PNX2000 Audio video input processor Rev. 03 – 23 August 2004 Product data 1. General description The PNX2000 is a companion IC for use with the Nexperia™ 1 digital video home entertainment engines such as PNX8526 and PNX8550. The PNX2000 is always used in combination with the PNX3000. PNX2000 is intended for mid to high-end analog and hybrid TV sets, performing input decoding of single stream analog audio and single stream analog video signals. In addition, the PNX2000 is used for decoding and presentation of all audio output streams in the system. Figure 1 shows a block diagram of the device. 2. Features ■ Detection of PAL, NTSC or SECAM, and various 1fH and 2fH component video input sources. ■ Full support for 1fH and 2fH video sources; progressive and interlaced. ■ Decoding for global VBI Standards (WST, WSS, VPS, CC, VITC). ■ ITU-656 output interface. ■ Global multi-standard audio demodulation and decoding. ■ Dolby Pro Logic II™ 2 multi-channel audio decoding and post-processing. ■ Advanced fully programmable audio post-processing functions, including psychoacoustic spatial algorithms for optimal loudspeaker matching. 3. Applications ■ ■ ■ ■ Analog TV receivers. Hybrid TV receivers. DVD recorders. VCRs. 1. Nexperia is a trademark of Koninklijke Philips Electronics N.V. 2. Dolby is a trademark of Dolby Laboratories PNX2000 Philips Semiconductors Audio video input processor 4. Ordering information Table 1: Ordering information Type number Package name Description Version PNX2000HL LQFP144 plastic low profile quad flat package; 144 leads; body 20 × 20 × 1.4 mm SOT486-1 5. Block diagram DLINK2 DLINK1 DLINK3 video data CVBS, Y/C, YUV 54 MHz clock 27 Msps or 54 Msps PNX2000 audio data SIF or L/R I2C-bus I2D I2C-BUS HSYNC VIDDEC INT GTU HSYNC/ VSYNC DCU 13.5 MHz or 27 MHz Xtal CLOCKS ITU-656 DEMDEC DSP 6× I2S-bus outputs PI-bus AUDIO DSP 6× I2S-bus inputs ×4 ×6 ×2 BCU mce559 PNX3000 interface (2 stereo or 4 mono) ITU-656 1fH or 2fH 10-bit data Fig 1. Block diagram 9397 750 13928 Product data © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 03 – 23 August 2004 2 of 31 PNX2000 Philips Semiconductors Audio video input processor 6. Pinning information 109 144 6.1 Pinning 1 108 PNX2000HL 72 73 37 36 001aaa287 Fig 2. Pin configuration 6.1.1 Pin description Table 2 describes acronyms used in the pin tables: Table 2: Acronym description Acronym Description 3V 3.3 V LVCMOS 5VT 5 V tolerant inputs Z 3-state TTL TTL logic TTL-H TTL with hysteresis CMOS CMOS logic IA Input Analog ID Input Digital OD Output Digital OA Output Analog IOA I/O Analog IOD I/O Digital GA Ground Analog SA Supply Analog SD Supply Digital OSCIN Crystal Oscillator Input OSCOUT Crystal Oscillator Output OSCGND Crystal Oscillator Ground 9397 750 13928 Product data © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 03 – 23 August 2004 3 of 31 PNX2000 Philips Semiconductors Audio video input processor Table 3: Pins in numerical sequence Pin Symbol Type Description 1 VSSD(I2D) GD I2D digital ground 2 DLINK1DP IA analog differential data link 1 positive termination 3 DLINK1DN IA analog differential data link 1 negative termination 4 DLINK1SP IA analog differential strobe link 1 positive termination 5 DLINK1SN IA analog differential strobe link 1 negative termination 7 DLINK2DP IA analog differential data link 2 positive termination 8 DLINK2DN IA analog differential data link 2 negative termination 9 DLINK2SP IA analog differential strobe link 2 positive termination 10 DLINK2SN IA analog differential strobe link 2 negative termination 12 DLINK3DP IA analog differential data link 3 positive termination 13 DLINK3DN IA analog differential data link 3 negative termination 14 DLINK3SP IA analog differential strobe link 3 positive termination 15 DLINK3SN IA analog differential strobe link 3 negative termination 16 VDDD(I2D) SD I2D digital 1.8 V supply voltage 17 I2C_ADR ID I2C-bus address select (internal pull-down); TTL; 5VT 18 HSYNCFBL1 IA horizontal sync (external); fastblanking signal from SCART 19 HSYNCFBL2 IA horizontal sync (external); fastblanking signal from SCART 20 HVINFO OD horizontal and vertical sync information to PNX3000; CMOS 21 VSYNC1 ID vertical sync (external); TTL; 5VT 22 VSYNC2 ID vertical sync (external); TTL; 5VT 23 VDD3(DTC) SD DTC 3.3 V supply voltage 24 VDDD(DTC) SD DTC 1.8 V supply voltage 25 VSS(DTC) GA DTC analog ground 26 I2C_SCL IOD I2C-bus clock; TTL; Z; 5VT 27 I2C_SDA IOD I2C-bus data; TTL; Z; 5VT 28 VSSE - 3.3 V ground 29 VSS - 1.8 V ground 30 VDDI - 1.8 V supply voltage 31 MPIFCLK OD 13.5 MHz or 27 MHz to PNX3000; CMOS 32 VDDE - 3.3 V supply voltage 33 VDDA(PLL) - phase locked loop 1.8 V supply voltage 34 - n.c. not connected 35 VDDI - 1.8 V supply voltage 36 VSS - 1.8 V ground 37 VDDA(XTAL) OSCVDD 1.8 V crystal oscillator supply voltage 38 XIN OSCIN crystal oscillator input 39 XOUT OSCOUT crystal oscillator output 40 XGND OSCGND crystal oscillator ground 9397 750 13928 Product data © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 03 – 23 August 2004 4 of 31 PNX2000 Philips Semiconductors Audio video input processor Table 3: Pins in numerical sequence…continued Pin Symbol Type Description 41 VSSE - 3.3 V ground 42 VDDI - 1.8 V supply voltage 43 VSS - 1.8 V ground 44 VDDM - 1.8 V supply voltage for KSFRAMs and KROMs 45 RESET_N IA external reset input 46 RESET_SEL ID selects between using an external reset input or using internal POR; TTL; 5VT 47 DCLK OD reserved; CMOS 48 INTOUT OD interrupt line output; Z; 5VT 49 VDDE - 3.3 V supply voltage 50 LL_CLK ID reserved; TTL; 5VT 51 DVO_CLK OD digital video output clock; CMOS; Z 52 DVO_VALID OD digital video data valid; CMOS; Z 53 VDDI - 1.8 V supply voltage 54 VSS - 1.8 V ground 55 DVO_DATA_0 OD digital video output state 0; CMOS; Z 56 DVO_DATA_1 OD digital video output state 1; CMOS; Z 57 DVO_DATA_2 OD digital video output state 2; CMOS; Z 58 DVO_DATA_3 OD digital video output state 3; CMOS; Z 59 VSSE - 3.3 V ground 60 DVO_DATA_4 OD digital video output state 4; CMOS; Z 61 DVO_DATA_5 OD digital video output state 5; CMOS; Z 62 DVO_DATA_6 OD digital video output state 6; CMOS; Z 63 DVO_DATA_7 OD digital video output state 7; CMOS; Z 64 DVO_DATA_8 OD digital video output state 8; CMOS; Z 65 DVO_DATA_9 OD digital video output state 9; CMOS; Z 66 VDDE - 3.3 V supply voltage 