LX7203-xx EMI Filter & ESD Protection for Up Stream USB Ports ® TM P RODUCTION D ATA S HEET KEY FEATURES DESCRIPTION Small SC70-6L Package Bi-directional EMI/RFI low-pass filter Line termination with integrated ESD protection Low TVS operating voltage (5.25V) Low leakage current Integrated single die construction Crosses From Semtech STF203 bs ol et e The 47 pF capacitor completes the high frequency filter and controls the edge rate of the USB signals The LX7203 protects both D+ and D- data lines and the voltage bus from ESD. The TVS protection diodes exceed the requirements of IEC61000-4-2, level 4, 15kV (air discharge) and 8kV (contact discharge).The integrated configuration of the LX7203 minimizes board space and allows for ideal placement near the connector. The LX7203 is ideal for use in USB hubs, peripherals and portable appliances APPLICATIONS USB 1.1 and USB 2.0 Full Speed Compliant Peripherals Computers and Printers Mobile phones Pagers and PDA’s Digital Cameras IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com PACKAGE ORDER INFO TJ (°C) SM Plastic 6-Pin SC70 Package Marking Tape & Reel Quantity (Reel Size) 31 32 3K (7inches) BENEFITS RoHS Compliant / Pb-free Transition DC: 0450 -40 to 125 -40 to 125 LX7203-15ISM LX7203-22ISM WWW . Microsemi .C OM The LX7203 is an integrated Universal Serial Bus (USB) line termination device with an EMI filter and ESD protection diodes. This device offers a cost effective and compact solution for one USB upstream port. The USB specification requires line termination resistors on both the D+ and D- lines. These resistors ensure signal integrity by matching the cable impedance to that of the differential driver. The 1.5 kΩ pull-up resistor identifies the appropriate data line for full speed or low speed operation. Note: Append the letters “TR” to the part number for Tape & Reel Ordering. Filter response characterized up to 6 GHz <2dB insertion loss in the pass band >20dB attenuation in the 800900 MHz range >12dB attenuation in the WLAN frequencies of 2.4GHz and 5.06.0 GHz PRODUCT HIGHLIGHT Rs D in D out to IC CEDGE 1.5K RS 6 DOUT to IC C VBUS 2 5 2 GND CEDGE D in from connector DIN 1 from connector D out Rs to IC DIN 3 from connector RPU ? 5 VBUS C 4 RS LX7203 O from connector DOUT to IC Functional Schematic with PinOut Circuit Diagram Copyright © 2002 Rev. 1.1d, 2005-05-18 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 1 LX7203-xx EMI Filter & ESD Protection for Up Stream USB Ports ® TM P RODUCTION D ATA S HEET ABSOLUTE MAXIMUM RATINGS PACKAGE PIN OUT DIN 6 DOUT 1 to IC from connector GND 2 5 VBUS DIN 3 4 DOUT to IC bs ol et e from connector WWW . Microsemi .C OM Steady State Power ................................................................100mW ESD Air Discharge per IEC61000-4-2.......................................16kV ESD Contact Discharge per IEC61000-4-2 ...............................10kV Peak Package Solder Reflow Temperature (40 second maximum exposure) ................................. 260°C (+0, -5) Operating Temperature ............................................-40°C to +125°C Storage Temperature Range.....................................