INCH-POUND MIL-M-38510/101K 14 December 2005 SUPERSEDING MIL-M-38510/101J 07 February 2003 MILITARY SPECIFICATION MICROCIRCUITS, LINEAR, OPERATIONAL AMPLIFIER, MONOLITHIC SILICON This specification is approved for use by all Departments and Agencies of the Department of Defense. Inactive for new design after 13 July 1995. The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF-38535. 1. SCOPE 1.1 Scope. This specification covers the detail requirements for monolithic silicon, operational amplifiers. Two product assurance classes and a choice of case outlines and lead finish are provided for each type and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535, (see 6.4). 1.1.2 Part or identifying number (PIN). The PIN is in accordance with MIL-PRF-38535, and as specified herein. 1.2.1 Device types. The device types are as follows: Device type 01 02 03 04 05 06 07 08 Circuit Single operational amplifier - internally compensated Dual operational amplifier - internally compensated Single operational amplifier - externally compensated Single operational amplifier - externally compensated Dual operational amplifier - externally compensated 1/ Dual operational amplifier - externally compensated 1/ Single operational amplifier, high speed Dual operational amplifier - internally compensated 1.2.2 Device class. The device class is the product assurance level as defined in MIL-PRF-38535. ______ 1/ Device types 05 and 06 may be monolithic, or they may consist of two separate, independent die. Comments, suggestions, or questions on this document should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAS, 3990 East Broad St., Columbus, OH 43218-3990, or emailed to [email protected]. Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at http://assist.daps.dla.mil. AMSC N/A FSC 5962 MIL-M-38510/101K 1.2.3 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter A 2/ B 2/ C D E F G H I P Z 2 Descriptive designator Terminals GDFP5-F14 or CDFP6-F14 GDFP4-14 GDIP1-T14 or CDIP2-T14 GDFP1-F14 or CDFP2-F14 GDIP1-T16 or CDIP2-T16 GDFP2-F16 or CDFP3-F16 MACY1-X8 GDFP1-F10 or CDFP2-F10 MACY1-X10 GDIP1-T8 or CDIP2-T8 GDFP1-G10 CQCC1-N20 14 14 14 14 16 16 8 10 10 8 10 20 Package style Flat pack Flat pack Dual-in-line Flat pack Dual-in-line Flat pack Can Flat pack Can Dual-in-line Flat pack with gullwing leads Square leadless chip carrier 1.3 Absolute maximum ratings. Supply voltage range (VCC) ............................................................................ ±22 V dc 3/ Input voltage range ......................................................................................... ±20 V dc 4/ Differential input voltage range ....................................................................... ±30 V dc 5/ Input current range ......................................................................................... -0.1 mA to +10 mA Storage temperature range ............................................................................ -65°C to +150°C Output short-circuit duration ........................................................................... Unlimited 6/ Lead temperature (soldering, 60 seconds) ..................................................... +300°C Junction temperature (TJ) ............................................................................... +175°C 7/ 1.4 Recommended operating conditions. Supply voltage (VCC) ...................................................................................... ±5 V dc to ±20 V dc Ambient temperature range (TA) .................................................................... -55°C to +125°C ______ 2/ Inactive package case outline. 3/ Voltages in excess of these may be applied for short-term tests if voltage difference does not exceed 44 volts. 4/ For supply voltages less than ±20 V dc, the absolute maximum input voltage is equal to the supply voltage. 5/ For device types 04, 06, and 07 only, this rating is ±1.0 V unless resistances of 2 kΩ or greater are inserted in series with the inputs to limit current in the input shunt diodes to the maximum allowable value. 6/ Short circuit may be to ground or either supply. Rating applies to +125°C case temperature or +75°C ambient temperature. 7/ For short term test (in the specific burn-in and life test configuration when required and up to 168 hours maximum) TJ = +275°C. 2 MIL-M-38510/101K 1.5 Power and thermal characteristics. Case outlines Maximum Maximum allowable power dissipation Maximum θJC θJA 140°C/W A,B,D 350 mW at TA = +125°C 60°C/W C,E,P 400 mW at TA = +125°C 35°C/W 120°C/W G 330 mW at TA = +125°C 40°C/W 150°C/W I 350 mW at TA = +125°C 40°C/W 140°C/W H 330 mW at TA = +125°C 60°C/W 150°C/W F 400 mW at TA = +125°C 35°C/W 120°C/W Z 330 mW at TA = +125°C 21°C/W 225°C/W still air 142°C/W 500 LFPM 2 60°C/W 8/ at TA = +125°C 120°C/W 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they are listed. 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following specifications and standards form a part of this specification to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits (Microcircuits) Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard for Microelectronics. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Order of precedence. In the event of a conflict between the text of this specification and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. ______ 8/ PD = 102 mW for device type 01. PD = 75 mW for device type 03. PD = 149 mW for device type 04. 3 MIL-M-38510/101K 3. REQUIREMENTS 3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before contract award (see 4.3 and 6.3). 3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein. 3.3.1 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3.2 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available to the qualifying activity and the preparing activity (DSCC-VAS) upon request. 3.3.3 Case outlines. The case outlines shall be as specified in 1.2.3. 3.4 Lead material and finish. Lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6). 