67 VDDI - 1.8 V supply voltage 68 VSS - 1.8 V ground 69 I2S_OUT_SD3 OD I2S-bus data-out channel 3; CMOS 70 I2S_OUT_SD3_WS OD I2S-bus word select channel 3; CMOS 71 I2S_OUT_SD3_SCK OD I2S-bus bit clock channel 3; CMOS 72 VSSE - 3.3 V ground 73 I2S_OUT_SD6 OD I2S-bus data out channel 6; CMOS 74 I2S_OUT_SD5 OD I2S-bus data out channel 5; CMOS 75 I2S_OUT_SD4 OD I2S-bus data out channel 4; CMOS 76 I2S_OUT_SD2 OD I2S-bus data out channel 2; CMOS 77 I2S_OUT_SD1 OD I2S-bus data out channel 1; CMOS 78 I2S_WS_SYS IOD I2S-bus system word select; TTL-H; CMOS 79 I2S_SCK_SYS IOD I2S-bus system bit clock; TTL-H; CMOS 80 VDDI - 1.8 V supply voltage 9397 750 13928 Product data © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 03 – 23 August 2004 5 of 31 PNX2000 Philips Semiconductors Audio video input processor Table 3: Pins in numerical sequence…continued Pin Symbol Type Description 81 VSS - 1.8 V ground 82 VDDE - 3.3 V supply voltage 83 I2S_IN_SD6 ID I2S-bus data in channel 6; TTL; 5VT 84 I2S_IN_SD5 ID I2S-bus data in channel 5; TTL; 5VT 85 I2S_IN_SD4 ID I2S-bus data in channel 4; TTL; 5VT 86 I2S_IN_SD3 ID I2S-bus data in channel 3; TTL; 5VT 87 I2S_IN_SD2 ID I2S-bus data in channel 2; TTL; 5VT 88 I2S_IN_SD1 ID I2S-bus data in channel 1; TTL; 5VT 89 ADAC_CLK OD Used for 128 fs or 256 fs clock output to external audio DAC; CMOS. 90 - n.c. not connected 91 VDDE - 3.3 V supply voltage 92 TDI ID JTAG test data in; TTL-H; 5VT 93 TDO OD JTAG test data out; CMOS 94 TCK ID JTAG test clock; TTL-H; 5VT 95 TMS ID JTAG test mode select; TTL-H; 5VT 96 TRST_N ID JTAG reset (active low); TTL-H; 5VT 97 VDDI - 1.8 V supply voltage 98 VSS - 1.8 V ground 99 VSSE - 3.3 V ground 100 VSS(ADAC) GD audio DAC 1.8 V digital ground 101 VDDD(ADAC) SD audio DAC 1.8 V digital supply voltage 102 VDDA(ADAC) SA audio DAC 3.3 V supply voltage 103 ADAC1_P SA Positive analog reference derived via emitter follower from PNX3000 V_SND pin. 104 ADAC1 OA analog audio output 1 105 ADAC1_N GA Negative analog reference star connected at PNX3000. 106 ADAC2_N GA Negative analog reference star connected at PNX3000. 107 ADAC2 OA analog audio output 2 108 ADAC2_P SA Positive analog reference derived via emitter follower from PNX3000 V_SND pin. 109 ADAC3_P SA Positive analog reference derived via emitter follower from PNX3000 V_SND pin. 110 ADAC3 OA analog audio output 3 111 ADAC3_N GA Negative analog reference star connected at PNX3000. 112 ADAC4_N GA Negative analog reference star connected at PNX3000. 113 ADAC4 OA analog audio output 4 114 ADAC4_P SA Positive analog reference derived via emitter follower from PNX3000 V_SND pin. 9397 750 13928 Product data © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 03 – 23 August 2004 6 of 31 PNX2000 Philips Semiconductors Audio video input processor Table 3: Pins in numerical sequence…continued Pin Symbol Type Description 115 ADAC5_P SA Positive analog reference derived via emitter follower from PNX3000 V_SND pin. 116 ADAC5 OA analog audio output 5 117 ADAC5_N GA Negative analog reference star connected at PNX3000. 118 ADAC6_N GA Negative analog reference star connected at PNX3000. 119 ADAC6 OA analog audio output 6 120 ADAC6_P SA Positive analog reference derived via emitter follower from PNX3000 V_SND pin. 121 ADAC7_P SA Positive analog reference derived via emitter follower from PNX3000 V_SND pin. 122 ADAC7 OA analog audio output 7 123 ADAC7_N GA Negative analog reference star connected at PNX3000. 124 ADAC8_N GA Negative analog reference star connected at PNX3000. 125 ADAC8 OA analog audio output 8 126 ADAC8_P SA Positive analog reference derived via emitter follower from PNX3000 V_SND pin. 127 ADAC9_P SA Positive analog reference derived via emitter follower from PNX3000 V_SND pin. 128 ADAC9 OA analog audio output 9 129 ADAC9_N GA Negative analog reference star connected at PNX3000. 130 ADAC10_N GA Negative analog reference star connected at PNX3000. 131 ADAC10 OA analog audio output 10 132 ADAC10_P SA Positive analog reference derived via emitter follower from PNX3000 V_SND pin. 133 ADAC11_P SA Positive analog reference derived via emitter follower from PNX3000 V_SND pin. 134 ADAC11 OA analog audio output 11 135 ADAC11_N GA Negative analog reference star connected at PNX3000. 136 ADAC12_N GA Negative analog reference star connected at PNX3000. 137 ADAC12 OA analog audio output 12 138 ADAC12_P SA Positive analog reference derived via emitter follower from PNX3000 V_SND pin. 139 VSS - 1.8 V ground 140 VDDM - 1.8 V supply voltage for KSFRAMs and KROMs 141 VDDE - 3.3 V supply voltage 9397 750 13928 Product data © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 03 – 23 August 2004 7 of 31 PNX2000 Philips Semiconductors Audio video input processor Table 3: Pins in numerical sequence…continued Pin Symbol Type Description 142 VSSE - 3.3 V ground 143 VDDE - 3.3 V supply voltage 144 VSSE - 3.3 V ground In the tables that follow, signals of the PNX2000 have been sorted by functional group. For quick reference Table 4 identifies each functional group and associated table. Table 4: Signal groups Functional group Table number I2D-bus Table 5 AUDIO Table 6 I2S-bus Table 7 VIDDEC Table 8 ITU-656 Table 9 JTAG Table 10 I2C-bus Table 11 CLOCK Table 12 GTU Table 13 RESET Table 14 DIGITAL SUPPLY Table 15 ANALOG SUPPLY Table 16 Table 5: I2D pins Symbol Pin Type Description DLINK1DP 2 IA analog differential data link 1 positive termination DLINK1DN 3 IA analog differential data link 1 negative termination DLINK1SP 4 IA analog differential strobe link 1 positive termination DLINK1SN 5 IA analog differential strobe link 1 negative termination DLINK2DP 7 IA analog differential data link 2 positive termination DLINK2DN 8 IA analog differential data link 2 negative termination DLINK2SP 9 IA analog differential strobe link 2 positive termination DLINK2SN 10 IA analog differential strobe link 2 negative termination DLINK3DP 12 IA analog differential data link 3 positive termination DLINK3DN 13 IA analog differential data link 3 negative termination DLINK3SP 14 IA analog differential strobe link 3 positive termination DLINK3SN 15 IA analog differential strobe link 3 negative termination Table 6: Audio pins Symbol Pin Type Description ADAC1 104 OA analog audio output 1 ADAC2 107 OA analog audio output 2 ADAC3 110 OA analog audio output 