MC9S08PA16 Reference Manual

MC9S08PA16 Reference Manual
Supports: MC9S08PA16(A) and MC9S08PA8(A)
Document Number: MC9S08PA16RM
Rev 2, 08/2014
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
2
Freescale Semiconductor, Inc.
Contents
Section number
Title
Page
Chapter 1
Device Overview
1.1
Introduction.....................................................................................................................................................................31
1.2
MCU block diagram....................................................................................................................................................... 32
1.3
System clock distribution................................................................................................................................................33
Chapter 2
Pins and connections
2.1
Device pin assignment.................................................................................................................................................... 37
2.2
Pin functions................................................................................................................................................................... 39
2.2.1
Power (VDD, VSS)..........................................................................................................................................39
2.2.2
Analog power supply and reference pins (VDDA/VREFH and VSSA/VREFL)............................................40
2.2.3
Oscillator (XTAL, EXTAL)............................................................................................................................ 40
2.2.4
External reset pin (RESET)..............................................................................................................................41
2.2.5
Background/mode select (BKGD/MS)............................................................................................................ 41
2.2.6
Port A input/output (I/O) pins (PTA–PTA0)................................................................................................... 42
2.2.7
Port B input/output (I/O) pins (PTB7–PTB0)..................................................................................................43
2.2.8
Port C input/output (I/O) pins (PTC–PTC0)....................................................................................................43
2.2.9
Port D input/output (I/O) pins (PTD7–PTD0)................................................................................................. 43
2.2.10
Port E input/Output (I/O) pins (PTE4–PTE0)..................................................................................................43
2.2.11
True open drain pins (PTA3–PTA2)................................................................................................................43
2.2.12
High current drive pins (PTB4, PTB5, PTD0, PTD1)..................................................................................... 44
2.2.13
Peripheral pinouts............................................................................................................................................ 44
Chapter 3
Power management
3.1
Introduction.....................................................................................................................................................................47
3.2
Features........................................................................................................................................................................... 47
3.2.1
Run mode......................................................................................................................................................... 47
3.2.2
Wait mode........................................................................................................................................................ 48
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
3
Section number
3.3
Title
Page
3.2.3
Stop3 mode...................................................................................................................................................... 48
3.2.4
Active BDM enabled in stop3 mode................................................................................................................48
3.2.5
LVD enabled in stop mode.............................................................................................................................. 49
3.2.6
Power modes behaviors................................................................................................................................... 49
Low voltage detect (LVD) system..................................................................................................................................50
3.3.1
Power-on reset (POR) operation...................................................................................................................... 51
3.3.2
LVD reset operation.........................................................................................................................................51
3.3.3
Low-voltage warning (LVW).......................................................................................................................... 51
3.4
Bandgap reference.......................................................................................................................................................... 52
3.5
Power management control bits and registers................................................................................................................ 52
3.5.1
System Power Management Status and Control 1 Register (PMC_SPMSC1)................................................52
3.5.2
System Power Management Status and Control 2 Register (PMC_SPMSC2)................................................54
Chapter 4
Memory map
4.1
Memory map...................................................................................................................................................................55
4.2
Reset and interrupt vector assignments...........................................................................................................................56
4.3
Register addresses and bit assignments.......................................................................................................................... 57
4.4
Random-access memory (RAM).................................................................................................................................... 67
4.5
Flash and EEPROM........................................................................................................................................................68
4.5.1
Overview.......................................................................................................................................................... 68
4.5.2
Function descriptions....................................................................................................................................... 70
4.5.2.1
Modes of operation........................................................................................................................ 70
4.5.2.2
Flash and EEPROM memory map.................................................................................................70
4.5.2.3
Flash and EEPROM initialization after system reset.....................................................................71
4.5.2.4
Flash and EEPROM command operations.....................................................................................71
4.5.2.5
Flash and EEPROM interrupts.......................................................................................................76
4.5.2.6
Protection....................................................................................................................................... 77
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
4
Freescale Semiconductor, Inc.
Section number
4.6
Title
Page
4.5.2.7
Security.......................................................................................................................................... 80
4.5.2.8
Flash and EEPROM commands.....................................................................................................82
4.5.2.9
Flash and EEPROM command summary...................................................................................... 84
Flash and EEPROM registers descriptions..................................................................................................................... 98
4.6.1
Flash Clock Divider Register (NVM_FCLKDIV)...........................................................................................98
4.6.2
Flash Security Register (NVM_FSEC)............................................................................................................99
4.6.3
Flash CCOB Index Register (NVM_FCCOBIX)............................................................................................ 100
4.6.4
Flash Configuration Register (NVM_FCNFG)............................................................................................... 100
4.6.5
Flash Error Configuration Register (NVM_FERCNFG).................................................................................101
4.6.6
Flash Status Register (NVM_FSTAT).............................................................................................................102
4.6.7
Flash Error Status Register (NVM_FERSTAT).............................................................................................. 103
4.6.8
Flash Protection Register (NVM_FPROT)......................................................................................................104
4.6.9
EEPROM Protection Register (NVM_EEPROT)............................................................................................105
4.6.10
Flash Common Command Object Register:High (NVM_FCCOBHI)............................................................ 106
4.6.11
Flash Common Command Object Register: Low (NVM_FCCOBLO)...........................................................107
4.6.12
Flash Option Register (NVM_FOPT)..............................................................................................................107
Chapter 5
Interrupt
5.1
5.2
Interrupts......................................................................................................................................................................... 109
5.1.1
Interrupt stack frame........................................................................................................................................ 110
5.1.2
Interrupt vectors, sources, and local masks......................................................................................................111
5.1.3
Hardware nested interrupt................................................................................................................................ 114
5.1.3.1
Interrupt priority level register....................................................................................................... 115
5.1.3.2
Interrupt priority level comparator set........................................................................................... 116
5.1.3.3
Interrupt priority mask update and restore mechanism..................................................................116
5.1.3.4
Integration and application of the IPC........................................................................................... 117
IRQ..................................................................................................................................................................................117
5.2.1
Features............................................................................................................................................................ 118
5.2.1.1
Pin configuration options............................................................................................................... 118
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
5
Section number
5.2.1.2
5.3
Page
Edge and level sensitivity.............................................................................................................. 119
Interrupt pin request register...........................................................................................................................................119
5.3.1
5.4
Title
Interrupt Pin Request Status and Control Register (IRQ_SC)......................................................................... 120
Interrupt priority control register.................................................................................................................................... 121
5.4.1
IPC Status and Control Register (IPC_SC)......................................................................................................122
5.4.2
Interrupt Priority Mask Pseudo Stack Register (IPC_IPMPS)........................................................................ 123
5.4.3
Interrupt Level Setting Registers n (IPC_ILRSn)............................................................................................123
Chapter 6
System control
6.1
System device identification (SDID).............................................................................................................................. 125
6.2
Universally unique identification (UUID)...................................................................................................................... 125
6.3
Reset and system initialization........................................................................................................................................125
6.4
System options................................................................................................................................................................ 126
6.5
6.6
6.4.1
BKGD pin enable.............................................................................................................................................126
6.4.2
RESET pin enable............................................................................................................................................ 126
6.4.3
SCI0 pin reassignment..................................................................................................................................... 126
6.4.4
SPI0 pin reassignment......................................................................................................................................127
6.4.5
IIC pins reassignments..................................................................................................................................... 127
6.4.6
FTM0 channels pin reassignment.................................................................................................................... 127
6.4.7
FTM2 channels pin reassignment.................................................................................................................... 127
6.4.8
Bus clock output pin enable............................................................................................................................. 127
System interconnection...................................................................................................................................................128
6.5.1
SCI0 TxD modulation...................................................................................................................................... 128
6.5.2
SCI0 RxD capture............................................................................................................................................ 129
6.5.3
SCI0 RxD filter................................................................................................................................................ 129
6.5.4
FTM2 software synchronization...................................................................................................................... 130
6.5.5
ADC hardware trigger......................................................................................................................................130
System Control Registers................................................................................................................................................131
6.6.1
System Reset Status Register (SYS_SRS).......................................................................................................131
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
6
Freescale Semiconductor, Inc.
Section number
Title
Page
6.6.2
System Background Debug Force Reset Register (SYS_SBDFR)..................................................................133
6.6.3
System Device Identification Register: High (SYS_SDIDH)......................................................................... 134
6.6.4
System Device Identification Register: Low (SYS_SDIDL).......................................................................... 134
6.6.5
System Options Register 1 (SYS_SOPT1)...................................................................................................... 135
6.6.6
System Options Register 2 (SYS_SOPT2)...................................................................................................... 136
6.6.7
System Options Register 3 (SYS_SOPT3)...................................................................................................... 137
6.6.8
System Options Register 4 (SYS_SOPT4)...................................................................................................... 138
6.6.9
Illegal Address Register: High (SYS_ILLAH)................................................................................................ 139
6.6.10
Illegal Address Register: Low (SYS_ILLAL)................................................................................................. 139
6.6.11
Universally Unique Identifier Register 1 (SYS_UUID1)................................................................................ 140
6.6.12
Universally Unique Identifier Register 2 (SYS_UUID2)................................................................................ 140
6.6.13
Universally Unique Identifier Register 3 (SYS_UUID3)................................................................................ 141
6.6.14
Universally Unique Identifier Register 4 (SYS_UUID4)................................................................................ 141
6.6.15
Universally Unique Identifier Register 5 (SYS_UUID5)................................................................................ 142
6.6.16
Universally Unique Identifier Register 6 (SYS_UUID6)................................................................................ 142
6.6.17
Universally Unique Identifier Register 7 (SYS_UUID7)................................................................................ 143
6.6.18
Universally Unique Identifier Register 8 (SYS_UUID8)................................................................................ 143
Chapter 7
Parallel input/output
7.1
Introduction.....................................................................................................................................................................145
7.2
Port data and data direction.............................................................................................................................................147
7.3
Internal pullup enable..................................................................................................................................................... 148
7.4
Input glitch filter setting..................................................................................................................................................148
7.5
High current drive........................................................................................................................................................... 149
7.6
Pin behavior in stop mode...............................................................................................................................................149
7.7
Port data registers............................................................................................................................................................149
7.7.1
Port A Data Register (PORT_PTAD).............................................................................................................. 150
7.7.2
Port B Data Register (PORT_PTBD).............................................................................................................. 150
7.7.3
Port C Data Register (PORT_PTCD).............................................................................................................. 151
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
7
Section number
Title
Page
7.7.4
Port D Data Register (PORT_PTDD).............................................................................................................. 151
7.7.5
Port E Data Register (PORT_PTED)...............................................................................................................152
7.7.6
Port High Drive Enable Register (PORT_HDRVE)........................................................................................152
7.7.7
Port A Output Enable Register (PORT_PTAOE)............................................................................................153
7.7.8
Port B Output Enable Register (PORT_PTBOE)............................................................................................ 154
7.7.9
Port C Output Enable Register (PORT_PTCOE)............................................................................................ 156
7.7.10
Port D Output Enable Register (PORT_PTDOE)............................................................................................157
7.7.11
Port E Output Enable Register (PORT_PTEOE).............................................................................................158
7.7.12
Port A Input Enable Register (PORT_PTAIE)................................................................................................ 159
7.7.13
Port B Input Enable Register (PORT_PTBIE)................................................................................................ 160
7.7.14
Port C Input Enable Register (PORT_PTCIE)................................................................................................ 161
7.7.15
Port D Input Enable Register (PORT_PTDIE)................................................................................................ 163
7.7.16
Port E Input Enable Register (PORT_PTEIE)................................................................................................. 164
7.7.17
Port Filter Register 0 (PORT_IOFLT0)...........................................................................................................165
7.7.18
Port Filter Register 1 (PORT_IOFLT1)...........................................................................................................166
7.7.19
Port Filter Register 2 (PORT_IOFLT2)...........................................................................................................166
7.7.20
Port Clock Division Register (PORT_FCLKDIV).......................................................................................... 167
7.7.21
Port A Pullup Enable Register (PORT_PTAPE)............................................................................................. 168
7.7.22
Port B Pullup Enable Register (PORT_PTBPE)..............................................................................................169
7.7.23
Port C Pullup Enable Register (PORT_PTCPE)..............................................................................................171
7.7.24
Port D Pullup Enable Register (PORT_PTDPE)............................................................................................. 172
7.7.25
Port E Pullup Enable Register (PORT_PTEPE).............................................................................................. 173
Chapter 8
Clock management
8.1
Clock module.................................................................................................................................................................. 175
8.2
Internal clock source (ICS)............................................................................................................................................. 177
8.2.1
Function description.........................................................................................................................................177
8.2.1.1
Bus frequency divider.................................................................................................................... 178
8.2.1.2
Low power bit usage...................................................................................................................... 178
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
8
Freescale Semiconductor, Inc.
Section number
8.2.2
8.2.3
8.3
Title
Page
8.2.1.3
Internal reference clock (ICSIRCLK)............................................................................................178
8.2.1.4
Fixed frequency clock (ICSFFCLK)..............................................................................................179
8.2.1.5
BDC clock......................................................................................................................................180
Modes of operation.......................................................................................................................................... 180
8.2.2.1
FLL engaged internal (FEI)........................................................................................................... 181
8.2.2.2
FLL engaged external (FEE)..........................................................................................................182
8.2.2.3
FLL bypassed internal (FBI)..........................................................................................................182
8.2.2.4
FLL bypassed internal low power (FBILP)................................................................................... 182
8.2.2.5
FLL bypassed external (FBE)........................................................................................................ 183
8.2.2.6
FLL bypassed external low power (FBELP)................................................................................. 183
8.2.2.7
Stop (STOP)................................................................................................................................... 184
FLL lock and clock monitor.............................................................................................................................185
8.2.3.1
FLL clock lock............................................................................................................................... 185
8.2.3.2
External reference clock monitor................................................................................................... 185
Initialization / application information........................................................................................................................... 185
8.3.1
Initializing FEI mode....................................................................................................................................... 186
8.3.2
Initializing FBI mode....................................................................................................................................... 186
8.3.3
Initializing FEE mode...................................................................................................................................... 186
8.3.4
Initializing FBE mode...................................................................................................................................... 187
8.3.5
External oscillator (OSC).................................................................................................................................187
8.3.5.1
Bypass mode.................................................................................................................................. 188
8.3.5.2
Low-power configuration.............................................................................................................. 188
8.3.5.3
High-gain configuration................................................................................................................. 189
8.3.5.4
Initializing external oscillator for peripherals................................................................................ 189
8.4
1 kHz low-power oscillator (LPO)................................................................................................................................. 190
8.5
Peripheral clock gating................................................................................................................................................... 190
8.6
ICS control registers....................................................................................................................................................... 190
8.6.1
ICS Control Register 1 (ICS_C1).................................................................................................................... 191
8.6.2
ICS Control Register 2 (ICS_C2).................................................................................................................... 192
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
9
Section number
8.7
Title
Page
8.6.3
ICS Control Register 3 (ICS_C3).................................................................................................................... 193
8.6.4
ICS Control Register 4 (ICS_C4).................................................................................................................... 193
8.6.5
ICS Status Register (ICS_S)............................................................................................................................ 194
8.6.6
OSC Status and Control Register (ICS_OSCSC)............................................................................................ 195
System clock gating control registers............................................................................................................................. 196
8.7.1
System Clock Gating Control 1 Register (SCG_C1).......................................................................................197
8.7.2
System Clock Gating Control 2 Register (SCG_C2).......................................................................................198
8.7.3
System Clock Gating Control 3 Register (SCG_C3).......................................................................................199
8.7.4
System Clock Gating Control 4 Register (SCG_C4).......................................................................................200
Chapter 9
Chip configurations
9.1
Introduction.....................................................................................................................................................................203
9.2
Core modules.................................................................................................................................................................. 203
9.3
9.2.1
Central processor unit (CPU)........................................................................................................................... 203
9.2.2
Debug module (DBG)...................................................................................................................................... 203
System modules.............................................................................................................................................................. 204
9.3.1
Watchdog (WDOG)......................................................................................................................................... 204
9.4
Clock module.................................................................................................................................................................. 204
9.5
Memory...........................................................................................................................................................................206
9.5.1
Random-access-memory (RAM)..................................................................................................................... 206
9.5.2
Non-volatile memory (NVM).......................................................................................................................... 206
9.6
Power modules................................................................................................................................................................206
9.7
Security........................................................................................................................................................................... 207
9.7.1
9.8
Cyclic redundancy check (CRC)......................................................................................................................207
Timers............................................................................................................................................................................. 209
9.8.1
FlexTimer module (FTM)................................................................................................................................ 209
9.8.1.1
FTM0 interconnection....................................................................................................................210
9.8.1.2
FTM2 interconnection....................................................................................................................211
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
10
Freescale Semiconductor, Inc.
Section number
9.8.2
9.9
Page
8-bit modulo timer (MTIM)............................................................................................................................. 211
9.8.2.1
9.8.3
Title
MTIM0 as ADC hardware trigger................................................................................................. 212
Real-time counter (RTC)................................................................................................................................. 213
Communication interfaces.............................................................................................................................................. 215
9.9.1
Serial communications interface (SCI)............................................................................................................ 215
9.9.1.1
SCI0 infrared functions.................................................................................................................. 217
9.9.2
8-Bit Serial Peripheral Interface (8-bit SPI).................................................................................................... 218
9.9.3
Inter-Integrated Circuit (I2C)...........................................................................................................................219
9.10 Analog.............................................................................................................................................................................221
9.10.1
9.10.2
Analog-to-digital converter (ADC)..................................................................................................................221
9.10.1.1
ADC channel assignments............................................................................................................. 222
9.10.1.2
Alternate clock............................................................................................................................... 223
9.10.1.3
Hardware trigger............................................................................................................................ 223
9.10.1.4
Temperature sensor........................................................................................................................ 223
Analog comparator (ACMP)............................................................................................................................224
9.10.2.1
ACMP configuration information.................................................................................................. 225
9.10.2.2
ACMP in stop3 mode.....................................................................................................................226
9.10.2.3
ACMP for SCI0 RXD filter........................................................................................................... 226
9.11 Human-machine interfaces HMI.....................................................................................................................................226
9.11.1
Keyboard interrupts (KBI)............................................................................................................................... 226
Chapter 10
Central processor unit
10.1 Introduction.....................................................................................................................................................................229
10.1.1
Features............................................................................................................................................................ 229
10.2 Programmer's Model and CPU Registers....................................................................................................................... 230
10.2.1
Accumulator (A).............................................................................................................................................. 230
10.2.2
Index Register (H:X)........................................................................................................................................231
10.2.3
Stack Pointer (SP)............................................................................................................................................ 231
10.2.4
Program Counter (PC)..................................................................................................................................... 232
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
11
Section number
10.2.5
Title
Page
Condition Code Register (CCR)...................................................................................................................... 232
10.3 Addressing Modes.......................................................................................................................................................... 233
10.3.1
Inherent Addressing Mode (INH).................................................................................................................... 234
10.3.2
Relative Addressing Mode (REL)....................................................................................................................234
10.3.3
Immediate Addressing Mode (IMM)............................................................................................................... 234
10.3.4
Direct Addressing Mode (DIR)........................................................................................................................235
10.3.5
Extended Addressing Mode (EXT)..................................................................................................................235
10.3.6
Indexed Addressing Mode............................................................................................................................... 236
10.3.7
10.3.6.1
Indexed, No Offset (IX)................................................................................................................. 236
10.3.6.2
Indexed, No Offset with Post Increment (IX+)..............................................................................236
10.3.6.3
Indexed, 8-Bit Offset (IX1)............................................................................................................236
10.3.6.4
Indexed, 8-Bit Offset with Post Increment (IX1+)........................................................................ 237
10.3.6.5
Indexed, 16-Bit Offset (IX2)..........................................................................................................237
10.3.6.6
SP-Relative, 8-Bit Offset (SP1)..................................................................................................... 237
10.3.6.7
SP-Relative, 16-Bit Offset (SP2)................................................................................................... 238
Memory to memory Addressing Mode............................................................................................................ 238
10.3.7.1
Direct to Direct...............................................................................................................................238
10.3.7.2
Immediate to Direct....................................................................................................................... 238
10.3.7.3
Indexed to Direct, Post Increment..................................................................................................238
10.3.7.4
Direct to Indexed, Post-Increment................................................................................................. 239
10.4 Operation modes............................................................................................................................................................. 239
10.4.1
Stop mode........................................................................................................................................................ 239
10.4.2
Wait mode........................................................................................................................................................ 239
10.4.3
Background mode............................................................................................................................................ 240
10.4.4
Security mode.................................................................................................................................................. 241
10.5 HCS08 V6 Opcodes........................................................................................................................................................243
10.6 Special Operations.......................................................................................................................................................... 243
10.6.1
Reset Sequence................................................................................................................................................ 243
10.6.2
Interrupt Sequence........................................................................................................................................... 243
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
12
Freescale Semiconductor, Inc.
Section number
Title
Page
10.7 Instruction Set Summary.................................................................................................................................................244
Chapter 11
Keyboard Interrupts (KBI)
11.1 Introduction.....................................................................................................................................................................257
11.1.1
Features............................................................................................................................................................ 257
11.1.2
Modes of Operation......................................................................................................................................... 257
11.1.3
11.1.2.1
KBI in Wait mode.......................................................................................................................... 257
11.1.2.2
KBI in Stop modes......................................................................................................................... 258
Block Diagram................................................................................................................................................. 258
11.2 External signals description............................................................................................................................................ 258
11.3 Register definition...........................................................................................................................................................259
11.4 Memory Map and Registers............................................................................................................................................259
11.4.1
KBI Status and Control Register (KBIx_SC).................................................................................................. 259
11.4.2
KBIx Pin Enable Register (KBIx_PE)............................................................................................................. 260
11.4.3
KBIx Edge Select Register (KBIx_ES)........................................................................................................... 261
11.5 Functional Description....................................................................................................................................................261
11.5.1
Edge-only sensitivity........................................................................................................................................261
11.5.2
Edge and level sensitivity................................................................................................................................ 262
11.5.3
KBI Pullup Resistor......................................................................................................................................... 262
11.5.4
KBI initialization..............................................................................................................................................262
Chapter 12
FlexTimer Module (FTM)
12.1 Introduction.....................................................................................................................................................................265
12.1.1
FlexTimer philosophy...................................................................................................................................... 265
12.1.2
Features............................................................................................................................................................ 266
12.1.3
Modes of operation.......................................................................................................................................... 267
12.1.4
Block diagram.................................................................................................................................................. 267
12.2 Signal description............................................................................................................................................................270
12.2.1
EXTCLK — FTM external clock.................................................................................................................... 270
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
13
Section number
Title
Page
12.2.2
CHn — FTM channel (n) I/O pin.................................................................................................................... 270
12.2.3
FAULTj — FTM fault input............................................................................................................................ 270
12.3 Memory map and register definition...............................................................................................................................271
12.3.1
Module memory map....................................................................................................................................... 271
12.3.2
Register descriptions........................................................................................................................................ 271
12.3.3
Status and Control (FTMx_SC)....................................................................................................................... 274
12.3.4
Counter High (FTMx_CNTH)......................................................................................................................... 275
12.3.5
Counter Low (FTMx_CNTL).......................................................................................................................... 276
12.3.6
Modulo High (FTMx_MODH)........................................................................................................................ 276
12.3.7
Modulo Low (FTMx_MODL)......................................................................................................................... 277
12.3.8
Channel Status and Control (FTMx_CnSC).................................................................................................... 277
12.3.9
Channel Value High (FTMx_CnVH)...............................................................................................................280
12.3.10 Channel Value Low (FTMx_CnVL)................................................................................................................281
12.3.11 Counter Initial Value High (FTMx_CNTINH)................................................................................................ 281
12.3.12 Counter Initial Value Low (FTMx_CNTINL)................................................................................................. 282
12.3.13 Capture and Compare Status (FTMx_STATUS)............................................................................................. 282
12.3.14 Features Mode Selection (FTMx_MODE)...................................................................................................... 284
12.3.15 Synchronization (FTMx_SYNC)..................................................................................................................... 285
12.3.16 Initial State for Channel Output (FTMx_OUTINIT)....................................................................................... 287
12.3.17 Output Mask (FTMx_OUTMASK)................................................................................................................. 289
12.3.18 Function for Linked Channels (FTMx_COMBINEn)..................................................................................... 290
12.3.19 Deadtime Insertion Control (FTMx_DEADTIME)......................................................................................... 292
12.3.20 External Trigger (FTMx_EXTTRIG).............................................................................................................. 293
12.3.21 Channels Polarity (FTMx_POL)...................................................................................................................... 294
12.3.22 Fault Mode Status (FTMx_FMS).....................................................................................................................296
12.3.23 Input Capture Filter Control (FTMx_FILTERn)............................................................................................. 297
12.3.24 Fault Input Filter Control (FTMx_FLTFILTER).............................................................................................298
12.3.25 Fault Input Control (FTMx_FLTCTRL)..........................................................................................................299
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
14
Freescale Semiconductor, Inc.
Section number
Title
Page
12.4 Functional Description....................................................................................................................................................300
12.4.1
Clock Source.................................................................................................................................................... 301
12.4.1.1
Counter Clock Source.................................................................................................................... 301
12.4.2
Prescaler........................................................................................................................................................... 302
12.4.3
Counter.............................................................................................................................................................302
12.4.4
12.4.3.1
Up counting....................................................................................................................................302
12.4.3.2
Up-down counting..........................................................................................................................305
12.4.3.3
Free running counter...................................................................................................................... 306
12.4.3.4
Counter reset.................................................................................................................................. 307
Input capture mode...........................................................................................................................................307
12.4.4.1
Filter for input capture mode......................................................................................................... 308
12.4.5
Output compare mode...................................................................................................................................... 309
12.4.6
Edge-aligned PWM (EPWM) mode................................................................................................................ 311
12.4.7
Center-aligned PWM (CPWM) mode..............................................................................................................313
12.4.8
Combine mode................................................................................................................................................. 315
12.4.8.1
12.4.9
Asymmetrical PWM...................................................................................................................... 322
Complementary mode...................................................................................................................................... 322
12.4.10 Update of the registers with write buffers........................................................................................................323
12.4.10.1 CNTINH:L registers...................................................................................................................... 323
12.4.10.2 MODH:L registers......................................................................................................................... 323
12.4.10.3 CnVH:L registers........................................................................................................................... 324
12.4.11 PWM synchronization......................................................................................................................................325
12.4.11.1 Hardware trigger............................................................................................................................ 325
12.4.11.2 Software trigger..............................................................................................................................326
12.4.11.3 Boundary cycle.............................................................................................................................. 327
12.4.11.4 MODH:L registers synchronization...............................................................................................328
12.4.11.5 CnVH:L registers synchronization.................................................................................................330
12.4.11.6 OUTMASK register synchronization............................................................................................ 330
12.4.11.7 FTM counter synchronization........................................................................................................ 332
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
15
Section number
Title
Page
12.4.11.8 Summary of PWM synchronization...............................................................................................334
12.4.12 Deadtime insertion........................................................................................................................................... 336
12.4.12.1 Deadtime insertion corner cases.................................................................................................... 337
12.4.13 Output mask..................................................................................................................................................... 338
12.4.14 Fault control..................................................................................................................................................... 339
12.4.14.1 Automatic fault clearing.................................................................................................................341
12.4.14.2 Manual fault clearing..................................................................................................................... 342
12.4.15 Polarity control.................................................................................................................................................343
12.4.16 Initialization..................................................................................................................................................... 343
12.4.17 Features priority............................................................................................................................................... 344
12.4.18 Channel trigger output..................................................................................................................................... 344
12.4.19 Initialization trigger..........................................................................................................................................345
12.4.20 Capture test mode.............................................................................................................................................347
12.4.21 Dual edge capture mode...................................................................................................................................348
12.4.21.1 One-shot capture mode.................................................................................................................. 350
12.4.21.2 Continuous capture mode...............................................................................................................350
12.4.21.3 Pulse width measurement...............................................................................................................351
12.4.21.4 Period measurement....................................................................................................................... 353
12.4.21.5 Read coherency mechanism...........................................................................................................355
12.4.22 TPM emulation................................................................................................................................................ 357
12.4.22.1 MODH:L and CnVH:L synchronization........................................................................................357
12.4.22.2 Free running counter...................................................................................................................... 357
12.4.22.3 Write to SC.....................................................................................................................................357
12.4.22.4 Write to CnSC................................................................................................................................ 357
12.4.23 BDM mode.......................................................................................................................................................357
12.5 Reset overview................................................................................................................................................................358
12.6 FTM Interrupts................................................................................................................................................................360
12.6.1
Timer overflow interrupt..................................................................................................................................360
12.6.2
Channel (n) interrupt........................................................................................................................................ 360
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
16
Freescale Semiconductor, Inc.
Section number
12.6.3
Title
Page
Fault interrupt...................................................................................................................................................360
Chapter 13
8-bit modulo timer (MTIM)
13.1 Introduction.....................................................................................................................................................................361
13.2 Features........................................................................................................................................................................... 361
13.3 Modes of operation......................................................................................................................................................... 361
13.3.1
MTIM in wait mode......................................................................................................................................... 362
13.3.2
MTIM in stop mode......................................................................................................................................... 362
13.3.3
MTIM in active background mode.................................................................................................................. 362
13.4 Block diagram.................................................................................................................................................................362
13.5 External signal description..............................................................................................................................................363
13.6 Register definition...........................................................................................................................................................363
13.6.1
MTIM Status and Control Register (MTIMx_SC).......................................................................................... 363
13.6.2
MTIM Clock Configuration Register (MTIMx_CLK).................................................................................... 364
13.6.3
MTIM Counter Register (MTIMx_CNT)........................................................................................................ 365
13.6.4
MTIM Modulo Register (MTIMx_MOD)....................................................................................................... 366
13.7 Functional description.....................................................................................................................................................366
13.7.1
MTIM operation example................................................................................................................................ 367
Chapter 14
Real-time counter (RTC)
14.1 Introduction.....................................................................................................................................................................369
14.2 Features........................................................................................................................................................................... 369
14.2.1
14.2.2
Modes of operation.......................................................................................................................................... 369
14.2.1.1
Wait mode...................................................................................................................................... 369
14.2.1.2
Stop modes..................................................................................................................................... 370
Block diagram.................................................................................................................................................. 370
14.3 External signal description..............................................................................................................................................370
14.4 Register definition...........................................................................................................................................................371
14.4.1
RTC Status and Control Register 1 (RTC_SC1)............................................................................................. 371
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
17
Section number
Title
Page
14.4.2
RTC Status and Control Register 2 (RTC_SC2)............................................................................................. 372
14.4.3
RTC Modulo Register: High (RTC_MODH).................................................................................................. 373
14.4.4
RTC Modulo Register: Low (RTC_MODL)................................................................................................... 373
14.4.5
RTC Counter Register: High (RTC_CNTH)................................................................................................... 374
14.4.6
RTC Counter Register: Low (RTC_CNTL).................................................................................................... 374
14.5 Functional description.....................................................................................................................................................375
14.5.1
RTC operation example................................................................................................................................... 376
14.6 Initialization/application information............................................................................................................................. 377
Chapter 15
Serial communications interface (SCI)
15.1 Introduction.....................................................................................................................................................................379
15.1.1
Features............................................................................................................................................................ 379
15.1.2
Modes of operation.......................................................................................................................................... 379
15.1.3
Block diagram.................................................................................................................................................. 380
15.2 SCI signal descriptions................................................................................................................................................... 382
15.2.1
Detailed signal descriptions............................................................................................................................. 382
15.3 Register definition...........................................................................................................................................................382
15.3.1
SCI Baud Rate Register: High (SCIx_BDH)................................................................................................... 383
15.3.2
SCI Baud Rate Register: Low (SCIx_BDL).................................................................................................... 384
15.3.3
SCI Control Register 1 (SCIx_C1)...................................................................................................................385
15.3.4
SCI Control Register 2 (SCIx_C2)...................................................................................................................386
15.3.5
SCI Status Register 1 (SCIx_S1)..................................................................................................................... 387
15.3.6
SCI Status Register 2 (SCIx_S2)..................................................................................................................... 389
15.3.7
SCI Control Register 3 (SCIx_C3)...................................................................................................................391
15.3.8
SCI Data Register (SCIx_D)............................................................................................................................ 392
15.4 Functional description.....................................................................................................................................................393
15.4.1
Baud rate generation........................................................................................................................................ 393
15.4.2
Transmitter functional description................................................................................................................... 394
15.4.2.1
Send break and queued idle........................................................................................................... 394
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
18
Freescale Semiconductor, Inc.
Section number
15.4.3
Title
Page
Receiver functional description....................................................................................................................... 395
15.4.3.1
Data sampling technique................................................................................................................ 396
15.4.3.2
Receiver wake-up operation...........................................................................................................397
15.4.4
Interrupts and status flags................................................................................................................................ 398
15.4.5
Baud rate tolerance...........................................................................................................................................399
15.4.6
15.4.5.1
Slow data tolerance........................................................................................................................ 400
15.4.5.2
Fast data tolerance..........................................................................................................................401
Additional SCI functions................................................................................................................................. 402
15.4.6.1
8- and 9-bit data modes.................................................................................................................. 402
15.4.6.2
Stop mode operation...................................................................................................................... 402
15.4.6.3
Loop mode..................................................................................................................................... 403
15.4.6.4
Single-wire operation..................................................................................................................... 403
Chapter 16
8-Bit Serial Peripheral Interface (8-Bit SPI)
16.1 Introduction.....................................................................................................................................................................405
16.1.1
Features............................................................................................................................................................ 405
16.1.2
Modes of operation.......................................................................................................................................... 406
16.1.3
Block diagrams................................................................................................................................................ 407
16.1.3.1
SPI system block diagram..............................................................................................................407
16.1.3.2
SPI module block diagram............................................................................................................. 407
16.2 External signal description..............................................................................................................................................409
16.2.1
SPSCK — SPI Serial Clock.............................................................................................................................409
16.2.2
MOSI — Master Data Out, Slave Data In....................................................................................................... 410
16.2.3
MISO — Master Data In, Slave Data Out....................................................................................................... 410
16.2.4
SS — Slave Select............................................................................................................................................410
16.3 Memory map/register definition..................................................................................................................................... 411
16.3.1
SPI Control Register 1 (SPIx_C1)................................................................................................................... 411
16.3.2
SPI Control Register 2 (SPIx_C2)................................................................................................................... 413
16.3.3
SPI Baud Rate Register (SPIx_BR)................................................................................................................. 414
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
19
Section number
Title
Page
16.3.4
SPI Status Register (SPIx_S)........................................................................................................................... 415
16.3.5
SPI Data Register (SPIx_D)............................................................................................................................. 416
16.3.6
SPI Match Register (SPIx_M)..........................................................................................................................417
16.4 Functional description.....................................................................................................................................................417
16.4.1
General............................................................................................................................................................. 417
16.4.2
Master mode.....................................................................................................................................................418
16.4.3
Slave mode....................................................................................................................................................... 419
16.4.4
SPI clock formats............................................................................................................................................. 421
16.4.5
SPI baud rate generation.................................................................................................................................. 424
16.4.6
Special features................................................................................................................................................ 424
16.4.7
16.4.6.1
SS Output....................................................................................................................................... 424
16.4.6.2
Bidirectional mode (MOMI or SISO)............................................................................................ 425
Error conditions................................................................................................................................................426
16.4.7.1
16.4.8
16.4.9
Mode fault error............................................................................................................................. 426
Low-power mode options................................................................................................................................ 427
16.4.8.1
SPI in Run mode............................................................................................................................ 427
16.4.8.2
SPI in Wait mode........................................................................................................................... 427
16.4.8.3
SPI in Stop mode............................................................................................................................428
Reset.................................................................................................................................................................428
16.4.10 Interrupts.......................................................................................................................................................... 429
16.4.10.1 MODF............................................................................................................................................ 429
16.4.10.2 SPRF.............................................................................................................................................. 429
16.4.10.3 SPTEF............................................................................................................................................ 430
16.4.10.4 SPMF............................................................................................................................................. 430
16.5 Initialization/application information............................................................................................................................. 430
16.5.1
Initialization sequence......................................................................................................................................430
16.5.2
Pseudo-Code Example..................................................................................................................................... 431
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
20
Freescale Semiconductor, Inc.
Section number
Title
Page
Chapter 17
Inter-Integrated Circuit (I2C)
17.1 Introduction.....................................................................................................................................................................433
17.1.1
Features............................................................................................................................................................ 433
17.1.2
Modes of operation.......................................................................................................................................... 434
17.1.3
Block diagram.................................................................................................................................................. 434
17.2 I2C signal descriptions....................................................................................................................................................435
17.3 Memory map/register definition..................................................................................................................................... 436
17.3.1
I2C Address Register 1 (I2C_A1)....................................................................................................................436
17.3.2
I2C Frequency Divider register (I2C_F)..........................................................................................................437
17.3.3
I2C Control Register 1 (I2C_C1).....................................................................................................................438
17.3.4
I2C Status register (I2C_S).............................................................................................................................. 439
17.3.5
I2C Data I/O register (I2C_D)......................................................................................................................... 441
17.3.6
I2C Control Register 2 (I2C_C2).....................................................................................................................442
17.3.7
I2C Programmable Input Glitch Filter Register (I2C_FLT)............................................................................ 442
17.3.8
I2C Range Address register (I2C_RA)............................................................................................................ 443
17.3.9
I2C SMBus Control and Status register (I2C_SMB).......................................................................................443
17.3.10 I2C Address Register 2 (I2C_A2)....................................................................................................................445
17.3.11 I2C SCL Low Timeout Register High (I2C_SLTH)....................................................................................... 445
17.3.12 I2C SCL Low Timeout Register Low (I2C_SLTL).........................................................................................446
17.4 Functional description.....................................................................................................................................................446
17.4.1
I2C protocol..................................................................................................................................................... 446
17.4.1.1
START signal................................................................................................................................ 447
17.4.1.2
Slave address transmission.............................................................................................................447
17.4.1.3
Data transfers................................................................................................................................. 448
17.4.1.4
STOP signal................................................................................................................................... 448
17.4.1.5
Repeated START signal.................................................................................................................449
17.4.1.6
Arbitration procedure..................................................................................................................... 449
17.4.1.7
Clock synchronization....................................................................................................................449
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
21
Section number
Title
Page
17.4.1.8
Handshaking...................................................................................................................................450
17.4.1.9
Clock stretching............................................................................................................................. 450
17.4.1.10 I2C divider and hold values........................................................................................................... 450
17.4.2
10-bit address................................................................................................................................................... 451
17.4.2.1
Master-transmitter addresses a slave-receiver............................................................................... 452
17.4.2.2
Master-receiver addresses a slave-transmitter............................................................................... 452
17.4.3
Address matching.............................................................................................................................................453
17.4.4
System management bus specification............................................................................................................ 454
17.4.4.1
Timeouts.........................................................................................................................................454
17.4.4.2
FAST ACK and NACK................................................................................................................. 456
17.4.5
Resets............................................................................................................................................................... 456
17.4.6
Interrupts.......................................................................................................................................................... 456
17.4.6.1
Byte transfer interrupt.................................................................................................................... 457
17.4.6.2
Address detect interrupt................................................................................................................. 457
17.4.6.3
Exit from low-power/stop modes...................................................................................................457
17.4.6.4
Arbitration lost interrupt................................................................................................................ 458
17.4.6.5
Timeout interrupt in SMBus.......................................................................................................... 458
17.4.7
Programmable input glitch filter...................................................................................................................... 459
17.4.8
Address matching wake-up.............................................................................................................................. 459
17.5 Initialization/application information............................................................................................................................. 460
Chapter 18
Analog-to-digital converter (ADC)
18.1 Introduction.....................................................................................................................................................................463
18.1.1
Features............................................................................................................................................................ 463
18.1.2
Block Diagram................................................................................................................................................. 464
18.2 External Signal Description............................................................................................................................................ 464
18.2.1
Analog Power (VDDA)................................................................................................................................... 465
18.2.2
Analog Ground (VSSA)...................................................................................................................................465
18.2.3
Voltage Reference High (VREFH).................................................................................................................. 465
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
22
Freescale Semiconductor, Inc.
Section number
Title
Page
18.2.4
Voltage Reference Low (VREFL)................................................................................................................... 465
18.2.5
Analog Channel Inputs (ADx)......................................................................................................................... 465
18.3 ADC Control Registers................................................................................................................................................... 466
18.3.1
Status and Control Register 1 (ADC_SC1)......................................................................................................466
18.3.2
Status and Control Register 2 (ADC_SC2)......................................................................................................468
18.3.3
Status and Control Register 3 (ADC_SC3)......................................................................................................469
18.3.4
Status and Control Register 4 (ADC_SC4)......................................................................................................470
18.3.5
Conversion Result High Register (ADC_RH)................................................................................................. 471
18.3.6
Conversion Result Low Register (ADC_RL).................................................................................................. 472
18.3.7
Compare Value High Register (ADC_CVH)...................................................................................................473
18.3.8
Compare Value Low Register (ADC_CVL)....................................................................................................473
18.3.9
Pin Control 1 Register (ADC_APCTL1)......................................................................................................... 474
18.3.10 Pin Control 2 Register (ADC_APCTL2)......................................................................................................... 475
18.4 Functional description.....................................................................................................................................................476
18.4.1
Clock select and divide control........................................................................................................................ 476
18.4.2
Input select and pin control.............................................................................................................................. 477
18.4.3
Hardware trigger.............................................................................................................................................. 477
18.4.4
Conversion control........................................................................................................................................... 478
18.4.4.1
Initiating conversions..................................................................................................................... 478
18.4.4.2
Completing conversions.................................................................................................................478
18.4.4.3
Aborting conversions..................................................................................................................... 479
18.4.4.4
Power control................................................................................................................................. 479
18.4.4.5
Sample time and total conversion time.......................................................................................... 480
18.4.5
Automatic compare function............................................................................................................................481
18.4.6
FIFO operation................................................................................................................................................. 482
18.4.7
MCU wait mode operation...............................................................................................................................485
18.4.8
MCU Stop mode operation.............................................................................................................................. 486
18.4.8.1
Stop mode with ADACK disabled.................................................................................................486
18.4.8.2
Stop mode with ADACK enabled..................................................................................................486
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
23
Section number
Title
Page
18.5 Initialization information................................................................................................................................................ 487
18.5.1
18.5.2
ADC module initialization example................................................................................................................ 487
18.5.1.1
Initialization sequence....................................................................................................................487
18.5.1.2
Pseudo-code example.....................................................................................................................488
ADC FIFO module initialization example.......................................................................................................488
18.5.2.1
Pseudo-code example.....................................................................................................................489
18.6 Application information..................................................................................................................................................490
18.6.1
18.6.2
External pins and routing................................................................................................................................. 490
18.6.1.1
Analog supply pins.........................................................................................................................490
18.6.1.2
Analog reference pins.................................................................................................................... 490
18.6.1.3
Analog input pins........................................................................................................................... 491
Sources of error................................................................................................................................................ 492
18.6.2.1
Sampling error................................................................................................................................492
18.6.2.2
Pin leakage error............................................................................................................................ 492
18.6.2.3
Noise-induced errors...................................................................................................................... 492
18.6.2.4
Code width and quantization error.................................................................................................493
18.6.2.5
Linearity errors...............................................................................................................................494
18.6.2.6
Code jitter, non-monotonicity, and missing codes.........................................................................494
Chapter 19
Analog comparator (ACMP)
19.1 Introduction.....................................................................................................................................................................497
19.1.1
Features............................................................................................................................................................ 497
19.1.2
Modes of operation.......................................................................................................................................... 497
19.1.3
19.1.2.1
Operation in Wait mode................................................................................................................. 498
19.1.2.2
Operation in Stop mode................................................................................................................. 498
19.1.2.3
Operation in Debug mode.............................................................................................................. 498
Block diagram.................................................................................................................................................. 498
19.2 External signal description..............................................................................................................................................498
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
24
Freescale Semiconductor, Inc.
Section number
Title
Page
19.3 Memory map and register definition...............................................................................................................................499
19.3.1
ACMP Control and Status Register (ACMP_CS)........................................................................................... 499
19.3.2
ACMP Control Register 0 (ACMP_C0).......................................................................................................... 500
19.3.3
ACMP Control Register 1 (ACMP_C1).......................................................................................................... 501
19.3.4
ACMP Control Register 2 (ACMP_C2).......................................................................................................... 501
19.4 Functional description.....................................................................................................................................................502
19.5 Setup and operation of ACMP........................................................................................................................................503
19.6 Resets.............................................................................................................................................................................. 503
19.7 Interrupts......................................................................................................................................................................... 503
Chapter 20
Cyclic redundancy check (CRC)
20.1 Introduction.....................................................................................................................................................................505
20.2 Features........................................................................................................................................................................... 505
20.3 Block diagram.................................................................................................................................................................505
20.4 Modes of operation......................................................................................................................................................... 506
20.5 Register definition...........................................................................................................................................................506
20.5.1
CRC Data 0 Register (CRC_D0)..................................................................................................................... 507
20.5.2
CRC Data 1 Register (CRC_D1)..................................................................................................................... 507
20.5.3
CRC Data 2 Register (CRC_D2)..................................................................................................................... 508
20.5.4
CRC Data 3 Register (CRC_D3)..................................................................................................................... 509
20.5.5
CRC Polynomial 0 Register (CRC_P0)........................................................................................................... 509
20.5.6
CRC Polynomial 1 Register (CRC_P1)........................................................................................................... 510
20.5.7
CRC Polynomial 2 Register (CRC_P2)........................................................................................................... 510
20.5.8
CRC Polynomial 3 Register (CRC_P3)........................................................................................................... 511
20.5.9
CRC Control Register (CRC_CTRL).............................................................................................................. 511
20.6 Functional description.....................................................................................................................................................512
20.6.1
16-bit CRC calculation.....................................................................................................................................512
20.6.2
32-bit CRC calculation.....................................................................................................................................512
20.6.3
Bit reverse........................................................................................................................................................ 513
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
25
Section number
Title
Page
20.6.4
Result complement...........................................................................................................................................513
20.6.5
CCITT compliant CRC example......................................................................................................................513
Chapter 21
Watchdog (WDOG)
21.1 Introduction.....................................................................................................................................................................515
21.1.1
Features............................................................................................................................................................ 515
21.1.2
Block diagram.................................................................................................................................................. 516
21.2 Memory map and register definition...............................................................................................................................517
21.2.1
Watchdog Control and Status Register 1 (WDOG_CS1)................................................................................ 517
21.2.2
Watchdog Control and Status Register 2 (WDOG_CS2)................................................................................ 519
21.2.3
Watchdog Counter Register: High (WDOG_CNTH)...................................................................................... 520
21.2.4
Watchdog Counter Register: Low (WDOG_CNTL)....................................................................................... 520
21.2.5
Watchdog Timeout Value Register: High (WDOG_TOVALH)..................................................................... 521
21.2.6
Watchdog Timeout Value Register: Low (WDOG_TOVALL)...................................................................... 521
21.2.7
Watchdog Window Register: High (WDOG_WINH)..................................................................................... 522
21.2.8
Watchdog Window Register: Low (WDOG_WINL)...................................................................................... 522
21.3 Functional description.....................................................................................................................................................523
21.3.1
21.3.2
Watchdog refresh mechanism.......................................................................................................................... 523
21.3.1.1
Window mode................................................................................................................................ 524
21.3.1.2
Refreshing the Watchdog...............................................................................................................524
21.3.1.3
Example code: Refreshing the Watchdog...................................................................................... 525
Configuring the Watchdog...............................................................................................................................525
21.3.2.1
Reconfiguring the Watchdog......................................................................................................... 525
21.3.2.2
Unlocking the Watchdog............................................................................................................... 526
21.3.2.3
Example code: Reconfiguring the Watchdog................................................................................ 526
21.3.3
Clock source.....................................................................................................................................................526
21.3.4
Using interrupts to delay resets........................................................................................................................ 528
21.3.5
Backup reset..................................................................................................................................................... 528
21.3.6
Functionality in debug and low-power modes................................................................................................. 528
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
26
Freescale Semiconductor, Inc.
Section number
21.3.7
Title
Page
Fast testing of the watchdog.............................................................................................................................529
21.3.7.1
Testing each byte of the counter.................................................................................................... 529
21.3.7.2
Entering user mode........................................................................................................................ 530
Chapter 22
Development support
22.1 Introduction.....................................................................................................................................................................531
22.1.1
Forcing active background...............................................................................................................................531
22.1.2
Features............................................................................................................................................................ 531
22.2 Background debug controller (BDC)..............................................................................................................................532
22.2.1
BKGD pin description..................................................................................................................................... 533
22.2.2
Communication details.................................................................................................................................... 534
22.2.3
BDC commands............................................................................................................................................... 536
22.2.4
BDC hardware breakpoint............................................................................................................................... 539
22.3 On-chip debug system (DBG)........................................................................................................................................ 539
22.3.1
Comparators A and B.......................................................................................................................................540
22.3.2
Bus capture information and FIFO operation.................................................................................................. 540
22.3.3
Change-of-flow information............................................................................................................................ 541
22.3.4
Tag vs. force breakpoints and triggers............................................................................................................. 542
22.3.5
Trigger modes.................................................................................................................................................. 543
22.3.6
Hardware breakpoints...................................................................................................................................... 544
22.4 Memory map and register description............................................................................................................................ 545
22.4.1
BDC Status and Control Register (BDC_SCR)............................................................................................... 545
22.4.2
BDC Breakpoint Match Register: High (BDC_BKPTH)................................................................................ 547
22.4.3
BDC Breakpoint Register: Low (BDC_BKPTL)............................................................................................ 548
22.4.4
System Background Debug Force Reset Register (BDC_SBDFR).................................................................548
Chapter 23
Debug module (DBG)
23.1 Introduction.....................................................................................................................................................................551
23.1.1
Features............................................................................................................................................................ 551
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
27
Section number
Title
Page
23.1.2
Modes of operation.......................................................................................................................................... 552
23.1.3
Block diagram.................................................................................................................................................. 552
23.2 Signal description............................................................................................................................................................553
23.3 Memory map and registers..............................................................................................................................................553
23.3.1
Debug Comparator A High Register (DBG_CAH)......................................................................................... 554
23.3.2
Debug Comparator A Low Register (DBG_CAL).......................................................................................... 555
23.3.3
Debug Comparator B High Register (DBG_CBH)..........................................................................................556
23.3.4
Debug Comparator B Low Register (DBG_CBL)...........................................................................................556
23.3.5
Debug Comparator C High Register (DBG_CCH)..........................................................................................557
23.3.6
Debug Comparator C Low Register (DBG_CCL)...........................................................................................558
23.3.7
Debug FIFO High Register (DBG_FH)...........................................................................................................558
23.3.8
Debug FIFO Low Register (DBG_FL)............................................................................................................ 559
23.3.9
Debug Comparator A Extension Register (DBG_CAX)................................................................................. 560
23.3.10 Debug Comparator B Extension Register (DBG_CBX)..................................................................................561
23.3.11 Debug Comparator C Extension Register (DBG_CCX)..................................................................................562
23.3.12 Debug FIFO Extended Information Register (DBG_FX)................................................................................563
23.3.13 Debug Control Register (DBG_C)...................................................................................................................563
23.3.14 Debug Trigger Register (DBG_T)................................................................................................................... 564
23.3.15 Debug Status Register (DBG_S)......................................................................................................................566
23.3.16 Debug Count Status Register (DBG_CNT)..................................................................................................... 567
23.4 Functional description.....................................................................................................................................................568
23.4.1
23.4.2
Comparator.......................................................................................................................................................568
23.4.1.1
RWA and RWAEN in full modes..................................................................................................568
23.4.1.2
Comparator C in loop1 capture mode............................................................................................ 568
Breakpoints...................................................................................................................................................... 569
23.4.2.1
Hardware breakpoints.................................................................................................................... 569
23.4.3
Trigger selection.............................................................................................................................................. 570
23.4.4
Trigger break control (TBC)............................................................................................................................ 570
23.4.4.1
Begin- and end-trigger................................................................................................................... 571
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
28
Freescale Semiconductor, Inc.
Section number
23.4.5
23.4.6
Title
Page
23.4.4.2
Arming the DBG module............................................................................................................... 571
23.4.4.3
Trigger modes................................................................................................................................ 572
FIFO................................................................................................................................................................. 574
23.4.5.1
Storing data in FIFO...................................................................................................................... 575
23.4.5.2
Storing with begin-trigger.............................................................................................................. 575
23.4.5.3
Storing with end-trigger................................................................................................................. 575
23.4.5.4
Reading data from FIFO................................................................................................................ 575
Interrupt priority...............................................................................................................................................576
23.5 Resets.............................................................................................................................................................................. 577
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
29
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
30
Freescale Semiconductor, Inc.
Chapter 1
Device Overview
1.1 Introduction
These devices are members of the low-cost, high-performance HCS08 family of 8-bit
microcontroller units (MCUs). All MCUs in the family use the enhanced HCS08 central
processor unit and are available with a variety of modules, memory sizes and types, and
package types. The following table summarizes the peripheral availability per package
type for the devices available.
Table 1-1. Memory and package availability
Feature
MC9S08PA16
MC9S08PA8
Flash size (bytes)
16,384
8,192
EEPROM size (bytes)
256
256
RAM size (bytes)
2,048
2,048
LQFP-44
Yes
Yes
LQFP-32
Yes
Yes
SOIC-20
Yes
Yes
TSSOP-20
Yes
Yes
TSSOP-16
Yes
Yes
Table 1-2. Feature availability
Pin number
Bus frequency
(MHz)
44-pin
32-pin
20-pin
16-pin
20
20
20
20
IRQ
Yes
WDOG
Yes
DBG
Yes
IPC
Yes
CRC
Yes
ICS
Yes
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
31
MCU block diagram
Table 1-2. Feature availability (continued)
Pin number
44-pin
32-pin
20-pin
XOSC
Yes
RTC
Yes
SPI0 (8-bit)
Yes
IIC
Yes
ACMP
Yes
FTM0 channels
2-ch
FTM2 channels
16-pin
6-ch
MTIM0
2-ch
Yes
SCI0
Yes
SCI1
Yes
No
ADC
12-channel, 12-bit
12-channel, 12-bit
10-channel, 10-bit
8-channel, 10-bit
KBI pins
8
8
8
8
GPIO
37
28
18
14
1.2 MCU block diagram
The block diagram below shows the structure of the MCUs.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
32
Freescale Semiconductor, Inc.
Port A
Port B
CPU
PTB0/KBI0P4/RxD0/ADP4
PTB1/KBI0P5/TxD0/ADP5
PTB2/KBI0P6/SPSCK0/ADP6
PTB3/KBI0P7/MOSI0/ADP7
PTB4/FTM2CH4/MISO0 3
PTB5/FTM2CH5/SS0 3
PTB6/SDA/XTAL
PTB7/SCL/EXTAL
Port C
HCS08 CORE
PTA0/KBI0P0/FTM0CH0/ACMP0/ADP0
PTA1/KBI0P1/FTM0CH1/ACMP1/ADP1
PTA2/KBI0P2/RxD0/SDA1
PTA3/KBI0P3/TxD0/SCL1
PTA4/ACMPO/BKGD/MS 2
PTA5/IRQ/TCLK0/RESET
PTA6/FTM2FAULT1/ADP2
PTA7/FTM2FAULT2/ADP3
PTC0/FTM2CH0/ADP8
PTC1/FTM2CH1/ADP9
PTC2/FTM2CH2/ADP10
PTC3/FTM2CH3/ADP11
PTC4/FTM0CH0
PTC5/FTM0CH1
PTC6/RxD1
PTC7/TxD1
Port D
Chapter 1 Device Overview
PTD0/FTM2CH23
PTD1/FTM2CH33
PTD2
PTD3
PTD4
PTD5
PTD6
PTD7
BDC
SYSTEM INTEGRATION
MODULE (SIM)
WDG
IRQ
1 kHz OSC
LVD
KEYBOARD INTERRUPT
MODULE (KBI0)
INTER-INTEGRATED
CIRCUIT BUS (IIC)
8-BIT MODULO TIMER
INTERRUPT PRIORITY
(MTIM0)
CONTROLLER(IPC)
2-CH FLEX TIMER
ON-CHIP ICE AND
DEBUG MODUE (DBG)
MODULE (FTM0)
6-CH FLEX TIMER
MODULE (FTM2)
SERIAL COMMUNICATION
INTERFACE (SCI0)
USER EEPROM
MC9S08PA16 = 256 bytes
MC9S08PA8 = 256 bytes
USER RAM
MC9S08PA16 = 2,048 bytes
MC9S08PA8 = 2,048 bytes
20 MHz INTERNAL CLOCK
SOURCE (ICS)
EXTAL
XTAL
VDD
VSS
VDD4
VSS 4
VSS 4
VREFH
VDDA
VREFL
VSSA
EXTERNAL OSCILLATOR
SOURCE (XOSC)
SERIAL COMMUNICATION
INTERFACE (SCI1)
ANALOG COMPARATOR
(ACMP)
Port E
USER FLASH
MC9S08PA16 = 16,384 bytes
MC9S08PA8 = 8,192 bytes
REAL-TIME CLOCK
(RTC)
PTE0/SPSCK0
PTE1/MOSI0
PTE2/MISO0
PTE3/BUSOUT
PTE4/TCLK2
SERIAL PERIPHERAL
INTERFACE (SPI0)
POWER MANAGEMENT
CONTROLLER (PMC)
12-CH 12-BIT
ANALOG-TO-DIGITAL
CONVERTER(ADC)
CYCLIC REDUNDANCY
CHECK (CRC)
1. PTA2 and PTA3 operate as true-open drain when working as output.
2. PTA4/ACMPO/BKGD/MS is an output-only pin when used as port pin.
3. PTD0, PTD1, PTB4 and PTB5 can provide high sink/source current drive.
4. The secondary power pair of V DD and VSS (pin 11, 27 and 28 in 44-pin package) are not bonded in 32-pin, 20-pin or 16-pin packages.
Figure 1-1. MCU block diagram
1.3 System clock distribution
These series contain three on-chip clock sources:
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
33
System clock distribution
• Internal clock source (ICS) module — The main clock source generator providing
bus clock and other reference clocks to peripherals
• External oscillator (XOSC) module — The external oscillator providing reference
clock to internal clock source (ICS), the real-time clock counter clock module (RTC)
and other MCU sub-systems.
• Low-power oscillator (LPO) module — The on-chip low-power oscillator providing
1 kHz reference clock to RTC and watchdog (WDOG).
NOTE
For this device, the system clock is the bus clock.
The following figure shows a simplified clock connection diagram.
1-kHz
LPO
XTAL
EXTAL
OSC
LPOCLK
OSCOUT
ICSIRCLK
WDG
RTC
ICSFFCLK
ICS
ICSCLK (~8 MHz after reset)
CPU
RAM
TCLK0
TCLK2
ADC
ACMP
SPI
FTM0
MTIM0
FTM2
CRC
FLASH
BDC
DBG
IPC
SCI0
SCI1
IIC
÷2
KBI
ICSLCLK
Figure 1-2. System clock distribution diagram
The clock system supplies:
• ICSCLK(BUS) — This up to 20 MHz clock source is used as the bus clock that is
the reference to CPU and all peripherals. Control bits in the ICS control registers
determine which of the clock sources is connected:
• Internal reference clock
• External reference clock
• Frequency-locked loop (FLL) output

MC9S08PA16 Reference Manual, Rev. 2, 08/2014
34
Freescale Semiconductor, Inc.
Chapter 1 Device Overview
• ICSLCLK — This clock source is derived from the digitally controlled oscillator
(DCO) of the ICS when the ICS is configured to run off of the internal or external
reference clock. Development tools can select this internal self-clocked source (8
MHz) to speed up BDC communications in systems where the bus clock is slow.
• ICSIRCLK — This is the internal reference clock and can be selected as the clock
source to the WDOG module.
• ICSFFCLK — This generates the fixed frequency clock (FFCLK) after being
synchronized to the bus clock. It can be selected as clock source to the FTM and
MTIM modules. The frequency of the ICSFFCLK is determined by the setting of the
ICS.
• LPOCLK — This clock is generated from an internal low power oscillator (≈1 kHz)
that is completely independent of the ICS module. The LPOCLK can be selected as
the clock source to the RTC or WDOG modules.
• OSCOUT — This is the direct output of the external oscillator module and can be
selected as the clock source for RTC, WDOG and ADC.
• TCLK0 — This is an optional external clock source for the FTM0 and MTIM0
modules. The TCLK0 must be limited to 1/4th frequency of the bus clock for
synchronization.
• TCLK2 — This is an optional external clock source for the FTM2 module. The
TCLK2 must be limited to 1/4th frequency of the bus clock for synchronization.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
35
System clock distribution
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
36
Freescale Semiconductor, Inc.
Chapter 2
Pins and connections
PTA0/KBI0P0/FTM0CH0/ACMP0/ADP0
PTA1/KBI0P1/FTM0CH1/ACMP1/ADP1
35
34
PTC6/RxD1
PTC7/TxD1
36
PTE2/MISO0
38
37
PTE0/SPSCK0
PTE1/MOSI0
39
PTC5/FTM0CH1
40
41
42
PTA4/ACMPO/BKGD/MS
PTA5/IRQ/TCLK0/RESET
PTC4/FTM0CH0
44
43
2.1 Device pin assignment
33
PTA2/KBI0P2/RxD0/SDA 2
32
PTA3/KBI0P3/TxD0/SCL 2
PTD1/FTM2CH31
1
1
2
PTE4/TCLK2
PTE3/BUSOUT
VDD
3
31
PTD2
4
30
PTD3
5
29
PTD4
VDDA /VREFH
6
28
VDD
PTD0/FTM2CH2
18
19
20
21
22
PTD5
PTC1/FTM2CH1/ADP9
PTC0/FTM2CH0/ADP8
PTB3/KBI0P7/MOSI0/ADP7
PTB2/KBI0P6/SPSCK0/ADP6
17
PTD6
23
16
11
PTD7
VSS
PTA7/FTM2FAULT2/ADP3
PTB0/KBI0P4/RxD0/ADP4
PTB1/KBI0P5/TxD0/ADP5
14
25
24
15
9
10
PTC3/FTM2CH3/ADP11
PTB7/SCL/EXTAL
PTB6/SDA/XTAL
PTC2/FTM2CH2/ADP10
PTA6/FTM2FAULT1/ADP2
12
26
13
27
8
PTB5/FTM2CH5/SS01
7
VSS
PTB4/FTM2CH4/MISO01
VSSA /VREFL
VSS
Pins in bold are not available on less pin-count packages.
1. High source/sink current pins
2. True open drain pins
Figure 2-1. MC9S08PA16 44-pin LQFP package
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
37
PTC5/FTM0CH1
PTC6/RxD1
PTC7/TxD1
PTA0/KBI0P0/FTM0CH0/ACMP0/ADP0
PTA1/KBI0P1/FTM0CH1/ACMP1/ADP1
29
28
27
26
25
PTA5/IRQ/TCLK1/RESET
PTC4/FTM0CH0
30
PTA4/ACMPO/BKGD/MS
32
31
Device pin assignment
PTD1/FTM2CH31
1
PTD0/FTM2CH2
1
2
VDD
3
22
PTD2
VDDA/VREFH
4
21
PTD3
PTA6/FTM2FAULT1/ADP2
24
PTA2/KBI0P2/RxD0/SDA 2
23
PTA3/KBI0P3/TxD0/SCL2
14
15
16
PTC0/FTM2CH0/ADP8
PTB2/KBI0P6/SPSCK0/ADP6
PTB1/KBI0P5/TxD0/ADP5
PTB3/KBI0P7/MOSI0/ADP7
17
12
8
13
PTB6/SDA/XTAL
PTC1/FTM2CH1/ADP9
PTB0/KBI0P4/RxD0/ADP4
PTC2/FTM2CH2/ADP10
18
11
7
PTC3/FTM2CH3/ADP11
PTA7/FTM2FAULT2/ADP3
PTB7/SCL/EXTAL
9
19
10
20
6
PTB5/FTM2CH5/SS01
5
VSS
PTB4/FTM2CH4/MISO01
VSSA/VREFL
Pins in bold are not available on less pin-count packages.
1. High source/sink current pins
2. True open drain pins
Figure 2-2. MC9S08PA16 32-pin LQFP package
PTA5/IRQ/TCLK0/RESET
1
20
PTA4/ACMPO/BKGD/MS
VDD
VSS
2
19
PTA1/KBI0P1/FTM0CH1/ACMP1/ADP1
3
18
PTA2/KBI0P2/RxD0/SDA2
4
17
16
PTA3/KBI0P3/TxD0/SCL2
15
14
13
PTB1/KBI0P5/TxD0/ADP5
PTB3/KBI0P7/MOSI0/ADP7
12
PTC0/FTM2CH0/ADP8
11
PTC1/FTM2CH1/ADP9
PTB7/SCL/EXTAL
5
PTB6/SDA/XTAL
6
PTB5/FTM2CH5/SS01
PTB4/FTM2CH4/MISO01
7
PTC3/FTM2CH3/ADP11
8
9
PTC2/FTM2CH2/ADP10
10
PTA0/KBI0P0/FTM0CH0/ACMP0/ADP0
PTB0/KBI0P4/RxD0/ADP4
PTB2/KBI0P6/SPSCK0/ADP6
Pins in bold are not available on less pin-count packages.
1. High source/sink current pins
2. True open drain pins
Figure 2-3. MC9S08PA16 20-pin SOIC and TSSOP package
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
38
Freescale Semiconductor, Inc.
Chapter 2 Pins and connections
PTA5/IRQ/TCLK0/RESET
1
16
PTA0/KBI0P0/FTM0CH0/ACMP0/ADP0
PTA4/ACMPO/BKGD/MS
VDD
VSS
2
PTA1/KBI0P1/FTM0CH1/ACMP1/ADP1
4
15
14
13
PTA3/KBI0P3/TxD0/SCL2
PTB7/SCL/EXTAL
5
12
PTB0/KBI0P4/RxD0/ADP4
PTB6/SDA/XTAL
6
PTB1/KBI0P5/TxD0/ADP5
7
11
10
8
9
3
PTB5/FTM2CH5/SS01
PTB4/FTM2CH4/MISO01
PTA2/KBI0P2/RxD0/SDA 2
PTB2/KBI0P6/SPSCK0/ADP6
PTB3/KBI0P7/MOSI0/ADP7
Pins in bold are not available on less pin-count packages.
1. High source/sink current pins
2. True open drain pins
Figure 2-4. MC9S08PA16 16-pin TSSOP package
2.2 Pin functions
2.2.1 Power (VDD, VSS)
VDD and VSS are the primary power supply pins for the MCU. This voltage source
supplies power to all I/O buffer circuitry and to an internal voltage regulator. The internal
voltage regulator provides a regulated lower-voltage source to the CPU and to the MCU's
other internal circuitry.
Typically, application systems have two separate capacitors across the power pins. In this
case, there should be a bulk electrolytic capacitor, such as a 10 µF tantalum capacitor,
that provides bulk charge storage for the overall system and a 0.1 µF ceramic bypass
capacitor located as near to the paired VDD and VSS power pins as practical to suppress
high-frequency noise.
MCU
Vss
VDD
C1
0.1 F
C2
VDD
Figure 2-5. Power supply bypassing
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
39
Pin functions
2.2.2 Analog power supply and reference pins (VDDA/VREFH and
VSSA/VREFL)
VDDA and VSSA are the power supply pins for the analog-to-digital converter (ADC).
Connect the VDDA pin to the same voltage potential as VDD, and the VSSA pin to the same
voltage potential as VSS.
De-coupling of these pins should be as per the digital supply. A 0.1 µF ceramic bypass
capacitor should be located as near to the MCU power pins as practical to suppress highfrequency noise.
MCU
VDDA /VREFH
VSSA /V
REFL
C1
0.1 F
External reference voltage
Figure 2-6. Analog power supply bypassing
VREFH is the high reference supply for the ADC, and is internally connected to VDDA.
VREFL is the low reference supply for the ADC, and is internally connected to VSSA.
2.2.3 Oscillator (XTAL, EXTAL)
The XTAL and EXTAL pins are used to provide the connections for the on-chip
oscillator. The oscillator (XOSC) in this MCU is a Pierce oscillator that can
accommodate a crystal or ceramic resonator. Optionally, an external clock source can be
connected to the EXTAL input pin. The oscillator can be configured to run in stop3
mode.
Refer to the following figure, RS (when used) and RF must be low-inductance resistors
such as carbon composition resistors. Wire-wound resistors, and some metal film
resistors, have too much inductance. C1 and C2 normally must be high-quality ceramic
capacitors that are specifically designed for high-frequency applications.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
40
Freescale Semiconductor, Inc.
Chapter 2 Pins and connections
MCU
EXTAL
XTAL
Rs
RF
X1
C1
C2
Figure 2-7. Typical crystal or resonator circuit
RF is used to provide a bias path to keep the EXTAL input in its linear range during
crystal startup; its value is not generally critical. Typical systems use 1 M to 10 M.
Higher values are sensitive to humidity and lower values reduce gain and (in extreme
cases) could prevent startup.
C1 and C2 are typically in the 5 pF to 25 pF range and are chosen to match the
requirements of a specific crystal or resonator. Take into account printed circuit board
(PCB) capacitance and MCU pin capacitance when selecting C1 and C2. The crystal
manufacturer typically specifies a load capacitance, which is the series combination of
C1 and C2 (which are usually the same size). As a first-order approximation, use 10 pF as
an estimate of combined pin and PCB capacitance for each oscillator pin (EXTAL and
XTAL).
2.2.4 External reset pin (RESET)
A low on the RESET pin forces the MCU to an known startup state. RESET is
bidirectional, allowing a reset of the entire system. It is driven low when any internal
reset source is asserted. This pin contains an internal pullup resistor.
2.2.5 Background/mode select (BKGD/MS)
During a power-on-reset (POR) or background debug force reset, the PTA4/ACMPO/
BKGD/MS pin functions as a mode select pin. Immediately after internal reset rises the
pin functions as the background pin and can be used for background debug
communication. While the pin functions as a background/mode selection pin, it includes
an internal pullup device and a standard output driver.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
41
Pin functions
The background debug communication function is enabled when SOPT1[BKGDPE] bit
is set. SOPT1[BKGDPE] is set following any reset of the MCU and must be cleared to
use the PTA4/ACMPO/BKGD/MS pin's alternative pin functions.
If this pin is floating, the MCU will enter normal operating mode at the rising edge of
reset. If a debug system is connected to the 6-pin standard background debug header, it
can hold BKGD/MS low during the POR or immediately after issuing a background
debug force reset, which will force the MCU into active background mode.
The BKGD pin is used primarily for background debug controller (BDC)
communications using a custom protocol that uses 16 clock cycles of the target MCU's
BDC clock per bit time. The target MCU's BDC clock can run as fast as the bus clock, so
there should never be any significant capacitance connected to the BKGD/MS pin that
interferes with background serial communications. When the pin performs output only
PTA4, it can drive only capacitance-limited MOSFET. Driving a bipolar transistor
directly by PTA4 is prohibited because this can cause mode entry fault and BKGD errors.
Although the BKGD pin is a pseudo open-drain pin, the background debug
communication protocol provides brief, actively driven, high speedup pulses to ensure
fast rise time. Small capacitances from cables and the absolute value of the internal
pullup device play almost no role in determining rise and fall time on the BKGD pin.
PTA5/IRQ/TCLK0/RESET
Optional Manual Reset
BKGD/MS
VSS
V DD
Figure 2-8. Typical debug circuit
2.2.6 Port A input/output (I/O) pins (PTA–PTA0)
PTA–PTA0 except PTA4 are general-purpose, bidirectional I/O port pins. These port
pins also have selectable pullup devices when configured for input mode except PTA4.
The pullup devices are selectable on an individual port bit basis. The pulling devices are
disengaged when configured for output mode except when PTA2 and PTA3 are used as
SDA and SCL function.
PTA3 and PTA2 provide true open drain when operated as output.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
42
Freescale Semiconductor, Inc.
Chapter 2 Pins and connections
2.2.7 Port B input/output (I/O) pins (PTB7–PTB0)
PTB7–PTB0 are general-purpose, bidirectional I/O port pins. These port pins also have
selectable pullup devices when configured for input mode, the pullup devices are
selectable on an individual port bit basis. The pulling devices are disengaged when
configured for output mode.
2.2.8 Port C input/output (I/O) pins (PTC–PTC0)
PTC–PTC0 are general-purpose, bidirectional I/O port pins. These port pins also have
selectable pullup devices when configured for input mode, and the pullup devices are
selectable on an individual port bit basis. The pulling devices are disengaged when
configured for output mode.
2.2.9 Port D input/output (I/O) pins (PTD7–PTD0)
PTD7–PTD0 are general-purpose, bidirectional I/O port pins. These port pins also have
selectable pullup devices when configured for input mode, the pullup devices are
selectable on an individual port bit basis. The pulling devices are disengaged when
configured for output mode.
2.2.10 Port E input/Output (I/O) pins (PTE4–PTE0)
PTE4–PTE0 are general-purpose, bidirectional I/O port pins. These port pins also have
selectable pullup devices when configured for input mode, the pullup devices are
selectable on an individual port bit basis. The pulling devices are disengaged when
configured for output mode.
2.2.11 True open drain pins (PTA3–PTA2)
PTA3 and PTA2 operate in true open drain mode.
NOTE
When configuring IIC to use SDA(PTA2) and SCL(PTA3)
pins, if an application uses internal pullups instead of external
pullups, the internal pullups remain present setting when the
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
43
Pin functions
pins are configured as outputs, but they are automatically
disabled to save power when the output values are low.
2.2.12 High current drive pins (PTB4, PTB5, PTD0, PTD1)
When high current function is enabled, PTB4, PTB5, PTD0 and PTD1 can drive output
current. Each high current drive pin can drive higher sink/source current than the other
normal pins, please refer to data sheet for the drive capacity.
2.2.13 Peripheral pinouts
These MCUs support up to 37 general-purpose I/O pins, which are shared with on-chip
peripheral functions (FTM, ACMP, ADC, SCI, SPI, IIC, KBI, etc.). These 37 generalpurpose I/O pins include one output-only pin (PTA4).
When a port pin is configured as general-purpose input, or when a peripheral uses the
port pin as an input, the software can enable a pullup device.
When a high current drive port pin is configured as general-purpose output or when a
peripheral uses the port pin as an output, software can select alternative drive strengths.
For information about controlling these pins as general-purpose I/O pins, see the Parallel
input/output. For information about how and when on-chip peripheral systems use these
pins, see the appropriate module chapter.
Immediately after reset, all pins are configured as high-impedance general-purpose IO
with internal pullup devices disabled.
Table 2-1. Pin availability by package pin-count
Pin Number
Lowest Priority <-- --> Highest
44-LQFP
32-LQFP
20-TSSOP
16-TSSOP
Port Pin
Alt 1
Alt 2
Alt 3
Alt 4
1
1
—
—
PTD11
—
FTM2CH3
—
—
—
FTM2CH2
—
—
2
2
—
—
PTD01
3
—
—
—
PTE4
—
TCLK2
—
—
4
—
—
—
PTE3
—
BUSOUT
—
—
5
3
3
3
—
—
—
—
VDD
6
4
—
—
—
—
—
VDDA
VREFH
7
5
—
—
—
—
—
VSSA
VREFL
8
6
4
4
—
—
—
—
VSS
9
7
5
5
PTB7
—
—
SCL
EXTAL
10
8
6
6
PTB6
—
—
SDA
XTAL
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
44
Freescale Semiconductor, Inc.
Chapter 2 Pins and connections
Table 2-1. Pin availability by package pin-count (continued)
Pin Number
Lowest Priority <-- --> Highest
44-LQFP
32-LQFP
20-TSSOP
16-TSSOP
Port Pin
Alt 1
Alt 2
Alt 3
Alt 4
11
—
—
—
—
—
—
—
Vss
12
9
7
7
PTB51
—
FTM2CH5
SS0
—
13
10
8
8
PTB41
—
FTM2CH4
MISO0
—
14
11
9
—
PTC3
—
FTM2CH3
ADP11
—
15
12
10
—
PTC2
—
FTM2CH2
ADP10
—
16
—
—
—
PTD7
—
—
—
—
17
—
—
—
PTD6
—
—
—
—
18
—
—
—
PTD5
—
—
—
—
19
13
11
—
PTC1
—
FTM2CH1
ADP9
—
20
14
12
—
PTC0
—
FTM2CH0
ADP8
—
21
15
13
9
PTB3
KBI0P7
MOSI0
ADP7
—
22
16
14
10
PTB2
KBI0P6
SPSCK0
ADP6
—
23
17
15
11
PTB1
KBI0P5
TXD0
ADP5
—
24
18
16
12
PTB0
KBI0P4
RXD0
ADP4
—
25
19
—
—
PTA7
—
FTM2FAULT2
ADP3
—
26
20
—
—
PTA6
—
FTM2FAULT1
ADP2
—
27
—
—
—
—
—
—
—
Vss
28
—
—
—
—
—
—
—
VDD
29
—
—
—
PTD4
—
—
—
—
30
21
—
—
PTD3
—
—
—
—
31
22
—
—
PTD2
—
—
—
—
13
PTA32
KBI0P3
TXD0
SCL
—
KBI0P2
RXD0
SDA
—
32
23
17
33
24
18
14
PTA22
34
25
19
15
PTA1
KBI0P1
FTM0CH1
ACMP1
ADP1
35
26
20
16
PTA0
KBI0P0
FTM0CH0
ACMP0
ADP0
36
27
—
—
PTC7
—
TxD1
—
—
37
28
—
—
PTC6
—
RxD1
—
—
38
—
—
—
PTE2
—
MISO0
—
—
39
—
—
—
PTE1
—
MOSI0
—
—
40
—
—
—
PTE0
—
SPSCK0
—
—
41
29
—
—
PTC5
—
FTM0CH1
—
—
42
30
—
—
PTC4
—
FTM0CH0
—
—
43
31
1
1
PTA5
IRQ
TCLK0
—
RESET
44
32
2
2
PTA4
—
ACMPO
BKGD
MS
1. This is a high current drive pin when operated as output. Please see High current drive for more information.
2. This is a true open-drain pin when operated as output.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
45
Pin functions
Note
When an alternative function is first enabled, it is possible to
get a spurious edge to the module. User software must clear any
associated flags before interrupts are enabled. The table above
illustrates the priority if multiple modules are enabled. The
highest priority module will have control over the pin. Selecting
a higher priority pin function with a lower priority function
already enabled can cause spurious edges to the lower priority
module. Disable all modules that share a pin before enabling
another module.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
46
Freescale Semiconductor, Inc.
Chapter 3
Power management
3.1 Introduction
The operating modes of the device are described in this chapter. Entry into each mode,
exit from each mode, and functionality while in each of the modes are described.
3.2 Features
These MCUs feature the following power modes:
• Run mode
• Wait mode
• CPU shuts down to conserve power
• Bus clocks are running
• Full voltage regulation is maintained
• Stop3 modes
• System clocks stopped; voltage regulator in standby
• all internal circuits powered for fast recovery
3.2.1 Run mode
This is the normal operating mode. In this mode, the CPU executes code from internal
memory with execution beginning at the address fetched from memory at 0xFFFE:
0xFFFF after reset. The power supply is fully regulating and all peripherals can be active
in run mode.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
47
Features
3.2.2 Wait mode
Wait mode is entered by executing a WAIT instruction. Upon execution of the WAIT
instruction, the CPU enters a low-power state in which it is not clocked. The I bit in CCR
is cleared when the CPU enters the wait mode, enabling interrupts. When an interrupt
request occurs, the CPU exits the wait mode and resumes processing, beginning with the
stacking operations leading to the interrupt service routine.
While the MCU is in wait mode, there are some restrictions on which background debug
commands can be used. Only the BACKGROUND command and memory-access-withstatus commands are available when the MCU is in wait mode. The memory-access-withstatus commands do not allow memory access, but they report an error indicating that the
MCU is in either stop or wait mode. The BACKGROUND command can be used to
wake the MCU from wait mode and enter active background mode.
3.2.3 Stop3 mode
To enter stop3, the user must execute a STOP instruction with stop mode enabled
(SOPT1[STOPE] = 1). Upon entering the stop3 mode, all of the clocks in the MCU are
halted by default, but OSC clock and internal reference clock can be turned on by setting
the ICS control registers. The ICS enters its standby state, as does the voltage regulator
and the ADC. The states of all of the internal registers and logic, as well as the RAM
content, are maintained. The I/O pin states are not latched at the pin. Instead they are
maintained by virtue of the states of the internal logic driving the pins being maintained.
Exit from stop3 is done by asserting reset or through an interrupt. The interrupt include
the asynchronous interrupt from the IRQ or KBI pins, the SCI receive interrupt, the ADC,
ACMP, IIC or LVI interrupt and the real-time interrupt.
If stop3 is exited by means of the RESET pin, then the MCU will be reset and operation
will resume after taking the reset vector. Exit by means of an asynchronous interrupt or
the real-time interrupt will result in the MCU taking the appropriate interrupt vector.
The LPO (≈1 kHz) for the real-time counter clock allows a wakeup from stop3 mode with
no external components. When RTC_SC2[RTCPS] is clear, the real-time counter clock
function is disabled.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
48
Freescale Semiconductor, Inc.
Chapter 3 Power management
3.2.4 Active BDM enabled in stop3 mode
Entry into the active background mode from run mode is enabled if the
BDC_SCR[ENBDM] bit is set. This register is described in the development support. If
BDC_SCR[ENBDM] is set when the CPU executes a STOP instruction, the system
clocks to the background debug logic remain active when the MCU enters stop mode, so
background debug communication is still possible. In addition, the voltage regulator does
not enter its low-power standby state but maintains full internal regulation.
Most background commands are not available in stop mode. The memory-access-withstatus commands do not allow memory access, but they report an error indicating that the
MCU is in either stop or wait mode. The BACKGROUND command can be used to
wake the MCU from stop and enter active background mode if the BDC_SCR[ENBDM]
bit is set. After entering background debug mode, all background commands are
available.
3.2.5 LVD enabled in stop mode
The LVD system is capable of generating either an interrupt or a reset when the supply
voltage drops below the LVD voltage. If the LVD is enabled in stop (LVDE and LVDSE
bits in SPMSC1 both set) at the time the CPU executes a STOP instruction, then the
voltage regulator remains active during stop3 mode.
3.2.6 Power modes behaviors
Executing the WAIT or STOP command puts the MCU in a low power consumption
mode for standby situations. The system integration module (SIM) holds the CPU in a
non-clocked state. The operation of each of these modes is described in the following
subsections. Both STOP and WAIT clear the interrupt mask (I) in the condition code
register, allowing interrupt to occur. The following table shows the low power mode
behaviors.
Table 3-1. Low power mode behavior
Mode
Run
Wait
Stop3
PMC
Full regulation
Full regulation
Loose regulation
ICS
On
On
Optional on
OSC
On
On
Optional on
LPO
On
On
On
CPU
On
Standby
Standby
FLASH
On
On
Standby
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
49
Low voltage detect (LVD) system
Table 3-1. Low power mode behavior (continued)
Mode
Run
Wait
Stop3
RAM
On
Standby
Standby
ADC
On
On
Optional on
ACMP
On
On
Optional on
I/O
On
On
States held
SCI
On
On
Standby
SPI
On
On
Standby
IIC
On
On
Standby
FTM
On
On
Standby
MTIM
On
On
Standby
WDOG
On
On
Optional on
DBG
On
On
Standby
IPC
On
On
Standby
CRC
On
On
Standby
RTC
On
On
Optional on
LVD
On
On
Optional on
3.3 Low voltage detect (LVD) system
This device includes a system to protect against low voltage conditions in order to protect
memory contents and control MCU system states during supply voltage variations. This
system consists of a power-on reset (POR) circuit and an LVD circuit with a user
selectable trip voltage, either high (VLVDH) or low (VLVDL). The LVD circuit is enabled
when SPMSC1[LVDE] is set and the trip voltage is selected by SPMSC2[LVDV]. The
LVD is disabled upon entering the stop modes unless the SPMSC1[LVDSE] bit is set or
active BDM enabled (BDCSCR[ENBDM]=1). If SPMSC1[LVDSE] and
SPMSC1[LVDE] are both set, the current consumption in stop3 with the LVD enabled
will be greater.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
50
Freescale Semiconductor, Inc.
Chapter 3 Power management
vDD
LVDV:LVDWV
R1
LVD0
+
LVD1
LVD
LVW0
LVW1
LVW2
LVW3
+
LVW
vBG
Bandgap
R7
vss
Figure 3-1. Low voltage detect (LVD) block diagram
3.3.1 Power-on reset (POR) operation
When power is initially applied to the MCU, or when the supply voltage drops below the
VPOR level, the POR circuit will cause a reset condition. As the supply voltage rises, the
LVD circuit will hold the chip in reset until the supply has risen above the VLVDL level.
Both the SRS[POR] and SRS[LVD] are set following a POR.
3.3.2 LVD reset operation
The LVD can be configured to generate a reset upon detection of a low voltage condition
by setting SPMSC1[LVDRE] to 1. After an LVD reset has occurred, the LVD system
will hold the MCU in reset until the supply voltage has risen above the level determined
by LVDV. The SRS[LVD] bit is set following either an LVD reset or POR.
3.3.3 Low-voltage warning (LVW)
The LVD system has a low voltage warning flag to indicate that the supply voltage is
approaching the LVD voltage. When a low voltage condition is detected and the LVD
circuit is configured for interrupt operation (SPMSC1[LVDE] set, SPMSC1[LVWIE]
set), SPMSC1[LVWF] will be set and LVW interrupt will occur. There are four userselectable trip voltages for the LVW upon each LVDV configuration. The trip voltage is
selected by SPMSC2[LVWV].
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
51
Bandgap reference
3.4 Bandgap reference
This device includes an on-chip bandgap reference (≈1.2V) connected to ADC channel
and ACMP. The bandgap reference voltage will not drop under the full operating voltage
even when the operating voltage is falling. This reference voltage acts as an ideal
reference voltage for accurate measurements.
3.5 Power management control bits and registers
PMC memory map
Absolute
address
(hex)
Width
Access
(in bits)
Register name
Reset value
Section/
page
3040
System Power Management Status and Control 1 Register
(PMC_SPMSC1)
8
R/W
1Ch
3.5.1/52
3041
System Power Management Status and Control 2 Register
(PMC_SPMSC2)
8
R/W
00h
3.5.2/54
3.5.1 System Power Management Status and Control 1 Register
(PMC_SPMSC1)
This high page register contains status and control bits to support the low-voltage
detection function, and to enable the bandgap voltage reference for use by the ADC
module. This register should be written during the user's reset initialization program to
set the desired controls, even if the desired settings are the same as the reset settings.
Address: 3040h base + 0h offset = 3040h
Bit
Read
7
6
LVWF
0
Write
Reset
LVWACK
0
5
4
3
2
1
0
LVWIE
LVDRE
LVDSE
LVDE
BGBDS
BGBE
0
1
1
1
0
0
0
PMC_SPMSC1 field descriptions
Field
7
LVWF
Description
Low-Voltage Warning Flag
The LVWF bit indicates the low-voltage warning status.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
52
Freescale Semiconductor, Inc.
Chapter 3 Power management
PMC_SPMSC1 field descriptions (continued)
Field
Description
NOTE: LVWF will be set in the case when VSupply transitions below the trip point or after reset and VSupply
is already below VLVW. LVWF bit may be 1 after power on reset, therefore, to use LVW interrupt
function, before enabling LVWIE, LVWF must be cleared by writing LVWACK first.
0
1
6
LVWACK
5
LVWIE
Low-Voltage Warning Acknowledge
If LVWF = 1, a low-voltage condition has occurred. To acknowledge this low-voltage warning, write 1 to
LVWACK, which automatically clears LVWF to 0 if the low-voltage warning is no longer present.
Low-Voltage Warning Interrupt Enable
This bit enables hardware interrupt requests for LVWF.
0
1
4
LVDRE
Low-voltage warning is not present.
Low-voltage warning is present or was present.
Hardware interrupt disabled (use polling).
Request a hardware interrupt when LVWF = 1.
Low-Voltage Detect Reset Enable
This write-once bit enables LVD events to generate a hardware reset (provided LVDE = 1).
NOTE: This bit can be written only one time after reset. Additional writes are ignored.
0
1
3
LVDSE
Low-Voltage Detect Stop Enable
Provided LVDE = 1, this read/write bit determines whether the low-voltage detect function operates when
the MCU is in stop mode.
0
1
2
LVDE
LVD events do not generate hardware resets.
Force an MCU reset when an enabled low-voltage detect event occurs.
Low-voltage detect disabled during stop mode.
Low-voltage detect enabled during stop mode.
Low-Voltage Detect Enable
This write-once bit enables low-voltage detect logic and qualifies the operation of other bits in this register.
NOTE: This bit can be written only one time after reset. Additional writes are ignored.
0
1
1
BGBDS
Bandgap Buffer Drive Select
This bit is used to select the high drive mode of the bandgap buffer.
0
1
0
BGBE
LVD logic disabled.
LVD logic enabled.
Bandgap buffer enabled in low drive mode if BGBE = 1.
Bandgap buffer enabled in high drive mode if BGBE = 1.
Bandgap Buffer Enable
This bit enables an internal buffer for the bandgap voltage reference for use by the ADC module on one of
its internal channels.
0
1
Bandgap buffer disabled.
Bandgap buffer enabled.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
53
Power management control bits and registers
3.5.2 System Power Management Status and Control 2 Register
(PMC_SPMSC2)
This register is used to report the status of the low-voltage warning function, and to
configure the stop mode behavior of the MCU. This register should be written during the
user's reset initialization program to set the desired controls, even if the desired settings
are the same as the reset settings.
Address: 3040h base + 1h offset = 3041h
Bit
7
Read
Write
Reset
0
6
LVDV
0
0
5
4
3
2
LVWV
0
1
0
0
0
0
0
0
0
PMC_SPMSC2 field descriptions
Field
7
Reserved
6
LVDV
Description
This field is reserved.
This read-only field is reserved and always has the value 0.
Low-Voltage Detect Voltage Select
This write-once bit selects the low-voltage detect (LVD) trip point setting. See data sheet for details.
0
1
5–4
LVWV
Low-Voltage Warning Voltage Select
This bit selects the low-voltage warning (LVW) trip point voltage. See data sheet for details.
00
01
10
11
Reserved
Low trip point selected (VLVD = VLVDL).
High trip point selected (VLVD = VLVDH).
Low trip point selected (VLVW = VLVW1).
Middle 1 trip point selected (VLVW = VLVW2).
Middle 2 trip point selected (VLVW = VLVW3).
High trip point selected (VLVW = VLVW4).
This field is reserved.
This read-only field is reserved and always has the value 0.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
54
Freescale Semiconductor, Inc.
Chapter 4
Memory map
4.1 Memory map
The HCS08 core processor can address 64 KB of memory space. The memory map,
shown in the following figure, includes:
• User flash memory (flash)
• MC9S08PA16: 16,384 bytes; 32 pages of 512 bytes each
• MC9S08PA8: 8,192 bytes; 16 pages of 512 bytes each
• Random-access memory (RAM)
• MC9S08PA16: 2,048 bytes
• MC9S08PA8: 2,048 bytes
• Electrically erasable programmable read-only memory (EEPROM)
• MC9S08PA16: 256 bytes; 128 pages of 2 bytes each
• MC9S08PA8: 256 bytes; 128 pages of 2 bytes each
• Direct-page registers (0x0000 through 0x003F)
• High-page registers (0x3000 through 0x30FF)
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
55
Reset and interrupt vector assignments
0x0000
0x003F
0x0040
0x0000
0x003F
0x0040
DIRECT PAGE REGISTERS
2048 BYTES RAM
2048 BYTES RAM
0x083F
0x0840
0x083F
0x0840
UNIMPLEMENTED
0x2FFF
0x3000
0x30FF
0x3100
0x31FF
0x3200
DIRECT PAGE REGISTERS
UNIMPLEMENTED
0x3000
0x30FF
0x3100
0x31FF
HIGH PAGE REGISTERS
256 BYTES EEPROM
HIGH PAGE REGISTERS
256 BYTES EEPROM
UNIMPLEMENTED
UNIMPLEMENTED
0xC000
0xE000
16,384B FLASH
8,192B FLASH
0xFFAF
0xFFB0
0xFFFF
0xFFAF
0xFFB0
0xFFFF
VECTOR TABLE
MC9S08PA16
VECTOR TABLE
MC9S08PA8
0xFFB0 map
Figure 4-1. Memory
4.2 Reset and interrupt vector assignments
The following table shows address assignments for reset and interrupt vectors. The vector
names shown in this table are the labels used in the Freescale-provided header files for
the device.
Table 4-1. Reset and interrupt vectors
Address
(high/low)
Vector
Vector name
0xFFB0:FFB1
NVM
Vnvm
0xFFB2:FFB3
Reserved
Reserved
0xFFB4:FFB5
KBI0
Vkbi0
0xFFB6:FFB7
Reserved
Reserved
0xFFB8:FFB9
RTC
Vrtc
0xFFBA:FFBB
IIC
Viic
0xFFBC:FFBD
Reserved
Reserved
0xFEBE:FFBF
SPI0
Vspi0
0xFFC0:FFC1
Reserved
Reserved
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
56
Freescale Semiconductor, Inc.
Chapter 4 Memory map
Table 4-1. Reset and interrupt vectors (continued)
Address
Vector
Vector name
Reserved
Reserved
0xFFC4:FFC5
Reserved
Reserved
0xFFC6:FFC7
SCI1 transmit
Vsci1txd
0xFFC8:FFC9
SCI1 receive
Vsci1rxd
0xFFCA:FFCB
SCI1 error
Vsci1err
0xFFCC:FFCD
SCI0 transmit
Vsci0txd
0xFFCE:FFCF
SCI0 receive
Vsci0rxd
0xFFD0:FFD1
SCI0 error
Vsci0err
0xFFD2:FFD3
ADC
Vadc
(high/low)
0xFFC2:FFC3
0xFFD4:FFD5
ACMP
Vacmp
0xFFD6:FFD7
Reserved
Reserved
0xFFD8:FFD9
MTIM0
Vmtim0
0xFFDA:FFDB
FTM0 overflow
Vftm0ovf
0xFFDC:FFDD
FTM0 channel 1
Vftm0ch1
0xFFDE:FFDF
FTM0 channel 0
Vftm0ch0
0xFFE0:FFE1
Reserved
Reserved
0xFFE2:FFE3
Reserved
Reserved
0xFFE4:FFE5
Reserved
Reserved
0xFFE6:FFE7
FTM2 overflow
Vftm2ovf
0xFFE8:FFE9
FTM2 channel 5
Vftm2ch5
0xFFEA:FFEB
FTM2 channel 4
Vftm2ch4
0xFFEC:FFED
FTM2 channel 3
Vftm2ch3
0xFFEE:FFEF
FTM2 channel 2
Vftm2ch2
0xFFF0:FFF1
FTM2 channel 1
Vftm2ch1
0xFFF2:FFF3
FTM2 channel 0
Vftm2ch0
0xFFF4:FFF5
FTM2 fault
Vftm2flt
0xFFF6:FFF7
Clock loss of lock
Vclk
0xFFF8:FFF9
Low voltage warning
Vlvw
0xFFFA:FFFB
IRQ or Watchdog
Virq or Vwdog
0xFFFC:FFFD
SWI
Vswi
0xFFFE:FFFF
Reset
Vreset
4.3 Register addresses and bit assignments
The register definitions vary in different memory sizes. The register addresses of unused
peripherals are reserved. The following table shows the register availability of the
devices.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
57
Register addresses and bit assignments
Table 4-2. Peripheral registers availability
Address
Bytes
Peripheral registers
0x0000—0x0004
5
Port data
0x0010—0x0017
8
ADC
0x0018—0x001B
4
MTIM0
0x0020—0x002A
11
FTM0
0x002C—0x002F
4
ACMP
0x003B—0x003B
1
IRQ
0x003C—0x003C
1
KBI0
0x003E—0x003F
2
IPC
0x3000—0x300B
12
SIM
0x300C—0x300F
4
SCG
0x3010—0x301F
16
DBG
0x3020—0x302C
13
NVM
0x3030—0x3037
8
WDOG
0x3038—0x303E
7
ICS, XOSC
0x3040—0x3041
2
PMC
0x304A—0x304B
2
SYS
0x3050—0x3059
10
IPC
0x3060—0x3068
9
CRC
0x306A—0x306F
6
RTC
0x3070—0x307B
12
IIC
0x307C—0x307D
2
KBI0
0x3080—0x3087
8
SCI0
0x3088—0x308F
8
SCI1
0x3098—0x309F
8
SPI0
0x30AC—0x30AD
2
ADC
0x30AF—0x30AF
1
Port high drive enable
0x30B0—0x30B4
5
Port output enable
0x30B8—0x30BC
5
Port input enable
0x30C0—0x30EA
43
FTM2
0x30EC—0x30EF
4
Port filter
0x30F0—0x30F4
5
Port pullup
0x30F8—0x30FF
8
SYS
The registers in the devices are divided into two groups:
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
58
Freescale Semiconductor, Inc.
Chapter 4 Memory map
• Direct-page registers are located in the first 64 locations in the memory map, so they
can be accessed with efficient direct addressing mode instructions.
• High-page registers are used much less often, so they are located above 0x3000 in
the memory map. This leaves room in the direct page for more frequently used
registers and variables.
Direct-page registers can be accessed with efficient direct addressing mode instructions.
Bit manipulation instructions can be used to access any bit in a direct-page register.
The direct page registers can use the more efficient direct addressing mode, which
requires only the lower byte of the address.
The following tables are summaries of all user-accessible direct-page and high-page
registers and control bits. Cells that are not associated with named bits are shaded. A
shaded cell with a 0 indicates this unused bit always reads as a 0; and a shaded cell with a
1 indicates this unused bit always reads as a 1. Shaded cells with dashes indicate unused
or reserved bit locations that could read as 1s or 0s.
Table 4-3. Direct-page register allocation
Address
Register name
Bit 7
6
5
4
3
2
1
Bit 0
0x0000
PORT_PTAD
PTAD7
PTAD6
PTAD5
PTAD4
PTAD3
PTAD2
PTAD1
PTAD0
0x0001
PORT_PTBD
PTBD7
PTBD6
PTBD5
PTBD4
PTBD3
PTBD2
PTBD1
PTBD0
0x0002
PORT_PTCD
PTCD7
PTCD6
PTCD5
PTCD4
PTCD3
PTCD2
PTCD1
PTCD0
0x0003
PORT_PTDD
PTDD7
PTDD6
PTDD5
PTDD4
PTDD3
PTDD2
PTDD1
PTDD0
0x0004
PORT_PTED
—
—
—
PTED4
PTED3
PTED2
PTED1
PTED0
0x0005-0x0007
Reserved
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0x0008-0x000F
Reserved
—
—
—
0x0010
ADC_SC1
COCO
AIEN
ADCO
0x0011
ADC_SC2
ADACT
ADTRG
ACFE
0x0012
ADC_SC3
ADLPC
ADIV
ADLSM
P
0x0013
ADC_SC4
—
ASCAN
ACFSEL
E
—
—
0x0014
ADC_RH
Bit 15
14
13
12
11
10
9
Bit 8
0x0015
ADC_RL
Bit 7
6
5
4
3
2
1
Bit 0
0x0016
ADC_CVH
Bit 15
14
13
12
11
10
9
Bit 8
0x0017
ADC_CVL
Bit 7
6
5
4
3
2
1
Bit 0
0x0018
MTIM0_SC
TOF
TOIE
TRST
TSTP
—
—
—
—
—
—
ADCH
ACFGT
FEMPT
Y
FFULL
MODE
0x0019
MTIM0_CLK
0x001A
MTIM0_CNT
CLKS
COUNT
0x001B
MTIM0_MOD
MOD
ADICLK
AFDEP
PS
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
59
Register addresses and bit assignments
Table 4-3. Direct-page register allocation (continued)
Address
Register name
Bit 7
6
5
4
—
—
0x001C-0X001F
Reserved
—
—
0x0020
FTM0_SC
TOF
TOIE
0x0021
FTM0_CNTH
Bit 15
14
13
0x0022
FTM0_CNTL
Bit 7
6
0x0023
FTM0_MODH
Bit 15
0x0024
FTM0_MODL
0x0025
0x0026
3
2
1
Bit 0
—
—
—
—
CLKS0
PS2
PS1
PS0
12
11
10
9
Bit 8
5
4
3
2
1
Bit 0
14
13
12
11
10
9
Bit 8
Bit 7
6
5
4
3
2
1
Bit 0
FTM0_C0SC
CHF
CHIE
MSB
MSA
ELSB
ELSA
—
—
FTM0_C0VH
Bit 15
14
13
12
11
10
9
Bit 8
CPWMS CLKS1
0x0027
FTM0_C0VL
Bit 7
6
5
4
3
2
1
Bit 0
0x0028
FTM0_C1SC
CHF
CHIE
MSB
MSA
ELSB
ELSA
—
—
0x0029
FTM0_C1VH
Bit 15
14
13
12
11
10
9
Bit 8
0x002A
FTM0_C1VL
Bit 7
6
5
4
3
2
1
Bit 0
0x002B
Reserved
—
—
—
—
—
—
—
—
0x002C
ACMP_CS
ACE
HYST
ACF
ACIE
ACO
ACOPE
ACMOD
0x002D
ACMP_C0
—
—
—
—
ACNSEL
0x002E
ACMP_C1
DACEN
DACRE
F
0x002F
ACMP_C2
—
—
—
—
—
0x0030-0x003A
Reserved
—
—
—
—
—
—
—
—
0x003B
IRQ_SC
—
IRQF
IRQACK
IRQIE
IRQMO
D
0x003C
KBI0_SC
—
—
KBF
KBACK
KBIE
KBMOD
0x003D
Reserved
—
—
—
—
—
—
—
0x003E
IPC_SC
IPCE
—
PSE
PSF
PULIPM
—
0x003F
IPC_IPMPS
ACPSEL
DACVAL
IRQPDD IRQEDG IRQPE
—
IPM3
—
IPM2
ACIPE2 ACIPE1 ACIPE0
—
IPM
IPM1
IPM0
Table 4-4. High-page register allocation
Address
Register name
Bit 7
6
5
4
3
2
1
Bit 0
0x3000
SYS_SRS
POR
PIN
WDOG
ILOP
ILAD
LOC
LVD
—
0x3001
SYS_SBDFR
—
—
—
—
—
—
—
BDFR
0x3002
SYS_SDIDH
—
—
—
—
ID11
ID10
ID9
ID8
0x3003
SYS_SDIDL
ID7
ID6
ID5
ID4
ID3
ID2
ID1
ID0
0x3004
SYS_SOPT1
SCI0PS SPI0PS
IICPS
FTM2PS
BKGDP
E
RSTPE
FWAKE
STOPE
0x3005
SYS_SOPT2
TXDME
FTMSY
NC
RXDFE
RXDCE
—
—
0x3006
SYS_SOPT3
DLYACT
FTM0P
S
—
—
CLKOE
0x3007
SYS_SOPT4
0x3008-0x300B
Reserved
ADHWTS
BUSREF
DELAY
—
—
—
—
—
—
—
—
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
60
Freescale Semiconductor, Inc.
Chapter 4 Memory map
Table 4-4. High-page register allocation (continued)
Address
Register name
Bit 7
6
5
4
3
2
1
Bit 0
0x300C
SCG_C1
FTM2
—
FTM0
—
—
—
MTIM0
RTC
0x300D
SCG_C2
—
—
DBG
NVM
IPC
CRC
—
—
0x300E
SCG_C3
—
—
SCI1
SCI0
—
SPI0
IIC
—
0x300F
SCG_C4
ACMP
—
ADC
—
IRQ
—
—
KBI0
0x3010
DBG_CAH
Bit 15
14
13
12
11
10
9
Bit 8
0x3011
DBG_CAL
Bit 7
6
5
4
3
2
1
Bit 0
0x3012
DBG_CBH
Bit 15
14
13
12
11
10
9
Bit 8
0x3013
DBG_CBL
Bit 7
6
5
4
3
2
1
Bit 0
0x3014
DBG_CCH
Bit 15
14
13
12
11
10
9
Bit 8
0x3015
DBG_CCL
Bit 7
6
5
4
3
2
1
Bit 0
0x3016
DBG_FH
Bit 15
14
13
12
11
10
9
Bit 8
0x3017
DBG_FL
Bit 7
6
5
4
3
2
1
Bit 0
0x3018
DBG_CAX
RWAEN
RWA
—
—
—
—
—
—
0x3019
DBG_CBX
RWBEN
RWB
—
—
—
—
—
—
0x301A
DBG_CCX
RWCEN
RWC
—
—
—
—
—
—
0x301B
DBG_FX
PPACC
—
—
—
—
—
—
Bit 16
0x301C
DBG_C
DBGEN
ARM
TAG
BRKEN
—
—
—
LOOP1
0x301D
DBG_T
TRGSE
L
BEGIN
—
—
0x301E
DBG_S
AF
BF
CF
—
—
ARMF
0x301F
DBG_CNT
—
—
—
—
0x3020
NVM_FCLKDIV
FDIVLD
FDIVLC
K
FDIV5
FDIV4
FDIV3
FDIV2
FDIV1
FDIV0
0x3021
NVM_FSEC
1
1
1
1
SEC1
SEC0
0x3022
NVM_FCCOBIX
—
—
—
—
—
0x3023
Reserved
—
—
—
—
—
—
0x3024
NVM_FCNFG
CCIE
—
—
IGNSF
—
—
FDFD
FSFD
0x3025
NVM_FERCNFG
—
—
—
—
—
—
DFDIE
SFDIE
0x3026
NVM_FSTAT
CCIF
—
—
MGSTA MGSTA
T1
T0
0x3027
NVM_FERSTAT
—
—
—
—
—
—
DFDIF
SFDIF
0x3028
NVM_FPROT
FPOEN
—
FPHDIS
FPHS1
FPHS0
—
—
—
0x3029
NVM_EEPROT
DPOPE
N
—
—
—
—
DPS2
DPS1
DPS0
0x302A
NVM_FCCOBHI
CCOB1
5
CCOB1
4
CCOB1
3
CCOB1
2
CCOB1
1
CCOB1
0
CCOB9
CCOB8
0x302B
NVM_FCCOBLO
CCOB7
CCOB6
CCOB5
CCOB4
CCOB3
CCOB2
CCOB1
CCOB0
0x302C
NVM_FOPT
NV7
NV6
NV5
NV4
NV3
NV2
NV1
NV0
0x302D-0x302F
Reserved
—
—
—
—
—
—
—
—
KEYEN1 KEYEN0
TRG
—
—
CNT
ACCER
MGBUS
FPVIOL
R
Y
CCOBIX CCOBIX CCOBIX
2
1
0
—
—
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
61
Register addresses and bit assignments
Table 4-4. High-page register allocation (continued)
Address
Register name
Bit 7
6
5
4
0x3030
WDOG_CS1
EN
INT
UPDAT
E
0x3031
WDOG_CS2
WIN
FLG
—
PRES
—
—
0x3032
WDOG_CNTH
Bit 15
14
13
12
11
10
9
Bit 8
0x3033
WDOG_CNTL
Bit 7
6
5
4
3
2
1
Bit 0
0x3034
WDOG_TOVALH
Bit 15
14
13
12
11
10
9
Bit 8
0x3035
WDOG_TOVALL
Bit 7
6
5
4
3
2
1
Bit 0
0x3036
WDOG_WINH
Bit 15
14
13
12
11
10
9
Bit 8
0x3037
WDOG_WINL
Bit 7
6
5
4
3
2
1
Bit 0
0x3038
ICS_C1
0x3039
ICS_C2
0x303A
ICS_C3
0x303B
ICS_C4
LOLIE
—
CME
—
0x303C
ICS_S
LOLS
LOCK
—
IREFST
0x303D
Reserved
—
—
—
—
0x303E
ICS_OSCSC
OSCEN
—
0x303F
Reserved
—
—
—
0x3040
PMC_SPMSC1
LVWF
LVWAC
K
LVWIE
0x3041
PMC_SPMSC2
—
LVDV
0x3042-0x3049
Reserved
—
—
—
0x304A
SYS_ILLAH
Bit 15
14
13
CLKS
3
TST
RDIV
BDIV
LP
2
1
Bit 0
DBG
WAIT
STOP
IREFS
—
CLK
IRCLKE IREFST
N
EN
—
—
—
—
—
SCFTRI
M
—
—
SCTRIM
—
CLKST
—
—
—
—
—
RANGE
HGO
OSCINI
T
—
—
—
—
—
LVDRE
LVDSE
LVDE
BGBDS
BGBE
—
—
—
—
—
—
—
—
—
12
11
19
9
Bit 8
OSCST
OSCOS
EN
LVWV
0x304B
SYS_ILLAL
Bit 7
6
5
4
3
2
1
Bit 0
0x304C-0x304F
Reserved
—
—
—
—
—
—
—
—
0x3050
IPC_ILRS0
ILR3
ILR2
ILR1
ILR0
0x3051
IPC_ILRS1
ILR7
ILR6
ILR5
ILR4
0x3052
IPC_ILRS2
ILR11
ILR10
ILR9
ILR8
0x3053
IPC_ILRS3
ILR15
ILR14
ILR13
ILR12
0x3054
IPC_ILRS4
ILR19
ILR18
ILR17
ILR16
0x3055
IPC_ILRS5
ILR23
ILR22
ILR21
ILR20
0x3056
IPC_ILRS6
ILR27
ILR26
ILR25
ILR24
0x3057
IPC_ILRS7
ILR31
ILR30
ILR29
ILR28
0x3058
IPC_ILRS8
ILR35
ILR34
ILR33
ILR32
0x3059
IPC_ILRS9
ILR39
ILR38
ILR37
ILR36
0x305A-0x305F
Reserved
—
—
—
—
—
—
—
—
0x3060
CRC_D0
Bit 31
30
29
28
27
26
25
Bit 24
0x3061
CRC_D1
Bit 23
22
21
20
19
18
17
Bit 16
0x3062
CRC_D2
Bit 15
14
13
12
11
10
9
Bit 8
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
62
Freescale Semiconductor, Inc.
Chapter 4 Memory map
Table 4-4. High-page register allocation (continued)
Address
Register name
Bit 7
6
5
4
3
2
1
Bit 0
0x3063
CRC_D3
Bit 7
6
5
4
3
2
1
Bit 0
0x3064
CRC_P0
Bit 31
30
29
28
27
26
25
Bit 24
0x3065
CRC_P1
Bit 23
22
21
20
19
18
17
Bit 16
0x3066
CRC_P2
Bit 15
14
13
12
11
10
9
Bit 8
0x3067
CRC_P3
Bit 7
6
5
4
3
2
1
Bit 0
0x3068
CRC_CTRL
0
FXOR
WAS
TCRC
TOT
TOTR
0x3069
Reserved
—
—
—
—
—
—
—
—
0x306A
RTC_SC1
RTIF
RTIE
—
RTCO
—
—
—
—
0x306B
RTC_SC2
—
—
—
0x306C
RTC_MODH
MODH
0x306D
RTC_MODL
MODL
0x306E
RTC_CNTH
CNTH
0x306F
RTC_CNTL
CNTL
0x3070
I2C_A1
RTCLKS
AD7
AD6
AD5
AD4
AD3
MULT
RTCPS
AD2
AD1
0
0x3071
I2C_F
0x3072
I2C_C1
IICEN
IICIE
MST
TX
TXAK
ICR
RSTA
WUEN
—
0x3073
I2C_S
TCF
IAAS
BUSY
ARBL
RAM
SRW
IICIF
RXAK
0x3074
I2C_D
0x3075
I2C_C2
GCAEN
ADEXT
HDRS
SBRC
RMEN
AD10
AD9
AD8
0x3076
I2C_FLT
—
—
—
FLT4
FLT3
FLT2
FLT1
FLT0
0x3077
I2C_RA
0x3078
I2C_SMB
FACK
0x3079
I2C_A2
SAD7
0x307A
I2C_SLTH
0x307B
DATA
RAD
ALERTE SIICAE
TCKSEL
N
N
—
SLTF
SHTF1
SHTF2
SHTF2I
E
SAD3
SAD2
SAD1
—
SSLT15 SSLT14 SSLT13 SSLT12 SSLT11 SSLT10
SSLT9
SSLT8
I2C_SLTL
SSLT7
SSLT1
SSLT0
0x307C
KBI0_PE
KBIPE7 KBIPE6 KBIPE5 KBIPE4 KBIPE3 KBIPE2 KBIPE1 KBIPE0
0x307D
KBI0_ES
KBEDG KBEDG KBEDG KBEDG KBEDG KBEDG KBEDG KBEDG
7
6
5
4
3
2
1
0
0x307E-0x307F
Reserved
—
—
—
—
—
—
—
—
0x3080
SCI0_BDH
LBKDIE
RXEDGI
E
SBNS
SBR12
SBR11
SBR10
SBR9
SBR8
0x3081
SCI0_BDL
SBR7
SBR6
SBR5
SBR4
SBR3
SBR2
SBR1
SBR0
0x3082
SCI0_C1
LOOPS
SCISWA
I
RSRC
M
WAKE
ILT
PE
PT
0x3083
SCI0_C2
TIE
TCIE
RIE
ILIE
TE
RE
RWU
SBK
0x3084
SCI0_S1
TDRE
TC
RDRF
IDLE
OR
NF
FE
PF
0x3085
SCI0_S2
LBKDIF
RXEDGI
F
—
RXINV
RWUID
BRK13
LBKDE
RAF
0x3086
SCI0_C3
R8
T8
TXDIR
TXINV
ORIE
NEIE
FEIE
PEIE
0x3087
SCI0_D
D7
D6
D5
D4
D3
D2
D1
D0
SAD6
SSLT6
SAD5
SSLT5
SAD4
SSLT4
SSLT3'
SSLT2
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
63
Register addresses and bit assignments
Table 4-4. High-page register allocation (continued)
Address
Register name
Bit 7
6
5
4
3
2
1
Bit 0
0x3088
SCI1_BDH
LBKDIE
RXEDGI
E
SBNS
SBR12
SBR11
SBR10
SBR9
SBR8
0x3089
SCI1_BDL
SBR7
SBR6
SBR5
SBR4
SBR3
SBR2
SBR1
SBR0
0x308A
SCI1_C1
LOOPS
SCISWA
I
RSRC
M
WAKE
ILT
PE
PT
0x308B
SCI1_C2
TIE
TCIE
RIE
ILIE
TE
RE
RWU
SBK
0x308C
SCI1_S1
TDRE
TC
RDRF
IDLE
OR
NF
FE
PF
0x308D
SCI1_S2
LBKDIF
RXEDGI
F
—
RXINV
RWUID
BRK13
LBKDE
RAF
0x308E
SCI1_C3
R8
T8
TXDIR
TXINV
ORIE
NEIE
FEIE
PEIE
0x308F
SCI1_D
D7
D6
D5
D4
D3
D2
D1
D0
0x3090-0x3097
Reserved
—
—
—
—
—
—
—
—
0x3098
SPI0_C1
SPIE
SPE
SPTIE
MSTR
CPOL
CPHA
SSOE
LSBFE
0x3099
SPI0_C2
SPMIE
—
—
—
SPISWA
I
SPC0
0x309A
SPI0_BR
—
SPPR2
SPPR1
SPPR0
SPR3
SPR2
SPR1
SPR0
0x309B
SPI0_S
SPRF
SPMF
SPTEF
MODF
—
—
—
—
0x309C
Reserved
—
—
—
—
—
—
—
—
0x309D
SPI0_D
Bit 7
6
5
4
3
2
1
Bit 0
0x309E
Reserved
—
—
—
—
—
—
—
—
0x309F
SPI0_M
Bit 7
6
5
4
3
2
1
Bit 0
0x30A0-0x30AB
Reserved
—
—
—
—
—
—
—
—
0x30AC
ADC_APCTL1
ADPC7
ADPC6
ADPC5
ADPC4
ADPC3
ADPC2
ADPC1
ADPC0
0x30AD
ADC_APCTL2
—
—
—
—
ADPC11 ADPC10 ADPC9
ADPC8
0x30AE
Reserved
—
—
—
—
—
—
—
—
0x30AF
PORT_HDRVE
—
—
—
—
PTD1
PTD0
PTB5
PTB4
0x30B0
PORT_PTAOE
PTAOE7 PTAOE6 PTAOE5 PTAOE4 PTAOE3 PTAOE2 PTAOE1 PTAOE0
0x30B1
PORT_PTBOE
PTBOE7 PTBOE6 PTBOE5 PTBOE4 PTBOE3 PTBOE2 PTBOE1 PTBOE0
0x30B2
PORT_PTCOE
PTCOE
7
PTCOE
6
PTCOE
5
PTCOE
4
PTCOE
3
PTCOE
2
PTCOE
1
PTCOE
0
0x30B3
PORT_PTDOE
PTDOE
7
PTDOE
6
PTDOE
5
PTDOE
4
PTDOE
3
PTDOE
2
PTDOE
1
PTDOE
0
MODFE BIDIRO
N
E
0x30B4
PORT_PTEOE
—
—
—
0x30B5-0x30B7
Reserved
—
—
—
PTEOE4 PTEOE3 PTEOE2 PTEOE1 PTEOE0
—
—
—
—
—
0x30B8
PORT_PTAIE
PTAIE7
PTAIE6
PTAIE5
—
PTAIE3
PTAIE2
PTAIE1
PTAIE0
0x30B9
PORT_PTBIE
PTBIE7
PTBIE6
PTBIE5
PTBIE4
PTBIE3
PTBIE2
PTBIE1
PTBIE0
0x30BA
PORT_PTCIE
PTCIE7 PTCIE6 PTCIE5 PTCIE4 PTCIE3 PTCIE2 PTCIE1 PTCIE0
0x30BB
PORT_PTDIE
PTDIE7 PTDIE6 PTDIE5 PTDIE4 PTDIE3 PTDIE2 PTDIE1 PTDIE0
0x30BC
PORT_PTEIE
—
—
—
PTEIE4
PTEIE3
PTEIE2
PTEIE1
PTEIE0
0x30BD-0x30BF
Reserved
—
—
—
—
—
—
—
—
0x30C0
FTM2_SC
TOF
TOIE
CLKS0
PS2
PS1
PS0
CPWMS CLKS1
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
64
Freescale Semiconductor, Inc.
