Features • Fast Read Access Time – 70 ns • 5-volt Only Reprogramming • Sector Program Operation • • • • • • • • • • • – Single Cycle Reprogram (Erase and Program) – 1024 Sectors (128 Bytes/Sector) – Internal Address and Data Latches for 128 Bytes Two 8K Bytes Boot Blocks with Lockout Internal Program Control and Timer Hardware and Software Data Protection Fast Sector Program Cycle Time – 10 ms DATA Polling for End of Program Detection Low Power Dissipation – 50 mA Active Current – 300 µA CMOS Standby Current Typical Endurance > 10,000 Cycles Single 5V ± 10% Supply CMOS and TTL Compatible Inputs and Outputs Commercial and Industrial Temperature Ranges Green (Pb/Halide-free) Packaging Option 1-megabit (128K x 8) 5-volt Only Flash Memory AT29C010A 1. Description The AT29C010A is a 5-volt-only in-system Flash programmable and erasable read only memory (PEROM). Its 1 megabit of memory is organized as 131,072 words by 8 bits. Manufactured with Atmel’s advanced nonvolatile CMOS technology, the device offers access times to 70 ns with power dissipation of just 275 mW over the industrial temperature range. When the device is deselected, the CMOS standby current is less than 300 µA. The device endurance is such that any sector can typically be written to in excess of 10,000 times. To allow for simple in-system reprogrammability, the AT29C010A does not require high input voltages for programming. Five-volt-only commands determine the operation of the device. Reading data out of the device is similar to reading from an EPROM. Reprogramming the AT29C010A is performed on a sector basis; 128 bytes of data are loaded into the device and then simultaneously programmed. During a reprogram cycle, the address locations and 128 bytes of data are internally latched, freeing the address and data bus for other operations. Following the initiation of a program cycle, the device will automatically erase the sector and then program the latched data using an internal control timer. The end of a program cycle can be detected by DATA polling of I/O7. Once the end of a program cycle has been detected, a new access for a read or program can begin. 0394i–FLASH–9/08 2. Pin Configurations Function A0 - A16 Addresses CE Chip Enable OE Output Enable WE Write Enable I/O0 - I/O7 Data Inputs/Outputs NC No Connect 32-lead PLCC Top View 29 28 27 26 25 24 23 22 21 14 15 16 17 18 19 20 5 6 7 8 9 10 11 12 13 A14 A13 A8 A9 A11 OE A10 CE I/O7 I/O1 I/O2 GND I/O3 I/O4 I/O5 I/O6 A7 A6 A5 A4 A3 A2 A1 A0 I/O0 4 3 2 1 32 31 30 A12 A15 A16 NC VCC WE NC 2.1 Pin Name 2.2 32-lead TSOP (Type 1) Top View A11 A9 A8 A13 A14 NC WE VCC NC A16 A15 A12 A7 A6 A5 A4 2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 OE A10 CE I/O7 I/O6 I/O5 I/O4 I/O3 GND I/O2 I/O1 I/O0 A0 A1 A2 A3 AT29C010A 0394i–FLASH–9/08 AT29C010A 3. Block Diagram 4. Device Operation 4.1 Read The AT29C010A is accessed like an EPROM. When CE and OE are low and WE is high, the data stored at the memory location determined by the address pins is asserted on the outputs. The outputs are put in the high impedance state whenever CE or OE is high. This dual-line control gives designers flexibility in preventing bus contention. 