NXP Semiconductors User’s guide Document Number: KTFRDMGD3000UG Rev. 3.0, 5/2016 FRDM-GD3000EVB evaluation board Figure 1. FRDM-GD3000EVB © 2016 NXP B.V. Table of Contents 1 2 3 4 5 6 7 8 9 10 11 Important notice . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Getting started . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Getting to know the hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Installing the software and setting up the hardware. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Evaluation board examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Silkscreen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Bill of Materials. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Accessory Item Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 FRDM-GD3000EVB evaluation board, Rev. 3.0 2 NXP Semiconductors Important notice 1 Important notice NXP provides the enclosed product(s) under the following conditions: This evaluation kit is intended for use of ENGINEERING DEVELOPMENT OR EVALUATION PURPOSES ONLY. It is provided as a sample IC pre-soldered to a printed circuit board to make it easier to access inputs, outputs, and supply terminals. This evaluation board may be used with any development system or other source of I/O signals by simply connecting it to the host MCU or computer board via off-the-shelf cables. This evaluation board is not a Reference Design and is not intended to represent a final design recommendation for any particular application. Final device in an application will be heavily dependent on proper printed circuit board layout and heat sinking design as well as attention to supply filtering, transient suppression, and I/O signal quality. The goods provided may not be complete in terms of required design, marketing, and or manufacturing related protective considerations, including product safety measures typically found in the end product incorporating the goods. Due to the open construction of the product, it is the user's responsibility to take any and all appropriate precautions with regard to electrostatic discharge. In order to minimize risks associated with the customers applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. For any safety concerns, contact NXP sales and technical support services. Should this evaluation kit not meet the specifications indicated in the kit, it may be returned within 30 days from the date of delivery and will be replaced by a new kit. NXP reserves the right to make changes without further notice to any products herein. NXP makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does NXP assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typical”, must be validated for each customer application by customer’s technical experts. NXP does not convey any license under its patent rights nor the rights of others. NXP products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the NXP product could create a situation where personal injury or death may occur. Should the Buyer purchase or use NXP products for any such unintended or unauthorized application, the Buyer shall indemnify and hold NXP and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges NXP was negligent regarding the design or manufacture of the part. NXP and the NXP logo are trademarks of NXP B.V. All other product or service names are the property of their respective owners. © 2016 NXP B.V. FRDM-GD3000EVB evaluation board, Rev. 3.0 NXP Semiconductors 3 Getting started 2 Getting started 2.1 Kit contents/packing list The FRDM-GD3000EVB evaluation board contents include: • Assembled and tested evaluation board/module in an anti-static bag • Four Arduino™ female/male connectors (two each 2X8, one each 2X6, one each 2X10) • Warranty card 2.2 Jump Start NXP’s analog product development boards help to easily evaluate NXP products. These tools support analog mixed signal and power solutions including monolithic ICs using proven high-volume SMARTMOS mixed signal technology, and system-in-package devices utilizing power, SMARTMOS and MCU dies. NXP products enable longer battery life, smaller form factor, component count reduction, ease of design, lower system cost and improved performance in powering state of the art systems. • Go to www.nxp.com/FRDM-GD3000EVB • Look for Jump Start Your Design • Download documents, software, and other information Once the files are downloaded, review the user guide in the bundle. The user guide includes setup instructions, BOM and schematics. Jump Start bundles are available on each tool summary page with the most relevant and current information. The information includes everything needed for design. 2.3 Required equipment and software To use this kit, you need: • DC Power supply: 5.0 V to 48 V with up to 10 A current handling capability, depending on motor requirements and MOSFET specifications. • Typical loads (BLDC motor) • Any compatible FRDM board (see Section 3.12 "Compatible FRDM boards", page 13) • USB Standard A (male) to mini or micro (male) cable, depending on which FRDM board is used • Soldering station • A FRDM-PWRSTG evaluation board or any custom-designed, but compatible MOSFET board 2.4 System requirements The kit requires the following: • USB-enabled PC with Windows® XP or higher FRDM-GD3000EVB evaluation board, Rev. 3.0 4 NXP Semiconductors Getting to know the hardware 3 Getting to know the hardware 3.1 Board overview The evaluation board (EVB) provides a development platform exercising all the functions of the GD3000 3-Phase Brushless Motor Pre-Driver IC. The EVB is designed for use in conjunction with any compatible FRDM board. It may be used with the FRDM-KL25Z to enable control via the SPIGen GUI. 3.2 Board features The board allows evaluation