Chapter 4 Memory map
Table 4-4. High-page register allocation (continued)
Address
Register name
Bit 7
6
5
4
3
2
1
Bit 0
0x30C1
FTM2_CNTH
Bit 15
14
13
12
11
10
9
Bit 8
0x30C2
FTM2_CNTL
Bit 7
6
5
4
3
2
1
Bit 0
0x30C3
FTM2_MODH
Bit 15
14
13
12
11
10
9
Bit 8
0x30C4
FTM2_MODL
Bit 7
6
5
4
3
2
1
Bit 0
0x30C5
FTM2_C0SC
CHF
CHIE
MSB
MSA
ELSB
ELSA
—
—
0x30C6
FTM2_C0VH
Bit 15
14
13
12
11
10
9
Bit 8
0x30C7
FTM2_C0VL
Bit 7
6
5
4
3
2
1
Bit 0
0x30C8
FTM2_C1SC
CHF
CHIE
MSB
MSA
ELSB
ELSA
—
—
0x30C9
FTM2_C1VH
Bit 15
14
13
12
11
10
9
Bit 8
0x30CA
FTM2_C1VL
Bit 7
6
5
4
3
2
1
Bit 0
0x30CB
FTM2_C2SC
CHF
CHIE
MSB
MSA
ELSB
ELSA
—
—
0x30CC
FTM2_C2VH
Bit 15
14
13
12
11
10
9
Bit 8
0x30CD
FTM2_C2VL
Bit 7
6
5
4
3
2
1
Bit 0
0x30CE
FTM2_C3SC
CHF
CHIE
MSB
MSA
ELSB
ELSA
—
—
0x30CF
FTM2_C3VH
Bit 15
14
13
12
11
10
9
Bit 8
0x30D0
FTM2_C3VL
Bit 7
6
5
4
3
2
1
Bit 0
0x30D1
FTM2_C4SC
CHF
CHIE
MSB
MSA
ELSB
ELSA
—
—
0x30D2
FTM2_C4VH
Bit 15
14
13
12
11
10
9
Bit 8
0x30D3
FTM2_C4VL
Bit 7
6
5
4
3
2
1
Bit 0
0x30D4
FTM2_C5SC
CHF
CHIE
MSB
MSA
ELSB
ELSA
—
—
0x30D5
FTM2_C5VH
Bit 15
14
13
12
11
10
9
Bit 8
0x30D6
FTM2_C5VL
Bit 7
6
5
4
3
2
1
Bit 0
0x30D7
FTM2_CNTINH
Bit 15
14
13
12
11
10
9
Bit 8
0x30D8
FTM2_CNTINL
Bit 7
6
5
4
3
2
1
Bit 0
0x30D9
FTM2_STATUS
CH7F
CH6F
CH5F
CH4F
CH3F
CH2F
CH1F
CH0F
0x30DA
FTM2_MODE
FAULTI
E
INIT
FTMEN
0x30DB
FTM2_SYNC
SWSYN
C
TRIG2
TRIG1
TRIG0
SYNCH
OM
REINIT
CNTMA
CNTMIN
X
0x30DC
FTM2_OUTINIT
CH7OI
CH6OI
CH5OI
CH4OI
CH3OI
CH2OI
CH1OI
0x30DD
FTM2_OUTMASK
0x30DE
FTM2_COMBINE0
—
FAULTE SYNCE
N
N
DTEN
DECAP
DECAP
EN
COMP
COMBI
NE
0x30DF
FTM2_COMBINE1
—
FAULTE SYNCE
N
N
DTEN
DECAP
DECAP
EN
COMP
COMBI
NE
0x30E0
FTM2_COMBINE2
—
FAULTE SYNCE
N
N
DTEN
DECAP
DECAP
EN
COMP
COMBI
NE
0x30E1
FTM2_COMBINE3
—
FAULTE SYNCE
N
N
DTEN
DECAP
DECAP
EN
COMP
COMBI
NE
0x30E2
FTM2_DEATIME
FAULTM
CAPTE PWMSY
WPDIS
ST
NC
CH0OI
CH7OM CH6OM CH5OM CH4OM CH3OM CH2OM CH1OM CH0OM
DTPS
DTVAL
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
65
Register addresses and bit assignments
Table 4-4. High-page register allocation (continued)
Address
Register name
Bit 7
6
5
4
3
2
1
Bit 0
0x30E3
FTM2_EXTTRIG
TRIGF
0x30E4
FTM2_POL
POL7
POL6
POL5
POL4
POL3
0x30E5
FTM2_FMS
FAULTF
WPEN
FAULTI
N
—
—
0x30E6
FTM2_FILTER0
CHoddFVAL
CHevenFVAL
0x30E7
FTM2_FILTER1
CHoddFVAL
CHevenFVAL
0x30E8
FTM2_FLTFILTER
0x30E9
FTM2_FLTCTRL
0x30EA-0x30EB
Reserved
0x30EC
PORT_IOFLT0
0x30ED
PORT_IOFLT1
—
—
—
—
0x30EE
PORT_IOFLT2
—
—
—
—
0x30EF
PORT_FCLKDIV
FLTDIV3
0x30F0
PORT_PTAPE
PTAPE7 PTAPE6 PTAPE5
0x30F1
PORT_PTBPE
PTBPE7 PTBPE6 PTBPE5 PTBPE4 PTBPE3 PTBPE2 PTBPE1 PTBPE0
0x30F2
PORT_PTCPE
PTCPE7 PTCPE6 PTCPE5 PTCPE4 PTCPE3 PTCPE2 PTCPE1 PTCPE0
0x30F3
PORT_PTDPE
PTDPE7 PTDPE6 PTDPE5 PTDPE4 PTDPE3 PTDPE2 PTDPE1 PTDPE0
0x30F4
PORT_PTEPE
INITTRI CH1TRI CH0TRI CH5TRI CH4TRI CH3TRI CH2TRI
GEN
G
G
G
G
G
G
—
—
—
POL2
POL1
POL0
FAULTF FAULTF FAULTF
2
1
0
—
FFVAL
FFLTR3 FFLTR2 FFLTR1 FFLTR0 FAULT3 FAULT2 FAULT1 FAULT0
EN
EN
EN
EN
EN
EN
EN
EN
—
—
—
FLTD
—
—
—
FLTC
—
—
FLTB
—
—
—
FLTA
—
FLTKBI0
FLTDIV2
—
—
FLTE
FLTRST
FLTDIV1
PTAPE3 PTAPE2 PTAPE1 PTAPE0
PTEPE4 PTEPE3 PTEPE2 PTEPE1 PTEPE0
0x30F5-0x30F7
Reserved
—
—
—
—
—
—
—
—
0x30F8
SYS_UUID1
ID63
ID62
ID61
ID60
ID59
ID58
ID57
ID56
0x30F9
SYS_UUID2
ID55
ID54
ID53
ID52
ID51
ID50
ID49
ID48
0x30FA
SYS_UUID3
ID47
ID46
ID45
ID44
ID43
ID42
ID41
ID40
0x30FB
SYS_UUID4
ID39
ID38
ID37
ID36
ID35
ID34
ID33
ID32
0x30FC
SYS_UUID5
ID31
ID30
ID29
ID28
ID27
ID26
ID25
ID24
0x30FD
SYS_UUID6
ID23
ID22
ID21
ID20
ID19
ID18
ID17
ID16
0x30FE
SYS_UUID7
ID15
ID14
ID13
ID12
ID11
ID10
ID9
ID8
0x30FF
SYS_UUID8
ID7
ID6
ID5
ID4
ID3
ID2
ID1
ID0
Several reserved flash memory locations, shown in the following table, are used for
storing values used by several registers. These registers include an 8-byte backdoor key,
NV_BACKKEY, which can be used to gain access to secure memory resources. During
reset events, the contents of NVPROT and NVOPT in the reserved flash memory are
transferred into corresponding FPROT and FOPT registers in the high-page registers area
to control security and block protection options.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
66
Freescale Semiconductor, Inc.
Chapter 4 Memory map
Table 4-5. Reserved flash memory addresses
Address
Register Name
Bit 7
6
5
4
3
2
1
Bit 0
0xFF70
NV_BACKKEY0
BACKKEY0
0xFF71
NV_BACKKEY1
BACKKEY1
0xFF72
NV_BACKKEY2
BACKKEY2
0xFF73
NV_BACKKEY3
BACKKEY3
0xFF74
NV_BACKKEY4
BACKKEY4
0xFF75
NV_BACKKEY5
BACKKEY5
0xFF76
NV_BACKKEY6
BACKKEY6
0xFF77
NV_BACKKEY7
0xFF78
Reserved
—
—
—
—
—
—
—
—
0xFF79
Reserved
—
—
—
—
—
—
—
—
0xFF7A
Reserved
—
—
—
—
—
—
—
—
0xFF7B
Reserved
—
—
—
—
—
—
—
—
0xFF7C
NV_FPROT
FPOPE
N
—
FPHDIS
—
—
—
0xFF7D
NV_EEPROT
DPOPE
N
0xFF7E
NV_FOPT
0xFF7F
NV_FSEC
BACKKEY7
FPH
—
DPS
NV
KEYEN
1
1
1
1
SEC
The 8-byte comparison key can be used to temporarily disengage memory security
provided the key enable field, NV_FSEC[KEYEN], is 10b. This key mechanism can be
accessed only through user code running in secure memory. A security key cannot be
entered directly through background debug commands. This security key can be disabled
completely by programming the NV_FSEC[KEYEN] bit to 0. If the security key is
disabled, the only way to disengage security is by mass erasing the flash if needed,
normally through the background debug interface and verifying that flash is blank. To
avoid returning to secure mode after the next reset, program the security bits,
NV_FSEC[SEC], to the unsecured state (10b).
4.4 Random-access memory (RAM)
This section describes the 2048 bytes of RAM (random-access memory).
These devices include static RAM. The locations in RAM below 0x0100 can be accessed
using the more efficient direct addressing mode. Any single bit in this area can be
accessed with the bit manipulation instructions (BCLR, BSET, BRCLR, and BRSET).
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
67
Flash and EEPROM
The RAM retains data when the MCU is in low-power wait, or stop3 mode. At power-on,
the contents of RAM are uninitialized. RAM data is unaffected by any reset provided that
the supply voltage does not drop below the minimum value for RAM retention.
For compatibility with older M68HC05 MCUs, the HCS08 resets the stack pointer to
0x00FF. In this series, re-initialize the stack pointer to the top of the RAM so that the
direct-page RAM can be used for frequently accessed RAM variables and bit-addressable
program variables. Include the following 2-instruction sequence in your reset
initialization routine (where RamLast is equated to the highest address of the RAM in the
Freescale-provided equate file).
LDHX
TXS
#RamLast+1
;point one past RAM
;SP<-(H:X-1)
When security is enabled, the RAM is considered a secure memory resource and is not
accessible through BDM or code executing from non-secure memory.
4.5 Flash and EEPROM
4.5.1 Overview
This device includes various configuration of flash and EEPROM. The controller for
flash and EEPROM is ideal for single-supply applications for field programming without
external high voltage sources for program or erase operations.
The flash memory is ideal for single-supply applications that allow for field
reprogramming without requiring external high voltage sources for program or erase
operations. The flash module includes a memory controller that executes commands to
modify flash memory contents. The user interface to the memory controller consists of
the indexed flash common command object (FCCOB) register, which is written to with
the command, global address, data, and any required command parameters. The memory
controller must complete the execution of a command before the FCCOB register is
written to with a new command.
CAUTION
A flash byte or longword must be in the erased state before
being programmed. Cumulative programming of bits within a
flash byte or longword is not allowed.
The flash memory is read as bytes. Read access time is one bus
cycle for bytes. For flash memory, an erased bit reads 1 and a
programmed bit reads 0. It is possible to read from flash
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
68
Freescale Semiconductor, Inc.
Chapter 4 Memory map
memory while commands are being executed on EEPROM
memory. It is not possible to read from EEPROM memory
while a command (erase/program) is executing on flash
memory. Simultaneous EEPROM memory are implemented
with error correction codes (ECC) that can resolve single bit
faults and detect double bit faults.
The following figure shows the block diagram of the flash and EEPROM module.
Command Interrupt Request
Error Interrupt Request
Bus Clock
Flash
Interface
FLASH
4Kx32
Sector 0
Clock
Divider
Registers
Sector 1
Protection
Security
NVM controller
CPU
Sector 31
EEPROM
256x8
Sector 0
Sector 1
Sector 127
Figure 4-2. Flash and EEPROM block diagram
Flash features:
• 16 KB of flash memory composed of one 16 KB flash block divided into 32 sectors
of 512 bytes
• Automated program and erase algorithm with verification
• Fast sector erase and longword program operation
• Ability to read the flash memory while programming a word in the EEPROM
memory
• Flexible protection scheme to prevent accidental program or erase of flash memory
EEPROM features:
• 256 bytes of EEPROM memory composed of one 256 byte EEPROM block divided
into sectors of 2 bytes
• Single bit fault correction and double bit fault detection within a word during read
operations
• Automated program and erase algorithm with verification and generation of ECC
parity bits
• Fast sector erase and byte program operation
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
69
Flash and EEPROM
• Protection scheme to prevent accidental program or erase of EEPROM memory
• Ability to program up to four bytes in a burst sequence
Other features
• No external high-voltage power supply required for flash memory program and erase
operations
• Interrupt generation on flash command completion and flash error detection
• Security mechanism to prevent unauthorized access to the flash memory
4.5.2 Function descriptions
4.5.2.1 Modes of operation
The flash and EEPROM module provides the normal user mode of operation. The
operating mode is determined by module-level inputs and affects the FCLKDIV,
FCNFG, and EEPROT registers.
4.5.2.1.1
Wait mode
The flash and EEPROM module is not affected if the MCU enters wait mode. The flash
module can recover the MCU from wait via the CCIF interrupt. See Flash and EEPROM
interrupts.
4.5.2.1.2
Stop mode
If a flash and EEPROM command is active, that is, FSTAT[CCIF] = 0, when the MCU
requests stop mode, the current NVM operation will be completed before the MCU is
allowed to enter stop mode.
4.5.2.2 Flash and EEPROM memory map
The MCU places the flash memory between global address 0x0000 and 0xFFFF as
shown in the following table. Not all flash are available to users because some addresses
are overlapped with RAM, EEPROM, and registers.
MC9S08PA16 contains a piece of 16 KB flash that is fully available for users. This flash
block is divided into 32 sectors of 512 bytes. MC9S08PA8 contains a piece of 8 KB flash
that is fully available for users. This flash block is divided into 16 sectors of 512 bytes.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
70
Freescale Semiconductor, Inc.
Chapter 4 Memory map
Table 4-6. Flash memory addressing
Device
Global address
Size (Bytes)
Description
User availability
MC9S08PA16
0xC000 — 0xFFFF
16 KB
Flash block contains
Sector [0:31]: fully
flash configuration field available
MC9S08PA8
0xE000 — 0xFFFF
8 KB
Flash block contains
Sector [0:15]: fully
flash configuration field available
4.5.2.3 Flash and EEPROM initialization after system reset
On each system reset, the flash and EEPROM module executes an initialization sequence
that establishes initial values for the flash and EEPROM block configuration parameters,
the FPROT and EEPROT protection registers, and the FOPT and FSEC registers. The
initialization routine reverts to built-in default values that leave the module in a fully
protected and secured state if errors are encountered during execution of the reset
sequence. If a double bit fault is detected during the reset sequence, both
FSTAT[MGSTAT] bits will be set.
FSTAT[CCIF] is cleared throughout the initialization sequence. The NVM module holds
off all CPU access for a portion of the initialization sequence. Flash and EEPROM reads
are allowed after the hold is removed. Completion of the initialization sequence is
marked by setting FSTAT[CCIF] high, which enables user commands.
If a reset occurs while any flash or EEPROM command is in progress, that command will
be immediately aborted. The state of the word being programmed or the sector/block
being erased is not guaranteed.
4.5.2.4 Flash and EEPROM command operations
Flash and EEPROM command operations are used to modify flash and EEPROM
memory contents.
The command operations contain three steps:
1. Configure the clock for flash or EEPROM program and erase command operations.
2. Use command write sequence to set flash and EEPROM command parameters and
launch execution.
3. Execute valid flash and EEPROM commands according to MCU functional mode
and MCU security state.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
71
Flash and EEPROM
The figure below shows a general flowchart of the flash or EEPROM command write
sequence.
START
Read: FCLKDIV
register
Clock Divider
Value Check
FDIV
Correct?
No
Read: FSTAT
register
Yes
Read: FSTAT
register
FCCOB
Availability Check
CCIF
Set?
No
NOTE: FCLKDIV must be
set after each reset
Yes
No
CCIF
Set?
Write: FCLKDIV
register
Yes
Access Error and
Protection Violation Check
ACCERR
or FPVIOL Set?
No
Results from previous Command
Yes
Write: FSTAT register
Clear ACCERR
FPVIOL 0x30
Write to FCCOBIX register
to identify specific command
parameter to load
Write to FCCOB register
to load required command
parameter
More
Parameters?
No
Yes
Write: FSTAT register
(to launch command)
Clear CCIF 0x80
Read: FSTAT register
Bit Polling for
Command Completion Check
No
CCIF Set?
Yes
END
Figure 4-3. Generic flash and EEPROM command write sequence flowchart
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
72
Freescale Semiconductor, Inc.
Chapter 4 Memory map
4.5.2.4.1
Writing the FCLKDIV register
Prior to issuing any flash and EEPROM program or erase command after a reset, the user
is required to write the FCLKDIV register to divide BUSCLK down to a target FCLK of
1MHz. The following table shows recommended values for the FDIV field based on
BUSCLK frequency.
Table 4-7. FDIV values for various BUSCLK frequencies
BUSCLK frequency
FDIV[5:0]
(MHz)
MIN1
MAX2
1.0
1.6
0x00
1.6
2.6
0x01
2.6
3.6
0x02
3.6
4.6
0x03
4.6
5.6
0x04
5.6
6.6
0x05
6.6
7.6
0x06
7.6
8.6
0x07
8.6
9.6
0x08
9.6
10.6
0x09
10.6
11.6
0x0A
11.6
12.6
0x0B
12.6
13.6
0x0C
13.6
14.6
0x0D
14.6
15.6
0x0E
15.6
16.6
0x0F
16.6
17.6
0x10
17.6
18.6
0x11
18.6
19.6
0x12
19.6
20.0
0x13
1. BUSCLK is greater than this value
2. BUSCLK is less than or equal to this value
CAUTION
Programming or erasing the flash and EEPROM memory
cannot be performed if the bus clock runs at less than 0.8 MHz.
Setting FCLKDIV[FDIV] too high can destroy the flash and
EEPROM memory due to overstress. Setting FCLKDIV[FDIV]
too low can result in incomplete programming or erasure of the
flash and EEPROM memory cells.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
73
Flash and EEPROM
When the FCLKDIV register is written, the FCLKDIV[FDIVLD] bit is set automatically.
If the FCLKDIV[FDIVLD] bit is 0, the FCLKDIV register has not been written since the
last reset. If the FCLKDIV register has not been written, any flash and EEPROM
program or erase command loaded during a command write sequence will not execute
and the FSTAT[ACCERR] bit will be set.
4.5.2.4.2
Command write sequence
The memory controller will launch all valid flash and EEPROM commands entered using
a command write sequence.
Before launching a command, the FSTAT[ACCERR] and FSTAT[FPVIOL] bits must be
clear and the FSTAT[CCIF] flag will be tested to determine the status of the current
command write sequence. If FSTAT[CCIF] is 0, indicating that the previous command
write sequence is still active, a new command write sequence cannot be started and all
writes to the FCCOB register are ignored.
The FCCOB parameter fields must be loaded with all required parameters for the flash
and EEPROM command being executed. Access to the FCCOB parameter fields is
controlled via FCCOBIX[CCOBIX] bits.
Flash and EEPROM command mode uses the indexed FCCOB register to provide a
command code and its relevant parameters to the memory controller. First, the user must
set up all required FCCOB field. Then they can initiate the command's execution by
writing a 1 to the FSTAT[CCIF] bit. This action clears the CCIF command completion
flag to 0. When the user clears the FSTAT[CCIF] bit all FCCOB parameter field are
locked and cannot be changed by the user until the command completes (evidenced by
the memory controller returning FSTAT[CCIF] to1). Some commands return information
to the FCCOB register array.
The generic format for the FCCOB parameter fields in flash and EEPROM command
mode is shown in the following table. The return values are available for reading after the
FSTAT[CCIF] flag has been returned to 1 by the memory controller. Writes to the
unimplemented parameter fields, FCCOBIX[CCOBIX] =110b and FCCOBIX[CCOBIX]
= 111b, are ignored with read from these fields returning 0x0000.
The table below shows the generic flash command format. The high byte of the first word
in the CCOB array contains the command code, followed by the parameters for this
specific flash command. For details on the FCCOB settings required by each command,
see the flash command descriptions in Flash and EEPROM command summary .
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
74
Freescale Semiconductor, Inc.
Chapter 4 Memory map
Table 4-8. FCCOB – flash and EEPROM command mode typical usage
CCOBIX[2:0]
000
001
010
011
100
101
Byte
FCCOB parameter fields in flash and EEPROM command mode
HI
FCMD[7:0] defining flash command
LO
Global address [23:16]
HI
Global address [15:8]
LO
Global address [7:0]
HI
Data 0 [15:8]
LO
Data 0 [7:0]
HI
Data 1 [15:8]
LO
Data 1 [7:0]
HI
Data 2 [15:8]
LO
Data 2 [7:0]
HI
Data 3 [15:8]
LO
Data 3 [7:0]
The contents of the FCCOB parameter fields are transferred to the memory controller
when the user clears the FSTAT[CCIF] command completion flag by writing 1. The
CCIF flag will remain clear until the flash and EEPROM command has completed. Upon
completion, the memory controller will return FSTAT[CCIF] to 1 and the FCCOB
register will be used to communicate any results.
The following table presents the valid flash and EEPROM commands, as enabled by the
combination of the functional MCU mode with the MCU security state of unsecured or
secured.
MCU secured state is selected by NVM_FSEC[SEC].
Table 4-9. Flash and EEPROM commands by mode and security state
Unsecured
Secured
U1
U2
Erase verify all blocks
*
*
0x02
Erase verify block
*
*
0x03
Erase verify flash section
*
N/A
0x04
Read once
*
N/A
0x06
Program flash
*
N/A
0x07
Program once
*
N/A
0x08
Erase all block
*
*
0x09
Erase flash block
*
*
0x0A
Erase flash sector
*
N/A
0x0B
Unsecure NVM
N/A
*
0x0C
Verify backdoor access key
*
*
FCMD
Command
0x01
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
75
Flash and EEPROM
Table 4-9. Flash and EEPROM commands by mode and security state (continued)
Unsecured
Secured
U1
U2
Set user margin level
*
N/A
0x10
Erase verify EEPROM section
*
*
0x11
Program EEPROM
*
N/A
0x12
Erase EEPROM sector
*
N/A
FCMD
Command
0x0D
1. Unsecured User mode
2. Secured User mode
4.5.2.5 Flash and EEPROM interrupts
The flash and EEPROM module can generate an interrupt when a flash command
operation has completed or when a flash and EEPROM command operation has detected
an ECC fault.
Table 4-10. Flash interrupt source
Interrupt source
Flash and EEPROM command complete
ECC double bit fault on flash and EEPROM read
ECC single bit fault on flash and EEPROM read
4.5.2.5.1
Interrupt flag
Local enable
Global (CCR) mask
CCIF
CCIE
(FSTAT register)
(FCNFG register)
DFDIF
DFDIE
(FERSTAT register)
(FERCNFG register)
SFDIF
SFDIE
(FERSTAT register)
(FERCNFG register)
I Bit
I Bit
I Bit
Description of flash and EEPROM interrupt operation
The flash module uses the FSTAT[CCIF] flag in combination with the FCNFG[CCIE]
interrupt enable bit to generate the flash command interrupt request. The flash module
uses the DFDIF and SFDIF flags in combination with the FERSTAT[DFDIE] and
FERSTAT[SFDIE] interrupt enable bits to generate the flash error interrupt request.
The logic used for generating the flash module interrupts is shown in the following
figure.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
76
Freescale Semiconductor, Inc.
Chapter 4 Memory map
Flash and EEPROM Command
Complete Interrupt Request
CCIE
CCIF
CPU Interrupt
DFDIE
DFDIF
Flash and EEPROM
Error Interrupt Request
SFDIE
SFDIF
Figure 4-4. Flash and EEPROM module interrupts implementation
4.5.2.6 Protection
The FPROT register can be set to protect regions in the flash memory from accidental
programming or erasing. Two separate memory regions, one growing downward from
global address 0xFFFF in the flash memory, called the higher region; and the remaining
addresses in the flash memory, can be activated for protection. The flash memory
addresses covered by these protectable regions are shown in the flash memory map. The
higher address region is mainly targeted to hold the boot loader code because it covers
the vector space.
0x0000
Flash START = 0xC000
0xD000
Protection Movable End
Flash Protected/Unprotected Higher Region 2, 4, 8, 16 Kbytes
0xE000
0xF000
Protection Fixed End
0xF800
0xFFFF
Flash Configuration Field 16 bytes (0xFF70
0xFF7F)
Figure 4-5. Flash protection memory map
Default protection settings as well as security information that allows the MCU to restrict
access to the flash module are stored in the flash configuration field as described in the
table below.
Table 4-11. Flash configuration field
Global address
Size (Bytes)
0xFF70 — 0xFF771
8
Description
Backdoor comparison key. See Verify backdoor access key command and
Unsecuring the MCU using backdoor key access.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
77
Flash and EEPROM
Table 4-11. Flash configuration field (continued)
Global address
Size (Bytes)
Description
0xFF78 — 0xFF7B
4
Reserved
0xFF7C1
1
Flash protection byte
0xFF7D1
1
EEPROM protection byte
0xFF7E1
1
Flash nonvolatile byte
0xFF7F1
1
Flash security byte
1. 0xFF78–0xFF7F for a flash phrase and must be programmed in a single command write sequence. Each byte in the
0xFF78-0xFF7B reserved field must be programmed to 0xFF.
The flash and EEPROM module provides protection to the MCU. During the reset
sequence, the FPROT register is loaded with the contents of the flash protection byte in
the flash configuration field at global address 0xFF7C in flash memory. The protection
functions depend on the configuration of bit settings in FPORT register.
Table 4-12. Flash protection function
FPOPEN
FPHDIS
Function1
1
1
No flash protection
1
0
Protected high range
0
1
Full flash memory protected
0
0
Unprotected high range
1. For range sizes, see Table 4.
The flash protection scheme can be used by applications requiring reprogramming in
single chip mode while providing as much protection as possible if reprogramming is not
required.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
78
Freescale Semiconductor, Inc.
Chapter 4 Memory map
FPHDIS = 1
FPHDIS = 0
FPHDIS = 1
FPHDIS = 0
Scenario 3
Scenario 2
Scenario 1
Scenario 0
FPOPEN = 1
FPOPEN = 1
FPOPEN = 0
FPOPEN = 0
Flash Start Address
FPHS[1:0]
0xFFFF
Unprotected region
Protected region with size
defined by FPHS
Protected region
not defined by FPHS
Figure 4-6. Flash protection scenarios
The general guideline is that flash protection can only be added and not removed. The
following table specifies all valid transitions between flash protection scenarios. Any
attempt to write an invalid scenario to the FPROT register will be ignored. The contents
of the FPROT register reflect the active protection scenario. See the FPROT[FPHS] and
FPROT[FPLS] bit descriptions for additional restrictions.
Table 4-13. Flash protection scenario transitions
From protection
scenario
To protection scenario
0
0
1
×
×
1
2
3
×
2
3
×
×
×
×
×
×
The flash protection address range is listed in the following two tables regarding the
scenarios in the table above.
Table 4-14. Flash protection higher address range
FPHS[1:0]
Global address range
Protected size
00
0xF800 – 0xFFFF
2 Kbytes
01
0xF000 – 0xFFFF
4 Kbytes
10
0xE000 – 0xFFFF
8 Kbytes
11
0xC000 – 0xFFFF
16 Kbytes
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
79
Flash and EEPROM
During the reset sequence, fields NVM_EEPROT[DPOPEN] and NVM_EEPROT[DPS]
are loaded with the contents of the EEPROM protection byte in the flash configuration
field at global address 0xFF7D located in flash memory. EEPROM protection address
range is specified by the NVM_EEPROT[DPS].
Table 4-15. EEPROM protection address range
DPS[2:0]
Global address range
Protected size
000
0x3100 – 0x311F
32 bytes
001
0x3100 – 0x313F
64 bytes
010
0x3100 – 0x315F
96 bytes
011
0x3100 – 0x317F
128 bytes
100
0x3100 – 0x319F
160 bytes
101
0x3100 – 0x31BF
192 bytes
110
0x3100 – 0x31DF
224 bytes
111
0x3100 – 0x31FF
256 bytes
All possible flash protection scenarios are shown in Figure 4-6. Although the protection
scheme is loaded from the flash memory at global address 0xFF7C during the reset
sequence, it can be changed by the user.
4.5.2.7 Security
The flash and EEPROM module provides security information to the MCU. The flash
security state is defined by the NVM_FSEC[SEC] bits. During reset, the flash module
initializes the NVM_FSEC register using data read from the security byte of the flash and
EEPROM configuration field at global address 0xFF7F. The security state out of reset
can be permanently changed by programming the security byte, assuming that the MCU
is starting from a mode where the necessary flash and EEPROM erase and program
commands are available and that the upper region of the flash is unprotected. If the flash
security byte is successfully programmed, its new value will take affect after the next
MCU reset.
The following subsections describe these security-related subjects:
• Unsecuring the MCU using backdoor key access
• Unsecuring the MCU using BDM
• Mode and security effects on flash and EEPROM command availability
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
80
Freescale Semiconductor, Inc.
Chapter 4 Memory map
4.5.2.7.1
Unsecuring the MCU using backdoor key access
The MCU may be unsecured by using the backdoor key access feature which requires
knowledge of the contents of the backdoor keys, which are four 16-bit words
programmed at addresses 0xFF70–0xFF77. If the KEYEN[1:0] bits are in the enabled
state, the verify backdoor access key command – see Verify backdoor access key
command, allows the user to present four prospective keys for comparison to the keys
stored in the flash and EEPROM memory via the memory controller. If the keys
presented in the verify backdoor access key command match the backdoor keys stored in
the flash and EEPROM memory, the FSEC[SEC] bits will be changed to unsecure the
MCU. Key values of 0x0000 and 0xFFFF are not permitted as backdoor keys. While the
Verify Backdoor Access Key command is active, flash memory and EEPROM memory
will not be available for read access and will return invalid data.
The user code stored in the flash memory must have a method of receiving the backdoor
keys from an external stimulus. This external stimulus would typically be through one of
the on-chip serial ports.
If the KEYEN[1:0] bits are in the enabled state, the MCU can be unsecured by the
backdoor key access sequence described below:
1. Follow the command sequence for the verify backdoor access key command as
explained in Verify backdoor access key command.
2. If the verify backdoor access key command is successful, the MCU is unsecured and
the FSEC[SEC] bits are forced to the unsecure state of 10.
The verify backdoor access key command is monitored by the memory controller and an
illegal key will prohibit future use of the verify backdoor access key command. A reset of
the MCU is the only method to re-enable the verify backdoor access key command. The
security as defined in the flash and EEPROM security byte (0xFF7F) is not changed by
using the verify backdoor access key command sequence. The backdoor keys stored in
addresses 0xFF70–0xFF77 are unaffected by the verify backdoor access key command
sequence. The verify backdoor access key command sequence has no effect on the
program and erase protections defined in the flash and EEPROM protection register,
FPORT.
After the backdoor keys have been correctly matched, the MCU will be unsecured. After
the MCU is unsecured, the sector containing the flash and EEPROM security byte can be
erased and the flash and EEPROM security byte can be reprogrammed to the unsecure
state, if desired. In the unsecure state, the user has full control of the contents of the
backdoor keys by programming addresses 0xFF70–0xFF77 in the flash configuration
field.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
81
Flash and EEPROM
4.5.2.7.2
Unsecuring the MCU using BDM
A secured MCU can be unsecured by using the following method to erase the flash and
EEPROM memory:
1. Reset the MCU.
2. Set FCDIV register as described in Writing the FCLKDIV register.
3. Configure registers NVM_FERSTAT and NVM_FPROT to disable protection in the
flash and EEPROM memory.
4. Execute the erase all blocks command write sequence to erase the flash and
EEPROM memory. Alternately, the unsecure NVM command can be executed.
If the flash and EEPROM memory are verified as erased, the MCU will be
unsecured. All BDM. commands will now be enabled and the flash security byte may
be programmed to the unsecure state by continuing with the steps that follow.
5. Execute the program flash command write sequence to program the flash security
byte to the unsecured state.
6. Reset the MCU.
4.5.2.7.3
Mode and security effects on flash and EEPROM command
availability
The availability of flash and EEPROM module commands depends on the MCU
operating mode and security state as shown in Table 4-9.
4.5.2.8 Flash and EEPROM commands
4.5.2.8.1
Flash commands
The following table summarizes the valid flash commands as well as the effects of the
commands on the flash block and other resources within the flash and EEPROM module.
Table 4-16. Flash commands
FCMD
Command
Function on flash memory
0x01
Erase verify all blocks
0x02
Erase verify block
0x03
Erase verify flash section
0x04
Read Once
Verify that all flash (and EEPROM) blocks are erased
Verify that a flash block is erased
Verify that a given number of words starting at the address provided are erased
Read a dedicated 64 byte field in the nonvolatile information register in flash
block that was previously programmed using the program once command
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
82
Freescale Semiconductor, Inc.
Chapter 4 Memory map
Table 4-16. Flash commands (continued)
FCMD
Command
Function on flash memory
0x06
Program flash
Program up to two longwords in a flash block
0x07
Program once
Program a dedicated 64 byte field in the nonvolatile information register in flash
block that is allowed to be programmed only once
Erase all flash and EEPROM blocks
0x08
An erase of all flash blocks is possible only when the FPROT[FPHDIS], and
FPROT[FPOEN] bits and the EEPROT[DPOPEN] bit are set prior to launching
the command
Erase all block
Erase a flash or EEPROM block
0x09
Erase flash block
An erase of the full flash block is possible only when FPROT[FPHDIS], and
FPROT[FPOEN] bits are set prior to launching the command
0x0A
Erase flash sector
Erase all bytes in a flash sector
0x0B
Unsecure flash
Supports a method of releasing MCU security by erasing all flash (and
EEPROM) blocks and verifying that all flash (and EEPROM) blocks are erased
0x0C
Verify backdoor access key
Supports a method of releasing MCU security by verifying a set of security keys
0x0D
Set user margin level
4.5.2.8.2
Specifies a user margin read level for all flash blocks
EEPROM commands
The following table summarizes the valid EEPROM commands along with the effects of
the commands on the EEPROM block.
Table 4-17. EEPROM commands
FCMD
Command
Function on flash memory
0x01
Erase verify all blocks
0x02
Erase verify block
Verify that all EEPROM (and flash) blocks are erased.
Verify that an EEPROM block is erased.
Erase all EEPROM and flash blocks
0x08
Erase all block
An erase of all EEPROM blocks is possible only when the FPROT[FPHDIS], and
FPROT[FPOEN] bits and the DPOPEN bit in the EEPORT register are set prior
to launching the command.
Erase a EEPROM and flash block
0x09
Erase EEPROM Block
0x0B
Unsecure EEPROM
0x0D
Set User Margin Level
Specifies a user margin read level for all flash blocks.
0x10
Erase Verify EEPROM
Section
Verify that a given number of bytes starting at the address provided are erased.
0x11
Program EEPROM
Program up to four bytes in the EEPROM block.
0x12
Erase EEPROM Sector
Erase all bytes in a sector of the EEPROM block.
An erase of the full flash block is possible only when FPROT[FPHDIS] and
FPROT[FPOPEN] bits are set prior to launching the command.
Supports a method of releasing MCU security by erasing all EEPROM and flash
blocks and verifying that all EEPROM and flash blocks are erased.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
83
Flash and EEPROM
4.5.2.8.3
Allowed simultaneous flash and EEPROM operations
Only the operations marked 'OK' in the following table are permitted to be run
simultaneously on the flash and EEPROM blocks. Some operations cannot be executed
simultaneously because certain hardware resources are shared by the two memories. The
priority has been placed on permitting flash reads while program and erase operations
execute on the EEPROM, providing read (flash) while write (EEPROM) functionality.
Table 4-18. Allowed simultaneous flash and EEPROM operations
Program flash
Read
EEPROM
Read
Margin read
Program
Sector erase
OK
OK
OK
Mass erase
Margin Read1
Program
Sector Erase
Mass Erase2
OK
1. A 'Margin read' is any read after executing the margin setting commands 'Set user margin level' or 'Set field margin level'
with anything but the 'normal' level specified. See the Note on margin settings in
2. The 'Mass erase' operations are commands 'Erase all blocks' and 'Erase flash block'
4.5.2.9 Flash and EEPROM command summary
This section provides details of all available flash commands launched by a command
write sequence. The FSTAT[ACCERR] bit will be set during the command write
sequence if any of the following illegal steps are performed, causing the command not to
be processed by the memory controller:
• Starting any command write sequence that programs or erases flash memory before
initializing the FLCKDIV register.
• Writing an invalid command as part of the command write sequence.
• For additional possible errors, refer to the error handling table provided for each
command.
If a flash block is read during the execution of an algorithm (FSTAT[CCIF] = 0) on that
same block, the read operation will return invalid data if both flags FERSTAT[SFDIF]
and FERSTAT[DFDIF] are set. If the FERSTAT[SFDIF] or FERSTAT[DFDIF] flags
were not previously set when the invalid read operation occurred, both the
FERSTAT[SFDIF] and FERSTAT[DFDIF] flags will be set.
If the FSTAT[ACCERR] or FSTAT[FPVIOL] bits are set, the user must clear these bits
before starting any command write sequence.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
84
Freescale Semiconductor, Inc.
Chapter 4 Memory map
CAUTION
An EEPROM byte or flash longword must be in the erased state
before being programmed. Cumulative programming of bits
within an EEPROM byte or flash longword is not allowed.
4.5.2.9.1
Erase verify all blocks command
The erase verify all blocks command will verify that all flash and EEPROM blocks have
been erased.
Table 4-19. Erase verify all blocks command FCCOB requirements
CCOBIX[2:0]
NVM_FCCOBHI parameters
NVM_FCCOBLO parameters
000
0x01
Not required
Upon clearing NVM_FSTAT[CCIF] to launch the erase verify all blocks command, the
memory controller will verify that the entire flash memory space is erased. The
NVM_FSTAT[CCIF] flag will set after the erase verify all blocks operation has
completed. If all blocks are not erased, it means blank check failed and both
NVM_FSTAT[MGSTAT] bits will be set.
Table 4-20. Erase verify all blocks command error handling
Register
Error bit
Error condition
ACCERR
Set if CCOBIX[2:0] != 000 at command launch
FPVIOL
NVM_FSTAT
None
MGSTAT1
Set if any errors have been encountered during the read1 or if blank check
failed
MGSTAT0
Set if any non-correctable errors have been encountered during the read
or if blank check failed
1. As found in the memory map for NVM
4.5.2.9.2
Erase verify block command
The erase verify block command allows the user to verify that an entire flash or
EEPROM block has been erased. The FCCOB global address [23:0] bits determine which
block must be verified.
Table 4-21. Erase verify block command FCCOB requirements
CCOBIX[2:0]
NVM_FCCOBHI parameters
NVM_FCCOBLO parameters
000
0x02
Global address [23:16] to identify Flash block1
001
Global address [15:0] in flash block to be verified
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
85
Flash and EEPROM
1. Global address [23] selects between flash (0) or EEPROM (1) block, that can otherwise eventually share the same
address on the MCU global memory map.
Upon clearing NVM_FSTAT[CCIF] to launch the erase verify block command, the
memory controller will verify that the selected flash or EEPROM block is erased. The
NVM_FSTAT[CCIF] flag will set after the erase verify block operation has completed. If
the block is not erased, it means blank check failed and both NVM_FSTAT[MGSTAT]
bits will be set.
Table 4-22. Erase verify block command error handling
Register
Error bit
Error condition
Set if CCOBIX[2:0] != 000 at command launch
ACCERR
Set if an invalid global address [23:0] is supplied1
FPVIOL
FSTAT
None
MGSTAT1
Set if any errors have been encountered during the read or if blank check
failed
MGSTAT0
Set if any non-correctable errors have been encountered during the read
or if blank check failed
1. As found in the memory map for NVM
4.5.2.9.3
Erase verify flash section command
The erase verify flash section command will verify that a section of code in the flash
memory is erased. The erase verify flash section command defines the starting point of
the code to be verified and the number of longwords.
Table 4-23. Erase verify flash section command FCCOB requirements
CCOBIX[2:0]
NVM_FCCOBHI parameters
NVM_FCCOBLO parameters
000
0x03
Global address [23:16] of flash block
001
Global address [15:0] of the first longwords to be verified
010
Number of long words to be verified
Upon clearing NVM_FSTAT[CCIF] to launch the erase verify flash section command,
the memory controller will verify that the selected section of flash memory is erased. The
NVM_FSTAT[CCIF] flag will set after the erase verify flash section operation has
completed. If the section is not erased, it means blank check failed and both
FSTAT[MGSTAT] bits will be set.
Table 4-24. Erase verify flash section command error handling
Register
Error bit
Error condition
FSTAT
ACCERR
Set if CCOBIX[2:0] != 010 at command launch
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
86
Freescale Semiconductor, Inc.
Chapter 4 Memory map
Table 4-24. Erase verify flash section command error handling (continued)
Register
Error bit
Error condition
Set if command not available in current mode (see Table 4-9)
Set if an invalid global address [23:0] is supplied (see Table 4-6)1
Set if a misaligned long words address is supplied (global address[1:0] !=
00)
Set if the requested section crosses flash address boundary
FPVIOL
None
MGSTAT1
Set if any errors have been encountered during the read2 or if blank check
failed
MGSTAT0
Set if any non-correctable errors have been encountered during the read2
or if blank check failed
1. As defined by the memory map for NVM
2. As found in the memory map for NVM
4.5.2.9.4
Read once command
The read once command provides read access to a reserved 64 byte field (8 phrase)
located in the nonvolatile information register of flash. The read once field can only be
programmed once and can not be erased. It can be used to store the product ID or any
other information that can be written only once. It is programmed using the program once
command described in Program once command. To avoid code runaway, the read once
command must not be executed from the flash block containing the program once
reserved field.
Table 4-25. Read once command FCCOB requirements
CCOBIX[2:0]
000
FCCOB parameters
0x04
Not required
001
Read once phrase index (0x0000 – 0x0007)
010
Read once word 0 value
011
Read once word 1 value
100
Read once word 2 value
101
Read once word 3 value
Upon clearing FSTAT[CCIF] to launch the read once command, a read once phrase is
fetched and stored in the FCCOB indexed register. The FSTAT[CCIF] flag will set after
the read once operation has completed. Valid phrase index values for the read once
command range from 0x0000 to 0x0007. During execution of the read once command,
any attempt to read addresses within flash block will return invalid data.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
87
Flash and EEPROM
Table 4-26. Read once command error handling
Register
Error bit
Error condition
Set if CCOBIX[2:0] != 001 at command launch
ACCERR
Set if an invalid phrase index is supplied
FSTAT
4.5.2.9.5
Set if command is not available in current mode (see Table 4-9)
FPVIOL
None
MGSTAT1
Set if any errors have been encountered during the read
MGSTAT0
Set if any non-correctable errors have been encountered during the read
Program flash command
The program flash operation will program up to two previously erased longwords in the
flash memory using an embedded algorithm.
Note
A flash phrase must be in the erased state before being
programmed. Cumulative programming of bits within a flash
phrase is not allowed.
Table 4-27. Program flash command FCCOB requirements
CCOBIX[2:0]
NVM_FCCOBHI parameters
NVM_FCCOBLO parameters
000
0x06
Global address [23:16] to identify flash block
001
Global address [15:0] of longwords location to be programmed1
010
Word 0 (longword 0) program value
011
Word 1 (longword 0) program value
100
Word 2 (longword 1) program value
101
Word 3 (longword 1) program value
1. Global address [1:0] must be 00.
Upon clearing NVM_FSTAT[CCIF] to launch the program flash command, the memory
controller will program the data words to the supplied global address and will then
proceed to verify the data words read back as expected. The NVM_FSTAT[CCIF] flag
will set after the program flash operation has completed.
Table 4-28. Program flash command error handling
Register
Error bit
Error condition
Set if CCOBIX[2:0] ≠ 011 or 101 at command launch
NVM_FSTAT
ACCERR
Set if command not available in current mode (see Table 4-9)
Set if an invalid global address [23:0] is supplied (see Table 4-6)1
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
88
Freescale Semiconductor, Inc.
Chapter 4 Memory map
Table 4-28. Program flash command error handling (continued)
Register
Error bit
Error condition
Set if a misaligned longword address is supplied (global address [1:0] !=
00)
Set if the requested group of words breaches the end of the flash block.
FPVIOL
Set if the global address [23:0] points to a protected data
MGSTAT1
Set if any errors have been encountered during the verify operation
MGSTAT0
Set if any non-correctable errors have been encountered during the verify
operation
1. As defined by the memory map of NVM
4.5.2.9.6
Program once command
The program once command restricts programming to a reserved 64 byte field (8 phrases)
in the nonvolatile information register located in flash. The program once reserved field
can be read using the read once command as described in Read once command. The
program once command must be issued only because the nonvolatile information register
in flash cannot be erased. To avoid code runaway, the read once command must not be
executed from the flash block containing the program once reserved field.
Table 4-29. Program once command FCCOB requirements
CCOBIX[2:0]
000
FCCOB parameters
0x07
Not required
001
Program Once phrase index (0x000 – 0x0007)
010
Program once Word 0 value
011
Program once Word 1value
100
Program once Word 2 value
101
Program once Word 3 value
Upon clearing FSTAT[CCIF] to launch the program once command, the memory
controller first verifies that the selected phrase is erased. If erased, then the selected
phrase will be programmed and then verified with read back. The FSTAT[CCIF] flag will
remain clear, setting only after the program once operation has completed.
The reserved nonvolatile information register accessed by the program once command
cannot be erased, and any attempt to program one of these phrases a second time will not
be allowed. Valid phrase index values for the program once command range from 0x0000
to 0x0007. During execution of the program once command, any attempt to read
addresses within flash will return invalid data.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
89
Flash and EEPROM
Table 4-30. Program once command error handling
Register
Error bit
Error condition
Set if CCOBIX[2:0] != 101 at command launch
ACCERR
Set if command not available in current mode (see Table 4-9)
Set if an invalid phrase index is supplied
Set if the requested phrase has already been programmed1
FSTAT
FPVIOL
None
MGSTAT1
Set if any errors have been encountered during the verify operation
MGSTAT0
Set if any non-correctable errors have been encountered during the verify
operation
1. If a program once phrase is initially programmed to 0xFFFF_FFFF_FFFF_FFFF, the program once command will be
allowed to execute again on that same phrase.
4.5.2.9.7
Erase all blocks command
The erase all blocks operation will erase the entire flash and EEPROM memory space.
Table 4-31. Erase all blocks command FCCOB requirements
CCOBIX[2:0]
NVM_FCCOBHI parameters
NVM_FCCOBLO parameters
000
0x08
Not required
Upon clearing NVM_FSTAT[CCIF] to launch the erase all blocks command, the
memory controller will erase the entire NVM memory space and verify that it is erased. If
the memory controller verifies that the entire NVM memory space was properly erased,
security will be released. Therefore, the device is in unsecured state. During the execution
of this command (NVM_FSTAT[CCIF] = 0) the user must not write to any NVM module
register. The NVM_FSTAT[CCIF] flag will set after the erase all blocks operation has
completed.
Table 4-32. Erase all blocks command error handling
Register
Error bit
ACCERR
NVM_FSTAT
FPVIOL
Error condition
Set if CCOBIX[2:0] ≠ 000 at command launch
Set if command not available in current mode (see Table 4-9)
Set if any area of the flash or EEPROM memory is protected
MGSTAT1
Set if any errors have been encountered during the verify operation1
MGSTAT0
Set if any non-correctable errors have been encountered during the verify
operation1
1. As found in the memory map for NVM
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
90
Freescale Semiconductor, Inc.
Chapter 4 Memory map
4.5.2.9.8
Erase flash block command
The erase flash block operation will erase all addresses in a flash or EEPROM block.
Table 4-33. Erase flash block command FCCOB requirements
CCOBIX[2:0]
FCCOB parameters
000
Global address [23:16] to identify flash block1
0x09
001
Global address[15:0] in flash block to be erased
1. Global address [23] selects between flash (0) or EEPROM (1) block, that can otherwise eventually share the same
address on the MCU global memory map.
Upon clearing FSTAT[CCIF] to launch the erase flash block command, the memory
controller will erase the selected flash block and verify that it is erased. The
FSTAT[CCIF] flag will set after the erase flash block operation has completed.
Table 4-34. Erase flash block command error handling
Register
Error Bit
Error Condition
Set if CCOBIX[2:0] != 001 at command launch
ACCERR
Set if command not available in current mode (see Table 4-9)
Set if an invalid global address [23:16] is supplied1
FSTAT
FPVIOL
Set if an area of the selected flash block is protected
MGSTAT1
Set if any errors have been encountered during the verify operation2
MGSTAT0
Set if any non-correctable errors have been encountered during the verify
operation2
1. As defined by the memory map for NVM
2. As found in the memory map for NVM
4.5.2.9.9
Erase flash sector command
The erase flash sector operation will erase all addresses in a flash sector.
Table 4-35. Erase flash sector command FCCOB requirements
CCOBIX[2:0]
FCCOB parameters
000
001
0x0A
Global address [23:16] to identify flash block to be erased
Global address [15:0] anywhere within the sector to be erased. Refer to Overview for the flash
sector size
Upon clearing FSTAT[CCIF] to launch the erase flash sector command, the memory
controller will erase the selected flash sector and then verify that it is erased. The
FSTAT[CCIF] flag will be set after the erase flash sector operation has completed.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
91
Flash and EEPROM
Table 4-36. Erase flash sector command error handling
Register
Error bit
Error condition
Set if CCOBIX[2:0] != 001 at command launch
Set if command not available in current mode (see Table 4-9)
ACCERR
Set if an invalid global address [23:16] is supplied.1 (see Table 4-6)
Set if a misaligned longword address is supplied (global address [1:0] !=
00)
FSTAT
FPVIOL
Set if the selected flash sector is protected
MGSTAT1
Set if any errors have been encountered during the verify operation
MGSTAT0
Set if any non-correctable errors have been encountered during the verify
operation
1. As defined by the memory map for NVM
4.5.2.9.10
Unsecure flash command
The unsecure flash command will erase the entire flash and EEPROM memory space,
and if the erase is successful, will release security.
Table 4-37. Unsecure flash command FCCOB requirements
CCOBIX[2:0]
FCCOB parameters
000
0x0B
Not required
Upon clearing FSTAT[CCIF] to launch the unsecure flash command, the memory
controller will erase the entire flash and EEPROM memory space and verify that it is
erased. If the memory controller verifies that the entire flash and EEPROM memory
space was properly erased, security will be released. If the erase verify is not successful,
the unsecure flash operation sets FSTAT[MGSTAT1] and terminates without changing
the security state. During the execution of this command (FSTAT[CCIF] = 0), the user
must not write to any flash and EEPROM module register. The FSTAT[CCIF] flag is set
after the unsecure flash operation has completed.
Table 4-38. Unsecure flash command error handling
Register
Error bit
ACCERR
FSTAT
FPVIOL
Error condition
Set if CCOBIX[2:0] != 000 at command launch
Set if command is not available in current mode (see Table 4-9)
Set if any area of the flash or EEPROM memory is protected
MGSTAT1
Set if any errors have been encountered during the verify operation1
MGSTAT0
Set if any non-correctable errors have been encountered during the verify
operation1
1. As found in the memory map for NVM
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
92
Freescale Semiconductor, Inc.
Chapter 4 Memory map
4.5.2.9.11
Verify backdoor access key command
The verify backdoor access key command will execute only if it is enabled by the
NVM_FSEC[KEYEN] bits. The verify backdoor access key command releases security
if user-supplied keys match those stored in the flash security bytes of the flash
configuration field. See Table 4-6 for details. The code that performs verifying backdoor
access command must be running from RAM or EEPROM.
Table 4-39. Verify backdoor access key command FCCOB requirements
CCOBIX[2:0]
NVM_FCCOBHI parameters
NVM_FCCOBLO parameters
000
0x0C
Not required
001
Key 0
010
Key 1
011
Key 2
100
Key 3
Upon clearing NVM_FSTAT[CCIF] to launch the verify backdoor access key command,
the memory controller will check the NVM_FSEC[KEYEN] bits to verify that this
command is enabled. If not enabled, the memory controller sets the
NVM_FSTAT[ACCERR] bit. If the command is enabled, the memory controller
compares the key provided in FCCOB to the backdoor comparison key in the flash
configuration field with Key 0 compared to 0xFF70, and so on. If the backdoor keys
match, security will be released. If the backdoor keys do not match, security is not
released and all future attempts to execute the verify backdoor access key command are
aborted (set NVM_FSTAT[ACCERR]) until a reset occurs. The NVM_FSTAT[CCIF]
flag is set after the verify backdoor access key operation has completed.
Table 4-40. Verify backdoor access key command error handling
Register
Error bit
Error condition
Set if CCOBIX[2:0] ≠ 100 at command launch
ACCERR
NVM_FSTAT
Set if an incorrect backdoor key is supplied
Set if backdoor key access has not been enabled (KEYEN[1:0] ≠ 10
Set if the backdoor key has mismatched since the last reset
FPVIOL
None
MGSTAT1
None
MGSTAT0
None
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
93
Flash and EEPROM
4.5.2.9.12
Set user margin level command
The user margin is a small delta to the normal read reference level and, in effect, is a
minimum safety margin. That is, if the reads pass at the tighter tolerances of the user
margins, the normal reads have at least that much safety margin before users experience
data loss.
The set user margin level command causes the memory controller to set the margin level
for future read operations of the flash or EEPROM block.
Table 4-41. Set user margin level command FCCOB requirements
CCOBIX[2:0]
NVM_FCCOBHI parameters
NVM_FCCOBLO parameters
000
0x0D
Global address [23:16] to identify flash block1
001
Global address [15:0] to identify flash block
010
Margin level setting
1. Global Address [23] selects between flash (0) or EEPROM (1) block, that can otherwise eventually share the same
address on the MCU global memory map.
Upon clearing NVM_FSTAT[CCIF] to launch the set user margin level command, the
memory controller will set the user margin level for the targeted block and then set the
NVM_FSTAT[CCIF] flag.
Note
When the EEPROM block is targeted, the EEPROM user
margin levels are applied only to the EEPROM reads. However,
when the Flash block is targeted, the flash user margin levels
are applied to both Flash and EEPROM reads. It is not possible
to apply user margin levels to the flash block only.
Valid margin level settings for the set user margin level command are defined in the
following tables.
Table 4-42. Valid set user margin level settings
CCOB
Level description
(CCOBIX = 010)
0x0000
Return to normal level
0x0001
User margin-1 level1
0x0002
User margin-0 level2
1. Read margin to the erased state
2. Read margin to the programmed state
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
94
Freescale Semiconductor, Inc.
Chapter 4 Memory map
Table 4-43. Set user margin level command error handling
Register
Error bit
Error condition
Set if CCOBIX[2:0] != 010 at command launch
Set if command is not available in current mode (see Table 4-9)
ACCERR
Set if an invalid global address [23:0] is supplied
NVM_FSTAT
Set if an invalid margin level setting is supplied
FPVIOL
None
MGSTAT1
None
MGSTAT0
None
Note
User margin levels can be used to check that NVM memory
contents have adequate margin for normal level read operations.
If unexpected results are encountered when checking NVM
memory contents at user margin levels, a potential loss of
information has been detected.
Erase verify EEPROM section command
4.5.2.9.13
The erase verify EEPROM section command will verify that a section of code in the
EEPROM is erased. The erase verify EEPROM section command defines the starting
point of the data to be verified and the number of bytes.
Table 4-44. Erase verify EEPROM section command FCCOB requirements
CCOBIX[2:0]
NVM_FCCOBHI parameters
NVM_FCCOBLO parameters
000
0x10
Global address [23:16] to identify the EEPROM block
001
Global address [15:0] of the first byte to be verified
010
Number of bytes to be verified
Upon clearing NVM_FSTAT[CCIF] to launch the erase verify that EEPROM section
command, the memory controller will verify the selected section of EEPROM memory is
erased. The NVM_FSTAT[CCIF] flag will set after the erase verify EEPROM section
operation has completed. If the section is not erased, which means that blank check
failed, both NVM_FSTAT[MGSTAT] bits will be set.
Table 4-45. Erase verify EEPROM section command error handling
Register
Error bit
FSTAT
ACCERR
Error condition
Set if CCOBIX[2:0] ≠ 010 at command launch
Set if command is not available in current mode (see Table 4-9)
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
95
Flash and EEPROM
Table 4-45. Erase verify EEPROM section command error handling (continued)
Register
Error bit
Error condition
Set if an invalid global address [23:0] is supplied
Set if the requested section breaches the end of the EEPROM block
FPVIOL
4.5.2.9.14
None
MGSTAT1
Set if any errors have been encountered during the read or if blank check
failed
MGSTAT0
Set if any non-correctable errors have been encountered during the read
or it blank check failed.
Program EEPROM command
The program EEPROM operation programs one to four previously erased bytes in the
EEPROM block. The program EEPROM operation will confirm that the targeted
location(s) were successfully programmed upon completion.
Note
A EEPROM byte must be in the erased state before being
programmed. Cumulative programming of bits within a
EEPROM byte is not allowed.
Table 4-46. Program EEPROM command FCCOB requirements
CCOBIX[2:0]
NVM_FCCOBHI parameters
NVM_FCCOBLO parameters
000
0x11
Global address [23:16] to identify the EEPROM block
001
Global address [15:0] of the first word to be verified
010
Byte 0 program value
011
Byte 1 program value, if desired
100
Byte 2 program value, if desired
101
Byte 3 program value, if desired
Upon clearing NVM_FSTAT[CCIF] to launch the program EEPROM command, the
user-supplied words will be transferred to the memory controller and be programmed if
the area is unprotected. The CCOBIX index value at program EEPROM command
launch determines how many bytes will be programmed in the EEPROM block. The
NVM_FSTAT[CCIF] flag is set when the operation has completed.
Table 4-47. Program EEPROM command error handling
Register
Error Bit
NVM_FSTAT
ACCERR
Error condition
Set if CCOBIX[2:0] < 010 at command launch
Set if CCOBIX[2:0] >101 at command launch
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
96
Freescale Semiconductor, Inc.
Chapter 4 Memory map
Table 4-47. Program EEPROM command error handling (continued)
Register
Error Bit
Error condition
Set if command is not available in current mode (see Table 4-9)
Set if an invalid global address [23:0] is supplied
Set if the requested group of words breaches the end of the EEPROM
block
FPVIOL
4.5.2.9.15
Set if the selected area of the EEPROM memory is protected
MGSTAT1
Set if any errors have been encountered during the verify operation
MGSTAT0
Set if any non-correctable errors have been encountered during the verify
operation
Erase EEPROM sector command
The erase EEPROM sector operation will erase all addresses in a sector of the EEPROM
block.
Table 4-48. Erase EEPROM sector command FCCOB requirements
CCOBIX[2:0]
NVM_FCCOBHI parameters
NVM_FCCOBLO parameters
000
0x12
Global address [23:16] to identify EEPROM block
001
Global address [15:0] anywhere within the sector to be erased. See Overview for EEPROM sector
size
Upon clearing NVM_FSTAT[CCIF] to launch the erase EEPROM sector command, the
memory controller will erase the selected EEPROM sector and verify that it is erased.
The NVM_FSTAT[CCIF] flag will set after the erase EEPROM sector operation has
completed.
Table 4-49. Erase EEPROM sector command error handling
Register
Error bit
Error condition
Set if CCOBIX[2:0] ≠ 001 at command launch
ACCERR
Set if command is not available in current mode (see Table 4-9)
Set if an invalid global address [23:0] is supplied (see Table 4-6)
NVM_FSTAT
FPVIOL
Set if the selected area of the EEPROM memory is protected
MGSTAT1
Set if any errors have been encountered during the verify operation
MGSTAT0
Set if any non-correctable errors have been encountered during the verify
operation
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
97
Flash and EEPROM registers descriptions
4.6 Flash and EEPROM registers descriptions
The flash module contains a set of 16 user control and status registers located between
0x3020 and 0x302F. In the case of the writable registers, the write accesses are forbidden
during flash command execution. For more details, see Caution note in Flash and
EEPROM memory map. A summary of the flash module registers is given in the
following table with detailed descriptions in the following subsections.
NVM memory map
Absolute
address
(hex)
Width
Access
(in bits)
Register name
Reset value
Section/
page
3020
Flash Clock Divider Register (NVM_FCLKDIV)
8
R/W
00h
4.6.1/98
3021
Flash Security Register (NVM_FSEC)
8
R
Undefined
4.6.2/99
3022
Flash CCOB Index Register (NVM_FCCOBIX)
8
R/W
00h
4.6.3/100
3024
Flash Configuration Register (NVM_FCNFG)
8
R/W
00h
4.6.4/100
3025
Flash Error Configuration Register (NVM_FERCNFG)
8
R/W
00h
4.6.5/101
3026
Flash Status Register (NVM_FSTAT)
8
R/W
80h
4.6.6/102
3027
Flash Error Status Register (NVM_FERSTAT)
8
R/W
00h
4.6.7/103
3028
Flash Protection Register (NVM_FPROT)
8
R
Undefined
4.6.8/104
3029
EEPROM Protection Register (NVM_EEPROT)
8
R/W
Undefined
4.6.9/105
302A
Flash Common Command Object Register:High
(NVM_FCCOBHI)
8
R/W
00h
4.6.10/106
302B
Flash Common Command Object Register: Low
(NVM_FCCOBLO)
8
R/W
00h
4.6.11/107
302C
Flash Option Register (NVM_FOPT)
8
R
Undefined
4.6.12/107
4.6.1 Flash Clock Divider Register (NVM_FCLKDIV)
The FCLKDIV register is used to control timed events in program and erase algorithms.
NOTE
The FCLKDIV register must not be written while a flash
command is executing (NVM_FSTAT[CCIF] = 0)
Address: 3020h base + 0h offset = 3020h
Bit
Read
7
FDIVLD
Write
Reset
0
6
5
4
3
FDIVLCK
0
2
1
0
0
0
0
FDIV
0
0
0
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
98
Freescale Semiconductor, Inc.
Chapter 4 Memory map
NVM_FCLKDIV field descriptions
Field
Description
7
FDIVLD
Clock Divider Loaded
6
FDIVLCK
Clock Divider Locked
FDIV
0
1
0
1
FCLKDIV register has not been written since the last reset.
FCLKDIV register has been written since the last reset.
FDIV field is open for writing.
FDIV value is locked and cannot be changed. After the lock bit is set high, only reset can clear this bit
and restore writability to the FDIV field in user mode.
Clock Divider Bits
FDIV[5:0] must be set to effectively divide BUSCLK down to 1MHz to control timed events during flash
program and erase algorithms. Refer to the table in the Writing the FCLKDIV register for the
recommended values of FDIV based on the BUSCLK frequency.
4.6.2 Flash Security Register (NVM_FSEC)
The FSEC register holds all bits associated with the security of the MCU and NVM
module. All bits in the FSEC register are readable but not writable. During the reset
sequence, the FSEC register is loaded with the contents of the flash security byte in the
flash configuration field at global address 0xFF7F located in flash memory.
See Security for security function.
Address: 3020h base + 1h offset = 3021h
Bit
7
Read
6
5
4
KEYEN
3
2
1
Reserved
0
SEC
Write
Reset
x*
x*
x*
x*
x*
x*
x*
x*
* Notes:
• x = Undefined at reset.
NVM_FSEC field descriptions
Field
7–6
KEYEN
Description
Backdoor Key Security Enable Bits
The KEYEN[1:0] bits define the enabling of backdoor key access to the flash module.
NOTE: 01 is the preferred KEYEN state to disable backdoor key access.
00
01
10
11
Disabled
Disabled
Enabled
Disabled
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
99
Flash and EEPROM registers descriptions
NVM_FSEC field descriptions (continued)
Field
5–2
Reserved
SEC
Description
This field is reserved.
Flash Security Bits
The SEC[1:0] bits define the security state of the MCU. If the flash module is unsecured using backdoor
key access, the SEC bits are forced to 10.
NOTE: 01 is the preferred SEC state to set MCU to secured state.
00
01
10
11
Secured
Secured
Unsecured
Secured
4.6.3 Flash CCOB Index Register (NVM_FCCOBIX)
The FCCOBIX register is used to index the FCCOB register for NVM memory
operations.
Address: 3020h base + 2h offset = 3022h
Bit
Read
Write
Reset
7
6
5
4
3
2
0
0
0
0
1
0
CCOBIX
0
0
0
0
0
NVM_FCCOBIX field descriptions
Field
Description
7–3
Reserved
This field is reserved.
This read-only field is reserved and always has the value 0.
CCOBIX
Common Command Register Index
The CCOBIX bits are used to select which word of the FCCOB register array is being read or written to.
4.6.4 Flash Configuration Register (NVM_FCNFG)
The FCNFG register enables the flash command complete interrupt and forces ECC
faults on flash array read access from the CPU.
Address: 3020h base + 4h offset = 3024h
Bit
Read
Write
Reset
7
6
0
CCIE
0
5
0
4
3
0
IGNSF
0
0
2
0
0
1
0
FDFD
FSFD
0
0
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
100
Freescale Semiconductor, Inc.
Chapter 4 Memory map
NVM_FCNFG field descriptions
Field
7
CCIE
Description
Command Complete Interrupt Enable
The CCIE bit controls interrupt generation when a flash command has completed.
0
1
6–5
Reserved
4
IGNSF
This field is reserved.
This read-only field is reserved and always has the value 0.
Ignore Single Bit Fault
The IGNSF controls single bit fault reporting in the FERSTAT register.
0
1
3–2
Reserved
1
FDFD
All single bit faults detected during array reads are reported.
Single bit faults detected during array reads are not reported and the single bit fault interrupt will not
be generated.
This field is reserved.
This read-only field is reserved and always has the value 0.
Force Double Bit Fault Detect
The FDFD bit allows the user to simulate a double bit fault during flash array read operations and check
the associated interrupt routine. The FDFD bit is cleared by writing a 0 to FDFD.
0
1
0
FSFD
Command complete interrupt disabled.
An interrupt will be requested whenever the CCIF flag in the FSTAT register is set.
Flash array read operations will set the FERSTAT[DFDIF] flag only if a double bit fault is detected.
Any flash array read operation will force the FERSTAT[DFDIF] flag to be set and an interrupt will be
generated as long as the DFDIE interrupt enable in the FERCNFG register is set.
Force Single Bit Fault Detect
The FSFD bit allows the user to simulate a single bit fault during flash array read operations and check the
associated interrupt routine. The FSFD bit is cleared by writing a 0 to FSFD.
0
1
Flash array read operations will set the SFDIF flag in the FERSTAT register only if a single bit fault is
detected.
Flash array read operation will force the SFDIF flag in the FERSTAT register to be set and an interrupt
will be generated as long as the SFDIE interrupt enable in the FERCNFG register is set.
4.6.5 Flash Error Configuration Register (NVM_FERCNFG)
The FERCNFG register enables the flash error interrupts for the FERSTAT flags.
Address: 3020h base + 5h offset = 3025h
Bit
Read
Write
Reset
7
6
5
4
3
2
0
0
0
0
0
0
0
1
0
DFDIE
SFDIE
0
0
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
101
Flash and EEPROM registers descriptions
NVM_FERCNFG field descriptions
Field
7–2
Reserved
1
DFDIE
Description
This field is reserved.
This read-only field is reserved and always has the value 0.
Double Bit Fault Detect Interrupt Enable
The DFDIE bit controls interrupt generation when a double bit fault is detected during a flash block read
operation.
0
1
0
SFDIE
DFDIF interrupt disabled.
An interrupt will be requested whenever the DFDIF flag is set.
Single Bit Fault Detect Interrupt Enable
The SFDIE bit controls interrupt generation when a single bit fault is detected during a flash block read
operation.
0
1
SFDIF interrupt disabled whenever the SFDIF flag is set.
An interrupt will be requested whenever the SFDIF flag is set.
4.6.6 Flash Status Register (NVM_FSTAT)
The FSTAT register reports the operational status of the flash and EEPROM module.
Address: 3020h base + 6h offset = 3026h
Bit
Read
Write
Reset
7
6
CCIF
1
5
0
0
4
ACCERR
FPVIOL
0
0
3
2
MGBUSY
0
0
0
1
0
MGSTAT
0
0
NVM_FSTAT field descriptions
Field
7
CCIF
Description
Command Complete Interrupt Flag
The CCIF flag indicates that a flash command has completed. The CCIF flag is cleared by writing a 1 to
CCIF to launch a command and CCIF will stay low until command completion or command violation.
0
1
Flash command in progress.
Flash command has completed.
6
Reserved
This field is reserved.
This read-only field is reserved and always has the value 0.
5
ACCERR
Flash Access Error Flag
The ACCERR bit indicates an illegal access has occurred to the flash memory caused by either a violation
of the command write sequence or issuing an illegal flash command. While ACCERR is set, the CCIF flag
cannot be cleared to launch a command. The ACCERR bit is cleared by writing a 1 to ACCERR. Writing a
0 to the ACCERR bit has no effect on ACCERR.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
102
Freescale Semiconductor, Inc.
Chapter 4 Memory map
NVM_FSTAT field descriptions (continued)
Field
Description
0
1
4
FPVIOL
Flash Protection Violation Flag
The FPVIOL bit indicates an attempt was made to program or erase an address in a protected area of
flash or EEPROM memory during a command write sequence. The FPVIOL bit is cleared by writing a 1 to
FPVIOL. Writing a 0 to the FPIOL bit has no effect on FPIOL. While FPIOL is set, it is not possible to
launch a command or start a command write sequence.
0
1
3
MGBUSY
No access error detected.
Access error detected.
No protection violation detected.
Protection violation detected.
Memory Controller Busy Flag
The MGBUSY flag reflects the active state of the memory controller.
0
1
Memory controller is idle.
Memory controller is busy executing a flash command (CCIF = 0).
2
Reserved
This field is reserved.
This read-only field is reserved and always has the value 0.
MGSTAT
Memory Controller Command Completion Status Flag
One or more MGSTAT flag bits are set if an error is detected during execution of a flash command or
during the flash reset sequence.
NOTE: Reset value can deviate from the value shown if a double bit fault is detected during the reset
sequence.
4.6.7 Flash Error Status Register (NVM_FERSTAT)
The FERSTAT register reflects the error status of internal flash and EEPROM
operations.
Address: 3020h base + 7h offset = 3027h
Bit
Read
Write
Reset
7
6
5
4
3
2
0
0
0
0
0
0
0
1
0
DFDIF
SFDIF
0
0
NVM_FERSTAT field descriptions
Field
7–2
Reserved
1
DFDIF
Description
This field is reserved.
This read-only field is reserved and always has the value 0.
Double Bit Fault Detect Interrupt Flag
The setting of the DFDIF flag indicates that a double bit fault was detected in the stored parity and data
bits during a flash array read operation or that a flash array read operation returning invalid data was
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
103
Flash and EEPROM registers descriptions
NVM_FERSTAT field descriptions (continued)
Field
Description
attempted on a flash block that was under a flash command operation. The DFDIF flag is cleared by
writing a 1 to DFDIF. Writing a 0 to DFDIF has no effect on DFDIF.
NOTE: The single bit fault and double bit fault flags are mutually exclusive for parity errors, meaning that
an ECC fault occurrence can be either single fault or double fault but never both. A simultaneous
access collision, when the flash array read operation is returning invalid data attempted while a
command is running, is indicated when both SFDIF and DFDIF flags are high.
NOTE: There is a one cycle delay in storing the ECC DFDIF and SFDIF fault flags in the register. At least
one NOP is required after a flash memory read before checking FERSTAT for the occurrence of
EEC errors.
0
1
0
SFDIF
No double bit fault detected.
Double bit fault detected or a flash array read operation returning invalid data was attempted while
command running.
Single Bit Fault Detect Interrupt Flag
With the IGNSF bit in the FCNFG register clear, the SFDIF flag indicates that a single bit fault was
detected in the stored parity and data bits during a flash array read operation or that a flash array read
operation returning invalid data was attempted on a flash block that was under a flash command
operation. The SFDIF flag is cleared by writing a 1 to SFDIF. Writing a 0 to SFDIF has no effect on
SRFDIF.
0
1
No single bit fault detected.
Single bit fault detected and corrected or a flash array read operation returning invalid data was
attempted while command running.
4.6.8 Flash Protection Register (NVM_FPROT)
The FPROT register defines which flash sectors are protected against program and erase
operations.
The unreserved bits of the FPROT register are writable with the restriction that the size of
the protected region can only be increased (see Protection).
During the reset sequence, the FPROT register is loaded with the contents of the flash
protection byte in the flash configuration field at global address 0xFF7C located in flash
memory. To change the flash protection that will be loaded during the reset sequence, the
upper sector of the flash memory must be unprotected, then the flash protection byte must
be reprogrammed.
Trying to alter data in any protected area in the flash memory will result in a protection
violation error and the FPVIOL bit will be set in the FSTAT register. The block erase of a
flash block is not possible if any of the flash sectors contained in the same flash block are
protected.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
104
Freescale Semiconductor, Inc.
Chapter 4 Memory map
Address: 3020h base + 8h offset = 3028h
Bit
Read
Write
Reset
7
6
5
FPOPEN
1
FPHDIS
x*
x*
x*
4
3
2
FPHS
x*
1
0
0
x*
x*
x*
x*
* Notes:
• x = Undefined at reset.
NVM_FPROT field descriptions
Field
7
FPOPEN
Description
Flash Protection Operation Enable
The FPOPEN bit determines the protection function for program or erase operations.
0
1
6
Reserved
5
FPHDIS
This field is reserved.
This read-only field is reserved and always has the value 1.
Flash Protection Higher Address Range Disable
The FPHDIS bit determines whether there is a protected/unprotected area in a specific region of the flash
memory ending with global address 0xFFFF.
0
1
4–3
FPHS
Reserved
When FPOPEN is clear, the FPHDIS and FPLDIS bits define unprotected address ranges as specified
by the corresponding FPHS and FPLS bits.
When FPOPEN is set, the FPHDIS and FPLDIS bits enable protection for the address range specified
by the corresponding FPHS and FPLS bits.
Protection/Unprotection enabled.
Protection/Unprotection disabled.
Flash Protection Higher Address Size
The FPHS bits determine the size of the protected/unprotected area in flash memory. The FPHS bits can
be written to only while the FPHDIS bit is set.
This field is reserved.
This read-only field is reserved and always has the value 0.
4.6.9 EEPROM Protection Register (NVM_EEPROT)
The EEPROT register defines which EEPROM sectors are protected against program and
erase operations.
The unreserved bits of the EEPROT register are writable with the restriction that
protection can be added but not removed. Writes must increase the DPS value and the
DPOPEN bit can only be written from 1, protection disabled, to 0, protection enabled. If
the DPOPEN bit is set, the state of the DPS bits is irrelevant.
During the reset sequence, fields DPOPEN and DPS of the EEPROT register are loaded
with the contents of the EEPROM protection byte in the flash configuration field at
global address 0xFF7D located in flash memory. To change the EEPROM protection that
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
105
Flash and EEPROM registers descriptions
will be loaded during the reset sequence, the flash sector containing the EEPROM
protection byte must be unprotected. Then the EEPROM protection byte must be
programmed.
Trying to alter data in any protected area in the EEPROM memory will result in a
protection violation error and the FPVIOL bit will be set in the FSTAT register. Block
erase of the EEPROM memory is not possible if any of the EEPROM sectors are
protected.
Address: 3020h base + 9h offset = 3029h
Bit
Read
Write
Reset
7
6
5
DPOPEN
x*
4
3
2
1
0
x*
x*
0
DPS
x*
x*
x*
x*
x*
* Notes:
• x = Undefined at reset.
NVM_EEPROT field descriptions
Field
7
DPOPEN
Description
EEPROM Protection Control
0
1
6–3
Reserved
DPS
Enables EEPROM memory protection from program and erase with protected address range defined
by DPS bits.
Disables EEPROM memory protection from program and erase.
This field is reserved.
This read-only field is reserved and always has the value 0.
EEPROM Protection Size
These bits determine the size of the protected area in the EEPROM memory.
4.6.10 Flash Common Command Object Register:High
(NVM_FCCOBHI)
The FCCOB is an array of six words addressed via the CCOBIX index found in the
FCCOBIX register. Byte-wide reads and writes are allowed to the FCCOB register.
Address: 3020h base + Ah offset = 302Ah
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
CCOB
0
0
0
0
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
106
Freescale Semiconductor, Inc.
Chapter 4 Memory map
NVM_FCCOBHI field descriptions
Field
CCOB
Description
Common Command Object Bit 15:8
High 8 bits of common command object register
4.6.11 Flash Common Command Object Register: Low
(NVM_FCCOBLO)
The FCCOB is an array of six words addressed via the CCOBIX index found in the
FCCOBIX register. Byte-wide reads and writes are allowed to the FCCOB register.
Address: 3020h base + Bh offset = 302Bh
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
CCOB
0
0
0
0
NVM_FCCOBLO field descriptions
Field
CCOB
Description
Common Command Object Bit 7:0
Low 8 bits of common command object register
4.6.12 Flash Option Register (NVM_FOPT)
The FOPT register is the flash option register.
During the reset sequence, the FOPT register is loaded from the flash nonvolatile byte in
the flash configuration field at global address 0xFF7E located in flash memory as
indicated by reset condition.
Address: 3020h base + Ch offset = 302Ch
Bit
7
6
5
4
Read
3
2
1
0
x*
x*
x*
x*
NV
Write
Reset
x*
x*
x*
x*
* Notes:
• x = Undefined at reset.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
107
Flash and EEPROM registers descriptions
NVM_FOPT field descriptions
Field
NV
Description
Nonvolatile Bits
The NV[7:0] bits are available as nonvolatile bits. During the reset sequence, the FOPT register is loaded
from the flash nonvolatile byte in the flash configuration field at global address 0xFF7E located in flash
memory.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
108
Freescale Semiconductor, Inc.
Chapter 5
Interrupt
5.1 Interrupts
Interrupts save the current CPU status and registers, execute an interrupt service routine
(ISR), and then restore the CPU status so that processing resumes where it left off before
the interrupt. Other than the software interrupt (SWI), which is a program instruction,
interrupts are caused by hardware events such as an edge on the IRQ pin or a timeroverflow event. The debug module can also generate an SWI under certain
circumstances.
If an event occurs in an enabled interrupt source, an associated read-only status flag will
be set. The CPU will not respond unless only the local interrupt enable is a logic 1. The I
bit in the CCR is 0 to allow interrupts. The global interrupt mask (I bit) in the CCR is
initially set after reset that masks (prevents) all maskable interrupt sources. The user
program initializes the stack pointer and performs other system setups before clearing the
I bit to allow the CPU to respond to interrupts.
When the CPU receives a qualified interrupt request, it completes the current instruction
before responding to the interrupt. The interrupt sequence obeys the same cycle-by-cycle
sequence as the SWI instruction and consists of:
• Saving the CPU registers on the stack.
• Setting the I bit in the CCR to mask further interrupts.
• Fetching the interrupt vector for the highest-priority interrupt that is currently
pending.
• Filling the instruction queue with the first three bytes of program information starting
from the address fetched from the interrupt vector locations.
While the CPU is responding to the interrupt, the I bit is automatically set to prevent
another interrupt from interrupting the ISR itself, which is called nesting of interrupts.
Normally, the I bit is restored to 0 when the CCR is restored from the value stacked on
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
109
Interrupts
entry to the ISR. In rare cases, the I bit may be cleared inside an ISR, after clearing the
status flag that generated the interrupt, so that other interrupts can be serviced without
waiting for the first service routine to finish. This practice is recommended only for the
most experienced programmers because it can lead to subtle program errors that are
difficult to debug.
The interrupt service routine ends with a return-from-interrupt (RTI) instruction that
restores the CCR, A, X, and PC registers to their pre-interrupt values by reading the
previously saved information off the stack.
Note
For compatibility with the M68HC08, the H register is not
automatically saved and restored. Push H onto the stack at the
start of the interrupt service routine (ISR) and restore it
immediately before the RTI that is used to return from the ISR.
When two or more interrupts are pending when the I bit is cleared, the highest priority
source is serviced first.
5.1.1 Interrupt stack frame
The following figure shows the contents and organization of a stack frame. Before the
interrupt, the stack pointer (SP) points at the next available byte location on the stack.
The current values of CPU registers are stored on the stack, starting with the low-order
byte of the program counter (PC) and ending with the CCR. After stacking, the SP points
at the next available location on the stack, which is the address that is one less than the
address where the CCR was saved. The PC value that is stacked is the address of the
instruction in the main program that would have executed next if the interrupt had not
occurred.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
110
Freescale Semiconductor, Inc.
Chapter 5 Interrupt
UNSTACKING
ORDER
TOWARD LOWER ADDRESSES
7
0
5
1
4
2
3
3
* X)
INDEX REGISTER (LOW BYTE
2
4
PROGRAM COUNTER HIGH
1
5
PROGRAM COUNTER LOW
CONDITION CODE REGISTER
SP AFTER
INTERRUPT STACKING
ACCUMULATOR
STACKING
ORDER
SP BEFORE
THE INTERRUPT
TOWARD HIGHER ADDRESSES
* High byte (H) of index register is not automatically stacked.
Figure 5-1. Interrupt stack frame
When an RTI instruction executes, these values are recovered from the stack in reverse
order. As part of the RTI sequence, the CPU fills the instruction pipeline by reading three
bytes of program information, starting from the PC address recovered from the stack.
The status flag causing the interrupt must be acknowledged (cleared) before returning
from the ISR. Typically, the flag must be cleared at the beginning of the ISR because if
another interrupt is generated by this source it will be registered so that it can be serviced
after completion of the current ISR.
5.1.2 Interrupt vectors, sources, and local masks
The following table provides a summary of all interrupt sources. High-priority sources
are located toward the bottom of the table. The high-order byte of the address for the
interrupt service routine is located at the first address in the vector address column, and
the low-order byte of the address for the interrupt service routine is located at the next
higher address.
When an interrupt condition occurs, an associated flag bit is set. If the associated local
interrupt enable is 1, an interrupt request is sent to the CPU. If the global interrupt mask
(I bit in the CCR) is 0, the CPU finishes the current instruction, stacks the PCL, PCH, X,
A, and CCR CPU registers, sets the I bit, and then fetches the interrupt vector for the
highest priority pending interrupt. Processing then continues in the interrupt service
routine.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
111
Interrupts
Table 5-1. Vector summary (from lowest to highest priority)
Vector number
Address (high/
low)
Vector name
Module
Source
Local enable
CCIF
39
0xFFB0:FFB1
Vnvm
NVM
DFDIF
Description
CCIE
NVM command
complete
interrupt
SFDIF
38
0xFFB2:FFB3
Unused
Unused
Unused
Unused
Unused
37
0xFFB4:FFB5
Vkeyboard0
KBI0
KBF
KBIE
Keyboard
interrupt 0
36
0xFFB6:FFB7
Unused
Unused
Unused
Unused
Unused
35
0xFFB8:FFB9
Vrtc
RTC
RTIF
RTIE
RTC overflow
34
0xFFBA:FFBB
Viic
IIC
IICIF
IICIE
IIC
33
0xFFBC:FFBD
Unused
Unused
Unused
Unused
Unused
SPRF
SPIE
SPI0 receive
MODF
SPIE
SPI0 mode fault
SPTEF
SPTIE
SPI0 transmit
SPMF
SPMIE
SPI0 match
32
0xFFBE:FFBF
Vspi0
SPI0
31
0xFFC0:FFC1
Unused
Unused
Unused
Unused
Unused
30
0xFFC2:FFC3
Unused
Unused
Unused
Unused
Unused
29
0xFFC4:FFC5
Unused
Unused
Unused
Unused
Unused
28
0xFFC6:FFC7
Vsci1tx
SCI1
TRDE
TIE
TC
TCIE
IDLE
ILIE
RDRF
RIE
LBKDIF
LBKDIE
RXEDGIF
RXEDGIE
OR
ORIE
NF
NEIE
FE
FEIE
PF
PEIE
TRDE
TIE
TC
TCIE
IDLE
ILIE
RDRF
RIE
LBKDIF
LBKDIE
RXEDGIF
RXEDGIE
OR
ORIE
NF
NEIE
FE
FEIE
PF
PEIE
27
26
25
24
23
0xFFC8:FFC9
0xFFCA:FFCB
0xFFCC:FFCD
0xFFCE:FFCF
0xFFD0:FFD1
Vsci1rx
Vsci1err
Vsci0tx
Vsci0rx
Vsci0err
SCI1
SCI1
SCI0
SCI0
SCI0
SCI1 transmit
SCI1 receive
SCI1 error
SCI0 transmit
SCI0 receive
SCI0 error
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
112
Freescale Semiconductor, Inc.
Chapter 5 Interrupt
Table 5-1. Vector summary (from lowest to highest priority) (continued)
Vector number
Address (high/
low)
Vector name
Module
Source
Local enable
Description
22
0xFFD2:FFD3
Vadc
ADC
COCO
AIEN
ADC conversion
complete
interrupt
21
0xFFD4:FFD5
Vacmp
ACMP
ACF
ACIE
Analog
comparator
interrupt
20
0xFFD6:FFD7
Unused
Unused
Unused
Unused
Unused
19
0xFFD8:FFD9
Vmtim0
MTIM0
TOF
TOIE
MTIM0 overflow
interrupt
18
0xFFDA:FFDB
Vftm0ovf
FTM0
TOF
TOIE
FTM0 overflow
17
0xFFDC:FFDD
Vftm0ch1
FTM0CH1
CH1F
CH1IE
FTM0 channel 1
16
0xFFDE:FFDF
Vftm0ch0
FTM0CH0
CH0F
CH0IE
FTM0 channel 0
15
0xFFE0:FFE1
Unused
Unused
Unused
Unused
Unused
14
0xFFE2:FFE3
Unused
Unused
Unused
Unused
Unused
13
0xFFE4:FFE5
Unused
Unused
Unused
Unused
Unused
12
0xFFE6:FFE7
Vftm2ovf
FTM2
TOF
TOIE
FTM2 overflow
11
0xFFE8:FFE9
Vftm2ch5
FTM2CH5
CH5F
CH5IE
FTM2 channel 5
10
0xFFEA:FFEB
Vftm2ch4
FTM2CH4
CH4F
CH4IE
FTM2 channel 4
9
0xFFEC:FFED
Vftm2ch3
FTM2CH3
CH3F
CH3IE
FTM2 channel 3
8
0xFFEE:FFEF
Vftm2ch2
FTM2CH2
CH2F
CH2IE
FTM2 channel 2
7
0xFFF0:FFF1
Vftm2ch1
FTM2CH1
CH1F
CH1IE
FTM2 channel 1
6
0xFFF2:FFF3
Vftm2ch0
FTM2CH0
CH0F
CH0IE
FTM2 channel 0
5
0xFFF4:FFF5
Vftm2fault
FTM2
FAULTF
FAULTIE
FTM2 fault
4
0xFFF6:FFF7
Vclk
ICS
LOLS
LOLIE
Clock loss of
lock
3
0xFFF8:FFF9
Vlvw
System control
LVWF
LVWIE
Low-voltage
warning
2
0xFFFA:FFFB
Vwdog
WDOG
WDOGF
WDOGI
WDOG timeout
Virq
IRQ
IRQF
IRQIE
IRQ interrupt
1
0xFFFC:FFFD
Vswi
Core
SWI Instruction
—
Software
interrupt
WDOGE
Watchdog timer
LVDRE
Low-voltage
detect
WDOG
LVD
RESET pin
0
0xFFFE:FFFF
Vreset
System control
Illegal opcode
Illegal address
POR
ICS
BDFR
RSTPE
—
—
—
—
External pin
Illegal opcode
Illegal address
Power-on-reset
CME
ICS loss of clk
reset
—
BDM force reset
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
113
Interrupts
5.1.3 Hardware nested interrupt
This device has interrupt priority controller (IPC) module to provide up to four-level
nested interrupt capability. IPC includes the following features:
• Four-level programmable interrupt priority for each interrupt source.
• Support for prioritized preemptive interrupt service routines
• Low-priority interrupt requests are blocked when high-priority interrupt service
routines are being serviced.
• Higher or equal priority level interrupt requests can preempt lower priority
interrupts being serviced.
• Automatic update of interrupt priority mask with being serviced interrupt source
priority level when the interrupt vector is being fetched.
• Interrupt priority mask can be modified during main flow or interrupt service
execution.
• Previous interrupt mask level is automatically stored when interrupt vector is fetched
(four levels of previous values accommodated)
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
114
Freescale Semiconductor, Inc.
Chapter 5 Interrupt
Inputs
Outputs
INTIN0
INTOUT0
+
v
ILR0[1:0]
INTIN1
INTOUT1
ILR1[1:0]
.
.
.
v
+
.
.
.
.
.
.
.
.
.
INTOUT47
INTIN47
ILR0
.
.
.
ILR47
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
ILR47[1:0]
Stop
1
+
v
ILR Register Content
CPU
0
00
IPCE
(IPC Enable)
DECODE
AND SHIFT
LOGIC
IPMPS
(Interrupt Priority Mask Pseudo Stack Register)
IPM
[1 :0]
[1:0]
[1:0]
[1:0]
[1:0]
Two bits are pushed during vector fetch
Two bits are pulled by
software (PULIPM = 1)
6
ADDRESS[5:0]
VFETCH
Figure 5-2. Interrupt priority controller block diagram
The IPC works with the existing HCS08 interrupt mechanism to allow nested interrupts
with programmable priority levels. This module also allows implementation of
preemptive interrupt according to the programmed interrupt priority with minimal
software overhead. The IPC consists of three major functional blocks:
• The interrupt priority level registers
• The interrupt priority level comparator set
• The interrupt mask register update and restore mechanism
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
115
Interrupts
5.1.3.1 Interrupt priority level register
This set of registers is associated with the interrupt sources to the HCS08 CPU. Each
interrupt priority level is a 2-bit value such that a user can program the interrupt priority
level of each source to priority 0, 1, 2, or 3. Level 3 has the highest priority while level 0
has the lowest. Software can read or write to these registers at any time. The interrupt
priority level comparator set, interrupt mask register update, and restore mechanism use
this information.
5.1.3.2 Interrupt priority level comparator set
When the module is enabled, an active interrupt request forces a comparison between the
corresponding ILR and the 2-bit interrupt mask IPM[1:0]. In stop3 mode, the IPM[1:0] is
substituted by value 00b. If the ILR value is greater than or equal to the value of the
interrupt priority mask (IPM bits in IPCSC), the corresponding interrupt out (INTOUT)
signal will be asserted and signals an interrupt request to the HCS08 CPU.
When the module is disabled, the interrupt request signal from the source is directly
passed to the CPU.
The interrupt priority level programmed in the interrupt priority register will not affect
the inherent interrupt priority arbitration as defined by the HCS08 CPU because the IPC
is an external module. Therefore, if two (or more) interrupts are present in the HCS08
CPU at the same time, the inherent priority in HCS08 CPU will perform arbitration by
the inherent interrupt priority.
5.1.3.3 Interrupt priority mask update and restore mechanism
The interrupt priority mask (IPM) is two bits located in the least significant end of IPCSC
register. These two bits control which interrupt is allowed to be presented to the HCS08
CPU. During vector fetch, the interrupt priority mask is updated automatically with the
value of the ILR corresponding to that interrupt source. The original value of the IPM
will be saved onto IPMPS for restoration after the interrupt service routine completes
execution. When the interrupt service routine completes execution, the user restore the
original value of IPM by writing 1 to the IPCSC[PULIPM] bit. In both cases, the IPMPS
is a shift register functioning as a pseudo stack register for storing the IPM. When the
IPM is updated, the original value is shifted into IPMPS. The IPMPS can store four levels
of IPM. If the last position of IPMPS is written, the PSF flag indicates that the IPMPS is
full. If all the values in the IPMPS were read, the PSE flag indicates that the IPMPS is
empty.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
116
Freescale Semiconductor, Inc.
Chapter 5 Interrupt
5.1.3.4 Integration and application of the IPC
All interrupt inputs that comes from peripheral modules are synchronous signals. None of
the asynchronous signals of the interrupts are routed to IPC. The asynchronous signals of
the interrupts are routed directly to SIM module to wake system clocks in stop3 mode.
Additional care must be exercised when IRQ is reprioritized by IPC. CPU instructions
BIL and BIH need input from IRQ pin. If IRQ interrupt is masked, BIL and BIH still
work but the IRQ interrupt will not occur.
• The interrupt priority controller must be enabled to function. While inside an
interrupt service routine, some work has to be done to enable other higher priority
interrupts. The following is a pseudo code example written in assembly language:
INT_SER :
BCLR
.
.
.
.
.
CLI
enabled
.
.
.
.
BSET
RTI
INTFLAG,INTFLAG_R ; clear flag that generate interrupt
; do the most critical part
; which it cannot be interrupted
; global interrupt enable and nested interrupt
; continue the less critical
PULIPM, PULIPM_R
; restore the old IPM value before leaving
; then you can return
• A minimum overhead of six bus clock cycles is added inside an interrupt services
routine to enable preemptive interrupts.
• As an interrupt of the same priority level is allowed to pass through IPC to HCS08
CPU, the flag generating the interrupt must be cleared before doing CLI to enable
preemptive interrupts.
• The IPM is automatically updated to the level the interrupt is servicing and the
original level is kept in IPMPS. Watch out for the full (PSF) bit if nesting for more
than four levels is expected.
• Before leaving the interrupt service routine, the previous levels must be restored
manually by setting PULIPM bit. Watch out for the full (PSF) bit and empty (PSE)
bit.
5.2 IRQ
The IRQ (external interrupt) module provides a maskable interrupt input.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
117
IRQ
5.2.1 Features
Features of the IRQ module include:
• A Dedicated External Interrupt Pin
• IRQ Interrupt Control Bits
• Programmable Edge-only or Edge and Level Interrupt Sensitivity
• Automatic Interrupt Acknowledge
• Internal pullup device
A low level applied to the external interrupt request (IRQ) pin can latch a CPU interrupt
request. The following figure shows the structure of the IRQ module:
IRQACK
RESET
SYNCHRONIZER
BUSCLK
VDD
1
IRQ
0
IRQF
D
S
CLR
Q
SYNCHRONIZER
CK
IRQPE
STOP
IRQEDG
To pullup enable logic for IRQ
IRQPDD
TO CPU FOR
BIL/BIH
INSTRUCTIONS
IRQMOD
STOP
BYPASS
IRQIE
TO INTERNAL
MODULES
WAKE-UP
INPUTS
IRQ
INTERRUPT
REQUEST
Figure 5-3. IRQ module block diagram
External interrupts are managed by the IRQSC status and control register. When the IRQ
function is enabled, synchronous logic monitors the pin for edge-only or edge-and-level
events. When the MCU is in stop mode and system clocks are shut down, a separate
asynchronous path is used so that the IRQ, if enabled, can wake the MCU.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
118
Freescale Semiconductor, Inc.
Chapter 5 Interrupt
5.2.1.1 Pin configuration options
The IRQ pin enable control bit (IRQSC[IRQPE]) must be 1 for the IRQ pin to act as the
IRQ input. The user can choose the polarity of edges or levels detected (IRQEDG),
whether the pin detects edges-only or edges and levels (IRQMOD), or whether an event
causes an interrupt or only sets the IRQF flag, which can be polled by software.
When enabled, the IRQ pin defaults to use an internal pullup device (IRQSC[IRQPDD] =
0). If the user uses an external pullup or pulldown, the IRQSC[IRQPDD] can be written
to a 1 to turn off the internal device.
BIH and BIL instructions may be used to detect the level on the IRQ pin when it is
configured to act as the IRQ input.
Note
This pin does not contain a clamp diode to VDD and must not be
driven above VDD. The voltage measured on the internally
pullup IRQ pin may be as low as VDD – 0.7 V. The internal
gates connected to this pin are pulled all the way to VDD.
When enabling the IRQ pin for use, the IRQF will be set, and
must be cleared prior to enabling the interrupt. When
configuring the pin for falling edge and level sensitivity in a 3
V system, it is necessary to wait at least cycles between
clearing the flag and enabling the interrupt.
5.2.1.2 Edge and level sensitivity
The IRQSC[IRQMOD] control bit reconfigures the detection logic so that it can detect
edge events and pin levels. In this detection mode, the IRQF status flag is set when an
edge is detected, if the IRQ pin changes from the de-asserted to the asserted level, but the
flag is continuously set and cannot be cleared as long as the IRQ pin remains at the
asserted level.
5.3 Interrupt pin request register
IRQ memory map
Absolute
address
(hex)
Register name
3B
Interrupt Pin Request Status and Control Register (IRQ_SC)
Width
Access
(in bits)
8
R/W
Reset value
Section/
page
00h
5.3.1/120
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
119
Interrupt pin request register
5.3.1 Interrupt Pin Request Status and Control Register (IRQ_SC)
This direct page register includes status and control bits, which are used to configure the
IRQ function, report status, and acknowledge IRQ events.
Address: 3Bh base + 0h offset = 3Bh
Bit
7
Read
0
Write
Reset
0
6
5
4
IRQPDD
IRQEDG
IRQPE
0
0
0
3
2
IRQF
0
IRQACK
0
0
1
0
IRQIE
IRQMOD
0
0
IRQ_SC field descriptions
Field
Description
7
Reserved
This field is reserved.
This read-only field is reserved and always has the value 0.
6
IRQPDD
Interrupt Request (IRQ) Pull Device Disable
This read/write control bit is used to disable the internal pullup device when the IRQ pin is enabled (IRQPE
= 1) allowing for an external device to be used.
0
1
5
IRQEDG
Interrupt Request (IRQ) Edge Select
This read/write control bit is used to select the polarity of edges or levels on the IRQ pin that cause IRQF
to be set. The IRQMOD control bit determines whether the IRQ pin is sensitive to both edges and levels or
only edges. When the IRQ pin is enabled as the IRQ input and is configured to detect rising edges, the
optional pullup resistor is disabled.
0
1
4
IRQPE
This read/write control bit enables the IRQ pin function. When this bit is set the IRQ pin can be used as an
interrupt request.
IRQ pin function is disabled.
IRQ pin function is enabled.
IRQ Flag
This read-only status bit indicates when an interrupt request event has occurred.
0
1
2
IRQACK
IRQ is falling edge or falling edge/low-level sensitive.
IRQ is rising edge or rising edge/high-level sensitive.
IRQ Pin Enable
0
1
3
IRQF
IRQ pull device enabled if IRQPE = 1.
IRQ pull device disabled if IRQPE = 1.
No IRQ request.
IRQ event detected.
IRQ Acknowledge
This write-only bit is used to acknowledge interrupt request events (write 1 to clear IRQF). Writing 0 has
no meaning or effect. Reads always return 0. If edge-and-level detection is selected (IRQMOD = 1), IRQF
cannot be cleared while the IRQ pin remains at its asserted level.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
120
Freescale Semiconductor, Inc.
Chapter 5 Interrupt
IRQ_SC field descriptions (continued)
Field
1
IRQIE
Description
IRQ Interrupt Enable
This read/write control bit determines whether IRQ events generate an interrupt request.
0
1
0
IRQMOD
Interrupt request when IRQF set is disabled (use polling).
Interrupt requested whenever IRQF = 1.
IRQ Detection Mode
This read/write control bit selects either edge-only detection or edge-and-level detection.
0
1
IRQ event on falling/rising edges only.
IRQ event on falling/rising edges and low/high levels.
5.4 Interrupt priority control register
IPC memory map
Absolute
address
(hex)
Register name
Width
Access
(in bits)
Reset value
Section/
page
3E
IPC Status and Control Register (IPC_SC)
8
R/W
20h
5.4.1/122
3F
Interrupt Priority Mask Pseudo Stack Register (IPC_IPMPS)
8
R
00h
5.4.2/123
3050
Interrupt Level Setting Registers n (IPC_ILRS0)
8
R/W
00h
5.4.3/123
3051
Interrupt Level Setting Registers n (IPC_ILRS1)
8
R/W
00h
5.4.3/123
3052
Interrupt Level Setting Registers n (IPC_ILRS2)
8
R/W
00h
5.4.3/123
3053
Interrupt Level Setting Registers n (IPC_ILRS3)
8
R/W
00h
5.4.3/123
3054
Interrupt Level Setting Registers n (IPC_ILRS4)
8
R/W
00h
5.4.3/123
3055
Interrupt Level Setting Registers n (IPC_ILRS5)
8
R/W
00h
5.4.3/123
3056
Interrupt Level Setting Registers n (IPC_ILRS6)
8
R/W
00h
5.4.3/123
3057
Interrupt Level Setting Registers n (IPC_ILRS7)
8
R/W
00h
5.4.3/123
3058
Interrupt Level Setting Registers n (IPC_ILRS8)
8
R/W
00h
5.4.3/123
3059
Interrupt Level Setting Registers n (IPC_ILRS9)
8
R/W
00h
5.4.3/123
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
121
Interrupt priority control register
5.4.1 IPC Status and Control Register (IPC_SC)
This register contains status and control bits for the IPC.
Address: 3Eh base + 0h offset = 3Eh
Bit
Read
Write
Reset
7
IPCE
0
6
5
4
3
2
0
PSE
PSF
0
0
1
IPM
PULIPM
0
1
0
0
0
0
0
0
IPC_SC field descriptions
Field
7
IPCE
Description
Interrupt Priority Controller Enable
This bit enables/disables the interrupt priority controller module.
0
1
6
Reserved
Disables IPCE. Interrupt generated from the interrupt source is passed directly to CPU without
processing (bypass mode). The IPMPS register is not updated when the module is disabled.
Enables IPCE and interrupt generated from the interrupt source is processed by IPC before passing to
CPU.
This field is reserved.
This read-only field is reserved and always has the value 0.
5
PSE
Pseudo Stack Empty
4
PSF
Pseudo Stack Full
This bit indicates that the pseudo stack has no valid information. This bit is automatically updated after
each IPMPS register push or pull operation.
This bit indicates that the pseudo stack register IPMPS register is full. It is automatically updated after
each IPMPS register push or pull operation. If additional interrupt is nested after this bit is set, the earliest
interrupt mask value(IPM0[1:0]) stacked in IPMPS will be lost.
0
1
3
PULIPM
Pull IPM from IPMPS
This bit pulls stacked IPM value from IPMPS register to IPM bits of IPCSC. Zeros are shifted into bit
positions 1 and 0 of IPMPS.
0
1
2
Reserved
IPM
IPMPS register is not full.
IPMPS register is full.
No operation.
Writing 1 to this bit causes a 2-bit value from the interrupt priority mask pseudo stack register to be
pulled to the IPM bits of IPCSC to restore the previous IPM value.
This field is reserved.
This read-only field is reserved and always has the value 0.
Interrupt Priority Mask
This field sets the mask for the interrupt priority control. If the interrupt priority controller is enabled, the
interrupt source with an interrupt level (ILRxx) value that is greater than or equal to the value of IPM will be
presented to the CPU. Writes to this field are allowed, but doing this will not push information to the
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
122
Freescale Semiconductor, Inc.
Chapter 5 Interrupt
IPC_SC field descriptions (continued)
Field
Description
IPMPS register. Writing IPM with PULIPM setting when IPCE is already set, the IPM will restore the value
pulled from the IPMPS register, not the value written to the IPM register.
5.4.2 Interrupt Priority Mask Pseudo Stack Register (IPC_IPMPS)
This register is used to store the previous interrupt priority mask level temporarily when
the currently active interrupt is executed.
Address: 3Eh base + 1h offset = 3Fh
Bit
7
Read
6
5
IPM3
4
3
IPM2
2
1
IPM1
0
IPM0
Write
Reset
0
0
0
0
0
0
0
0
IPC_IPMPS field descriptions
Field
Description
7–6
IPM3
Interrupt Priority Mask pseudo stack position 3
5–4
IPM2
Interrupt Priority Mask pseudo stack position 2
3–2
IPM1
Interrupt Priority Mask pseudo stack position 1
IPM0
Interrupt Priority Mask pseudo stack position 0
This field is the pseudo stack register for IPM3. The most recent information is stored in IPM3.
This field is the pseudo stack register for IPM2. The most recent information is stored in IPM2.
This field is the pseudo stack register for IPM1. The most recent information is stored in IPM1.
This field is the pseudo stack register for IPM0. The most recent information is stored in IPM0.
5.4.3 Interrupt Level Setting Registers n (IPC_ILRSn)
This set of registers (ILRS0-ILRS9) contains the user specified interrupt level for each
interrupt source, and indicates the number of the register (ILRSn is ILRS0 through
ILRS9).
Address: 3Eh base + 3012h offset + (1d × i), where i=0d to 9d
Bit
Read
Write
Reset
7
6
5
ILRn3
0
4
3
ILRn2
0
0
2
1
ILRn1
0
0
0
ILRn0
0
0
0
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
123
Interrupt priority control register
IPC_ILRSn field descriptions
Field
Description
7–6
ILRn3
Interrupt Level Register for Source n*4+3
5–4
ILRn2
Interrupt Level Register for Source n*4+2
3–2
ILRn1
Interrupt Level Register for Source n*4+1
ILRn0
Interrupt Level Register for Source n*4+0
This field sets the interrupt level for interrupt source n*4+3.
This field sets the interrupt level for interrupt source n*4+2.
This field sets the interrupt level for interrupt source n*4+1.
This field sets the interrupt level for interrupt source n*4+0.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
124
Freescale Semiconductor, Inc.
Chapter 6
System control
6.1 System device identification (SDID)
This device is hard coded to the value 0x0042 in SDID registers.
6.2 Universally unique identification (UUID)
This device contains up to 64-bit UUID to identify each device in this family. The intent
of UUID is to enable distributed systems to uniquely identify information without
significant central coordination.
6.3 Reset and system initialization
Resetting the MCU provides a way to start processing from a set of known initial
conditions. During reset, most control and status registers are forced to initial values and
the program counter is loaded from the reset vector (0xFFFE:0xFFFF). On-chip
peripheral modules are disabled and I/O pins are initially configured as general-purpose
high-impedance inputs with disabled pullup devices. The CCR[I] bit is set to block
maskable interrupts so that the user program has a chance to initialize the stack pointer
(SP) and system control settings. SP is forced to 0x00FF at reset.
This device has the following sources for reset:
• Power-on reset (POR)
• Low-voltage detect (LVD)
• Watchdog (WDOG) timer
• Illegal opcode detect (ILOP)
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
125
System options
• Illegal address detect (ILAD)
• Background debug forced reset
• External reset pin (RESET)
• Internal clock source module reset (CLK)
Each of these sources, with the exception of the background debug forced reset, has an
associated bit in the system reset status (SRS) register.
When the MCU is reset by ILAD, the address of illegal address is captured in illegal
address register, which is a 16-bit register consisting of ILLAL and ILLAH that contains
the LSB and MSB 8-bit of the address, respectively.
6.4 System options
6.4.1 BKGD pin enable
After POR, PTA4/ACMPO/BKGD/MS pin functions as BKGD output. The
SYS_SOPT1[BKGDPE] bit must be set to enable the background debug mode pin enable
function. When this bit is clear, this pin can function as PTA4 or ACMP output.
6.4.2 RESET pin enable
After POR reset, PTA5/IRQ/TCLK0/RESET functions as RESET. The
SYS_SOPT1[RSTPE] bit must be set to enable the reset functions. When this bit is clear,
this pin can function as PTA5, IRQ, or TCLK0.
6.4.3 SCI0 pin reassignment
After reset, SCI0 module pinouts of RxD and TxD are mapped on PTB0 and PTB1,
respectively. SYS_SOPT1[SCI0PS] bit enables to reassign SCI0 pinouts on PTA2 and
PTA3.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
126
Freescale Semiconductor, Inc.
Chapter 6 System control
6.4.4 SPI0 pin reassignment
After reset, SPI0 module pinouts of SPSCK0, MOSI0, MISO0, and SS0 are mapped on
PTB2, PTB3, PTB4, and PTB5. SYS_SOPT1[SPI0PS] bit enables to reassign the SPI0
pinouts on PTE0, PTE1, PTE2, and PTB5 respectively.
6.4.5 IIC pins reassignments
After POR reset, IIC module pinouts of SDA and SCL are mapped on PTA2 and PTA3.
SYS_SOPT1[IICPS] bit enables to reassign the IIC pinout pair on PTB6 and PTB7
respectively. Please note the PTA2 and PTA3 operate as true open drain, which can
support different level IIC communication. When PTB6 and PTB7 act as IIC pins, the
remote IIC level is limited to no more than MCU VDD.
6.4.6 FTM0 channels pin reassignment
After reset, FTM0 channels pinouts of FTM0CH0 and FTM0CH1 are mapped on PTA0
and PTA1, respectively. SOPT3[FTM0PS] bit enables to reassign FTM0 channels
pinouts on PTC4 and PTC5.
6.4.7 FTM2 channels pin reassignment
After POR reset, FTM2 channel pinouts of FTM2CH2, and FTM2CH3 are default
mapped on PTC2, and PTC3. When set, SYS_SOPT1[FTM2PS] bit enables to
reassignment these FTM2 channels on PTD0, and PTD1, respectively. As PTD0, PTD1,
PTB4, and PTB5 can provide up to 20 mA sink/source current, up to 4 FTM2 channels
can provide high current with the same time base when this bit is set.
6.4.8 Bus clock output pin enable
The system bus clock can be outputted on PTE3 when the SYS_SOPT3[CLKOE] bits are
set by nonzero. Before mapping on the pinout, the output of bus clock can be pre-divided
by 1, 2, 4, 8, 16, 32, 64, or 128 by setting SYS_SOPT3[BUSREF].
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
127
System interconnection
6.5 System interconnection
This device contains a set of system-level logics for module-to-module interconnection
for flexible configuration. These interconnections provide the hardware trigger function
between modules with least software configuration, which is ideal for infrared
communication, serial communication baudrate detection, low-end motor control,
metering clock calibration, and other general-purpose applications.
RXDFE
+
RTC
ovf
1
ADC trg
00
01
10
11
ovf
MTIM0
SCI0
FTM0
–
0
rxd
txd
RxD0
0
TxD0
1
ch0
ch1
ACMP
1
0
0
ovf
ICSCLK
ADHWT
DELAY
÷2N
BUSREF
1
FTM0CH1
inittrg
fault0
matchtrg fault1
fault2
FTM2 fault3
trigger0
trigger1
trigger2
FTMSYNC
FTM2FAULT1
FTM2FAULT2
RXDCE
TXDME
CLKOE
BUSOUT
Figure 6-1. System interconnection diagram
6.5.1 SCI0 TxD modulation
SCI0 TXD can be modulated by FTM0 channel 0 output. When SYS_SOPT2[TXDME]
bit is set, the TXD output is passed to an AND gate with FTM0 channel 0 output before
mapping on TXD0 pinout. When this bit is clear, the TXD is directly mapped on the
pinout. To enable IR modulation function, both FTM0CH0 and SCI must be active. The
FTM0 counter modulo register specifies the period of the PWM, and the FTM0 channel 0
value register specifies the duty cycle of the PWM. Then, when TXDME bit is enabled,
each data transmitted via TXD0 from SCI0 is modulated by the FTM0 channel 0 output,
and the FTM0CH0 pin is released to other shared functions regardless of the
configuration of FTM0 pin reassignment.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
128
Freescale Semiconductor, Inc.
Chapter 6 System control
TXD0
SCI0
0
PTB1/KBI0P5/TXD0/ADP5
1
FTM0CH0
PORT LOGIC
TXDME
Figure 6-2. IR modulation diagram
6.5.2 SCI0 RxD capture
RxD0 pin is selectable connected to SCI0 module directly or tagged to FTM0 channel 1.
When SYS_SOPT2[RXDCE] bit is set, the RxD0 pin is connected to both SCI0 and
FTM0 channel 1, and the FTM0CH1 pin is released to other shared functions regardless
of the configuration of FTM0 pin reassignment. When this bit is clear, the RxD0 pin is
connected to SCI0 only.
RxD0
RxD0
SCI0
FTM0 CH1
RXDCE
Figure 6-3. RxD0 capture function diagram
6.5.3 SCI0 RxD filter
When SYS_SOPT2[RXDFE] bit is clear, the RxD0 pin is connected to SCI0 module
directly. When this bit is set, the ACMP output is connected to the receive channel of
SCI0. To enable RxD filter function, both SCI0 and ACMP must be active. If this
function is active, the SCI0 external RxD0 pin is released to other shared functions
regardless of the configuration of SCI0 pin reassignment. When SCI0 RxD capture
function is active, the ACMP output is injected to FTM0CH1 as well.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
129
System interconnection
RXD0
SCI0
0
1
ACMP0
ACMP1
+
To SCI0 RxD
Capture Function
RXDFE
From Internal or External
Reference Voltage
Figure 6-4. IR demodulation diagram
6.5.4 FTM2 software synchronization
FTM2 contains three synchronization input trigger, one of which is a software trigger by
writing 1 to the SYS_SOPT2[FTMSYNC] bit. Writing 0 to this bit takes no effect. This
bit is always read 0.
6.5.5 ADC hardware trigger
ADC module may initiate a conversion via a hardware trigger. MTIM0 overflow, RTC,
FTM2 match trigger with 8-bit programmable delay, and FTM2 init trigger with 8-bit
programmable delay can be enabled as the hardware trigger for the ADC module by
setting the SYS_SOPT2[ADHWT] bits. The following table shows the ADC hardware
trigger setting.
Table 6-1. ADC hardware trigger setting
ADHWT
ADC hardware trigger
0:0
RTC overflow
0:1
MTIM0 overflow
1:0
FTM2 init trigger with 8-bit programmable delay
1:1
FTM2 match trigger with 8-bit programmable delay
When ADC hardware trigger selects the output of FTM2 triggers, an 8-bit delay block
will be enabled. This logic delays any trigger from FTM2 with an 8-bit counter whose
value is specified by SYS_SOPT4[DELAY] bit. The reference clock to this module is the
output of ICSCLK with selectable pre-divider specified by SYS_SOPT3[BUSREF].
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
130
Freescale Semiconductor, Inc.
Chapter 6 System control
6.6 System Control Registers
SYS memory map
Absolute
address
(hex)
Register name
Width
Access
(in bits)
Reset value
Section/
page
3000
System Reset Status Register (SYS_SRS)
8
R
82h
6.6.1/131
3001
System Background Debug Force Reset Register
(SYS_SBDFR)
8
W
(always
reads 0)
00h
6.6.2/133
3002
System Device Identification Register: High (SYS_SDIDH)
8
R
00h
6.6.3/134
3003
System Device Identification Register: Low (SYS_SDIDL)
8
R
42h
6.6.4/134
3004
System Options Register 1 (SYS_SOPT1)
8
R/W
0Ch
6.6.5/135
3005
System Options Register 2 (SYS_SOPT2)
8
R/W
00h
6.6.6/136
3006
System Options Register 3 (SYS_SOPT3)
8
R/W
00h
6.6.7/137
3007
System Options Register 4 (SYS_SOPT4)
8
R/W
00h
6.6.8/138
304A
Illegal Address Register: High (SYS_ILLAH)
8
R
Undefined
6.6.9/139
304B
Illegal Address Register: Low (SYS_ILLAL)
8
R
Undefined
6.6.10/139
30F8
Universally Unique Identifier Register 1 (SYS_UUID1)
8
R
Undefined
6.6.11/140
30F9
Universally Unique Identifier Register 2 (SYS_UUID2)
8
R
Undefined
6.6.12/140
30FA
Universally Unique Identifier Register 3 (SYS_UUID3)
8
R
Undefined
6.6.13/141
30FB
Universally Unique Identifier Register 4 (SYS_UUID4)
8
R
Undefined
6.6.14/141
30FC
Universally Unique Identifier Register 5 (SYS_UUID5)
8
R
Undefined
6.6.15/142
30FD
Universally Unique Identifier Register 6 (SYS_UUID6)
8
R
Undefined
6.6.16/142
30FE
Universally Unique Identifier Register 7 (SYS_UUID7)
8
R
Undefined
6.6.17/143
30FF
Universally Unique Identifier Register 8 (SYS_UUID8)
8
R
Undefined
6.6.18/143
6.6.1 System Reset Status Register (SYS_SRS)
This register includes read-only status flags to indicate the source of the most recent
reset. When a debug host forces reset by writing 1 to the SYS_SBDFR[BDFR] bit, none
of the status bits in SRS will be set. The reset state of these bits depends on what caused
the MCU to reset.
NOTE
For PIN, WDOG, and ILOP, any of these reset sources that are
active at the time of reset (not including POR or LVR) will
cause the corresponding bit(s) to be set; bits corresponding to
sources that are not active at the time of reset will be cleared.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
131
System Control Registers
NOTE
The RESET values in the figure are values for power on reset;
for other resets, the values depend on the trigger causes.
Address: 3000h base + 0h offset = 3000h
Bit
Read
7
6
5
4
3
2
1
0
POR
PIN
WDOG
ILOP
ILAD
LOC
LVD
0
1
0
0
0
0
0
1
0
Write
Reset
SYS_SRS field descriptions
Field
7
POR
Description
Power-On Reset
Reset was caused by the power-on detection logic. When the internal supply voltage was ramping up at
the time, the low-voltage reset (LVR) status bit is also set to indicate that the reset occurred while the
internal supply was below the LVR threshold.
NOTE: This bit POR to 1, LVR to uncertain value and reset to 0 at any other conditions.
0
1
6
PIN
External Reset Pin
Reset was caused by an active low level on the external reset pin.
0
1
5
WDOG
Reset was caused by the WDOG timer timing out. This reset source may be blocked by WDOGE = 0.
Reset was caused by an attempt to execute an unimplemented or illegal opcode. The STOP instruction is
considered illegal if stop is disabled by STOPE = 0 in the SOPT register. The BGND instruction is
considered illegal if active background mode is disabled by ENBDM = 0 in the BDCSC register.
Reset not caused by an illegal opcode.
Reset caused by an illegal opcode.
Illegal Address
Reset was caused by an attempt to access a illegal address. The illegal address is captured in illegal
address register (ILLAH:ILLAL).
0
1
2
LOC
Reset not caused by WDOG timeout.
Reset caused by WDOG timeout.
Illegal Opcode
0
1
3
ILAD
Reset not caused by external reset pin.
Reset came from external reset pin.
Watchdog (WDOG)
0
1
4
ILOP
Reset not caused by POR.
POR caused reset.
Reset not caused by an illegal address.
Reset caused by an illegal address.
Internal Clock Source Module Reset
Reset was caused by an ICS module reset.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
132
Freescale Semiconductor, Inc.
Chapter 6 System control
SYS_SRS field descriptions (continued)
Field
Description
0
1
1
LVD
Reset not caused by ICS module.
Reset caused by ICS module.
Low Voltage Detect
If the LVDRE bit is set in run mode or both LVDRE and LVDSE bits are set in stop mode, and the supply
drops below the LVD trip voltage, an LVD reset will occur. This bit is also set by POR.
NOTE: This bit reset to 1 on POR and LVR and reset to 0 on other reset.
0
1
0
Reserved
Reset not caused by LVD trip or POR.
Reset caused by LVD trip or POR.
This field is reserved.
This read-only field is reserved and always has the value 0.
6.6.2 System Background Debug Force Reset Register (SYS_SBDFR)
This register contains a single write-only control bit. A serial background command such
as WRITE_BYTE must be used to write to SYS_SBDFR. Attempts to write this register
from a user program are ignored. Reads always return 0x00.
NOTE
This register is the same as the BDC_SBDFR.
Address: 3000h base + 1h offset = 3001h
Bit
7
6
5
Read
4
3
2
1
0
0
Write
Reset
0
BDFR
0
0
0
0
0
0
0
0
SYS_SBDFR field descriptions
Field
7–1
Reserved
0
BDFR
Description
This field is reserved.
This read-only field is reserved and always has the value 0.
Background Debug Force Reset
A serial background command such as WRITE_BYTE may be used to allow an external debug host to
force a target system reset. Writing logic 1 to this bit forces an MCU reset. This bit cannot be written from
a user program.
NOTE: BDFR is writable only through serial background debug commands, not from user programs.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
133
System Control Registers
6.6.3 System Device Identification Register: High (SYS_SDIDH)
This read-only register, together with SYS_SDIDL, is included so that host development
systems can identify the HCS08 derivative and revision number. This allows the
development software to recognize where specific memory blocks, registers, and control
bits are located in a target MCU.
Address: 3000h base + 2h offset = 3002h
Bit
7
6
Read
4
3
2
0
0
1
0
0
0
ID
Reserved
Write
Reset
5
0
0
0
0
SYS_SDIDH field descriptions
Field
7–4
Reserved
ID
Description
This field is reserved.
Part Identification Number
These bits, together with the SYS_SDIDL, indicate part identification number. Each derivative in the
HCS08 family has a unique identification number. This device is hard coded to the value 0x42.
6.6.4 System Device Identification Register: Low (SYS_SDIDL)
This read-only register, together with SYS_SDIDH, is included so host development
systems can identify the HCS08 derivative and revision number. This allows the
development software to recognize where specific memory blocks, registers, and control
bits are located in a target MCU.
Address: 3000h base + 3h offset = 3003h
Bit
7
6
5
4
Read
3
2
1
0
0
0
1
0
ID
Write
Reset
0
1
0
0
SYS_SDIDL field descriptions
Field
ID
Description
Part Identification Number
These bits, together with the SYS_SDIDH, indicate part identification number. Each derivative in the
HCS08 family has a unique identification number. This device is hard coded to the value 0x42.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
134
Freescale Semiconductor, Inc.
Chapter 6 System control
6.6.5 System Options Register 1 (SYS_SOPT1)
Address: 3000h base + 4h offset = 3004h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
SCI0PS
SPI0PS
IICPS
FTM2PS
BKGDPE
RSTPE
FWAKE
STOPE
0
0
0
0
1
1
0
0
SYS_SOPT1 field descriptions
Field
7
SCI0PS
Description
SCI0 Pin Select
This write-once bit selects the SCI0 pinouts.
0
1
6
SPI0PS
SPI0 Pin Select
This write-once bit selects the SPI0 Pinouts.
0
1
5
IICPS
This write-once bit selects the IIC port pins.
This write-once bit selects the FTM2 channels port pins.
FTM2 channels mapped on PTC0, PTC1, PTC2, PTC3, PTB4, and PTB5.
FTM2 channels mapped on PTC0, PTC1, PTD0, PTD1, PTB4, and PTB5.
Background Debug Mode Pin Enable
This write-once bit when set enables the PTA4/ACMPO/BKGD/MS pin to function as BKGD/MS. When
clear, the pin functions as output only PTA4. This pin defaults to the BKGD/MS function following any
MCU reset.
0
1
2
RSTPE
IIC SCL and SDA are mapped on PTA3 and PTA2, respectively.
IIC SCL and SDA are mapped on PTB7 and PTB6, respectively.
FTM2 Port Pin Select
0
1
3
BKGDPE
SPI0 SPSCK0, MOSI0, MISO0, and SS0 are mapped on PTB2, PTB3, PTB4, and PTB5.
SPI0 SPSCK0, MOSI0, MISO0, and SS0 are mapped on PTE0, PTE1, PTE2, and PTB5.
IIC Port Pin Select
0
1
4
FTM2PS
SCI0 RxD and TxD are mapped on PTB0 and PTB1.
SCI0 RxD and TxD are mapped on PTA2 and PTA3.
PTA4/ACMPO/BKGD/MS as PTA4 or ACMPO function.
PTA4/ACMPO/BKGD/MS as BKGD function.
RESET Pin Enable
This write-once bit can be written after any reset. When RSTPE is set, the PTA5/IRQ/TCLK0/RESET pin
functions as RESET. When clear, the pin functions as one of its alternative functions. This pin defaults to
RESET following an MCU POR. Other resets will not affect this bit. When RSTPE is set, an internal pullup
device on RESET is enabled.
