CY7C1380D
CY7C1380F
CY7C1382D
18-Mbit (512K × 36/1M × 18)
Pipelined SRAM
18-Mbit (512K × 36/1M × 18) Pipelined SRAM
Functional Description
■
Supports bus operation up to 250 MHz
■
Available speed grades are 250, 200, and 167 MHz
■
Registered inputs and outputs for pipelined operation
■
3.3 V core power supply
■
2.5 V or 3.3 V I/O power supply
■
Fast clock-to-output times
❐ 2.6 ns (for 250 MHz device)
■
Provides high performance 3-1-1-1 access rate
■
User selectable burst counter supporting Intel® Pentium®
interleaved or linear burst sequences
■
Separate processor and controller address strobes
■
Synchronous self-timed write
■
Asynchronous output enable
■
Single cycle chip deselect
■
CY7C1380D/CY7C1382D is available in JEDEC-standard
Pb-free 100-pin TQFP package; CY7C1380F is available in
non Pb-free 165-ball FBGA package
■
IEEE 1149.1 JTAG-Compatible Boundary Scan
■
ZZ sleep mode option
The CY7C1380D/CY7C1380F/CY7C1382D SRAM integrates
524,288 × 36 and 1,048,576 × 18 SRAM cells with advanced
synchronous peripheral circuitry and a two-bit counter for
internal burst operation. All synchronous inputs are gated by
registers controlled by a positive edge triggered clock input
(CLK). The synchronous inputs include all addresses, all data
inputs, address-pipelining chip enable (CE1), depth-expansion
chip enables (CE2 and CE3), burst control inputs (ADSC, ADSP,
and ADV), write enables (BWX, and BWE), and global write
(GW). Asynchronous inputs include the output enable (OE) and
the ZZ pin.
Addresses and chip enables are registered at rising edge of
clock when address strobe processor (ADSP) or address strobe
controller (ADSC) are active. Subsequent burst addresses can
be internally generated as they are controlled by the advance pin
(ADV).
Address, data inputs, and write controls are registered on-chip
to initiate a self-timed write cycle. This part supports byte write
operations (see Pin Definitions on page 6 and Truth Table on
page 10 for further details). Write cycles can be one to two or four
bytes wide as controlled by the byte write control inputs. GW
when active LOW causes all bytes to be written.
The CY7C1380D/CY7C1380F/CY7C1382D operates from a
+3.3 V core power supply while all outputs operate with a +2.5
or +3.3 V power supply. All inputs and outputs are
JEDEC-standard and JESD8-5-compatible.
For a complete list of related documentation, click here.
Selection Guide
250 MHz
200 MHz
167 MHz
Unit
Maximum Access Time
Description
2.6
3.0
3.4
ns
Maximum Operating Current
350
300
275
mA
Maximum CMOS Standby Current
70
70
70
mA
Errata: For information on silicon errata, see “Errata” on page 32. Details include trigger conditions, devices affected, and proposed workaround.
Cypress Semiconductor Corporation
Document Number: 38-05543 Rev. *S
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised March 29, 2016
Not Recommended for New Designs.
Features
CY7C1380D
CY7C1380F
CY7C1382D
Logic Block Diagram – CY7C1380D/CY7C1380F
A0, A1, A
ADDRESS
REGISTER
2
A [1:0]
MODE
ADV
CLK
Q1
BURST
COUNTER
CLR AND
LOGIC
ADSC
Q0
BW D
DQ D , DQP D
BYTE
WRITE REGISTER
DQ D ,DQP D
BYTE
WRITE DRIVER
BW C
DQ C , DQP C
BYTE
WRITE REGISTER
DQ C , DQP C
BYTE
WRITE DRIVER
DQ B , DQP B
BYTE
WRITE REGISTER
DQ B , DQP B
BYTE
WRITE DRIVER
BW B
BW A
BWE
ZZ
SENSE
AMPS
OUTPUT
REGISTERS
OUTPUT
BUFFERS
E
DQs
DQP A
DQP B
DQP C
DQP D
DQ A , DQP A
BYTE
WRITE DRIVER
DQ A , DQP A
BYTE
WRITE REGISTER
GW
CE 1
CE 2
CE 3
OE
MEMORY
ARRAY
ENABLE
REGISTER
INPUT
REGISTERS
PIPELINED
ENABLE
SLEEP
CONTROL
Logic Block Diagram – CY7C1382D
A0, A1, A
ADDRESS
REGISTER
2
BURST Q1
COUNTER AND
LOGIC
ADV
CLK
ADSC
BW B
DQ B, DQP B
WRITE DRIVER
DQ B, DQP B
WRITE REGISTER
MEMORY
ARRAY
BW A
SENSE
OUTPUT
OUTPUT
BUFFERS
DQs
DQP A
DQP B
DQ A, DQP A
WRITE DRIVER
DQ A, DQP A
WRITE REGISTER
BWE
GW
CE 1
CE2
CE3
INPUT
ENABLE
REGISTER
PIPELINED
ENABLE
OE
ZZ
SLEEP
CONTROL
Document Number: 38-05543 Rev. *S
Page 2 of 38
Not Recommended for New Designs.
ADSP
CY7C1380D
CY7C1380F
CY7C1382D
Pin Configurations ........................................................... 4
Pin Definitions .................................................................. 6
Functional Overview ........................................................ 8
Single Read Accesses ................................................ 8
Single Write Accesses Initiated by ADSP ................... 8
Single Write Accesses Initiated by ADSC ................... 8
Burst Sequences ......................................................... 8
Sleep Mode ................................................................. 9
Interleaved Burst Address Table ................................. 9
Linear Burst Address Table ......................................... 9
ZZ Mode Electrical Characteristics .............................. 9
Truth Table ...................................................................... 10
Truth Table for Read/Write ............................................ 11
Truth Table for Read/Write ............................................ 11
IEEE 1149.1 Serial Boundary Scan (JTAG [13]) ........... 12
Disabling the JTAG Feature ...................................... 12
Test Access Port (TAP) ............................................. 12
PERFORMING A TAP RESET .................................. 12
TAP REGISTERS ...................................................... 12
TAP Instruction Set ................................................... 13
TAP Controller State Diagram ....................................... 14
TAP Controller Block Diagram ...................................... 15
TAP Timing ...................................................................... 16
TAP AC Switching Characteristics ............................... 16
3.3 V TAP AC Test Conditions ....................................... 17
3.3 V TAP AC Output Load Equivalent ......................... 17
2.5 V TAP AC Test Conditions ....................................... 17
2.5 V TAP AC Output Load Equivalent ......................... 17
TAP DC Electrical Characteristics
and Operating Conditions ............................................. 17
Identification Register Definitions ................................ 18
Document Number: 38-05543 Rev. *S
Scan Register Sizes ....................................................... 18
Identification Codes ....................................................... 18
Boundary Scan Order .................................................... 19
Maximum Ratings ........................................................... 20
Operating Range ............................................................. 20
Electrical Characteristics ............................................... 20
Capacitance .................................................................... 21
Thermal Resistance ........................................................ 21
AC Test Loads and Waveforms ..................................... 22
Switching Characteristics .............................................. 23
Switching Waveforms .................................................... 24
Ordering Information ...................................................... 28
Ordering Code Definitions ......................................... 28
Package Diagrams .......................................................... 29
Acronyms ........................................................................ 31
Document Conventions ................................................. 31
Units of Measure ....................................................... 31
Errata ............................................................................... 32
Part Numbers Affected .............................................. 32
Product Status ........................................................... 32
Ram9 Sync ZZ Pin
& JTAG Issues Errata Summary ...................................... 32
Document History Page ................................................. 34
Sales, Solutions, and Legal Information ...................... 38
Worldwide Sales and Design Support ....................... 38
Products .................................................................... 38
PSoC® Solutions ...................................................... 38
Cypress Developer Community ................................. 38
Technical Support ..................................................... 38
Page 3 of 38
Not Recommended for New Designs.
Contents
CY7C1380D
CY7C1380F
CY7C1382D
Pin Configurations
Figure 1. 100-pin TQFP (14 × 20 × 1.4 mm) pinout (3-Chip Enable) [1]
CY7C1382D (1M × 18)
Not Recommended for New Designs.
CY7C1380D (512K × 36)
Note
1. Errata: The ZZ pin (Pin 64) needs to be externally connected to ground. For more information, see “Errata” on page 32.
Document Number: 38-05543 Rev. *S
Page 4 of 38
CY7C1380D
CY7C1380F
CY7C1382D
Pin Configurations (continued)
Figure 2. 165-ball FBGA (13 × 15 × 1.4 mm) pinout (3-Chip Enable) [2, 3]
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
NC/288M
R
2
3
4
5
6
7
8
9
10
11
CE1
BWC
BWB
CE3
NC
BWE
ADSC
ADV
A
NC/144M
A
CE2
BWD
BWA
CLK
GW
OE
ADSP
A
NC/576M
DQPC
DQC
NC
DQC
VDDQ
VSS
VDD
VSS
VSS
VSS
VSS
VSS
VSS
VDD
VDDQ
VDDQ
NC/1G
DQB
DQPB
DQB
DQC
DQC
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
DQB
DQB
DQC
DQC
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
DQB
DQB
DQC
NC
DQD
DQC
NC
DQD
VDDQ
NC
VDDQ
VDD
VDD
VDD
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VDD
VDD
VDD
VDDQ
NC
VDDQ
DQB
NC
DQA
DQB
ZZ
DQA
DQD
DQD
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
DQA
DQA
A
VSS
VDDQ
DQD
DQD
VDDQ
VDD
VSS
VSS
VSS
VDD
VDDQ
DQA
DQA
DQD
DQPD
DQD
NC
VDDQ
VDDQ
VDD
VSS
VSS
NC
VSS
A
VSS
NC
VDD
VSS
VDDQ
VDDQ
DQA
NC
DQA
DQPA
NC
NC/72M
A
A
TDI
A1
TDO
A
A
A
A
MODE
NC/36M
A
A
TMS
TCK
A
A
A
A
A0
Notes
2. Errata: The ZZ ball (H11) needs to be externally connected to ground. For more information, see “Errata” on page 32.
3. Errata: The JTAG testing should be performed with these devices in BYPASS mode as the JTAG functionality is not guaranteed. For more information, see “Errata”
on page 32.