3 ADAC4 113 OA analog audio output 4 9397 750 13928 Product data © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 03 – 23 August 2004 8 of 31 PNX2000 Philips Semiconductors Audio video input processor Table 6: Audio pins…continued Symbol Pin Type Description ADAC5 116 OA analog audio output 5 ADAC6 119 OA analog audio output 6 ADAC7 122 OA analog audio output 7 ADAC8 125 OA analog audio output 8 ADAC9 128 OA analog audio output 9 ADAC10 131 OA analog audio output 10 ADAC11 134 OA analog audio output 11 ADAC12 137 OA analog audio output 12 ADAC1_P 103 SA Positive analog reference derived via emitter follower from PNX3000 V_SND pin. ADAC1_N 105 GA Negative analog reference star connected at PNX3000. ADAC2_P 108 SA Positive analog reference derived via emitter follower from PNX3000 V_SND pin. ADAC2_N 106 GA Negative analog reference star connected at PNX3000. ADAC3_P 109 SA Positive analog reference derived via emitter follower from PNX3000 V_SND pin. ADAC3_N 111 GA Negative analog reference star connected at PNX3000. ADAC4_P 114 SA Positive analog reference derived via emitter follower from PNX3000 V_SND pin. ADAC4_N 112 GA Negative analog reference star connected at PNX3000. ADAC5_P 115 SA Positive analog reference derived via emitter follower from PNX3000 V_SND pin. ADAC5_N 117 GA Negative analog reference star connected at PNX3000. ADAC6_P 120 SA Positive analog reference derived via emitter follower from PNX3000 V_SND pin. ADAC6_N 118 GA Negative analog reference star connected at PNX3000. ADAC7_P 121 SA Positive analog reference derived via emitter follower from PNX3000 V_SND pin. ADAC7_N 123 GA Negative analog reference star connected at PNX3000. ADAC8_P 126 SA Positive analog reference derived via emitter follower from PNX3000 V_SND pin. ADAC8_N 124 GA Negative analog reference star connected at PNX3000. ADAC9_P 127 SA Positive analog reference derived via emitter follower from PNX3000 V_SND pin. ADAC9_N 129 GA Negative analog reference star connected at PNX3000. ADAC10_P 132 SA Positive analog reference derived via emitter follower from PNX3000 V_SND pin. ADAC10_N 130 GA Negative analog reference star connected at PNX3000. ADAC11_P 133 SA Positive analog reference derived via emitter follower from PNX3000 V_SND pin. ADAC11_N 135 GA Negative analog reference star connected at PNX3000. ADAC12_P 138 SA Positive analog reference derived via emitter follower from PNX3000 V_SND pin. ADAC12_N 136 GA Negative analog reference star connected at PNX3000. 9397 750 13928 Product data © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 03 – 23 August 2004 9 of 31 PNX2000 Philips Semiconductors Audio video input processor Table 7: I2S-bus pins Symbol Pin Type Description I2S_IN_SD1 88 ID I2S-bus data in channel 1; TTL; 5VT I2S_IN_SD2 87 ID I2S-bus data in channel 2; TTL; 5VT I2S_IN_SD3 86 ID I2S-bus data in channel 3; TTL; 5VT I2S_IN_SD4 85 ID I2S-bus data in channel 4; TTL; 5VT I2S_IN_SD5 84 ID I2S-bus data in channel 5; TTL; 5VT I2S_IN_SD6 83 ID I2S-bus data in channel 6; TTL; 5VT I2S_OUT_SD1 77 OD I2S-bus data out channel 1; CMOS I2S_OUT_SD2 76 OD I2S-bus data out channel 2; CMOS I2S_OUT_SD4 75 OD I2S-bus data out channel 4; CMOS I2S_OUT_SD5 74 OD I2S-bus data out channel 5; CMOS I2S_OUT_SD6 73 OD I2S-bus data out channel 6; CMOS I2S_OUT_SD3_SCK 71 OD I2S-bus bit clock channel 3; CMOS I2S_OUT_SD3_WS 70 OD I2S-bus word select channel 3; CMOS I2S_OUT_SD3 69 OD I2S-bus data-out channel 3; CMOS I2S_SCK_SYS 79 IOD I2S-bus system bit clock; TTL-H; CMOS I2S_WS_SYS 78 IOD I2S-bus system word select; TTL-H; CMOS ADAC_CLK 89 OD Used for 128 fs or 256 fs clock output to external audio DAC; CMOS. Table 8: VIDDEC pins Symbol Pin Type HVINFO 20 OD horizontal and vertical sync information to PNX3000; CMOS HSYNCFBL1 18 IA horizontal sync (external); fastblanking signal from SCART HSYNCFBL2 19 IA horizontal sync (external); fastblanking signal from SCART VSYNC1 21 ID vertical sync (external); TTL; 5VT VSYNC2 22 ID vertical sync (external); TTL; 5VT Description Table 9: ITU-656 pins Symbol Pin Type Description DVO_DATA_0 55 OD digital video output state 0; CMOS; Z DVO_DATA_1 56 OD digital video output state 1; CMOS; Z DVO_DATA_2 57 OD digital video output state 2; CMOS; Z DVO_DATA_3 58 OD digital video output state 3; CMOS; Z DVO_DATA_4 60 OD digital video output state 4; CMOS; Z DVO_DATA_5 61 OD digital video output state 5; CMOS; Z DVO_DATA_6 62 OD digital video output state 6; CMOS; Z DVO_DATA_7 63 OD digital video output state 7; CMOS; Z DVO_DATA_8 64 OD digital video output state 8; CMOS; Z DVO_DATA_9 65 OD digital video output state 9; CMOS; Z 9397 750 13928 Product data © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 03 – 23 August 2004 10 of 31 PNX2000 Philips Semiconductors Audio video input processor Table 9: ITU-656 pins…continued Symbol Pin Type Description DVO_VALID 52 OD digital video data valid; CMOS; Z DVO_CLK 51 OD digital video output clock; CMOS; Z LL_CLK 50 ID reserved; TTL; 5VT [1] [1] It is recommended to bias this pad with a 10 kΩ resistor Table 10: JTAG pins Symbol Pin Type Description TDO 93 OD JTAG test data out; CMOS TDI 92 ID JTAG test data in; TTL-H; 5VT TCK 94 ID JTAG test clock; TTL-H; 5VT TRST_N [1] 96 ID JTAG reset (active low); TTL-H; 5VT TMS 95 ID JTAG test mode select; TTL-H; 5VT [1] It is recommended to pull-down TRST_N with a 10 kΩ resistor. This ensures correct reset state of internal TAP circuitry and correct POR of the device within defined state machine. Table 11: I2C-bus pins Symbol Pin Type Description I2C_SDA 27 IOD I2C-bus data; TTL; Z; 5VT I2C_SCL 26 IOD I2C-bus clock; TTL; Z; 5VT I2C_ADR 17 ID I2C-bus address select (internal pull-down); TTL; 5VT Table 12: Clock pins Symbol Pin Type Description MPIFCLK 31 OD 13.5 MHz or 27 MHz to PNX3000; CMOS DCLK 47 OD reserved; CMOS XIN 38 OSCIN crystal oscillator input XOUT 39 OSCOUT crystal oscillator output XGND 40 OSCGND crystal oscillator ground Table 13: GTU pins Symbol Pin Type Description INTOUT 48 OD interrupt line output; Z; 5VT Table 14: Reset pins Symbol Pin Type Description RESET_N 45 IA external reset input RESET_SEL 46 ID selects between using an external reset input or using internal POR; TTL; 5VT HIGH = internal reset LOW = external reset 9397 750 13928 Product data © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 