of NXP part MC33812 and all its functions. The board features the following: • Compatibility with select NXP Freedom Development Platforms • Test points to allow signal probing • Optional built in voltage regulator to supply logic level circuitry • LEDs to indicate the supply status 3.3 Block diagram A simplified version of the hardware block diagram is shown in Figure 2. It shows only the major components and features of the evaluation board and the entire system. For specifics, refer to the schematic. MCU (FRDM) PWM3 PWM0 FRDM-GD3000xEVB PA_HS_B PA_LS FRDM-PWRSTGxEVB DCB_POS Power Supply PWM4 PWM1 MOSFETs PB_HS_B PB_LS PWM5 PWM2 PHASEA PHASEB PHASEC CS_B MOSI CLK MOSI RST_B INT EN PC_HS_B PC_LS PHASEA PHASEB PHASEC CS_B MOSI CLK MOSI RST_B INT EN1 EN2 PC_LS_G PC_HS_G PC_LS_G PC_HS_G PB_LS_G PB_HS_G PB_LS_G PB_HS_G PA_LS_G PA_HS_G PA_LS_G PA_HS_G Three-Phase Motor Figure 2. Block diagram FRDM-GD3000EVB evaluation board, Rev. 3.0 NXP Semiconductors 5 Getting to know the hardware 3.4 Device features This evaluation board features the following NXP product: Table 1. Device features Device Description Features • Supports greater than 1.0 A peak current capability • Can operate off of a single power supply, with a wide range from 6.0 V to 58.0V with 75 V transient protection MC33812 The GD3000 is a gate driver IC for three-phase motor drive applications providing three half-bridge drivers, each capable of driving two N-channel MOSFETs. • Uses a bootstrap gate driver architecture with trickle charge circuitry to support 100% duty cycle • Uses programmable cross-talk protection when the high-side or low-side MOSFET is switching to prevent current flow • Integrated VDS sensing of the high-side and low-side MOSFETs is used to protect the external power stage against overcurrent conditions • Includes a current shunt amplifier for accurate current measurement for phase error detection 3.5 Board description Figure 3 describes the main blocks of the evaluation board. Figure 3. Board description FRDM-GD3000EVB evaluation board, Rev. 3.0 6 NXP Semiconductors Getting to know the hardware Table 2. Board description Name Description FRDM Connectors Connectors to attach to a compatible FRDM board GD3000 Connectors Connectors to attach to an FRDM-PWRSTG board MC33812 Three Phase Field Effect Transistor Pre-driver Jumpers Jumpers for configuring the board for various modes of operation Test points 3.6 Test points to probe various signals LED display The following LEDs are provided as visual output devices for the evaluation board: Figure 4. LED display Table 3. LED display Name D1 Description GREEN LED, indicates when VLS is present (i.e. the device is on) FRDM-GD3000EVB evaluation board, Rev. 3.0 NXP Semiconductors 7 Getting to know the hardware 3.7 Jumper definitions Figure 5 shows the jumper locations on the board. Figure 5. Board jumpers The following table defines the evaluation board jumper positions and explains their functions. (The default settings are shown in blue.) Table 4. Jumper definitions Jumper JP1 JP2 JP3 JP4 JP5 Description VPWR Select Phase A Input Select Phase B Input Select Phase C Input Select PUMP Select Setting Connection 1-2 DCB_POS to VPWR 2-3 PUMP to VPWR 1-2 PA_HS_B to PWM3 2-3 PA_HS_B to PA_LS 1-2 PB_HS_B to PWM4 2-3 PB_HS_B to PB_LS 1-2 PC_HS_B to PWM5 2-3 PC_HS_B to PC_LS 1-2 PUMP in use (remove when PUMP is not used) 3-4 PUMP in use (remove when PUMP is not used) 5-6 PUMP in use (remove when PUMP is not used) FRDM-GD3000EVB evaluation board, Rev. 3.0 8 NXP Semiconductors Getting to know the hardware 3.8 Input signal definition The board has the following input signals used to drive the gate driver and relay feedback to the gate driver. Additional feedback signals may be present depending on which FRDM-PWRSTG board is used. Refer to the relevant FRDM-PWRSTG user guide. Table 5. Input signals Input Name EN RST_B CS MOSI CLK Description Logic signal input must be high to enable any gate drive output (from MCU) Reset input (from MCU) Chip Select input. It frames SPI commands and enables SPI port (from MCU) Input data for SPI port. Clocked on the falling edge of SCLK, MSB first (from MCU) Clock for SPI port and typically is 3.0 MHz (from MCU) OC_TH Threshold of the overcurrent detector (from FRDM-PWRSTG) AMP_P Non-inverting input of the current-sensing amplifier (from FRDM-PWRSTG) AMP_N Inverting input of the current-sensing amplifier (from FRDM-PWRSTG) PWM2 Active low input signal for PC_LS (or both PC_LS and PC_HS_B) (from MCU) PWM1 Active low input signal for PB_LS (or both PB_LS and PB_HS_B) (from MCU) PWM0 Active low input signal for PA_LS (or both PA_LS and PA_HS_B) (from MCU) PWM3 Active low input signal for PA_HS_B (from MCU) PWM4 Active low input signal for PB_HS_B (from MCU) PWM5 Active low input signal for PC_HS_B (from MCU) PA_HS_S Source connection for Phase A high-side FET (from FRDM-PWRSTG) PB_HS_S Source connection for Phase B high-side FET (from FRDM-PWRSTG) PC_HS_S Source connection for Phase C high-side FET (from FRDM-PWRSTG) PA_BOOT Bootstrap capacitor for Phase A (from FRDM-PWRSTG) PB_BOOT Bootstrap capacitor for Phase B (from FRDM-PWRSTG) PC_BOOT Bootstrap capacitor for Phase C (from FRDM-PWRSTG) PA_LS_S Source connection for Phase A low-side FET (from FRDM-PWRSTG) PB_LS_S Source connection for Phase B low-side FET (from FRDM-PWRSTG) PC_LS_S Source connection for Phase C low-side FET (from FRDM-PWRSTG) FRDM-GD3000EVB evaluation board, Rev. 3.0 NXP Semiconductors 9 Getting to know the hardware 3.9 Output signal definition The board has the following output signals which are used to communicate with an MCU board and a FRDM-PWRSTG accessory board which can drive a load, such as a brushless DC motor. Table 6. Output