ATMEL AT27C040-12TC

Features
• Fast Read Access Time – 70 ns
• Low Power CMOS Operation
•
•
•
•
•
•
•
– 100 µA Max Standby
– 30 mA Max Active at 5 MHz
JEDEC Standard Packages
– 32-lead, 600-mil PDIP
– 32-lead PLCC
– 32-lead TSOP
5V ± 10% Supply
High Reliability CMOS Technology
– 2000V ESD Protection
– 200 mA Latchup Immunity
Rapid™ Programming Algorithm – 100 µs/Byte (Typical)
CMOS and TTL Compatible Inputs and Outputs
Integrated Product Identification Code
Commercial and Industrial Temperature Ranges
4-Megabit
(512K x 8)
OTP EPROM
AT27C040
Description
The AT27C040 chip is a low-power, high-performance, 4,194,304-bit one-time programmable read-only memory (OTP EPROM) organized as 512K by 8 bits. The
AT27C040 requires only one 5V power supply in normal read mode operation. Any
byte can be accessed in less than 70 ns, eliminating the need for speed reducing
WAIT states on high-performance microprocessor systems.
TSOP Top View
Pin Configurations
O0 - O7
Outputs
CE
Chip Enable
OE
Output Enable
PDIP Top View
VPP
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
O0
O1
O2
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VCC
A18
A17
A14
A13
A8
A9
A11
OE
A10
CE
07
06
05
04
03
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A10
CE
07
06
05
04
03
GND
02
01
O0
A0
A1
A2
A3
PLCC Top View
A12
A15
A16
VPP
VCC
A18
A17
Addresses
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
A7
A6
A5
A4
A3
A2
A1
A0
O0
4
3
2
1
32
31
30
A0 - A18
A11
A9
A8
A13
A14
A17
A18
VCC
VPP
A16
A15
A12
A7
A6
A5
A4
5
6
7
8
9
10
11
12
13
29
28
27
26
25
24
23
22
21
14
15
16
17
18
19
20
Function
01
02
GND
03
04
05
06
Pin Name
A14
A13
A8
A9
A11
OE
A10
CE
07
0189F–EPROM–4/03
1
Atmel’s scaled CMOS technology provides low active power consumption, and fast programming. Power consumption is typically 8 mA in active mode and less than 10 µA in standby
mode.
The AT27C040 is available in a choice of industry standard JEDEC-approved one-time programmable (OTP) plastic PDIP, PLCC and TSOP packages. The device features two-line
control (CE, OE) to eliminate bus contention in high-speed systems.
Atmel’s AT27C040 has additional features to ensure high quality and efficient production use.
The Rapid Programming Algorithm reduces the time required to program the part and guarantees reliable programming. Programming time is typically only 100 µs/byte. The Integrated
Product Identification Code electronically identifies the device and manufacturer. This feature
is used by industry standard programming equipment to select the proper programming algorithms and voltages.
Switching
Considerations
Switching between active and standby conditions via the Chip Enable pin may produce transient voltage excursions. Unless accommodated by the system design, these transients may
exceed datasheet limits, resulting in device non-conformance. At a minimum, a 0.1 µF high
frequency, low inherent inductance, ceramic capacitor should be utilized for each device. This
capacitor should be connected between the VCC and Ground terminals of the device, as close
to the device as possible. Additionally, to stabilize the supply voltage level on printed circuit
boards with large EPROM arrays, a 4.7 µF bulk electrolytic capacitor should be utilized, again
connected between the VCC and Ground terminals. This capacitor should be positioned as
close as possible to the point where the power supply is connected to the array.
Block Diagram
2
AT27C040
0189F–EPROM–4/03
AT27C040
Operating Modes
Mode/Pin
CE
OE
Ai
Read
VIL
VIL
Ai
X(1)
Output Disable
X
VIH
X
X
High Z
VIH
X
X
X
High Z
Rapid Program
VIL
VIH
Ai
VPP
DIN
PGM Verify
X
VIL
Ai
VPP
DOUT
VIH
VIH
X
VPP
High Z
X
Identification Code
Standby
(2)
PGM Inhibit
(4)
Product Identification
Notes:
1.
2.
3.
4.
VIL
VIL
VH(3)
A9 =
A0 = VIH or VIL
A1 - A18 = VIL
VPP
Outputs
DOUT
X can be VIL or VIH.