Document Number: 38-05543 Rev. *S
Page 5 of 38
Not Recommended for New Designs.
CY7C1380F (512K × 36)
CY7C1380D
CY7C1380F
CY7C1382D
Pin Definitions
Name
A0, A1, A
I/O
Description
InputAddress inputs used to select one of the address locations. Sampled at the rising edge of the CLK
Synchronous if ADSP or ADSC is active LOW, and CE1, CE2, and CE3 are sampled active. A1:A0 are fed to the two-bit
counter.
GW
InputGlobal write enable input, active LOW. When asserted LOW on the rising edge of CLK, a global write
Synchronous is conducted (all bytes are written, regardless of the values on BWX and BWE).
BWE
InputByte write enable input, active LOW. Sampled on the rising edge of CLK. This signal must be asserted
Synchronous LOW to conduct a byte write.
CLK
InputClock
Clock input. Used to capture all synchronous inputs to the device. Also used to increment the burst
counter when ADV is asserted LOW, during a burst operation.
CE1
InputChip enable 1 input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with CE2
Synchronous and CE3 to select or deselect the device. ADSP is ignored if CE1 is HIGH. CE1 is sampled only when a
new external address is loaded.
CE2
InputChip enable 2 input, active HIGH. Sampled on the rising edge of CLK. Used in conjunction with CE1
Synchronous and CE3 to select or deselect the device. CE2 is sampled only when a new external address is loaded.
CE3
InputChip enable 3 input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with CE1
Synchronous and CE2 to select or deselect the device. CE3 is sampled only when a new external address is loaded.
OE
InputOutput enable, asynchronous input, active LOW. Controls the direction of the I/O pins. When LOW,
Asynchronou the I/O pins behave as outputs. When deasserted HIGH, I/O pins are tri-stated, and act as input data
s
pins. OE is masked during the first clock of a read cycle when emerging from a deselected state.
ADV
InputAdvance input signal, sampled on the rising edge of CLK, active LOW. When asserted, it
Synchronous automatically increments the address in a burst cycle.
ADSP
InputAddress strobe from processor, sampled on the rising edge of CLK, active LOW. When asserted
Synchronous LOW, addresses presented to the device are captured in the address registers. A1:A0 are also loaded
into the burst counter. When ADSP and ADSC are both asserted, only ADSP is recognized. ASDP is
ignored when CE1 is deasserted HIGH.
ADSC
InputAddress strobe from controller, sampled on the rising edge of CLK, active LOW. When asserted
Synchronous LOW, addresses presented to the device are captured in the address registers. A1:A0 are also loaded
into the burst counter. When ADSP and ADSC are both asserted, only ADSP is recognized.
ZZ [4]
InputZZ sleep input. This active HIGH input places the device in a non-time critical sleep condition with data
Asynchronou integrity preserved. For normal operation, this pin has to be LOW or left floating. ZZ pin has an internal
s
pull down.
DQs,
DQPX
I/OBidirectional data I/O lines. As inputs, they feed into an on-chip data register that is triggered by the
Synchronous rising edge of CLK. As outputs, they deliver the data contained in the memory location specified by the
addresses presented during the previous clock rise of the read cycle. The direction of the pins is
controlled by OE. When OE is asserted LOW, the pins behave as outputs. When HIGH, DQs and DQPX
are placed in a tri-state condition.
VDD
Power Supply Power supply inputs to the core of the device
VSS
Ground
Ground for the core of the device.
VSSQ
I/O Ground
Ground for the I/O circuitry.
VDDQ
I/O Power
Supply
Power supply for the I/O circuitry.
MODE
Input-Static
Selects burst order. When tied to GND selects linear burst sequence. When tied to VDD or left floating
selects interleaved burst sequence. This is a strap pin and must remain static during device operation.
Mode pin has an internal pull up.
Note
4. Errata: The ZZ pin needs to be externally connected to ground. For more information, see “Errata” on page 32.
Document Number: 38-05543 Rev. *S
Page 6 of 38
Not Recommended for New Designs.
InputByte write select inputs, active LOW. Qualified with BWE to conduct byte writes to the SRAM. Sampled
BWA, BWB,
BWC, BWD Synchronous on the rising edge of CLK.
CY7C1380D
CY7C1380F
CY7C1382D
Pin Definitions (continued)
TDO
[5]
I/O
Description
JTAG serial Serial data-out to the JTAG circuit. Delivers data on the negative edge of TCK. If the JTAG feature is
not being utilized, this pin must be disconnected. This pin is not available on TQFP packages.
output
Synchronous
TDI [5]
JTAG serial Serial data-in to the JTAG circuit. Sampled on the rising edge of TCK. If the JTAG feature is not being
utilized, this pin can be disconnected or connected to VDD. This pin is not available on TQFP packages.
input
Synchronous
TMS [5]
JTAG serial Serial data-in to the JTAG circuit. Sampled on the rising edge of TCK. If the JTAG feature is not being
utilized, this pin can be disconnected or connected to VDD. This pin is not available on TQFP packages.
input
Synchronous
TCK [5]
NC
JTAGClock
Clock input to the JTAG circuitry. If the JTAG feature is not being utilized, this pin must be connected
to VSS. This pin is not available on TQFP packages.
–
No Connects. 36M, 72M, 144M, 288M, 576M, and 1G are address expansion pins and are not internally
connected to the die.
Note
5. Errata: The JTAG testing should be performed with these devices in BYPASS mode as the JTAG functionality is not guaranteed. For more information, see “Errata”
on page 32.
Document Number: 38-05543 Rev. *S
Page 7 of 38
Not Recommended for New Designs.
Name
CY7C1380D
CY7C1380F
CY7C1382D
All synchronous inputs pass through input registers controlled by
the rising edge of the clock. All data outputs pass through output
registers controlled by the rising edge of the clock. Maximum
access delay from the clock rise (tCO) is 2.6 ns (250 MHz device).
CY7C1380D/CY7C1380F/CY7C1382D supports secondary
cache in systems using a linear or interleaved burst sequence.
The interleaved burst order supports Pentium and i486
processors. The linear burst sequence suits processors that use
a linear burst sequence. The burst order is user selectable, and
is determined by sampling the MODE input. Accesses can be
initiated with either the processor address strobe (ADSP) or the
controller address strobe (ADSC). Address advancement
through the burst sequence is controlled by the ADV input. A
two-bit on-chip wraparound burst counter captures the first
address in a burst sequence and automatically increments the
address for the rest of the burst access.
Byte write operations are qualified with the byte write enable
(BWE) and byte write select (BWX) inputs. A global write enable
(GW) overrides all byte write inputs and writes data to all four
bytes. All writes are simplified with on-chip synchronous
self-timed write circuitry.
Three synchronous chip selects (CE1, CE2, CE3) and an
asynchronous output enable (OE) provide for easy bank
selection and output tri-state control. ADSP is ignored if CE1 is
HIGH.
Single Read Accesses
This access is initiated when the following conditions are
satisfied at clock rise: (1) ADSP or ADSC is asserted LOW,
(2) CE1, CE2, CE3 are all asserted active, and (3) the write
signals (GW, BWE) are all deserted HIGH. ADSP is ignored if
CE1 is HIGH. The address presented to the address inputs (A)
is stored into the address advancement logic and the address
register while being presented to the memory array. The
corresponding data is enabled to propagate to the input of the
output registers. At the rising edge of the next clock, the data is
enabled to propagate through the output register and onto the
data bus within 2.6 ns (250 MHz device) if OE is active LOW. The
only exception occurs when the SRAM is emerging from a
deselected state to a selected state; its outputs are always
tri-stated during the first cycle of the access. After the first cycle
of the access, the outputs are controlled by the OE signal.
Consecutive single read cycles are supported. Once the SRAM
is deselected at clock rise by the chip select and either ADSP or
ADSC signals, its output tri-states immediately.
Single Write Accesses Initiated by ADSP
This access is initiated when both the following conditions are
satisfied at clock rise: (1) ADSP is asserted LOW and (2) CE1,
CE2, and CE3 are all asserted active. The address presented to
A is loaded into the address register and the address
advancement logic while being delivered to the memory array.
Document Number: 38-05543 Rev. *S
The write signals (GW, BWE, and BWX) and ADV inputs are
ignored during this first cycle.
ADSP triggered write accesses require two clock cycles to
complete. If GW is asserted LOW on the second clock rise, the
data presented to the DQs inputs is written into the
corresponding address location in the memory array. If GW is
HIGH, then the write operation is controlled by BWE and BWX
signals.
CY7C1380D/CY7C1380F/CY7C1382D provides byte write
capability that is described in the write cycle descriptions table.
Asserting the byte write enable input (BWE) with the selected
byte write (BWX) input, selectively writes to only the desired
bytes. Bytes not selected during a byte write operation remain
unaltered. A synchronous self-timed write mechanism has been
provided to simplify the write operations.
CY7C1380D/CY7C1380F/CY7C1382D is a common I/O device,
the output enable (OE) must be deserted HIGH before
presenting data to the DQs inputs. Doing so tri-states the output
drivers. As a safety precaution, DQs are automatically tri-stated
whenever a write cycle is detected, regardless of the state of OE.
Single Write Accesses Initiated by ADSC
ADSC write accesses are initiated when the following conditions
are satisfied: (1) ADSC is asserted LOW, (2) ADSP is deserted
HIGH, (3) CE1, CE2, and CE3 are all asserted active, and (4) the
appropriate combination of the write inputs (GW, BWE, and
BWX) are asserted active to conduct a write to the desired
byte(s). ADSC-triggered Write accesses require a single clock
cycle to complete. The address presented to A is loaded into the
address register and the address advancement logic while being
delivered to the memory array. The ADV input is ignored during
this cycle. If a global write is conducted, the data presented to
the DQs is written into the corresponding address location in the
memory core. If a byte write is conducted, only the selected bytes
are written. Bytes not selected during a byte write operation
remain unaltered. A synchronous self-timed write mechanism
has been provided to simplify the write operations.