4.2 Byte Load Byte loads are used to enter the 128 bytes of a sector to be programmed or the software codes for data protection. A byte load is performed by applying a low pulse on the WE or CE input with CE or WE low (respectively) and OE high. The address is latched on the falling edge of CE or WE, whichever occurs last. The data is latched by the first rising edge of CE or WE. 4.3 Program The device is reprogrammed on a sector basis. If a byte of data within a sector is to be changed, data for the entire sector must be loaded into the device. The data in any byte that is not loaded during the programming of its sector will be indeterminate. Once the bytes of a sector are loaded into the device, they are simultaneously programmed during the internal programming period. After the first data byte has been loaded into the device, successive bytes are entered in the same manner. Each new byte to be programmed must have its high to low transition on WE (or CE) within 150 μs of the low to high transition of WE (or CE) of the preceding byte. If a high to low transition is not detected within 150 μs of the last low to high transition, the load period will end and the internal programming period will start. A7 to A16 specify the sector address. The sector address must be valid during each high to low transition of WE (or CE). A0 to A6 specify the byte address within the sector. The bytes may be loaded in any order; sequential loading is not required. Once a programming operation has been initiated, and for the duration of tWC, a read operation will effectively be a polling operation. 4.4 Software Data Protection A software controlled data protection feature is available on the AT29C010A. Once the software protection is enabled a software algorithm must be issued to the device before a program may be performed. The software protection feature may be enabled or disabled by the user; when 3 0394i–FLASH–9/08 shipped from Atmel, the software data protection feature is disabled. To enable the software data protection, a series of three program commands to specific addresses with specific data must be performed. After the software data protection is enabled the same three program commands must begin each program cycle in order for the programs to occur. All software program commands must obey the sector program timing specifications. Once set, the software data protection feature remains active unless its disable command is issued. Power transitions will not reset the software data protection feature, however the software feature will guard against inadvertent program cycles during power transitions. Once set, software data protection will remain active unless the disable command sequence is issued. After setting SDP, any attempt to write to the device without the 3-byte command sequence will start the internal write timers. No data will be written to the device; however, for the duration of tWC, a read operation will effectively be a polling operation. After the software data protection’s 3-byte command code is given, a byte load is performed by applying a low pulse on the WE or CE input with CE or WE low (respectively) and OE high. The address is latched on the falling edge of CE or WE, whichever occurs last. The data is latched by the first rising edge of CE or WE. The 128 bytes of data must be loaded into each sector by the same procedure as outlined in the program section under device operation. 4.5 Hardware Data Protection Hardware features protect against inadvertent programs to the AT29C010A in the following ways: (a) VCC sense – if VCC is below 3.8V (typical), the program function is inhibited; (b) VCC power on delay – once VCC has reached the VCC sense level, the device will automatically time out 5 ms (typical) before programming; (c) Program inhibit – holding any one of OE low, CE high or WE high inhibits program cycles; and (d) Noise filter—pulses of less than 15 ns (typical) on the WE or CE inputs will not initiate a program cycle. 