0
1
PTA5/IRQ/TCLK0/RESET pin functions as PTA5, IRQ, or TCLK0.
PTA5/IRQ/TCLK0/RESET pin functions as RESET.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
135
System Control Registers
SYS_SOPT1 field descriptions (continued)
Field
1
FWAKE
Description
Fast Wakeup Enable
This write once bit can set CPU wakeup without any interrupt subroutine serviced. This action saved more
than 11 cycles(whole interrupt subroutine time). After wake up CPU continue the address before wait or
stop.
NOTE: When FWAKE is set, user should avoid generating interrupt 0~8 bus clock cycles after issuing
the stop instruction, or the MCU may stuck at stop3 mode and cannot wake up by interrupts.
0
1
0
STOPE
CPU wakes up as normal.
CPU wakes up without any interrupt subroutine serviced.
Stop Mode Enable
This write-once bit defaults to 0 after reset, which disables stop mode. If stop mode is disabled and a user
program attempts to execute a STOP instruction, an illegal opcode reset occurs.
0
1
Stop mode disabled.
Stop mode enabled.
6.6.6 System Options Register 2 (SYS_SOPT2)
This register may be read/write at any time. SYS_SOPT2 should be written during the
user's reset initialization program to set the desired controls even if the desired settings
are the same as the reset settings.
Address: 3000h base + 5h offset = 3005h
Bit
Read
Write
Reset
7
6
TXDME
0
0
FTMSYNC
5
4
RXDFE
RXDCE
0
0
0
3
2
1
0
0
0
ADHWTS
0
0
0
SYS_SOPT2 field descriptions
Field
7
TXDME
Description
SCI0 TxD Modulation Select
This bit enables the SCI0 TxD output modulated by FTM0 channel 0.
0
1
6
FTMSYNC
TxD0 output is connected to pinout directly.
TxD0 output is modulated by FTM0 channel 0 before mapped to pinout.
FTM2 Synchronization Select
Writing a 1 to this bit generates a PWM synchronization trigger to the FTM modules.
0
1
No synchronization triggered.
Generate a PWM synchronization trigger to the FTM2 modules.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
136
Freescale Semiconductor, Inc.
Chapter 6 System control
SYS_SOPT2 field descriptions (continued)
Field
5
RXDFE
Description
SCI0 RxD Filter Select
This bit enables the SCI0 RxD input filtered by ACMP. When this function is enabled, any signal tagged
with ACMP inputs can be regarded SCI0.
0
1
4
RXDCE
RXD0 input signal is connected to SCI0 module directly.
RXD0 input signal is filtered by ACMP, then injected to SCI0.
SCI0 RxD Capture Select
This bit enables the SCI0 RxD is captured by FTM0 channel 1.
0
1
RXD0 input signal is connected to SCI0 module only.
RXD0 input signal is connected to SCI0 module and FTM0 channel 1.
3–2
Reserved
This field is reserved.
This read-only field is reserved and always has the value 0.
ADHWTS
ADC Hardware Trigger Source
These bits select the ADC hardware trigger source. All trigger sources start ADC conversion on rising
edge.
00
01
10
11
RTC overflow as the ADC hardware trigger.
MTIM0 overflow as the ADC hardware trigger.
FTM2 init trigger with 8-bit programmable delay.
FTM2 match trigger with 8-bit programmable delay.
6.6.7 System Options Register 3 (SYS_SOPT3)
This register may be read and written at any time.
Address: 3000h base + 6h offset = 3006h
Bit
Read
7
6
DLYACT
Write
Reset
0
5
4
0
FTM0PS
0
0
3
2
CLKOE
0
0
1
0
BUSREF
0
0
0
SYS_SOPT3 field descriptions
Field
7
DLYACT
Description
FTM2 Trigger Delay Active
This read-only bit specifies the status if the FTM2 initial or match delay is active. This bit is set when an
FTM2 trigger arrives and the delay counter is ticking. Otherwise, this bit will be clear.
0
1
The delay inactive.
The delay active.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
137
System Control Registers
SYS_SOPT3 field descriptions (continued)
Field
6
FTM0PS
Description
FTM0 Pin Select
This write-once bit selects the FTM0 Pinouts.
0
1
5–4
Reserved
3
CLKOE
This field is reserved.
This read-only field is reserved and always has the value 0.
CLK Output Enable
This bit enables reference clock output on PTE3
0
1
BUSREF
FTM0CH0 and FTM0CH1 are mapped on PTA0 and PTA1.
FTM0CH0 and FTM0CH1 are mapped on PTC4 and PTC5.
ICSCLK output disabled on PTE3.
ICSCLK output enabled on PTE3.
BUS Output select
This bit enables bus clock output on PTE3 via an optional prescalar.
000
001
010
011
100
101
110
111
Bus.
Bus divided by 2.
Bus divided by 4.
Bus divided by 8.
Bus divided by 16.
Bus divided by 32.
Bus divided by 64.
Bus divided by 128.
6.6.8 System Options Register 4 (SYS_SOPT4)
Address: 3000h base + 7h offset = 3007h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
DELAY
0
0
0
0
SYS_SOPT4 field descriptions
Field
DELAY
Description
FTM2 Trigger Delay
These bits specify the delay from FTM2 initial or match trigger to ADC hardware trigger upon the setting of
ADHWT. The 8-bit modulo value allows the delay from 0 to 255 upon the BUSREF clock settings. This is a
one-shot counter that starts ticking when the trigger arrives and stop ticking when the counter value
reaches the modulo value that is defined.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
138
Freescale Semiconductor, Inc.
Chapter 6 System control
6.6.9 Illegal Address Register: High (SYS_ILLAH)
The SYS_ILLAH is a read-only register containing the high 8-bit of the illegal address of
ILAD reset.
Address: 3000h base + 4Ah offset = 304Ah
Bit
7
6
5
4
Read
3
2
1
0
x*
x*
x*
x*
ADDR[15:8]
Write
Reset
x*
x*
x*
x*
* Notes:
• x = Undefined at reset.
SYS_ILLAH field descriptions
Field
ADDR[15:8]
Description
High 8-bit of illegal address
NOTE: For ILAD, it reset to the high 8-bit of the illegal address; in other cases, the reset to values are
undetermined.
6.6.10 Illegal Address Register: Low (SYS_ILLAL)
The SYS_ILLAL is a read-only register containing the low 8-bit of the illegal address of
ILAD reset.
Address: 3000h base + 4Bh offset = 304Bh
Bit
7
6
5
4
Read
3
2
1
0
x*
x*
x*
x*
ADDR[7:0]
Write
Reset
x*
x*
x*
x*
* Notes:
• x = Undefined at reset.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
139
System Control Registers
SYS_ILLAL field descriptions
Field
ADDR[7:0]
Description
Low 8-bit of illegal address
NOTE: For ILAD, it resets to the low 8-bit of the illegal address; in other cases, the reset to values are
undetermined.
6.6.11 Universally Unique Identifier Register 1 (SYS_UUID1)
The read-only SYS_UUIDx registers contain a series of 64-bit number to identify the
unique device in the family.
Address: 3000h base + F8h offset = 30F8h
Bit
7
6
5
4
Read
3
2
1
0
x*
x*
x*
x*
ID[63:56]
Write
Reset
x*
x*
x*
x*
* Notes:
• x = Undefined at reset.
SYS_UUID1 field descriptions
Field
ID[63:56]
Description
Universally Unique Identifier
6.6.12 Universally Unique Identifier Register 2 (SYS_UUID2)
The read-only SYS_UUIDx registers contain a series of 63-bit number to identify the
unique device in the family.
Address: 3000h base + F9h offset = 30F9h
Bit
7
6
5
4
Read
3
2
1
0
x*
x*
x*
x*
ID[55:48]
Write
Reset
x*
x*
x*
x*
* Notes:
• x = Undefined at reset.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
140
Freescale Semiconductor, Inc.
Chapter 6 System control
SYS_UUID2 field descriptions
Field
ID[55:48]
Description
Universally Unique Identifier
6.6.13 Universally Unique Identifier Register 3 (SYS_UUID3)
The read-only SYS_UUIDx registers contain a series of 63-bit number to identify the
unique device in the family.
Address: 3000h base + FAh offset = 30FAh
Bit
7
6
5
4
Read
3
2
1
0
x*
x*
x*
x*
ID[47:40]
Write
Reset
x*
x*
x*
x*
* Notes:
• x = Undefined at reset.
SYS_UUID3 field descriptions
Field
ID[47:40]
Description
Universally Unique Identifier
6.6.14 Universally Unique Identifier Register 4 (SYS_UUID4)
The read-only SYS_UUIDx registers contain a series of 63-bit number to identify the
unique device in the family.
Address: 3000h base + FBh offset = 30FBh
Bit
7
6
5
4
Read
3
2
1
0
x*
x*
x*
x*
ID[39:32]
Write
Reset
x*
x*
x*
x*
* Notes:
• x = Undefined at reset.
SYS_UUID4 field descriptions
Field
ID[39:32]
Description
Universally Unique Identifier
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
141
System Control Registers
6.6.15 Universally Unique Identifier Register 5 (SYS_UUID5)
The read-only SYS_UUIDx registers contain a series of 64-bit number to identify the
unique device in the family.
Address: 3000h base + FCh offset = 30FCh
Bit
7
6
5
4
Read
3
2
1
0
x*
x*
x*
x*
ID[31:24]
Write
Reset
x*
x*
x*
x*
* Notes:
• x = Undefined at reset.
SYS_UUID5 field descriptions
Field
ID[31:24]
Description
Universally Unique Identifier
6.6.16 Universally Unique Identifier Register 6 (SYS_UUID6)
The read-only SYS_UUIDx registers contain a series of 64-bit number to identify the
unique device in the family.
Address: 3000h base + FDh offset = 30FDh
Bit
7
6
5
4
Read
3
2
1
0
x*
x*
x*
x*
ID[23:16]
Write
Reset
x*
x*
x*
x*
* Notes:
• x = Undefined at reset.
SYS_UUID6 field descriptions
Field
ID[23:16]
Description
Universally Unique Identifier
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
142
Freescale Semiconductor, Inc.
Chapter 6 System control
6.6.17 Universally Unique Identifier Register 7 (SYS_UUID7)
The read-only SYS_UUIDx registers contain a series of 64-bit number to identify the
unique device in the family.
Address: 3000h base + FEh offset = 30FEh
Bit
7
6
5
4
Read
3
2
1
0
x*
x*
x*
x*
ID[15:8]
Write
Reset
x*
x*
x*
x*
* Notes:
• x = Undefined at reset.
SYS_UUID7 field descriptions
Field
ID[15:8]
Description
Universally Unique Identifier
6.6.18 Universally Unique Identifier Register 8 (SYS_UUID8)
The read-only SYS_UUIDx registers contain a series of 64-bit number to identify the
unique device in the family.
Address: 3000h base + FFh offset = 30FFh
Bit
7
6
5
4
Read
3
2
1
0
x*
x*
x*
x*
ID[7:0]
Write
Reset
x*
x*
x*
x*
* Notes:
• x = Undefined at reset.
SYS_UUID8 field descriptions
Field
ID[7:0]
Description
Universally Unique Identifier
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
143
System Control Registers
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
144
Freescale Semiconductor, Inc.
Chapter 7
Parallel input/output
7.1 Introduction
This device has five sets of I/O ports, which include up to 37 general-purpose I/O pins.
Not all pins are available on all devices. See Table 2-1 to determine which functions are
available for a specific device.
Many of the I/O pins are shared with on-chip peripheral functions, as shown in Table 2-1.
The peripheral modules have priority over the I/O, so when a peripheral is enabled, the
associated I/O functions are disabled.
After reset, the shared peripheral functions are disabled so that the pins are controlled by
the parallel I/O except PTA4 and PTA5 that are default to BKGD/MS and RESET
function. All of the parallel I/O are configured as high-impedance (Hi-Z). The pin control
functions for each pin are configured as follows:
• input disabled (PTxIEn = 0),
• output disabled (PTxOEn = 0), and
• internal pullups disabled (PTxPEn = 0).
Additionally, the parallel I/O that support high drive capability are disabled (HDRVE =
0x00) after reset.
The following three figures show the structures of each I/O pin.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
145
Introduction
PTxPEn
PTxOEn
PTxDn
PTxIEn
0
CPU read PTxDn
1
Figure 7-1. Normal I/O structure
PTxPEn
PTxOEn
PTxIEn
PTxDn
0
CPU read PTxDn
1
Figure 7-2. SDA(PTA2)/SCL(PTA3) structure
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
146
Freescale Semiconductor, Inc.
Chapter 7 Parallel input/output
PTxPEn
PTxOEn
PTxDn
PTxIEn
0
CPU read PTxDn
1
HDRVE
Figure 7-3. High drive I/O structure
7.2 Port data and data direction
Reading and writing of parallel I/O is accomplished through the port data registers
(PTxD). The direction, input or output, is controlled through the input enable or output
enable registers.
After reset, all parallel I/O default to the Hi-Z state. The corresponding bit in output
enable register (PTxOE) or input enable register (PTxIE) must be configured for output
or input operation. Each port pin has an input enable bit and an output enable bit. When
PTxIEn = 1, a read from PTxDn returns the input value of the associated pin; when
PTxIEn = 0, a read from PTxDn returns the last value written to the port data register.
NOTE
The PTxOE must be clear when the corresponding pin is used
as input function to avoid contention. If set the corresponding
PTxOE and PTxIE bits at same time, read from PTxDn will
always return the output data.
When a peripheral module or system function is in control of a port pin, the data direction
register bit still controls what is returned for reads of the port data register, even though
the peripheral system has overriding control of the actual pin direction.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
147
Internal pullup enable
When a shared analog function is enabled for a pin, all digital pin functions are disabled.
A read of the port data register returns a value of 0 for any bits that have shared analog
functions enabled. In general, whenever a pin is shared with both an alternate digital
function and an analog function, the analog function has priority such that if both of the
digital and analog functions are enabled, the analog function controls the pin.
A write of valid data to a port data register must occur before setting the output enable bit
of an associated port pin. This ensures that the pin will not be driven with an incorrect
data value.
7.3 Internal pullup enable
An internal pullup device can be enabled for each port pin by setting the corresponding
bit in one of the pullup enable registers (PTxPEn). The internal pullup device is disabled
if the pin is configured as an output by the parallel I/O control logic, or by any shared
peripheral function, regardless of the state of the corresponding pullup enable register bit.
The internal pullup device is also disabled if the pin is controlled by an analog function.
NOTE
When configuring IIC to use "SDA(PTA2) and SCL(PTA3)"
pins, and if an application uses internal pullups instead of
external pullups, the internal pullups remain present setting
when the pins are configured as outputs, but they are
automatically disabled to save power when the output values
are low.
7.4 Input glitch filter setting
A filter is implemented for each port pin that is configured as a digital input. It can be
used as a simple low-pass filter to filter any glitch that is introduced from the pins of
GPIO, IRQ,RESET, and KBI. The glitch width threshold can be adjusted easily by
setting registers PORT_IOFLTn and PORT_FCLKDIV between 1~4096 BUSCLKs (or
1~128 LPOCLKs). This configurable glitch filter can take the place of an on board
external analog filter, and greatly improve the EMC performance.
Setting register PORT_IOFLTn can configure the filter of the whole port, etc. set
PORT_IOFLT0[FLTA] will affect all PTAn pins.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
148
Freescale Semiconductor, Inc.
Chapter 7 Parallel input/output
7.5 High current drive
Output high sink/source current drive can be enabled by setting the corresponding bit in
the HDRVE register for PTD1, PTD0, PTB5 and PTB4. Output high sink/source current
when they are operated as output. High current drive function is disabled if the pin is
configured as an input by the parallel I/O control logic. When configured as any shared
peripheral function, high current drive function still works on these pins, but only when
they are configured as outputs.
7.6 Pin behavior in stop mode
In stop3 mode, all I/O is maintained because internal logic circuitry stays powered up.
Upon recovery, normal I/O function is available to the user.
7.7 Port data registers
PORT memory map
Absolute
address
(hex)
Register name
Width
Access
(in bits)
Reset value
Section/
page
0
Port A Data Register (PORT_PTAD)
8
R/W
00h
7.7.1/150
1
Port B Data Register (PORT_PTBD)
8
R/W
00h
7.7.2/150
2
Port C Data Register (PORT_PTCD)
8
R/W
00h
7.7.3/151
3
Port D Data Register (PORT_PTDD)
8
R/W
00h
7.7.4/151
4
Port E Data Register (PORT_PTED)
8
R/W
00h
7.7.5/152
30AF
Port High Drive Enable Register (PORT_HDRVE)
8
R/W
00h
7.7.6/152
30B0
Port A Output Enable Register (PORT_PTAOE)
8
R/W
00h
7.7.7/153
30B1
Port B Output Enable Register (PORT_PTBOE)
8
R/W
00h
7.7.8/154
30B2
Port C Output Enable Register (PORT_PTCOE)
8
R/W
00h
7.7.9/156
30B3
Port D Output Enable Register (PORT_PTDOE)
8
R/W
00h
7.7.10/157
30B4
Port E Output Enable Register (PORT_PTEOE)
8
R/W
00h
7.7.11/158
30B8
Port A Input Enable Register (PORT_PTAIE)
8
R/W
00h
7.7.12/159
30B9
Port B Input Enable Register (PORT_PTBIE)
8
R/W
00h
7.7.13/160
30BA
Port C Input Enable Register (PORT_PTCIE)
8
R/W
00h
7.7.14/161
30BB
Port D Input Enable Register (PORT_PTDIE)
8
R/W
00h
7.7.15/163
30BC
Port E Input Enable Register (PORT_PTEIE)
8
R/W
00h
7.7.16/164
30EC
Port Filter Register 0 (PORT_IOFLT0)
8
R/W
00h
7.7.17/165
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
149
Port data registers
PORT memory map (continued)
Absolute
address
(hex)
Width
Access
(in bits)
Register name
Reset value
Section/
page
30ED
Port Filter Register 1 (PORT_IOFLT1)
8
R/W
00h
7.7.18/166
30EE
Port Filter Register 2 (PORT_IOFLT2)
8
R/W
00h
7.7.19/166
30EF
Port Clock Division Register (PORT_FCLKDIV)
8
R/W
00h
7.7.20/167
30F0
Port A Pullup Enable Register (PORT_PTAPE)
8
R/W
00h
7.7.21/168
30F1
Port B Pullup Enable Register (PORT_PTBPE)
8
R/W
00h
7.7.22/169
30F2
Port C Pullup Enable Register (PORT_PTCPE)
8
R/W
00h
7.7.23/171
30F3
Port D Pullup Enable Register (PORT_PTDPE)
8
R/W
00h
7.7.24/172
30F4
Port E Pullup Enable Register (PORT_PTEPE)
8
R/W
00h
7.7.25/173
7.7.1 Port A Data Register (PORT_PTAD)
Address: 0h base + 0h offset = 0h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
PTAD
0
0
0
0
PORT_PTAD field descriptions
Field
PTAD
Description
Port A Data Register Bits
For port A pins that are configured as inputs, a read returns the logic level on the pin.
For port A pins that are configured as outputs, a read returns the last value that was written to this register.
For port A pins that are configured as Hi-Z, a read returns uncertainty data.
Writes are latched into all bits of this register. For port A pins that are configured as outputs, the logic level
is driven out of the corresponding MCU pin.
Reset forces PTAD to all 0s, but these 0s are not driven out of the corresponding pins because reset also
configures all port pins as high-impedance inputs with pullups disabled.
7.7.2 Port B Data Register (PORT_PTBD)
Address: 0h base + 1h offset = 1h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
PTBD
0
0
0
0
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
150
Freescale Semiconductor, Inc.
Chapter 7 Parallel input/output
PORT_PTBD field descriptions
Field
PTBD
Description
Port B Data Register Bits
For port B pins that are configured as inputs, a read returns the logic level on the pin.
For port B pins that are configured as outputs, a read returns the last value that was written to this register.
For port B pins that are configured as Hi-Z, a read returns uncertainty data.
Writes are latched into all bits of this register. For port B pins that are configured as outputs, the logic level
is driven out of the corresponding MCU pin.
Reset forces PTBD to all 0s, but these 0s are not driven out of the corresponding pins because reset also
configures all port pins as high-impedance inputs with pullups disabled.
7.7.3 Port C Data Register (PORT_PTCD)
Address: 0h base + 2h offset = 2h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
PTCD
0
0
0
0
PORT_PTCD field descriptions
Field
PTCD
Description
Port C Data Register Bits
For port C pins that are configured as inputs, a read returns the logic level on the pin.
For port C pins that are configured as outputs, a read returns the last value that was written to this
register.
For port C pins that are configured as Hi-Z, a read returns uncertainty data.
Writes are latched into all bits of this register. For port C pins that are configured as outputs, the logic level
is driven out of the corresponding MCU pin.
Reset forces PTCD to all 0s, but these 0s are not driven out of the corresponding pins because reset also
configures all port pins as high-impedance inputs with pullups disabled.
7.7.4 Port D Data Register (PORT_PTDD)
Address: 0h base + 3h offset = 3h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
PTDD
0
0
0
0
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
151
Port data registers
PORT_PTDD field descriptions
Field
PTDD
Description
Port D Data Register Bits
For port D pins that are configured as inputs, a read returns the logic level on the pin.
For port D pins that are configured as outputs, a read returns the last value that was written to this
register.
For port D pins that are configured as Hi-Z, a read returns uncertainty data.
Writes are latched into all bits of this register. For port D pins that are configured as outputs, the logic level
is driven out of the corresponding MCU pin.
Reset forces PTDD to all 0s, but these 0s are not driven out of the corresponding pins because reset also
configures all port pins as high-impedance inputs with pullups disabled.
7.7.5 Port E Data Register (PORT_PTED)
Address: 0h base + 4h offset = 4h
Bit
Read
Write
Reset
7
6
5
4
3
0
0
2
1
0
0
0
PTED
0
0
0
0
0
PORT_PTED field descriptions
Field
7–5
Reserved
PTED
Description
This field is reserved.
This read-only field is reserved and always has the value 0.
Port E Data Register Bits
For port E pins that are configured as inputs, a read returns the logic level on the pin.
For port E pins that are configured as outputs, a read returns the last value that was written to this register.
For port E pins that are configured as Hi-Z, a read returns uncertainty data.
Writes are latched into all bits of this register. For port E pins that are configured as outputs, the logic level
is driven out of the corresponding MCU pin.
Reset forces PTED to all 0s, but these 0s are not driven out of the corresponding pins because reset also
configures all port pins as high-impedance inputs with pullups disabled.
7.7.6 Port High Drive Enable Register (PORT_HDRVE)
Address: 0h base + 30AFh offset = 30AFh
Bit
Read
Write
Reset
7
6
5
4
0
0
0
0
0
3
2
1
0
PTD1
PTD0
PTB5
PTB4
0
0
0
0
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
152
Freescale Semiconductor, Inc.
Chapter 7 Parallel input/output
PORT_HDRVE field descriptions
Field
7–4
Reserved
3
PTD1
Description
This field is reserved.
This read-only field is reserved and always has the value 0.
PTD1
This read/write bit enables the high current drive capability of PTD1
0
1
2
PTD0
PTD0
This read/write bit enables the high current drive capability of PTD0
0
1
1
PTB5
PTD0 is disabled to offer high current drive capability.
PTD0 is enable to offer high current drive capability.
PTB5
This read/write bit enables the high current drive capability of PTB5
0
1
0
PTB4
PTD1 is disabled to offer high current drive capability.
PTD1 is enable to offer high current drive capability.
PTB5 is disabled to offer high current drive capability.
PTB5 is enable to offer high current drive capability.
PTB4
This read/write bit enables the high current drive capability of PTB4
0
1
PTB4 is disabled to offer high current drive capability.
PTB4 is enable to offer high current drive capability.
7.7.7 Port A Output Enable Register (PORT_PTAOE)
Address: 0h base + 30B0h offset = 30B0h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
PTAOE7
PTAOE6
PTAOE5
PTAOE4
PTAOE3
PTAOE2
PTAOE1
PTAOE0
0
0
0
0
0
0
0
0
PORT_PTAOE field descriptions
Field
7
PTAOE7
Description
Output Enable for Port A Bit 7
This read/write bit enables the port A pin as an output.
0
1
6
PTAOE6
Output Disabled for port A bit 7.
Output Enabled for port A bit 7.
Output Enable for Port A Bit 6
This read/write bit enables the port A pin as an output.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
153
Port data registers
PORT_PTAOE field descriptions (continued)
Field
Description
0
1
5
PTAOE5
Output Enable for Port A Bit 5
This read/write bit enables the port A pin as an output.
0
1
4
PTAOE4
This read/write bit enables the port A pin as an output.
This read/write bit enables the port A pin as an output.
This read/write bit enables the port A pin as an output.
Output Disabled for port A bit 2.
Output Enabled for port A bit 2.
Output Enable for Port A Bit 1
This read/write bit enables the port A pin as an output.
0
1
0
PTAOE0
Output Disabled for port A bit 3.
Output Enabled for port A bit 3.
Output Enable for Port A Bit 2
0
1
1
PTAOE1
Output Disabled for port A bit 4.
Output Enabled for port A bit 4.
Output Enable for Port A Bit 3
0
1
2
PTAOE2
Output Disabled for port A bit 5.
Output Enabled for port A bit 5.
Output Enable for Port A Bit 4
0
1
3
PTAOE3
Output Disabled for port A bit 6.
Output Enabled for port A bit 6.
Output Disabled for port A bit 1.
Output Enabled for port A bit 1.
Output Enable for Port A Bit 0
This read/write bit enables the port A pin as an output.
0
1
Output Disabled for port A bit 0.
Output Enabled for port A bit 0.
7.7.8 Port B Output Enable Register (PORT_PTBOE)
Address: 0h base + 30B1h offset = 30B1h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
PTBOE7
PTBOE6
PTBOE5
PTBOE4
PTBOE3
PTBOE2
PTBOE1
PTBOE0
0
0
0
0
0
0
0
0
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
154
Freescale Semiconductor, Inc.
Chapter 7 Parallel input/output
PORT_PTBOE field descriptions
Field
7
PTBOE7
Description
Output Enable for Port B Bit 7
This read/write bit enables the port B pin as an output.
0
1
6
PTBOE6
Output Enable for Port B Bit 6
This read/write bit enables the port B pin as an output.
0
1
5
PTBOE5
This read/write bit enables the port B pin as an output.
This read/write bit enables the port B pin as an output.
This read/write bit enables the port B pin as an output.
This read/write bit enables the port B pin as an output.
Output Disabled for port B bit 2.
Output Enabled for port B bit 2.
Output Enable for Port B Bit 1
This read/write bit enables the port B pin as an output.
0
1
0
PTBOE0
Output Disabled for port B bit 3.
Output Enabled for port B bit 3.
Output Enable for Port B Bit 2
0
1
1
PTBOE1
Output Disabled for port B bit 4.
Output Enabled for port B bit 4.
Output Enable for Port B Bit 3
0
1
2
PTBOE2
Output Disabled for port B bit 5.
Output Enabled for port B bit 5.
Output Enable for Port B Bit 4
0
1
3
PTBOE3
Output Disabled for port B bit 6.
Output Enabled for port B bit 6.
Output Enable for Port B Bit 5
0
1
4
PTBOE4
Output Disabled for port B bit 7.
Output Enabled for port B bit 7.
Output Disabled for port B bit 1.
Output Enabled for port B bit 1.
Output Enable for Port B Bit 0
This read/write bit enables the port B pin as an output.
0
1
Output Disabled for port B bit 0.
Output Enabled for port B bit 0.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
155
Port data registers
7.7.9 Port C Output Enable Register (PORT_PTCOE)
Address: 0h base + 30B2h offset = 30B2h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
PTCOE7
PTCOE6
PTCOE5
PTCOE4
PTCOE3
PTCOE2
PTCOE1
PTCOE0
0
0
0
0
0
0
0
0
PORT_PTCOE field descriptions
Field
7
PTCOE7
Description
Output Enable for Port C Bit 7
This read/write bit enables the port C pin as an output.
0
1
6
PTCOE6
Output Enable for Port C Bit 6
This read/write bit enables the port C pin as an output.
0
1
5
PTCOE5
This read/write bit enables the port C pin as an output.
This read/write bit enables the port C pin as an output.
This read/write bit enables the port C pin as an output.
Output Disabled for port C bit 3.
Output Enabled for port C bit 3.
Output Enable for Port C Bit 2
This read/write bit enables the port C pin as an output.
0
1
1
PTCOE1
Output Disabled for port C bit 4.
Output Enabled for port C bit 4.
Output Enable for Port C Bit 3
0
1
2
PTCOE2
Output Disabled for port C bit 5.
Output Enabled for port C bit 5.
Output Enable for Port C Bit 4
0
1
3
PTCOE3
Output Disabled for port C bit 6.
Output Enabled for port C bit 6.
Output Enable for Port C Bit 5
0
1
4
PTCOE4
Output Disabled for port C bit 7.
Output Enabled for port C bit 7.
Output Disabled for port C bit 2.
Output Enabled for port C bit 2.
Output Enable for Port C Bit 1
This read/write bit enables the port C pin as an output.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
156
Freescale Semiconductor, Inc.
Chapter 7 Parallel input/output
PORT_PTCOE field descriptions (continued)
Field
Description
0
1
0
PTCOE0
Output Disabled for port C bit 1.
Output Enabled for port C bit 1.
Output Enable for Port C Bit 0
This read/write bit enables the port C pin as an output.
0
1
Output Disabled for port C bit 0.
Output Enabled for port C bit 0.
7.7.10 Port D Output Enable Register (PORT_PTDOE)
Address: 0h base + 30B3h offset = 30B3h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
PTDOE7
PTDOE6
PTDOE5
PTDOE4
PTDOE3
PTDOE2
PTDOE1
PTDOE0
0
0
0
0
0
0
0
0
PORT_PTDOE field descriptions
Field
7
PTDOE7
Description
Output Enable for Port D Bit 7
This read/write bit enables the port D pin as an output.
0
1
6
PTDOE6
Output Enable for Port D Bit 6
This read/write bit enables the port D pin as an output.
0
1
5
PTDOE5
This read/write bit enables the port D pin as an output.
Output Disabled for port D bit 5.
Output Enabled for port D bit 5.
Output Enable for Port D Bit 4
This read/write bit enables the port D pin as an output.
0
1
3
PTDOE3
Output Disabled for port D bit 6.
Output Enabled for port D bit 6.
Output Enable for Port D Bit 5
0
1
4
PTDOE4
Output Disabled for port D bit 7.
Output Enabled for port D bit 7.
Output Disabled for port D bit 4.
Output Enabled for port D bit 4.
Output Enable for Port D Bit 3
This read/write bit enables the port D pin as an output.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
157
Port data registers
PORT_PTDOE field descriptions (continued)
Field
Description
0
1
2
PTDOE2
Output Enable for Port D Bit 2
This read/write bit enables the port D pin as an output.
0
1
1
PTDOE1
Output Disabled for port D bit 2.
Output Enabled for port D bit 2.
Output Enable for Port D Bit 1
This read/write bit enables the port D pin as an output.
0
1
0
PTDOE0
Output Disabled for port D bit 3.
Output Enabled for port D bit 3.
Output Disabled for port D bit 1.
Output Enabled for port D bit 1.
Output Enable for Port D Bit 0
This read/write bit enables the port D pin as an output.
0
1
Output Disabled for port D bit 0.
Output Enabled for port D bit 0.
7.7.11 Port E Output Enable Register (PORT_PTEOE)
Address: 0h base + 30B4h offset = 30B4h
Bit
Read
Write
Reset
7
6
5
0
0
0
0
4
3
2
1
0
PTEOE4
PTEOE3
PTEOE2
PTEOE1
PTEOE0
0
0
0
0
0
PORT_PTEOE field descriptions
Field
Description
7–5
Reserved
This field is reserved.
This read-only field is reserved and always has the value 0.
4
PTEOE4
Output Enable for Port E Bit 4
This read/write bit enables the port E pin as an output.
0
1
3
PTEOE3
Output Disabled for port E bit 4.
Output Enabled for port E bit 4.
Output Enable for Port E Bit 3
This read/write bit enables the port E pin as an output.
0
1
Output Disabled for port E bit 3.
Output Enabled for port E bit 3.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
158
Freescale Semiconductor, Inc.
Chapter 7 Parallel input/output
PORT_PTEOE field descriptions (continued)
Field
2
PTEOE2
Description
Output Enable for Port E Bit 2
This read/write bit enables the port E pin as an output.
0
1
1
PTEOE1
Output Enable for Port E Bit 1
This read/write bit enables the port E pin as an output.
0
1
0
PTEOE0
Output Disabled for port E bit 2.
Output Enabled for port E bit 2.
Output Disabled for port E bit 1.
Output Enabled for port E bit 1.
Output Enable for Port E Bit 0
This read/write bit enables the port E pin as an output.
0
1
Output Disabled for port E bit 0.
Output Enabled for port E bit 0.
7.7.12 Port A Input Enable Register (PORT_PTAIE)
Address: 0h base + 30B8h offset = 30B8h
Bit
Read
Write
Reset
7
6
5
PTAIE7
PTAIE6
PTAIE5
0
0
0
4
3
2
1
0
0
PTAIE3
PTAIE2
PTAIE1
PTAIE0
0
0
0
0
0
PORT_PTAIE field descriptions
Field
7
PTAIE7
Description
Input Enable for Port A Bit 7
This read/write bit enables the port A pin as an input.
0
1
6
PTAIE6
Input Enable for Port A Bit 6
This read/write bit enables the port A pin as an input.
0
1
5
PTAIE5
Input disabled for port A bit 7.
Input enabled for port A bit 7.
Input disabled for port A bit 6.
Input enabled for port A bit 6.
Input Enable for Port A Bit 5
This read/write bit enables the port A pin as an input.
0
1
Input disabled for port A bit 5.
Input enabled for port A bit 5.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
159
Port data registers
PORT_PTAIE field descriptions (continued)
Field
4
Reserved
3
PTAIE3
Description
This field is reserved.
This read-only field is reserved and always has the value 0.
Input Enable for Port A Bit 3
This read/write bit enables the port A pin as an input.
0
1
2
PTAIE2
Input Enable for Port A Bit 2
This read/write bit enables the port A pin as an input.
0
1
1
PTAIE1
Input disabled for port A bit 2.
Input enabled for port A bit 2.
Input Enable for Port A Bit 1
This read/write bit enables the port A pin as an input.
0
1
0
PTAIE0
Input disabled for port A bit 3.
Input enabled for port A bit 3.
Input disabled for port A bit 1.
Input enabled for port A bit 1.
Input Enable for Port A Bit 0
This read/write bit enables the port A pin as an input.
0
1
Input disabled for port A bit 0.
Input enabled for port A bit 0.
7.7.13 Port B Input Enable Register (PORT_PTBIE)
Address: 0h base + 30B9h offset = 30B9h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
PTBIE7
PTBIE6
PTBIE5
PTBIE4
PTBIE3
PTBIE2
PTBIE1
PTBIE0
0
0
0
0
0
0
0
0
PORT_PTBIE field descriptions
Field
7
PTBIE7
Description
Input Enable for Port B Bit 7
This read/write bit enables the port B pin as an input.
0
1
6
PTBIE6
Input disabled for port B bit 7.
Input enabled for port B bit 7.
Input Enable for Port B Bit 6
This read/write bit enables the port B pin as an input.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
160
Freescale Semiconductor, Inc.
Chapter 7 Parallel input/output
PORT_PTBIE field descriptions (continued)
Field
Description
0
1
5
PTBIE5
Input Enable for Port B Bit 5
This read/write bit enables the port B pin as an input.
0
1
4
PTBIE4
This read/write bit enables the port B pin as an input.
This read/write bit enables the port B pin as an input.
This read/write bit enables the port B pin as an input.
Input disabled for port B bit 2.
Input enabled for port B bit 2.
Input Enable for Port B Bit 1
This read/write bit enables the port B pin as an input.
0
1
0
PTBIE0
Input disabled for port B bit 3.
Input enabled for port B bit 3.
Input Enable for Port B Bit 2
0
1
1
PTBIE1
Input disabled for port B bit 4.
Input enabled for port B bit 4.
Input Enable for Port B Bit 3
0
1
2
PTBIE2
Input disabled for port B bit 5.
Input enabled for port B bit 5.
Input Enable for Port B Bit 4
0
1
3
PTBIE3
Input disabled for port B bit 6.
Input enabled for port B bit 6.
Input disabled for port B bit 1.
Input enabled for port B bit 1.
Input Enable for Port B Bit 0
This read/write bit enables the port B pin as an input.
0
1
Input disabled for port B bit 0.
Input enabled for port B bit 0.
7.7.14 Port C Input Enable Register (PORT_PTCIE)
Address: 0h base + 30BAh offset = 30BAh
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
PTCIE7
PTCIE6
PTCIE5
PTCIE4
PTCIE3
PTCIE2
PTCIE1
PTCIE0
0
0
0
0
0
0
0
0
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
161
Port data registers
PORT_PTCIE field descriptions
Field
7
PTCIE7
Description
Input Enable for Port C Bit 7
This read/write bit enables the port C pin as an input.
0
1
6
PTCIE6
Input Enable for Port C Bit 6
This read/write bit enables the port C pin as an input.
0
1
5
PTCIE5
This read/write bit enables the port C pin as an input.
This read/write bit enables the port C pin as an input.
This read/write bit enables the port C pin as an input.
This read/write bit enables the port C pin as an input.
Input disabled for port C bit 2.
Input enabled for port C bit 2.
Input Enable for Port C Bit 1
This read/write bit enables the port C pin as an input.
0
1
0
PTCIE0
Input disabled for port C bit 3.
Input enabled for port C bit 3.
Input Enable for Port C Bit 2
0
1
1
PTCIE1
Input disabled for port C bit 4.
Input enabled for port C bit 4.
Input Enable for Port C Bit 3
0
1
2
PTCIE2
Input disabled for port C bit 5.
Input enabled for port C bit 5.
Input Enable for Port C Bit 4
0
1
3
PTCIE3
Input disabled for port C bit 6.
Input enabled for port C bit 6.
Input Enable for Port C Bit 5
0
1
4
PTCIE4
Input disabled for port C bit 7.
Input enabled for port C bit 7.
Input disabled for port C bit 1.
Input enabled for port C bit 1.
Input Enable for Port C Bit 0
This read/write bit enables the port C pin as an input.
0
1
Input disabled for port C bit 0.
Input enabled for port C bit 0.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
162
Freescale Semiconductor, Inc.
Chapter 7 Parallel input/output
7.7.15 Port D Input Enable Register (PORT_PTDIE)
Address: 0h base + 30BBh offset = 30BBh
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
PTDIE7
PTDIE6
PTDIE5
PTDIE4
PTDIE3
PTDIE2
PTDIE1
PTDIE0
0
0
0
0
0
0
0
0
PORT_PTDIE field descriptions
Field
7
PTDIE7
Description
Input Enable for Port D Bit 7
This read/write bit enables the port D pin as an input.
0
1
6
PTDIE6
Input Enable for Port D Bit 6
This read/write bit enables the port D pin as an input.
0
1
5
PTDIE5
This read/write bit enables the port D pin as an input.
This read/write bit enables the port D pin as an input.
This read/write bit enables the port D pin as an input.
Input disabled for port D bit 3.
Input enabled for port D bit 3.
Input Enable for Port D Bit 2
This read/write bit enables the port D pin as an input.
0
1
1
PTDIE1
Input disabled for port D bit 4.
Input enabled for port D bit 4.
Input Enable for Port D Bit 3
0
1
2
PTDIE2
Input disabled for port D bit 5.
Input enabled for port D bit 5.
Input Enable for Port D Bit 4
0
1
3
PTDIE3
Input disabled for port D bit 6.
Input enabled for port D bit 6.
Input Enable for Port D Bit 5
0
1
4
PTDIE4
Input disabled for port D bit 7.
Input enabled for port D bit 7.
Input disabled for port D bit 2.
Input enabled for port D bit 2.
Input Enable for Port D Bit 1
This read/write bit enables the port D pin as an input.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
163
Port data registers
PORT_PTDIE field descriptions (continued)
Field
Description
0
1
0
PTDIE0
Input disabled for port D bit 1.
Input enabled for port D bit 1.
Input Enable for Port D Bit 0
This read/write bit enables the port D pin as an input.
0
1
Input disabled for port D bit 0.
Input enabled for port D bit 0.
7.7.16 Port E Input Enable Register (PORT_PTEIE)
Address: 0h base + 30BCh offset = 30BCh
Bit
Read
Write
Reset
7
6
5
0
0
0
0
4
3
2
1
0
PTEIE4
PTEIE3
PTEIE2
PTEIE1
PTEIE0
0
0
0
0
0
PORT_PTEIE field descriptions
Field
7–5
Reserved
4
PTEIE4
Description
This field is reserved.
This read-only field is reserved and always has the value 0.
Input Enable for Port E Bit 4
This read/write bit enables the port E pin as an input.
0
1
3
PTEIE3
Input Enable for Port E Bit 3
This read/write bit enables the port E pin as an input.
0
1
2
PTEIE2
Input disabled for port E bit 3.
Input enabled for port E bit 3.
Input Enable for Port E Bit 2
This read/write bit enables the port E pin as an input.
0
1
1
PTEIE1
Input disabled for port E bit 4.
Input enabled for port E bit 4.
Input disabled for port E bit 2.
Input enabled for port E bit 2.
Input Enable for Port E Bit 1
This read/write bit enables the port E pin as an input.
0
1
Input disabled for port E bit 1.
Input enabled for port E bit 1.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
164
Freescale Semiconductor, Inc.
Chapter 7 Parallel input/output
PORT_PTEIE field descriptions (continued)
Field
0
PTEIE0
Description
Input Enable for Port E Bit 0
This read/write bit enables the port E pin as an input.
0
1
Input disabled for port E bit 0.
Input enabled for port E bit 0.
7.7.17 Port Filter Register 0 (PORT_IOFLT0)
This register sets the filters for input from PTA to PTD.
Address: 0h base + 30ECh offset = 30ECh
Bit
Read
Write
Reset
7
6
5
FLTD
0
4
3
FLTC
0
0
2
1
FLTB
0
0
0
FLTA
0
0
0
PORT_IOFLT0 field descriptions
Field
Description
7–6
FLTD
Filter selection for input from PTD
5–4
FLTC
Filter selection for input from PTC
3–2
FLTB
Filter selection for input from PTB
FLTA
Filter selection for input from PTA
00
01
10
11
00
01
10
11
00
01
10
11
00
01
10
11
BUSCLK
FLTDIV1
FLTDIV2
FLTDIV3
BUSCLK
FLTDIV1
FLTDIV2
FLTDIV3
BUSCLK
FLTDIV1
FLTDIV2
FLTDIV3
BUSCLK
FLTDIV1
FLTDIV2
FLTDIV3
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
165
Port data registers
7.7.18 Port Filter Register 1 (PORT_IOFLT1)
This register sets the filters for input from PTE.
Address: 0h base + 30EDh offset = 30EDh
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
FLTE
0
0
0
0
0
2
1
0
PORT_IOFLT1 field descriptions
Field
7–2
Reserved
FLTE
Description
This field is reserved.
This read-only field is reserved and always has the value 0.
Filter selection for input from PTE
00
01
10
11
BUSCLK
FLTDIV1
FLTDIV2
FLTDIV3
7.7.19 Port Filter Register 2 (PORT_IOFLT2)
This register sets the filters for input.
Address: 0h base + 30EEh offset = 30EEh
Bit
Read
Write
Reset
7
6
5
4
3
0
0
0
FLTKBI0
0
0
0
FLTRST
0
0
0
PORT_IOFLT2 field descriptions
Field
Description
7–4
Reserved
This field is reserved.
This read-only field is reserved and always has the value 0.
3–2
FLTKBI0
Filter selection for input from KBI0
FLTRST
Filter selection for input from RESET/IRQ
00
01
10
11
BUSCLK
Select FLTDIV1, and will switch to FLTDIV3 in stop mode automatically.
Select FLTDIV2, and will switch to FLTDIV3 in stop mode automatically.
FLTDIV3
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
166
Freescale Semiconductor, Inc.
Chapter 7 Parallel input/output
PORT_IOFLT2 field descriptions (continued)
Field
Description
00
01
10
11
No filter.
Select FLTDIV1, and will switch to FLTDIV3 in stop mode automatically.
Select FLTDIV2, and will switch to FLTDIV3 in stop mode automatically.
FLTDIV3
7.7.20 Port Clock Division Register (PORT_FCLKDIV)
Configure the high/low level glitch width threshold. Glitches that are shorter than the
selected clock width will be filtered out; glitches that are more than twice the selected
clock width will not be filtered out (they will pass to the internal circuitry).
Address: 0h base + 30EFh offset = 30EFh
Bit
Read
Write
Reset
7
6
5
4
FLTDIV3
0
0
3
2
1
FLTDIV2
0
0
0
0
FLTDIV1
0
0
0
PORT_FCLKDIV field descriptions
Field
7–5
FLTDIV3
Description
Filter Division Set 3
Port Filter Division Set 3
000
001
010
011
100
101
110
111
4–2
FLTDIV2
Filter Division Set 2
Port Filter Division Set 2
000
001
010
011
100
101
110
111
FLTDIV1
LPOCLK.
LPOCLK/2.
LPOCLK/4.
LPOCLK/8.
LPOCLK/16.
LPOCLK/32.
LPOCLK/64.
LPOCLK/128.
BUSCLK/32.
BUSCLK/64.
BUSCLK/128.
BUSCLK/256.
BUSCLK/512.
BUSCLK/1024.
BUSCLK/2048.
BUSCLK/4096.
Filter Division Set 1
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
167
Port data registers
PORT_FCLKDIV field descriptions (continued)
Field
Description
Port Filter Division Set 1
00
01
10
11
BUSCLK/2.
BUSCLK/4.
BUSCLK/8.
BUSCLK/16.
7.7.21 Port A Pullup Enable Register (PORT_PTAPE)
Address: 0h base + 30F0h offset = 30F0h
Bit
Read
Write
Reset
7
6
5
PTAPE7
PTAPE6
PTAPE5
0
0
0
4
3
2
1
0
0
PTAPE3
PTAPE2
PTAPE1
PTAPE0
0
0
0
0
0
PORT_PTAPE field descriptions
Field
7
PTAPE7
Description
Pull Enable for Port A Bit 7
This control bit determines if the internal pullup device is enabled for the associated PTA pin. For port A
pins that are configured as outputs or Hi-Z, these bits have no effect.
0
1
6
PTAPE6
Pull Enable for Port A Bit 6
This control bit determines if the internal pullup device is enabled for the associated PTA pin. For port A
pins that are configured as outputs or Hi-Z, these bits have no effect.
0
1
5
PTAPE5
Pullup disabled for port A bit 7.
Pullup enabled for port A bit 7.
Pullup disabled for port A bit 6.
Pullup enabled for port A bit 6.
Pull Enable for Port A Bit 5
This control bit determines if the internal pullup device is enabled for the associated PTA pin. For port A
pins that are configured as outputs or Hi-Z, these bits have no effect.
0
1
Pullup disabled for port A bit 5.
Pullup enabled for port A bit 5.
4
Reserved
This field is reserved.
This read-only field is reserved and always has the value 0.
3
PTAPE3
Pull Enable for Port A Bit 3
This control bit determines if the internal pullup device is enabled for the associated PTA pin. For port A
pins that are configured as outputs or Hi-Z, these bits have no effect.
NOTE: When configuring to use this pin as output high for IIC, the internal pullup device remains active
when PTAPE3 is set. It is automatically disabled to save power when output low.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
168
Freescale Semiconductor, Inc.
Chapter 7 Parallel input/output
PORT_PTAPE field descriptions (continued)
Field
Description
0
1
2
PTAPE2
Pullup disabled for port A bit 3.
Pullup enabled for port A bit 3.
Pull Enable for Port A Bit 2
This control bit determines if the internal pullup device is enabled for the associated PTA pin. For port A
pins that are configured as outputs or Hi-Z, these bits have no effect.
NOTE: When configuring to use this pin as output high for IIC, the internal pullup device remains active
when PTAPE2 is set. It is automatically disabled to save power when output low.
0
1
1
PTAPE1
Pull Enable for Port A Bit 1
This control bit determines if the internal pullup device is enabled for the associated PTA pin. For port A
pins that are configured as outputs or Hi-Z, these bits have no effect.
0
1
0
PTAPE0
Pullup disabled for port A bit 2.
Pullup enabled for port A bit 2.
Pullup disabled for port A bit 1.
Pullup enabled for port A bit 1.
Pull Enable for Port A Bit 0
This control bit determines if the internal pullup device is enabled for the associated PTA pin. For port A
pins that are configured as outputs or Hi-Z, these bits have no effect.
0
1
Pullup disabled for port A bit 0.
Pullup enabled for port A bit 0.
7.7.22 Port B Pullup Enable Register (PORT_PTBPE)
Address: 0h base + 30F1h offset = 30F1h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
PTBPE7
PTBPE6
PTBPE5
PTBPE4
PTBPE3
PTBPE2
PTBPE1
PTBPE0
0
0
0
0
0
0
0
0
PORT_PTBPE field descriptions
Field
7
PTBPE7
Description
Pull Enable for Port B Bit 7
This control bit determines if the internal pullup device is enabled for the associated PTB pin. For port B
pins that are configured as outputs or Hi-Z, these bits have no effect.
0
1
6
PTBPE6
Pullup disabled for port B bit 7.
Pullup enabled for port B bit 7.
Pull Enable for Port B Bit 6
This control bit determines if the internal pullup device is enabled for the associated PTB pin. For port B
pins that are configured as outputs or Hi-Z, these bits have no effect.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
169
Port data registers
PORT_PTBPE field descriptions (continued)
Field
Description
0
1
5
PTBPE5
Pull Enable for Port B Bit 5
This control bit determines if the internal pullup device is enabled for the associated PTB pin. For port B
pins that are configured as outputs or Hi-Z, these bits have no effect.
0
1
4
PTBPE4
This control bit determines if the internal pullup device is enabled for the associated PTB pin. For port B
pins that are configured as outputs or Hi-Z, these bits have no effect.
This control bit determines if the internal pullup device is enabled for the associated PTB pin. For port B
pins that are configured as outputs or Hi-Z, these bits have no effect.
This control bit determines if the internal pullup device is enabled for the associated PTB pin. For port B
pins that are configured as outputs or Hi-Z, these bits have no effect.
Pullup disabled for port B bit 2.
Pullup enabled for port B bit 2.
Pull Enable for Port B Bit 1
This control bit determines if the internal pullup device is enabled for the associated PTB pin. For port B
pins that are configured as outputs or Hi-Z, these bits have no effect.
0
1
0
PTBPE0
Pullup disabled for port B bit 3.
Pullup enabled for port B bit 3.
Pull Enable for Port B Bit 2
0
1
1
PTBPE1
Pullup disabled for port B bit 4.
Pullup enabled for port B bit 4.
Pull Enable for Port B Bit 3
0
1
2
PTBPE2
Pullup disabled for port B bit 5.
Pullup enabled for port B bit 5.
Pull Enable for Port B Bit 4
0
1
3
PTBPE3
Pullup disabled for port B bit 6.
Pullup enabled for port B bit 6.
Pullup disabled for port B bit 1.
Pullup enabled for port B bit 1.
Pull Enable for Port B Bit 0
This control bit determines if the internal pullup device is enabled for the associated PTB pin. For port B
pins that are configured as outputs or Hi-Z, these bits have no effect.
0
1
Pullup disabled for port B bit 0.
Pullup enabled for port B bit 0.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
170
Freescale Semiconductor, Inc.
Chapter 7 Parallel input/output
7.7.23 Port C Pullup Enable Register (PORT_PTCPE)
Address: 0h base + 30F2h offset = 30F2h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
PTCPE7
PTCPE6
PTCPE5
PTCPE4
PTCPE3
PTCPE2
PTCPE1
PTCPE0
0
0
0
0
0
0
0
0
PORT_PTCPE field descriptions
Field
7
PTCPE7
Description
Pull Enable for Port C Bit 7
This control bit determines if the internal pullup device is enabled for the associated PTC pin. For port C
pins that are configured as outputs or Hi-Z, these bits have no effect.
0
1
6
PTCPE6
Pull Enable for Port C Bit 6
This control bit determines if the internal pullup device is enabled for the associated PTC pin. For port C
pins that are configured as outputs or Hi-Z, these bits have no effect.
0
1
5
PTCPE5
This control bit determines if the internal pullup device is enabled for the associated PTC pin. For port C
pins that are configured as outputs or Hi-Z, these bits have no effect.
This control bit determines if the internal pullup device is enabled for the associated PTC pin. For port C
pins that are configured as outputs or Hi-Z, these bits have no effect.
Pullup disabled for port C bit 4.
Pullup enabled for port C bit 4.
Pull Enable for Port C Bit 3
This control bit determines if the internal pullup device is enabled for the associated PTC pin. For port C
pins that are configured as outputs or Hi-Z, these bits have no effect.
0
1
2
PTCPE2
Pullup disabled for port C bit 5.
Pullup enabled for port C bit 5.
Pull Enable for Port C Bit 4
0
1
3
PTCPE3
Pullup disabled for port C bit 6.
Pullup enabled for port C bit 6.
Pull Enable for Port C Bit 5
0
1
4
PTCPE4
Pullup disabled for port C bit 7.
Pullup enabled for port C bit 7.
Pullup disabled for port C bit 3.
Pullup enabled for port C bit 3.
Pull Enable for Port C Bit 2
This control bit determines if the internal pullup device is enabled for the associated PTC pin. For port C
pins that are configured as outputs or Hi-Z, these bits have no effect.
0
1
Pullup disabled for port C bit 2.
Pullup enabled for port C bit 2.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
171
Port data registers
PORT_PTCPE field descriptions (continued)
Field
1
PTCPE1
Description
Pull Enable for Port C Bit 1
This control bit determines if the internal pullup device is enabled for the associated PTC pin. For port C
pins that are configured as outputs or Hi-Z, these bits have no effect.
0
1
0
PTCPE0
Pullup disabled for port C bit 1.
Pullup enabled for port C bit 1.
Pull Enable for Port C Bit 0
This control bit determines if the internal pullup device is enabled for the associated PTC pin. For port C
pins that are configured as outputs or Hi-Z, these bits have no effect.
0
1
Pullup disabled for port C bit 0.
Pullup enabled for port C bit 0.
7.7.24 Port D Pullup Enable Register (PORT_PTDPE)
Address: 0h base + 30F3h offset = 30F3h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
PTDPE7
PTDPE6
PTDPE5
PTDPE4
PTDPE3
PTDPE2
PTDPE1
PTDPE0
0
0
0
0
0
0
0
0
PORT_PTDPE field descriptions
Field
7
PTDPE7
Description
Pull Enable for Port D Bit 7
This control bit determines if the internal pullup device is enabled for the associated PTD pin. For port D
pins that are configured as outputs or Hi-Z, these bits have no effect.
0
1
6
PTDPE6
Pull Enable for Port D Bit 6
This control bit determines if the internal pullup device is enabled for the associated PTD pin. For port D
pins that are configured as outputs or Hi-Z, these bits have no effect.
0
1
5
PTDPE5
Pullup disabled for port D bit 6.
Pullup enabled for port D bit 6.
Pull Enable for Port D Bit 5
This control bit determines if the internal pullup device is enabled for the associated PTD pin. For port D
pins that are configured as outputs or Hi-Z, these bits have no effect.
0
1
4
PTDPE4
Pullup disabled for port D bit 7.
Pullup enabled for port D bit 7.
Pullup disabled for port D bit 5.
Pullup enabled for port D bit 5.
Pull Enable for Port D Bit 4
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
172
Freescale Semiconductor, Inc.
Chapter 7 Parallel input/output
PORT_PTDPE field descriptions (continued)
Field
Description
This control bit determines if the internal pullup device is enabled for the associated PTD pin. For port D
pins that are configured as outputs or Hi-Z, these bits have no effect.
0
1
3
PTDPE3
Pull Enable for Port D Bit 3
This control bit determines if the internal pullup device is enabled for the associated PTD pin. For port D
pins that are configured as outputs or Hi-Z, these bits have no effect.
0
1
2
PTDPE2
This control bit determines if the internal pullup device is enabled for the associated PTD pin. For port D
pins that are configured as outputs or Hi-Z, these bits have no effect.
Pullup disabled for port D bit 2.
Pullup enabled for port D bit 2.
Pull Enable for Port D Bit 1
This control bit determines if the internal pullup device is enabled for the associated PTD pin. For port D
pins that are configured as outputs or Hi-Z, these bits have no effect.
0
1
0
PTDPE0
Pullup disabled for port D bit 3.
Pullup enabled for port D bit 3.
Pull Enable for Port D Bit 2
0
1
1
PTDPE1
Pullup disabled for port D bit 4.
Pullup enabled for port D bit 4.
Pullup disabled for port D bit 1.
Pullup enabled for port D bit 1.
Pull Enable for Port D Bit 0
This control bit determines if the internal pullup device is enabled for the associated PTD pin. For port D
pins that are configured as outputs or Hi-Z, these bits have no effect.
0
1
Pullup disabled for port D bit 0.
Pullup enabled for port D bit 0.
7.7.25 Port E Pullup Enable Register (PORT_PTEPE)
Address: 0h base + 30F4h offset = 30F4h
Bit
Read
Write
Reset
7
6
5
0
0
0
0
4
3
2
1
0
PTEPE4
PTEPE3
PTEPE2
PTEPE1
PTEPE0
0
0
0
0
0
PORT_PTEPE field descriptions
Field
7–5
Reserved
Description
This field is reserved.
This read-only field is reserved and always has the value 0.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
173
Port data registers
PORT_PTEPE field descriptions (continued)
Field
4
PTEPE4
Description
Pull Enable for Port E Bit 4
This control bit determines if the internal pullup device is enabled for the associated PTE pin. For port E
pins that are configured as outputs or Hi-Z, these bits have no effect.
0
1
3
PTEPE3
Pull Enable for Port E Bit 3
This control bit determines if the internal pullup device is enabled for the associated PTE pin. For port E
pins that are configured as outputs or Hi-Z, these bits have no effect.
0
1
2
PTEPE2
This control bit determines if the internal pullup device is enabled for the associated PTE pin. For port E
pins that are configured as outputs or Hi-Z, these bits have no effect.
Pullup disabled for port E bit 2.
Pullup enabled for port E bit 2.
Pull Enable for Port E Bit 1
This control bit determines if the internal pullup device is enabled for the associated PTE pin. For port E
pins that are configured as outputs or Hi-Z, these bits have no effect.
0
1
0
PTEPE0
Pullup disabled for port E bit 3.
Pullup enabled for port E bit 3.
Pull Enable for Port E Bit 2
0
1
1
PTEPE1
Pullup disabled for port E bit 4.
Pullup enabled for port E bit 4.
Pullup disabled for port E bit 1.
Pullup enabled for port E bit 1.
Pull Enable for Port E Bit 0
This control bit determines if the internal pullup device is enabled for the associated PTE pin. For port E
pins that are configured as outputs or Hi-Z, these bits have no effect.
0
1
Pullup disabled for port E bit 0.
Pullup enabled for port E bit 0.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
174
Freescale Semiconductor, Inc.
Chapter 8
Clock management
8.1 Clock module
This device has ICS, XOSC, and LPO clock modules.
The internal clock source (ICS) module provides several clock source options for this
device. The module contains a frequency-locked loop (FLL) that is controllable by either
an internal or external reference clock. The module can select clock from the FLL or
bypass the FLL as a source of the MCU system clock. The selected clock source is
passed through a reduced bus divider, which allows a lower output clock frequency to be
derived.
The external oscillator (XOSC) module allows an external crystal, ceramic resonator, or
other external clock source to produce the external reference clock. The output of XOSC
module can be used as the reference of ICS to generate system bus clock, and/or clock
source of watchdog (WDOG), real-time counter (RTC), and analog-to-digital (ADC)
modules.
The low-power oscillator (LPO) module is an on-chip low-power oscillator providing 1
kHz reference clock to RTC and watchdog (WDOG).
The following figures show the block diagram, highlighting the clock modules.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
175
Port A
Port B
CPU
PTB0/KBI0P4/RxD0/ADP4
PTB1/KBI0P5/TxD0/ADP5
PTB2/KBI0P6/SPSCK0/ADP6
PTB3/KBI0P7/MOSI0/ADP7
PTB4/FTM2CH4/MISO0 3
PTB5/FTM2CH5/SS0 3
PTB6/SDA/XTAL
PTB7/SCL/EXTAL
Port C
HCS08 CORE
PTA0/KBI0P0/FTM0CH0/ACMP0/ADP0
PTA1/KBI0P1/FTM0CH1/ACMP1/ADP1
PTA2/KBI0P2/RxD0/SDA1
PTA3/KBI0P3/TxD0/SCL1
PTA4/ACMPO/BKGD/MS 2
PTA5/IRQ/TCLK0/RESET
PTA6/FTM2FAULT1/ADP2
PTA7/FTM2FAULT2/ADP3
PTC0/FTM2CH0/ADP8
PTC1/FTM2CH1/ADP9
PTC2/FTM2CH2/ADP10
PTC3/FTM2CH3/ADP11
PTC4/FTM0CH0
PTC5/FTM0CH1
PTC6/RxD1
PTC7/TxD1
Port D
Clock module
PTD0/FTM2CH23
PTD1/FTM2CH33
PTD2
PTD3
PTD4
PTD5
PTD6
PTD7
BDC
SYSTEM INTEGRATION
MODULE (SIM)
WDG
IRQ
1 kHz OSC
LVD
KEYBOARD INTERRUPT
MODULE (KBI0)
INTER-INTEGRATED
CIRCUIT BUS (IIC)
8-BIT MODULO TIMER
INTERRUPT PRIORITY
(MTIM0)
CONTROLLER(IPC)
2-CH FLEX TIMER
ON-CHIP ICE AND
DEBUG MODUE (DBG)
MODULE (FTM0)
6-CH FLEX TIMER
MODULE (FTM2)
SERIAL COMMUNICATION
INTERFACE (SCI0)
USER EEPROM
MC9S08PA16 = 256 bytes
MC9S08PA8 = 256 bytes
USER RAM
MC9S08PA16 = 2,048 bytes
MC9S08PA8 = 2,048 bytes
20 MHz INTERNAL CLOCK
SOURCE (ICS)
EXTAL
XTAL
VDD
VSS
VDD4
VSS 4
VSS 4
VREFH
VDDA
VREFL
VSSA
EXTERNAL OSCILLATOR
SOURCE (XOSC)
SERIAL COMMUNICATION
INTERFACE (SCI1)
ANALOG COMPARATOR
(ACMP)
Port E
USER FLASH
MC9S08PA16 = 16,384 bytes
MC9S08PA8 = 8,192 bytes
REAL-TIME CLOCK
(RTC)
PTE0/SPSCK0
PTE1/MOSI0
PTE2/MISO0
PTE3/BUSOUT
PTE4/TCLK2
SERIAL PERIPHERAL
INTERFACE (SPI0)
POWER MANAGEMENT
CONTROLLER (PMC)
12-CH 12-BIT
ANALOG-TO-DIGITAL
CONVERTER(ADC)
CYCLIC REDUNDANCY
CHECK (CRC)
1. PTA2 and PTA3 operate as true-open drain when working as output.
2. PTA4/ACMPO/BKGD/MS is an output-only pin when used as port pin.
3. PTD0, PTD1, PTB4 and PTB5 can provide high sink/source current drive.
4. The secondary power pair of V DD and VSS (pin 11, 27 and 28 in 44-pin package) are not bonded in 32-pin, 20-pin or 16-pin packages.
Figure 8-1. Device block diagram highlighting clock modules and pins
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
176
Freescale Semiconductor, Inc.
Chapter 8 Clock management
8.2 Internal clock source (ICS)
The internal clock source (ICS) module provides clock source options for the MCU. The
module contains a frequency-locked loop (FLL) as a clock source that is controllable by
an internal or external reference clock. The module can provide this FLL clock or the
internal reference clock as a source for the MCU system clock, ICSCLK.
Whichever clock source is chosen, ICSCLK is the output from a bus clock divider
(BDIV), which allows a lower clock frequency to be derived.
Key features of the ICS module are:
• Frequency-locked loop (FLL) is trimmable for accuracy
• Internal or external reference clocks can be used to control the FLL
• Reference divider is provided for external clock
• Internal reference clock has nine trim bits available
• Internal or external reference clocks can be selected as the clock source for the MCU
• Whichever clock is selected as the source can be divided down by 1, 2, 4, 8, 16, 32,
64 or 128
• FLL Engaged Internal mode is automatically selected out of reset
• A constant divide by 2 of the DCO output that can be select as BDC clock.
• Digitally-controlled oscillator (DCO) optimized for 16 MHz to 20 MHz frequency
range
• FLL lock detector and external clock monitor
• FLL lock detector with interrupt capability
• External reference clock monitor with reset capability
8.2.1 Function description
The following figure shows the ICS block diagram.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
177
Internal clock source (ICS)
External Reference Clock /
Oscillator
Internal Clock Source Block
ICSIRCLK
IRCLKEN
IREFSTEN
BDIV
Internal
Reference
Clock
/ 2n
n=0-7
ICSOUT
LP
CLKS
FLL
SCFTRIMSCTRIM
/ 2n
n=0-7
DCOOUT
Filter DCO
2
ICSLCLK
ICSBDCCLK
CLKSW
IREFS
BUSCLK
RDIV
ICSFFCLK
IREFST
CLKST
LOLIE
LOLS
LOCK
CME
Figure 8-2. Internal clock source (ICS)
8.2.1.1 Bus frequency divider
The ICS_C2[BDIV] bits can be changed at anytime and the actual switch to the new
frequency occurs immediately.
8.2.1.2 Low power bit usage
The low power bit (ICS_C2[LP]) is provided to allow the FLL to be disabled and thus
conserve power when it is not used.
However, in some applications it may be desirable to allow the FLL to be enabled and to
lock for maximum accuracy before switching to an FLL engaged mode. To do this, write
the ICS_C2[LP] bit to 0.
8.2.1.3 Internal reference clock (ICSIRCLK)
When ICS_C1[IRCLKEN] is set the internal reference clock signal is presented as
ICSIRCLK, which can be used as an additional clock source. To re-target the ICSIRCLK
frequency, write a new value to the ICS_C3[SCTRIM] and ICS_C4[SCFTRIM] bits to
trim the period of the internal reference clock:
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
178
Freescale Semiconductor, Inc.
Chapter 8 Clock management
• Writing a larger value slows down the ICSIRCLK frequency.
• Writing a smaller value to the ICSTRM register speeds up the ICSIRCLK frequency.
The TRIM bits affect the ICSOUT frequency if the ICS is in FLL engaged internal (FEI),
FLL bypassed internal (FBI), or FLL bypassed internal low power (FBILP) mode.
Until ICSIRCLK is trimmed, programming low reference divider (BDIV) factors may
result in ICSOUT frequencies that exceed the maximum chip-level frequency and violate
the chip-level clock timing specifications.
If ICS_C1[IREFSTEN] is set and the ICS_C1[IRCLKEN] bit is written to 1, the internal
reference clock keeps running during stop mode in order to provide a fast recovery upon
exiting stop.
All MCU devices are factory programmed with a trim value in a factory reserved
memory location (i.e. reserved nonvolatile information registers that can not be accessed
by users). This value is uploaded to the ICS_C3 register and ICS_C4 register during any
reset initialization. For finer precision, trim the internal oscillator in the application and
set the ICS_C4[SCFTRIM] bit accordingly.
NOTE
Some tools like ProcessorExpert or USB Multilink may use
flash memory location, such as 0xFF6F and/or 0xFF6E, to store
the temporary trim value.
8.2.1.4 Fixed frequency clock (ICSFFCLK)
The ICS presents the divided FLL reference clock as ICSFFCLK for use as an additional
clock source. ICSFFCLK frequency must be no more than 1/4 of the ICSOUT frequency
to be valid. When ICSFFCLK is valid, ICS output signal (ICSFFE) gets asserted high.
Because of this requirement, in bypass modes the ICSFFCLK is valid only in bypass
external modes (FBE and FBELP) for the following combinations of BDIV, RDIV, and
RANGE values:
• RANGE=1
• BDIV=000 (divide by 1), RDIV ≥ 010
• BDIV=001 (divide by 2), RDIV ≥ 011
• BDIV=010 (divide by 4), RDIV ≥ 100
• BDIV=011 (divide by 8), RDIV ≥ 101
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
179
Internal clock source (ICS)
• BDIV=100 (divide by 16), NA
• BDIV=101 (divide by 32), NA
• BDIV=110 (divide by 64), NA
• BDIV=111 (divide by 128), NA
8.2.1.5 BDC clock
The ICS presents the DCO output clock divided by two as ICSLCLK for use as a clock
source for BDC communications. ICSLCLK is not available in FLL bypassed internal
low power (FBILP) and FLL bypassed external low power (FBELP) modes. The
ICSLCLK can be selected as BDC clock.
8.2.2 Modes of operation
There are seven modes of operation for the ICS: FEI, FEE, FBI, FBILP, FBE, FBELP,
and stop. The following figure shows the seven states of the ICS as a state diagram. The
arrows indicate the allowed movements between the states.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
180
Freescale Semiconductor, Inc.
Chapter 8 Clock management
IREFS=1
CLKS=00
IREFS=0
CLKS=10
BDM Enabled
or LP =0
FLL Bypassed
External Low
Power(FBELP)
FLL Engaged
Internal (FEI)
FLL Bypassed
Internal (FBI)
FLL Bypassed
External (FBE)
IREFS=0
CLKS=10
BDM Disabled
and LP=1
IREFS=1
CLKS=01
BDM Enabled
or LP=0
FLL Bypassed
Internal Low
Power(FBILP)
IREFS=1
CLKS=01
BDM Disabled
and LP=1
FLL Engaged
External (FEE)
IREFS=0
CLKS=00
Entered from any state
when MCU enters stop
Stop
Returns to state that was active
before MCU entered stop, unless
RESET occurs while in stop.
Figure 8-3. ICS clocking switching modes
The ICS_C1[IREFS] bit can be changed at anytime, but the actual switch to the newly
selected clock is shown by the ICS_S[IREFST] bit. When switching between FLL
engaged internal (FEI) and FLL engaged external (FEE) modes, the FLL will lock again
after the switch is completed.
The ICS_C1[CLKS] bits can also be changed at anytime, but the actual switch to the
newly selected clock is shown by the ICS_S[CLKST] bits. If the newly selected clock is
not available, the previous clock remains selected.
8.2.2.1 FLL engaged internal (FEI)
FLL engaged internal (FEI) is the default mode of operation and is entered when all of
the following conditions occur:
• ICS_C1[CLKS] bits are written to 0b
• ICS_C1[IREFS] bit is written to 1b
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
181
Internal clock source (ICS)
In FLL engaged internal mode, the ICSOUT clock is derived from the FLL clock, which
is controlled by the internal reference clock. The FLL loop locks the frequency to the 512
times the internal reference frequency. The ICSLCLK is available for BDC
communications, and the internal reference clock is enabled.
8.2.2.2 FLL engaged external (FEE)
The FLL engaged external (FEE) mode is entered when all of the following conditions
occur:
• ICS_C1[CLKS] bits are written to 00b
• ICS_C1[IREFS] bit written to 0b
• ICS_C1[RDIV] bits are written to divide external reference clock to be within the
range of 31.25 kHz to 39.0625 kHz
In FLL engaged external mode, the ICSOUT clock is derived from the FLL clock, which
is controlled by the external reference clock source. The FLL loop locks the frequency to
the 512 times the external reference frequency, as selected by the ICS_C1[RDIV] bits.
The ICSLCLK is available for BDC communications, and the external reference clock is
enabled.
8.2.2.3 FLL bypassed internal (FBI)
The FLL bypassed internal (FBI) mode is entered when all of the following conditions
occur:
• ICS_C1[CLKS] bits are written to 01
• ICS_C1[IREFS] bit is written to 1
• BDM mode is active or ICS_C2[LP] bit is written to 0
In FLL bypassed internal mode, the ICSOUT clock is derived from the internal reference
clock. The FLL clock is controlled by the internal reference clock, and the FLL loop
locks the FLL frequency to the 512 times the internal reference frequency. The ICSLCLK
will be available for BDC communications, and the internal reference clock is enabled.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
182
Freescale Semiconductor, Inc.
Chapter 8 Clock management
8.2.2.4 FLL bypassed internal low power (FBILP)
The FLL bypassed internal low power (FBILP) mode is entered when all the following
conditions occur:
• ICS_C1[CLKS] bits are written to 01
• ICS_C1[IREFS] bit is written to 1
• BDM mode is not active and ICS_C2[LP] bit is written to 1
In FLL bypassed internal low power mode, the ICSOUT clock is derived from the
internal reference clock and the FLL is disabled. The ICSLCLK will be not be available
for BDC communications, and the internal reference clock is enabled.
8.2.2.5 FLL bypassed external (FBE)
The FLL bypassed external (FBE) mode is entered when all of the following conditions
occur:
• ICS_C1[CLKS] bits are written to 10
• ICS_C1[IREFS] bit is written to 0
• ICS_C1[RDIV] bits are written to divide external reference clock to be within the
range of 31.25 kHz to 39.0625 kHz
• BDM mode is active or ICS_C2[LP] bit is written to 0
In FLL bypassed external mode, the ICSOUT clock is derived from the external reference
clock source. The FLL clock is controlled by the external reference clock, and the FLL
loop locks the FLL frequency to the 512 times the external reference frequency, as
selected by the ICS_C1[RDIV] bits, so that the ICSLCLK will be available for BDC
communications, and the external reference clock is enabled.
8.2.2.6 FLL bypassed external low power (FBELP)
The FLL bypassed external low power (FBELP) mode is entered when all of the
following conditions occur:
• ICS_C1[CLKS] bits are written to 10
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
183
Internal clock source (ICS)
• ICS_C1[IREFS] bit is written to 0
• BDM mode is not active and ICS_C2[LP] bit is written to 1
In FLL bypassed external low power mode, the ICSOUT clock is derived from the
external reference clock source and the FLL is disabled. The ICSLCLK will be not
available for BDC communications. The external reference clock source is enabled.
8.2.2.7 Stop (STOP)
In stop mode, the FLL is disabled and the internal clock source can be enabled or
disabled. The BDC clock is not available and the ICS does not provide MCU clock
source.
Stop mode is entered whenever the MCU enters a stop state. In this mode, all ICS clock
signals are static except in the following cases:
• ICSIRCLK will be active in stop mode when all of the following conditions occur:
• ICS_C1[IRCLKEN] bit is written to 1
• ICS_C1[IREFSTEN] bit is written to 1
• OSCOUT will be active in stop mode when all of the following conditions occur:
• ICS_OSCSC[OSCEN] bit is written to 1
• ICS_OSCSC[OSCSTEN] bit is written to 1
NOTE
The DCO frequency changes from the pre-stop value to its reset
value and the FLL need to re-acquire the lock before the
frequency is stable. Timing sensitive operations must wait for
the FLL acquisition time, tAquire, before executing.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
184
Freescale Semiconductor, Inc.
Chapter 8 Clock management
8.2.3 FLL lock and clock monitor
8.2.3.1 FLL clock lock
In FBE and FEE modes, the clock detector source uses the external reference as the
reference. When FLL is detected from lock to unlock, the ICS_S[LOLS] bit is set. An
interrupt will be generated if ICS_C4[LOLIE] bit is set. ICS_S[LOLS] bit is cleared by
reset or by writing a logic 1 to ICS_S[LOLS] when ICS_S[LOLS] is set. Writing a logic
0 to ICS_S[LOLS] has no effect.
In FBI and FEI modes, the lock detector source uses the internal reference as the
reference. When FLL is detected from lock to unlock, the ICS_S[LOLS] bit is set. An
interrupt will be generated if ICS_S[LOLS] bit is set. ICS_S[LOLS] bit is cleared by
reset or by writing a logic 1 to ICS_S[LOLS] when ICS_S[LOLS] is set. Writing a logic
0 to ICS_S[LOLS] has no effect.
In FBELP and FBILP modes, the FLL is not on, therefore, lock detect function is not
applicable.
8.2.3.2 External reference clock monitor
In FBE, FEE, FEI, or FBI modes, if ICS_C4[CME] bit is written to 1, the clock monitor
is enabled. If the external reference falls below a certain frequency, such as floc_high or
floc_low depending on the ICS_OSCSC[RANGE] bit, the MCU will reset. The
SYS_SRS[CLK] bit will be set to indicate the error.
In FBELP or FBILP modes, the FLL is not on, so the external reference clock monitor
will not function even if ICS_C4[CME] bit is written to 1.
External reference clock monitor uses FLL as the internal reference clock. The FLL must
be functional before ICS_C4[CME] bit is set.
8.3 Initialization / application information
This section provides example code to give some basic direction to a user on how to
initialize and configure the ICS module. The example software is implemented in C
language.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
185
Initialization / application information
8.3.1 Initializing FEI mode
The following code segment demonstrates setting ICS to FEI mode.
Example: 8.3.1.1 FEI mode initialization routine
/* the
ICS_C2
ICS_C1
ICS_C2
ICS_C3
*/
/* the
ICS_C2
ICS_C1
ICS_C2
ICS_C3
*/
/* the
ICS_C2
ICS_C1
ICS_C2
ICS_C3
following code segment demonstrates setting ICS to FEI mode generating 20MHz bus*/
= 0x00;
= 0x04; /* internal reference clock to FLL */
= 0x00; /* BDIV = 0, no prescalar */
= TRIM_VALUE_39K0625HZ; /* FLL output 20MHz, TRIM_VALUE_39K0625HZ is ~0x50 typically
following code segment demonstrates setting ICS to FEI mode generating 5MHz bus*/
= 0x00;
= 0x04; /* internal reference clock to FLL */
= 0x40; /* BDIV = 2, prescalar = 4 */
= TRIM_VALUE_39K0625HZ; /* FLL output 20MHz, TRIM_VALUE_39K0625HZ is ~0x50 typically
following code segment demonstrates
= 0x00;
= 0x04; /* internal reference clock
= 0xA0; /* BDIV = 5, prescalar = 32
= TRIM_VALUE_31K25HZ; /* FLL output
setting ICS to FEI mode generating 500kHz bus*/
to FLL */
*/
16MHz, TRIM_VALUE_31K25HZ is ~0x90 typically */
8.3.2 Initializing FBI mode
The following code segment demonstrates setting ICS to FBI mode.
Example: 8.3.2.1 FBI mode initialization routine
/* the
ICS_C2
ICS_C1
ICS_C2
ICS_C3
following code segment demonstrates setting ICS to FBI mode generating 32768Hz bus*/
= 0x00;
= 0x40;
= 0x00;
= TRIM_VALUE_32K768HZ; /* TRIM_VALUE_31K25HZ is ~0x90 typically */
8.3.3 Initializing FEE mode
The following code segment demonstrates setting ICS to FEE mode.
Example: 8.3.3.1 FEE mode initialization routine
/* the following code segment demonstrates setting ICS to FEE mode generating 8MHZ bus*/
/* supposing external 4MHZ crystal is installed in high gain mode */
ICS_OSCSC = 0x96; /* high-range, high-gain, oscillator required */
while (ICS_OSCINIT == 0); /* waiting until oscillator is ready */
ICS_C1 = 0x10; /* external clock reference (31.25kHz) to FLL, RDIV = 2, external prescalar =
128 */
ICS_C2 = 0x20; /* BDIV = 1, prescalar = 2 */
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
186
Freescale Semiconductor, Inc.
Chapter 8 Clock management
8.3.4 Initializing FBE mode
The following code segment demonstrates setting ICS to FBE mode.
Example: 8.3.4.1 FBE mode initialization routine
/* the following code segment demonstrates setting ICS to FBE mode generating 20MHZ bus*/
/* supposing external 20MHZ crystal is installed in high gain mode */
ICS_OSCSC = 0x96; /* high-range, high-gain, oscillator required */
while (ICS_OSCINIT == 0); /* waiting until oscillator is ready */
ICS_C1 = 0x80; /* external clock reference (20MHZ) to FLL output */
ICS_C2 = 0x00; /* BDIV = 0, prescalar = 1 */
8.3.5 External oscillator (OSC)
The oscillator module provides the reference clock for internal reference clock module
(ICS), the real time counter clock module, and other MCU sub-systems.
OSCINIT
Initialization
Oscillator
High Gain
LP
RANGE
XTLCLK
EN
Oscillator
Low-Powe r
OSCOS
OSCOUT
MCU
EXTAL
XTAL
Rs
RF
X1
C1
C2
Figure 8-4. Oscillator module block diagram
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
187
Initialization / application information
The external oscillator circuit is designed for use with an external crystal or ceramic
resonator to provide an accurate clock source. In its typical configuration, the oscillator is
connected in a Pierce oscillator configuration, as shown in the above figure. This figure
shows only the logical representation of the internal components and may not represent
actual circuitry. The oscillator configuration uses five components:
• Crystal or ceramic, X1
• Fixed capacitor, C1
• Tuning capacitor, C2, which can also be a fixed capacitor
• Feedback resistor, RB
• Series resistor, RS (optional)
8.3.5.1 Bypass mode
In bypass mode (ICS_OSCSC[OSCEN] = 0, ICS_OSCSC[OSCOS] = 0), external clock
module is disabled. EXTAL can be used as the input of external clock source. When
external clock source is not used in this mode, the EXTAL can be used as GPIO or other
function muxed with this pinout. XTAL can be used as GPIO or other function muxed
with its pinout even EXTAL is used as external clock source. The following figure shows
the typical OSC bypass mode connection.
MCU
EXTAL
External Clock Input
XTAL
GPIO
Figure 8-5. OSC bypass mode connection
8.3.5.2 Low-power configuration
In low-power mode, when ICS_OSCSC[OSCEN] = 1, ICS_OSCSC[OSCOS] = 1, and
ICS_OSCSC[HGO] = 0, the series resistor RS is not used. The feedback resistor RF must
be carefully selected to get best performance. The figure below shows the typical OSC
low-gain mode connection.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
188
Freescale Semiconductor, Inc.
Chapter 8 Clock management
MCU
XTAL
EXTAL
RF
X1
C1
C2
Figure 8-6. OSC low-power mode connection
8.3.5.3 High-gain configuration
In high-gain mode, when ICS_OSCSC[OSCEN] = 1, ICS_OSCSC[OSCOS] = 1, and
ICS_OSCSC[HGO] = 1, the series resistor RS must be used. The series resistor RS and
feedback resistor RF must be carefully selected to get best performance. The following
figure shows the typical OSC high-gain mode connection.
MCU
EXTAL
XTAL
RS
RF
X1
C1
C2
Figure 8-7. OSC high-gain mode connection
8.3.5.4 Initializing external oscillator for peripherals
The following code segment demonstrates initializing external oscillator.
Example: 8.3.5.4.1 External oscillator initialization routine
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
189
1 kHz low-power oscillator (LPO)
/* the following code segment demonstrates initializing external oscillator */
/* supposing external 32768Hz crystal is installed in low power mode */
ICS_OSCSC = 0xA0; /* low-range, low-power, oscillator required, ERCLK enabled in stop mode */
while (ICS_OSCSC_OSCINIT == 0); /* waiting until oscillator is ready */
8.4 1 kHz low-power oscillator (LPO)
The 1 kHz low-power oscillator acts as a standalone low-frequency clock source in all
run, wait, and stop3 modes.
8.5 Peripheral clock gating
This device includes a clock gating system to manage the bus clock sources to the
individual peripherals. Using this system, the user can enable or disable the bus clock to
each of the peripherals at the clock source, eliminating unnecessary clocks to peripherals
that are not in use, thereby reducing the overall run and wait mode currents.
Out of reset, all peripheral clocks will be enabled. For lowest possible run wait currents,
user software should disable the clock source to any peripheral not in use. The actual
clock will be enabled or disabled immediately following the write to the Clock Gating
Control registers (SCG_Cx). Any peripheral with a gated clock cannot be used unless its
clock is enabled. Writing to the registers of a peripheral with a disabled clock has no
effect.
Note
User software should disable the peripheral before disabling the
clocks to the peripheral. When clocks are re-enabled to a
peripheral, the peripheral registers need to be re-initialized by
user software.
In stop modes, the bus clock is disabled for all gated peripherals, regardless of the setting
in SCG_Cx registers.
8.6 ICS control registers
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
190
Freescale Semiconductor, Inc.
Chapter 8 Clock management
ICS memory map
Absolute
address
(hex)
Width
Access
(in bits)
Register name
Reset value
Section/
page
3038
ICS Control Register 1 (ICS_C1)
8
R/W
04h
8.6.1/191
3039
ICS Control Register 2 (ICS_C2)
8
R/W
20h
8.6.2/192
303A
ICS Control Register 3 (ICS_C3)
8
R/W
Undefined
8.6.3/193
303B
ICS Control Register 4 (ICS_C4)
8
R/W
00h
8.6.4/193
303C
ICS Status Register (ICS_S)
8
R
10h
8.6.5/194
303E
OSC Status and Control Register (ICS_OSCSC)
8
R/W
00h
8.6.6/195
2
1
0
IREFS
IRCLKEN
IREFSTEN
1
0
0
8.6.1 ICS Control Register 1 (ICS_C1)
Address: 3038h base + 0h offset = 3038h
Bit
Read
Write
Reset
7
6
5
CLKS
0
4
3
RDIV
0
0
0
0
ICS_C1 field descriptions
Field
7–6
CLKS
Description
Clock Source Select
Selects the clock source that controls the bus frequency. The actual bus frequency depends on the value
of the BDIV bits.
00
01
10
11
5–3
RDIV
Output of FLL is selected.
Internal reference clock is selected.
External reference clock is selected.
Reserved.
Reference Divider
Selects the amount to divide down the FLL reference clock selected by the IREFS bits. Resulting
frequency must be in the range 31.25 kHz to 39.0625 kHz.
RDIV
ICS_OSCSC[RANGE]= 0
ICS_OSCSC[RANGE]= 1
000
11
32
001
2
64
010
4
128
011
8
256
100
16
512
101
32
1024
110
64
Reserved
111
128
Reserved
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
191
ICS control registers
ICS_C1 field descriptions (continued)
Field
Description
1. Reset default
2
IREFS
Internal Reference Select
The IREFS bit selects the reference clock source for the FLL.
0
1
1
IRCLKEN
Internal Reference Clock Enable
The IRCLKEN bit enables the internal reference clock for use as ICSIRCLK.
0
1
0
IREFSTEN
External reference clock selected.
Internal reference clock selected.
ICSIRCLK inactive.
ICSIRCLK active.
Internal Reference Stop Enable
The IREFSTEN bit controls whether or not the internal reference clock remains enabled when the ICS
enters stop mode.
0
1
Internal reference clock is disabled in stop.
Internal reference clock stays enabled in stop if IRCLKEN is set or if ICS is in FEI, FBI, or FBILP mode
before entering stop.
1. Reset default
8.6.2 ICS Control Register 2 (ICS_C2)
Address: 3038h base + 1h offset = 3039h
Bit
Read
Write
Reset
7
6
5
BDIV
0
0
4
3
2
LP
1
1
0
0
0
0
0
0
0
ICS_C2 field descriptions
Field
7–5
BDIV
Description
Bus Frequency Divider
Selects the amount to divide down the clock source selected by the CLKS bits. This controls the bus
frequency.
000
001
010
011
100
101
110
111
Encoding 0 - Divides selected clock by 1.
Encoding 1 - Divides selected clock by 2.
Encoding 2 - Divides selected clock by 4.
Encoding 3 - Divides selected clock by 8.
Encoding 4 - Divides selected clock by 16.
Encoding 5 - Divides selected clock by 32.
Encoding 6 - Divides selected clock by 64.
Encoding 7 - Divides selected clock by 128.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
192
Freescale Semiconductor, Inc.
Chapter 8 Clock management
ICS_C2 field descriptions (continued)
Field
4
LP
Description
Low Power Select
The LP bit controls whether the FLL is disabled in FLL bypassed modes.
0
1
Reserved
FLL is not disabled in bypass mode.
FLL is disabled in bypass modes unless BDM is active.
This field is reserved.
This read-only field is reserved and always has the value 0.
8.6.3 ICS Control Register 3 (ICS_C3)
Address: 3038h base + 2h offset = 303Ah
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
x*
x*
x*
x*
SCTRIM
x*
x*
x*
x*
* Notes:
• x = Undefined at reset.
ICS_C3 field descriptions
Field
SCTRIM
Description
Slow Internal Reference Clock Trim Setting
The SCTRIM bits control the slow internal reference clock frequency by controlling the internal reference
clock period. The bits are binary weighted. In other words, bit 1 adjusts twice as much as bit 0. Increasing
the binary value in SCTRIM will increase the period, and decreasing the value will decrease the period. An
additional fine trim bit is available in ICSC4 as the SCFTRIM bit.
8.6.4 ICS Control Register 4 (ICS_C4)
Address: 3038h base + 3h offset = 303Bh
Bit
Read
Write
Reset
7
6
5
LOLIE
0
CME
0
0
0
4
3
2
1
0
0
0
0
SCFTRIM
0
0
0
ICS_C4 field descriptions
Field
7
LOLIE
Description
Loss of Lock Interrupt
Determines if an interrupt request is made following a loss of lock indication. The LOLIE bit has an effect
only when LOLS is set.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
193
ICS control registers
ICS_C4 field descriptions (continued)
Field
Description
0
1
6
Reserved
5
CME
No request on loss of lock.
Generate an interrupt request on loss of lock.
This field is reserved.
This read-only field is reserved and always has the value 0.
Clock Monitor Enable
Determines if a reset request is made following a loss of external clock indication. The CME bit should be
set to a logic 1 only when the ICS is in an operational mode that uses the external clock (FEE or FBE).
0
1
Clock monitor is disabled.
Generate a reset request on loss of external clock.
4–1
Reserved
This field is reserved.
This read-only field is reserved and always has the value 0.
0
SCFTRIM
Slow Internal Reference Clock Fine Trim
The SCFTRIM bit controls the smallest adjustment of the internal reference clock frequency. Setting
SCFTRIM will increase the period and clearing SCFTRIM will decrease the period by the smallest amount
possible.
NOTE: SCFTRIM is loaded during reset from a factory programmed location when not in any BDM mode.
8.6.5 ICS Status Register (ICS_S)
Address: 3038h base + 4h offset = 303Ch
Bit
Read
7
6
5
4
3
LOLS
LOCK
0
IREFST
0
0
0
1
2
1
CLKST
0
0
Write
Reset
0
0
0
0
ICS_S field descriptions
Field
7
LOLS
Description
Loss of Lock Status
This bit is a sticky indication of lock status for the FLL. LOLS is set when lock detection is enabled and
after acquiring lock, the FLL output frequency has fallen outside the lock exit frequency tolerance, Dunl.
LOLIE determines whether an interrupt request is made when set. LOLS is cleared by reset or by writing a
logic 1 to LOLS when LOLS is set. Writing a logic 0 to LOLS has no effect.
0
1
6
LOCK
FLL has not lost lock since LOLS was last cleared.
FLL has lost lock since LOLS was last cleared.
Lock Status
Indicates whether the FLL has acquired lock. Lock detection is disabled when FLL is disabled. If the lock
status bit is set then changing the value of any of the following bits IREFS, RDIV[2:0], or, if in FEI or FBI
modes, TRIM[7:0] will cause the lock status bit to clear and stay cleared until the FLL has reacquired lock.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
194
Freescale Semiconductor, Inc.
Chapter 8 Clock management
ICS_S field descriptions (continued)
Field
Description
Stop mode entry will also cause the lock status bit to clear and stay cleared until the FLL has reacquired
lock.
NOTE: Wait at least for Tqcquire after wake from stop mode to start timing critical tasks like serial
communication. Do not need to wait for LOCK bit to set after wake from stop mode.
0
1
5
Reserved
4
IREFST
This field is reserved.
This read-only field is reserved and always has the value 0.
Internal Reference Status
The IREFST bit indicates the current source for the reference clock. The IREFST bit does not update
immediately after a write to the IREFS bit due to internal synchronization between clock domains.
0
1
3–2
CLKST
Source of reference clock is external clock.
Source of reference clock is internal clock.
Clock Mode Status
The CLKST bits indicate the current clock mode. The CLKST bits don't update immediately after a write to
the CLKS bits due to internal synchronization between clock domains.
00
01
10
11
Reserved
FLL is currently unlocked.
FLL is currently locked.
Output of FLL is selected.
FLL Bypassed, internal reference clock is selected.
FLL Bypassed, external reference clock is selected.
Reserved.
This field is reserved.
This read-only field is reserved and always has the value 0.
8.6.6 OSC Status and Control Register (ICS_OSCSC)
Address: 3038h base + 6h offset = 303Eh
Bit
Read
Write
Reset
7
6
OSCEN
0
0
5
4
OSCSTEN
OSCOS
0
0
0
3
0
0
2
1
RANGE
HGO
0
0
0
OSCINIT
0
ICS_OSCSC field descriptions
Field
7
OSCEN
Description
OSC Enable
The OSCEN bit enables the external clock for use as ICSERCLK.
0
1
OSC module disabled.
OSC module enabled.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
195
System clock gating control registers
ICS_OSCSC field descriptions (continued)
Field
Description
6
Reserved
This field is reserved.
This read-only field is reserved and always has the value 0.
5
OSCSTEN
OSC Enable in Stop mode
The OSCSTEN bit controls whether or not the OSC clock remains enabled when MCU enters stop mode.
0
1
4
OSCOS
OSC Output Select
This bit is used to select the output clock of OSC module.
0
1
3
Reserved
2
RANGE
Frequency Range Select
Selects the frequency range for the OSC module.
Low frequency range of 31.25kHz - 39.0625kHz.
High frequency range of 4 - 20MHz.
High Gain Oscillator Select
The HGO bit controls the OSC mode of operation.
0
1
0
OSCINIT
External clock source from EXTAL pin is selected.
Oscillator clock source is selected.
This field is reserved.
This read-only field is reserved and always has the value 0.
0
1
1
HGO
OSC clock is disabled in stop.
OSC stays enabled in stop if OSCEN is set or if ICS is set or ICS requests to be active before entering
stop.
Low gain mode.
High gain mode.
OSC Initialization
This bit set after the initialization cycles of oscillator completes.
0
1
Oscillator initialization not completes.
Oscillator initialization completed.
8.7 System clock gating control registers
SCG memory map
Absolute
address
(hex)
Register name
Width
Access
(in bits)
Reset value
Section/
page
300C
System Clock Gating Control 1 Register (SCG_C1)
8
R/W
A3h
8.7.1/197
300D
System Clock Gating Control 2 Register (SCG_C2)
8
R/W
3Ch
8.7.2/198
300E
System Clock Gating Control 3 Register (SCG_C3)
8
R/W
36h
8.7.3/199
300F
System Clock Gating Control 4 Register (SCG_C4)
8
R/W
A9h
8.7.4/200
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
196
Freescale Semiconductor, Inc.
Chapter 8 Clock management
8.7.1 System Clock Gating Control 1 Register (SCG_C1)
This high page register contains control bits to enable or disable the bus clock to the
FTMs, MTIMs, and RTC modules. Gating off the clocks to unused peripherals is used to
reduce the MCU's run and wait currents.
NOTE
User software should disable the peripheral before disabling the
clocks to the peripheral. When clocks are re-enabled to a
peripheral, the peripheral registers need to be re-initialized by
user software.
Address: 300Ch base + 0h offset = 300Ch
Bit
Read
Write
Reset
7
6
5
FTM2
0
FTM0
1
0
1
4
3
2
0
0
0
0
1
0
MTIM0
RTC
1
1
SCG_C1 field descriptions
Field
7
FTM2
Description
FTM2 Clock Gate Control
This bit controls the clock gate to the FTM2 module.
0
1
6
Reserved
5
FTM0
This field is reserved.
This read-only field is reserved and always has the value 0.
FTM0 Clock Gate Control
This bit controls the clock gate to the FTM0 module.
0
1
4–2
Reserved
1
MTIM0
Bus clock to the FTM0 module is disabled.
Bus clock to the FTM0 module is enabled.
This field is reserved.
This read-only field is reserved and always has the value 0.
MTIM0 Clock Gate Control
This bit controls the clock gate to the MTIM0 module.
0
1
0
RTC
Bus clock to the FTM2 module is disabled.
Bus clock to the FTM2 module is enabled.
Bus clock to the MTIM0 module is disabled.
Bus clock to the MTIM0 module is enabled.
RTC Clock Gate Control
This bit controls the clock gate to the RTC module.
0
1
Bus clock to the MTRTCIM1 module is disabled.
Bus clock to the RTC module is enabled.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
197
System clock gating control registers
8.7.2 System Clock Gating Control 2 Register (SCG_C2)
This high-page register contains control bits to enable or disable the bus clock to the
DBG, NVM, CRC, and IPC modules. Gating off the clocks to unused peripherals is used
to reduce the MCU's run and wait currents.
NOTE
User software should disable the peripheral before disabling the
clocks to the peripheral. When clocks are re-enabled to a
peripheral, the peripheral registers need to be re-initialized by
user software.
Address: 300Ch base + 1h offset = 300Dh
Bit
Read
Write
Reset
7
6
0
0
0
5
4
3
2
DBG
NVM
IPC
CRC
1
1
1
1
1
0
0
0
0
SCG_C2 field descriptions
Field
7–6
Reserved
5
DBG
Description
This field is reserved.
This read-only field is reserved and always has the value 0.
DBG Clock Gate Control
This bit controls the clock gate to the DBG module.
0
1
4
NVM
NVM Clock Gate Control
This bit controls the clock gate to the NVM module.
0
1
3
IPC
This bit controls the clock gate to the IPC module.
Bus clock to the IPC module is disabled.
Bus clock to the IPC module is enabled.
CRC Clock Gate Control
This bit controls the clock gate to the CRC module.
0
1
Reserved
Bus clock to the NVM module is disabled.
Bus clock to the NVM module is enabled.
IPC Clock Gate Control
0
1
2
CRC
Bus clock to the DBG module is disabled.
Bus clock to the DBG module is enabled.
Bus clock to the CRC module is disabled.
Bus clock to the CRC module is enabled.
This field is reserved.
This read-only field is reserved and always has the value 0.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
198
Freescale Semiconductor, Inc.
Chapter 8 Clock management
8.7.3 System Clock Gating Control 3 Register (SCG_C3)
This high page register contains control bits to enable or disable the bus clock to the SCI,
SPI, IIC modules. Gating off the clocks to unused peripherals is used to reduce the
MCU's run and wait currents.
NOTE
User software should disable the peripheral before disabling the
clocks to the peripheral. When clocks are re-enabled to a
peripheral, the peripheral registers need to be re-initialized by
user software.
Address: 300Ch base + 2h offset = 300Eh
Bit
Read
Write
Reset
7
6
0
0
0
5
4
3
SCI1
SCI0
0
1
1
0
2
1
0
SPI0
IIC
0
1
1
0
SCG_C3 field descriptions
Field
7–6
Reserved
5
SCI1
Description
This field is reserved.
This read-only field is reserved and always has the value 0.
SCI1 Clock Gate Control
This bit controls the clock gate to the SCI1 module.
0
1
4
SCI0
SCI0 Clock Gate Control
This bit controls the clock gate to the SCI0 module.
0
1
3
Reserved
2
SPI0
Bus clock to the SCI0 module is disabled.
Bus clock to the SCI0 module is enabled.
This field is reserved.
This read-only field is reserved and always has the value 0.
SPI0 Clock Gate Control
This bit controls the clock gate to the SPI0 module.
0
1
1
IIC
Bus clock to the SCI1 module is disabled.
Bus clock to the SCI1 module is enabled.
Bus clock to the SPI0 module is disabled.
Bus clock to the SPI0 module is enabled.
IIC Clock Gate Control
This bit controls the clock gate to the IIC module.
0
1
Bus clock to the IIC module is disabled.
Bus clock to the IIC module is enabled.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
199
System clock gating control registers
SCG_C3 field descriptions (continued)
Field
0
Reserved
Description
This field is reserved.
This read-only field is reserved and always has the value 0.
8.7.4 System Clock Gating Control 4 Register (SCG_C4)
This high page register contains control bits to enable or disable the bus clock to the
ACMP, ADC, IRQ, and KBI modules. Gating off the clocks to unused peripherals is used
to reduce the MCU's run and wait currents.
NOTE
User software should disable the peripheral before disabling the
clocks to the peripheral. When clocks are re-enabled to a
peripheral, the peripheral registers need to be re-initialized by
user software.
Address: 300Ch base + 3h offset = 300Fh
Bit
Read
Write
Reset
7
6
ACMP
0
1
0
5
4
3
ADC
0
IRQ
1
0
1
2
1
0
0
0
KBI0
0
1
SCG_C4 field descriptions
Field
7
ACMP
Description
ACMP Clock Gate Control
This bit controls the clock gate to the ACMP module.
0
1
6
Reserved
5
ADC
This field is reserved.
This read-only field is reserved and always has the value 0.
ADC Clock Gate Control
This bit controls the clock gate to the ADC module.
0
1
4
Reserved
3
IRQ
Bus clock to the ACMP module is disabled.
Bus clock to the ACMP module is enabled.
Bus clock to the ADC module is disabled.
Bus clock to the ADC module is enabled.
This field is reserved.
This read-only field is reserved and always has the value 0.
IRQ Clock Gate Control
This bit controls the clock gate to the IRQ module.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
200
Freescale Semiconductor, Inc.
Chapter 8 Clock management
SCG_C4 field descriptions (continued)
Field
Description
0
1
2–1
Reserved
0
KBI0
Bus clock to the IRQ module is disabled.
Bus clock to the IRQ module is enabled.
This field is reserved.
This read-only field is reserved and always has the value 0.
KBI0 Clock Gate Control
This bit controls the clock gate to the KBI0 module.
0
1
Bus clock to the KBI0 module is disabled.
Bus clock to the KBI0 module is enabled.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
201
System clock gating control registers
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
202
Freescale Semiconductor, Inc.
Chapter 9
Chip configurations
9.1 Introduction
This chapter provides details on the individual modules of the device. It includes:
• device block diagrams highlighting the specific modules and pin-outs
• specific module-to-module interactions not necessarily discussed in the individual
module chapters, and
• links for more information
9.2 Core modules
9.2.1 Central processor unit (CPU)
The HCS08 CPU is fully source- and object-code-compatible with the M68HC08 CPU.
Several instructions and enhanced addressing modes were added to improve C compiler
efficiency and to support a new background debug system which replaces the monitor
mode of earlier M68HC08 microcontrollers.
9.2.2 Debug module (DBG)
The DBG module implements an on-chip ICE (in-circuit emulation) system and allows
non-intrusive debug of application software by providing an on-chip trace buffer with
flexible triggering capability. The trigger can also provide extended breakpoint capacity.
The on-chip ICE system is optimized for the HCS08 8-bit architecture and supports 64
KB of memory space.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
203
System modules
9.3 System modules
9.3.1 Watchdog (WDOG)
The watchdog timer (WDOG) module triggers a system reset if it is allowed to time out.
The program is expected to periodically reload the watchdog timer, thereby preventing it
from timing out. However, if a fault occurs that causes the program to stop working, the
timer will not be reloaded and it will time out. The resulting trigger of a system reset
brings the system back from an unresponsive state into a normal state.
9.4 Clock module
This device has ICS, XOSC, and LPO clock modules.
The internal clock source (ICS) module provides several clock source options for this
device. The module contains a frequency-locked loop (FLL) that is controllable by either
an internal or external reference clock. The module can select clock from the FLL or
bypass the FLL as a source of the MCU system clock. The selected clock source is
passed through a reduced bus divider, which allows a lower output clock frequency to be
derived.
The external oscillator (XOSC) module allows an external crystal, ceramic resonator, or
other external clock source to produce the external reference clock. The output of XOSC
module can be used as the reference of ICS to generate system bus clock, and/or clock
source of watchdog (WDOG), real-time counter (RTC), and analog-to-digital (ADC)
modules.
The low-power oscillator (LPO) module is an on-chip low-power oscillator providing 1
kHz reference clock to RTC and watchdog (WDOG).
The following figures show the block diagram, highlighting the clock modules.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
204
Freescale Semiconductor, Inc.
Port A
Port B
CPU
PTB0/KBI0P4/RxD0/ADP4
PTB1/KBI0P5/TxD0/ADP5
PTB2/KBI0P6/SPSCK0/ADP6
PTB3/KBI0P7/MOSI0/ADP7
PTB4/FTM2CH4/MISO0 3
PTB5/FTM2CH5/SS0 3
PTB6/SDA/XTAL
PTB7/SCL/EXTAL
Port C
HCS08 CORE
PTA0/KBI0P0/FTM0CH0/ACMP0/ADP0
PTA1/KBI0P1/FTM0CH1/ACMP1/ADP1
PTA2/KBI0P2/RxD0/SDA1
PTA3/KBI0P3/TxD0/SCL1
PTA4/ACMPO/BKGD/MS 2
PTA5/IRQ/TCLK0/RESET
PTA6/FTM2FAULT1/ADP2
PTA7/FTM2FAULT2/ADP3
PTC0/FTM2CH0/ADP8
PTC1/FTM2CH1/ADP9
PTC2/FTM2CH2/ADP10
PTC3/FTM2CH3/ADP11
PTC4/FTM0CH0
PTC5/FTM0CH1
PTC6/RxD1
PTC7/TxD1
Port D
Chapter 9 Chip configurations
PTD0/FTM2CH23
PTD1/FTM2CH33
PTD2
PTD3
PTD4
PTD5
PTD6
PTD7
BDC
SYSTEM INTEGRATION
MODULE (SIM)
WDG
IRQ
1 kHz OSC
LVD
KEYBOARD INTERRUPT
MODULE (KBI0)
INTER-INTEGRATED
CIRCUIT BUS (IIC)
8-BIT MODULO TIMER
INTERRUPT PRIORITY
(MTIM0)
CONTROLLER(IPC)
2-CH FLEX TIMER
ON-CHIP ICE AND
DEBUG MODUE (DBG)
MODULE (FTM0)
6-CH FLEX TIMER
MODULE (FTM2)
SERIAL COMMUNICATION
INTERFACE (SCI0)
USER EEPROM
MC9S08PA16 = 256 bytes
MC9S08PA8 = 256 bytes
USER RAM
MC9S08PA16 = 2,048 bytes
MC9S08PA8 = 2,048 bytes
20 MHz INTERNAL CLOCK
SOURCE (ICS)
EXTAL
XTAL
VDD
VSS
VDD4
VSS 4
VSS 4
VREFH
VDDA
VREFL
VSSA
EXTERNAL OSCILLATOR
SOURCE (XOSC)
SERIAL COMMUNICATION
INTERFACE (SCI1)
ANALOG COMPARATOR
(ACMP)
Port E
USER FLASH
MC9S08PA16 = 16,384 bytes
MC9S08PA8 = 8,192 bytes
REAL-TIME CLOCK
(RTC)
PTE0/SPSCK0
PTE1/MOSI0
PTE2/MISO0
PTE3/BUSOUT
PTE4/TCLK2
SERIAL PERIPHERAL
INTERFACE (SPI0)
POWER MANAGEMENT
CONTROLLER (PMC)
12-CH 12-BIT
ANALOG-TO-DIGITAL
CONVERTER(ADC)
CYCLIC REDUNDANCY
CHECK (CRC)
1. PTA2 and PTA3 operate as true-open drain when working as output.
2. PTA4/ACMPO/BKGD/MS is an output-only pin when used as port pin.
3. PTD0, PTD1, PTB4 and PTB5 can provide high sink/source current drive.
4. The secondary power pair of V DD and VSS (pin 11, 27 and 28 in 44-pin package) are not bonded in 32-pin, 20-pin or 16-pin packages.
Figure 9-1. Device block diagram highlighting clock modules and pins
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
205
Memory
9.5 Memory
9.5.1 Random-access-memory (RAM)
This device contains2,048 byte static RAM and addresses 0x0040 through 0x083F. The
location of the stack RAM is programmable. The 16-bit stack pointer allows the stack to
be anywhere in the 64 KB memory space.
9.5.2 Non-volatile memory (NVM)
The NVM is ideal for single-supply applications allowing for field programming without
requiring external high voltage sources from program or erase operations. The NVM
module includes a memory controller that executes commands to modify NVM contents.
This device contains two types of non-volatile memory: Flash memory and EEPROM.
The Flash is mostly used for the storage of program and constant. The EEPROM is used
for storing frequently modified non-volatile data.
Non-volatile memory (NVM) includes:
• Flash memory
• MC9S08PA16—16,384 bytes: 32 sectors of 512 bytes
• MC9S08PA8—8,192 bytes: 16 sectors of 512 bytes
• EEPROM memory
• MC9S08PA16—256 bytes: 128 sector of 2 bytes
• MC9S08PA8—256 bytes: 128 sector of 2 bytes
9.6 Power modules
This device contains on-chip regulator for various operational power modes of run, wait,
and stop3 modes. The low voltage detect (LVD) system allows the system to protect
against low voltage conditions in order to protect memory contents and control MCU
system states during supply voltage variations. The on-chip bandgap reference (≈1.2V),
which is internally connected to ADC channel, provides independent accuracy reference
which will not drop over the full operating voltage even when the operating voltage is
falling.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
206
Freescale Semiconductor, Inc.
Chapter 9 Chip configurations
9.7 Security
9.7.1 Cyclic redundancy check (CRC)
The CRC generator module uses a programmable polynomial to generate CRC code for
error detection. The 16-bit code is calculated for 8-bit of data at a time, and provides a
simple check for all accessible memory locations in flash and RAM.
The following figure shows the device block diagram highlighting the CRC module.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
207
Port A
Port B
CPU
PTB0/KBI0P4/RxD0/ADP4
PTB1/KBI0P5/TxD0/ADP5
PTB2/KBI0P6/SPSCK0/ADP6
PTB3/KBI0P7/MOSI0/ADP7
PTB4/FTM2CH4/MISO0 3
PTB5/FTM2CH5/SS0 3
PTB6/SDA/XTAL
PTB7/SCL/EXTAL
Port C
HCS08 CORE
PTA0/KBI0P0/FTM0CH0/ACMP0/ADP0
PTA1/KBI0P1/FTM0CH1/ACMP1/ADP1
PTA2/KBI0P2/RxD0/SDA1
PTA3/KBI0P3/TxD0/SCL1
PTA4/ACMPO/BKGD/MS 2
PTA5/IRQ/TCLK0/RESET
PTA6/FTM2FAULT1/ADP2
PTA7/FTM2FAULT2/ADP3
PTC0/FTM2CH0/ADP8
PTC1/FTM2CH1/ADP9
PTC2/FTM2CH2/ADP10
PTC3/FTM2CH3/ADP11
PTC4/FTM0CH0
PTC5/FTM0CH1
PTC6/RxD1
PTC7/TxD1
Port D
Security
PTD0/FTM2CH23
PTD1/FTM2CH33
PTD2
PTD3
PTD4
PTD5
PTD6
PTD7
BDC
SYSTEM INTEGRATION
MODULE (SIM)
WDG
IRQ
1 kHz OSC
LVD
KEYBOARD INTERRUPT
MODULE (KBI0)
INTER-INTEGRATED
CIRCUIT BUS (IIC)
8-BIT MODULO TIMER
INTERRUPT PRIORITY
(MTIM0)
CONTROLLER(IPC)
2-CH FLEX TIMER
ON-CHIP ICE AND
DEBUG MODUE (DBG)
MODULE (FTM0)
6-CH FLEX TIMER
MODULE (FTM2)
SERIAL COMMUNICATION
INTERFACE (SCI0)
USER EEPROM
MC9S08PA16 = 256 bytes
MC9S08PA8 = 256 bytes
USER RAM
MC9S08PA16 = 2,048 bytes
MC9S08PA8 = 2,048 bytes
20 MHz INTERNAL CLOCK
SOURCE (ICS)
EXTAL
XTAL
VDD
VSS
VDD4
VSS 4
VSS 4
VREFH
VDDA
VREFL
VSSA
EXTERNAL OSCILLATOR
SOURCE (XOSC)
SERIAL COMMUNICATION
INTERFACE (SCI1)
ANALOG COMPARATOR
(ACMP)
Port E
USER FLASH
MC9S08PA16 = 16,384 bytes
MC9S08PA8 = 8,192 bytes
REAL-TIME CLOCK
(RTC)
PTE0/SPSCK0
PTE1/MOSI0
PTE2/MISO0
PTE3/BUSOUT
PTE4/TCLK2
SERIAL PERIPHERAL
INTERFACE (SPI0)
POWER MANAGEMENT
CONTROLLER (PMC)
12-CH 12-BIT
ANALOG-TO-DIGITAL
CONVERTER(ADC)
CYCLIC REDUNDANCY
CHECK (CRC)
1. PTA2 and PTA3 operate as true-open drain when working as output.
2. PTA4/ACMPO/BKGD/MS is an output-only pin when used as port pin.
3. PTD0, PTD1, PTB4 and PTB5 can provide high sink/source current drive.
4. The secondary power pair of V DD and VSS (pin 11, 27 and 28 in 44-pin package) are not bonded in 32-pin, 20-pin or 16-pin packages.
Figure 9-2. Device block diagram highlighting CRC module
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
208
Freescale Semiconductor, Inc.
Chapter 9 Chip configurations
9.8 Timers
9.8.1 FlexTimer module (FTM)
The FlexTimer module is an up to six-channel timer that supports input capture, output
compare, and the generation of PWM signals to control electric motor and power
management applications. FTM time reference is a 16-bit counter that can be used as an
unsigned or signed counter.
This MCU contains up to two FTM modules with one 6-channel FTM and one 2-channel
FTMs. FTM0 has two independent channels, are fully compatible to the TPM. FTM2,
which has six channels, is backward compatible to the TPM for simple configuration and
operation, and features hardware deadtime insertion, pairs with complementary outputs,
generation of triggers, and fault inputs.
Each FTM module has independent external clock input. The following table summarizes
the external signals of FTM modules.
Table 9-1. FTM module external signals
FTM
FTM0
FTM2
Functions
Default
Alternate
channel 0
PTA0/FTM0CH0
PTC4/FTM0CH0
channel 1
PTA1/FTM0CH1
PTC5/FTM0CH1
alternate clock
PTA5/TCLK0
channel 0
PTC0/FTM2CH0
channel 1
PTC1/FTM2CH1
channel 2
PTC2/FTM2CH2
PTD0/FTM2CH2
channel 3
PTC3/FTM2CH3
PTD1/FTM2CH3
channel 4
PTB4/FTM2CH4
channel 5
PTB5/FTM2CH5
fault 1
PTA6/FTM2FAULT1
fault 2
PTA7/FTM2FAULT2
alternate clock
PTE4/TCLK2
The following figure shows the device block diagram highlighting FTM modules and
pins.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
209
Port A
Port B
CPU
PTB0/KBI0P4/RxD0/ADP4
PTB1/KBI0P5/TxD0/ADP5
PTB2/KBI0P6/SPSCK0/ADP6
PTB3/KBI0P7/MOSI0/ADP7
PTB4/FTM2CH4/MISO0 3
PTB5/FTM2CH5/SS0 3
PTB6/SDA/XTAL
PTB7/SCL/EXTAL
Port C
HCS08 CORE
PTA0/KBI0P0/FTM0CH0/ACMP0/ADP0
PTA1/KBI0P1/FTM0CH1/ACMP1/ADP1
PTA2/KBI0P2/RxD0/SDA1
PTA3/KBI0P3/TxD0/SCL1
PTA4/ACMPO/BKGD/MS 2
PTA5/IRQ/TCLK0/RESET
PTA6/FTM2FAULT1/ADP2
PTA7/FTM2FAULT2/ADP3
PTC0/FTM2CH0/ADP8
PTC1/FTM2CH1/ADP9
PTC2/FTM2CH2/ADP10
PTC3/FTM2CH3/ADP11
PTC4/FTM0CH0
PTC5/FTM0CH1
PTC6/RxD1
PTC7/TxD1
Port D
Timers
PTD0/FTM2CH23
PTD1/FTM2CH33
PTD2
PTD3
PTD4
PTD5
PTD6
PTD7
BDC
SYSTEM INTEGRATION
MODULE (SIM)
WDG
IRQ
1 kHz OSC
LVD
KEYBOARD INTERRUPT
MODULE (KBI0)
INTER-INTEGRATED
CIRCUIT BUS (IIC)
8-BIT MODULO TIMER
INTERRUPT PRIORITY
(MTIM0)
CONTROLLER(IPC)
2-CH FLEX TIMER
ON-CHIP ICE AND
DEBUG MODUE (DBG)
MODULE (FTM0)
6-CH FLEX TIMER
MODULE (FTM2)
SERIAL COMMUNICATION
INTERFACE (SCI0)
USER EEPROM
MC9S08PA16 = 256 bytes
MC9S08PA8 = 256 bytes
USER RAM
MC9S08PA16 = 2,048 bytes
MC9S08PA8 = 2,048 bytes
20 MHz INTERNAL CLOCK
SOURCE (ICS)
EXTAL
XTAL
VDD
VSS
VDD4
VSS 4
VSS 4
VREFH
VDDA
VREFL
VSSA
EXTERNAL OSCILLATOR
SOURCE (XOSC)
SERIAL COMMUNICATION
INTERFACE (SCI1)
ANALOG COMPARATOR
(ACMP)
Port E
USER FLASH
MC9S08PA16 = 16,384 bytes
MC9S08PA8 = 8,192 bytes
REAL-TIME CLOCK
(RTC)
PTE0/SPSCK0
PTE1/MOSI0
PTE2/MISO0
PTE3/BUSOUT
PTE4/TCLK2
SERIAL PERIPHERAL
INTERFACE (SPI0)
POWER MANAGEMENT
CONTROLLER (PMC)
12-CH 12-BIT
ANALOG-TO-DIGITAL
CONVERTER(ADC)
CYCLIC REDUNDANCY
CHECK (CRC)
1. PTA2 and PTA3 operate as true-open drain when working as output.
2. PTA4/ACMPO/BKGD/MS is an output-only pin when used as port pin.
3. PTD0, PTD1, PTB4 and PTB5 can provide high sink/source current drive.
4. The secondary power pair of V DD and VSS (pin 11, 27 and 28 in 44-pin package) are not bonded in 32-pin, 20-pin or 16-pin packages.
Figure 9-3. Device block diagram highlighting FTM modules and pins
9.8.1.1 FTM0 interconnection
SCI0 TxD signal can be modulated by FTM0 channel 0 PWM output. Please refer to
SCI0 TxD modulation.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
210
Freescale Semiconductor, Inc.
Chapter 9 Chip configurations
SCI0 RxD signal can be tagged by FTM0 channel 1 input capture function. Please refer
to SCI0 RxD filter.
9.8.1.2 FTM2 interconnection
FTM2 supports three PWM synchronization sources:
• Trigger0 is connected to the output of ACMP.
• Trigger1 is connected to FTM0 channel 0 output.
• Trigger2 is a software trigger by writing 1 to the SYS_SOPT2[FTMSYNC] bit.
Please refer to System interconnection.
FTM2 supports four FTM fault sources:
•
•
•
•
Fault 0 is connected to ACMP output.
Fault1 is connected to PTA6.
Fault 2 is connected to PTA7.
Fault 3 is not used. Please refer to System interconnection.
FTM2 supports seven FTM triggers including an initialization trigger and six channel
triggers to other modules. The initialization trigger and match trigger are optionally
connected to ADC hardware trigger via an 8-bit delay counter. All other triggers are not
used in this device. Please refer to System interconnection.
9.8.2 8-bit modulo timer (MTIM)
MTIM0 8-bit modulo timer module that provide a circuit of selectable clock sources and
a programmable interrupt. The MTIM module contain an 8-bit modulo counter, which
can operate as a free-running counter or a modulo counter. A timer overflow interrupt can
be enabled to generate periodic interrupts for time-based software events. MTIM module
may also use external clock source.