CY7C1380D/CY7C1380F/CY7C1382D is a common I/O device,
the output enable (OE) must be deserted HIGH before
presenting data to the DQs inputs. Doing so tri-states the output
drivers. As a safety precaution, DQs are automatically tri-stated
whenever a write cycle is detected, regardless of the state of OE.
Burst Sequences
CY7C1380D/CY7C1380F/CY7C1382D provides a two-bit
wraparound counter, fed by A1:A0, that implements an
interleaved or a linear burst sequence. The interleaved burst
sequence is designed specifically to support Intel Pentium
applications. The linear burst sequence is designed to support
processors that follow a linear burst sequence. The burst
sequence is user selectable through the MODE input.
Asserting ADV LOW at clock rise automatically increments the
burst counter to the next address in the burst sequence. Both
read and write burst operations are supported.
Page 8 of 38
Not Recommended for New Designs.
Functional Overview
CY7C1380D
CY7C1380F
CY7C1382D
Sleep Mode
The ZZ input pin is an asynchronous input. Asserting ZZ places
the SRAM in a power conservation sleep mode. Two clock cycles
are required to enter into or exit from this sleep mode. While in
this mode, data integrity is guaranteed. Accesses pending when
entering the sleep mode are not considered valid nor is the
completion of the operation guaranteed. The device must be
deselected prior to entering the sleep mode. CE1, CE2, CE3,
ADSP, and ADSC must remain inactive for the duration of tZZREC
after the ZZ input returns LOW.
Linear Burst Address Table
(MODE = GND)
First
Address
A1:A0
Second
Address
A1:A0
Third
Address
A1:A0
Fourth
Address
A1:A0
00
01
10
11
01
10
11
00
10
11
00
01
11
00
01
10
(MODE = Floating or VDD)
First
Address
A1:A0
Second
Address
A1:A0
Third
Address
A1:A0
Fourth
Address
A1:A0
00
01
10
11
01
00
11
10
10
11
00
01
11
10
01
00
ZZ Mode Electrical Characteristics
Parameter
Description
Test Conditions
Min
Max
Unit
IDDZZ
Sleep mode standby current
ZZ > VDD– 0.2 V
–
80
mA
tZZS
Device operation to ZZ
ZZ > VDD – 0.2 V
–
2tCYC
ns
tZZREC
ZZ recovery time
ZZ < 0.2 V
2tCYC
–
ns
tZZI
ZZ Active to sleep current
This parameter is sampled
–
2tCYC
ns
tRZZI
ZZ Inactive to exit sleep current
This parameter is sampled
0
–
ns
Document Number: 38-05543 Rev. *S
Page 9 of 38
Not Recommended for New Designs.
Interleaved Burst Address Table
CY7C1380D
CY7C1380F
CY7C1382D
Truth Table
The Truth Table for CY7C1380D/CY7C1380F/CY7C1382D follows. [6, 7, 8, 9, 10]
Add. Used
CE1 CE2 CE3 ZZ ADSP ADSC ADV WRITE OE CLK
DQ
Deselect Cycle, Power Down
None
H
X
X
L
X
L
X
X
X
L–H Tri-state
Deselect Cycle, Power Down
None
L
L
X
L
L
X
X
X
X
L–H Tri-state
Deselect Cycle, Power Down
None
L
X
H
L
L
X
X
X
X
L–H Tri-state
Deselect Cycle, Power Down
None
L
L
X
L
H
L
X
X
X
L–H Tri-state
Deselect Cycle, Power Down
None
L
X
H
L
H
L
X
X
X
L–H Tri-state
Sleep Mode, Power Down
None
X
X
X
H
X
X
X
X
X
X
Tri-state
READ Cycle, Begin Burst
External
L
H
L
L
L
X
X
X
L
L–H
Q
READ Cycle, Begin Burst
External
L
H
L
L
L
X
X
X
H
L–H Tri-state
WRITE Cycle, Begin Burst
External
L
H
L
L
H
L
X
L
X
L–H
D
READ Cycle, Begin Burst
External
L
H
L
L
H
L
X
H
L
L–H
Q
READ Cycle, Begin Burst
External
L
H
L
L
H
L
X
H
H
L–H Tri-state
READ Cycle, Continue Burst
Next
X
X
X
L
H
H
L
H
L
L–H
READ Cycle, Continue Burst
Next
X
X
X
L
H
H
L
H
H
L–H Tri-state
READ Cycle, Continue Burst
Next
H
X
X
L
X
H
L
H
L
L–H
READ Cycle, Continue Burst
Next
H
X
X
L
X
H
L
H
H
L–H Tri-state
WRITE Cycle, Continue Burst
Next
X
X
X
L
H
H
L
L
X
L–H
D
WRITE Cycle, Continue Burst
Next
H
X
X
L
X
H
L
L
X
L–H
D
READ Cycle, Suspend Burst
Current
X
X
X
L
H
H
H
H
L
L–H
Q
READ Cycle, Suspend Burst
Current
X
X
X
L
H
H
H
H
H
L–H Tri-state
READ Cycle, Suspend Burst
Current
H
X
X
L
X
H
H
H
L
L–H
READ Cycle, Suspend Burst
Current
H
X
X
L
X
H
H
H
H
L–H Tri-state
WRITE Cycle, Suspend Burst
Current
X
X
X
L
H
H
H
L
X
L–H
D
WRITE Cycle, Suspend Burst
Current
H
X
X
L
X
H
H
L
X
L–H
D
Q
Q
Q
Notes
6. X = Don't Care, H = Logic HIGH, L = Logic LOW.
7. WRITE = L when any one or more byte write enable signals, and BWE = L or GW = L. WRITE = H when all byte write enable signals, BWE, GW = H.
8. The DQ pins are controlled by the current cycle and the OE signal. OE is asynchronous and is not sampled with the clock.
9. The SRAM always initiates a read cycle when ADSP is asserted, regardless of the state of GW, BWE, or BWX. Writes may occur only on subsequent clocks after
the ADSP or with the assertion of ADSC. As a result, OE must be driven HIGH prior to the start of the write cycle to allow the outputs to tri-state. OE is a don't care
for the remainder of the write cycle.
10. OE is asynchronous and is not sampled with the clock rise. It is masked internally during write cycles. During a read cycle all data bits are tri-state when OE is inactive
or when the device is deselected, and all data bits behave as output when OE is active (LOW).
Document Number: 38-05543 Rev. *S
Page 10 of 38
Not Recommended for New Designs.
Operation
CY7C1380D
CY7C1380F
CY7C1382D
Truth Table for Read/Write
Function (CY7C1380D/CY7C1380F)
GW
BWE
BWD
BWC
BWB
BWA
Read
H
H
X
X
X
X
Read
H
L
H
H
H
H
Write Byte A – (DQA and DQPA)
H
L
H
H
H
L
Write Byte B – (DQB and DQPB)
H
L
H
H
L
H
Write Bytes B, A
H
L
H
H
L
L
Write Byte C – (DQC and DQPC)
H
L
H
L
H
H
Write Bytes C, A
H
L
H
L
H
L
Write Bytes C, B
H
L
H
L
L
H
Write Bytes C, B, A
H
L
H
L
L
L
Write Byte D – (DQD and DQPD)
H
L
L
H
H
H
Write Bytes D, A
H
L
L
H
H
L
Write Bytes D, B
H
L
L
H
L
H
Write Bytes D, B, A
H
L
L
H
L
L
Write Bytes D, C
H
L
L
L
H
H
Write Bytes D, C, A
H
L
L
L
H
L
Write Bytes D, C, B
H
L
L
L
L
H
Write All Bytes
H
L
L
L
L
L
Write All Bytes
L
X
X
X
X
X
Truth Table for Read/Write
The Truth Table for Read/Write for CY7C1382D follows. [11, 12]
Function (CY7C1382D)
GW
BWE
BWB
BWA
Read
H
H
X
X
Read
H
L
H
H
Write Byte A – (DQA and DQPA)
H
L
H
L
Write Byte B – (DQB and DQPB)
H
L
L
H
Write Bytes B, A
H
L
L
L
Write All Bytes
H
L
L
L
Write All Bytes
L
X
X
X
Notes
11. X = Don't Care, H = Logic HIGH, L = Logic LOW.
12. Table only lists a partial listing of the byte write combinations. Any combination of BWX is valid. Appropriate write is done based on which byte write is active.
Document Number: 38-05543 Rev. *S
Page 11 of 38
Not Recommended for New Designs.
The Truth Table for Read/Write for CY7C1380D/CY7C1380F follows. [11, 12]
CY7C1380D
CY7C1380F
CY7C1382D
The CY7C1380F incorporates a serial boundary scan test
access port (TAP).This part is fully compliant with 1149.1. The
TAP operates using JEDEC-standard 3.3 V or 2.5 V I/O logic
levels.
CY7C1380F contains a TAP controller, instruction register,
boundary scan register, bypass register, and ID register.
Disabling the JTAG Feature
At power up, the TAP is reset internally to ensure that TDO
comes up in a high Z state.
TAP Registers
Registers are connected between the TDI and TDO balls and
enable data to be scanned in and out of the SRAM test circuitry.
Only one register can be selected at a time through the
instruction register. Data is serially loaded into the TDI ball on the
rising edge of TCK. Data is output on the TDO ball on the falling
edge of TCK.
It is possible to operate the SRAM without using the JTAG
feature. To disable the TAP controller, TCK must be tied LOW
(VSS) to prevent clocking of the device. TDI and TMS are
internally pulled up and may be unconnected. They may
alternately be connected to VDD through a pull up resistor. TDO
must be left unconnected. Upon power up, the device comes up
in a reset state which does not interfere with the operation of the
device.
Instruction Register
Test Access Port (TAP)
When the TAP controller is in the Capture-IR state, the two least
significant bits are loaded with a binary ‘01’ pattern to enable fault
isolation of the board-level serial test data path.