signals Output name INT OC_OUT Description Interrupt pin output (to MCU) Totem pole digital output of the overcurrent comparator (to MCU) TOTEM_PA Totem pole output of Phase A comparator; this output is low when the voltage on PA_HS_S (source of high-side FET) is less than 50% of VSUP (to MCU) TOTEM_PB Totem pole output of Phase B comparator; this output is low when the voltage on PB_HS_S (source of high-side FET) is less than 50% of VSUP (to MCU) TOTEM_PC Totem pole output of Phase C comparator; this output is low when the voltage on PC_HS_S (source of high-side FET) is less than 50% of VSUP (to MCU) MISO Output data for SPI port. Tri-state until CS becomes low (to MCU) AMP_OUT Output of the current-sensing amplifier (to FRDM-PWRSTG, then to MCU) PC_LS_G Gate drive for output Phase C low-side (to FRDM-PWRSTG) PC_HS_G Gate drive for output Phase C high-side (to FRDM-PWRSTG) PB_LS_G Gate drive for output Phase B low-side (to FRDM-PWRSTG) PB_HS_G Gate drive for output Phase B high-side (to FRDM-PWRSTG) PA_LS_G Gate drive for output Phase A low-side (to FRDM-PWRSTG) PA_HS_G Gate drive for output Phase A high-side (to FRDM-PWRSTG) FRDM-GD3000EVB evaluation board, Rev. 3.0 10 NXP Semiconductors Getting to know the hardware 3.10 Test point definitions The following test points, shown in Figure 6, provide access to various signals to and from the board. Figure 6. Test points Table 7. Test point definitions Test point name Signal name Description VDD VDD VDD regulator output capacitor connection VLS VLS VLS regulator output; power supply for the gate drives VLS_CAP VLS_CAP IOREF IOREF DCB_POS DCB_POS PUMP PUMP_VPWR VPWR if external pump is used VIN VIN Power supply for FRDM board DGND1 GND Ground DGND2 GND Ground DGND3 GND Ground VLS Regulator connection for additional output capacitor, providing low impedance supply source for low-side gate drive IO reference from FRDM board Power supply input for gate drives FRDM-GD3000EVB evaluation board, Rev. 3.0 NXP Semiconductors 11 Getting to know the hardware Table 7. Test point definitions (continued) Test point name Signal name AGND1 AGND PHASE_A PA_HS_S Source connection for Phase A high-side FET (PHASE A output) PHASE_B PB_HS_S Source connection for Phase B high-side FET (PHASE B output) PHASE_C PC_HS_S Source connection for Phase C high-side FET (PHASE C output) EN EN RST_B RST_B INT INT OC_OUT OC_OUT OC_TH OC_TH Threshold of the overcurrent detector CS CS3_0 Chip Select input. It frames SPI commands and enables SPI port SI MOSI_0 Input data for SPI port. Clocked on the falling edge of SCLK, MSB first SO MISO_0 Output data for SPI port. Tri-state until CS becomes low CLK CLK_0 TOTEM_PA TOTEM_PA Totem pole output of Phase A comparator; this output is low when the voltage on PA_HS_S (source of high-side FET) is less than 50% of VSUP TOTEM_PB TOTEM_PB Totem pole output of Phase B comparator; this output is low when the voltage on PB_HS_S (source of high-side FET) is less than 50% of VSUP TOTEM_PC TOTEM_PC Totem pole output of Phase C comparator; this output is low when the voltage on PC_HS_S (source of high-side FET) is less than 50% of VSUP LS_A PA_LS Active high input logic signal enables the low-side driver for Phase A LS_B PB_LS Active high input logic signal enables the low-side driver for Phase B LS_C PC_LS Active high input logic signal enables the low-side driver for Phase C HS_A PA_HS_B Active low input logic signal enables the high-side driver for Phase A HS_B PB_HS_B Active low input logic signal enables the high-side driver for Phase B HS_C PC_HS_B Active low input logic signal enables the high-side driver for Phase C AMP_P AMP_P Non-inverting input of the current-sensing amplifier AMP_N AMP_N Inverting input of the current-sensing amplifier AMP_OUT AMP_OUT 3.11 Description Analog ground from FRDM board Logic signal input must be high (EN1 ANDed with EN2) to enable any gate drive output. Reset input Interrupt pin output Totem pole digital output of the overcurrent comparator Clock for SPI port and typically is 3.0 MHz Output of the current-sensing amplifier Screw terminal connections The board does not have screw terminal connectors for the power supply and load. These connectors are found on the power stage board which must be stacked on top of this gate driver board. See related products for available power stage boards and their respective user guides. FRDM-GD3000EVB evaluation board, Rev. 3.0 12 NXP Semiconductors Getting to know the hardware 3.12 Compatible FRDM boards The following FRDM boards are guaranteed to be compatible with this evaluation board. If using a FRDM board not listed, check the pin assignments to make sure the FRDM board is compatible with this evaluation board. Table 8. Compatible Freedom development boards FRDM board name Functionality FRDM-K22F Partial FRDM-K64F Partial FRDM-K20D50M Partial FRDM-KE02Z Partial FRDM-KE02Z40M Partial FRDM-KE04Z <none> FRDM-KE06Z Partial FRDM-KL02Z Partial FRDM-KL03Z Partial FRDM-KL05Z Partial FRDM-KL25Z Partial FRDM-KL26Z Partial FRDM-KL27Z Partial FRDM-KL43Z Partial FRDM-KL46Z Partial FRDM-KV10Z Full (1) FRDM-KV31F Full Notes 1. On the FRDM-KV10Z, populate R64 with a 0 Ohm resister, replace R9 and R15 with 680 Ohm resistors, and set PTD1 high in software to disable the accelerometer. 