PHILIPS TDA8777HL/14/C1

TDA8777
Triple 10-bit video DAC, up to 330 MHz sample frequency
Rev. 03 — 15 August 2005
Preliminary data sheet
1. General description
The TDA8777 consists of three separate 10-bit video Digital-to-Analog Converters (DACs)
with complementary outputs. They convert the digital input signals into analog current
outputs at a maximum conversion rate of 330 MHz.
The DACs are based on current source architecture.
A sync pulse can be added to the green signal (sync-on-green) to allow devices driven by
the video DAC to be synchronized.
The TDA8777 has a Power-down mode to reduce power consumption during inactive
periods.
The TDA8777 is fabricated in a CMOS process that ensures high functionality with low
power dissipation.
2. Features
■
■
■
■
■
■
■
■
■
■
■
Triple 10-bit DAC
Sampling frequency up to 330 MHz
Internal voltage reference (1.21 V)
Complementary outputs
Direct drive of double terminated 75 Ω load into standard level
TTL compatible input
Sync and blank control inputs
Analog output current source
Power-down mode
3.3 V power supply
LQFP48 package
3. Applications
■
■
■
■
PC video cards
High resolution image processing
Digital video systems
General purpose high-speed digital-to-analog conversion
TDA8777
Philips Semiconductors
Triple 10-bit video DAC, up to 330 MHz sample frequency
4. Quick reference data
Table 1:
Quick reference data
Symbol
Parameter
VDDA
Conditions
Min
Typ
Max
Unit
analog supply voltage
3.0
3.3
3.6
V
IDDA
analog supply current
-
90
-
mA
INL
integral non-linearity
−2
-
+2
LSB
DNL
differential non-linearity
−1
-
+1
LSB
fCLK
clock frequency
TDA8777HL/14/C1
-
-
140
MHz
TDA8777HL/24/C1
-
-
240
MHz
TDA8777HL/33/C1
-
-
330
MHz
Ptot
total power dissipation
-
297
-
mW
Ipd
current in Power-down mode
-
20
-
mA
5. Ordering information
Table 2:
Ordering information
Type number
TDA8777HL/14/C1
TDA8777HL/24/C1
Package
Description
Version
LQFP48
plastic low profile quad flat package;
48 leads; body 7 × 7 × 1.4 mm
SOT313-2 140 MHz
TDA8777HL/33/C1
240 MHz
330 MHz
TDA8777_3
Preliminary data sheet
Sampling
frequency
Name
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 15 August 2005
2 of 18
TDA8777
Philips Semiconductors
Triple 10-bit video DAC, up to 330 MHz sample frequency
6. Block diagram
VDDA3
30
VDDA2
29
VDDA1
13
VSSA2
VSSA1
PSAVE
26
25
38
RSET
COMP
37
35
36
TDA8777
POR
Vref + Iref
48-39
red digital
inputs
(bits R9 to R0)
10
Iref
34
10
10
VREF
CURRENT/VOLTAGE REFERENCE
10-BIT DAC
33
OUTR
OUTR
Vref + Iref
green digital
inputs
(bits G9 to G0)
10-1
10
TRIPLE
MULTIPLEXER
10
32
BLANKING 10
INSERT
SYNC
INSERT
10-BIT DAC
31
OUTG
OUTG
Vref + Iref
23-14
blue digital
inputs
(bits B9 to B0)
10
10
28
10
10-BIT DAC
27
OUTB
OUTB
sync
DAC CONTROL MODULE
24
CLK
11
12
BLANK
SYNC
mle290
Fig 1. Block diagram
TDA8777_3
Preliminary data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 15 August 2005
3 of 18
TDA8777
Philips Semiconductors
Triple 10-bit video DAC, up to 330 MHz sample frequency
7. Pinning information
37 RSET
38 PSAVE
39 R0
40 R1
41 R2
42 R3
43 R4
44 R5
45 R6
46 R7
47 R8
48 R9
7.1 Pinning
G0
1
36 VREF
G1
2
35 COMP
G2
3
34 OUTR
G3
4
33 OUTR
G4
5
32 OUTG
G5
6
G6
7
G7
8
30 VDDA3
29 VDDA2
G8
31 OUTG
TDA8777HL
9
28 OUTB
G9 10
27 OUTB
BLANK 11
26 VSSA2
25 VSSA1
CLK 24
B9 23
B8 22
B7 21
B6 20
B5 19
B4 18
B3 17
B2 16
B1 15
B0 14
VDDA1 13
SYNC 12
001aad432
Fig 2. Pin configuration
7.2 Pin description
Table 3:
Pin description
Symbol
Pin
Description
G0
1
green digital input data; bit 0 (LSB)
G1
2
green digital input data; bit 1
G2
3
green digital input data; bit 2
G3
4
green digital input data; bit 3
G4
5
green digital input data; bit 4
G5
6
green digital input data; bit 5
G6
7