-65°C to +150°C Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of specified terminal. SM PACKAGE (Top View) RoHS / Pb-free 100% Matte Tin Lead Finish THERMAL DATA SM Plastic 6-Pin SC70 THERMAL RESISTANCE-JUNCTION TO CASE, θJC THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA 119 °C/W 122 °C/W Junction Temperature Calculation: TJ = TA + (PD x θJA). The θJA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow. FUNCTIONAL PIN DESCRIPTION Name VBUS DIN GND DOUT Description Bus Voltage Data In Ground Data Out ELECTRICAL CHARACTERISTICS Parameter Symbol Stand-Off Voltage Breakdown Voltage Leakage Current Series Resistance (-15) Series Resistance (-22) Temperature Coefficient of RS Pull Up Resistance Capacitor VRWM VBR IR RS RS TCOEFF RPU CEDGE Total Capacitance Copyright © 2002 Rev. 1.1d, 2005-05-18 CTOT Test Conditions IR = 1mA VRWM = 5.25V, T = 25°C Each Line Each Line Each Line Each Line Each Line Between I/O Pins and Ground, Each Device VR = 0V, f = 1MHz Min ≤ +125°C except where LX7203 Typ Max 5.25 6 13.5 19.8 1.35 54 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 15 22 200 1.5 47 60 1 16.5 24.2 1.65 66 Units V V µA Ω Ω ppm KΩ pF pF Page 2 ELECTRICALS O Unless otherwise specified, the following specifications apply over the operating ambient temperature -40°C ≤ TA otherwise noted. LX7203-xx EMI Filter & ESD Protection for Up Stream USB Ports ® TM P RODUCTION D ATA S HEET APPLICATION CIRCUITS Peripheral (upstream port) LX7201 LX7203 RS 1 4 WWW . Microsemi .C OM Host or Hub (downstream port) 6 RS bs ol et e 3 C C USB Transceiver R PD 5 R PU 2 2 RS C 3 6 1 GND V BUS USB Transceiver V BUS GND C R PD 5 4 RS Figure 1 – Typical Application APPLICATION INFORMATION Host USB Transceiver cable FULL SPEED DEVICE (FIGURE 2) The USB 2.0 specification offers a 12 Mbps data transfer rate known as Full-Speed which requires a 1.5 kΩ pull-up resistor to be connected to the D+ line. Slew rate control is accomplished with CEDGE attached to the transceiver before the RS. Voltage Supply (Vbus) is connected to Pin 5 Ground is connected to Pin 2 D+ from the connector is routed to Pin 1 (1.5 kΩ pull-up resistor) and Pin 6 to the D+ line of the USB Transceiver D- from the connector is routed to Pin 3 and Pin 4 to the D- line of the USB Transceiver V BUS V BUS GND GND D+ D+ D- R PU D IN from connector GND 2 D- 6 1 LX7203 3 D IN from connector D OUT to IC APPLICATIONS O The LX7203 meets the requirements of the USB v1.1 and USB 2.0 Full Speed specification for device termination, EMI filtering and ESD protection. The RS resistor provides the proper signal termination; the CEDGE capacitor controls the signal rise and fall slew; the TVS diodes protect the IC from ESD damage; and the total capacitance and resistance creates a low pass filter eliminating the high frequency energy from the circuit. The LX7203 can configure the upstream port for either Full-Speed or Low-Speed operation. The figures below show the proper connection in accordance with the USB specification. Peripheral USB Transceiver 5 V BUS 4 D OUT to IC Figure 2 – Connection for Full Speed Operation Copyright © 2002 Rev. 1.1d, 2005-05-18 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 3 LX7203-xx EMI Filter & ESD Protection for Up Stream USB Ports ® TM P RODUCTION D ATA S HEET APPLICATION INFORMATION (CONTINUED) bs ol et e Voltage Supply (Vbus) is connected to Pin 5 Ground is connected to Pin 2 D+ from the connector is routed to Pin 3 and Pin 4 to the D+ line of the USB Transceiver D- from the connector is routed to Pin 1 (1.5 kΩ pull-up resistor) and Pin 6 to the D- line of the USB Transceiver VBUS Host USB Transceiver cable VBUS GND D+ GND D+ D- 1 DIN from connector RPU 6 DOUT to IC LX7203 GND 2 5 VBUS 3 4 WWW . Microsemi .C OM LOW SPEED DEVICE (FIGURE 3) The USB v1.1 specification offers a 1.5 Mbps data transfer rate known as Low-Speed which requires a 1.5 kΩ pull-up resistor to be connected to the D- line. Slew rate control is accomplished with CEDGE