3.13 Pin assignments Table 9 provides information about the connectors and pin assignments of the FRDM-GD3000, FRDM-KL25Z, FRDM-KV10Z, and FRDM-KV31F. The FRDM-KL25Z is generally used as a Freedom SPI Dongle (FSD). It can also be used as a regular microcontroller, although with limited functionality. The FRDM-KV10Z and the FRDM-KV31F can be used as regular MCU boards and provide full functionality. On the FRDM-KV10Z, populate R64 with a 0 Ohm resister, replace R9 and R15 with 680 Ohm resistors, and set PTD1 high in software to disable the accelerometer. Table 9. Arduino™ connector pin assignments (“A” suffix) FRDM-GD3000 Name FRDM-KL25Z Header Pin Port FRDM-KV10Z Header Pin Port FRDM-KV31F Header Pin Header Pin Port J1A 1 INT J1 2 PTA1 J1 2 PTD0 J1 2 PTE1 J1A 2 OC_OUT J1 4 PTA2 J1 4 PTD1 J1 4 PTE0 J1A 3 <NC> J1 6 PTD4 J1 6 – J1 6 PTD5 J1A 4 TOTEM_PA J1 8 PTA12 J1 8 PTE24 J1 8 PTE6 J1A 5 TOTEM_PB J1 10 PTA4 J1 10 PTB0 J1 10 PTC13 J1A 6 TOTEM_PC J1 12 PTA5 J1 12 PTE25 J1 12 PTA12 J1A 7 <NC> J1 14 PTC8 J1 14 PTE29 J1 14 PTC3 J1A 8 EN J1 16 PTC9 J1 16 PTC7 J1 16 PTC6 FRDM-GD3000EVB evaluation board, Rev. 3.0 NXP Semiconductors 13 Getting to know the hardware Table 9. Arduino™ connector pin assignments (“A” suffix) (continued) FRDM-GD3000 Header Pin J2A 1 FRDM-KL25Z Name <reserved> Header Pin J2 2 FRDM-KV10Z Port PTA13 Header Pin J2 2 FRDM-KV31F Port PTD2 Header Pin J2 2 Port PTA0 J2A 2 RST_B J2 4 PTD5 J2 4 PTA4 J2 4 PTA1 J2A 3 CS J2 6 PTD0 J2 6 PTD6 J2 6 PTC19 J2A 4 MOSI J2 8 PTD2 J2 8 PTC6 J2 8 PTC18 J2A 5 MISO J2 10 PTD3 J2 10 PTD3 J2 10 PTC17 J2A 6 CLK J2 12 PTD1 J2 12 PTC5 J2 12 PTC16 J2A 7 GND J2 14 GND J2 14 GND J2 14 GND J2A 8 AREF J2 16 VREFH J2 16 AREF J2 16 VREF J2A 9 <reserved> J2 18 PTE0 J2 18 PTB3 J2 18 PTC1 J2A 10 <reserved> J2 20 PTE1 J2 20 PTB2 J2 20 PTC0 J3A 8 VIN J3 16 P5-9V_VIN J3 16 P5-9V_VIN J3 16 P5-9V_VIN J3A 7 GND J3 14 GND J3 14 GND J3 14 GND J3A 6 GND J3 12 GND J3 12 GND J3 12 GND J3A 5 5V J3 10 P5V_USB J3 10 P5V_USB J3 10 P5V_USB J3A 4 3V3 J3 8 P3V3 J3 8 P3V3 J3 8 P3V3 J3A 3 <NC> J3 6 RESET/PTA20 J3 6 RST_TGTMCU_B J3 6 RST_TGTMCU_B J3A 2 IOREF J3 4 P3V3 J3 4 P3V3 J3 4 P3V3 J3A 1 <NC> J3 2 SDA_PTD5 J3 2 <NC> J3 2 <NC> J4A 6 <reserved> J4 12 PTC1 J4 12 PTB2 J4 12 PTC10 J4A 5 <reserved> J4 10 PTC2 J4 10 PTB3 J4 10 PTC11 J4A 4 <reserved> J4 8 PTB3 J4 8 PTE21 J4 8 PTC0 J4A 3 <reserved> J4 6 PTB2 J4 6 PTE20 J4 6 PTB11 J4A 2 <reserved> J4 4 PTB1 J4 4 PTE16 J4 4 PTC9 J4A 1 <reserved> J4 2 PTB0 J4 2 PTC0 J4 2 PTC8 Table 10. MCU connector pin assignments (“B” suffix) FRDM-GD3000 Header Pin FRDM-KL25Z Name Header Pin FRDM-KV10Z Port Header J1 Pin 1 FRDM-KV31F Port PTE24 Header J1 Pin 1 Port J1B 1 N/A J1 1 PTC7 PTC12 J1B 2 N/A J1 3 PTC0 J1 3 PTD7 J1 3 PTA13 J1B 3 N/A J1 5 PTC3 J1 5 PTE25 J1 5 PTC15 J1B 4 N/A J1 7 PTC4 J1 7 PTD0 J1 7 PTC16 J1B 5 N/A J1 9 PTC5 J1 9 PTD1 J1 9 PTC17 J1B 6 N/A J1 11 PTC6 J1 11 PTB0 J1 11 PTE2 J1B 7 N/A J1 13 PTC10 J1 13 PTE29 J1 13 PTE3 J2B 1 N/A J2 1 PTC12 J2 1 PTE18 J2 1 <NC> J2B 2 N/A J2 3 PTC13 J2 3 PTB1 J2 3 <NC> J2B 3 N/A J2 5 PTC16 J2 5 PTE19 J2 5 <NC> J2B 4 N/A J2 7 PTC17 J2 7 PTE17 J2 7 <NC> J2B 5 N/A J2 9 PTA16 J2 9 PTE30 J2 9 <NC> J2B 6 N/A J2 11 PTA17 J2 11 PTB3 J2 11 <NC> J2B 7 N/A J2 13 PTE31 J2 13 PTC6 J2 13 <NC> FRDM-GD3000EVB evaluation board, Rev. 3.0 14 NXP Semiconductors Getting to know the hardware Table 10. MCU connector pin assignments (“B” suffix) FRDM-GD3000 Header Pin FRDM-KL25Z Name Header J2 Pin 15 FRDM-KV10Z Port <NC> Header J2B 8 N/A J2 J2B 9 N/A J2 17 PTC6 J2 J2B 10 N/A J2 19 PTD7 J2 J3B 8 PWM2 J3 15 PTE5 J3 J3B 7 PWM1 J3 13 PTE4 J3 J3B 6 PWM0 J3 11 PTE3 J3 J3B 5 PWM3 J3 9 PTE2 J3 J3B 4 PWM4 J3 7 PTB11 J3B 3 PWM5 J3 5 PTB10 J3B 2 N/A J3 3 J3B 1 N/A J3 1 J4B 6 N/A J4 J4B 5 N/A J4 J4B 4 N/A J4B 3 N/A J4B 2 J4B 1 Pin 15 FRDM-KV31F Port Header Pin Port PTB0 J2 15 <NC> 17 PTE29 J2 17 <NC> 19 PTC7 J2 19 <NC> 15 PTC1 J3 15 PTC1 13 PTC2 J3 13 PTC2 11 PTC3 J3 11 PTC5 9 PTC4 J3 9 PTC4 J3 7 PTD4 J3 7 PTD4 J3 5 PTD5 J3 5 PTD5 PTB9 J3 3 PTA1 J3 3 PTB18 PTB8 J3 1 PTA2 J3 1 PTB19 11 PTE30 J4 11 PTE30 J4 11 DAC0_OUT 9 PTE29 J4 9 PTC5 J4 9 PTB21 J4 7 PTE23 J4 7 PTB2 J4 7 ADC1_DM0 J4 5 PTE22 J4 5 PTB3 J4 5 ADC0_DM0 N/A J4 3 PTE21 J4 3 PTE21 J4 3 ADC0_DM1 N/A J4 1 PTE20 J4 1 PTE20 J4 1 ADC0_DP1 FRDM-GD3000EVB evaluation board, Rev. 3.0 NXP Semiconductors 15 Getting to know the hardware Table 11. Gate drive connector pin assignments (“D” suffix) FRDM-GD3000 Header J1D Pin 1 FRDM-KL25Z Name Header Pin FRDM-KV10Z Port Header Pin FRDM-KV31F Port Header Pin Port DCB_POS N/A N/A N/A N/A N/A N/A N/A N/A N/A J1D 2 DCB_POS N/A N/A N/A N/A N/A N/A N/A N/A N/A J1D 3 PA_HS_S N/A N/A N/A N/A N/A N/A N/A N/A N/A J1D 4 PB_HS_S N/A N/A N/A N/A N/A N/A N/A N/A N/A J1D 5 PC_HS_S N/A N/A N/A N/A N/A N/A N/A N/A N/A J1D 6 PA_BOOT N/A N/A N/A N/A N/A N/A N/A N/A N/A J1D 7 PB_BOOT N/A N/A N/A N/A N/A N/A N/A N/A N/A J1D 8 PC_BOOT N/A N/A N/A N/A N/A N/A N/A N/A N/A J2D 1 PC_LS_S N/A N/A N/A N/A N/A N/A N/A N/A N/A J2D 2 PC_LS_G N/A N/A N/A N/A N/A N/A N/A N/A N/A J2D 3 PC_HS_G N/A N/A N/A N/A N/A N/A N/A N/A N/A J2D 4 PB_LS_S N/A N/A N/A N/A N/A N/A N/A N/A N/A J2D 5 PB_LS_G N/A N/A N/A N/A N/A N/A N/A N/A N/A J2D 6 PB_HS_G N/A N/A N/A N/A N/A N/A N/A N/A N/A J2D 7 PA_LS_S N/A N/A N/A N/A N/A N/A N/A N/A N/A J2D 8 PA_LS_G N/A N/A N/A N/A N/A N/A N/A N/A N/A J2D 9 PA_HS_G N/A N/A N/A N/A N/A N/A N/A N/A N/A J2D 10 <NC> N/A N/A N/A N/A N/A N/A N/A N/A N/A J3D 8 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A J3D 7 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A J3D 6 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A J3D 5 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A J3D 4 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A J3D 3 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A J3D 2 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A J3D 1 N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A J4D 6 OC_TH N/A N/A N/A N/A N/A N/A N/A N/A N/A J4D 5 AMP_P N/A N/A N/A N/A N/A N/A N/A N/A N/A J4D 4 AMP_N N/A N/A N/A N/A N/A N/A N/A N/A N/A J4D 3 AMP_OUT N/A N/A N/A N/A N/A N/A N/A N/A N/A J4D 2 <reserved> N/A N/A N/A N/A N/A N/A N/A N/A N/A J4D 1 <reserved> N/A N/A N/A N/A N/A N/A N/A N/A N/A FRDM-GD3000EVB evaluation board, Rev. 3.0 16 NXP