Audio jack configuration switch matrix

NCX8200
Audio jack configuration switch matrix
Rev. 1 — 15 May 2015
Product data sheet
1. General description
The NCX8200 is an advanced audio jack configuration switch matrix device that supports
3- and 4-pole connectors. It allows reconfiguration of the GND, microphone-bias contact
to comply with the American Headset Jack (AHJ) and the Open Mobile Terminal Platform
(OMTP) pinout. Furthermore, a GND sense path supports quasi-differential amplifier
architectures. The device contains Human Body Model compliant ESD protection diodes
rated 8 kV at all pins. The device can be operated from a supply in the range of 1.6 V to
3.6 V. It supports a broad variety of after-market headphones.
2. Features and benefits









AHJ and OMTP headset jack pinout support
Low supply current
Sense path to GND for quasi differential amplifier configuration
Low THD and noise microphone pass through channel
Ultra low RDSon of ground and sense switches
High power supply ripple rejection
ESD protection: HBM JEDEC JDS-001 Class 3B exceeds 8 kV
Operating ambient temperature: 40C to +85C
1.22 mm  1.22 mm  0.5 mm WLCSP9 package
3. Applications
 Headphones with integrated microphone and remote control buttons
4. Ordering information
Table 1.
Ordering information
Type number
NCX8200UK
Package
Name
Description
Version
WLCSP9
wafer chip-scale package; 9 bumps; 1.22  1.22  0.5 mm
NCX8200UK
5. Marking
Table 2.
Marking codes
Type number
Marking code
NCX8200UK
qx82
NCX8200
NXP Semiconductors
Audio jack configuration switch matrix
6. Functional diagram
AHJ
OMTP
VDD
Sense
Rbias
MIC
headset jack
SNS 1
SNS1
2
SNS2
R
CON2
2
1
SEL
L
CON1
MIB 1
CMIC
GND MIC
MIC GND
2
GRD
750 kΩ
GND
aaa-016470
Default configuration with SEL = L is AHJ-compliant in this example.
Fig 1.
Simplified schematic
NCX8200
Product data sheet
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Rev. 1 — 15 May 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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NCX8200
NXP Semiconductors
Audio jack configuration switch matrix
7. Pinning information
7.1 Pinning
bump A1
index area
A1
A2
A3
SNS1
Sense
SNS2
B1
B2
B3
CON1
SEL
CON2
C1
C2
C3
VDD
GND
MIC
Transparent top view,
solder balls facing down
Fig 2.
Transparent top view,
solder balls facing down
aaa-016471
Pin configuration WLCSP9
Fig 3.
aaa-016472
NCX8200 pinout, transparent top view
7.2 Pin description
Table 3.
Pin description
Symbol
Pin
Type
Description
SNS1
A1
I/O
analog sense path 1 to headset jack GND
Sense
A2
I/O
analog sense path for GND sensing
SNS2
A3
I/O
analog sense path 2 to headset jack GND
CON1
B1
I/O
headset jack pin 1
SEL
B2
I
configuration select input:
SEL = L: CON1 = GND, CON2 = MIC, Sense = SNS1
SEL = H: CON1 = MIC, CON2 = GND, Sense = SNS2
CON2
B3
I/O
headset jack pin 2
VDD
C1
power
core supply
GND
C2
ground
ground
MIC
C3
I/O
microphone bias connection audio codec side
8. Functional description
The basic application of the NCX8200 device is shown in Figure 1.
There is a 750 kW pull down resistor at SEL pin, for setting SEL default LOW.
If SEL is at low level, CON1 is connected to GND, the MIC channel is routed to CON2,
and the Sense channel switches to SNS1. If SEL is at high level, CON2 is connected to
GND, the MIC channel is routed to CON1, and the Sense channel switches to SNS2.
NCX8200
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 15 May 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
3 of 14
NCX8200
NXP Semiconductors
Audio jack configuration switch matrix
9. Application diagram
A capacitor of value not less than 1 F, should be placed between VDD and GND for
stable operation of the NCX8200. The bypass capacitor should be placed close to the
device with low-ohmic connection from the power supply and GND connection.