03 – 23 August 2004 11 of 31 PNX2000 Philips Semiconductors Audio video input processor Table 15: Digital supply pins Symbol Pin Type Description VDDE 32,49,66, 82,91, - 3.3 V supply voltage - 3.3 V ground 30,35,53,67, 80,97 - 1.8 V supply voltage 29,36,43, 54,68,81, 98,139 - 1.8 V ground 44,140 - 1.8 V supply voltage for KSFRAMs and KROMs VSSD(I2D) 1 GD I2D digital ground VDDD(I2D) 16 SD I2D digital 1.8 V supply voltage VSS(ADAC) 100 GD audio DAC 1.8 V digital ground VDDD(ADAC) 101 SD audio DAC 1.8 V digital supply voltage VDD3(DTC) 23 SD DTC 3.3 V supply voltage VDDD(DTC) 24 SD DTC 1.8 V supply voltage 141,143 28,41,59, 72,99, VSSE 142,144 VDDI [1] VSS VDDM [1] [1] VDDI and VDDM can be connected to same 1.8 V supply voltage. Table 16: Analog supply pins Symbol Pin Type Description VSSA(I2D) 6 GA I2D analog ground VDDA(I2D) 11 SA I2D analog 1.8 V supply voltage VDDA(PLL) 33 - phase locked loop 1.8 V supply voltage VDDA(ADAC) 102 SA audio DAC 3.3 V supply voltage VSS(DTC) 25 GA DTC analog ground VDDA(XTAL) 37 OSCVDD 1.8 V crystal oscillator supply voltage 7. Functional description 7.1 Overview Table 17 describes the functions of the hardware blocks (see also PNX2000 Block Diagram Figure 1). For more detailed functional description refer to the PNX2000 User Manual. Table 17: Block function Function Block Description High speed data link I2D Receives data in three streams from PNX3000. Video decoder processor VIDDEC Decodes and processes CVBS, YUV or Y/C in YUV stream. Serial interface I2C-bus To access all the internal registers. Global Task Unit GTU Generates all the internal clocks, reset and power management. 9397 750 13928 Product data © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 03 – 23 August 2004 12 of 31 PNX2000 Philips Semiconductors Audio video input processor Table 17: Block function…continued Function Block Description TV sound decoder DEMDEC DSP Demodulation, decoding of terrestrial TV audio standards . Audio processor AUDIO DSP Processing analog and digital audio sources. Data Capture Unit DCU Acquires VBI data (Teletext; CC; VPS) and formats in a stream. Formatter unit ITU-656 Formats YUV, VBI data and CVBS data in ITU-656. Bus Control Unit BCU Bus arbitration among all the internal blocks. 7.2 Interfaces Table 18: Interfaces Interface Description I2C-bus The PNX2000 IC is controlled using an I2C-bus. It performs like an I2C-bus to PI-bus bridge, i.e. translates I2C-bus slave received commands to PI-bus master commands. I2 D Receives data in three streams from PNX3000. I2S-bus Serial digital audio interface (6 stereo inputs, 6 stereo outputs) for connection to other devices that support the I2S-bus standard. Can be used to receive decoded sound from a multi-channel digital audio decoder, provide additional ADCs and DACs, or loop audio signals through an external processor or delay line. ITU-656 Mainly intended to transfer output data stream externally to the PNX8550, but the output data stream could also be readable by other ITU-656 input devices that implement data valid signalling. DACS Digital-analog converters used to generate analog outputs from Sound Core. 7.3 Features in detail 7.3.1 Video • • • • Automatic Gain Control (AGC) to correct amplitude errors at input source. Synchronization identification (used for channel search). Sync processing for 1fH and 2fH video input source. Standard detection of PAL, NTSC or SECAM and various 1fH and 2fH component video input sources. 1fH video • • • • Color decoding (ITU-601) for PAL, NTSC or SECAM input sources. 2D comb filtering. Support for component video sources with sync on CVBS or green. Fastblank insertion of RGB signals onto CVBS input. 2fH video • Support for various progressive and interlaced component video sources. • Synchronization of video sources with sync on Y or external H/V inputs. VBI data capture 9397 750 13928 Product data © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 03 – 23 August 2004 13 of 31 PNX2000 Philips Semiconductors Audio video input processor • Decoding of 525 line standards; WST, WSS, VPS, CC, VITC. • Decoding of 625 line standards; WST, WSS, CC, VITC. ITU-656 output interface • Video and VBI formatting into ITU-style output data stream, compliant to ITU-656/1364 (exception being the use of a data valid signal). • Interfacing to PNX8550 IC. • Support for CVBS/C mode to interface to external picture improvement devices. 7.3.2 Audio Demodulator and decoder • • • • Demodulator and Decoder Easy Programming (DDEP). Auto Standard Detection (ASD). Static Standard Selection (SSS). DQPSK demodulation for different standards, simultaneously with 1-channel FM demodulation. • NICAM decoding (B/G, I, D/K and L standard). • Two-carrier multi-standard FM demodulation (B/G, D/K and M standard). • Decoding for three analog multi-channel systems (A2, A2+ and A2*) and satellite sound. • Adaptive de-emphasis for satellite FM. • Optional AM demodulation for system L, simultaneously with NICAM. • Identification A2 systems (B/G, D/K and M standard) with different identification time constants. • FM pilot carrier present detector. • Monitor selection for FM/AM DC values and signals, with peak and quasi peak detection option. • • • • • • • • BTSC MPX decoding. SAP decoding. dbx® 3 TV noise reduction. Japan (EIAJ) decoding. FM radio decoding. Soft muting for DEMDEC outputs DEC, MONO and SAP. FM over modulation adaptation option to avoid clipping and distortion. Sample Rate Conversion (SRC) for up to three demodulated terrestrial audio signals. Allows processing of SCART and demodulated terrestrial signals. Audio multi-channel decoder • Dolby Pro Logic II™ 3. dbx is a registered trademark of Carillon Electronics Corp. 9397 750 13928 Product data © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 03 – 23 August 2004 14 of 31 PNX2000 Philips Semiconductors Audio video input processor • 6-channel processing for Main Left and Main Right, Subwoofer, Center, Surround Left and Surround Right. Volume and tone control • • • • • • • • • • • • • Automatic Volume Level (AVL) control. Smooth volume control. Master volume control and balance. Soft mute. Loudness. Bass, treble. Dynamic Bass Enhancement (DBE). Dynamic ULTRABASS (DUB). Non-processed subwoofer. 