Semiconductors Installing the software and setting up the hardware 4 Installing the software and setting up the hardware 4.1 General hardware setup Figure 7 shows the typical setup of the FRDM-GD3000EVB system. The FRDM-GD3000EVB connects to the top of any compatible FRDM board. Any FRDM-PWRSTG (a power stage board specifically designed for use with the GD3000 evaluation board) attaches to the top of the evaluation board. A power supply (typically 12 V to 48 V) connects to the screw terminal J5 on the power stage board. The FRDM board connects to the PC via a USB cable. A BLDC load is connected to J6 on the power stage board. The following procedure describes how to set up the hardware: 1. Solder the female headers into the top of the Freedom MCU board. If SPIGen is to be used, the FRDM-KL25Z must be used. 2. Connect the FRDM-GD3000EVB to the top of the Freedom MCU board. 3. Connect the FRDM-PWRSTG to the top of the FRDM-GD3000EVB. 4. Attach a load to the phase outputs (J6). 5. With the power supply OFF, attach it to the power input terminals (J5). 6. Connect the Freedom MCU board to the PC via the USB cable. To use SPIGen, the USB cable must be connected to the USBKL25Z port on the FRDM-KL25Z. Otherwise, in order to program the Freedom MCU board, the SDA port must be used. Note: The Freedom MCU board must first be configured as a FSD or regular MCU board. See the following sections for setup details. Three-phase motor Figure 7. Hardware Configuration FRDM-GD3000EVB evaluation board, Rev. 3.0 NXP Semiconductors 17 Installing the software and setting up the hardware 4.2 Using the FSD The FRDM-KL25Z provides an ideal support platform for the FRDM-GD3000EVB kit. In this configuration, the FRDM-KL25Z connects to a PC and allows the user—via the GUI—to control the inputs to the GD3000. However, SPIGen can only provide limited functionality. For more advanced evaluations, microcontroller code must be used. See Section 4.4 "Using MCU code", page 21. 4.2.1 Installing SPIGen The latest version of SPIGen is designed to run on any Windows 8, Windows 7, Vista or XP-based operating system. To install the software: 1. Go to www.nxp.com/SPIGen and download the latest version of SPIGen. 2. Run the install program from the desktop. The Installation Wizard guides the user through the rest of the process. 3. Go to www.nxp.com/FRDM-GD3000EVB and download the SPIGen configuration file. For additional information on using SPIGen, see the SPIGen 7 User Guide available at www.nxp.com/SPIGen 4.3 Preparing the FRDM-KL25Z for use as an FSD (Freedom SPI Dongle) Because the FRDM-KL25Z board has access to the KL25Z microcontroller’s USB, SPI, and parallel ports, it can be configured to serve as an FSD for the FRDM-GD3000EVB evaluation board. The main function of the FRDM-KL25Z in this configuration is to provide the evaluation board with a parallel port to communicate via a USB port with the SPIGen GUI on a PC. NOTE: If using SPIGen with the FRDM-GD3000EVB evaluation board, configure the FRDM-KL25Z as an FSD. A generic FRDM-KL25Z board does not have firmware installed to support the FRDM-GD3000EVB evaluation board. Prior to connecting the KL25Z to the evaluation board: • Install the FRDM-KL25Z board driver onto the PC. This causes the board to appear on the PC as a mass storage device (MSD) and enables installing microcode by dragging and dropping to the MSD icon. • Download the OpenSDA firmware onto the KL25Z. This enables OpenSDA functionality supporting firmware downloading and debugging. • Install the FRDM-GD3000EVB evaluation board firmware onto the KL25Z. This provides the communication interface between SPIGen and the MCU on the evaluation board. FRDM-GD3000EVB evaluation board, Rev. 3.0 18 NXP Semiconductors Installing the software and setting up the hardware 4.3.1 Installing the FRDM-KL25Z board driver 1. Connect the Standard A end of the USB cable to the PC. The board draws power through the USB port. While holding down the FRDM-KL25Z’s Reset button, attach the Mini-B end of the USB cable to the board’s OpenSDA USB port (labelled SDA on the board). The small LED above the OpenSDA port flashes green when the board is properly connected. 2. When properly connected through the OpenSDA port, the FRDM-KL25Z automatically loads the board driver. Subsequently, a Mass Storage Device (MSD) icon named “BOOTLOADER” appears as a device on the PC. FRDM-KL25Z MSD Icon Figure 8. FRDM-KL25Z board driver installed 4.3.2 Downloading the OpenSDA firmware 1. Go to the P&E Microcomputer Systems website at http://www.pemicro.com/opensda. 2. Login to the P&E Micro user account. If no account, create a new one to access the firmware. 3. Search for the OpenSDA Firmware panel, then click to download the P&E Micro zip file. 4. Open the zip file and locate the OpenSDA firmware file named MSD-DEBUG-FRDM-KL25Z_Pemico_vxxx.SDA. Unzip this file to the PC. 5. Verify the USB cable is connected to the OpenSDA USB port on the KL25Z. 6. Drag and drop MSD-DEBUG-FRDM-KL25Z_Pemicro_vxxx.SDA to the KL25Z BOOTLOADER icon on the PC. 7. Unplug the USB mini-plug, then re-insert the plug into the OpenSDA port. The green OpenSDA LED remains on and an MSD device named FRDM-KL25Z appears on the PC. FRDM-GD3000EVB evaluation board, Rev. 3.0 NXP Semiconductors 19 Installing the software and setting up the hardware Figure 9. Downloading OpenSDA firmware 4.3.3 Installing the FRDM-GD3000EVB evaluation board Firmware 1. Go to evaluation board tool summary page at www.nxp.com/FRDM-GD3000EVB. Click on Jump Start Your Design. Download the .srec file UsbSpiDongleKL25Z_GD3000. 