Refer to Programming Characteristics
VH = 12.0 ± 0.5V.
Two identifier bytes may be selected. All Ai inputs are held low (VIL), except A9 which is set to VH and A0 which is toggled
low (VIL) to select the Manufacturer’s Identification byte and high (VIH) to select the Device Code byte.
Absolute Maximum Ratings*
Temperature Under Bias................................ -55°C to +125°C
Storage Temperature ..................................... -65°C to +150°C
Voltage on Any Pin with
Respect to Ground ............................................-2.0V to +7.0V
Voltage on A9 with
Respect to Ground .........................................-2.0V to +14.0V
*NOTICE:
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability.
VPP Supply Voltage with
Respect to Ground ..........................................-2.0V to +14.0V
3
0189F–EPROM–4/03
DC and AC Operating Conditions for Read Operation
Operating
Temperature (Case)
Com.
Ind.
VCC Power Supply
AT27C040-70
AT27C040-90
AT27C040-12
AT27C040-15
0°C - 70°C
0°C - 70°C
0°C - 70°C
0°C - 70°C
-40°C - 85°C
-40°C - 85°C
-40°C - 85°C
-40°C - 85°C
5V ± 10%
5V ± 10%
5V ± 10%
5V ± 10%
DC and Operating Characteristics for Read Operation
Symbol
Parameter
Condition
ILI
Input Load Current
Output Leakage Current
ILO
IPP1
(2)
VPP
(1)
Read/Standby Current
VCC1(1) Standby Current
ISB
Min
Max
Units
VIN = 0V to VCC
±1
µA
VOUT = 0V to VCC
±5
µA
VPP = VCC
10
µA
ISB1 (CMOS), CE = VCC ± 0.3V
100
µA
ISB2 (TTL), CE = 2.0 to VCC + 0.5V
1
mA
f = 5 MHz, IOUT = 0 mA, CE = VIL
30
mA
ICC
VCC Active Current
VIL
Input Low Voltage
-0.6
0.8
V
VIH
Input High Voltage
2.0
VCC + 0.5
V
VOL
Output Low Voltage
IOL = 2.1 mA
0.4
V
VOH
Output High Voltage
IOH = -400 µA
Notes:
2.4
V
1. VCC must be applied simultaneously or before VPP, and removed simultaneously or after VPP.
2. VPP may be connected directly to VCC, except during programming. The supply current would then be the sum of ICC and IPP.
AC Characteristics for Read Operation
AT27C040
-70
Symbol
Condition
Address to Output Delay
CE = OE
= VIL
70
90
tCE(2)
CE to Output Delay
OE = VIL
70
tOE(2)(3)
OE to Output Delay
CE = VIL
OE or CE High to Output Float, whichever
occurred first
tACC
tDF
(4)(5)
tOH
Note:
4
Output Hold from Address, CE or OE,
whichever occurred first
0
Max
Min
-12
Parameter
(3)
Min
-90
Max
Units
120
150
ns
90
120
150
ns
30
35
35
40
ns
20
20
30
30
ns
0
Max
Min
-15
0
Max
Min
0
ns
1. 2, 3, 4, 5 – see AC Waveforms for Read Operation
AT27C040
0189F–EPROM–4/03
AT27C040
AC Waveforms for Read Operation(1)
Notes:
1.
2.
3.
4.
5.
Timing measurement references are 0.8V and 2.0V. Input AC drive levels are 0.45V and 2.4V, unless otherwise specified.
OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE.
OE may be delayed up to tACC - tOE after the address is valid without impact on tACC.
This parameter is only sampled and is not 100% tested.
Output float is defined as the point when data is no longer driven.
Input Test Waveforms and Measurement Levels
Output Test Load
1.3V
(1N914)
OUTPUT
PIN
3.3K
CL
Pin Capacitance
f = 1 MHz, T = 25° C (1)
Symbol
Typ
Max
Units
Conditions
CIN
4
8
pF
VIN = 0V
COUT
8
12
pF
VOUT = 0V
Note:
1. Typical values for nominal supply voltage. This parameter is only sampled and is not 100% tested.
5
0189F–EPROM–4/03
Programming Waveforms(1)
Notes:
1. The Input Timing Reference is 0.8V for VIL and 2.0V for VIH.
2. tOE and tDFP are characteristics of the device but must be accommodated by the programmer.