4.6 Product Identification The product identification mode identifies the device and manufacturer as Atmel. It may be accessed by hardware or software operation. The hardware operation mode can be used by an external programmer to identify the correct programming algorithm for the Atmel product. In addition, users may wish to use the software product identification mode to identify the part (i.e. using the device code), and have the system software use the appropriate sector size for program operations. In this manner, the user can have a common board design for 256K to 4-megabit densities and, with each density’s sector size in a memory map, have the system software apply the appropriate sector size. For details, see Operating Modes (for hardware operation) or Software Product Identification. The manufacturer and device code is the same for both modes. 4.7 DATA Polling The AT29C010A features DATA polling to indicate the end of a program cycle. During a program cycle an attempted read of the last byte loaded will result in the complement of the loaded data on I/O7. Once the program cycle has been completed, true data is valid on all outputs and the next cycle may begin. DATA polling may begin at any time during the program cycle. 4 AT29C010A 0394i–FLASH–9/08 AT29C010A 4.8 Toggle Bit In addition to DATA polling the AT29C010A provides another method for determining the end of a program or erase cycle. During a program or erase operation, successive attempts to read data from the device will result in I/O6 toggling between one and zero. Once the program cycle has completed, I/O6 will stop toggling and valid data will be read. Examining the toggle bit may begin at any time during a program cycle. 4.9 Optional Chip Erase Mode The entire device can be erased by using a 6-byte software code. Please see Software Chip Erase application note for details. 4.10 Boot Block Programming Lockout The AT29C010A has two designated memory blocks that have a programming lockout feature. This feature prevents programming of data in the designated block once the feature has been enabled. Each of these blocks consists of 8K bytes; the programming lockout feature can be set independently for either block. While the lockout feature does not have to be activated, it can be activated for either or both blocks. These two 8K memory sections are referred to as boot blocks. Secure code which will bring up a system can be contained in a boot block. The AT29C010A blocks are located in the first 8K bytes of memory and the last 8K bytes of memory. The boot block programming lockout feature can therefore support systems that boot from the lower addresses of memory or the higher addresses. Once the programming lockout feature has been activated, the data in that block can no longer be erased or programmed; data in other memory locations can still be changed through the regular programming methods. To activate the lockout feature, a series of seven program commands to specific addresses with specific data must be performed. Please see Boot Block Lockout Feature Enable Algorithm. If the boot block lockout feature has been activated on either block, the chip erase function will be disabled. 4.10.1 Boot Block Lockout Detection A software method is available to determine whether programming of either boot block section is locked out. See Software Product Identification Entry and Exit sections. When the device is in the software product identification mode, a read from location 00002 will show if programming the lower address boot block is locked out while reading location 1FFF2 will do so for the upper boot block. If the data is FE, the corresponding block can be programmed; if the data is FF, the program lockout feature has been activated and the corresponding block cannot be programmed. The software product identification exit mode should be used to return to standard operation. 