Test Clock (TCK)
The test clock is used only with the TAP controller. All inputs are
captured on the rising edge of TCK. All outputs are driven from
the falling edge of TCK.
Test MODE SELECT (TMS)
The TMS input is used to give commands to the TAP controller
and is sampled on the rising edge of TCK. This pin may be left
unconnected if the TAP is not used. The ball is pulled up
internally, resulting in a logic HIGH level.
Test Data-In (TDI)
The TDI ball is used to serially input information into the registers
and can be connected to the input of any of the registers. The
register between TDI and TDO is chosen by the instruction that
is loaded into the TAP instruction register. For information on
loading the instruction register, see TAP Controller State
Diagram on page 14. TDI is internally pulled up and can be
unconnected if the TAP is unused in an application. TDI is
connected to the most significant bit (MSB) of any register.
Test Data-Out (TDO)
The TDO output ball is used to serially clock data-out from the
registers. The output is active depending upon the current state
of the TAP state machine (see Identification Codes on page 18).
The output changes on the falling edge of TCK. TDO is
connected to the least significant bit (LSB) of any register.
Performing a TAP Reset
A Reset is performed by forcing TMS HIGH (VDD) for five rising
edges of TCK. This Reset does not affect the operation of the
SRAM and may be performed while the SRAM is operating.
Three-bit instructions can be serially loaded into the instruction
register. This register is loaded when it is placed between the TDI
and TDO balls as shown in the TAP Controller Block Diagram on
page 15. Upon power up, the instruction register is loaded with
the IDCODE instruction. It is also loaded with the IDCODE
instruction if the controller is placed in a reset state as described
in the previous section.
Bypass Register
To save time when serially shifting data through registers, it is
sometimes advantageous to skip certain chips. The bypass
register is a single-bit register that can be placed between the
TDI and TDO balls. This enables data to be shifted through the
SRAM with minimal delay. The bypass register is set LOW (VSS)
when the BYPASS instruction is executed.
Boundary Scan Register
The boundary scan register is connected to all the input and
bidirectional balls on the SRAM.
The boundary scan register is loaded with the contents of the
RAM input and output ring when the TAP controller is in the
Capture-DR state and is then placed between the TDI and TDO
balls when the controller is moved to the Shift-DR state. The
EXTEST, SAMPLE/PRELOAD, and SAMPLE Z instructions can
be used to capture the contents of the input and output ring.
The Boundary Scan Order on page 19 show the order in which
the bits are connected. Each bit corresponds to one of the bumps
on the SRAM package. The MSB of the register is connected to
TDI, and the LSB is connected to TDO.
Identification (ID) Register
The ID register is loaded with a vendor-specific 32-bit code
during the Capture-DR state when the IDCODE command is
loaded in the instruction register. The IDCODE is hardwired into
the SRAM and can be shifted out when the TAP controller is in
the Shift-DR state. The ID register has a vendor code and other
information described in the Identification Register Definitions on
page 18.
Note
13. Errata: The JTAG testing should be performed with these devices in BYPASS mode as the JTAG functionality is not guaranteed. For more information, see “Errata”
on page 32.
Document Number: 38-05543 Rev. *S
Page 12 of 38
Not Recommended for New Designs.
IEEE 1149.1 Serial Boundary Scan (JTAG [13])
CY7C1380D
CY7C1380F
CY7C1382D
Overview
Eight different instructions are possible with the three bit
instruction register. All combinations are listed in Identification
Codes on page 18. Three of these instructions are listed as
RESERVED and must not be used. The other five instructions
are described in detail in this section.
To guarantee that the boundary scan register captures the
correct value of a signal, the SRAM signal must be stabilized
long enough to meet the TAP controller’s capture setup plus hold
times (tCS and tCH). The SRAM clock input might not be captured
correctly if there is no way in a design to stop (or slow) the clock
during a SAMPLE/PRELOAD instruction. If this is an issue, it is
still possible to capture all other signals and simply ignore the
value of the CK and CK# captured in the boundary scan register.
Instructions are loaded into the TAP controller during the Shift-IR
state when the instruction register is placed between TDI and
TDO. During this state, instructions are shifted through the
instruction register through the TDI and TDO balls. To execute
the instruction once it is shifted in, the TAP controller must be
moved into the Update-IR state.
Once the data is captured, it is possible to shift out the data by
putting the TAP into the Shift-DR state. This places the boundary
scan register between the TDI and TDO pins.
EXTEST
The shifting of data for the SAMPLE and PRELOAD phases can
occur concurrently when required; that is, while data captured is
shifted out, the preloaded data is shifted in.
The EXTEST instruction enables the preloaded data to be driven
out through the system output pins. This instruction also selects
the boundary scan register to be connected for serial access
between the TDI and TDO in the Shift-DR controller state.
IDCODE
The IDCODE instruction causes a vendor-specific 32-bit code to
be loaded into the instruction register. It also places the
instruction register between the TDI and TDO balls and enables
the IDCODE to be shifted out of the device when the TAP
controller enters the Shift-DR state.
The IDCODE instruction is loaded into the instruction register
upon power up or whenever the TAP controller is given a test
logic reset state.
SAMPLE Z
The SAMPLE Z instruction causes the boundary scan register to
be connected between the TDI and TDO balls when the TAP
controller is in a Shift-DR state. The SAMPLE Z command places
all SRAM outputs into a high Z state.
SAMPLE/PRELOAD
SAMPLE/PRELOAD is a 1149.1 mandatory instruction. When
the SAMPLE/PRELOAD instructions are loaded into the
instruction register and the TAP controller is in the Capture-DR
state, a snapshot of data on the input and output pins is captured
in the boundary scan register.
The TAP controller clock can only operate at a frequency up to
20 MHz, while the SRAM clock operates more than an order of
magnitude faster. As there is a large difference in the clock
frequencies, it is possible that during the Capture-DR state, an
input or output undergoes a transition. The TAP may then try to
capture a signal while in transition (metastable state). This does
not harm the device, but there is no guarantee as to the value
that is captured. Repeatable results may not be possible.
Document Number: 38-05543 Rev. *S
PRELOAD enables an initial data pattern to be placed at the
latched parallel outputs of the boundary scan register cells prior
to the selection of another boundary scan test operation.
BYPASS
When the BYPASS instruction is loaded in the instruction register
and the TAP is placed in a Shift-DR state, the bypass register is
placed between the TDI and TDO balls. The advantage of the
BYPASS instruction is that it shortens the boundary scan path
when multiple devices are connected together on a board.
EXTEST Output Bus Tri-State
IEEE Standard 1149.1 mandates that the TAP controller be able
to put the output bus into a tri-state mode.
The boundary scan register has a special bit located at Bit #89
(for 165-ball FBGA package). When this scan cell, called the
“extest output bus tri-state,” is latched into the preload register
during the Update-DR state in the TAP controller, it directly
controls the state of the output (Q-bus) pins, when the EXTEST
is entered as the current instruction. When HIGH, it enables the
output buffers to drive the output bus. When LOW, this bit places
the output bus into a high Z condition.
This bit can be set by entering the SAMPLE/PRELOAD or
EXTEST command, and then shifting the desired bit into that cell,
during the Shift-DR state. During Update-DR, the value loaded
into that shift-register cell latches into the preload register. When
the EXTEST instruction is entered, this bit directly controls the
output Q-bus pins. Note that this bit is preset HIGH to enable the
output when the device is powered up, and also when the TAP
controller is in the Test-Logic-Reset state.
Reserved
These instructions are not implemented but are reserved for
future use. Do not use these instructions.
Page 13 of 38
Not Recommended for New Designs.
TAP Instruction Set
CY7C1380D
CY7C1380F
CY7C1382D
TAP Controller State Diagram
1
TEST-LOGIC
RESET
0
RUN-TEST/
IDLE
1
SELECT
DR-SCAN
1
SELECT
IR-SCAN
0
1
0
1
CAPTURE-DR
CAPTURE-IR
0
0
SHIFT-DR
0
SHIFT-IR
1
1
EXIT1-IR
0
1
0
PAUSE-DR
0
PAUSE-IR
1
0
1
EXIT2-DR
0
EXIT2-IR
1
1
UPDATE-DR
UPDATE-IR
1
0
1
EXIT1-DR
0
1
Not Recommended for New Designs.
0
0
1
0
The 0 or 1 next to each state represents the value of TMS at the rising edge of TCK.
Document Number: 38-05543 Rev. *S
Page 14 of 38
CY7C1380D
CY7C1380F
CY7C1382D
TAP Controller Block Diagram
0
Bypass Register
2 1 0
TDI
Selection
Circuitry
Instruction Register
31 30 29 . . . 2 1 0
S election
TDO
Circuitr y
Not Recommended for New Designs.
Identification Register
x . . . . . 2 1 0
Boundary Scan Register
TCK
TMS
Document Number: 38-05543 Rev. *S
TAP CONTROLLER
Page 15 of 38
CY7C1380D
CY7C1380F
CY7C1382D
TAP Timing
Figure 3. TAP Timing
Test Clock
(TCK)
t
t TH
t TMSS
t TMSH
t TDIS
t TDIH
TL
t CYC
Test Data-In
(TDI)
t TDOV
t TDOX
Test Data-Out
(TDO)
DON’T CARE
UNDEFINED
TAP AC Switching Characteristics
Over the Operating Range
Parameter [14, 15]
Description
Min
Max
Unit
50
–
ns
Clock
tTCYC
TCK Clock Cycle Time
tTF
TCK Clock Frequency
–
20
MHz
tTH
TCK Clock HIGH time
20
–
ns
tTL
TCK Clock LOW time
20
–
ns
tTDOV
TCK Clock LOW to TDO Valid
–
10
ns
tTDOX
TCK Clock LOW to TDO Invalid
0
–
ns
tTMSS
TMS Setup to TCK Clock Rise
5
–
ns
tTDIS
TDI Setup to TCK Clock Rise
5
–
ns
tCS
Capture Setup to TCK Rise
5
–
ns
tTMSH
TMS Hold after TCK Clock Rise
5
–
ns
tTDIH
TDI Hold after Clock Rise
5
–
ns
tCH
Capture Hold after Clock Rise
5
–
ns
Output Times
Setup Times
Hold Times
Notes
14. tCS and tCH refer to the setup and hold time requirements of latching data from the boundary scan register.