2. Assure that the USB cable is connected to the OpenSDA USB port on the KL25Z. 3. Drag and drop the .srec file onto the FRDM-KL25Z icon that appears on your PC as a Mass Storage Device named FRDM-KL25Z. The microcode automatically installs on the FRDM-KL25Z board’s embedded flash memory The flashing green LED above the OpenSDA port indicates that the download is in process. When the firmware has been successfully installed, the green LED stops flashing and remains on. 4. To begin communicating with SPIGen, move the USB mini-plug from the KL25Z’s OpenSDA port to the KL25Z USB port. FRDM-GD3000EVB evaluation board, Rev. 3.0 20 NXP Semiconductors Installing the software and setting up the hardware Figure 10. Download the FRDM-GD3000EVB evaluation board .srec File 4.4 Using MCU code 4.4.1 Installing the IDE Install the preferred IDE (e.g. Codewarrior, Kinetis Design Studio, etc.) on the PC or use a web-based compiler (e.g. mbed). Use the compiler to program the MCU. 4.4.2 Configuring the FRDM-KL25Z as an MCU board 1. Connect the Standard A end of the USB cable to the PC. The board draws power through the USB port. While holding down the FRDM-KL25Z’s Reset button, attach the Mini-B end of the USB cable to the board’s OpenSDA USB port (labelled SDA on the board). The small LED above the OpenSDA port flashes green when the board is properly connected. 2. When properly connected through the OpenSDA port, the FRDM-KL25Z automatically loads the board driver. Subsequently, a Mass Storage Device (MSD) icon named “BOOTLOADER” appears as a device on the PC. FRDM-GD3000EVB evaluation board, Rev. 3.0 NXP Semiconductors 21 Installing the software and setting up the hardware Figure 11. FRDM-KL25Z board driver installed 1. Go to the P&E Microcomputer Systems website at http://www.pemicro.com/opensda. 2. Login to the P&E Micro user account. When there is no account, create one to access the firmware. 3. Search for the OpenSDA Firmware panel, then click to download the P&E Micro zip file. 4. Open the zip file and locate the OpenSDA firmware file named MSD-DEBUG-FRDM-KL25Z_Pemico_vxxx.SDA. Unzip this file to the PC. 5. Assure the USB cable is connected to the OpenSDA USB port on the KL25Z. 6. Drag and drop MSD-DEBUG-FRDM-KL25Z_Pemicro_vxxx.SDA to the KL25Z BOOTLOADER icon on the PC. 7. Unplug the USB mini-plug, then re-insert the plug into the OpenSDA port. The green OpenSDA LED remains on and an MSD device named FRDM-KL25Z appears on the PC. FRDM-GD3000EVB evaluation board, Rev. 3.0 22 NXP Semiconductors Installing the software and setting up the hardware Figure 12. Downloading OpenSDA firmware FRDM-GD3000EVB evaluation board, Rev. 3.0 NXP Semiconductors 23 Evaluation board examples 5 Evaluation board examples The evaluation board is designed to work in conjunction with many of NXP’s FRDM boards and allows several different ways of controlling the inputs to the evaluation board. The setup for these enablement boards is described in Section 4.1 "General hardware setup", page 17. The following section provides a simple example using SPIGen. 5.1 SPIGen example The example is NOT tuned for a motor. It simply introduces the user to a limited set of functions of the GD3000. While other loads may be used for this example, it is specifically designed to be used with an LED configuration, as shown in Figure 13. The LEDs indicate which direction the current flows. Figure 13. Example configuration FRDM-GD3000EVB evaluation board, Rev. 3.0 24 NXP Semiconductors Evaluation board examples 5.2 Setting up SPIGen to use with the GD3000 To use SPIGen with the GD3000, follow these instructions: 1. Plug the USB mini-plug into the USBKL25Z port on the FRDM-KL25Z. 2. Run the SPIGen program, previously installed. SPIGen opens to the page shown in Figure 14. Figure 14. Generic SPIGen Tab 3. Click File -> Open and open the FRDM-GD3000EVB.spi file. FRDM-GD3000EVB evaluation board, Rev. 3.0 NXP Semiconductors 25 Evaluation board examples 4. Under Settings (Figure 15), make sure the configuration of the SPI protocol is correct. The GD3000 uses Type 2 (Figure 16). Figure 15. SPIGen settings Figure 16. SPIGen SPI Type and other settings FRDM-GD3000EVB evaluation board, Rev. 3.0 26 NXP Semiconductors Evaluation board examples 5.2.1 Using the SPIGen Generic tab The Generic tab configures and sends commands to the GD3000 device. It is active when SPIGen starts up and can be activated thereafter by clicking to expand the Generic folder in the Device View panel. The Generic tab sends either a single command or a batch of commands to the device. 1. To send single commands to the device, click on Single Command under Generic in the Device View panel. See Figure 17. Figure 17. SPIGen single commands FRDM-GD3000EVB evaluation board, Rev. 3.0 NXP Semiconductors 27 Evaluation board examples 2. To send batch commands to the device, click on Batch Commands under Generic in the Device View panel. See Figure 18. Figure 18. SPIGen batch commands 3. To run a batch command, select the appropriate batch command, as shown in Figure 19. Figure 19. SPIGen select batch command FRDM-GD3000EVB evaluation board, Rev. 3.0 28 NXP Semiconductors Evaluation board examples 4. Once selected, the batch command can be sent once (Figure 20) or continuously (Figure 21). Figure 20. SPIGen Sending single batch commands Figure 21. SPIGen sending batch commands continuously FRDM-GD3000EVB evaluation board, Rev. 3.0 NXP Semiconductors 29 Evaluation board examples 5. The Send Once operation stops automatically when the batch commands have been sent once (Figure 22). If Send Continuously is selected, the batch command sequence must be stopped manually (Figure 23). Figure 22. SPIGen stopping single batch commands Figure 23. SPIGen stopping batch commands FRDM-GD3000EVB evaluation board, Rev. 3.0 30 NXP Semiconductors Evaluation board examples 5.2.2 Using the SPIGen GD3000 Register tab Alternatively, the GD3000 Reg tab may be used to read and write to registers and to toggle gates on the GD3000 device. 