5 0394i–FLASH–9/08 5. Absolute Maximum Ratings* Temperature Under Bias............................... -55° C to +125° C *NOTICE: Storage Temperature .................................... -65° C to +150° C All Input Voltages (including NC Pins) with Respect to Ground ...................................-0.6V to +6.25V All Output Voltages with Respect to Ground .............................-0.6V to VCC + 0.6V Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Voltage on OE with Respect to Ground ...................................-0.6V to +13.5V 6. DC and AC Operating Range Operating Temperature (Case) Industrial VCC Power Supply AT29C010A-70 AT29C010A-90 -40° C - 85° C -40° C - 85° C 5V ± 5% 5V ± 10% 7. Operating Modes Mode Read Program (2) 5V Chip Erase CE OE WE Ai I/O VIL VIL VIH Ai DOUT VIL VIH VIL Ai DIN VIL VIH VIL Ai X (1) VIH X X Program Inhibit X X VIH Program Inhibit X VIL X Output Disable X VIH X VIL VIL VIH Standby/Write Inhibit High Z High Z Product Identification Hardware A1 - A16 = VIL, A9 = VH,(3) A0 = VIL Manufacturer Code(4) A1 - A16 = VIL, A9 = VH,(3) A0 = VIH Device Code(4) A0 = VIL Manufacturer Code(4) A0 = VIH Device Code(4) Software(5) Notes: 1. X can be VIL or VIH. 2. Refer to AC Programming Waveforms. 3. VH = 12.0V ± 0.5V. 4. Manufacturer Code: 1F, Device Code: D5. 5. See details under Software Product Identification Entry/Exit. 6 AT29C010A 0394i–FLASH–9/08 AT29C010A 8. DC Characteristics Symbol Parameter Condition ILI Input Load Current ILO Min Max Units VIN = 0V to VCC 10 µA Output Leakage Current VI/O = 0V to VCC 10 µA 0° - 40°C 30 µA ISB1 VCC Standby Current CMOS CE = VCC - 0.3V to VCC Industrial 300 µA ISB2 VCC Standby Current TTL CE = 2.0V to VCC 3 mA ICC VCC Active Current f = 5 MHz; IOUT = 0 mA 50 mA VIL Input Low Voltage 0.8 V VIH Input High Voltage VOL Output Low Voltage IOL = 2.1 mA VOH1 Output High Voltage IOH = -400 µA 2.4 V VOH2 Output High Voltage CMOS IOH = -100 µA; VCC = 4.5V 4.2 V 2.0 V 0.45 V 9. AC Read Characteristics AT29C010A-70 Symbol Parameter Min Max tACC Address to Output Delay tCE(1) CE to Output Delay tOE(2) OE to Output Delay 0 35 tDF(3)(4) CE or OE to Output Float 0 25 tOH Output Hold from OE, CE or Address, whichever occurred first 0 AT29C010A-90 Min Max Units 70 90 ns 70 90 ns 0 40 ns 0 25 ns 0 ns 10. AC Read Waveforms(1)(2)(3)(4) Notes: 1. CE may be delayed up to tACC - tCE after the address transition without impact on tACC. 2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE or by tACC - tOE after an address change without impact on tACC. 3. tDF is specified from OE or CE whichever occurs first (CL = 5 pF). 4. This parameter is characterized and is not 100% tested. 7 0394i–FLASH–9/08 11. Input Test Waveforms and Measurement Level tR, tF < 5 ns 12. Output Test Load 70 ns 90/120/150 ns 13. Pin Capacitance f = 1 MHz, T = 25°C(1) Symbol Typ Max Units Conditions CIN 4 6 pF VIN = 0V COUT 8 12 pF VOUT = 0V Note: 8 1. This parameter is canharacterized and is not 100% tested. AT29C010A 0394i–FLASH–9/08 AT29C010A 14. AC Byte Load Characteristics Symbol Parameter Min Max Units tAS, tOES Address, OE Set-up Time 0 ns tAH Address Hold Time 50 ns tCS Chip Select Set-up Time 0 ns tCH Chip Select Hold Time 0 ns tWP Write Pulse Width (WE or CE) 90 ns tDS Data Set-up Time 35 ns tDH, tOEH Data, OE Hold Time 0 ns tWPH Write Pulse Width High 100 ns 15. AC Byte Load Waveforms 15.1 WE Controlled 15.2 CE Controlled 9 0394i–FLASH–9/08 16. Program Cycle Characteristics Symbol Parameter Min Max Units tWC Write Cycle Time 10 ms tAS Address Set-up Time 0 ns tAH Address Hold Time 50 ns tDS Data Set-up Time 35 ns tDH Data Hold Time 0 ns tWP Write Pulse Width 90 ns tBLC Byte Load Cycle Time tWPH Write Pulse Width High 150 100 µs ns 17. Program Cycle Waveforms(1)(2)(3) Notes: 1. A7 through A16 must specify the sector address during each high to low transition of WE (or CE). 