15. Test conditions are specified using the load in TAP AC test conditions. tR/tF = 1 ns.
Document Number: 38-05543 Rev. *S
Page 16 of 38
Not Recommended for New Designs.
Test Mode Select
(TMS)
CY7C1380D
CY7C1380F
CY7C1382D
3.3 V TAP AC Test Conditions
2.5 V TAP AC Test Conditions
Input pulse levels ...............................................VSS to 3.3 V
Input pulse levels ............................................... VSS to 2.5 V
Input rise and fall times ...................................................1 ns
Input rise and fall time ....................................................1 ns
Input timing reference levels ......................................... 1.5 V
Input timing reference levels ....................................... 1.25 V
Output reference levels ................................................ 1.5 V
Output reference levels .............................................. 1.25 V
Test load termination supply voltage ............................ 1.5 V
Test load termination supply voltage .......................... 1.25 V
3.3 V TAP AC Output Load Equivalent
2.5 V TAP AC Output Load Equivalent
1.5V
50Ω
50Ω
TDO
TDO
Z O= 50 Ω
Z O= 50 Ω
20pF
20pF
TAP DC Electrical Characteristics and Operating Conditions
(0 °C < TA < +70 °C; VDD = 3.3 V ± 0.165 V unless otherwise noted)
Parameter [16]
VOH1
VOH2
VOL1
VOL2
VIH
VIL
IX
Description
Output HIGH Voltage
Output HIGH Voltage
Output LOW Voltage
Output LOW Voltage
Test Conditions
Min
Max
Unit
IOH = –4.0 mA, VDDQ = 3.3 V
2.4
–
V
IOH = –1.0 mA, VDDQ = 2.5 V
2.0
–
V
IOH = –100 µA
IOL = 8.0 mA
IOL = 100 µA
Input HIGH Voltage
Input LOW Voltage
Input Load Current
GND < VIN < VDDQ
VDDQ = 3.3 V
2.9
–
V
VDDQ = 2.5 V
2.1
–
V
VDDQ = 3.3 V
–
0.4
V
VDDQ = 2.5 V
–
0.4
V
VDDQ = 3.3 V
–
0.2
V
VDDQ = 2.5 V
–
0.2
V
VDDQ = 3.3 V
2.0
VDD + 0.3
V
VDDQ = 2.5 V
1.7
VDD + 0.3
V
VDDQ = 3.3 V
–0.3
0.8
V
VDDQ = 2.5 V
–0.3
0.7
V
–5
5
µA
Note
16. All voltages referenced to VSS (GND).
Document Number: 38-05543 Rev. *S
Page 17 of 38
Not Recommended for New Designs.
1.25V
CY7C1380D
CY7C1380F
CY7C1382D
Identification Register Definitions
CY7C1380F (512K × 36)
000
Device Depth (28:24) [17]
01011
Device Width (23:18) 165-ball FBGA
000000
Cypress Device ID (17:12)
100101
Cypress JEDEC ID Code (11:1)
00000110100
ID Register Presence Indicator (0)
1
Description
Describes the version number.
Reserved for internal use.
Defines the memory type and architecture.
Defines the width and density.
Allows unique identification of SRAM vendor.
Indicates the presence of an ID register.
Scan Register Sizes
Register Name
Bit Size (× 36)
Instruction
3
Bypass
1
ID
32
Boundary Scan Order (165-ball FBGA package)
89
Identification Codes
Code
Description
EXTEST
Instruction
000
Captures I/O ring contents. Places the boundary scan register between TDI and TDO. Forces
all SRAM outputs to high Z state.
IDCODE
001
Loads the ID register with the vendor ID code and places the register between TDI and TDO.
This operation does not affect SRAM operations.
SAMPLE Z
010
Captures I/O ring contents. Places the boundary scan register between TDI and TDO. Forces
all SRAM output drivers to a high Z state.
RESERVED
011
Do Not Use. This instruction is reserved for future use.
SAMPLE/PRELOAD
100
Captures I/O ring contents. Places the boundary scan register between TDI and TDO. Does
not affect SRAM operation.
RESERVED
101
Do Not Use. This instruction is reserved for future use.
RESERVED
110
Do Not Use. This instruction is reserved for future use.
BYPASS
111
Places the bypass register between TDI and TDO. This operation does not affect SRAM
operations.
Note
17. Bit #24 is 1 in the register definitions for both 2.5 V and 3.3 V versions of this device.
Document Number: 38-05543 Rev. *S
Page 18 of 38
Not Recommended for New Designs.
Instruction Field
Revision Number (31:29)
CY7C1380D
CY7C1380F
CY7C1382D
Boundary Scan Order
Bit #
Ball ID
Bit #
Ball ID
Bit #
Ball ID
1
N6
31
D10
61
G1
2
N7
32
C11
62
D2
3
N10
33
A11
63
E2
4
P11
34
B11
64
F2
5
P8
35
A10
65
G2
6
R8
36
B10
66
H1
7
R9
37
A9
67
H3
8
P9
38
B9
68
J1
9
P10
39
C10
69
K1
10
R10
40
A8
70
L1
11
R11
41
B8
71
M1
12
H11
42
A7
72
J2
13
N11
43
B7
73
K2
14
M11
44
B6
74
L2
15
L11
45
A6
75
M2
16
K11
46
B5
76
N1
17
J11
47
A5
77
N2
18
M10
48
A4
78
P1
19
L10
49
B4
79
R1
20
K10
50
B3
80
R2
21
J10
51
A3
81
P3
22
H9
52
A2
82
R3
23
H10
53
B2
83
P2
24
G11
54
C2
84
R4
25
F11
55
B1
85
P4
26
E11
56
A1
86
N5
27
D11
57
C1
87
P6
28
G10
58
D1
88
R6
29
F10
59
E1
89
Internal
30
E10
60
F1
Note
18. Balls which are NC (No Connect) are pre-set LOW.
19. Bit# 89 is pre-set HIGH.
Document Number: 38-05543 Rev. *S
Page 19 of 38
Not Recommended for New Designs.
165-ball BGA [18, 19]
CY7C1380D
CY7C1380F
CY7C1382D
Maximum Ratings
DC Input Voltage ................................ –0.5 V to VDD + 0.5 V
Storage Temperature ............................... –65 °C to +150 °C
Ambient Temperature with
Power Applied ......................................... –55 °C to +125 °C
Current into Outputs (LOW) ........................................ 20 mA
Static Discharge Voltage
(per MIL-STD-883, Method 3015) .......................... > 2001 V
Latch-up Current .................................................... > 200 mA
Operating Range
Supply Voltage on VDD Relative to GND .....–0.3 V to +4.6 V
Supply Voltage on VDDQ Relative to GND .... –0.3 V to +VDD
Range
Ambient
Temperature
DC Voltage Applied to Outputs
in tri-state ..........................................–0.5 V to VDDQ + 0.5 V
Commercial
0 °C to +70 °C
Industrial
–40 °C to +85 °C
VDD
VDDQ
3.3 V– 5% / 2.5 V – 5% to
+ 10%
VDD
Electrical Characteristics
Over the Operating Range
Parameter [20, 21]
Description
VDD
Power Supply Voltage
VDDQ
I/O Supply Voltage
VOH
Output HIGH Voltage
VOL
Output LOW Voltage
VIH
Input HIGH Voltage [20]
Test Conditions
Min
IX
Unit
3.135
3.6
V
for 3.3 V I/O
3.135
VDD
V
for 2.5 V I/O
2.375
2.625
V
for 3.3 V I/O, IOH = –4.0 mA
2.4
–
V
for 2.5 V I/O, IOH = –1.0 mA
2.0
–
V
–
0.4
V
for 3.3 V I/O, IOL = 8.0 mA
for 2.5 V I/O, IOL = 1.0 mA
VIL
Max
–
0.4
V
for 3.3 V I/O
2.0
VDD + 0.3 V
V
for 2.5 V I/O
1.7
VDD + 0.3 V
V
for 3.3 V I/O
–0.3
0.8
V
for 2.5 V I/O
–0.3
0.7
V
Input Leakage Current except ZZ GND VI VDDQ
and MODE
–5
5
A
Input Current of MODE
–30
–
A
5
A
Input LOW Voltage
[20]
Input = VSS
Input = VDD
Input Current of ZZ
–5
Input = VSS
Input = VDD
–
A
30
A
IOZ
Output Leakage Current
GND VI VDDQ, Output Disabled
–5
5
A
IDD
VDD Operating Supply Current
VDD = Max., IOUT = 0 mA,
f = fMAX = 1/tCYC
4.0-ns cycle,
250 MHz
–
350
mA
5.0-ns cycle,
200 MHz
–
300
mA
6.0-ns cycle,
167 MHz
–
275
mA
VDD = Max, Device Deselected, 4.0-ns cycle,
VIN VIH or VIN VIL,
250 MHz
f = fMAX = 1/tCYC
5.0-ns cycle,
200 MHz
–
160
mA
–
150
mA
6.0-ns cycle,
167 MHz
–
140
mA
ISB1
Automatic CE Power Down
Current – TTL Inputs
Notes
20. Overshoot: VIH(AC) < VDD + 1.5 V (pulse width less than tCYC/2), undershoot: VIL(AC) > –2 V (pulse width less than tCYC/2).
21. TPower up: Assumes a linear ramp from 0 V to VDD(min.) within 200 ms. During this time VIH < VDD and VDDQ < VDD.
Document Number: 38-05543 Rev. *S
Page 20 of 38
Not Recommended for New Designs.
Exceeding the maximum ratings may impair the useful life of the
device. For user guidelines, not tested.