5-band equalizer. Acoustical compensation. Programmable beeper. Noise generation for loudspeaker level trimming. Reflection and delay • Dolby Pro Logic II™ delay. • Pseudo hall/matrix function. Psychoacoustic spatial algorithms, downmix and split • • • • • • Incredible Mono. Incredible Stereo. Virtual Dolby Surround™. Virtual Dolby Digital™. Bass Redirection according to Dolby™ specifications. BBE® Sound Processing 4 Interfaces and switching • • • • • • • • 4. Digital audio input interface (stereo I2S-bus input interface). Digital audio output interface (stereo I2S-bus output interface). Digital crossbar switch for all digital signal sources and destinations. Output crossbar for exchange of channel processing functionality. Voice recognition output interface (stereo I2S-bus output interface). Audio monitoring for level detection. Eight audio DACs for 6-channel loudspeaker outputs and stereo headphones output. Four audio DACs for stereo SCART output and stereo LINE output. BBE is a registered trademark of BBE Sound Inc. See Section 18. 9397 750 13928 Product data © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 03 – 23 August 2004 15 of 31 PNX2000 Philips Semiconductors Audio video input processor • Serial data link interfacing for analog multi-purpose interface PNX3000. 8. Television application Figure 3 shows an overview of the top level hardware architecture of a TV application, using the PNX3000 and PNX2000 as an analog front-end and the PNX8550 as the main processor. This system is aimed at the hybrid (analog or digital) TV market. The main SOC in the system, PNX8550, performs key features for high quality television like video quality enhancement, motion compensation and picture-in-picture processing. PNX2000 together with PNX3000 are used to perform the input decoding of a single stream of analog audio and a single stream of analog video (1fH or 2fH) broadcast signals. PNX2000 performs the following main functions: • • • • • • Color decoding into ITU-601 compatible format (1fH or 2fH). A digital interface to external 3D comb filter. VBI data capture (Teletext, WSS, CC). ITU-656 formatting for communication to PNX8550. Audio demodulation and decoding. Audio processing and D-A conversion. The audio data is transferred between PNX2000 and PNX8550 using I2S-bus. PNX2000 and PNX3000 are controlled from PNX8550 via the I2C-bus. CVBS TUNERS UV1316 UV13361 SCART I2D VIF 21 L/R audio 20 19 20 17 18 15 14 16 13 12 14 11 10 12 21 18 19 16 17 15 13 CVBS Y/C RGB 2 audio I2S-bus 2 PNX2000 audio I S-bus PNX8550 PNX3000 10 6 8 9 (2×) DEFL. CONT. audio I2S-bus (3×) CVBS 1 32-bit DDR 16 Mb 8-bit or 16-bit FLASH ROM 18 Mb 7 4 6 2 4 5 DISPLAY PROCESSOR RGB AMPLIFIER L/R audio 2 11 8 RGB 10 bits (3×) YUV (656) SIF L/R audio 1 3 2 1 status LEVEL ADJUSTMENT REMOTE CONTROL AUDIO AMPLIFIER STANDBY MICROCONTROLLER mce558 LOCAL KEYPAD Fig 3. TV application 9397 750 13928 Product data © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 03 – 23 August 2004 16 of 31 PNX2000 Philips Semiconductors Audio video input processor 9. Limiting values Permanent damage may occur if absolute maximum ratings are exceeded. Prolonged operation at maximum rating may significantly reduce the reliability of the product. Table 19: Absolute maximum ratings Ratings are valid only within operating temperature range unless otherwise specified. All voltages are with respect to VSS unless otherwise stated. Symbol Parameter Min Max Unit VDD(core) supply voltage −0.5 +2.5 V VDD(I/O) supply voltage −0.5 +4.6 V −0.5 VDD(I/O) + 0.5 V DC input voltage VI ( [1] [2] and [3]) ( [2] and [3]) VI DC input voltage 5V tolerant I/O pins Ilatchup latch-up current ( [4]) Vesd electrostatic discharge voltage HBM ( [5] and Vesd electrostatic discharge voltage MM Tstg storage temperature [1] Not to exceed 4.6 V. [2] Including voltage on outputs in 3-state mode. ( [6] [7]) and [7]) −0.5 +6 V 100 - mA - ±2 kV - ±200 V −40 +125 °C [3] Only valid when the VDD(I/O) supply voltage is present. [4] Valid for : −(0.5 × VDD) < V < +(1.5 × VDD); Tj < 125 °C. [5] Human Body Model, Ileak < 1 mA. [6] Machine Model 0.5 mH, Ileak < 1 mA. [7] This product includes circuits specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. However, it is suggested that conventional precautions be taken to avoid applying voltages greater than the rated maximum. 10. Characteristics 10.1 Static characteristics Table 20: Static characteristics: power supply pins Tamb = 0 °C to +70 °C to commercial unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit 1.8V Power Supply Pins: VDDI, VDDM, VDDD(I2D), VDDA(I2D), VDDA(PLL), VDDA(XTAL), VDDD(ADAC), VDDD(DTC) VDD(core) supply voltage, 1.8 V supplies - 1.65 1.8 1.95 V IDD(core) supply current, 1.8 V supplies VDD(core) = 1.8 V - 250 - mA 3.3V Power Supply Pins: VDDE, VDD3(DTC), VDDA(ADAC) VDD(3V3) supply voltage, 3.3 V supplies - 3.0 3.3 3.6 V IDD(3V3) supply current, 3.3 V supplies VDD(core) = 3.3 V - 50 - mA 9397 750 13928 Product data © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 03 – 23 August 2004 17 of 31 PNX2000 Philips Semiconductors Audio video input processor Table 21: Static characteristics: digital pins Tamb = 0 °C to +70 °C to commercial unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Vi = 0 - - 1 µA I2S inputs: I2S_IN_SD1-6, I2C Address: I2C_ADR IIL LOW-level input current VI input voltage - 0 - 5.5 V VIH HIGH-level input voltage - 2.0 - - V VIL LOW-level input voltage - - - 0.8 V IPD pull-down current Vi = VDD(I/O) 20 50 75 µA External Sync: VSYNC1, VSYNC2, Reset: RESET_SEL, ITU-656: LL_CLK IIL LOW-level input current Vi = 0 - - 1 µA IIH HIGH-level input current Vi = VDD(I/O) - - 1 µA VI input voltage - 0 - 5.5 V VIH HIGH-level input voltage - 2.0 - - V VIL LOW-level input voltage - - - 0.8 V Vi = VDD(I/O) - - 1 µA Jtag inputs: TDI, TCK, TRST_N, TMS IIH HIGH-level input current VI input voltage - 0 - 5.5 V VIH HIGH-level input voltage - 2.0 - - V VIL LOW-level input voltage - - - 0.8 V Vhys hysteresis voltage - - 0.3 - V IPU pull-up current Vi = 0 −25 −50 −65 µA VDD(I/O) < Vi < 5 V 0 0 0 µA - 5 - pF I2C Pins: I2C_SDA, I2C_SCL CI input capacitance - ILI input leakage current [1] VDD(3V3) = 3.3 V; Tamb = 25 °C 1.37 1.85 2.45 µA IIN(MAX) max. input current [2] at 5 V 8.20 10.7 12.45 µA VI input voltage - 0 - 5 V VIL LOW-level input voltage - - - 0.8 V VIH HIGH-level input voltage - 2.0 - - V