BB189 UHF variable capacitance diode Rev. 01 — 8 June 2009 Product data sheet 1. Product profile 1.1 General description The BB189 is a planar technology variable capacitance diode in a SOD523 ultra small leadless plastic SMD package. The excellent matching performance is achieved by gliding matching and a Direct Matching Assembly (DMA) procedure. 1.2 Features n n n n n Excellent linearity Excellent matching to 1.8 % DMA Ultra small plastic SMD package Cd(25V) : 2.05 pF; Cd(2V) to Cd(25V) ratio: 6.3 min. Low series resistance 1.3 Applications n Voltage Controlled Oscillators (VCO) n Electronic tuning in UHF television tuners 2. Pinning information Table 1. Pinning Pin Description 1 cathode 2 anode Simplified outline Graphic symbol [1] 1 2 sym008 [1] The marking bar indicates the cathode. 3. Ordering information Table 2. Ordering information Type number BB189 Package Name Description Version SC-79 plastic surface-mounted package; 2 leads SOD523 BB189 NXP Semiconductors UHF variable capacitance diode 4. Marking Table 3. Marking codes Type number Marking code BB189 4 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Min Max Unit VR reverse voltage Conditions - 32 V IF forward current - 20 mA Tstg storage temperature −55 +150 °C Tj junction temperature −55 +125 °C 6. Characteristics Table 5. Characteristics Tj = 25 °C unless otherwise specified Symbol Parameter Conditions IR reverse current see Figure 2 Min Typ Max Unit VR = 30 V - - 10 nA VR = 30 V; Tj = 85 °C - - 200 nA - 0.6 0.7 Ω VR = 2 V 14.15 - 15.75 pF VR = 25 V 1.89 - 2.18 pF rs diode series resistance f = 470 MHz at Cd = 9 pF Cd diode capacitance f = 1 MHz; see Figure 1 and Figure 3 Cd(2V)/Cd(25V) diode capacitance ratio (2 V to 25 V) f = 1 MHz 6.3 - - ∆Cd/Cd diode capacitance matching VR = 2 V to 25 V; in sequence of 10 diodes (gliding) - - 1.8 BB189_1 Product data sheet % © NXP B.V. 2009. All rights reserved. Rev. 01 — 8 June 2009 2 of 6 BB189 NXP Semiconductors UHF variable capacitance diode 001aak204 30 Cd (pF) 20 10 0 10−1 1 102 10 VR (V) Fig 1. Diode capacitance as a function of reverse voltage; typical values 001aak205 103 001aak206 10−2 IR (nA) TCCd (K−1) 102 10−3 10 10−4 1 0 20 40 60 80 100 10−5 10−1 1 Tj (°C) 102 10 VR (V) Tj = 0 °C to 85 °C. Fig 2. Reverse current as a function of junction temperature; maximum values Fig 3. Temperature coefficient of diode capacitance as a function of reverse voltage; typical values BB189_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 8 June 2009 3 of 6 BB189 NXP Semiconductors UHF variable capacitance diode 7. Package outline Plastic surface-mounted package; 2 leads SOD523 A c v M A HE A D 1 E 0 0.5 1 mm scale 2 DIMENSIONS (mm are the original dimensions) bp (1) UNIT A bp c D E HE v mm 0.65 0.58 0.34 0.26 0.17 0.11 1.25 1.15 0.85 0.75 1.65 1.55 0.1 Note 1. The marking bar indicates the cathode. OUTLINE VERSION REFERENCES IEC JEDEC SOD523 Fig 4. EUROPEAN PROJECTION JEITA ISSUE DATE 02-12-13 06-03-16 SC-79 Package outline SOD523 (SC-79) 8. Abbreviations Table 6. Abbreviations Acronym Description SMD Surface Mounted Device UHF Ultra High Frequency 9. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes BB189_1 20090608 Product data sheet - - BB189_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 8 June 2009 4 of 6 BB189 NXP Semiconductors UHF variable capacitance diode 10. Legal information 10.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 10.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 10.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 10.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 11. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BB189_1 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 01 — 8 June 2009 5 of 6 BB189 NXP Semiconductors UHF variable capacitance diode 12. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 8 9 10 10.1 10.2 10.3 10.4 11 12 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description. . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 1 2 2 2 4 4 4 5 5 5 5 5 5 6 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 8 June 2009 Document identifier: BB189_1