3.5 Electrical performance characteristics. The following electrical performance characteristics apply over the full operating ambient temperature range of -55°C to +125°C and for supply voltages ±5 V dc to ±20 V dc, unless otherwise specified (see table I). 3.5.1 Offset null circuits. Each amplifier having nulling inputs (device types 01, 02, 03, 05, and 07) shall be capable of being nulled 1 mV beyond the specified offset voltage limits for -55°C ≤ TA ≤ +125°C using the circuits of figure 2. 3.5.2 Frequency compensation. Device types 01, 02, 07, and 08 shall be free of oscillation when operated in a unity gain non-inverting mode with no external compensation and a source resistance of ≤ 10 kΩ, and when operated in any test condition specified herein. Device types 03, 04, 05, and 06 shall be free from oscillation when compensated with a 30 pF capacitor for all gain configurations or a 3 pF capacitor when used with a gain of 10. 3.6 Rebonding. Rebonding shall be in accordance with MIL-PRF-38535. 3.7 Electrical test requirements. Electrical test requirements for each device class shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table III. 3.8 Marking. Marking shall be in accordance with MIL-PRF-38535. 3.9 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group number 49 (see MIL-PRF-38535, appendix A). 4 MIL-M-38510/101K TABLE I. Electrical performance characteristics. 1/ Test Symbol Conditions -55°C ≤ TA ≤ +125°C see figure 3 Group A subgroups Device type unless otherwise specified Input offset voltage VIO 1 RS = 50 Ω 2/ 2,3 Input offset voltage temperature sensitivity 2 ∆VIO / ∆T 3 See footnotes at end of table. 5 Limits Unit Min Max 01,02, 08 -3 +3 03,05 -2 +2 04,06 -0.5 +0.5 07 -4 +4 01,02, 08 -4 +4 03,05 -3 +3 04,06 -1 +1 07 -6 +6 01,02, 08 -15 +15 03,05 -18 +18 04,06 -5 +5 07 -50 +50 01,02, 03,05 -15 +15 04,06 -5 +5 07 -50 +50 08 -20 20 mV µV/°C MIL-M-38510/101K TABLE I. Electrical performance characteristics – Continued. 1/ Test Conditions -55°C ≤ TA ≤ +125°C see figure 3 Symbol Group A subgroups Device type unless otherwise specified Input offset current Input offset current temperature sensitivity IIO 2/ Unit Min Max 01,02,08 -30 +30 03,05 -10 +10 04,06 -0.2 +0.2 07 -40 +40 2 01 -30 +30 2,3 02,08 -70 +70 03,05 -20 +20 04,06 -0.4 +0.4 07 -80 +80 3 01 -70 +70 2 01,02,08 -500 +500 03,05 -200 +200 04,06 -2.5 +2.5 07 -1000 +1000 01,02,08 -200 +200 03,05 -100 +100 04,06 -2.5 +2.5 07 -1000 +1000 1 ∆IIO / Limits ∆T 3 See footnotes at end of table. 6 nA * * pA/°C MIL-M-38510/101K TABLE I. Electrical performance characteristics – Continued. 1/ Test Conditions -55°C ≤ TA ≤ +125°C see figure 3 Symbol Group A subgroups Device type unless otherwise specified Input bias current +IIB 2/ 1,2 1 Min Max 01,02, 08 -0.1 +110 03,05 -0.1 +75 07 -0.1 +250 04,06 -0.1 +2.0 -1.0 +2.0 01,02, 08 -0.1 +265 03,05 -0.1 +100 04,06 -0.1 +3.0 07 -0.1 +400 01,02, 08 -0.1 +110 03,05 -0.1 +75 07 -0.1 +250 04,06 -0.1 +2.0 -1.0 +2.0 01,02, 08 -0.1 +265 03,05 -0.1 +100 04,06 -0.1 +3.0 07 -0.1 +400 2 3 1,2 -IIB 1 2 3 See footnotes at end of table. 7 Limits Unit nA MIL-M-38510/101K TABLE I. Electrical performance characteristics – Continued. 1/ Test Symbol Conditions -55°C ≤ TA ≤ +125°C see figure 3 Group A subgroups Device type unless otherwise specified Power supply rejection ratio +PSRR +VCC = 10 V, RS = 50 Ω, 1 -VCC = -20 V 2,3 -PSRR +VCC = 20 V, RS = 50 Ω, 1 -VCC = -10 V 2,3 Input voltage common mode rejection CMR ±VCC = 20 V, VIN = ±15 V, RS = 50 Ω See footnotes at end of table. 8 1,2,3 Limits Min Max 01,02, 03,05, 08 -50 +50 04,06 -16 +16 07 -100 +100 01,02, 03,05, 08 -100 +100 04,06 -16 +16 07 -150 +150 01,02, 03,05, 08 -50 +50 04,06 -16 +16 07 -100 +100 01,02, 03,05, 08 -100 +100 04,06 -16 +16 07 -150 +150 01,02, 03,05, 07,08 80 04,06 96 Unit µV/V dB MIL-M-38510/101K TABLE I. Electrical performance characteristics – Continued. 1/ Test Symbol Conditions -55°C ≤ TA ≤ +125°C see figure 3 Group A subgroups Device type unless otherwise specified Adjustment for input 3/ offset voltage Adjustment for input 3/ offset voltage Output short-circuit current (for positive VIO Min 1,2,3 ±VCC = 20 V ADJ(+) VIO 1,2,3 ±VCC = 20 V ADJ(-) IOS(+) ±VCC = 15 V, t ≤ 25 ms 4/ 1,2,3 output) Output short-circuit current (for negative IOS(-) ±VCC = 15 V, t ≤ 25 ms 4/ 1,2,3 output) 1,2 3 See footnotes at end of table. 9 Limits 01,02, 08 +5 03,05 +4 04,06 No external ADJ 07 +7 Unit Max mV 01,02, 08 -5 03,05 -4 04,06 No extern al ADJ 07 -7 mV 01,02, 03,05, 08 -60 mA 04 -20 * 06 -20 * 07 -65 01,02, 03,05, 08 +60 04 +20 * 06 +20 * 07 +65 +80 mA MIL-M-38510/101K TABLE I. Electrical performance characteristics – Continued. 1/ Test Symbol Conditions -55°C ≤ TA ≤ +125°C see figure 3 Group A subgroups Device type unless otherwise specified Supply current ICC ±VCC = ±15 V 5/ Min 1 2 3 Output voltage swing (maximum) VOP ±VCC = 20 V, RL = 10 kΩ ±VCC = 20 V, RL = 2 kΩ See footnotes at end of table. 10 Limits 4,5,6 Unit Max 01,02, 08 +3.8 03,05 +3 04,06 +0.6 07 +8 01,02, 08 +3.4 03,05 +2.5 04,06 +0.6 07 +7 01,02, 08 +4.2 03,05 +3.5 04,06 +0.8 07 +9 01-06, 08 ±16 07 ±17 01,02, 03,05, 08 ±15 04,06 Not specified 07 ±16 mA V MIL-M-38510/101K TABLE I. Electrical performance characteristics – Continued. 1/ Test Symbol Conditions -55°C ≤ TA ≤ +125°C see figure 3 Group A subgroups Device type unless otherwise specified Open loop voltage gain 6/ (single ended) AVS(±) Min 50 RL = 2 kΩ, 10 kΩ 01,02, 03,05, 07,08 VOUT = ±15 V 04,06 80 01,02, 03,05, 08 25 04,06 40 07 32 10 RL = 2 kΩ, 10 kΩ 01,02, 03,05, 07,08 VOUT = ±2 V 04,06 20 ±VCC = 20 V, 7/ 4 5,6 Open loop voltage gain 6/ (single ended) Transient response rise time Transient response overshoot Slew rate 9/ AVS TR(tr) TR(OS) SR(+) Limits ±VCC = 5 V, 7/ See figure 4 See figure 4 8/ 8/ VIN = ±5 V, AV = 1, see figure 4 See footnotes at end of table. 11 4,5,6 7,8A,8B 7,8A,8B 7,8B Max V/mV V/mV 01,02, 03,05, 08 +800 04,06 +1000 07 +40 01,02, 03,05, 08 +25 04,06, 07 +50 01,02, 08 +0.3 03,05 10/ 04,06 +0.05 07 +40 Unit ns % V/µs MIL-M-38510/101K TABLE I. Electrical performance characteristics – Continued. 