Freescale Semiconductor Inc PART INFORMATION Mfg Item Number Mfg Item Name MCF54451VM240 MAPBGA 256 17*17*1.6P1.0 SUPPLIER Company Name Company Unique ID Response Date Response Document ID Contact Name Contact Title Contact Phone Contact Email Authorized Representative Representative Title Representative Phone Representative Email URL for Additional Information Freescale Semiconductor Inc 14-141-7928 2016-04-05 5246K00022D072A1.40 Freescale Semiconductor Inc Product Technical Support 1-800-521-6274 [email protected] Daniel Binyon EPP Customer Response 512-895-3406 [email protected] www.freescale.com DECLARATION EU RoHS Pb Free HalogenFree Plating Indicator EU RoHS Exemption(s) MANUFACTURING Mfg Item Number Mfg Item Name Version Weight UoM Unit Volume J-STD-020 MSL Rating Peak Processing Temperature Max Time at Peak Temperature Number of Processing Cycles Yes Yes Yes e1 MCF54451VM240 MAPBGA 256 17*17*1.6P1.0 ALL 0.785300 g EACH 3 260 C 40 seconds 3 RoHS RoHS Directive RoHS Definition RoHS Legal Definition RoHS Declaration Supplier Acceptance Signature Exemption List Version List of Freescale Accepted Exemptions 2011/65/EU RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states) of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of Sale applicable to such part(s) shall apply. 1 - Item(s) do not contain RoHS restricted substances per the definition above Accepted Daniel Binyon 2012/51/EU 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight 6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight 6(c) : Copper alloy containing up to 4% lead by weight 7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) 7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for telecommunications 7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher 7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC 7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors 15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages MATERIAL COMPOSITION Homogeneous Material Weight SubstanceClass Substance CAS Solder Balls - Lead Free 0.1304 SubPart% ARTICLEPPM ARTICLE% Solder Balls - Lead Free Metals Aluminum, metal 7429-90-5 0.00000404 g Solder Balls - Lead Free Antimony/Antimony Compounds Antimony (metallic) 7440-36-0 0.0000163 g 31 0.0031 5 0.0005 125 0.0125 20 Solder Balls - Lead Free Arsenic/Arsenic Compounds Arsenic 7440-38-2 0.00000965 0.002 g 74 0.0074 12 Solder Balls - Lead Free Bismuth/Bismuth Compounds Bismuth 7440-69-9 0.0012 0.00002438 g 187 0.0187 31 Solder Balls - Lead Free Cadmium/Cadmium Compounds Cadmium 0.0031 7440-43-9 0.00000156 g 12 0.0012 1 Solder Balls - Lead Free Metals 0.0001 Copper, metal 7440-50-8 0.00065122 g 4994 0.4994 829 Solder Balls - Lead Free 0.0829 Metals Gold, metal 7440-57-5 0.00000808 g 62 0.0062 10 0.001 Solder Balls - Lead Free Metals Indium, metal 7440-74-6 0.00000808 g 62 0.0062 10 0.001 Solder Balls - Lead Free Solvents, additives, and other materials Sulfur 7704-34-9 0.00000078 g 6 0.0006 0 0 Solder Balls - Lead Free Solvents, additives, and other materials Phosphorus, elemental (not containing red allotrope) 7723-14-0 0.00000808 g 62 0.0062 10 0.001 Solder Balls - Lead Free Metals Iron, metal 7439-89-6 0.0000163 g 125 0.0125 20 0.002 Solder Balls - Lead Free Lead/Lead Compounds Lead 7439-92-1 0.0000489 g 375 0.0375 62 0.0062 Solder Balls - Lead Free Nickel (external applications only) Nickel 7440-02-0 0.00000404 g 31 0.0031 5 0.0005 Solder Balls - Lead Free Metals Silver, metal 7440-22-4 0.00520987 g 39953 3.9953 6634 0.6634 Solder Balls - Lead Free Metals Tin, metal 7440-31-5 0.12438624 g 953882 95.3882 158393 15.8393 Solder Balls - Lead Free Metals Zinc, metal 7440-66-6 0.00000248 g 19 0.0019 3 0.0003 Non-Conductive Epoxy/Adhesive Exemption SubstanceWeight UoM SubPart PPM g 0.0105 g Non-Conductive Epoxy/Adhesive Plastics/polymers Proprietary Material-Other Epoxy resins - 0.0007875 g 75000 7.5 1002 0.1002 Non-Conductive Epoxy/Adhesive Plastics/polymers Crosslinked acrylate polymer 25767-43-5 0.0021 g 200000 20 2674 0.2674 Non-Conductive Epoxy/Adhesive Plastics/polymers Other polymers - 0.0007875 g 75000 7.5 1002 0.1002 Non-Conductive Epoxy/Adhesive Plastics/polymers Proprietary Material-Other polymers - 0.0021 g 200000 20 2674 0.2674 Non-Conductive Epoxy/Adhesive Glass Silica, vitreous 60676-86-0 0.004725 g 450000 45 6016 0.6016 Silicon Semiconductor Die 0.0933 g Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.001866 g 20000 2 2376 0.2376 Silicon Semiconductor Die Glass Silicon, doped - 0.091434 g 980000 98 116431 11.6431 Die Encapsulant, Halogen-free 0.342 g Die Encapsulant, Halogen-free Metals Other aluminum compounds - 0.01026 g 30000 3 13065 1.3065 Die Encapsulant, Halogen-free Solvents, additives, and other materials Carbon Black 1333-86-4 0.00342 g 10000 1 4355 0.4355 Die Encapsulant, Halogen-free Plastics/polymers Phenol, polymer with formaldehyde 9003-35-4 0.01026 g 30000 3 13065 1.3065 Die Encapsulant, Halogen-free Plastics/polymers Other phenolic resins - 0.01026 g 30000 3 13065 1.3065 Die Encapsulant, Halogen-free Glass Silica, vitreous 60676-86-0 0.2907 g 850000 85 370194 37.0194 Die Encapsulant, Halogen-free Plastics/polymers Other Non-halogenated Epoxy resins - 0.0171 g 50000 5 21775 2.1775 Organic Substrate 0.2073 g Organic Substrate Solvents, additives, and other materials Acrylonitrile/Butadiene copolymer, carboxyl terminated (26/74) 68891-46-3 0.00081904 g 3951 0.3951 1042 0.1042 Organic Substrate Metals Barium sulfate 7727-43-7 0.00953228 g 45983 4.5983 12138 1.2138 Organic Substrate Metals Copper, metal 7440-50-8 0.0912319 g 440096 44.0096 116174 11.6174 Organic Substrate Plastics/polymers 4,4'-dihydroxy-3,3',5,5'-tetramethylbiphenyl digycidyl ether 85954-11-6 0.00628679 g 30327 3.0327 8005 0.8005 Organic Substrate Plastics/polymers Phenolic Polymer Resin, Epikote 155 9003-36-5 0.05478027 g 264256 26.4256 69757 6.9757 Organic Substrate Metals Gold, metal 7440-57-5 0.00060304 g 2909 0.2909 767 0.0767 Organic Substrate Solvents, additives, and other materials Silicon 7440-21-3 0.00009867 g 476 0.0476 125 0.0125 Organic Substrate Nickel (external applications only) Nickel 7440-02-0 0.00254875 g 12295 1.2295 3245 0.3245 Organic Substrate Glass Fibrous-glass-wool 65997-17-3 0.03561704 g 171814 17.1814 45354 4.5354 Organic Substrate Plastics/polymers Other acrylic resins - 0.00578222 g 27893 2.7893 7363 0.7363 Bonding Wire, PdCu 0.0018 g Bonding Wire, PdCu Metals Copper, metal 7440-50-8 0.00175139 g 972995 97.2995 2230 0.223 Bonding Wire, PdCu Metals Palladium, metal 7440-05-3 0.00004861 g 27005 2.7005 61 0.0061 LINKS MCD LINK NXP website GENERAL ENVIRONMENTAL COMPLIANCE LINKS RoHS signed letter China RoHS REACH signed letter ELV signed letter Conflict Minerals statement NXP ENVIRONMENTAL INFORMATION Environmental Compliance website FAQ Technical Service Request LINKS TO BLANK IPC1752 FORMS Blank IPC1752 v1.1 Form http://www.nxp.com http://www.nxp.com/files/corporate/doc/support_info/NXP-ROHS-DECLARATION.pdf http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/china-rohs:ENV_CHINA_ROHS_STRATEGY http://www.nxp.com/files/corporate/doc/support_info/NXP-REACH-STATEMENT.pdf http://www.nxp.com/files/corporate/doc/support_info/NXP-ELV-STATEMENT.pdf http://www.nxp.com/files/corporate/doc/support_info/NXP-STATEMENT-CONFLICT-MINERALS.pdf http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization:ABUENVPRFPRDX http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/eco-product-faqs:ENVIRON_FAQ http://www.nxp.com/support/sales-and-support:SUPPORTHOME http://www.NXP.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf IPC1752 XML LINKS http://www.freescale.com/mcds/MCF54451VM240_IPC1752_v11.xml http://www.freescale.com/mcds/MCF54451VM240_IPC1752A.xml