BAP50-03 General purpose PIN diode Rev. 04 — 11 September 2009 Product data sheet 1. Product profile 1.1 General description General purpose PIN diode in a SOD323 small plastic SMD package. 1.2 Features n Low diode capacitance n Low diode forward resistance 1.3 Applications n General RF application 2. Pinning information Table 1. Discrete pinning Pin Description 1 cathode 2 anode Simplified outline 1 Graphic symbol 2 sym006 3. Ordering information Table 2. Ordering information Type number Package BAP50-03 Name Description Version SC-76 plastic surface-mounted package; 2 leads SOD323 BAP50-03 NXP Semiconductors General purpose PIN diode 4. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per diode VR reverse voltage - 50 V IF forward current - 50 mA Ptot total power dissipation - 500 mW Tstg storage temperature −65 +150 °C Tj junction temperature −65 +150 °C Typ Unit 85 K/W Tsp = 90 °C 5. Thermal characteristics Table 4. Thermal characteristics Symbol Parameter Rth(j-sp) thermal resistance from junction to soldering point Conditions 6. Characteristics Table 5. Characteristics Tj = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VF forward voltage IF = 50 mA - 0.95 1.1 V VR reverse voltage IR = 10 µA 50 - - V IR reverse current VR = 50 V - - 100 nA Cd diode capacitance f = 1 MHz; see Figure 1 VR = 0 V - 0.4 - pF VR = 1 V - 0.3 0.55 pF VR = 5 V - 0.2 0.35 pF diode forward resistance rD [1] f = 100 MHz; see Figure 2 IF = 0.5 mA [1] - 25 40 Ω IF = 1 mA [1] - 14 25 Ω IF = 10 mA [1] - 3 5 Ω Guaranteed on AQL basis: inspection level S4, AQL 1.0. BAP50-03_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 11 September 2009 2 of 7 BAP50-03 NXP Semiconductors General purpose PIN diode mgs323 500 Cd (fF) mgs317 103 rD (Ω) 400 102 300 200 10 100 1 10−2 0 0 4 8 12 20 16 10−1 1 f = 1 MHz; Tj = 25 °C. Fig 1. 10 IF (mA) VR (V) f = 100 MHz; Tj = 25 °C. Diode capacitance as a function of reverse voltage; typical values Fig 2. Diode forward resistance as a function of forward current; typical values mgs319 0 (1) Lins (dB) ISL (dB) (2) −1 mgs316 0 −5 (3) −2 −10 −3 −15 −4 −20 −5 0.5 1 1.5 2 2.5 3 −25 0.5 1 f (GHz) 1.5 2 2.5 3 f (GHz) (1) IF = 10 mA Tamb = 25 °C. (2) IF = 1 mA Diode zero biased and inserted in series with a 50 Ω stripline circuit. (3) IF = 0.5 mA Tamb = 25 °C. Diode inserted in series with a 50 Ω stripline circuit and biased via the analyzer Tee network. Fig 3. Insertion loss of the diode as a function of frequency; typical values Fig 4. Isolation of the diode as a function of frequency; typical values BAP50-03_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 11 September 2009 3 of 7 BAP50-03 NXP Semiconductors General purpose PIN diode 7. Package outline Plastic surface-mounted package; 2 leads SOD323 A D E X v HD M A Q 1 2 bp A A1 (1) c Lp detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E HD Lp Q v mm 1.1 0.8 0.05 0.40 0.25 0.25 0.10 1.8 1.6 1.35 1.15 2.7 2.3 0.45 0.15 0.25 0.15 0.2 Note 1. The marking bar indicates the cathode OUTLINE VERSION REFERENCES IEC SOD323 Fig 5. JEDEC JEITA SC-76 EUROPEAN PROJECTION ISSUE DATE 03-12-17 06-03-16 Package outline SOD323 BAP50-03_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 11 September 2009 4 of 7 BAP50-03 NXP Semiconductors General purpose PIN diode 8. Abbreviations Table 6. Abbreviations Acronym Description AQL Acceptable Quality Level PIN P-type, Intrinsic, N-type SMD Surface Mounted Device RF Radio Frequency S4 Special inspection level 4 9. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes BAP50-03_4 20090911 Product data sheet - BAP50-03_3 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. BAP50-03_3 20040211 Product data sheet BAP50-03_2 BAP50-03_2 19990510 Product data sheet BAP50-03_N_1 BAP50-03_N_1 19990201 Preliminary data sheet - BAP50-03_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 11 September 2009 5 of 7 BAP50-03 NXP Semiconductors General purpose PIN diode 10. Legal information 10.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 10.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 10.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 10.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 11. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BAP50-03_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 11 September 2009 6 of 7 BAP50-03 NXP Semiconductors General purpose PIN diode 12. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 8 9 10 10.1 10.2 10.3 10.4 11 12 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description. . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics. . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 1 2 2 2 4 5 5 6 6 6 6 6 6 7 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 11 September 2009 Document identifier: BAP50-03_4