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APTGL90A120T1G
Phase leg
Trench + Field Stop IGBT4
Power module
5
Q1
Application
 Welding converters
 Switched Mode Power Supplies
 Uninterruptible Power Supplies
 Motor control
11
6
CR1
7
8
3
4
Q2
NTC
CR2
9
10
1
2
VCES = 1200V
IC = 90A @ Tc = 80°C
12
Pins 1/2 ; 3/4 ; 5/6 must be shorted together
Features
 Trench + Field Stop IGBT 4 Technology
- Low voltage drop
- Low leakage current
- Low switching losses
- Soft recovery parallel diodes
- Low diode VF
- Low leakage current
- RBSOA and SCSOA rated
- Symmetrical design
 Kelvin emitter for easy drive
 Very low stray inductance
 High level of integration
 Internal thermistor for temperature monitoring
Benefits
 Outstanding performance at high frequency
operation
 Direct mounting to heatsink (isolated package)
 Low junction to case thermal resistance
 Solderable terminals both for power and signal for
easy PCB mounting
 Low profile
 RoHS Compliant
Absolute maximum ratings
IC
ICM
VGE
PD
RBSOA
Parameter
Collector - Emitter Breakdown Voltage
Continuous Collector Current
Pulsed Collector Current
Gate – Emitter Voltage
Maximum Power Dissipation
Reverse Bias Safe Operating Area
Tc = 25°C
Tc = 80°C
Tc = 25°C
Tc = 25°C
Tj = 150°C
Max ratings
1200
110
90
150
±20
385
150A @ 1150V
Unit
V
A
V
W
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note
APT0502 on www.microsemi.com
www.microsemi.com
1-7
APTGL90A120T1G – Rev 1 October, 2012
Symbol
VCES
APTGL90A120T1G
All ratings @ Tj = 25°C unless otherwise specified
Electrical Characteristics
Symbol Characteristic
ICES
Zero Gate Voltage Collector Current
VCE(sat)
Collector Emitter saturation Voltage
VGE(th)
IGES
Gate Threshold Voltage
Gate – Emitter Leakage Current
Test Conditions
VGE = 0V, VCE = 1200V
Tj = 25°C
VGE = 15V
IC = 75A
Tj = 150°C
VGE = VCE , IC = 3mA
VGE = 20V, VCE = 0V
Min
Typ
5.0
1.85
2.25
5.8
Min
Typ
Max
Unit
250
2.25
µA
6.5
600
V
nA
Max
Unit
V
Dynamic Characteristics
Symbol Characteristic
Cies
Coes
Cres
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
QG
Gate charge
Td(on)
Tr
Td(off)
Tf
Td(on)
Tr
Td(off)
Tf
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Eon
Turn-on Switching Energy
Eoff
Turn-off Switching Energy
Isc
Short Circuit data
Test Conditions
VGE = 0V
VCE = 25V
f = 1MHz
VGE= ±15V ; VCE=600V
IC=75A
Inductive Switching (25°C)
VGE = ±15V
VBus = 600V
IC = 75A
RG = 2.2
Inductive Switching (150°C)
VGE = ±15V
VBus = 600V
IC = 75A
RG = 2.2
TJ = 25°C
VGE = ±15V
VBus = 600V
TJ = 150°C
IC = 75A
TJ = 25°C
RG = 2.2
TJ = 150°C
VGE ≤15V ; VBus = 900V
tp ≤10µs ; Tj = 150°C
4.4
0.29
0.24
nF
0.57
µC
130
20
300
ns
45
150
35
ns
350
80
3.4
8.5
4.2
7.2
mJ
300
A
mJ
Reverse diode ratings and characteristics
Characteristic
Test Conditions
Min
1200
Maximum Peak Repetitive Reverse Voltage
Maximum Reverse Leakage Current
DC Forward Current
VF
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
Er
Reverse Recovery Energy
VR=1200V
IF = 75A
VGE = 0V
IF = 75A
VR = 600V
di/dt =1900A/µs
Typ
Tj = 25°C
Tc = 80°C
Tj = 25°C
Tj = 150°C
90
1.7
1.65
Tj = 25°C
155
Tj = 150°C
Tj = 25°C
300
7.3
Tj = 150°C
Tj = 25°C
Tj = 150°C
15.2
2.6
5.5
www.microsemi.com
Max
250
2.2
Unit
V
µA
A
V
ns
µC
mJ
2-7
APTGL90A120T1G – Rev 1 October, 2012
Symbol
VRRM
IRM
IF
APTGL90A120T1G
Thermal and package characteristics
Symbol Characteristic
RthJC
VISOL
TJ
TSTG
TC
Torque
Wt
Min
Junction to Case Thermal Resistance
RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz
Operating junction temperature range
Storage Temperature Range
Operating Case Temperature
Mounting torque
Package Weight
Typ
IGBT
Diode
To heatsink
M4
4000
-40
-40
-40
2
Max
0.39
0.62
Unit
°C/W
V
175
125
100
3
80
°C
N.m
g
Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information).