VOL LOW-level output voltage - - - 0.4 V IOL LOW-level output current VOL=0.4V - 8.45 - mA ITU-656 Outputs: DVO_DATA_0-9, DVO_VALID, DVO_CLK Ioz 3-state output leakage VO = 0 VO = VDD(I/O) - - 1 µA VI input voltage - 0 - 5.5 V VOH HIGH-level output voltage IOH = −4 mA 2.4 - - V VOL LOW-level output voltage IOL = 4 mA - - 0.4 V IOH HIGH-level output current VOH = 2.4 −4 - - mA IOL LOW-level output current VOL = 0.4 V 4 - - mA IOH HIGH-level short circuit current VOH = 0 - - −45 mA IOL LOW-level short circuit current VOL = VDD(I/O) - - 50 mA I2S I/O: I2S_SCK_SYS, I2S_WS_SYS 9397 750 13928 Product data © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 03 – 23 August 2004 18 of 31 PNX2000 Philips Semiconductors Audio video input processor Table 21: Static characteristics: digital pins…continued Tamb = 0 °C to +70 °C to commercial unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit IIL LOW-level input current Vi = 0 - - 1 µA IIH HIGH-level input current Vi = VDD(I/O) - - 1 µA VI input voltage - 0 - VDD(I/O) V VIH HIGH-level input voltage - 2.0 - - V VIL LOW-level input voltage - - - 0.8 V Vhys hysteresis voltage - - 0.4 - V Ioz 3-state output leakage VO = 0 VO = VDD(I/O) - - 1 µA VOH HIGH-level output voltage IOH = −8 mA 2.4 - - V VOL LOW-level output voltage IOL = 8 mA - - 0.4 V IOH HIGH-level output current VOH = 2.4 −8 - - mA IOL LOW-level output current VOL = 0.4 V 8 - - mA IOH HIGH-level short circuit current VOH = 0 - - −95 mA IOL LOW-level short circuit current VOL = VDD(I/O) - - 95 mA - V I2S Outputs: I2S_OUT_SD1-6, JTAG Output: TDO, PNX3000 Clock: MPIFCLK, Sync Output: HVINFO VOH HIGH-level output voltage IOH = −4 mA 2.4 - VOL LOW-level output voltage IOL = 4 mA - - 0.4 V IOH HIGH-level output current VOH = 2.4 −4 - - mA IOL LOW-level output current VOL = 0.4V 4 - - mA IOH HIGH-level short circuit current VOH = 0 - - −45 mA IOL LOW-level short circuit current VOL = VDD(I/O) - - 50 mA I2S Output: I2S_OUT_SD3_SCK, I2S_OUT_SD3_WS, ADAC_CLK, Clock Output: DCLK VOH HIGH-level output voltage IOH = −8 mA 2.4 - - V VOL LOW-level output voltage IOL = 8 mA - - 0.4 V IOH HIGH-level output current VOH = 2.4 −8 - - mA IOL LOW-level output current VOL = 0.4 V 8 - - mA IOH HIGH-level short circuit current VOH = 0 - - −95 mA IOL LOW-level short circuit current VOL = VDD(I/O) - - 95 mA Interrupt: INTOUT Ioz 3-state output leakage VO = 0 VO = VDD(I/O) - - 1 µA VI input voltage - 0 - 5.5 V VOL LOW-level output voltage IOL = 8 mA - - 0.4 V IOL LOW-level output current VOL = 0.4 V 8 - - mA IOL LOW-level short circuit current VOL = VDD(I/O) - - 140 mA 9397 750 13928 Product data © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 03 – 23 August 2004 19 of 31 PNX2000 Philips Semiconductors Audio video input processor Table 22: Static characteristics: analog pins Tamb = 0 °C to +70 °C to commercial unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit External Sync: HSYNCFBL1, HSYNCFBL2 VIT input threshold dtc_lowth = 0 - 1.65 - V VIT input threshold dtc_lowth = 1 - 0.65 - V Reset: RESET_N Vtrip_high high trip level RESET_SEL = 0 1.0 1.2 1.4 V Vtrip_low low trip level RESET_SEL = 0 0.95 1.1 1.3 V I2D Inputs: DLINK1-3DP, DLINK1-3DN,DLINK1-3SP, DLINK1-3SN Vsens input sensitivity - - 6 - mV Zdiff differential line load impedance across input diff pair - 100 - Ω VDATA(pos) data pos. range - 0 - 300 mV VDATA(neg) data neg. range - 0 - 300 mV VSTROBE(pos) strobe pos. range - 0 - 300 mV VSTROBE(neg) strobe neg. range - 0 - 300 mV Audio DACs: ADAC1-12P, ADAC1-12N VREFP positive reference voltage - 3.0 3.3 3.6 V VREFN negative reference voltage - - 0 - V IREFP positive reference current - - 820 - µA Audio DACs: ADAC1-12 VOUT(rms) output voltage (rms); single-ended, digital i/p level = 0 dBFS - - 1.17 - V ROUT output resistance - 0.7 1.0 1.3 kΩ RL load resistance - 10 - - kΩ 10.2 Dynamic characteristics Table 23: Dynamic characteristics Symbol Parameter Conditions Min Typ Max Unit fclk clock frequency - - 400 - kHz tr rise time 1.5 kΩ ext. pull-up; 160 pF load - 550 - ns tf fall time 1.5 kΩ ext. pull-up; 160 pF load 130 162 245 ns I2C Viddec: HVINFO (slew rate limited) tthl output transition time (H to L) 30 pF load - 10 13.8 ns ttlh output transition time (L to H) 30 pF load - 10 13.8 ns data setup at Rx 40 pF load - - 7.3 ns ITU-656 tsu(DATA) 9397 750 13928 Product data © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 03 – 23 August 2004 20 of 31 PNX2000 Philips Semiconductors Audio video input processor Table 23: Dynamic characteristics…continued Symbol Parameter Conditions Min Typ Max Unit th(DATA) data hold at Rx 40 pF load - - 4.9 ns fs audio sample frequency - 32 48 48 kHz fSCK SCK frequency I2S-bus master mode - 64fs - - fSCK SCK frequency I2S-bus slave mode 32fs 64fs 256fs - DFSCK SCK duty factor I2S-bus master mode 40 50 60 % DFSCK SCK duty factor I2S-bus slave mode 35 - 65 % tRSCK SCK rise / fall time I2S-bus master mode; Cload = 30 pF - - 5 ns tRSCK SCK rise / fall time I2S-bus slave mode; fSCK = 3.072 MHz - - 50 ns td delay time: SCK to WS and SD outputs [2] TSCK = 1/fSCK 0.3 0.5 0.7 TSCK th hold time: SCK to WS and SD inputs - 0 - - ns ts setup time: WS and SD inputs to SCK TSCK = 1/fSCK 0.2 - - TSCK fclock(WORD) word clock frequency - - 13.5 - MHz WL word length - - 44 - bit DR data rate - - 594 - Mbit/s fclock(BIT) bit clock freq. - - 297 - MHz I2S I2D JTAG Clock Reset tlow Time RESET_N should be below Vtrip_high before internal reset = 1. RESET_SEL = 0 - - 11 µs thigh Time RESET_N should be above Vtrip_high before internal reset = 0 (after tpulse). RESET_SEL = 0 - - 2 µs tpulse Time before PNX2000 internal reset = 0 [3]. RESET_SEL = 0 200 - - ns [1] Allowed SCK/WS ratios are 32, 48, 64, 128 and 256 SCK periods per WS period. [2] All timings relative to the rising edge of SCK. [3] See Section 10.4 for waveforms. 