XC7WT14 Triple inverting Schmitt trigger Rev. 2 — 3 November 2011 Product data sheet 1. General description The XC7WT14 is a high-speed Si-gate CMOS device. This device provides three inverting buffers with Schmitt trigger action. This device is capable of transforming slowly changing input signals into sharply defined, jitter-free output signals. 2. Features and benefits Symmetrical output impedance High noise immunity ESD protection: HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V CDM JESD22-C101D exceeds 1000 V Low power dissipation Balanced propagation delays Multiple package options Specified from 40 C to +85 C and 40 C to +125 C 3. Applications Wave and pulse shaper for highly noisy environment Astable multivibrator Monostable multivibrator 4. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version XC7WT14DP 40 C to +125 C TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm SOT505-2 XC7WT14DC 40 C to +125 C VSSOP8 plastic very thin shrink small outline package; 8 leads; SOT765-1 body width 2.3 mm XC7WT14GT 40 C to +125 C XSON8 plastic extremely thin small outline package; no leads; SOT833-1 8 terminals; body 1 1.95 0.5 mm XC7WT14GD 40 C to +125 C XSON8U plastic extremely thin small outline package; no leads; SOT996-2 8 terminals; UTLP based; body 3 2 0.5 mm XC7WT14 NXP Semiconductors Triple inverting Schmitt trigger 5. Marking Table 2. Marking codes Type number Marking code[1] XC7WT14DP g14 XC7WT14DC g14 XC7WT14GT g14 XC7WT14GD g14 [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 6. Functional diagram 1A 1Y 3Y 3A 2A 2Y A 001aah728 Fig 1. Y mna025 001aah729 Logic symbol Fig 2. IEC logic symbol Fig 3. Logic diagram (one Schmitt trigger) 7. Pinning information 7.1 Pinning XC7WT14 1A 1 8 VCC 3Y 2 7 1Y 2A 3 6 3A GND 4 5 2Y XC7WT14 1A 1 8 VCC 3Y 2 7 1Y 2A 3 6 3A GND 4 5 2Y 001aam984 Transparent top view 001aam983 Fig 4. Pin configuration SOT505-2 and SOT765-1 XC7WT14 Product data sheet Fig 5. Pin configuration SOT833-1 All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 2 of 18 XC7WT14 NXP Semiconductors Triple inverting Schmitt trigger XC7WT14 1A 1 8 VCC 3Y 2 7 1Y 2A 3 6 3A GND 4 5 2Y 001aam985 Transparent top view Fig 6. Pin configuration SOT996-2 7.2 Pin description Table 3. Pin description Symbol Pin Description 1A, 2A, 3A 1, 3, 6 data input GND 4 ground (0 V) 1Y, 2Y, 3Y 7, 5, 2 data output VCC 8 supply voltage 8. Functional description Table 4. Function table [1] Input nA Output nY L H H L [1] H = HIGH voltage level; L = LOW voltage level XC7WT14 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 3 of 18 XC7WT14 NXP Semiconductors Triple inverting Schmitt trigger 9. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VCC supply voltage VI input voltage IIK input clamping current VI < 0.5 V IOK output clamping current VO < 0.5 V or VO > VCC + 0.5 V IO output current 0.5 V < VO < VCC + 0.5 V ICC IGND Tstg storage temperature [1] [2] Min Max Unit 0.5 +7.0 V 0.5 +7.0 V 20 - mA - 20 mA - 25 mA supply current - 75 mA ground current 75 - mA 65 +150 C - 250 mW total power dissipation Ptot Conditions [1] Tamb = 40 C to +125 C [2] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. For TSSOP8 package: above 55 C the value of Ptot derates linearly at 2.5 mW/K. For VSSOP8 package: above 110 C the value of Ptot derates linearly at 8 mW/K. For XSON8 and XSON8U package: above 118 C the value of Ptot derates linearly with 7.8 mW/K. 10. Recommended operating conditions Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage VI VO Tamb ambient temperature Conditions Min Typ Max 4.5 5.0 input voltage 0 output voltage 0 40 XC7WT14 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 Unit 5.5 V - 5.5 V - VCC V +25 +125 C © NXP B.V. 2011. All rights reserved. 4 of 18 XC7WT14 NXP Semiconductors Triple inverting Schmitt trigger 11. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter VOH 25 C Conditions HIGH-level VI = VT+ or VT; VCC = 4.5 V output voltage IO = 50 A IO = 8.0 mA VOL LOW-level VI = VT+ or VT; VCC = 4.5 V output voltage IO = 50 A IO = 8.0 mA Min Typ Max Min Max Min Max 4.4 4.5 - 4.4 - 4.4 - V 3.94 - - 3.8 - 3.70 - V - 0 0.1 - 0.1 - 0.1 V - - 0.36 - 0.44 - 0.55 V - - 0.1 - 1.0 - 2.0 A II input leakage current ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 1.0 - 10 - 40 A ICC additional per input pin; VI = 3.4 V; supply current other inputs at VCC or GND; IO = 0 A; VCC = 5.5 V - - 1.35 - 1.5 - 1.5 mA CI input capacitance - 1.5 10 - 10 - 10 pF XC7WT14 Product data sheet VI = 5.5 V or GND; VCC = 0 V to 5.5 V 40 C to +85 C 40 C to +125 C Unit All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 5 of 18 XC7WT14 NXP Semiconductors Triple inverting Schmitt trigger 11.1 Transfer characteristics Table 8. Transfer characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). See Figure 9 and Figure 10. Symbol Parameter positive-going threshold voltage VT+ VT VH 25 C Conditions 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max Min Max VCC = 4.5 V - - 2.0 - 2.0 - 2.0 V VCC = 5.5 V - - 2.0 - 2.0 - 2.0 V negative-going threshold voltage VCC = 4.5 V 0.5 - - 0.5 - 0.5 - V VCC = 5.5 V 0.6 - - 0.6 - 0.6 - V hysteresis voltage VCC = 4.5 V 0.4 - 1.4 0.4 1.4 0.35 1.4 V VCC = 5.5 V 0.4 - 1.6 0.4 1.6 0.35 1.6 V 12. Dynamic characteristics Table 9. Dynamic characteristics GND = 0 V; for test circuit see Figure 8. Symbol Parameter tpd 25 C Conditions propagation delay nA to nY; Figure 7 power dissipation capacitance per buffer; VI = GND to VCC [1] 40 C to +125 C Unit Typ Max Min Max Min Max - 4.1 7.0 1.0 8.0 1.0 9.0 ns - 5.9 8.5 1.0 10.0 1.0 11.0 ns - 12 - - - - - pF [1] [2] CL = 15 pF CL = 50 pF CPD 40 C to +85 C Min [3] tpd is the same as tPLH and tPHL. [2] Typical values are measured at VCC = 5.0 V. [3] CPD is used to determine the dynamic power dissipation PD (W). PD = CPD VCC2 fi + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; (CL VCC2 fo) = sum of the outputs. XC7WT14 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 6 of 18 XC7WT14 NXP Semiconductors Triple inverting Schmitt trigger 13. Waveforms VM A input tPHL tPLH VM Y output mna033 Measurement points are given in Table 10. Fig 7. The input (nA) to output (nY) propagation delays Table 10. Measurement points Type number Input XC7WT14 Output VI VM VM GND to 3.0 V 1.5 V 0.5 VCC VCC PULSE GENERATOR VI VO DUT CL RT mna101 Test data is given in Table 11. Definitions for test circuit: CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to output impedance Zo of the pulse generator. Fig 8. Test circuit for measuring switching times Table 11. Test data Type XC7WT14 XC7WT14 Product data sheet Input Load VI tr, tf CL 3.0 V 3.0 ns 15 pF, 50 pF All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 Test tPLH, tPHL © NXP B.V. 2011. All rights reserved. 7 of 18 XC7WT14 NXP Semiconductors Triple inverting Schmitt trigger 13.1 Transfer characteristic waveforms VO VI VT+ VH VT− VH VT− Fig 9. VO VI VT+ mna027 mna026 Transfer characteristic Fig 10. The definitions of VT+, VT and VH mna404 5 ICC (mA) mna405 8 ICC (mA) 4 6 3 4 2 2 1 0 0 0 1 2 3 4 V (V) 5 I VCC = 4.5 V. Product data sheet 2 4 VI (V) 6 VCC = 5.5 V. Fig 11. Typical transfer characteristics XC7WT14 0 Fig 12. Typical transfer characteristics All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 8 of 18 XC7WT14 NXP Semiconductors Triple inverting Schmitt trigger 14. Application information The slow input rise and fall times cause additional power dissipation, which can be calculated using the following formula: Padd = fi (tr ICC(AV) + tf ICC(AV)) VCC where: Padd = additional power dissipation (W); fi = input frequency (MHz); tr = input rise time (ns); 10 % to 90 %; tf = input fall time (ns); 90 % to 10 %; ICC(AV) = average additional supply current (A). ICC(AV) differs with positive or negative input transitions, as shown in Figure 13. For XC7WT14 used in relaxation oscillator circuit, see Figure 14. Note to the application information: 1. All values given are typical unless otherwise specified. mna058 200 ΔICC(AV) (μA) 150 positive-going edge 100 negative-going edge 50 0 0 2 4 VCC (V) 6 Linear change of VI between 0.1VCC to 0.9VCC Fig 13. Average additional ICC XC7WT14 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 9 of 18 XC7WT14 NXP Semiconductors Triple inverting Schmitt trigger R C mna035 1 1 f = --- -----------------------T 0.60 RC Fig 14. Relaxation oscillator using the XC7WT14 XC7WT14 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 10 of 18 XC7WT14 NXP Semiconductors Triple inverting Schmitt trigger 15. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm D E A SOT505-2 X c HE y v M A Z 5 8 A A2 (A3) A1 pin 1 index θ Lp L 1 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(1) e HE L Lp v w y Z(1) θ mm 1.1 0.15 0.00 0.95 0.75 0.25 0.38 0.22 0.18 0.08 3.1 2.9 3.1 2.9 0.65 4.1 3.9 0.5 0.47 0.33 0.2 0.13 0.1 0.70 0.35 8° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT505-2 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 02-01-16 --- Fig 15. Package outline SOT505-2 (TSSOP8) XC7WT14 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 11 of 18 XC7WT14 NXP Semiconductors Triple inverting Schmitt trigger VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm D E SOT765-1 A X c y HE v M A Z 5 8 Q A A2 A1 pin 1 index (A3) θ Lp 1 4 e L detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(2) e HE L Lp Q v w y Z(1) θ mm 1 0.15 0.00 0.85 0.60 0.12 0.27 0.17 0.23 0.08 2.1 1.9 2.4 2.2 0.5 3.2 3.0 0.4 0.40 0.15 0.21 0.19 0.2 0.13 0.1 0.4 0.1 8° 0° Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT765-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 02-06-07 MO-187 Fig 16. Package outline SOT765-1 (VSSOP8) XC7WT14 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 12 of 18 XC7WT14 NXP Semiconductors Triple inverting Schmitt trigger XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm 1 2 SOT833-1 b 4 3 4× (2) L L1 e 8 7 6 e1 5 e1 e1 8× A (2) A1 D E terminal 1 index area 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max A1 max b D E e e1 L L1 mm 0.5 0.04 0.25 0.17 2.0 1.9 1.05 0.95 0.6 0.5 0.35 0.27 0.40 0.32 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT833-1 --- MO-252 --- EUROPEAN PROJECTION ISSUE DATE 07-11-14 07-12-07 Fig 17. Package outline SOT833-1 (XSON8) XC7WT14 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 13 of 18 XC7WT14 NXP Semiconductors Triple inverting Schmitt trigger XSON8U: plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 3 x 2 x 0.5 mm B D SOT996-2 A E A A1 detail X terminal 1 index area e1 v w b e L1 1 4 8 5 C C A B C M M y y1 C L2 L X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 b D E e e1 L L1 L2 v w y y1 mm 0.5 0.05 0.00 0.35 0.15 2.1 1.9 3.1 2.9 0.5 1.5 0.5 0.3 0.15 0.05 0.6 0.4 0.1 0.05 0.05 0.1 REFERENCES OUTLINE VERSION IEC SOT996-2 --- JEDEC JEITA --- EUROPEAN PROJECTION ISSUE DATE 07-12-18 07-12-21 Fig 18. Package outline SOT996-2 (XSON8U) XC7WT14 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 14 of 18 XC7WT14 NXP Semiconductors Triple inverting Schmitt trigger 16. Abbreviations Table 12. Abbreviations Acronym Description CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model 17. Revision history Table 13. Revision history Document ID Release date Data sheet status Change notice Supersedes XC7WT14 v.2 20111103 Product data sheet - XC7WT14 v.1 - - Modifications: XC7WT14 v.1 XC7WT14 Product data sheet • Legal pages updated 20110119 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 15 of 18 XC7WT14 NXP Semiconductors Triple inverting Schmitt trigger 18. Legal information 18.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 18.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 18.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. XC7WT14 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 16 of 18 XC7WT14 NXP Semiconductors Triple inverting Schmitt trigger Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond 18.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 19. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] XC7WT14 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 3 November 2011 © NXP B.V. 2011. All rights reserved. 17 of 18 XC7WT14 NXP Semiconductors Triple inverting Schmitt trigger 20. Contents 1 2 3 4 5 6 7 7.1 7.2 8 9 10 11 11.1 12 13 13.1 14 15 16 17 18 18.1 18.2 18.3 18.4 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Transfer characteristics . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Transfer characteristic waveforms . . . . . . . . . . 8 Application information. . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Contact information. . . . . . . . . . . . . . . . . . . . . 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 3 November 2011 Document identifier: XC7WT14