The following figure shows the device block diagram highlighting the MTIM module and
pins.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
211
Port A
Port B
CPU
PTB0/KBI0P4/RxD0/ADP4
PTB1/KBI0P5/TxD0/ADP5
PTB2/KBI0P6/SPSCK0/ADP6
PTB3/KBI0P7/MOSI0/ADP7
PTB4/FTM2CH4/MISO0 3
PTB5/FTM2CH5/SS0 3
PTB6/SDA/XTAL
PTB7/SCL/EXTAL
Port C
HCS08 CORE
PTA0/KBI0P0/FTM0CH0/ACMP0/ADP0
PTA1/KBI0P1/FTM0CH1/ACMP1/ADP1
PTA2/KBI0P2/RxD0/SDA1
PTA3/KBI0P3/TxD0/SCL1
PTA4/ACMPO/BKGD/MS 2
PTA5/IRQ/TCLK0/RESET
PTA6/FTM2FAULT1/ADP2
PTA7/FTM2FAULT2/ADP3
PTC0/FTM2CH0/ADP8
PTC1/FTM2CH1/ADP9
PTC2/FTM2CH2/ADP10
PTC3/FTM2CH3/ADP11
PTC4/FTM0CH0
PTC5/FTM0CH1
PTC6/RxD1
PTC7/TxD1
Port D
Timers
PTD0/FTM2CH23
PTD1/FTM2CH33
PTD2
PTD3
PTD4
PTD5
PTD6
PTD7
BDC
SYSTEM INTEGRATION
MODULE (SIM)
WDG
IRQ
1 kHz OSC
LVD
KEYBOARD INTERRUPT
MODULE (KBI0)
INTER-INTEGRATED
CIRCUIT BUS (IIC)
8-BIT MODULO TIMER
INTERRUPT PRIORITY
(MTIM0)
CONTROLLER(IPC)
2-CH FLEX TIMER
ON-CHIP ICE AND
DEBUG MODUE (DBG)
MODULE (FTM0)
6-CH FLEX TIMER
MODULE (FTM2)
SERIAL COMMUNICATION
INTERFACE (SCI0)
USER EEPROM
MC9S08PA16 = 256 bytes
MC9S08PA8 = 256 bytes
USER RAM
MC9S08PA16 = 2,048 bytes
MC9S08PA8 = 2,048 bytes
20 MHz INTERNAL CLOCK
SOURCE (ICS)
EXTAL
XTAL
VDD
VSS
VDD4
VSS 4
VSS 4
VREFH
VDDA
VREFL
VSSA
EXTERNAL OSCILLATOR
SOURCE (XOSC)
SERIAL COMMUNICATION
INTERFACE (SCI1)
ANALOG COMPARATOR
(ACMP)
Port E
USER FLASH
MC9S08PA16 = 16,384 bytes
MC9S08PA8 = 8,192 bytes
REAL-TIME CLOCK
(RTC)
PTE0/SPSCK0
PTE1/MOSI0
PTE2/MISO0
PTE3/BUSOUT
PTE4/TCLK2
SERIAL PERIPHERAL
INTERFACE (SPI0)
POWER MANAGEMENT
CONTROLLER (PMC)
12-CH 12-BIT
ANALOG-TO-DIGITAL
CONVERTER(ADC)
CYCLIC REDUNDANCY
CHECK (CRC)
1. PTA2 and PTA3 operate as true-open drain when working as output.
2. PTA4/ACMPO/BKGD/MS is an output-only pin when used as port pin.
3. PTD0, PTD1, PTB4 and PTB5 can provide high sink/source current drive.
4. The secondary power pair of V DD and VSS (pin 11, 27 and 28 in 44-pin package) are not bonded in 32-pin, 20-pin or 16-pin packages.
Figure 9-4. Block diagram highlighting the MTIM module and pins
9.8.2.1 MTIM0 as ADC hardware trigger
MTIM0 overflow can be used as ADC hardware trigger. See ADC hardware trigger for
details.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
212
Freescale Semiconductor, Inc.
Chapter 9 Chip configurations
9.8.3 Real-time counter (RTC)
The real-time counter (RTC) consists of one 16-bit counter, one 16-bit comparator,
several binary-based and decimal-based prescaler dividers, two clock sources, and one
programmable periodic interrupt. This module can be used for time-of-day, calendar or
any task scheduling functions. It can also serve as a cyclic wakeup from low power
modes without external components. RTC overflow trigger can be used as hardware
trigger for ADC module. Furthermore, when the trigger is enabled, RTC can toggle
external pin function if the counter overflows.
The following figure shows the device block diagram highlighting RTC module and pin.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
213
Port A
Port B
CPU
PTB0/KBI0P4/RxD0/ADP4
PTB1/KBI0P5/TxD0/ADP5
PTB2/KBI0P6/SPSCK0/ADP6
PTB3/KBI0P7/MOSI0/ADP7
PTB4/FTM2CH4/MISO0 3
PTB5/FTM2CH5/SS0 3
PTB6/SDA/XTAL
PTB7/SCL/EXTAL
Port C
HCS08 CORE
PTA0/KBI0P0/FTM0CH0/ACMP0/ADP0
PTA1/KBI0P1/FTM0CH1/ACMP1/ADP1
PTA2/KBI0P2/RxD0/SDA1
PTA3/KBI0P3/TxD0/SCL1
PTA4/ACMPO/BKGD/MS 2
PTA5/IRQ/TCLK0/RESET
PTA6/FTM2FAULT1/ADP2
PTA7/FTM2FAULT2/ADP3
PTC0/FTM2CH0/ADP8
PTC1/FTM2CH1/ADP9
PTC2/FTM2CH2/ADP10
PTC3/FTM2CH3/ADP11
PTC4/FTM0CH0
PTC5/FTM0CH1
PTC6/RxD1
PTC7/TxD1
Port D
Timers
PTD0/FTM2CH23
PTD1/FTM2CH33
PTD2
PTD3
PTD4
PTD5
PTD6
PTD7
BDC
SYSTEM INTEGRATION
MODULE (SIM)
WDG
IRQ
1 kHz OSC
LVD
KEYBOARD INTERRUPT
MODULE (KBI0)
INTER-INTEGRATED
CIRCUIT BUS (IIC)
8-BIT MODULO TIMER
INTERRUPT PRIORITY
(MTIM0)
CONTROLLER(IPC)
2-CH FLEX TIMER
ON-CHIP ICE AND
DEBUG MODUE (DBG)
MODULE (FTM0)
6-CH FLEX TIMER
MODULE (FTM2)
SERIAL COMMUNICATION
INTERFACE (SCI0)
USER EEPROM
MC9S08PA16 = 256 bytes
MC9S08PA8 = 256 bytes
USER RAM
MC9S08PA16 = 2,048 bytes
MC9S08PA8 = 2,048 bytes
20 MHz INTERNAL CLOCK
SOURCE (ICS)
EXTAL
XTAL
VDD
VSS
VDD4
VSS 4
VSS 4
VREFH
VDDA
VREFL
VSSA
EXTERNAL OSCILLATOR
SOURCE (XOSC)
SERIAL COMMUNICATION
INTERFACE (SCI1)
ANALOG COMPARATOR
(ACMP)
Port E
USER FLASH
MC9S08PA16 = 16,384 bytes
MC9S08PA8 = 8,192 bytes
REAL-TIME CLOCK
(RTC)
PTE0/SPSCK0
PTE1/MOSI0
PTE2/MISO0
PTE3/BUSOUT
PTE4/TCLK2
SERIAL PERIPHERAL
INTERFACE (SPI0)
POWER MANAGEMENT
CONTROLLER (PMC)
12-CH 12-BIT
ANALOG-TO-DIGITAL
CONVERTER(ADC)
CYCLIC REDUNDANCY
CHECK (CRC)
1. PTA2 and PTA3 operate as true-open drain when working as output.
2. PTA4/ACMPO/BKGD/MS is an output-only pin when used as port pin.
3. PTD0, PTD1, PTB4 and PTB5 can provide high sink/source current drive.
4. The secondary power pair of V DD and VSS (pin 11, 27 and 28 in 44-pin package) are not bonded in 32-pin, 20-pin or 16-pin packages.
Figure 9-5. Device block diagram highlighting RTC module and pin
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
214
Freescale Semiconductor, Inc.
Chapter 9 Chip configurations
9.9 Communication interfaces
9.9.1 Serial communications interface (SCI)
This device includes two independent serial communications interface (SCI) modules.
Typically, these systems are used to connect to the RS232 serial input/output port of a
personal computer or workstation. They can also be used to communicate with other
embedded controllers.
A flexible, 13-bit, modulo-based baud rate generator supports a broad range of standard
baud rates beyond 115.2 kBd. Transmit and receive within the same SCI use a common
baud rate, and each SCI module has a separate baud rate generator.
This SCI system offers many advanced features not commonly found on other
asynchronous serial I/O peripherals of the embedded controllers. The receiver employs an
advanced data sampling technique that ensures reliable communication and noise
detection. Hardware parity, receiver wakeup, and double buffering on transmit and
receive are also included.
The following figure shows the device block diagram highlighting SCI modules and pins.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
215
Port A
Port B
CPU
PTB0/KBI0P4/RxD0/ADP4
PTB1/KBI0P5/TxD0/ADP5
PTB2/KBI0P6/SPSCK0/ADP6
PTB3/KBI0P7/MOSI0/ADP7
PTB4/FTM2CH4/MISO0 3
PTB5/FTM2CH5/SS0 3
PTB6/SDA/XTAL
PTB7/SCL/EXTAL
Port C
HCS08 CORE
PTA0/KBI0P0/FTM0CH0/ACMP0/ADP0
PTA1/KBI0P1/FTM0CH1/ACMP1/ADP1
PTA2/KBI0P2/RxD0/SDA1
PTA3/KBI0P3/TxD0/SCL1
PTA4/ACMPO/BKGD/MS 2
PTA5/IRQ/TCLK0/RESET
PTA6/FTM2FAULT1/ADP2
PTA7/FTM2FAULT2/ADP3
PTC0/FTM2CH0/ADP8
PTC1/FTM2CH1/ADP9
PTC2/FTM2CH2/ADP10
PTC3/FTM2CH3/ADP11
PTC4/FTM0CH0
PTC5/FTM0CH1
PTC6/RxD1
PTC7/TxD1
Port D
Communication interfaces
PTD0/FTM2CH23
PTD1/FTM2CH33
PTD2
PTD3
PTD4
PTD5
PTD6
PTD7
BDC
SYSTEM INTEGRATION
MODULE (SIM)
WDG
IRQ
1 kHz OSC
LVD
KEYBOARD INTERRUPT
MODULE (KBI0)
INTER-INTEGRATED
CIRCUIT BUS (IIC)
8-BIT MODULO TIMER
INTERRUPT PRIORITY
(MTIM0)
CONTROLLER(IPC)
2-CH FLEX TIMER
ON-CHIP ICE AND
DEBUG MODUE (DBG)
MODULE (FTM0)
6-CH FLEX TIMER
MODULE (FTM2)
SERIAL COMMUNICATION
INTERFACE (SCI0)
USER EEPROM
MC9S08PA16 = 256 bytes
MC9S08PA8 = 256 bytes
USER RAM
MC9S08PA16 = 2,048 bytes
MC9S08PA8 = 2,048 bytes
20 MHz INTERNAL CLOCK
SOURCE (ICS)
EXTAL
XTAL
VDD
VSS
VDD4
VSS 4
VSS 4
VREFH
VDDA
VREFL
VSSA
EXTERNAL OSCILLATOR
SOURCE (XOSC)
SERIAL COMMUNICATION
INTERFACE (SCI1)
ANALOG COMPARATOR
(ACMP)
Port E
USER FLASH
MC9S08PA16 = 16,384 bytes
MC9S08PA8 = 8,192 bytes
REAL-TIME CLOCK
(RTC)
PTE0/SPSCK0
PTE1/MOSI0
PTE2/MISO0
PTE3/BUSOUT
PTE4/TCLK2
SERIAL PERIPHERAL
INTERFACE (SPI0)
POWER MANAGEMENT
CONTROLLER (PMC)
12-CH 12-BIT
ANALOG-TO-DIGITAL
CONVERTER(ADC)
CYCLIC REDUNDANCY
CHECK (CRC)
1. PTA2 and PTA3 operate as true-open drain when working as output.
2. PTA4/ACMPO/BKGD/MS is an output-only pin when used as port pin.
3. PTD0, PTD1, PTB4 and PTB5 can provide high sink/source current drive.
4. The secondary power pair of V DD and VSS (pin 11, 27 and 28 in 44-pin package) are not bonded in 32-pin, 20-pin or 16-pin packages.
Figure 9-6. Device block diagram highlighting SCI modules and pins
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
216
Freescale Semiconductor, Inc.
Chapter 9 Chip configurations
9.9.1.1 SCI0 infrared functions
9.9.1.1.1
SCI0 TxD modulation
SCI0 TxD output can be modulated by FTM0 channel 0 PWM output. Please refer to
SCI0 TxD modulation.
9.9.1.1.2
SCI0 RxD tag
ACMP module output can be directly ejected to SCI0 RxD. In this mode, SCI0 external
RxD pinout does not work. Any external signal tagged to ACMP inputs can be set as SCI
input. Please refer to SCI0 RxD filter.
9.9.1.1.3
FTM registers
The following table lists all the FTM registers this device has.
Table 9-2. FTM registers
Registers (x=0, 2)
FTM0
FTM2
FTMx_SC
Y
Y
FTM2_CNTH
Y
Y
FTMx_CNTL
Y
Y
FTMx_MODH
Y
Y
FTMx_MODL
Y
Y
FTMx_C0SC
Y
Y
FTMx_C0VH
Y
Y
FTMx_C0VL
Y
Y
FTMx_C1SC
Y
Y
FTMx_C1VH
Y
Y
FTMx_C1VL
Y
Y
FTMx_C2SC
N
Y
FTMx_C2VH
N
Y
FTMx_C2VL
N
Y
FTMx_C3SC
N
Y
FTMx_C3VH
N
Y
FTMx_C3VL
N
Y
FTMx_C4SC
N
Y
FTMx_C4VH
N
Y
FTMx_C4VL
N
Y
FTMx_C5SC
N
Y
FTMx_C5VH
N
Y
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
217
SCI0 infrared functions
Table 9-2. FTM registers (continued)
Registers (x=0, 2)
FTM0
FTM2
FTMx_C5VL
N
Y
FTMx_CNTINH
N
Y
FTMx_CNTINL
N
Y
FTMx_STATUS
N
Y
FTMx_MODE
N
Y
FTMx_SYNC
N
Y
FTMx_OUTINIT
N
Y
FTMx_OUTMASK
N
Y
FTMx_COMBINE0
N
Y
FTMx_COMBINE1
N
Y
FTMx_COMBINE2
N
Y
FTMx_DEADTIME
N
Y
FTMx_EXTTRIG
N
Y
FTMx_POL
N
Y
FTMx_FMS
N
Y
FTMx_FILTER0
N
Y
FTMx_FILTER1
N
Y
FTMx_FLTFILTER
N
Y
FTMx_FLTCTRL
N
Y
9.9.2 8-Bit Serial Peripheral Interface (8-bit SPI)
This MCU contains an 8-bit serial peripheral interface (SPI0) module which provides for
full-duplex, synchronous, serial communication between the MCU and peripheral
devices. These peripheral devices can include other microcontrollers, analog-to-digital
converters, shift registers, sensors, memories, etc.
The following figure shows the device block diagram highlighting 8-bit SPI module and
pins.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
218
Freescale Semiconductor, Inc.
Port A
Port B
CPU
PTB0/KBI0P4/RxD0/ADP4
PTB1/KBI0P5/TxD0/ADP5
PTB2/KBI0P6/SPSCK0/ADP6
PTB3/KBI0P7/MOSI0/ADP7
PTB4/FTM2CH4/MISO0 3
PTB5/FTM2CH5/SS0 3
PTB6/SDA/XTAL
PTB7/SCL/EXTAL
Port C
HCS08 CORE
PTA0/KBI0P0/FTM0CH0/ACMP0/ADP0
PTA1/KBI0P1/FTM0CH1/ACMP1/ADP1
PTA2/KBI0P2/RxD0/SDA1
PTA3/KBI0P3/TxD0/SCL1
PTA4/ACMPO/BKGD/MS 2
PTA5/IRQ/TCLK0/RESET
PTA6/FTM2FAULT1/ADP2
PTA7/FTM2FAULT2/ADP3
PTC0/FTM2CH0/ADP8
PTC1/FTM2CH1/ADP9
PTC2/FTM2CH2/ADP10
PTC3/FTM2CH3/ADP11
PTC4/FTM0CH0
PTC5/FTM0CH1
PTC6/RxD1
PTC7/TxD1
Port D
Chapter 9 Chip configurations
PTD0/FTM2CH23
PTD1/FTM2CH33
PTD2
PTD3
PTD4
PTD5
PTD6
PTD7
BDC
SYSTEM INTEGRATION
MODULE (SIM)
WDG
IRQ
1 kHz OSC
LVD
KEYBOARD INTERRUPT
MODULE (KBI0)
INTER-INTEGRATED
CIRCUIT BUS (IIC)
8-BIT MODULO TIMER
INTERRUPT PRIORITY
(MTIM0)
CONTROLLER(IPC)
2-CH FLEX TIMER
ON-CHIP ICE AND
DEBUG MODUE (DBG)
MODULE (FTM0)
6-CH FLEX TIMER
MODULE (FTM2)
SERIAL COMMUNICATION
INTERFACE (SCI0)
USER EEPROM
MC9S08PA16 = 256 bytes
MC9S08PA8 = 256 bytes
USER RAM
MC9S08PA16 = 2,048 bytes
MC9S08PA8 = 2,048 bytes
20 MHz INTERNAL CLOCK
SOURCE (ICS)
EXTAL
XTAL
VDD
VSS
VDD4
VSS 4
VSS 4
VREFH
VDDA
VREFL
VSSA
EXTERNAL OSCILLATOR
SOURCE (XOSC)
SERIAL COMMUNICATION
INTERFACE (SCI1)
ANALOG COMPARATOR
(ACMP)
Port E
USER FLASH
MC9S08PA16 = 16,384 bytes
MC9S08PA8 = 8,192 bytes
REAL-TIME CLOCK
(RTC)
PTE0/SPSCK0
PTE1/MOSI0
PTE2/MISO0
PTE3/BUSOUT
PTE4/TCLK2
SERIAL PERIPHERAL
INTERFACE (SPI0)
POWER MANAGEMENT
CONTROLLER (PMC)
12-CH 12-BIT
ANALOG-TO-DIGITAL
CONVERTER(ADC)
CYCLIC REDUNDANCY
CHECK (CRC)
1. PTA2 and PTA3 operate as true-open drain when working as output.
2. PTA4/ACMPO/BKGD/MS is an output-only pin when used as port pin.
3. PTD0, PTD1, PTB4 and PTB5 can provide high sink/source current drive.
4. The secondary power pair of V DD and VSS (pin 11, 27 and 28 in 44-pin package) are not bonded in 32-pin, 20-pin or 16-pin packages.
Figure 9-7. Device block diagram highlighting 8-bit SPI module and pins
9.9.3 Inter-Integrated Circuit (I2C)
This device contains an inter-integrated circuit (I2C) module for communication with
other integrated circuits.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
219
SCI0 infrared functions
Port A
Port B
CPU
PTB0/KBI0P4/RxD0/ADP4
PTB1/KBI0P5/TxD0/ADP5
PTB2/KBI0P6/SPSCK0/ADP6
PTB3/KBI0P7/MOSI0/ADP7
PTB4/FTM2CH4/MISO0 3
PTB5/FTM2CH5/SS0 3
PTB6/SDA/XTAL
PTB7/SCL/EXTAL
Port C
HCS08 CORE
PTA0/KBI0P0/FTM0CH0/ACMP0/ADP0
PTA1/KBI0P1/FTM0CH1/ACMP1/ADP1
PTA2/KBI0P2/RxD0/SDA1
PTA3/KBI0P3/TxD0/SCL1
PTA4/ACMPO/BKGD/MS 2
PTA5/IRQ/TCLK0/RESET
PTA6/FTM2FAULT1/ADP2
PTA7/FTM2FAULT2/ADP3
PTC0/FTM2CH0/ADP8
PTC1/FTM2CH1/ADP9
PTC2/FTM2CH2/ADP10
PTC3/FTM2CH3/ADP11
PTC4/FTM0CH0
PTC5/FTM0CH1
PTC6/RxD1
PTC7/TxD1
Port D
The following figure shows the device block diagram highlighting I2C module and pins.
PTD0/FTM2CH23
PTD1/FTM2CH33
PTD2
PTD3
PTD4
PTD5
PTD6
PTD7
BDC
SYSTEM INTEGRATION
MODULE (SIM)
WDG
IRQ
1 kHz OSC
LVD
INTERRUPT PRIORITY
KEYBOARD INTERRUPT
MODULE (KBI0)
INTER-INTEGRATED
CIRCUIT BUS (IIC)
8-BIT MODULO TIMER
(MTIM)
CONTROLLER(IPC)
2-CH FLEX TIMER
ON-CHIP ICE AND
DEBUG MODUE (DBG)
MODULE (FTM0)
6-CH FLEX TIMER
MODULE (FTM2)
SERIAL COMMUNICATION
INTERFACE (SCI0)
USER EEPROM
MC9S08PA16 = 256 bytes
MC9S08PA8 = 256 bytes
USER RAM
MC9S08PA16 = 2,048 bytes
MC9S08PA8 = 2,048 bytes
20 MHz INTERNAL CLOCK
SOURCE (ICS)
EXTAL
XTAL
VDD
VSS
VDD4
VSS 4
VSS 4
VREFH
VDDA
VREFL
VSSA
EXTERNAL OSCILLATOR
SOURCE (XOSC)
SERIAL COMMUNICATION
INTERFACE (SCI1)
ANALOG COMPARATOR
(ACMP)
Port E
USER FLASH
MC9S08PA16 = 16,384 bytes
MC9S08PA8 = 8,192 bytes
REAL-TIME CLOCK
(RTC)
PTE0/SPSCK0
PTE1/MOSI0
PTE2/MISO0
PTE3/BUSOUT
PTE4/TCLK2
SERIAL PERIPHERAL
INTERFACE (SPI0)
POWER MANAGEMENT
CONTROLLER (PMC)
12-CH 12-BIT
ANALOG-TO-DIGITAL
CONVERTER(ADC)
CYCLIC REDUNDANCY
CHECK (CRC)
1. PTA2 and PTA3 operate as true-open drain when working as output.
2. PTA4/ACMPO/BKGD/MS is an output-only pin when used as port pin.
3. PTD0, PTD1, PTB4 and PTB5 can provide high sink/source current drive.
4. The secondary power pair of V DD and VSS (pin 11, 27 and 28 in 44-pin package) are not bonded in 32-pin, 20-pin or 16-pin packages.
Figure 9-8. Device block diagram highlighting I2C module and pins
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
220
Freescale Semiconductor, Inc.
Chapter 9 Chip configurations
9.10 Analog
9.10.1 Analog-to-digital converter (ADC)
This device contains an analog-to-digital converter (ADC) of 12-bit, a successive
approximation ADC for operation within an integrated microcontroller system-on-chip.
The ADC channel assignments, alternate clock function, and hardware trigger function
are configured as described following sections.
The following figure shows device block diagram highlighting ADC module and pins.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
221
Port A
Port B
CPU
PTB0/KBI0P4/RxD0/ADP4
PTB1/KBI0P5/TxD0/ADP5
PTB2/KBI0P6/SPSCK0/ADP6
PTB3/KBI0P7/MOSI0/ADP7
PTB4/FTM2CH4/MISO0 3
PTB5/FTM2CH5/SS0 3
PTB6/SDA/XTAL
PTB7/SCL/EXTAL
Port C
HCS08 CORE
PTA0/KBI0P0/FTM0CH0/ACMP0/ADP0
PTA1/KBI0P1/FTM0CH1/ACMP1/ADP1
PTA2/KBI0P2/RxD0/SDA1
PTA3/KBI0P3/TxD0/SCL1
PTA4/ACMPO/BKGD/MS 2
PTA5/IRQ/TCLK0/RESET
PTA6/FTM2FAULT1/ADP2
PTA7/FTM2FAULT2/ADP3
PTC0/FTM2CH0/ADP8
PTC1/FTM2CH1/ADP9
PTC2/FTM2CH2/ADP10
PTC3/FTM2CH3/ADP11
PTC4/FTM0CH0
PTC5/FTM0CH1
PTC6/RxD1
PTC7/TxD1
Port D
Analog
PTD0/FTM2CH23
PTD1/FTM2CH33
PTD2
PTD3
PTD4
PTD5
PTD6
PTD7
BDC
SYSTEM INTEGRATION
MODULE (SIM)
WDG
IRQ
1 kHz OSC
LVD
KEYBOARD INTERRUPT
MODULE (KBI0)
INTER-INTEGRATED
CIRCUIT BUS (IIC)
8-BIT MODULO TIMER
INTERRUPT PRIORITY
(MTIM0)
CONTROLLER(IPC)
2-CH FLEX TIMER
ON-CHIP ICE AND
DEBUG MODUE (DBG)
MODULE (FTM0)
6-CH FLEX TIMER
MODULE (FTM2)
SERIAL COMMUNICATION
INTERFACE (SCI0)
USER EEPROM
MC9S08PA16 = 256 bytes
MC9S08PA8 = 256 bytes
USER RAM
MC9S08PA16 = 2,048 bytes
MC9S08PA8 = 2,048 bytes
20 MHz INTERNAL CLOCK
SOURCE (ICS)
EXTAL
XTAL
VDD
VSS
VDD4
VSS 4
VSS 4
VREFH
VDDA
VREFL
VSSA
EXTERNAL OSCILLATOR
SOURCE (XOSC)
SERIAL COMMUNICATION
INTERFACE (SCI1)
ANALOG COMPARATOR
(ACMP)
Port E
USER FLASH
MC9S08PA16 = 16,384 bytes
MC9S08PA8 = 8,192 bytes
REAL-TIME CLOCK
(RTC)
PTE0/SPSCK0
PTE1/MOSI0
PTE2/MISO0
PTE3/BUSOUT
PTE4/TCLK2
SERIAL PERIPHERAL
INTERFACE (SPI0)
POWER MANAGEMENT
CONTROLLER (PMC)
12-CH 12-BIT
ANALOG-TO-DIGITAL
CONVERTER(ADC)
CYCLIC REDUNDANCY
CHECK (CRC)
1. PTA2 and PTA3 operate as true-open drain when working as output.
2. PTA4/ACMPO/BKGD/MS is an output-only pin when used as port pin.
3. PTD0, PTD1, PTB4 and PTB5 can provide high sink/source current drive.
4. The secondary power pair of V DD and VSS (pin 11, 27 and 28 in 44-pin package) are not bonded in 32-pin, 20-pin or 16-pin packages.
Figure 9-9. Device block diagram highlighting ADC module and pins
9.10.1.1 ADC channel assignments
The ADC channel assignments for the device are shown in the following table. Reserved
channels convert to an unknown value.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
222
Freescale Semiconductor, Inc.
Chapter 9 Chip configurations
9.10.1.2 Alternate clock
The ADC module is capable of performing conversions using the MCU bus clock, the
bus clock divided by two, the local asynchronous clock (ADACK) within the module, or
the alternate clock, ALTCLK. The alternate clock for the devices is the external oscillator
output (OSCOUT).
The selected clock source must run at a frequency such that the ADC conversion clock
(ADCK) runs at a frequency within its specified range (fADCK) after being divided down
from the ALTCLK input as determined by the ADIV bits.
ALTCLK is active while the MCU is in wait mode provided the conditions described
above are met. This allows ALTCLK to be used as the conversion clock source for the
ADC while the MCU is in wait mode.
ALTCLK cannot be used as the ADC conversion clock source while the MCU is in stop3
mode.
9.10.1.3 Hardware trigger
The ADC hardware trigger is selectable from MTIM0 overflow, RTC overflow, FTM2
match trigger with 8-bit programmable delay, or FTM2 init trigger with 8-bit
programmable delay . The MCU can be configured to use any of those four hardware
trigger sources in run and wait modes. The RTC overflow can be used as ADC hardware
trigger in STOP3 mode. Please refer to ADC hardware trigger.
9.10.1.4 Temperature sensor
The ADC module integrates an on-chip temperature sensor. Following actions must be
performed to use this temperature sensor.
• Configure ADC for long sample with a maximum of 1 MHz clock
• Convert the bandgap voltage reference channel (AD23)
• By converting the digital value of the bandgap voltage reference channel using
the value of VBG the user can determine VDD.
• Convert the temperature sensor channel (AD22)
• By using the calculated value of VDD, convert the digital value of AD22 into a
voltage, VTEMP
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
223
Analog
The following equation provides an approximate transfer function of the on-chip
temperature sensor for VDD = 5.0V, Temp = 25°C, using the ADC at fADCK = 1.0 MHz
and configured for long sample.
where:
• VTEMP is the voltage of the temperature sensor channel at the ambient temperature
• VTEMP25 is the voltage of the temperature sensor channel at 25 °C
• m is the hot or cold voltage versus temperature slope in V/°C
For temperature calculations, use the VTEMP25 and m values in the data sheet.
In application code, you read the temperature sensor channel, calculate VTEMP, and
compare it to VTEMP25. If VTEMP is greater than VTEMP25, the cold slope value is applied
in the above equation. If VTEMP is less than VTEMP25 the hot slope value is applied.
Calibrating at 25°C will improve accuracy to ±4.5°C.
Calibration at three points -40°C, 25°C, and 105°C will improve accuracy to ±2.5°C.
After calibration has been completed, you will need to calculate the slope for both hot
and cold. In application code, you can calculate the temperature as detailed above and
determine if it is above or below 25°C. After you have determined whether the
temperature is above or below 25 °C. you can recalculate the temperature using the hot or
cold slope value obtained during calibration.
9.10.2 Analog comparator (ACMP)
The analog comparator module (ACMP) provides a circuit for comparing two analog
input voltages or for comparing one analog input voltage to an internal reference voltage.
The comparator circuit is used to operate across the full range of the supply voltage (railto-rail operation).
The ACMP features four different inputs muxed with both positive and negative inputs to
the ACMP. One is fixed connected to built-in DAC output. ACMP0 and ACMP1 are
externally mapped on pinouts. ACMP2 is reserved.
When using the bandgap reference voltage as the reference voltage to the built-in DAC,
the user must enable the bandgap buffer by setting BGBE =1 in SPMSC1. For value of
bandgap voltage reference see Bandgap reference.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
224
Freescale Semiconductor, Inc.
Chapter 9 Chip configurations
Port A
Port B
CPU
PTB0/KBI0P4/RxD0/ADP4
PTB1/KBI0P5/TxD0/ADP5
PTB2/KBI0P6/SPSCK0/ADP6
PTB3/KBI0P7/MOSI0/ADP7
PTB4/FTM2CH4/MISO0 3
PTB5/FTM2CH5/SS0 3
PTB6/SDA/XTAL
PTB7/SCL/EXTAL
Port C
HCS08 CORE
PTA0/KBI0P0/FTM0CH0/ACMP0/ADP0
PTA1/KBI0P1/FTM0CH1/ACMP1/ADP1
PTA2/KBI0P2/RxD0/SDA1
PTA3/KBI0P3/TxD0/SCL1
PTA4/ACMPO/BKGD/MS 2
PTA5/IRQ/TCLK0/RESET
PTA6/FTM2FAULT1/ADP2
PTA7/FTM2FAULT2/ADP3
PTC0/FTM2CH0/ADP8
PTC1/FTM2CH1/ADP9
PTC2/FTM2CH2/ADP10
PTC3/FTM2CH3/ADP11
PTC4/FTM0CH0
PTC5/FTM0CH1
PTC6/RxD1
PTC7/TxD1
Port D
The following figure shows the device block diagram highlighting ACMP modules and
pins.
PTD0/FTM2CH23
PTD1/FTM2CH33
PTD2
PTD3
PTD4
PTD5
PTD6
PTD7
BDC
SYSTEM INTEGRATION
MODULE (SIM)
WDG
IRQ
1 kHz OSC
LVD
KEYBOARD INTERRUPT
MODULE (KBI0)
INTER-INTEGRATED
CIRCUIT BUS (IIC)
8-BIT MODULO TIMER
INTERRUPT PRIORITY
(MTIM0)
CONTROLLER(IPC)
2-CH FLEX TIMER
ON-CHIP ICE AND
DEBUG MODUE (DBG)
MODULE (FTM0)
6-CH FLEX TIMER
MODULE (FTM2)
SERIAL COMMUNICATION
INTERFACE (SCI0)
USER EEPROM
MC9S08PA16 = 256 bytes
MC9S08PA8 = 256 bytes
USER RAM
MC9S08PA16 = 2,048 bytes
MC9S08PA8 = 2,048 bytes
20 MHz INTERNAL CLOCK
SOURCE (ICS)
EXTAL
XTAL
VDD
VSS
VDD4
VSS 4
VSS 4
VREFH
VDDA
VREFL
VSSA
EXTERNAL OSCILLATOR
SOURCE (XOSC)
SERIAL COMMUNICATION
INTERFACE (SCI1)
ANALOG COMPARATOR
(ACMP)
Port E
USER FLASH
MC9S08PA16 = 16,384 bytes
MC9S08PA8 = 8,192 bytes
REAL-TIME CLOCK
(RTC)
PTE0/SPSCK0
PTE1/MOSI0
PTE2/MISO0
PTE3/BUSOUT
PTE4/TCLK2
SERIAL PERIPHERAL
INTERFACE (SPI0)
POWER MANAGEMENT
CONTROLLER (PMC)
12-CH 12-BIT
ANALOG-TO-DIGITAL
CONVERTER(ADC)
CYCLIC REDUNDANCY
CHECK (CRC)
1. PTA2 and PTA3 operate as true-open drain when working as output.
2. PTA4/ACMPO/BKGD/MS is an output-only pin when used as port pin.
3. PTD0, PTD1, PTB4 and PTB5 can provide high sink/source current drive.
4. The secondary power pair of V DD and VSS (pin 11, 27 and 28 in 44-pin package) are not bonded in 32-pin, 20-pin or 16-pin packages.
Figure 9-10. Device block diagram highlighting ACMP modules and pins
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
225
Human-machine interfaces HMI
9.10.2.1 ACMP configuration information
The ACMP features four different inputs muxed with both positive and negative inputs to
the ACMP. One is fixed connected to built-in DAC output. ACMP0 and ACMP1 are
externally mapped on pinouts. ACMP2 is reserved. The following table shows the
connection of ACMP input assignments.
Table 9-3. ACMP module external signals
ACMP Channel
Connection
0
PTA0/KBI0P0/FTM0CH0/ACMP0/ADP0
1
PTA1/KBI0P1/FTM0CH1/ACMP1/ADP1
2
Reserved
3
DAC output
When using the bandgap reference voltage as the reference voltage to the built-in DAC,
the user must enable the bandgap buffer by setting BGBE =1 in SPMSC1. For value of
bandgap voltage reference see Bandgap reference.
9.10.2.2 ACMP in stop3 mode
ACMP continues to operate in stop3 mode if enabled. If ACMP_SC[ACOPE] is enabled,
comparator output will operate as in the normal operating mode and will control ACMPO
pin. The MCU is brought out of stop when a compare event occurs and
ACMP_SC[ACIE] is enabled; ACF flag sets accordingly.
9.10.2.3 ACMP for SCI0 RXD filter
ACMP module output can be directly ejected to SCI0 RxD. In this mode, SCI0 external
RxD pinout does not work. Any external signal tagged to ACMP inputs can be regarded
as input pins. Please refer SCI0 RxD filter.
9.11 Human-machine interfaces HMI
9.11.1 Keyboard interrupts (KBI)
This device has one KBI modules with up to 8 keyboard interrupt inputs grouped in a
KBI modules available depending on packages.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
226
Freescale Semiconductor, Inc.
Chapter 9 Chip configurations
Port A
Port B
CPU
PTB0/KBI0P4/RxD0/ADP4
PTB1/KBI0P5/TxD0/ADP5
PTB2/KBI0P6/SPSCK0/ADP6
PTB3/KBI0P7/MOSI0/ADP7
PTB4/FTM2CH4/MISO0 3
PTB5/FTM2CH5/SS0 3
PTB6/SDA/XTAL
PTB7/SCL/EXTAL
Port C
HCS08 CORE
PTA0/KBI0P0/FTM0CH0/ACMP0/ADP0
PTA1/KBI0P1/FTM0CH1/ACMP1/ADP1
PTA2/KBI0P2/RxD0/SDA1
PTA3/KBI0P3/TxD0/SCL1
PTA4/ACMPO/BKGD/MS 2
PTA5/IRQ/TCLK0/RESET
PTA6/FTM2FAULT1/ADP2
PTA7/FTM2FAULT2/ADP3
PTC0/FTM2CH0/ADP8
PTC1/FTM2CH1/ADP9
PTC2/FTM2CH2/ADP10
PTC3/FTM2CH3/ADP11
PTC4/FTM0CH0
PTC5/FTM0CH1
PTC6/RxD1
PTC7/TxD1
Port D
The following figure shows the device block diagram with the KBI modules and pins
highlighted.
PTD0/FTM2CH23
PTD1/FTM2CH33
PTD2
PTD3
PTD4
PTD5
PTD6
PTD7
BDC
SYSTEM INTEGRATION
MODULE (SIM)
WDG
IRQ
1 kHz OSC
LVD
KEYBOARD INTERRUPT
MODULE (KBI0)
INTER-INTEGRATED
CIRCUIT BUS (IIC)
8-BIT MODULO TIMER
INTERRUPT PRIORITY
(MTIM0)
CONTROLLER(IPC)
2-CH FLEX TIMER
ON-CHIP ICE AND
DEBUG MODUE (DBG)
MODULE (FTM0)
6-CH FLEX TIMER
MODULE (FTM2)
SERIAL COMMUNICATION
INTERFACE (SCI0)
USER EEPROM
MC9S08PA16 = 256 bytes
MC9S08PA8 = 256 bytes
USER RAM
MC9S08PA16 = 2,048 bytes
MC9S08PA8 = 2,048 bytes
20 MHz INTERNAL CLOCK
SOURCE (ICS)
EXTAL
XTAL
VDD
VSS
VDD4
VSS 4
VSS 4
VREFH
VDDA
VREFL
VSSA
EXTERNAL OSCILLATOR
SOURCE (XOSC)
SERIAL COMMUNICATION
INTERFACE (SCI1)
ANALOG COMPARATOR
(ACMP)
Port E
USER FLASH
MC9S08PA16 = 16,384 bytes
MC9S08PA8 = 8,192 bytes
REAL-TIME CLOCK
(RTC)
PTE0/SPSCK0
PTE1/MOSI0
PTE2/MISO0
PTE3/BUSOUT
PTE4/TCLK2
SERIAL PERIPHERAL
INTERFACE (SPI0)
POWER MANAGEMENT
CONTROLLER (PMC)
12-CH 12-BIT
ANALOG-TO-DIGITAL
CONVERTER(ADC)
CYCLIC REDUNDANCY
CHECK (CRC)
1. PTA2 and PTA3 operate as true-open drain when working as output.
2. PTA4/ACMPO/BKGD/MS is an output-only pin when used as port pin.
3. PTD0, PTD1, PTB4 and PTB5 can provide high sink/source current drive.
4. The secondary power pair of V DD and VSS (pin 11, 27 and 28 in 44-pin package) are not bonded in 32-pin, 20-pin or 16-pin packages.
Figure 9-11. Block diagram highlighting KBI modules and pins
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
227
Human-machine interfaces HMI
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
228
Freescale Semiconductor, Inc.
Chapter 10
Central processor unit
10.1 Introduction
This section provides summary information about the registers, addressing modes, special
operations, instructions and exceptions processing of the HCS08 V6 CPU.
The HCS08 V6 CPU is fully source- and object-code-compatible with the HCS08 CPU.
10.1.1 Features
Features of the HCS08 V6 CPU include:
• Object code fully upward-compatible with M68HC05 and M68HC08 families
• 16-bit stack pointer (any size stack anywhere in 64 KB CPU address space)
• 16-bit index register (H:X) with powerful indexed addressing modes
• 8-bit accumulator (A)
• Many instructions treat X as a second general-purpose 8-bit register
• Seven addressing modes:
• Inherent — Operands in internal registers
• Relative — 8-bit signed offset to branch destination
• Immediate — Operand in next object code byte(s)
• Direct — Operand in memory at 0x0000–0x00FF
• Extended — Operand anywhere in 64-Kbyte address space
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
229
Programmer's Model and CPU Registers
• Indexed relative to H:X — Five submodes including auto increment
• Indexed relative to SP — Improves C efficiency dramatically
• Memory-to-memory data move instructions with four address mode combinations
• Overflow, half-carry, negative, zero, and carry condition codes support conditional
branching on the results of signed, unsigned, and binary-coded decimal (BCD)
operations
• Efficient bit manipulation instructions
• STOP and WAIT instructions to invoke low-power operating modes
10.2 Programmer's Model and CPU Registers
Figure 10-1 shows the five CPU registers. CPU registers are not part of the memory map.
7
0
ACCUMULATOR
A
16-BIT INDEX REGISTER H:X
8 7
0
15
INDEX REGISTER (H) INDEX REGISTER (X)
15
0
SP
STACK POINTER
0
15
PC
PROGRAM COUNTER
7
CONDITION CODE REGISTER
0
V 1 1 H I N Z C
CCR
CARRY
ZERO
NEGATIVE
INTERRUPT MASK
HALF-CARRY (FROM BIT 3)
TWO’S COMPLEMENT OVERFLOW
Figure 10-1. CPU Registers
10.2.1 Accumulator (A)
The A accumulator is a general-purpose 8-bit register. One input operand from the
arithmetic logic unit (ALU) is connected to the accumulator, and the ALU results are
often stored into the A accumulator after arithmetic and logical operations. The
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
230
Freescale Semiconductor, Inc.
Chapter 10 Central processor unit
accumulator can be loaded from memory using various addressing modes to specify the
address where the loaded data comes from, or the contents of A can be stored to memory
using various addressing modes to specify the address where data from A will be stored.
Reset has no effect on the contents of the A accumulator.
10.2.2 Index Register (H:X)
This 16-bit register is actually two separate 8-bit registers (H and X), which often work
together as a 16-bit address pointer where H holds the upper byte of an address and X
holds the lower byte of the address. All indexed addressing mode instructions use the full
16-bit value in H:X as an index reference pointer; however, for compatibility with the
earlier M68HC05 family, some instructions operate only on the low-order 8-bit half (X).
Many instructions treat X as a second general-purpose 8-bit register that can be used to
hold 8-bit data values. X can be cleared, incremented, decremented, complemented,
negated, shifted, or rotated. Transfer instructions allow data to be transferred from A or
transferred to A where arithmetic and logical operations can then be performed.
For compatibility with the earlier M68HC05 family, H is forced to 0x00 during reset.
Reset has no effect on the contents of X.
10.2.3 Stack Pointer (SP)
This 16-bit address pointer register points at the next available location on the automatic
last-in-first-out (LIFO) stack. The stack may be located anywhere in the 64 KB address
space that has RAM, and can be any size up to the amount of available RAM. The stack
is used to automatically save the return address for subroutine calls, the return address
and CPU registers during interrupts, and for local variables. The AIS (add immediate to
stack pointer) instruction adds an 8-bit signed immediate value to SP. This is most often
used to allocate or deallocate space for local variables on the stack.
SP is forced to 0x00FF at reset for compatibility with the earlier M68HC05 family.
HCS08 V6 programs normally change the value in SP to the address of the last location
(highest address) in on-chip RAM during reset initialization to free up direct page RAM
(from the end of the on-chip registers to 0x00FF).
The RSP (reset stack pointer) instruction was included for compatibility with the
M68HC05 family and is seldom used in new HCS08 V6 programs because it affects only
the low-order half of the stack pointer.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
231
Programmer's Model and CPU Registers
10.2.4 Program Counter (PC)
The program counter is a 16-bit register that contains the address of the next instruction
or operand to be fetched.
During normal program execution, the program counter automatically increments to the
next sequential memory location every time an instruction or operand is fetched. Jump,
branch, interrupt, and return operations load the program counter with an address other
than that of the next sequential location. This is called a change-of-flow.
During reset, the program counter is loaded with the reset vector that is located at
0xFFFE and 0xFFFF. The vector stored there is the address of the first instruction that
will be executed after exiting the reset state.
10.2.5 Condition Code Register (CCR)
The 8-bit condition code register contains the interrupt mask (I) and five flags that
indicate the results of the instruction just executed. Bits 6 and 5 are set permanently to 1.
The following paragraphs describe the functions of the condition code bits in general
terms.
Table 10-1. CCR Register Field Descriptions
Field
7
V
Description
Two's Complement Overflow Flag — The CPU sets the overflow flag when a two's complement
overflow occurs. The signed branch instructions BGT, BGE, BLE, and BLT use the overflow flag.
0 No overflow
1 Overflow
4
H
Half-Carry Flag — The CPU sets the half-carry flag when a carry occurs between accumulator bits
3 and 4 during an add-without-carry (ADD) or add-with-carry (ADC) operation. The half-carry flag is
required for binary-coded decimal (BCD) arithmetic operations. The DAA instruction uses the states
of the H and C condition code bits to automatically add a correction value to the result from a
previous ADD or ADC on BCD operands to correct the result to a valid BCD value.
0 No carry between bits 3 and 4
1 Carry between bits 3 and 4
3
I
Interrupt Mask Bit — When the interrupt mask is set, all maskable CPU interrupts are disabled.
CPU interrupts are enabled when the interrupt mask is cleared. When a CPU interrupt occurs, the
interrupt mask is set automatically after the CPU registers are saved on the stack, but before the
first instruction of the interrupt service routine is executed.
Interrupts are not recognized at the instruction boundary after any instruction that clears I (CLI or
TAP). This ensures that the next instruction after a CLI or TAP will always be executed without the
possibility of an intervening interrupt, provided I was set.
0 Interrupts enabled
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
232
Freescale Semiconductor, Inc.
Chapter 10 Central processor unit
Table 10-1. CCR Register Field Descriptions (continued)
Field
Description
1 Interrupts disabled
2
N
Negative Flag — The CPU sets the negative flag when an arithmetic operation, logic operation, or
data manipulation produces a negative result, setting bit 7 of the result. Simply loading or storing an
8-bit or 16-bit value causes N to be set if the most significant bit of the loaded or stored value was 1.
0 Non-negative result
1 Negative result
1
Z
Zero Flag — The CPU sets the zero flag when an arithmetic operation, logic operation, or data
manipulation produces a result of 0x00 or 0x0000. Simply loading or storing an 8-bit or 16-bit value
causes Z to be set if the loaded or stored value was all 0s.
0 Non-zero result
1 Zero result
0
C
Carry/Borrow Flag — The CPU sets the carry/borrow flag when an addition operation produces a
carry out of bit 7 of the accumulator or when a subtraction operation requires a borrow. Some
instructions — such as bit test and branch, shift, and rotate — also clear or set the carry/borrow flag.
0 No carry out of bit 7
1 Carry out of bit 7
10.3 Addressing Modes
Addressing modes define the way the CPU accesses operands and data. In the HCS08
V6, memory, status and control registers, and input/output (I/O) ports share a single 64
KB CPU address space. This arrangement means that the same instructions that access
variables in RAM can also be used to access I/O and control registers or nonvolatile
program space.
Some instructions use more than one addressing mode. For instance, move instructions
use one addressing mode to specify the source operand and a second addressing mode to
specify the destination address. Instructions such as BRCLR, BRSET, CBEQ, and DBNZ
use one addressing mode to specify the location of an operand for a test and then use
relative addressing mode to specify the branch destination address when the tested
condition is true. For BRCLR, BRSET, CBEQ, and DBNZ, the addressing mode listed in
the instruction set tables is the addressing mode needed to access the operand to be tested,
and relative addressing mode is implied for the branch destination.
Every addressing mode, except inherent, generates a 16-bit effective address. The
effective address is the address of the memory location that the instruction acts on.
Effective address computations do not require extra execution cycles. The HCS08 V6
CPU uses the 16 addressing modes described in the following sections.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
233
Addressing Modes
10.3.1 Inherent Addressing Mode (INH)
In this addressing mode, instructions either have no operands or all operands are in
internal CPU registers. In either case, the CPU does not need to access any memory
locations to complete the instruction. Examples:
NOP
CLRA
;this instruction has no operands
;operand is a CPU register
10.3.2 Relative Addressing Mode (REL)
Relative addressing mode is used to specify the destination location for branch
instructions. A signed two's complement byte offset value is located in the memory
location immediately following the opcode. The offset gives a branching range of -128 to
+127 bytes. In most assemblers, the programmer does not need to calculate the offset,
because the assembler determines the proper offset and verifies that it is within the span
of the branch.
During program execution, if a branch condition is true, the signed offset is signextended to a 16-bit value and is added to the current contents of the program counter,
which causes program execution to continue at the branch destination address. If a branch
condition is false, the CPU executes the next instruction.
10.3.3 Immediate Addressing Mode (IMM)
The operand for instructions with the immediate addressing mode is contained in the
byte(s) immediately following the opcode. The byte or bytes that follow the opcode are
the value of the statement rather than the address of the value. The pound symbol (#) is
used to indicate an immediate addressing mode operand. One very common
programming error is to accidentally omit the # symbol. This causes the assembler to
misinterpret the following expression as an address rather than explicitly provided data.
For example LDA #$55 means to load the immediate value $55 into the accumulator,
while LDA $55 means to load the value from address $0055 into the accumulator.
Without the # symbol, the instruction is erroneously interpreted as a direct addressing
instruction.
Example:
LDA
CPHX
LDHX
#$55
#$FFFF
#$67
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
234
Freescale Semiconductor, Inc.
Chapter 10 Central processor unit
The size of the immediate operand is implied by the instruction context. In the third
example, the instruction implies a 16-bit immediate value, but only an 8-bit value is
supplied. In this case the assembler generates the 16-bit value $0067 because the CPU
expects a 16-bit value in the instruction stream.
10.3.4 Direct Addressing Mode (DIR)
This addressing mode is sometimes called zero-page addressing because it accesses
operands in the address range $0000 through $00FF. Since these addresses always begin
with $00, only the low byte of the address needs to be included in the instruction, which
saves program space and execution time. A system can be optimized by placing the most
commonly accessed data in this area of memory. The low byte of the operand address is
supplied with the instruction and the high byte of the address is assumed to be zero.
Examples:
LDA
$55
The value $55 is taken to be the low byte of an address in the range $0000 through
$00FF. The high byte of the address is assumed to be zero. During execution, the CPU
combines the value $55 from the instruction with the assumed value of $00 to form the
address $0055, which is then used to access the data to be loaded into accumulator.
LDHX
$20
In this example, the value $20 is combined with the assumed value of $00 to form the
address $0020. Since the LDHX instruction requires a 16-bit value, a 16-bit word of data
is read from addresses $0020 and $0021. After execution, the H:X index register has the
value from address $0020 in its high byte and the value from address $0021 in its low
byte. The same happens for CPHX and STHX.
BRSET
0,$80,foo
In this example, direct addressing is used to access the operand and relative addressing is
used to identify the destination address of a branch, in case the branch-taken conditions
are met. This is also the case for BRCLR.
10.3.5 Extended Addressing Mode (EXT)
In extended addressing, the full 16-bit address of the memory location to be operated on
is provided in the instruction. Extended addressing can access any location in the 64 KB
memory map.
Example:
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
235
Addressing Modes
LDA
$F03B
This instruction uses extended addressing because $F03B is above the zero page. In most
assemblers, the programmer does not need to specify whether an instruction is direct or
extended. The assembler automatically selects the shortest form of the instruction.
10.3.6 Indexed Addressing Mode
Indexed addressing mode has seven variations, including five that use the 16-bit H:X
index register pair and two that use the stack pointer as the base reference.
10.3.6.1 Indexed, No Offset (IX)
Instructions using the indexed, no offset addressing mode are one-byte instructions that
can access data with variable addresses. The X (Index register low byte) register contains
the low byte of the conditional address of the operand and the H (Index register high
byte) register contains the high byte of the address.
Indexed, no offset instructions can move a pointer through a table or hold the address of a
frequently used RAM or input/output (I/O) location.
10.3.6.2 Indexed, No Offset with Post Increment (IX+)
Instructions using the indexed, no offset with post increment addressing mode are twobyte instructions that address the operands and then increment the Index register (H:X).
The X (Index register low byte) register contains the low byte of the conditional address
of the operand and the H (Index register high byte) register contains the high byte of the
address. This addressing mode is usually used for table searches. MOV and CBEQ
instructions use this addressing mode as well.
10.3.6.3 Indexed, 8-Bit Offset (IX1)
Indexed with 8-bit offset instructions are two-byte instructions that can access data with a
variable address. The CPU adds the unsigned bytes in the H:X register to the unsigned
byte immediately following the opcode. The sum is the effective address.
Indexed, 8-bit offset instructions are useful in selecting the k-th element in an n-element
table. The table can begin anywhere and can extend as far as the address map allows. The
k value would typically be in H:X, and the address of the beginning of the table would be
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
236
Freescale Semiconductor, Inc.
Chapter 10 Central processor unit
in the byte following the opcode. Using H:X in this way, this addressing mode is limited
to the first 256 addresses in memory. Tables can be located anywhere in the address map
when H:X is used as the base address, and the byte following the opcode is the offset.
10.3.6.4 Indexed, 8-Bit Offset with Post Increment (IX1+)
Indexed, 8-bit offset with post-increment instructions are three-byte instructions that
access the operands with variable addresses, then increment H:X. The CPU adds the
unsigned bytes in the H:X register to the byte immediately following the opcode. The
sum is the effective address. This addressing mode is generally used for table searches.
This addressing mode is used for CBEQ instruction.
10.3.6.5 Indexed, 16-Bit Offset (IX2)
Indexed, 16-bit offset instructions are three-byte instructions that can access data with
variable addresses at any location in memory. The CPU adds the unsigned contents of
H:X to the 16-bit unsigned word formed by the two bytes following the opcode. The sum
is the effective address of the operand. The first byte after the opcode is the most
significant byte of the 16-bit offset; the second byte is the least significant byte of the 16bit offset. As with direct and extended addressing, most assemblers determine the shortest
form of indexed addressing.
Indexed, 16-bit offset instructions are useful in selecting the k-th element in an n-element
table. The table can begin anywhere and can extend as far as the address map allows. The
k value would typically be in H:X, and the address of the beginning of the table would be
in the bytes following the opcode.
10.3.6.6 SP-Relative, 8-Bit Offset (SP1)
Stack pointer, 8-bit offset instructions are three-byte instructions that address operands in
much the same way as indexed 8-bit offset instructions, except that the 8-bit offset is
added to the value of the stack pointer instead of the index register.
The stack pointer, 8-bit offset addressing mode permits easy addressing of data on the
stack. The CPU adds the unsigned byte in the 16-bit stack pointer (SP) register to the
unsigned byte following the opcode. The sum is the effective address of the operand. If
interrupts are disabled, this addressing mode allows the stack pointer to be used as a
second "index" register.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
237
Addressing Modes
Stack pointer relative instructions require a pre-byte for access. Consequently, all SP
relative instructions take one cycle longer than their index relative counterparts.
10.3.6.7 SP-Relative, 16-Bit Offset (SP2)
Stack pointer, 16-bit offset instructions are four-byte instructions used to access data
relative to the stack pointer with variable addresses at any location in memory. The CPU
adds the unsigned contents of the 16-bit stack pointer to the 16-bit unsigned word formed
by the two bytes following the opcode. The sum is the effective address of the operand.
As with direct and extended addressing, most assemblers determine the shortest form of
stack pointer addressing. Due to the pre-byte, stack pointer relative instructions take one
cycle longer than their index relative counterparts.
Stack pointer, 16-bit offset instructions are useful in selecting the k-th element a an nelement table. The table can begin anywhere and can extend anywhere in memory. The k
value would typically be in the stack pointer register, and the address of the beginning of
the table is located in the two bytes following the two-byte opcode.
10.3.7 Memory to memory Addressing Mode
Memory to memory addressing mode has the following four variations.
10.3.7.1 Direct to Direct
This addressing mode is used to move data within the direct page of memory. Both the
source operand and the destination operand are in the direct page. The source data is
addressed by the first byte immediately following the opcode, and the destination
location is addressed by the second byte following the opcode.
10.3.7.2 Immediate to Direct
This addressing mode is used to move an 8-bit constant to any location in the direct page
memory. The source data is the byte immediately following the opcode, and the
destination is addressed by the second byte following the opcode.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
238
Freescale Semiconductor, Inc.
Chapter 10 Central processor unit
10.3.7.3 Indexed to Direct, Post Increment
Used only by the MOV instruction, this addressing mode accesses a source operand
addressed by the H:X register, and a destination location within the direct page addressed
by the byte following the opcode. H:X is incremented after the source operand is
accessed.
10.3.7.4 Direct to Indexed, Post-Increment
Used only with the MOV instruction, this addressing mode accesses a source operand
addressed by the byte following the opcode, and a destination location addressed by the
H:X register. H:X is incremented after the destination operand is written.
10.4 Operation modes
The CPU can be placed into the following operation modes: stop, wait, background and
security.
10.4.1 Stop mode
Usually, all system clocks, including the crystal oscillator (when used), are halted during
stop mode to minimize power consumption. In such systems, external circuitry is needed
to control the time spent in stop mode and to issue a signal to wake up the target MCU
when it is time to resume processing. Unlike the earlier M68HC05 and M68HC08
MCUs, the HCS08 V6 can be configured to keep a minimum set of clocks running in
stop mode. This optionally allows an internal periodic signal to wake the target MCU
from stop mode.
When a host debug system is connected to the background debug pin (BKGD) and the
ENBDM control bit has been set by a serial command through the background interface
(or because the MCU was reset into active background mode), the oscillator is forced to
remain active when the MCU enters stop mode. In this case, if a serial BACKGROUND
command is issued to the MCU through the background debug interface while the CPU is
in stop mode, CPU clocks will resume and the CPU will enter active background mode
where other serial background commands can be processed. This ensures that a host
development system can still gain access to a target MCU even if it is in stop mode.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
239
Operation modes
10.4.2 Wait mode
The WAIT instruction enables interrupts by clearing the I bit in the CCR. It then halts the
clocks to the CPU to reduce overall power consumption while the CPU is waiting for the
interrupt or reset event that will wake the CPU from wait mode. When an interrupt or
reset event occurs, the CPU clocks will resume and the interrupt or reset event will be
processed normally.
If a serial BACKGROUND command is issued to the MCU through the background
debug interface while the CPU is in wait mode, CPU clocks will resume and the CPU
will enter active background mode where other serial background commands can be
processed. This ensures that a host development system can still gain access to a target
MCU even if it is in wait mode.
While in wait mode, there are some restrictions on which background debug commands
can be used. Only the BACKGROUND command and memory-access-with-status
commands are available while in wait mode. The memory-access-with-status commands
do not allow memory access, but they report an error indicating that the CPU is in either
stop or wait mode. The BACKGROUND command can be used to wake the CPU from
wait mode and enter active background mode.
10.4.3 Background mode
Background instruction (BGND) is not used in normal user programs because it forces
the CPU to stop processing user instructions and enter the active background mode
waiting for serial background commands. The only way to resume execution of the user
program is through reset or by a host debug system issuing a GO, TRACE1, or TAGGO
serial command through the background debug interface.
Software-based breakpoints can be set by replacing an opcode at the desired breakpoint
address with the BGND opcode. When the program reaches this breakpoint address, the
CPU is forced to active background mode rather than continuing the user program.
The active background mode functions are managed through the background debug
controller (BDC) in the HCS08 V6 core. The BDC provides the means for analyzing
MCU operation during software development. Active background mode is entered in any
of the following ways:
• When the BKGD/MS pin is low at the time the MCU exits reset.
• When a BACKGROUND command is received through the BKGD pin.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
240
Freescale Semiconductor, Inc.
Chapter 10 Central processor unit
• When a BGND instruction is executed.
• When encountering a BDC breakpoint.
Background commands are of two types:
• Non-intrusive commands, defined as commands that can be issued while the user
program is running. Non-intrusive commands can be issued through the BKGD pin
while the MCU is in run mode; non-intrusive commands can also be executed when
the MCU is in the active background mode. Non-intrusive commands include:
• Memory access commands
• Memory-access-with-status commands
• BDC register access commands
• The BACKGROUND command
• Active background commands, which can be executed only while the MCU is in
active background mode. Active background commands include commands to:
• Read or write CPU registers
• Trace one user program instruction at a time
• Leave active background mode to return to the user's application program (GO)
The active background mode is used to program a bootloader or user application program
into the flash program memory before the MCU is operated in run mode for the first time.
The active background mode can also be used to erase and reprogram the flash memory
after it has been previously programmed.
10.4.4 Security mode
Usually HCS08 V6 MCUs are implemented with a secure operating mode. When in
secure mode, external access to internal memory is restricted, so that only instructions
fetched from secure memory can access secure memory.
The method by which the MCU is put into secure mode is not defined by the HCS08 V6
Core. The core receives an external input signal that, when asserted, informs to the core
that the MCU is in secure mode.
While in secure mode, the core controls the following set of conditions:
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
241
Operation modes
1. The RAM, flash, and EEPROM arrays are considered secure memory. All registers
in Direct Page or High Page are considered non-secure memory.
2. Read data is tagged as either secure or non-secure during a program read, depending
on whether the read is from secure or non-secure memory.
3. A data read of secure memory returns a value of $00 when the current instruction is
tagged as non-secure or the access is a BDC access.
4. A data write to secure memory is blocked and data at the target address does not
change state when the current instruction is tagged as non-secure or the access is
through BDC.
5. A data write to secure memory is never blocked during the stacking cycles of
interrupt service routines.
6. Data accesses to either secure or non-secure memory are allowed when the current
instruction is tagged as secure.
7. BDC accesses to non-secure memory are allowed.
When the device is in the non-secure mode, secure memory is treated the same as nonsecure memory, and all accesses are allowed.
Table 10-2 details the security conditions for allowing or disabling a read access.
Table 10-2. Security conditions for read access
Inputs conditions
Read control
Security
enabled
Ram, flash or
EEPROM
access
Program or
vector read
Current CPU instruction
from secure memory
Current access
is via BDC
Read access
allowed
0
x
x
x
x
1
1
0
x
x
x
1
1
1
1
x
x
1
1
1
0
1
0
1
1
1
0
1
1
0
1
1
0
0
0
0
1
1
0
0
1
0
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
242
Freescale Semiconductor, Inc.
Chapter 10 Central processor unit
10.5 HCS08 V6 Opcodes
The HCS08 V6 Core has 254 one-byte opcodes and 47 two-byte opcodes, totaling 301
opcodes. For a more detailed description of the HCS08 V6 instructions please refer to the
Instruction Set Summary section.
10.6 Special Operations
The CPU performs a few special operations that are similar to instructions but do not
have opcodes like other CPU instructions. This section provides additional information
about these operations.
10.6.1 Reset Sequence
Reset can be caused by a power-on-reset (POR) event, internal conditions such as the
COP (computer operating properly) watchdog, or by assertion of an external active-low
reset pin. When a reset event occurs, the CPU immediately stops whatever it is doing (the
MCU does not wait for an instruction boundary before responding to a reset event).
The reset event is considered concluded when the sequence to determine whether the
reset came from an internal source is done and when the reset pin is no longer asserted.
At the conclusion of a reset event, the CPU performs a 6-cycle sequence to fetch the reset
vector from $FFFE and $FFFF and to fill the instruction queue in preparation for
execution of the first program instruction.
10.6.2 Interrupt Sequence
When an interrupt is requested, the CPU completes the current instruction before
responding to the interrupt. At this point, the program counter is pointing at the start of
the next instruction, which is where the CPU should return after servicing the interrupt.
The CPU responds to an interrupt by performing the same sequence of operations as for a
software interrupt (SWI) instruction, except the address used for the vector fetch is
determined by the highest priority interrupt that is pending when the interrupt sequence
started.
The CPU sequence for an interrupt is:
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
243
Instruction Set Summary
1.
2.
3.
4.
5.
Store the contents of PCL, PCH, X, A, and CCR on the stack, in that order.
Set the I bit in the CCR.
Fetch the high-order half of the interrupt vector.
Fetch the low-order half of the interrupt vector.
Delay for one free bus cycle.
Fetch three bytes of program information starting at the address indicated by the interrupt
vector to fill the instruction queue in preparation for execution of the first instruction in
the interrupt service routine.
After the CCR contents are pushed onto the stack, the I bit in the CCR is set to prevent
other interrupts while in the interrupt service routine. Although it is possible to clear the I
bit with an instruction in the interrupt service routine, this would allow nesting of
interrupts (which is not recommended because it leads to programs that are difficult to
debug and maintain).
For compatibility with the earlier M68HC05 MCUs, the high-order half of the H:X index
register pair (H) is not saved on the stack as part of the interrupt sequence. The user must
use a PSHH instruction at the beginning of the service routine to save H and then use a
PULH instruction just before the RTI that ends the interrupt service routine. It is not
necessary to save H if you are certain that the interrupt service routine does not use any
instructions or auto-increment addressing modes that might change the value of H.
The software interrupt (SWI) instruction is like a hardware interrupt except that it is not
masked by the global I bit in the CCR and it is associated with an instruction opcode
within the program so it is not asynchronous to program execution.
10.7 Instruction Set Summary
Table 10-3. Instruction Set Summary
I
N
Z
C
Address
Mode
Bus Cycles
ADC #opr8i
↕
↕
–
↕
↕
↕
IMM
A9
ii
2
ADC opr8a
↕
↕
–
↕
↕
↕
DIR
B9
dd
3
ADC opr16a
↕
↕
–
↕
↕
↕
EXT
C9
hh ll
4
ADC oprx16,X
↕
↕
–
↕
↕
↕
IX2
D9
ee ff
4
↕
↕
–
↕
↕
↕
IX1
E9
ff
3
ADC ,X
↕
↕
–
↕
↕
↕
IX
F9
ADC oprx16,SP
↕
↕
–
↕
↕
↕
SP2
9ED9
ee ff
5
ADC oprx8,SP
↕
↕
–
↕
↕
↕
SP1
9EE9
ff
4
Source Form
ADC oprx8,X
Operation
Add with Carry
Description
A ← (A) + (M) + (C)
Opcode
V H
Operand
Effect on CCR
3
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
244
Freescale Semiconductor, Inc.
Chapter 10 Central processor unit
Table 10-3. Instruction Set Summary (continued)
I
N
Z
C
Address
Mode
Bus Cycles
ADD #opr8i
↕
↕
–
↕
↕
↕
IMM
AB
ii
2
ADD opr8a
↕
↕
–
↕
↕
↕
DIR
BB
dd
3
ADD opr16a
↕
↕
–
↕
↕
↕
EXT
CB
hh ll
4
ADD oprx16,X
↕
↕
–
↕
↕
↕
IX2
DB
ee ff
4
↕
↕
–
↕
↕
↕
IX1
EB
ff
3
ADD ,X
↕
↕
–
↕
↕
↕
IX
FB
ADD oprx16,SP
↕
↕
–
↕
↕
↕
SP2
9EDB
ee ff
5
ADD oprx8,SP
↕
↕
–
↕
↕
↕
SP1
9EEB
ff
4
–
–
–
–
–
–
IMM
A7
ii
2
–
–
–
–
–
–
IMM
AF
ii
2
AND #opr8i
0
–
–
↕
↕
–
IMM
A4
ii
2
AND opr8a
0
–
–
↕
↕
–
DIR
B4
dd
3
AND opr16a
0
–
–
↕
↕
–
EXT
C4
hh ll
4
AND oprx16,X
0
–
–
↕
↕
–
IX2
D4
ee ff
4
0
–
–
↕
↕
–
IX1
E4
ff
3
AND ,X
0
–
–
↕
↕
–
IX
F4
AND oprx16,SP
0
–
–
↕
↕
–
SP2
9ED4
ee ff
5
AND oprx8,SP
0
–
–
↕
↕
–
SP1
9EE4
ff
4
ASL opr8a
↕
–
–
↕
↕
↕
DIR
38
dd
5
ASLA
↕
–
–
↕
↕
↕
INH
48
↕
–
–
↕
↕
↕
INH
58
↕
–
–
↕
↕
↕
IX1
68
ASL ,X
↕
–
–
↕
↕
↕
IX
78
ASL oprx8,SP
↕
–
–
↕
↕
↕
SP1
9E68
ff
6
ASR opr8a
↕
–
–
↕
↕
↕
DIR
37
dd
5
ASRA
↕
–
–
↕
↕
↕
INH
47
1
ASRX
↕
–
–
↕
↕
↕
INH
57
1
↕
–
–
↕
↕
↕
IX1
67
ASR ,X
↕
–
–
↕
↕
↕
IX
77
ASR oprx8,SP
↕
–
–
↕
↕
↕
SP1
9E67
ff
6
–
–
–
–
–
–
REL
24
rr
3
–
–
–
–
–
–
DIR (b0)
11
dd
5
Source Form
ADD oprx8,X
Operation
Add without Carry
Description
A ← (A) + (M)
AIS #opr8i
Add Immediate Value SP ← (SP) + (M) where
(Signed) to Stack
M is sign extended to a
Pointer
16-bit value
AIX #opr8i
Add Immediate Value
(Signed) to Index
Register (H:X)
AND oprx8,X
Logical AND
H:X ← (H:X) + (M)
where M is sign
extended to a 16-bit
value
A ← (A) & (M)
ASLX
ASL oprx8,X
ASR oprx8,X
BCC rel
Arithmetic Shift Left
(same as LSL)
Arithmetic Shift Right
Branch if Carry Bit
Clear
C ← MSB, LSB ← 0
MSB → MSB, LSB → C
Branch if (C) = 0
Opcode
V H
Operand
Effect on CCR
3
3
1
1
ff
5
4
ff
5
4
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
245
Instruction Set Summary
BCLR n,opr8a
Operation
Clear Bit n in Memory
Description
Mn ← 0
Bus Cycles
Source Form
Operand
Effect on CCR
Opcode
Table 10-3. Instruction Set Summary (continued)
V H
I
N
Z
C
Address
Mode
–
–
–
–
–
–
DIR (b1)
13
dd
5
–
–
–
–
–
–
DIR (b2)
15
dd
5
–
–
–
–
–
–
DIR (b3)
17
dd
5
–
–
–
–
–
–
DIR (b4)
19
dd
–
–
–
–
–
–
DIR (b5)
1B
dd
5
–
–
–
–
–
–
DIR (b6)
1D
dd
5
–
–
–
–
–
–
DIR (b7)
1F
dd
5
BCS rel
Branch if Carry Bit Set
(same as BLO)
Branch if (C) = 1
–
–
–
–
–
–
REL
25
rr
3
BEQ rel
Branch if Equal
Branch if (Z) = 1
–
–
–
–
–
–
REL
27
rr
3
BGE rel
Branch if Greater
Than or Equal To
(Signed Operands)
Branch if (N ⊕ V) = 0
–
–
–
–
–
–
REL
90
rr
3
BGND
Enter Active
Background if ENBDM
=1
Waits For and
Processes BDM
Commands Until GO,
TRACE1, or TAGGO
–
–
–
–
–
–
INH
82
BGT rel
Branch if Greater
Than (Signed
Operands)
Branch if (Z) | (N ⊕ V) = −
0
−
−
−
−
−
REL
92
rr
3
5+
BHCC rel
Branch if Half Carry
Bit Clear
Branch if (H) = 0
−
−
−
−
−
−
REL
28
rr
3
BHCS rel
Branch if Half Carry
Bit Set
Branch if (H) = 1
−
−
−
−
−
−
REL
29
rr
3
BHI rel
Branch if Higher
Branch if (C) | (Z) = 0
−
−
−
−
−
−
REL
22
rr
3
BHS rel
Branch if Higher or
Same (same as BCC)
Branch if (C) = 0
−
−
−
−
−
−
REL
24
rr
3
BIH rel
Branch if IRQ Pin High
Branch if IRQ pin = 1
−
−
−
−
−
−
REL
2F
rr
3
BIL rel
Branch if IRQ Pin Low
Branch if IRQ pin = 0
−
−
−
−
−
−
REL
2E
rr
3
BIT #opr8i
0
−
−
↕
↕
−
IMM
A5
ii
2
BIT opr8a
0
−
−
↕
↕
−
DIR
B5
dd
3
BIT opr16a
0
−
−
↕
↕
−
EXT
C5
hh ll
4
0
−
−
↕
↕
−
IX2
D5
ee ff
4
BIT oprx8,X
0
−
−
↕
↕
−
IX1
E5
ff
3
BIT ,X
0
−
−
↕
↕
−
IX
F5
BIT oprx16,SP
0
−
−
↕
↕
−
SP2
9ED5
ee ff
5
BIT oprx8,SP
0
−
−
↕
↕
−
SP1
9EE5
ff
4
BIT oprx16,X
Bit Test
(A) & (M), (CCR
Updated but Operands
Not Changed)
3
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
246
Freescale Semiconductor, Inc.
Chapter 10 Central processor unit
BLE rel
Operation
Description
I
N
Z
C
Address
Mode
−
−
−
−
−
REL
93
rr
3
V H
Branch if Less Than or Branch if (Z) | (N ⊕ V) = −
Equal To (Signed
1
Operands)
Bus Cycles
Source Form
Operand
Effect on CCR
Opcode
Table 10-3. Instruction Set Summary (continued)
BLO rel
Branch if Lower
(Same as BCS)
Branch if (C) = 1
−
−
−
−
−
−
REL
25
rr
3
BLS rel
Branch if Lower or
Same
Branch if (C) | (Z) = 1
−
−
−
−
−
−
REL
23
rr
3
BLT rel
Branch if Less Than
(Signed Operands)
Branch if (N ⊕ V ) = 1
−
−
−
−
−
−
REL
91
rr
3
BMC rel
Branch if Interrupt
Mask Clear
Branch if (I) = 0
−
−
−
−
−
−
REL
2C
rr
3
BMI rel
Branch if Minus
Branch if (N) = 1
−
−
−
−
−
−
REL
2B
rr
3
BMS rel
Branch if Interrupt
Mask Set
Branch if (I) = 1
−
−
−
−
−
−
REL
2D
rr
3
BNE rel
Branch if Not Equal
Branch if (Z) = 0
−
−
−
−
−
−
REL
26
rr
3
BPL rel
Branch if Plus
Branch if (N) = 0
−
−
−
−
−
−
REL
2A
rr
3
BRA rel
Branch Always
No Test
−
−
−
−
−
−
REL
20
rr
3
−
−
−
−
−
↕
DIR (b0)
01
dd rr
5
−
−
−
−
−
↕
DIR (b1)
03
dd rr
5
−
−
−
−
−
↕
DIR (b2)
05
dd rr
5
−
−
−
−
−
↕
DIR (b3)
07
dd rr
5
−
−
−
−
−
↕
DIR (b4)
09
dd rr
5
−
−
−
−
−
↕
DIR (b5)
0B
dd rr
5
−
−
−
−
−
↕
DIR (b6)
0D
dd rr
5
−
−
−
−
−
↕
DIR (b7)
0F
dd rr
5
−
−
−
−
−
−
REL
21
rr
3
−
−
−
−
−
↕
DIR (b0)
00
dd rr
5
−
−
−
−
−
↕
DIR (b1)
02
dd rr
5
−
−
−
−
−
↕
DIR (b2)
04
dd rr
5
−
−
−
−
−
↕
DIR (b3)
06
dd rr
5
−
−
−
−
−
↕
DIR (b4)
08
dd rr
5
−
−
−
−
−
↕
DIR (b5)
0A
dd rr
5
−
−
−
−
−
↕
DIR (b6)
0C
dd rr
5
−
−
−
−
−
↕
DIR (b7)
0E
dd rr
5
–
–
–
–
–
–
DIR (b0)
10
dd
5
–
–
–
–
–
–
DIR (b1)
12
dd
5
–
–
–
–
–
–
DIR (b2)
14
dd
5
BRCLR
n,opr8a,rel
BRN rel
BRSET
n,opr8a,rel
Branch if Bit n in
Memory Clear
Branch Never
Branch if Bit n in
Memory Set
Branch if (Mn) = 0
Uses 3 Bus Cycles
Branch if (Mn) = 1
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
247
Instruction Set Summary
BSET n,opr8a
Operation
Set Bit n in Memory
Description
Mn ← 1
Bus Cycles
Source Form
Operand
Effect on CCR
Opcode
Table 10-3. Instruction Set Summary (continued)
V H
I
N
Z
C
Address
Mode
–
–
–
–
–
–
DIR (b3)
16
dd
5
–
–
–
–
–
–
DIR (b4)
18
dd
5
–
–
–
–
–
–
DIR (b5)
1A
dd
5
–
–
–
–
–
–
DIR (b6)
1C
dd
5
–
–
–
–
–
–
DIR (b7)
1E
dd
5
–
–
–
–
–
–
REL
AD
rr
5
PC ← (PC) + 0x0002
push (PCL)
BSR rel
Branch to Subroutine
SP ← (SP) – 0x0001
push (PCH)
SP ← (SP) – 0x0001
PC ← (PC) + rel
CBEQ opr8a,rel
Branch if (A) = (M)
–
–
–
–
–
–
DIR
31
dd rr
5
CBEQA
#opr8i,rel
Branch if (A) = (M)
–
–
–
–
–
–
IMM
41
ii rr
4
Branch if (X) = (M)
–
–
–
–
–
–
IMM
51
ii rr
4
CBEQ oprx8,X
+,rel
Branch if (A) = (M)
–
–
–
–
–
–
IX1+
61
ff rr
5
CBEQ ,X+,rel
Branch if (A) = (M)
–
–
–
–
–
–
IX+
71
rr
5
CBEQ
oprx8,SP,rel
Branch if (A) = (M)
–
–
–
–
–
–
SP1
9E61
ff rr
6
CBEQX
#opr8i,rel
Compare and Branch
if Equal
CLC
Clear Carry Bit
C←0
–
–
–
–
–
0
INH
98
1
CLI
Clear Interrupt Mask
Bit
I←0
–
–
0
–
–
–
INH
9A
1
CLR opr8a
M ← 0x00
0
–
–
0
1
–
DIR
3F
CLRA
A ← 0x00
0
–
–
0
1
–
INH
4F
1
CLRX
X ← 0x00
0
–
–
0
1
–
INH
5F
1
dd
5
H ← 0x00
0
–
–
0
1
–
INH
8C
CLR oprx8,X
M ← 0x00
0
–
–
0
1
–
IX1
6F
CLR ,X
M ← 0x00
0
–
–
0
1
–
IX
7F
CLR oprx8,SP
M ← 0x00
0
–
–
0
1
–
SP1
9E6F
ff
6
CMP #opr8i
↕
–
–
↕
↕
↕
IMM
A1
ii
2
CMP opr8a
↕
–
–
↕
↕
↕
DIR
B1
dd
3
CMP opr16a
↕
–
–
↕
↕
↕
EXT
C1
hh ll
4
↕
–
–
↕
↕
↕
IX2
D1
ee ff
4
↕
–
–
↕
↕
↕
IX1
E1
ff
3
CMP ,X
↕
–
–
↕
↕
↕
IX
F1
CMP oprx16,SP
↕
–
–
↕
↕
↕
SP2
9ED1
CLRH
Clear
CMP oprx16,X
CMP oprx8,X
Compare Accumulator
(A) – (M); (CCR
with Memory
Updated But Operands
Not Changed)
1
ff
5
4
3
ee ff
5
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
248
Freescale Semiconductor, Inc.
Chapter 10 Central processor unit
Operation
Description
CMP oprx8,SP
Bus Cycles
Source Form
Operand
Effect on CCR
Opcode
Table 10-3. Instruction Set Summary (continued)
V H
I
N
Z
C
Address
Mode
↕
–
–
↕
↕
↕
SP1
9EE1
ff
4
dd
5
COM opr8a
M ← (M) = 0xFF – (M)
0
–
–
↕
↕
1
DIR
33
COMA
A ← (A) = 0xFF – (A)
0
–
–
↕
↕
1
INH
43
1
X ← (X) = 0xFF – (X)
0
–
–
↕
↕
1
INH
53
1
COM oprx8,X
M ← (M) = 0xFF – (M)
0
–
–
↕
↕
1
IX1
63
COM ,X
M ← (M) = 0xFF – (M)
0
–
–
↕
↕
1
IX
73
COM oprx8,SP
M ← (M) = 0xFF – (M)
0
–
–
↕
↕
1
SP1
9E63
ff
6
CPHX opr16a
↕
–
–
↕
↕
↕
EXT
3E
hh ll
6
CPHX #opr16i
↕
–
–
↕
↕
↕
IMM
65
jj kk
3
↕
–
–
↕
↕
↕
DIR
75
dd
5
CPHX oprx8,SP
↕
–
–
↕
↕
↕
SP1
9EF3
ff
6
CPX #opr8i
↕
−
−
↕
↕
↕
IMM
A3
ii
2
CPX opr8a
↕
−
−
↕
↕
↕
DIR
B3
dd
3
CPX opr16a
↕
−
−
↕
↕
↕
EXT
C3
hh ll
4
↕
−
−
↕
↕
↕
IX2
D3
ee ff
4
CPX oprx8,X
↕
−
−
↕
↕
↕
IX1
E3
ff
3
CPX ,X
↕
−
−
↕
↕
↕
IX
F3
CPX oprx16,SP
↕
−
−
↕
↕
↕
SP2
9ED3
ee ff
5
CPX oprx8,SP
↕
−
−
↕
↕
↕
SP1
9EE3
ff
4
U
−
−
↕
↕
↕
INH
72
DBNZ opr8a,rel
−
−
−
−
−
−
DIR
3B
dd rr
7
DBNZA rel
−
−
−
−
−
−
INH
4B
rr
4
DBNZX rel
−
−
−
−
−
−
INH
5B
rr
4
−
−
−
−
−
−
IX1
6B
ff rr
7
DBNZ ,X,rel
−
−
−
−
−
−
IX
7B
rr
6
DBNZ
oprx8,SP,rel
−
−
−
−
−
−
SP1
9E6B
ff rr
8
dd
5
COMX
CPHX opr8a
CPX oprx16,X
DAA
DBNZ oprx8,X,rel
One’s Complement
Compare Index
Register (H:X) with
Memory
Compare X (Index
Register Low) with
Memory
Decimal Adjust
Accumulator After
ADD or ADC of BCD
Values
Decrement and
Branch if Not Zero
(H:X) – (M:M +
0x0001); (CCR
Updated But Operands
Not Changed)
(X) – (M); (CCR
Updated But Operands
Not Changed)
(A)10
Decrement A, X, or M
Branch if (result) ≠ 0
Affects X, Not H
ff
5
4
3
1
DEC opr8a
M ← (M) – 0x01
↕
−
−
↕
↕
−
DIR
3A
DECA
A ← (A) – 0x01
↕
−
−
↕
↕
−
INH
4A
1
DECX
X ← (X) – 0x01
↕
−
−
↕
↕
−
INH
5A
1
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
249
Instruction Set Summary
Bus Cycles
Operand
Effect on CCR
Opcode
Table 10-3. Instruction Set Summary (continued)
V H
I
N
Z
C
Address
Mode
↕
−
−
↕
↕
−
IX1
6A
M ← (M) – 0x01
↕
−
−
↕
↕
−
IX
7A
M ← (M) – 0x01
↕
−
−
↕
↕
−
SP1
9E6A
A ← (H:A)÷(X), H ←
Remainder
−
−
−
−
↕
↕
INH
52
EOR #opr8i
0
−
−
↕
↕
−
IMM
A8
ii
2
EOR opr8a
0
−
−
↕
↕
−
DIR
B8
dd
3
EOR opr16a
0
−
−
↕
↕
−
EXT
C8
hh ll
4
EOR oprx16,X
0
−
−
↕
↕
−
IX2
D8
ee ff
4
0
−
−
↕
↕
−
IX1
E8
ff
3
EOR ,X
0
−
−
↕
↕
−
IX
F8
EOR oprx16,SP
0
−
−
↕
↕
−
SP2
9ED8
ee ff
5
EOR oprx8,SP
0
−
−
↕
↕
−
SP1
9EE8
ff
4
dd
5
Source Form
Operation
Description
Decrement
M ← (M) – 0x01
DEC ,X
DEC oprx8,SP
DEC oprx8,X
DIV
EOR oprx8,X
Divide
Exclusive OR Memory
with Accumulator
A ← (A ⊕ M)
ff
5
4
ff
6
6
3
INC opr8a
M ← (M) + 0x01
↕
−
−
↕
↕
−
DIR
3C
INCA
A ← (A) + 0x01
↕
−
−
↕
↕
−
INH
4C
1
INCX
X ← (X) + 0x01
↕
−
−
↕
↕
−
INH
5C
1
M ← (M) + 0x01
↕
−
−
↕
↕
−
IX1
6C
INC ,X
M ← (M) + 0x01
↕
−
−
↕
↕
−
IX
7C
INC oprx8,SP
M ← (M) + 0x01
↕
−
−
↕
↕
−
INC oprx8,X
Increment
ff
5
4
SP1
9E6C
ff
6
JMP opr8a
DIR
BC
dd
3
JMP opr16a
EXT
CC
hh ll
4
IX2
DC
ee ff
4
JMP oprx8,X
IX1
EC
ff
3
JMP ,X
IX
FC
JMP oprx16,X
PC ← Jump Address
Jump
JSR opr8a
JSR opr16a
−
−
−
−
−
−
3
−
−
−
−
−
−
DIR
BD
dd
5
PC ← (PC) + n (n = 1, 2, −
or 3) Push (PCL)
−
−
−
−
−
EXT
CD
hh ll
6
SP ← (SP) – 0x0001
Push (PCH)
−
−
−
−
−
−
IX2
DD
ee ff
6
JSR oprx8,X
SP ← (SP) – 0x0001
−
−
−
−
−
−
IX1
ED
ff
5
JSR ,X
PC ← Unconditional
Address
−
−
−
−
−
−
IX
FD
0
−
−
↕
↕
−
IMM
A6
ii
2
LDA opr8a
DIR
B6
dd
3
LDA opr16a
EXT
C6
hh ll
4
IX2
D6
ee ff
4
IX1
E6
ff
3
JSR oprx16,X
Jump to Subroutine
LDA #opr8i
LDA oprx16,X
LDA oprx8,X
Load Accumulator
from Memory
A ← (M)
5
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
250
Freescale Semiconductor, Inc.
Chapter 10 Central processor unit
Operation
Description
V H
I
N
Z
C
LDA ,X
Address
Mode
Bus Cycles
Source Form
Operand
Effect on CCR
Opcode
Table 10-3. Instruction Set Summary (continued)
IX
F6
3
LDA oprx16,SP
SP2
9ED6
ee ff
5
LDA oprx8,SP
SP1
9EE6
ff
4
LDHX #opr16i
0
−
−
↕
↕
−
IMM
45
jj kk
3
LDHX opr8a
0
−
−
↕
↕
−
DIR
55
dd
4
0
−
−
↕
↕
−
EXT
32
hh ll
5
0
−
−
↕
↕
−
IX
9EAE
LDHX oprx16,X
0
−
−
↕
↕
−
IX2
9EBE
ee ff
6
LDHX oprx8,X
0
−
−
↕
↕
−
IX1
9ECE
ff
5
LDHX oprx8,SP
0
−
−
↕
↕
−
SP1
9EFE
ff
5
LDX #opr8i
0
−
−
↕
↕
−
IMM
AE
ii
2
LDX opr8a
0
−
−
↕
↕
−
DIR
BE
dd
3
LDX opr16a
0
−
−
↕
↕
−
EXT
CE
hh ll
4
LDX oprx16,X
0
−
−
↕
↕
−
IX2
DE
ee ff
4
0
−
−
↕
↕
−
IX1
EE
ff
3
LDX ,X
0
−
−
↕
↕
−
IX
FE
LDX oprx16,SP
0
−
−
↕
↕
−
SP2
9EDE
ee ff
5
LDX oprx8,SP
0
−
−
↕
↕
−
SP1
9EEE
ff
4
LSL opr8a
↕
−
−
↕
↕
↕
DIR
38
dd
5
LSLA
↕
−
−
↕
↕
↕
INH
48
↕
−
−
↕
↕
↕
INH
58
↕
−
−
↕
↕
↕
IX1
68
LSL ,X
↕
−
−
↕
↕
↕
IX
78
LSL oprx8,SP
↕
−
−
↕
↕
↕
SP1
9E68
ff
6
LSR opr8a
↕
−
−
0
↕
↕
DIR
34
dd
5
LSRA
↕
−
−
0
↕
↕
INH
44
1
LSRX
↕
−
−
0
↕
↕
INH
54
1
↕
−
−
0
↕
↕
IX1
64
LSR ,X
↕
−
−
0
↕
↕
IX
74
LSR oprx8,SP
↕
−
−
0
↕
↕
SP1
9E64
ff
6
MOV
opr8a,opr8a
0
−
−
↕
↕
−
DIR/DIR
4E
dd
5
0
−
−
↕
↕
−
DIR/IX+
5E
dd
5
LDHX opr16a
LDHX ,X
LDX oprx8,X
Load Index Register
(H:X) from Memory
Load X (Index
Register Low) from
Memory
H:X ← (M:M + 0x0001)
X ← (M)
LSLX
LSL oprx8,X
LSR oprx8,X
MOV opr8a,X+
Logical Shift Left
(Same as ASL)
Logical Shift Right
Move
C ← MSB, LSB ← 0
0 → MSB, LSB → C
(M)destination ← (M)source
5
3
1
1
ff
5
4
ff
5
4
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
251
Instruction Set Summary
Table 10-3. Instruction Set Summary (continued)
MOV
#opr8i,opr8a
Description
V H
I
N
Z
C
Address
Mode
Bus Cycles
Operation
↕
↕
−
IMM/DIR
6E
ii
4
dd
5
H:X ← (H:X) + 0x0001 0
in IX+/DIR and DIR/IX+
Modes
−
−
MOV ,X+,opr8a
Opcode
Source Form
Operand
Effect on CCR
0
−
−
↕
↕
−
IX+/DIR
7E
X:A ← (X) × (A)
−
0
−
−
−
0
INH
42
NEG opr8a
M ← – (M) = 0x00 – (M)
↕
−
−
↕
↕
↕
DIR
30
NEGA
A ← – (A) = 0x00 – (A)
↕
−
−
↕
↕
↕
INH
40
1
X ← – (X) = 0x00 – (X)
↕
−
−
↕
↕
↕
INH
50
1
NEG oprx8,X
M ← – (M) = 0x00 – (M)
↕
−
−
↕
↕
↕
IX1
60
NEG ,X
M ← – (M) = 0x00 – (M)
↕
−
−
↕
↕
↕
IX
70
NEG oprx8,SP
M ← – (M) = 0x00 – (M)
↕
−
−
↕
↕
↕
SP1
9E60
MUL
NEGX
Unsigned multiply
Negate (Two’s
Complement)
5
dd
ff
5
5
4
ff
6
NOP
No Operation
Uses 1 Bus Cycle
−
−
−
−
−
−
INH
9D
1
NSA
Nibble Swap
Accumulator
A ← (A[3:0]:A[7:4])
−
−
−
−
−
−
INH
62
1
ORA #opr8i
0
−
−
↕
↕
−
IMM
AA
ORA opr8a
0
−
−
↕
↕
−
DIR
ORA opr16a
0
−
−
↕
↕
−
EXT
ORA oprx16,X
0
−
−
↕
↕
−
IX2
0
−
−
↕
↕
−
ORA ,X
0
−
−
↕
↕
ORA oprx16,SP
0
−
−
↕
ORA oprx8,SP
0
−
−
ORA oprx8,X
Inclusive OR
Accumulator and
Memory
A ← (A) | (M)
ii
2
BA
dd
3
CA
hh ll
4
DA
ee ff
4
IX1
EA
ff
3
−
IX
FA
↕
−
SP2
9EDA
ee ff
5
↕
↕
−
SP1
9EEA
ff
4
3
PSHA
Push Accumulator
onto Stack
Push (A); SP ← (SP) –
0x0001
−
−
−
−
−
−
INH
87
2
PSHH
Push H (Index
Register High) onto
Stack
Push (H); SP ← (SP) –
0x0001
−
−
−
−
−
−
INH
8B
2
PSHX
Push X (Index
Register Low) onto
Stack
Push (X); SP ← (SP) –
0x0001
−
−
−
−
−
−
INH
89
2
PULA
Pull Accumulator from
Stack
SP ← (SP + 0x0001);
Pull (A)
−
−
−
−
−
−
INH
86
3
PULH
Pull H (Index Register
High) from Stack
SP ← (SP + 0x0001);
Pull (H)
−
−
−
−
−
−
INH
8A
3
PULX
Pull X (Index Register
Low) from Stack
SP ← (SP + 0x0001);
Pull (X)
−
−
−
−
−
−
INH
88
3
ROL opr8a
↕
−
−
↕
↕
↕
DIR
39
ROLA
↕
−
−
↕
↕
↕
INH
49
dd
5
1
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
252
Freescale Semiconductor, Inc.
Chapter 10 Central processor unit
Bus Cycles
Operand
Effect on CCR
Opcode
Table 10-3. Instruction Set Summary (continued)
V H
I
N
Z
C
Address
Mode
↕
−
−
↕
↕
↕
INH
59
↕
−
−
↕
↕
↕
IX1
69
ROL ,X
↕
−
−
↕
↕
↕
IX
79
ROL oprx8,SP
↕
−
−
↕
↕
↕
SP1
9E69
ff
6
ROR opr8a
↕
−
−
↕
↕
↕
DIR
36
dd
5
RORA
↕
−
−
↕
↕
↕
INH
46
1
RORX
↕
−
−
↕
↕
↕
INH
56
1
↕
−
−
↕
↕
↕
IX1
66
ROR ,X
↕
−
−
↕
↕
↕
IX
76
ROR oprx8,SP
↕
−
−
↕
↕
↕
SP1
9E66
−
−
−
−
−
−
INH
9C
1
↕
↕
↕
↕
↕
↕
INH
80
9
−
−
−
−
−
−
INH
81
6
SBC #opr8i
↕
−
−
↕
↕
↕
IMM
A2
ii
2
SBC opr8a
↕
−
−
↕
↕
↕
DIR
B2
dd
3
SBC opr16a
↕
−
−
↕
↕
↕
EXT
C2
hh ll
4
SBC oprx16,X
↕
−
−
↕
↕
↕
IX2
D2
ee ff
4
ff
3
Source Form
Operation
Description
ROLX
ROL oprx8,X
ROR oprx8,X
RSP
Rotate Left through
Carry
Rotate Right through
Carry
Reset Stack Pointer
C ← MSB, LSB ← C
LSB → C, C → MSB
SP ← 0xFF (High Byte
Not Affected)
1
ff
5
4
ff
5
4
ff
6
SP ← (SP) + 0x0001,
Pull (CCR)
SP ← (SP) + 0x0001,
Pull (A)
RTI
Return from Interrupt
SP ← (SP) + 0x0001,
Pull (X)
SP ← (SP) + 0x0001,
Pull (PCH)
SP ← (SP) + 0x0001,
Pull (PCL)
SP ← SP + 0x0001, Pull
(PCH)
RTS
Return from
Subroutine
SP ← SP + 0x0001, Pull
(PCL)
SBC oprx8,X
Subtract with Carry
A ← (A) – (M) – (C)
↕
−
−
↕
↕
↕
IX1
E2
SBC ,X
↕
−
−
↕
↕
↕
IX
F2
SBC oprx16,SP
↕
−
−
↕
↕
↕
SP2
9ED2
ee ff
5
SBC oprx8,SP
↕
−
−
↕
↕
↕
SP1
9EE2
ff
4
3
SEC
Set Carry Bit
C←1
−
−
−
−
−
1
INH
99
1
SEI
Set Interrupt Mask Bit
I←1
−
−
1
−
−
−
INH
9B
1
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
253
Instruction Set Summary
Bus Cycles
Operand
Effect on CCR
Opcode
Table 10-3. Instruction Set Summary (continued)
V H
I
N
Z
C
Address
Mode
STA opr8a
0
−
−
↕
↕
−
DIR
B7
dd
3
STA opr16a
0
−
−
↕
↕
−
EXT
C7
hh ll
4
STA oprx16,X
0
−
−
↕
↕
−
IX2
D7
ee ff
4
STA oprx8,X
0
−
−
↕
↕
−
IX1
E7
ff
3
0
−
−
↕
↕
−
IX
F7
STA oprx16,SP
0
−
−
↕
↕
−
SP2
9ED7
ee ff
5
STA oprx8,SP
0
−
−
↕
↕
−
SP1
9EE7
ff
4
STHX opr8a
0
−
−
↕
↕
−
DIR
35
dd
4
Store H:X (Index Reg.) (M:M + 0x0001) ← (H:X) 0
−
−
↕
↕
−
EXT
96
hh ll
5
0
−
−
↕
↕
−
SP1
9EFF
ff
5
−
−
0
−
−
−
INH
8E
STX opr8a
0
−
−
↕
↕
−
DIR
BF
STX opr16a
0
−
−
↕
↕
−
EXT
STX oprx16,X
0
−
−
↕
↕
−
IX2
STX oprx8,X
0
−
−
↕
↕
−
0
−
−
↕
↕
STX oprx16,SP
0
−
−
↕
STX oprx8,SP
0
−
−
SUB #opr8i
↕
−
SUB opr8a
↕
SUB opr16a
SUB oprx16,X
Source Form
STA ,X
STHX opr16a
Operation
Store Accumulator in
Memory
Description
M ← (A)
STHX oprx8,SP
STOP
Enable Interrupts:
Stop Processing.
Refer to MCU
Documentation.
I bit ← 0; Stop
Processing
2
3+
dd
3
CF
hh ll
4
DF
ee ff
4
IX1
EF
ff
3
−
IX
FF
↕
−
SP2
9EDF
ee ff
5
↕
↕
−
SP1
9EEF
ff
4
−
↕
↕
↕
IMM
A0
ii
2
−
−
↕
↕
↕
DIR
B0
dd
3
↕
−
−
↕
↕
↕
EXT
C0
hh ll
4
↕
−
−
↕
↕
↕
IX2
D0
ee ff
4
↕
−
−
↕
↕
↕
IX1
E0
ff
3
SUB ,X
↕
−
−
↕
↕
↕
IX
F0
SUB oprx16,SP
↕
−
−
↕
↕
↕
SP2
9ED0
ee ff
5
SUB oprx8,SP
↕
−
−
↕
↕
↕
SP1
9EE0
ff
4
STX ,X
SUB oprx8,X
Store X (Low 8 Bits of
Index Register) in
Memory
Subtract
M ← (X)
A ← (A) – (M)
2
3
PC ← (PC) + 0x0001
Push (PCL)
SP ← (SP) – 0x0001
Push (PCH)
SP ← (SP) – 0x0001,
Push (X)
SP ← (SP) – 0x0001
Push (A)
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
254
Freescale Semiconductor, Inc.
Chapter 10 Central processor unit
SWI
Operation
Description
Software Interrupt
SP ← (SP) – 0x0001
Push (CCR)
Bus Cycles
Source Form
Operand
Effect on CCR
Opcode
Table 10-3. Instruction Set Summary (continued)
V H
I
N
Z
C
Address
Mode
−
−
1
−
−
−
INH
83
11
SP ← (SP) – 0x0001 I ←
1
PCH ← Interrupt Vector
High Byte
PCL ← Interrupt Vector
Low Byte
TAP
Transfer Accumulator
to CCR
CCR ← (A)
↕
↕
↕
↕
↕
↕
INH
84
1
TAX
Transfer Accumulator
to X (Index Register
Low)
X ← (A)
−
−
−
−
−
−
INH
97
1
TPA
Transfer CCR to
Accumulator
A ← (CCR)
−
−
−
−
−
−
INH
85
1
TST opr8a
(M) – 0x00
0
−
−
↕
↕
−
DIR
3D
TSTA
(A) – 0x00
0
−
−
↕
↕
−
INH
4D
1
TSTX
(X) – 0x00
0
−
−
↕
↕
−
INH
5D
1
(M) – 0x00
0
−
−
↕
↕
−
IX1
6D
TST ,X
(M) – 0x00
0
−
−
↕
↕
−
IX
7D
TST oprx8,SP
(M) – 0x00
0
−
−
↕
↕
−
SP1
9E6D
TST oprx8,X
Test for Negative or
Zero
dd
ff
4
4
3
ff
5
TSX
Transfer SP to Index
Register
H:X ← (SP) + 0x0001
−
−
−
−
−
−
INH
95
2
TXA
Transfer X (Index Reg.
Low) to Accumulator
A ← (X)
−
−
−
−
−
−
INH
9F
1
TXS
Transfer Index
Register to SP
SP ← (H:X) – 0x0001
−
−
−
−
−
−
INH
94
2
WAIT
Enable Interrupts Wait
for Interrupt
I bit ← 0, Halt CPU
−
−
0
−
−
−
INH
8F
3+
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
255
Instruction Set Summary
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
256
Freescale Semiconductor, Inc.
Chapter 11
Keyboard Interrupts (KBI)
11.1 Introduction
11.1.1 Features
The KBI features include:
• Up to eight keyboard interrupt pins with individual pin enable bits
• Each keyboard interrupt pin is programmable as:
• falling-edge sensitivity only
• rising-edge sensitivity only
• both falling-edge and low-level sensitivity
• both rising-edge and high-level sensitivity
• One software-enabled keyboard interrupt
• Exit from low-power modes
11.1.2 Modes of Operation
This section defines the KBI operation in:
• Wait mode
• Stop mode
• Background debug mode
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
257
External signals description
11.1.2.1 KBI in Wait mode
Executing the Wait instruction places the MCU into Wait mode. The KBI interrupt
should be enabled (KBI_SC[KBIE] = 1), if desired, before executing the Wait
instruction, allowing the KBI to continue to operate while the MCU is in Wait mode. An
enabled KBI pin (KBI_PE[KBIPEn] = 1) can be used to bring the MCU out of Wait
mode if the KBI interrupt is enabled (KBI_SC[KBIE] = 1).
11.1.2.2 KBI in Stop modes
Executing the Stop instruction places the MCU into Stop mode (when Stop is selected),
where the KBI can operate asynchronously. If this is the desired behavior, the KBI
interrupt must be enabled (KBI_SC[KBIE] = 1) before executing the Stop instruction,
allowing the KBI to continue to operate while the MCU is in Stop mode. An enabled KBI
pin (KBI_PE[KBIPEn] = 1) can be used to bring the MCU out of Stop mode if the KBI
interrupt is enabled (KBI_SC[KBIE] = 1).
11.1.3 Block Diagram
The block diagram for the keyboard interrupt module is shown below..
BUSCLK
KBACK
1
KBIxP0
0
VDD
S
KBIPE0
RESET
D
CLR
KBF
Q
SYNCHRONIZER
CK
KBEDG0
KEYBOARD
INTERRUPT FF
1
KBIxPn
0
S
KBIPEn
STOP
STOP BYPASS
KBIx
INTERRUPT
REQUEST
KBMOD
KBIE
KBEDGn
Figure 11-1. KBI block diagram
11.2 External signals description
The KBI input pins can be used to detect either falling edges, or both falling edge and
low-level interrupt requests. The KBI input pins can also be used to detect either rising
edges, or both rising edge and high-level interrupt requests.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
258
Freescale Semiconductor, Inc.
Chapter 11 Keyboard Interrupts (KBI)
The signal properties of KBI are shown in the following table:
Table 11-1. External signals description
Signal
Function
KBIxPn
I/O
Keyboard interrupt pins
I
11.3 Register definition
The KBI includes following registers:
• A pin status and control register, KBIx_SC
• A pin enable register, KBIx_PE
• An edge select register, KBIx_ES
See the direct-page register summary in the Memory chapter for the absolute address
assignments for all KBI registers. This section refers to registers and control bits only by
their names.
Some MCUs may have more than one KBI, so register names include placeholder
characters to identify which KBI is being referenced.
11.4 Memory Map and Registers
KBI memory map
Absolute
address
(hex)
3C
Width
Access
(in bits)
Register name
Reset value
Section/
page
KBI Status and Control Register (KBI0_SC)
8
R/W
00h
11.4.1/259
307C
KBIx Pin Enable Register (KBI0_PE)
8
R/W
00h
11.4.2/260
307D
KBIx Edge Select Register (KBI0_ES)
8
R/W
00h
11.4.3/261
11.4.1 KBI Status and Control Register (KBIx_SC)
KBI_SC contains the status flag and control bits, which are used to configure the KBI.
Address: 3Ch base + 0h offset = 3Ch
Bit
7
6
Read
5
4
0
3
KBF
Write
Reset
2
KBACK
0
0
0
0
0
0
1
0
KBIE
KBMOD
0
0
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
259
Memory Map and Registers
KBIx_SC field descriptions
Field
7–4
Reserved
3
KBF
Description
This field is reserved.
This read-only field is reserved and always has the value 0.
KBI Interrupt Flag
KBF indicates when a KBI interrupt request is detected. Writes have no effect on KBF.
0
1
2
KBACK
1
KBIE
KBI Acknowledge
Writing a 1 to KBACK is part of the flag clearing mechanism.
KBI Interrupt Enable
KBIE determines whether a KBI interrupt is enabled or not.
0
1
0
KBMOD
KBI interrupt request not detected.
KBI interrupt request detected.
KBI interrupt not enabled.
KBI interrupt enabled.
KBI Detection Mode
KBMOD (along with the KBEDG bits) controls the detection mode of the KBI interrupt pins.
0
1
Keyboard detects edges only.
Keyboard detects both edges and levels.
11.4.2 KBIx Pin Enable Register (KBIx_PE)
KBIx_PE contains the pin enable control bits.
Address: 3Ch base + 3040h offset = 307Ch
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
KBIPE
0
0
0
0
KBIx_PE field descriptions
Field
KBIPE
Description
KBI Pin Enables
Each of the KBIPEn bits enable the corresponding KBI interrupt pin.
0
1
Pin is not enabled as KBI interrupt.
Pin is enabled as KBI interrupt.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
260
Freescale Semiconductor, Inc.
Chapter 11 Keyboard Interrupts (KBI)
11.4.3 KBIx Edge Select Register (KBIx_ES)
KBIx_ES contains the edge select control bits.
Address: 3Ch base + 3041h offset = 307Dh
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
KBEDG
0
0
0
0
KBIx_ES field descriptions
Field
KBEDG
Description
KBI Edge Selects
Each of the KBEDGn bits selects the falling edge/low-level or rising edge/high-level function of the
corresponding pin.
0
1
Falling edge/low level.
Rising edge/high level.
11.5 Functional Description
This on-chip peripheral module is called a keyboard interrupt module because originally
it was designed to simplify the connection and use of row-column matrices of keyboard
switches. However, these inputs are also useful as extra external interrupt inputs and as
an external means of waking the MCU from stop or wait low-power modes.
The KBI module allows up to eight pins to act as additional interrupt sources. Writing to
the KBIx_PE[KBIPEn] bits independently enables or disables each KBI pin. Each KBI
pin can be configured as edge sensitive or edge and level sensitive based on the
KBIx_SC[KBMOD] bit. Edge sensitive can be software programmed to be either falling
or rising; the level can be either low or high. The polarity of the edge or edge and level
sensitivity is selected using the KBIx_ES[KBEDGn] bits.
11.5.1 Edge-only sensitivity
Synchronous logic is used to detect edges. A falling edge is detected when an enabled
keyboard interrupt (KBIx_PE[KBIPEn]=1) input signal is seen as a logic 1 (the
deasserted level) during one bus cycle and then a logic 0 (the asserted level) during the
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
261
Functional Description
next cycle. A rising edge is detected when the input signal is seen as a logic 0 (the
deasserted level) during one bus cycle and then a logic 1 (the asserted level) during the
next cycle.
Before the first edge is detected, all enabled keyboard interrupt input signals must be at
the deasserted logic levels. After any edge is detected, all enabled keyboard interrupt
input signals must return to the deasserted level before any new edge can be detected.
A valid edge on an enabled KBI pin will set KBIx_SC[KBF]. If KBIx_SC[KBIE] is set,
an interrupt request will be presented to the MPU. Clearing of KBIx_SC[KBF] is
accomplished by writing a 1 to KBIx_SC[KBACK].
11.5.2 Edge and level sensitivity
A valid edge or level on an enabled KBI pin will set KBIx_SC[KBF]. If
KBIx_SC[KBIE] is set, an interrupt request will be presented to the MCU. Clearing of
KBIx_SC[KBF] is accomplished by writing a 1 to KBIx_SC[KBACK], provided all
enabled keyboard inputs are at their deasserted levels. KBIx_SC[KBF] will remain set if
any enabled KBI pin is asserted while attempting to clear KBIx_SC[KBF] by writing a 1
to KBIx_SC[KBACK].
11.5.3 KBI Pullup Resistor
Each KBI pin, if enabled by KBIx_PE, can be configured via the associated I/O port pull
enable register, see chapter, to use:
• an internal pullup resistor, or
• no resistor
If an internal pullup resistor is enabled for an enabled KBI pin, the associated I/O port
pull select register (see I/O Port chapter) can be used to select an internal pullup resistor.
11.5.4 KBI initialization
When a keyboard interrupt pin is first enabled, it is possible to get a false keyboard
interrupt flag. To prevent a false interrupt request during keyboard initialization, the user
should do the following:
1. Mask keyboard interrupts by clearing KBIx_SC[KBIE].
2. Enable the KBI polarity by setting the appropriate KBIx_ES[KBEDGn] bits.
3. Before using internal pullup resistors, configure the associated bits in PORT_.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
262
Freescale Semiconductor, Inc.
Chapter 11 Keyboard Interrupts (KBI)
4. Enable the KBI pins by setting the appropriate KBIx_PE[KBIPEn] bits.
5. Write to KBIx_SC[KBACK] to clear any false interrupts.
6. Set KBIx_SC[KBIE] to enable interrupts.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
263
Functional Description
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
264
Freescale Semiconductor, Inc.
Chapter 12
FlexTimer Module (FTM)
12.1 Introduction
NOTE
For the chip-specific implementation details of this module's
instances, see the chip configuration information.
The FlexTimer module is a two to eight channel timer which supports input capture,
output compare, and the generation of PWM signals to control electric motor and power
management applications. The FTM time reference is a 16-bit counter that can be used as
an unsigned or signed counter.
12.1.1 FlexTimer philosophy
The FlexTimer is built upon a very simple timer used for many years on Freescale's 8-bit
microcontrollers, the HCS08 Timer PWM Module – TPM. The FlexTimer extends the
functionality to meet the demands of motor control, digital lighting solutions, and power
conversion, while providing low cost and backwards compatibility with the TPM module.
Several key enhancements are made: signed up-counter, dead time insertion hardware,
fault control inputs, enhanced triggering functionality and initialization, and polarity
control.
All of the features common with the TPM module have fully backwards compatible
register assignments and the FlexTimer can use code on the same core platform without
change to perform the same functions. A small exception to this is when the FlexTimer
clock frequency is twice bus clock frequency to provide extra resolution for high speed
PWM applications.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
265
Introduction
Motor control and power conversion features have been added through a dedicated set of
registers. The new features, such as hardware dead time insertion, polarity, fault control,
and masking, greatly reduce loading on the execution software and are usually each
controlled by a group of registers. All of the new features are disabled after reset by
default.
Flextimer input triggers can come directly from other modules integrated on the chip,
such as comparators or ADCs, to automatically initiate timer functions. These triggers
can be linked in a variety of ways during integration of the modules so please note
carefully the options available for used FlexTimer configuration.
All main user access registers are buffered to ease the load on the executing software. A
number of trigger options exist to determine which registers are updated with this user
defined data.
12.1.2 Features
The FTM features include:
• Selectable FTM source clock:
• Source clock can be the system clock, the fixed frequency clock, or an external
clock
• Fixed frequency clock is an additional clock input to allow the selection of an on
chip clock source other than the system clock
• Selecting external clock connects FTM clock to a chip level input pin therefore
allowing to synchronize the FTM counter with an off chip clock source
• Prescaler divide-by 1, 2, 4, 8, 16, 32, 64, or 128
• FTM has a 16-bit counter
• It can be a free-running counter or a counter with initial and final value
• The counting can be up or up-down
• Each channel can be configured for input capture, output compare, or edge-aligned
PWM mode
• In input capture mode:
• The capture can occur on rising edges, falling edges or both edges
• An input filter can be selected for some channels
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
266
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
• In output compare mode the output signal can be set, cleared, or toggled on match
• All channels can be configured for center-aligned PWM mode
• Each pair of channels can be combined to generate a PWM signal with independent
control of both edges of PWM signal
• The FTM channels can operate as pairs with equal outputs, pairs with
complementary outputs, or independent channels with independent outputs
• The deadtime insertion is available for each complementary pair
• Generation of triggers (match trigger)
• Software control of PWM outputs
• Up to four fault inputs for global fault control
• The polarity of each channel is configurable
• The generation of an interrupt per channel
• The generation of an interrupt when the counter overflows
• The generation of an interrupt when the fault condition is detected
• Synchronized loading of write buffered FTM registers
• Write protection for critical registers
• Backwards compatible with TPM
• Testing of input captures for a stuck at zero and one conditions
• Dual edge capture for pulse and period width measurement
12.1.3 Modes of operation
When the MCU is in active BDM background or BDM foreground mode, the FTM
temporarily suspends all counting until the MCU returns to normal user operating mode.
During stop mode, all FTM input clocks are stopped, so the FTM is effectively disabled
until clocks resume. During wait mode, the FTM continues to operate normally. If the
FTM does not need to produce a real time reference or provide the interrupt sources
needed to wake the MCU from wait mode, the power can then be saved by disabling
FTM functions before entering wait mode.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
267
Introduction
12.1.4 Block diagram
The FTM uses one input/output (I/O) pin per channel, CHn (FTM channel (n)) where n is
the channel number (0–7).
The following figure shows the FTM structure. The central component of the FTM is the
16-bit counter with programmable initial and final values and its counting can be up or
up-down.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
268
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
CLKS[1:0]
FTMEN
no clock selected
(FTM counter disable)
PS[2:0]
system clock
divided
by 2
fixed frequency clock
Prescaler
3(
1, 2, 4, 8, 16, 32, 64 or 128)
synchronizer
external clock
INITTRIGEN
CPWMS
initialization
trigger
CNTINH:L
CAPTEST
TOIE
FTM counter
(16-bit counter)
FAULTM[1:0]
FFVAL[3:0]
FAULTIE
FAULTnEN*
FFLTRnEN*
fault input n*
MODH:L
FAULTIN
FAULTF
FAULTFn*
Fault control
fault interrupt
channel 0
input
Input capture
mode logic
C0VH:L
C1VH:L
channel 1
input
Input capture
mode logic
DECAPEN
COMBINE
CPWMS
channel 0
interrupt
CH0F
CH0TRIG
DECAPEN
COMBINE
CPWMS
MS0B:MS0A
ELS0B:ELS0A
DTEN
DTPS[1:0]
DTVAL[5:0]
Output modes
logic
Deadtime
insertion
channel 6
input
Input capture
mode logic
C6VH:L
C7VH:L
channel 7
input
Input capture
mode logic
DECAPEN
COMBINE
CPWMS
INT
CH0OI
CH1OI
Initialization
channel 0
match trigger
FAULTM[1:0]
FAULTEN
POL0
POL1
SYNCHOM
CH0OM
CH1OM
Fault
control
Polarity
control
Output
mask
COMP
MS1B:MS1A
ELS1B:ELS1A
CH1F
channel 0
output
channel 1
output
channel 1
match trigger
CH1TRIG
channel 1
interrupt
CH1IE
CH6IE
Dual edge
capture
mode logic
fault condition
*where n = 3, 2, 1, 0
CH0IE
Dual edge
capture
mode logic
timer overflow
interrupt
TOF
CH6F
channel 6
interrupt
DECAPEN
COMBINE
CPWMS
MS6B:MS6A
ELS6B:ELS6A
DTEN
DTPS[1:0]
DTVAL[5:0]
INT
CH6OI
CH7OI
Output modes
logic
Deadtime
insertion
Initialization
SYNCHOM
CH6OM FAULTM[1:0]
FAULTEN
CH7OM
Output
mask
Fault
control
POL6
POL7
Polarity
control
channel 6
output
channel 7
output
COMP
MS7B:MS7A
ELS7B:ELS7A
CH7F
CH7IE
channel 7
interrupt
Figure 12-1. FTM block diagram
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
269
Signal description
12.2 Signal description
The following table shows the user-accessible signals for the FTM.
Table 12-1. Signal properties
Name
EXTCLK
Function
External clock – FTM external clock can be selected to drive the FTM counter.
CHn1
Channel (n) – I/O pin associated with FTM channel (n).
FAULTj2
Fault input (j) – input pin associated with fault input (j).
1. n = channel number (0 to 7)
2. j = fault input (0 to 3)
12.2.1 EXTCLK — FTM external clock
The external clock input signal is used as the FTM counter clock if selected by
CLKS[1:0] bits in the SC register. This clock signal must not exceed 1/4 of system clock
frequency. The FTM counter prescaler selection and settings are also used when an
external clock is selected.
12.2.2 CHn — FTM channel (n) I/O pin
Each FTM channel can be configured to operate either as input or output. The direction
associated with each channel, input or output, is selected according to the mode assigned
for that channel.
12.2.3 FAULTj — FTM fault input
The fault input signals are used to control the CHn channel output state. If a fault is
detected, the FAULTj signal is asserted and the channel output is put in a safe state. The
behavior of the fault logic is defined by the FAULTM[1:0] control bits in the MODE
register and FAULTEN bit in the COMBINEm register. Note that each FAULTj input
may affect all channels selectively since FAULTM[1:0] and FAULTEN control bits are
defined for each pair of channels. Each FAULTj input is activated by its corresponding
FAULTjEN bit in the FLTCTRL register.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
270
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
12.3 Memory map and register definition
This section provides a detailed description of all FTM registers.
12.3.1 Module memory map
This section presents a high-level summary of the FTM registers and how they are
mapped.
The FTM memory map can be split into two sets of registers. The first set has the original
TPM registers.
Starting with Counter Initial Value High (CNTINH), the second set has the FTM specific
registers. Any second set registers, or bits within these registers, that are used by an
unavailable function in the FTM configuration remain in the memory map and in the
reset value even though they have no active function.
Note
Do not write to the FTM specific registers (second set registers)
when FTMEN = 0.
12.3.2 Register descriptions
This section consists of register descriptions in address order.
NOTE
Not all the registers in the following memory map are available
for this device, see FTM registers for details.