green digital input data; bit 6
G7
8
green digital input data; bit 7
G8
9
green digital input data; bit 8
G9
10
green digital input data; bit 9 (MSB)
BLANK
11
composite blank control input (active LOW)
SYNC
12
composite sync control input; for green channel only (active LOW)
VDDA1
13
analog supply voltage 1
B0
14
blue digital input data; bit 0 (LSB)
B1
15
blue digital input data; bit 1
B2
16
blue digital input data; bit 2
TDA8777_3
Preliminary data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 15 August 2005
4 of 18
TDA8777
Philips Semiconductors
Triple 10-bit video DAC, up to 330 MHz sample frequency
Table 3:
Pin description …continued
Symbol
Pin
Description
B3
17
blue digital input data; bit 3
B4
18
blue digital input data; bit 4
B5
19
blue digital input data; bit 5
B6
20
blue digital input data; bit 6
B7
21
blue digital input data; bit 7
B8
22
blue digital input data; bit 8
B9
23
blue digital input data; bit 9 (MSB)
CLK
24
clock input
VSSA1
25
analog supply ground 1
VSSA2
26
analog supply ground 2
OUTB
27
complementary blue current analog output
OUTB
28
blue current analog output
VDDA2
29
analog supply voltage 2
VDDA3
30
analog supply voltage 3
OUTG
31
complementary green current analog output
OUTG
32
green current analog output
OUTR
33
complementary red current analog output
OUTR
34
red current analog output
COMP
35
compliance voltage output
VREF
36
voltage reference input
RSET
37
full-scale current control resistor pin
PSAVE
38
power-save control input (active LOW)
R0
39
red digital input data; bit 0 (LSB)
R1
40
red digital input data; bit 1
R2
41
red digital input data; bit 2
R3
42
red digital input data; bit 3
R4
43
red digital input data; bit 4
R5
44
red digital input data; bit 5
R6
45
red digital input data; bit 6
R7
46
red digital input data; bit 7
R8
47
red digital input data; bit 8
R9
48
red digital input data; bit 9 (MSB)
8. Functional description
This triple 10-bit video DAC is designed to convert digital input signals into analog output
currents. All inputs (clock, data, blank and sync) must be TLL levels.
8.1 Voltage reference
The voltage reference input to pin VREF should be 1.21 V. For correct operation, a 100 nF
capacitor should be connected between pin VREF and pin VDDA.
TDA8777_3
Preliminary data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 15 August 2005
5 of 18
TDA8777
Philips Semiconductors
Triple 10-bit video DAC, up to 330 MHz sample frequency
An external reference resistor must be connected between pin RSET and analog ground.
This resistor sets the reference current which determines the analog output level, and is
specified to be 560 Ω. This value allows a 1 V (p-p) output (video plus sync) into a 37.5 Ω
load, such as a double-terminated 75 Ω coaxial cable.
8.2 Blanking and sync pulse insertion
The video signal (see Figure 3) is comprised of the following three parts:
• The video information: defined by the 10 bits used to drive the DAC; nominal signal
amplitude = 700 mV (p-p)
• The sync pulse: a horizontal synchronization (hsync) pulse indicates the end of a
video line and the start of the next video line; sync nominal amplitude = 300 mV; sync
is added to the video signal output via the SYNC input (active LOW)
• The blanking period: allows interface-free detection of both sync and video, blanking
is allocated either side of the sync pulse; the blank level is equal to the video black
level; blanking is added to the video signal output via the BLANK input (active LOW).
The values of SYNC and BLANK are latched on the rising edge of the clock signal. When
no sync and no blank are applied, the DAC can be used continuously. This is the so-called
generic mode.