9397 750 13928 Product data © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 03 – 23 August 2004 21 of 31 PNX2000 Philips Semiconductors Audio video input processor 10.3 Audio DAC characteristics Table 24: Dynamic characteristics: Audio DAC Tamb = 0 °C to +70 °C for commercial unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Audio DAC Outputs: ADAC1-12 fs audio sample frequency - 32 48 [1] 48 kHz S/N Signal to Noise Ratio, CCIR-2 k weighted outputs muted; reference f = 2 kHz, 0 dBFS - 94 - dB f =1 kHz; 0 dBFS; 22 kHz measurement bandwidth - −77 - dB (THD+N)/S Total Harmonic Distortion + Noise to Signal ratio fres frequency response +/-1 dB <10 - 22.5 kHz αct crosstalk between adjacent DACs f = 1 kHz; 0 dBFS - −90 - dB [1] Allowed audio sample frequencies are 32 kHz, 44.1 kHz and 48 kHz. Default fS in I2S-bus master mode is 48 kHz. The audio DACs are based on a switched-resistor architecture which acts as a controlled voltage divider between the positive and negative references ADACn_P and ADACn_N. Therefore all noise on the reference pins will spread directly to the associated output pin ADACn. Consequently it is important to provide adequate filtering of the reference voltage to allow optimum signal-to-noise performance. Also, the voltage difference between ADACn_P and SDAC_3V3 should be kept to a minimum as any difference will degrade distortion performance. The DACs have an internal resolution of 4 bits, running at a clock frequency of 128 fS, using a noise shaper circuit to shift the quantization noise to out-of-band frequencies. To prevent HF overloading of the circuit that is driven by the DAC outputs, a 3.3 nF capacitor should be used to filter off the HF signal content. Together with the DAC’s nominal output impedance of 1 kΩ, a first order roll-off at approximately 50 kHz will result. One capacitor is required for each DAC output, connected between ADACn and the corresponding ADACn_N. 10.4 Timing 10.4.1 Clock Crystal specification The crystal oscillator can be used with an external crystal, or in bypass mode with external clock signal, see Figure 4. 9397 750 13928 Product data © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 03 – 23 August 2004 22 of 31 PNX2000 Philips Semiconductors Audio video input processor VDDA VSSA pd VDDA xtm XO VSSA pd xtm XO clkout clkout on-chip osc_in osc_out osc_in osc_out n.c. off-chip clock (a) (b) Cx1 Cx2 mce560 Fig 4. Application diagram: (a) slave/test mode, (b) oscillation mode The supported crystal/external clock frequencies are 27 MHz and 13.5 MHz. The crystal oscillator is followed by a selectable divide-by-two frequency divider giving three available clock frequencies, as shown in Table 25. Table 25: Primary clock settings Clock/Crystal Input Divider setting Clock frequency 27 MHz x/1 27 MHz 27 MHz x/2 13.5 MHz 13.5 MHz x/1 13.5 MHz 13.5 MHz x/2 6.75 MHz The crystal specification is: • • • • • Package: surface mount. Accuracy: (±50 ppm). Temperature: (±50 ppm). Operating temperature range: −20 to +70 oC. Load capacitance: 30 pF. Table 26: Crystal parameters Oscillator Crystal load Max.crystal series External load frequency (fc) capacitance (CL) resistance (RS) capacitors (Cx1; Cx2) 10 pF < 600 Ω 2 x 18 pF 20 pF < 255 Ω 2 x 38 pF 30 pF < 140 Ω 2 x 58 pF 10 pF < 130 Ω 2 x 18 pF 20 pF < 50 Ω 38 pF; 18 pF 30 pF n.a. n.a. 13.5 MHz 27 MHz 9397 750 13928 Product data © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 03 – 23 August 2004 23 of 31 PNX2000 Philips Semiconductors Audio video input processor 10.4.2 Reset long external reset produces internal reset short spike ignored RESET_N tpulse tlow internal reset thigh mce561 RESET_N pin and internal reset timing Fig 5. PNX2000 reset 10.4.3 ITU-656 DVO_CLK DVO_DATA[9:0] DVO_VALID tsu(DATA) th(DATA) mce562 Fig 6. Timing ITU interface 9397 750 13928 Product data © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 03 – 23 August 2004 24 of 31 PNX2000 Philips Semiconductors Audio video input processor 11. Glossary AGC................. Automatic Gain Control SSOP...............Shrink Small Outline Package ASD ................. Auto Standard Detection SOC .................System On Chip AVL.................. Auto Volume Level VBI...................Vertical Blanking Interval BCU................. Bus Control Unit VIDDEC ...........Video front-end Decoder BTSC............... Broadcast TV System Committee VITC.................Vertical Interval Time Code DBE ................. Dynamic Base Enhancement VPS..................Video Program System DCU................. Data Capture Unit WSS.................Wide Screen Signaling DDEP .............. Demodulator and Decoder Easy Programming WST.................World System Teletext DEMDEC ......... Demodulator Decoder DQPSK............ Differential Quadrature Phase Shift Keying DSP ................. Digital Signal Processor DUB................. Dynamic UltraBass DVD ................. Digital Video Disc EIAJ ................ Electronic Industries Association of Japan GTU ................. Global Task Unit HBM ................ Human Body Model LQFP ............... Low profile Quad Flat Package MM .................. Machine Model MPX................. Multiplexer NICAM............. Near Instantaneous Compounded Audio Multiplex NTSC............... National TV Systems Committee PAL.................. Phase Alternate Line SAP ................. Secondary Audio Program SCART ............ Syndicate for Constructors of Apparatus for Radio and Television SECAM ........... Sequential Color and Memory SMD ................ Surface Mount Device SRC ................. Sample Rate Conversion SSS ................. Static Standard Selection 9397 750 13928 Product data © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 03 – 23 August 2004 25 of 31 PNX2000 Philips Semiconductors Audio video input processor 12. Package outline LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm SOT486-1 c y X A 73 72 108 109 ZE e E HE A A2 (A 3) A1 θ wM Lp bp L pin 1 index detail X 37 144 1 36 v M A ZD wM bp e D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e mm 1.6 0.15 0.05 1.45 1.35 0.25 0.27 0.17 0.20 0.09 20.1 19.9 20.1 19.9 0.5 HD HE 22.15 22.15 21.85 21.85 L Lp v w y 1 0.75 0.45 0.2 0.08 0.08 Z D(1) Z E(1) 1.4 1.1 1.4 1.1 θ o 7 o 0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT486-1 136E23 MS-026 JEITA EUROPEAN PROJECTION ISSUE DATE 00-03-14 03-02-20 Fig 7. LQFP package outline 9397 750 13928 Product data © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 03 – 23 August 2004 26 of 31 PNX2000 Philips Semiconductors Audio video input processor 13. Soldering 13.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. In these situations reflow soldering is recommended. 