FTM memory map
Absolute
address
(hex)
Register name
Width
Access
(in bits)
Reset value
Section/
page
20
Status and Control (FTM0_SC)
8
R/W
00h
12.3.3/274
21
Counter High (FTM0_CNTH)
8
R/W
00h
12.3.4/275
22
Counter Low (FTM0_CNTL)
8
R/W
00h
12.3.5/276
23
Modulo High (FTM0_MODH)
8
R/W
00h
12.3.6/276
24
Modulo Low (FTM0_MODL)
8
R/W
00h
12.3.7/277
25
Channel Status and Control (FTM0_C0SC)
8
R/W
00h
12.3.8/277
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
271
Memory map and register definition
FTM memory map (continued)
Absolute
address
(hex)
Register name
Width
Access
(in bits)
Reset value
Section/
page
26
Channel Value High (FTM0_C0VH)
8
R/W
00h
12.3.9/280
27
Channel Value Low (FTM0_C0VL)
8
R/W
00h
12.3.10/281
28
Channel Status and Control (FTM0_C1SC)
8
R/W
00h
12.3.8/277
29
Channel Value High (FTM0_C1VH)
8
R/W
00h
12.3.9/280
2A
Channel Value Low (FTM0_C1VL)
8
R/W
00h
12.3.10/281
2B
Channel Status and Control (FTM0_C2SC)
8
R/W
00h
12.3.8/277
2C
Channel Value High (FTM0_C2VH)
8
R/W
00h
12.3.9/280
2D
Channel Value Low (FTM0_C2VL)
8
R/W
00h
12.3.10/281
2E
Channel Status and Control (FTM0_C3SC)
8
R/W
00h
12.3.8/277
2F
Channel Value High (FTM0_C3VH)
8
R/W
00h
12.3.9/280
30
Channel Value Low (FTM0_C3VL)
8
R/W
00h
12.3.10/281
31
Channel Status and Control (FTM0_C4SC)
8
R/W
00h
12.3.8/277
32
Channel Value High (FTM0_C4VH)
8
R/W
00h
12.3.9/280
33
Channel Value Low (FTM0_C4VL)
8
R/W
00h
12.3.10/281
34
Channel Status and Control (FTM0_C5SC)
8
R/W
00h
12.3.8/277
35
Channel Value High (FTM0_C5VH)
8
R/W
00h
12.3.9/280
36
Channel Value Low (FTM0_C5VL)
8
R/W
00h
12.3.10/281
37
Counter Initial Value High (FTM0_CNTINH)
8
R/W
00h
12.3.11/281
38
Counter Initial Value Low (FTM0_CNTINL)
8
R/W
00h
12.3.12/282
39
Capture and Compare Status (FTM0_STATUS)
8
R/W
00h
12.3.13/282
3A
Features Mode Selection (FTM0_MODE)
8
R/W
04h
12.3.14/284
3B
Synchronization (FTM0_SYNC)
8
R/W
00h
12.3.15/285
3C
Initial State for Channel Output (FTM0_OUTINIT)
8
R/W
00h
12.3.16/287
3D
Output Mask (FTM0_OUTMASK)
8
R/W
00h
12.3.17/289
3E
Function for Linked Channels (FTM0_COMBINE0)
8
R/W
00h
12.3.18/290
3F
Function for Linked Channels (FTM0_COMBINE1)
8
R/W
00h
12.3.18/290
40
Function for Linked Channels (FTM0_COMBINE2)
8
R/W
00h
12.3.18/290
42
Deadtime Insertion Control (FTM0_DEADTIME)
8
R/W
00h
12.3.19/292
43
External Trigger (FTM0_EXTTRIG)
8
R/W
00h
12.3.20/293
44
Channels Polarity (FTM0_POL)
8
R/W
00h
12.3.21/294
45
Fault Mode Status (FTM0_FMS)
8
R/W
00h
12.3.22/296
46
Input Capture Filter Control (FTM0_FILTER0)
8
R/W
00h
12.3.23/297
47
Input Capture Filter Control (FTM0_FILTER1)
8
R/W
00h
12.3.23/297
48
Fault Input Filter Control (FTM0_FLTFILTER)
8
R/W
00h
12.3.24/298
49
Fault Input Control (FTM0_FLTCTRL)
8
R/W
00h
12.3.25/299
30C0
Status and Control (FTM2_SC)
8
R/W
00h
12.3.3/274
30C1
Counter High (FTM2_CNTH)
8
R/W
00h
12.3.4/275
30C2
Counter Low (FTM2_CNTL)
8
R/W
00h
12.3.5/276
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
272
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
FTM memory map (continued)
Absolute
address
(hex)
Register name
Width
Access
(in bits)
Reset value
Section/
page
30C3
Modulo High (FTM2_MODH)
8
R/W
00h
12.3.6/276
30C4
Modulo Low (FTM2_MODL)
8
R/W
00h
12.3.7/277
30C5
Channel Status and Control (FTM2_C0SC)
8
R/W
00h
12.3.8/277
30C6
Channel Value High (FTM2_C0VH)
8
R/W
00h
12.3.9/280
30C7
Channel Value Low (FTM2_C0VL)
8
R/W
00h
12.3.10/281
30C8
Channel Status and Control (FTM2_C1SC)
8
R/W
00h
12.3.8/277
30C9
Channel Value High (FTM2_C1VH)
8
R/W
00h
12.3.9/280
30CA
Channel Value Low (FTM2_C1VL)
8
R/W
00h
12.3.10/281
30CB
Channel Status and Control (FTM2_C2SC)
8
R/W
00h
12.3.8/277
30CC
Channel Value High (FTM2_C2VH)
8
R/W
00h
12.3.9/280
30CD
Channel Value Low (FTM2_C2VL)
8
R/W
00h
12.3.10/281
30CE
Channel Status and Control (FTM2_C3SC)
8
R/W
00h
12.3.8/277
30CF
Channel Value High (FTM2_C3VH)
8
R/W
00h
12.3.9/280
30D0
Channel Value Low (FTM2_C3VL)
8
R/W
00h
12.3.10/281
30D1
Channel Status and Control (FTM2_C4SC)
8
R/W
00h
12.3.8/277
30D2
Channel Value High (FTM2_C4VH)
8
R/W
00h
12.3.9/280
30D3
Channel Value Low (FTM2_C4VL)
8
R/W
00h
12.3.10/281
30D4
Channel Status and Control (FTM2_C5SC)
8
R/W
00h
12.3.8/277
30D5
Channel Value High (FTM2_C5VH)
8
R/W
00h
12.3.9/280
30D6
Channel Value Low (FTM2_C5VL)
8
R/W
00h
12.3.10/281
30D7
Counter Initial Value High (FTM2_CNTINH)
8
R/W
00h
12.3.11/281
30D8
Counter Initial Value Low (FTM2_CNTINL)
8
R/W
00h
12.3.12/282
30D9
Capture and Compare Status (FTM2_STATUS)
8
R/W
00h
12.3.13/282
30DA
Features Mode Selection (FTM2_MODE)
8
R/W
04h
12.3.14/284
30DB
Synchronization (FTM2_SYNC)
8
R/W
00h
12.3.15/285
30DC
Initial State for Channel Output (FTM2_OUTINIT)
8
R/W
00h
12.3.16/287
30DD
Output Mask (FTM2_OUTMASK)
8
R/W
00h
12.3.17/289
30DE
Function for Linked Channels (FTM2_COMBINE0)
8
R/W
00h
12.3.18/290
30DF
Function for Linked Channels (FTM2_COMBINE1)
8
R/W
00h
12.3.18/290
30E0
Function for Linked Channels (FTM2_COMBINE2)
8
R/W
00h
12.3.18/290
30E2
Deadtime Insertion Control (FTM2_DEADTIME)
8
R/W
00h
12.3.19/292
30E3
External Trigger (FTM2_EXTTRIG)
8
R/W
00h
12.3.20/293
30E4
Channels Polarity (FTM2_POL)
8
R/W
00h
12.3.21/294
30E5
Fault Mode Status (FTM2_FMS)
8
R/W
00h
12.3.22/296
30E6
Input Capture Filter Control (FTM2_FILTER0)
8
R/W
00h
12.3.23/297
30E7
Input Capture Filter Control (FTM2_FILTER1)
8
R/W
00h
12.3.23/297
30E8
Fault Input Filter Control (FTM2_FLTFILTER)
8
R/W
00h
12.3.24/298
30E9
Fault Input Control (FTM2_FLTCTRL)
8
R/W
00h
12.3.25/299
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
273
Memory map and register definition
12.3.3 Status and Control (FTMx_SC)
SC contains the overflow status flag and control bits used to configure the interrupt
enable, FTM configuration, clock source, and prescaler factor. These controls relate to all
channels within this module.
Address: Base address + 0h offset
Bit
7
Read
TOF
Write
0
Reset
0
6
5
TOIE
CPWMS
0
0
4
3
2
CLKS
0
1
0
PS
0
0
0
0
FTMx_SC field descriptions
Field
7
TOF
Description
Timer Overflow Flag
Set by hardware when the FTM counter passes the value in the Counter Modulo registers. The TOF bit is
cleared by reading the SC register while TOF is set and then writing a 0 to TOF bit. Writing a 1 to TOF has
no effect.
If another FTM overflow occurs between the read and write operations, the write operation has no effect;
therefore, TOF remains set indicating an overflow has occurred. In this case a TOF interrupt request is not
lost due to the clearing sequence for a previous TOF.
0
1
6
TOIE
Timer Overflow Interrupt Enable
Enables FTM overflow interrupts.
0
1
5
CPWMS
FTM counter has not overflowed.
FTM counter has overflowed.
Disable TOF interrupts. Use software polling.
Enable TOF interrupts. An interrupt is generated when TOF equals one.
Center-aligned PWM Select
Selects CPWM mode. This mode configures the FTM to operate in up-down counting mode.
CPWMS is write protected. It can be written only when MODE[WPDIS] = 1.
0
1
4–3
CLKS
FTM counter operates in up counting mode.
FTM counter operates in up-down counting mode.
Clock Source Selection
Selects one of the three FTM counter clock sources.
CLKS is write protected. It can be written only when MODE[WPDIS] = 1.
00
01
10
11
No clock selected (this in effect disables the FTM counter).
If MODE[FTMEN] = 0, the System clock divided by 2 is selected. If MODE[FTMEN] = 1, the System
clock is selected.
Fixed frequency clock
External clock
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
274
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
FTMx_SC field descriptions (continued)
Field
PS
Description
Prescale Factor Selection
Selects one of 8 division factors for the clock source selected by CLKS. The new prescaler factor affects
the clock source on the next system clock cycle after the new value is updated into the register bits.
PS is write protected. It can be written only when MODE[WPDIS] = 1.
000
001
010
011
100
101
110
111
Divide by 1
Divide by 2
Divide by 4
Divide by 8
Divide by 16
Divide by 32
Divide by 64
Divide by 128
12.3.4 Counter High (FTMx_CNTH)
The Counter registers contain the high and low bytes of the counter value. Reading either
byte latches the contents of both bytes into a buffer where they remain latched until the
other half is read. This allows coherent 16-bit reads in either big-endian or little-endian
order which makes this more friendly to various compiler implementations. The
coherency mechanism is automatically restarted by an MCU reset or any write to the
Status and Control register.
Writing any value to COUNT_H or COUNT_L updates the FTM counter with its initial
16-bit value (contained in the Counter Initial Value registers) and resets the read
coherency mechanism, regardless of the data involved in the write.
When BDM is active, the FTM counter is frozen (this is the value that you may read); the
read coherency mechanism is frozen such that the buffer latches remain in the state they
were in when the BDM became active, even if one or both counter bytes are read while
BDM is active. This assures that if you were in the middle of reading a 16-bit register
when BDM became active, it reads the appropriate value from the other half of the 16-bit
value after returning to normal execution.
Address: Base address + 1h offset
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
COUNT_H
0
0
0
0
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
275
Memory map and register definition
FTMx_CNTH field descriptions
Field
COUNT_H
Description
Counter value high byte
12.3.5 Counter Low (FTMx_CNTL)
See the description for the Counter High register.
Address: Base address + 2h offset
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
COUNT_L
0
0
0
0
FTMx_CNTL field descriptions
Field
COUNT_L
Description
Counter value low byte
12.3.6 Modulo High (FTMx_MODH)
The Modulo registers contain the high and low bytes of the modulo value for the FTM
counter. After the FTM counter reaches the modulo value, the overflow flag (TOF)
becomes set at the next clock, and the next value of FTM counter depends on the selected
counting method (Counter).
Writing to either byte latches the value into a buffer. The register is updated with the
value of their write buffer according to Update of the registers with write buffers.
If MODE[FTMEN] = 0, this write coherency mechanism may be manually reset by
writing to the SC register whether BDM is active or not.
When BDM is active, this write coherency mechanism is frozen such that the buffer
latches remain in the state they were in when the BDM became active, even if one or both
bytes of the modulo register are written while BDM is active. Any write to the modulo
register bypasses the buffer latches and directly writes to the modulo register while BDM
is active.
It is recommended to initialize the FTM counter, by writing to CNTH or CNTL, before
writing to the FTM modulo register to avoid confusion about when the first counter
overflow will occur.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
276
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
Address: Base address + 3h offset
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
3
2
1
0
0
0
0
0
MOD_H
0
0
0
0
FTMx_MODH field descriptions
Field
MOD_H
Description
High byte of the modulo value
12.3.7 Modulo Low (FTMx_MODL)
See the description for the Modulo High register.
Address: Base address + 4h offset
Bit
Read
Write
Reset
7
6
5
4
MOD_L
0
0
0
0
FTMx_MODL field descriptions
Field
MOD_L
Description
Low byte of the modulo value
12.3.8 Channel Status and Control (FTMx_CnSC)
CnSC contains the channel-interrupt-status flag and control bits used to configure the
interrupt enable, channel configuration, and pin function.
Table 12-73. Mode, edge, and level selection
DECAPEN
COMBINE
CPWMS
MSnB:MSnA
ELSnB:ELSnA
Mode
Configuration
X
X
X
XX
00
None
Pin not used for
FTM
0
0
0
00
01
Input capture
Capture on
Rising Edge
Only
10
Capture on
Falling Edge
Only
11
Capture on
Rising or Falling
Edge
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
277
Memory map and register definition
Table 12-73. Mode, edge, and level selection (continued)
DECAPEN
COMBINE
CPWMS
MSnB:MSnA
ELSnB:ELSnA
Mode
Configuration
01
01
Output compare
Toggle Output
on match
1X
10
Clear Output on
match
11
Set Output on
match
10
Edge-aligned
PWM
High-true pulses
(clear Output on
match)
X1
1
1
1
0
XX
0
XX
0
X0
10
Low-true pulses
(set Output on
match)
Center-aligned
PWM
High-true pulses
(clear Output on
match-up)
X1
Low-true pulses
(set Output on
match-up)
10
Combine PWM High-true pulses
(set on channel
(n) match, and
clear on channel
(n+1) match)
X1
Low-true pulses
(clear on
channel (n)
match, and set
on channel (n
+1) match)
See the
following table.
Dual Edge
Capture Mode
X1
One-shot
capture mode
Continuous
capture mode
Table 12-74. Dual edge capture mode — edge polarity selection
ELSnB
ELSnA
Channel Port Enable
Detected Edges
0
0
Disabled
No edge
0
1
Enabled
Rising edge
1
0
Enabled
Falling edge
1
1
Enabled
Rising and falling edges
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
278
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
Address: Base address + 5h offset + (3d × i), where i=0d to 5d
Bit
7
Read
CHF
Write
0
Reset
0
6
5
4
3
2
CHIE
MSB
MSA
ELSB
ELSA
0
0
0
0
0
1
0
0
0
0
0
FTMx_CnSC field descriptions
Field
7
CHF
Description
Channel Flag
Set by hardware when an event occurs on the channel. CHF is cleared by reading the CnSC register while
CHnF is set and then writing a 0 to the CHF bit. Writing a 1 to CHF has no effect.
If another event occurs between the read and write operations, the write operation has no effect; therefore,
CHF remains set indicating an event has occurred. In this case a CHF interrupt request is not lost due to
the clearing sequence for a previous CHF.
0
1
6
CHIE
Channel Interrupt Enable
Enables channel interrupts.
0
1
5
MSB
No channel event has occurred.
A channel event has occurred.
Disable channel interrupts. Use software polling.
Enable channel interrupts.
Channel Mode Select
Used for further selections in the channel logic. Its functionality is dependent on the channel mode. See
the table in the register description.
MSB is write protected. It can be written only when MODE[WPDIS] = 1.
4
MSA
Channel Mode Select
Used for further selections in the channel logic. Its functionality is dependent on the channel mode. See
the table in the register description.
MSA is write protected. It can be written only when MODE[WPDIS] = 1.
3
ELSB
Edge or Level Select
2
ELSA
Edge or Level Select
The functionality of ELSB and ELSA depends on the channel mode. See the table in the register
description.
ELSB is write protected. It can be written only when MODE[WPDIS] = 1.
The functionality of ELSB and ELSA depends on the channel mode. See the table in the register
description.
ELSA is write protected. It can be written only when MODE[WPDIS] = 1.
1
Reserved
This field is reserved.
This read-only field is reserved and always has the value 0.
0
Reserved
This field is reserved.
This read-only field is reserved and always has the value 0.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
279
Memory map and register definition
12.3.9 Channel Value High (FTMx_CnVH)
These registers contain the captured FTM counter value of the input capture function or
the match value for the output modes.
In input capture, capture test, and dual edge capture modes, reading a single byte in CnV
latches the contents into a buffer where they remain latched until the other byte is read.
This latching mechanism also resets, or becomes unlatched, when the CnSC register is
written whether BDM mode is active or not. Any write to the channel registers is ignored
during these input modes.
When BDM is active, the read coherency mechanism is frozen such that the buffer
latches remain in the state they were in when the BDM became active, even if one or both
bytes of the channel value register are read while BDM is active. This ensures that if you
were in the middle of reading a 16-bit register when BDM became active, it reads the
appropriate value from the other half of the 16-bit value after returning to normal
execution. Any read of the CnV registers in BDM mode bypasses the buffer latches and
returns the value of these registers and not the value of their read buffer.
In output modes, writing to CnV latches the value into a buffer. The registers are updated
with the value of their write buffer according to Update of the registers with write
buffers.
If MODE[FTMEN] = 0, this write coherency mechanism may be manually reset by
writing to the CnSC register whether BDM mode is active or not. This latching
mechanism allows coherent 16-bit writes in either big-endian or little-endian order, which
is friendly to various compiler implementations.
When BDM is active, the write coherency mechanism is frozen such that the buffer
latches remain in the state they were in when the BDM became active even if one or both
bytes of the channel value register are written while BDM is active. Any write to the CnV
registers bypasses the buffer latches and writes directly to the register while BDM is
active. The values written to the channel value registers while BDM is active are used in
output modes operation after normal execution resumes. Writes to the channel value
registers while BDM is active do not interfere with the partial completion of a coherency
sequence. After the write coherency mechanism has been fully exercised, the channel
value registers are updated using the buffered values while BDM was not active.
Address: Base address + 6h offset + (3d × i), where i=0d to 5d
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
VAL_H
0
0
0
0
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
280
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
FTMx_CnVH field descriptions
Field
VAL_H
Description
Channel Value High Byte
Captured FTM counter value of the input capture function or the match value for the output modes
12.3.10 Channel Value Low (FTMx_CnVL)
See the description for the Channel Value High register.
Address: Base address + 7h offset + (3d × i), where i=0d to 5d
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
VAL_L
0
0
0
0
FTMx_CnVL field descriptions
Field
VAL_L
Description
Channel Value Low Byte
Captured FTM counter value of the input capture function or the match value for the output modes
12.3.11 Counter Initial Value High (FTMx_CNTINH)
The Counter Initial Value registers contain the high and low bytes of the initial value for
the FTM counter.
Writing to either byte latches the value into a buffer. The registers are updated with the
value of their write buffer.
When BDM is active, the write coherency mechanism is frozen such that the buffer
latches remain in the state they were in when the BDM became active, even if one or both
bytes of the counter initial value register are written while BDM is active. Any write to
the counter initial value registers bypasses the buffer latches and writes directly to the
counter initial value register while BDM is active.
The first time that the FTM clock is selected (first write to change the CLKS bits to a
non-zero value), FTM counter starts with the value 0x0000. To avoid this behavior,
before the first write to select the FTM clock, write the new value to the Counter Initial
Value registers and then initialize the FTM counter by writing any value to CNT).
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
281
Memory map and register definition
Address: Base address + 17h offset
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
3
2
1
0
0
0
0
0
INIT_H
0
0
0
0
FTMx_CNTINH field descriptions
Field
INIT_H
Description
Counter Initial Value High Byte
12.3.12 Counter Initial Value Low (FTMx_CNTINL)
See the description for the Counter Initial Value High register.
Address: Base address + 18h offset
Bit
Read
Write
Reset
7
6
5
4
INIT_L
0
0
0
0
FTMx_CNTINL field descriptions
Field
INIT_L
Description
Counter Initial Value Low Byte
12.3.13 Capture and Compare Status (FTMx_STATUS)
STATUS contains a copy of the status flag CHnF bit, in CnSC, for each FTM channel for
software convenience.
Each CHnF bit in STATUS is a mirror of CHnF bit in CnSC. All CHnF bits can be
checked using only one read of STATUS. All CHnF bits can be cleared by reading
STATUS followed by writing 0x00 to STATUS.
Hardware sets the individual channel flags when an event occurs on the channel. CHF is
cleared by reading STATUS while CHnF is set and then writing a 0 to the CHF bit.
Writing a 1 to CHF has no effect.
If another event occurs between the read and write operations, the write operation has no
effect; therefore, CHF remains set indicating an event has occurred. In this case, a CHF
interrupt request is not lost due to the clearing sequence for a previous CHF.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
282
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
NOTE
The use of STATUS register is available only when
(MODE[FTMEN] = 1), (COMBINE = 1), and (CPWMS = 0).
The use of this register with (MODE[FTMEN] = 0),
(COMBINE = 0), or (CPWMS = 1) is not recommended and its
results are not guaranteed.
Address: Base address + 19h offset
7
6
5
4
3
2
1
0
Read
Bit
CH7F
CH6F
CH5F
CH4F
CH3F
CH2F
CH1F
CH0F
Write
0
0
0
0
0
0
0
0
Reset
0
0
0
0
0
0
0
0
FTMx_STATUS field descriptions
Field
7
CH7F
Description
Channel 7 Flag
See the register description.
0
1
6
CH6F
Channel 6 Flag
See the register description.
0
1
5
CH5F
See the register description.
See the register description.
No channel event has occurred.
A channel event has occurred.
Channel 3 Flag
See the register description.
0
1
2
CH2F
No channel event has occurred.
A channel event has occurred.
Channel 4 Flag
0
1
3
CH3F
No channel event has occurred.
A channel event has occurred.
Channel 5 Flag
0
1
4
CH4F
No channel event has occurred.
A channel event has occurred.
No channel event has occurred.
A channel event has occurred.
Channel 2 Flag
See the register description.
0
1
No channel event has occurred.
A channel event has occurred.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
283
Memory map and register definition
FTMx_STATUS field descriptions (continued)
Field
1
CH1F
Description
Channel 1 Flag
See the register description.
0
1
0
CH0F
No channel event has occurred.
A channel event has occurred.
Channel 0 Flag
See the register description.
0
1
No channel event has occurred.
A channel event has occurred.
12.3.14 Features Mode Selection (FTMx_MODE)
This register contains the control bits used to configure the fault interrupt and fault
control, capture test mode, PWM synchronization, write protection, channel output
initialization, and enable the enhanced features of the FTM. These controls relate to all
channels within this module.
Address: Base address + 1Ah offset
Bit
Read
Write
Reset
7
6
FAULTIE
0
5
FAULTM
0
0
4
3
2
1
0
CAPTEST
PWMSYNC
WPDIS
INIT
FTMEN
0
0
1
0
0
FTMx_MODE field descriptions
Field
7
FAULTIE
Description
Fault Interrupt Enable
Enables the generation of an interrupt when a fault is detected by FTM and the FTM fault control is
enabled.
0
1
6–5
FAULTM
Fault control interrupt is disabled.
Fault control interrupt is enabled.
Fault Control Mode
Defines the FTM fault control mode.
FAULTM is write protected. These bits can be written only if MODE[WPDIS] = 1.
00
01
10
11
Fault control is disabled for all channels.
Fault control is enabled for even channels only (channels 0, 2, 4, and 6), and the selected mode is
the manual fault clearing.
Fault control is enabled for all channels, and the selected mode is the manual fault clearing.
Fault control is enabled for all channels, and the selected mode is the automatic fault clearing.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
284
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
FTMx_MODE field descriptions (continued)
Field
4
CAPTEST
Description
Capture Test Mode Enable
Enables the capture test mode. CAPTEST bit is write protected. This bit can be written only if WPDIS = 1.
0
1
3
PWMSYNC
PWM Synchronization Mode
Selects which triggers can be used by MOD, CV, CHnOM, and FTM counter synchronization (PWM
synchronization).
0
1
2
WPDIS
No restrictions. Software and hardware triggers can be used by MOD, CV, CHnOM, and FTM counter
synchronization.
Software trigger can be used only by MOD and CV synchronization, and hardware triggers can be
used only by CHnOM and FTM counter synchronization.
Write Protection Disable
When write protection is enabled (MODE[WPDIS] = 0), write protected bits can not be written. When write
protection is disabled (MODE[WPDIS] = 1), write protected bits can be written. The WPDIS bit is the
negation of the WPEN bit. WPDIS is cleared when 1 is written to WPEN. WPDIS is set when WPEN bit is
read as a 1 and then 1 is written to WPDIS. Writing 0 to WPDIS has no effect.
0
1
1
INIT
Capture test mode is disabled.
Capture test mode is enabled.
Write protection is enabled.
Write protection is disabled.
Initialize the Output Channels
When a 1 is written to INIT bit the output channels are initialized according to the state of their
corresponding bit in the OUTINIT register. Writing a 0 to INIT bit has no effect.
The INIT bit is always read as 0.
0
FTMEN
FTM Enable
This bit is write protected, and can be written only if WPDIS = 1.
0
1
Only the TPM-compatible registers (first set of registers) can be used without any restriction. Do not
use the FTM-specific registers.
All registers including the FTM-specific registers (second set of registers) are available for use with no
restrictions.
12.3.15 Synchronization (FTMx_SYNC)
This register configures the PWM synchronization.
A synchronization event can perform the synchronized update of MOD, CV, and
OUTMASK registers with the value of their write buffer and the FTM counter
initialization.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
285
Memory map and register definition
NOTE
The software trigger (SWSYNC bit) and hardware triggers
(TRIG0, TRIG1, and TRIG2 bits) have a potential conflict if
used together. Use only hardware or software triggers but not
both at the same time, otherwise unpredictable behavior is
likely to happen.
The selection of the boundary cycle (CNTMAX and CNTMIN
bits) is intended to provide the update of MOD, CNTIN, and
CV across all enabled channels simultaneously. The use of the
boundary cycle selection together with TRIG0, TRIG1, or
TRIG2 bits is likely to result in unpredictable behavior.
The MODE[PWMSYNC] bit determines which type of trigger
event controls the functions enabled by the SYNC register.
Address: Base address + 1Bh offset
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
SWSYNC
TRIG2
TRIG1
TRIG0
SYNCHOM
REINIT
CNTMAX
CNTMIN
0
0
0
0
0
0
0
0
FTMx_SYNC field descriptions
Field
7
SWSYNC
Description
PWM Synchronization Software Trigger
Selects the software trigger as the PWM synchronization trigger. The software trigger occurs when a 1 is
written to SWSYNC bit.
0
1
6
TRIG2
PWM Synchronization External Trigger 2
Selects external trigger 2 as the PWM synchronization trigger. External trigger 2 occurs when the FTM
detects a rising edge in the trigger 2 input signal.
0
1
5
TRIG1
External trigger 2 is not selected.
External trigger 2 is selected.
PWM Synchronization External Trigger 1
Selects external trigger 1 as the PWM synchronization trigger. External trigger 1 occurs when the FTM
detects a rising edge in the trigger 1 input signal.
0
1
4
TRIG0
Software trigger is not selected.
Software trigger is selected.
External trigger 1 is not selected.
External trigger 1 is selected.
PWM Synchronization External Trigger 0
Selects external trigger 0 as the PWM synchronization trigger. External trigger 0 occurs when the FTM
detects a rising edge in the trigger 0 input signal.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
286
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
FTMx_SYNC field descriptions (continued)
Field
Description
0
1
3
SYNCHOM
Output Mask Synchronization
Selects when the CHnOM bits in register OUTMASK are updated with the value of their write buffer.
0
1
2
REINIT
Determines if the FTM counter is reinitialized when the selected trigger for the synchronization is detected.
FTM counter continues to count normally.
FTM counter is updated with its initial value when the selected trigger is detected.
Maximum Boundary Cycle Enable
Determines when the MOD, CNTIN, and CV registers are updated with their write buffer contents following
a PWM synchronization event. If CNTMAX is enabled, the registers are updated when the FTM counter
reaches its maximum value MOD.
0
1
0
CNTMIN
CHnOM bits are updated with the value of the OUTMASK write buffer in all rising edges of the system
clock.
CHnOM bits are updated with the value of the OUTMASK write buffer only by the PWM
synchronization.
FTM Counter Reinitialization by Synchronization (See “FTM Counter Synchronization”)
0
1
1
CNTMAX
External trigger 0 is not selected.
External trigger 0 is selected.
The maximum boundary cycle is disabled.
The maximum boundary cycle is enabled.
Minimum Boundary Cycle Enable
Determines when the MOD and CV registers are updated with their write buffer contents after a PWM
synchronization event. If CNTMIN is enabled, the registers are updated when the FTM counter reaches its
minimum value CNTIN.
0
1
The minimum boundary cycle is disabled.
The minimum boundary cycle is enabled.
12.3.16 Initial State for Channel Output (FTMx_OUTINIT)
Address: Base address + 1Ch offset
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
CH7OI
CH6OI
CH5OI
CH4OI
CH3OI
CH2OI
CH1OI
CH0OI
0
0
0
0
0
0
0
0
FTMx_OUTINIT field descriptions
Field
7
CH7OI
Description
Channel 7 Output Initialization Value
Selects the value that is forced into the channel output when the initialization occurs.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
287
Memory map and register definition
FTMx_OUTINIT field descriptions (continued)
Field
Description
0
1
6
CH6OI
Channel 6 Output Initialization Value
Selects the value that is forced into the channel output when the initialization occurs.
0
1
5
CH5OI
Selects the value that is forced into the channel output when the initialization occurs.
Selects the value that is forced into the channel output when the initialization occurs.
Selects the value that is forced into the channel output when the initialization occurs.
Selects the value that is forced into the channel output when the initialization occurs.
The initialization value is 0.
The initialization value is 1.
Channel 1 Output Initialization Value
Selects the value that is forced into the channel output when the initialization occurs.
0
1
0
CH0OI
The initialization value is 0.
The initialization value is 1.
Channel 2 Output Initialization Value
0
1
1
CH1OI
The initialization value is 0.
The initialization value is 1.
Channel 3 Output Initialization Value
0
1
2
CH2OI
The initialization value is 0.
The initialization value is 1.
Channel 4 Output Initialization Value
0
1
3
CH3OI
The initialization value is 0.
The initialization value is 1.
Channel 5 Output Initialization Value
0
1
4
CH4OI
The initialization value is 0.
The initialization value is 1.
The initialization value is 0.
The initialization value is 1.
Channel 0 Output Initialization Value
Selects the value that is forced into the channel output when the initialization occurs.
0
1
The initialization value is 0.
The initialization value is 1.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
288
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
12.3.17 Output Mask (FTMx_OUTMASK)
This register provides a mask for each FTM channel. The mask of a channel determines if
its output responds, that is, it is masked or not, when a match occurs. This feature is used
for BLDC control applications where the PWM signal is presented to an electric motor at
specific times to provide electronic commutation.
Any write to the OUTMASK register stores the value into a write buffer. The register is
updated with the value of its write buffer according to PWM synchronization.
Address: Base address + 1Dh offset
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
CH7OM
CH6OM
CH5OM
CH4OM
CH3OM
CH2OM
CH1OM
CH0OM
0
0
0
0
0
0
0
0
FTMx_OUTMASK field descriptions
Field
7
CH7OM
Description
Channel 7 Output Mask
Defines if the channel output is masked (forced to its inactive state) or unmasked (it continues to operate
normally).
0
1
6
CH6OM
Channel 6 Output Mask
Defines if the channel output is masked (forced to its inactive state) or unmasked (it continues to operate
normally).
0
1
5
CH5OM
Defines if the channel output is masked (forced to its inactive state) or unmasked (it continues to operate
normally).
Channel output is not masked. It continues to operate normally.
Channel output is masked. It is forced to its inactive state.
Channel 4 Output Mask
Defines if the channel output is masked (forced to its inactive state) or unmasked (it continues to operate
normally).
0
1
3
CH3OM
Channel output is not masked. It continues to operate normally.
Channel output is masked. It is forced to its inactive state.
Channel 5 Output Mask
0
1
4
CH4OM
Channel output is not masked. It continues to operate normally.
Channel output is masked. It is forced to its inactive state.
Channel output is not masked. It continues to operate normally.
Channel output is masked. It is forced to its inactive state.
Channel 3 Output Mask
Defines if the channel output is masked (forced to its inactive state) or unmasked (it continues to operate
normally).
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
289
Memory map and register definition
FTMx_OUTMASK field descriptions (continued)
Field
Description
0
1
2
CH2OM
Channel 2 Output Mask
Defines if the channel output is masked (forced to its inactive state) or unmasked (it continues to operate
normally).
0
1
1
CH1OM
Channel output is not masked. It continues to operate normally.
Channel output is masked. It is forced to its inactive state.
Channel 1 Output Mask
Defines if the channel output is masked (forced to its inactive state) or unmasked (it continues to operate
normally).
0
1
0
CH0OM
Channel output is not masked. It continues to operate normally.
Channel output is masked. It is forced to its inactive state.
Channel output is not masked. It continues to operate normally.
Channel output is masked. It is forced to its inactive state.
Channel 0 Output Mask
Defines if the channel output is masked (forced to its inactive state) or unmasked (it continues to operate
normally).
0
1
Channel output is not masked. It continues to operate normally.
Channel output is masked. It is forced to its inactive state.
12.3.18 Function for Linked Channels (FTMx_COMBINEn)
This register contains the control bits used to configure the fault control, synchronization,
deadtime, dual edge capture mode, complementary, and combine features of channels (n)
and (n+1).
• COMBINE0 supports channels 0 and 1.
• COMBINE1 supports channels 2 and 3.
• COMBINE2 supports channels 4 and 5.
NOTE
The channel (n) is the even channel and the channel (n+1) is the
odd channel of a pair of channels.
Address: Base address + 1Eh offset + (1d × i), where i=0d to 2d
Bit
7
6
5
4
3
2
1
0
Read
Write
Reset
0
FAULTEN
SYNCEN
DTEN
DECAP
DECAPEN
COMP
COMBINE
0
0
0
0
0
0
0
0
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
290
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
FTMx_COMBINEn field descriptions
Field
Description
7
Reserved
This field is reserved.
This read-only field is reserved and always has the value 0.
6
FAULTEN
Fault Control Enable
Enables the fault control in channels (n) and (n+1).
This field is write protected. It can be written only when MODE[WPDIS] = 1.
0
1
5
SYNCEN
Synchronization Enable
Enables PWM synchronization of registers C(n)V and C(n+1)V.
0
1
4
DTEN
The fault control in this pair of channels is disabled.
The fault control in this pair of channels is enabled.
The PWM synchronization in this pair of channels is disabled.
The PWM synchronization in this pair of channels is enabled.
Deadtime Enable
Enables the deadtime insertion in the channels (n) and (n+1).
This field is write protected. It can be written only when MODE[WPDIS] = 1.
0
1
3
DECAP
The deadtime insertion in this pair of channels is disabled.
The deadtime insertion in this pair of channels is enabled.
Dual Edge Capture Mode Captures
Enables the capture of the FTM counter value according to the channel (n) input event and the
configuration of the dual edge capture bits.
This field applies only when MODE[FTMEN] = 1 and DECAPEN = 1.
DECAP bit is cleared automatically by hardware if dual edge capture one-shot mode is selected and when
the capture of channel (n+1) event is made.
0
1
2
DECAPEN
The dual edge captures are inactive.
The dual edge captures are active.
Dual Edge Capture Mode Enable
Enables the dual edge capture mode in the channels (n) and (n+1). This bit reconfigures the function of
MSnA, ELSnB:ELSnA, and ELS(n+1)B:ELS(n+1)A bits in dual edge capture mode according to the table
Mode, Edge, and Level Selection in the description of the CnSC register.
This field applies only when MODE[FTMEN] = 1.
DECAPEN is write protected, this bit can be written only if MODE[WPDIS] = 1.
0
1
1
COMP
The dual edge capture mode in this pair of channels is disabled.
The dual edge capture mode in this pair of channels is enabled.
Complement of Channel (n)
Enables complementary mode for the combined channels. In complementary mode the channel (n+1)
output is the inverse of the channel (n) output.
This field is write protected. It can be written only when MODE[WPDIS] = 1.
0
1
The channel (n+1) output is the same as the channel (n) output.
The channel (n+1) output is the complement of the channel (n) output.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
291
Memory map and register definition
FTMx_COMBINEn field descriptions (continued)
Field
0
COMBINE
Description
Combine Channels
Enables the combine feature for channels (n) and (n+1).
This field is write protected. It can be written only when MODE[WPDIS] = 1.
0
1
Channels (n) and (n+1) are independent.
Channels (n) and (n+1) are combined.
12.3.19 Deadtime Insertion Control (FTMx_DEADTIME)
This register selects the deadtime prescaler factor and deadtime value. All FTM channels
use this clock prescaler and this deadtime value for the deadtime insertion.
Address: Base address + 22h offset
Bit
Read
Write
Reset
7
6
5
4
3
DTPS
0
2
1
0
0
0
0
DTVAL
0
0
0
0
FTMx_DEADTIME field descriptions
Field
7–6
DTPS
Description
Deadtime Prescaler Value
Selects the division factor of the system clock. This prescaled clock is used by the deadtime counter.
DTPS is write protected. It can be written only when MODE[WPDIS] = 1.
0x
10
11
DTVAL
Divide the system clock by 1.
Divide the system clock by 4.
Divide the system clock by 16.
Deadtime Value
Selects the deadtime insertion value for the deadtime counter. The deadtime counter is clocked by a
scaled version of the system clock. See the description of DTPS.
Deadtime insert value = (DTPS × DTVAL).
DTVAL selects the number of deadtime counts inserted as follows:
• When DTVAL is 0, no counts are inserted.
• When DTVAL is 1, 1 count is inserted.
• When DTVAL is 2, 2 counts are inserted.
This pattern continues up to a possible 63 counts.
DTVAL is write protected. It can be written only when MODE[WPDIS] = 1.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
292
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
12.3.20 External Trigger (FTMx_EXTTRIG)
This register indicates when a channel trigger was generated, enables the generation of a
trigger when the FTM counter is equal to its initial value, and selects which channels are
used in the generation of the channel triggers. Several FTM channels can be selected to
generate multiple triggers in one PWM period.
Channels 6 and 7 are not used to generate channel triggers.
Address: Base address + 23h offset
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
TRIGF
INITTRIGEN
CH1TRIG
CH0TRIG
CH5TRIG
CH4TRIG
CH3TRIG
CH2TRIG
0
0
0
0
0
0
0
0
FTMx_EXTTRIG field descriptions
Field
7
TRIGF
Description
Channel Trigger Flag
Set by hardware when a channel trigger is generated. Clear TRIGF by reading EXTTRIG while TRIGF is
set and then writing a 0 to TRIGF. Writing a 1 to TRIGF has no effect.
If another channel trigger is generated before the clearing sequence is completed, the sequence is reset
so TRIGF remains set after the clear sequence is completed for the earlier TRIGF.
0
1
6
INITTRIGEN
Initialization Trigger Enable
Enables the generation of the trigger when the FTM counter is equal to its initial value.
0
1
5
CH1TRIG
Enables the generation of the channel trigger when the FTM counter is equal to the CV register.
The generation of the channel trigger is disabled.
The generation of the channel trigger is enabled.
Channel 0 Trigger Enable
Enables the generation of the channel trigger when the FTM counter is equal to the CV register.
0
1
3
CH5TRIG
The generation of initialization trigger is disabled.
The generation of initialization trigger is enabled.
Channel 1 Trigger Enable
0
1
4
CH0TRIG
No channel trigger was generated.
A channel trigger was generated.
The generation of the channel trigger is disabled.
The generation of the channel trigger is enabled.
Channel 5 Trigger Enable
Enables the generation of the channel trigger when the FTM counter is equal to the CV register.
0
1
The generation of the channel trigger is disabled.
The generation of the channel trigger is enabled.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
293
Memory map and register definition
FTMx_EXTTRIG field descriptions (continued)
Field
2
CH4TRIG
Description
Channel 4 Trigger Enable
Enables the generation of the channel trigger when the FTM counter is equal to the CV register.
0
1
1
CH3TRIG
Channel 3 Trigger Enable
Enables the generation of the channel trigger when the FTM counter is equal to the CV register.
0
1
0
CH2TRIG
The generation of the channel trigger is disabled.
The generation of the channel trigger is enabled.
The generation of the channel trigger is disabled.
The generation of the channel trigger is enabled.
Channel 2 Trigger Enable
Enables the generation of the channel trigger when the FTM counter is equal to the CV register.
0
1
The generation of the channel trigger is disabled.
The generation of the channel trigger is enabled.
12.3.21 Channels Polarity (FTMx_POL)
This register defines the output polarity of the FTM channels.
NOTE
The safe value that is driven in a channel output when the fault
control is enabled and a fault condition is detected is the
inactive state of the channel. That is, the safe value of a channel
is the value of its POL bit.
Address: Base address + 24h offset
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
POL7
POL6
POL5
POL4
POL3
POL2
POL1
POL0
0
0
0
0
0
0
0
0
FTMx_POL field descriptions
Field
7
POL7
Description
Channel 7 Polarity
Defines the polarity of the channel output.
This field is write protected. It can be written only when MODE[WPDIS] = 1.
0
1
6
POL6
The channel polarity is active high.
The channel polarity is active low.
Channel 6 Polarity
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
294
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
FTMx_POL field descriptions (continued)
Field
Description
Defines the polarity of the channel output.
This field is write protected. It can be written only when MODE[WPDIS] = 1.
0
1
5
POL5
The channel polarity is active high.
The channel polarity is active low.
Channel 5 Polarity
Defines the polarity of the channel output.
This field is write protected. It can be written only when MODE[WPDIS] = 1.
0
1
4
POL4
The channel polarity is active high.
The channel polarity is active low.
Channel 4 Polarity
Defines the polarity of the channel output.
This field is write protected. It can be written only when MODE[WPDIS] = 1.
0
1
3
POL3
The channel polarity is active high.
The channel polarity is active low.
Channel 3 Polarity
Defines the polarity of the channel output.
This field is write protected. It can be written only when MODE[WPDIS] = 1.
0
1
2
POL2
The channel polarity is active high.
The channel polarity is active low.
Channel 2 Polarity
Defines the polarity of the channel output.
This field is write protected. It can be written only when MODE[WPDIS] = 1.
0
1
1
POL1
The channel polarity is active high.
The channel polarity is active low.
Channel 1 Polarity
Defines the polarity of the channel output.
This field is write protected. It can be written only when MODE[WPDIS] = 1.
0
1
0
POL0
The channel polarity is active high.
The channel polarity is active low.
Channel 0 Polarity
Defines the polarity of the channel output.
This field is write protected. It can be written only when MODE[WPDIS] = 1.
0
1
The channel polarity is active high.
The channel polarity is active low.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
295
Memory map and register definition
12.3.22 Fault Mode Status (FTMx_FMS)
This register contains the fault detection flags, write protection enable bit, and the logic
OR of the enable fault inputs.
Address: Base address + 25h offset
Bit
7
6
Read
FAULTF
Write
0
Reset
0
WPEN
0
5
4
3
2
1
0
FAULTIN
0
FAULTF3
FAULTF2
FAULTF1
FAULTF0
0
0
0
0
0
0
0
0
0
0
FTMx_FMS field descriptions
Field
7
FAULTF
Description
Fault Detection Flag
Represents the logic OR of the individual FAULTFn bits. Clear FAULTF by reading the FMS register while
FAULTF is set and then writing a 0 to FAULTF while there is no existing fault condition at the enabled fault
inputs. Writing a 1 to FAULTF has no effect.
If another fault condition is detected in an enabled fault input before the clearing sequence is completed,
the sequence is reset so FAULTF remains set after the clearing sequence is completed for the earlier fault
condition. FAULTF is also cleared when FAULTFn bits are cleared individually.
0
1
6
WPEN
Write Protection Enable
The WPEN bit is the negation of the WPDIS bit. WPEN is set when 1 is written to it. WPEN is cleared
when WPEN bit is read as a 1 and then 1 is written to WPDIS. Writing 0 to WPEN has no effect.
0
1
5
FAULTIN
No fault condition was detected.
A fault condition was detected.
Write protection is disabled. Write protected bits can be written.
Write protection is enabled. Write protected bits cannot be written.
Fault Inputs
Represents the logic OR of the enabled fault input after its filter, if its filter is enabled, when fault control is
enabled.
0
1
The value of the fault input is 0.
The value of the fault input is 1.
4
Reserved
This field is reserved.
This read-only field is reserved and always has the value 0.
3
FAULTF3
Fault Detection Flag 3
Set by hardware when fault control is enabled, the corresponding fault input is enabled and a fault
condition is detected in the fault input.
Clear FAULTF by reading the FMS register while FAULTFn is set and then writing a 0 to FAULTFn
FAULTF while there is no existing fault condition at the fault input n. Writing a 1 to FAULTFn has no effect.
FAULTFn bit is also cleared when FAULTF bit is cleared.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
296
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
FTMx_FMS field descriptions (continued)
Field
Description
If another fault condition is detected at fault input n before the clearing sequence is completed, the
sequence is reset so FAULTFn remains set after the clearing sequence is completed for the earlier fault
condition.
0
1
2
FAULTF2
No fault condition was detected in the fault input.
A fault condition was detected in the fault input.
Fault Detection Flag 2
Set by hardware when fault control is enabled, the corresponding fault input is enabled and a fault
condition is detected in the fault input.
Clear FAULTF by reading the FMS register while FAULTFn is set and then writing a 0 to FAULTFn
FAULTF while there is no existing fault condition at the fault input n. Writing a 1 to FAULTFn has no effect.
FAULTFn bit is also cleared when FAULTF bit is cleared.
If another fault condition is detected at fault input n before the clearing sequence is completed, the
sequence is reset so FAULTFn remains set after the clearing sequence is completed for the earlier fault
condition.
0
1
1
FAULTF1
No fault condition was detected in the fault input.
A fault condition was detected in the fault input.
Fault Detection Flag 1
Set by hardware when fault control is enabled, the corresponding fault input is enabled and a fault
condition is detected in the fault input.
Clear FAULTF by reading the FMS register while FAULTFn is set and then writing a 0 to FAULTFn
FAULTF while there is no existing fault condition at the fault input n. Writing a 1 to FAULTFn has no effect.
FAULTFn bit is also cleared when FAULTF bit is cleared.
If another fault condition is detected at fault input n before the clearing sequence is completed, the
sequence is reset so FAULTFn remains set after the clearing sequence is completed for the earlier fault
condition.
0
1
0
FAULTF0
No fault condition was detected in the fault input.
A fault condition was detected in the fault input.
Fault Detection Flag 0
Set by hardware when fault control is enabled, the corresponding fault input is enabled and a fault
condition is detected in the fault input.
Clear FAULTF by reading the FMS register while FAULTFn is set and then writing a 0 to FAULTFn
FAULTF while there is no existing fault condition at the fault input n. Writing a 1 to FAULTFn has no effect.
FAULTFn bit is also cleared when FAULTF bit is cleared.
If another fault condition is detected at fault input n before the clearing sequence is completed, the
sequence is reset so FAULTFn remains set after the clearing sequence is completed for the earlier fault
condition.
0
1
No fault condition was detected in the fault input.
A fault condition was detected in the fault input.
12.3.23 Input Capture Filter Control (FTMx_FILTERn)
This register selects the filter value for the inputs of channels.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
297
Memory map and register definition
• FILTER0 supports Channels 0 and 1.
• FILTER1 supports Channels 2 and 3.
• Channels 4 and 5 do not have an input filter.
NOTE
Writing to this register has immediate effect and must be done
only when the input capture modes of the affected channels are
disabled. Failure to do this could result in a missing valid
signal.
Address: Base address + 26h offset + (1d × i), where i=0d to 1d
Bit
Read
Write
Reset
7
6
5
4
3
CHoddFVAL
0
0
2
1
0
CHevenFVAL
0
0
0
0
0
0
1
0
0
0
FTMx_FILTERn field descriptions
Field
7–4
CHoddFVAL
Description
Input Filter for Odd Channel
Selects the filter value for the odd-numbered channel input.
The filter is disabled when the value is zero.
CHevenFVAL
Input Filter for Even Channel
Selects the filter value for the even-numbered channel input.
The filter is disabled when the value is zero.
12.3.24 Fault Input Filter Control (FTMx_FLTFILTER)
This register selects the fault inputs and enables the fault input filter.
Address: Base address + 28h offset
Bit
Read
Write
Reset
7
6
5
4
3
2
0
0
0
FFVAL
0
0
0
0
FTMx_FLTFILTER field descriptions
Field
7–4
Reserved
FFVAL
Description
This field is reserved.
This read-only field is reserved and always has the value 0.
Fault Input Filter
Selects the filter value for the fault inputs.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
298
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
FTMx_FLTFILTER field descriptions (continued)
Field
Description
The fault filter is disabled when the value is zero.
NOTE: Writing to this field has immediate effect and must be done only when the fault control or the fault
input is disabled. Failure to do so could result in a missing fault detection.
12.3.25 Fault Input Control (FTMx_FLTCTRL)
This register selects the fault inputs and enables the fault input filter.
Address: Base address + 29h offset
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
FFLTR3EN
FFLTR2EN
FFLTR1EN
FFLTR0EN
FAULT3EN
FAULT2EN
FAULT1EN
FAULT0EN
0
0
0
0
0
0
0
0
FTMx_FLTCTRL field descriptions
Field
7
FFLTR3EN
Description
Fault Input 3 Filter Enable
Enables the filter for the fault input.
This field is write protected. It can be written only when MODE[WPDIS] = 1.
0
1
6
FFLTR2EN
Fault input filter is disabled.
Fault input filter is enabled.
Fault Input 2 Filter Enable
Enables the filter for the fault input.
This field is write protected. It can be written only when MODE[WPDIS] = 1.
0
1
5
FFLTR1EN
Fault input filter is disabled.
Fault input filter is enabled.
Fault Input 1 Filter Enable
Enables the filter for the fault input.
This field is write protected. It can be written only when MODE[WPDIS] = 1.
0
1
4
FFLTR0EN
Fault input filter is disabled.
Fault input filter is enabled.
Fault Input 0 Filter Enable
Enables the filter for the fault input.
This field is write protected. It can be written only when MODE[WPDIS] = 1.
0
1
Fault input filter is disabled.
Fault input filter is enabled.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
299
Functional Description
FTMx_FLTCTRL field descriptions (continued)
Field
3
FAULT3EN
Description
Fault Input 3 Enable
Enables the fault input.
This field is write protected. It can be written only when MODE[WPDIS] = 1.
0
1
2
FAULT2EN
Fault input is disabled.
Fault input is enabled.
Fault Input 2 Enable
Enables the fault input.
This field is write protected. It can be written only when MODE[WPDIS] = 1.
0
1
1
FAULT1EN
Fault input is disabled.
Fault input is enabled.
Fault Input 1 Enable
Enables the fault input.
This field is write protected. It can be written only when MODE[WPDIS] = 1.
0
1
0
FAULT0EN
Fault input is disabled.
Fault input is enabled.
Fault Input 0 Enable
Enables the fault input.
This field is write protected. It can be written only when MODE[WPDIS] = 1.
0
1
Fault input is disabled.
Fault input is enabled.
12.4 Functional Description
The following sections describe the FTM features.
The notation used in this document to represent the counters and the generation of the
signals is shown in the following figure.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
300
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
Channel (n) - high-true EPWM
PS[2:0] = 001
CNTINH:L = 0x0000
MODH:L = 0x0004
CnVH:L = 0x0002
prescaler counter
FTM counter
1
0
3
1
0
4
1
0
1
0
0
1
1
0
2
1
0
3
1
0
4
1
0
0
1
0
1 0
0
1
2
1
3
1
0
0
4
1
0
1
0
1
1
0
2
channel (n) output
counter
overflow
channel (n)
match
counter
overflow
channel (n)
match
counter
overflow
channel (n)
match
Figure 12-140. Notation used
12.4.1 Clock Source
FTM module has only one clock domain that is the system clock.
12.4.1.1 Counter Clock Source
The CLKS[1:0] bits in the SC register select one of three possible clock sources for the
FTM counter or disable the FTM counter. After any MCU reset, CLKS[1:0] = 0:0 so no
clock source is selected.
The CLKS[1:0] bits may be read or written at any time. Disabling the FTM counter by
writing 0:0 to the CLKS[1:0] bits does not affect the FTM counter value or other
registers.
The fixed frequency clock is an alternative clock source for the FTM counter that allows
the selection of a clock other than the system clock or an external clock. This clock input
is defined by chip integration. Refer to chip specific documentation for further
information. Due to FTM hardware implementation limitations, the frequency of the
fixed frequency clock must not exceed the system clock frequency.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
301
Functional Description
The external clock passes through a synchronizer clocked by the system clock to ensure
that counter transitions are properly aligned to system clock transitions. Therefore, to
meet the Nyquist criteria and account for jitter, the frequency of the external clock source
must not exceed 1/4 of the system clock frequency.
12.4.2 Prescaler
The selected counter clock source passes through a prescaler that is a 7-bit counter. The
value of the prescaler is selected by the PS[2:0] bits. The following figure shows an
example of the prescaler counter and FTM counter.
EPWM
PS[2:0] = 001
CNTINH:L = 0x0000
MODH:L = 0x0003
selected input clock
prescaler counter
1
FTM counter
0
0
1
1
0
1
2
0
1
0
3
1
0
0
1
1
0
1
2
0
1
3
0
1
0
0
1
Figure 12-141. Example of the prescaler counter
12.4.3 Counter
The FTM has a 16-bit counter that is used by the channels either for input or output
modes. The FTM counter clock is the selected clock divided by the prescaler (see
Prescaler).
The FTM counter has these modes of operation:
• up counting (see Up counting)
• up-down counting (see Up-down counting)
12.4.3.1 Up counting
Up counting is selected when (CPWMS = 0).
CNTINH:L defines the starting value of the count and MODH:L defines the final value
of the count; see the following figure. The value of CNTINH:L is loaded into the FTM
counter, and the counter increments until the value of MODH:L is reached, at which
point the counter is reloaded with CNTINH:L.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
302
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
The FTM period when using up counting is (MODH:L – CNTINH:L + 0x0001) × period
of the FTM counter clock.
The TOF bit is set when the FTM counter changes from MODH:L to CNTINH:L.
FTM counting is up
CNTINH:L = 0xFFFC (in two's complement is equal to -4)
MODH:L = 0x0004
FTM counter (in decimal values)
4
-4 -3 -2 -1 0
1
2
3
4
-4 -3 -2 -1
0
1
2
3
4
-4 -3
TOF bit
set TOF bit
set TOF bit
set TOF bit
period of FTM counter clock
period of counting = (MODH:L - CNTINH:L + 0x0001) x period of FTM counter clock
Figure 12-142. Example of FTM up and signed counting
If (CNTINH:L = 0x0000), the FTM counting is equivalent to TPM up counting; that is,
up and unsigned counting. See the following figure. If (CNTINH[7] = 1), then the initial
value of the FTM counter is a negative number in two's complement format, so the FTM
counting is up and signed. Conversely, if (CNTINH[7] = 0 and CNTINH:L ≠ 0x0000),
then the initial value of the FTM counter is a positive number, therefore the FTM
counting is up and unsigned.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
303
Functional Description
FTM counting is up
CNTINH:L = 0x0000
MODH:L = 0x0004
FTM counter
3
4
0
1
2
3
4
0
1
2
3
4
0
1
2
TOF bit
set TOF bit
set TOF bit
set TOF bit
period of FTM counter clock
period of counting = (MODH:L - CNTINH:L + 0x0001) x period of FTM counter clock
= (MODH:L + 0x0001) x period of FTM counter clock
Figure 12-143. Example of FTM up counting with CNTIN = 0x0000
Note
• FTM operation is valid only when the value of the
CNTINH:L registers is less than the value of the MODH:L
registers, either in the unsigned counting or signed
counting.. Software must ensure that the values in the
CNTINH:L and MODH:L registers meet this requirement.
Any values of CNTINH:L and MODH:L that do not satisfy
this criteria can result in unpredictable behavior.
• MODH:L = CNTINH:L is a redundant condition. In this
case, the FTM counter is always equal to MODH:L and the
TOF bit is set in each rising edge of the FTM counter
clock.
• When MODH:L = 0x0000, CNTINH:L = 0x0000 (for
example after reset), and FTMEN = 1, the FTM counter
remains stopped at 0x0000 until a non-zero value is written
into the MODH:L or CNTINH:L registers.
• Setting CNTINH:L to be greater than the value of
MODH:L is not recommended as this unusual setting may
make the FTM operation difficult to comprehend.
However, there is no restriction on this configuration, and
an example is shown in the following figure.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
304
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
FTM counting is up
MODH:L = 0x0005
CNTINH:L = 0x0015
load of CNTINH:L
FTM counter
load of CNTINH:L
0x0005 0x0015 0x0016 ... 0xFFFE 0xFFFF 0x0000 0x0001 0x0002 0x0003 0x0004 0x0005 0x0015 0x0016
...
TOF bit
set TOF bit
set TOF bit
Figure 12-144. Example of up counting when the value of CNTIN registers is greater
than the value of MOD registers
12.4.3.2 Up-down counting
Up-down counting is selected when (CPWMS = 1).
CNTINH:L defines the starting value of the count and MODH:L defines the final value
of the count. The value of CNTINH:L is loaded into the FTM counter, and the counter
increments until the value of MODH:L is reached, at which point the counter is
decremented until it returns to the value of CNTINH:L and the up-down counting
restarts.
The FTM period when using up-down counting is 2 × (MODH:L – CNTINH:L) × period
of the FTM counter clock.
The TOF bit is set when the FTM counter changes from MODH:L to (MODH:L – 1).
If (CNTINH:L = 0x0000), the FTM counting is equivalent to TPM up-down counting;
that is, up-down and unsigned counting. See the following figure.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
305
Functional Description
FTM counting is up-down
CNTINH:L = 0x0000
MODH:L = 0x0004
FTM counter
0
1
2
3
4
3
2
1
0
1
2
3
4
3
2
1
0
1
2
3
4
TOF bit
set TOF bit
period of FTM counter clock
set TOF bit
period of counting = 2 x (MODH:L - CNTINH:L) x period of FTM counter clock
= 2 x MODH:L x period of FTM counter clock
Figure 12-145. Example of up-down counting when CNTIN = 0x0000
Note
• The up-down counting is available only when (CNTINH:L
= 0x0000).
• The configuration with (CNTINH:L ≠ 0x0000) when
(CPWMS = 1) is not recommended and its results are not
guaranteed.
12.4.3.3 Free running counter
If (FTMEN = 0) and (MODH:L = 0x0000 or MODH:L = 0xFFFF), the FTM counter is a
free running counter. In this case, the FTM counter runs free from 0x0000 through
0xFFFF and the TOF bit is set when the FTM counter changes from 0xFFFF to 0x0000
See the following figure.
FTMEN = 0
MODH:L = 0x0000
FTM counter
... 0x0003 0x0004 ... 0xFFFE 0xFFFF 0x0000 0x0001 0x0002 0x0003 0x0004 0x0005 0x0006 ...
TOF bit
set TOF bit
Figure 12-146. Example when the FTM counter is a free running
The FTM counter is also a free running counter when all of the following apply:
• (FTMEN = 1)
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
306
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
• (CPWMS = 0)
• (CNTINH:L = 0x0000)
• (MODH:L = 0xFFFF)
In this case, the FTM counter runs free from 0x0000 through 0xFFFF and the TOF bit is
set when the FTM counter changes from 0xFFFF to 0x0000.
12.4.3.4 Counter reset
Any write to CNTH or CNTL register resets the FTM counter to the value of CNTINH:L
and the channels output to its initial value, except for channels in output compare mode.
The FTM counter synchronization can also be used to force the value of CNTINH:L into
the FTM counter and the channels output to its initial value, except for channels in output
compare mode.
12.4.4 Input capture mode
The input capture mode is selected when (DECAPEN = 0), (COMBINE = 0), (CPWMS
= 0), (MSnB:MSnA = 0:0), and (ELSnB:ELSnA ≠ 0:0).
When a selected edge occurs on the channel input, the current value of the FTM counter
is captured into the CnVH:L registers. At the same time, the CHnF bit is set and the
channel interrupt is generated if enabled by CHnIE = 1. See the following figure.
When a channel is configured for input capture, the CHn pin is an edge-sensitive input.
ELSnB:ELSnA control bits determine which edge, falling or rising, triggers input-capture
event. Note that the maximum frequency for the channel input signal to be detected
correctly is system clock divided by four, which is required to meet Nyquist criteria for
signal sampling.
When either half of the 16-bit capture register (CnVH:L) is read, the other half is latched
into a buffer to support coherent 16-bit access in big-endian or little-endian order. This
read coherency mechanism can be manually reset by writing to CnSC register.
Writes to the CnVH:L registers are ignored in input capture mode.
While in BDM, the input capture function works as configured. When a selected edge
event occurs, the FTM counter value, which is frozen because of BDM, is captured into
the CnVH:L registers and the CHnF bit is set.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
307
Functional Description
was rising
edge selected?
is filter
enabled?
0
synchronizer
0
channel (n) input
system clock
D
CLK
Q
D
rising edge 1
CHnIE
Filter*
1
channel (n) interrupt
CHnF
edge
detector
Q
CLK
0
CnVH:L[15:0]
falling edge
0
1
0
was falling
edge selected?
* NOTE: Filtering function is only available in the inputs of channel 0, 1, 2, and 3
FTM counter
Figure 12-147. Input capture mode
If the channel input does not have a filter enabled, then the input signal is always delayed
three rising edges of the system clock; that is, two rising edges to the synchronizer plus
one more rising edge to the edge detector. In other words, the CHnF bit is set on the third
rising edge of the system clock after a valid edge occurs on the channel input.
Note
• Input capture mode is available only with (CNTINH:L =
0x0000).
• Input capture mode with (CNTINH:L ≠ 0x0000) is not
recommended and its results are not guaranteed.
12.4.4.1 Filter for input capture mode
The filter function is available only on channels 0, 1, 2, and 3.
Firstly, the input signal is synchronized by the system clock. Following synchronization,
the input signal enters the filter block; see the following figure. When there is a state
change in the input signal, the 5-bit counter is reset and starts counting up. As long as the
new state is stable on the input, the counter continues to increment. If the 5-bit counter
overflows (the counter exceeds the value of the CHnFVAL[3:0] bits), the state change of
the input signal is validated. It is then transmitted as a pulse edge to the edge detector.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
308
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
CHnFVAL[3:0]
Logic to control
channel (n) input after
the synchronizer
the filter counter
5-bit up counter
divided by 4
Logic to define
the filter output
S
filter output
Q
C
CLK
system clock
Figure 12-148. Channel input filter
If the opposite edge appears on the input signal before validation, the counter is reset. At
the next input transition, the counter starts counting again. Any pulse shorter than the
minimum valid width (CHnFVAL[3:0] bits × 4 system clocks) is regarded as a glitch and
is not passed on to the edge detector. A timing diagram of the input filter is shown in the
following figure.
The filter function is disabled when CHnFVAL[3:0] bits are zero. In this case, the input
signal is delayed three rising edges of the system clock. If (CHnFVAL[3:0] ≠ 0000), then
the input signal is delayed by the minimum pulse width (CHnFVAL[3:0] × 4 system
clocks) plus a further four rising edges of the system clock (two rising edges to the
synchronizer, one rising edge to the filter output plus one more to the edge detector). In
other words, CHnF is set (4 + 4 × CHnFVAL[3:0]) system clock periods after a valid
edge occurs on the channel input.
The clock for the 5-bit counter in the channel input filter is the system clock divided by 4.
system clock divided by 4
channel (n) input
after the synchronizer
5-bit counter
CHnFVAL[3:0] = 0010
(binary value)
Time
filter output
Figure 12-149. Channel input filter example
12.4.5 Output compare mode
The output compare mode is selected when (DECAPEN = 0), (COMBINE = 0),
(CPWMS = 0) and (MSnB:MSnA = 0:1).
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
309
Functional Description
In output compare mode, the FTM can generate timed pulses with programmable
position, polarity, duration, and frequency. When the counter matches the value in the
CnVH:CnVL registers of an output compare channel, the channel (n) output can be set,
cleared, or toggled.
When a channel is initially configured to toggle mode, the previous value of the channel
output is held until the first output compare event occurs.
The CHnF bit is set and the channel (n) interrupt is generated (if CHnIE = 1) at the
channel (n) match (FTM counter = CnVH:CnVL).
MODH:L = 0x0005
CnVH:L = 0x0003
channel (n)
match
counter
overflow
CNTH:L
...
2
1
0
channel (n) output
previous value
CHnF bit
previous value
4
3
channel (n)
match
counter
overflow
5
1
0
2
counter
overflow
4
3
5
1
0
...
TOF bit
Figure 12-150. Example of the output compare mode when the match toggles the
channel output
MODH:L = 0x0005
CnVH:L = 0x0003
CNTH:L
channel (n) output
CHnF bit
...
0
counter
overflow
channel (n)
match
counter
overflow
2
1
3
4
5
0
counter
overflow
channel (n)
match
1
2
3
4
5
0
1
...
previous value
previous value
TOF bit
Figure 12-151. Example of the output compare mode when the match clears the channel
output
MODH:L = 0x0005
CnVH:L = 0x0003
channel (n)
match
counter
overflow
CNTH:L
channel (n) output
CHnF bit
...
0
1
2
3
counter
overflow
4
5
0
channel (n)
match
1
2
3
counter
overflow
4
5
0
1
...
previous value
previous value
TOF bit
Figure 12-152. Example of the output compare mode when the match sets the channel
output
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
310
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
It is possible to use the output compare mode with (ELSnB:ELSnA = 0:0). In this case,
when the counter reaches the value in the CnVH:CnVL registers, the CHnF bit is set and
the channel (n) interrupt is generated, if CHnIE = 1. However, the channel (n) output is
not modified and controlled by FTM.
Note
• Output compare mode is available only with
(CNTINH:CNTINL = 0x0000).
• Output compare mode with (CNTINH:CNTINL ≠ 0x0000)
is not recommended and its results are not guaranteed.
12.4.6 Edge-aligned PWM (EPWM) mode
The edge-aligned mode is selected when all of the following apply:
• (DECAPEN = 0)
• (COMBINE = 0)
• (CPWMS = 0)
• (MSnB = 1)
The EPWM period is determined by (MODH:L – CNTINH:L + 0x0001) and the pulse
width (duty cycle) is determined by (CnVH:L – CNTINH:L).
The CHnF bit is set and the channel (n) interrupt is generated (if CHnIE = 1) at the
channel (n) match (FTM counter = CnVH:L), that is, at the end of the pulse width.
This type of PWM signal is called edge-aligned because the leading edges of all PWM
signals are aligned with the beginning of the period, which is the same for all channels
within an FTM.
counter overflow
counter overflow
counter overflow
period
pulse
width
channel (n) output
channel (n) match
channel (n) match
channel (n) match
Figure 12-153. EPWM period and pulse width with ELSnB:ELSnA = 1:0
If (ELSnB:ELSnA = 0:0) when the counter reaches the value in the CnVH:L registers,
the CHnF bit is set and the channel (n) interrupt is generated (if CHnIE = 1), however,
the channel (n) output is not controlled by FTM.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
311
Functional Description
If (ELSnB:ELSnA = 1:0), then the channel (n) output is forced high at the counter
overflow, when the value of CNTINH:L is loaded into the FTM counter. Additionally, it
is forced low at the channel (n) match, when the FTM counter = CnVH:L. See the
following figure.
MODH:L = 0x0008
CnVH:L = 0x0005
counter
overflow
CNTH:L
...
0
channel (n)
match
1
2
3
4
5
counter
overflow
6
7
8
0
1
2
...
channel (n) output
previous value
CHnF bit
TOF bit
Figure 12-154. EPWM signal with ELSnB:ELSnA = 1:0
If (ELSnB:ELSnA = X:1), then the channel (n) output is forced low at the counter
overflow, when the value of CNTINH:L is loaded into the FTM counter. Additionally, it
is forced high at the channel (n) match, when the FTM counter = CnVH:L. See the
following figure.
MODH:L = 0x0008
CnVH:L = 0x0005
CNTH:L
counter
overflow
...
0
channel (n)
match
1
2
3
4
5
counter
overflow
6
7
8
0
1
2
...
channel (n) output
CHnF bit
previous value
TOF bit
Figure 12-155. EPWM signal with ELSnB:ELSnA = X:1
If (CnVH:L = 0x0000), then the channel (n) output is a 0% duty cycle EPWM signal and
CHnF bit is not set, even when there is the channel (n) match. If (CnVH:L > MODH:L),
then the channel (n) output is a 100% duty cycle EPWM signal and CHnF bit is not set,
even when there is the channel (n) match. Therefore, MODH:MODL must be less than
0xFFFF in order to get a 100% duty cycle EPWM signal.
Note
• EPWM mode is available only with (CNTINH:L =
0x0000).
• EPWM mode with (CNTINH:L ≠ 0x0000) is not
recommended and its results are not guaranteed.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
312
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
12.4.7 Center-aligned PWM (CPWM) mode
The center-aligned mode is selected when all of the following apply:
• (DECAPEN = 0)
• (COMBINE = 0)
• (CPWMS = 1)
The CPWM pulse width (duty cycle) is determined by 2 × (CnVH:L – CNTINH:L). The
period is determined by 2 × (MODH:L – CNTINH:L). See the following figure.
MODH:L must be kept in the range of 0x0001 to 0x7FFF because values outside this
range can produce ambiguous results.
In the CPWM mode, the FTM counter counts up until it reaches MODH:L and then
counts down until it reaches the value of CNTINH:L.
The CHnF bit is set and channel (n) interrupt is generated (if CHnIE = 1) at the channel
(n) match (FTM counter = CnVH:L) when the FTM counting is down, at the begin of the
pulse width, and when the FTM counting is up, at the end of the pulse width.
This type of PWM signal is called center-aligned because the pulse width centers for all
channels are aligned with the value of CNTINH:L.
The other channel modes are not compatible with the up-down counter (CPWMS = 1).
Therefore, all FTM channels must be used in CPWM mode when (CPWMS = 1).
FTM counter =
CNTINH:L
counter overflow
FTM counter =
MODH:L
channel (n) match
(FTM counting
is up)
channel (n) match
(FTM counting
is down)
counter overflow
FTM counter =
MODH:L
channel (n) output
pulse width
2 x (CnVH:L - CNTINH:L)
period
2 x (MODH:L - CNTINH:L)
Figure 12-156. CPWM period and pulse width with ELSnB:ELSnA = 1:0
If (ELSnB:ELSnA = 0:0) when the counter reaches the value in the CnVH:L registers,
the CHnF bit is set and the channel (n) interrupt is generated (if CHnIE = 1), however the
channel (n) output is not controlled by FTM.
If (ELSnB:ELSnA = 1:0), then the channel (n) output is forced high at the channel (n)
match (FTM counter = CnVH:L) when counting down, and it is forced low at the channel
(n) match when counting up; see the following figure.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
313
Functional Description
counter
overflow
channel (n) match in
down counting
MODH:L = 0x0008
CnVH:L = 0x0005
...
CNTH:L
7
7
8
6
5
4
3
counter
overflow
channel (n) match in
down counting
channel (n) match in
up counting
2
1
0
1
2
3
4
5
7
6
8
7
6
5
...
channel (n) output
previous value
CHnF bit
TOF bit
Figure 12-157. CPWM signal with ELSnB:ELSnA = 1:0
If (ELSnB:ELSnA = X:1), then the channel (n) output is forced low at the channel (n)
match (FTM counter = CnVH:L) when counting down, and it is forced high at the
channel (n) match when counting up; see the following figure.
counter
overflow
counter
overflow
MODH:L = 0x0008
CnVH:L = 0x0005
channel (n) match in
down counting
CNTH:L
...
7
8
7
6
5
4
3
channel (n) match in
up counting
2
1
0
1
2
3
4
5
6
channel (n) match in
down counting
7
8
7
6
5
...
channel (n) output
CHnF bit
previous value
TOF bit
Figure 12-158. CPWM signal with ELSnB:ELSnA = X:1
If (CnVH:L = 0x0000) or (CnVH:L is a negative value, that is, CnVH[7] = 1) then the
channel (n) output is a 0% duty cycle CPWM signal and CHnF bit is not set even when
there is the channel (n) match.
If (CnVH:L is a positive value, that is, CnVH[7] = 0), (CnVH:L ≥ MODH:L), and
(MODH:L ≠ 0x0000), then the channel (n) output is a 100% duty cycle CPWM signal
and CHnF bit is not set even when there is the channel (n) match. This implies that the
usable range of periods set by MODH:L is 0x0001 through 0x7FFE, or 0x7FFF if you do
not need to generate a 100% duty cycle CPWM signal. This is not a significant limitation
because the resulting period is much longer than required for normal applications.
The CPWM mode must not be used when the FTM counter is a free running counter.
Note
• CPWM mode is available only with (CNTINH:L =
0x0000).
• CPWM mode with (CNTINH:L ≠ 0x0000) is not
recommended and its results are not guaranteed.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
314
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
12.4.8 Combine mode
The combine mode is selected when all of the following apply:
• (FTMEN = 1)
• (DECAPEN = 0)
• (COMBINE = 1)
• (CPWMS = 0)
In combine mode, the even channel (n) and adjacent odd channel (n+1) are combined to
generate a PWM signal in the channel (n) output.
In the combine mode, the PWM period is determined by (MODH:L – CNTINH:L +
0x0001) and the PWM pulse width (duty cycle) is determined by (|C(n+1)VH:L –
C(n)VH:L|).
The CHnF bit is set and the channel (n) interrupt is generated (if CHnIE = 1) at the
channel (n) match (FTM counter = C(n)VH:L). The CH(n+1)F bit is set and the channel
(n+1) interrupt is generated (if CH(n+1)IE = 1) at the channel (n+1) match (FTM counter
= C(n+1)VH:C(n+1)VL).
If (ELSnB:ELSnA = 1:0), then the channel (n) output is forced low at the beginning of
the period (FTM counter = CNTINH:L) and at the channel (n+1) match (FTM counter =
C(n+1)VH:L). It is forced high at the channel (n) match (FTM counter = C(n)VH:L). See
the following figure.
If (ELSnB:ELSnA = X:1), then the channel (n) output is forced high at the beginning of
the period (FTM counter = CNTINH:L) and at the channel (n+1) match (FTM counter =
C(n+1)VH:L). It is forced low at the channel (n) match (FTM counter = C(n)VH:L). See
the following figure.
In combine mode, the ELS(n+1)B and ELS(n+1)A bits are not used in the generation of
the channels (n) and (n+1) output.
channel (n+1) match
FTM counter
channel (n) match
channel (n) output
with ELSnB:ELSnA = 1:0
channel (n) output
with ELSnB:ELSnA = X:1
Figure 12-159. Combine mode
The following figures illustrate the generation of PWM signals using combine mode.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
315
Functional Description
FTM counter
MODH:L
C(n+1)VH:L
C(n)VH:L
CNTINH:L
channel (n) output
with ELSnB:ELSnA = 1:0
channel (n) output
with ELSnB:ELSnA = X:1
Figure 12-160. Channel (n) output if (CNTIN < C(n)V < MOD) and (CNTIN < C(n+1)V <
MOD) and (C(n)V < C(n+1)V)
FTM counter
MODH:L =
C(n+1)VH:L
C(n)VH:L
CNTINH:L
channel (n) output
with ELSnB:ELSnA = 1:0
channel (n) output
with ELSnB:ELSnA = X:1
Figure 12-161. Channel (n) output if (CNTIN < C(n)V < MOD) and (C(n+1)V = MOD)
FTM counter
MODH:L
C(n+1)VH:L
C(n)VH:L =
CNTINH:L
channel (n) output
with ELSnB:ELSnA = 1:0
channel (n) output
with ELSnB:ELSnA = X:1
Figure 12-162. Channel (n) output if (C(n)V = CNTIN) and (CNTIN < C(n+1)V < MOD)
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
316
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
FTM counter
MODH:L =
C(n+1)VH:L
C(n)VH:L
CNTINH:L
channel (n) output
with ELSnB:ELSnA = 1:0
channel (n) output
with ELSnB:ELSnA = X:1
not fully 100% duty cycle
not fully 0% duty cycle
Figure 12-163. Channel (n) output if (CNTIN < C(n)V < MOD) and (C(n)V is almost equal
to CNTIN) and (C(n+1)V = MOD)
FTM counter
MODH:L
C(n+1)VH:L
C(n)VH:L =
CNTINH:L
channel (n) output
with ELSnB:ELSnA = 1:0
channel (n) output
with ELSnB:ELSnA = X:1
not fully 100% duty cycle
not fully 0% duty cycle
Figure 12-164. Channel (n) output if (C(n)V = CNTIN) and (CNTIN < C(n+1)V < MOD) and
(C(n+1)V is almost equal to MOD)
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
317
Functional Description
FTM counter
C(n+1)VH:L
MODH:L
CNTINH:L
C(n)VH:L
channel (n) output
with ELSnB:ELSnA = 1:0
0% duty cycle
channel (n) output
with ELSnB:ELSnA = X:1
100% duty cycle
Figure 12-165. Channel (n) output if C(n)V and C(n+1)V are not between CNTIN and MOD
FTM counter
MODH:L
C(n+1)VH:L =
C(n)VH:L
CNTINH:L
channel (n) output
with ELSnB:ELSnA = 1:0
0% duty cycle
channel (n) output
with ELSnB:ELSnA = X:1
100% duty cycle
Figure 12-166. Channel (n) output if (CNTIN < C(n)V < MOD) and (CNTIN < C(n+1)V <
MOD) and (CnV = C(n+1)V)
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
318
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
FTM counter
MODH:L
C(n+1)VH:L =
C(n)VH:L =
CNTINH:L
channel (n) output
with ELSnB:ELSnA = 1:0
0% duty cycle
channel (n) output
with ELSnB:ELSnA = X:1
100% duty cycle
Figure 12-167. Channel (n) output if (C(n)V = C(n+1)V = CNTIN)
MODH:L =
C(n+1)VH:L =
C(n)VH:L
FTM counter
CNTINH:L
channel (n) output
with ELSnB:ELSnA = 1:0
0% duty cycle
channel (n) output
with ELSnB:ELSnA = X:1
100% duty cycle
Figure 12-168. Channel (n) output if (C(n)V = C(n+1)V = MOD)
FTM counter
MODH:L
C(n)VH:L
C(n+1)VH:L
CNTINH:L
channel (n) output
with ELSnB:ELSnA = 1:0
0% duty cycle
channel (n) output
with ELSnB:ELSnA = X:1
100% duty cycle
channel (n) match
is ignored
Figure 12-169. Channel (n) output if (CNTIN < C(n)V < MOD) and (CNTIN < C(n+1)V <
MOD) and (C(n)V > C(n+1)V)
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
319
Functional Description
FTM counter
MODH:L
C(n+1)VH:L
CNTINH:L
C(n)VH:L
channel (n) output
with ELSnB:ELSnA = 1:0
0% duty cycle
channel (n) output
with ELSnB:ELSnA = X:1
100% duty cycle
Figure 12-170. Channel (n) output if (C(n)V < CNTIN) and (CNTIN < C(n+1)V < MOD)
FTM counter
MODH:L
C(n)VH:L
CNTINH:L
C(n+1)VH:L
channel (n) output
with ELSnB:ELSnA = 1:0
channel (n) output
with ELSnB:ELSnA = X:1
Figure 12-171. Channel (n) output if (C(n+1)V < CNTIN) and (CNTIN < C(n)V < MOD)
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
320
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
FTM counter
C(n)VH:L
MODH:L
C(n+1)VH:L
CNTINH:L
channel (n) output
with ELSnB:ELSnA = 1:0
0% duty cycle
channel (n) output
with ELSnB:ELSnA = X:1
100% duty cycle
Figure 12-172. Channel (n) output if (C(n)V > MOD) and (CNTIN < C(n+1)V < MOD)
FTM counter
C(n+1)VH:L
MODH:L
C(n)VH:L
CNTINH:L
channel (n) output
with ELSnB:ELSnA = 1:0
channel (n) output
with ELSnB:ELSnA = X:1
Figure 12-173. Channel (n) output if (C(n+1)V > MOD) and (CNTIN < C(n)V < MOD)
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
321
Functional Description
FTM counter
C(n+1)VH:L
MODH:L =
C(n)VH:L
CNTINH:L
channel (n) output
with ELSnB:ELSnA = 1:0
not fully 0% duty cycle
channel (n) output
with ELSnB:ELSnA = X:1
not fully 100% duty cycle
Figure 12-174. Channel (n) output if (C(n+1)V > MOD) and (CNTIN < C(n)V = MOD)
12.4.8.1 Asymmetrical PWM
In the combine mode, the control of the PWM signal first edge (when the channel (n)
match occurs, that is, FTM counter = C(n)VH:L) is independent of the control of the
PWM signal second edge (when the channel (n+1) match occurs, that is, FTM counter =
C(n+1)VH:L). So, the combine mode allows to generate asymmetrical PWM signals.
12.4.9 Complementary mode
The complementary mode is selected when all of the following apply:
• (FTMEN = 1)
• (DECAPEN = 0)
• (COMBINE = 1)
• (CPWMS = 0)
• (COMP = 1)
In complementary mode the channel (n+1) output is the inverse of the channel (n) output.
The channel (n+1) output is the same as the channel (n) output if all of the following
apply:
• (FTMEN = 1)
• (DECAPEN = 0)
• (COMBINE = 1)
• (CPWMS = 0)
• (COMP = 0)
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
322
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
channel (n+1) match
FTM counter
channel (n) match
channel (n) output
with ELSnB:ELSnA = 1:0
channel (n+1) output
with COMP = 0
channel (n+1) output
with COMP = 1
Figure 12-175. Channel (n+1) output in complementary mode with (ELSnB:ELSnA = 1:0)
channel (n+1) match
FTM counter
channel (n) match
channel (n) output
with ELSnB:ELSnA = X:1
channel (n+1) output
with COMP = 0
channel (n+1) output
with COMP = 1
Figure 12-176. Channel (n+1) output in complementary mode with (ELSnB:ELSnA = X:1)
12.4.10 Update of the registers with write buffers
This section describes the updating of registers that have write buffers.
12.4.10.1 CNTINH:L registers
CNTINH:L registers are always updated with their write buffer after both bytes have
been written.
12.4.10.2 MODH:L registers
If (CLKS[1:0] = 0:0), then MODH:L registers are updated when their second byte is
written, independent of FTMEN bit.
If (CLKS[1:0] ≠ 0:0 and FTMEN = 0), then MODH:L registers are updated according to
the CPWMS bit:
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
323
Functional Description
• If the selected mode is not CPWM mode, then MODH:L registers are updated after
both bytes have been written and the FTM counter changes from (MODH:L) to
(CNTINH:L). If the FTM counter is a free-running counter, then this update is made
when the FTM counter changes from 0xFFFF to 0x0000.
• If the selected mode is CPWM mode, then MODH:L registers are updated after both
bytes have been written and the FTM counter changes from MODH:L to (MODH:L
– 0x0001).
If (CLKS[1:0] ≠ 0:0 and FTMEN = 1), then MODH:L registers are updated by PWM
synchronization. See MODH:L registers synchronization.
12.4.10.3 CnVH:L registers
If (CLKS[1:0] = 0:0), then CnVH:L registers are updated when their second byte is
written, independent of FTMEN bit.
If (CLKS[1:0] ≠ 0:0 and FTMEN = 0), then CnVH:L registers are updated according to
the selected mode:
• If the selected mode is output compare mode, then CnVH:L registers are updated
after their second byte is written and on the next change of the FTM counter.
• If the selected mode is EPWM mode, the CnVH:L registers are updated after both
bytes have been written and the FTM counter changes from MODH:L to CNTINH:L.
If the FTM counter is a free running counter, then this update is made when the FTM
counter changes from 0xFFFF to 0x0000.
• If the selected mode is CPWM mode, then CnVH:L registers are updated after both
bytes have been written and the FTM counter changes from MODH:L to (MODH:L
– 0x0001).
If (CLKS[1:0] ≠ 0:0 and FTMEN = 1), then CnVH:L registers are updated according to
the selected mode:
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
324
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
• If the selected mode is output compare mode, then CnVH:L registers are updated
according to the SYNCEN bit. If (SYNCEN = 0), then CnVH:L registers are updated
after their second byte is written and on the next change of the FTM counter. If
(SYNCEN = 1), then CnVH:L registers are updated by PWM synchronization. See
CnVH:L registers synchronization.
• If the selected mode is not output compare mode and (SYNCEN = 1), then CnVH:L
registers are updated by PWM synchronization. See CnVH:L registers
synchronization.
12.4.11 PWM synchronization
PWM synchronization provides an opportunity to update registers with the contents of
their write buffers. It can also be used to synchronize two or more FlexTimer modules on
the same MCU.
PWM synchronization updates the MODH:L and CnVH:L registers with their write
buffers. It is also possible to force the FTM counter to its initial value and update the
CHnOM bits in OUTMASK using PWM synchronization.
Note
PWM synchronization is available only in combine mode.
12.4.11.1 Hardware trigger
Each hardware trigger is synchronized by the system clock. The input signals are:
trigger_0, trigger_1, and trigger_2.
A rising edge on the selected hardware trigger input (trigger n event) initiates PWM
synchronization. A hardware trigger is selected when its enable bit is set (TRIGn = 1
where n = 0, 1, or 2). The TRIGn bit is cleared when 0 is written to it or when the trigger
n event is detected.
For example, if TRIG0 and TRIG1 are enabled and only the trigger 1 event occurs, only
the TRIG1 bit is cleared.
If a trigger n event occurs together with a write to set the TRIGn bit, then the
synchronization is made, but the TRIGn bit remains set because of the last write.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
325
Functional Description
system clock
write 1 to TRIG0 bit
TRIG0 bit
trigger_0 input
synchronized trigger_0
by system clock
trigger 0 event
Notes
- All hardware trigger (input signals: trigger_0, trigger_1, and trigger_2) have this same behavior
Figure 12-177. Hardware trigger event
12.4.11.2 Software trigger
A software trigger event occurs when 1 is written to the SWSYNC bit. The SWSYNC bit
is cleared when 0 is written to it or when the PWM synchronization, which is initiated by
the software event, is completed.
If the software trigger event occurs together with the event that clears the SWSYNC bit,
then the synchronization is made using this trigger event and the SWSYNC bit remains
set because of the last write.
For example, if PWMSYNC = 0 and REINIT = 0 and there is a software trigger event,
then the load of MODH:L and CnVH:L registers is made only at the boundary cycle
(CNTMIN and CNTMAX). In this case, the SWSYNC bit is cleared only at the boundary
cycle, so you do not know when this bit is cleared. Therefore, it is possible a new write to
set SWSYNC happens when FTM is clearing the SWSYNC because it is the selected
boundary cycle of PWM synchronization that was started previously by the software
trigger event.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
326
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
system clock
write 1 to SWSYNC bit
SWSYNC bit
software trigger event
PWM synchronization
Figure 12-178. Software Trigger event
12.4.11.3 Boundary cycle
The CNTMAX and CNTMIN bits select the boundary cycle when the MODH:L and
CnVH:L registers are updated with the value of their write buffer by PWM
synchronization, except if (PWMSYNC = 0 and REINIT = 1).
If CNTMIN = 1, then the boundary cycle is the CNTINH:L value. MODH:L and
CnVH:L registers are updated when the FTM counter reaches the CNTINH:L value. If
CPWMS = 0, then CNTINH:L is reached when the FTM counter changes from MODH:L
to CNTINH:L. If CPWMS = 1, then CNTINH:L is reached when the FTM counter
changes from (CNTINH:L + 0x0001) to CNTINH:L.
If CNTMAX = 1, then the boundary cycle is the MODH:L value. MODH:L and CnVH:L
registers are updated when the FTM counter reaches the MODH:L value. MODH:L is
reached when the FTM counter changes from (MODH:L – 0x0001) to MODH:L,
regardless of the CPWMS configuration.
If no boundary cycle was selected (CNTMAX = 0 and CNTMIN = 0), then the update of
the MODH:L and CnVH:L registers is not made, unless (PWMSYNC = 0 and REINIT =
1).
If both boundary cycles were selected (CNTMAX = 1 and CNTMIN = 1), then the
update of the MODH:L and CnVH:L registers is made in the first boundary cycle that
occurs with valid conditions for MODH:L or CnVH:L synchronization, except if
(PWMSYNC = 0 and REINIT = 1).
The CNTMAX and CNTMIN bits are cleared only by software.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
327
Functional Description
Note
• PWM synchronization boundary cycle is available only
when (CNTMIN = 1).
• PWM synchronization with (CNTMAX = 1) is not
recommended and its results are not guaranteed.
12.4.11.4 MODH:L registers synchronization
The MODH:L synchronization occurs when the MODH:L registers are updated with the
value of their write buffer.
The synchronization requires both bytes of MODH:L to have been written in one of the
following situations.
• If PWMSYNC = 0 and REINIT = 0, then the synchronization is made on the next
selected boundary cycle after an enabled trigger event takes place. If the trigger event
was a software trigger, then the SWSYNC bit is cleared on the next selected
boundary cycle. See the following figure.
system clock
write 1 to SWSYNC bit
SWSYNC bit
software trigger event
selected boundary cycle
MODH:L registers
are updated if both bytes
were written
Figure 12-179. MODH:L synchronization when (PWMSYNC = 0), (REINIT = 0), and
software trigger was used
If the trigger event was a hardware trigger, then the trigger enable bit (TRIGn) is
cleared when the trigger n event is detected. See the following figure.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
328
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
system clock
write 1 to TRIG0 bit
TRIG0 bit
trigger 0 event
selected boundary cycle
MODH:L registers
are updated if both bytes
were written
Figure 12-180. MODH:L synchronization when (PWMSYNC = 0), (REINIT = 0), and a
hardware trigger was used
• If PWMSYNC = 0 and REINIT = 1, then the synchronization is made on the next
enabled trigger event. If the trigger event was a software trigger, then the SWSYNC
bit is cleared. See the following figure.
system clock
write 1 to SWSYNC bit
SWSYNC bit
software trigger event
MODH:L registers
are updated if both bytes
were written
Figure 12-181. MODH:L synchronization when (PWMSYNC = 0), (REINIT = 1), and
software trigger was used
If the trigger event was a hardware trigger, then the TRIGn bit is cleared. See the
following figure.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
329
Functional Description
system clock
write 1 to TRIG0 bit
TRIG0 bit
trigger 0 event
MODH:L registers
are updated if both bytes
were written
Figure 12-182. MODH:L synchronization when (PWMSYNC = 0), (REINIT = 1), and a
hardware trigger was used
• If PWMSYNC = 1, then the synchronization is made on the next selected boundary
cycle after the enabled software trigger event takes place. The SWSYNC bit is
cleared on the next selected boundary cycle. See the following figure.
system clock
write 1 to SWSYNC bit
SWSYNC bit
software trigger event
selected boundary cycle
MODH:L registers
are updated if both bytes
were written
Figure 12-183. MODH:L synchronization when (PWMSYNC = 1)
12.4.11.5 CnVH:L registers synchronization
The CnVH:L synchronization occurs when the CnVH:L registers are updated with the
value of their write buffer.
The synchronization requires both bytes of CnVH:L to have been written, SYNCEN = 1
and either a hardware or software trigger event as per MODH:L registers
synchronization.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
330
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
12.4.11.6 OUTMASK register synchronization
Any write to a CHnOM bit updates the OUTMASK write buffer. The CHnOM bit is
updated with the value of its corresponding bit in the OUTMASK write buffer according
to SYNCHOM and PWMSYNC bits.
• If SYNCHOM = 0, then the CHnOM bit is updated with the value of its write buffer
equivalent in all rising edges of the system clock.
system clock
write to CHnOM bit
set CHnOM
clear CHnOM
write buffer of CHnOM bit
CHnOM bit
Figure 12-184. CHnOM synchronization when (SYNCHOM = 0)
• If SYNCHOM = 1 and PWMSYNC = 0, then this synchronization is made on the
next enabled trigger event. If the trigger event was a software trigger, then the
SWSYNC bit is cleared on the next selected boundary cycle. See the following
figure.
system clock
write 1 to SWSYNC bit
SWSYNC bit
software trigger event
selected boundary cycle
CHnOM bit is updated
SWSYNC bit is cleared
Figure 12-185. CHnOM synchronization when (SYNCHOM = 1), (PWMSYNC = 0) and
software trigger was used
If the trigger event was a hardware trigger, then the trigger enable bit (TRIGn) is
cleared when the trigger n event is detected. See the following figure.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
331
Functional Description
system clock
write 1 to TRIG0 bit
TRIG0 bit
trigger 0 event
CHnOM bit is updated and
TRIG0 bit is cleared
Figure 12-186. CHnOM synchronization when (SYNCHOM = 1), (PWMSYNC = 0), and a
hardware trigger was used
• If SYNCHOM = 1 and PWMSYNC = 1, then this synchronization is made on the
next enabled hardware trigger event. The trigger enable bit (TRIGn) is cleared when
the enabled hardware trigger n event is detected. See the following figure.
system clock
write 1 to TRIG0 bit
TRIG0 bit
trigger 0 event
CHnOM bit is updated and
TRIG0 bit is cleared
Figure 12-187. CHnOM Synchronization when (SYNCHOM = 1), (PWMSYNC = 1), and a
hardware trigger was used
12.4.11.7 FTM counter synchronization
The FTM counter synchronization occurs when the FTM counter is updated with the
value of the CNTINH:L registers and the channel outputs are forced to their initial value
as defined by the channel configuration.
• If REINIT = 0, then this synchronization is made when the FTM counter changes
from MODH:L to CNTINH:L.
• If REINIT = 1 and PWMSYNC = 0, then this synchronization is made on the next
enabled trigger event. If the trigger event was a software trigger, then the SWSYNC
bit is cleared. See the following figure.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
332
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
system clock
write 1 to SWSYNC bit
SWSYNC bit
software trigger event
FTM counter is reset and
channel outputs are forced to their initial value
Figure 12-188. FTM counter synchronization when (REINIT = 1), (PWMSYNC = 0), and
software trigger was used
If the trigger event was a hardware trigger, then the TRIGn bit is cleared. See the
following figure.
system clock
write 1 to TRIG0 bit
TRIG0 bit
trigger 0 event
FTM counter is reset and
channel outputs are forced to their initial value
Figure 12-189. FTM counter synchronization when (REINIT = 1), (PWMSYNC = 0), and a
hardware trigger was used
• If REINIT = 1 and PWMSYNC = 1, then this synchronization is made on the next
enabled hardware trigger event. The trigger enable bit (TRIGn) is cleared when the
enabled hardware trigger n event is detected. See the following figure.
system clock
write 1 to TRIG0 bit
TRIG0 bit
trigger 0 event
FTM counter is reset and
channel outputs are forced to their initial value
Figure 12-190. FTM counter synchronization when (REINIT = 1), (PWMSYNC = 1), and a
hardware trigger was used
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
333
Functional Description
12.4.11.8 Summary of PWM synchronization
The following table shows the summary of PWM synchronization.
Table 12-185. Summary of PWM synchronization
Register or bit
PWMSYN
C
REINIT
CNTINH:L
X
X
SYNCH CNTMA
OM
X
X
X
CNTMI
N
SYNCE
Description
N
X
X
Changes take effect after the
second byte is written.
Effect is seen after the next TOF or
PWM synchronization.
MODH:L
CnVH:L
0
0
X
1
0
X
MODH:L are updated with their write
buffer contents when the counter
reaches its maximum value after the
enabled hardware or software
trigger has occurred.
0
0
X
0
1
X
MODH:L are updated with their write
buffer contents when the counter
reaches its minimum value after the
enabled hardware or software
trigger has occurred.
0
1
X
X
X
X
MODH:L are updated with their write
buffer contents when the enabled
hardware or software trigger occurs.
1
X
X
1
0
X
MODH:L are updated with their write
buffer contents when the counter
reaches its maximum value after the
enabled software trigger has
occurred.
1
X
X
0
1
X
MODH:L are updated with their write
buffer contents when the counter
reaches its minimum value after the
enabled software trigger has
occurred.
0
0
X
1
0
1
CnVH:L are updated with their write
buffer contents when the counter
reaches its maximum value after the
enabled hardware or software
trigger has occurred.
0
0
X
0
1
1
CnVH:L are updated with their write
buffer contents when the counter
reaches its minimum value after the
enabled hardware or software
trigger has occurred.
0
1
X
X
X
1
CnVH:L are updated with their write
buffer contents when the enabled
hardware or software trigger occurs.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
334
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
Table 12-185. Summary of PWM synchronization (continued)
Register or bit
PWMSYN
C
REINIT
1
X
X
1
0
1
CnVH:L are updated with their write
buffer contents when the counter
reaches its maximum value after the
enabled software trigger has
occurred.
1
X
X
0
1
1
CnVH:L are updated with their write
buffer contents when the counter
reaches its minimum value after the
enabled software trigger has
occurred.
0
1
X
X
X
X
CNTH:L are forced to the FTM
counter initial value when the
enabled hardware or software
trigger occurs.
1
1
X
X
X
X
CNTH:L are forced to the FTM
counter initial value when the
enabled hardware trigger occurs.
X
X
0
X
X
X
Changes to OUTMASK take effect
on the next rising edge of the
system clock.
0
X
1
X
X
X
OUTMASK is updated with its write
buffer contents when the enabled
hardware or software trigger occurs.
1
X
1
X
X
X
OUTMASK is updated with its write
buffer contents when the enabled
hardware trigger occurs.
0
0
X
1
0
X
SWSYNC bit is cleared when the
counter reaches its maximum value
after the enabled software trigger
has occurred.
0
0
X
0
1
X
SWSYNC bit is cleared when the
counter reaches its minimum value
after the enabled software trigger
has occurred.
0
1
X
X
X
X
SWSYNC bit is cleared when the
enabled software trigger occurs.
1
X
X
1
0
X
SWSYNC bit is cleared when the
counter reaches its maximum value
after the enabled software trigger
has occurred.
1
X
X
0
1
X
SWSYNC bit is cleared when the
counter reaches its minimum value
after the enabled software trigger
has occurred.
X
X
X
X
X
X
TRIGn bit is cleared when the
enabled hardware trigger has
occurred.
CNTH:L
OUTMASK
SWSYNC bit
TRIGn bit
SYNCH CNTMA
OM
X
CNTMI
N
SYNCE
Description
N
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
335
Functional Description
12.4.12 Deadtime insertion
The deadtime insertion is enabled when (DTEN = 1) and (DTVAL[5:0] is non- zero).
DEADTIME register defines the deadtime delay that can be used for all FTM channels.
The DTPS[1:0] bits define the prescaler for the system clock and the DTVAL[5:0] bits
define the deadtime modulo; that is, the number of deadtime prescaler clocks).
The deadtime delay insertion ensures that no two complementary signals (channel (n) and
(n+1)) drive the active state at the same time.
For POL(n) = 0, POL(n+1) = 0, and deadtime enabled, a rising edge on the output of
channel (n) remains low for the duration of the deadtime delay, after which the rising
edge appears on the output. Similarly, when a falling edge is due on the output of channel
(n), the channel (n+1) output remains low for the duration of the deadtime delay, after
which the channel (n+1) output will have a rising edge.
For POL(n) = 1, POL(n+1) = 1, and deadtime enabled, a falling edge on the output of
channel (n) remains high for the duration of the deadtime delay, after which the falling
edge appears on the output. Similarly, when a rising edge is due on the output of channel
(n), the channel (n+1) output remains high for the duration of the deadtime delay, after
which the channel (n+1) output will have a falling edge.
channel (n+1) match
FTM counter
channel (n) match
channel (n) output
(before deadtime
insertion)
channel (n+1) output
(before deadtime
insertion)
channel (n) output
(after deadtime
insertion)
channel (n+1) output
(after deadtime
insertion)
Figure 12-191. Deadtime insertion with ELSnB:ELSnA = 1:0, POL(n) = 0, and POL(n+1) =
0
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
336
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
channel (n+1) match
FTM counter
channel (n) match
channel (n) output
(before deadtime
insertion)
channel (n+1) output
(before deadtime
insertion)
channel (n) output
(after deadtime
insertion)
channel (n+1) output
(after deadtime
insertion)
Figure 12-192. Deadtime insertion with ELSnB:ELSnA = X:1, POL(n) = 0, and POL(n+1) =
0
NOTE
Deadtime feature is available only in combine and
complementary modes.
12.4.12.1 Deadtime insertion corner cases
If (PS[2:0] bits are cleared), (DTPS[1:0] = 0:0 or DTPS[1:0] = 0:1):
• and the deadtime delay is greater than or equal to the channel (n) duty cycle ((C(n
+1)VH:L – C(n)VH:L) × system clock), then the channel (n) output is always the
inactive value (POL(n) bit value).
• and the deadtime delay is greater than or equal to the channel (n+1) duty cycle
((MODH:L – CNTINH:L + 1 – (C(n+1)VH:L – C(n)VH:L) ) × system clock), then
the channel (n+1) output is always the inactive value (POL(n+1) bit value).
Although in most cases the deadtime delay is not comparable to channels (n) and (n+1)
duty cycle, the following figures show examples where the deadtime delay is comparable
to the duty cycle.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
337
Functional Description
channel (n+1) match
FTM counter
channel (n) match
channel (n) output
(before deadtime
insertion)
channel (n+1) output
(before deadtime
insertion)
channel (n) output
(after deadtime
insertion)
channel (n+1) output
(after deadtime
insertion)
Figure 12-193. Example of the deadtime insertion (ELSnB:ELSnA = 1:0, POL(n) = 0, and
POL(n+1) = 0) when the deadtime delay is comparable to channel (n+1) duty cycle
channel (n+1) match
FTM counter
channel (n) match
channel (n) output
(before deadtime
insertion)
channel (n+1) output
(before deadtime
insertion)
channel (n) output
(after deadtime
insertion)
channel (n+1) output
(after deadtime
insertion)
Figure 12-194. Example of the deadtime insertion (ELSnB:ELSnA = 1:0, POL(n) = 0, and
POL(n+1) = 0) when the deadtime delay Is comparable to channels (n) and (n+1) duty
cycle
12.4.13 Output mask
The output mask register OUTMASK can be used to force channel outputs to their
inactive state through software; for example, to control a BLDC motor.
Any write to a CHnOM bit updates the OUTMASK write buffer. The CHnOM bit is
updated with the value of its corresponding bit in the OUTMASK write buffer according
to OUTMASK register synchronization.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
338
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
If CHnOM = 1, then the channel (n) output is forced to its inactive state, defined by the
POLn bit in register POL. If CHnOM = 0, then the channel (n) output is unaffected by the
output mask function.
When a CHnOM bit is cleared, the channel (n) output is enabled. See the following
figure.
the beginning of new PWM cycles
FTM counter
channel (n) output
(before output mask)
CHnOM bit
channel (n) output
(after output mask)
configured PWM signal starts
to be available in the channel (n) output
channel (n) output is disabled
Figure 12-195. Output mask
The following table shows the output mask result before the polarity control.
Table 12-186. Output mask result for channel (n) before the polarity
control
CHnOM
Output Mask Input
Output Mask Result
0
inactive state
inactive state
active state
active state
inactive state
inactive state
1
active state
Note
Output mask is available only in combine mode.
12.4.14 Fault control
The fault control is enabled if (FTMEN = 1) and (FAULTM[1:0] ≠ 0:0).
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
339
Functional Description
FTM can have up to four fault inputs. FAULTnEN bit (where n = 0, 1, 2, 3) enables the
fault input n and FFLTRnEN bit enables the fault input n filter. FFVAL[3:0] bits select
the value of the enabled filter in each enabled fault input.
First, each fault input signal is synchronized by the system clock; see the synchronizer
block in the following figure. Following synchronization, the fault input n signal enters
the filter block. When there is a state change in the fault input n signal, the 5-bit counter
is reset and starts counting up. As long as the new state is stable on the fault input n, the
counter continues to increment. If the 5-bit counter overflows and exceeds the value of
the FFVAL[3:0] bits, the new fault input n value is validated. It is then transmitted as a
pulse edge to the edge detector.
If the opposite edge appears on the fault input n signal before validation (counter
overflow), the counter is reset. At the next input transition, the counter starts counting
again. Any pulse that is shorter than the minimum value selected by FFVAL[3:0] bits (×
system clock) is regarded as a glitch and is not passed on to the edge detector.
The fault input n filter is disabled when the FFVAL[3:0] bits are zero or when
FAULTnEN = 0. In this case the fault input n signal is delayed two rising edges of the
system clock and the FAULTFn bit is set on the third rising edge of the system clock
after a rising edge occurs on the fault input n.
If FFVAL[3:0] ≠ 0000 and FAULTnEN = 1, then the fault input n signal is delayed (3 +
FFVAL[3:0]) rising edges of the system clock; that is, the FAULTFn bit is set (4 +
FFVAL[3:0]) rising edges of the system clock after a rising edge occurs on the fault input
n.
(FFVAL[3:0] 0000)
and (FFLTRnEN*)
FLTnPOL
synchronizer
fault input n* value
0
fault input n*
system clock
D
CLK
Q
D
CLK
Q
Fault filter
(5-bit counter)
1
fault input
polarity
control
rising edge
edge
FAULTFn*
detector
* where n = 3, 2, 1, 0
Figure 12-196. Fault input n control block diagram
If the fault control and fault input n are enabled and a rising edge at the fault input n
signal is detected, then the FAULTFn bit is set. The FAULTF bit is the logic OR of
FAULTFn[3:0] bits. See the following figure.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
340
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
fault input 0 value
fault input 1 value
fault input 2 value
fault input 3 value
FAULTIN
FAULTIE
FAULTF0
FAULTF1
fault interrupt
FAULTF
FAULTF2
FAULTF3
Figure 12-197. FAULTF and FAULTIN bits and fault interrupt
If the fault control is enabled (FAULTM[1:0] ≠ 0:0), a fault condition has occurred
(rising edge at the logic OR of the enabled fault input) and (FAULTEN = 1), then
channel (n) and (n+1) outputs are forced to their safe value (that is, the channel (n) output
is forced to the value of POL(n) and the channel (n+1) is forced to the value of POL(n
+1)).
The fault interrupt is generated when (FAULTF = 1) and (FAULTIE = 1). This interrupt
request remains set until:
• Software clears the FAULTF bit (by reading FAULTF bit as 1 and writing 0 to it)
• Software clears the FAULTIE bit
• A reset occurs
Note
Fault control is available only in combine mode.
12.4.14.1 Automatic fault clearing
If the automatic fault clearing is selected (FAULTM[1:0] = 1:1), then the disabled
channel outputs are enabled when the fault input signal (FAULTIN) returns to zero and a
new PWM cycle begins. See the following figure.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
341
Functional Description
the beginning of new PWM cycles
FTM counter
channel (n) output
(before fault control)
FAULTIN bit
channel (n) output
(after fault control with
automatic fault clearing
and POLn=0)
FAULTF bit
FAULTF bit is cleared
Figure 12-198. Fault control with automatic fault clearing
12.4.14.2 Manual fault clearing
If the manual fault clearing is selected (FAULTM[1:0] = 0:1 or 1:0), then disabled
channel outputs are enabled when the FAULTF bit is cleared and a new PWM cycle
begins. See the following figure.
It is possible to manually clear a fault by clearing the FAULTF bit, and enable disabled
channels regardless of the fault input signal (FAULTIN) (the filter output if the filter is
enabled or the synchronizer output if the filter is disabled). However, it is recommended
to verify the value of the fault input signal (value of the FAULTIN bit) before clearing
the FAULTF bit to avoid unpredictable results.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
342
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
the beginning of new PWM cycles
FTM counter
channel (n) output
(before fault control)
FAULTIN bit
channel (n) output
(after fault control with
manual fault clearing
and POLn=0)
FAULTF bit
FAULTF bit is cleared
Figure 12-199. Fault control with manual fault clearing
12.4.15 Polarity control
The POLn bit selects the channel (n) output polarity:
• If (POLn = 0), the channel (n) output polarity is active-high: one is the active state;
zero is the inactive state.
• If (POLn = 1), the channel (n) output polarity is active-low: zero is the active state;
one is the inactive state.
Note
Polarity control is available only in combine mode.
12.4.16 Initialization
The initialization forces the CHnOI bit value to the channel (n) output when a one is
written to the INIT bit.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
343
Functional Description
Note
• It is recommended to use the initialization only when the
FTM counter is disabled (CLKS[1:0] = 0:0).
• Initialization is available only in combine mode.
12.4.17 Features priority
The following figure shows the priority of the features that can be combined to generate
channel (n) and (n+1) outputs.
Output modes logic
(generation of channels
(n) and (n 1) output
in Output Compare, EPWM,
CPWM, Combine and/or
Complementary modes)
Deadtime
Insertion
Initialization
Output
Mask
Fault
Control
Polarity
Control
channel (n) output
channel (n 1) output
Figure 12-200. FTM features priority
12.4.18 Channel trigger output
The channel trigger output is generated if (FTMEN = 1) and one or more channels were
selected by the CHjTRIG bit, where j = 0, 1, 2, 3, 4, or 5. The CHjTRIG bit defines if the
channel (j) match (that is, FTM counter = C(j)VH:L) generates the trigger.
The channel trigger output provides a trigger signal that is used for on-chip modules.
The FTM is able to generate multiple triggers in one PWM period. Because each trigger
is generated for a specific channel, several channels are required to implement this
functionality. This behavior is described in the following figure.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
344
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
the beginning of new PWM cycles
FTM counter = C1VH:L
FTM counter = C0VH:L
FTM counter = C5VH:L
FTM counter = C4VH:L
FTM counter = C3VH:L
FTM counter = C2VH:L
match trigger when
CH2TRIG=0, CH3TRIG=0,
CH4TRIG=0, CH5TRIG=0,
CH0TRIG=0, and CH1TRIG=0
match trigger when
CH2TRIG=0, CH3TRIG=0,
CH4TRIG=0, CH5TRIG=0,
CH0TRIG=1, and CH1TRIG=0
match trigger when
CH2TRIG=0, CH3TRIG=1,
CH4TRIG=1, CH5TRIG=1,
CH0TRIG=0, and CH1TRIG=0
match trigger when
CH2TRIG=1, CH3TRIG=1,
CH4TRIG=1, CH5TRIG=1,
CH0TRIG=1, and CH1TRIG=1
Figure 12-201. Match triggers
Note
Match trigger is available only in combine mode.
12.4.19 Initialization trigger
If INITTRIGEN = 1, the FTM generates a trigger when the FTM counter is updated with
the CNTINH:L registers value in the following cases:
• The FTM counter is automatically updated with the CNTINH:L registers value by
selected counting mode.
CNTINH:L = 0x0000
MODH:L = 0x000F
CPWMS = 0
system clock
FTM counter 0x0C 0x0D 0x0E 0x0F 0x00 0x01 0x02 0x03 0x04 0x05
initialization trigger
Figure 12-202. Initialization trigger is generated when the FTM counter achieves the
value of CNTINH:L
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
345
Functional Description
• When there is a write to CNTH or CNTL register
CNTINH:L = 0x0000
MODH:L = 0x000F
CPWMS = 0
system clock
FTM counter 0x04 0x05 0x06 0x00 0x01 0x02 0x03 0x04 0x05 0x06
write to CNTH
initialization trigger
Figure 12-203. Initialization trigger is generated when there is a write to CNTH or CNTL
• When there is the FTM counter synchronization
CNTINH:L = 0x0000
MODH:L = 0x000F
CPWMS = 0
REINIT = 1
system clock
FTM counter 0x04 0x05 0x06 0x07 0x00 0x01 0x02 0x03 0x04 0x05
FTM counter
synchronization
initialization trigger
Figure 12-204. Initialization trigger is generated when there is the FTM counter
synchronization
• If (CNTH:L = CNTINH:L), (CLKS[1:0] = 0:0), and a value different from zero is
written to CLKS[1:0] bits
CNTINH:L = 0x0000
MODH:L = 0x000F
CPWMS = 0
system clock
0x00
FTM counter
CLKS[1:0] bits
00
0x01 0x02 0x03 0x04 0x05
01
initialization trigger
Figure 12-205. Initialization trigger is generated if (CNTH:L = CNTINH:L) and (CLKS[1:0]
= 0:0) and a value different from zero is written to CLKS[1:0] bits
The initialization trigger output provides a trigger signal that is used for on-chip modules.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
346
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
Note
Initialization trigger is available only in combine mode.
12.4.20 Capture test mode
The capture test mode allows the testing of the CnVH:L registers, the FTM counter, and
the interconnection logic between the FTM counter and CnVH:L registers.
In this test mode, all channels must be configured for input capture mode (see Input
capture mode) and FTM counter must be configured for up-counting (see Up counting).
When the capture test mode is enabled (CAPTEST = 1), the FTM counter is frozen and
any write to CNTH and CNTL updates directly the FTM counter; see the following
figure. After both bytes were written, independent of the order, all CnVH:L registers are
updated with the value that was written to CNTH:L registers and CHnF bits are set.
Therefore, the FTM counter is updated with its next value according to its configuration.
Its next value depends on CNTINH:L, MODH:L, and the value that was written to FTM
counter.
The next reads of CnVH:L registers return the value that was written to FTM counter and
the next reads of CNTH:L register return the next value of the FTM counter.
The read coherency mechanism of CNTH:L and CnVH:L registers remains enabled.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
347
Functional Description
FTM counter clock
set CAPTEST
clear CAPTEST
write to MODE
CAPTEST bit
FTM counter
0x1053 0x1054 0x1055
0x1056
0x7856
0x78AC
0x78AD
0x78AE 0x78AF 0x78B0
write 0x78
write to CNTH
write 0xAC
write to CNTL
CH0F bit
C0VH:L
0x0300
0x78AC
Notes
- FTM counter configuration: (FTMEN = 1), (CAPTEST = 1), (CPWMS = 0), (CNTINH:L = 0x0000) and
(MODH:L = 0xFFFF)
- FTM channel n configuration: input capture mode – (DECAPEN = 0), (COMBINE = 0), and (MSnB:MSnA = 0:0)
Figure 12-206. Capture test mode
12.4.21 Dual edge capture mode
The dual edge capture mode is selected if FTMEN = 1 and DECAPEN = 1. This mode
allows software to measure a pulse width or period of the signal on the input of channel
(n) of a channel pair. The channel (n) filter can be active in this mode when n is the
channels 0 or 2.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
348
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
FTMEN
DECAPEN
is filter
DECAP
enabled?
MS(n)A
ELS(n)B:ELS(n)A
ELS(n+1)B:ELS(n+1)A
0
synchronizer
channel (n) input
system clock
D
Q
CLK
D
CLK
Q
CH(n)IE
CH(n)F
C(n)VH:L[15:0]
Dual edge capture
mode logic
Filter*
1
channel (n)
interrupt
CH(n+1)IE
CH(n+1)F
channel (n+1)
interrupt
C(n+1)VH:L[15:0]
FTM counter
* Filtering function for dual edge capture mode is only available in the channels 0 and 2
Figure 12-207. Dual edge capture mode block diagram
The MS(n)A bit defines if the dual edge capture mode is one-shot or continuous
according to table "Mode, Edge, and Level Selection".
The ELS(n)B:ELS(n)A bits select the edge that is captured by channel (n), and ELS(n
+1)B:ELS(n+1)A bits select the edge that is captured by channel (n+1) as described in
table "Dual Edge Capture Mode — Edge Polarity Selection". If both ELS(n)B:ELS(n)A
and ELS(n+1)B:ELS(n+1)A bits select the same edge, then it is the period measurement.
If these bits select different edges, then it is a pulse width measurement.
In the dual edge capture mode, only channel (n) input is used and channel (n+1) input is
ignored.
If the selected edge by channel (n) bits is detected at channel (n) input, then CH(n)F bit is
set and the channel (n) interrupt is generated (if CH(n)IE = 1). If the selected edge by
channel (n+1) bits is detected at channel (n) input and (CH(n)F = 1), then CH(n+1)F bit is
set and the channel (n+1) interrupt is generated (if CH(n+1)IE = 1).
The C(n)VH:L registers store the value of FTM counter when the selected edge by
channel (n) is detected at channel (n) input. The C(n+1)VH:L registers store the value of
FTM counter when the selected edge by channel (n+1) is detected at channel (n) input.
In this mode, the coherency mechanism of the pair of channels ensures that data is
coherent when the C(n)VH:L and C(n+1)VH:L registers are read. Note that the
C(n)VH:L registers must be read first before reading the C(n+1)VH:L registers.
C(n)VH:L registers must be read first than C(n+1)VH:L registers.
Note
• The CH(n)F, CH(n)IE, MS(n)A, ELS(n)B, and ELS(n)A
bits are channel (n) bits.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
349
Functional Description
• The CH(n+1)F, CH(n+1)IE, MS(n+1)A, ELS(n+1)B, and
ELS(n+1)A bits are channel (n+1) bits.
• It is expected that the dual edge capture mode be used with
ELS(n)B:ELS(n)A = 0:1 or 1:0, ELS(n+1)B:ELS(n+1)A =
0:1 or 1:0 and the FTM counter in free running counter
mode. See Free running counter.
12.4.21.1 One-shot capture mode
The one-shot capture mode is selected when (FTMEN = 1), (DECAPEN = 1), and
(MS(n)A = 0). In this capture mode, only one pair of edges at the channel (n) input is
captured. The ELS(n)B:ELS(n)A bits select the first edge to be captured, and ELS(n
+1)B:ELS(n+1)A bits select the second edge to be captured.
The edge captures are enabled while DECAP bit is set. For each new measurement in
one-shot capture mode, first the CH(n)F and CH(n+1) bits must be cleared, and then the
DECAP bit must be set.
In this mode, the DECAP bit is automatically cleared by FTM when the edge selected by
channel (n+1) is captured. Therefore, while DECAP bit is set, the one-shot capture is in
process. When this bit is cleared, both edges were captured and the captured values are
ready for reading in the C(n)VH:L and C(n+1)VH:L registers.
Similarly, when the CH(n+1)F bit is set, both edges were captured and the captured
values are ready for reading in the C(n)VH:L and C(n+1)VH:L registers.
12.4.21.2 Continuous capture mode
The continuous capture mode is selected when (FTMEN = 1), (DECAPEN = 1), and
(MS(n)A = 1). In this capture mode, the edges at the channel (n) input are captured
continuously. The ELS(n)B:ELS(n)A bits select the initial edge to be captured, and
ELS(n+1)B:ELS(n+1)A bits select the final edge to be captured.
The edge captures are enabled while DECAP bit is set. For the initial use, first the
CH(n)F and CH(n+1)F bits must be cleared, and then DECAP bit must be set to start the
continuous measurements.
When the CH(n+1)F bit is set, both edges are captured and the captured values are ready
for reading in the C(n)VH:L and C(n+1)VH:L registers. The latest captured values are
always available in these registers even after the DECAP bit is cleared.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
350
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
In this mode, it is possible to clear only the CH(n+1)F bit. Therefore, when the CH(n+1)F
bit is set again, the latest captured values are available in C(n)VH:L and C(n+1)VH:L
registers.
For a new sequence of the measurements in the dual edge capture – continuous mode, it
is recommended to clear the CH(n)F and CH(n+1) bits to start new measurements.
12.4.21.3 Pulse width measurement
If the channel (n) is configured to capture rising edges (ELS(n)B:ELS(n)A = 0:1) and the
channel (n+1) to capture falling edges (ELS(n+1)B:ELS(n+1)A = 1:0), then the positive
polarity pulse width is measured. If the channel (n) is configured to capture falling edges
(ELS(n)B:ELS(n)A = 1:0) and the channel (n+1) to capture rising edges (ELS(n
+1)B:ELS(n+1)A = 0:1), then the negative polarity pulse width is measured.
The pulse width measurement can be made in one-shot capture mode (One-shot capture
mode) or continuous capture mode (Continuous capture mode).
The following figure shows an example of the dual edge capture – one-shot mode used to
measure the positive polarity pulse width. The DECAPEN bit selects the dual edge
capture mode. The DECAP bit is set to enable the measurement of next positive polarity
pulse width. The CH(n)F bit is set when the first edge of this pulse is detected, that is, the
edge selected by ELS(n)B:ELS(n)A bits. The CH(n+1)F bit is set and DECAP bit is
cleared when the second edge of this pulse is detected, that is, the edge selected by ELS(n
+1)B:ELS(n+1)A bits. Both DECAP and CH(n+1)F bits indicate when two edges of the
pulse were captured and the C(n)VH:L and C(n+1)VH:L registers are ready for reading.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
351
Functional Description
4
FTM counter
12
8
3
7
2
6
1
16
11
10
5
20
15
14
9
13
24
19
18
17
28
23
27
22
26
21
25
channel (n) input
(after the filter
channel input)
DECAPEN bit
set DECAPEN
DECAP bit
set DECAP
C(n)VH:L
1
3
5
7
9
15
2
4
6
8
10
16
19
CH(n)F bit
clear CH(n)F
C(n+1)VH:L
20
22
24
CH(n+1)F bit
clear CH(n+1)F
problem 1 problem 2
Note:
- The commands set DECAPEN, set DECAP, clear CH(n)F, and clear CH(n+1)F are made by the user.
- Problem 1: channel (n) input = 1, set DECAP, not clear CH(n)F, and clear CH(n+1)F.
- Problem 2: channel (n) input = 1, set DECAP, not clear CH(n)F, and not clear CH(n+1)F.
Figure 12-208. Dual edge capture – one-shot mode for positive polarity pulse width
measurement
The following figure shows an example of the dual edge capture – continuous mode used
to measure the positive polarity pulse width. The DECAPEN bit selects the dual edge
capture mode, so it keeps set in all operation mode. While the DECAP bit is set the
configured measurements are made. The CH(n)F bit is set when the first edge of the
positive polarity pulse is detected, that is, the edge selected by ELS(n)B:ELS(n)A bits.
The CH(n+1)F bit is set when the second edge of this pulse is detected, that is, the edge
selected by ELS(n+1)B:ELS(n+1)A bits. The CH(n+1)F bit indicates when two edges of
the pulse were captured and the C(n)VH:L and C(n+1)VH:L registers are ready for
reading.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
352
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
4
FTM counter
12
8
3
7
2
6
1
16
11
10
5
20
15
14
9
13
24
19
18
17
28
23
27
22
26
21
25
channel (n) input
(after the filter
channel input)
DECAPEN bit
set DECAPEN
DECAP bit
set DECAP
C(n)VH:L
1
3
5
7
9
11
15
19
21
23
2
4
6
8
10
12
16
20
22
24
CH(n)F bit
clear CH(n)F
C(n+1)VH:L
CH(n+1)F bit
clear CH(n+1)F
Note
- The commands set DECAPEN, set DECAP, clear CH(n)F, and clear CH(n+1)F are made by the user.
Figure 12-209. Dual edge capture – continuous mode for positive polarity pulse width
measurement
12.4.21.4 Period measurement
If the channels (n) and (n+1) are configured to capture consecutive edges of the same
polarity, then the period of the channel (n) input signal is measured. If both channels (n)
and (n+1) are configured to capture rising edges (ELS(n)B:ELS(n)A = 0:1 and ELS(n
+1)B:ELS(n+1)A = 0:1), then the period between two consecutive rising edges is
measured. If both channels (n) and (n+1) are configured to capture falling edges
(ELS(n)B:ELS(n)A = 1:0 and ELS(n+1)B:ELS(n+1)A = 1:0), then the period between
two consecutive rising edges is measured.
The period measurement can be made in one-shot capture mode (One-shot capture mode)
or continuous capture mode (Continuous capture mode).
The following figure shows an example of the dual edge capture – one-shot mode used to
measure the period between two consecutive rising edges. The DECAPEN bit selects the
dual edge capture mode, so it keeps set in all operation mode. The DECAP bit is set to
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
353
Functional Description
enable the measurement of next period. The CH(n)F bit is set when the first rising edge is
detected, that is, the edge selected by ELS(n)B:ELS(n)A bits. The CH(n+1)F bit is set
and DECAP bit is cleared when the second rising edge is detected, that is, the edge
selected by ELS(n+1)B:ELS(n+1)A bits. Both DECAP and CH(n+1)F bits indicate when
two selected edges were captured and the C(n)VH:L and C(n+1)VH:L registers are ready
for reading.
