AD843: Military Data Sheet (Rev C, 03/2003)

REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
A
Changes in accordance with N.O.R. 5962-R043-93.
92-12-23
M. A. FRYE
B
Drawing being updated to reflect current requirements. - ro
00-09-11
R. MONNIN
C
Made changes to replace reference to MIL-STD-973 with reference to
MIL-PRF-38535. - ro
03-03-21
R. MONNIN
D
Update drawing to current MIL-PRF-38535 requirements. -rrp
13-04-17
C. SAFFLE
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
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SHEET
REV STATUS
REV
D
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D
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D
D
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OF SHEETS
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PMIC N/A
PREPARED BY
RICK C. OFFICER
STANDARD
MICROCIRCUIT
DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
CHECKED BY
SANDRA ROONEY
APPROVED BY
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
MICHAEL A. FRYE
DRAWING APPROVAL DATE
92-05-21
REVISION LEVEL
D
MICROCIRCUIT, LINEAR, PRECISION FAST
SETTLING, OPERATIONAL AMPLIFIER,
MONOLITHIC SILICON
SIZE
CAGE CODE
A
67268
SHEET
DSCC FORM 2233
APR 97
5962-90980
1 OF 12
5962-E345-13
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q and M)
and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
-
90980
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
01
M
P
A
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
/
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
Generic number
01
Circuit function
AD843
Precision, fast settling, operational amplifier
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
Device requirements documentation
M
Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Q or V
Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
P
X
2
Descriptive designator
GDIP1-T8 or CDIP2-T8
See figure 1
CQCC1-N20
Terminals
8
12
20
Package style
Dual-in-line
Can
Square leadless chip carrier
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-90980
A
REVISION LEVEL
D
SHEET
2
1.3 Absolute maximum ratings. 1/ 2/
Voltage between +VS and –VS terminals ......................................
Differential input voltage ................................................................
Voltage at either input terminal ......................................................
Peak output current (< 10 % duty cycle) ........................................
Power dissipation (PD):
Case P .......................................................................................
Case X .......................................................................................
Case 2 ........................................................................................
Junction temperature (TJ) ..............................................................
Storage temperature range ............................................................
Lead temperature (soldering, 10 seconds) ....................................
Thermal resistance, junction-to-case (θJC):
Case P .......................................................................................
Case X .......................................................................................
Case 2 ........................................................................................
Thermal resistance, junction-to-ambient (θJA):
Case P .......................................................................................
Case X .......................................................................................
Case 2 ........................................................................................
36 V dc
±6.0 V dc
+VS to –VS
100 mA
1.3 W 3/
1.5 W 3/
1.0 W 3/
+175°C
-65°C to +150°C
+300°C
22°C/W
65°C/W
35°C/W
110°C/W
80°C/W
150°C/W
1.4 Recommended operating conditions.
Positive supply voltage range (+VS) .............................................. +4.5 V dc to +15 V dc
Negative supply voltage range (-VS) ............................................. -4.5 V dc to -15 V dc
Common mode input voltage (VCM) .............................................. ±10 V
Load resistance (RL) ..................................................................... 500 Ω
Ambient temperature range (TA) ................................................... -55°C to +125°C
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
________
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ Unless otherwise specified, TA = +25°C.
3/
Derate linearly above TA = +25°C for case P at 8.7 mW/°C, case X at 10 mW/°C, and case 2 at 6.7 mW/°C.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-90980
A
REVISION LEVEL
D
SHEET
3
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at https://assist.dla.mil/quicksearch/ or from the Standardization Document
Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 as specified herein, or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of
supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MILPRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime-VA of change of
product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime’s agent,
and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore
documentation shall be made available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 85 (see MIL-PRF-38535, appendix A).
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A
REVISION LEVEL
D
SHEET
4
TABLE I. Electrical performance characteristics.
Test
Conditions 1/
-55°C ≤ TA ≤ +125°C
Symbol
±VS = ±15 V
Group A
subgroups
Device
type
1
01
Limits 2/
unless otherwise specified
Input offset voltage
VIO
VCM = 0 V
2,3
Input bias current
IB
1
VCM = 0 V
Min
-2.0
Max
+2.0
-4.5
+4.5
01
2.5
2,3 3/
Input offset current
IIO
1
VCM = 0 V
+VCM
1,2,3
+VS = 5.0 V, -VS = -25 V,
mV
nA
2600
01
2,3 3/
Common mode voltage
range
Unit
-1
+1
-1025
+1025
01
10
nA
V
VOUT = -10 V
-VCM
-10
+VS = 25 V, -VS = –5.0 V,
VOUT = 10 V
Large signal voltage
gain
+AVOL
1
VOUT = 0 V and 10 V,
RL = 500 Ω
-AVOL
VOUT = 0 V and –10 V,
RL = 500 Ω
Quiescent power 4/
consumption
PC
15
2,3
10
1
15
2,3
10
1
VOUT = 0 V, IOUT = 0 mA
01
01
390
2,3
Output current
+IOUT
1
VOUT = 0 V, TA = +25°C
+VOUT
01
50
ICC
mA
-50
1,2,3
RL = 500 Ω
01
10
V
-10
-VOUT
Quiescent power supply
current
mW
480
-IOUT
Output voltage swing
V/mV
1
VOUT = 0 V, IOUT = 0 mA
01
13
2,3
mA
16
See footnotes at end of table.
