Freescale Semiconductor Inc PART INFORMATION Mfg Item Number Mfg Item Name MCIMX27LVOP4AR2 TMAP 404 17SQ*0.7P0.65 SUPPLIER Company Name Company Unique ID Response Date Response Document ID Contact Name Contact Title Contact Phone Contact Email Authorized Representative Representative Title Representative Phone Representative Email URL for Additional Information Freescale Semiconductor Inc 14-141-7928 2016-05-23 5343K11153D015A1.28 Freescale Semiconductor Inc Product Technical Support 1-800-521-6274 [email protected] Daniel Binyon EPP Customer Response 512-895-3406 [email protected] www.freescale.com DECLARATION EU RoHS Pb Free HalogenFree Plating Indicator EU RoHS Exemption(s) MANUFACTURING Mfg Item Number Mfg Item Name Version Weight UoM Unit Volume J-STD-020 MSL Rating Peak Processing Temperature Max Time at Peak Temperature Number of Processing Cycles Yes Yes Yes e1 MCIMX27LVOP4AR2 TMAP 404 17SQ*0.7P0.65 ALL 0.642750 g EACH 3 260 C 40 seconds 3 RoHS RoHS Directive RoHS Definition RoHS Legal Definition RoHS Declaration Supplier Acceptance Signature Exemption List Version List of Freescale Accepted Exemptions 2011/65/EU RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states) of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of Sale applicable to such part(s) shall apply. 1 - Item(s) do not contain RoHS restricted substances per the definition above Accepted Daniel Binyon 2012/51/EU 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight 6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight 6(c) : Copper alloy containing up to 4% lead by weight 7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) 7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for telecommunications 7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher 7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC 7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors 15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages MATERIAL COMPOSITION Homogeneous Material Weight SubstanceClass Substance CAS Non-Conductive Epoxy/Adhesive 0.0169 Non-Conductive Epoxy/Adhesive Plastics/polymers Proprietary Material-Other Epoxy resins - 0.0012675 g Non-Conductive Epoxy/Adhesive Plastics/polymers Crosslinked acrylate polymer 25767-43-5 0.00338 g Non-Conductive Epoxy/Adhesive Plastics/polymers Other polymers - 0.0012675 Non-Conductive Epoxy/Adhesive Plastics/polymers Proprietary Material-Other polymers - Non-Conductive Epoxy/Adhesive Glass Silica, vitreous 60676-86-0 Solder Balls - Lead Free Exemption SubstanceWeight UoM SubPart PPM SubPart% ARTICLEPPM ARTICLE% 75000 7.5 1971 0.1971 200000 20 5258 0.5258 g 75000 7.5 1971 0.1971 0.00338 g 200000 20 5258 0.5258 0.007605 g 450000 45 11831 1.1831 g 0.0498 g Solder Balls - Lead Free Metals Aluminum, metal 7429-90-5 0.00000154 g 31 0.0031 2 0.0002 Solder Balls - Lead Free Antimony/Antimony Compounds Antimony (metallic) 7440-36-0 0.00000623 g 125 0.0125 9 0.0009 Solder Balls - Lead Free Arsenic/Arsenic Compounds Arsenic 7440-38-2 0.00000309 g 62 0.0062 4 0.0004 Solder Balls - Lead Free Bismuth/Bismuth Compounds Bismuth 7440-69-9 0.00000936 g 188 0.0188 14 0.0014 Solder Balls - Lead Free Cadmium/Cadmium Compounds Cadmium 7440-43-9 0.0000006 g 12 0.0012 0 0 Solder Balls - Lead Free Metals Copper, metal 7440-50-8 0.000249 g 5000 0.5 387 0.0387 Solder Balls - Lead Free Metals Gold, metal 7440-57-5 0.00000309 g 62 0.0062 4 0.0004 Solder Balls - Lead Free Metals Indium, metal 7440-74-6 0.00000309 g 62 0.0062 4 0.0004 Solder Balls - Lead Free Solvents, additives, and other materials Sulfur 7704-34-9 0.0000003 g 6 0.0006 0 0 Solder Balls - Lead Free Solvents, additives, and other materials Phosphorus, elemental (not containing red allotrope) 7723-14-0 0.00000309 g 62 0.0062 4 0.0004 Solder Balls - Lead Free Metals Iron, metal 7439-89-6 0.00000623 g 125 0.0125 9 0.0009 Solder Balls - Lead Free Lead/Lead Compounds Lead 7439-92-1 0.00001564 g 314 0.0314 24 0.0024 Solder Balls - Lead Free Nickel (external applications only) Nickel 7440-02-0 0.00000154 g 31 