1/ Test Symbol Conditions -55°C ≤ TA ≤ +125°C see figure 3 Group A subgroups Device type unless otherwise specified Slew rate 9/ SR(+) VIN = ±5 V, AV = 1, Min 8A see figure 4 Slew rate 9/ SR(-) VIN = ±5 V, AV = 1, 7,8B see figure 4 8A Settling time 11/ tS(+) See figure 4 12 tS(-) Channel separation CS ±VCC = ±20 V, see figure 5, TA = +25°C See footnotes at end of table. 12 Limits 01,02, 03,05, 08 +0.3 04,06 +0.05 07 +30 01,02, 08 +0.3 03,05 10/ 04,06 +0.05 07 +40 01,02, 03,05, 08 +0.3 04,06 +0.05 07 +30 07 Max V/µs V/µs 800 13A,13B 1200 12 800 13A,13B 1200 7 02,05, 06,08 80 Unit ns dB MIL-M-38510/101K TABLE I. Electrical performance characteristics – Continued. 1/ Test Symbol Conditions -55°C ≤ TA ≤ +125°C see figure 3 Group A subgroups Device type unless otherwise specified Noise (referred to input) broadband Noise (referred to input) popcorn NI(BB) ±VCC = 20 V, TA = +25°C, Min 7 bandwidth = 5 kHz NI(PC) ±VCC = 20 V, TA = +25°C, Limits 7 bandwidth = 5 kHz Unit Max 01-06, 08 15 07 25 01,02, 04,06, 08 40 03,05, 07 80 µVrms µVpk 1/ For devices marked with the “Q” certification mark, the parameters listed herein maybe guaranteed if not tested to the limits specified herein in accordance with the manufacturer’s QM plan. 2/ Tests at common mode VCM = 0 V, VCM = -15 V, and VCM = +15 V. 3/ VIO(ADJ) is not performed on device type 02, case I only, or on device type 08 for either case G or P. 4/ Continuous short circuit limits will be considerably less than the indicated test limits. Continuous IOS at TA ≤ +75°C will cause TJ to exceed the maximum of +175°C. For dual devices, IOS is measured one channel at a time. 5/ Value shown is for single devices (01, 03, 04) only. For dual devices (02, 05, 06, and 08) this limit is for single devices. 6/ Note that gain is not specified at VIO(ADJ) extremes. Some gain reduction is usually seen at VIO(ADJ) extremes. For closed loop applications (closed loop gain less than 1,000), the open loop tests (AVS) prescribed herein should guarantee a positive, reasonably linear, transfer characteristic. They do not, however, guarantee that the open loop gain is linear, or even positive, over the operating range. If either of these requirements exist (positive open loop gain or open loop gain linearity), they should be specified in the individual procurement document as additional requirements. 7/ RL = 10 kΩ only for device types 04 and 06. 8/ For transient response tests, CF = 10 pF for device types 01, 02, 03, 04, 05, 06, and 08. Device type 07, CF = 47 pF. CF includes the effects of stray capacitance. 9/ Minimum limit for device 08 is 0.4 V/µs at all temperatures. 10/ Minimum limits for device types 03 and 05 are 0.2 V/µs at -55°C and 0.3 V/µs at both +25°C and +125°C. 11/ Settling time is waived for method 5004, MIL-STD-883 except for device type 07. 13 MIL-M-38510/101K TABLE II. Electrical test requirements. MIL-PRF-38535 test requirements Subgroups (see table III) Class S devices Class B devices Interim electrical parameters 1 1 Final electrical test parameters 1/ 1,2,3,4 1,2,3,4 1,2,3,4,5,6, 7,8A,8B,12, 13A,13B 1,2,3, and table IV delta limits Group A test requirements Group C end point electrical parameters 1,2,3,4,5,6,7 1 and table IV delta limits Additional electrical subgroups For group C periodic inspections Not applicable 8A,8B,12, 13A,13B Group D end point electrical parameters 1,2,3 1 1/ PDA applies to subgroup 1. 4. VERIFICATION. 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer’s Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as function as described herein. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and quality conformance inspection. The following additional criteria shall apply: a. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document control by the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II, except interim electrical parameters test prior to burn-in is optional at the discretion of the manufacturer. c. Additional screening for space level product shall be as specified in MIL-PRF-38535. 14 MIL-M-38510/101K Device type Case outlines 01 A,B,C,D G and P H 2 Terminal number 1 Terminal symbol NC OFFSET NULL NC NC 2 NC -INPUT OFFSET NULL 3 OFFSET NULL +INPUT -INPUT OFFSET NULL (-) NC 4 -INPUT -VCC +INPUT NC 5 +INPUT OFFSET NULL -VCC -INPUT 6 -VCC OUTPUT OFFSET NULL NC 7 NC +VCC OUTPUT +INPUT 8 NC NC +VCC NC 9 OFFSET NULL --- NC NC 10 OUTPUT --- NC -VCC 11 +VCC --- --- NC 12 NC --- --- 13 NC --- --- OFFSET NULL (+) NC 14 NC --- --- NC 15 --- --- --- OUTPUT 16 --- --- --- NC 17 --- --- --- +VCC 18 --- --- --- NC 19 --- --- --- NC 20 --- --- --- NC NC = No connection FIGURE 1. Terminal connections. 15 MIL-M-38510/101K Device type 02 Case outlines A,B,C,D 03 I C Terminal number 1 -INPUT A OUTPUT A NC 2 +INPUT A NC 3 OFFSET NULL A +VCC (A) SEE NOTE 2 -INPUT A 4 -VCC 5 G and P H OFFSET NULL / COMP -INPUT NC Terminal symbol OFFSET NULL / COMP +INPUT -INPUT +INPUT A OFFSET NULL / COMP -INPUT -VCC +INPUT OFFSET NULL B -VCC +INPUT OFFSET NULL -VCC 6 +INPUT B +INPUT B -VCC OUTPUT OFFSET NULL 7 -INPUT B -INPUT B NC +VCC OUTPUT 8 OFFSET NULL B NC COMP +VCC 9 OFFSET NULL --- COMP 10 +VCC (B) SEE NOTE 2 OUTPUT B +VCC (B) SEE NOTE 2 OUTPUT B NC OUTPUT --- NC 11 NC --- +VCC --- --- 12 OUTPUT A --- COMP --- --- 13 --- NC --- --- 14 +VCC (A) SEE NOTE 2 OFFSET NULL A --- NC --- --- 15 --- --- --- --- --- 16 --- --- --- --- --- 17 --- --- --- --- --- 18 --- --- --- --- --- 19 --- --- --- --- --- 20 --- --- --- --- --- NC = No connection FIGURE 1. Terminal connections – Continued. 16 MIL-M-38510/101K Device type 03 Case outlines 2 Terminal number 1 04 C G and P H 2 Terminal symbol NC NC INPUT COMP NC NC INPUT COMP -INPUT GUARD INPUT COMP 3 OFFSET NULL (-) NC GUARD +INPUT -INPUT NC 4 NC -INPUT -VCC +INPUT NC 5 -INPUT +INPUT NC GUARD -INPUT 6 NC GUARD OUTPUT -VCC NC 7 +INPUT -VCC +VCC OUTPUT +INPUT 8 NC NC +VCC NC 9 NC NC OUTPUT COMP --- NC 10 -VCC OUTPUT --- OUTPUT COMP INPUT COMP -VCC 11 NC +VCC --- --- NC 12 OUTPUT COMP NC --- --- NC 13 OFFSET NULL (+) NC --- --- NC 14 NC NC --- --- NC 15 OUTPUT --- --- --- OUTPUT 16 NC --- --- --- NC 17 +VCC --- --- --- +VCC 18 NC --- --- --- NC 19 NC --- --- --- NC 20 FREQ COMP --- --- --- OUTPUT COMP 2 NC = No connection FIGURE 1. Terminal connections – Continued. 