HL QF N1 6R SOT1301-1 plastic thermal enhanced low profile quad flat package; no leads; 16 terminals 22 March 2016 Package information 1. Package summary Terminal position code Q (quad) Package type descriptive code HLQFN16R Package type industry code HLQFN16R Package style descriptive code HLQFN (thermal enhanced low profile quad flatpack; no leads) Package style suffix code NA (not applicable) Package body material type P (plastic) IEC package outline code --- JEDEC package outline code --- JEITA package outline code --- Mounting method type S (surface mount) Issue date 30-8-2011 Table 1. Package summary Symbol Parameter Min Typ Nom Max Unit D package length 7.9 - 8 8.1 mm E package width 7.9 - 8 8.1 mm A seated height 1.25 - 1.3 1.4 mm e nominal pitch - - 1.42 - mm n2 actual quantity of termination - - 16 - SOT1301-1 NXP Semiconductors plastic thermal enhanced low profile quad flat package; no leads; 16 terminals 2. Package outline HLQFN16R: plastic thermal enhanced low profile quad flat package; no leads; 16 terminals; body 8 x 8 x 1.3 mm B D SOT1301-1 A terminal 1 index area A E detail X e1 e L1 C 1/2 e b 5 C A B C Øv Øw 8 y1 C y L 9 4 e Eh e2 1/2 e 1 12 terminal 1 index area 16 13 X Dh 0 5 mm scale Dimensions Unit mm A b max 1.40 0.75 nom 1.30 0.70 min 1.25 0.65 D Dh E 8.1 8.0 7.9 5.85 5.80 5.75 8.1 8.0 7.9 Eh e e1 e2 L L1 5.85 0.75 0.15 5.80 1.42 4.26 4.26 0.70 0.10 5.75 0.65 0.05 v 0.1 w y 0.05 0.08 y1 0.1 sot1301-1_po Outline version References IEC JEDEC JEITA European projection Issue date 11-08-23 11-08-29 SOT1301-1 Fig. 1. Package outline HLQFN16R (SOT1301-1) SOT1301-1 Package information All information provided in this document is subject to legal disclaimers. 22 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved 2/5 SOT1301-1 NXP Semiconductors plastic thermal enhanced low profile quad flat package; no leads; 16 terminals 3. Soldering Footprint information for reflow soldering of HLQFN16R package SOT1301-1 Hx Gx P1 nSPx Hy Gy SLy By Ay nSPy (0.125) see detail X C D1 SLx Bx Ax solder land 0.60 0.30 solder paste detail X occupied area Dimensions in mm P1 Ax Ay Bx By C D1 Gx Gy Hx Hy SLx SLy nSPx nSPy 1.42 8.95 8.95 6.65 6.65 1.15 0.80 8.25 8.25 9.20 9.20 5.85 5.85 4 4 Issue date 11-09-14 11-11-20 sot1301-1_fr Fig. 2. Reflow soldering footprint for HLQFN16R (SOT1301-1) SOT1301-1 Package information All information provided in this document is subject to legal disclaimers. 22 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved 3/5 SOT1301-1 NXP Semiconductors plastic thermal enhanced low profile quad flat package; no leads; 16 terminals 4. Legal information Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. SOT1301-1 Package information All information provided in this document is subject to legal disclaimers. 22 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved 4/5 SOT1301-1 NXP Semiconductors plastic thermal enhanced low profile quad flat package; no leads; 16 terminals 5. Contents 1. Package summary........................................................ 1 2. Package outline............................................................ 2 3. Soldering....................................................................... 3 4. Legal information......................................................... 4 © NXP Semiconductors N.V. 2016. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 22 March 2016 SOT1301-1 Package information All information provided in this document is subject to legal disclaimers. 22 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved 5/5