1. To access the GD300 Register tab, click to open the GD3000 folder in the Device View panel, then click on the GD3000 Reg icon. See Figure 24. Figure 24. SPIGen GD3000 main page FRDM-GD3000EVB evaluation board, Rev. 3.0 NXP Semiconductors 31 Evaluation board examples 2. To initialize the device, set Reset to Yes and Enable to No, then select the INIT button. The MCU automatically initializes the GD3000 driver (Figure 25). Figure 25. SPIGen GD3000 Init function 3. To write to registers, select which bits to write and then click Write. To read from registers, simply click the Read button. Follow the specifications in the GD3000 data sheet when reading from and writing to the registers. 4. To toggle the gates, do one of the following: a) Use the batch commands under the generic tab. b) Use the PWM function by setting the frequency and using the Start and Stop buttons. c) Toggle manually, by using the parallel output buttons on the GD3000 tab. FRDM-GD3000EVB evaluation board, Rev. 3.0 32 NXP Semiconductors PUMP_VPWR DCB_POS PC_HS_S PB_HS_S OC_OUT INT RST_B EN VIN 3V3 5V VLS VDD VLS_CAP IOREF PA_HS_S 6.65K 6.65K 6.65K IOREF PB_LS PC_LS AGND1 OC_TH AMP_OUT INT OC_OUT AMP_N AMP_P PC_HS_B PB_HS_B RST_B EN1 PHASE_C PHASE_B PA_HS_B PA_LS DGND2 DGND3 PHASE_A TOTEM_PC TOTEM_PB TOTEM_PA CLK_0 MISO_0 MOSI_0 CS3_0 DGND1 PUMP DCB_POS VIN 3V3 5V VLS_CAP VLS VDD R14 R15 R16 R17 R18 RST_B CS MOSI MISO CLK R12 TOTEM_PC TOTEM_PB OC_TH AMP_OUT AMP_N AMP_P HS_C HS_B HS_A LS_C LS_B LS_A R7 R9 R11 R3 R5 EN TOTEM_PA TOTEM_PB TOTEM_PC INT OC_OUT TOTEM_PA CLK SO SI CS 10K 10K 10K 10K R19 R20 R21 R22 Place close to driver TEST POINTS R6 R8 R10 TOTEM_PA_PRE TOTEM_PB_PRE TOTEM_PC_PRE 6.65K 6.65K 0 0 0 0 IO0 INT2 INT3 INT4 INT0 INT1 AREF RESERVED RESERVED 1 2 3 4 5 6 7 8 9 10 1 2 3 4 5 6 7 8 J2A J1A J2D J1D 1 2 3 4 5 6 7 8 9 10 1 2 3 4 5 6 7 8 PC_LS_S PC_LS_G PC_HS_G PB_LS_S PB_LS_G PB_HS_G PA_LS_S PA_LS_G PA_HS_G PA_HS_S PB_HS_S PC_HS_S PA_BOOT PB_BOOT PC_BOOT * JUMPERS DCB_POS R26 8 7 6 5 4 3 2 1 J4D JP3 6 5 4 3 2 1 HDR 1X3 10K 0 1 2 3 10K R27 0 R31 PWM1 PWM4 R24 PB_HS_B PB_LS R30 HDR 1X3 0 JP2 1 2 3 0 PWM2 PWM1 PWM0 PWM3 PWM4 PWM5 RESERVED RESERVED * RESERVED RESERVED OC_TH AMP_P AMP_N AMP_OUT 0.1uF 100V C14 DCB_POS VLS_CAP C16 0.1uF 100V VLS_CAP C15 2.2uF 100V 0.1uF 100V DNP C21 DCB_POS 3 VIN DNP VOUT U2 LM317D2T 4 1.6K DNP R34 270 DNP R33 1uF 50V DNP C22 VIN Optional on-board 5V supply to FRDM circuit (DNP by default) POWER 2.2uF 100V C13 DCB_POS 2.2uF 100V C17 VLS J3A J4A 8 7 6 5 4 3 2 1 6 5 4 3 2 1 0.1uF 100V C18 VLS PWM2 R28 PWM5 R25 PC_HS_B PC_LS J3B POWER SUPPLY FILTERING PWM0 PWM3 R23 PA_HS_B PA_LS (1-2) Separate HS mode (2-3) LS and HS linked mode JUMPERS RESERVED 0 IO1 CS3_0 0 MOSI_0 0 MISO_0 0 CLK_0 0 RESERVED RESERVED 0 0 2.2uF 100V C19 VDD 0 0 JP4 IOREF 3V3 10K 0.1uF 100V C20 VDD HDR 1X3 1 2 3 R32 5V VIN RESERVED RESERVED RESERVED RESERVED RESERVED RESERVED 1 1 2 3 DCB_POS PUMP_VPWR 0.1uF 100V C7 2.2uF 100V C8 2N7002 649.0 R13 Q1 1uF 50V C12 PUMP_VPWR 2 BAT54SWT1G 0.1uF 100V C9 D3 DCB_POS 1 Optional PUMP circuit (enabled by default) HDR 1X3 JP1 (1-2) no PUMP (2-3) PUMP VLS LED_GRN D1 DCB_POS A 3 C 2 R2 R4 VLS Indicator RST_B EN 9 8 7 6 5 4 2 4 6 14 13 12 11 10 HDR_2X3 JP5 1 3 2 remove all if no PUMP 1 3 5 TOTEM_PA_PRE VLS PA_BOOT PA_HS_G PUMP NC_13 RST EN2 EN1 PGND PHASEA NC_7 VPWR NC_5 VLS NC_3 NC_2 PA_BOOT U1 470PF 50V DNP C1 470PF 50V DNP C2 PA_LS_S INT_PRE OC_OUT_PRE 0 PB_BOOT R1 0.1uF 100V 2.2uF 100V C11 DCB_POS C10 PB_HS_G GATE DRIVER 470PF 50V DNP C3 VDD PB_LS_G Digital GND to analog GND 470PF 50V DNP C4 PC_BOOT This board attaches to the TOP of the FRDM MCU board. The FRDM-PWRSTGxEVB board attaches to the TOP of this board. ADJ 1 3 57 EP 56 PA_HS_G VPUMP 15 PA_HS_S 55 PA_LS_G 17 PA_HS_S VSUP 16 54 PA_LS_G 53 PA_LS_S 18 TOTEM_PB_PRE PHASEB PB_HS_S 19 TOTEM_PC_PRE NC_17 52 PB_BOOT 51 PB_HS_G PA_HS 20 PA_HS_B PHASEC 50 PB_HS_S PA_LS 21 PA_LS 49 PB_LS_G PC_HS_G PB_LS_S 470PF 50V DNP C5 23 PB_HS_B VDD 22 48 PB_LS_S PC_HS_S 24 PB_LS PB_HS 47 PC_BOOT PC_LS_G 25 INT_PRE PB_LS 46 PC_HS_G 26 CS INT PC_LS_S 43 29 30 31 32 33 34 35 36 37 38 39 40 41 42 MC34GD3000EP SO PC_LS PC_HS AMP_OUT AMP_N AMP_P OC_OUT OC_TH VSS GND1 GND2 VLS_CAP NC_41 NC_42 470PF 50V DNP C6 PC_LS_S 45 PC_HS_S CS 44 PC_LS_G SI 27 MOSI SCLK 28 CLK NXP Semiconductors 1.0K R29 MISO PMEG3020EH,115 D2 IOREF PC_LS PC_HS_B AMP_OUT AMP_N AMP_P OC_OUT_PRE OC_TH VLS_CAP C 6 A FRDM INTERFACE Schematic Schematic Figure 26. Schematic FRDM-GD3000EVB evaluation board, Rev. 3.0 33 Silkscreen 7 Silkscreen FRDM-GD3000EVB evaluation board, Rev. 3.0 34 NXP Semiconductors Bill of Materials 8 Bill of Materials Table 12. Bill of Materials (2) Item Qty Schematic Label Value Description Part Number Assy Opt Active Components U1 NXP IC 3PH FET PRE-DRV 6-58V QFN56 MC33GD3000 (3) U2 IC VREG 1.2-37V 1.5A D2PAK LM317D2TG (4) 1 Q1 TRAN NMOS SW 300mA 60V SOT23 2N7002,215 (4) 4 1 D1 LED BRIGHT GRN SGL 30mA 0603 150060VS75000 5 1 D2 DIODE SCH PWR RECT 2A 30V AEC-Q101 SOD123F PMEG3020EH,115 6 1 D3 DIODE SCH DUAL 200MA 30V SOT323 BAT54SWT1G 1 1 Voltage Regulator 2 1 Transistor 3 Diodes Capacitors 7 6 C1, C2, C3, C4, C5, C6 470 PF CAP CER 470PF 50V 10% X7R 0603 06035C471KAT2A 8 7 C7, C9, C10, C14, C16, C18, C20 0.1 F CAP CER 0.1uF 100V X7R 10% 0603 GRM188R72A104KA35D 9 6 C8, C11, C13, C15, C17, C19 2.2 F CAP CER 2.2UF 100V 10% X7R 1210 GRM32ER72A225KA35L 10 1 C12 1.0 F CAP CER 1uF 50V 10% X7R AEC-Q200 0805 GCM21BR71H105KA03 11 1 C21 0.1 F CAP CER 0.1uF 100V X7R 10% 0603 GRM188R72A104KA35D (4) 12 1 C22 1.0 F CAP CER 1uF 50V 10% X7R AEC-Q200 0805 GCM21BR71H105KA03 (4) 13 1 R1 0 RES MF ZERO OHM 1/8W -- 0805 RC0805JR-070RL 14 