17 MIL-M-38510/101K Device type 05 06 Case outlines E and F E and F Terminal number 1 07 C G and P COMP A / OFFSET NULL -INPUT Terminal symbol +VCC (A) SEE NOTE 5 +VCC (A) SEE NOTE 5 NC 2 COMP A NC 3 COMP A / OFFSET NULL -INPUT +INPUT 4 OFFSET NULL / COMP -INPUT A OUTPUT COMP A INPUT COMP A -INPUT A 5 +INPUT A +INPUT A +INPUT 6 -VCC -VCC -VCC COMP B / OFFSET NULL OUTPUT 7 OFFSET NULL B OUTPUT B NC NC +VCC OUTPUT B NC COMP C COMP B / OFFSET NULL --- OUTPUT --- +VCC --- 12 OFFSET NULL / COMP B -INPUT B +VCC (B) SEE NOTE 5 OUTPUT COMP B INPUT COMP B -INPUT B COMP C --- 13 +INPUT B +INPUT B NC --- 14 NC NC --- 15 OFFSET NULL A NC NC --- --- 16 OUTPUT A OUTPUT A --- --- 8 9 10 11 +VCC (B) SEE NOTE 5 COMP B NC = No connection FIGURE 1. Terminal connections – Continued. 18 -VCC MIL-M-38510/101K Device types 07 08 Case outlines H G and P Terminal number 1 Terminal symbol NC OUTPUT A -INPUT A 3 COMP A / OFFSET NULL -INPUT +INPUT A 4 +INPUT -VCC 5 -VCC +INPUT B 6 -INPUT B 7 COMP B / OFFSET NULL OUTPUT OUTPUT B 8 +VCC +VCC 9 COMP C --- 10 NC --- 2 NC = No connection NOTES: 1. -VCC shall be connected to case of metal packages. 2. 3. 4. 5. For device type 02 only, +VCC (A) and +VCC (B) shall be internally connected. +Input is non-inverting input. -Input is inverting input. For device types 05 and 06 only, +VCC (A) and +VCC (B) shall not be internally connected. (External connection to the same supply voltage recommended). FIGURE 1. Terminal connections – Continued. 19 MIL-M-38510/101K FIGURE 2. Offset null circuits. 20 MIL-M-38510/101K Device type 07 FIGURE 2. Offset null circuits - Continued. 21 MIL-M-38510/101K FIGURE 3. Test circuit for static and dynamic tests. 22 23 -5 -35 -20 -5 -5 -35 -20 -5 -5 -35 -20 -5 35 5 20 5 35 5 20 5 35 5 20 5 0 0 0 0 0 0 -20 -20 -20 -20 -20 -20 20 20 20 FIGURE 3. Test circuit for static and dynamic tests- Continued. 20 20 20 VIO 15/ ADJ(-) VIO 15/ ADJ(+) VIO 6/ ADJ(-) VIO 6/ ADJ(+) VIO 7/ ADJ(-) VIO 7/ ADJ(+) -15 +15 -5 -35 35 5 CMR -5 5 -15 15 0 0 -15 15 0 0 -15 15 0 0 -15 15 0 0 V 20 -10 -20 -5 -35 -20 -5 35 5 20 5 10 -VCC +VCC Apply (in volts) -PSRR +PSRR -IIB +IIB IIO VIO Parameter 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 S1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 2 2 2 2 2 2 2 1 1 1 1 S2 1 1 1 1 1 1 1 1 1 1 2 2 2 2 1 1 1 1 2 2 2 2 1 1 1 1 S3 7 6 5 4 3 2 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 S4 Switch position 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 S5 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 S6 E35 E34 E23 E22 E21 E20 E1 1/ E2 1/ E19 1/ E18 1/ E13 E14 E15 E16 E9 E10 E11 E12 E5 E6 E7 E8 E1 E2 E3 E4 Value V V V V V V V V V V V V V V Units Measure 2 2 VIO ADJ (-) = (E3 - E35) VIO ADJ (+) = (E3 - E34) VIO ADJ (-) = (E3 - E23) VIO ADJ (+) = (E3 - E22) VIO ADJ (-) = (E3 - E21) VIO ADJ (+) = (E3 - E20) 3 CMR = 20 LOG |(30 X 10 ) / (E1 - E2)| -PSRR = (E3 - E19) X 10 +PSRR = (E3 - E18) X 10 6 6 -IIB = ((E13 - E1) X 10 ) / RS, ((E14 - E2) X 10 ) / RS, 6 6 ((E15 - E31) X 10 ) / RS, ((E16 - E4) X 10 ) / RS 6 6 +IIB = ((E1 - E9) X 10 ) / RS, ((E2 – E10) X 10 ) / RS, 6 6 ((E3 - E11) X 10 ) / RS, ((E4 - E12) X 10 ) / RS 6 6 IIO = ((E1 - E5) X 10 ) / RS, ((E2 - E6) X 10 ) / RS, 6 6 ((E3 - E7) X 10 ) / RS, ((E4 - E8) X 10 ) / RS VIO = E1, E2, E3, E4 Equation Measured parameter 20/ 13/ 13/ 13/ mV mV mV mV mV mV dB µV/V µV/V nA nA nA mV Units MIL-M-38510/101K 24 FIGURE 3. Test circuit for static and dynamic tests- Continued. CMR 3/ RL = 10 kΩ AVS 16/ RL = 10 kΩ -AVS 16/ RL = 10 kΩ +AVS 16/ RL = 2 kΩ AVS 16/ RL = 2 kΩ -AVS 16/ RL = 2 kΩ +AVS 16/ RL = 2 kΩ -VOP RL = 2 kΩ +VOP RL = 10 kΩ -VOP RL = 10 kΩ +VOP ICC -IOS (output) +IOS (output) Parameter 20 20 5 5 -20 -20 -5 -5 -20 -20 20 20 -5 -5 -20 -20 -20 -20 -20 5 5 20 20 20 20 20 -20 20 -15 15 -15 -15 15 15 -VCC +VCC -15 V +15 -15 -2 +2 +15 -15 -2 +2 +15 -15 +20 -20 +20 -20 0 +15 Apply (in volts) 2 2 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 S1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 S2 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 S3 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 S4 Switch position 1 1 2 2 2 2 3 3 3 3 3 3 2 2 1 1 1 S5 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 2 S6 E28 1/ E29 1/ E32 E33 E31 E30 E26 E27 E25 E24 (E0)4 (E0)3 (E0)2 (E0)1 ICC IOS2 IOS1 Value V V V V V V V V V V V mA mA mA Units Measure 3 CMR = 20 log |(30 x 10 ) / (E28 - E29)| AVS = 4 / (E33 - E32) -AVS = 15 / (E31 - E3) +AVS = 15 / (E3 - E30) AVS = 4 / (E27 - E26) -AVS = 15 / (E25 - E3) +AVS = 15 / (E3 - E24) -VOP = (E0)4 +VOP = (E0)3 -VOP = (E0)2 +VOP = (E0)1 ICC = ICC -IOS = IOS2 +IOS -= IOS1 Equation Measured parameter 20/ V/mV V/mV V/mV V/mV V/mV V/mV V V V V mA mA mA Units MIL-M-38510/101K MIL-M-38510/101K NOTES: 1/ These voltages in mV shall be measured to four place accuracy to provide required resolution in PSRR and CMR. 2/ Precautions shall be taken to prevent damage to the device under test during insertion into socket and change of switch positions (example, disable voltage supplies, current limit ±VCC, etc.). 3/ If this alternate CMR test is used, these resistors shall be of .01 percent tolerances matched to .001 percent. 4/ Device types 02, 05, and 06 only, test both halves for all tests. The idle half of the dual amplifiers shall be maintained in this configuration where V1 is midway between +VCC and -VCC, or the manufacturer has the option to connect the idle half in a VIO configuration such that the inputs are maintained at the same common mode voltage as the device under test. 5/ Compensation: for device types 03, 04, 05, and 06 only, equals 30 pF; for device type 07 only, equals 330 pF (optional). 6/ Device types 01, all case types, and device type 02, case outlines A, B, C, and D only. 7/ Device types 03 and 05 only. 8/ See figure 6. Noise test circuit. 