2. OE must be high when WE and CE are both low. 3. All bytes that are not loaded within the sector being programmed will be indeterminate. 10 AT29C010A 0394i–FLASH–9/08 AT29C010A 18. Software Data Protection Enable Algorithm(1) 19. Software Data Protection Disable Algorithm(1) LOAD DATA AA TO ADDRESS 5555 LOAD DATA AA TO ADDRESS 5555 LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA A0 TO ADDRESS 5555 LOAD DATA TO SECTOR (128 BYTES)(4) LOAD DATA 80 TO ADDRESS 5555 WRITES ENABLED ENTER DATA PROTECT STATE(2) LOAD DATA AA TO ADDRESS 5555 LOAD DATA 55 TO ADDRESS 2AAA Notes: 1. Data Format: I/O7 - I/O0 (Hex); Address Format: A14 - A0 (Hex). 2. Data Protect state will be activated at end of program cycle. 3. Data Protect state will be deactivated at end of program period. 4. 128 bytes of data MUST BE loaded. LOAD DATA 20 TO ADDRESS 5555 EXIT DATA PROTECT STATE(3) LOAD DATA TO SECTOR (128 BYTES)(4) 20. Software Protected Program Cycle Waveform(1)(2)(3) Notes: 1. A7 through A16 must specify the sector address during each high to low transition of WE (or CE) after the software code has been entered. 2. OE must be high when WE and CE are both low. 3. All bytes that are not loaded within the sector being programmed will be indeterminate. 11 0394i–FLASH–9/08 21. Data Polling Characteristics(1) Symbol Parameter tDH Data Hold Time tOEH OE Hold Time Min Max OE to Output Delay tWR Write Recovery Time Units 10 ns 10 ns (2) tOE Notes: Typ ns 0 ns 1. These parameters are characterized and not 100% tested. 2. See tOE spec in AC Read Characteristics. 22. Data Polling Waveforms 23. Toggle Bit Characteristics(1) Symbol Parameter Min tDH Data Hold Time 10 ns tOEH OE Hold Time 10 ns tOE OE to Output Delay(2) tOEHP OE High Pulse tWR Write Recovery Time Notes: Typ Max Units ns 150 ns 0 ns 1. These parameters are characterized and not 100% tested. 2. See tOE spec in AC Read Characteristics. 24. Toggle Bit Waveforms(1)(2)(3) Notes: 1. Toggling either OE or CE or both OE and CE will operate toggle bit. 2. Beginning and ending state of I/O6 will vary. 3. Any address location may be used but the address should not vary. 12 AT29C010A 0394i–FLASH–9/08 AT29C010A 25. Software Product Identification Entry(1) 27. Boot Block Lockout Feature Enable Algorithm(1) LOAD DATA AA TO ADDRESS 5555 LOAD DATA AA TO ADDRESS 5555 LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA 90 TO ADDRESS 5555 LOAD DATA 80 TO ADDRESS 5555 PAUSE 10 mS LOAD DATA AA TO ADDRESS 5555 ENTER PRODUCT IDENTIFICATION MODE(2)(3)(5) LOAD DATA 55 TO ADDRESS 2AAA 26. Software Product Identification Exit(1) LOAD DATA AA TO ADDRESS 5555 LOAD DATA 40 TO ADDRESS 5555 LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA F0 TO ADDRESS 5555 Notes: PAUSE 10 mS Notes: EXIT PRODUCT IDENTIFICATION MODE(4) LOAD DATA 00 TO ADDRESS 00000H(2) LOAD DATA FF TO ADDRESS 1FFFFH(3) PAUSE 20 mS PAUSE 20 mS 1. Data Format: I/O7 - I/O0 (Hex); Address Format: A14 - A0 (Hex). 2. Lockout feature set on lower address boot block. 3. Lockout feature set on higher address boot block. 1. Data Format: I/O7 - I/O0 (Hex); Address Format: A14 - A0 (Hex). 