attached to the transceiver before the RS. DPeripheral USB Transceiver DOUT to IC DIN from connector Figure 3 – Connection for Low Speed Operation ELECTROMAGNETIC EMISSION AND SUSCEPTABILITY Copyright © 2002 Rev. 1.1d, 2005-05-18 devices, video monitors, keyboards, control cards, interface boards, external memory expansion cards and other input/output devices that may or may not contain digital circuitry. LX7203 is optimized to minimize the radiated EMI which is the primary concern in devices using USB. Refer to the typical filter response curve for the attenuation characteristics of LX7203 over the frequency range of 30kHz to 6GHz. APPLICATIONS O FCC Part 15 sets limits for maximum allowable EM emission and susceptibility. There are two types of emissions. Conducted emissions with frequency of emission of 0.45 to 30 MHz and radiated emissions with frequency of emission of 30 MHz to 40 GHz. All digital computing devices including the peripheral devices must comply. Examples of peripheral devices include terminals, printers, external floppy disk drives and other data storage Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 4 LX7203-xx EMI Filter & ESD Protection for Up Stream USB Ports ® TM P RODUCTION D ATA S HEET WWW . Microsemi .C OM CHARACTERISTIC CURVES bs ol et e 8KV Contact ESD 1 Ch1 M 5.0VΩ Figure 4 – 8KV ESD input pulse as per IEC61000-4-2. Vertical scale is equivalent to 5A/div. M 40.0ns 5dB / REF 0 dB Figure 5 – Clamping Characteristics when device subjected to an 8 KV ESD pulse. CH1 S12 LOG 20dB / REF 0 dB START 0.030 000 MHz STOP 6 000.000 000 MHz Figure 6 – Frequency response curve. Low insertion loss in the pass band and -20dB attenuation at 800-900 MHz. Better than -10dB attenuation at the WLAN frequencies of 2.4 and 5.0-6.0 GHz. Copyright © 2002 Rev. 1.1d, 2005-05-18 START 0.030 000 MHz STOP 6 000.000 000 MHz Figure 7 – Analog Crosstalk between the two datalines Dand D+ Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 5 GRAPHS O CH1 S12 LOG 5.0V Ω 40.0ns LX7203-xx EMI Filter & ESD Protection for Up Stream USB Ports ® TM P RODUCTION D ATA S HEET SM WWW . Microsemi .C OM PACKAGE DIMENSIONS 6 Pin Plastic SC70 B MILLIMETERS MIN MAX 1.15 1.35 1.80 2.20 1.80 2.40 0.15 0.30 0.65 BSC 0.10 0.40 0 0.10 0.80 1.00 0.80 1.10 0.10 0.18 0.10 0.30 INCHES MIN MAX 0.045 0.053 0.071 0.086 0.071 0.094 0.006 0.012 0.026 BSC 0.004 0.016 0 0.004 0.032 0.039 0.032 0.043 0.004 0.007 0.004 0.012 bs ol et e K Dim A B C D E F G H I J K F C A G D J E Note: H I 1. Dimensions do not include mold flash or protrusions; these shall not exceed 0.155mm(.006”) on any side. Lead dimension shall not include solder coverage. Recommended Footprint X Dim C D E X Y O Y C (ref) MILLIMETERS MIN MAX 1.60 1.30 0.65 0.35 0.90 INCHES MIN MAX 0.063 0.052 0.026 0.014 0.035 MECHANICALS E (ref) D (ref) Copyright © 2002 Rev. 1.1d, 2005-05-18 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 6 LX7203-xx ® TM EMI Filter & ESD Protection for Up Stream USB Ports P RODUCTION D ATA S HEET O bs ol et e WWW . Microsemi .C OM NOTES NOTES PRODUCTION DATA – Information contained in this document is proprietary to Microsemi and is current as of publication date. This document may not be modified in any way without the express written consent of Microsemi. Product processing does not necessarily include testing of all parameters. Microsemi reserves the right to change the configuration and performance of the product and to discontinue product at any time. Copyright © 2002 Rev. 1.1d, 2005-05-18 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 7