SNS1 should be for sensing CON1 connection and SNS2 should be for sensing CON2
connection. In PCB design, CONx routes from the headset jack should be as low-ohmic
as possible. SNSx sensing nodes should be as close to the headset jack as possible with
low-ohmic connection, so that the star connection is recommended. The routes from
sensing nodes to SNSx should be as low-ohmic as possible.
When VDD is not powered, all the FETs become open by default. Thus, the ground return
path becomes floating. Noise might be heard if a speaker (with external powered
amplified) is plugged in the audio jack. It is highly recommended when the audio jack
detects a plug-in, the NCX8200 is kept powered until unplug.
VDD
1.0 μF
VDD
Sense
GND
Sensing
MIC
BIAS
Audio
CODEC
2.2 kΩ
SNS 1
SNS1
2
SNS2
MIB 1
MIC
headset jack
L
R
CON2
1
SEL
GND MIC
MIC GND
CON1
2
1 μF
AHJ
OMTP
Switching
Control
2
GRD
Processor
750 kΩ
GND
Fig 4.
aaa-016473
NCX8200 application diagram
NCX8200
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 15 May 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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NCX8200
NXP Semiconductors
Audio jack configuration switch matrix
10. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to
GND (ground = 0 V).
Symbol
Parameter
Conditions
Min
Max
Unit
VDD
supply voltage
VI/O
input/output voltage
MIC, CON1, CON2, Sense,
SNS1, SNS2
0.5
+3.6
V
0.5
VDD
V
VI
input voltage
SEL
0.5
VDD + 0.1 V
ISW(GRD)
switch current
continuous current from
CON1 or CON2 to GND
-
100
mA
ISW(MIB)
switch current
continuous current from
MIC to CON1 or CON2
-
50
mA
ISW(SNS)
switch current
continuous current from
Sense to SNS1 or SNS2
-
50
mA
Tj(max)
maximum junction
temperature
40
+125
C
Tstg
storage temperature
65
+150
C
Ptot
total power dissipation
-
530
mW
11. Recommended operating conditions
Table 5.
Recommended operating conditions
Symbol
Parameter
VDD
supply voltage
VI/O
input/output voltage
VI
input voltage
Tamb
ambient temperature
Conditions
Min
Max
Unit
1.6
3.6
V
MIC, CON1, CON2,
Sense, SNS1, SNS2
0.3
VDD
V
SEL
0.3
VDD
V
40
+85
C
12. Thermal characteristics
Table 6.
NCX8200
Product data sheet
Thermal characteristics
Symbol
Parameter
Rth(j-a)
thermal resistance from junction to
ambient
Conditions
[1][2]
Typ
Unit
75.5
K/W
[1]
The overall Rth(j-a) can vary depending on the board layout. To minimize the effective Rth(j-a), all pins must
have a solid connection to larger Cu layer areas e.g. to the power and ground layer. In multi-layer PCB
applications, the second layer should be used to create a large heat spreader area right below the device. If
this layer is either ground or power, it should be connected with several vias to the top layer connecting to
the device ground or supply. Try not to use any solder-stop varnish under the chip.
[2]
Rely on the measurement data given for rough estimation of the Rth(j-a) in your application. The actual
Rth(j-a) value may vary in applications using different layer stacks and layouts.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 15 May 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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NCX8200
NXP Semiconductors
Audio jack configuration switch matrix
13. Static characteristics
Table 7.
Static characteristics
At recommended operating conditions Tamb = 40 C to +85 C unless otherwise specified. Typical values are measured with
VDD = 3.0 V and Tamb = 25C. Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Digital control
VIH
HIGH-level input voltage
SEL input
1.0
-
-
V
VIL
LOW-level input voltage
SEL input
-
-
0.4
V
Rpd
pull-down Resistor
SEL input
-
750
-
k
VDD = 3.0 V; Tamb = 25C
-
0.1
1
A
VDD = 3.0 V; Tamb = 85C
-
-
5
A
-
-
1.5
A
-
1.6
2.5