CY7C1380D
CY7C1380F
CY7C1382D
Electrical Characteristics (continued)
Parameter [20, 21]
Description
Test Conditions
Min
Max
Unit
ISB2
Automatic CE Power Down
Current – CMOS Inputs
VDD = Max, Device Deselected, All speeds
VIN 0.3 V or VIN > VDDQ – 0.3
V, f = 0
–
70
mA
ISB3
Automatic CE Power Down
Current – CMOS Inputs
VDD = Max, Device Deselected,
VIN 0.3 V or VIN > VDDQ – 0.3
V,
f = fMAX = 1/tCYC
4.0-ns cycle,
250 MHz
–
135
mA
5.0-ns cycle,
200 MHz
–
130
mA
6.0-ns cycle,
167 MHz
–
125
mA
–
80
mA
ISB4
Automatic CE Power Down
Current – TTL Inputs
VDD = Max, Device Deselected, All speeds
VIN VIH or VIN VIL, f = 0
Capacitance
Parameter [22]
Description
CIN
Input capacitance
CCLK
Clock input capacitance
CIO
Input/Output capacitance
Test Conditions
TA = 25 °C, f = 1 MHz,
VDD = 3.3 V, VDDQ = 2.5 V
100-pin TQFP 165-ball FBGA Unit
Package
Package
5
9
pF
5
9
pF
5
9
pF
Thermal Resistance
Parameter [22]
Description
JA
Thermal resistance
(junction to ambient)
JC
Thermal resistance
(junction to case)
Test Conditions
Test conditions follow standard test
methods and procedures for measuring
thermal impedance, in accordance with
EIA/JESD51.
100-pin TQFP 165-ball FBGA Unit
Package
Package
28.66
20.7
°C/W
4.08
4.0
°C/W
Note
22. Tested initially and after any design or process change that may affect these parameters.
Document Number: 38-05543 Rev. *S
Page 21 of 38
Not Recommended for New Designs.
Over the Operating Range
CY7C1380D
CY7C1380F
CY7C1382D
AC Test Loads and Waveforms
Figure 4. AC Test Loads and Waveforms
R = 317
3.3 V
OUTPUT
OUTPUT
RL = 50
Z0 = 50
GND
5 pF
R = 351
VT = 1.5 V
INCLUDING
JIG AND
SCOPE
(a)
2.5 V I/O Test Load
OUTPUT
RL = 50
Z0 = 50
VT = 1.25 V
(a)
Document Number: 38-05543 Rev. *S
10%
(c)
ALL INPUT PULSES
VDDQ
INCLUDING
JIG AND
SCOPE
1 ns
(b)
GND
5 pF
R = 1538
(b)
90%
10%
90%
1 ns
R = 1667
2.5 V
OUTPUT
ALL INPUT PULSES
VDDQ
10%
90%
10%
90%
1 ns
1 ns
(c)
Page 22 of 38
Not Recommended for New Designs.
3.3 V I/O Test Load
CY7C1380D
CY7C1380F
CY7C1382D
Switching Characteristics
Over the Operating Range
Parameter [23, 24]
tPOWER
250 MHz
Description
VDD(typical) to the first Access [25]
200 MHz
167 MHz
Unit
Min
Max
Min
Max
Min
Max
1
–
1
–
1
–
ms
tCYC
Clock Cycle Time
4.0
–
5
–
6
–
ns
tCH
Clock HIGH
1.7
–
2.0
–
2.2
–
ns
tCL
Clock LOW
1.7
–
2.0
–
2.2
–
ns
Output Times
tCO
Data Output Valid After CLK Rise
–
2.6
–
3.0
–
3.4
ns
tDOH
Data Output Hold After CLK Rise
1.0
–
1.3
–
1.3
–
ns
1.0
–
1.3
–
1.3
–
ns
–
2.6
–
3.0
–
3.4
ns
–
2.6
–
3.0
–
3.4
ns
0
–
0
–
0
–
ns
–
2.6
–
3.0
–
3.4
ns
[26, 27, 28]
tCLZ
Clock to Low-Z
tCHZ
Clock to High-Z [26, 27, 28]
tOEV
OE LOW to Output Valid
tOELZ
tOEHZ
OE LOW to Output Low-Z
[26, 27, 28]
OE HIGH to Output High-Z
[26, 27, 28]
Setup Times
tAS
Address Setup Before CLK Rise
1.2
–
1.4
–
1.5
–
ns
tADS
ADSC, ADSP Setup Before CLK Rise
1.2
–
1.4
–
1.5
–
ns
tADVS
ADV Setup Before CLK Rise
1.2
–
1.4
–
1.5
–
ns
tWES
GW, BWE, BWX Setup Before CLK
Rise
1.2
–
1.4
–
1.5
–
ns
tDS
Data Input Setup Before CLK Rise
1.2
–
1.4
–
1.5
–
ns
tCES
Chip Enable SetUp Before CLK Rise
1.2
–
1.4
–
1.5
–
ns
tAH
Address Hold After CLK Rise
0.3
–
0.4
–
0.5
–
ns
tADH
ADSP, ADSC Hold After CLK Rise
0.3
–
0.4
–
0.5
–
ns
tADVH
ADV Hold After CLK Rise
0.3
–
0.4
–
0.5
–
ns
tWEH
GW, BWE, BWX Hold After CLK Rise
0.3
–
0.4
–
0.5
–
ns
tDH
Data Input Hold After CLK Rise
0.3
–
0.4
–
0.5
–
ns
tCEH
Chip Enable Hold After CLK Rise
0.3
–
0.4
–
0.5
–
ns
Hold Times
Notes
23. Timing reference level is 1.5 V when VDDQ = 3.3 V and is 1.25 V when VDDQ = 2.5 V.
24. Test conditions shown in (a) of Figure 4 on page 22 unless otherwise noted.
25. This part has a voltage regulator internally; tPOWER is the time that the power needs to be supplied above VDD(minimum) initially before a read or write operation can
be initiated.
26. tCHZ, tCLZ, tOELZ, and tOEHZ are specified with AC test conditions shown in part (b) of Figure 4 on page 22. Transition is measured ±200 mV from steady-state voltage.
27. At any given voltage and temperature, tOEHZ is less than tOELZ and tCHZ is less than tCLZ to eliminate bus contention between SRAMs when sharing the same data
bus. These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed to achieve
high Z prior to low Z under the same system conditions.
28. This parameter is sampled and not 100% tested.
Document Number: 38-05543 Rev. *S
Page 23 of 38
Not Recommended for New Designs.
Clock
CY7C1380D
CY7C1380F
CY7C1382D
Switching Waveforms
Figure 5. Read Cycle Timing [29]
t CYC
CLK
t
t
ADS
CH
t
CL
t
ADH
t ADS
Not Recommended for New Designs.
ADSP
tADH
ADSC
t AS
tAH
A1
ADDRESS
A2
t WES
A3
Burst continued with
new base address
tWEH
GW, BWE,
BWx
t CES
Deselect
cycle
tCEH
CE
t ADVS
tADVH
ADV
ADV
suspends
burst.
OE
t OEHZ
t CLZ
Data Out (Q)
High-Z
Q(A1)
t OEV
t CO
t OELZ
t DOH
Q(A2)
t CHZ
Q(A2 + 1)
Q(A2 + 2)
Q(A2 + 3)
Q(A2)
Q(A2 + 1)
t CO
Burst wraps around
to its initial state
Single READ
BURST READ
DON’T CARE
UNDEFINED
Note
29. On this diagram, when CE is LOW: CE1 is LOW, CE2 is HIGH and CE3 is LOW. When CE is HIGH: CE1 is HIGH or CE2 is LOW or CE3 is HIGH.
Document Number: 38-05543 Rev. *S
Page 24 of 38
CY7C1380D
CY7C1380F
CY7C1382D
Switching Waveforms (continued)
Figure 6. Write Cycle Timing [30, 31]
t CYC
CLK
tCH
t ADS
tCL
tADH
ADSP
ADSC extends burst
tADH
t ADS
tADH
ADSC
t AS
tAH
A1
ADDRESS
A2
A3
Byte write signals are
ignored for first cycle when
ADSP initiates burst
t WES tWEH
BWE,
BW X
t WES tWEH
GW
t CES
tCEH
CE
t
t
ADVS ADVH
ADV
ADV suspends burst
OE
t DS
Data In (D)
High-Z
t
OEHZ
tDH
D(A1)
D(A2)
D(A2 + 1)
D(A2 + 1)
D(A2 + 2)
D(A2 + 3)
D(A3)
D(A3 + 1)
D(A3 + 2)
ata Out (Q)
BURST READ
Single WRITE
BURST WRITE
DON’T CARE
Extended BURST WRITE
UNDEFINED
Notes
30. On this diagram, when CE is LOW: CE1 is LOW, CE2 is HIGH and CE3 is LOW. When CE is HIGH: CE1 is HIGH or CE2 is LOW or CE3 is HIGH.
31. Full width write can be initiated by either GW LOW; or by GW HIGH, BWE LOW and BWX LOW.
Document Number: 38-05543 Rev. *S
Page 25 of 38
Not Recommended for New Designs.
t ADS
CY7C1380D
CY7C1380F
CY7C1382D
Switching Waveforms (continued)
Figure 7. Read/Write Cycle Timing [32, 33, 34]
tCYC
CLK
tCL
tCH
t ADS
tADH
t AS
tAH
ADSC
ADDRESS
A1
A2
A3
A4
A5
A6
t WES tWEH
BWE,
BW X
t CES
tCEH
CE
ADV
OE
t DS
tCO
tDH
t OELZ
Data In (D)
High-Z
tOEHZ
tCLZ
Data Out (Q)
High-Z
Q(A1)
D(A3)
D(A5)
Q(A4)
Q(A2)
Back-to-Back READs
Single WRITE
Q(A4+1)
BURST READ
DON’T CARE
Q(A4+2)
D(A6)
Q(A4+3)
Back-to-Back
WRITEs
UNDEFINED
Notes
32. On this diagram, when CE is LOW: CE1 is LOW, CE2 is HIGH and CE3 is LOW. When CE is HIGH: CE1 is HIGH or CE2 is LOW or CE3 is HIGH.