Because the signal delay in the DAC is 1.5 times the clock period, the sync and blank are
also delayed by 1.5 times the clock period.
blanking period
0.7 V
video information
sync pulse
0.3 V
mle291
Fig 3. Video signal sync pulse and blanking period
9. Limiting values
Table 4:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDDA
analog supply voltage
referred to VSSA1
−0.5
+6.5
V
Vn
voltage on digital input pins
referred to VSSA2
−0.5
+5.5
V
Tstg
storage temperature
−55
+150
°C
Tamb
ambient temperature
0
70
°C
Tj
junction temperature
−40
+125
°C
TDA8777_3
Preliminary data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 15 August 2005
6 of 18
TDA8777
Philips Semiconductors
Triple 10-bit video DAC, up to 330 MHz sample frequency
10. Thermal characteristics
Table 5:
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
Rth(j-a)
thermal resistance from junction to ambient
in free air for SOT313-2
88
K/W
11. Characteristics
Table 6:
Characteristics
Typical values measured at VDDA = 3.3 V; RRSET = 560 Ω; Tamb = 25 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supplies
VDDA
analog supply voltage
3.0
3.3
3.6
V
IDDA
analog supply current
-
90
-
mA
Ptot
total power dissipation
-
297
-
mW
Ipd
current in Power-down mode
-
20
-
mA
VIL
LOW-level input voltage
-
-
0.8
V
VIH
HIGH-level input voltage
2.0
-
-
V
IIL
LOW-level input current
-
-
80
µA
IIH
HIGH-level input current
-
-
120
µA
CIN
input capacitance
-
<tbd>
-
pF
Inputs
Band gap reference
VDDA
analog supply voltage
3.0
3.3
3.6
V
IDDA
analog supply current
-
2.7
-
mA
VVREF
reference voltage input
-
1.21
-
V
RRSET
resistor for reference current
-
560
-
Ω
Digital-to-analog converter
RESDAC
DAC resolution
-
-
10
bits
∆Io(DAC)
DAC to DAC output current
matching
-
-
4
%
INL
integral non-linearity
−2
-
+2
LSB
DNL
differential non-linearity
−1
-
+1
LSB
DACCT
DAC to DAC crosstalk
-
<tbd>
-
dB
THD
total harmonic distortion
fOUT = 1 MHz
-
60
-
dB
fOUT = 2.2 MHz
-
60
-
dB
fOUT = 4.7 MHz
-
60
-
dB
fOUT = 12 MHz
-
59
-
dB
fOUT = 22 MHz
-
58
-
dB
fOUT = 39 MHz
-
57
-
dB
fCLK = 140 MHz
TDA8777_3
Preliminary data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 15 August 2005
7 of 18
TDA8777
Philips Semiconductors
Triple 10-bit video DAC, up to 330 MHz sample frequency
Table 6:
Characteristics …continued
Typical values measured at VDDA = 3.3 V; RRSET = 560 Ω; Tamb = 25 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
THD
total harmonic distortion
fCLK = 240 MHz
fOUT = 1 MHz
-
60
-
dB
fOUT = 2.2 MHz
-
60
-
dB
fOUT = 4.7 MHz
-
60
-
dB
fOUT = 12 MHz
-
60
-
dB
fOUT = 22 MHz
-
54
-
dB
fOUT = 39 MHz
-
51
-
dB
fOUT = 1 MHz
-
60
-
dB
fOUT = 2.2 MHz
-
60
-
dB
fOUT = 4.7 MHz
-
60
-
dB
fOUT = 12 MHz
-
60
-
dB
fOUT = 22 MHz
-
52
-
dB
fOUT = 39 MHz
-
43
-
dB
fOUT = 1 MHz
-
62
-
dB
fOUT = 2.2 MHz
-
62
-
dB
fOUT = 4.7 MHz
-
63
-
dB
fOUT = 12 MHz
-
63
-
dB
fOUT = 22 MHz
-
61
-
dB
fOUT = 39 MHz
-
61
-
dB
fOUT = 1 MHz
-
61
-
dB
fOUT = 2.2 MHz
-
61
-
dB
fOUT = 4.7 MHz
-
63
-
dB
fOUT = 12 MHz
-
56
-
dB
fOUT = 22 MHz
-
58
-
dB
fOUT = 39 MHz
-
52
-
dB
fOUT = 1 MHz
-
59
-
dB
fOUT = 2.2 MHz
-
59
-
dB
fOUT = 4.7 MHz
-
54
-
dB
fOUT = 12 MHz
-
53
-
dB
fOUT = 22 MHz
-
54
-
dB
fOUT = 39 MHz
-
47
-
dB
fCLK = 330 MHz
SFDR
spurious-free dynamic range to
Nyquist limit
fCLK = 140 MHz
fCLK = 240 MHz
fCLK = 330 MHz
Outputs
VO(compl)
output voltage compliance
0
-
1.4
V
ZOUT
output impedance
-
<tbd>
-
kΩ
COUT
output capacitance
-
<tbd>
-
pF
TDA8777_3
Preliminary data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 15 August 2005
8 of 18
TDA8777
Philips Semiconductors
Triple 10-bit video DAC, up to 330 MHz sample frequency
Table 6:
Characteristics …continued
Typical values measured at VDDA = 3.3 V; RRSET = 560 Ω; Tamb = 25 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