5 R2, R4, R6, R8, R10 6.65 k RES MF 6.65K 1/10W 1% 0603 RK73H1JTTD6651F RES MF ZERO OHM 1/10W -- 0603 CR0603J/000ELF RES MF 649.0 OHM 1/10W 1% 0603 RK73H1JTTD6490F RES MF 10K 1/10W 5% 0603 RK73B1JTTD103J (4) Resistors R3, R5, R7, R9, R11, R12, R14, R15, R16, R17, 0 R18, R23, R24, R25, R26, R27, R28 15 17 16 1 17 7 18 1 R29 1.0 k RES MF 10.0 K 1/10 W 1% 0603 RK73H1JTTD1001F 19 1 R33 270 RES MF 270 1/10W 5% 0603 RK73B1JTTD271J (4) 20 1 R34 1.6 k RES MF 1.6K 1/10W 1% 0603 RK73H1JTTD1601F (4) R13 649 R19, R20, R21, 10 k R22, R30, R31, R32 Switches, Connectors, Jumpers, and Test Points 21 4 DGND1, AGND1, DGND2, DGND3 TEST POINT BLACK 40 MIL DRILL 180 MIL TH 109L 5001 FRDM-GD3000EVB evaluation board, Rev. 3.0 NXP Semiconductors 35 Bill of Materials Table 12. Bill of Materials (2) Item Qty Schematic Label 22 4 OC_TH, AMP_P, AMP_OUT, AMP_N 23 4 SO, SI, CS, CLK 24 9 5V, 3V3, VLS_CAP, VLS,VIN, VDD, PUMP, IOREF, DCB_POS 25 2 26 Value Description TEST POINT ORANGE 40 MIL DRILL 180 MIL TH Part Number Assy Opt 5003 TEST POINT GREY 40 MIL DRILL 180 MIL TH 120L 5118 TEST POINT RED 40 MIL DRILL 180 MIL TH 109L 5000 EN1, RST_B TEST POINT GREEN 40 MIL DRILL 180 MIL TH 120L 5116 3 HS_C, HS_B, HS_A TEST POINT PURPLE 40 MIL DRILL 180 MIL TH 120L 5119 27 2 OC_OUT, INT TEST POINT YELLOW 40 MIL DRILL 180 MIL TH 5004 28 4 JP1, JP2, JP3, JP4 HDR 1x3 TH 100MIL SP 343H SN 100L TSW-103-07-T-S 29 1 JP5 HDR 2X3 TH 100MIL CTR 343H SN 100L TSW-103-07-T-D 30 3 J1A, J3B, J3A CON 1X8 SKT TH 100MIL SP 340H AU 394L SSQ-108-23-F-S 31 1 J1D CON 1X8 SKT TH 100MIL SP 340H AU 104L SSQ-108-21-G-S 32 1 J2A CON 1X10 SKT TH 100MIL SP 340H AU 394L SSQ-110-23-F-S 33 1 J2D CON 1X10 SKT TH 100MIL SP 340H AU 104L SSQ-110-21-G-S 34 1 J4A CON 1X6 SKT TH 100MIL SP 340H AU 394L SSQ-106-23-F-S 35 1 J4D CON 1X6 SKT TH 100MIL SP 335H AU 104L SSW-106-01-G-S 36 3 LS_C, LS_B, LS_A TEST POINT BLUE 40 MIL DRILL 180 MIL TH 120L 5117 37 3 PHASE_C, PHASE_B, PHASE_A TEST POINT WHITE 40 MIL DRILL 180 MIL TH 109L 5002 38 3 TOTEM_PC, TOTEM_PB, TOTEM_PA TEST POINT BROWN 40 MIL DRILL 180 MIL TH 120L 5115 Notes: 2. 3. 4. NXP does not assume liability, endorse, or warrant components from external manufacturers that are referenced in circuit drawings or tables. While NXP offers component recommendations in this configuration, it is the customer’s responsibility to validate their application. Critical components. For critical components, it is vital to use the manufacturer listed. Do not populate FRDM-GD3000EVB evaluation board, Rev. 3.0 36 NXP Semiconductors Accessory Item Bill of Materials 9 Accessory Item Bill of Materials Table 13. Bill of Materials (5) Item Qty. Part Number Description 1 1 FRDM-Kxxxx MCU Board Any compatible FRDM board 2 1 FRDM-PWRSTG Any power stage board. This board includes the MOSFET the GD3000 may drive. There are several different boards for various applications. Notes: 5. NXP does not assume liability, endorse, or warrant components from external manufacturers that are referenced in circuit drawings or tables. While NXP offers component recommendations in this configuration, it is the customer’s responsibility to validate their application. FRDM-GD3000EVB evaluation board, Rev. 3.0 NXP Semiconductors 37 References 10 References Following are URLs where you can obtain information on related NXP products and application solutions: NXP.com Support Pages Description URL FRDM-GD3000EVB Tool Summary Page www.nxp.com/FRDM-GD3000EVB GD3000 Product Summary Page www.nxp.com/GD3000 FRDM-KL25Z Tool Summary Page www.nxp.com/FRDM-KL25Z FRDM-KV10Z Tool Summary Page www.nxp.com/FRDM-KV10Z FRDM-KV31F Tool Summary Page www.nxp.com/FRDM-KV31F 10.1 Support Visit www.nxp.com/support for a list of phone numbers within your region. 10.2 Warranty Visit www.nxp.com/warranty to submit a request for tool warranty. FRDM-GD3000EVB evaluation board, Rev. 3.0 38 NXP Semiconductors Revision history 11 Revision history Revision Date 1.0 10/2015 • Initial release 11/2015 • Added SPIGen Register tab section 2.0 3.0 11/2015 5/2016 Description of Changes • Fixed typo in Section 4.3.3 • Fixed typo in Table 9 and Table 10 • In Section 3.12 and Section 3.13, added note to remove 0 resistor on pin 40 of FRDM-KV10Z to allow access to EN signal • In Figure 7 and Figure 13, replaced product specific power supply image with generic power supply image • Updated document form and style to NXP format FRDM-GD3000EVB evaluation board, Rev. 3.0 NXP Semiconductors 39 How to Reach Us: Information in this document is provided solely to enable system and software implementers to use NXP products. Home Page: NXP.com There are no expressed or implied copyright licenses granted hereunder to design or fabricate any integrated circuits Web Support: http://www.nxp.com/support products herein. based on the information in this document. NXP reserves the right to make changes without further notice to any NXP makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does NXP assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation, consequential or incidental damages. "Typical" parameters that may be provided in NXP data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including "typicals," must be validated for each customer application by the customer's technical experts. NXP does not convey any license under its patent rights nor the rights of others. NXP sells products pursuant to standard terms and conditions of sale, which can be found at the following address: http://www.nxp.com/terms-of-use.html. NXP, the NXP logo, Freescale, the Freescale logo and SMARTMOS are trademarks of NXP B.V. All other product or service names are the property of their respective owners. All rights reserved. © 2016 NXP B.V. Document Number: KTFRDMGD3000UG Rev. 3.0 5/2016