33. The data bus (Q) remains in high Z following a WRITE cycle, unless a new read access is initiated by ADSP or ADSC.
34. GW is HIGH.
Document Number: 38-05543 Rev. *S
Page 26 of 38
Not Recommended for New Designs.
ADSP
CY7C1380D
CY7C1380F
CY7C1382D
Switching Waveforms (continued)
Figure 8. ZZ Mode Timing [35, 36]
CLK
t
ZZ
ZZREC
ZZI
SUPPLY
I
t
DDZZ
ALL INPUTS
RZZI
Not Recommended for New Designs.
I
t
t
ZZ
DESELECT or READ Only
(except ZZ)
Outputs (Q)
High-Z
DON’T CARE
Notes
35. Device must be deselected when entering ZZ mode. See Truth Table on page 10 for all possible signal conditions to deselect the device.
36. DQs are in high Z when exiting ZZ sleep mode.
Document Number: 38-05543 Rev. *S
Page 27 of 38
CY7C1380D
CY7C1380F
CY7C1382D
Ordering Information
The below table lists the key package features and ordering codes. The table contains only the parts that are currently available. If
you do not see what you are looking for, contact your local sales representative. For more information, visit the Cypress website at
www.cypress.com and refer to the product summary page at http://www.cypress.com/products.
Speed
(MHz)
MPN
Status
Package
Diagram
NRND
51-85050 100-pin TQFP (14 × 20 × 1.4 mm) Pb-free
Commercial
51-85050 100-pin TQFP (14 × 20 × 1.4 mm) Pb-free
Commercial
51-85050 100-pin TQFP (14 × 20 × 1.4 mm) Pb-free
Commercial
CY7C1380D-167AXI [37]
51-85050 100-pin TQFP (14 × 20 × 1.4 mm) Pb-free
Industrial
CY7C1380F-167BZI [37]
51-85180 165-ball FBGA (13 × 15 × 1.4 mm)
Ordering Code
250
CY7C1380D-250AXC [37]
200
[37]
CY7C1380D-200AXC
Part and Package Type
Operating
Range
167
CY7C1380D-167AXC [37]
CY7C1382D-167AXC
[37]
Ordering Code Definitions
CY 7
C 138X X -
XXX
XX X
X
Temperature Range: X = C or I
C = Commercial; I = Industrial
Pb-free
Package Type: XX = A or BZ
A = 100-pin TQFP
BZ = 165-ball FPBGA
Frequency Range: XXX = 250 MHz or 200 MHz or 167 MHz
Die Revision: X = D or F
D 90 nm
F 90nm errata fix PCN084636
Part Identifier: 138X = 1380 or 1382
1380 = SCD, 512 K × 36 (18 Mb)
1382 = SCD, 1 Mb × 18 (18 Mb)
Technology Code: C = CMOS
Marketing Code: 7 = SRAM
Company ID: CY = Cypress
Note
37. These MPNs are not recommended for new designs.
Document Number: 38-05543 Rev. *S
Page 28 of 38
Not Recommended for New Designs.
CY7C1382D-200AXC [37]
CY7C1380D
CY7C1380F
CY7C1382D
Package Diagrams
Not Recommended for New Designs.
Figure 9. 100-pin TQFP (14 × 20 × 1.4 mm) A100RA Package Outline, 51-85050
51-85050 *E
Document Number: 38-05543 Rev. *S
Page 29 of 38
CY7C1380D
CY7C1380F
CY7C1382D
Package Diagrams (continued)
Not Recommended for New Designs.
Figure 10. 165-ball FBGA (13 × 15 × 1.4 mm) BB165D/BW165D (0.5 Ball Diameter) Package Outline, 51-85180
51-85180 *G
Document Number: 38-05543 Rev. *S
Page 30 of 38
CY7C1380D
CY7C1380F
CY7C1382D
Acronym
Document Conventions
Description
Units of Measure
CMOS
Complementary Metal Oxide Semiconductor
FBGA
Fine-Pitch Ball Grid Array
°C
degree Celsius
I/O
Input/Output
MHz
megahertz
JTAG
Joint Test Action Group
µA
microampere
LSB
Least Significant Bit
mA
milliampere
MSB
Most Significant Bit
mm
millimeter
ms
millisecond
OE
Output Enable
SRAM
Static Random Access Memory
TCK
Test Clock
TMS
Test Mode Select
TDI
Test Data-In
TDO
Test Data-Out
TQFP
Thin Quad Flat Pack
TTL
Transistor-Transistor Logic
Document Number: 38-05543 Rev. *S
Symbol
Unit of Measure
ns
nanosecond
ohm
%
percent
pF
picofarad
V
volt
W
watt
Not Recommended for New Designs.
Acronyms
Page 31 of 38
CY7C1380D
CY7C1380F
CY7C1382D
Errata
This section describes the Ram9 Sync ZZ pin and JTAG issues. Details include trigger conditions, the devices affected, proposed
workaround and silicon revision applicability. Please contact your local Cypress sales representative if you have further questions.
Part Numbers Affected
Density & Revision
Package Type
Operating Range
18Mb-Ram9 Synchronous SRAMs: CY7C138*D, CY7C138*F
100-pin TQFP
Commercial/
Industrial
165-ball FBGA
Industrial
All of the devices in the Ram9 18Mb Sync family are qualified and available in production quantities.
Ram9 Sync ZZ Pin & JTAG Issues Errata Summary
The following table defines the errata applicable to available Ram9 18Mb Sync family devices.
Item
Issues
Description
Device
Fix Status
1.
ZZ Pin
When asserted HIGH, the ZZ pin places
device in a “sleep” condition with data integrity
preserved.The ZZ pin currently does not have
an internal pull-down resistor and hence
cannot be left floating externally by the user
during normal mode of operation.
18M-Ram9 (90 nm)
For the 18M Ram9 (90 nm)
devices, there is no plan to fix
this issue.
2.
JTAG
Functionality
During JTAG test mode, the Boundary scan
circuitry does not perform as described in the
datasheet.However, it is possible to perform
the JTAG test with these devices in “BYPASS
mode”.
18M-Ram9 (90 nm)
This issue will be fixed in the
new revision, which use the
65 nm technology. Please
contact your local sales rep for
availability.
Document Number: 38-05543 Rev. *S
Page 32 of 38
Not Recommended for New Designs.
Product Status
CY7C1380D
CY7C1380F
CY7C1382D
■
PROBLEM DEFINITION
The problem occurs only when the device is operated in the normal mode with ZZ pin left floating. The ZZ pin on the SRAM
device does not have an internal pull-down resistor. Switching noise in the system may cause the SRAM to recognize a HIGH
on the ZZ input, which may cause the SRAM to enter sleep mode. This could result in incorrect or undesirable operation of the
SRAM.
■
TRIGGER CONDITIONS
Device operated with ZZ pin left floating.
■
SCOPE OF IMPACT
When the ZZ pin is left floating, the device delivers incorrect data.
■
WORKAROUND
Tie the ZZ pin externally to ground.
■
FIX STATUS
For the 18M Ram9 (90 nm) devices, there is no plan to fix this issue.
2. JTAG Functionality
■
PROBLEM DEFINITION
The problem occurs only when the device is operated in the JTAG test mode.During this mode, the JTAG circuitry can perform
incorrectly by delivering the incorrect data or the incorrect scan chain length.
■
TRIGGER CONDITIONS
Several conditions can trigger this failure mode.
1. The device can deliver an incorrect length scan chain when operating in JTAG mode.
2. Some Byte Write inputs only recognize a logic HIGH level when in JTAG mode.
3. Incorrect JTAG data can be read from the device when the ZZ input is tied HIGH during JTAG operation.
■
SCOPE OF IMPACT
The device fails for JTAG test. This does not impact the normal functionality of the device.
■
WORKAROUND
1.Perform JTAG testing with these devices in “BYPASS mode”.
2.Do not use JTAG test.
■
FIX STATUS
This issue will be fixed in the new revision, which use the 65 nm technology. Please contact your local sales rep for availability.
Document Number: 38-05543 Rev. *S
Page 33 of 38
Not Recommended for New Designs.
1. ZZ Pin Issue
CY7C1380D
CY7C1380F
CY7C1382D
Document History Page
Document Title: CY7C1380D/CY7C1380F/CY7C1382D, 18-Mbit (512K × 36/1M × 18) Pipelined SRAM
Document Number: 38-05543
Rev.
ECN No.
Submission
Date
Orig. of
Change
**
254515
See ECN
RKF
New data sheet.
*A
288531
See ECN
SYT
Updated Selection Guide (Removed 225 MHz and 133 MHz frequencies
related information).
Updated IEEE 1149.1 Serial Boundary Scan (JTAG [13]) (Edited description
for non-compliance with 1149.1).
Updated Electrical Characteristics (Removed 225 MHz and 133 MHz
frequencies related information).
Updated Switching Characteristics (Removed 225 MHz and 133 MHz
frequencies related information).
Updated Ordering Information (Added Pb-free information for 100-pin TQFP,
119-ball BGA and 165-ball FBGA packages) and added comment for ‘Pb-free
BG packages availability’ below the Ordering Information.
*B
326078
See ECN
PCI
Updated Pin Configurations (Address expansion pins/balls in the pinouts for
all packages are modified as per JEDEC standard).
Updated IEEE 1149.1 Serial Boundary Scan (JTAG [13]) (Updated TAP
Instruction Set (Updated OVERVIEW (description), updated EXTEST
(description), added EXTEST Output Bus Tri-State)).
Updated Identification Register Definitions (Splitted Device Width (23:18) into
two rows (one for 119-ball BGA and another for 165-ball FBGA), retained the
same values of 165-ball FBGA and changed the values from 000000 to 101000
for 119-ball BGA)
Updated Electrical Characteristics (Modified Test Conditions for VOL, VOH
parameters).