3. When programming the AT27C040 a 0.1 µF capacitor is required across VPP and ground to suppress spurious voltage
transients.
DC Programming Characteristics
TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V
Limits
Symbol
Parameter
Test Conditions
ILI
Input Load Current
VIN = VIL, VIH
VIL
Input Low Level
VIH
Input High Level
VOL
Output Low Voltage
IOL = 2.1 mA
VOH
Output High Voltage
IOH = -400 µA
ICC2
VCC Supply Current (Program and Verify)
IPP2
VPP Supply Current
VID
A9 Product Identification Voltage
6
Min
Max
Units
±10
µA
-0.6
0.8
V
2.0
VCC + 0.7
V
0.4
V
2.4
CE = VIL
11.5
V
40
mA
20
mA
12.5
V
AT27C040
0189F–EPROM–4/03
AT27C040
AC Programming Characteristics
TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V
Limits
(1)
Min
Symbol
Parameter
Test Conditions
tAS
Address Setup Time
tOES
OE Setup Time
Input Rise and Fall Times:
(10% to 90%) 20 ns
tDS
Data Setup Time
tAH
Address Hold Time
tDH
Data Hold Time
tDFP
OE High to Output Float Delay(2)
tVPS
VPP Setup Time
tVCS
VCC Setup Time
Input Pulse Levels:
0.45V to 2.4V
(3)
CE Program Pulse Width
tOE
Data Valid from OE(2)
tPRT
VPP Pulse Rise Time During
Programming
Units
2
µs
2
µs
2
µs
0
µs
2
µs
0
Output Timing Reference Level:
0.8V to 2.0V
tPW
Notes:
Input Timing Reference Level:
0.8V to 2.0V
Max
130
ns
2
µs
2
µs
95
105
µs
150
ns
50
ns
1. VCC must be applied simultaneously or before VPP and removed simultaneously or after VPP.
2. This parameter is only sampled and is not 100% tested. Output Float is defined as the point where data is no longer driven
– see timing diagram.
3. Program Pulse width tolerance is 100 µsec ± 5%.
Atmel’s AT27C040 Integrated Product Identification Code
Pins
Codes
A0
O7
O6
O5
O4
O3
O2
O1
O0
Hex Data
Manufacturer
0
0
0
0
1
1
1
1
0
1E
Device Type
1
0
0
0
0
1
0
1
1
0B
7
0189F–EPROM–4/03
Rapid
Programming
Algorithm
8
A 100 µs CE pulse width is used to program. The address is set to the first location. VCC is
raised to 6.5V and VPP is raised to 13.0V. Each address is first programmed with one 100 µs
CE pulse without verification. Then a verification/reprogramming loop is executed for each
address. In the event a byte fails to pass verification, up to 10 successive 100 µs pulses are
applied with a verification after each pulse. If the byte fails to verify after 10 pulses have been
applied, the part is considered failed. After the byte verifies properly, the next address is
selected until all have been checked. VPP is then lowered to 5.0V and VCC to 5.0V. All bytes
are read again and compared with the original data to determine if the device passes or fails.
AT27C040
0189F–EPROM–4/03
AT27C040
Ordering Information
ICC (mA)
tACC (ns)
Active
Standby
Ordering Code
Package
70
30
0.1
AT27C040-70JC
AT27C040-70PC
AT27C040-70TC
32J
32P6
32T
Commercial
(0° C to 70° C)
30
0.1
AT27C040-70JI
AT27C040-70PI
AT27C040-70TI
32J
32P6
32T
Industrial
(-40° C to 85° C)
30
0.1
AT27C040-90JC
AT27C040-90PC
AT27C040-90TC
32J
32P6
32T
Commercial
(0° C to 70° C)
30
0.1
AT27C040-90JI
AT27C040-90PI
AT27C040-90TI
32J
32P6
32T
Industrial
(-40° C to 85° C)
30
0.1
AT27C040-12JC
AT27C040-12PC
AT27C040-12TC
32J
32P6
32T
Commercial
(0° C to 70° C)
30
0.1
AT27C040-12JI
AT27C040-12PI
AT27C040-12TI
32J
32P6
32T
Industrial
(-40° C to 85° C)
30
0.1
AT27C040-15JC
AT27C040-15PC
AT27C040-15TC
32J
32P6
32T
Commercial
(0° C to 70° C)
30
0.1
AT27C040-15JI
AT27C040-15PI
AT27C040-15TI
32J
32P6
32T
Industrial
(-40° C to 85° C)
90
120
150
Operation Range
Package Type
32J
32-lead, Plastic J-leaded Chip Carrier (PLCC)
32P6
32-lead, 0.600" Wide, Plastic Dual Inline Package (PDIP)
32T
32-lead, Plastic Thin Small Outline Package (TSOP)
9
0189F–EPROM–4/03
Package Information
32J – PLCC
1.14(0.045) X 45˚
PIN NO. 1
IDENTIFIER
1.14(0.045) X 45˚
0.318(0.0125)
0.191(0.0075)
E1
E2
B1
E
B
e
A2
D1
A1
D
A
0.51(0.020)MAX
45˚ MAX (3X)
COMMON DIMENSIONS
(Unit of Measure = mm)
D2
Notes:
