PHILIPS SOT545-3

PDF: 2004 Feb 05
Philips Semiconductors
Package outline
HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads;
body 7 x 7 x 1 mm; exposed die pad
SOT545-3
c
y
exposed die pad side
X
Dh
36
25
A
24
37
ZE
e
E HE
Eh
(A 3)
A A2 A1
w M
θ
bp
Lp
L
pin 1 index
13
48
detail X
1
12
ZD
w M
bp
v M A
e
D
B
HD
v M B
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT max.
mm
1.2
A1
A2
0.15
0.05
1.05
0.95
A3
bp
c
D(1)
Dh
E(1)
Eh
0.25
0.27
0.17
0.20
0.09
7.1
6.9
3.6
3.4
7.1
6.9
3.6
3.4
e
HD
HE
0.5
9.1
8.9
9.1
8.9
L
Lp
1
0.75
0.45
v
0.2
w
0.08
y
0.08
ZD(1) ZE(1)
0.9
0.6
0.9
0.6
θ
7°
0°
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT545-3
REFERENCES
IEC
JEDEC
MS-026
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
04-02-05