Current consumption
IDD
Quiescent current
Microphone bias switch MIB
IS(MIB)
MIB Path leakage current
MIC; VMIC = 850 mV; CONx open;
SEL = H or L
RON(MIB)
MIB switch-on resistance
IO = 30 mA, VI = 850 mV
VDD = 1.8 V
RON(MIB_flat)
MIB switch-on resistance
flatness
VDD = 3.0 V
-
0.5
0.8

VDD = 3.6 V
-
0.46
0.7

IO = 30 mA,
0.8 V < VI < 1.2 V
VDD = 1.8 V
-
-
5

VDD = 3.0 V
-
-
0.1

VDD = 3.6 V
-
-
0.1

CS
input/output capacitance
MIC; CONx open; SEL = H or L
-
250
-
pF
THD
total harmonic distortion of RS = RL = 600 , fAC = 20 kHz,
the conducting MIB switch VAC = 0.5 VPP, VDC = 1.7 V,
VDD = 3.0 V; SEL = H or L
-
0.005
-
%
PSRR
power supply ripple
rejection ratio of the
conducting MIB switch
-
80
-
dB
VDD = 1.8 V
-
70
120
m
VDD = 3.0 V
-
60
90
m
VDD = 3.6 V
-
57
82
m
-
-
50
m
RS = RL = 600 , f = 217 Hz,
VDD = 3.0 V, VDC = 2.1 V,
VAC = 0.3 VPP; SEL = H or L
Ground switch GRD
RON(GRD)
GRD
switch on resistance
IICONx = 100 mA
RON(GRD_flat) GRD switch-on resistance IICONx = 10 mA, VDD = 1.8 V ~ 3.6 V
flatness
IICONx = 1 mA, VDD = 1.8 V ~ 3.6 V
PSRR
power supply ripple
rejection ratio of the
conducting GRD switch
NCX8200
Product data sheet
VS = 1 V, RS = 8 ,
VDD = 3.0 V, VAC = 0.3 VPP, f = 217 Hz;
SEL = H or L
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 15 May 2015
-
-
50
m
-
60
-
dB
© NXP Semiconductors N.V. 2015. All rights reserved.
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NCX8200
NXP Semiconductors
Audio jack configuration switch matrix
Table 7.
Static characteristics …continued
At recommended operating conditions Tamb = 40 C to +85 C unless otherwise specified. Typical values are measured with
VDD = 3.0 V and Tamb = 25C. Voltages are referenced to GND (ground = 0 V). …continued
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDD = 1.8 V
-
80
130
m
VDD = 3.0 V
-
60
90
m
VDD = 3.6 V
-
57
82
m
IIsense = 10 mA, SNSx = 0 V,
VDD = 1.8 V ~ 3.6 V
-
-
50
m
IIsense = 1 mA, SNSx= 0 V,
VDD = 1.8 V ~ 3.6 V
-
-
50
m
SEL = H; SNS1 =GND; SNS2 = OPEN
-
-
1
A
SEL = L; SNS1 = OPEN; SNS2 = GND
-
-
1
A
Sense switch SNS
RON(SNS)
SNS
switch on resistance
RON(SNS_flat) SNS switch-on resistance
flatness
IS(SNS_OFF)
SNS switch leakage
current
NCX8200
Product data sheet
IIsense = 30 mA, SNSx= 0 V
Sense; Vsense = 1 V
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 15 May 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
7 of 14
NCX8200
NXP Semiconductors
Audio jack configuration switch matrix
13.1 Test circuit and graphs
VDD
VDD
CONX
MIC
SEL = VIH or VIL
VSW
ll
MIB
CONX
CONX
lS
GND
SEL = VIH or VIL
V
V
RON = sw
ll
Fig 5.
aaa-016475
aaa-016474
Test circuit for measuring ON resistance
Fig 6.
DDD
5RQ
Pȍ
Test circuit for measuring leakage current
DDD
5RQ
ȍ
GND
9''9
(1) SNS RON
9''9
MIB RON
(2) GRD RON
Fig 7.
GRD and SNS channel ON resistance
NCX8200
Product data sheet
Fig 8.
MIB channel ON resistance
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Rev. 1 — 15 May 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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NCX8200
NXP Semiconductors
Audio jack configuration switch matrix
14. Dynamic characteristics
Table 8.
Dynamic characteristics
At recommended operating conditions Tamb = 40 C to +85 C unless otherwise specified. Typical values are measured with
VDD = 3.0 V and Tamb = 25C. Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
Min
Typ
Max [1]
Unit
tON
Turn-ON Time
VMIC = VDD, Vsense= 0 V,
RL = 50 , CL = 35 pF
-
215
400
ns
tOFF
Turn-OFF Time
VMIC = VDD, Vsense= 0 V,
RL = 50 , CL = 35 pF
-
35
120
ns
tBBM
break-before-make time
VMIC = VDD, Vsense= 0 V,
RL = 50 , CL = 35 pF
70[1]
180
320
ns
[1]
Guaranteed by design
14.1 Waveform
VDD
SEL
Logic Input
50 %
50 %
0V
TOFF
TON
90 %
90 %
CON1 or CON2
CON2 or CON1
90 %
90 %
TBBM
TBBM
aaa-016476
Fig 9.
Turn-ON time and turn-OFF time
NCX8200
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 15 May 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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NCX8200
NXP Semiconductors
Audio jack configuration switch matrix
15. Package outline
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Fig 10. Package outline NCX8200 (WLCSP9)
NCX8200
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 15 May 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
10 of 14
NCX8200
NXP Semiconductors
Audio jack configuration switch matrix
16. Abbreviations
Table 9.
Abbreviations
Acronym
Description
THD
Total Harmonic Distortion
CDM
Charged Device Model
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
MOSFET
Metal-Oxide Semiconductor Field Effect Transistor
17. Revision history
Table 10.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
NCX8200 v.1
20150515
Product data sheet
-
-
NCX8200
Product data sheet
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Rev. 1 — 15 May 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
11 of 14
NCX8200
NXP Semiconductors
Audio jack configuration switch matrix
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
NCX8200
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 15 May 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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NCX8200
NXP Semiconductors
Audio jack configuration switch matrix
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
NCX8200
Product data sheet
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Rev. 1 — 15 May 2015
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NCX8200
NXP Semiconductors
Audio jack configuration switch matrix
20. Contents
1
2
3
4
5
6
7
7.1
7.2
8
9
10
11
12
13
13.1
14
14.1
15
16
17
18
18.1
18.2
18.3
18.4
19
20
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
Application diagram . . . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Recommended operating conditions. . . . . . . . 5
Thermal characteristics . . . . . . . . . . . . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Test circuit and graphs . . . . . . . . . . . . . . . . . . . 8
Dynamic characteristics . . . . . . . . . . . . . . . . . . 9
Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11
Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Contact information. . . . . . . . . . . . . . . . . . . . . 13
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2015.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 15 May 2015
Document identifier: NCX8200