TDA8777 Triple 10-bit video DAC, up to 330 MHz sample frequency Rev. 03 — 15 August 2005 Preliminary data sheet 1. General description The TDA8777 consists of three separate 10-bit video Digital-to-Analog Converters (DACs) with complementary outputs. They convert the digital input signals into analog current outputs at a maximum conversion rate of 330 MHz. The DACs are based on current source architecture. A sync pulse can be added to the green signal (sync-on-green) to allow devices driven by the video DAC to be synchronized. The TDA8777 has a Power-down mode to reduce power consumption during inactive periods. The TDA8777 is fabricated in a CMOS process that ensures high functionality with low power dissipation. 2. Features ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Triple 10-bit DAC Sampling frequency up to 330 MHz Internal voltage reference (1.21 V) Complementary outputs Direct drive of double terminated 75 Ω load into standard level TTL compatible input Sync and blank control inputs Analog output current source Power-down mode 3.3 V power supply LQFP48 package 3. Applications ■ ■ ■ ■ PC video cards High resolution image processing Digital video systems General purpose high-speed digital-to-analog conversion TDA8777 Philips Semiconductors Triple 10-bit video DAC, up to 330 MHz sample frequency 4. Quick reference data Table 1: Quick reference data Symbol Parameter VDDA Conditions Min Typ Max Unit analog supply voltage 3.0 3.3 3.6 V IDDA analog supply current - 90 - mA INL integral non-linearity −2 - +2 LSB DNL differential non-linearity −1 - +1 LSB fCLK clock frequency TDA8777HL/14/C1 - - 140 MHz TDA8777HL/24/C1 - - 240 MHz TDA8777HL/33/C1 - - 330 MHz Ptot total power dissipation - 297 - mW Ipd current in Power-down mode - 20 - mA 5. Ordering information Table 2: Ordering information Type number TDA8777HL/14/C1 TDA8777HL/24/C1 Package Description Version LQFP48 plastic low profile quad flat package; 48 leads; body 7 × 7 × 1.4 mm SOT313-2 140 MHz TDA8777HL/33/C1 240 MHz 330 MHz TDA8777_3 Preliminary data sheet Sampling frequency Name © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 03 — 15 August 2005 2 of 18 TDA8777 Philips Semiconductors Triple 10-bit video DAC, up to 330 MHz sample frequency 6. Block diagram VDDA3 30 VDDA2 29 VDDA1 13 VSSA2 VSSA1 PSAVE 26 25 38 RSET COMP 37 35 36 TDA8777 POR Vref + Iref 48-39 red digital inputs (bits R9 to R0) 10 Iref 34 10 10 VREF CURRENT/VOLTAGE REFERENCE 10-BIT DAC 33 OUTR OUTR Vref + Iref green digital inputs (bits G9 to G0) 10-1 10 TRIPLE MULTIPLEXER 10 32 BLANKING 10 INSERT SYNC INSERT 10-BIT DAC 31 OUTG OUTG Vref + Iref 23-14 blue digital inputs (bits B9 to B0) 10 10 28 10 10-BIT DAC 27 OUTB OUTB sync DAC CONTROL MODULE 24 CLK 11 12 BLANK SYNC mle290 Fig 1. Block diagram TDA8777_3 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 03 — 15 August 2005 3 of 18 TDA8777 Philips Semiconductors Triple 10-bit video DAC, up to 330 MHz sample frequency 7. Pinning information 37 RSET 38 PSAVE 39 R0 40 R1 41 R2 42 R3 43 R4 44 R5 45 R6 46 R7 47 R8 48 R9 7.1 Pinning G0 1 36 VREF G1 2 35 COMP G2 3 34 OUTR G3 4 33 OUTR G4 5 32 OUTG G5 6 G6 7 G7 8 30 VDDA3 29 VDDA2 G8 31 OUTG TDA8777HL 9 28 OUTB G9 10 27 OUTB BLANK 11 26 VSSA2 25 VSSA1 CLK 24 B9 23 B8 22 B7 21 B6 20 B5 19 B4 18 B3 17 B2 16 B1 15 B0 14 VDDA1 13 SYNC 12 001aad432 Fig 2. Pin configuration 7.2 Pin description Table 3: Pin description Symbol Pin Description G0 1 green digital input data; bit 0 (LSB) G1 2 green digital input data; bit 1 G2 3 green digital input data; bit 2 G3 4 green digital input data; bit 3 G4 5 green digital input data; bit 4 G5 6 green digital input data; bit 5 G6 7 green digital input data; bit 6 G7 8 green digital input data; bit 7 G8 9 green digital input data; bit 8 G9 10 green digital input data; bit 9 (MSB) BLANK 11 composite blank control input (active LOW) SYNC 12 composite sync control input; for green channel only (active LOW) VDDA1 13 analog supply voltage 1 B0 14 blue digital input data; bit 0 (LSB) B1 15 blue digital input data; bit 1 B2 16 blue digital input data; bit 2 TDA8777_3 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 03 — 15 August 2005 4 of 18 TDA8777 Philips Semiconductors Triple 10-bit video DAC, up to 330 MHz sample frequency Table 3: Pin description …continued Symbol Pin Description B3 17 blue digital input data; bit 3 B4 18 blue digital input data; bit 4 B5 19 blue digital input data; bit 5 B6 20 blue digital input data; bit 6 B7 21 blue digital input data; bit 7 B8 22 blue digital input data; bit 8 B9 23 blue digital input data; bit 9 (MSB) CLK 24 clock input VSSA1 25 analog supply ground 1 VSSA2 26 analog supply ground 2 OUTB 27 complementary blue current analog output OUTB 28 blue current