TDA8777HL/14/C1
-
-
140
MHz
TDA8777HL/24/C1
-
-
240
MHz
TDA8777HL/33/C1
-
-
330
MHz
in clock cycles
2.5
2.5
2.5
Timing
fCLK
clock frequency
td(p)
pipeline delay
tsu(i)
input setup time
see Figure 4
0.15
-
-
ns
th(i)
input hold time
see Figure 4
0
-
-
ns
td(o)
output delay time
see Figure 4
-
3.75
-
ns
CLK
th(i)
Digital inputs
(R9 to R0, G9 to G0,
B9 to B0, SYNC,
BLANK)
DATA
tsu(i)
td(o)
Analog outputs
(OUTB, OUTB,
OUTG, OUTG
OUTR, OUTR)
001aaa892
Output delay (td(o)) is measured from the 50 % point of the rising edge of CLK to the 50 % point of full-scale transition.
Fig 4. Timing diagram digital inputs and analog outputs
TDA8777_3
Preliminary data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 15 August 2005
9 of 18
TDA8777
Philips Semiconductors
Triple 10-bit video DAC, up to 330 MHz sample frequency
12. Application information
001aad345
0
THD
(dB)
001aad347
0
THD
(dB)
−20
−20
−40
−40
−60
−60
−80
1
102
10
−80
1
fOUT (MHz)
Sampling frequency = 140 MHz.
Sampling frequency = 240 MHz.
Fig 5. THD as a function of fOUT, typical values
001aad348
0
102
10
fOUT (MHz)
THD
(dB)
Fig 6. THD as a function of fOUT, typical values
001aad427
0
SFDR
(dB)
−20
−20
−40
−40
−60
−60
−80
1
102
10
−80
1
fOUT (MHz)
fOUT (MHz)
Sampling frequency = 330 MHz.
Sampling frequency = 140 MHz.
Fig 7. THD as a function of fOUT, typical values
Fig 8. SFDR as a function of fOUT, typical values
TDA8777_3
Preliminary data sheet
102
10
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 15 August 2005
10 of 18
TDA8777
Philips Semiconductors
Triple 10-bit video DAC, up to 330 MHz sample frequency
001aad428
0
001aad429
0
SFDR
(dB)
SFDR
(dB)
−20
−20
−40
−40
−60
−60
−80
1
−80
102
10
1
102
10
fOUT (MHz)
fOUT (MHz)
Sampling frequency = 240 MHz
Sampling frequency = 330 MHz.
Fig 9. SFDR as a function of fOUT, typical values.
Fig 10. SFDR as a function of fOUT, typical values
48
SYNC
RSET
PSAVE
R0
R1
R2
R3
R4
R5
R6
R7
VDDA
37
1
36
2
35
3
34
4
33
5
32
6
31
TDA8777
7
30
8
29
9
28
10
27
11
26
12
25
VDDA1
13
14
15
16
17
18
19
20
21
22
23
VREF
COMP
0.1 µF
OUTR
OUTR
OUTG
OUTG
VDDA3
VDDA2
OUTB
OUTB
VSSA2
VSSA1
24
CLK
BLANK
38
B9
G9
39
B8
G8
40
B7
G7
41
B6
G6
42
B5
G5
43
B4
G4
44
B3
G3
45
B2
G2
46
B1
G1
47
B0
G0
R8
R9
560 Ω
001aaa890
VDDA
Fig 11. Application diagram
TDA8777_3
Preliminary data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 15 August 2005
11 of 18
TDA8777
Philips Semiconductors
Triple 10-bit video DAC, up to 330 MHz sample frequency
13. Package outline
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm
SOT313-2
c
y
X
36
25
A
37
24
ZE
e
E HE
A A2
(A 3)
A1
w M
θ
bp
pin 1 index
Lp
L
13
48
1
detail X
12
ZD
e
v M A
w M
bp
D
B
HD
v M B
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HD
HE
L
Lp
v
w
y
mm
1.6
0.20
0.05
1.45
1.35
0.25
0.27
0.17
0.18
0.12
7.1
6.9
7.1
6.9
0.5
9.15
8.85
9.15
8.85
1
0.75
0.45
0.2
0.12
0.1
Z D (1) Z E (1)
θ
0.95
0.55
7
o
0
0.95
0.55
o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT313-2
136E05
MS-026
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
00-01-19
03-02-25
Fig 12. Package outline SOT313-2 (LQFP48)
TDA8777_3
Preliminary data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 15 August 2005
12 of 18
TDA8777
Philips Semiconductors
Triple 10-bit video DAC, up to 330 MHz sample frequency
14. Soldering
14.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
14.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 °C to 270 °C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
• below 225 °C (SnPb process) or below 245 °C (Pb-free process)
– for all BGA, HTSSON..T and SSOP..T packages
– for packages with a thickness ≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called
thick/large packages.