STANDARD
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COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-90980
A
REVISION LEVEL
D
SHEET
5
TABLE I. Electrical performance characteristics – Continued.
Test
Conditions 1/
-55°C ≤ TA ≤ +125°C
Symbol
±VS = ±15 V
Group A
subgroups
Device
type
1
01
unless otherwise specified
Power supply rejection
ratio
+PSRR
+VS = 5.0 V to 18 V,
-VS = -15 V
-PSRR
-VS = -5.0 V to –18 V,
+VS = +15 V
Common mode rejection
ratio
+CMRR
Min
65
2,3
62
1
65
2,3
62
4,5,6
∆VCM = 10 V, +VS = 5.0 V,
Limits 2/
01
Unit
Max
dB
60
dB
-VS = -25 V, VOUT = -10 V
-CMRR
60
∆VCM = -10 V,
+VS = 25.0 V, -VS = -5.0 V,
VOUT = 10 V
Gain bandwidth product 3/
GBWP
VOUT = ±100 mV,
4
01
20
MHz
4
01
2.3
MHz
RL = 500 Ω, f1 = 100 kHz,
f2 = 10 MHz, TA = +25°C
Full power bandwidth 3/ 5/
FPBW
Closed loop stable 3/
gain
CLSG
RL = 500 Ω, CL ≤ 10 pF
4,5,6
01
1
V/V
Slew rate 3/
+SR
VOUT = -5.0 V to +5.0 V,
4
01
200
V/µs
RL = 500 Ω, AV = -1 V/V,
5,6
160
VOUT = +5.0 V to -5.0 V,
4
200
RL = 500 Ω, AV = -1 V/V,
5,6
160
VPK = 10 V, RL = 500 Ω,
TA = +25°C
measured at –5 V to +5 V
-SR
measured at +5 V to -5 V
Rise time 3/ 6/
tR
VOUT = 0 V to +200 mV,
9,10,11
01
11
ns
9,10,11
01
11
ns
AV = +1, RL = 500 Ω
Fall time 3/ 6/
tF
VOUT = 0 V to -200 mV,
AV = +1, RL = 500 Ω
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-90980
A
REVISION LEVEL
D
SHEET
6
TABLE I. Electrical performance characteristics – Continued.
Test
Conditions 1/
-55°C ≤ TA ≤ +125°C
Symbol
±VS = ±15 V
Group A
subgroups
Device
type
9
01
unless otherwise specified
Settling time 3/
tS
Limits 2/
Min
AV = -1 V/V, RL = 500 Ω,
Unit
Max
160
ns
10 V step at 0.1 % of the
final value, TA = +25°C
250
AV = -1 V/V, RL = 500 Ω,
10 V step at 0.01 % of the
final value, TA = +25°C
Overshoot 3/
+OS
9
VOUT = 0 V to +200 mV,
01
50
%
AV = +1 , RL = 500 Ω,
TA = +25°C
-OS
50
VOUT = 0 V to -200 mV,
AV = +1, RL = 500 Ω,
TA = +25°C
1/
Unless otherwise specified, for dc tests, RL = 100 kΩ, VOUT = 0 V, and all other specifications are guaranteed after
the equivalent of five minutes of operation at TA = +25°C.
2/
The algebraic convention, whereby the most negative is a minimum and the most positive is a maximum, is used in this
table. Negative current shall be defined as conventional current flow out of a device terminal.
3/
If not tested, shall be guaranteed to the limits specified in table I herein.
4/
Quiescent power consumption is based on quiescent supply current test maximum with no load on outputs
5/
Full power bandwidth = SR / (2 x π x VPK).
6/
Rise and fall times measured between 10 percent and 90 percent point.
STANDARD
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REVISION LEVEL
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7
Symbol
A
φb
φb1
φD
φD1
e
e1
e2
F
k
k1
L
L1
Q
Inches
Min
Max
0.148
0.181
0.016
0.019
0.016
0.021
0.592
0.615
0.545
0.555
0.400 BSC
0.200 BSC
0.100 BSC
--0.400
0.026
0.036
0.027
0.037
0.375
----0.050
0.010
0.045
Millimeters
Min
Max
3.76
4.60
0.41
0.48
0.41
0.53
15.04
15.62
13.84
14.10
10.16 BSC
5.00 BSC
2.54 BSC
--1.02
0.66
0.91
0.68
0.94
9.50
----1.27
0.25
1.14
Notes
1
1
3
3
3
2
1
NOTES:
1. (All leads) φb applies between L and L1, φb1 applies between L1 and 0.375 inch (9.50 mm) from the reference plane.
2.
3.