Symbol
R25
∆R25/R25
B25/85
∆B/B
Characteristic
Resistance @ 25°C
Min
T25 = 298.15 K
TC=100°C
RT 
R25
Typ
50
5
3952
4
Max
Unit
k
%
K
%
T: Thermistor temperature

 1
1  RT: Thermistor value at T
exp  B25 / 85 
 
T
T
 25


See application note 1904 - Mounting Instructions for SP1 Power Modules on www.microsemi.com
www.microsemi.com
3-7
APTGL90A120T1G – Rev 1 October, 2012
SP1 Package outline (dimensions in mm)
APTGL90A120T1G
Typical Performance Curve
Output Characteristics (VGE=15V)
150
Output Characteristics
150
VGE=19V
TJ=25°C
100
100
TJ=150°C
75
VGE=15V
75
50
50
25
25
0
VGE=9V
0
0
1
2
VCE (V)
3
4
0
Transfert Characteristics
150
20
E (mJ)
75
2
VCE (V)
3
VCE = 600V
VGE = 15V
RG = 2.2 Ω
TJ = 150°C
25
100
1
4
Energy losses vs Collector Current
30
TJ=25°C
125
IC (A)
TJ = 150°C
125
IC (A)
IC (A)
125
Eon
15
Eoff
10
50
TJ=150°C
25
5
0
0
5
6
7
8
9
10
11
12
Er
Eon
0
13
25
50
75
100
125
150
IC (A)
VGE (V)
Switching Energy Losses vs Gate Resistance
Reverse Bias Safe Operating Area
20
160
Eon
VCE = 600V
VGE =15V
IC = 75A
TJ = 150°C
12
120
IC (A)
E (mJ)
16
Eoff
8
Er
80
VGE=15V
TJ=150°C
RG=2.2 Ω
40
4
0
0
0
5
10
15
20
Gate Resistance (ohms)
25
0
300
600
900
VCE (V)
1200
1500
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
0.3
0.2
0.9
IGBT
0.7
0.5
0.3
0.1
0.1
Single Pulse
0.05
0
0.00001
0.0001
0.001
0.01
0.1
1
10
rectangular Pulse Duration (Seconds)
www.microsemi.com
4-7
APTGL90A120T1G – Rev 1 October, 2012
Thermal Impedance (°C/W)
0.4
APTGL90A120T1G
Forward Characteristic of diode
150
VCE=600V
D=50%
RG=2.2 Ω
TJ=150°C
Tc=75°C
80
60
40
IF, Forward Current (A)
Fmax, Operating Frequency (kHz)
Operating Frequency vs Collector Current
100
ZCS
20
Hard
switching
ZVS
100
75
50
40
TJ=150°C
25
0
0
20
TJ=25°C
125
60
80
100
0
120
0.5
1
1.5
2
2.5
VF, Anode to Cathode Voltage (V)
IC (A)
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
0.6
0.9
0.5
0.7
0.4
Diode
0.5
0.3
0.2
0.1
0.3
0.1
0.05
0
0.00001
Single Pulse
0.0001
0.001
0.01
0.1
1
10
Rectangular Pulse Duration in Seconds
www.microsemi.com
5-7
APTGL90A120T1G – Rev 1 October, 2012
Thermal Impedance (°C/W)
0.7
APTGL90A120T1G
DISCLAIMER
The information contained in the document (unless it is publicly available on the Web without access restrictions) is
PROPRIETARY AND CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted,
transmitted, distributed or disclosed or used without the express duly signed written consent of Microsemi. If the
recipient of this document has entered into a disclosure agreement with Microsemi, then the terms of such Agreement
will also apply. This document and the information contained herein may not be modified, by any person other than
authorized personnel of Microsemi. No license under any patent, copyright, trade secret or other intellectual property
right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication,
inducement, estoppels or otherwise. Any license under such intellectual property rights must be approved by
Microsemi in writing signed by an officer of Microsemi.
Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime
without any notice. This product has been subject to limited testing and should not be used in conjunction with lifesupport or other mission-critical equipment or applications. Microsemi assumes no liability whatsoever, and Microsemi
disclaims any express or implied warranty, relating to sale and/or use of Microsemi products including liability or
warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other
intellectual property right. Any performance specifications believed to be reliable but are not verified and customer or
user must conduct and complete all performance and other testing of this product as well as any user or customers final
application. User or customer shall not rely on any data and performance specifications or parameters provided by
Microsemi. It is the customer’s and user’s responsibility to independently determine suitability of any Microsemi
product and to test and verify the same. The information contained herein is provided “AS IS, WHERE IS” and with all
faults, and the entire risk associated with such information is entirely with the User. Microsemi specifically disclaims
any liability of any kind including for consequential, incidental and punitive damages as well as lost profit. The product
is subject to other terms and conditions which can be located on the web at http://www.microsemi.com/legal/tnc.asp
Life Support Application
Seller's Products are not designed, intended, or authorized for use as components in systems intended for space,
aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other
application in which the failure of the Seller's Product could create a situation where personal injury, death or property
damage or loss may occur (collectively "Life Support Applications").
Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive
testing of the Product in such applications and further agrees to indemnify and hold Seller, and its officers, employees,
subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, damages and
expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damage
or otherwise associated with the use of the goods in Life Support Applications, even if such claim includes allegations
that Seller was negligent regarding the design or manufacture of the goods.
www.microsemi.com
6-7
APTGL90A120T1G – Rev 1 October, 2012
Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. Seller will study with
Buyer alternative solutions to meet Buyer application specification based on Sellers sales conditions applicable for the
new proposed specific part.
APTGL90A120T1G
DISCLAIMER
The information contained in the document (unless it is publicly available on the Web without access restrictions) is
PROPRIETARY AND CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted,
transmitted, distributed or disclosed or used without the express duly signed written consent of Microsemi. If the
recipient of this document has entered into a disclosure agreement with Microsemi, then the terms of such Agreement
will also apply. This document and the information contained herein may not be modified, by any person other than
authorized personnel of Microsemi. No license under any patent, copyright, trade secret or other intellectual property
right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication,
inducement, estoppels or otherwise. Any license under such intellectual property rights must be approved by
Microsemi in writing signed by an officer of Microsemi.
Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime
without any notice. This product has been subject to limited testing and should not be used in conjunction with lifesupport or other mission-critical equipment or applications. Microsemi assumes no liability whatsoever, and Microsemi
disclaims any express or implied warranty, relating to sale and/or use of Microsemi products including liability or
warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other
intellectual property right. Any performance specifications believed to be reliable but are not verified and customer or
user must conduct and complete all performance and other testing of this product as well as any user or customers final
application. User or customer shall not rely on any data and performance specifications or parameters provided by
Microsemi. It is the customer’s and user’s responsibility to independently determine suitability of any Microsemi
product and to test and verify the same. The information contained herein is provided “AS IS, WHERE IS” and with all
faults, and the entire risk associated with such information is entirely with the User. Microsemi specifically disclaims
any liability of any kind including for consequential, incidental and punitive damages as well as lost profit. The product
is subject to other terms and conditions which can be located on the web at http://www.microsemi.com/legal/tnc.asp
Life Support Application
Seller's Products are not designed, intended, or authorized for use as components in systems intended for space,
aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other
application in which the failure of the Seller's Product could create a situation where personal injury, death or property
damage or loss may occur (collectively "Life Support Applications").
Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive
testing of the Product in such applications and further agrees to indemnify and hold Seller, and its officers, employees,
subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, damages and
expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damage
or otherwise associated with the use of the goods in Life Support Applications, even if such claim includes allegations
that Seller was negligent regarding the design or manufacture of the goods.
www.microsemi.com
7-7
APTGL90A120T1G – Rev 1 October, 2012
Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. Seller will study with
Buyer alternative solutions to meet Buyer application specification based on Sellers sales conditions applicable for the
new proposed specific part.