9/ As required, if needed to prevent oscillation. Also, proper wiring procedures shall be followed to prevent oscillation. Loop response and settling time shall be consistent with the test rate such that any value has settled for at least five loop time constants before the value is measured. 10/ Adequate settling time shall be allowed such that each parameter has settled to within five percent of its final value. 11/ The nulling amplifier is an M38510/10101XXX. Saturation of the nulling amplifier is not allowed on test where the "E" value is measured. 12/ All resistors 0.1 percent tolerance except as noted (note 3). 13/ For device types 01, 02, 07, and 08: RS = 20 kΩ. For device types 03 and 05: RS = 100 kΩ. For device types 04 and 06: RS = 5.0 MΩ. 14/ Device type 07 only, this capacitor = 1,000 pF maximum to prevent oscillations. 15/ Device type 07 only. 16/ To minimize thermal drift, the reference voltages for gain measurements (E3 and E4) shall be taken immediately prior to or after the reading corresponding to device gain (E24, E25, E26, E27, E30, E31, E32, and E33). The gain at RL = 10 kΩ is essentially the gain at RL = 2 kΩ is influenced by thermal gradients on the die resulting from power dissipation in the output stage. Hence, it is not linear and may not even be a true approximation of the gain between other than the specified operation points. 17/ Any oscillation greater that 300 mV in amplitude (pk - pk) shall be cause for device failure. 18/ Although switches are depicted as toggle switches, any switching mechanism may be used provided the switching action is achieved without adversely affecting the measurement. 19/ The load resistors (2,050 Ω and 11.1 kΩ) yield effective load resistances of 2 kΩ and 10 kΩ, respectively. 20/ The equations take into account both the loop gain of 1,000 and the scale factor multiplier, so that the calculated value is in table III units. Therefore, use measured value / units in the equations, example E1 (volts). FIGURE 3. Test circuit for static and dynamic tests- Continued. 25 MIL-M-38510/101K See notes on page 29 Parameter Pulse generator Measure Equation Units Rise time (tr) AV = 1 Overshoot (OS) AV = 1 Bandwidth (BW) AV = 1 Slew rate (+SR) AV = 1 +50 mV amplitude t (µs), see waveform 1 tr = t µs +50 mV amplitude ∆V (mV), see waveform 1 OS = (∆V / 50) x 100 % +50 mV amplitude Calculate BW = 0.35 / tr (µs) MHz -5 V to +5 V step ∆VO (volts), ∆t (µs) see waveform 2 +SR = |∆VO(+) / ∆t(+)| V/µs Slew rate (-SR) AV = 1 +5 V to -5 V step ∆VO (volts), ∆t (µs) see waveform 3 -SR = |∆VO(-) / ∆t(-)| V/µs FIGURE 4. Transient response test circuit. 26 MIL-M-38510/101K See notes on page 30 Parameter Pulse generator Measure Equation Units Rise time (tr) +50 mV amplitude tr = t ns Overshoot (OS) +50 mV amplitude OS = (∆V / 50) x 100 % Bandwidth (BW) +50 mV amplitude t (ns), see waveform 1 ∆V (mV), see waveform 1 Calculate Slew rate (+SR) -5 V to +5 V step ∆VO (+) (volts), ∆t (+) (ns) see waveform 2 +SR = |∆VO(+) / ∆t(+) x 10 | Slew rate (-SR) +5 V to -5 V step ∆VO (-) (volts), ∆t (-) (ns) see waveform 3 -SR = |∆VO(-) / ∆t(-) x 10 | V/µs Settling time tS(+) 5/ -5 V to +5 V step tS(+), see waveform 2 tS(+) = tS(+) ns Settling time tS(-) 5/ +5 V to -5 V step tS(-), see waveform 3 tS(-) = tS(-) ns 3 BW = (0.35 x 10 ) / tr (ns) -3 -3 FIGURE 4. Transient response test circuit - Continued. 27 MHz V/µs MIL-M-38510/101K (Alternate) device type 07 NOTES: 1. K1 is closed for small tests (Tr and P.O.) and is open for large signal tests ( ±slew rate, ±Ts). 2. Input signal is a -50 mV to 0 mV pulse train for small signal tests and -5 V to +5 V pulse train for large signal tests. 3. Tr of the input signal is < 10 ns for the small signal tests. FIGURE 4. Transient response test circuit - Continued. 28 MIL-M-38510/101K NOTES: 1. 2. 3. 4. 5. 6. 7. 8. 9. Idle half of dual amplifier shall be connected during test of other half. All resistor tolerances are 1 percent, capacitor tolerances are 10 percent and ±VCC = ±20 V. This compensation capacitor is used for device types 03, 04, 05, and 06. For device types 01, 02, 03, 05, and 08, RL = 2 kΩ; for device types 04 and 06, RL = 10 kΩ. Settling time is the interval from the beginning of the output response to the point where the output remains within the error band, in this case ±2 percent. CF = 10 pF ±10 percent includes stray capacitance. R1 may be added to the circuit. When R1 is added, its value shall be 10 kΩ. When using R1, the unity gain will increase to 2. To accommodate this change in gain, the pulse generator input shall be halved. C1 may be added to the circuit. When added, it shall be within the range of 0 pF to 2 pF. CL capacitance specified includes stray, jig, and probe capacitance. FIGURE 4. Transient response test circuit - Continued. 29 MIL-M-38510/101K Device types 02, 05, 06, and 08 only. NOTES: 1. ±VCC = 20 V. 2. Measure: V02 (volts, p-p) at 1 kHz to accuracy of 0.1 mV or better. 3. 4. 5. Channel separation (dB) referred to input of second channel = 20 log [V01 / (0.1 x V02) ]. All resistor tolerances ≤ 1 percent. A 30 pF compensation capacitor is required for device types 05 and 06. FIGURE 5. Test circuit for channel separation. 30 MIL-M-38510/101K Noise Symbol (Referred to input) Broadband N1(BB) Popcorn N1(PC) S1 Measure Measured equation Parameter units Value Units Closed E0 mV rms E0 / 1000 µV rms Open E0 mV pk E0 / 1000 µV pk NOTES: 1. RS = 20 kΩ for device types 01, 02, 07, and 08; RS = 100 kΩ for device types 03, 04, 05, and 06. 2. E0 is measured using an RMS voltmeter with a bandwidth of 10 Hz to 5 kHz and a peak detector simultaneously. Monitor the peak test for a minimum of 15 seconds. The loop bandwidth shall be at least 5 kHz. FIGURE 6. Noise test circuit. 