2. A1 - A15 = VIL. Manufacturer Code is read for A0 = VIL; Device Code is read for A0 = VIH. 3. The device does not remain in identification mode if powered down. 4. The device returns to standard operation mode. 5. Manufacturer Code is 1F. The Device Code is D5. 13 0394i–FLASH–9/08 NORMALIZED SUPPLY CURRENT vs. TEMPERATURE 1.4 N O R M A L I Z E D 1.3 1.2 1.1 1.0 I 0.9 C C 0.8 -55 -25 5 35 65 95 125 TEMPERATURE (C) NORMALIZED SUPPLY CURRENT vs. ADDRESS FREQUENCY 1.1 N O R M 1.0 A L I 0.9 Z E D I C C VCC = 5V T = 25C 0.8 0.7 0 1 2 3 4 5 6 7 FREQUENCY (MHz) NORMALIZED SUPPLY CURRENT vs. SUPPLY VOLTAGE 1.4 N O R M 1.2 A L I 1.0 Z E D I C C 0.8 0.6 4.50 4.75 5.00 5.25 5.50 SUPPLY VOLTAGE (V) 14 AT29C010A 0394i–FLASH–9/08 AT29C010A 28. Ordering Information 28.1 Green Package Option (Pb/Halide-free) ICC (mA) tACC (ns) Active Standby 70 50 0.3 90 50 0.3 Ordering Code Package AT29C010A-70JU AT29C010A-70TU 32J 32T AT29C010A-90JU AT29C010A-90TU 32J 32T Operation Range Industrial (-40° to 85° C) Package Type 32J 32-lead, Plastic J-leaded Chip Carrier (PLCC) 32T 32-lead, Thin Small Outline Package (TSOP) 15 0394i–FLASH–9/08 29. Packaging Information 29.1 32J – PLCC 1.14(0.045) X 45˚ PIN NO. 1 IDENTIFIER 1.14(0.045) X 45˚ 0.318(0.0125) 0.191(0.0075) E1 E E2 B1 B e A2 D1 A1 D A 0.51(0.020)MAX 45˚ MAX (3X) COMMON DIMENSIONS (Unit of Measure = mm) D2 Notes: 1. This package conforms to JEDEC reference MS-016, Variation AE. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is .010"(0.254 mm) per side. Dimension D1 and E1 include mold mismatch and are measured at the extreme material condition at the upper or lower parting line. 3. Lead coplanarity is 0.004" (0.102 mm) maximum. SYMBOL MIN NOM MAX A 3.175 – 3.556 A1 1.524 – 2.413 A2 0.381 – – D 12.319 – 12.573 D1 11.354 – 11.506 D2 9.906 – 10.922 E 14.859 – 15.113 E1 13.894 – 14.046 E2 12.471 – 13.487 B 0.660 – 0.813 B1 0.330 – 0.533 e NOTE Note 2 Note 2 1.270 TYP 10/04/01 R 16 2325 Orchard Parkway San Jose, CA 95131 TITLE 32J, 32-lead, Plastic J-leaded Chip Carrier (PLCC) DRAWING NO. REV. 32J B AT29C010A 0394i–FLASH–9/08 AT29C010A 29.2 32T – TSOP PIN 1 0º ~ 8º c Pin 1 Identifier D1 D L b e L1 A2 E A GAGE PLANE SEATING PLANE COMMON DIMENSIONS (Unit of Measure = mm) A1 MIN NOM MAX A – – 1.20 A1 0.05 – 0.15 A2 0.95 1.00 1.05 D 19.80 20.00 20.20 D1 18.30 18.40 18.50 Note 2 E 7.90 8.00 8.10 Note 2 L 0.50 0.60 0.70 SYMBOL Notes: 1. This package conforms to JEDEC reference MO-142, Variation BD. 2. Dimensions D1 and E do not include mold protrusion. Allowable protrusion on E is 0.15 mm per side and on D1 is 0.25 mm per side. 3. Lead coplanarity is 0.10 mm maximum. L1 0.25 BASIC b 0.17 0.22 0.27 c 0.10 – 0.21 e NOTE 0.50 BASIC 10/18/01 R 2325 Orchard Parkway San Jose, CA 95131 TITLE 32T, 32-lead (8 x 20 mm Package) Plastic Thin Small Outline Package, Type I (TSOP) DRAWING NO. REV. 32T B 17 0394i–FLASH–9/08 Headquarters International Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Atmel Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon Hong Kong Tel: (852) 2721-9778 Fax: (852) 2722-1369 Atmel Europe Le Krebs 8, Rue Jean-Pierre Timbaud BP 309 78054 Saint-Quentin-enYvelines Cedex France Tel: (33) 1-30-60-70-00 Fax: (33) 1-30-60-71-11 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Technical Support [email protected] Sales Contact www.atmel.com/contacts Product Contact Web Site www.atmel.com Literature Requests www.atmel.com/literature Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDITIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. © 2008 Atmel Corporation. All rights reserved. Atmel ®, Atmel logo and combinations thereof, and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. 0394i–FLASH–9/08