4
8
3
FTM counter
2
11
6
1
16
12
7
10
5
20
15
13
28
23
18
14
9
24
19
27
22
17
21
26
25
channel (n) input
(after the filter
channel input)
DECAPEN bit
set DECAPEN
DECAP bit
set DECAP
C(n)VH:L
1
3
5
6
7
14
17
2
4
6
7
9
15
18
18
20
27
23
26
CH(n)F bit
clear CH(n)F
C(n+1)VH:L
20
CH(n+1)F bit
clear CH(n+1)F
problem 1
problem 2
problem 3
Note
- The commands set DECAPEN, set DECAP, clear CH(n)F, and clear CH(n+1)F are made by the user.
- Problem 1: channel (n) input = 0, set DECAP, not clear CH(n)F, and not clear CH(n+1)F.
- Problem 2: channel (n) input = 1, set DECAP, not clear CH(n)F, and clear CH(n+1)F.
- Problem 3: channel (n) input = 1, set DECAP, not clear CH(n)F, and not clear CH(n+1)F.
Figure 12-210. Dual edge capture – one-shot mode to measure of the period between
two consecutive rising edges
The following figure shows an example of the dual edge capture – continuous mode used
to measure the period between two consecutive rising edges. The DECAPEN bit selects
the dual edge capture mode, so it keeps set in all operation mode. While the DECAP bit
is set the configured measurements are made. The CH(n)F bit is set when the first rising
edge is detected, that is, the edge selected by ELS(n)B:ELS(n)A bits. The CH(n+1)F bit
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
354
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
is set when the second rising edge is detected, that is, the edge selected by ELS(n
+1)B:ELS(n+1)A bits. The CH(n+1)F bit indicates when two edges of the period were
captured and the C(n)VH:L and C(n+1)VH:L registers are ready for reading.
4
FTM counter
12
8
3
2
6
1
16
11
7
9
24
19
14
10
5
20
15
18
13
28
23
27
22
17
21
26
25
channel (n) input
(after the filter
channel input)
DECAPEN bit
set DECAPEN
DECAP bit
set DECAP
C(n)VH:L
1
3
5
6
7
8
9
10 11
12
14 15
16
18 19
20 21 22 23
24
26
2
4
6
7
8
9
10 11 12
13
15 16
17
19 20 21 22 23 24
25
27
CH(n)F bit
clear CH(n)F
C(n+1)VH:L
CH(n+1)F bit
clear CH(n+1)F
Note:
- The commands set DECAPEN, set DECAP, clear CH(n)F, and clear CH(n+1)F are made by the user.
Figure 12-211. Dual edge capture – continuous mode to measure of the period between
two consecutive rising edges
12.4.21.5 Read coherency mechanism
The dual edge capture mode implements a read coherency mechanism between the FTM
counter value captured in C(n)VH:L and C(n+1)VH:L registers. The read coherency
mechanism is illustrated in the following figure. In this example, the channels (n) and (n
+1) are in dual edge capture – continuous mode for positive polarity pulse width
measurement. Thus, the channel (n) is configured to capture the FTM counter value when
there is a rising edge at channel (n) input signal, and channel (n+1) to capture the FTM
counter value when there is a falling edge at channel (n) input signal.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
355
Functional Description
When a rising edge occurs in the channel (n) input signal, the FTM counter value is
captured into channel (n) capture buffer. The channel (n) capture buffer value is
transferred to C(n)VH:L registers when a falling edge occurs in the channel (n) input
signal. C(n)VH:L registers have the FTM counter value when the previous rising edge
occurred, and the channel (n) capture buffer has the FTM counter value when the last
rising edge occurred.
When a negative edge occurs in the channel (n) input signal, the FTM counter value is
captured into channel (n+1) capture buffer. The channel (n+1) capture buffer value is
transferred to C(n+1)VH:L registers when the first byte of C(n)VH:L registers is read.
In the following figure, the read of C(n)VH returns the FTM counter high byte value
when the event 1 occurred, and the read of C(n+1)VL returns the FTM counter low byte
value when the event 1 occurred. The read of C(n+1)VL returns the FTM counter low
byte value when the event 2 occurred, and the read of C(n+1)VH returns the FTM
counter high byte value when the event 2 occurred.
event 1
FTM counter
1
event 2
2
event 3
3
event 4
4
event 5
5
event 6
event 8
event 7
6
7
8
event 9
9
channel (n) input
(after the filter
channel input)
channel (n)
capture buffer
C(n)VH:L
channel (n+1)
capture buffer
1
3
1
2
5
7
9
3
5
7
4
6
8
C(n+1)VH:L
2
channel (n)
read buffer
1
channel (n+1)
read buffer
2
read C(n)VH
read C(n)VL
read C(n+1)VL
read C(n+1)VH
Figure 12-212. Dual edge capture mode read coherency mechanism
C(n)VH:L registers must be read prior to C(n+1)VH:L registers in dual edge capture oneshot and continuous modes for the read coherency mechanism works properly. Either the
high or low bytes of C(n)VH:L and C(n+1)VH:L registers can be accessed first; however,
the C(n)VH:L registers must be read prior to the C(n+1)VH:L registers in dual edge
capture oneshot and continuous modes for the read coherency mechanism to work
properly.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
356
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
12.4.22 TPM emulation
This section describe the FTM features that are selected according to the FTMEN bit.
12.4.22.1 MODH:L and CnVH:L synchronization
If (FTMEN = 0), then the MODH:L and CnVH:L registers are updated according to the
Update of the registers with write buffers and they are not updated by PWM
synchronization.
If (FTMEN = 1), then the MODH:L and CnVH:L registers are updated only by PWM
synchronization (PWM synchronization).
12.4.22.2 Free running counter
If (FTMEN = 0), then the FTM counter is a free running counter when (MODH:L =
0x0000) or (MODH:L = 0xFFFF).
If (FTMEN = 1), then the FTM counter is a free running counter when (CPWMS = 0),
(CNTINH:L = 0x0000), and (MODH:L = 0xFFFF).
12.4.22.3 Write to SC
If (FTMEN = 0), then a write to the SC register resets the write coherency mechanism of
MODH:L registers.
If (FTMEN = 1), then a write to the SC register does not reset the write coherency
mechanism of MODH:L registers.
12.4.22.4 Write to CnSC
If (FTMEN = 0), then a write to the CnSC register resets the write coherency mechanism
of CnVH:L registers.
If (FTMEN = 1), then a write to the CnSC register does not reset the write coherency
mechanism of CnVH:L registers.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
357
Reset overview
12.4.23 BDM mode
When BDM mode is active, the FlexTimer counter and the channels output are frozen.
However, the value of FlexTimer counter or the channels output are modified in BDM
mode when:
• A write of any value to the CNTH or CNTL registers (Counter reset) resets the FTM
counter to the value of CNTINH:L and the channels output to their initial value,
except for channels in output compare mode.
• The PWM synchronization with REINIT = 1 (see FTM counter synchronization)
resets the FTM counter to the value of CNTINH:L registers and the channels output
to their initial value, except for channels in output compare mode.
• The initialization (Initialization) forces the value of the CHnOI bit to the channel (n)
output.
Note
Do not use the above cases together with fault control (Fault
control). If fault control is enabled and the fault condition is at
the enabled fault input, these cases reset the FTM counter to the
CNTINH:L value and the channels output to their initial value.
12.5 Reset overview
The FTM is reset whenever any chip reset occurs.
When the FTM exits from reset:
• The FTM counter and the prescaler counter are zero and are stopped (CLKS[1:0] =
0b00)
• The timer overflow interrupt is zero (Timer overflow interrupt)
• The channels interrupts are zero (Channel (n) interrupt)
• The fault interrupt is zero (Fault interrupt)
• The channels are in input capture mode (Input capture mode)
• The channels outputs are zero
• The channels pins are not controlled by FTM (ELS(n)B:ELS(n)A = 0b00). See table
"Mode, Edge, and Level Selection"
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
358
Freescale Semiconductor, Inc.
Chapter 12 FlexTimer Module (FTM)
The following figure shows the FTM behavior after the reset. At the reset (item 1), the
FTM counter is disabled (see table "FTM Clock Source Selection"), its value is updated
to zero and the pins are not controlled by FTM (table "Mode, Edge, and Level
Selection").
After the reset, the FTM should be configured (item 2). It is necessary to define the FTM
counter mode, the FTM counting limits (MODH:L and CNTINH:L registers value), the
channels mode and CnVH:L registers value according to the channels mode.
Because of this, you should write any value to CNTH or CNTL registers (item 3). This
write updates the FTM counter with the value of CNTINH:L and the channels output
with its initial value (except for channels in output compare mode) (Counter reset).
The next step is to select the FTM counter clock by the CLKS[1:0] bits (item 4). It is
important to highlight that the pins are controlled only by FTM when CLKS[1:0] bits are
different from zero (table "Mode, Edge, and Level Selection").
(3) write any value to
CNTH or CNTL registers
(1) FTM reset
FTM counter
CLKS[1:0]
(4) write 0b01 to CLKS[1:0]
XXXX
0x0000
XX
0b00
0x0010
0x0011 0x0012 0x0013 0x0014 0x0015 0x0016 0x0017 0x0018 . . .
0b01
channel (n) output
(2) FTM configuration
channel (n) pin is controlled by FTM
Note
– CNTINH:L = 0x0010
– Channel (n) is in low-true combine mode with CNTINH:L < C(n)VH:L < C(n+1)VH:L < MODH:L
– C(n)VH:L = 0x0015
Figure 12-213. FTM behavior after the reset when the channel (n) is in combine mode
The following figure shows an example when the channel (n) is in output compare mode
and the channel (n) output is toggled when there is a match. In the output compare mode,
the channel output is not updated to its initial value when there is a write to CNTH or
CNTL registers (item 3). In this case, it is recommended to use the initialization
(Initialization) to update the channel output to the selected value (item 4).
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
359
FTM Interrupts
(3) write any value to
CNTH or CNTL registers
(1) FTM reset
FTM counter
CLKS[1:0]
(4) use of initialization to update
the channel output to the zero
(5) write 0b01 to CLKS[1:0]
XXXX
0x0000
XX
0b00
0x0010
0x0011 0x0012 0x0013 0x0014 0x0015 0x0016 0x0017 . . .
0b01
channel (n) output
(2) FTM configuration
channel (n) pin is controlled by FTM
Note
– CNTINH:L = 0x0010
– Channel (n) is in output compare and the channel (n) output is toggled when there is a match
– C(n)VH:L = 0x0014
Figure 12-214. FTM behavior after the reset when the channel (n) is in output compare
mode
12.6 FTM Interrupts
12.6.1 Timer overflow interrupt
The timer overflow interrupt is generated when (TOIE = 1) and (TOF = 1).
12.6.2 Channel (n) interrupt
The channel (n) interrupt is generated when (CHnIE = 1) and (CHnF = 1).
12.6.3 Fault interrupt
The fault interrupt is generated when (FAULTIE = 1) and (FAULTF = 1).
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
360
Freescale Semiconductor, Inc.
Chapter 13
8-bit modulo timer (MTIM)
13.1 Introduction
The MTIM is a simple 8-bit timer with several software selectable clock sources and a
programmable interrupt.
For MCUs that have more than one MTIM, the MTIMs are collectively called MTIMx.
For example, MTIMx for an MCU with two MTIMs would refer to MTIM1 and MTIM2.
For MCUs that have exactly one MTIM, it is always referred to as MTIM.
13.2 Features
Timer system features include:
• 8-bit up-counter:
• Free-running or 8-bit modulo limit
• Software controllable interrupt on overflow
• Counter reset bit (TRST)
• Counter stop bit (TSTP)
• Four software selectable clock sources for input to prescaler:
• System bus clock - rising edge
• Fixed frequency clock (XCLK) - rising edge
• External clock source on the TCLK pin - rising edge
• External clock source on the TCLK pin - falling edge
• Nine selectable clock prescale values:
• Clock source divide by 1, 2, 4, 8, 16, 32, 64, 128, or 256
13.3 Modes of operation
This section defines the MTIM's operation in stop, wait, and background debug modes.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
361
Block diagram
13.3.1 MTIM in wait mode
The MTIM continues to run in wait mode if enabled before executing the WAIT
instruction. Therefore, the MTIM can be used to bring the MCU out of wait mode if the
timer overflow interrupt is enabled. For lowest possible current consumption, the MTIM
must be stopped by software if not needed as an interrupt source during wait mode.
13.3.2 MTIM in stop mode
The MTIM is disabled in stop mode, regardless of the settings before executing the STOP
instruction. Therefore, the MTIM cannot be used as a wakeup source from stop modes.
If stop3 is exited with a reset, the MTIM will be put into its reset state. If stop3 is exited
with an interrupt, the MTIM continues from the state it was in when stop3 was entered. If
the counter was active upon entering stop3, the count will resume from the current value.
13.3.3 MTIM in active background mode
The MTIM suspends all counting until the microcontroller returns to normal user
operating mode. Counting resumes from the suspended value as long as an MTIM reset
did not occur, MTIM_SC[TRST] written to a 1 or MTIM_MOD written.
13.4 Block diagram
The block diagram for the modulo timer module is shown in the following figure.
BUSCLK
XCLK
TCLK
MTIM_
INTERRU
PT
SYNC
CLOCK
SOURCE
SELECT
PRESCALE
AND SELECT
DIVIDE BY
CLKS
PS
8-BIT COUNTER
(MTIM_CNT)
TRST
TSTP
8-BIT COMPARATOR
TOF
TOIE
8-BIT MODULO
(MTIM_MOD)
Figure 13-1. Modulo timer (MTIM) block diagram
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
362
Freescale Semiconductor, Inc.
Chapter 13 8-bit modulo timer (MTIM)
13.5 External signal description
The MTIM includes one external signal, TCLK, used to input an external clock when
selected as the MTIM clock source. The signal properties of TCLK are shown in the
following table.
Table 13-1. MTIM external signal
Signal
Function
TCLK
I/O
External clock source input into MTIM
I
The TCLK input must be synchronized by the bus clock. Also, variations in duty cycle
and clock jitter must be accommodated. Therefore, the TCLK signal must be limited to
one-fourth of the bus frequency.
The TCLK pin can be muxed with a general-purpose port pin.
13.6 Register definition
MTIM memory map
Absolute
address
(hex)
Width
Access
(in bits)
Register name
Reset value
Section/
page
18
MTIM Status and Control Register (MTIM0_SC)
8
R/W
10h
13.6.1/363
19
MTIM Clock Configuration Register (MTIM0_CLK)
8
R/W
00h
13.6.2/364
1A
MTIM Counter Register (MTIM0_CNT)
8
R
00h
13.6.3/365
1B
MTIM Modulo Register (MTIM0_MOD)
8
R/W
00h
13.6.4/366
13.6.1 MTIM Status and Control Register (MTIMx_SC)
MTIM_SC contains the overflow status flag and control bits that are used to configure
the interrupt enable, reset the counter, and stop the counter.
Address: 18h base + 0h offset = 18h
Bit
Read
Write
Reset
7
6
TOF
TOIE
0
0
5
0
TRST
0
4
3
2
TSTP
1
1
0
0
0
0
0
0
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
363
Register definition
MTIMx_SC field descriptions
Field
7
TOF
Description
MTIM Overflow Flag
This bit is set when the MTIM counter register overflows to 0x00 after reaching the value in the MTIM
modulo register. Clear TOF by reading the MTIM_SC register while TOF is set, then write a 0 to TOF. TOF
is also cleared when TRST is written to a 1 or when any value is written to the MTIM_MOD register.
0
1
6
TOIE
MTIM Overflow Interrupt Enable
This read/write bit enables MTIM overflow interrupts. If TOIE is set, then an interrupt is generated when
TOF = 1. Reset clears TOIE. Do not set TOIE if TOF = 1. Clear TOF first, then set TOIE.
0
1
5
TRST
When a 1 is written to this write-only bit, the MTIM counter register resets to 0x00 and TOF is cleared.
Reading this bit always returns 0.
No effect. MTIM counter remains at current state.
MTIM counter is reset to 0x00.
MTIM Counter Stop
When set, this read/write bit stops the MTIM counter at its current value. Counting resumes from the
current value when TSTP is cleared. Reset sets TSTP to prevent the MTIM from counting.
0
1
Reserved
TOF interrupts are disabled. Use software polling.
TOF interrupts are enabled.
MTIM Counter Reset
0
1
4
TSTP
MTIM counter has not reached the overflow value in the MTIM modulo register.
MTIM counter has reached the overflow value in the MTIM modulo register.
MTIM counter is active.
MTIM counter is stopped.
This field is reserved.
This read-only field is reserved and always has the value 0.
13.6.2 MTIM Clock Configuration Register (MTIMx_CLK)
MTIM_CLK contains the clock select bits (CLKS) and the prescaler select bits (PS).
Address: 18h base + 1h offset = 19h
Bit
Read
Write
Reset
7
6
5
0
0
4
3
2
CLKS
0
0
1
0
0
0
PS
0
0
0
MTIMx_CLK field descriptions
Field
7–6
Reserved
Description
This field is reserved.
This read-only field is reserved and always has the value 0.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
364
Freescale Semiconductor, Inc.
Chapter 13 8-bit modulo timer (MTIM)
MTIMx_CLK field descriptions (continued)
Field
5–4
CLKS
Description
Clock Source Select
These two read/write bits select one of four different clock sources as the input to the MTIM prescaler.
Changing the clock source while the counter is active does not clear the counter. The count continues with
the new clock source. Reset clears CLKS to 000b.
00
01
10
11
PS
Encoding 0. Bus clock (BUSCLK).
Encoding 1. Fixed-frequency clock (XCLK).
Encoding 2. External source (TCLK pin), falling edge.
Encoding 3. External source (TCLK pin), rising edge.
Clock Source Prescaler
These four read/write bits select one of nine outputs from the 8-bit prescaler. Changing the prescaler value
while the counter is active does not clear the counter. The count continues with the new prescaler value.
Reset clears PS to 0000b.
0000
0001
0010
0011
0100
0101
0110
0111
1000
Others
Encoding 0. MTIM clock source.
Encoding 1. MTIM clock source/2.
Encoding 2. MTIM clock source/4.
Encoding 3. MTIM clock source/8.
Encoding 4. MTIM clock source/16.
Encoding 5. MTIM clock source/32.
Encoding 6. MTIM clock source/64.
Encoding 7. MTIM clock source/128.
Encoding 8. MTIM clock source/256.
Default to MTIM clock source/256.
13.6.3 MTIM Counter Register (MTIMx_CNT)
MTIM_CNT is the read-only value of the current MTIM count of the 8-bit counter.
Address: 18h base + 2h offset = 1Ah
Bit
7
6
5
4
Read
3
2
1
0
0
0
0
0
COUNT
Write
Reset
0
0
0
0
MTIMx_CNT field descriptions
Field
COUNT
Description
MTIM Count
These eight read-only bits contain the current value of the 8-bit counter. Writes have no effect to this
register. Reset clears the count to 0x00.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
365
Functional description
13.6.4 MTIM Modulo Register (MTIMx_MOD)
Address: 18h base + 3h offset = 1Bh
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
MOD
0
0
0
0
MTIMx_MOD field descriptions
Field
MOD
Description
MTIM Modulo
These eight read/write bits contain the modulo value used to reset the count and set TOF. A value of 0x00
puts the MTIM in free-running mode. Writing to MTIM_MOD resets the COUNT to 0x00 and clears TOF.
Reset sets the modulo to 0x00.
13.7 Functional description
The MTIM consists of a main 8-bit up-counter with an 8-bit modulo register, a clock
source selector, and a prescaler block with nine selectable values. The module also
contains software-selectable interrupt logic.
The MTIM counter (MTIM_CNT) has three modes of operation: stopped, free-running,
and modulo. Out of reset, the counter is stopped. If the counter is started without writing
a new value to the modulo register, then the counter will be in free-running mode. The
counter is in modulo mode when a value other than 0x00 is in the modulo register while
the counter is running.
After any MCU reset, the counter is stopped and reset to 0x00, and the modulus is set to
0x00. The bus clock is selected as the default clock source and the prescale value is
divide by 1. To start the MTIM in free-running mode, simply write to the MTIM status
and control register (MTIM_SC), and clear the MTIM stop bit (TSTP).
Four clock sources are software selectable: the internal bus clock, the fixed frequency
clock (XCLK), and an external clock on the TCLK pin, selectable as incrementing on
either rising or falling edges. The MTIM clock select bits, CLKS1:CLKS0, in
MTIM_CLK are used to select the desired clock source. If the counter is active
(SC[TSTP] = 0) when a new clock source is selected, the counter will continue counting
from the previous value using the new clock source.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
366
Freescale Semiconductor, Inc.
Chapter 13 8-bit modulo timer (MTIM)
Nine prescale values are software selectable: clock source divided by 1, 2, 4, 8, 16, 32,
64, 128, or 256. The prescaler select bits (CLK[PS]) in MTIM_CLK select the desired
prescale value. If the counter is active (SC[TSTP] = 0) when a new prescaler value is
selected, the counter will continue counting from the previous value using the new
prescaler value.
The MTIM modulo register (MTIM_MOD) allows the overflow compare value to be set
to any value from 0x01 to 0xFF. Reset clears the modulo value to 0x00, which results in
a free running counter.
When the counter is active (SC[TSTP] = 0), the counter increments at the selected rate
until the count matches the modulo value. When these values match, the counter
overflows to 0x00 and continues counting. The MTIM overflow flag (SC[TOF]) is set
whenever the counter overflows. The flag sets on the transition from the modulo value to
0x00. Writing to MTIM_MOD while the counter is active resets the counter to 0x00 and
clears SC[TOF].
Clearing SC[TOF] is a two-step process. The first step is to read the MTIM_SC register
while SC[TOF] is set. The second step is to write a 0 to SC[TOF]. If another overflow
occurs between the first and second step, the clearing process is reset and SC[TOF] will
remain set after the second step is performed. This will prevent the second occurrence
from being missed. SC[TOF] is also cleared when a 1 is written to SC[TRST] or when
any value is written to the MTIM_MOD register.
The MTIM allows for an optional interrupt to be generated whenever SC[TOF] is set. To
enable the MTIM overflow interrupt, set the MTIM overflow interrupt enable bit
(SC[TOIE]). SC[TOIE] must never be written to a 1 while SC[TOF] = 1. Instead,
SC[TOF] must be cleared first, then the SC[TOIE] can be set to 1.
13.7.1 MTIM operation example
This section shows an example of the MTIM operation as the counter reaches a matching
value from the modulo register.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
367
Functional description
selected
clock source
MTIM clock
(PS=%0010)
MTIM_CNT
MTIM_MOD:
0xA7
0xA8
0xA9
0xAA
0x00
0x01
0xAA
Figure 13-10. MTIM counter overflow example
In the above example, the selected clock source could be any of the four possible choices.
The prescaler is set to CLK[PS] = 0010b or divide-by-4. The modulo value in the
MTIM_MOD register is set to 0xAA. When the counter, MTIM_CNT, reaches the
modulo value of 0xAA, it overflows to 0x00 and continues counting. The timer overflow
flag, SC[TOF], sets when the counter value changes from 0xAA to 0x00. An MTIM
overflow interrupt is generated when SC[TOF] is set, if SC[TOIE] = 1.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
368
Freescale Semiconductor, Inc.
Chapter 14
Real-time counter (RTC)
14.1 Introduction
The real-time counter (RTC) consists of one 16-bit counter, one 16-bit comparator,
several binary-based and decimal-based prescaler dividers, three clock sources, one
programmable periodic interrupt, and one programmable external toggle pulse output.
This module can be used for time-of-day, calendar or any task scheduling functions. It
can also serve as a cyclic wake-up from low-power modes, Stop and Wait without the
need of external components.
14.2 Features
Features of the RTC module include:
• 16-bit up-counter
• 16-bit modulo match limit
• Software controllable periodic interrupt on match
• Software selectable clock sources for input to prescaler with programmable 16 bit
prescaler
• OSC 32.768KHz nominal.
• LPO (~1 kHz)
• Bus clock
14.2.1 Modes of operation
This section defines the RTC operation in Stop, Wait, and Background Debug modes.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
369
External signal description
14.2.1.1 Wait mode
The RTC continues to run in Wait mode if enabled before executing the WAIT
instruction. Therefore, the RTC can be used to bring the MCU out of Wait mode if the
real-time interrupt is enabled. For lowest possible current consumption, the RTC must be
stopped by software if not needed as an interrupt source during Wait mode.
14.2.1.2 Stop modes
The RTC continues to run in Stop mode if the RTC is enabled before executing the STOP
instruction. Therefore, the RTC can be used to bring the MCU out of stop modes with no
external components, if the real-time interrupt is enabled.
14.2.2 Block diagram
The block diagram for the RTC module is shown in the following figure.
RTCMOD
16-bit modulo
16-bit latch
16-bit modulo
1
16-bit comparator
EXT CLK
LPO CLK
CLOCK
DIVIDER
BUS CLK
BUS CLK
RTIF
D Q
RTC
INTERRUPT
REQUEST
R
16-bit counter
RTIE
D Q
Q
RTCLKS
RTCPS
OUTPUT
TOGLE
RTCO
RTCCNT
Write 1 to RTIF
Figure 14-1. Real-time counter (RTC) block diagram
14.3 External signal description
RTCO is the output of RTC. After MCU reset, the RTC_SC1[RTCO] is set to high.
When the counter overflows, the output is toggled.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
370
Freescale Semiconductor, Inc.
Chapter 14 Real-time counter (RTC)
14.4 Register definition
The RTC includes a status and control register, a 16-bit counter register, and a 16-bit
modulo register.
RTC memory map
Absolute
address
(hex)
Width
Access
(in bits)
Register name
Reset value
Section/
page
306A
RTC Status and Control Register 1 (RTC_SC1)
8
R/W
00h
14.4.1/371
306B
RTC Status and Control Register 2 (RTC_SC2)
8
R/W
00h
14.4.2/372
306C
RTC Modulo Register: High (RTC_MODH)
8
R/W
00h
14.4.3/373
306D
RTC Modulo Register: Low (RTC_MODL)
8
R/W
00h
14.4.4/373
306E
RTC Counter Register: High (RTC_CNTH)
8
R
00h
14.4.5/374
306F
RTC Counter Register: Low (RTC_CNTL)
8
R
00h
14.4.6/374
14.4.1 RTC Status and Control Register 1 (RTC_SC1)
RTC_SC1 contains the real-time interrupt status flag (RTIF), and the toggle output
enable bit (RTCO).
Address: 306Ah base + 0h offset = 306Ah
Bit
Read
Write
Reset
7
6
5
4
RTIF
RTIE
0
RTCO
0
0
0
0
3
2
1
0
0
0
0
0
0
RTC_SC1 field descriptions
Field
7
RTIF
Description
Real-Time Interrupt Flag
This status bit indicates the RTC counter register reached the value in the RTC modulo register. Writing a
logic 0 has no effect. Writing a logic 1 clears the bit and the real-time interrupt request. Reset clears RTIF
to 0.
0
1
6
RTIE
RTC counter has not reached the value in the RTC modulo register.
RTC counter has reached the value in the RTC modulo register.
Real-Time Interrupt Enable
This read/write bit enables real-time interrupts. If RTIE is set, then an interrupt is generated when RTIF is
set. Reset clears RTIE to 0.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
371
Register definition
RTC_SC1 field descriptions (continued)
Field
Description
0
1
5
Reserved
4
RTCO
This field is reserved.
This read-only field is reserved and always has the value 0.
Real-Time Counter Output
The read/write bit enables real-time to toggle output on pinout. If this bit is set, the RTCO pinout will be
toggled when RTC counter overflows.
0
1
Reserved
Real-time interrupt requests are disabled. Use software polling.
Real-time interrupt requests are enabled.
Real-time counter output disabled.
Real-time counter output enabled.
This field is reserved.
This read-only field is reserved and always has the value 0.
14.4.2 RTC Status and Control Register 2 (RTC_SC2)
RTC_SC2 contains the clock select bits (RTCLKS) and the prescaler select bits
(RTCPS).
Address: 306Ah base + 1h offset = 306Bh
Bit
Read
Write
Reset
7
6
5
3
2
0
RTCLKS
0
4
0
0
1
0
RTCPS
0
0
0
0
0
RTC_SC2 field descriptions
Field
7–6
RTCLKS
Description
Real-Time Clock Source Select
These two read/write bits select the clock source input to the RTC prescaler. Changing the clock source
clears the prescaler and RTCCNT counters. Reset clears RTCLKS to 00.
00
01
10
11
5–3
Reserved
RTCPS
External clock source.
Real-time clock source is 1 kHz.
Bus clock.
Bus clock.
This field is reserved.
This read-only field is reserved and always has the value 0.
Real-Time Clock Prescaler Select
These four read/write bits select binary-based or decimal-based divide-by values for the clock source.
Changing the prescaler value clears the prescaler and RTCCNT counters. Reset clears RTCPS to 0000.
000
001
Off
If RTCLKS = x0, it is 1; if RTCLKS = x1, it is 128.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
372
Freescale Semiconductor, Inc.
Chapter 14 Real-time counter (RTC)
RTC_SC2 field descriptions (continued)
Field
Description
010
011
100
101
110
111
If RTCLKS = x0, it is 2; if RTCLKS = x1, it is 256.
If RTCLKS = x0, it is 4; if RTCLKS = x1, it is 512.
If RTCLKS = x0, it is 8; if RTCLKS = x1, it is 1024.
If RTCLKS = x0, it is 16; if RTCLKS = x1, it is 2048.
If RTCLKS = x0, it is 32; if RTCLKS = x1, it is 100.
If RTCLKS = x0, it is 64; if RTCLKS = x1, it is 1000.
14.4.3 RTC Modulo Register: High (RTC_MODH)
RTC_MODH, together with RTC_MODL, indicates the value of the 16-bit modulo
value.
Address: 306Ah base + 2h offset = 306Ch
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
MODH
0
0
0
0
RTC_MODH field descriptions
Field
MODH
Description
RTC Modulo High
These sixteen read/write bits, MODH and MODL, contain the modulo value used to reset the count to
0x0000 upon a compare match and set the RTIF status bit. A value of 0x00 of the MODH an MODL sets
the RTIF bit on each rising edge of the prescaler output. Reset sets the modulo to 0x00.
14.4.4 RTC Modulo Register: Low (RTC_MODL)
RTC_MODL, together with RTC_MODH, indicates the value of the 16-bit modulo
value.
Address: 306Ah base + 3h offset = 306Dh
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
MODL
0
0
0
0
RTC_MODL field descriptions
Field
MODL
Description
RTC Modulo Low
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
373
Register definition
RTC_MODL field descriptions (continued)
Field
Description
These sixteen read/write bits, MODH and MODL, contain the modulo value used to reset the count to
0x0000 upon a compare match and set the RTIF status bit. A value of 0x00 of the MODH an MODL sets
the RTIF bit on each rising edge of the prescaler output. Reset sets the modulo to 0x00.
14.4.5 RTC Counter Register: High (RTC_CNTH)
RTC_CNTH, together with RTC_CNTL, indicates the read-only value of the current
RTC count of the 16-bit counter.
NOTE
The RTC_CNTL must be read first to lock the counter and then
read RTC_CNTH to correctly read 16-bit counter.
Address: 306Ah base + 4h offset = 306Eh
Bit
7
6
5
4
Read
3
2
1
0
0
0
0
0
CNTH
Write
Reset
0
0
0
0
RTC_CNTH field descriptions
Field
CNTH
Description
RTC Count High
CNTH and CNTL contain the current value of the 16-bit counter. Writes have no effect to this register.
Reset or writing different values to RTCLKS and RTCPS clear the count to 0x00.
14.4.6 RTC Counter Register: Low (RTC_CNTL)
RTC_CNTL, together with RTC_CNTH, indicates the read-only value of the current
RTC count of the 16-bit counter.
Address: 306Ah base + 5h offset = 306Fh
Bit
7
6
5
4
Read
3
2
1
0
0
0
0
0
CNTL
Write
Reset
0
0
0
0
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
374
Freescale Semiconductor, Inc.
Chapter 14 Real-time counter (RTC)
RTC_CNTL field descriptions
Field
CNTL
Description
RTC Count Low
CNTH and CNTL contain the current value of the 16-bit counter. Writes have no effect to this register.
Reset or writing different values to RTCLKS and RTCPS clear the count to 0x00.
14.5 Functional description
The RTC is composed of a main 16-bit up-counter with a 16-bit modulo register, a clock
source selector, and a prescaler block with binary-based and decimal-based selectable
values. The module also contains software selectable interrupt logic and toggle logic for
pinout.
After any MCU reset, the counter is stopped and reset to 0x0000, the modulus register is
set to 0x0000, and the prescaler is off. The external oscillator clock is selected as the
default clock source. To start the prescaler, write any value other than 0 to the Prescaler
Select field (RTC_SC2[RTCPS]).
The clock sources are software selectable: the external oscillator (OSC), on-chip low
power oscillator (LPO), and bus clock. The RTC Clock Select field
(RTC_SC2[RTCLKS]) is used to select the desired clock source to the prescaler dividers.
If a different value is written to RTC_SC2[RTCLKS], the prescaler and CNTH and
RTC_CNTL counters are reset to 0x00.
RTC_SC2[RTCPS] and RTC_SC2[RTCLKS] select the desired divide-by value. If a
different value is written to RTC_SC2[RTCPS], the prescaler and RTCCNT counters are
reset to 0x00. The following table shows different prescaler period values.
Table 14-8. Prescaler period
RTCPS
32768Hz OSC clock
LPO clock (1 kHz)
Bus clock (8 MHz)
Bus clock (8 MHz)
source prescaler
source prescaler
source prescaler
source prescaler
period (RTCLKS = 00) period (RTCLKS = 01) period (RTCLKS = 10) period (RTCLKS = 11)
000
Off
Off
Off
Off
001
30.5176 µs
128 ms
125 ns
16 µs
010
61.0351 µs
256 ms
250 ns
32 µs
011
122.0703 µs
512 ms
500 ns
64 µs
100
244.1406 µs
1024 ms
1 µs
128 µs
101
488.28125 µs
2048 ms
2 µs
256 µs
110
976.5625 µs
100 ms
4 µs
12.5 µs
111
1.9531 ms
1s
8 µs
125 µs
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
375
Functional description
The RTC Modulo register (RTC_MODH and RTC_MODL) allows the compare value to
be set to any value from 0x0000 to 0xFFFF. When the counter is active, the counter
increments at the selected rate until the count matches the modulo value. When these
values match, the counter resets to 0x0000 and continues counting. The Real-Time
Interrupt Flag (RTC_SC1[RTIF]) is set whenever a match occurs. The flag sets on the
transition from the modulo value to 0x0000. The modulo value written to RTC_MODH
and RTC_MODL is latched until the RTC counter overflows or RTC_SC2[RTCPS] is
selected nonzero.
The RTC allows for an interrupt to be generated whenever RTC_SC1[RTIF] is set. To
enable the real-time interrupt, set the Real-Time Interrupt Enable field
(RTC_SC1[RTIE]). RTC_SC1[RTIF] is cleared by writing a 1 to RTC_SC1[RTIF].
The RTC also allows an output to external pinout by toggling the level.
RTC_SC1[RTCO] must be set to enable toggling external pinout. The level depends on
the previous state of the pinout when the counter overflows if this function is active.
14.5.1 RTC operation example
This section shows an example of the RTC operation as the counter reaches a matching
value from the modulo register.
OSC (32768Hz)
RTCLKS = 00b
RTC Clock
RTCPS = 001b
RTCCNT
RTCPS = 001b
32765
32766
32767
0
1
2
3
4
16-bit modulo
32767
32767
32767
32766
32766
32766
32766
32766
RTCMOD
32766
32766
32766
RTIF
RTCO
Figure 14-8. RTC counter overflow example
In the above example, the external clock source is selected. The prescaler is set to
RTC_SC2[RTCPS] = 001b or passthrough. The actual modulo value used by 16-bit
comparator is 32767, when the modulo value in the RTC_MODH and RTC_MODL
registers is set to 32766. When the counter, RTC_CNTH and RTC_CNTL, reaches the
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
376
Freescale Semiconductor, Inc.
Chapter 14 Real-time counter (RTC)
modulo value of 32767, the counter overflows to 0x00 and continues counting. The
modulo value is updated by fetching from RTC_MODH and RTC_MODL registers. The
real-time interrupt flag, RTC_SC1[RTIF], sets when the counter value changes from
0x7FFF to 0x0000. The RTC_SC1[RTCO] toggles as well when the RTC_SC1[RTIF] is
set.
14.6 Initialization/application information
This section provides example code to give some basic direction to a user on how to
initialize and configure the RTC module. The example software is implemented in C
language.
The example below shows how to implement time of day with the RTC using the OSC
clock source to achieve the lowest possible power consumption.
Example: 14.6.1 Software calendar implementation in RTC ISR
/* Initialize the elapsed time counters */
Seconds = 0;
Minutes = 0;
Hours = 0;
Days=0;
/* Configure RTC to interrupt every 1 second from OSC (32.768KHz) clock source */
RTC_MOD = 511; // overflow every 32 times
RTC_SC2 = RTC_SC2_RTCPS_MASK; // external 32768 clock selected with 1/64 predivider.
RTC_SC1 = RTC_SC1_RTIF_MASK | RTC_SC1_RTIE_MASK; // interrupt cleared and enabled
/**********************************************************************
Function Name : RTC_ISR
Notes : Interrupt service routine for RTC module.
**********************************************************************/
void RTC_ISR(void)
{
/* Clears the interrupt flag, RTIF, and interrupt request */
RTC_SC1 |= RTC_SC1_RTIF_MASK;
/* RTC interrupts every 1 Second */
Seconds++;
/* 60 seconds in a minute */
if (Seconds > 59)
{
Minutes++;
Seconds = 0;
}
/* 60 minutes in an hour */
if (Minutes > 59)
{
Hours++;
Minutes = 0;
}
/* 24 hours in a day */
if (Hours > 23)
{
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
377
Initialization/application information
Days ++;
Hours = 0;
}
}
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
378
Freescale Semiconductor, Inc.
Chapter 15
Serial communications interface (SCI)
15.1 Introduction
15.1.1 Features
Features of SCI module include:
• Full-duplex, standard non-return-to-zero (NRZ) format
• Double-buffered transmitter and receiver with separate enables
• Programmable baud rates (13-bit modulo divider)
• Interrupt-driven or polled operation:
• Transmit data register empty and transmission complete
• Receive data register full
• Receive overrun, parity error, framing error, and noise error
• Idle receiver detect
• Active edge on receive pin
• Break detect supporting LIN
• Hardware parity generation and checking
• Programmable 8-bit or 9-bit character length
• Programmable 1-bit or 2-bit stop bits
• Receiver wakeup by idle-line or address-mark
• Optional 13-bit break character generation / 11-bit break character detection
• Selectable transmitter output polarity
15.1.2 Modes of operation
See Section Functional description for details concerning SCI operation in these modes:
• 8- and 9-bit data modes
• Stop mode operation
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
379
Introduction
• Loop mode
• Single-wire mode
15.1.3 Block diagram
The following figure shows the transmitter portion of the SCI.
Internal Bus
(Write-Only)
LOOPS
SCID – Tx Buffer
Loop
Control
Stop
Start
11-BIT Transmit Shift Register
M
1x Baud Rate Clock
H
8
7
6
5
4
3
2
1
0
To Receive
Data In
To TxD Pin
L
lsb

RSRC
SHIFT DIRECTION
Break (All 0s)
Parity
Generation
PT
Preamble (All 1s)
PE
Shift Enable
T8
Load From SCIxD
TXINV
SCI Controls TxD
TE
SBK
Transmit Control
TXDIR
TxD Direction
TO TxD
Pin Logic
BRK13
TDRE
TIE
TC
Tx Interrupt
Request
TCIE
Figure 15-1. SCI transmitter block diagram
The following figure shows the receiver portion of the SCI.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
380
Freescale Semiconductor, Inc.
Chapter 15 Serial communications interface (SCI)
Internal Bus
(Read-only)
16 x Baud
Rate Clock
Divide
By 16
From
Transmitter
H
Data Recovery
RXINV
WAKE
ILT
8
7
6
5
4
3
2
Start
LBKDE
lsb
Stop
From RxD Pin
M
msb
RSRC
11-Bit Receive Shift Register
Single-Wire
Loop Control
All 1s
LOOPS
SCID – Rx Buffer
0
L
1
Shift Direction
Wakeup
Logic
RWU
RWUID
RDRF
RIE
IDLE
ILIE
LBKDIF
Rx Interrupt
Request
LBKDIE
From RxD Pin
Active Edge
Detect
RXEDGIF
RXEDGIE
OR
ORIE
FE
FEIE
NF
Error Interrupt
Request
NEIE
PE
PT
Parity
Checking
PF
PEIE
Figure 15-2. SCI receiver block diagram
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
381
SCI signal descriptions
15.2 SCI signal descriptions
The SCI signals are shown in the table found here.
Table 15-1. SCI signal descriptions
Signal
Description
I/O
RxD
Receive data
I
TxD
Transmit data
I/O
15.2.1 Detailed signal descriptions
The detailed signal descriptions of the SCI are shown in the following table.
Table 15-2. SCI—Detailed signal descriptions
Signal
I/O
Description
RxD
I
Receive data. Serial data input to receiver.
TxD
State meaning
Whether RxD is interpreted as a 1 or 0 depends on the bit encoding
method along with other configuration settings.
Timing
Sampled at a frequency determined by the module clock divided by
the baud rate.
I/O
Transmit data. Serial data output from transmitter.
State meaning
Timing
Whether TxD is interpreted as a 1 or 0 depends on the bit encoding
method along with other configuration settings.
Driven at the beginning or within a bit time according to the bit
encoding method along with other configuration settings.
Otherwise, transmissions are independent of reception timing.
15.3 Register definition
The SCI has 8-bit registers to control baud rate, select SCI options, report SCI status, and
for transmit/receive data.
Refer to the direct-page register summary in the memory chapter of this document or the
absolute address assignments for all SCI registers. This section refers to registers and
control bits only by their names. A Freescale-provided equate or header file is used to
translate these names into the appropriate absolute addresses.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
382
Freescale Semiconductor, Inc.
Chapter 15 Serial communications interface (SCI)
SCI memory map
Absolute
address
(hex)
Width
Access
(in bits)
Register name
Reset value
Section/
page
3080
SCI Baud Rate Register: High (SCI0_BDH)
8
R/W
00h
15.3.1/383
3081
SCI Baud Rate Register: Low (SCI0_BDL)
8
R/W
04h
15.3.2/384
3082
SCI Control Register 1 (SCI0_C1)
8
R/W
00h
15.3.3/385
3083
SCI Control Register 2 (SCI0_C2)
8
R/W
00h
15.3.4/386
3084
SCI Status Register 1 (SCI0_S1)
8
R
C0h
15.3.5/387
3085
SCI Status Register 2 (SCI0_S2)
8
R/W
00h
15.3.6/389
3086
SCI Control Register 3 (SCI0_C3)
8
R/W
00h
15.3.7/391
3087
SCI Data Register (SCI0_D)
8
R/W
00h
15.3.8/392
3088
SCI Baud Rate Register: High (SCI1_BDH)
8
R/W
00h
15.3.1/383
3089
SCI Baud Rate Register: Low (SCI1_BDL)
8
R/W
04h
15.3.2/384
308A
SCI Control Register 1 (SCI1_C1)
8
R/W
00h
15.3.3/385
308B
SCI Control Register 2 (SCI1_C2)
8
R/W
00h
15.3.4/386
308C
SCI Status Register 1 (SCI1_S1)
8
R
C0h
15.3.5/387
308D
SCI Status Register 2 (SCI1_S2)
8
R/W
00h
15.3.6/389
308E
SCI Control Register 3 (SCI1_C3)
8
R/W
00h
15.3.7/391
308F
SCI Data Register (SCI1_D)
8
R/W
00h
15.3.8/392
15.3.1 SCI Baud Rate Register: High (SCIx_BDH)
This register, along with SCI_BDL, controls the prescale divisor for SCI baud rate
generation. To update the 13-bit baud rate setting [SBR12:SBR0], first write to
SCI_BDH to buffer the high half of the new value and then write to SCI_BDL. The
working value in SCI_BDH does not change until SCI_BDL is written.
Address: Base address + 0h offset
Bit
Read
Write
Reset
7
6
5
LBKDIE
RXEDGIE
SBNS
0
0
0
4
3
2
1
0
0
0
SBR
0
0
0
SCIx_BDH field descriptions
Field
7
LBKDIE
6
RXEDGIE
Description
LIN Break Detect Interrupt Enable (for LBKDIF)
0
1
Hardware interrupts from SCI_S2[LBKDIF] disabled (use polling).
Hardware interrupt requested when SCI_S2[LBKDIF] flag is 1.
RxD Input Active Edge Interrupt Enable (for RXEDGIF)
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
383
Register definition
SCIx_BDH field descriptions (continued)
Field
Description
0
1
5
SBNS
Stop Bit Number Select
SBNS determines whether data characters are one or two stop bits.
0
1
SBR
Hardware interrupts from SCI_S2[RXEDGIF] disabled (use polling).
Hardware interrupt requested when SCI_S2[RXEDGIF] flag is 1.
One stop bit.
Two stop bit.
Baud Rate Modulo Divisor.
The 13 bits in SBR[12:0] are referred to collectively as BR, and they set the modulo divide rate for the SCI
baud rate generator. When BR is cleared, the SCI baud rate generator is disabled to reduce supply
current. When BR is 1 - 8191, the SCI baud rate equals BUSCLK/(16×BR).
15.3.2 SCI Baud Rate Register: Low (SCIx_BDL)
This register, along with SCI_BDH, control the prescale divisor for SCI baud rate
generation. To update the 13-bit baud rate setting [SBR12:SBR0], first write to
SCI_BDH to buffer the high half of the new value and then write to SCI_BDL. The
working value in SCI_BDH does not change until SCI_BDL is written.
SCI_BDL is reset to a non-zero value, so after reset the baud rate generator remains
disabled until the first time the receiver or transmitter is enabled; that is, SCI_C2[RE] or
SCI_C2[TE] bits are written to 1.
Address: Base address + 1h offset
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
1
0
0
SBR
0
0
0
0
SCIx_BDL field descriptions
Field
SBR
Description
Baud Rate Modulo Divisor
These 13 bits in SBR[12:0] are referred to collectively as BR. They set the modulo divide rate for the SCI
baud rate generator. When BR is cleared, the SCI baud rate generator is disabled to reduce supply
current. When BR is 1 - 8191, the SCI baud rate equals BUSCLK/(16×BR).
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
384
Freescale Semiconductor, Inc.
Chapter 15 Serial communications interface (SCI)
15.3.3 SCI Control Register 1 (SCIx_C1)
This read/write register controls various optional features of the SCI system.
Address: Base address + 2h offset
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
LOOPS
SCISWAI
RSRC
M
WAKE
ILT
PE
PT
0
0
0
0
0
0
0
0
SCIx_C1 field descriptions
Field
7
LOOPS
Description
Loop Mode Select
Selects between loop back modes and normal 2-pin full-duplex modes. When LOOPS is set, the
transmitter output is internally connected to the receiver input.
0
1
6
SCISWAI
SCI Stops in Wait Mode
0
1
5
RSRC
This bit has no meaning or effect unless the LOOPS bit is set to 1. When LOOPS is set, the receiver input
is internally connected to the TxD pin and RSRC determines whether this connection is also connected to
the transmitter output.
1
3
WAKE
2
ILT
SCI clocks continue to run in wait mode so the SCI can be the source of an interrupt that wakes up the
CPU.
SCI clocks freeze while CPU is in wait mode.
Receiver Source Select
0
4
M
Normal operation - RxD and TxD use separate pins.
Loop mode or single-wire mode where transmitter outputs are internally connected to receiver input.
(See RSRC bit.) RxD pin is not used by SCI.
Provided LOOPS is set, RSRC is cleared, selects internal loop back mode and the SCI does not use
the RxD pins.
Single-wire SCI mode where the TxD pin is connected to the transmitter output and receiver input.
9-Bit or 8-Bit Mode Select
0
1
Normal - start + 8 data bits (lsb first) + stop.
Receiver and transmitter use 9-bit data characters start + 8 data bits (lsb first) + 9th data bit + stop.
Receiver Wakeup Method Select
0
1
Idle-line wakeup.
Address-mark wakeup.
Idle Line Type Select
Setting this bit to 1 ensures that the stop bits and logic 1 bits at the end of a character do not count toward
the 10 or 11 bit times of logic high level needed by the idle line detection logic.
0
1
Idle character bit count starts after start bit.
Idle character bit count starts after stop bit.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
385
Register definition
SCIx_C1 field descriptions (continued)
Field
1
PE
Description
Parity Enable
Enables hardware parity generation and checking. When parity is enabled, the most significant bit (msb) of
the data character, eighth or ninth data bit, is treated as the parity bit.
0
1
0
PT
No hardware parity generation or checking.
Parity enabled.
Parity Type
Provided parity is enabled (PE = 1), this bit selects even or odd parity. Odd parity means the total number
of 1s in the data character, including the parity bit, is odd. Even parity means the total number of 1s in the
data character, including the parity bit, is even.
0
1
Even parity.
Odd parity.
15.3.4 SCI Control Register 2 (SCIx_C2)
This register can be read or written at any time.
Address: Base address + 3h offset
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
TIE
TCIE
RIE
ILIE
TE
RE
RWU
SBK
0
0
0
0
0
0
0
0
SCIx_C2 field descriptions
Field
7
TIE
6
TCIE
Description
Transmit Interrupt Enable for TDRE
0
1
Hardware interrupts from TDRE disabled; use polling.
Hardware interrupt requested when TDRE flag is 1.
Transmission Complete Interrupt Enable for TC
0
1
Hardware interrupts from TC disabled; use polling.
Hardware interrupt requested when TC flag is 1.
5
RIE
Receiver Interrupt Enable for RDRF
4
ILIE
Idle Line Interrupt Enable for IDLE
3
TE
Transmitter Enable
0
1
0
1
Hardware interrupts from RDRF disabled; use polling.
Hardware interrupt requested when RDRF flag is 1.
Hardware interrupts from IDLE disabled; use polling.
Hardware interrupt requested when IDLE flag is 1.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
386
Freescale Semiconductor, Inc.
Chapter 15 Serial communications interface (SCI)
SCIx_C2 field descriptions (continued)
Field
Description
TE must be 1 to use the SCI transmitter. When TE is set, the SCI forces the TxD pin to act as an output
for the SCI system.
When the SCI is configured for single-wire operation (LOOPS = RSRC = 1), TXDIR controls the direction
of traffic on the single SCI communication line (TxD pin).
TE can also queue an idle character by clearing TE then setting TE while a transmission is in progress.
When TE is written to 0, the transmitter keeps control of the port TxD pin until any data, queued idle, or
queued break character finishes transmitting before allowing the pin to revert to a general-purpose I/O pin.
0
1
2
RE
Receiver Enable
When the SCI receiver is off, the RxD pin reverts to being a general-purpose port I/O pin. If LOOPS is set
the RxD pin reverts to being a general-purpose I/O pin even if RE is set.
0
1
1
RWU
Receiver off.
Receiver on.
Receiver Wakeup Control
This bit can be written to 1 to place the SCI receiver in a standby state where it waits for automatic
hardware detection of a selected wakeup condition. The wakeup condition is an idle line between
messages, WAKE = 0, idle-line wakeup, or a logic 1 in the most significant data bit in a character, WAKE =
1, address-mark wakeup. Application software sets RWU and, normally, a selected hardware condition
automatically clears RWU.
0
1
0
SBK
Transmitter off.
Transmitter on.
Normal SCI receiver operation.
SCI receiver in standby waiting for wakeup condition.
Send Break
Writing a 1 and then a 0 to SBK queues a break character in the transmit data stream. Additional break
characters of 10 or 11 or 12, 13 or 14 or 15 if BRK13 = 1, bit times of logic 0 are queued as long as SBK is
set. Depending on the timing of the set and clear of SBK relative to the information currently being
transmitted, a second break character may be queued before software clears SBK.
0
1
Normal transmitter operation.
Queue break character(s) to be sent.
15.3.5 SCI Status Register 1 (SCIx_S1)
This register has eight read-only status flags. Writes have no effect. Special software
sequences, which do not involve writing to this register, clear these status flags.
Address: Base address + 4h offset
Bit
Read
7
6
5
4
3
2
1
0
TDRE
TC
RDRF
IDLE
OR
NF
FE
PF
1
1
0
0
0
0
0
0
Write
Reset
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
387
Register definition
SCIx_S1 field descriptions
Field
7
TDRE
Description
Transmit Data Register Empty Flag
TDRE is set out of reset and when a transmit data value transfers from the transmit data buffer to the
transmit shifter, leaving room for a new character in the buffer. To clear TDRE, read SCI_S1 with TDRE
set and then write to the SCI data register (SCI_D).
0
1
6
TC
Transmission Complete Flag
TC is set out of reset and when TDRE is set and no data, preamble, or break character is being
transmitted.
TC is cleared automatically by reading SCI_S1 with TC set and then doing one of the following:
• Write to the SCI data register (SCI_D) to transmit new data
• Queue a preamble by changing TE from 0 to 1
• Queue a break character by writing 1 to SCI_C2[SBK]
0
1
5
RDRF
Transmitter active (sending data, a preamble, or a break).
Transmitter idle (transmission activity complete).
Receive Data Register Full Flag
RDRF becomes set when a character transfers from the receive shifter into the receive data register
(SCI_D). To clear RDRF, read SCI_S1 with RDRF set and then read the SCI data register (SCI_D).
0
1
4
IDLE
Transmit data register (buffer) full.
Transmit data register (buffer) empty.
Receive data register empty.
Receive data register full.
Idle Line Flag
IDLE is set when the SCI receive line becomes idle for a full character time after a period of activity. When
ILT is cleared, the receiver starts counting idle bit times after the start bit. If the receive character is all 1s,
these bit times and the stop bits time count toward the full character time of logic high, 10 or 11 bit times
depending on the M control bit, needed for the receiver to detect an idle line. When ILT is set, the receiver
doesn't start counting idle bit times until after the stop bits. The stop bits and any logic high bit times at the
end of the previous character do not count toward the full character time of logic high needed for the
receiver to detect an idle line.
To clear IDLE, read SCI_S1 with IDLE set and then read the SCI data register (SCI_D). After IDLE has
been cleared, it cannot become set again until after a new character has been received and RDRF has
been set. IDLE is set only once even if the receive line remains idle for an extended period.
0
1
3
OR
Receiver Overrun Flag
OR is set when a new serial character is ready to be transferred to the receive data register (buffer), but
the previously received character has not been read from SCI_D yet. In this case, the new character, and
all associated error information, is lost because there is no room to move it into SCI_D. To clear OR, read
SCI_S1 with OR set and then read the SCI data register (SCI_D).
0
1
2
NF
No idle line detected.
Idle line was detected.
No overrun.
Receive overrun (new SCI data lost).
Noise Flag
The advanced sampling technique used in the receiver takes seven samples during the start bit and three
samples in each data bit and the stop bits. If any of these samples disagrees with the rest of the samples
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
388
Freescale Semiconductor, Inc.
Chapter 15 Serial communications interface (SCI)
SCIx_S1 field descriptions (continued)
Field
Description
within any bit time in the frame, the flag NF is set at the same time as RDRF is set for the character. To
clear NF, read SCI_S1 and then read the SCI data register (SCI_D).
0
1
1
FE
No noise detected.
Noise detected in the received character in SCI_D.
Framing Error Flag
FE is set at the same time as RDRF when the receiver detects a logic 0 where the stop bits was expected.
This suggests the receiver was not properly aligned to a character frame. To clear FE, read SCI_S1 with
FE set and then read the SCI data register (SCI_D).
0
1
0
PF
No framing error detected. This does not guarantee the framing is correct.
Framing error.
Parity Error Flag
PF is set at the same time as RDRF when parity is enabled (PE = 1) and the parity bit in the received
character does not agree with the expected parity value. To clear PF, read SCI_S1 and then read the SCI
data register (SCI_D).
0
1
No parity error.
Parity error.
15.3.6 SCI Status Register 2 (SCIx_S2)
This register contains one read-only status flag.
When using an internal oscillator in a LIN system, it is necessary to raise the break
detection threshold one bit time. Under the worst case timing conditions allowed in LIN,
it is possible that a 0x00 data character can appear to be 10.26 bit times long at a slave
running 14% faster than the master. This would trigger normal break detection circuitry
designed to detect a 10-bit break symbol. When the LBKDE bit is set, framing errors are
inhibited and the break detection threshold changes from 10 bits to 11 bits, preventing
false detection of a 0x00 data character as a LIN break symbol.
Address: Base address + 5h offset
Bit
Read
Write
Reset
7
6
LBKDIF
RXEDGIF
0
0
5
0
0
4
3
2
1
RXINV
RWUID
BRK13
LBKDE
0
0
0
0
0
RAF
0
SCIx_S2 field descriptions
Field
7
LBKDIF
Description
LIN Break Detect Interrupt Flag
LBKDIF is set when the LIN break detect circuitry is enabled and a LIN break character is detected.
LBKDIF is cleared by writing a 1 to it.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
389
Register definition
SCIx_S2 field descriptions (continued)
Field
Description
0
1
6
RXEDGIF
RxD Pin Active Edge Interrupt Flag
RXEDGIF is set when an active edge, falling if RXINV = 0, rising if RXINV=1, on the RxD pin occurs.
RXEDGIF is cleared by writing a 1 to it.
0
1
5
Reserved
4
RXINV
No LIN break character has been detected.
LIN break character has been detected.
No active edge on the receive pin has occurred.
An active edge on the receive pin has occurred.
This field is reserved.
This read-only field is reserved and always has the value 0.
Receive Data Inversion
Setting this bit reverses the polarity of the received data input.
NOTE: Setting RXINV inverts the RxD input for all cases: data bits, start and stop bits, break, and idle.
0
1
3
RWUID
Receive Wake Up Idle Detect
RWUID controls whether the idle character that wakes up the receiver sets the IDLE bit.
0
1
2
BRK13
BRK13 selects a longer transmitted break character length. Detection of a framing error is not affected by
the state of this bit.
1
Break character is transmitted with length of 10 bit times (if M = 0, SBNS = 0) or 11 (if M = 1, SBNS =
0 or M = 0, SBNS = 1) or 12 (if M = 1, SBNS = 1).
Break character is transmitted with length of 13 bit times (if M = 0, SBNS = 0) or 14 (if M = 1, SBNS =
0 or M = 0, SBNS = 1) or 15 (if M = 1, SBNS = 1).
LIN Break Detection Enable
LBKDE selects a longer break character detection length. While LBKDE is set, framing error (FE) and
receive data register full (RDRF) flags are prevented from setting.
0
1
0
RAF
During receive standby state (RWU = 1), the IDLE bit does not get set upon detection of an idle
character.
During receive standby state (RWU = 1), the IDLE bit gets set upon detection of an idle character.
Break Character Generation Length
0
1
LBKDE
Receive data not inverted.
Receive data inverted.
Break character is detected at length 10 bit times (if M = 0, SBNS = 0) or 11 (if M = 1, SBNS = 0 or M
= 0, SBNS = 1) or 12 (if M = 1, SBNS = 1).
Break character is detected at length of 11 bit times (if M = 0, SBNS = 0) or 12 (if M = 1, SBNS = 0 or
M = 0, SBNS = 1) or 13 (if M = 1, SBNS = 1).
Receiver Active Flag
RAF is set when the SCI receiver detects the beginning of a valid start bit, and RAF is cleared
automatically when the receiver detects an idle line. This status flag can be used to check whether an SCI
character is being received before instructing the MCU to go to stop mode.
0
1
SCI receiver idle waiting for a start bit.
SCI receiver active (RxD input not idle).
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
390
Freescale Semiconductor, Inc.
Chapter 15 Serial communications interface (SCI)
15.3.7 SCI Control Register 3 (SCIx_C3)
Address: Base address + 6h offset
Bit
Read
7
R8
Write
Reset
0
6
5
4
3
2
1
0
T8
TXDIR
TXINV
ORIE
NEIE
FEIE
PEIE
0
0
0
0
0
0
0
SCIx_C3 field descriptions
Field
Description
7
R8
Ninth Data Bit for Receiver
6
T8
Ninth Data Bit for Transmitter
5
TXDIR
When the SCI is configured for 9-bit data (M = 1), R8 can be thought of as a ninth receive data bit to the
left of the msb of the buffered data in the SCI_D register. When reading 9-bit data, read R8 before reading
SCI_D because reading SCI_D completes automatic flag clearing sequences that could allow R8 and
SCI_D to be overwritten with new data.
When the SCI is configured for 9-bit data (M = 1), T8 may be thought of as a ninth transmit data bit to the
left of the msb of the data in the SCI_D register. When writing 9-bit data, the entire 9-bit value is
transferred to the SCI shift register after SCI_D is written so T8 should be written, if it needs to change
from its previous value, before SCI_D is written. If T8 does not need to change in the new value, such as
when it is used to generate mark or space parity, it need not be written each time SCI_D is written.
TxD Pin Direction in Single-Wire Mode
When the SCI is configured for single-wire half-duplex operation (LOOPS = RSRC = 1), this bit determines
the direction of data at the TxD pin.
0
1
4
TXINV
TxD pin is an input in single-wire mode.
TxD pin is an output in single-wire mode.
Transmit Data Inversion
Setting this bit reverses the polarity of the transmitted data output.
NOTE: Setting TXINV inverts the TxD output for all cases: data bits, start and stop bits, break, and idle.
0
1
3
ORIE
Overrun Interrupt Enable
This bit enables the overrun flag (OR) to generate hardware interrupt requests.
0
1
2
NEIE
Transmit data not inverted.
Transmit data inverted.
OR interrupts disabled; use polling.
Hardware interrupt requested when OR is set.
Noise Error Interrupt Enable
This bit enables the noise flag (NF) to generate hardware interrupt requests.
0
1
NF interrupts disabled; use polling).
Hardware interrupt requested when NF is set.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
391
Register definition
SCIx_C3 field descriptions (continued)
Field
1
FEIE
Description
Framing Error Interrupt Enable
This bit enables the framing error flag (FE) to generate hardware interrupt requests.
0
1
0
PEIE
FE interrupts disabled; use polling).
Hardware interrupt requested when FE is set.
Parity Error Interrupt Enable
This bit enables the parity error flag (PF) to generate hardware interrupt requests.
0
1
PF interrupts disabled; use polling).
Hardware interrupt requested when PF is set.
15.3.8 SCI Data Register (SCIx_D)
This register is actually two separate registers. Reads return the contents of the read-only
receive data buffer and writes go to the write-only transmit data buffer. Reads and writes
of this register are also involved in the automatic flag clearing mechanisms for the SCI
status flags.
Address: Base address + 7h offset
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
R7T7
R6T6
R5T5
R4T4
R3T3
R2T2
R1T1
R0T0
0
0
0
0
0
0
0
0
SCIx_D field descriptions
Field
Description
7
R7T7
Read receive data buffer 7 or write transmit data buffer 7.
6
R6T6
Read receive data buffer 6 or write transmit data buffer 6.
5
R5T5
Read receive data buffer 5 or write transmit data buffer 5.
4
R4T4
Read receive data buffer 4 or write transmit data buffer 4.
3
R3T3
Read receive data buffer 3 or write transmit data buffer 3.
2
R2T2
Read receive data buffer 2 or write transmit data buffer 2.
1
R1T1
Read receive data buffer 1 or write transmit data buffer 1.
0
R0T0
Read receive data buffer 0 or write transmit data buffer 0.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
392
Freescale Semiconductor, Inc.
Chapter 15 Serial communications interface (SCI)
SCIx_D field descriptions (continued)
Field
Description
15.4 Functional description
The SCI allows full-duplex, asynchronous, NRZ serial communication among the MCU
and remote devices, including other MCUs.
The SCI comprises a baud rate generator, transmitter, and receiver block. The transmitter
and receiver operate independently, although they use the same baud rate generator.
During normal operation, the MCU monitors the status of the SCI, writes the data to be
transmitted, and processes received data. The following describes each of the blocks of
the SCI.
15.4.1 Baud rate generation
As shown in the figure found here, the clock source for the SCI baud rate generator is the
bus-rate clock.
Modulo Divide By
(1 through 8191)
SCI Module Clock
SBR[12:0]
Baud Rate Generator
Off If [SBR12:SBR0] =0
Divide By
16
16
Tx Baud Rate
Rx Sampling Clock
(16 × Baud Rate)
Baud Rate =
SCI Module Clock
SBR[12:0] × 16
Figure 15-27. SCI baud rate generation
SCI communications require the transmitter and receiver, which typically derive baud
rates from independent clock sources, to use the same baud rate. Allowed tolerance on
this baud frequency depends on the details of how the receiver synchronizes to the
leading edge of the start bit and how bit sampling is performed.
The MCU resynchronizes to bit boundaries on every high-to-low transition. In the worst
case, there are no such transitions in the full 10- or 11-bit or 12-bittime character frame
so any mismatch in baud rate is accumulated for the whole character time. For a
Freescale SCI system whose bus frequency is driven by a crystal, the allowed baud rate
mismatch is about ±4.5 percent for 8-bit data format and about ±4 percent for 9-bit data
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
393
Functional description
format. Although baud rate modulo divider settings do not always produce baud rates that
exactly match standard rates, it is normally possible to get within a few percent, which is
acceptable for reliable communications.
15.4.2 Transmitter functional description
This section describes the overall block diagram for the SCI transmitter, as well as
specialized functions for sending break and idle characters.
The transmitter output (TxD) idle state defaults to logic high, SCI_C3[TXINV] is cleared
following reset. The transmitter output is inverted by setting SCI_C3[TXINV]. The
transmitter is enabled by setting the TE bit in SCI_C2. This queues a preamble character
that is one full character frame of the idle state. The transmitter then remains idle until
data is available in the transmit data buffer. Programs store data into the transmit data
buffer by writing to the SCI data register (SCI_D).
The central element of the SCI transmitter is the transmit shift register that is 10 or 11 or
12 bits long depending on the setting in the SCI_C1[M] control bit and SCI_BDH[SBNS]
bit. For the remainder of this section, assume SCI_C1[M] is cleared, SCI_BDH[SBNS] is
also cleared, selecting the normal 8-bit data mode. In 8-bit data mode, the shift register
holds a start bit, eight data bits, and a stop bit. When the transmit shift register is
available for a new SCI character, the value waiting in the transmit data register is
transferred to the shift register, synchronized with the baud rate clock, and the transmit
data register empty (SCI_S1[TDRE]) status flag is set to indicate another character may
be written to the transmit data buffer at SCI_D.
NOTE
Always read SCI_S1 before writing to SCI_D to allow data to
be transmitted.
If no new character is waiting in the transmit data buffer after a stop bit is shifted out the
TxD pin, the transmitter sets the transmit complete flag and enters an idle mode, with
TxD high, waiting for more characters to transmit.
Writing 0 to SCI_C2[TE] does not immediately release the pin to be a general-purpose
I/O pin. Any transmit activity in progress must first be completed. This includes data
characters in progress, queued idle characters, and queued break characters.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
394
Freescale Semiconductor, Inc.
Chapter 15 Serial communications interface (SCI)
15.4.2.1 Send break and queued idle
SCI_C2[SBK] sends break characters originally used to gain the attention of old teletype
receivers. Break characters are a full character time of logic 0, 10 bit times including the
start and stop bits. A longer break of 13 bit times can be enabled by setting
SCI_S2[BRK13]. Normally, a program would wait for SCI_S1[TDRE] to become set to
indicate the last character of a message has moved to the transmit shifter, write 1, and
then write 0 to SCI_C2[SBK]. This action queues a break character to be sent as soon as
the shifter is available. If SCI_C2[SBK] remains 1 when the queued break moves into the
shifter, synchronized to the baud rate clock, an additional break character is queued. If
the receiving device is another Freescale Semiconductor SCI, the break characters are
received as 0s in all eight data bits and a framing error (SCI_S1[FE] = 1) occurs.
When idle-line wake-up is used, a full character time of idle (logic 1) is needed between
messages to wake up any sleeping receivers. Normally, a program would wait for
SCI_S1[TDRE] to become set to indicate the last character of a message has moved to
the transmit shifter, then write 0 and then write 1 to the SCI_C2[TE] bit. This action
queues an idle character to be sent as soon as the shifter is available. As long as the
character in the shifter does not finish while SCI_C2[TE] is cleared, the SCI transmitter
never actually releases control of the TxD pin. If there is a possibility of the shifter
finishing while SCI_C2[TE] is cleared, set the general-purpose I/O controls so the pin
shared with TxD is an output driving a logic 1. This ensures that the TxD line looks like a
normal idle line even if the SCI loses control of the port pin between writing 0 and then 1
to SCI_C2[TE].
The length of the break character is affected by the SCI_S2[BRK13] and SCI_C1[M] as
shown below.
Table 15-30. Break character length
BRK13
M
SBNS
Break character length
0
0
0
10 bit times
0
0
1
11 bit times
0
1
0
11 bit times
0
1
1
12 bit times
1
0
0
13 bit times
1
0
1
14 bit times
1
1
0
14 bit times
1
1
1
15 bit times
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
395
Functional description
15.4.3 Receiver functional description
In this section, the receiver block diagram is a guide for the overall receiver functional
description.
Next, the data sampling technique used to reconstruct receiver data is described in more
detail. Finally, two variations of the receiver wakeup function are explained.
The receiver input is inverted by setting SCI_S2[RXINV]. The receiver is enabled by
setting the SCI_C2[RE] bit. Character frames consist of a start bit of logic 0, eight (or
nine) data bits (lsb first), and one (or two) stop bits of logic 1. For information about 9-bit
data mode, refer to 8- and 9-bit data modes. For the remainder of this discussion, assume
the SCI is configured for normal 8-bit data mode.
After receiving the stop bit into the receive shifter, and provided the receive data register
is not already full, the data character is transferred to the receive data register and the
receive data register full (SCI_S1[RDRF]) status flag is set. If SCI_S1[RDRF] was
already set indicating the receive data register (buffer) was already full, the overrun (OR)
status flag is set and the new data is lost. Because the SCI receiver is double-buffered, the
program has one full character time after SCI_S1[RDRF] is set before the data in the
receive data buffer must be read to avoid a receiver overrun.
When a program detects that the receive data register is full (SCI_S1[RDRF] = 1), it gets
the data from the receive data register by reading SCI_D. The SCI_S1[RDRF] flag is
cleared automatically by a two-step sequence normally satisfied in the course of the user's
program that manages receive data. Refer to Interrupts and status flags for more details
about flag clearing.
15.4.3.1 Data sampling technique
The SCI receiver uses a 16× baud rate clock for sampling. The oversampling ratio is
fixed at 16. The receiver starts by taking logic level samples at 16 times the baud rate to
search for a falling edge on the RxD serial data input pin. A falling edge is defined as a
logic 0 sample after three consecutive logic 1 samples. The 16× baud rate clock divides
the bit time into 16 segments labeled SCI_D[RT1] through SCI_D[RT16]. When a falling
edge is located, three more samples are taken at SCI_D[RT3], SCI_D[RT5], and
SCI_D[RT7] to make sure this was a real start bit and not merely noise. If at least two of
these three samples are 0, the receiver assumes it is synchronized to a receive character.
The receiver then samples each bit time, including the start and stop bits, at SCI_D[RT8],
SCI_D[RT9], and SCI_D[RT10] to determine the logic level for that bit. The logic level
is interpreted to be that of the majority of the samples taken during the bit time. In the
case of the start bit, the bit is assumed to be 0 if at least two of the samples at
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
396
Freescale Semiconductor, Inc.
Chapter 15 Serial communications interface (SCI)
SCI_D[RT3], SCI_D[RT5], and SCI_D[RT7] are 0 even if one or all of the samples
taken at SCI_D[RT8], SCI_D[RT9], and SCI_D[RT10] are 1s. If any sample in any bit
time, including the start and stop bits, in a character frame fails to agree with the logic
level for that bit, the noise flag (SCI_S1[NF]) is set when the received character is
transferred to the receive data buffer.
The falling edge detection logic continuously looks for falling edges. If an edge is
detected, the sample clock is resynchronized to bit times. This improves the reliability of
the receiver in the presence of noise or mismatched baud rates. It does not improve worst
case analysis because some characters do not have any extra falling edges anywhere in
the character frame.
In the case of a framing error, provided the received character was not a break character,
the sampling logic that searches for a falling edge is filled with three logic 1 samples so
that a new start bit can be detected almost immediately.
In the case of a framing error, the receiver is inhibited from receiving any new characters
until the framing error flag is cleared. The receive shift register continues to function, but
a complete character cannot transfer to the receive data buffer if SCI_S1[FE] remains set.
15.4.3.2 Receiver wake-up operation
Receiver wake-up is a hardware mechanism that allows an SCI receiver to ignore the
characters in a message intended for a different SCI receiver. In such a system, all
receivers evaluate the first character(s) of each message, and as soon as they determine
the message is intended for a different receiver, they write logic 1 to the receiver wake up
control field (SCI_C2[RWU]). When SCI_C2[RWU] is set, the status flags associated
with the receiver, (with the exception of the idle bit, IDLE, when SCI_S2[RWUID] is
set), are inhibited from setting, thus eliminating the software overhead for handling the
unimportant message characters. At the end of a message, or at the beginning of the next
message, all receivers automatically force SCI_C2[RWU] to 0, so all receivers wake up
in time to look at the first character(s) of the next message.
15.4.3.2.1
Idle-line wakeup
When wake is cleared, the receiver is configured for idle-line wakeup. In this mode,
SCI_C2[RWU] is cleared automatically when the receiver detects a full character time of
the idle-line level. The SCI_C1[M] control field selects 8-bit or 9-bit data mode and
SCI_BDH[SBNS] selects 1-bit or 2-bit stop bit number that determines how many bit
times of idle are needed to constitute a full character time, 10 or 11 or 12 bit times
because of the start and stop bits.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
397
Functional description
When SCII_C2[RWU] is 1 and SCI_S2[RWUID] is 0, the idle condition that wakes up
the receiver does not set SCI_S1[IDLE]. The receiver wakes up and waits for the first
data character of the next message that sets SCI_S1[RDRF] and generates an interrupt, if
enabled. When SCI_S2[RWUID] is 1, any idle condition sets SCI_S1[IDLE] flag and
generates an interrupt if enabled, regardless of whether SCI_C2[RWU] is 0 or 1.
The idle-line type (SCI_C1[ILT]) control bit selects one of two ways to detect an idle
line. When SCI_C1[ILT] is cleared, the idle bit counter starts after the start bit so the stop
bit and any logic 1s at the end of a character count toward the full character time of idle.
When SCI_C1[ILT] is set, the idle bit counter does not start until after a stop bit time, so
the idle detection is not affected by the data in the last character of the previous message.
15.4.3.2.2
Address-mark wakeup
When wake is set, the receiver is configured for address-mark wakeup. In this mode,
SCI_C2[RWU] is cleared automatically when the receiver detects a, or two, if
SCI_BDH[SBNS] = 1, logic 1 in the most significant bits of a received character, eighth
bit when SCI_C1[M] is cleared and ninth bit when SCI_C1[M] is set.
Address-mark wakeup allows messages to contain idle characters, but requires the msb
be reserved for use in address frames. The one, or two, if SCI_BDH[SBNS] = 1, logic 1s
msb of an address frame clears the SCI_C2[RWU] bit before the stop bits are received
and sets the SCI_S1[RDRF] flag. In this case, the character with the msb set is received
even though the receiver was sleeping during most of this character time.
15.4.4 Interrupts and status flags
The SCI system has three separate interrupt vectors to reduce the amount of software
needed to isolate the cause of the interrupt.
One interrupt vector is associated with the transmitter for SCI_S1[TDRE] and
SCI_S1[TC] events. Another interrupt vector is associated with the receiver for RDRF,
IDLE, RXEDGIF, and LBKDIF events. A third vector is used for OR, NF, FE, and PF
error conditions. Each of these ten interrupt sources can be separately masked by local
interrupt enable masks. The flags can be polled by software when the local masks are
cleared to disable generation of hardware interrupt requests.
The SCI transmitter has two status flags that can optionally generate hardware interrupt
requests. Transmit data register empty (SCI_S1[TDRE]) indicates when there is room in
the transmit data buffer to write another transmit character to SCI_D. If the transmit
interrupt enable (SCI_C2[TIE]) bit is set, a hardware interrupt is requested when
SCI_S1[TDRE] is set. Transmit complete (SCI_S1[TC]) indicates that the transmitter is
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
398
Freescale Semiconductor, Inc.
Chapter 15 Serial communications interface (SCI)
finished transmitting all data, preamble, and break characters and is idle with TxD at the
inactive level. This flag is often used in systems with modems to determine when it is
safe to turn off the modem. If the transmit complete interrupt enable (SCI_C2[TCIE]) bit
is set, a hardware interrupt is requested when SCI_S1[TC] is set. Instead of hardware
interrupts, software polling may be used to monitor the SCI_S1[TDRE] and SCI_S1[TC]
status flags if the corresponding SCI_C2[TIE] or SCI_C2[TCIE] local interrupt masks
are cleared.
When a program detects that the receive data register is full (SCI_S1[RDRF] = 1), it gets
the data from the receive data register by reading SCI_D. The SCI_S1[RDRF] flag is
cleared by reading SCI_S1 while SCI_S1[RDRF] is set and then reading SCI_D.
When polling is used, this sequence is naturally satisfied in the normal course of the user
program. If hardware interrupts are used, SCI_S1 must be read in the interrupt service
routine (ISR). Normally, this is done in the ISR anyway to check for receive errors, so the
sequence is automatically satisfied.
The IDLE status flag includes logic that prevents it from getting set repeatedly when the
RxD line remains idle for an extended period of time. IDLE is cleared by reading SCI_S1
while SCI_S1[IDLE] is set and then reading SCI_D. After SCI_S1[IDLE] has been
cleared, it cannot become set again until the receiver has received at least one new
character and has set SCI_S1[RDRF].
If the associated error was detected in the received character that caused SCI_S1[RDRF]
to be set, the error flags - noise flag (SCI_S1[NF]), framing error (SCI_S1[FE]), and
parity error flag (SCI_S1[PF]) - are set at the same time as SCI_S1[RDRF]. These flags
are not set in overrun cases.
If SCI_S1[RDRF] was already set when a new character is ready to be transferred from
the receive shifter to the receive data buffer, the overrun (SCI_S1[OR]) flag is set instead
of the data along with any associated NF, FE, or PF condition is lost.
At any time, an active edge on the RxD serial data input pin causes the
SCI_S2[RXEDGIF] flag to set. The SCI_S2[RXEDGIF] flag is cleared by writing a 1 to
it. This function depends on the receiver being enabled (SCI_C2[RE] = 1).
15.4.5 Baud rate tolerance
A transmitting device may operate at a baud rate below or above that of the receiver.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
399
Functional description
Accumulated bit time misalignment can cause one of the three stop bit data samples
(RT8, RT9, and RT10) to fall outside the actual stop bit. A noise error will occur if the
RT8, RT9, and RT10 samples are not all the same logical values. A framing error will
occur if the receiver clock is misaligned in such a way that the majority of the RT8, RT9,
and RT10 stop bit samples are a logic zero.
As the receiver samples an incoming frame, it re-synchronizes the RT clock on any valid
falling edge within the frame. Resynchronization within frames will correct a
misalignment between transmitter bit times and receiver bit times.
15.4.5.1 Slow data tolerance
Figure 15-28 shows how much a slow received frame can be misaligned without causing
a noise error or a framing error. The slow stop bit begins at RT8 instead of RT1 but
arrives in time for the stop bit data samples at RT8, RT9, and RT10.
RT16
RT15
RT14
RT13
RT11
RT10
RT9
RT8
RT7
RT6
RT5
RT4
RT3
RT2
RT1
RECEIVER
RT CLOCK
RT12
STOP
MSB
DATA
SAMPLES
Figure 15-28. Slow data
For an 8-bit data and 1 stop bit character, data sampling of the stop bit takes the receiver
9 bit times x 16 RT cycles +10 RT cycles =154 RT cycles.
With the misaligned character shown in Figure 15-28, the receiver counts 154 RT cycles
at the point when the count of the transmitting device is 9 bit times x 16 RT cycles + 3
RT cycles = 147 RT cycles.
The maximum percent difference between the receiver count and the transmitter count of
a slow 8-bit data and 1 stop bit character with no errors is:
((154 - 147) / 154) x 100 = 4.54%
For a 9-bit data or 2 stop bits character, data sampling of the stop bit takes the receiver 10
bit times x 16 RT cycles + 10 RT cycles = 170 RT cycles.
With the misaligned character shown in Figure 15-28, the receiver counts 170 RT cycles
at the point when the count of the transmitting device is 10 bit times x 16 RT cycles + 3
RT cycles = 163 RT cycles.
The maximum percent difference between the receiver count and the transmitter count of
a slow 9-bit or 2 stop bits character with no errors is:
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
400
Freescale Semiconductor, Inc.
Chapter 15 Serial communications interface (SCI)
((170 - 163) / 170) X 100 = 4.12%
For a 9-bit data and 2 stop bit character, data sampling of the stop bit takes the receiver
11 bit times x 16 RT cycles + 10 RT cycles = 186 RT cycles.
With the misaligned character shown in Figure 15-28, the receiver counts 186 RT cycles
at the point when the count of the transmitting device is 11 bit times x 16 RT cycles + 3
RT cycles = 179 RT cycles.
The maximum percent difference between the receiver count and the transmitter count of
a slow 9-bit and 2 stop bits character with no errors is: ((186 - 179) / 186) X 100 = 3.76%
15.4.5.2 Fast data tolerance
Figure 15-29 shows how much a fast received frame can be misaligned. The fast stop bit
ends at RT10 instead of RT16 but is still sampled at RT8, RT9, and RT10.
RT16
RT15
RT14
RT13
RT12
RT11
RT10
RT9
RT8
RT7
RT6
IDLE OR NEXT FRAME
RT5
RT4
RT3
RT2
RECEIVER
RT CLOCK
RT1
STOP
DATA
SAMPLES
Figure 15-29. Fast data
For an 8-bit data and 1 stop bit character, data sampling of the stop bit takes the receiver
9 bit times x 16 RT cycles + 10 RT cycles = 154 RT cycles.
With the misaligned character shown in Figure 15-29, the receiver counts 154 RT cycles
at the point when the count of the transmitting device is 10 bit times x 16 RT cycles =
160 RT cycles.
The maximum percent difference between the receiver count and the transmitter count of
a fast 8-bit and 1 stop bit character with no errors is:
((154 - 160) / 154) x 100 = 3.90%
For a 9-bit data or 2 stop bits character, data sampling of the stop bit takes the receiver 10
bit times x 16 RT cycles + 10 RT cycles = 170 RT cycles.
With the misaligned character shown in, the receiver counts 170 RT cycles at the point
when the count of the transmitting device is 11 bit times x 16 RT cycles = 176 RT cycles.
The maximum percent difference between the receiver count and the transmitter count of
a fast 9-bit or 2 stop bits character with no errors is:
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
401
Functional description
((170 - 176) / 170) x 100 = 3.53%
For a 9-bit data and 2 stop bits character, data sampling of the stop bit takes the receiver
11 bit times x 16 RT cycles + 10 RT cycles = 186 RT cycles.
With the misaligned character shown in, the receiver counts 186 RT cycles at the point
when the count of the transmitting device is 12 bit times x 16 RT cycles = 192 RT cycles.
The maximum percent difference between the receiver count and the transmitter count of
a fast 9-bit and 2 stop bits character with no errors is:
((186 - 192) / 186) x 100 = 3.23%
15.4.6 Additional SCI functions
The following sections describe additional SCI functions.
15.4.6.1 8- and 9-bit data modes
The SCI system, transmitter and receiver, can be configured to operate in 9-bit data mode
by setting SCI_C1[M]. In 9-bit mode, there is a ninth data bit to the left of the most
significant bit of the SCI data register. For the transmit data buffer, this bit is stored in T8
in SCI_C3. For the receiver, the ninth bit is held in SCI_C3[R8].
For coherent writes to the transmit data buffer, write to SCI_C3[T8] before writing to
SCI_D.
If the bit value to be transmitted as the ninth bit of a new character is the same as for the
previous character, it is not necessary to write to SCI_C3[T8] again. When data is
transferred from the transmit data buffer to the transmit shifter, the value in SCI_C3[T8]
is copied at the same time data is transferred from SCI_D to the shifter.
The 9-bit data mode is typically used with parity to allow eight bits of data plus the parity
in the ninth bit, or it is used with address-mark wake-up so the ninth data bit can serve as
the wakeup bit. In custom protocols, the ninth bit can also serve as a software-controlled
marker.
15.4.6.2 Stop mode operation
During all stop modes, clocks to the SCI module are halted.
No SCI module registers are affected in Stop mode.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
402
Freescale Semiconductor, Inc.
Chapter 15 Serial communications interface (SCI)
The receive input active edge detect circuit remains active in Stop mode. An active edge
on the receive input brings the CPU out of Stop mode if the interrupt is not masked
(SCI_BDH[RXEDGIE] = 1).
Because the clocks are halted, the SCI module resumes operation upon exit from stop,
only in Stop mode. Software must ensure stop mode is not entered while there is a
character (including preamble, break and normal data) being transmitted out of or
received into the SCI module, that means SCI_S1[TC] =1, SCI_S1[TDRE] = 1, and
SCI_S2[RAF] = 0 must all meet before entering stop mode.
15.4.6.3 Loop mode
When SCI_C1[LOOPS] is set, the SCI_C1[RSRC] bit in the same register chooses
between loop mode (SCI_C1[RSRC] = 0) or single-wire mode (SCI_C1[RSRC] = 1).
Loop mode is sometimes used to check software, independent of connections in the
external system, to help isolate system problems. In this mode, the internal loop back
connection from the transmitter to the receiver causes the receiver to receive characters
that are sent out by the transmitter.
15.4.6.4 Single-wire operation
When SCI_C1[LOOPS] is set, SCI_C1[RSRC] chooses between loop mode
(SCI_C1[RSRC] = 0) or single-wire mode (SCI_C1[RSRC] = 1). Single-wire mode
implements a half-duplex serial connection. The receiver is internally connected to the
transmitter output and to the TxD pin. The RxD pin is not used and reverts to a generalpurpose port I/O pin.
In single-wire mode, the SCI_C3[TXDIR] bit controls the direction of serial data on the
TxD pin. When SCI_C3[TXDIR] is cleared, the TxD pin is an input to the SCI receiver
and the transmitter is temporarily disconnected from the TxD pin so an external device
can send serial data to the receiver. When SCI_C3[TXDIR] is set, the TxD pin is an
output driven by the transmitter. In single-wire mode, the transmitter output is internally
connected to the receiver input and the RxD pin is not used by the SCI, so it reverts to a
general-purpose port I/O pin.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
403
Functional description
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
404
Freescale Semiconductor, Inc.
Chapter 16
8-Bit Serial Peripheral Interface (8-Bit SPI)
16.1 Introduction
NOTE
For the chip-specific implementation details of this module's
instances, see the chip configuration information.
The serial peripheral interface (SPI) module provides for full-duplex, synchronous, serial
communication between the MCU and peripheral devices. These peripheral devices can
include other microcontrollers, analog-to-digital converters, shift registers, sensors, and
memories, among others.
The SPI runs at a baud rate up to the bus clock divided by two in master mode and up to
the bus clock divided by four in slave mode. Software can poll the status flags, or SPI
operation can be interrupt driven.
NOTE
For the actual maximum SPI baud rate, refer to the Chip
Configuration details and to the device’s Data Sheet.
The SPI also includes a hardware match feature for the receive data buffer.
16.1.1 Features
The SPI includes these distinctive features:
• Master mode or slave mode operation
• Full-duplex or single-wire bidirectional mode
• Programmable transmit bit rate
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
405
Introduction
• Double-buffered transmit and receive data register
• Serial clock phase and polarity options
• Slave select output
• Mode fault error flag with CPU interrupt capability
• Control of SPI operation during wait mode
• Selectable MSB-first or LSB-first shifting
• Receive data buffer hardware match feature
16.1.2 Modes of operation
The SPI functions in the following three modes.
• Run mode
This is the basic mode of operation.
• Wait mode
SPI operation in Wait mode is a configurable low power mode, controlled by the
SPISWAI bit located in the SPIx_C2 register. In Wait mode, if C2[SPISWAI] is
clear, the SPI operates like in Run mode. If C2[SPISWAI] is set, the SPI goes into a
power conservative state, with the SPI clock generation turned off. If the SPI is
configured as a master, any transmission in progress stops, but is resumed after CPU
enters Run mode. If the SPI is configured as a slave, reception and transmission of a
byte continues, so that the slave stays synchronized to the master.
• Stop mode
To reduce power consumption, the SPI is inactive in stop modes where the peripheral
bus clock is stopped but internal logic states are retained. If the SPI is configured as a
master, any transmission in progress stops, but is resumed after the CPU enters run
mode. If the SPI is configured as a slave, reception and transmission of a data
continues, so that the slave stays synchronized to the master.
The SPI is completely disabled in Stop modes where the peripheral bus clock is
stopped and internal logic states are not retained. When the CPU wakes from these
Stop modes, all SPI register content is reset.
Detailed descriptions of operating modes appear in Low-power mode options.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
406
Freescale Semiconductor, Inc.
Chapter 16 8-Bit Serial Peripheral Interface (8-Bit SPI)
16.1.3 Block diagrams
This section includes block diagrams showing SPI system connections, the internal
organization of the SPI module, and the SPI clock dividers that control the master mode
bit rate.
16.1.3.1 SPI system block diagram
The following figure shows the SPI modules of two MCUs connected in a master-slave
arrangement. The master device initiates all SPI data transfers. During a transfer, the
master shifts data out (on the MOSI pin) to the slave while simultaneously shifting data
in (on the MISO pin) from the slave. The transfer effectively exchanges the data that was
in the SPI shift registers of the two SPI systems. The SPSCK signal is a clock output
from the master and an input to the slave. The slave device must be selected by a low
level on the slave select input (SS pin). In this system, the master device has configured
its SS pin as an optional slave select output.
SLAVE
MASTER
MOSI
MOSI
SPI SHIFTER
SPI SHIFTER
MISO
8 BITS
SPSCK
CLOCK
GENERATOR
SS
MISO
8 BITS
SPSCK
SS
Figure 16-1. SPI system connections
16.1.3.2 SPI module block diagram
The following is a block diagram of the SPI module. The central element of the SPI is the
SPI shift register. Data is written to the double-buffered transmitter (write to SPIx_D) and
gets transferred to the SPI Shift Register at the start of a data transfer. After shifting in 8
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
407
Introduction
bits of data, the data is transferred into the double-buffered receiver where it can be read
from SPIx_D. Pin multiplexing logic controls connections between MCU pins and the
SPI module.
When the SPI is configured as a master, the clock output is routed to the SPSCK pin, the
shifter output is routed to MOSI, and the shifter input is routed from the MISO pin.
When the SPI is configured as a slave, the SPSCK pin is routed to the clock input of the
SPI, the shifter output is routed to MISO, and the shifter input is routed from the MOSI
pin.
In the external SPI system, simply connect all SPSCK pins to each other, all MISO pins
together, and all MOSI pins together. Peripheral devices often use slightly different
names for these pins.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
408
Freescale Semiconductor, Inc.
Chapter 16 8-Bit Serial Peripheral Interface (8-Bit SPI)
PIN CONTROL
M
SPE
MOSI
(MOMI)
S
Tx BUFFER (WRITE SPIxD)
ENABLE
SPI SYSTEM
M
SPI SHIFT REGISTER
SHIFT
OUT
SHIFT
IN
Rx BUFFER (READ SPIxD)
MISO
(SISO)
S
SPC0
BIDIROE
LSBFE
SHIFT
DIRECTION
SHIFT Rx BUFFER Tx BUFFER
FULL
CLOCK
EMPTY
MASTER CLOCK
BUS RATE
CLOCK
MSTR
SPIBR
CLOCK GENERATOR
CLOCK
LOGIC
SLAVE CLOCK
MASTER/SLAVE
M
SPSCK
S
MASTER/
SLAVE
MODE SELECT
MODSSOE
MODE FAULT
DETECTION
SPRF
8-BIT COMPARATOR
SPIxM
SS
SPMF
SPMIE
SPTEF
SPTIE
MODF
SPIE
INTERRUPT
REQUEST
Figure 16-2. SPI module block diagram without FIFO
16.2 External signal description
The SPI optionally shares four port pins. The function of these pins depends on the
settings of SPI control bits. When the SPI is disabled (SPE = 0), these four pins revert to
other functions that are not controlled by the SPI (based on chip configuration).
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
409
External signal description
16.2.1 SPSCK — SPI Serial Clock
When the SPI is enabled as a slave, this pin is the serial clock input. When the SPI is
enabled as a master, this pin is the serial clock output.
16.2.2 MOSI — Master Data Out, Slave Data In
When the SPI is enabled as a master and SPI pin control zero (SPC0) is 0 (not
bidirectional mode), this pin is the serial data output. When the SPI is enabled as a slave
and SPC0 is 0, this pin is the serial data input. If SPC0 is 1 to select single-wire
bidirectional mode, and master mode is selected, this pin becomes the bidirectional data
I/O pin (MOMI). Also, the bidirectional mode output enable bit determines whether the
pin acts as an input (BIDIROE is 0) or an output (BIDIROE is 1). If SPC0 is 1 and slave
mode is selected, this pin is not used by the SPI and reverts to other functions (based on
chip configuration).
16.2.3 MISO — Master Data In, Slave Data Out
When the SPI is enabled as a master and SPI pin control zero (SPC0) is 0 (not
bidirectional mode), this pin is the serial data input. When the SPI is enabled as a slave
and SPC0 is 0, this pin is the serial data output. If SPC0 is 1 to select single-wire
bidirectional mode, and slave mode is selected, this pin becomes the bidirectional data
I/O pin (SISO), and the bidirectional mode output enable bit determines whether the pin
acts as an input (BIDIROE is 0) or an output (BIDIROE is 1). If SPC0 is 1 and master
mode is selected, this pin is not used by the SPI and reverts to other functions (based on
chip configuration).
16.2.4 SS — Slave Select
When the SPI is enabled as a slave, this pin is the low-true slave select input. When the
SPI is enabled as a master and mode fault enable is off (MODFEN is 0), this pin is not
used by the SPI and reverts to other functions (based on chip configuration). When the
SPI is enabled as a master and MODFEN is 1, the slave select output enable bit
determines whether this pin acts as the mode fault input (SSOE is 0) or as the slave select
output (SSOE is 1).
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
410
Freescale Semiconductor, Inc.
Chapter 16 8-Bit Serial Peripheral Interface (8-Bit SPI)
16.3 Memory map/register definition
The SPI has 8-bit registers to select SPI options, to control baud rate, to report SPI status,
to hold an SPI data match value, and for transmit/receive data.
SPI memory map
Address
offset (hex)
Absolute
address
(hex)
0
3098
SPI Control Register 1 (SPI0_C1)
8
1
3099
SPI Control Register 2 (SPI0_C2)
2
309A
3
Width
Access
(in bits)
Reset value
Section/
page
R/W
04h
16.3.1/411
8
R/W
00h
16.3.2/413
SPI Baud Rate Register (SPI0_BR)
8
R/W
00h
16.3.3/414
309B
SPI Status Register (SPI0_S)
8
R
20h
16.3.4/415
5
309D
SPI Data Register (SPI0_D)
8
R/W
00h
16.3.5/416
7
309F
SPI Match Register (SPI0_M)
8
R/W
00h
16.3.6/417
Register name
16.3.1 SPI Control Register 1 (SPIx_C1)
This read/write register includes the SPI enable control, interrupt enables, and
configuration options.
Address: 3098h base + 0h offset = 3098h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
SPIE
SPE
SPTIE
MSTR
CPOL
CPHA
SSOE
LSBFE
0
0
0
0
0
1
0
0
SPI0_C1 field descriptions
Field
7
SPIE
Description
SPI Interrupt Enable: for SPRF and MODF
Enables the interrupt for SPI receive buffer full (SPRF) and mode fault (MODF) events.
0
1
6
SPE
Interrupts from SPRF and MODF are inhibited—use polling
Request a hardware interrupt when SPRF or MODF is 1
SPI System Enable
Enables the SPI system and dedicates the SPI port pins to SPI system functions. If SPE is cleared, the
SPI is disabled and forced into an idle state, and all status bits in the S register are reset.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
411
Memory map/register definition
SPI0_C1 field descriptions (continued)
Field
Description
0
1
5
SPTIE
SPI Transmit Interrupt Enable
This is the interrupt enable bit for SPI transmit buffer empty (SPTEF). An interrupt occurs when the SPI
transmit buffer is empty (SPTEF is set).
0
1
4
MSTR
Interrupts from SPTEF inhibited (use polling)
When SPTEF is 1, hardware interrupt requested
Master/Slave Mode Select
Selects master or slave mode operation.
0
1
3
CPOL
SPI system inactive
SPI system enabled
SPI module configured as a slave SPI device
SPI module configured as a master SPI device
Clock Polarity
Selects an inverted or non-inverted SPI clock. To transmit data between SPI modules, the SPI modules
must have identical CPOL values.
This bit effectively places an inverter in series with the clock signal either from a master SPI device or to a
slave SPI device. Refer to the description of “SPI Clock Formats” for details.
0
1
2
CPHA
Clock Phase
Selects one of two clock formats for different kinds of synchronous serial peripheral devices. Refer to the
description of “SPI Clock Formats” for details.
0
1
1
SSOE
Active-high SPI clock (idles low)
Active-low SPI clock (idles high)
First edge on SPSCK occurs at the middle of the first cycle of a data transfer.
First edge on SPSCK occurs at the start of the first cycle of a data transfer.
Slave Select Output Enable
This bit is used in combination with the Mode Fault Enable (MODFEN) field in the C2 register and the
Master/Slave (MSTR) control bit to determine the function of the SS pin.
0
1
When C2[MODFEN] is 0: In master mode, SS pin function is general-purpose I/O (not SPI). In slave
mode, SS pin function is slave select input.
When C2[MODFEN] is 1: In master mode, SS pin function is SS input for mode fault. In slave mode,
SS pin function is slave select input.
When C2[MODFEN] is 0: In master mode, SS pin function is general-purpose I/O (not SPI). In slave
mode, SS pin function is slave select input.
When C2[MODFEN] is 1: In master mode, SS pin function is automatic SS output. In slave mode: SS
pin function is slave select input.
0
LSBFE
LSB First (shifter direction)
This bit does not affect the position of the MSB and LSB in the data register. Reads and writes of the data
register always have the MSB in bit 7.
0
1
SPI serial data transfers start with the most significant bit.
SPI serial data transfers start with the least significant bit.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
412
Freescale Semiconductor, Inc.
Chapter 16 8-Bit Serial Peripheral Interface (8-Bit SPI)
16.3.2 SPI Control Register 2 (SPIx_C2)
This read/write register is used to control optional features of the SPI system. Bit 6 is not
implemented and always reads 0.
Address: 3098h base + 1h offset = 3099h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
SPMIE
Reserved
Reserved
MODFEN
BIDIROE
Reserved
SPISWAI
SPC0
0
0
0
0
0
0
0
0
SPI0_C2 field descriptions
Field
7
SPMIE
Description
SPI Match Interrupt Enable
This is the interrupt enable bit for the SPI receive data buffer hardware match (SPMF) function.
0
1
Interrupts from SPMF inhibited (use polling)
When SPMF is 1, requests a hardware interrupt
6
Reserved
This field is reserved.
Do not write to this reserved bit.
5
Reserved
This field is reserved.
Do not write to this reserved bit.
4
MODFEN
Master Mode-Fault Function Enable
When the SPI is configured for slave mode, this bit has no meaning or effect. (The SS pin is the slave
select input.) In master mode, this bit determines how the SS pin is used. For details, refer to the
description of the SSOE bit in the C1 register.
0
1
3
BIDIROE
Mode fault function disabled, master SS pin reverts to general-purpose I/O not controlled by SPI
Mode fault function enabled, master SS pin acts as the mode fault input or the slave select output
Bidirectional Mode Output Enable
When bidirectional mode is enabled because SPI pin control 0 (SPC0) is set to 1, BIDIROE determines
whether the SPI data output driver is enabled to the single bidirectional SPI I/O pin. Depending on whether
the SPI is configured as a master or a slave, it uses the MOSI (MOMI) or MISO (SISO) pin, respectively,
as the single SPI data I/O pin. When SPC0 is 0, BIDIROE has no meaning or effect.
0
1
Output driver disabled so SPI data I/O pin acts as an input
SPI I/O pin enabled as an output
2
Reserved
This field is reserved.
Do not write to this reserved bit.
1
SPISWAI
SPI Stop in Wait Mode
This bit is used for power conservation while the device is in Wait mode.
0
1
SPI clocks continue to operate in Wait mode.
SPI clocks stop when the MCU enters Wait mode.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
413
Memory map/register definition
SPI0_C2 field descriptions (continued)
Field
0
SPC0
Description
SPI Pin Control 0
Enables bidirectional pin configurations.
0
SPI uses separate pins for data input and data output (pin mode is normal).
In master mode of operation: MISO is master in and MOSI is master out.
1
In slave mode of operation: MISO is slave out and MOSI is slave in.
SPI configured for single-wire bidirectional operation (pin mode is bidirectional).
In master mode of operation: MISO is not used by SPI; MOSI is master in when BIDIROE is 0 or
master I/O when BIDIROE is 1.
In slave mode of operation: MISO is slave in when BIDIROE is 0 or slave I/O when BIDIROE is 1;
MOSI is not used by SPI.
16.3.3 SPI Baud Rate Register (SPIx_BR)
Use this register to set the prescaler and bit rate divisor for an SPI master. This register
may be read or written at any time.
Address: 3098h base + 2h offset = 309Ah
Bit
7
Read
Write
Reset
0
0
6
5
4
3
2
SPPR[2:0]
0
0
1
0
0
0
SPR[3:0]
0
0
0
SPI0_BR field descriptions
Field
Description
7
Reserved
This field is reserved.
This read-only field is reserved and always has the value 0.
6–4
SPPR[2:0]
SPI Baud Rate Prescale Divisor
This 3-bit field selects one of eight divisors for the SPI baud rate prescaler. The input to this prescaler is
the bus rate clock (BUSCLK). The output of this prescaler drives the input of the SPI baud rate divider.
Refer to the description of “SPI Baud Rate Generation” for details.
000
001
010
011
100
101
110
111
Baud rate prescaler divisor is 1.
Baud rate prescaler divisor is 2.
Baud rate prescaler divisor is 3.
Baud rate prescaler divisor is 4.
Baud rate prescaler divisor is 5.
Baud rate prescaler divisor is 6.
Baud rate prescaler divisor is 7.
Baud rate prescaler divisor is 8.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
414
Freescale Semiconductor, Inc.
Chapter 16 8-Bit Serial Peripheral Interface (8-Bit SPI)
SPI0_BR field descriptions (continued)
Field
SPR[3:0]
Description
SPI Baud Rate Divisor
This 4-bit field selects one of nine divisors for the SPI baud rate divider. The input to this divider comes
from the SPI baud rate prescaler. Refer to the description of “SPI Baud Rate Generation” for details.
0000
0001
0010
0011
0100
0101
0110
0111
1000
All others
Baud rate divisor is 2.
Baud rate divisor is 4.
Baud rate divisor is 8.
Baud rate divisor is 16.
Baud rate divisor is 32.
Baud rate divisor is 64.
Baud rate divisor is 128.
Baud rate divisor is 256.
Baud rate divisor is 512.
Reserved
16.3.4 SPI Status Register (SPIx_S)
This register contains read-only status bits. Writes have no meaning or effect.
NOTE
Bits 3 through 0 are not implemented and always read 0.
Address: 3098h base + 3h offset = 309Bh
Bit
Read
7
6
5
4
SPRF
SPMF
SPTEF
MODF
0
0
1
0
3
2
1
0
0
0
0
Write
Reset
0
0
SPI0_S field descriptions
Field
7
SPRF
Description
SPI Read Buffer Full Flag
SPRF is set at the completion of an SPI transfer to indicate that received data may be read from the SPI
data (D) register. SPRF is cleared by reading SPRF while it is set and then reading the SPI data register.
0
1
6
SPMF
No data available in the receive data buffer
Data available in the receive data buffer
SPI Match Flag
SPMF is set after SPRF is 1 when the value in the receive data buffer matches the value in the M register.
To clear the flag, read SPMF when it is set and then write a 1 to it.
0
1
Value in the receive data buffer does not match the value in the M register
Value in the receive data buffer matches the value in the M register
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
415
Memory map/register definition
SPI0_S field descriptions (continued)
Field
5
SPTEF
Description
SPI Transmit Buffer Empty Flag
This bit is set when the transmit data buffer is empty. SPTEF is cleared by reading the S register with
SPTEF set and then writing a data value to the transmit buffer at D. The S register must be read with
SPTEF set to 1 before writing data to the D register; otherwise, the D write is ignored. SPTEF is
automatically set when all data from the transmit buffer transfers into the transmit shift register. For an idle
SPI, data written to D is transferred to the shifter almost immediately so that SPTEF is set within two bus
cycles, allowing a second set of data to be queued into the transmit buffer. After completion of the transfer
of the data in the shift register, the queued data from the transmit buffer automatically moves to the shifter,
and SPTEF is set to indicate that room exists for new data in the transmit buffer. If no new data is waiting
in the transmit buffer, SPTEF simply remains set and no data moves from the buffer to the shifter.
If a transfer does not stop, the last data that was transmitted is sent out again.
0
1
4
MODF
SPI transmit buffer empty
Master Mode Fault Flag
MODF is set if the SPI is configured as a master and the slave select input goes low, indicating some
other SPI device is also configured as a master. The SS pin acts as a mode fault error input only when
C1[MSTR] is 1, C2[MODFEN] is 1, and C1[SSOE] is 0; otherwise, MODF will never be set. MODF is
cleared by reading MODF while it is 1 and then writing to the SPI Control Register 1 (C1).
0
1
Reserved
SPI transmit buffer not empty
No mode fault error
Mode fault error detected
This field is reserved.
This read-only field is reserved and always has the value 0.
16.3.5 SPI Data Register (SPIx_D)
This register is both the input and output register for SPI data. A write to the register
writes to the transmit data buffer, allowing data to be queued and transmitted.
When the SPI is configured as a master, data queued in the transmit data buffer is
transmitted immediately after the previous transmission has completed.
The SPTEF bit in the S register indicates when the transmit data buffer is ready to accept
new data. The S register must be read when S[SPTEF] is set before writing to the SPI
data register; otherwise, the write is ignored.
Data may be read from the SPI data register any time after S[SPRF] is set and before
another transfer is finished. Failure to read the data out of the receive data buffer before a
new transfer ends causes a receive overrun condition, and the data from the new transfer
is lost. The new data is lost because the receive buffer still held the previous character
and was not ready to accept the new data. There is no indication for a receive overrun
condition, so the application system designer must ensure that previous data has been
read from the receive buffer before a new transfer is initiated.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
416
Freescale Semiconductor, Inc.
Chapter 16 8-Bit Serial Peripheral Interface (8-Bit SPI)
Address: 3098h base + 5h offset = 309Dh
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
Bits[7:0]
0
0
0
0
SPI0_D field descriptions
Field
Bits[7:0]
Description
Data (low byte)
16.3.6 SPI Match Register (SPIx_M)
This register contains the hardware compare value. When the value received in the SPI
receive data buffer equals this hardware compare value, the SPI Match Flag in the S
register (S[SPMF]) sets.
Address: 3098h base + 7h offset = 309Fh
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
Bits[7:0]
0
0
0
0
SPI0_M field descriptions
Field
Bits[7:0]
Description
Hardware compare value (low byte)
16.4 Functional description
This section provides the functional description of the module.
16.4.1 General
The SPI system is enabled by setting the SPI enable (SPE) bit in SPI Control Register 1.
While C1[SPE] is set, the four associated SPI port pins are dedicated to the SPI function
as:
• Slave select (SS)
• Serial clock (SPSCK)
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
417
Functional description
• Master out/slave in (MOSI)
• Master in/slave out (MISO)
An SPI transfer is initiated in the master SPI device by reading the SPI status register
(SPIx_S) when S[SPTEF] = 1 and then writing data to the transmit data buffer (write to
SPIxD ). When a transfer is complete, received data is moved into the receive data buffer.
The SPIxD register acts as the SPI receive data buffer for reads and as the SPI transmit
data buffer for writes.
The Clock Phase Control (CPHA) and Clock Polarity Control (CPOL) bits in the SPI
Control Register 1 (SPIx_C1) select one of four possible clock formats to be used by the
SPI system. The CPOL bit simply selects a non-inverted or inverted clock. C1[CPHA] is
used to accommodate two fundamentally different protocols by sampling data on odd
numbered SPSCK edges or on even numbered SPSCK edges.
The SPI can be configured to operate as a master or as a slave. When the MSTR bit in
SPI Control Register 1 is set, master mode is selected; when C1[MSTR] is clear, slave
mode is selected.
16.4.2 Master mode
The SPI operates in master mode when C1[MSTR] is set. Only a master SPI module can
initiate transmissions. A transmission begins by reading the SPIx_S register while
S[SPTEF] = 1 and writing to the master SPI data registers. If the shift register is empty,
the byte immediately transfers to the shift register. The data begins shifting out on the
MOSI pin under the control of the serial clock.
• SPSCK
• The SPR3, SPR2, SPR1, and SPR0 baud rate selection bits in conjunction with
the SPPR2, SPPR1, and SPPR0 baud rate preselection bits in the SPI Baud Rate
register control the baud rate generator and determine the speed of the
transmission. The SPSCK pin is the SPI clock output. Through the SPSCK pin,
the baud rate generator of the master controls the shift register of the slave
peripheral.
• MOSI, MISO pin
• In master mode, the function of the serial data output pin (MOSI) and the serial
data input pin (MISO) is determined by the SPC0 and BIDIROE control bits.
• SS pin
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
418
Freescale Semiconductor, Inc.
Chapter 16 8-Bit Serial Peripheral Interface (8-Bit SPI)
• If C2[MODFEN] and C1[SSOE] are set, the SS pin is configured as slave select
output. The SS output becomes low during each transmission and is high when
the SPI is in idle state. If C2[MODFEN] is set and C1[SSOE] is cleared, the SS
pin is configured as input for detecting mode fault error. If the SS input becomes
low this indicates a mode fault error where another master tries to drive the
MOSI and SPSCK lines. In this case, the SPI immediately switches to slave
mode by clearing C1[MSTR] and also disables the slave output buffer MISO (or
SISO in bidirectional mode). As a result, all outputs are disabled, and SPSCK,
MOSI and MISO are inputs. If a transmission is in progress when the mode fault
occurs, the transmission is aborted and the SPI is forced into idle state. This
mode fault error also sets the Mode Fault (MODF) flag in the SPI Status Register
(SPIx_S). If the SPI Interrupt Enable bit (SPIE) is set when S[ MODF] gets set,
then an SPI interrupt sequence is also requested. When a write to the SPI Data
Register in the master occurs, there is a half SPSCK-cycle delay. After the delay,
SPSCK is started within the master. The rest of the transfer operation differs
slightly, depending on the clock format specified by the SPI clock phase bit,
CPHA, in SPI Control Register 1 (see SPI clock formats).
Note
A change of C1[CPOL], C1[CPHA], C1[SSOE], C1[LSBFE],
C2[MODFEN], C2[SPC0], C2[BIDIROE] with C2[SPC0] set,
SPPR2-SPPR0 and SPR3-SPR0 in master mode abort a
transmission in progress and force the SPI into idle state. The
remote slave cannot detect this, therefore the master has to
ensure that the remote slave is set back to idle state.
16.4.3 Slave mode
The SPI operates in slave mode when the MSTR bit in SPI Control Register 1 is clear.
• SPSCK
In slave mode, SPSCK is the SPI clock input from the master.
• MISO, MOSI pin
In slave mode, the function of the serial data output pin (MISO) and serial data input
pin (MOSI) is determined by the SPC0 bit and BIDIROE bit in SPI Control Register
2.
• SS pin
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
419
Functional description
The SS pin is the slave select input. Before a data transmission occurs, the SS pin of
the slave SPI must be low. SS must remain low until the transmission is complete. If
SS goes high, the SPI is forced into an idle state.
The SS input also controls the serial data output pin. If SS is high (not selected), the
serial data output pin is high impedance. If SS is low, the first bit in the SPI Data
Register is driven out of the serial data output pin. Also, if the slave is not selected
(SS is high), then the SPSCK input is ignored and no internal shifting of the SPI shift
register occurs.
Although the SPI is capable of duplex operation, some SPI peripherals are capable of
only receiving SPI data in a slave mode. For these simpler devices, there is no serial
data out pin.
Note
When peripherals with duplex capability are used, take care not
to simultaneously enable two receivers whose serial outputs
drive the same system slave's serial data output line.
As long as no more than one slave device drives the system slave's serial data output line,
it is possible for several slaves to receive the same transmission from a master, although
the master would not receive return information from all of the receiving slaves.
If the CPHA bit in SPI Control Register 1 is clear, odd numbered edges on the SPSCK
input cause the data at the serial data input pin to be latched. Even numbered edges cause
the value previously latched from the serial data input pin to shift into the LSB or MSB
of the SPI shift register, depending on the LSBFE bit.
If C1[CPHA] is set, even numbered edges on the SPSCK input cause the data at the serial
data input pin to be latched. Odd numbered edges cause the value previously latched
from the serial data input pin to shift into the LSB or MSB of the SPI shift register,
depending on C1[LSBFE].
When C1[CPHA] is set, the first edge is used to get the first data bit onto the serial data
output pin. When C1[CPHA] is clear and the SS input is low (slave selected), the first bit
of the SPI data is driven out of the serial data output pin. After the eighth shift, the
transfer is considered complete and the received data is transferred into the SPI Data
register. To indicate transfer is complete, the SPRF flag in the SPI Status Register is set.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
420
Freescale Semiconductor, Inc.
Chapter 16 8-Bit Serial Peripheral Interface (8-Bit SPI)
Note
A change of the bits C2[BIDIROE] with C2[SPC0] set,
C1[CPOL], C1[CPHA], C1[SSOE], C1[LSBFE],
C2[MODFEN], and C2[SPC0] in slave mode will corrupt a
transmission in progress and must be avoided.
16.4.4 SPI clock formats
To accommodate a wide variety of synchronous serial peripherals from different
manufacturers, the SPI system has a Clock Polarity (CPOL) bit and a Clock Phase
(CPHA) control bit in the Control Register 1 to select one of four clock formats for data
transfers. C1[CPOL] selectively inserts an inverter in series with the clock. C1[CPHA]
chooses between two different clock phase relationships between the clock and data.
The following figure shows the clock formats when CPHA = 1. At the top of the figure,
the eight bit times are shown for reference with bit 1 starting at the first SPSCK edge and
bit 8 ending one-half SPSCK cycle after the eighth SPSCK edge. The MSB first and LSB
first lines show the order of SPI data bits depending on the setting in LSBFE. Both
variations of SPSCK polarity are shown, but only one of these waveforms applies for a
specific transfer, depending on the value in C1[CPOL]. The SAMPLE IN waveform
applies to the MOSI input of a slave or the MISO input of a master. The MOSI waveform
applies to the MOSI output pin from a master and the MISO waveform applies to the
MISO output from a slave. The SS OUT waveform applies to the slave select output from
a master (provided C2[MODFEN] and C1[SSOE] = 1). The master SS output goes to
active low one-half SPSCK cycle before the start of the transfer and goes back high at the
end of the eighth bit time of the transfer. The SS IN waveform applies to the slave select
input of a slave.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
421
Functional description
BIT TIME #
(REFERENCE)
1
2
...
6
8
7
SPSCK
(CPOL = 0)
SPSCK
(CPOL = 1)
SAMPLE IN
(MISO OR MOSI)
MOSI
(MASTER OUT)
MSB FIRST
LSB FIRST
BIT 7
BIT 0
BIT 6
BIT 1
...
...
BIT 2
BIT 5
BIT 1
BIT 6
BIT 0
BIT 7
MISO
(SLAVE OUT)
SS OUT
(MASTER)
SS IN
(SLAVE)
Figure 16-15. SPI clock formats (CPHA = 1)
When C1[CPHA] = 1, the slave begins to drive its MISO output when SS goes to active
low, but the data is not defined until the first SPSCK edge. The first SPSCK edge shifts
the first bit of data from the shifter onto the MOSI output of the master and the MISO
output of the slave. The next SPSCK edge causes both the master and the slave to sample
the data bit values on their MISO and MOSI inputs, respectively. At the third SPSCK
edge, the SPI shifter shifts one bit position which shifts in the bit value that was just
sampled, and shifts the second data bit value out the other end of the shifter to the MOSI
and MISO outputs of the master and slave, respectively.
When C1[CPHA] = 1, the slave's SS input is not required to go to its inactive high level
between transfers. In this clock format, a back-to-back transmission can occur, as
follows:
1. A transmission is in progress.
2. A new data byte is written to the transmit buffer before the in-progress transmission
is complete.
3. When the in-progress transmission is complete, the new, ready data byte is
transmitted immediately.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
422
Freescale Semiconductor, Inc.
Chapter 16 8-Bit Serial Peripheral Interface (8-Bit SPI)
Between these two successive transmissions, no pause is inserted; the SS pin remains
low.
The following figure shows the clock formats when C1[CPHA] = 0. At the top of the
figure, the eight bit times are shown for reference with bit 1 starting as the slave is
selected (SS IN goes low), and bit 8 ends at the last SPSCK edge. The MSB first and
LSB first lines show the order of SPI data bits depending on the setting in LSBFE. Both
variations of SPSCK polarity are shown, but only one of these waveforms applies for a
specific transfer, depending on the value in CPOL. The SAMPLE IN waveform applies
to the MOSI input of a slave or the MISO input of a master. The MOSI waveform applies
to the MOSI output pin from a master and the MISO waveform applies to the MISO
output from a slave. The SS OUT waveform applies to the slave select output from a
master (provided C2[MODFEN] and C1[SSOE] = 1). The master SS output goes to
active low at the start of the first bit time of the transfer and goes back high one-half
SPSCK cycle after the end of the eighth bit time of the transfer. The SS IN waveform
applies to the slave select input of a slave.
BIT TIME #
(REFERENCE)
1
2
...
6
7
8
SPSCK
(CPOL = 0)
SPSCK
(CPOL = 1)
SAMPLE IN
(MISO OR MOSI)
MOSI
(MASTER OUT)
MSB FIRST
LSB FIRST
BIT 7
BIT 0
BIT 6
BIT 1
...
...
BIT 2
BIT 5
BIT 1
BIT 6
BIT 0
BIT 7
MISO
(SLAVE OUT)
SS OUT
(MASTER)
SS IN
(SLAVE)
Figure 16-16. SPI clock formats (CPHA = 0)
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
423
Functional description
When C1[CPHA] = 0, the slave begins to drive its MISO output with the first data bit
value (MSB or LSB depending on LSBFE) when SS goes to active low. The first SPSCK
edge causes both the master and the slave to sample the data bit values on their MISO
and MOSI inputs, respectively. At the second SPSCK edge, the SPI shifter shifts one bit
position which shifts in the bit value that was just sampled and shifts the second data bit
value out the other end of the shifter to the MOSI and MISO outputs of the master and
slave, respectively. When C1[CPHA] = 0, the slave's SS input must go to its inactive high
level between transfers.
16.4.5 SPI baud rate generation
As shown in the following figure, the clock source for the SPI baud rate generator is the
bus clock. The three prescale bits (SPPR2:SPPR1:SPPR0) choose a prescale divisor of 1,
2, 3, 4, 5, 6, 7, or 8. The three rate select bits (SPR3:SPR2:SPR1:SPR0) divide the output
of the prescaler stage by 2, 4, 8, 16, 32, 64, 128, 256, or 512 to get the internal SPI master
mode bit-rate clock.
The baud rate generator is activated only when the SPI is in the master mode and a serial
transfer is taking place. In the other cases, the divider is disabled to decrease IDD current.
The baud rate divisor equation is as follows (except those reserved combinations in the
SPI Baud Rate Divisor table).
BaudRateDivisor = (SPPR + 1) × 2(SPR
+ 1)
The baud rate can be calculated with the following equation:
BaudRate = BusClock / BaudRateDivisor
BUS
CLOCK
PRESCALER
BAUD RATE DIVIDER
DIVIDE BY
1, 2, 3, 4, 5, 6, 7, or 8
DIVIDE BY
2, 4, 8, 16, 32, 64, 128,
256, or 512
SPPR2:SPPR1:SPPR0
SPR3:SPR2:SPR1:SPR0
MASTER
SPI
BIT RATE
Figure 16-17. SPI baud rate generation
16.4.6 Special features
The following section describes the special features of SPI module.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
424
Freescale Semiconductor, Inc.
Chapter 16 8-Bit Serial Peripheral Interface (8-Bit SPI)
16.4.6.1 SS Output
The SS output feature automatically drives the SS pin low during transmission to select
external devices and drives the SS pin high during idle to deselect external devices. When
the SS output is selected, the SS output pin is connected to the SS input pin of the
external device.
The SS output is available only in master mode during normal SPI operation by asserting
C1[SSOE] and C2[MODFEN] as shown in the description of C1[SSOE].
The mode fault feature is disabled while SS output is enabled.
Note
Be careful when using the SS output feature in a multimaster
system because the mode fault feature is not available for
detecting system errors between masters.
