2 +VDD NC OUTPUT 3 +INPUT 2 9 +VDD --- NC -INPUT 3 -INPUT 2 10 NC --- -VDD / GND +INPUT 3 OUTPUT 2 11 --- --- NC -VDD / GND NC 12 --- --- +INPUT 2 +INPUT 4 OUTPUT 3 13 --- --- NC -INPUT 4 -INPUT 3 14 --- --- NC OUTPUT 4 +INPUT 3 15 --- --- -INPUT 2 --- NC 16 --- --- NC --- -VDD / GND 17 --- --- OUTPUT 2 --- NC 18 --- --- NC --- +INPUT 4 19 --- --- NC --- -INPUT 4 20 --- --- +VDD --- OUTPUT 4 NC = No connection FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95666 A REVISION LEVEL E SHEET 8 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. 4.2.1 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections, and as specified herein. 4.4.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 7, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95666 A REVISION LEVEL E SHEET 9 TABLE II. Electrical test requirements. Test requirements Interim electrical parameters (see 4.2) Final electrical parameters (see 4.2) Group A test requirements (see 4.4) Group C end-point electrical parameters (see 4.4) Group D end-point electrical parameters (see 4.4) Group E end-point electrical parameters (see 4.4) Subgroups (in accordance with MIL-STD-883, method 5005, table I) Device class M ---- Subgroups (in accordance with MIL-PRF-38535, table III) Device class Q ---- Device class V ---- 1,2,3,4,5,6 1/ 1,2,3,4,5,6 1/ 1,2,3,4, 1/ 5,6 1,2,3,4,5,6 1,2,3,4,5,6 1,2,3,4,5,6 1 1 1 1 1 1 ---- ---- ---- 1/ PDA applies to subgroup 1. 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein. 4.4.2.1 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MILSTD-883. 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein. 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table II herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25°C ±5°C, after exposure, to the subgroups specified in table II herein. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95666 A REVISION LEVEL E SHEET 10 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor prepared specification or drawing. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires configuration control and which SMD's are applicable to that system. DLA Land and Maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DLA Land and Maritime-VA, telephone (614) 692-8108. 6.4 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0540. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in MIL-HDBK-103 and QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DLA Land and Maritime-VA and have agreed to this drawing. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-95666 A REVISION LEVEL E SHEET 11 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 14-01-22 Approved sources of supply for SMD 5962-95666 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DLA Land and Maritime-VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-9566601QHA 01295 TLV2252MUB 5962-9566601QPA 01295 TLV2252MJGB 5962-9566601Q2A 01295 TLV2252MFKB 5962-9566602QCA 01295 TLV2254MJB 5962-9566602QDA 01295 TLV2254MWB 5962-9566602Q2A 01295 TLV2254MFKB 5962-9566603QHA 01295 TLV2252AMUB 5962-9566603QPA 01295 TLV2252AMJGB 5962-9566603Q2A 01295 TLV2252AMFKB 5962-9566604QCA 01295 TLV2254AMJB 5962-9566604QDA 01295 TLV2254AMWB 5962-9566604Q2A 01295 TLV2254AMFKB 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 1 of 2 STANDARD MICROCIRCUIT DRAWING BULLETIN – CONTINUED. Vendor CAGE number Vendor name and address 01295 Texas Instruments, Inc. Semiconductor Group 8505 Forest Lane P.O. Box 660199 Dallas, TX 75243 Point of contact: U.S. Highway 75 South P.O. Box 84, M/S 853 Sherman, TX 75090-9493 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin. 2 of 2