31 +25°C TA = 1 Subgroup 32 VIO ADJ (-) VIO ADJ (+) 3/ 3/ 21 VCM = +15 V +VCC = 20 V, -VCC = -10 V +VCC = 10 V, -VCC = -20 V ±VCC = ±5 V, VCM = 0 V VCM = 0 V VCM = +15 V 2/ VCM = -15 V 2/ ±VCC = ±5 V, VCM = 0 V VCM = 0 V VCM = +15 V 2/ VCM = -15 V 2/ ±VCC = ±5 V, VCM = 0 V VCM = 0 V VCM = +15 V 2/ VCM = -15 V 2/ ±VCC = ±5 V, VCM = 0 V VCM = 0 V VCM = +15 V 2/ VCM = -15 V 2/ 20 19 CMR 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 18 4003 4001 unless otherwise specified method Conditions ±VCC = ±20 V dc, figure 3 Test no. -883 MIL-STD -PSRR +PSRR -IIB +IIB IIO VIO Symbol +5 80 -50 -50 " " " -0.1 " " " -0.1 " " " -30 " " " -3.0 Min -5 +50 +50 " " " 110 " +4 80 -50 -50 " " " -0.1 " " " " " -0.1 " " " -10 " " " -2.0 Min Max -4 +50 +50 " " " 75 " " " 75 " " " +10 " " " +2.0 Limits 03, 05 1/ 110 " " " +30 " " " +3.0 Max Limits 01, 02, 08 1/ 96 -16 -16 " " " -0.1 " " " -0.1 " " " -0.2 " " " -0.5 Min Max +16 +16 " " " +2.0 " " " +2.0 " " " +0.2 " " " +0.5 Limits 04, 06 1/ +7 80 -100 -100 " " " -0.1 " " " -0.1 " " " -40 " " " -4.0 Min " " " 250 " " " 250 " " " +40 " " " +4.0 Max -7 +100 +100 Limits 07 1/ mV mV dB µV/V µV/V " " " nA " " " nA " " " nA " " " mV Unit MIL-M-38510/101K TABLE III. Group A inspection. +125°C TA = 2 +25°C TA = 1 Subgroup See footnotes at end of table III. 33 -IIB +IIB ∆IIO / ∆T IIO ∆VIO / 6/ ∆T VIO ICC IOS (-) 4/ IOS (+) 4/ Symbol 4001 4005 3011 42 41 40 39 38 37 36 ±VCC = ±5 V, VCM = 0 V VCM = 0 V VCM = +15 V 2/ VCM = -15 V 2/ ±VCC = ±5 V, VCM = 0 V VCM = 0 V VCM = +15 V 2/ VCM = -15 V 2/ ∆IIO / ∆T = [IIO (test 32) - IIO (test 7)] x 10 34 35 ±VCC = ±5 V, VCM = 0 V VCM = 0 V VCM = +15 V 2/ 33 32 31 VCM = -15 V 2/ ∆VIO / ∆T = [VIO (test 27) - VIO (test 3)] x 10 29 30 ±VCC = ±5 V, VCM = 0 V VCM = 0 V VCM = +15 V 2/ VCM = -15 V 2/ 28 27 26 25 ±VCC = ±15 V 5/ ±VCC = ±15 V, t ≤ 25 ms 23 24 ±VCC = ±15 V, t ≤ 25 ms 22 unless otherwise specified method Conditions ±VCC = ±20 V dc, figure 3 Test no. -883 MIL-STD " " " -0.1 " " " -0.1 -200 " " " 110 " " " 110 +200 " " " " " -0.1 " " " -0.1 -100 " " " " -10 -15 " " " -3.0 -60 Min " +30 +15 " " " +4.0 3.8 +60 Max 3.0 +60 Max " " " 75 " " " 75 +100 " " " +10 +15 " " " +3.0 Limits 03, 05 1/ " " -30 -15 " " " -4.0 -60 Min Limits 01, 02, 08 1/ " " " -1.0 " " " -1.0 -2.5 " " " -0.4 -5.0 " " " -1.0 -20 Min * 0.6 +20 Max " " " +2.0 " " " +2.0 +2.5 " " " +0.4 +5.0 " " " +1.0 Limits 04 1/ * “ " " -1.0 " " " -1.0 -2.5 " " " -0.4 -5.0 " " " -1.0 -20 Min * 0.6 +20 Max “ " " +2.0 " " " +2.0 +2.5 " " " +0.4 +5.0 " " " +1.0 Limits 06 1/ * " " " -0.1 " " " -0.1 -1,000 " " " -80 -50 " " " -6.0 -65 Min " " " +80 +50 " " " +6.0 8 +65 Max " " " 250 " " " 250 +1,000 Limits 07 1/ “ " " nA “ " " nA pA/°C " " " nA µV/°C " " " mV mA mA mA Unit MIL-M-38510/101K TABLE III. Group A inspection - Continued. See footnotes at end of table III. 34 -55°C TA = 3 +125°C TA = 2 Subgroup ∆IIO / 6/ ∆T IIO ∆VIO / 6/ ∆T VIO VIO ADJ(-) VIO ADJ(+) CMR -PSRR +PSRR ICC IOS (-) 4/ IOS (+) 4/ Symbol 4001 4003 ±VCC = ±5 V, VCM = 0 V ∆IIO / ∆T = [IIO (test 7) - IIO (test 58)] x 12.5 60 VCM = 0 V VCM = +15 V 2/ 59 58 57 VCM = -15 V 2/ ∆VIO / ∆T = [VIO (test 3) - VIO (test 53)] x 12.5 55 56 ±VCC = ±5 V, VCM = 0 V VCM = 0 V VCM = +15 V 2/ 54 53 52 VCM = -15 V 2/ 3/ 50 51 3/ VCM = ±15 V +VCC = 20 V, -VCC = -10 V +VCC = 10 V, -VCC = -20 V 49 48 47 46 4003 ±VCC = ±15 V ±VCC = ±15 V, t ≤ 25 ms 44 45 ±VCC = ±15 V, t ≤ 25 ms 43 4005 3011 unless otherwise specified method Conditions ±VCC = ±20 V dc, figure 3 Test no. -883 MIL-STD -500 " " " -70 -15 " " " -4.0 +5 80 " -100 -60 Min +500 " " " +70 +15 " " " +4.0 -5 " +100 3.4 +60 Max Limits 01, 02 1/ -200 " " " -20 -18 " " " -3.0 +4 80 " -100 -60 Min +200 " " " +20 +18 " " " +3.0 -4 " +100 2.5 +60 Max Limits 03, 05 1/ -2.5 " " " -0.4 -5.0 " " " -1.0 96 " -16 -20 * +2.5 " " " +0.4 +5.0 " " " +1.0 " +16 0.6 +20 Max Limits 04 1/ Min * -2.5 " " " -0.4 -5.0 " " " -1.0 96 " -16 -20 * +2.5 " " " +0.4 +5.0 " " " +1.0 " +16 0.6 +20 Max Limits 06 1/ Min * " " " +80 +50 " " " +6.0 -7 " +150 7 +65 Max -1,000 +1,000 " " " -80 -50 " " " -6.0 +7 80 " -150 -65 Min Limits 07 1/ -500 " " " -70 -20 " " " -4.0 +5 80 " -100 -60 Min +500 “ " " +70 +20 “ " " +4.0 -5 +100" 3.4 +60 Max Limits 08 1/ pA/°C " " nA µV /°C " " " mV mV dB µV /V mA mA mA Unit MIL-M-38510/101K TABLE III. Group A inspection - Continued. See footnotes at end of table III. 35 +25°C TA = 4 -55°C TA = 3 Subgroup -VOP +VOP -VOP +VOP 80 79 78 77 RL = 2 kΩ RL = 2 kΩ RL = 10 kΩ RL = 10 kΩ +15 +16 3/ 76 VIO ADJ(-) 4004 +5 3/ 75 VIO ADJ(+) 80 VCM = ±15 V -100 -100 74 +VCC = 20 V, -VCC = -10 V +VCC = 10 V, -VCC = -20 V -60 " " " -0.1 " " " -0.1 CMR 72 5/ ±VCC = ±15 V, t ≤ 25 ms 70 ±VCC = ±15 V ±VCC = ±15 V, t ≤ 25 ms 69 71 ±VCC = ±5 V, VCM = 0 V VCM = 0 V VCM = +15 V 2/ VCM = -15 V 2/ ±VCC = ±5 V, VCM = 0 V VCM = 0 V VCM = +15 V 2/ VCM = -15 V 2/ 68 67 66 65 64 63 62 61 Min -15 -16 -5 +100 +100 4.2 +60 " " " 265 " " " 265 Max Limits 01, 02, 08 1/ 73 4003 4005 3011 4001 unless otherwise specified method Conditions ±VCC = ±20 V dc, figure 3 Test no. -883 MIL-STD -PSRR +PSRR ICC IOS (-) 4/ IOS (+) 4/ -IIB +IIB Symbol +15 +16 +4 80 -100 -100 -60 " " " -0.1 " " " -0.1 Min -15 -16 -4 +100 +100 3.5 +60 " " " 100 " " " 100 Max Limits 03, 05 1/ +16 96 -16 -16 -20 " " " -0.1 " " " -0.1 * -16 +16 +16 0.8 +20 " " " 3.0 " " " 3.0 Max Limits 04 1/ Min * +16 96 -16 -16 -20 " " " -0.1 " " " 06 1/ * -16 +16 +16 0.8 +20 " " " 3.0 " " " 3.0 Max Limits -0.1 Min * +16 +17 +7 80 -150 -150 -65 " " " -0.1 " " " -0.1 Min -16 -17 -7 +150 +150 9 80 " " " 400 " " " 400 Max Limits 07 1/ " " " V mV mV dB µV/V µV/V mA mA mA " " " nA " " " nA Unit MIL-M-38510/101K TABLE III. Group A inspection - Continued. See footnotes at end of table III. 36 -55°C TA = 6 +125°C TA = 5 +25°C TA = 4 Subgroup -VOP +VOP -VOP +VOP AVS AVS -AVS +AVS -AVS +AVS -VOP +VOP -VOP +VOP AVS AVS -AVS +AVS -AVS +AVS Symbol 4004 100 99 98 RL = 2 kΩ RL = 2 kΩ RL = 10 kΩ RL = 10 kΩ RL = 10 kΩ, ±VCC = ±5 V, VOUT = ±2 V 96 97 RL = 2 kΩ, ±VCC = ±5 V, VOUT = ±2 V RL = 10 kΩ, VOUT = -15 V RL = 10 kΩ, VOUT = +15 V RL = 2 kΩ, VOUT = -15 V RL = 2 kΩ, VOUT = +15 V RL = 2 kΩ RL = 2 kΩ RL = 10 kΩ 95 94 93 92 91 90 89 88 RL = 10 kΩ RL = 10 kΩ, ±VCC = ±5 V, VOUT = ±2 V 86 87 RL = 2 kΩ, ±VCC = ±5 V, VOUT = ±2 V RL = 10 kΩ, VOUT = -15 V RL = 10 kΩ, VOUT = +15 V RL = 2 kΩ, VOUT = -15 V RL = 2 kΩ, VOUT = +15 V 85 84 83 82 81 unless otherwise specified method Conditions ±VCC = ±20 V dc, figure 3 Test no. -883 MIL-STD +15 +16 10 10 25 25 25 25 +15 +16 10 10 50 50 50 50 Min -15 -16 -15 -16 Max Limits 01, 02, 08 1/ +15 +16 10 10 25 25 25 25 +15 +16 10 10 50 50 50 50 Min Limits -15 -16 -15 -16 Max 03, 05 1/ +16 20 40 40 +16 20 80 80 Min Limits -16 -16 Max 04, 06 1/ +16 +17 10 10 32 32 32 32 +16 +17 10 10 50 50 50 50 Min Limits -16 -17 -16 -17 Max 07 1/ " " " V " " " " " V/mV " " " V " " " " " V/mV Unit MIL-M-38510/101K TABLE III. Group A inspection - Continued. See footnotes at end of table III. 37 -55°C TA = 8B +125°C TA = 8A +25°C TA = 7 -55°C TA = 6 Subgroup SR(-) 121 120 SR(+) 4002 119 118 117 TR(OS) TR(tr) SR(-) 116 SR(+) 4002 115 TR(OS) TR(tr) TA = -55°C, figure 4, AV = 1, VIN = +5 V to -5 V TA = -55°C, figure 4, AV = 1, VIN = -5 V to +5 V TA = -55°C, figure 4 TA = -55°C, figure 4 TA = +125°C, figure 4, AV = 1, VIN = +5 V to -5 V TA = +125°C, figure 4, AV = 1, VIN = -5 V to +5 V TA = +125°C, figure 4 TA = +125°C, figure 4 BW = 5 kHz, figure 6 113 NI(PC) 114 BW = 5 kHz, figure 6 112 NI(BB) Figure 5 111 Figure 4, AV = 1, VIN = +5 V to -5 V Figure 4, AV = 1, VIN = -5 V to +5 V CS 7/ 109 Figure 4 110 4002 108 Figure 4 RL = 10 kΩ, ±VCC = ±5 V, VOUT = ±2 V 106 107 RL = 2 kΩ, ±VCC = ±5 V, VOUT = ±2 V RL = 10 kΩ, VOUT = -15 V RL = 10 kΩ, VOUT = +15 V RL = 2 kΩ, VOUT = -15 V RL = 2 kΩ, VOUT = +15 V 105 104 103 102 101 unless otherwise specified method Conditions ±VCC = ±20 V dc, figure 3 Test no. -883 MIL-STD SR(-) SR(+) TR(OS) TR(tr) AVS AVS -AVS +AVS -AVS +AVS Symbol 0.3 0.3 0.3 0.3 80 0.3 0.3 10 10 25 25 25 25 Min 25 800 25 800 40 15 25 800 Max Limits 01, 02, 08 1/ 0.2 0.2 0.3 0.3 80 0.3 0.3 10 10 25 25 25 25 Min 25 800 25 800 80 15 25 800 Max Limits 03, 05 1/ 0.05 0.05 0.05 0.05 80 0.05 0.05 20 40 40 Min Max 50 1,000 50 1,000 40 15 50 1,000 Limits 04, 06 1/ 40 40 30 30 40 40 10 10 32 32 32 32 Min Limits 50 40 50 40 80 25 50 40 Max 07 1/ V/µs V/µs % ns V/µs V/µs % ns µV pk µV rms dB V/µs V/µs % ns " " " " " V/mV Unit MIL-M-38510/101K TABLE III. Group A inspection - Continued. 38 tS(-) tS(+) tS(-) tS(+) tS(-) tS(+) 4002 127 126 125 124 123 122 TA = -55°C, figure 4 TA = -55°C, figure 4 TA = +125°C, figure 4 TA = +125°C, figure 4 TA = +25°C, figure 4 TA = +25°C, figure 4 unless otherwise specified method Conditions ±VCC = ±20 V dc, figure 3 Test no. -883 Symbol MIL-STD Min Max Limits 01, 02, 08 1/ Min Max Limits 03, 05 1/ Min Limits Max 04, 06 1/ Min 800 800 Max 1,200 1,200 1,200 1,200 Limits 07 1/ ns ns ns ns ns ns Unit 7/ Applies to device types 02, 05, and 06 only. 6/ Tests 29, 34, 55, and 60 which require a read and record measurement plus a calculation, may be omitted except when subgroups 2 and 3 are being accomplished for group A sampling inspection and group C and D endpoint measurements. 5/ Limit shown applied to single devices (01, 03, and 04) only. The maximum quiescent ICC for dual devices (02, 05, 06, and 08) is twice that shown for single devices. verification (example, such tests as VOPP, AVS, TR, SR). 4/ Due to the significant power dissipation and associated device heating, these tests shall always be the last tests performed in any given sequence, followed by operational 3/ VIO (ADJ) is not performed on device type 02, case I only, or on device types 04, 06, and 08 all case types. (example, for VCM = -15 V, +VCC = +35 V, -VCC = -5 V, V = -15 V). 2/ VCM is achieved by algebraically subtracting the common mode voltage from each supply and algebraically adding the common mode voltage to V 1/ For devices marked with the “Q” certification mark, the parameters listed herein may be guaranteed if not tested to the limits specified herein in accordance with the manufacturer’s QM plan. Limits apply to both halves of dual devices (02, 05, 06, and 08) independently, and slew rate limit for device 08 is 0.4 V/µs at all temperatures (tests 109, 110, 116, 117, 120, 121). TA =-55°C 13B TA =+125°C 13A TA =+25°C 12 Subgroup MIL-M-38510/101K TABLE III. Group A inspection - Continued. MIL-M-38510/101K TABLE IV. Group C end point electrical parameters. (TA = +25°C, VCC = ±20 V, VCM = 0 V) Table III test no. Test 01, 02, 08 Limit 03, 05 Delta Limit Unit Delta Min Max Min Max Min Max Min Max 3 VIO -3.0 +3.0 -0.5 +0.5 -2.0 +2.0 -0.5 +0.5 mV 11 +IIB +1.0 +110 -12 +12 +1.0 +75 -7.5 +7.5 nA 15 -IIB +1.0 +110 -12 +12 +1.0 +75 -7.5 +7.5 nA Table III test no. Test 04, 06 Limit 07 Delta Unit Limit Delta Min Max Min Max Min Max Min Max 3 VIO -0.5 +0.5 -0.25 +0.25 -4.0 +4.0 -1.0 +1.0 mV 11 +IIB -0.1 +2.0 -0.5 +0.5 +1.0 250 -25 +25 nA 15 -IIB -0.1 +2.0 -0.5 +0.5 +1.0 250 -25 +25 nA 39 MIL-M-38510/101K 4.3 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-38535. 4.4 Technology Conformance inspection (TCI). Technology conformance inspection shall be in accordance with MILPRF-38535 and herein for groups A, B, C, and inspections (see 4.4.1 through 4.4.4). 4.4.1 Group A inspection. Group A inspection shall be in accordance with table III of MIL-PRF-38535 and as follows: a. Subgroups 9, 10, and 11 shall be omitted. b. Tests shall be as specified in table II herein. c. Subgroups 12 and 13 (for device type 07 only) shall be added to table III of MIL-PRF-38535 for class S only. The class S sample size series for subgroup 12 shall be 5 and for subgroup 13 the class S sample size series shall be 7. 4.4.2 Group B inspection. Group B inspection shall be in accordance with table II of MIL-PRF-38535. 4.4.3 Group C inspection. Group C inspection shall be in accordance with table IV of MIL-PRF-38535 and as follows: a. End point electrical parameters shall be as specified in table II herein. b. Subgroups shall be added to group C inspection and shall consist of subgroups 8, 12, and 13 respectively as specified in table III herein. The sample size series for subgroup 12 shall be 5, and subgroup 13 shall be 7 for class B devices (see MIL-PRF-38535, Appendix D). c. The steady-state life test duration, test condition, and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document control by the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. 