Diameter is uncontrolled in L1 and beyond 0.375 inch (9.50 mm) from the reference plane.
Measured from the maximum diameter of the product.
Leads having a maximum diameter 0.019 inch (0.48 mm) measured in gauging plane 0.054 inch (1.37 mm) +
0.001 inch (0.03 mm) – 0.000 inch (0.000 mm) below the base plane of the product are within 0.007 inch (0.18 mm)
of their true position relative to the maximum width tab.
FIGURE 1. Case outline X.
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REVISION LEVEL
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Device type
01
Case outlines
P
X
2
Terminal
number
1
Terminal symbol
BALANCE
NC
NC
2
-INPUT
NC
BALANCE
3
+INPUT
BALANCE
NC
4
-VS
BALANCE
NC
5
NC
-INPUT
-INPUT
6
OUTPUT
+INPUT
NC
7
+VS
NC
+INPUT
8
BALANCE
NC
NC
9
---
NC
NC
10
---
-VS
-VS
11
---
OUTPUT
NC
12
---
+VS
NC
13
---
---
NC
14
---
---
NC
15
---
---
OUTPUT
16
---
---
NC
17
---
---
+VS
18
---
---
NC
19
---
---
NC
20
---
---
BALANCE
NC = No connection
FIGURE 2. Terminal connections.
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4. VERIFICATION
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in
accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
4.2.1 Additional criteria for device class M.
a.
Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
(2) TA = +125°C, minimum.
b.
Interim and final electrical test parameters shall be as specified in table II herein.
4.2.2 Additional criteria for device classes Q and V.
a.
The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under
document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
b.
Interim and final electrical test parameters shall be as specified in table II herein.
c.
Additional screening for device class V beyond the requirements of device class Q shall be as specified in
MIL-PRF-38535, appendix B.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups
A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with
MIL-PRF-38535 including groups A, B, C, D, and E inspections, and as specified herein. Quality conformance inspection for
device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed
for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections
(see 4.4.1 through 4.4.4).
4.4.1 Group A inspection.
a.
Tests shall be as specified in table II herein.
b.
Subgroups 7 and 8 in table I, method 5005 of MIL-STD-883 shall be omitted.
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REVISION LEVEL
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TABLE II. Electrical test requirements.
Test requirements
Interim electrical
parameters (see 4.2)
Final electrical
parameters (see 4.2)
Group A test
requirements (see 4.4)
Group C end-point electrical
parameters (see 4.4)
Group D end-point electrical
parameters (see 4.4)
Group E end-point electrical
parameters (see 4.4)
Subgroups
(in accordance with
MIL-STD-883,
method 5005, table I)
Device
class M
1
Subgroups
(in accordance with
MIL-PRF-38535, table III)
1
1
1,2,3,4,9 1/
1,2,3,4,9 1/
1,2,3,4,9 1/
1,2,3,4,5, 2/
6,9,10,11
1,2,3,4,5, 2/
6,9,10,11
1,2,3,4,5, 2/
6,9,10,11
1
1
1
1
1
1
1
1
1
Device
class Q
Device
class V
1/ PDA applies to subgroup 1.
2/ Subgroups 9, 10, and 11, shall be measured only for initial test and after process or
design changes and shall be guaranteed to the limits specified in table I herein.
4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein.
4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:
a.
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of
MIL-STD-883.
b.
TA = +125°C, minimum.
c.
Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.4.2.1 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,
or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The
test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MILSTD-883.
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein.
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REVISION LEVEL
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4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured
(see 3.5 herein).
a.
End-point electrical parameters shall be as specified in table II herein.
b.
For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as
specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to
radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device
classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25°C ±5°C,
after exposure, to the subgroups specified in table II herein.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes
Q and V or MIL-PRF-38535, appendix A for device class M.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor
prepared specification or drawing.
6.1.2 Substitutability. Device class Q devices will replace device class M devices.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.3 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires
configuration control and which SMD's are applicable to that system. DLA Land and Maritime will maintain a record of users and
this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic
devices (FSC 5962) should contact DLA Land and Maritime-VA, telephone (614) 692-8108.
6.4 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3990,
or telephone (614) 692-0540.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-HDBK-1331.
6.6 Sources of supply.
6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in
MIL-HDBK-103 and QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein)
to DLA Land and Maritime-VA and have agreed to this drawing.
6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103.
The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been
submitted to and accepted by DLA Land and Maritime-VA.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-90980
A
REVISION LEVEL
D
SHEET
12
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 13-04-17
Approved sources of supply for SMD 5962-90980 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DLA Land and Maritime-VA. This information
bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime
maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-9098001MPA
24355
AD843SQ/883B
5962-9098001MXA
24355
AD843SH/883B
5962-9098001M2A
24355
AD843SE/883B
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
Vendor CAGE
number
24355
Vendor name
and address
Analog Devices
RT 1 Industrial Park
PO Box 9106
Norwood, MA 02062
Point of contact: 804 Woburn Street
Wilmington, MA 01887-3462
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.