16.4.6.2 Bidirectional mode (MOMI or SISO)
The bidirectional mode is selected when the SPC0 bit is set in SPI Control Register 2 (see
the following table). In this mode, the SPI uses only one serial data pin for the interface
with one or more external devices. C1[MSTR] decides which pin to use. The MOSI pin
becomes the serial data I/O (MOMI) pin for the master mode, and the MISO pin becomes
serial data I/O (SISO) pin for the slave mode. The MISO pin in master mode and MOSI
pin in slave mode are not used by the SPI.
Table 16-15. Normal Mode and Bidirectional Mode
When SPE = 1
Master Mode MSTR = 1
Serial Out
Normal Mode
SPC0 = 0
Bidirectional Mode
SPC0 = 1
Slave Mode MSTR = 0
MOSI
SPI
SPI
Serial In
MISO
Serial Out
Serial Out
MOMI
Serial In
SPI
Serial In
MOSI
Serial In
BIDIROE
SPI
MISO
BIDIROE
Serial Out
SISO
The direction of each serial I/O pin depends on C2[BIDIROE]. If the pin is configured as
an output, serial data from the shift register is driven out on the pin. The same pin is also
the serial input to the shift register.
The SPSCK is an output for the master mode and an input for the slave mode.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
425
Functional description
SS is the input or output for the master mode, and it is always the input for the slave
mode.
The bidirectional mode does not affect SPSCK and SS functions.
Note
In bidirectional master mode, with the mode fault feature
enabled, both data pins MISO and MOSI can be occupied by
the SPI, though MOSI is normally used for transmissions in
bidirectional mode and MISO is not used by the SPI. If a mode
fault occurs, the SPI is automatically switched to slave mode. In
this case, MISO becomes occupied by the SPI and MOSI is not
used. Consider this scenario if the MISO pin is used for another
purpose.
16.4.7 Error conditions
The SPI module has one error condition: the mode fault error.
16.4.7.1 Mode fault error
If the SS input becomes low while the SPI is configured as a master, it indicates a system
error where more than one master may be trying to drive the MOSI and SPSCK lines
simultaneously. This condition is not permitted in normal operation, and it sets the
MODF bit in the SPI status register automatically provided that C2[MODFEN] is set.
In the special case where the SPI is in master mode and C2[MODFEN] is cleared, the SS
pin is not used by the SPI. In this special case, the mode fault error function is inhibited
and MODF remains cleared. If the SPI system is configured as a slave, the SS pin is a
dedicated input pin. A mode fault error does not occur in slave mode.
If a mode fault error occurs, the SPI is switched to slave mode, with the exception that
the slave output buffer is disabled. So the SPSCK, MISO and MOSI pins are forced to be
high impedance inputs to avoid any possibility of conflict with another output driver. A
transmission in progress is aborted and the SPI is forced into idle state.
If the mode fault error occurs in the bidirectional mode for an SPI system configured in
master mode, the output enable of MOMI (MOSI in bidirectional mode) is cleared if it
was set. No mode fault error occurs in the bidirectional mode for the SPI system
configured in slave mode.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
426
Freescale Semiconductor, Inc.
Chapter 16 8-Bit Serial Peripheral Interface (8-Bit SPI)
The mode fault flag is cleared automatically by a read of the SPI Status Register (with
MODF set) followed by a write to SPI Control Register 1. If the mode fault flag is
cleared, the SPI becomes a normal master or slave again.
16.4.8 Low-power mode options
This section describes the low-power mode options.
16.4.8.1 SPI in Run mode
In Run mode, with the SPI system enable (SPE) bit in the SPI Control Register 1 clear,
the SPI system is in a low-power, disabled state. SPI registers can still be accessed, but
clocks to the core of this module are disabled.
16.4.8.2 SPI in Wait mode
SPI operation in Wait mode depends upon the state of the SPISWAI bit in SPI Control
Register 2.
• If C2[SPISWAI] is clear, the SPI operates normally when the CPU is in Wait mode.
• If C2[SPISWAI] is set, SPI clock generation ceases and the SPI module enters a
power conservation state when the CPU is in wait mode.
• If C2[SPISWAI] is set and the SPI is configured for master, any transmission
and reception in progress stops at Wait mode entry. The transmission and
reception resumes when the SPI exits Wait mode.
• If C2[SPISWAI] is set and the SPI is configured as a slave, any transmission and
reception in progress continues if the SPSCK continues to be driven from the
master. This keeps the slave synchronized to the master and the SPSCK.
If the master transmits data while the slave is in wait mode, the slave continues
to send data consistent with the operation mode at the start of wait mode (that is,
if the slave is currently sending its SPIx_D to the master, it continues to send the
same byte. Otherwise, if the slave is currently sending the last data received byte
from the master, it continues to send each previously received data from the
master byte).
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
427
Functional description
Note
Care must be taken when expecting data from a master while
the slave is in a Wait mode or a Stop mode where the peripheral
bus clock is stopped but internal logic states are retained. Even
though the shift register continues to operate, the rest of the SPI
is shut down (that is, an SPRF interrupt is not generated until an
exit from Stop or Wait mode). Also, the data from the shift
register is not copied into the SPIx_D registers until after the
slave SPI has exited Wait or Stop mode. An SPRF flag and
SPIx_D copy is only generated if Wait mode is entered or
exited during a transmission. If the slave enters Wait mode in
idle mode and exits Wait mode in idle mode, neither an SPRF
nor a SPIx_D copy occurs.
16.4.8.3 SPI in Stop mode
Operation in a Stop mode where the peripheral bus clock is stopped but internal logic
states are retained depends on the SPI system. The Stop mode does not depend on
C2[SPISWAI]. Upon entry to this type of stop mode, the SPI module clock is disabled
(held high or low).
• If the SPI is in master mode and exchanging data when the CPU enters the Stop
mode, the transmission is frozen until the CPU exits stop mode. After the exit from
stop mode, data to and from the external SPI is exchanged correctly.
• In slave mode, the SPI remains synchronized with the master.
The SPI is completely disabled in a stop mode where the peripheral bus clock is stopped
and internal logic states are not retained. After an exit from this type of stop mode, all
registers are reset to their default values, and the SPI module must be reinitialized.
16.4.9 Reset
The reset values of registers and signals are described in the Memory Map and Register
Descriptions content, which details the registers and their bitfields.
• If a data transmission occurs in slave mode after a reset without a write to SPIx_D,
the transmission consists of "garbage" or the data last received from the master
before the reset.
• Reading from SPIx_D after reset always returns zeros.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
428
Freescale Semiconductor, Inc.
Chapter 16 8-Bit Serial Peripheral Interface (8-Bit SPI)
16.4.10 Interrupts
The SPI originates interrupt requests only when the SPI is enabled (the SPE bit in the
SPIx_C1 register is set). The following is a description of how the SPI makes a request
and how the MCU should acknowledge that request. The interrupt vector offset and
interrupt priority are chip dependent.
Four flag bits, three interrupt mask bits, and one interrupt vector are associated with the
SPI system. The SPI interrupt enable mask (SPIE) enables interrupts from the SPI
receiver full flag (SPRF) and mode fault flag (MODF). The SPI transmit interrupt enable
mask (SPTIE) enables interrupts from the SPI transmit buffer empty flag (SPTEF). The
SPI match interrupt enable mask bit (SPIMIE) enables interrupts from the SPI match flag
(SPMF). When one of the flag bits is set, and the associated interrupt mask bit is set, a
hardware interrupt request is sent to the CPU. If the interrupt mask bits are cleared,
software can poll the associated flag bits instead of using interrupts. The SPI interrupt
service routine (ISR) should check the flag bits to determine which event caused the
interrupt. The service routine should also clear the flag bit(s) before returning from the
ISR (usually near the beginning of the ISR).
16.4.10.1 MODF
MODF occurs when the master detects an error on the SS pin. The master SPI must be
configured for the MODF feature (see the description of the C1[SSOE] bit). Once MODF
is set, the current transfer is aborted and the master (MSTR) bit in the SPIx_C1 register
resets to 0.
The MODF interrupt is reflected in the status register's MODF flag. Clearing the flag also
clears the interrupt. This interrupt stays active while the MODF flag is set. MODF has an
automatic clearing process that is described in the SPI Status Register.
16.4.10.2 SPRF
SPRF occurs when new data has been received and copied to the SPI receive data buffer.
After SPRF is set, it does not clear until it is serviced. SPRF has an automatic clearing
process that is described in the SPI Status Register details. If the SPRF is not serviced
before the end of the next transfer (that is, SPRF remains active throughout another
transfer), the subsequent transfers are ignored and no new data is copied into the Data
register.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
429
Initialization/application information
16.4.10.3 SPTEF
SPTEF occurs when the SPI transmit buffer is ready to accept new data.
After SPTEF is set, it does not clear until it is serviced. SPTEF has an automatic clearing
process that is described in the SPI Status Register details.
16.4.10.4 SPMF
SPMF occurs when the data in the receive data buffer is equal to the data in the SPI
Match Register.
16.5 Initialization/application information
This section discusses an example of how to initialize and use the SPI.
16.5.1 Initialization sequence
Before the SPI module can be used for communication, an initialization procedure must
be carried out, as follows:
1. Update the Control Register 1 (SPIx_C1) to enable the SPI and to control interrupt
enables. This register also sets the SPI as master or slave, determines clock phase and
polarity, and configures the main SPI options.
2. Update the Control Register 2 (SPIx_C2) to enable additional SPI functions such as
the SPI match interrupt feature, the master mode-fault function, and bidirectional
mode output as well as to control and other optional features.
3. Update the Baud Rate Register (SPIx_BR) to set the prescaler and bit rate divisor for
an SPI master.
4. Update the Hardware Match Register (SPIx_M) with the value to be compared to the
receive data register for triggering an interrupt if hardware match interrupts are
enabled.
5. In the master, read SPIx_S while S[SPTEF] = 1, and then write to the transmit data
register (SPIx_D) to begin transfer.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
430
Freescale Semiconductor, Inc.
Chapter 16 8-Bit Serial Peripheral Interface (8-Bit SPI)
16.5.2 Pseudo-Code Example
In this example, the SPI module is set up for master mode with only hardware match
interrupts enabled. The SPI runs at a maximum baud rate of bus clock divided by 2.
Clock phase and polarity are set for an active-high SPI clock where the first edge on
SPSCK occurs at the start of the first cycle of a data transfer.
SPIx_C1=0x54(%01010100)
Bit 7
SPIE
=
0
Disables receive and mode fault interrupts
Bit 6
SPE
=
1
Enables the SPI system
Bit 5
SPTIE
=
0
Disables SPI transmit interrupts
Bit 4
MSTR
=
1
Sets the SPI module as a master SPI device
Bit 3
CPOL
=
0
Configures SPI clock as active-high
Bit 2
CPHA
=
1
First edge on SPSCK at start of first data transfer cycle
Bit 1
SSOE
=
0
Determines SS pin function when mode fault enabled
Bit 0
LSBFE
=
0
SPI serial data transfers start with most significant bit
SPMIE
SPIx_C2 = 0x80(%10000000)
Bit 7
=
1
SPI hardware match interrupt enabled
Bit 6
=
0
Unimplemented
Bit 5
=
0
Reserved
Bit 4
MODFEN
=
0
Disables mode fault function
Bit 3
BIDIROE
=
0
SPI data I/O pin acts as input
=
0
Reserved
Bit 2
Bit 1
SPISWAI
=
0
SPI clocks operate in wait mode
Bit 0
SPC0
=
0
uses separate pins for data input and output
Bit 7
=
0
Reserved
Bit 6:4
=
000
Sets prescale divisor to 1
Bit 3:0
=
0000 Sets baud rate divisor to 2
SPIx_BR = 0x00(%00000000)
SPIx_S = 0x00(%00000000)
Bit 7
SPRF
=
0
Flag is set when receive data buffer is full
Bit 6
SPMF
=
0
Flag is set when SPIx_M = receive data buffer
Bit 5
SPTEF
=
0
Flag is set when transmit data buffer is empty
Bit 4
MODF
=
0
Mode fault flag for master mode
=
0
Reserved
Bit 3:0
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
431
Initialization/application information
SPIx_M = 0xXX
Holds bits 0–7 of the hardware match buffer.
SPIx_D = 0xxx
Holds bits 0–7 of the data to be transmitted by the transmit buffer and received by the receive buffer.
RESET
INITIALIZE SPI
SPIxC1 = 0x54
SPIxC2 = 0x80
SPIxBR = 0x00
YES
SPTEF = 1
?
NO
YES
WRITE TO
SPIxD
SPRF = 1
?
NO
YES
READ
SPIxD
SPMF = 1
?
NO
YES
READ SPMF WHILE SET
TO CLEAR FLAG,
THEN WRITE A 1 TO IT
CONTINUE
Figure 16-18. Initialization Flowchart Example for SPI Master Device
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
432
Freescale Semiconductor, Inc.
Chapter 17
Inter-Integrated Circuit (I2C)
17.1 Introduction
NOTE
For the chip-specific implementation details of this module's
instances, see the chip configuration information.
The inter-integrated circuit (I2C, I2C, or IIC) module provides a method of
communication between a number of devices.
The interface is designed to operate up to 100 kbit/s with maximum bus loading and
timing. The I2C device is capable of operating at higher baud rates, up to a maximum of
clock/20, with reduced bus loading. The maximum communication length and the
number of devices that can be connected are limited by a maximum bus capacitance of
400 pF. The I2C module also complies with the System Management Bus (SMBus)
Specification, version 2.
17.1.1 Features
The I2C module has the following features:
•
•
•
•
•
•
•
•
•
•
Compatible with The I2C-Bus Specification
Multimaster operation
Software programmable for one of 64 different serial clock frequencies
Software-selectable acknowledge bit
Interrupt-driven byte-by-byte data transfer
Arbitration-lost interrupt with automatic mode switching from master to slave
Calling address identification interrupt
START and STOP signal generation and detection
Repeated START signal generation and detection
Acknowledge bit generation and detection
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
433
Introduction
•
•
•
•
•
•
•
Bus busy detection
General call recognition
10-bit address extension
Support for System Management Bus (SMBus) Specification, version 2
Programmable input glitch filter
Low power mode wakeup on slave address match
Range slave address support
17.1.2 Modes of operation
The I2C module's operation in various low power modes is as follows:
• Run mode: This is the basic mode of operation. To conserve power in this mode,
disable the module.
• Wait mode: The module continues to operate when the core is in Wait mode and can
provide a wakeup interrupt.
• Stop mode: The module is inactive in Stop3 mode for reduced power consumption,
except that address matching is enabled in Stop3 mode. The STOP instruction does
not affect the I2C module's register states.
17.1.3 Block diagram
The following figure is a functional block diagram of the I2C module.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
434
Freescale Semiconductor, Inc.
Chapter 17 Inter-Integrated Circuit (I2C)
Module Enable
Address
Write/Read
Interrupt
DATA_MUX
ADDR_DECODE
CTRL_REG
FREQ_REG ADDR_REG
Input
Sync
START
STOP
Arbitration
Control
Clock
Control
STATUS_REG
DATA_REG
In/Out
Data
Shift
Register
Address
Compare
SCL
SDA
Figure 17-1. I2C Functional block diagram
17.2 I2C signal descriptions
The signal properties of I2C are shown in the table found here.
Table 17-1. I2C signal descriptions
Signal
Description
I/O
SCL
Bidirectional serial clock line of the I2C system.
I/O
SDA
Bidirectional serial data line of the I2C system.
I/O
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
435
Memory map/register definition
17.3 Memory map/register definition
This section describes in detail all I2C registers accessible to the end user.
I2C memory map
Absolute
address
(hex)
Width
Access
(in bits)
Register name
Reset value
Section/
page
3070
I2C Address Register 1 (I2C_A1)
8
R/W
00h
17.3.1/436
3071
I2C Frequency Divider register (I2C_F)
8
R/W
00h
17.3.2/437
3072
I2C Control Register 1 (I2C_C1)
8
R/W
00h
17.3.3/438
3073
I2C Status register (I2C_S)
8
R/W
80h
17.3.4/439
3074
I2C Data I/O register (I2C_D)
8
R/W
00h
17.3.5/441
3075
I2C Control Register 2 (I2C_C2)
8
R/W
00h
17.3.6/442
3076
I2C Programmable Input Glitch Filter Register (I2C_FLT)
8
R/W
00h
17.3.7/442
3077
I2C Range Address register (I2C_RA)
8
R/W
00h
17.3.8/443
3078
I2C SMBus Control and Status register (I2C_SMB)
8
R/W
00h
17.3.9/443
3079
I2C Address Register 2 (I2C_A2)
8
R/W
C2h
17.3.10/445
307A
I2C SCL Low Timeout Register High (I2C_SLTH)
8
R/W
00h
17.3.11/445
307B
I2C SCL Low Timeout Register Low (I2C_SLTL)
8
R/W
00h
17.3.12/446
17.3.1 I2C Address Register 1 (I2C_A1)
This register contains the slave address to be used by the I2C module.
Address: 3070h base + 0h offset = 3070h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
AD[7:1]
0
0
0
0
0
0
0
0
0
0
I2C_A1 field descriptions
Field
7–1
AD[7:1]
0
Reserved
Description
Address
Contains the primary slave address used by the I2C module when it is addressed as a slave. This field is
used in the 7-bit address scheme and the lower seven bits in the 10-bit address scheme.
This field is reserved.
This read-only field is reserved and always has the value 0.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
436
Freescale Semiconductor, Inc.
Chapter 17 Inter-Integrated Circuit (I2C)
17.3.2 I2C Frequency Divider register (I2C_F)
Address: 3070h base + 1h offset = 3071h
Bit
Read
Write
Reset
7
6
5
4
3
MULT
0
2
1
0
0
0
0
ICR
0
0
0
0
I2C_F field descriptions
Field
7–6
MULT
Description
Multiplier Factor
Defines the multiplier factor (mul). This factor is used along with the SCL divider to generate the I2C baud
rate.
00
01
10
11
ICR
mul = 1
mul = 2
mul = 4
Reserved
ClockRate
Prescales the I2C module clock for bit rate selection. This field and the MULT field determine the I2C baud
rate, the SDA hold time, the SCL start hold time, and the SCL stop hold time. For a list of values
corresponding to each ICR setting, see I2C divider and hold values.
The SCL divider multiplied by multiplier factor (mul) determines the I2C baud rate.
I2C baud rate = I2C module clock speed (Hz)/(mul × SCL divider)
The SDA hold time is the delay from the falling edge of SCL (I2C clock) to the changing of SDA (I2C data).
SDA hold time = I2C module clock period (s) × mul × SDA hold value
The SCL start hold time is the delay from the falling edge of SDA (I2C data) while SCL is high (start
condition) to the falling edge of SCL (I2C clock).
SCL start hold time = I2C module clock period (s) × mul × SCL start hold value
The SCL stop hold time is the delay from the rising edge of SCL (I2C clock) to the rising edge of SDA (I2C
data) while SCL is high (stop condition).
SCL stop hold time = I2C module clock period (s) × mul × SCL stop hold value
For example, if the I2C module clock speed is 8 MHz, the following table shows the possible hold time
values with different ICR and MULT selections to achieve an I2C baud rate of 100 kbit/s.
MULT
ICR
2h
Hold times (μs)
SDA
SCL Start
SCL Stop
00h
3.500
3.000
5.500
1h
07h
2.500
4.000
5.250
1h
0Bh
2.250
4.000
5.250
0h
14h
2.125
4.250
5.125
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
437
Memory map/register definition
I2C_F field descriptions (continued)
Field
Description
MULT
ICR
0h
18h
Hold times (μs)
SDA
SCL Start
SCL Stop
1.125
4.750
5.125
17.3.3 I2C Control Register 1 (I2C_C1)
Address: 3070h base + 2h offset = 3072h
Bit
Read
Write
Reset
7
6
5
4
3
IICEN
IICIE
MST
TX
TXAK
0
0
0
0
0
2
0
RSTA
0
1
WUEN
0
0
0
0
I2C_C1 field descriptions
Field
7
IICEN
Description
I2C Enable
Enables I2C module operation.
0
1
6
IICIE
I2C Interrupt Enable
Enables I2C interrupt requests.
0
1
5
MST
Disabled
Enabled
Master Mode Select
When MST is changed from 0 to 1, a START signal is generated on the bus and master mode is selected.
When this bit changes from 1 to 0, a STOP signal is generated and the mode of operation changes from
master to slave.
0
1
4
TX
Disabled
Enabled
Slave mode
Master mode
Transmit Mode Select
Selects the direction of master and slave transfers. In master mode this bit must be set according to the
type of transfer required. Therefore, for address cycles, this bit is always set. When addressed as a slave
this bit must be set by software according to the SRW bit in the status register.
0
1
Receive
Transmit
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
438
Freescale Semiconductor, Inc.
Chapter 17 Inter-Integrated Circuit (I2C)
I2C_C1 field descriptions (continued)
Field
3
TXAK
Description
Transmit Acknowledge Enable
Specifies the value driven onto the SDA during data acknowledge cycles for both master and slave
receivers. The value of SMB[FACK] affects NACK/ACK generation.
NOTE: SCL is held low until TXAK is written.
0
1
An acknowledge signal is sent to the bus on the following receiving byte (if FACK is cleared) or the
current receiving byte (if FACK is set).
No acknowledge signal is sent to the bus on the following receiving data byte (if FACK is cleared) or
the current receiving data byte (if FACK is set).
2
RSTA
Repeat START
1
WUEN
Wakeup Enable
Writing 1 to this bit generates a repeated START condition provided it is the current master. This bit will
always be read as 0. Attempting a repeat at the wrong time results in loss of arbitration.
The I2C module can wake the MCU from low power mode with no peripheral bus running when slave
address matching occurs.
0
1
0
Reserved
Normal operation. No interrupt generated when address matching in low power mode.
Enables the wakeup function in low power mode.
This field is reserved.
This read-only field is reserved and always has the value 0.
17.3.4 I2C Status register (I2C_S)
Address: 3070h base + 3h offset = 3073h
Bit
Read
7
6
TCF
IAAS
Write
Reset
1
0
5
4
BUSY
ARBL
3
RAM
w1c
0
0
0
2
1
0
SRW
IICIF
RXAK
w1c
0
0
0
I2C_S field descriptions
Field
7
TCF
Description
Transfer Complete Flag
Acknowledges a byte transfer; TCF is set on the completion of a byte transfer. This bit is valid only during
or immediately following a transfer to or from the I2C module. TCF is cleared by reading the I2C data
register in receive mode or by writing to the I2C data register in transmit mode.
0
1
6
IAAS
Transfer in progress
Transfer complete
Addressed As A Slave
This bit is set by one of the following conditions:
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
439
Memory map/register definition
I2C_S field descriptions (continued)
Field
Description
• The calling address matches the programmed primary slave address in the A1 register, or matches
the range address in the RA register (which must be set to a nonzero value and under the condition
I2C_C2[RMEN] = 1).
• C2[GCAEN] is set and a general call is received.
• SMB[SIICAEN] is set and the calling address matches the second programmed slave address.
• ALERTEN is set and an SMBus alert response address is received
• RMEN is set and an address is received that is within the range between the values of the A1 and
RA registers.
IAAS sets before the ACK bit. The CPU must check the SRW bit and set TX/RX accordingly. Writing the
C1 register with any value clears this bit.
0
1
5
BUSY
Bus Busy
Indicates the status of the bus regardless of slave or master mode. This bit is set when a START signal is
detected and cleared when a STOP signal is detected.
0
1
4
ARBL
Bus is idle
Bus is busy
Arbitration Lost
This bit is set by hardware when the arbitration procedure is lost. The ARBL bit must be cleared by
software, by writing 1 to it.
0
1
3
RAM
Not addressed
Addressed as a slave
Standard bus operation.
Loss of arbitration.
Range Address Match
This bit is set to 1 by any of the following conditions, if I2C_C2[RMEN] = 1:
• Any nonzero calling address is received that matches the address in the RA register.
• The calling address is within the range of values of the A1 and RA registers.
NOTE: For the RAM bit to be set to 1 correctly, C1[IICIE] must be set to 1.
Writing the C1 register with any value clears this bit to 0.
0
1
2
SRW
Slave Read/Write
When addressed as a slave, SRW indicates the value of the R/W command bit of the calling address sent
to the master.
0
1
1
IICIF
Not addressed
Addressed as a slave
Slave receive, master writing to slave
Slave transmit, master reading from slave
Interrupt Flag
This bit sets when an interrupt is pending. This bit must be cleared by software by writing 1 to it, such as in
the interrupt routine. One of the following events can set this bit:
• One byte transfer, including ACK/NACK bit, completes if FACK is 0. An ACK or NACK is sent on the
bus by writing 0 or 1 to TXAK after this bit is set in receive mode.
• One byte transfer, excluding ACK/NACK bit, completes if FACK is 1.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
440
Freescale Semiconductor, Inc.
Chapter 17 Inter-Integrated Circuit (I2C)
I2C_S field descriptions (continued)
Field
Description
• Match of slave address to calling address including primary slave address, range slave address,
alert response address, second slave address, or general call address.
• Arbitration lost
• In SMBus mode, any timeouts except SCL and SDA high timeouts
0
1
0
RXAK
No interrupt pending
Interrupt pending
Receive Acknowledge
0
1
Acknowledge signal was received after the completion of one byte of data transmission on the bus
No acknowledge signal detected
17.3.5 I2C Data I/O register (I2C_D)
Address: 3070h base + 4h offset = 3074h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
DATA
0
0
0
0
I2C_D field descriptions
Field
DATA
Description
Data
In master transmit mode, when data is written to this register, a data transfer is initiated. The most
significant bit is sent first. In master receive mode, reading this register initiates receiving of the next byte
of data.
NOTE: When making the transition out of master receive mode, switch the I2C mode before reading the
Data register to prevent an inadvertent initiation of a master receive data transfer.
In slave mode, the same functions are available after an address match occurs.
The C1[TX] bit must correctly reflect the desired direction of transfer in master and slave modes for the
transmission to begin. For example, if the I2C module is configured for master transmit but a master
receive is desired, reading the Data register does not initiate the receive.
Reading the Data register returns the last byte received while the I2C module is configured in master
receive or slave receive mode. The Data register does not reflect every byte that is transmitted on the I2C
bus, and neither can software verify that a byte has been written to the Data register correctly by reading it
back.
In master transmit mode, the first byte of data written to the Data register following assertion of MST (start
bit) or assertion of RSTA (repeated start bit) is used for the address transfer and must consist of the
calling address (in bits 7-1) concatenated with the required R/W bit (in position bit 0).
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
441
Memory map/register definition
17.3.6 I2C Control Register 2 (I2C_C2)
Address: 3070h base + 5h offset = 3075h
Bit
Read
Write
Reset
7
6
5
4
0
RMEN
0
0
GCAEN
ADEXT
0
0
0
0
3
2
1
0
AD[10:8]
0
0
0
I2C_C2 field descriptions
Field
7
GCAEN
Description
General Call Address Enable
Enables general call address.
0
1
6
ADEXT
Disabled
Enabled
Address Extension
Controls the number of bits used for the slave address.
0
1
7-bit address scheme
10-bit address scheme
5
Reserved
This field is reserved.
This read-only field is reserved and always has the value 0.
4
Reserved
This field is reserved.
This read-only field is reserved and always has the value 0.
3
RMEN
Range Address Matching Enable
This bit controls the slave address matching for addresses between the values of the A1 and RA registers.
When this bit is set, a slave address matching occurs for any address greater than the value of the A1
register and less than or equal to the value of the RA register.
0
1
AD[10:8]
Range mode disabled. No address matching occurs for an address within the range of values of the
A1 and RA registers.
Range mode enabled. Address matching occurs when a slave receives an address within the range of
values of the A1 and RA registers.
Slave Address
Contains the upper three bits of the slave address in the 10-bit address scheme. This field is valid only
while the ADEXT bit is set.
17.3.7 I2C Programmable Input Glitch Filter Register (I2C_FLT)
Address: 3070h base + 6h offset = 3076h
Bit
Read
Write
Reset
7
6
4
3
0
Reserved
0
5
0
2
1
0
0
0
FLT
0
0
0
0
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
442
Freescale Semiconductor, Inc.
Chapter 17 Inter-Integrated Circuit (I2C)
I2C_FLT field descriptions
Field
Description
7
Reserved
This field is reserved.
Writing this bit has no effect.
6–5
Reserved
This field is reserved.
This read-only field is reserved and always has the value 0.
FLT
I2C Programmable Filter Factor
Controls the width of the glitch, in terms of I2C module clock cycles, that the filter must absorb. For any
glitch whose size is less than or equal to this width setting, the filter does not allow the glitch to pass.
00h
01-1Fh
No filter/bypass
Filter glitches up to width of n I2C module clock cycles, where n=1-31d
17.3.8 I2C Range Address register (I2C_RA)
Address: 3070h base + 7h offset = 3077h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
RAD
0
0
0
0
0
0
0
0
0
I2C_RA field descriptions
Field
7–1
RAD
0
Reserved
Description
Range Slave Address
This field contains the slave address to be used by the I2C module. The field is used in the 7-bit address
scheme. If I2C_C2[RMEN] is set to 1, any nonzero value write enables this register. This register value
can be considered as a maximum boundary in the range matching mode.
This field is reserved.
This read-only field is reserved and always has the value 0.
17.3.9 I2C SMBus Control and Status register (I2C_SMB)
NOTE
When the SCL and SDA signals are held high for a length of
time greater than the high timeout period, the SHTF1 flag sets.
Before reaching this threshold, while the system is detecting
how long these signals are being held high, a master assumes
that the bus is free. However, the SHTF1 bit is set to 1 in the
bus transmission process with the idle bus state.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
443
Memory map/register definition
NOTE
When the TCKSEL bit is set, there is no need to monitor the
SHTF1 bit because the bus speed is too high to match the
protocol of SMBus.
Address: 3070h base + 8h offset = 3078h
Bit
Read
Write
Reset
7
6
5
4
FACK
ALERTEN
SIICAEN
TCKSEL
0
0
0
0
3
2
1
SLTF
SHTF1
SHTF2
w1c
0
w1c
0
0
0
SHTF2IE
0
I2C_SMB field descriptions
Field
7
FACK
Description
Fast NACK/ACK Enable
For SMBus packet error checking, the CPU must be able to issue an ACK or NACK according to the result
of receiving data byte.
0
1
6
ALERTEN
An ACK or NACK is sent on the following receiving data byte
Writing 0 to TXAK after receiving a data byte generates an ACK. Writing 1 to TXAK after receiving a
data byte generates a NACK.
SMBus Alert Response Address Enable
Enables or disables SMBus alert response address matching.
NOTE: After the host responds to a device that used the alert response address, you must use software
to put the device's address on the bus. The alert protocol is described in the SMBus specification.
0
1
5
SIICAEN
Second I2C Address Enable
Enables or disables SMBus device default address.
0
1
4
TCKSEL
I2C address register 2 matching is disabled
I2C address register 2 matching is enabled
Timeout Counter Clock Select
Selects the clock source of the timeout counter.
0
1
3
SLTF
SMBus alert response address matching is disabled
SMBus alert response address matching is enabled
Timeout counter counts at the frequency of the I2C module clock / 64
Timeout counter counts at the frequency of the I2C module clock
SCL Low Timeout Flag
This bit is set when the SLT register (consisting of the SLTH and SLTL registers) is loaded with a non-zero
value (LoValue) and an SCL low timeout occurs. Software clears this bit by writing a logic 1 to it.
NOTE: The low timeout function is disabled when the SLT register's value is 0.
0
1
No low timeout occurs
Low timeout occurs
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
444
Freescale Semiconductor, Inc.
Chapter 17 Inter-Integrated Circuit (I2C)
I2C_SMB field descriptions (continued)
Field
2
SHTF1
Description
SCL High Timeout Flag 1
This read-only bit sets when SCL and SDA are held high more than clock × LoValue / 512, which indicates
the bus is free. This bit is cleared automatically.
0
1
1
SHTF2
SCL High Timeout Flag 2
This bit sets when SCL is held high and SDA is held low more than clock × LoValue / 512. Software clears
this bit by writing 1 to it.
0
1
0
SHTF2IE
No SCL high and SDA high timeout occurs
SCL high and SDA high timeout occurs
No SCL high and SDA low timeout occurs
SCL high and SDA low timeout occurs
SHTF2 Interrupt Enable
Enables SCL high and SDA low timeout interrupt.
0
1
SHTF2 interrupt is disabled
SHTF2 interrupt is enabled
17.3.10 I2C Address Register 2 (I2C_A2)
Address: 3070h base + 9h offset = 3079h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
SAD
1
1
0
0
0
0
0
1
0
I2C_A2 field descriptions
Field
7–1
SAD
0
Reserved
Description
SMBus Address
Contains the slave address used by the SMBus. This field is used on the device default address or other
related addresses.
This field is reserved.
This read-only field is reserved and always has the value 0.
17.3.11 I2C SCL Low Timeout Register High (I2C_SLTH)
Address: 3070h base + Ah offset = 307Ah
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
SSLT[15:8]
0
0
0
0
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
445
Functional description
I2C_SLTH field descriptions
Field
SSLT[15:8]
Description
SSLT[15:8]
Most significant byte of SCL low timeout value that determines the timeout period of SCL low.
17.3.12 I2C SCL Low Timeout Register Low (I2C_SLTL)
Address: 3070h base + Bh offset = 307Bh
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
SSLT[7:0]
0
0
0
0
I2C_SLTL field descriptions
Field
SSLT[7:0]
Description
SSLT[7:0]
Least significant byte of SCL low timeout value that determines the timeout period of SCL low.
17.4 Functional description
This section provides a comprehensive functional description of the I2C module.
17.4.1 I2C protocol
The I2C bus system uses a serial data line (SDA) and a serial clock line (SCL) for data
transfers.
All devices connected to it must have open drain or open collector outputs. A logic AND
function is exercised on both lines with external pull-up resistors. The value of these
resistors depends on the system.
Normally, a standard instance of communication is composed of four parts:
1.
2.
3.
4.
START signal
Slave address transmission
Data transfer
STOP signal
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
446
Freescale Semiconductor, Inc.
Chapter 17 Inter-Integrated Circuit (I2C)
The STOP signal should not be confused with the CPU STOP instruction. The following
figure illustrates I2C bus system communication.
LSB
MSB
SCL
SDA
1
SDA
Start
Signal
3
4
5
6
7
8
Calling Address
1
XXX
3
4
5
6
D5
7
8
5
D4 D3
6
7
8
D2
D1
D0
1
Read/ Ack
Write Bit
XX
9
No Stop
Ack Signal
Bit
MSB
9
AD7 AD6 AD5 AD4 AD3 AD2 AD1 R/W
Calling Address
D7 D6
4
Data Byte
LSB
2
3
2
Read/ Ack
Write Bit
MSB
1
LSB
MSB
9
AD7 AD6 AD5 AD4 AD3 AD2 AD1 R/W
Start
Signal
SCL
2
LSB
2
3
4
5
6
7
8
9
AD7 AD6 AD5 AD4 AD3 AD2 AD1 R/W
Repeated
Start
Signal
New Calling Address
Read/ No Stop
Ack Signal
Write
Bit
Figure 17-14. I2C bus transmission signals
17.4.1.1 START signal
The bus is free when no master device is engaging the bus (both SCL and SDA are high).
When the bus is free, a master may initiate communication by sending a START signal.
A START signal is defined as a high-to-low transition of SDA while SCL is high. This
signal denotes the beginning of a new data transfer—each data transfer might contain
several bytes of data—and brings all slaves out of their idle states.
17.4.1.2 Slave address transmission
Immediately after the START signal, the first byte of a data transfer is the slave address
transmitted by the master. This address is a 7-bit calling address followed by an R/W bit.
The R/W bit tells the slave the desired direction of data transfer.
• 1 = Read transfer: The slave transmits data to the master
• 0 = Write transfer: The master transmits data to the slave
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
447
Functional description
Only the slave with a calling address that matches the one transmitted by the master
responds by sending an acknowledge bit. The slave sends the acknowledge bit by pulling
SDA low at the ninth clock.
No two slaves in the system can have the same address. If the I2C module is the master, it
must not transmit an address that is equal to its own slave address. The I2C module
cannot be master and slave at the same time. However, if arbitration is lost during an
address cycle, the I2C module reverts to slave mode and operates correctly even if it is
being addressed by another master.
17.4.1.3 Data transfers
When successful slave addressing is achieved, data transfer can proceed on a byte-bybyte basis in the direction specified by the R/W bit sent by the calling master.
All transfers that follow an address cycle are referred to as data transfers, even if they
carry subaddress information for the slave device.
Each data byte is 8 bits long. Data may be changed only while SCL is low. Data must be
held stable while SCL is high. There is one clock pulse on SCL for each data bit, and the
MSB is transferred first. Each data byte is followed by a ninth (acknowledge) bit, which
is signaled from the receiving device by pulling SDA low at the ninth clock. In summary,
one complete data transfer needs nine clock pulses.
If the slave receiver does not acknowledge the master in the ninth bit, the slave must
leave SDA high. The master interprets the failed acknowledgement as an unsuccessful
data transfer.
If the master receiver does not acknowledge the slave transmitter after a data byte
transmission, the slave interprets it as an end to data transfer and releases the SDA line.
In the case of a failed acknowledgement by either the slave or master, the data transfer is
aborted and the master does one of two things:
• Relinquishes the bus by generating a STOP signal.
• Commences a new call by generating a repeated START signal.
17.4.1.4 STOP signal
The master can terminate the communication by generating a STOP signal to free the
bus. A STOP signal is defined as a low-to-high transition of SDA while SCL is asserted.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
448
Freescale Semiconductor, Inc.
Chapter 17 Inter-Integrated Circuit (I2C)
The master can generate a STOP signal even if the slave has generated an
acknowledgement, at which point the slave must release the bus.
17.4.1.5 Repeated START signal
The master may generate a START signal followed by a calling command without
generating a STOP signal first. This action is called a repeated START. The master uses
a repeated START to communicate with another slave or with the same slave in a
different mode (transmit/receive mode) without releasing the bus.
17.4.1.6 Arbitration procedure
The I2C bus is a true multimaster bus that allows more than one master to be connected
on it.
If two or more masters try to control the bus at the same time, a clock synchronization
procedure determines the bus clock. The bus clock's low period is equal to the longest
clock low period, and the high period is equal to the shortest one among the masters.
The relative priority of the contending masters is determined by a data arbitration
procedure. A bus master loses arbitration if it transmits logic level 1 while another master
transmits logic level 0. The losing masters immediately switch to slave receive mode and
stop driving SDA output. In this case, the transition from master to slave mode does not
generate a STOP condition. Meanwhile, hardware sets a status bit to indicate the loss of
arbitration.
17.4.1.7 Clock synchronization
Because wire AND logic is performed on SCL, a high-to-low transition on SCL affects
all devices connected on the bus. The devices start counting their low period and, after a
device's clock has gone low, that device holds SCL low until the clock reaches its high
state. However, the change of low to high in this device clock might not change the state
of SCL if another device clock is still within its low period. Therefore, the synchronized
clock SCL is held low by the device with the longest low period. Devices with shorter
low periods enter a high wait state during this time; see the following diagram. When all
applicable devices have counted off their low period, the synchronized clock SCL is
released and pulled high. Afterward there is no difference between the device clocks and
the state of SCL, and all devices start counting their high periods. The first device to
complete its high period pulls SCL low again.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
449
Functional description
Delay
Start Counting High Period
SCL2
SCL1
SCL
Internal Counter Reset
Figure 17-15. I2C clock synchronization
17.4.1.8 Handshaking
The clock synchronization mechanism can be used as a handshake in data transfers. A
slave device may hold SCL low after completing a single byte transfer (9 bits). In this
case, it halts the bus clock and forces the master clock into wait states until the slave
releases SCL.
17.4.1.9 Clock stretching
The clock synchronization mechanism can be used by slaves to slow down the bit rate of
a transfer. After the master drives SCL low, a slave can drive SCL low for the required
period and then release it. If the slave's SCL low period is greater than the master's SCL
low period, the resulting SCL bus signal's low period is stretched. In other words, the
SCL bus signal's low period is increased to be the same length as the slave's SCL low
period.
17.4.1.10 I2C divider and hold values
NOTE
For some cases on some devices, the SCL divider value may
vary by ±2 or ±4 when ICR's value ranges from 00h to 0Fh.
These potentially varying SCL divider values are highlighted in
the following table. For the actual SCL divider values for your
device, see the chip-specific details about the I2C module.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
450
Freescale Semiconductor, Inc.
Chapter 17 Inter-Integrated Circuit (I2C)
Table 17-15. I2C divider and hold values
ICR
SCL
divider
SDA hold
value
SCL hold
(start)
value
SCL hold
(stop)
value
SCL
divider
(clocks)
SDA hold
(clocks)
SCL hold
(start)
value
SCL hold
(stop)
value
00
20
7
6
11
20
160
17
78
81
01
22
7
7
12
21
192
17
94
97
02
24
8
8
13
22
224
33
110
113
03
26
04
28
8
9
14
23
256
33
126
129
9
10
15
24
288
49
142
145
05
30
9
11
16
25
320
49
158
161
06
34
10
13
18
26
384
65
190
193
07
40
10
16
21
27
480
65
238
241
08
28
7
10
15
28
320
33
158
161
09
32
7
12
17
29
384
33
190
193
0A
36
9
14
19
2A
448
65
222
225
(hex)
ICR
(hex)
0B
40
9
16
21
2B
512
65
254
257
0C
44
11
18
23
2C
576
97
286
289
0D
48
11
20
25
2D
640
97
318
321
0E
56
13
24
29
2E
768
129
382
385
0F
68
13
30
35
2F
960
129
478
481
10
48
9
18
25
30
640
65
318
321
11
56
9
22
29
31
768
65
382
385
12
64
13
26
33
32
896
129
446
449
13
72
13
30
37
33
1024
129
510
513
14
80
17
34
41
34
1152
193
574
577
15
88
17
38
45
35
1280
193
638
641
16
104
21
46
53
36
1536
257
766
769
17
128
21
58
65
37
1920
257
958
961
18
80
9
38
41
38
1280
129
638
641
19
96
9
46
49
39
1536
129
766
769
1A
112
17
54
57
3A
1792
257
894
897
1B
128
17
62
65
3B
2048
257
1022
1025
1C
144
25
70
73
3C
2304
385
1150
1153
1D
160
25
78
81
3D
2560
385
1278
1281
1E
192
33
94
97
3E
3072
513
1534
1537
1F
240
33
118
121
3F
3840
513
1918
1921
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
451
Functional description
17.4.2 10-bit address
For 10-bit addressing, 0x11110 is used for the first 5 bits of the first address byte.
Various combinations of read/write formats are possible within a transfer that includes
10-bit addressing.
17.4.2.1 Master-transmitter addresses a slave-receiver
The transfer direction is not changed. When a 10-bit address follows a START condition,
each slave compares the first 7 bits of the first byte of the slave address (11110XX) with
its own address and tests whether the eighth bit (R/W direction bit) is 0. It is possible that
more than one device finds a match and generates an acknowledge (A1). Each slave that
finds a match compares the 8 bits of the second byte of the slave address with its own
address, but only one slave finds a match and generates an acknowledge (A2). The
matching slave remains addressed by the master until it receives a STOP condition (P) or
a repeated START condition (Sr) followed by a different slave address.
Table 17-16. Master-transmitter addresses slave-receiver with a 10-bit
address
S
Slave
address
first 7 bits
11110 +
AD10 +
AD9
R/W
0
A1
Slave
address
second
byte
AD[8:1]
A2
Data
A
...
Data
A/A
P
After the master-transmitter has sent the first byte of the 10-bit address, the slave-receiver
sees an I2C interrupt. User software must ensure that for this interrupt, the contents of the
Data register are ignored and not treated as valid data.
17.4.2.2 Master-receiver addresses a slave-transmitter
The transfer direction is changed after the second R/W bit. Up to and including
acknowledge bit A2, the procedure is the same as that described for a master-transmitter
addressing a slave-receiver. After the repeated START condition (Sr), a matching slave
remembers that it was addressed before. This slave then checks whether the first seven
bits of the first byte of the slave address following Sr are the same as they were after the
START condition (S), and it tests whether the eighth (R/W) bit is 1. If there is a match,
the slave considers that it has been addressed as a transmitter and generates acknowledge
A3. The slave-transmitter remains addressed until it receives a STOP condition (P) or a
repeated START condition (Sr) followed by a different slave address.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
452
Freescale Semiconductor, Inc.
Chapter 17 Inter-Integrated Circuit (I2C)
After a repeated START condition (Sr), all other slave devices also compare the first
seven bits of the first byte of the slave address with their own addresses and test the
eighth (R/W) bit. However, none of them are addressed because R/W = 1 (for 10-bit
devices), or the 11110XX slave address (for 7-bit devices) does not match.
Table 17-17. Master-receiver addresses a slave-transmitter with a 10-bit
address
S
Slave
address
first 7
bits
11110 +
AD10 +
AD9
R/W
0
A1
Slave
address
second
byte
AD[8:1]
A2
Sr
Slave
address
first 7
bits
11110 +
AD10 +
AD9
R/W
1
A3
Data
A
...
Data
A
P
After the master-receiver has sent the first byte of the 10-bit address, the slave-transmitter
sees an I2C interrupt. User software must ensure that for this interrupt, the contents of the
Data register are ignored and not treated as valid data.
17.4.3 Address matching
All received addresses can be requested in 7-bit or 10-bit address format.
• AD[7:1] in Address Register 1, which contains the I2C primary slave address, always
participates in the address matching process. It provides a 7-bit address.
• If the ADEXT bit is set, AD[10:8] in Control Register 2 participates in the address
matching process. It extends the I2C primary slave address to a 10-bit address.
Additional conditions that affect address matching include:
• If the GCAEN bit is set, general call participates the address matching process.
• If the ALERTEN bit is set, alert response participates the address matching process.
• If the SIICAEN bit is set, Address Register 2 participates in the address matching
process.
• If the RMEN bit is set, when the Range Address register is programmed to a nonzero
value, any address within the range of values of Address Register 1 (excluded) and
the Range Address register (included) participates in the address matching process.
The Range Address register must be programmed to a value greater than the value of
Address Register 1.
When the I2C module responds to one of these addresses, it acts as a slave-receiver and
the IAAS bit is set after the address cycle. Software must read the Data register after the
first byte transfer to determine that the address is matched.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
453
Functional description
17.4.4 System management bus specification
SMBus provides a control bus for system and power management related tasks. A system
can use SMBus to pass messages to and from devices instead of tripping individual
control lines.
Removing the individual control lines reduces pin count. Accepting messages ensures
future expandability. With the system management bus, a device can provide
manufacturer information, tell the system what its model/part number is, save its state for
a suspend event, report different types of errors, accept control parameters, and return its
status.
17.4.4.1 Timeouts
The TTIMEOUT,MIN parameter allows a master or slave to conclude that a defective device
is holding the clock low indefinitely or a master is intentionally trying to drive devices
off the bus. The slave device must release the bus (stop driving the bus and let SCL and
SDA float high) when it detects any single clock held low longer than TTIMEOUT,MIN.
Devices that have detected this condition must reset their communication and be able to
receive a new START condition within the timeframe of TTIMEOUT,MAX.
SMBus defines a clock low timeout, TTIMEOUT, of 35 ms, specifies TLOW:SEXT as the
cumulative clock low extend time for a slave device, and specifies TLOW:MEXT as the
cumulative clock low extend time for a master device.
17.4.4.1.1
SCL low timeout
If the SCL line is held low by a slave device on the bus, no further communication is
possible. Furthermore, the master cannot force the SCL line high to correct the error
condition. To solve this problem, the SMBus protocol specifies that devices participating
in a transfer must detect any clock cycle held low longer than a timeout value condition.
Devices that have detected the timeout condition must reset the communication. When
the I2C module is an active master, if it detects that SMBCLK low has exceeded the
value of TTIMEOUT,MIN, it must generate a stop condition within or after the current data
byte in the transfer process. When the I2C module is a slave, if it detects the
TTIMEOUT,MIN condition, it resets its communication and is then able to receive a new
START condition.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
454
Freescale Semiconductor, Inc.
Chapter 17 Inter-Integrated Circuit (I2C)
17.4.4.1.2
SCL high timeout
When the I2C module has determined that the SMBCLK and SMBDAT signals have
been high for at least THIGH:MAX, it assumes that the bus is idle.
A HIGH timeout occurs after a START condition appears on the bus but before a STOP
condition appears on the bus. Any master detecting this scenario can assume the bus is
free when either of the following occurs:
• SHTF1 rises.
• The BUSY bit is high and SHTF1 is high.
When the SMBDAT signal is low and the SMBCLK signal is high for a period of time,
another kind of timeout occurs. The time period must be defined in software. SHTF2 is
used as the flag when the time limit is reached. This flag is also an interrupt resource, so
it triggers IICIF.
17.4.4.1.3
CSMBCLK TIMEOUT MEXT and CSMBCLK TIMEOUT SEXT
The following figure illustrates the definition of the timeout intervals TLOW:SEXT and
TLOW:MEXT. When in master mode, the I2C module must not cumulatively extend its
clock cycles for a period greater than TLOW:MEXT within a byte, where each byte is
defined as START-to-ACK, ACK-to-ACK, or ACK-to-STOP. When CSMBCLK
TIMEOUT MEXT occurs, SMBus MEXT rises and also triggers the SLTF.
Stop
T LOW:SEXT
Start
T LOW:MEXT
ClkAck
T LOW:MEXT
ClkAck
T LOW:MEXT
SCL
SDA
Figure 17-16. Timeout measurement intervals
A master is allowed to abort the transaction in progress to any slave that violates the
TLOW:SEXT or TTIMEOUT,MIN specifications. To abort the transaction, the master issues a
STOP condition at the conclusion of the byte transfer in progress. When a slave, the I2C
module must not cumulatively extend its clock cycles for a period greater than
TLOW:SEXT during any message from the initial START to the STOP. When CSMBCLK
TIMEOUT SEXT occurs, SEXT rises and also triggers SLTF.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
455
Functional description
NOTE
CSMBCLK TIMEOUT SEXT and CSMBCLK TIMEOUT
MEXT are optional functions that are implemented in the
second step.
17.4.4.2 FAST ACK and NACK
To improve reliability and communication robustness, implementation of packet error
checking (PEC) by SMBus devices is optional for SMBus devices but required for
devices participating in and only during the address resolution protocol (ARP) process.
The PEC is a CRC-8 error checking byte, calculated on all the message bytes. The PEC is
appended to the message by the device that supplied the last data byte. If the PEC is
present but not correct, a NACK is issued by the receiver. Otherwise an ACK is issued.
To calculate the CRC-8 by software, this module can hold the SCL line low after
receiving the eighth SCL (8th bit) if this byte is a data byte. So software can determine
whether an ACK or NACK should be sent to the bus by setting or clearing the TXAK bit
if the FACK (fast ACK/NACK enable) bit is enabled.
SMBus requires a device always to acknowledge its own address, as a mechanism to
detect the presence of a removable device (such as a battery or docking station) on the
bus. In addition to indicating a slave device busy condition, SMBus uses the NACK
mechanism to indicate the reception of an invalid command or invalid data. Because such
a condition may occur on the last byte of the transfer, SMBus devices are required to
have the ability to generate the not acknowledge after the transfer of each byte and before
the completion of the transaction. This requirement is important because SMBus does not
provide any other resend signaling. This difference in the use of the NACK signaling has
implications on the specific implementation of the SMBus port, especially in devices that
handle critical system data such as the SMBus host and the SBS components.
NOTE
In the last byte of master receive slave transmit mode, the
master must send a NACK to the bus, so FACK must be
switched off before the last byte transmits.
17.4.5 Resets
The I2C module is disabled after a reset. The I2C module cannot cause a core reset.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
456
Freescale Semiconductor, Inc.
Chapter 17 Inter-Integrated Circuit (I2C)
17.4.6 Interrupts
The I2C module generates an interrupt when any of the events in the table found here
occur, provided that the IICIE bit is set.
The interrupt is driven by the IICIF bit (of the I2C Status Register) and masked with the
IICIE bit (of the I2C Control Register 1). The IICIF bit must be cleared (by software) by
writing 1 to it in the interrupt routine. The SMBus timeouts interrupt is driven by SLTF
and masked with the IICIE bit. The SLTF bit must be cleared by software by writing 1 to
it in the interrupt routine. You can determine the interrupt type by reading the Status
Register.
NOTE
In master receive mode, the FACK bit must be set to zero
before the last byte transfer.
Table 17-18. Interrupt summary
Interrupt source
Status
Flag
Local enable
Complete 1-byte transfer
TCF
IICIF
IICIE
Match of received calling address
IAAS
IICIF
IICIE
Arbitration lost
ARBL
IICIF
IICIE
SMBus SCL low timeout
SLTF
IICIF
IICIE
SMBus SCL high SDA low timeout
SHTF2
IICIF
IICIE & SHTF2IE
Wakeup from stop3 or wait mode
IAAS
IICIF
IICIE & WUEN
17.4.6.1 Byte transfer interrupt
The Transfer Complete Flag (TCF) bit is set at the falling edge of the ninth clock to
indicate the completion of a byte and acknowledgement transfer. When FACK is enabled,
TCF is then set at the falling edge of eighth clock to indicate the completion of byte.
17.4.6.2 Address detect interrupt
When the calling address matches the programmed slave address (I2C Address Register)
or when the GCAEN bit is set and a general call is received, the IAAS bit in the Status
Register is set. The CPU is interrupted, provided the IICIE bit is set. The CPU must
check the SRW bit and set its Tx mode accordingly.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
457
Functional description
17.4.6.3 Exit from low-power/stop modes
The slave receive input detect circuit and address matching feature are still active on low
power modes (wait and stop). An asynchronous input matching slave address or general
call address brings the CPU out of low power/stop mode if the interrupt is not masked.
Therefore, TCF and IAAS both can trigger this interrupt.
17.4.6.4 Arbitration lost interrupt
The I2C is a true multimaster bus that allows more than one master to be connected on it.
If two or more masters try to control the bus at the same time, the relative priority of the
contending masters is determined by a data arbitration procedure. The I2C module asserts
the arbitration-lost interrupt when it loses the data arbitration process and the ARBL bit
in the Status Register is set.
Arbitration is lost in the following circumstances:
1. SDA is sampled as low when the master drives high during an address or data
transmit cycle.
2. SDA is sampled as low when the master drives high during the acknowledge bit of a
data receive cycle.
3. A START cycle is attempted when the bus is busy.
4. A repeated START cycle is requested in slave mode.
5. A STOP condition is detected when the master did not request it.
The ARBL bit must be cleared (by software) by writing 1 to it.
17.4.6.5 Timeout interrupt in SMBus
When the IICIE bit is set, the I2C module asserts a timeout interrupt (outputs SLTF and
SHTF2) upon detection of any of the mentioned timeout conditions, with one exception.
The SCL high and SDA high TIMEOUT mechanism must not be used to influence the
timeout interrupt output, because this timeout indicates an idle condition on the bus.
SHTF1 rises when it matches the SCL high and SDA high TIMEOUT and falls
automatically just to indicate the bus status. The SHTF2's timeout period is the same as
that of SHTF1, which is short compared to that of SLTF, so another control bit,
SHTF2IE, is added to enable or disable it.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
458
Freescale Semiconductor, Inc.
Chapter 17 Inter-Integrated Circuit (I2C)
17.4.7 Programmable input glitch filter
An I2C glitch filter has been added outside legacy I2C modules but within the I2C
package. This filter can absorb glitches on the I2C clock and data lines for the I2C
module.
The width of the glitch to absorb can be specified in terms of the number of (half) I2C
module clock cycles. A single Programmable Input Glitch Filter control register is
provided. Effectively, any down-up-down or up-down-up transition on the data line that
occurs within the number of clock cycles programmed in this register is ignored by the
I2C module. The programmer must specify the size of the glitch (in terms of I2C module
clock cycles) for the filter to absorb and not pass.
Noise
suppress
circuits
SCL, SDA
external signals
DFF
DFF
DFF
SCL, SDA
internal signals
DFF
Figure 17-17. Programmable input glitch filter diagram
17.4.8 Address matching wake-up
When a primary, range, or general call address match occurs when the I2C module is in
slave receive mode, the MCU wakes from a low power mode where no peripheral bus is
running.
Data sent on the bus that is the same as a target device address might also wake the target
MCU.
After the address matching IAAS bit is set, an interrupt is sent at the end of address
matching to wake the core. The IAAS bit must be cleared after the clock recovery.
NOTE
After the system recovers and is in Run mode, restart the I2C
module if it is needed to transfer packets. To avoid I2C transfer
problems resulting from the situation, firmware should prevent
the MCU execution of a STOP instruction when the I2C
module is in the middle of a transfer.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
459
Initialization/application information
17.5 Initialization/application information
Module Initialization (Slave)
1. Write: Control Register 2
• to enable or disable general call
• to select 10-bit or 7-bit addressing mode
2. Write: Address Register 1 to set the slave address
3. Write: Control Register 1 to enable the I2C module and interrupts
4. Initialize RAM variables (IICEN = 1 and IICIE = 1) for transmit data
5. Initialize RAM variables used to achieve the routine shown in the following figure
Module Initialization (Master)
1. Write: Frequency Divider register to set the I2C baud rate (see example in
description of ICR)
2. Write: Control Register 1 to enable the I2C module and interrupts
3. Initialize RAM variables (IICEN = 1 and IICIE = 1) for transmit data
4. Initialize RAM variables used to achieve the routine shown in the following figure
5. Write: Control Register 1 to enable TX
6. Write: Control Register 1 to enable MST (master mode)
7. Write: Data register with the address of the target slave (the LSB of this byte
determines whether the communication is master receive or transmit)
The routine shown in the following figure encompasses both master and slave I2C
operations. For slave operation, an incoming I2C message that contains the proper
address begins I2C communication. For master operation, communication must be
initiated by writing the Data register. An example of an I2C driver which implements
many of the steps described here is available in AN4342: Using the Inter-Integrated
Circuit on ColdFire+ and Kinetis .
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
460
Freescale Semiconductor, Inc.
Chapter 17 Inter-Integrated Circuit (I2C)
Y
Is STOPF
set?
Entry of ISR
Clear STOPF
Clear IICIF
Zero Start Count
N
Y
Clear STARTF
Clear IICIF
Log Start Count++
Is STARTF
set?
N
N
Is this a Repeated-START
(Start Count > 1)?
Clear IICIF
Y
Y
Tx
Last byte
transmitted?
Master
mode?
N
Rx
Tx/Rx?
Y
Y
Arbitration
lost?
N
Clear ARBL
N
RXAK=0?
N
Last byte
to be read?
N
End of
address cycle
(master Rx)?
Y
Y
2nd to
last byte to be
read?
Write next
byte to Data reg
Set TXACK
Address transfer
see note 1
Multiple
addresses?
N
Y
Y (read)
SRW=1?
N (write)
N Data transfer
see note 2
Rx
Tx
Read Address from
Data register
and store
Generate stop
signal (MST=0)
IIAAS=1?
Tx/Rx?
Y
N
N
Y
IIAAS=1?
N
Y
Y
Y
ACK from
receiver?
N
Read data from
Data reg
and store
Transmit
next byte
Set Tx mode
Switch to
Rx mode
Switch to
Rx mode
Write data
to Data reg
Set Rx mode
Dummy read
from Data reg
Generate stop
signal (MST=0)
Read data from
Data reg
and store
Dummy read
from Data reg
Dummy read
from Data reg
RTI
Notes:
1. If general call is enabled, check to determine if the received address is a general call address (0x00).
If the received address is a general call address, the general call must be handled by user software.
2. When 10-bit addressing addresses a slave, the slave sees an interrupt following the first byte of the extended address.
Ensure that for this interrupt, the contents of the Data register are ignored and not treated as a valid data transfer.
Figure 17-18. Typical I2C interrupt routine
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
461
Initialization/application information
Entry of ISR
Y
SLTF=1 or
SHTF2=1?
N
N
FACK=1?
See typical I2C
interrupt routine
flow chart
Y
Clear IICIF
Y
Tx
Master
mode?
N
Rx
Y
Tx/Rx?
Last byte
transmitted?
Y
Last byte
to be read?
Y
N
Clear ARBL
N
N
Y
N
RXAK=0?
2nd to
last byte to be
read?
N
N
Y
Y
Arbitration
lost?
Y
Read data from
Data reg
and soft CRC
End of
address cycle
(master Rx)?
Y
(read)
Read data and
Soft CRC
N
Address transfer
(see note 1)
SRW=1?
Rx
N (write)
Set TXAK to
proper value
Delay (note 2)
Clear IICIF
Y
IAAS=1?
N
Set TXAK to
proper value,
Clear IICIF
Set TXAK to
proper value
Delay (note 2)
Clear IICIF
Switch to
Rx mode
Tx/Rx?
ACK from
receiver?
Set TXACK=1,
Clear FACK=0
Write next
byte to Data reg
N
Tx
Read data from
Data reg
and soft CRC
Generate stop
signal (MST=0)
IAAS=1?
Set Tx mode
Read data from
Data reg
and soft CRC
Set TXAK to
proper value,
Clear IICIF
Y
Clear IICIF
Transmit
next byte
Switch to
Rx mode
Delay (note 2)
Delay (note 2)
Dummy read
from Data reg
Generate stop
signal (MST=0)
Read data from
Data reg
and store
Write data
to Data reg
Read data from
Data reg
and store (note 3)
Dummy read
from Data reg
RTI
Notes:
1. If general call or SIICAEN is enabled, check to determine if the received address is a general call address (0x00) or an SMBus
device default address. In either case, they must be handled by user software.
2. In receive mode, one bit time delay may be needed before the first and second data reading, to wait for the possible longest time
period (in worst case) of the 9th SCL cycle.
3. This read is a dummy read in order to reset the SMBus receiver state machine.
Figure 17-19. Typical I2C SMBus interrupt routine
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
462
Freescale Semiconductor, Inc.
Chapter 18
Analog-to-digital converter (ADC)
18.1 Introduction
The 12-bit analog-to-digital converter (ADC) is a successive approximation ADC
designed for operation within an integrated microcontroller system-on-chip.
18.1.1 Features
Features of the ADC module include:
• Linear Successive Approximation algorithm with 8-, 10-, or 12-bit resolution
• Up to 12 external analog inputs, external pin inputs, and 5 internal analog inputs
including internal bandgap, temperature sensor, and references
• Output formatted in 8-, 10-, or 12-bit right-justified unsigned format
• Single or Continuous Conversion (automatic return to idle after single conversion)
• Support up to eight result FIFO with selectable FIFO depth
• Configurable sample time and conversion speed/power
• Conversion complete flag and interrupt
• Input clock selectable from up to four sources
• Operation in Wait or Stop modes for lower noise operation
• Asynchronous clock source for lower noise operation
• Selectable asynchronous hardware conversion trigger
• Automatic compare with interrupt for less-than, or greater-than or equal-to,
programmable value
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
463
External Signal Description
18.1.2 Block Diagram
This figure provides a block diagram of the ADC module.
7
5-bit ch
0
12-bit AD result
6
5-bit ch
1
12-bit AD result
5
5-bit ch
2
12-bit AD result
4
5-bit ch
3
12-bit AD result
3
4
12-bit AD result
2
5-bit ch
5-bit ch
5
12-bit AD result
1
5-bit ch
6
12-bit AD result
0
5-bit ch
7
12-bit AD result
AD RESULT FIFO
AD CHANNEL FIFO
AFDEP
Off-chip Source Channels
AD1
AD2
AIEN
Analog Result
FIFO Fulfilled
Input Channel
FIFO Fulfilled
AD0
Interrupt to CPU
AD10
Reserved
Reserved
AD11
AD12
AD21-AD20
Temperature Sensor
Internal Bandgap
Reserved
VREFL
VREFH
None (Module Disabled)
AD22
ANALOG MUX
AD0 to AD11 from External
Pin Inputs or Reserved
COCO
SAR ADC
ADCK
AD23
CONTROL
SEQUENCER
COMPARE
LOGIC
AD29
AD30
AD31
AD32
ADTRG MODE ADLSMP ADLPC ACFGT
On-chip Source Channels
ADCO
STOP
ACFE
ALT CLK
BUS CLK
2
ADACK
CLK MUX
ADHWT
CLOCK
DIVIDER
ADICLK
ADIV
Compare Value
ASYNC
CLOCK
GENERATOR
Figure 18-1. ADC Block Diagram
18.2 External Signal Description
The ADC module supports up to 24 separate analog inputs. It also requires four supply/
reference/ground connections.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
464
Freescale Semiconductor, Inc.
Chapter 18 Analog-to-digital converter (ADC)
Table 18-1. Signal Properties
Name
Function
AD23–AD0
Analog Channel inputs
VREFH
High reference voltage
VREFL
Low reference voltage
VDDA
Analog power supply
VSSA
Analog ground
18.2.1 Analog Power (VDDA)
The ADC analog portion uses VDDA as its power connection. In some packages, VDDA is
connected internally to VDD. If externally available, connect the VDDA pin to the same
voltage potential as VDD. External filtering may be necessary to ensure clean VDDA for
good results.
18.2.2 Analog Ground (VSSA)
The ADC analog portion uses VSSA as its ground connection. In some packages, VSSA is
connected internally to VSS. If externally available, connect the VSSA pin to the same
voltage potential as VSS.
18.2.3 Voltage Reference High (VREFH)
VREFH is the high reference voltage for the converter. In some packages, VREFH is
connected internally to VDDA. If externally available, VREFH may be connected to the
same potential as VDDA or may be driven by an external source between the minimum
VDDA specified in the data sheet and the VDDA potential (VREFH must never exceed
VDDA).
18.2.4 Voltage Reference Low (VREFL)
VREFL is the low-reference voltage for the converter. In some packages, VREFL is
connected internally to VSSA. If externally available, connect the VREFL pin to the same
voltage potential as VSSA.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
465
ADC Control Registers
18.2.5 Analog Channel Inputs (ADx)
The ADC module supports up to 24 separate analog inputs. An input is selected for
conversion through the ADCH channel select bits.
18.3 ADC Control Registers
ADC memory map
Absolute
address
(hex)
Width
Access
(in bits)
Register name
Reset value
Section/
page
10
Status and Control Register 1 (ADC_SC1)
8
R/W
1Fh
18.3.1/466
11
Status and Control Register 2 (ADC_SC2)
8
R/W
08h
18.3.2/468
12
Status and Control Register 3 (ADC_SC3)
8
R/W
00h
18.3.3/469
13
Status and Control Register 4 (ADC_SC4)
8
R/W
00h
18.3.4/470
14
Conversion Result High Register (ADC_RH)
8
R
00h
18.3.5/471
15
Conversion Result Low Register (ADC_RL)
8
R
00h
18.3.6/472
16
Compare Value High Register (ADC_CVH)
8
R/W
00h
18.3.7/473
17
Compare Value Low Register (ADC_CVL)
8
R/W
00h
18.3.8/473
30AC
Pin Control 1 Register (ADC_APCTL1)
8
R/W
00h
18.3.9/474
30AD
Pin Control 2 Register (ADC_APCTL2)
8
R/W
00h
18.3.10/475
18.3.1 Status and Control Register 1 (ADC_SC1)
This section describes the function of the ADC status and control register (ADC_SC1).
Writing ADC_SC1 aborts the current conversion and initiates a new conversion (if the
ADCH bits are equal to a value other than all 1s).
When FIFO is enabled, the analog input channel FIFO is written via ADCH. The analog
input channel queue must be written to ADCH continuously. The resulting FIFO follows
the order in which the analog input channel is written. The ADC will start conversion
when the input channel FIFO is fulfilled at the depth indicated by the
ADC_SC4[AFDEP]. Any write 0x1F to these bits will reset the FIFO and stop the
conversion if it is active.
Address: 10h base + 0h offset = 10h
Bit
Read
7
COCO
Write
Reset
0
6
5
AIEN
ADCO
0
0
4
3
2
1
0
1
1
ADCH
1
1
1
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
466
Freescale Semiconductor, Inc.
Chapter 18 Analog-to-digital converter (ADC)
ADC_SC1 field descriptions
Field
7
COCO
Description
Conversion Complete Flag
Conversion Complete Flag. The COCO flag is a read-only bit set each time a conversion is completed
when the compare function is disabled (ADC_SC2[ACFE] = 0). When the compare function is enabled
(ADC_SC2[ACFE] = 1), the COCO flag is set upon completion of a conversion only if the compare result is
true. When the FIFO function is enabled (ADC_SC4[AFDEP] > 0), the COCO flag is set upon completion
of the set of FIFO conversion. This bit is cleared when ADC_SC1 is written or when ADC_RL is read.
0
1
6
AIEN
Interrupt Enable
AIEN enables conversion complete interrupts. When COCO becomes set while AIEN is high, an interrupt
is asserted.
0
1
5
ADCO
Conversion complete interrupt disabled.
Conversion complete interrupt enabled.
Continuous Conversion Enable
ADCO enables continuous conversions.
0
1
ADCH
Conversion not completed.
Conversion completed.
One conversion following a write to the ADC_SC1 when software triggered operation is selected, or
one conversion following assertion of ADHWT when hardware triggered operation is selected. When
the FIFO function is enabled (AFDEP > 0), a set of conversions are triggered.
Continuous conversions are initiated following a write to ADC_SC1 when software triggered operation
is selected. Continuous conversions are initiated by an ADHWT event when hardware triggered
operation is selected. When the FIFO function is enabled (AFDEP > 0), a set of conversions are loop
triggered.
Input Channel Select
The ADCH bits form a 5-bit field that selects one of the input channels.
00000-01011
01100-10011
10100-10101
10110
10111
11000-11100
11101
11110
11111
AD0-AD11
VSS
Reserved
Temperature Sensor
Bandgap
Reserved
VREFH
VREFL
Module disabled
NOTE: Reset FIFO in FIFO mode.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
467
ADC Control Registers
18.3.2 Status and Control Register 2 (ADC_SC2)
The ADC_SC2 register controls the compare function, conversion trigger, and conversion
active of the ADC module.
Address: 10h base + 1h offset = 11h
Bit
Read
7
ADACT
Write
Reset
0
6
5
4
ADTRG
ACFE
ACFGT
0
0
0
3
2
FEMPTY
FFULL
1
0
0
1
0
0
0
ADC_SC2 field descriptions
Field
7
ADACT
Description
Conversion Active
Indicates that a conversion is in progress. ADACT is set when a conversion is initiated and cleared when a
conversion is completed or aborted.
0
1
6
ADTRG
Conversion Trigger Select
Selects the type of trigger used for initiating a conversion. Two types of trigger are selectable: software
trigger and hardware trigger. When software trigger is selected, a conversion is initiated following a write
to ADC_SC1. When hardware trigger is selected, a conversion is initiated following the assertion of the
ADHWT input.
0
1
5
ACFE
Enables the compare function.
2
FFULL
Compare function disabled.
Compare function enabled.
Compare Function Greater Than Enable
Configures the compare function to trigger when the result of the conversion of the input being monitored
is greater than or equal to the compare value. The compare function defaults to triggering when the result
of the compare of the input being monitored is less than the compare value.
0
1
3
FEMPTY
Software trigger selected.
Hardware trigger selected.
Compare Function Enable
0
1
4
ACFGT
Conversion not in progress.
Conversion in progress.
Compare triggers when input is less than compare level.
Compare triggers when input is greater than or equal to compare level.
Result FIFO empty
0
1
Indicates that ADC result FIFO have at least one valid new data.
Indicates that ADC result FIFO have no valid new data.
Result FIFO full
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
468
Freescale Semiconductor, Inc.
Chapter 18 Analog-to-digital converter (ADC)
ADC_SC2 field descriptions (continued)
Field
Description
0
1
Reserved
Indicates that ADC result FIFO is not full and next conversion data still can be stored into FIFO.
Indicates that ADC result FIFO is full and next conversion will override old data in case of no read
action.
This field is reserved.
18.3.3 Status and Control Register 3 (ADC_SC3)
ADC_SC3 selects the mode of operation, clock source, clock divide, and configure for
low power or long sample time.
Address: 10h base + 2h offset = 12h
Bit
Read
Write
Reset
7
6
ADLPC
0
5
ADIV
4
3
ADLSMP
0
0
0
2
1
MODE
0
0
ADICLK
0
0
0
ADC_SC3 field descriptions
Field
7
ADLPC
Description
Low-Power Configuration
ADLPC controls the speed and power configuration of the successive approximation converter. This
optimizes power consumption when higher sample rates are not required.
0
1
6–5
ADIV
Clock Divide Select
ADIV selects the divide ratio used by the ADC to generate the internal clock ADCK.
00
01
10
11
4
ADLSMP
Divide ration = 1, and clock rate = Input clock.
Divide ration = 2, and clock rate = Input clock ÷ 2.
Divide ration = 3, and clock rate = Input clock ÷ 4.
Divide ration = 4, and clock rate = Input clock ÷ 8.
Long Sample Time Configuration
ADLSMP selects between long and short sample time. This adjusts the sample period to allow higher
impedance inputs to be accurately sampled or to maximize conversion speed for lower impedance inputs.
Longer sample times can also be used to lower overall power consumption when continuous conversions
are enabled if high conversion rates are not required.
0
1
3–2
MODE
High speed configuration.
Low power configuration:The power is reduced at the expense of maximum clock speed.
Short sample time.
Long sample time.
Conversion Mode Selection
MODE bits are used to select between 12-, 10-, or 8-bit operation.
00
8-bit conversion (N=8)
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
469
ADC Control Registers
ADC_SC3 field descriptions (continued)
Field
Description
01
10
11
ADICLK
10-bit conversion (N=10)
12-bit conversion (N=12)
Reserved
Input Clock Select
ADICLK bits select the input clock source to generate the internal clock ADCK.
00
01
10
11
Bus clock
Bus clock divided by 2
Alternate clock (ALTCLK)
Asynchronous clock (ADACK)
18.3.4 Status and Control Register 4 (ADC_SC4)
This register controls the FIFO scan mode, FIFO compare function and FIFO depth
selection of the ADC module.
Address: 10h base + 3h offset = 13h
Bit
7
Read
Write
Reset
0
6
5
ASCANE
ACFSEL
0
0
0
4
3
2
0
0
1
0
AFDEP
0
0
0
0
ADC_SC4 field descriptions
Field
Description
7
Reserved
This field is reserved.
This read-only field is reserved and always has the value 0.
6
ASCANE
FIFO Scan Mode Enable
The FIFO always use the first dummied FIFO channels when it is enabled. When this bit is set and FIFO
function is enabled, ADC will repeat using the first FIFO channel as the conversion channel until the result
FIFO is fulfilled. In continuous mode (ADCO = 1), ADC will start next conversion with the same channel
when COCO is set.
0
1
5
ACFSEL
Compare function select OR/AND when the FIFO function is enabled (AFDEP > 0). When this field is
cleared, ADC will OR all of compare triggers and set COCO after at least one of compare trigger occurs.
When this field is set, ADC will AND all of compare triggers and set COCO after all of compare triggers
occur.
0
1
4–3
Reserved
FIFO scan mode disabled.
FIFO scan mode enabled.
OR all of compare trigger.
AND all of compare trigger.
This field is reserved.
This read-only field is reserved and always has the value 0.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
470
Freescale Semiconductor, Inc.
Chapter 18 Analog-to-digital converter (ADC)
ADC_SC4 field descriptions (continued)
Field
AFDEP
Description
FIFO Depth enables the FIFO function and sets the depth of FIFO. When AFDEP is cleared, the FIFO is
disabled. When AFDEP is set to nonzero, the FIFO function is enabled and the depth is indicated by the
AFDEP bits. The ADCH in ADC_SC1 and ADC_RH:ADC_RL must be accessed by FIFO mode when
FIFO function is enabled. ADC starts conversion when the analog channel FIFO is upon the level
indicated by AFDEP bits. The COCO bit is set when the set of conversions are completed and the result
FIFO is upon the level indicated by AFDEP bits.
NOTE: The bus clock frequency must be at least double the ADC clock when FIFO mode is enabled. It
means, if ICS FBE mode is used, the ADC clock can not be ADACK.
000
001
010
011
100
101
110
111
FIFO is disabled.
2-level FIFO is enabled.
3-level FIFO is enabled..
4-level FIFO is enabled.
5-level FIFO is enabled.
6-level FIFO is enabled.
7-level FIFO is enabled.
8-level FIFO is enabled.
18.3.5 Conversion Result High Register (ADC_RH)
In 12-bit operation, ADC_RH contains the upper four bits of the result of a 12-bit
conversion.
ADC_RH is updated each time a conversion completes except when automatic compare
is enabled and the compare condition is not met. Reading ADC_RH prevents the ADC
from transferring subsequent conversion results into the result registers until ADC_RL is
read. If ADC_RL is not read until after the next conversion is completed, the intermediate
conversion result is lost. In 8-bit mode, there is no interlocking with ADC_RL.
When FIFO is enabled, the result FIFO is read via ADC_RH:ADC_RL. The ADC
conversion completes when the input channel FIFO is fulfilled at the depth indicated by
the AFDEP. The AD result FIFO can be read via ADC_RH:ADC_RL continuously by
the order set in analog input channel ADCH.
If the MODE bits are changed, any data in ADC_RH becomes invalid.
Address: 10h base + 4h offset = 14h
Bit
7
6
Read
5
4
3
2
0
1
0
0
0
ADR
Write
Reset
0
0
0
0
0
0
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
471
ADC Control Registers
ADC_RH field descriptions
Field
7–4
Reserved
ADR
Description
This field is reserved.
This read-only field is reserved and always has the value 0.
Conversion Result[12:8]
18.3.6 Conversion Result Low Register (ADC_RL)
ADC_RL contains the lower eight bits of the result of a 12-bit conversion. This register is
updated each time a conversion completes except when automatic compare is enabled
and the compare condition is not met. In 12-bit mode, reading ADC_RH prevents the
ADC from transferring subsequent conversion results into the result registers until
ADC_RL is read. If ADC_RL is not read until the next conversion is completed, the
intermediate conversion results are lost. In 8-bit mode, there is no interlocking with
ADC_RH. If the MODE bits are changed, any data in ADC_RL becomes invalid.
When FIFO is enabled, the result FIFO is read via ADC_RH:ADC_RL. The ADC
conversion completes when the input channel FIFO is fulfilled at the depth indicated by
the AFDEP. The AD result FIFO can be read via ADC_RH:ADC_RL continuously by
the order set in analog input channel FIFO.
Address: 10h base + 5h offset = 15h
Bit
7
6
5
4
Read
3
2
1
0
0
0
0
0
ADR
Write
Reset
0
0
0
0
ADC_RL field descriptions
Field
ADR
Description
Conversion Result[7:0]
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
472
Freescale Semiconductor, Inc.
Chapter 18 Analog-to-digital converter (ADC)
18.3.7 Compare Value High Register (ADC_CVH)
In 12-bit mode, this register holds the upper four bits of the 12-bit compare value. These
bits are compared to the upper four bits of the result following a conversion in 12-bit
mode when the compare function is enabled.
Address: 10h base + 6h offset = 16h
Bit
Read
Write
Reset
7
6
5
4
3
2
0
0
1
0
0
0
CV
0
0
0
0
0
ADC_CVH field descriptions
Field
7–4
Reserved
CV
Description
This field is reserved.
This read-only field is reserved and always has the value 0.
Conversion Result[15:8]
18.3.8 Compare Value Low Register (ADC_CVL)
This register holds the lower 8 bits of the 12-bit compare value. Bits CV7:CV0 are
compared to the lower 8 bits of the result following a conversion in 12-bit mode.
Address: 10h base + 7h offset = 17h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
CV
0
0
0
0
ADC_CVL field descriptions
Field
CV
Description
Conversion Result[7:0]
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
473
ADC Control Registers
18.3.9 Pin Control 1 Register (ADC_APCTL1)
The pin control registers disable the I/O port control of MCU pins used as analog inputs.
APCTL1 is used to control the pins associated with channels 0-7 of the ADC module.
Address: 10h base + 309Ch offset = 30ACh
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
ADPC7
ADPC6
ADPC5
ADPC4
ADPC3
ADPC2
ADPC1
ADPC0
0
0
0
0
0
0
0
0
ADC_APCTL1 field descriptions
Field
7
ADPC7
Description
ADC Pin Control 7
ADPC7 controls the pin associated with channel AD7.
0
1
6
ADPC6
ADC Pin Control 6
ADPC6 controls the pin associated with channel AD6.
0
1
5
ADPC5
ADPC5 controls the pin associated with channel AD5.
ADPC4 controls the pin associated with channel AD4.
AD4 pin I/O control enabled.
AD4 pin I/O control disabled.
ADC Pin Control 3
ADPC3 controls the pin associated with channel AD3.
0
1
2
ADPC2
AD5 pin I/O control enabled.
AD5 pin I/O control disabled.
ADC Pin Control 4
0
1
3
ADPC3
AD6 pin I/O control enabled.
AD6 pin I/O control disabled.
ADC Pin Control 5
0
1
4
ADPC4
AD7 pin I/O control enabled.
AD7 pin I/O control disabled.
AD3 pin I/O control enabled.
AD3 pin I/O control disabled.
ADC Pin Control 2
ADPC2 controls the pin associated with channel AD2.
0
1
AD2 pin I/O control enabled.
AD2 pin I/O control disabled.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
474
Freescale Semiconductor, Inc.
Chapter 18 Analog-to-digital converter (ADC)
ADC_APCTL1 field descriptions (continued)
Field
1
ADPC1
Description
ADC Pin Control 1
ADPC1 controls the pin associated with channel AD1.
0
1
0
ADPC0
AD1 pin I/O control enabled.
AD1 pin I/O control disabled.
ADC Pin Control 0
ADPC0 controls the pin associated with channel AD0.
0
1
AD0 pin I/O control enabled.
AD0 pin I/O control disabled.
18.3.10 Pin Control 2 Register (ADC_APCTL2)
APCTL2 controls channels 8-15 of the ADC module.
Address: 10h base + 309Dh offset = 30ADh
Bit
Read
Write
Reset
7
6
5
4
Reserved
0
0
0
3
2
1
0
ADPC11
ADPC10
ADPC9
ADPC8
0
0
0
0
0
ADC_APCTL2 field descriptions
Field
Description
7–4
Reserved
This field is reserved.
3
ADPC11
ADC Pin Control 11
ADPC11 controls the pin associated with channel AD11.
0
1
2
ADPC10
ADC Pin Control 10
ADPC10 controls the pin associated with channel AD10.
0
1
1
ADPC9
AD10 pin I/O control enabled.
AD10 pin I/O control disabled.
ADC Pin Control 9
ADPC9 controls the pin associated with channel AD1.
0
1
0
ADPC8
AD11 pin I/O control enabled.
AD11 pin I/O control disabled.
AD9 pin I/O control enabled.
AD9 pin I/O control disabled.
ADC Pin Control 8
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
475
Functional description
ADC_APCTL2 field descriptions (continued)
Field
Description
ADPC8 controls the pin associated with channel AD8.
0
1
AD8 pin I/O control enabled.
AD8 pin I/O control disabled.
18.4 Functional description
The ADC module is disabled during reset or when the ADC_SC1[ADCH] bits are all
high. The module is idle when a conversion has completed and another conversion has
not been initiated. When idle, the module is in its lowest power state.
The ADC can perform an analog-to-digital conversion on any of the software selectable
channels. In 12-bit mode, the selected channel voltage is converted by a successive
approximation algorithm into a 12-bit digital result. In 10-bit mode, the selected channel
voltage is converted by a successive approximation algorithm into a 10-bit digital result.
In 8-bit mode, the selected channel voltage is converted by a successive approximation
algorithm into a 8-bit digital result.
When the conversion is completed, the result is placed in the data registers (ADC_RH
and ADC_RL). In 10-bit mode, the result is rounded to 10 bits and placed in the data
registers (ADC_RH and ADC_RL). In 8-bit mode, the result is rounded to 8 bits and
placed in ADC_RL. The conversion complete flag (ADC_SC1[COCO]) is then set and
an interrupt is generated if the conversion complete interrupt has been enabled
(ADC_SC1[AIEN] = 1).
The ADC module has the capability of automatically comparing the result of a
conversion with the contents of its compare registers. The compare function is enabled by
setting the ADC_SC2[ACFE] bit and operates with any of the conversion modes and
configurations.
18.4.1 Clock select and divide control
One of four clock sources can be selected as the clock source for the ADC module. This
clock source is then divided by a configurable value to generate the input clock to the
converter (ADCK). The clock is selected from one of the following sources by means of
the ADC_SC3[ADICLK] bits.
• The bus clock, which is equal to the frequency at which software is executed. This is
the default selection following reset.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
476
Freescale Semiconductor, Inc.
Chapter 18 Analog-to-digital converter (ADC)
• The bus clock divided by 2: For higher bus clock rates, this allows a maximum
divide by 16 of the bus clock.
• ALTCLK, that is, alternate clock which is OSCOUT
• The asynchronous clock (ADACK): This clock is generated from a clock source
within the ADC module. When selected as the clock source, this clock remains active
while the MCU is in Wait or Stop mode and allows conversions in these modes for
lower noise operation.
Whichever clock is selected, its frequency must fall within the specified frequency range
for ADCK. If the available clocks are too slow, the ADC does not perform according to
specifications. If the available clocks are too fast, the clock must be divided to the
appropriate frequency. This divider is specified by the ADC_SC3[ADIV] bits and can be
divide-by 1, 2, 4, or 8.
18.4.2 Input select and pin control
The Pin Control registers ( ADC_APCTL2 and ADC_APCTL1) disables the I/O port
control of the pins used as analog inputs. When a pin control register bit is set, the
following conditions are forced for the associated MCU pin:
• The output buffer is forced to its high impedance state.
• The input buffer is disabled. A read of the I/O port returns a zero for any pin with its
input buffer disabled.
• The pullup is disabled.
18.4.3 Hardware trigger
The ADC module has a selectable asynchronous hardware conversion trigger, ADHWT,
that is enabled when the ADC_SC2[ADTRG] bit is set. This source is not available on all
MCUs. See the module introduction for information on the ADHWT source specific to
this MCU.
When ADHWT source is available and hardware trigger is enabled
( ADC_SC2[ADTRG] = 1), a conversion is initiated on the rising edge of ADHWT. If a
conversion is in progress when a rising edge occurs, the rising edge is ignored. In
continuous convert configuration, only the initial rising edge to launch continuous
conversions is observed. The hardware trigger function operates in conjunction with any
of the conversion modes and configurations.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
477
Functional description
18.4.4 Conversion control
Conversions can be performed in 12-bit mode, 10-bit mode, or 8-bit mode as determined
by the ADC_SC3[MODE] bits. Conversions can be initiated by a software or hardware
trigger. In addition, the ADC module can be configured for low power operation, long
sample time, continuous conversion, and an automatic compare of the conversion result
to a software determined compare value.
18.4.4.1 Initiating conversions
A conversion initiates under the following conditions:
• A write to ADC_SC1 or a set of write to ADC_SC1 in FIFO mode (with ADCH bits
not all 1s) if software triggered operation is selected.
• A hardware trigger (ADHWT) event if hardware triggered operation is selected.
• The transfer of the result to the data registers when continuous conversion is enabled.
If continuous conversions are enabled, a new conversion is automatically initiated after
the completion of the current conversion. In software triggered operation, continuous
conversions begin after ADC_SC1 is written and continue until aborted. In hardware
triggered operation, continuous conversions begin after a hardware trigger event and
continue until aborted.
18.4.4.2 Completing conversions
A conversion is completed when the result of the conversion is transferred into the data
result registers, ADC_RH and ADC_RL. This is indicated by the setting of
ADC_SC1[COCO]. An interrupt is generated if ADC_SC1[AIEN] is high at the time that
ADC_SC1[COCO] is set.
A blocking mechanism prevents a new result from overwriting previous data in ADC_RH
and ADC_RL if the previous data is in the process of being read while in 12-bit or 10-bit
MODE (the ADC_RH register has been read but the ADC_RL register has not). When
blocking is active, the data transfer is blocked, ADC_SC1[COCO] is not set, and the new
result is lost. In the case of single conversions with the compare function enabled and the
compare condition false, blocking has no effect and ADC operation is terminated. In all
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
478
Freescale Semiconductor, Inc.
Chapter 18 Analog-to-digital converter (ADC)
other cases of operation, when a data transfer is blocked, another conversion is initiated
regardless of the state of ADC_SC1[ADCO] whether single or continuous conversions
are enabled.
If single conversions are enabled, the blocking mechanism could result in several
discarded conversions and excess power consumption. To avoid this issue, the data
registers must not be read after initiating a single conversion until the conversion
completes.
In fifo mode, a blocking mechanism will keep current channel conversion and no channel
fifo and result fifo switching until a block mechanism is released.
18.4.4.3 Aborting conversions
Any conversion in progress is aborted in the following cases:
• A write to ADC_SC1 occurs.
• The current conversion will be aborted and a new conversion will be initiated, if
ADC_SC1[ADCH] are not all 1s and ADC_SC4[AFDEP] are all 0s.
• The current conversion and the rest of conversions will be aborted and no new
conversion will be initialed, if ADC_SC4[AFDEP] are not all 0s.
• A new conversion will be initiated when the FIFO is re-fulfilled upon the levels
indicated by the ADC_SC4[AFDEP] bits).
• A write to ADC_SC2, ADC_SC3, ADC_SC4, ADC_CVH, or ADC_CVL occurs.
This indicates a mode of operation change has occurred and the current and rest of
conversions (when ADC_SC4[AFDEP] are not all 0s) are therefore invalid.
• The MCU is reset.
• The MCU enters Stop mode with ADACK not enabled.
When a conversion is aborted, the contents of the data registers, ADC_RH and ADC_RL,
are not altered. However, they continue to be the values transferred after the completion
of the last successful conversion. If the conversion was aborted by a reset, ADC_RH and
ADC_RL return to their reset states.
18.4.4.4 Power control
The ADC module remains in its idle state until a conversion is initiated. If ADACK is
selected as the conversion clock source, the ADACK clock generator is also enabled.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
479
Functional description
Power consumption when active can be reduced by setting ADC_SC3[ADLPC]. This
results in a lower maximum value for fADCK (see the data sheet).
18.4.4.5 Sample time and total conversion time
The total conversion time depends on the sample time (as determined by
ADC_SC3[ADLSMP]), the MCU bus frequency, the conversion mode (8-bit, 10-bit or
12-bit), and the frequency of the conversion clock (fADCK). After the module becomes
active, sampling of the input begins.ADC_SC3[ADLSMP] selects between short (3.5
ADCK cycles) and long (23.5 ADCK cycles) sample times. When sampling is complete,
the converter is isolated from the input channel and a successive approximation algorithm
is performed to determine the digital value of the analog signal. The result of the
conversion is transferred to ADC_RH and ADC_RL upon completion of the conversion
algorithm.
If the bus frequency is less than the fADCK frequency, precise sample time for continuous
conversions cannot be guaranteed when short sample is enabled (ADC_SC3[ADLSMP]
= 0). If the bus frequency is less than 1/11th of the fADCK frequency, precise sample time
for continuous conversions cannot be guaranteed when long sample is enabled
(ADC_SC3[ADLSMP] = 1).
The maximum total conversion time for different conditions is summarized in the table
below.
Table 18-13. Total conversion time vs. control conditions
Conversion type
ADICLK
ADLSMP
Max total conversion time
Single or first continuous 8-bit
0x, 10
0
20 ADCK cycles + 5 bus clock cycles
Single or first continuous 10-bit or 12-bit
0x, 10
0
23 ADCK cycles + 5 bus clock cycles
Single or first continuous 8-bit
0x, 10
1
40 ADCK cycles + 5 bus clock cycles
Single or first continuous 10-bit or 12-bit
0x, 10
1
43 ADCK cycles + 5 bus clock cycles
Single or first continuous 8-bit
11
0
5 µs + 20 ADCK + 5 bus clock cycles
Single or first continuous 10-bit or 12-bit
11
0
5 µs + 23 ADCK + 5 bus clock cycles
Single or first continuous 8-bit
11
1
5 µs + 40 ADCK + 5 bus clock cycles
Single or first continuous 10-bit or 12-bit
11
1
5 µs + 43 ADCK + 5 bus clock cycles
Subsequent continuous 8-bit;
xx
0
17 ADCK cycles
xx
0
20 ADCK cycles
xx
1
37 ADCK cycles
xx
1
40 ADCK cycles
fBUS > fADCK
Subsequent continuous 10-bit or 12-bit;
fBUS > fADCK
Subsequent continuous 8-bit;
fBUS > fADCK/11
Subsequent continuous 10-bit or 12-bit;
fBUS > fADCK/11
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
480
Freescale Semiconductor, Inc.
Chapter 18 Analog-to-digital converter (ADC)
The maximum total conversion time is determined by the selected clock source and the
divide ratio. The clock source is selectable by the ADC_SC3[ADICLK] bits, and the
divide ratio is specified by the ADC_SC3[ADIV] bits. For example, in 10-bit mode, with
the bus clock selected as the input clock source, the input clock divide-by-1 ratio
selected, and a bus frequency of 8 MHz, then the conversion time for a single conversion
as given below:
The number of bus cycles at 8 MHz is:
Note
The ADCK frequency must be between fADCK minimum and
fADCK maximum to meet ADC specifications.
18.4.5 Automatic compare function
The compare function can be configured to check for an upper or lower limit. After the
input is sampled and converted, the result is added to the two's complement of the
compare value (ADC_CVH and ADC_CVL). When comparing to an upper limit
(ADC_SC2[ACFGT] = 1), if the result is greater-than or equal-to the compare value,
ADC_SC1[COCO] is set. When comparing to a lower limit (ADC_SC2[ACFGT] = 0), if
the result is less than the compare value, ADC_SC1[COCO] is set. The value generated
by the addition of the conversion result and the two's complement of the compare value is
transferred to ADC_RH and ADC_RL.
On completion of a conversion while the compare function is enabled, if the compare
condition is not true, ADC_SC1[COCO] is not set and no data is transferred to the result
registers. An ADC interrupt is generated on the setting of ADC_SC1[COCO] if the ADC
interrupt is enabled (ADC_SC1[AIEN] = 1).
On completion of all conversions while the compare function is enabled and FIFO
enabled, if none of the compare conditions are not true when ADC_SC4[ACFSEL] is low
or if not all of compare conditions are true when ADC_SC4[ACFSEL] is high,
ADC_SC1[COCO] is not set. The compare data are transferred to the result registers
regardless of compare condition true or false when FIFO enabled.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
481
Functional description
Note
The compare function can monitor the voltage on a channel
while the MCU is in Wait or Stop mode. The ADC interrupt
wakes the MCU when the compare condition is met.
Note
The compare function can not work in continuous conversion
mode when FIFO enabled.
18.4.6 FIFO operation
The ADC module supports FIFO operation to minimize the interrupts to CPU in order to
reduce CPU loading in ADC interrupt service routines. This module contains two FIFOs
to buffer analog input channels and analog results respectively.
The FIFO function is enabled when the ADC_SC4[AFDEP] bits are set non-zero. The
FIFO depth is indicated by these bits. The FIFO supports up to eight level buffer.
The analog input channel FIFO is accessed by ADC_SC1[ADCH] bits, when FIFO
function is enabled. The analog channel must be written to this FIFO in order. The ADC
will not start the conversion if the channel FIFO is fulfilled below the level indicated by
the ADC_SC4[AFDEP] bits, no matter whether software or hardware trigger is set. Read
ADC_SC1[ADCH] will read the current active channel value. Write to
ADC_SC1[ADCH] will re-fill channel FIFO to initial new conversion. It will abort
current conversion and any other conversions that did not start. Write to the ADC_SC1
after all the conversions are completed or ADC is in idle state.
The result of the FIFO is accessed by ADC_RH:ADC_RL registers, when FIFO function
is enabled. The result must be read via these two registers by the same order of analog
input channel FIFO to get the proper results. Don't read ADC_RH:ADC_RL until all of
the conversions are completed in FIFO mode. The ADC_SC1[COCO] bit will be set only
when all conversions indicated by the analog input channel FIFO complete whatever
software or hardware trigger is set. An interrupt request will be submitted to CPU if the
ADC_SC1[AIEN] is set when the FIFO conversion completes and the
ADC_SC1[COCO] bit is set.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
482
Freescale Semiconductor, Inc.
Chapter 18 Analog-to-digital converter (ADC)
AFDEP
ADC_RL read
ADC_RH read
AD CHANNEL FIFO
ADCH
ADC_RH
ADC_RL
5-bit ch
7
0
16-bit AD result
5-bit ch
6
1
16-bit AD result
5-bit ch
5
2
16-bit AD result
5-bit ch
4
3
16-bit AD result
5-bit ch
5-bit ch
3
4
16-bit AD result
2
5
16-bit AD result
5-bit ch
1
6
16-bit AD result
5-bit ch
0
7
16-bit AD result
AD RESULT FIFO
ADCH write
FIFO Read/Write Logic reset
COMPARE
LOGIC
Result FIFO Fulfilled
COMPARE
LOGIC
Channel FIFO Fulfilled
Result FIFO read pointer
FIFO Read/Write Logic
D Q
CK
COCO
Channel FIFO write pointer
Result FIFO write pointer
FIFO Work Logic
Channel FIFO read pointer
D Q
CK
FIFO conversion start
BUS CLK
Figure 18-12. FADC FIFO structure
If software trigger is enabled, the next analog channel is fetched from analog input
channel FIFO as soon as a conversion completes and its result is stored in the result
FIFO. When all conversions set in the analog input channel FIFO completes, the
ADC_SC1[COCO] bit is set and an interrupt request will be submitted to CPU if the
ADC_SC1[AIEN] bit is set.
If hardware trigger mode is enabled, the next analog is fetched from analog input channel
FIFO only when this conversion completes, its result is stored in the result FIFO, and the
next hardware trigger is fed to ADC module. When all conversions set in the analog input
channel FIFO completes, the ADC_SC1[COCO] bit is set and an interrupt request will be
submitted to CPU if the ADC_SC1[AIEN] bit is set.
In single conversion in which ADC_SC1[ADCO] bit is clear, the ADC stops conversions
when ADC_SC1[COCO] bit is set until the channel FIFO is fulfilled again or new
hardware trigger occur.
The FIFO also provides scan mode to simplify the dummy work of input channel FIFO.
When the ADC_SC4[ASCANE] bit is set in FIFO mode, the FIFO will always use the
first dummied channel in spite of the value in the input channel FIFO. The ADC
conversion start to work in FIFO mode as soon as the first channel is dummied. The
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
483
Functional description
following write operation to the input channel FIFO will cover the first channel element
in this FIFO. In scan FIFO mode, the ADC_SC1[COCO] bit is set when the result FIFO
is fulfilled according to the depth indicated by the ADC_SC4[AFDEP] bits.
In continuous conversion in which the ADC_SC1[ADCO] bit is set, the ADC starts next
conversion immediately when all conversions are completed. ADC module will fetch the
analog input channel from the beginning of analog input channel FIFO.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
484
Freescale Semiconductor, Inc.
Chapter 18 Analog-to-digital converter (ADC)
The nth AD channel fetch
max = AFDEP
Channel FIFO fulfilled
Start FIFOed Conversion
n
0
max
The nth AD channel fetch
Software Triggered Single Conversion
COCO = 1
Conversions Completed
The nth AD result store
max = AFDEP
Channel FIFO fulfilled
Start FIFOed Conversion
n
0
max
The nth AD result store
n
0
max
ADC_SC1[COCO] = 1
Conversions Completed
The nth AD channel fetch
when n hardware trigger occurs
n
0
max
Software Triggered Continuous Conversion
max = AFDEP
when last hardware trigger occurs
Channel FIFO fulfilled
Start FIFOed Conversion
when 1st hardware trigger occurs
n
0
max
If new trigger occurs, the new set conversions will be generated
Hardware Triggered Single Conversion
The
nth
AD result store
The nth AD channel fetch
ADC_SC1[COCO] = 1
Conversions Completed
max = AFDEP
Channel FIFO fulfilled
Start FIFOed Conversion
when hardware trigger occurs
0
n
The nth AD result store
max
n
0
Hardware Triggered Continuous Conversion
(Only need one hardware trigger)
COCO = 1
Conversions Completed
Figure 18-13. ADC FIFO conversion sequence
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
485
Functional description
18.4.7 MCU wait mode operation
Wait mode is a low-power consumption standby mode from which recovery is fast
because the clock sources remain active. If a conversion is in progress when the MCU
enters wait mode, it continues until completion. Conversions can be initiated while the
MCU is in wait mode by means of the hardware trigger or if continuous conversions are
enabled.
The bus clock, bus clock divided by two, ALTCLK and ADACK are available as
conversion clock sources while in wait mode.
ADC_SC1[COCO] is set by a conversion complete event that generates an ADC interrupt
to wake the MCU from wait mode if the ADC interrupt is enabled (ADC_SC1[AIEN] =
1).
18.4.8 MCU Stop mode operation
Stop mode is a low-power consumption standby mode during which most or all clock
sources on the MCU are disabled.
18.4.8.1 Stop mode with ADACK disabled
If the asynchronous clock, ADACK, is not selected as the conversion clock, executing a
STOP instruction aborts the current conversion and places the ADC in its idle state. The
contents of ADC_RH and ADC_RL are unaffected by Stop mode. After exiting from
Stop mode, a software or hardware trigger is required to resume conversions.
18.4.8.2 Stop mode with ADACK enabled
If ADACK is selected as the conversion clock, the ADC continues operation during Stop
mode. For guaranteed ADC operation, the MCU's voltage regulator must remain active
during Stop mode. See the module introduction for configuration information for this
MCU.
If a conversion is in progress when the MCU enters Stop mode, it continues until
completion. Conversions can be initiated while the MCU is in Stop mode by means of the
hardware trigger or if continuous conversions are enabled.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
486
Freescale Semiconductor, Inc.
Chapter 18 Analog-to-digital converter (ADC)
A conversion complete event sets the ADC_SC1[COCO] and generates an ADC interrupt
to wake the MCU from Stop mode if the ADC interrupt is enabled (ADC_SC1[AIEN] =
1). In fifo mode, ADC cannot complete the conversion operation fully or wake the MCU
from Stop mode.
Note
The ADC module can wake the system from low-power stop
and cause the MCU to begin consuming run-level currents
without generating a system level interrupt. To prevent this
scenario, the data transfer blocking mechanism must be cleared
when entering Stop and continuing ADC conversions.
18.5 Initialization information
This section gives an example that provides some basic direction on how to initialize and
configure the ADC module. You can configure the module for 8-, 10-, or 12-bit
resolution, single or continuous conversion, and a polled or interrupt approach, among
many other options. Refer to ADC_SC3 register for information used in this example.
Note
Hexadecimal values prefixed by a 0x, binary values prefixed by
a %, and decimal values have no preceding character.
18.5.1 ADC module initialization example
Before the ADC module can be used to complete conversions, it must be initialized.
Given below is a method to initialize ADC module.
18.5.1.1 Initialization sequence
A typical initialization sequence is as follows:
1. Update the configuration register (ADC_SC3) to select the input clock source and the
divide ratio used to generate the internal clock, ADCK. This register is also used for
selecting sample time and low-power configuration.
2. Update status and control register 2 (ADC_SC2) to select the hardware or software
conversion trigger and compare function options, if enabled.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
487
Initialization information
3. Update status and control register 1 (ADC_SC1) to select whether conversions will
be continuous or completed only once, and to enable or disable conversion complete
interrupts. The input channel on which conversions will be performed is also selected
here.
18.5.1.2 Pseudo-code example
In this example, the ADC module is set up with interrupts enabled to perform a single 10bit conversion at low power with a long sample time on input channel 1, where the
internal ADCK clock is derived from the bus clock divided by 1.
Example: 18.5.1.2.1 General ADC initialization routine
void ADC_init(void)
{
/* The following code segment demonstrates how to initialize ADC by low-power mode,
long
sample time, bus frequency, software triggered from AD1 external pin without FIFO
enabled
*/
ADC_APCTL1 = ADC_APCTL1_ADPC1_MASK;
ADC_SC3 = ADC_SC3_ADLPC_MASK | ADC_SC3_ADLSMP_MASK | ADC_SC3_MODE0_MASK;
ADC_SC2 = 0x00;
ADC_SC1 = ADC_SC1_AIEN_MASK | ADC_SC1_ADCH0_MASK;
}
18.5.2 ADC FIFO module initialization example
Before the ADC module can be used to start FIFOed conversions, an initialization
procedure must be performed. A typical sequence is as follows:
1. Update the configuration register (ADC_SC3) to select the input clock source and the
divide ratio used to generate the internal clock, ADCK. This register is also used to
select sample time and low-power configuration.
2. Update the configuration register (ADC_SC4) to select the FIFO scan mode, FIFO
compare function selection (OR or AND function) and FIFO depth.
3. Update status and control register 2 (ADC_SC2) to select the hardware or software
conversion trigger, compare function options if enabled.
4. Update status and control register 1 (ADC_SC1) to select whether conversions will
be continuous or completed only once, and to enable or disable conversion complete
interrupts. The input channel on which conversions will be performed is also selected
here.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
488
Freescale Semiconductor, Inc.
Chapter 18 Analog-to-digital converter (ADC)
18.5.2.1 Pseudo-code example
In this example, the ADC module is set up with interrupts enabled to perform a single
hardware triggered 10-bit 4-level-FIFO conversion at low power with a long sample time
on input channels of 1, 3, 5, and 7. Here the internal ADCK clock is derived from the bus
clock divided by 1.
Example: 18.5.2.1.1 FIFO ADC initialization routine
void ADC_init(void)
{
/* The following code segment demonstrates how to initialize ADC by low-power mode, long
sample time, bus frequency, hardware triggered from AD1, AD3, AD5, and AD7 external pins
with 4-level FIFO enabled */
ADC_APCTL1 = ADC_APCTL1_ADPC6_MASK | ADC_APCTL1_ADPC5_MASK | ADC_APCTL1_ADPC3_MASK |
ADC_APCTL1_ADPC1_MASK;
ADC_SC3 = ADC_SC3_ADLPC_MASK | ADC_SC3_ADLSMP_MASK | ADC_SC3_MODE1_MASK;
// setting hardware trigger
ADC_SC2 = ADC_SC2_ADTRG_MASK ;
//4-Level FIFO
ADC_SC4 = ADC_SC4_AFDEP1_MASK | ADC_SC4_AFDEP0_MASK;
// dummy the 1st channel
ADC_SC1 = ADC_SC1_ADCH0_MASK;
// dummy the 2nd channel
ADC_SC1 = ADC_SC1_ADCH1_MASK | ADC_SC1_ADCH0_MASK;
// dummy the 3rd channel
ADC_SC1 = ADC_SC1_ADCH2_MASK | ADC_SC1_ADCH0_MASK;
// dummy the 4th channel and ADC starts conversion
ADC_SC1 = ADC_SC1_AIEN_MASK | ADC_SC1_ADCH2_MASK | ADC_SC1_ADCH1_MASK | ADC_SC1_ADCH0_MASK;
}
Example: 18.5.2.1.2 FIFO ADC interrupt service routine
unsigned short buffer[4];
interrupt VectorNumber_Vadc void ADC_isr(void)
{
/* The following code segment demonstrates read AD result FIFO */
// read conversion result of channel 1 and COCO bit is cleared
buffer[0] = ADC_R;
// read conversion result of channel 3
buffer[1] = ADC_R;
// read conversion result of channel 5
buffer[2] = ADC_R;
// read conversion result of channel 7
buffer[3] = ADC_R;
}
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
489
Application information
NOTE
ADC_R is 16-bit ADC result register, combined from
ADC_RH and ADC_RL
18.6 Application information
This section contains information for using the ADC module in applications. The ADC
has been designed to be integrated into a microcontroller for use in embedded control
applications requiring an A/D converter.
18.6.1 External pins and routing
The following sections discuss the external pins associated with the ADC module and
how they are used for best results.
18.6.1.1 Analog supply pins
The ADC module has analog power and ground supplies (VDDA and VSSA) available as
separate pins on some devices. VSSA is shared on the same pin as the MCU digital VSS on
some devices. On other devices, VSSA and VDDA are shared with the MCU digital supply
pins. In these cases, there are separate pads for the analog supplies bonded to the same
pin as the corresponding digital supply so that some degree of isolation between the
supplies is maintained.
When available on a separate pin, both VDDA and VSSA must be connected to the same
voltage potential as their corresponding MCU digital supply (VDD and VSS) and must be
routed carefully for maximum noise immunity and bypass capacitors placed as near as
possible to the package.
If separate power supplies are used for analog and digital power, the ground connection
between these supplies must be at the VSSA pin. This should be the only ground
connection between these supplies if possible. The VSSA pin makes a good single point
ground location.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
490
Freescale Semiconductor, Inc.
Chapter 18 Analog-to-digital converter (ADC)
18.6.1.2 Analog reference pins
In addition to the analog supplies, the ADC module has connections for two reference
voltage inputs. The high reference is VREFH, which may be shared on the same pin as
VDDA on some devices. The low reference is VREFL, which may be shared on the same
pin as VSSA on some devices.
When available on a separate pin, VREFH may be connected to the same potential as
VDDA, or may be driven by an external source between the minimum VDDA spec and the
VDDA potential (VREFH must never exceed VDDA). When available on a separate pin,
VREFL must be connected to the same voltage potential as VSSA. VREFH and VREFL must
be routed carefully for maximum noise immunity and bypass capacitors placed as near as
possible to the package.
AC current in the form of current spikes required to supply charge to the capacitor array
at each successive approximation step is drawn through the VREFH and VREFL loop. The
best external component to meet this current demand is a 0.1 µF capacitor with good high
frequency characteristics. This capacitor is connected between VREFH and VREFL and
must be placed as near as possible to the package pins. Resistance in the path is not
recommended because the current causes a voltage drop that could result in conversion
errors. Inductance in this path must be minimum (parasitic only).
18.6.1.3 Analog input pins
The external analog inputs are typically shared with digital I/O pins on MCU devices.
The pin I/O control is disabled by setting the appropriate control bit in one of the pin
control registers. Conversions can be performed on inputs without the associated pin
control register bit set. It is recommended that the pin control register bit always be set
when using a pin as an analog input. This avoids problems with contention because the
output buffer is in its high impedance state and the pullup is disabled. Also, the input
buffer draws DC current when its input is not at VDD or VSS. Setting the pin control
register bits for all pins used as analog inputs should be done to achieve lowest operating
current.
Empirical data shows that capacitors on the analog inputs improve performance in the
presence of noise or when the source impedance is high. Use of 0.01 µF capacitors with
good high-frequency characteristics is sufficient. These capacitors are not necessary in all
cases, but when used they must be placed as near as possible to the package pins and be
referenced to VSSA.
For proper conversion, the input voltage must fall between VREFH and VREFL. If the input
is equal to or exceeds VREFH, the converter circuit converts the signal to 0xFFF (full scale
12-bit representation), 0x3FF (full scale 10-bit representation) or 0xFF (full scale 8-bit
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
491
Application information
representation). If the input is equal to or less than VREFL, the converter circuit converts it
to 0x000. Input voltages between VREFH and VREFL are straight-line linear conversions.
There is a brief current associated with VREFL when the sampling capacitor is charging.
The input is sampled for 3.5 cycles of the ADCK source when ADC_SC3[ADLSMP] is
low, or 23.5 cycles when ADC_SC3[ADLSMP] is high.
For minimal loss of accuracy due to current injection, pins adjacent to the analog input
pins should not be transitioning during conversions.
18.6.2 Sources of error
Several sources of error exist for A/D conversions. These are discussed in the following
sections.
18.6.2.1 Sampling error
For proper conversions, the input must be sampled long enough to achieve the proper
accuracy. Given the maximum input resistance of approximately 7 kΩ and input
capacitance of approximately 5.5 pF, sampling to within 1/4 LSB (at 12-bit resolution)
can be achieved within the minimum sample window (3.5 cycles at 8 MHz maximum
ADCK frequency) provided the resistance of the external analog source (RAS) is kept
below 2 kΩ.
Higher source resistances or higher-accuracy sampling is possible by setting
ADC_SC3[ADLSMP] (to increase the sample window to 23.5 cycles) or decreasing
ADCK frequency to increase sample time.
18.6.2.2 Pin leakage error
Leakage on the I/O pins can cause conversion error if the external analog source
resistance (RAS) is high. If this error cannot be tolerated by the application, keep RAS
lower than VDDA / (2N*ILEAK) for less than 1/4 LSB leakage error (N = 8 in 8-bit, 10 in
10-bit or 12 in 12-bit mode).
18.6.2.3 Noise-induced errors
System noise that occurs during the sample or conversion process can affect the accuracy
of the conversion. The ADC accuracy numbers are guaranteed as specified only if the
following conditions are met:
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
492
Freescale Semiconductor, Inc.
Chapter 18 Analog-to-digital converter (ADC)
• There is a 0.1 µF low-ESR capacitor from VREFH to VREFL.
• There is a 0.1 µF low-ESR capacitor from VDDA to VSSA.
• If inductive isolation is used from the primary supply, an additional 1 µF capacitor is
placed from VDDA to VSSA.
• VSSA (and VREFL, if connected) is connected to VSS at a quiet point in the ground
plane.
• Operate the MCU in wait or Stop mode before initiating (hardware triggered
conversions) or immediately after initiating (hardware or software triggered
conversions) the ADC conversion.
• For software triggered conversions, immediately follow the write to ADC_SC1
with a wait instruction or stop instruction.
• For Stop mode operation, select ADACK as the clock source. Operation in Stop
reduces VDD noise but increases effective conversion time due to stop recovery.
• There is no I/O switching, input or output, on the MCU during the conversion.
There are some situations where external system activity causes radiated or conducted
noise emissions or excessive VDD noise is coupled into the ADC. In these situations, or
when the MCU cannot be placed in wait or Stop or I/O activity cannot be halted, these
recommended actions may reduce the effect of noise on the accuracy:
• Place a 0.01 µF capacitor (CAS) on the selected input channel to VREFL or VSSA (this
improves noise issues, but affects the sample rate based on the external analog source
resistance).
• Average the result by converting the analog input many times in succession and
dividing the sum of the results. Four samples are required to eliminate the effect of a
1LSB, one-time error.
• Reduce the effect of synchronous noise by operating off the asynchronous clock
(ADACK) and averaging. Noise that is synchronous to ADCK cannot be averaged
out.
18.6.2.4 Code width and quantization error
The ADC quantizes the ideal straight-line transfer function into 4096 steps (in 12-bit
mode). Each step ideally has the same height (1 code) and width. The width is defined as
the delta between the transition points to one code and the next. The ideal code width for
an N bit converter (in this case N can be 8, 10 or 12), defined as 1LSB, is:
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
493
Application information
There is an inherent quantization error due to the digitization of the result. For 8-bit or
10-bit conversions the code transitions when the voltage is at the midpoint between the
points where the straight line transfer function is exactly represented by the actual
transfer function. Therefore, the quantization error will be ± 1/2 lsb in 8- or 10-bit mode.
As a consequence, however, the code width of the first (0x000) conversion is only 1/2 lsb
and the code width of the last (0xFF or 0x3FF) is 1.5 lsb.
For 12-bit conversions the code transitions only after the full code width is present, so the
quantization error is -1 lsb to 0 lsb and the code width of each step is 1 lsb.
18.6.2.5 Linearity errors
The ADC may also exhibit non-linearity of several forms. Every effort has been made to
reduce these errors but the system must be aware of them because they affect overall
accuracy. These errors are:
• Zero-scale error (EZS) (sometimes called offset) — This error is defined as the
difference between the actual code width of the first conversion and the ideal code
width (1/2 lsb in 8-bit or 10-bit modes and 1 lsb in 12-bit mode). If the first
conversion is 0x001, the difference between the actual 0x001 code width and its ideal
(1 lsb) is used.
• Full-scale error (EFS) — This error is defined as the difference between the actual
code width of the last conversion and the ideal code width (1.5 lsb in 8-bit or 10-bit
modes and 1LSB in 12-bit mode). If the last conversion is 0x3FE, the difference
between the actual 0x3FE code width and its ideal (1 lsb) is used.
• Differential non-linearity (DNL) — This error is defined as the worst-case difference
between the actual code width and the ideal code width for all conversions.
• Integral non-linearity (INL) — This error is defined as the highest-value that the
absolute value of the running sum of DNL achieves. More simply, this is the worstcase difference of the actual transition voltage to a given code and its corresponding
ideal transition voltage, for all codes.
• Total unadjusted error (TUE) — This error is defined as the difference between the
actual transfer function and the ideal straight-line transfer function and includes all
forms of error.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
494
Freescale Semiconductor, Inc.
Chapter 18 Analog-to-digital converter (ADC)
18.6.2.6 Code jitter, non-monotonicity, and missing codes
Analog-to-digital converters are susceptible to three special forms of error. These are
code jitter, non-monotonicity, and missing codes.
Code jitter occurs when, at certain points, a given input voltage converts to one of two
values when sampled repeatedly. Ideally, when the input voltage is infinitesimally
smaller than the transition voltage, the converter yields the lower code (and vice-versa).
However, even small amounts of system noise can cause the converter to be
indeterminate, between two codes, for a range of input voltages around the transition
voltage. This range is normally around ±1/2 lsb in 8-bit or 10-bit mode, or around 2 lsb in
12-bit mode, and increases with noise.
This error may be reduced by repeatedly sampling the input and averaging the result.
Additionally the techniques discussed in Noise-induced errors reduces this error.
Non-monotonicity is defined when, except for code jitter, the converter converts to a
lower code for a higher input voltage. Missing codes are those values that are never
converted for any input value.
In 8-bit or 10-bit mode, the ADC is guaranteed to be monotonic and have no missing
codes.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
495
Application information
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
496
Freescale Semiconductor, Inc.
Chapter 19
Analog comparator (ACMP)
19.1 Introduction
The analog comparator module (ACMP) provides a circuit for comparing two analog
input voltages. The comparator circuit is designed to operate across the full range of the
supply voltage (rail-to-rail operation).
The analog mux provides a circuit for selecting an analog input signal from eight
channels. One signal provided by the 6-bit DAC. The mux circuit is designed to operate
across the full range of the supply voltage. The 6-bit DAC is 64-tap resistor ladder
network which provides a selectable voltage reference for applications where voltage
reference is needed. The 64-tap resistor ladder network divides the supply reference Vin
into 64 voltage level. A 6-bit digital signal input selects output voltage level, which varies
from Vin to Vin/64. Vin can be selected from two voltage sources.
19.1.1 Features
ACMP features include:
• Operational over the whole supply range of 2.7 V to 5.5 V
• On-chip 6-bit resolution DAC with selectable reference voltage from VDD or internal
bandgap
• Configurable hysteresis
• Selectable interrupt on rising edge, falling edge, or both rising or falling edges of
comparator output
• Selectable inversion on comparator output
• Up to four selectable comparator inputs
• Operational in Stop mode
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
497
External signal description
19.1.2 Modes of operation
This section defines the ACMP operation in Wait, Stop, and Background Debug modes.
19.1.2.1 Operation in Wait mode
The ACMP continues to operate in Wait mode, if enabled. The interrupt can wake the
MCU if enabled.
19.1.2.2 Operation in Stop mode
The ACMP (including DAC and CMP) continues to operate in Stop mode if enabled. If
ACMP_CS[ACIE] is set, a ACMP interrupt can be generated to wake the MCU up from
Stop mode.
If the Stop is exited by an interrupt, the ACMP setting remains before entering the Stop
mode. If Stop is exited with a reset, the ACMP goes into its reset.
The user must turn off the DAC if the output is not used as a reference input of ACMP to
save power, because the DAC consumes additional power.
19.1.2.3 Operation in Debug mode
When the MCU is in Debug mode, the ACMP continues operating normally.
19.1.3 Block diagram
The block diagram of the ACMP module is shown in the following figure.
Figure 19-1. ACMP block diagram
19.2 External signal description
The output of ACMP can also be mapped to an external pin. When the output is mapped
to an external pin, ACMP_CS[ACOPE] controls the pin to enable/disable the ACMP
output function.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
498
Freescale Semiconductor, Inc.
Chapter 19 Analog comparator (ACMP)
19.3 Memory map and register definition
ACMP memory map
Absolute
address
(hex)
Width
Access
(in bits)
Register name
Reset value
Section/
page
2C
ACMP Control and Status Register (ACMP_CS)
8
R/W
00h
19.3.1/499
2D
ACMP Control Register 0 (ACMP_C0)
8
R/W
00h
19.3.2/500
2E
ACMP Control Register 1 (ACMP_C1)
8
R/W
00h
19.3.3/501
2F
ACMP Control Register 2 (ACMP_C2)
8
R/W
00h
19.3.4/501
1
0
19.3.1 ACMP Control and Status Register (ACMP_CS)
Address: 2Ch base + 0h offset = 2Ch
Bit
Read
Write
Reset
7
6
5
4
ACE
HYST
ACF
ACIE
0
0
0
0
3
ACO
0
2
ACOPE
0
ACMOD
0
0
ACMP_CS field descriptions
Field
7
ACE
Description
Analog Comparator Enable
Enables the ACMP module.
0
1
6
HYST
The ACMP is disabled.
The ACMP is enabled.
Analog Comparator Hysterisis Selection
Selects ACMP hysterisis.
0
1
20 mV.
30 mV.
5
ACF
ACMP Interrupt Flag Bit
4
ACIE
ACMP Interrupt Enable
Synchronously set by hardware when ACMP output has a valid edge defined by ACMOD. The setting of
this bit lags the ACMPO to bus clocks. Clear ACF bit by writing a 0 to this bit. Writing a 1 to this bit has no
effect.