4.4.4 Group D inspection. Group D inspection shall be in accordance with table V of MIL-PRF-38535. End point electrical parameters shall be as specified in table II herein. 4.5 Methods of inspection. Methods of inspection shall be specified and as follows. 4.5.1 Voltage and current. All voltage values given, except the input offset voltage (or differential voltage) are referenced to the external zero reference level of the supply voltage. Currents given are conventional current and positive when flowing into the referenced terminal. 4.5.2 Burn-in and life test cooldown procedure. When devices are measured at +25°C following application of the steady state life or burn-in condition, they shall be cooled to within 10°C of their power stable condition at room temperature prior to removal of the bias. 40 MIL-M-38510/101K 5. PACKAGING 5.1 Packaging requirements. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When packaging of materiel is to be performed by DoD personnel, these personnel need to contact the responsible packaging activity to ascertain requisite packaging requirements. Packaging requirements are maintained by the Inventory Control Point's packaging activity within the Military Department of Defense Agency, or within the Military Department's System Command. Packaging data retrieval is available from the managing Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 6. NOTES (This section contains information of a general or explanatory nature which may be helpful, but is not mandatory.) 6.1 Intended use. Microcircuits conforming to this specification are intended for logistic support of existing equipment. 6.2 Acquisition requirements. Acquisition documents should specify the following: a. Title, number, and date of the specification. b. PIN and compliance identifier, if applicable (see 1.2). c. Requirements for delivery of one copy of the conformance inspection data pertinent to the device inspection lot to be supplied with each shipment by the device manufacturer, if applicable. d. Requirements for certificate of compliance, if applicable. e. Requirements for notification of change of product or process to acquiring activity in addition to notification of the qualifying activity, if applicable. f. Requirements for failure analysis (including required test condition of MIL-STD-883, method 5003), corrective action and reporting of results, if applicable. g. Requirements for product assurance options. h. Requirements for special carriers, lead lengths, or lead forming, if applicable. These requirements shall not affect the part number. Unless otherwise specified, these requirements will not apply to direct purchase by or direct shipment to the Government. i. Requirements for “JAN” marking. j. Packaging requirements (see 5.1). 6.3 Qualification. With respect to products requiring qualification, awards will be made only for products which are, at the time of award of contract, qualified for inclusion in Qualified Manufacturers List QML-38535 whether or not such products have actually been so listed by that date. The attention of the contractors is called to these requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal Government tested for qualification in order that they may be eligible to be awarded contracts or purchase orders for the products covered by this specification. Information pertaining to qualification of products may be obtained from DSCC-VQ, 3990 E. Broad Street, Columbus, Ohio 43218-1199. 41 MIL-M-38510/101K 6.4 Superseding information. The requirements of MIL-M-38510 have been superseded to take advantage of the available Qualified Manufacturer Listing (QML) system provided by MIL-PRF-38535. Previous references to MIL-M-38510 in this document have been replaced by appropriate references to MIL-PRF-38535. All technical requirements now consist of this specification and MIL-PRF-38535. The MIL-M-38510 specification sheet number and PIN have been retained to avoid adversely impacting existing government logistics systems and contractor's parts lists. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. 6.6 Logistic support. Lead materials and finishes (see 3.4) are interchangeable. Unless otherwise specified, microcircuits acquired to Government logistic support will be acquired to device class B (see 1.2.2), lead material and finish A (see 3.4). Longer length leads and lead forming should not affect the part number. 6.7 Substitutability. The cross-reference information below is presented for the convenience of users. Microcircuits covered by this specification will functionally replace the listed generic-industry type. Generic-industry microcircuit types may not have equivalent operational performance characteristics across military temperature ranges or reliability factors equivalent to MIL-M-38510 device types and may have slight physical variations in relation to case size. The presence of this information should not be deemed as permitting substitution of generic-industry types for MIL-M-38510 types or as a waiver of any of the provisions of MIL-PRF-38535. Military device type 01 02 Generic-industry type 741A 747A (with common +VCC) LM101A LM108A LH2101A LH2108A LM118 1558 03 04 05 06 07 08 6.8 Changes from previous issue. Marginal notations are not used in this revision to identify changes with respect to the previous issue due to the extensiveness of the changes. Custodians: Army - CR Navy - EC Air Force - 11 NASA - NA DLA - CC Preparing activity: DLA - CC Project 5962-2005-046 Review activities: Army – MI, SM Navy - AS, CG, MC, SH, TD Air Force – 03, 19, 99 NOTE: The activities listed above were interested in this document as of the date of this document. Since organizations and responsibilities can change, you should verify the currency of the information above using the ASSIST Online database at http://assist.daps.dla.mil. 42