13.2 Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 270 °C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: • below 220 °C (SnPb process) or below 245 °C (Pb-free process) — for all BGA and SSOP-T packages — for packages with a thickness ≥ 2.5 mm — for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called thick/large packages. • below 235 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. 13.3 Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. • For packages with leads on two sides and a pitch (e): 9397 750 13928 Product data © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 03 – 23 August 2004 27 of 31 PNX2000 Philips Semiconductors Audio video input processor — larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; — smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 13.4 Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. 13.5 Package related soldering information Table 27: Suitability of surface mount IC packages for wave and reflow soldering methods Package [1] Soldering method Reflow [2] Wave BGA, LBGA, LFBGA, SQFP, SSOP-T [3], TFBGA, not suitable VFBGA suitable DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, not suitable [4] HTQFP, HTSSOP, HVQFN, HVSON, SMS suitable PLCC [5], SO, SOJ suitable suitable LQFP, QFP, TQFP not recommended [5] [6] suitable SSOP, TSSOP, VSO, VSSOP not PMFP [8] not suitable suitable not suitable [1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. [2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. 9397 750 13928 Product data recommended [7] © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 03 – 23 August 2004 28 of 31 PNX2000 Philips Semiconductors Audio video input processor [3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. [5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. [6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. [7] Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. [8] Hot bar or manual soldering is suitable for PMFP packages. 14. Revision history Table 28: Revision history Rev Date CPCN Description 03 20040823 Minor revision (9397 750 13928) 02 20040712 Upgraded to Product data (9397 750 13591). Table 3 and Table 4 added. 01 20040504 Preliminary data (9397 750 12066) 9397 750 13928 Product data © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 03 – 23 August 2004 29 of 31 PNX2000 Philips Semiconductors Audio video input processor 15. Data sheet status Level Data sheet status [1] Product status [2] [3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production [1] Consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 18. Licenses 16. Definitions Purchase of Philips I2C components Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011. Short-form specification – The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition – Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information – Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Dolby Laboratories ‘Dolby’ and ‘Pro Logic’ are trademarks of Dolby Laboratories, San Francisco, USA. Products are available to licensees of Dolby Laboratories Licensing Corp., 100 Potrero Avenue, San Francisco, CA, 94103, USA. Tel: 1-415-558-0200, Fax: 1-415-863-1373. Supply of this implementation of Dolby Technology does not convey a license, nor imply a right under any patent to use this implementation in any final product. A license for such use is required from Dolby Laboratories. BBE Sound 17. Disclaimers BBE is a registered trademark of BBE Sound Inc., 5381 Production Drive, Huntington Beach, CA, 92649, USA. The use of BBE needs licensing from BBE Sound Inc. Tel: 1-714-897-6766, Fax: 1-714-895-6728. Life support – These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. dbx - TV noise reduction Right to make changes – Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these A Set-Maker License is required for use of this product under one (or more) of the following patents: US4,539,526; 5,796,842; 6,118,879 and U.S. Patent Application 09/638245 . For further information contact THAT Corporation, 45 Sumner Street, Milford, Massachusetts 01757-1656, USA. Tel: 1-508-478-9200, FAX: 1-508-478-0990 19. Trademarks Nexperia – is a trademark of Koninklijke Philips Electronics N.V. Dolby Pro Logic,Virtual Dolby Digital and Virtual Dolby Surround – are trademarks of Dolby Laboratories |nc. BBE – is a registered trademark of BBE Sound Inc. dbx – is a registered trademark of Carillon Electronics Corp. 20. Contact information For additional information, please visit http://www.semiconductors.philips.com For sales office addresses, send an email to: [email protected] 9397 750 13928 Product data © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 03 – 23 August 2004 30 of 31 PNX2000 Philips Semiconductors Audio video input processor 21. Contents 1 2 3 4 5 6 6.1 6.1.1 7 7.1 7.2 7.3 7.3.1 7.3.2 8 9 10 10.1 10.2 10.3 10.4 10.4.1 10.4.2 10.4.3 11 12 13 13.1 13.2 13.3 13.4 13.5 14 15 16 17 18 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . 12 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Features in detail . . . . . . . . . . . . . . . . . . . . . . 13 Video . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Audio. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Television application . . . . . . . . . . . . . . . . . . . 16 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 17 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 17 Static characteristics. . . . . . . . . . . . . . . . . . . . 17 Dynamic characteristics . . . . . . . . . . . . . . . . . 20 Audio DAC characteristics . . . . . . . . . . . . . . . 22 Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Clock. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 ITU-656. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 26 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 27 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 27 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 28 Package related soldering information . . . . . . 28 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 29 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 30 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Contact information . . . . . . . . . . . . . . . . . . . . 30 © Koninklijke Philips Electronics N.V. 2004 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 23 August 2004 Document order number: 9397 750 13928 Published in Netherlands