Enables an ACMP CPU interrupt.
0
1
Disable the ACMP Interrupt.
Enable the ACMP Interrupt.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
499
Memory map and register definition
ACMP_CS field descriptions (continued)
Field
3
ACO
2
ACOPE
Description
ACMP Output
Reading ACO will return the current value of the analog comparator output. ACO is reset to a 0 and will
read as a 0 when the ACMP is disabled (ACE = 0)
ACMP Output Pin Enable
ACOPE enables the pad logic so that the output can be placed onto an external pin.
0
1
ACMOD
ACMP output cannot be placed onto external pin.
ACMP output can be placed onto external pin.
ACMP MOD
Determines the sensitivity modes of the interrupt trigger.
00
01
10
11
ACMP interrupt on output falling edge.
ACMP interrupt on output rising edge.
ACMP interrupt on output falling edge.
ACMP interrupt on output falling or rising edge.
19.3.2 ACMP Control Register 0 (ACMP_C0)
Address: 2Ch base + 1h offset = 2Dh
Bit
Read
Write
Reset
7
6
5
0
0
4
3
ACPSEL
0
0
2
1
0
0
0
0
ACNSEL
0
0
0
ACMP_C0 field descriptions
Field
Description
7–6
Reserved
This field is reserved.
This read-only field is reserved and always has the value 0.
5–4
ACPSEL
ACMP Positive Input Select
3–2
Reserved
This field is reserved.
This read-only field is reserved and always has the value 0.
ACNSEL
ACMP Negative Input Select
00
01
10
11
00
01
10
11
External reference 0
External reference 1
Reserved
DAC output
External reference 0
External reference 1
Reserved
DAC output
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
500
Freescale Semiconductor, Inc.
Chapter 19 Analog comparator (ACMP)
19.3.3 ACMP Control Register 1 (ACMP_C1)
Address: 2Ch base + 2h offset = 2Eh
Bit
Read
Write
Reset
7
6
DACEN
DACREF
0
0
5
4
3
2
1
0
0
0
0
DACVAL
0
0
0
ACMP_C1 field descriptions
Field
7
DACEN
Description
DAC Enable
Enables the output of 6-bit DAC.
0
1
The DAC is disabled.
The DAC is enabled.
6
DACREF
DAC Reference Select
DACVAL
DAC Output Level Selection
0
1
The DAC selects Bandgap as the reference.
The DAC selects VDDA as the reference.
Selects the output voltage using the given formula: Voutput= (Vin/64)x(DACVAL[5:0]+1) The Voutput range is
from Vin/64 to Vin, the step is Vin/64
19.3.4 ACMP Control Register 2 (ACMP_C2)
Address: 2Ch base + 3h offset = 2Fh
Bit
Read
Write
Reset
7
6
5
4
3
2
0
0
0
0
1
0
ACIPE
0
0
0
0
0
ACMP_C2 field descriptions
Field
7–3
Reserved
ACIPE
Description
This field is reserved.
This read-only field is reserved and always has the value 0.
ACMP Input Pin Enable
This 3-bit field controls if the corresponding ACMP external pin can be driven by an analog input.
0
1
The corresponding external analog input is not allowed.
The corresponding external analog input is allowed.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
501
Functional description
19.4 Functional description
The ACMP module is functionally composed of two parts: digital-to-analog (DAC) and
comparator (CMP).
The DAC includes a 64-level DAC (digital to analog converter) and relevant control
logic. DAC can select one of two reference inputs, VDD or on-chip bandgap, as the DAC
input Vin by setting ACMP_C1[DACREF]. After the DAC is enabled, it converts the data
set in ACMP_C1[DACVAL] to a stepped analog output, which is fed into ACMP as an
internal reference input. This stepped analog output is also mapped out of the module.
The output voltage range is from Vin/64 to Vin. The step size is Vin/64.
The ACMP can achieve the analog comparison between positive input and negative
input, and then give out a digital output and relevant interrupt. Both the positive and
negative input of ACMP can be selected from the four common inputs: three external
reference inputs and one internal reference input from the DAC output. The positive input
of ACMP is selected by ACMP_C0[ACPSEL] and the negative input is selected by
ACMP_C0[ACNSEL]. Any pair of the eight inputs can be compared by configuring the
ACMPC0 with the appropriate value.
After the ACMP is enabled by setting ACMP_CS[ACE], the comparison result appears
as a digital output. Whenever a valid edge defined in ACMP_CS[ACMOD] occurs,
ACMP_CS[ACF] is asserted. If ACMP_CS[ACIE] is set, a ACMP CPU interrupt occurs.
The valid edge is defined by ACMP_CS[ACMOD]. When ACMP_CS[ACMOD] = 00b
or 10b, only the falling-edge on ACMP output is valid. When ACMP_CS[ACMOD] =
01b, only rising-edge on ACMP output is valid. When ACMP_CS[ACMOD] = 11b, both
the rising-edge and falling-edge on the ACMP output are valid.
The ACMP output is synchronized by the bus clock to generate ACMP_CS[ACO] so that
the CPU can read the comparison. In stop3 mode, if the output of ACMP is changed,
ACMPO cannot be updated in time. The output can be synchronized and
ACMP_CS[ACO] can be updated upon the waking up of the CPU because of the
availability of the bus clock. ACMP_CS[ACO] changes following the comparison result,
so it can serve as a tracking flag that continuously indicates the voltage delta on the
inputs.
If a reference input external to the chip is selected as an input of ACMP, the
corresponding ACMP_C2[ACIPE] bit must be set to enable the input from pad interface.
If the output of the ACMP needs to be put onto the external pin, the ACMP_CS[ACOPE]
bit must enable the ACMP pin function of pad logic.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
502
Freescale Semiconductor, Inc.
Chapter 19 Analog comparator (ACMP)
19.5 Setup and operation of ACMP
The two parts of ACMP (DAC and CMP) can be set up and operated independently. But
if the DAC works as an input of the CMP, the DAC must be configured before the
ACMP is enabled.
Because the input-switching can cause problems on the ACMP inputs, the user should
complete the input selection before enabling the ACMP and must not change the input
selection setting when the ACMP is enabled to avoid unexpected output. Similarly,
because the DAC experiences a setup delay after ACMP_C1[DACVAL] is changed, the
user should complete the setting of ACMP_C1[DACVAL] before DAC is enabled.
19.6 Resets
During a reset the ACMP is configured in the default mode. Both CMP and DAC are
disabled.
19.7 Interrupts
If the bus clock is available when a valid edge defined in ACMP_CS[ACMOD] occurs,
the ACMP_CS[ACF] is asserted. If ACMP_CS[ACIE] is set, a ACMP interrupt event
occurs. The ACMP_CS[ACF] bit remains asserted until the ACMP interrupt is cleared by
software. When in stop3 mode, a valid edge on ACMP output generates an asynchronous
interrupt that can wake the MCU from stop3. The interrupt can be cleared by writing a 0
to the ACMP_CS[ACF] bit.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
503
Interrupts
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
504
Freescale Semiconductor, Inc.
Chapter 20
Cyclic redundancy check (CRC)
20.1 Introduction
Cyclic redundancy check (CRC) generates 16/32-bit CRC code for error detection. The
CRC can be configured to work as a standard CRC. It provides the user with
programmable polynomial, SEED and other parameters required to implement a 16-bit or
32-bit CRC standard. These parameters are detailed in further sections.
20.2 Features
Features of the CRC module are:
• Hardware 16/32-bit CRC generator
• Programmable initial seed value
• Programmable 16/32-bit polynomial
• Optional feature to reverse input and output data by bit
• Optional final complement output of result
• High-speed CRC calculation
20.3 Block diagram
The following figure is the CRC block diagram.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
505
Modes of operation
TOT
Reverse
Logic
FXOR
TOTR
NOT
Logic
Reverse
Logic
Seed
MUX
CRC_D0
CRC_D1
CRC_D2
CRC_D3
WAS
CRC Data
CRC_D0
CRC_D1
CRC_D2
CRC_D3
Checksum
CRC Engine
CRC_P0
CRC_P1
CRC_P2
CRC_P3
Data
Combine
Logic
Polynomial
16-/32-bit Select
TCRC
Figure 20-1. Cyclic redundancy check (S08CRC) block diagram
20.4 Modes of operation
This section defines the CRC operation in run, wait, and stop modes.
• Run mode - This is the basic mode of operation in which CRC is full functional.
• Wait mode - The CRC module is optional functional
• Stop3 mode - The CRC module is not functional in this low-power standby state.
CRC calculations in progress stop and will resume after the CPU goes into run mode.
20.5 Register definition
CRC memory map
Absolute
address
(hex)
Register name
Width
Access
(in bits)
Reset value
Section/
page
3060
CRC Data 0 Register (CRC_D0)
8
R/W
FFh
20.5.1/507
3061
CRC Data 1 Register (CRC_D1)
8
R/W
FFh
20.5.2/507
3062
CRC Data 2 Register (CRC_D2)
8
R/W
FFh
20.5.3/508
3063
CRC Data 3 Register (CRC_D3)
8
R/W
FFh
20.5.4/509
3064
CRC Polynomial 0 Register (CRC_P0)
8
R/W
00h
20.5.5/509
3065
CRC Polynomial 1 Register (CRC_P1)
8
R/W
00h
20.5.6/510
3066
CRC Polynomial 2 Register (CRC_P2)
8
R/W
10h
20.5.7/510
3067
CRC Polynomial 3 Register (CRC_P3)
8
R/W
21h
20.5.8/511
3068
CRC Control Register (CRC_CTRL)
8
R/W
00h
20.5.9/511
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
506
Freescale Semiconductor, Inc.
Chapter 20 Cyclic redundancy check (CRC)
20.5.1 CRC Data 0 Register (CRC_D0)
D0 is one of the CRC data registers (D0:D3). The set of CRC data registers contains the
value of seed, data, and checksum. When CRC_CTRL[WAS] bit is set, any write to the
data registers is regarded as seed for CRC module. When CRC_CTRL[WAS] bit is clear,
any write to the data registers is regarded as data for general CRC computation, in which
D0:D2 does not accept any data and D3 accept 8-bit write upon the polynomial
configuration. When final data are written, the final result can be read from the data
register. The registers of D0:D1 contain the MSB 16-bit of CRC data, which is used only
in CRC 32-bit mode. Only D3 is used to dummy data to CRC. Writing D2 will be
ignored when WAS = 0.
Address: 3060h base + 0h offset = 3060h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
1
1
1
1
DH0
1
1
1
1
CRC_D0 field descriptions
Field
DH0
Description
CRC Data Bit 31:24
20.5.2 CRC Data 1 Register (CRC_D1)
D1 is one of the CRC data registers (D0:D3). The set of CRC data registers contains the
value of seed, data, and checksum. When CRC_CTRL[WAS] bit is set, any write to the
data registers is regarded as seed for CRC module. When CRC_CTRL[WAS] bit is clear,
any write to the data registers is regarded as data for general CRC computation, in which
D0:D2 does not accept any data and D3 accept 8-bit write upon the polynomial
configuration. When final data are written, the final result can be read from the data
register. The registers of D0:D1 contain the MSB 16-bit of CRC data, which is used only
in CRC 32-bit mode. Only D3 is used to dummy data to CRC. Writing D2 will be
ignored when WAS = 0.
Address: 3060h base + 1h offset = 3061h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
1
1
1
1
D1
1
1
1
1
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
507
Register definition
CRC_D1 field descriptions
Field
D1
Description
CRC Data Bit 23:16
20.5.3 CRC Data 2 Register (CRC_D2)
D2 is one of the CRC data registers (D0:D3). The set of CRC data registers contains the
value of seed, data, and checksum. When CRC_CTRL[WAS] bit is set, any write to the
data registers is regarded as seed for CRC module. When CRC_CTRL[WAS] bit is clear,
any write to the data registers is regarded as data for general CRC computation, in which
D0:D2 does not accept any data and D3 accept 8-bit write upon the polynomial
configuration. When final data are written, the final result can be read from the data
register. The registers of D0:D1 contain the MSB 16-bit of CRC data, which is used only
in CRC 32-bit mode. Only D3 is used to dummy data to CRC. Writing D2 will be
ignored when WAS = 0.
Address: 3060h base + 2h offset = 3062h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
1
1
1
1
D2
1
1
1
1
CRC_D2 field descriptions
Field
D2
Description
CRC Data Bit 15:8
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
508
Freescale Semiconductor, Inc.
Chapter 20 Cyclic redundancy check (CRC)
20.5.4 CRC Data 3 Register (CRC_D3)
D3 is one of the CRC data registers (D0:D3). The set of CRC data registers contains the
value of seed, data, and checksum. When CRC_CTRL[WAS] bit is set, any write to the
data registers is regarded as seed for CRC module. When CRC_CTRL[WAS] bit is clear,
any write to the data registers is regarded as data for general CRC computation, in which
D0:D2 does not accept any data and D3 accept 8-bit write upon the polynomial
configuration. When final data are written, the final result can be read from the data
register. The registers of D0:D1 contain the MSB 16-bit of CRC data, which is used only
in CRC 32-bit mode. Only D3 is used to dummy data to CRC. Writing D2 will be
ignored when WAS = 0.
Address: 3060h base + 3h offset = 3063h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
1
1
1
1
D3
1
1
1
1
CRC_D3 field descriptions
Field
D3
Description
CRC Data Bit 7:0
20.5.5 CRC Polynomial 0 Register (CRC_P0)
P0 is one of the CRC polynomial registers (P0:P3). The set of CRC polynominal registers
contains the value of polynomial. The registers of P0:P1 contain the MSB 16-bit of CRC
polynomial, which is used only in CRC 32-bit mode. The registers of P2:P3 contain the
LSB 16-bit of CRC polynomial, which is used in both CRC 16- and 32-bit modes.
Address: 3060h base + 4h offset = 3064h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
P0
0
0
0
0
CRC_P0 field descriptions
Field
P0
Description
CRC Polynominal Bit 31:24
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
509
Register definition
20.5.6 CRC Polynomial 1 Register (CRC_P1)
P1 is one of the CRC polynomial registers (P0:P3). The set of CRC polynominal registers
contains the value of polynomial. The registers of P0:P1 contain the MSB 16-bit of CRC
polynomial, which is used only in CRC 32-bit mode. The registers of P2:P3 contain the
LSB 16-bit of CRC polynomial, which is used in both CRC 16- and 32-bit modes.
Address: 3060h base + 5h offset = 3065h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
P1
0
0
0
0
CRC_P1 field descriptions
Field
P1
Description
CRC Polynominal Bit 23:16
20.5.7 CRC Polynomial 2 Register (CRC_P2)
P2 is one of the CRC polynomial registers (P0:P3). The set of CRC polynominal registers
contains the value of polynomial. The registers of P0:P1 contain the MSB 16-bit of CRC
polynomial, which is used only in CRC 32-bit mode. The registers of P2:P3 contain the
LSB 16-bit of CRC polynomial, which is used in both CRC 16- and 32-bit modes.
Address: 3060h base + 6h offset = 3066h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
P2
0
0
0
1
CRC_P2 field descriptions
Field
P2
Description
CRC Polynominal Bit 15:8
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
510
Freescale Semiconductor, Inc.
Chapter 20 Cyclic redundancy check (CRC)
20.5.8 CRC Polynomial 3 Register (CRC_P3)
P3 is one of the CRC polynomial registers (P0:P3). The set of CRC polynominal registers
contains the value of polynomial. The registers of P0:P1 contain the MSB 16-bit of CRC
polynomial, which is used only in CRC 32-bit mode. The registers of P2:P3 contain the
LSB 16-bit of CRC polynomial, which is used in both CRC 16- and 32-bit modes.
Address: 3060h base + 7h offset = 3067h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
1
P3
0
0
1
0
CRC_P3 field descriptions
Field
P3
Description
CRC Polynominal Bit 7:0
20.5.9 CRC Control Register (CRC_CTRL)
Address: 3060h base + 8h offset = 3068h
Bit
Read
Write
Reset
7
6
5
TOT
0
4
3
TOTR
0
0
0
2
1
0
0
FXOR
WAS
TCRC
0
0
0
0
CRC_CTRL field descriptions
Field
7–6
TOT
Description
Reverse of Write
These bits identify the reverse of the input data.
00
01
10
11
5–4
TOTR
No reverse.
Bit is reversed in byte; No byte is reversed.
Reserved.
Reserved.
Reverse of Read
These bits identify the reverse of the output data.
00
01
10
11
No reverse.
Bit is reversed in byte; No byte is reversed.
Reserved.
Reserved.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
511
Functional description
CRC_CTRL field descriptions (continued)
Field
3
Reserved
2
FXOR
Description
This field is reserved.
This read-only field is reserved and always has the value 0.
Complement of Read
This bit allows CRC module to output the complement of the final CRC checksum.
0
1
1
WAS
Write CRC data register as seed
This bit indicates the data written to the CRC data register (D0:D3) is seed or data.
0
1
0
TCRC
Normal checksum output.
Complement of checksum output.
Data is written in data registers.
Seed is written in data registers.
Width of Polynomial Generator
This bit indicates the bit width of the polynomial generator.
0
1
16-bit CRC Polynomial Generator.
32-bit CRC Polynomial Generator.
20.6 Functional description
20.6.1 16-bit CRC calculation
The following steps show how to start a general 16-bit CRC calculation:
1. Clear CRC_CTRL[TCRC] bit to enable 16-bit CRC mode.
2. Optional to enable reverse and complement function. Please see Bit reverse and
Result complement for details.
3. Write 16-bit polynomial to CRC_P2:CRC_P3.
4. Set CRC_CTRL[WAS] bit to allow CRC_D2:CRC_D3 to be written by seed.
5. Write 16-bit seed to CRC_D2:CRC_D3.
6. Clear CRC_CTRL[WAS] bit to start 16-bit CRC calculation.
7. Dummy CRC_D3 with 8-bit CRC raw data.
8. Get the checksum from CRC_D2:CRC_D3 when all CRC raw data dummied.
20.6.2 32-bit CRC calculation
The following steps show how to start a general 32-bit CRC calculation:
1. Set CRC_CTRL[TCRC] bit to enable 32-bit CRC mode.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
512
Freescale Semiconductor, Inc.
Chapter 20 Cyclic redundancy check (CRC)
2. Optional to enable reverse and complement function. Please see Bit reverse and
Result complement for details.
3. Write 32-bit polynomial to CRC_P0:CRC_P3.
4. Set CRC_CTRL[WAS] bit to allow CRC_D0:CRC_D3 written by seed.
5. Write 32-bit seed to CRC_D0:CRC_D3.
6. Clear CRC_CTRL[WAS] bit to start 32-bit CRC calculation.
7. Dummy CRC_D3 with 8-bit CRC raw data.
8. Get the checksum from CRC_D0:CRC_D3 when all CRC raw data dummied.
20.6.3 Bit reverse
The bit reverse function allows the input and output data reversed by bit for different
CRC standard and endian systems. The CRC_CTRL[TOT] bits control the reverse of
input data and the CRC_CTRL[TOTR] bits control the reverse of output data. The
following table shows how the CRC_CTRL[TOT] and CRC_CTRL[TOTR] bits work.
Table 20-11. TOT and TOTR bit and byte reverse function
TOT ROW
D0
D1
D2
D3
00
b31b30b29b28b27b26b b23b22b21b20b19b18b b15b14b13b12b11b10b b7b6b5b4b3b2b1b0
25b24
17b16
9b8
01
b24b25b26b27b28b29b b16b17b18b19b20b21b b8b9b10b11b12b13b14 b0b1b2b3b4b5b6b7
30b31
22b23
b15
NOTE
00 is the default case that no bit is reversed.
20.6.4 Result complement
The result complement function allows to output the complement of the checksum in
CRC data registers. When CRC_CTRL[FXOR] bit is set, the checksum is read by its
complement. Otherwise, the raw checksum is accessed.
20.6.5 CCITT compliant CRC example
The following code segment shows CCITT CRC-16 compliant example.
Example: 20.6.5.1 CCITT CRC-16 compliant example
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
513
Functional description
CRC_CTRL
CRC_P2P3
CRC_D2D3
CRC_CTRL
=
=
=
=
CRC_CTRL_WAS_MASK; // 16-bit CRC, ready to dummy seed
0x1021; // Standard CCITT polynomail of (x^16 + x^12 + x^5 + 1)
0xFFFF; // Set seed by 0xFFFF
0x00;
for ( i = 0 ; i < 128 ; i++ )
{
CRC_D3 = 'A'; // Dummy 256 `A'
CRC_D3 = 'A';
}
// Get 0xea0b in CRC_D2:CRC_D3 here
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
514
Freescale Semiconductor, Inc.
Chapter 21
Watchdog (WDOG)
21.1 Introduction
The Watchdog Timer (WDOG) module is an independent timer that is available for
system use. It provides a safety feature to ensure that software is executing as planned
and that the CPU is not stuck in an infinite loop or executing unintended code. If the
WDOG module is not serviced (refreshed) within a certain period, it resets the MCU.
21.1.1 Features
Features of the WDOG module include:
• Configurable clock source inputs independent from the:
• bus clock
• Internal 32 kHz RC oscillator
• Internal 1 kHz RC oscillator
• External clock source
• Programmable timeout period
• Programmable 16-bit timeout value
• Optional fixed 256 clock prescaler when longer timeout periods are needed
• Robust write sequence for counter refresh
• Refresh sequence of writing 0xA602 and then 0xB480 within 16 bus clocks
• Window mode option for the refresh mechanism
• Programmable 16-bit window value
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
515
Introduction
• Provides robust check that program flow is faster than expected
• Early refresh attempts trigger a reset.
• Optional timeout interrupt to allow post-processing diagnostics
• Interrupt request to CPU with interrupt vector for an interrupt service routine
(ISR)
• Forced reset occurs 128 bus clocks after the interrupt vector fetch.
• Configuration bits are write-once-after-reset to ensure watchdog configuration cannot
be mistakenly altered.
• Robust write sequence for unlocking write-once configuration bits
• Unlock sequence of writing 0xC520 and then 0xD928 within 16 bus clocks for
allowing updates to write-once configuration bits
• Software must make updates within 128 bus clocks after unlocking and before
WDOG closing unlock window.
21.1.2 Block diagram
The following figure provides a block diagram of the WDOG module.
16-bit Timeout Value Register
0xA602
0xB480
Refresh Sequence
Write Control
32K CLK
MUX
1K CLK
Compare Logic
Counter
Overflow
16-bit Counter Register
Counter
Reset
MUX
BUS CLK
EXT CLK
Control
Logic
128 Bus
Clock Delay
MUX
Backup Reset
CPU Reset
256
Compare Logic
EN
UPDATE
16-bit Window Register
Window
Protect
IRQ Interrupt
128 Bus Cycle
Disable Protect
0xC520 Control Status
0xD928 Bit Write Control
CLK
PRES WIN
INT
Figure 21-1. WDOG block diagram
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
516
Freescale Semiconductor, Inc.
Chapter 21 Watchdog (WDOG)
21.2 Memory map and register definition
WDOG memory map
Absolute
address
(hex)
Width
Access
(in bits)
Register name
Reset value
Section/
page
3030
Watchdog Control and Status Register 1 (WDOG_CS1)
8
R/W
80h
21.2.1/517
3031
Watchdog Control and Status Register 2 (WDOG_CS2)
8
R/W
01h
21.2.2/519
3032
Watchdog Counter Register: High (WDOG_CNTH)
8
R
00h
21.2.3/520
3033
Watchdog Counter Register: Low (WDOG_CNTL)
8
R
00h
21.2.4/520
3034
Watchdog Timeout Value Register: High (WDOG_TOVALH)
8
R/W
00h
21.2.5/521
3035
Watchdog Timeout Value Register: Low (WDOG_TOVALL)
8
R/W
04h
21.2.6/521
3036
Watchdog Window Register: High (WDOG_WINH)
8
R/W
00h
21.2.7/522
3037
Watchdog Window Register: Low (WDOG_WINL)
8
R/W
00h
21.2.8/522
21.2.1 Watchdog Control and Status Register 1 (WDOG_CS1)
This section describes the function of Watchdog Control and Status Register 1.
NOTE
TST is cleared (0:0) on POR only. Any other reset does not
affect the value of this field.
Address: 3030h base + 0h offset = 3030h
Bit
Read
Write
Reset
7
6
5
EN
INT
UPDATE
1
0
0
4
3
TST
0
0
2
1
0
DBG
WAIT
STOP
0
0
0
WDOG_CS1 field descriptions
Field
7
EN
Description
Watchdog Enable
This write-once bit enables the watchdog counter to start counting.
0
1
6
INT
Watchdog disabled.
Watchdog enabled.
Watchdog Interrupt
This write-once bit configures the watchdog to generate an interrupt request upon a reset-triggering event
(timeout or illegal write to the watchdog), prior to forcing a reset. After the interrupt vector fetch, the reset
occurs after a delay of 128 bus clocks.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
517
Memory map and register definition
WDOG_CS1 field descriptions (continued)
Field
Description
0
1
5
UPDATE
Allow updates
This write-once bit allows software to reconfigure the watchdog without a reset.
0
1
4–3
TST
Watchdog interrupts are disabled. Watchdog resets are not delayed.
Watchdog interrupts are enabled. Watchdog resets are delayed by 128 bus clocks.
Updates not allowed. After the initial configuration, the watchdog cannot be later modified without
forcing a reset.
Updates allowed. Software can modify the watchdog configuration registers within 128 bus clocks
after performing the unlock write sequence.
Watchdog Test
Enables the fast test mode. The test mode allows software to exercise all bits of the counter to
demonstrate that the watchdog is functioning properly. See the Fast testing of the watchdog section.
This write-once field is cleared (0:0) on POR only. Any other reset does not affect the value of this field.
00
01
10
11
2
DBG
Debug Enable
This write-once bit enables the watchdog to operate when the chip is in debug mode.
0
1
1
WAIT
Watchdog disabled in chip debug mode.
Watchdog enabled in chip debug mode.
Wait Enable
This write-once bit enables the watchdog to operate when the chip is in wait mode.
0
1
0
STOP
Watchdog test mode disabled.
Watchdog user mode enabled. (Watchdog test mode disabled.) After testing the watchdog, software
should use this setting to indicate that the watchdog is functioning normally in user mode.
Watchdog test mode enabled, only the low byte is used. WDOG_CNTL is compared with
WDOG_TOVALL.
Watchdog test mode enabled, only the high byte is used. WDOG_CNTH is compared with
WDOG_TOVALH.
Watchdog disabled in chip wait mode.
Watchdog enabled in chip wait mode.
Stop Enable
This write-once bit enables the watchdog to operate when the chip is in stop mode.
0
1
Watchdog disabled in chip stop mode.
Watchdog enabled in chip stop mode.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
518
Freescale Semiconductor, Inc.
Chapter 21 Watchdog (WDOG)
21.2.2 Watchdog Control and Status Register 2 (WDOG_CS2)
This section describes the function of the watchdog control and status register 2.
Address: 3030h base + 1h offset = 3031h
Bit
Read
Write
Reset
7
WIN
6
5
FLG
0
w1c
0
0
0
4
3
2
1
0
PRES
0
0
0
CLK
0
0
1
WDOG_CS2 field descriptions
Field
7
WIN
Description
Watchdog Window
This write-once bit enables window mode. See the Window mode section.
0
1
6
FLG
Watchdog Interrupt Flag
This bit is an interrupt indicator when INT is set in control and status register 1. Write 1 to clear it.
0
1
5
Reserved
4
PRES
CLK
No interrupt occurred.
An interrupt occurred.
This field is reserved.
This read-only field is reserved and always has the value 0.
Watchdog Prescalar
This write-once bit enables a fixed 256 pre-scaling of watchdog counter reference clock. (The block
diagram shows this clock divider option.)
0
1
3–2
Reserved
Window mode disabled.
Window mode enabled.
256 prescalar disabled.
256 prescalar enabled.
This field is reserved.
This read-only field is reserved and always has the value 0.
Watchdog Clock
This write-once field indicates the clock source that feeds the watchdog counter. See the Clock source
section.
00
01
10
11
Bus clock.
1 kHz internal low-power oscillator (LPOCLK).
32 kHz internal oscillator (ICSIRCLK).
External clock source.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
519
Memory map and register definition
21.2.3 Watchdog Counter Register: High (WDOG_CNTH)
This section describes the watchdog counter registers: high (CNTH) and low (CNTL)
combined.
The watchdog counter registers CNTH and CNTL provide access to the value of the freerunning watchdog counter. Software can read the counter registers at any time.
Software cannot write directly to the watchdog counter; however, two write sequences to
these registers have special functions:
1. The refresh sequence resets the watchdog counter to 0x0000. See the Refreshing the
Watchdog section.
2. The unlock sequence allows the watchdog to be reconfigured without forcing a reset
(when WDOG_CS1[UPDATE] = 1). See the Example code: Reconfiguring the
Watchdog section.
NOTE
All other writes to these registers are illegal and force a reset.
Address: 3030h base + 2h offset = 3032h
Bit
7
6
5
4
Read
3
2
1
0
0
0
0
0
CNTHIGH
Write
Reset
0
0
0
0
WDOG_CNTH field descriptions
Field
CNTHIGH
Description
High byte of the Watchdog Counter
21.2.4 Watchdog Counter Register: Low (WDOG_CNTL)
See the description of the WDOG_CNTH register.
Address: 3030h base + 3h offset = 3033h
Bit
7
6
5
4
Read
3
2
1
0
0
0
0
0
CNTLOW
Write
Reset
0
0
0
0
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
520
Freescale Semiconductor, Inc.
Chapter 21 Watchdog (WDOG)
WDOG_CNTL field descriptions
Field
CNTLOW
Description
Low byte of the Watchdog Counter
21.2.5 Watchdog Timeout Value Register: High (WDOG_TOVALH)
This section describes the watchdog timeout value registers: high (WDOG_TOVALH)
and low (WDOG_TOVALL) combined. WDOG_TOVALH and WDOG_TOVALL
contains the 16-bit value used to set the timeout period of the watchdog.
The watchdog counter (WDOG_CNTH and WDOG_CNTL) is continuously compared
with the timeout value (WDOG_TOVALH and WDOG_TOVALL). If the counter
reaches the timeout value, the watchdog forces a reset.
NOTE
Do not write 0 to the Watchdog Timeout Value Register,
otherwise, the watchdog always generates a reset.
Address: 3030h base + 4h offset = 3034h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
TOVALHIGH
0
0
0
0
WDOG_TOVALH field descriptions
Field
TOVALHIGH
Description
High byte of the timeout value
21.2.6 Watchdog Timeout Value Register: Low (WDOG_TOVALL)
See the description of the WDOG_TOVALH register.
NOTE
All the bits reset to 0 in read.
Address: 3030h base + 5h offset = 3035h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
1
0
0
TOVALLOW
0
0
0
0
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
521
Memory map and register definition
WDOG_TOVALL field descriptions
Field
TOVALLOW
Description
Low byte of the timeout value
21.2.7 Watchdog Window Register: High (WDOG_WINH)
This section describes the watchdog window registers: high (WDOG_WINH) and low
(WDOG_WINL) combined. When window mode is enabled (WDOG_CS2[WIN] is set),
WDOG_WINH and WDOG_WINL determine the earliest time that a refresh sequence is
considered valid. See the Watchdog refresh mechanism section.
WDOG_WINH and WDOG_WINL must be less than WDOG_TOVALH and
WDOG_TOVALL.
Address: 3030h base + 6h offset = 3036h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
WINHIGH
0
0
0
0
WDOG_WINH field descriptions
Field
WINHIGH
Description
High byte of Watchdog Window
21.2.8 Watchdog Window Register: Low (WDOG_WINL)
See the description of the WDOG_WINH register.
Address: 3030h base + 7h offset = 3037h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
WINLOW
0
0
0
0
WDOG_WINL field descriptions
Field
WINLOW
Description
Low byte of Watchdog Window
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
522
Freescale Semiconductor, Inc.
Chapter 21 Watchdog (WDOG)
21.3 Functional description
The WDOG module provides a fail safe mechanism to ensure the system can be reset to a
known state of operation in case of system failure, such as the CPU clock stopping or
there being a run away condition in the software code. The watchdog counter runs
continuously off a selectable clock source and expects to be serviced (refreshed)
periodically. If it is not, it resets the system.
The timeout period, window mode, and clock source are all programmable but must be
configured within 128 bus clocks after a reset.
21.3.1 Watchdog refresh mechanism
The watchdog resets the MCU if the watchdog counter is not refreshed. A robust refresh
mechanism makes it very unlikely that the watchdog can be refreshed by runaway code.
To refresh the watchdog counter, software must execute a refresh write sequence before
the timeout period expires. In addition, if window mode is used, software must not start
the refresh sequence until after the time value set in the WDOG_WINH and
WDOG_WINL registers. See the following figure.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
523
Functional description
WDOG counter
WDOG_TOVALH and
WDOG_TOVALL
WDOG_WINH and
WDOG_WINL
Refresh opportunity
in window mode
0
Refresh opportunity (not in window mode)
Time
Figure 21-10. Refresh opportunity for the Watchdog counter
21.3.1.1 Window mode
Software finishing its main control loop faster than expected could be an indication of a
problem. Depending on the requirements of the application, the WDOG can be
programmed to force a reset when refresh attempts are early.
When Window mode is enabled, the watchdog must be refreshed after the counter has
reached a minimum expected time value; otherwise, the watchdog resets the MCU. The
minimum expected time value is specified in the WDOG_WINH:L registers. Setting
CS1[WIN] enables Window mode.
21.3.1.2 Refreshing the Watchdog
The refresh write sequence is a write of 0xA602 followed by a write of 0xB480 to the
WDOG_CNTH and WDOG_CNTL registers. The write of the 0xB480 must occur within
16 bus clocks after the write of 0xA602; otherwise, the watchdog resets the MCU.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
524
Freescale Semiconductor, Inc.
Chapter 21 Watchdog (WDOG)
Note
Before starting the refresh sequence, disable global interrupts.
Otherwise, an interrupt could effectively invalidate the refresh
sequence if writing the four bytes takes more than 16 bus
clocks. Re-enable interrupts when the sequence is finished.
21.3.1.3 Example code: Refreshing the Watchdog
The following code segment shows the refresh write sequence of the WDOG module.
/* Refresh watchdog */
for (;;) // main loop
{
...
DisableInterrupts; // disable global interrupt
WDOG_CNT = 0xA602; // write the 1st refresh word
WDOG_CNT = 0xB480; // write the 2nd refresh word to refresh counter
EnableInterrupts; // enable global interrupt
}
...
21.3.2 Configuring the Watchdog
All watchdog control bits, timeout value, and window value are write-once after reset.
This means that after a write has occurred they cannot be changed unless a reset occurs.
This provides a robust mechanism to configure the watchdog and ensure that a runaway
condition cannot mistakenly disable or modify the watchdog configuration after
configured.
This is guaranteed by the user configuring the window and timeout value first, followed
by the other control bits, and ensuring that CS1[UPDATE] is also set to 0. The new
configuration takes effect only after all registers except WDOG_CNTH:L are written
once after reset. Otherwise, the WDOG uses the reset values by default. If window mode
is not used (CS2[WIN] is 0), writing to WDOG_WINH:L is not required to make the new
configuration take effect.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
525
Functional description
21.3.2.1 Reconfiguring the Watchdog
In some cases (such as when supporting a bootloader function), users may want to
reconfigure or disable the watchdog without forcing a reset first. By setting
CS1[UPDATE] to a 1 on the initial configuration of the watchdog after a reset, users can
reconfigure the watchdog at any time by executing an unlock sequence. (Conversely, if
CS1[UPDATE] remains 0, the only way to reconfigure the watchdog is by initiating a
reset.) The unlock sequence is similar to the refresh sequence but uses different values.
21.3.2.2 Unlocking the Watchdog
The unlock sequence is a write to the WDOG_CNTH:L registers of 0xC520 followed by
0xD928 within 16 bus clocks at any time after the watchdog has been configured. On
completing the unlock sequence, the user must reconfigure the watchdog within 128 bus
clocks; otherwise, the watchdog forces a reset to the MCU.
NOTE
Due to 128 bus clocks requirement for reconfiguring the
watchdog, some delays must be inserted before executing
STOP or WAIT instructions after reconfiguring the watchdog.
This ensures that the watchdog's new configuration takes effect
before MCU enters low power mode. Otherwise, the MCU may
not be waken up from low power mode.
21.3.2.3 Example code: Reconfiguring the Watchdog
The following code segment shows an example reconfiguration of the WDOG module.
/* Initialize watchdog with ~1-kHz clock source, ~1s time-out */
DisableInterrupts; // disable global interrupt
WDOG_CNT = 0xC520; // write the 1st unlock word
WDOG_CNT = 0xD928; // write the 2nd unlock word
WDOG_TOVAL = 1000; // setting timeout value
WDOG_CS2 = WDOG_CS2_CLK_MASK; // setting 1-kHz clock source
WDOG_CS1 = WDOG_CS1_EN_MASK; // enable counter running
EnableInterrupts; // enable global interrupt
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
526
Freescale Semiconductor, Inc.
Chapter 21 Watchdog (WDOG)
21.3.3 Clock source
The watchdog counter has four clock source options selected by programming
CS2[CLK]:
• bus clock
• internal Low-Power Oscillator (LPO) running at approximately 1 kHz (This is the
default source.)
• internal 32 kHz clock
• external clock
The options allow software to select a clock source independent of the bus clock for
applications that need to meet more robust safety requirements. Using a clock source
other than the bus clock ensures that the watchdog counter continues to run if the bus
clock is somehow halted; see Backup reset.
An optional fixed prescaler for all clock sources allows for longer timeout periods. When
CS2[PRES] is set, the clock source is prescaled by 256 before clocking the watchdog
counter.
The following table summarizes the different watchdog timeout periods available.
Table 21-10. Watchdog timeout availability
Reference clock
Internal ~1 kHz (LPO)
Internal ~32 kHz
1 MHz (from bus or external)
20 MHz (from bus or external)
Prescaler
Watchdog time-out availability
Pass through
~1 ms–65.5 s1
÷256
~256 ms–16,777 s
Pass through
~31.25 µs–2.048 s
÷256
~8 ms–524.3 s
Pass through
1 µs–65.54 ms
÷256
256 µs–16.777 s
Pass through
50 ns–3.277 ms
÷256
12.8 µs–838.8 ms
1. The default timeout value after reset is approximately 4 ms.
NOTE
When the programmer switches clock sources during
reconfiguration, the watchdog hardware holds the counter at
zero for 2.5 periods of the previous clock source and 2.5
periods of the new clock source after the configuration time
period (128 bus clocks) ends. This delay ensures a smooth
transition before restarting the counter with the new
configuration.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
527
Functional description
21.3.4 Using interrupts to delay resets
When interrupts are enabled (CS1[INT] = 1), the watchdog first generates an interrupt
request upon a reset triggering event (such as a counter timeout or invalid refresh
attempt). The watchdog delays forcing a reset for 128 bus clocks to allow the interrupt
service routine (ISR) to perform tasks, such as analyzing the stack to debug code.
When interrupts are disabled (CS1[INT] = 0), the watchdog does not delay forcing a
reset.
21.3.5 Backup reset
NOTE
A clock source other than the bus clock must be used as the
reference clock for the counter; otherwise, the backup reset
function is not available.
The backup reset function is a safeguard feature that independently generates a reset in
case the main WDOG logic loses its clock (the bus clock) and can no longer monitor the
counter. If the watchdog counter overflows twice in succession (without an intervening
reset), the backup reset function takes effect and generates a reset.
21.3.6 Functionality in debug and low-power modes
By default, the watchdog is not functional in Active Background mode, Wait mode, or
Stop3 mode. However, the watchdog can remain functional in these modes as follows:
• For Active Background mode, set CS1[DBG]. (This way the watchdog is functional
in Active Background mode even when the CPU is held by the Debug module.)
• For Wait mode, set CS1[WAIT].
• For Stop3 mode, set CS1[STOP].
NOTE
The watchdog can not generate interrupt in Stop3 mode even if
CS1[STOP] is set and will not wake the MCU from Stop3
mode. It can generate reset during Stop3 mode.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
528
Freescale Semiconductor, Inc.
Chapter 21 Watchdog (WDOG)
For Active Background mode and Stop3 mode, in addition to
the above configurations, a clock source other than the bus
clock must be used as the reference clock for the counter;
otherwise, the watchdog cannot function.
21.3.7 Fast testing of the watchdog
Before executing application code in safety critical applications, users are required to test
that the watchdog works as expected and resets the MCU. Testing every bit of a 16-bit
counter by letting it run to the overflow value takes a relatively long time (64 kHz
clocks).
To help minimize the startup delay for application code after reset, the watchdog has a
feature to test the watchdog more quickly by splitting the counter into its constituent
byte-wide stages. The low and high bytes are run independently and tested for timeout
against the corresponding byte of the timeout value register. (For complete coverage
when testing the high byte of the counter, the test feature feeds the input clock via the 8th
bit of the low byte, thus ensuring that the overflow connection from the low byte to the
high byte is tested.)
Using this test feature reduces the test time to 512 clocks (not including overhead, such as
user configuration and reset vector fetches). To further speed testing, use a faster clock
(such as the bus clock) for the counter reference.
On a power-on reset, the POR bit in the system reset register is set, indicating the user
should perform the WDOG fast test.
21.3.7.1 Testing each byte of the counter
The test procedure follows these steps:
1. Program the preferred watchdog timeout value in the WDOG_TOVALH and
WDOG_TOVALL registers during the watchdog configuration time period.
2. Select a byte of the counter to test using the WDOG_CS1[TST] = 10b for the low
byte; WDOG_CS1[TST] = 11b for the high byte.
3. Wait for the watchdog to timeout. Optionally, in the idle loop, increment RAM
locations as a parallel software counter for later comparison. Because the RAM is not
affected by a watchdog reset, the timeout period of the watchdog counter can be
compared with the software counter to verify the timeout period has occurred as
expected.
4. The watchdog counter times out and forces a reset.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
529
Functional description
5. Confirm the WDOG flag in the system reset register is set, indicating that the
watchdog caused the reset. (The POR flag remains clear.)
6. Confirm that WDOG_CS1[TST] shows a test (10b or 11b) was performed.
If confirmed, the count and compare functions work for the selected byte. Repeat the
procedure, selecting the other byte in step 2.
NOTE
WDOG_CS1[TST] is cleared by a POR only and not affected
by other resets.
21.3.7.2 Entering user mode
After successfully testing the low and high bytes of the watchdog counter, the user can
configure WDOG_CS1[TST] to 01b to indicate the watchdog is ready for use in
application user mode. Thus if a reset occurs again, software can recognize the reset
trigger as a real watchdog reset caused by runaway or faulty application code.
As an ongoing test when using the default 1-kHz clock source, software can periodically
read the WDOG_CNTH and WDOG_CNTL registers to ensure the counter is being
incremented.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
530
Freescale Semiconductor, Inc.
Chapter 22
Development support
22.1 Introduction
This chapter describes the single-wire background debug mode (BDM), which uses the
on-chip background debug controller (BDC) module, and the independent on-chip realtime in-circuit emulation (ICE) system, which uses the on-chip debug (DBG) module.
22.1.1 Forcing active background
The method for forcing active background mode depends on the specific HCS08
derivative. For the 9S08xxxx, you can force active background after a power-on reset by
holding the BKGD pin low as the device exits the reset condition. You can also force
active background by driving BKGD low immediately after a serial background
command that writes a one to the BDFR bit in the SBDFR register. Other causes of reset
including an external pin reset or an internally generated error reset ignore the state of the
BKGD pin and reset into normal user mode. If no debug pod is connected to the BKGD
pin, the MCU will always reset into normal operating mode.
22.1.2 Features
Features of the BDC module include:
• Single pin for mode selection and background communications
• BDC registers are not located in the memory map
• SYNC command to determine target communications rate
• Non-intrusive commands for memory access
• Active background mode commands for CPU register access
• GO and TRACE1 commands
• BACKGROUND command can wake CPU from stop or wait modes
• One hardware address breakpoint built into BDC
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
531
Background debug controller (BDC)
• BDC clock runs in stop mode, if BDC enabled
• Watchdog disabled by default while in active background mode. It can also be
enabled by proper configuration
Features of the ICE system include:
• Two trigger comparators: Two address + read/write (R/W) or one full address + data
+ R/W
• Flexible 8-word by 16-bit FIFO (first-in, first-out) buffer for capture information:
• Change-of-flow addresses or
• Event-only data
• Two types of breakpoints:
• Tag breakpoints for instruction opcodes
• Force breakpoints for any address access
• Nine trigger modes:
• Basic: A-only, A OR B
• Sequence: A then B
• Full: A AND B data, A AND NOT B data
• Event (store data): Event-only B, A then event-only B
• Range: Inside range (A ≤ address ≤ B), outside range (address < A or address >
B)
22.2 Background debug controller (BDC)
All MCUs in the HCS08 Family contain a single-wire background debug interface that
supports in-circuit programming of on-chip nonvolatile memory and sophisticated nonintrusive debug capabilities. Unlike debug interfaces on earlier 8-bit MCUs, this system
does not interfere with normal application resources. It does not use any user memory or
locations in the memory map and does not share any on-chip peripherals.
BDC commands are divided into two groups:
• Active background mode commands require that the target MCU is in active
background mode (the user program is not running). Active background mode
commands allow the CPU registers to be read or written, and allow the user to trace
one user instruction at a time, or GO to the user program from active background
mode.
• Non-intrusive commands can be executed at any time even while the user's program
is running. Non-intrusive commands allow a user to read or write MCU memory
locations or access status and control registers within the background debug
controller.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
532
Freescale Semiconductor, Inc.
Chapter 22 Development support
Typically, a relatively simple interface pod is used to translate commands from a host
computer into commands for the custom serial interface to the single-wire background
debug system. Depending on the development tool vendor, this interface pod may use a
standard RS-232 serial port, a parallel printer port, or some other type of communications
such as a universal serial bus (USB) to communicate between the host PC and the pod.
The pod typically connects to the target system with ground, the BKGD pin, RESET, and
sometimes VDD. An open-drain connection to reset allows the host to force a target
system reset, which is useful to regain control of a lost target system or to control startup
of a target system before the on-chip nonvolatile memory has been programmed.
Sometimes VDD can be used to allow the pod to use power from the target system to
avoid the need for a separate power supply. However, if the pod is powered separately, it
can be connected to a running target system without forcing a target system reset or
otherwise disturbing the running application program.
BKGD 1
2 GND
NO CONNECT 3
4 RESET
NO CONNECT 5
6 VDD
Figure 22-1. BDM tool connector
22.2.1 BKGD pin description
BKGD is the single-wire background debug interface pin. The primary function of this
pin is for bidirectional serial communication of active background mode commands and
data. During reset, this pin is used to select between starting in active background mode
or starting the user's application program. This pin is also used to request a timed sync
response pulse to allow a host development tool to determine the correct clock frequency
for background debug serial communications.
BDC serial communications use a custom serial protocol first introduced on the
M68HC12 Family of microcontrollers. This protocol assumes the host knows the
communication clock rate that is determined by the target BDC clock rate. All
communication is initiated and controlled by the host that drives a high-to-low edge to
signal the beginning of each bit time. Commands and data are sent most significant bit
first (MSB first). For a detailed description of the communications protocol, refer to
Communication details.
If a host is attempting to communicate with a target MCU that has an unknown BDC
clock rate, a SYNC command may be sent to the target MCU to request a timed sync
response signal from which the host can determine the correct communication speed.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
533
Background debug controller (BDC)
BKGD is a pseudo-open-drain pin and there is an on-chip pullup so no external pullup
resistor is required. Unlike typical open-drain pins, the external RC time constant on this
pin, which is influenced by external capacitance, plays almost no role in signal rise time.
The custom protocol provides for brief, actively driven speedup pulses to force rapid rise
times on this pin without risking harmful drive level conflicts. Refer to Communication
details for more detail.
When no debugger pod is connected to the 6-pin BDM interface connector, the internal
pullup on BKGD chooses normal operating mode. When a debug pod is connected to
BKGD it is possible to force the MCU into active background mode after reset. The
specific conditions for forcing active background depend upon the HCS08 derivative
(refer to the introduction to this Development Support section). It is not necessary to reset
the target MCU to communicate with it through the background debug interface.
22.2.2 Communication details
The BDC serial interface requires the external controller to generate a falling edge on the
BKGD pin to indicate the start of each bit time. The external controller provides this
falling edge whether data is transmitted or received.
BKGD is a pseudo-open-drain pin that can be driven either by an external controller or
by the MCU. Data is transferred MSB first at 16 BDC clock cycles per bit (nominal
speed). The interface times out if 512 BDC clock cycles occur between falling edges
from the host. Any BDC command that was in progress when this timeout occurs is
aborted without affecting the memory or operating mode of the target MCU system.
The custom serial protocol requires the debug pod to know the target BDC
communication clock speed.
The clock switch (CLKSW) control bit in the BDC status and control register allows the
user to select the BDC clock source. The BDC clock source can either be the bus or the
alternate BDC clock source.
The BKGD pin can receive a high or low level or transmit a high or low level. The
following diagrams show timing for each of these cases. Interface timing is synchronous
to clocks in the target BDC, but asynchronous to the external host. The internal BDC
clock signal is shown for reference in counting cycles.
The following figure shows an external host transmitting a logic 1 or 0 to the BKGD pin
of a target HCS08 MCU. The host is asynchronous to the target so there is a 0-to-1 cycle
delay from the host-generated falling edge to where the target perceives the beginning of
the bit time. Ten target BDC clock cycles later, the target senses the bit level on the
BKGD pin. Typically, the host actively drives the pseudo-open-drain BKGD pin during
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
534
Freescale Semiconductor, Inc.
Chapter 22 Development support
host-to-target transmissions to speed up rising edges. Because the target does not drive
the BKGD pin during the host-to-target transmission period, there is no need to treat the
line as an open-drain signal during this period.
BDC CLO CK
(T A R G E T M C U )
HOST
T R A N S M IT 1
HOST
T R A N S M IT 0
10 CYCLES
S Y N C H R O N IZ A T IO N
U N C E R T A IN T Y
E A R L IE S T S T A R T
O F N E X T B IT
T A R G E T S E N S E S B IT L E V E L
P E R C E IV E D S T A R T
O F B IT T IM E
Figure 22-2. BDC host-to-target serial bit timing
The next figure shows the host receiving a logic 1 from the target HCS08 MCU. Because
the host is asynchronous to the target MCU, there is a 0-to-1 cycle delay from the hostgenerated falling edge on BKGD to the perceived start of the bit time in the target MCU.
The host holds the BKGD pin low long enough for the target to recognize it (at least two
target BDC cycles). The host must release the low drive before the target MCU drives a
brief active-high speedup pulse seven cycles after the perceived start of the bit time. The
host should sample the bit level about 10 cycles after it started the bit time.
BDC CLO CK
(T A R G E T M C U )
H O S T D R IV E
T O B K G D P IN
H IG H -IM P E D A N C E
TARGET M CU
SPEEDUP PULSE
H IG H -IM P E D A N C E
H IG H -IM P E D A N C E
P E R C E IV E D S T A R T
O F B IT T IM E
R -C R IS E
B K G D P IN
10 CYCLES
10 CYCLES
E A R L IE S T S T A R T
O F N E X T B IT
H O S T S A M P L E S B K G D P IN
Figure 22-3. BDC target-to-host serial bit timing (logic 1)
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
535
Background debug controller (BDC)
The following figure shows the host receiving a logic 0 from the target HCS08 MCU.
Because the host is asynchronous to the target MCU, there is a 0-to-1 cycle delay from
the host-generated falling edge on BKGD to the start of the bit time as perceived by the
target MCU. The host initiates the bit time but the target HCS08 finishes it. Because the
target wants the host to receive a logic 0, it drives the BKGD pin low for 13 BDC clock
cycles, then briefly drives it high to speed up the rising edge. The host samples the bit
level about 10 cycles after starting the bit time.
BDC CLO CK
(T A R G E T M C U )
H O S T D R IV E
T O B K G D P IN
H IG H -IM P E D A N C E
SPEEDUP
PULSE
TARGET M CU
D R IV E A N D
S P E E D -U P P U L S E
P E R C E IV E D S T A R T
O F B IT T IM E
B K G D P IN
10 CYCLES
10 CYCLES
E A R L IE S T S T A R T
O F N E X T B IT
H O S T S A M P L E S B K G D P IN
Figure 22-4. BDM target-to-host serial bit timing (logic 0)
22.2.3 BDC commands
BDC commands are sent serially from a host computer to the BKGD pin of the target
HCS08 MCU. All commands and data are sent MSB-first using a custom BDC
communications protocol. Active background mode commands require that the target
MCU is currently in the active background mode while non-intrusive commands may be
issued at any time whether the target MCU is in active background mode or running a
user application program.
The following table shows all HCS08 BDC commands, a shorthand description of their
coding structure, and the meaning of each command.
Coding Structure Nomenclature
This nomenclature is used in the following table to describe the coding structure of the
BDC commands.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
536
Freescale Semiconductor, Inc.
Chapter 22 Development support
Commands begin with an 8-bit hexadecimal command code in the host-to-target direction (most
significant bit first)
/ =separates parts of the command
d=delay 16 target BDC clock cycles
AAAA = a 16-bit address in the host-to-target direction
RD
= 8 bits of read data in the target-to-host direction
WD
= 8 bits of write data in the host-to-target direction
RD16 = 16 bits of read data in the target-to-host direction
WD16 = 16 bits of write data in the host-to-target direction
SS
= the contents of BDCSCR in the target-to-host direction (STATUS)
CC
= 8 bits of write data for BDCSCR in the host-to-target direction (CONTROL)
RBKP = 16 bits of read data in the target-to-host direction (from BDCBKPT breakpoint
register)
WBKP = 16 bits of write data in the host-to-target direction (for BDCBKPT breakpoint
register)
Table 22-1. BDC command summary
Command mnemonic
Active BDM/ non-intrusive
Coding structure
Description
SYNC
Non-intrusive
N/A1
Request a timed reference
pulse to determine target BDC
communication speed
ACK_ENABLE
Non-intrusive
D5/d
Enable acknowledge protocol.
Refer to Freescale document
order no. HCS08RMv1/D.
ACK_DISABLE
Non-intrusive
D6/d
Disable acknowledge
protocol. Refer to Freescale
document order no.
HCS08RMv1/D.
BACKGROUND
Non-intrusive
90/d
Enter active background
mode if enabled (ignore if
ENBDM bit equals 0)
READ_STATUS
Non-intrusive
E4/SS
Read BDC status from
BDCSCR
WRITE_CONTROL
Non-intrusive
C4/CC
Write BDC controls in
BDCSCR
READ_BYTE
Non-intrusive
E0/AAAA/d/RD
READ_BYTE_WS
Non-intrusive
E1/AAAA/d/SS/RD
READ_LAST
Non-intrusive
E8/SS/RD
Read a byte from target
memory
Read a byte and report status
Re-read byte from address
just read and report status
WRITE_BYTE
Non-intrusive
C0/AAAA/WD/d
Write a byte to target memory
WRITE_BYTE_WS
Non-intrusive
C1/AAAA/WD/d/SS
Write a byte and report status
READ_BKPT
Non-intrusive
E2/RBKP
Read BDCBKPT breakpoint
register
WRITE_BKPT
Non-intrusive
C2/WBKP
Write BDCBKPT breakpoint
register
GO
Active BDM
08/d
Go to execute the user
application program starting at
the address currently in the
PC
TRACE1
Active BDM
10/d
Trace 1 user instruction at the
address in the PC, then return
to active background mode
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
537
Background debug controller (BDC)
Table 22-1. BDC command summary (continued)
Command mnemonic
Active BDM/ non-intrusive
Coding structure
TAGGO
Active BDM
18/d
Description
Same as GO but enable
external tagging (HCS08
devices have no external
tagging pin)
READ_A
Active BDM
68/d/RD
Read accumulator (A)
READ_CCR
Active BDM
69/d/RD
Read condition code register
(CCR)
READ_PC
Active BDM
6B/d/RD16
Read program counter (PC)
READ_HX
Active BDM
6C/d/RD16
Read H and X register pair
(H:X)
READ_SP
Active BDM
6F/d/RD16
Read stack pointer (SP)
READ_NEXT
Active BDM
70/d/RD
Increment H:X by one then
read memory byte located at
H:X
READ_NEXT_WS
Active BDM
71/d/SS/RD
Increment H:X by one then
read memory byte located at
H:X. Report status and data.
WRITE_A
Active BDM
48/WD/d
Write accumulator (A)
WRITE_CCR
Active BDM
49/WD/d
Write condition code register
(CCR)
WRITE_PC
Active BDM
4B/WD16/d
Write program counter (PC)
WRITE_HX
Active BDM
4C/WD16/d
Write H and X register pair
(H:X)
WRITE_SP
Active BDM
4F/WD16/d
Write stack pointer (SP)
WRITE_NEXT
Active BDM
50/WD/d
Increment H:X by one, then
write memory byte located at
H:X
WRITE_NEXT_WS
Active BDM
51/WD/d/SS
Increment H:X by one, then
write memory byte located at
H:X. Also report status.
1. The SYNC command is a special operation that does not have a command code.
The SYNC command is unlike other BDC commands because the host does not
necessarily know the correct communications speed to use for BDC communications
until after it has analyzed the response to the SYNC command.
To issue a SYNC command, the host:
• Drives the BKGD pin low for at least 128 cycles of the slowest possible BDC clock
(The slowest clock is normally the reference oscillator/64 or the self-clocked rate/
64.)
• Drives BKGD high for a brief speedup pulse to get a fast rise time (This speedup
pulse is typically one cycle of the fastest clock in the system.)
• Removes all drive to the BKGD pin so it reverts to high impedance
• Monitors the BKGD pin for the sync response pulse
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
538
Freescale Semiconductor, Inc.
Chapter 22 Development support
The target, upon detecting the SYNC request from the host (which is a much longer low
time than would ever occur during normal BDC communications):
• Waits for BKGD to return to a logic high
• Delays 16 cycles to allow the host to stop driving the high speedup pulse
• Drives BKGD low for 128 BDC clock cycles
• Drives a 1-cycle high speedup pulse to force a fast rise time on BKGD
• Removes all drive to the BKGD pin so it reverts to high impedance
The host measures the low time of this 128-cycle sync response pulse and determines the
correct speed for subsequent BDC communications. Typically, the host can determine the
correct communication speed within a few percent of the actual target speed and the
communication protocol can easily tolerate speed errors of several percent.
22.2.4 BDC hardware breakpoint
The BDC includes one relatively simple hardware breakpoint that compares the CPU
address bus to a 16-bit match value in the BDCBKPT register. This breakpoint can
generate a forced breakpoint or a tagged breakpoint. A forced breakpoint causes the CPU
to enter active background mode at the first instruction boundary following any access to
the breakpoint address. The tagged breakpoint causes the instruction opcode at the
breakpoint address to be tagged so that the CPU will enter active background mode rather
than executing that instruction if and when it reaches the end of the instruction queue.
This implies that tagged breakpoints can be placed only at the address of an instruction
opcode while forced breakpoints can be set at any address.
The breakpoint enable (BKPTEN) control bit in the BDC status and control register
(BDCSCR) is used to enable the breakpoint logic (BKPTEN = 1). When BKPTEN = 0,
its default value after reset, the breakpoint logic is disabled and no BDC breakpoints are
requested regardless of the values in other BDC breakpoint registers and control bits. The
force/tag select (FTS) control bit in BDCSCR is used to select forced (FTS = 1) or tagged
(FTS = 0) type breakpoints.
The on-chip debug module (DBG) includes circuitry for two additional hardware
breakpoints that are more flexible than the simple breakpoint in the BDC module.
22.3 On-chip debug system (DBG)
Because HCS08 devices do not have external address and data buses, the most important
functions of an in-circuit emulator have been built onto the chip with the MCU. The
debug system consists of an 8-stage FIFO that can store address or data bus information,
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
539
On-chip debug system (DBG)
and a flexible trigger system to decide when to capture bus information and what
information to capture. The system relies on the single-wire background debug system to
access debug control registers and to read results out of the eight stage FIFO.
The debug module includes control and status registers that are accessible in the user's
memory map. These registers are located in the high register space to avoid using
valuable direct page memory space.
Most of the debug module's functions are used during development, and user programs
rarely access any of the control and status registers for the debug module. The one
exception is that the debug system can provide the means to implement a form of ROM
patching. This topic is discussed in greater detail in Hardware breakpoints.
22.3.1 Comparators A and B
Two 16-bit comparators (A and B) can optionally be qualified with the R/W signal and
an opcode tracking circuit. Separate control bits allow you to ignore R/W for each
comparator. The opcode tracking circuitry optionally allows you to specify that a trigger
will occur only if the opcode at the specified address is actually executed as opposed to
only being read from memory into the instruction queue. The comparators are also
capable of magnitude comparisons to support the inside range and outside range trigger
modes. Comparators are disabled temporarily during all BDC accesses.
The A comparator is always associated with the 16-bit CPU address. The B comparator
compares to the CPU address or the 8-bit CPU data bus, depending on the trigger mode
selected. Because the CPU data bus is separated into a read data bus and a write data bus,
the RWAEN and RWA control bits have an additional purpose, in full address plus data
comparisons they are used to decide which of these buses to use in the comparator B data
bus comparisons. If RWAEN = 1 (enabled) and RWA = 0 (write), the CPU's write data
bus is used. Otherwise, the CPU's read data bus is used.
The currently selected trigger mode determines what the debugger logic does when a
comparator detects a qualified match condition. A match can cause:
• Generation of a breakpoint to the CPU
• Storage of data bus values into the FIFO
• Starting to store change-of-flow addresses into the FIFO (begin type trace)
• Stopping the storage of change-of-flow addresses into the FIFO (end type trace)
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
540
Freescale Semiconductor, Inc.
Chapter 22 Development support
22.3.2 Bus capture information and FIFO operation
The usual way to use the FIFO is to setup the trigger mode and other control options, then
arm the debugger. When the FIFO has filled or the debugger has stopped storing data into
the FIFO, you would read the information out of it in the order it was stored into the
FIFO. Status bits indicate the number of words of valid information that are in the FIFO
as data is stored into it. If a trace run is manually halted by writing 0 to ARM before the
FIFO is full (CNT = 1:0:0:0), the information is shifted by one position and the host must
perform ((8 - CNT) - 1) dummy reads of the FIFO to advance it to the first significant
entry in the FIFO.
In most trigger modes, the information stored in the FIFO consists of 16-bit change-offlow addresses. In these cases, read DBGFH then DBGFL to get one coherent word of
information out of the FIFO. Reading DBGFL (the low-order byte of the FIFO data port)
causes the FIFO to shift so the next word of information is available at the FIFO data
port. In the event-only trigger modes (see Trigger modes), 8-bit data information is stored
into the FIFO. In these cases, the high-order half of the FIFO (DBGFH) is not used and
data is read out of the FIFO by simply reading DBGFL. Each time DBGFL is read, the
FIFO is shifted so the next data value is available through the FIFO data port at DBGFL.
In trigger modes where the FIFO is storing change-of-flow addresses, there is a delay
between CPU addresses and the input side of the FIFO. Because of this delay, if the
trigger event itself is a change-of-flow address or a change-of-flow address appears
during the next two bus cycles after a trigger event starts the FIFO, it will not be saved
into the FIFO. In the case of an end-trace, if the trigger event is a change-of-flow, it will
be saved as the last change-of-flow entry for that debug run.
The FIFO can also be used to generate a profile of executed instruction addresses when
the debugger is not armed. When ARM = 0, reading DBGFL causes the address of the
most-recently fetched opcode to be saved in the FIFO. To use the profiling feature, a host
debugger would read addresses out of the FIFO by reading DBGFH then DBGFL at
regular periodic intervals. The first eight values would be discarded because they
correspond to the eight DBGFL reads needed to initially fill the FIFO. Additional
periodic reads of DBGFH and DBGFL return delayed information about executed
instructions so the host debugger can develop a profile of executed instruction addresses.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
541
On-chip debug system (DBG)
22.3.3 Change-of-flow information
To minimize the amount of information stored in the FIFO, only information related to
instructions that cause a change to the normal sequential execution of instructions is
stored. With knowledge of the source and object code program stored in the target
system, an external debugger system can reconstruct the path of execution through many
instructions from the change-of-flow information stored in the FIFO.
For conditional branch instructions where the branch is taken (branch condition was
true), the source address is stored (the address of the conditional branch opcode). Because
BRA and BRN instructions are not conditional, these events do not cause change-of-flow
information to be stored in the FIFO.
Indirect JMP and JSR instructions use the current contents of the H:X index register pair
to determine the destination address, so the debug system stores the run-time destination
address for any indirect JMP or JSR. For interrupts, RTI, or RTS, the destination address
is stored in the FIFO as change-of-flow information.
22.3.4 Tag vs. force breakpoints and triggers
Tagging is a term that refers to identifying an instruction opcode as it is fetched into the
instruction queue, but not taking any other action until and unless that instruction is
actually executed by the CPU. This distinction is important because any change-of-flow
from a jump, branch, subroutine call, or interrupt causes some instructions that have been
fetched into the instruction queue to be thrown away without being executed.
A force-type breakpoint waits for the current instruction to finish and then acts upon the
breakpoint request. The usual action in response to a breakpoint is to go to active
background mode rather than continuing to the next instruction in the user application
program.
The tag vs. force terminology is used in two contexts within the debug module. The first
context refers to breakpoint requests from the debug module to the CPU. The second
refers to match signals from the comparators to the debugger control logic. When a tagtype break request is sent to the CPU, a signal is entered into the instruction queue along
with the opcode so that if/when this opcode ever executes, the CPU will effectively
replace the tagged opcode with a BGND opcode so the CPU goes to active background
mode rather than executing the tagged instruction. When the TRGSEL control bit in the
DBGT register is set to select tag-type operation, the output from comparator A or B is
qualified by a block of logic in the debug module that tracks opcodes and produces only a
trigger to the debugger if the opcode at the compare address is actually executed. There is
separate opcode tracking logic for each comparator so more than one compare event can
be tracked through the instruction queue at a time.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
542
Freescale Semiconductor, Inc.
Chapter 22 Development support
22.3.5 Trigger modes
The trigger mode controls the overall behavior of a debug run. The 4-bit TRG field in the
DBGT register selects one of nine trigger modes. When TRGSEL = 1 in the DBGT
register, the output of the comparator must propagate through an opcode tracking circuit
before triggering FIFO actions. The BEGIN bit in DBGT chooses whether the FIFO
begins storing data when the qualified trigger is detected (begin trace), or the FIFO stores
data in a circular fashion from the time it is armed until the qualified trigger is detected
(end trigger).
A debug run is started by writing a 1 to the ARM bit in the DBGC register, which sets the
ARMF flag and clears the AF and BF flags and the CNT bits in DBGS. A begin-trace
debug run ends when the FIFO gets full. An end-trace run ends when the selected trigger
event occurs. Any debug run can be stopped manually by writing a 0 to ARM or DBGEN
in DBGC.
In all trigger modes except event-only modes, the FIFO stores change-of-flow addresses.
In event-only trigger modes, the FIFO stores data in the low-order eight bits of the FIFO.
The BEGIN control bit is ignored in event-only trigger modes and all such debug runs are
begin type traces. When TRGSEL = 1 to select opcode fetch triggers, it is not necessary
to use R/W in comparisons because opcode tags would apply only to opcode fetches that
are always read cycles. It would also be unusual to specify TRGSEL = 1 while using a
full mode trigger because the opcode value is normally known at a particular address.
The following trigger mode descriptions state only the primary comparator conditions
that lead to a trigger. Either comparator can usually be further qualified with R/W by
setting RWAEN (RWBEN) and the corresponding RWA (RWB) value to be matched
against R/W. The signal from the comparator with optional R/W qualification is used to
request a CPU breakpoint if BRKEN = 1 and TAG determines whether the CPU request
will be a tag request or a force request.
A-Only ̶ Trigger when the address matches the value in comparator A
A OR B ̶ Trigger when the address matches either the value in comparator A or the value
in comparator B
A Then B ̶ Trigger when the address matches the value in comparator B but only after
the address for another cycle matched the value in comparator A. There can be any
number of cycles after the A match and before the B match.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
543
On-chip debug system (DBG)
A AND B Data (Full Mode) ̶ This is called a full mode because address, data, and R/W
(optionally) must match within the same bus cycle to cause a trigger event. Comparator A
checks address, the low byte of comparator B checks data, and R/W is checked against
RWA if RWAEN = 1. The high-order half of comparator B is not used.
In full trigger modes it is not useful to specify a tag-type CPU breakpoint (BRKEN =
TAG = 1), but if you do, the comparator B data match is ignored for the purpose of
issuing the tag request to the CPU and the CPU breakpoint is issued when the comparator
A address matches.
A AND NOT B Data (Full Mode) ̶ Address must match comparator A, data must not
match the low half of comparator B, and R/W must match RWA if RWAEN = 1. All
three conditions must be met within the same bus cycle to cause a trigger.
In full trigger modes it is not useful to specify a tag-type CPU breakpoint (BRKEN =
TAG = 1), but if you do, the comparator B data match is ignored for the purpose of
issuing the tag request to the CPU and the CPU breakpoint is issued when the comparator
A address matches.
Event-Only B (Store Data) ̶ Trigger events occur each time the address matches the
value in comparator B. Trigger events cause the data to be captured into the FIFO. The
debug run ends when the FIFO becomes full.
A Then Event-Only B (Store Data) ̶ After the address has matched the value in
comparator A, a trigger event occurs each time the address matches the value in
comparator B. Trigger events cause the data to be captured into the FIFO. The debug run
ends when the FIFO becomes full.
Inside Range (A ≤ Address ≤ B) ̶ A trigger occurs when the address is greater than or
equal to the value in comparator A and less than or equal to the value in comparator B at
the same time.
Outside Range (Address < A or Address > B) ̶ A trigger occurs when the address is
either less than the value in comparator A or greater than the value in comparator B.
22.3.6 Hardware breakpoints
The BRKEN control bit in the DBGC register may be set to 1 to allow any of the trigger
conditions described in Trigger modes to be used to generate a hardware breakpoint
request to the CPU. TAG in DBGC controls whether the breakpoint request will be
treated as a tag-type breakpoint or a force-type breakpoint. A tag breakpoint causes the
current opcode to be marked as it enters the instruction queue. If a tagged opcode reaches
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
544
Freescale Semiconductor, Inc.
Chapter 22 Development support
the end of the pipe, the CPU executes a BGND instruction to go to active background
mode rather than executing the tagged opcode. A force-type breakpoint causes the CPU
to finish the current instruction and then go to active background mode.
If the background mode has not been enabled (ENBDM = 1) by a serial
WRITE_CONTROL command through the BKGD pin, the CPU will execute an SWI
instruction instead of going to active background mode.
22.4 Memory map and register description
This section contains the descriptions of the BDCand DBG registers and control bits.
Refer to the high-page register summary in the device overview chapter of this data sheet
for the absolute address assignments for all DBG registers. This section refers to registers
and control bits only by their names. A Freescale-provided equate or header file is used to
translate these names into the appropriate absolute addresses.
BDC memory map
Absolute
address
(hex)
Register name
Width
Access
(in bits)
Reset value
Section/
page
0
BDC Status and Control Register (BDC_SCR)
8
R/W
00h
22.4.1/545
1
BDC Breakpoint Match Register: High (BDC_BKPTH)
8
R/W
00h
22.4.2/547
2
BDC Breakpoint Register: Low (BDC_BKPTL)
8
R/W
00h
22.4.3/548
3
System Background Debug Force Reset Register
(BDC_SBDFR)
8
W
(always
reads 0)
00h
22.4.4/548
22.4.1 BDC Status and Control Register (BDC_SCR)
This register can be read or written by serial BDC commands (READ_STATUS and
WRITE_CONTROL) but is not accessible to user programs because it is not located in
the normal memory map of the MCU.
NOTE
The reset values shown in the register figure are those in the
normal reset conditions. If the MCU is reset in BDM, ENBDM,
BDMACT, CLKSW will be reset to 1 and others all be to 0.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
545
Memory map and register description
Address: 0h base + 0h offset = 0h
Bit
Read
Write
Reset
7
6
ENBDM
0
5
BDMACT
4
3
BKPTEN
FTS
CLKSW
0
0
0
0
2
1
0
WS
WSF
DVF
0
0
0
BDC_SCR field descriptions
Field
7
ENBDM
Description
Enable BDM (Permit Active Background Mode)
Typically, this bit is written to 1 by the debug host shortly after the beginning of a debug session or
whenever the debug host resets the target and remains 1 until a normal reset clears it.
0
1
6
BDMACT
Background Mode Active Status
This is a read-only status bit.
0
1
5
BKPTEN
If this bit is clear, the BDC breakpoint is disabled and the FTS (force tag select) control bit and BDCBKPT
match register are ignored.
When FTS = 1, a breakpoint is requested whenever the CPU address bus matches the BDCBKPT match
register. When FTS = 0, a match between the CPU address bus and the BDCBKPT register causes the
fetched opcode to be tagged. If this tagged opcode ever reaches the end of the instruction queue, the
CPU enters active background mode rather than executing the tagged opcode.
1
Tag opcode at breakpoint address and enter active background mode if CPU attempts to execute that
instruction
Breakpoint match forces active background mode at next instruction boundary (address need not be
an opcode)
Select Source for BDC Communications Clock
CLKSW defaults to 0, which selects the alternate BDC clock source.
0
1
2
WS
BDC breakpoint disabled.
BDC breakpoint enabled.
Force/Tag Select
0
3
CLKSW
BDM not active (user application program running).
BDM active and waiting for serial commands.
BDC Breakpoint Enable
0
1
4
FTS
BDM cannot be made active (non-intrusive commands still allowed).
BDM can be made active to allow active background mode commands.
Alternate BDC clock source.
MCU bus clock.
Wait or Stop Status
When the target CPU is in wait or stop mode, most BDC commands cannot function. However, the
BACKGROUND command can be used to force the target CPU out of wait or stop and into active
background mode where all BDC commands work. Whenever the host forces the target MCU into active
background mode, the host should issue a READ_STATUS command to check that BDMACT = 1 before
attempting other BDC commands.
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
546
Freescale Semiconductor, Inc.
Chapter 22 Development support
BDC_SCR field descriptions (continued)
Field
Description
0
1
1
WSF
Wait or Stop Failure Status
This status bit is set if a memory access command failed due to the target CPU executing a wait or stop
instruction at or about the same time. The usual recovery strategy is to issue a BACKGROUND command
to get out of wait or stop mode into active background mode, repeat the command that failed, then return
to the user program. (Typically, the host would restore CPU registers and stack values and re-execute the
wait or stop instruction.)
0
1
0
DVF
Target CPU is running user application code or in active background mode (was not in wait or stop
mode when background became active).
Target CPU is in wait or stop mode, or a BACKGROUND command was used to change from wait or
stop to active background mode.
Memory access did not conflict with a wait or stop instruction.
Memory access command failed because the CPU entered wait or stop mode.
Data Valid Failure Status
0
1
Memory access did not conflict with a slow memory access
Memory access command failed because CPU was not finished with a slow memory access.
22.4.2 BDC Breakpoint Match Register: High (BDC_BKPTH)
This register, together with BDC_BKPTL, holds the address for the hardware breakpoint
in the BDC. The BKPTEN and FTS control bits in BDCSCR are used to enable and
configure the breakpoint logic. Dedicated serial BDC commands (READ_BKPT and
WRITE_BKPT) are used to read and write the BDCBKPT register but is not accessible to
user programs because it is not located in the normal memory map of the MCU.
Breakpoints are normally set while the target MCU is in active background mode before
running the user application program.
Address: 0h base + 1h offset = 1h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
A[15:8]
0
0
0
0
BDC_BKPTH field descriptions
Field
A[15:8]
Description
High 8-bit of hardware breakpoint address.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
547
Memory map and register description
22.4.3 BDC Breakpoint Register: Low (BDC_BKPTL)
BDC_BKPTH and BDC_BKPTL registers hold the address for the hardware breakpoint
in the BDC. The BDC_SCR[FTS] and BDC_SCR[BKPTEN] bits are used to enable and
configure the breakpoint logic. Dedicated serial BDC commands (READ_BKPT and
WRITE_BKPT) are used to read and write the BDC_BKPTH and BDC_BKPTL register.
Breakpoints are normally set while the target MCU is in background debug mode before
running the user application program. However, since READ_BKPT and WRITE_BKPT
are foreground commands, they could be executed even while the user program is
running.
Address: 0h base + 2h offset = 2h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
A[7:0]
0
0
0
0
BDC_BKPTL field descriptions
Field
A[7:0]
Description
Low 8-bit of hardware breakpoint address.
22.4.4 System Background Debug Force Reset Register
(BDC_SBDFR)
This register contains a single write-only control bit. A serial background mode
command such as WRITE_BYTE must be used to write to SBDFR. Attempts to write
this register from a user program are ignored. Reads always return 0x00.
Address: 0h base + 3h offset = 3h
Bit
7
6
5
Read
4
3
2
1
0
0
Write
Reset
0
BDFR
0
0
0
0
0
0
0
0
BDC_SBDFR field descriptions
Field
7–1
Reserved
0
BDFR
Description
This field is reserved.
This read-only field is reserved and always has the value 0.
Background Debug Force Reset
Table continues on the next page...
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
548
Freescale Semiconductor, Inc.
Chapter 22 Development support
BDC_SBDFR field descriptions (continued)
Field
Description
A serial active background mode command such as WRITE_BYTE allows an external debug host to force
a target system reset. Writing 1 to this bit forces an MCU reset. This bit cannot be written from a user
program.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
549
Memory map and register description
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
550
Freescale Semiconductor, Inc.
Chapter 23
Debug module (DBG)
23.1 Introduction
The DBG module implements an on-chip ICE (in-circuit emulation) system and allows
non-intrusive debug of application software by providing an on-chip trace buffer with
flexible triggering capability. The trigger also can provide extended breakpoint capacity.
The on-chip ICE system is optimized for the S08CPUV6 8-bit architecture and supports 2
M bytes of memory space.
23.1.1 Features
The on-chip ICE system includes these distinctive features:
• Three comparators (A, B, and C) with ability to match addresses in 64 KB space
• Dual mode, Comparators A and B used to compare addresses
• Full mode, Comparator A compares address and Comparator B compares data
• Can be used as triggers and/or breakpoints
• Comparator C can be used as a normal hardware breakpoint
• Loop1 capture mode, Comparator C is used to track most recent COF event
captured into FIFO
• Tag and Force type breakpoints
• Nine trigger modes
• A
• A Or B
• A then B
• A and B, where B is data (full mode)
• A and not B, where B is data (full mode)
• Event only B, store data
• A then event only B, store data
• Inside range, A ≤ address ≤ B
• Outside range, address < A or address > B
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
551
Introduction
• FIFO for storing change of flow information and event only data
• Source address of conditional branches taken
• Destination address of indirect JMP and JSR instruction
• Destination address of interrupts, RTI, RTC, and RTS instruction
• Data associated with Event B trigger modes
• Ability to End-trace until reset and begin-trace from reset
23.1.2 Modes of operation
The on-chip ICE system can be enabled in all MCU functional modes. The DBG module
is disabled if the MCU is secure. The DBG module comparators are disabled when
executing a Background Debug Mode (BDM) command.
23.1.3 Block diagram
The following figure shows the structure of the DBG module.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
552
Freescale Semiconductor, Inc.
Chapter 23 Debug module (DBG)
DBG Read Data Bus
FIFO Data
Address Bus[16:0]
c
o
n
t
r
o
l
Write Data Bus
Read Data Bus
Read/Write
DBG Module Enable
mmu_ppage_access1
Address/Data/Control Registers
Trigger
Break
Control
Logic
match_A
Comparator A
match_B
Comparator B
Tag
Force
match_C
Comparator C
core_cof[1:0]
control
Change of Flow Indicators
MCU in BDM
MCU reset
event only
store
Read DBGFL
Read DBGFH
Read DBGFX
Instr. Lastcycle
Bus Clk
register
m
u
x
subtract 2
Write Data Bus
ppage_sel1
m
u
x
8 deep
FIFO
addr[16:0]1
m
u
x
FIFO Data
m
u
x
Read Data Bus
Read/Write
Figure 23-1. DBG block diagram
23.2 Signal description
The DBG module contains no external signals.
23.3 Memory map and registers
This section provides a detailed description of all DBG registers accessible to the end
user.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
553
Memory map and registers
DBG memory map
Absolute
address
(hex)
Width
Access
(in bits)
Register name
Reset value
Section/
page
3010
Debug Comparator A High Register (DBG_CAH)
8
R/W
FFh
23.3.1/554
3011
Debug Comparator A Low Register (DBG_CAL)
8
R/W
FEh
23.3.2/555
3012
Debug Comparator B High Register (DBG_CBH)
8
R/W
00h
23.3.3/556
3013
Debug Comparator B Low Register (DBG_CBL)
8
R/W
00h
23.3.4/556
3014
Debug Comparator C High Register (DBG_CCH)
8
R/W
00h
23.3.5/557
3015
Debug Comparator C Low Register (DBG_CCL)
8
R/W
00h
23.3.6/558
3016
Debug FIFO High Register (DBG_FH)
8
R
00h
23.3.7/558
3017
Debug FIFO Low Register (DBG_FL)
8
R
00h
23.3.8/559
3018
Debug Comparator A Extension Register (DBG_CAX)
8
R/W
00h
23.3.9/560
3019
Debug Comparator B Extension Register (DBG_CBX)
8
R/W
00h
23.3.10/
561
301A
Debug Comparator C Extension Register (DBG_CCX)
8
R/W
00h
23.3.11/
562
301B
Debug FIFO Extended Information Register (DBG_FX)
8
R
00h
23.3.12/
563
301C
Debug Control Register (DBG_C)
8
R/W
C0h
23.3.13/
563
301D
Debug Trigger Register (DBG_T)
8
R/W
40h
23.3.14/
564
301E
Debug Status Register (DBG_S)
8
R
01h
23.3.15/
566
301F
Debug Count Status Register (DBG_CNT)
8
R
00h
23.3.16/
567
23.3.1 Debug Comparator A High Register (DBG_CAH)
NOTE
All the bits in this register reset to 1 in POR or non-end-run
reset. The bits are undefined in end-run reset. In the case of an
end-trace to reset where DBGEN = 1 and BEGIN = 0, the bits
in this register do not change after reset.
Address: 3010h base + 0h offset = 3010h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
1
1
1
1
CA[15:8]
1
1
1
1
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
554
Freescale Semiconductor, Inc.
Chapter 23 Debug module (DBG)
DBG_CAH field descriptions
Field
CA[15:8]
Description
Comparator A High Compare Bits
The Comparator A High compare bits control whether Comparator A will compare the address bus bits
[15:8] to a logic 1 or logic 0.
0
1
Compare corresponding address bit to a logic 0.
Compare corresponding address bit to a logic 1.
23.3.2 Debug Comparator A Low Register (DBG_CAL)
NOTE
All the bits in this register reset to 1 in POR or non-end-run
reset. The bits are undefined in end-run reset. In the case of an
end-trace to reset where DBGEN = 1 and BEGIN = 0, the bits
in this register do not change after reset.
Address: 3010h base + 1h offset = 3011h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
1
1
1
0
CA[7:0]
1
1
1
1
DBG_CAL field descriptions
Field
CA[7:0]
Description
Comparator A Low
The Comparator A Low compare bits control whether Comparator A will compare the address bus bits
[7:0] to a logic 1 or logic 0.
0
1
Compare corresponding address bit to a logic 0.
Compare corresponding address bit to a logic 1.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
555
Memory map and registers
23.3.3 Debug Comparator B High Register (DBG_CBH)
NOTE
All the bits in this register reset to 0 in POR or non-end-run
reset. The bits are undefined in end-run reset. In the case of an
end-trace to reset where DBGEN = 1 and BEGIN = 0, the bits
in this register do not change after reset.
Address: 3010h base + 2h offset = 3012h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
CB[15:8]
0
0
0
0
DBG_CBH field descriptions
Field
CB[15:8]
Description
Comparator B High Compare Bits
The Comparator B High compare bits control whether Comparator B will compare the address bus bits
[15:8] to a logic 1 or logic 0.Not used in full mode.
0
1
Compare corresponding address bit to a logic 0.
Compare corresponding address bit to a logic 1.
23.3.4 Debug Comparator B Low Register (DBG_CBL)
NOTE
All the bits in this register reset to 0 in POR or non-end-run
reset. The bits are undefined in end-run reset. In the case of an
end-trace to reset where DBGEN = 1 and BEGIN = 0, the bits
in this register do not change after reset.
Address: 3010h base + 3h offset = 3013h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
CB[7:0]
0
0
0
0
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
556
Freescale Semiconductor, Inc.
Chapter 23 Debug module (DBG)
DBG_CBL field descriptions
Field
CB[7:0]
Description
Comparator B Low
The Comparator B Low compare bits control whether Comparator B will compare the address bus bits
[7:0] to a logic 1 or logic 0.
0
1
Compare corresponding address bit to a logic 0.
Compare corresponding address bit to a logic 1.
23.3.5 Debug Comparator C High Register (DBG_CCH)
NOTE
All the bits in this register reset to 0 in POR or non-end-run
reset. The bits are undefined in end-run reset. In the case of an
end-trace to reset where DBGEN = 1 and BEGIN = 0, the bits
in this register do not change after reset.
Address: 3010h base + 4h offset = 3014h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
CC[15:8]
0
0
0
0
DBG_CCH field descriptions
Field
CC[15:8]
Description
Comparator C High Compare Bits
The Comparator C High compare bits control whether Comparator C will compare the address bus bits
[15:8] to a logic 1 or logic 0.
0
1
Compare corresponding address bit to a logic 0.
Compare corresponding address bit to a logic 1.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
557
Memory map and registers
23.3.6 Debug Comparator C Low Register (DBG_CCL)
NOTE
All the bits in this register reset to 0 in POR or non-end-run
reset. The bits are undefined in end-run reset. In the case of an
end-trace to reset where DBGEN = 1 and BEGIN = 0, the bits
in this register do not change after reset.
Address: 3010h base + 5h offset = 3015h
Bit
Read
Write
Reset
7
6
5
4
3
2
1
0
0
0
0
0
CC[7:0]
0
0
0
0
DBG_CCL field descriptions
Field
CC[7:0]
Description
Comparator C Low
The Comparator C Low compare bits control whether Comparator C will compare the address bus bits
[7:0] to a logic 1 or logic 0.
0
1
Compare corresponding address bit to a logic 0.
Compare corresponding address bit to a logic 1.
23.3.7 Debug FIFO High Register (DBG_FH)
NOTE
All the bits in this register reset to 0 in POR or non-end-run
reset. The bits are undefined in end-run reset. In the case of an
end-trace to reset where DBGEN = 1 and BEGIN = 0, the bits
in this register do not change after reset.
Address: 3010h base + 6h offset = 3016h
Bit
7
6
5
4
Read
3
2
1
0
0
0
0
0
F[15:8]
Write
Reset
0
0
0
0
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
558
Freescale Semiconductor, Inc.
Chapter 23 Debug module (DBG)
DBG_FH field descriptions
Field
F[15:8]
Description
FIFO High Data Bits
The FIFO High data bits provide access to bits [15:8] of data in the FIFO. This register is not used in event
only modes and will read a $00 for valid FIFO words.
23.3.8 Debug FIFO Low Register (DBG_FL)
NOTE
All the bits in this register reset to 0 in POR or non-end-run
reset. The bits are undefined in end-run reset. In the case of an
end-trace to reset where DBGEN = 1 and BEGIN = 0, the bits
in this register do not change after reset.
Address: 3010h base + 7h offset = 3017h
Bit
7
6
5
4
Read
3
2
1
0
0
0
0
0
F[7:0]
Write
Reset
0
0
0
0
DBG_FL field descriptions
Field
F[7:0]
Description
FIFO Low Data Bits
The FIFO Low data bits contain the least significant byte of data in the FIFO. When reading FIFO words,
read DBGFX and DBGFH before reading DBGFL because reading DBGFL causes the FIFO pointers to
advance to the next FIFO location. In event-only modes, there is no useful information in DBGFX and
DBGFH so it is not necessary to read them before reading DBGFL.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
559
Memory map and registers
23.3.9 Debug Comparator A Extension Register (DBG_CAX)
NOTE
All the bits in this register reset to 0 in POR or non-end-run
reset. The bits are undefined in end-run reset. In the case of an
end-trace to reset where DBGEN = 1 and BEGIN = 0, the bits
in this register do not change after reset.
Address: 3010h base + 8h offset = 3018h
Bit
Read
Write
Reset
7
6
RWAEN
RWA
0
0
5
4
3
2
1
0
0
0
0
0
0
0
0
DBG_CAX field descriptions
Field
7
RWAEN
Description
Read/Write Comparator A Enable Bit
The RWAEN bit controls whether read or write comparison is enabled for Comparator A.
0
1
6
RWA
Read/Write Comparator A Value Bit
The RWA bit controls whether read or write is used in compare for Comparator A. The RWA bit is not used
if RWAEN = 0.
0
1
Reserved
Read/Write is not used in comparison.
Read/Write is used in comparison.
Write cycle will be matched.
Read cycle will be matched.
This field is reserved.
This read-only field is reserved and always has the value 0.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
560
Freescale Semiconductor, Inc.
Chapter 23 Debug module (DBG)
23.3.10 Debug Comparator B Extension Register (DBG_CBX)
NOTE
All the bits in this register reset to 0 in POR or non-end-run
reset. The bits are undefined in end-run reset. In the case of an
end-trace to reset where DBGEN = 1 and BEGIN = 0, the bits
in this register do not change after reset.
Address: 3010h base + 9h offset = 3019h
Bit
Read
Write
Reset
7
6
RWBEN
RWB
0
0
5
4
3
2
1
0
0
0
0
0
0
0
0
DBG_CBX field descriptions
Field
7
RWBEN
Description
Read/Write Comparator B Enable Bit
The RWBEN bit controls whether read or write comparison is enabled for Comparator B. In full modes,
RWAEN and RWA are used to control comparison of R/W and RWBEN is ignored.
0
1
6
RWB
Read/Write Comparator B Value Bit
The RWB bit controls whether read or write is used in compare for Comparator B. The RWB bit is not used
if RWBEN = 0.In full modes, RWAEN and RWA are used to control comparison of R/W and RWB is
ignored.
0
1
Reserved
Read/Write is not used in comparison.
Read/Write is used in comparison.
Write cycle will be matched.
Read cycle will be matched.
This field is reserved.
This read-only field is reserved and always has the value 0.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
561
Memory map and registers
23.3.11 Debug Comparator C Extension Register (DBG_CCX)
NOTE
All the bits in this register reset to 0 in POR or non-end-run
reset. The bits are undefined in end-run reset. In the case of an
end-trace to reset where DBGEN = 1 and BEGIN = 0, the bits
in this register do not change after reset.
Address: 3010h base + Ah offset = 301Ah
Bit
Read
Write
Reset
7
6
RWCEN
RWC
0
0
5
4
3
2
1
0
0
0
0
0
0
0
0
DBG_CCX field descriptions
Field
7
RWCEN
Description
Read/Write Comparator C Enable Bit
The RWCEN bit controls whether read or write comparison is enabled for Comparator C.
0
1
6
RWC
Read/Write Comparator C Value Bit
The RWC bit controls whether read or write is used in compare for Comparator C. The RWC bit is not
used if RWCEN = 0.
0
1
Reserved
Read/Write is not used in comparison.
Read/Write is used in comparison.
Write cycle will be matched.
Read cycle will be matched.
This field is reserved.
This read-only field is reserved and always has the value 0.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
562
Freescale Semiconductor, Inc.
Chapter 23 Debug module (DBG)
23.3.12 Debug FIFO Extended Information Register (DBG_FX)
NOTE
All the bits in this register reset to 0 in POR or non-end-run
reset. The bits are undefined in end-run reset. In the case of an
end-trace to reset where DBGEN = 1 and BEGIN = 0, the bits
in this register do not change after reset.
Address: 3010h base + Bh offset = 301Bh
Bit
Read
7
6
5
4
3
PPACC
2
1
0
0
Bit16
Write
Reset
0
0
0
0
0
0
0
0
DBG_FX field descriptions
Field
7
PPACC
Description
PPAGE Access Indicator Bit
This bit indicates whether the captured information in the current FIFO word is associated with an
extended access through the PPAGE mechanism or not. This is indicated by the internal signal
mmu_ppage_sel which is 1 when the access is through the PPAGE mechanism.
0
1
6–1
Reserved
0
Bit16
The information in the corresponding FIFO word is event-only data or an unpaged 17-bit CPU address
with bit-16 = 0.
The information in the corresponding FIFO word is a 17-bit flash address with PPAGE[2:0] in the three
most significant bits and CPU address[13:0] in the 14 least significant bits.
This field is reserved.
This read-only field is reserved and always has the value 0.
Extended Address Bit 16
This bit is the most significant bit of the 17-bit core address.
23.3.13 Debug Control Register (DBG_C)
Address: 3010h base + Ch offset = 301Ch
Bit
Read
Write
Reset
7
6
5
4
DBGEN
ARM
TAG
BRKEN
1
1
0
0
3
2
1
0
0
0
0
LOOP1
0
0
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
563
Memory map and registers
DBG_C field descriptions
Field
7
DBGEN
Description
DBG Module Enable Bit
The DBGEN bit enables the DBG module. The DBGEN bit is forced to zero and cannot be set if the MCU
is secure.
0
1
6
ARM
Arm Bit
The ARM bit controls whether the debugger is comparing and storing data in FIFO.
0
1
5
TAG
The TAG bit controls whether a debugger or comparator C breakpoint will be requested as a tag or force
breakpoint to the CPU. The TAG bit is not used if BRKEN = 0.
0
LOOP1
Force request selected.
Tag request selected.
Break Enable Bit
The BRKEN bit controls whether the debugger will request a breakpoint to the CPU at the end of a trace
run, and whether comparator C will request a breakpoint to the CPU.
0
1
3–1
Reserved
Debugger not armed.
Debugger armed.
Tag or Force Bit
0
1
4
BRKEN
DBG not enabled.
DBG enabled.
CPU break request not enabled.
CPU break request enabled.
This field is reserved.
This read-only field is reserved and always has the value 0.
Select LOOP1 Capture Mode
This bit selects either normal capture mode or LOOP1 capture mode. LOOP1 is not used in event-only
modes.
0
1
Normal operation - capture COF events into the capture buffer FIFO.
LOOP1 capture mode enabled. When the conditions are met to store a COF value into the FIFO,
compare the current COF address with the address in comparator C. If these addresses match,
override the FIFO capture and do not increment the FIFO count. If the address does not match
comparator C, capture the COF address, including the PPACC indicator, into the FIFO and into
comparator C..
23.3.14 Debug Trigger Register (DBG_T)
NOTE
The figure shows the values in POR or non-end-run reset. All
the bits are undefined in end-run reset. In the case of an endtrace to reset where DBGEN=1 and BEGIN=0, the ARM and
BRKEN bits are cleared but the remaining control bits in this
register do not change after reset.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
564
Freescale Semiconductor, Inc.
Chapter 23 Debug module (DBG)
NOTE
The DBG trigger register (DBGT) can not be changed unless
ARM=0.
Address: 3010h base + Dh offset = 301Dh
Bit
Read
Write
Reset
7
6
TRGSEL
BEGIN
0
1
5
4
3
2
0
0
1
0
0
0
TRG
0
0
0
DBG_T field descriptions
Field
7
TRGSEL
Description
Trigger Selection Bit
The TRGSEL bit controls the triggering condition for the comparators.
0
1
6
BEGIN
Begin/End Trigger Bit
The BEGIN bit controls whether the trigger begins or ends storing of data in FIFO.
0
1
5–4
Reserved
TRG
Trigger on any compare address access.
Trigger if opcode at compare address is execute.
Trigger at end of stored data.
Trigger before storing data.
This field is reserved.
This read-only field is reserved and always has the value 0.
Trigger Mode Bits
The TRG bits select the trigger mode of the DBG module.
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001-1111
A only.
A or B.
A then B.
Event only B.
A then event only B.
A and B (full mode).
A and not B (full mode).
Inside range.
Outside range.
No trigger.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
565
Memory map and registers
23.3.15 Debug Status Register (DBG_S)
NOTE
The figure shows the values in POR or non-end-run reset. The
bits of AF, BF and CF are undefined and ARMF is reset to 0 in
end-run reset. In the case of an end-trace to reset where
DBGEN=1 and BEGIN=0, ARMF gets cleared by reset but AF,
BF, and CF do not change after reset.
Address: 3010h base + Eh offset = 301Eh
Bit
Read
7
6
5
AF
BF
CF
0
0
0
4
3
2
1
0
0
ARMF
Write
Reset
0
0
0
0
1
DBG_S field descriptions
Field
7
AF
Description
Trigger A Match Bit
The AF bit indicates if Trigger A match condition was met since arming.
0
1
6
BF
Trigger B Match Bit
The BF bit indicates if Trigger B match condition was met since arming.
0
1
5
CF
0
ARMF
Comparator B did not match.
Comparator B match.
Trigger C Match Bit
The CF bit indicates if Trigger C match condition was met since arming.
0
1
4–1
Reserved
Comparator A did not match.
Comparator A match.
Comparator C did not match.
Comparator C match.
This field is reserved.
This read-only field is reserved and always has the value 0.
Arm Flag Bit
The ARMF bit indicates whether the debugger is waiting for trigger or waiting for the FIFO to fill. While
DBGEN = 1, this status bit is a read-only image of the ARM bit in DBGC.
0
1
Debugger not armed.
Debugger armed.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
566
Freescale Semiconductor, Inc.
Chapter 23 Debug module (DBG)
23.3.16 Debug Count Status Register (DBG_CNT)
NOTE
All the bits in this register reset to 0 in POR or non-end-run
reset. The bits are undefined in end-run reset. In the case of an
end-trace to reset where DBGEN = 1 and BEGIN = 0, the
CNT[3:0] bits do not change after reset.
Address: 3010h base + Fh offset = 301Fh
Bit
7
6
Read
5
4
3
2
0
1
0
0
0
CNT
Write
Reset
0
0
0
0
0
0
DBG_CNT field descriptions
Field
7–4
Reserved
CNT
Description
This field is reserved.
This read-only field is reserved and always has the value 0.
FIFO Valid Count Bits
The CNT bits indicate the amount of valid data stored in the FIFO. Table 1-20 shows the correlation
between the CNT bits and the amount of valid data in FIFO. The CNT will stop after a count to eight even
if more data is being stored in the FIFO. The CNT bits are cleared when the DBG module is armed, and
the count is incremented each time a new word is captured into the FIFO. The host development system is
responsible for checking the value in CNT[3:0] and reading the correct number of words from the FIFO
because the count does not decrement as data is read out of the FIFO at the end of a trace run.
0000
0001
0010
0011
0100
0101
0110
0111
1000
No data valid.
1 word valid.
2 words valid.
3 words valid.
4 words valid.
5 words valid.
6 words valid.
7 words valid.
8 words valid.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
567
Functional description
23.4 Functional description
This section provides a complete functional description of the on-chip ICE system. The
DBG module is enabled by setting the DBG_C[DBGEN] bit. Enabling the module allows
the arming, triggering and storing of data in the FIFO. The DBG module is made up of
three main blocks, the comparators, trigger break control logic and the FIFO.
23.4.1 Comparator
The DBG module contains three comparators, A, B, and C. Comparator A compares the
core address bus with the address stored in the DBG_CAH and DBG_CAL registers.
Comparator B compares the core address bus with the address stored in the DBG_CBH
and DBG_CBL registers except in full mode, where it compares the data buses to the data
stored in the DBG_CBL register. Comparator C compares the core address bus with the
address stored in the DBG_CCH and DBG_CCL registers. Matches on comparators A, B,
and C are signaled to the trigger break control (TBC) block.
23.4.1.1 RWA and RWAEN in full modes
In full modes ("A And B" and "A And Not B") DBG_CAX[RWAEN and
DBG_CAX[RWA] are used to select read or write comparisons for both comparators A
and B. To select write comparisons and the write data bus in Full Modes set
DBG_CAX[RWAEN] = 1 and DBG_CAX[RWA] = 0, otherwise read comparisons and
the read data bus will be selected. The DBG_CBX[RWBEN] and DBG_CBX[RWB] bits
are not used and will be ignored in full modes.
23.4.1.2 Comparator C in loop1 capture mode
Normally comparator C is used as a third hardware breakpoint and is not involved in the
trigger logic for the on-chip ICE system. In this mode, it compares the core address bus
with the address stored in the DBG_CCX, DBG_CCH, and DBG_CCL registers.
However, in loop1 capture mode, comparator C is managed by logic in the DBG module
to track the address of the most recent change-of-flow event that was captured into the
FIFO buffer. In loop1 capture mode, comparator C is not available for use as a normal
hardware breakpoint.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
568
Freescale Semiconductor, Inc.
Chapter 23 Debug module (DBG)
When the DBG_C[ARM] and DBG_C[DBGEN] bits are set to one in loop1 capture
mode, comparator C value registers are cleared to prevent the previous contents of these
registers from interfering with the loop1 capture mode operation. When a COF event is
detected, the address of the event is compared to the contents of the DBG_CCH and
DBG_CCL registers to determine whether it is the same as the previous COF entry in the
capture FIFO. If the values match, the capture is inhibited to prevent the FIFO from
filling up with duplicate entries. If the values do not match, the COF event is captured
into the FIFO and the DBG_CCH and DBG_CCL registers are updated to reflect the
address of the captured COF event.
23.4.2 Breakpoints
A breakpoint request to the CPU at the end of a trace run can be created if the
DBG_C[BRKEN] bit is set. The value of the DBG_T[BEGIN] bit determines when the
breakpoint request to the CPU will occur. If the DBG_T[BEGIN] bit is set, begin-trigger
is selected and the breakpoint request will not occur until the FIFO is filled with 8 words.
If the DBG_T[BEGIN] bit is cleared, end-trigger is selected and the breakpoint request
will occur immediately at the trigger cycle.
When traditional hardware breakpoints from comparators A or B are desired, set
DBG_T[BEGIN] = 0 to select an end-trace run and set the trigger mode to either 0x0 (Aonly) or 0x1 (A OR B) mode.
There are two types of breakpoint requests supported by the DBG module, tag-type and
force-type. Tagged breakpoints are associated with opcode addresses and allow breaking
just before a specific instruction executes. Force breakpoints are not associated with
opcode addresses. The DBG_C[TAG] bit determines whether CPU breakpoint requests
will be a tag-type or force-type breakpoints. When DBG_C[TAG] = 0, a force-type
breakpoint is requested and it will take effect at the next instruction boundary after the
request. When DBG_C[TAG] = 1, a tag-type breakpoint is registered into the instruction
queue and the CPU will break if/when this tag reaches the head of the instruction queue
and the tagged instruction is about to be executed.
23.4.2.1 Hardware breakpoints
Comparators A, B, and C can be used as three traditional hardware breakpoints whether
the on-chip ICE real-time capture function is required or not. To use any breakpoint or
trace run capture functions set DBG_C[DBGEN] = 1. DBG_C[BRKEN] and
DBG_C[TAG] affect all three comparators. When DBG_C[BRKEN] = 0, no CPU
breakpoints are enabled. When DBG_C[BRKEN] = 1, CPU breakpoints are enabled and
the DBG_C[TAG] bit determines whether the breakpoints will be tag-type or force-type
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
569
Functional description
breakpoints. To use comparators A and B as hardware breakpoints, set DBG_T = 0x81
for tag-type breakpoints and 0x01 for force-type breakpoints. This sets up an end-type
trace with trigger mode "A OR B".
Comparator C is not involved in the trigger logic for the on-chip ICE system.
23.4.3 Trigger selection
The DBG_T[TRGSEL] bit is used to determine the triggering condition of the on-chip
ICE system. DBG_T[TRGSEL] applies to both trigger A and B except in the event only
trigger modes. By setting the DBG_T[TRGSEL] bit, the comparators will qualify a match
with the output of opcode tracking logic. The opcode tracking logic is internal to each
comparator and determines whether the CPU executed the opcode at the compare
address. With the DBG_T[TRGSEL] bit cleared a comparator match is all that is
necessary for a trigger condition to be met.
NOTE
If the DBG_T[TRGSEL] is set, the address stored in the
comparator match address registers must be an opcode address
for the trigger to occur.
23.4.4 Trigger break control (TBC)
The TBC is the main controller for the DBG module. Its function is to decide whether
data should be stored in the FIFO based on the trigger mode and the match signals from
the comparator. The TBC also determines whether a request to break the CPU should
occur.
The DBG_C[TAG] bit controls whether CPU breakpoints are treated as tag-type or forcetype breakpoints. The DBG_T[TRGSEL] bit controls whether a comparator A or B
match is further qualified by opcode tracking logic. Each comparator has a separate
circuit to track opcodes because the comparators could correspond to separate
instructions that could be propagating through the instruction queue at the same time.
In end-type trace runs (DBG_T[BEGIN] = 0), when the comparator registers match,
including the optional R/W match, this signal goes to the CPU break logic where
DBG_C[BRKEN] determines whether a CPU break is requested and the DBG_C[TAG]
control bit determines whether the CPU break will be a tag-type or force-type breakpoint.
When DBG_T[TRGSEL] is set, the R/W qualified comparator match signal also passes
through the opcode tracking logic. If/when it propagates through this logic, it will cause a
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
570
Freescale Semiconductor, Inc.
Chapter 23 Debug module (DBG)
trigger to the ICE logic to begin or end capturing information into the FIFO. In the case
of an end-type (DBG_T[BEGIN] = 0) trace run, the qualified comparator signal stops the
FIFO from capturing any more information.
If a CPU breakpoint is also enabled, you would want DBG_C[TAG] and
DBG_T[TRGSEL] to agree so that the CPU break occurs at the same place in the
application program as the FIFO stopped capturing information. If DBG_T[TRGSEL]
was 0 and DBG_C[TAG] was 1 in an end-type trace run, the FIFO would stop capturing
as soon as the comparator address matched, but the CPU would continue running until a
TAG signal could propagate through the CPUs instruction queue, which could take a long
time in the case where changes of flow caused the instruction queue to be flushed. If
DBG_T[TRGSEL] was one and DBG_C[TAG] was zero in an end-type trace run, the
CPU would break before the comparator match signal could propagate through the
opcode tracking logic to end the trace run.
In begin-type trace runs (DBG_T[BEGIN] = 1), the start of FIFO capturing is triggered
by the qualified comparator signals, and the CPU breakpoint (if enabled by
DBG_C[BRKEN]=1) is triggered when the FIFO becomes full. Since this FIFO full
condition does not correspond to the execution of a tagged instruction, it would not make
sense to use DBG_C[TAG] = 1 for a begin-type trace run.
23.4.4.1 Begin- and end-trigger
The definition of begin- and end-trigger as used in the DBG module are as follows:
• Begin-trigger: storage in FIFO occurs after the trigger and continues until 8 locations
are filled.
• End-trigger: storage in FIFO occurs until the trigger with the least recent data falling
out of the FIFO if more than 8 words are collected.
23.4.4.2 Arming the DBG module
Arming occurs by enabling the DBG module by setting the DBG_C[DBGEN] bit and by
setting the DBG_C[ARM] bit. The DBG_C[ARM] and DBG_S[ARMF] bits are cleared
when the trigger condition is met in end-trigger mode or when the FIFO is filled in begintrigger mode. In the case of an end-trace where DBG_C[DBGEN] = 1 and
DBG_T[BEGIN] = 0, DBG_C[ARM] and DBG_S[ARMF] are cleared by any reset to
end the trace run that was in progress. The DBG_S[ARMF] bit is also cleared if
DBG_C[ARM] is written to zero or when the DBG_C[DBGEN] bit is low. The TBC
logic determines whether a trigger condition has been met based on the trigger mode and
the trigger selection.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
571
Functional description
23.4.4.3 Trigger modes
The on-chip ICE system supports nine trigger modes. The trigger mode is used as a
qualifier for either starting or ending the storing of data in the FIFO. When the match
condition is met, the appropriate flag AF or BF is set in DBG_S register. Arming the
DBG module clears the DBG_S[AF], DBG_S[BF], and DBG_S[CF] flags. In all trigger
modes except for the event only modes change of flow addresses are stored in the FIFO.
In the event only modes only the value on the data bus at the trigger event B comparator
match address will be stored.
23.4.4.3.1
A only
In the A only trigger mode, if the match condition for A is met, the DBG_S[AF] flag is
set.
23.4.4.3.2
A or B
In the A or B trigger mode, if the match condition for A or B is met, the corresponding
flag(s) in the DBG_S register are set.
23.4.4.3.3
A then B
In the A then B trigger mode, the match condition for A must be met before the match
condition for B is compared. When the match condition for A or B is met, the
corresponding flag in the DBG_S register is set.
23.4.4.3.4
Event only B
In the event only B trigger mode, if the match condition for B is met, the DBG_S[BF]
flag is set. The event only B trigger mode is considered a begin-trigger type and the
DBG_T[BEGIN] bit is ignored.
23.4.4.3.5
A then event only B
In the A then event only B trigger mode, the match condition for A must be met before
the match condition for B is compared. When the match condition for A or B is met, the
corresponding flag in the DBG_S register is set. The A then event only B trigger mode is
considered a begin-trigger type and the DBG_T[BEGIN] bit is ignored.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
572
Freescale Semiconductor, Inc.
Chapter 23 Debug module (DBG)
23.4.4.3.6
A and B (full mode)
In the A and B trigger mode, comparator A compares to the address bus and comparator
B compares to the data bus. In the A and B trigger mode, if the match condition for A and
B happen on the same bus cycle, both the DBG_S[AF] and DBG_S[BF] flags are set. If a
match condition on only A or only B happens, no flags are set.
For breakpoint tagging operation with an end-trigger type trace, only matches from
comparator A will be used to determine if the Breakpoint conditions are met and
comparator B matches will be ignored.
23.4.4.3.7
A and not B (full mode)
In the A and not B trigger mode, comparator A compares to the address bus and
comparator B compares to the data bus. In the A and not B trigger mode, if the match
condition for A and not B happen on the same bus cycle, both the DBG_S[AF] and
DBG_S[BF] flags are set. If a match condition on only A or only not B occur no flags are
set.
For breakpoint tagging operation with an end-trigger type trace, only matches from
comparator A will be used to determine if the breakpoint conditions are met and
comparator B matches will be ignored.
23.4.4.3.8
Inside range, A ≤ address ≤ B
In the inside range trigger mode, if the match condition for A and B happen on the same
bus cycle, both the DBG_S[AF] and DBG_S[BF] flags are set. If a match condition on
only A or only B occur no flags are set.
23.4.4.3.9
Outside range, address < A or address > B
In the outside range trigger mode, if the match condition for A or B is met, the
corresponding flag in the DBGS register is set.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
573
Functional description
The four control bits DBG_T[BEGIN] and DBG_T[TRGSEL], and DBG_C[BRKEN]
and DBG_C[TAG], determine the basic type of debug run as shown in the following
table. Some of the 16 possible combinations are not used (refer to the notes at the end of
the table).
Table 23-18. Basic types of debug runs
BEGIN
TRGSEL
BRKEN
TAG
Type of debug run
0
0
0
x
Fill FIFO until trigger
address (no CPU
breakpoint - keep
running)
0
0
1
0
Fill FIFO until trigger
address, then force
CPU breakpoint
0
0
1
1
Do not use
0
1
0
x
Fill FIFO until trigger
opcode about to
execute (no CPU
breakpoint - keep
running)
0
1
1
0
0
1
1
1
Fill FIFO until trigger
opcode about to
execute (trigger causes
CPU breakpoint)
1
0
0
x
Start FIFO at trigger
address (No CPU
breakpoint - keep
running)
1
0
1
0
Start FIFO at trigger
address, force CPU
breakpoint when FIFO
full
1
0
1
1
1
1
0
x
Start FIFO at trigger
opcode (No CPU
breakpoint - keep
running)
1
1
1
0
Start FIFO at trigger
opcode, force CPU
breakpoint when FIFO
full
1
1
1
1
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
574
Freescale Semiconductor, Inc.
Chapter 23 Debug module (DBG)
23.4.5 FIFO
The FIFO is an eight word deep FIFO. In all trigger modes except for event only, the data
stored in the FIFO will be change of flow addresses. In the event only trigger modes only
the data bus value corresponding to the event is stored. In event only trigger modes, the
high byte of the valid data from the FIFO will always read a 0x00.
23.4.5.1 Storing data in FIFO
In all trigger modes except for the event only modes, the address stored in the FIFO will
be determined by the change of flow indicators from the core. The signal core_cof[1]
indicates the current core address is the destination address of an indirect JSR or JMP
instruction, or a RTS or RTI instruction or interrupt vector and the destination address
should be stored. The signal core_cof[0] indicates that a conditional branch was taken
and that the source address of the conditional branch should be stored.
23.4.5.2 Storing with begin-trigger
Storing with begin-trigger can be used in all trigger modes. Once the DBG module is
enabled and armed in the begin-trigger mode, data is not stored in the FIFO until the
trigger condition is met. Once the trigger condition is met the DBG module will remain
armed until 8 words are stored in the FIFO. If the core_cof[1] signal becomes asserted,
the current address is stored in the FIFO. If the core_cof[0] signal becomes asserted, the
address registered during the previous last cycle is decremented by two and stored in the
FIFO.
23.4.5.3 Storing with end-trigger
Storing with end-trigger cannot be used in event-only trigger modes. After the DBG
module is enabled and armed in the end-trigger mode, data is stored in the FIFO until the
trigger condition is met. If the core_cof[1] signal becomes asserted, the current address is
stored in the FIFO. If the core_cof[0] signal becomes asserted, the address registered
during the previous last cycle is decremented by two and stored in the FIFO. When the
trigger condition is met, the DBG_C[ARM] and DBG_S[ARMF] will be cleared and no
more data will be stored. In non-event only end-trigger modes, if the trigger is at a change
of flow address the trigger event will be stored in the FIFO.
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
575
Functional description
23.4.5.4 Reading data from FIFO
The data stored in the FIFO can be read using BDM commands provided the DBG
module is enabled and not armed (DBG_C[DBGEN] = 1 and DBG_C[ARM] = 0). The
FIFO data is read out first-in-first-out. By reading the DBG_CNT[CNT] bits at the end of
a trace run, the number of valid words can be determined. The FIFO data is read by
optionally reading the DBG_FH register followed by the DBG_FL register. Each time the
DBG_FL register is read, the FIFO is shifted to allow reading of the next word, however,
the count does not decrement. In event-only trigger modes where the FIFO will contain
only the data bus values stored, to read the FIFO only DBG_FL needs to be accessed.
The FIFO is normally read only while DBG_C[ARM] = 0 and DBG_S[ARMF] = 0,
however, reading the FIFO while the DBG module is armed will return the data value in
the oldest location of the FIFO and the TBC will not allow the FIFO to shift. This action
could cause a valid entry to be lost because the unexpected read blocked the FIFO
advance.
If the DBG module is not armed and the DBG_FL register is read, the TBC will store the
current opcode address. Through periodic reads of the DBG_FH and DBG_FL registers
while the DBG module is not armed, host software can provide a histogram of program
execution This is called profile mode.
23.4.6 Interrupt priority
When DBG_T[TRGSEL] is set and the DBG module is armed to trigger on begin- or
end-trigger types, a trigger is not detected in the condition where a pending interrupt
occurs at the same time that a target address reaches the top of the instruction pipe. In
these conditions, the pending interrupt has higher priority and code execution switches to
the interrupt service routine.
When DBG_T[TRGSEL] is clear and the DBG module is armed to trigger on end-trigger
types, the trigger event is detected on a program fetch of the target address, even when an
interrupt becomes pending on the same cycle. In these conditions, the pending interrupt
has higher priority, the exception is processed by the core and the interrupt vector is
fetched. Code execution is halted before the first instruction of the interrupt service
routine is executed. In this scenario, the DBG module will have cleared DBG_C[ARM]
without having recorded the change-of-flow that occurred as part of the interrupt
exception. Note that the stack will hold the return addresses and can be used to
reconstruct execution flow in this scenario.
When DBG_T[TRGSEL] is clear and the DBG module is armed to trigger on begintrigger types, the trigger event is detected on a program fetch of the target address, even
when an interrupt becomes pending on the same cycle. In this scenario, the FIFO captures
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
576
Freescale Semiconductor, Inc.
Chapter 23 Debug module (DBG)
the change of flow event. Because the system is configured for begin-trigger, the DBG
remains armed and does not break until the FIFO has been filled by subsequent change of
flow events.
23.5 Resets
The DBG module cannot cause an MCU reset.
There are two different ways this module will respond to reset depending upon the
conditions before the reset event. If the DBG module was setup for an end trace run with
DBG_C[DBGEN] = 1 and DBG_T[BEGIN] = 0, DBG_C[ARM], DBG_S[ARMF], and
DBG_C[BRKEN] are cleared but the reset function on most DBG control and status bits
is overridden so a host development system can read out the results of the trace run after
the MCU has been reset. In all other cases including POR, the DBG module controls are
initialized to start a begin trace run starting from when the reset vector is fetched. The
conditions for the default begin trace run are:
• DBG_CAX = 0x00, DBG_CAH=0xFF, DBG_CAL=0xFE so comparator A is set to
match when the 16-bit CPU address 0xFFFE appears during the reset vector fetch
• DBG_C = 0xC0 to enable and arm the DBG module
• DBG_T = 0x40 to select a force-type trigger, a BEGIN trigger, and A-only trigger
mode
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
577
Resets
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
578
Freescale Semiconductor, Inc.
Appendix A
Changes between revision 2 and 1
Table A-1. Changes between revision 2 and 1
Chapter
Description
Device Overview
• Updated ADC features in the Introduction
Memory map
• Corrected the register at 0x309F to SPI0_M
System control
• Corrected the description in RESET pin enable to "The SOPT1[RSTPE] bit must be set
to enable the RESET function."
• Updated SOPT1[RSTPE] descriptions
Parallel input/output
• Added cross-reference in the Introduction
Clock management
• Updated to clarify the trim value in Internal reference clock (ICSIRCLK)
• Updated the examples in the Initializing FEI mode, Initializing FBI mode, Initializing FEE
mode and Initializing FBE mode
• Corrected ICS_C1[CLKS]
• Added a note to the ICS_S[LOCK].
Chip configurations
• Corrected the description of "Convert the temperature sensor channel (AD22)" in the
Temperature sensor
• Updated the input for AD10 and AD11 in the ADC channel assignments
Keyboard Interrupts (KBI)
• Corrected the registers address to be the same as those in the chapter 4 Memory map
FlexTimer Module (FTM)
• Removed the redundant registers of FTM0 in the section 12.3.2 to be the same as
those in the Chapter 4 Memory map
Real-time counter (RTC)
• Added a note to the RTC_CNTH
• Updated the example in the Initialization/application information
Serial communications
interface (SCI)
•
•
•
•
8-Bit Serial Peripheral
Interface (8-Bit SPI)
• Updated SPIx_CI register and fields descriptions.
• Corrected register address offset and absolute address to be the same as those in the
Chapter 4 Memory map.
Inter-Integrated Circuit (I2C)
•
•
•
•
•
Analog-to-digital converter
(ADC)
• Updated the ADC_SC2[1:0] to write 0 only.
• Added a note to the ADC_SC4[AFDEP].
• Corrected all the ADCSC1 to ADC_SC1, ADCRH to ADC_RH, ADCRL to ADC_RL to
keep consistent with the registers name.
Corrected SCI receiver block diagram in the Block diagram
Added SCI signal descriptions
Added a note to the Transmitter functional description
Added new sections of Baud rate tolerance, Slow data tolerance, and Fast data
tolerance
• Updated Stop mode operation, Loop mode and Single-wire operation
Updated the descriptions of I2C_F[ICR], I2C_S[TCF]
Polished Address matching
Updated Programmable input glitch filter
Updated the note in the Address matching wake-up
Updated Initialization/application information
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
Freescale Semiconductor, Inc.
579
Table A-1. Changes between revision 2 and 1
Chapter
Description
• Updated descriptions in section of Functional description.
• Added a note in the Pseudo-code example
MC9S08PA16 Reference Manual, Rev. 2, 08/2014
580
Freescale Semiconductor, Inc.
How to Reach Us:
Home Page:
freescale.com
Web Support:
freescale.com/support
Information in this document is provided solely to enable system and
software implementers to use Freescale products. There are no express
or implied copyright licenses granted hereunder to design or fabricate
any integrated circuits based on the information in this document.
Freescale reserves the right to make changes without further notice to
any products herein.
Freescale makes no warranty, representation, or guarantee regarding
the suitability of its products for any particular purpose, nor does
Freescale assume any liability arising out of the application or use of
any product or circuit, and specifically disclaims any and all liability,
including without limitation consequential or incidental damages.
“Typical” parameters that may be provided in Freescale data sheets
and/or specifications can and do vary in different applications, and
actual performance may vary over time. All operating parameters,
including “typicals,” must be validated for each customer application by
customer's technical experts. Freescale does not convey any license
under its patent rights nor the rights of others. Freescale sells products
pursuant to standard terms and conditions of sale, which can be found
at the following address: freescale.com/SalesTermsandConditions.
Freescale and the Freescale logo are trademarks of Freescale
Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or
service names are the property of their respective owners.
© 2011-2014 Freescale Semiconductor, Inc.
Document Number MC9S08PA16RM
Revision 2, 08/2014