DH VQ FN 24 SOT815-1 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 24 terminals; body 3.5 x 5.5 x 0.85 mm 8 February 2016 Package information 1. Package summary Terminal position code Q (quad) Package type descriptive code DHVQFN24 Package type industry code DHVQFN24 Package style descriptive code DHVQFN (DIL-compatible thermal enhanced very thin quad flatpack; no leads) Package style suffix code NA (not applicable) Package body material type P (plastic) IEC package outline code --- JEDEC package outline code --- JEITA package outline code --- Mounting method type S (surface mount) Issue date 29-4-2003 Table 1. Package summary Symbol Parameter Min Typ Nom Max Unit D package length 5.4 - 5.5 5.6 mm E package width 3.4 - 3.5 3.6 mm A seated height [tbd] - 0.85 1 mm A2 package height [tbd] - 0.85 [tbd] mm n2 actual quantity of termination - - 24 - SOT815-1 NXP Semiconductors plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 24 terminals; body 3.5 x 5.5 x 0.85 mm 2. Package outline DHVQFN24: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 24 terminals; body 3.5 x 5.5 x 0.85 mm D B SOT815-1 A A E A1 c detail X terminal 1 index area C e1 terminal 1 index area e 2 y1 C v M C A B w M C b 11 y L 12 1 e2 Eh 24 13 23 14 X Dh 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max. A1 b c D (1) Dh E (1) Eh e e1 e2 L v w y y1 mm 1 0.05 0.00 0.30 0.18 0.2 5.6 5.4 4.25 3.95 3.6 3.4 2.25 1.95 0.5 4.5 1.5 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT815-1 --- --- --- EUROPEAN PROJECTION ISSUE DATE 03-04-29 Fig. 1. Package outline DHVQFN24 (SOT815-1) SOT815-1 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 2/5 SOT815-1 NXP Semiconductors plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 24 terminals; body 3.5 x 5.5 x 0.85 mm 3. Soldering Footprint information for reflow soldering of DHVQFN24 package SOT815-1 6.750 5.800 0.290 0.500 0.600 0.025 0.025 0.105 0.450 4.750 4.500 2.700 2.050 1.200 1.500 2.000 2.400 4.000 4.700 6.500 Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste occupied area sot815-1_fr Fig. 2. Reflow soldering footprint for DHVQFN24 (SOT815-1) SOT815-1 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 3/5 SOT815-1 NXP Semiconductors plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 24 terminals; body 3.5 x 5.5 x 0.85 mm 4. Legal information Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. SOT815-1 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 4/5 SOT815-1 NXP Semiconductors plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 24 terminals; body 3.5 x 5.5 x 0.85 mm 5. Contents 1. Package summary........................................................ 1 2. Package outline............................................................ 2 3. Soldering....................................................................... 3 4. Legal information......................................................... 4 © NXP Semiconductors N.V. 2016. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 8 February 2016 SOT815-1 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 5/5