Updated Thermal Resistance (Changed JA and JC for 100-pin TQFP
Package from 31 and 6 C/W to 28.66 and 4.08 C/W respectively, changed
JA and JC for 119-ball BGA Package from 45 and 7 C/W to 23.8 and
6.2 C/W respectively, changed JA and JC for 165-ball FBGA Package from
46 and 3 C/W to 20.7 and 4.0 C/W respectively).
Updated Ordering Information (Updated part numbers) and removed comment
of ‘Pb-free BG packages availability’ below the Ordering Information.
*C
416321
See ECN
NXR
Changed status from Preliminary to Final.
Changed address of Cypress Semiconductor Corporation from “3901 North
First Street” to “198 Champion Court”.
Updated Electrical Characteristics (Changed the description of IX parameter
from Input Load Current to Input Leakage Current, changed the minimum and
maximum values of IX parameter (corresponding to Input Current of MODE)
from –5 A and 30 A to –30 A and 5 A, changed the minimum and maximum
values of IX parameter (corresponding to Input current of ZZ) from –30 A and
5 A to –5 A and 30 A, updated Note 21).
Updated Ordering Information (Updated part numbers) and replaced Package
Name column with Package Diagram in the Ordering Information table.
*D
475009
See ECN
VKN
Updated TAP AC Switching Characteristics (Changed minimum values of tTH,
and tTL parameters from 25 ns to 20 ns, and maximum value of tTDOV
parameter from 5 ns to 10 ns).
Updated Maximum Ratings (Added the Maximum Rating for Supply Voltage
on VDDQ Relative to GND).
Updated Ordering Information (Updated part numbers).
*E
776456
See ECN
VKN
Updated Features (Included CY7C1380F/CY7C1382F related information).
Updated Functional Description (Included CY7C1380F/CY7C1382F related
information).
Document Number: 38-05543 Rev. *S
Page 34 of 38
Not Recommended for New Designs.
Description of Change
CY7C1380D
CY7C1380F
CY7C1382D
Document History Page (continued)
Rev.
ECN No.
Submission
Date
Orig. of
Change
Description of Change
*E (cont.)
776456
See ECN
VKN
Updated Logic Block Diagram – CY7C1380D/CY7C1380F (Included
CY7C1380F related information, added the Note “CY7C1380F and
CY7C1382F in 119-ball BGA package have only 1 chip enable (CE1).” and
referred the same note in the title).
Updated Logic Block Diagram – CY7C1382D/CY7C1382F (Included
CY7C1382F related information, added the Note “CY7C1380F and
CY7C1382F in 119-ball BGA package have only 1 chip enable (CE1).” and
referred the same note in the title).
Updated Pin Configurations (Included CY7C1380F/CY7C1382F related
information).
Updated Functional Overview (Included CY7C1380F/CY7C1382F related
information).
Updated Truth Table (Included CY7C1380F/CY7C1382F related information).
Updated Truth Table for Read/Write (Included CY7C1380F related
information).
Updated Truth Table for Read/Write (Included CY7C1382F related
information).
Updated IEEE 1149.1 Serial Boundary Scan (JTAG [13]) (Included
CY7C1380F/CY7C1382F related information).
Updated Identification Register Definitions (Included
CY7C1380F/CY7C1382F related information).
Updated Ordering Information (Updated part numbers).
*F
2648065
01/27/09
VKN /
PYRS
Updated Ordering Information (To include CY7C1380F/CY7C1382F in 100-pin
TSOP package and 165-ball FBGA package) and modified text on top of the
Ordering information table.
*G
2897120
03/22/2010
NJY
Updated Ordering Information (Removed inactive parts).
Updated Package Diagrams.
*H
3067398
10/20/10
NJY
Updated Ordering Information (The part CY7C1380F-167BGC is found to be
in “EOL-Prune” state in Oracle PLM and therefore, it has been removed) and
added Ordering Code Definitions.
*I
3159479
02/01/2011
NJY
Added Acronyms and Units of Measure.
Updated Package Diagrams.
Minor edits.
Updated to new template.
*J
3192403
03/10/2011
NJY
Updated to new template.
*K
3210400
03/30/11
NJY
Updated Ordering Information (Removed pruned part CY7C1380D-167BZC
from the ordering information table).
*L
3575733
04/09/2012
Document Number: 38-05543 Rev. *S
NJY / PRIT Updated Features (Removed CY7C1382F related information, removed
165-ball FBGA package related information for CY7C1382D, removed 100-pin
TQFP package related information for CY7C1380F, removed 119-ball BGA
package related information).
Updated Functional Description (Removed the Note “For best practices or
recommendations, please refer to the Cypress application note AN1064,
SRAM System Design Guidelines on www.cypress.com.” and its reference,
removed the Note “CE3, CE2 are for 100-pin TQFP and 165-ball FBGA
packages only. 119-ball BGA is offered only in 1 chip enable.” and its
reference).
Updated Logic Block Diagram – CY7C1380D/CY7C1380F (Removed the Note
“CY7C1380F and CY7C1382F in 119-ball BGA package have only 1 chip
enable (CE1).” and its reference).
Updated Logic Block Diagram – CY7C1382D (Removed CY7C1382F related
information, removed the Note “CY7C1380F and CY7C1382F in 119-ball BGA
package have only 1 chip enable (CE1).” and its reference).
Page 35 of 38
Not Recommended for New Designs.
Document Title: CY7C1380D/CY7C1380F/CY7C1382D, 18-Mbit (512K × 36/1M × 18) Pipelined SRAM
Document Number: 38-05543
CY7C1380D
CY7C1380F
CY7C1382D
Document History Page (continued)
Document Title: CY7C1380D/CY7C1380F/CY7C1382D, 18-Mbit (512K × 36/1M × 18) Pipelined SRAM
Document Number: 38-05543
Rev.
ECN No.
Submission
Date
*L (cont.)
3575733
04/09/2012
*M
3945784
03/27/2013
PRIT
Updated Package Diagrams:
spec 51-85180 – Changed revision from *E to *F.
*N
3977530
04/23/2013
PRIT
Added Errata.
*O
4068739
07/20/2013
PRIT
Added Errata footnotes (Note 1, 2, 3, 4, 5, 13).
Updated Pin Configurations:
Added Note 1 and referred the same note in Figure 1.
Added Note 2, 3 and referred the same note in Figure 2.
Updated Pin Definitions:
Added Note 4 and referred the same note in ZZ pin.
Added Note 5 and referred the same note in TDO, TDI, TMS, TCK pins.
Updated IEEE 1149.1 Serial Boundary Scan (JTAG [13]):
Added Note 13 and referred the same note in JTAG in the heading.
Updated Errata.
Updated to new template.
*P
4150971
10/08/2013
PRIT
Updated Errata.
*Q
4569232
11/14/2014
PRIT
Updated Functional Description:
Added “For a complete list of related documentation, click here.” at the end.
Updated Package Diagrams:
spec 51-85050 – Changed revision from *D to *E.
*R
4739641
04/24/2015
PRIT
Updated to new template.
Completing Sunset Review.
Document Number: 38-05543 Rev. *S
Orig. of
Change
NJY / PRIT Updated Pin Configurations (Removed CY7C1382F related information,
removed 119-ball BGA package related information, removed 100-pin TQFP
package related information for CY7C1380F, removed 165-ball FBGA
package related information for CY7C1382D, removed the Note “CE3, CE2 are
for 100-pin TQFP and 165-ball FBGA packages only. 119-ball BGA is offered
only in 1 chip enable.” and its reference).
Updated Functional Overview (Removed CY7C1382F related information).
Updated Truth Table (Removed CY7C1382F related information).
Updated Truth Table for Read/Write (Removed CY7C1382F related
information).
Updated IEEE 1149.1 Serial Boundary Scan (JTAG [13]) (Removed
CY7C1380D, CY7C1382D, and CY7C1382F related information).
Updated Identification Register Definitions (Removed CY7C1380D,
CY7C1382D, and CY7C1382F related information, removed 119-ball BGA
package related information).
Updated Scan Register Sizes (Removed 119-ball BGA package related
information).
Removed Boundary Scan Order (Corresponding to 119-ball BGA).
Updated Capacitance (Removed 119-ball BGA package related information).
Updated Thermal Resistance (Removed 119-ball BGA package related
information).
Updated Package Diagrams (Removed 119-ball BGA package related
information).
Page 36 of 38
Not Recommended for New Designs.
Description of Change
CY7C1380D
CY7C1380F
CY7C1382D
Document History Page (continued)
Document Title: CY7C1380D/CY7C1380F/CY7C1382D, 18-Mbit (512K × 36/1M × 18) Pipelined SRAM
Document Number: 38-05543
ECN No.
Submission
Date
Orig. of
Change
*S
5190429
03/29/2016
PRIT
Document Number: 38-05543 Rev. *S
Description of Change
Added watermark “Not Recommended for New Designs.” across the
document.
Updated Ordering Information:
No change in part numbers.
Added a column “MPN Status”.
Added Note 37 and referred the same note in all MPNs.
Updated Package Diagrams:
spec 51-85180 – Changed revision from *F to *G.
Updated to new template.
Completing Sunset Review.
Page 37 of 38
Not Recommended for New Designs.
Rev.
CY7C1380D
CY7C1380F
CY7C1382D
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© Cypress Semiconductor Corporation 2004-2016. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC ("Cypress"). This document,
including any software or firmware included or referenced in this document ("Software"), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries
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assume any liability arising out of the application or use of any product or circuit described in this document. Any information provided in this document, including any sample design information or
programming code, is provided only for reference purposes. It is the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application
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hazardous substances management, or other uses where the failure of the device or system could cause personal injury, death, or property damage ("Unintended Uses"). A critical component is any
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and hold Cypress harmless from and against all claims, costs, damages, and other liabilities, including claims for personal injury or death, arising from or related to any Unintended Uses of Cypress
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Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in the United
States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners.
Document Number: 38-05543 Rev. *S
Revised March 29, 2016
i486 is a trademark, and Intel and Pentium are registered trademarks of Intel Corporation. PowerPC is a trademark of IBM Corporation.
Page 38 of 38
Not Recommended for New Designs.
Products