0.0031 2 0.0002 Solder Balls - Lead Free Metals Silver, metal 7440-22-4 0.00049795 g 9999 0.9999 774 0.0774 Solder Balls - Lead Free Metals Tin, metal 7440-31-5 0.0489983 g 983902 98.3902 76232 7.6232 Solder Balls - Lead Free Metals Zinc, metal 7440-66-6 0.00000095 g 19 0.0019 1 0.0001 Die Encapsulant, Halogen-free 0.3483 g Die Encapsulant, Halogen-free Solvents, additives, and other materials Acrylonitrile/Butadiene copolymer, carboxyl terminated (26/74) 68891-46-3 0.00017415 g 500 0.05 270 0.027 Die Encapsulant, Halogen-free Metals Proprietary Material-Other aluminum compounds - 0.003483 g 10000 1 5418 0.5418 Die Encapsulant, Halogen-free Plastics/polymers Other Epoxy resins - 0.0087075 g 25000 2.5 13547 1.3547 Die Encapsulant, Halogen-free Plastics/polymers Proprietary Material-Other Epoxy resins - 0.0087075 g 25000 2.5 13547 1.3547 Die Encapsulant, Halogen-free Solvents, additives, and other materials Carbon Black 1333-86-4 0.0017415 g 5000 0.5 2709 0.2709 Die Encapsulant, Halogen-free Plastics/polymers Proprietary Material-Other phenolic resins - 0.013932 g 40000 4 21675 2.1675 Die Encapsulant, Halogen-free Glass Silicon dioxide 7631-86-9 0.06966 g 200000 20 108378 10.8378 Die Encapsulant, Halogen-free Glass Silica, vitreous 60676-86-0 0.24189435 g 694500 69.45 376366 37.6366 Silicon Semiconductor Die 0.01305 g Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.000261 g 20000 2 406 0.0406 Silicon Semiconductor Die Glass Silicon, doped - 0.012789 g 980000 98 19897 1.9897 Bonding Wire, PdCu 0.0081 g Bonding Wire, PdCu Metals Copper, metal 7440-50-8 0.00800278 g 987998 98.7998 12450 1.245 Bonding Wire, PdCu Metals Palladium, metal 7440-05-3 0.00009722 g 12002 1.2002 151 0.0151 Organic Substrate 0.2066 g Organic Substrate Metals Barium sulfate 7727-43-7 0.01151113 g 55717 5.5717 17909 1.7909 Organic Substrate Metals Copper, metal 7440-50-8 0.04672114 g 226143 22.6143 72689 7.2689 Organic Substrate Plastics/polymers Epikote 862 28064-14-4 0.01807543 g 87490 8.749 28122 2.8122 Organic Substrate Plastics/polymers Formaldehyde, polymer with 2-methylphenol, glycidyl ether 64425-89-4 0.01783392 g 86321 8.6321 27746 2.7746 Organic Substrate Metals Gold, metal 7440-57-5 0.00062311 g 3016 0.3016 969 0.0969 Organic Substrate Nickel (external applications only) Nickel 7440-02-0 0.00486626 g 23554 2.3554 7570 0.757 Organic Substrate Plastics/polymers Phenol, polymer with formaldehyde 9003-35-4 0.00987052 g 47776 4.7776 15356 1.5356 Organic Substrate Glass Fibrous-glass-wool 65997-17-3 0.06045695 g 292628 29.2628 94059 9.4059 Organic Substrate Glass Silicon dioxide 7631-86-9 0.00518194 g 25082 2.5082 8062 0.8062 Organic Substrate Solvents, additives, and other materials Other Aromatic carbonyl compounds - 0.00184804 g 8945 0.8945 2875 0.2875 Organic Substrate Metals Aluminum Hydroxide 21645-51-2 0.02961156 g 143328 14.3328 46070 4.607 LINKS MCD LINK NXP website GENERAL ENVIRONMENTAL COMPLIANCE LINKS RoHS signed letter China RoHS REACH signed letter ELV signed letter Conflict Minerals statement NXP ENVIRONMENTAL INFORMATION Environmental Compliance website FAQ Technical Service Request LINKS TO BLANK IPC1752 FORMS Blank IPC1752 v1.1 Form http://www.nxp.com http://www.nxp.com/files/corporate/doc/support_info/NXP-ROHS-DECLARATION.pdf http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/china-rohs:ENV_CHINA_ROHS_STRATEGY http://www.nxp.com/files/corporate/doc/support_info/NXP-REACH-STATEMENT.pdf http://www.nxp.com/files/corporate/doc/support_info/NXP-ELV-STATEMENT.pdf http://www.nxp.com/files/corporate/doc/support_info/NXP-STATEMENT-CONFLICT-MINERALS.pdf http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization:ABUENVPRFPRDX http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/eco-product-faqs:ENVIRON_FAQ http://www.nxp.com/support/sales-and-support:SUPPORTHOME http://www.NXP.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf IPC1752 XML LINKS http://www.freescale.com/mcds/MCIMX27LVOP4AR2_IPC1752_v11.xml http://www.freescale.com/mcds/MCIMX27LVOP4AR2_IPC1752A.xml