• below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
14.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
• Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
TDA8777_3
Preliminary data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 15 August 2005
13 of 18
TDA8777
Philips Semiconductors
Triple 10-bit video DAC, up to 330 MHz sample frequency
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
• For packages with leads on four sides, the footprint must be placed at a 45° angle to
the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C
or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.
14.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270 °C and 320 °C.
14.5 Package related soldering information
Table 7:
Suitability of surface mount IC packages for wave and reflow soldering methods
Package [1]
Soldering method
Wave
Reflow [2]
BGA, HTSSON..T [3], LBGA, LFBGA, SQFP,
SSOP..T [3], TFBGA, VFBGA, XSON
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
not suitable [4]
suitable
PLCC [5], SO, SOJ
suitable
suitable
not
recommended [5] [6]
suitable
SSOP, TSSOP, VSO, VSSOP
not
recommended [7]
suitable
CWQCCN..L [8], PMFP [9], WQCCN..L [8]
not suitable
LQFP, QFP, TQFP
[1]
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026);
order a copy from your Philips Semiconductors sales office.
[2]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods.
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
TDA8777_3
Preliminary data sheet
not suitable
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 15 August 2005
14 of 18
TDA8777
Philips Semiconductors
Triple 10-bit video DAC, up to 330 MHz sample frequency
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
TDA8777_3
Preliminary data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 15 August 2005
15 of 18
TDA8777
Philips Semiconductors
Triple 10-bit video DAC, up to 330 MHz sample frequency
15. Revision history
Table 8:
Revision history
Document ID
Release date
Data sheet status
Change notice
Doc. number
Supersedes
TDA8777_3
20050815
Preliminary data sheet
-
-
TDA8777_2
Modifications:
•
The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors.
•
•
•
•
Status changed to Preliminary data sheet.
Characteristics table revised, SPDR and THD data added, see Table 6.
Figure 4 corrected.
Figure 5 through to Figure 10 added.
TDA8777_2
20040517
Objective specification
-
-
TDA8777_1
TDA8777_1
20040108
Objective specification
-
-
-
TDA8777_3
Preliminary data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 15 August 2005
16 of 18
TDA8777
Philips Semiconductors
Triple 10-bit video DAC, up to 330 MHz sample frequency
16. Data sheet status
Level
Data sheet status [1]
Product status [2] [3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
[2]
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
17. Definitions
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
19. Trademarks
18. Disclaimers
Notice — All referenced brands, product names, service names and
trademarks are the property of their respective owners.
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
20. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: [email protected]
TDA8777_3
Preliminary data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 15 August 2005
17 of 18
TDA8777
Philips Semiconductors
Triple 10-bit video DAC, up to 330 MHz sample frequency
21. Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
9
10
11
12
13
14
14.1
14.2
14.3
14.4
14.5
15
16
17
18
19
20
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Voltage reference . . . . . . . . . . . . . . . . . . . . . . . 5
Blanking and sync pulse insertion . . . . . . . . . . 6
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Thermal characteristics. . . . . . . . . . . . . . . . . . . 7
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Application information. . . . . . . . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 13
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 13
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 14
Package related soldering information . . . . . . 14
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 17
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Contact information . . . . . . . . . . . . . . . . . . . . 17
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 15 August 2005
Document number: TDA8777_3
Published in The Netherlands