1. This package conforms to JEDEC reference MS-016, Variation AE.
2. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is .010"(0.254 mm) per side. Dimension D1
and E1 include mold mismatch and are measured at the extreme
material condition at the upper or lower parting line.
3. Lead coplanarity is 0.004" (0.102 mm) maximum.
SYMBOL
MIN
NOM
MAX
A
3.175
–
3.556
A1
1.524
–
2.413
A2
0.381
–
–
D
12.319
–
12.573
D1
11.354
–
11.506
D2
9.906
–
10.922
E
14.859
–
15.113
E1
13.894
–
14.046
E2
12.471
–
13.487
B
0.660
–
0.813
B1
0.330
–
0.533
e
NOTE
Note 2
Note 2
1.270 TYP
10/04/01
R
10
2325 Orchard Parkway
San Jose, CA 95131
TITLE
32J, 32-lead, Plastic J-leaded Chip Carrier (PLCC)
DRAWING NO.
REV.
32J
B
AT27C040
0189F–EPROM–4/03
AT27C040
32P6 – PDIP
D
PIN
1
E1
A
SEATING PLANE
A1
L
B
B1
e
E
0º ~ 15º
C
COMMON DIMENSIONS
(Unit of Measure = mm)
REF
MIN
NOM
MAX
A
–
–
4.826
A1
0.381
–
–
D
41.783
–
42.291
E
15.240
–
15.875
E1
13.462
–
13.970
B
0.356
–
0.559
B1
1.041
–
1.651
L
3.048
–
3.556
C
0.203
–
0.381
eB
15.494
–
17.526
SYMBOL
eB
Note:
1. Dimensions D and E1 do not include mold Flash or Protrusion.
Mold Flash or Protrusion shall not exceed 0.25 mm (0.010").
e
NOTE
Note 1
Note 1
2.540 TYP
09/28/01
R
2325 Orchard Parkway
San Jose, CA 95131
TITLE
32P6, 32-lead (0.600"/15.24 mm Wide) Plastic Dual
Inline Package (PDIP)
DRAWING NO.
32P6
REV.
B
11
0189F–EPROM–4/03
32T – TSOP
PIN 1
0º ~ 8º
c
Pin 1 Identifier
D1 D
L
b
e
L1
A2
E
A
GAGE PLANE
SEATING PLANE
COMMON DIMENSIONS
(Unit of Measure = mm)
A1
MIN
NOM
MAX
A
–
–
1.20
A1
0.05
–
0.15
A2
0.95
1.00
1.05
D
19.80
20.00
20.20
D1
18.30
18.40
18.50
Note 2
E
7.90
8.00
8.10
Note 2
L
0.50
0.60
0.70
SYMBOL
Notes:
1. This package conforms to JEDEC reference MO-142, Variation BD.
2. Dimensions D1 and E do not include mold protrusion. Allowable
protrusion on E is 0.15 mm per side and on D1 is 0.25 mm per side.
3. Lead coplanarity is 0.10 mm maximum.
L1
0.25 BASIC
b
0.17
0.22
0.27
c
0.10
–
0.21
e
NOTE
0.50 BASIC
10/18/01
R
12
2325 Orchard Parkway
San Jose, CA 95131
TITLE
32T, 32-lead (8 x 20 mm Package) Plastic Thin Small Outline
Package, Type I (TSOP)
DRAWING NO.
REV.
32T
B
AT27C040
0189F–EPROM–4/03
Atmel Corporation
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Printed on recycled paper.
0189F–EPROM–4/03
xM