analog output VDDA2 29 analog supply voltage 2 VDDA3 30 analog supply voltage 3 OUTG 31 complementary green current analog output OUTG 32 green current analog output OUTR 33 complementary red current analog output OUTR 34 red current analog output COMP 35 compliance voltage output VREF 36 voltage reference input RSET 37 full-scale current control resistor pin PSAVE 38 power-save control input (active LOW) R0 39 red digital input data; bit 0 (LSB) R1 40 red digital input data; bit 1 R2 41 red digital input data; bit 2 R3 42 red digital input data; bit 3 R4 43 red digital input data; bit 4 R5 44 red digital input data; bit 5 R6 45 red digital input data; bit 6 R7 46 red digital input data; bit 7 R8 47 red digital input data; bit 8 R9 48 red digital input data; bit 9 (MSB) 8. Functional description This triple 10-bit video DAC is designed to convert digital input signals into analog output currents. All inputs (clock, data, blank and sync) must be TLL levels. 8.1 Voltage reference The voltage reference input to pin VREF should be 1.21 V. For correct operation, a 100 nF capacitor should be connected between pin VREF and pin VDDA. TDA8777_3 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 03 — 15 August 2005 5 of 18 TDA8777 Philips Semiconductors Triple 10-bit video DAC, up to 330 MHz sample frequency An external reference resistor must be connected between pin RSET and analog ground. This resistor sets the reference current which determines the analog output level, and is specified to be 560 Ω. This value allows a 1 V (p-p) output (video plus sync) into a 37.5 Ω load, such as a double-terminated 75 Ω coaxial cable. 8.2 Blanking and sync pulse insertion The video signal (see Figure 3) is comprised of the following three parts: • The video information: defined by the 10 bits used to drive the DAC; nominal signal amplitude = 700 mV (p-p) • The sync pulse: a horizontal synchronization (hsync) pulse indicates the end of a video line and the start of the next video line; sync nominal amplitude = 300 mV; sync is added to the video signal output via the SYNC input (active LOW) • The blanking period: allows interface-free detection of both sync and video, blanking is allocated either side of the sync pulse; the blank level is equal to the video black level; blanking is added to the video signal output via the BLANK input (active LOW). The values of SYNC and BLANK are latched on the rising edge of the clock signal. When no sync and no blank are applied, the DAC can be used continuously. This is the so-called generic mode. Because the signal delay in the DAC is 1.5 times the clock period, the sync and blank are also delayed by 1.5 times the clock period. blanking period 0.7 V video information sync pulse 0.3 V mle291 Fig 3. Video signal sync pulse and blanking period 9. Limiting values Table 4: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDDA analog supply voltage referred to VSSA1 −0.5 +6.5 V Vn voltage on digital input pins referred to VSSA2 −0.5 +5.5 V Tstg storage temperature −55 +150 °C Tamb ambient temperature 0 70 °C Tj junction temperature −40 +125 °C TDA8777_3 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 03 — 15 August 2005 6 of 18 TDA8777 Philips Semiconductors Triple 10-bit video DAC, up to 330 MHz sample frequency 10. Thermal characteristics Table 5: Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-a) thermal resistance from junction to ambient in free air for SOT313-2 88 K/W 11. Characteristics Table 6: Characteristics Typical values measured at VDDA = 3.3 V; RRSET = 560 Ω; Tamb = 25 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Supplies VDDA analog supply voltage 3.0 3.3 3.6 V IDDA analog supply current - 90 - mA Ptot total power dissipation - 297 - mW Ipd current in Power-down mode - 20 - mA VIL LOW-level input voltage - - 0.8 V VIH HIGH-level input voltage 2.0 - - V IIL LOW-level input current - - 80 µA IIH HIGH-level input current - - 120 µA CIN input capacitance - <tbd> - pF Inputs Band gap reference VDDA analog supply voltage 3.0 3.3 3.6 V IDDA analog supply current - 2.7 - mA VVREF reference voltage input - 1.21 - V RRSET resistor for reference current - 560 - Ω Digital-to-analog converter RESDAC DAC resolution - - 10 bits ∆Io(DAC) DAC to DAC output current matching - - 4 % INL integral non-linearity −2 - +2 LSB DNL differential non-linearity −1 - +1 LSB DACCT DAC to DAC crosstalk - <tbd> - dB THD total harmonic distortion fOUT = 1 MHz - 60 - dB fOUT = 2.2 MHz - 60 - dB fOUT = 4.7 MHz - 60 - dB fOUT = 12 MHz - 59 - dB fOUT = 22 MHz - 58 - dB fOUT = 39 MHz - 57 - dB fCLK = 140 MHz TDA8777_3 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 03 — 15 August 2005 7 of 18 TDA8777 Philips Semiconductors Triple 10-bit video DAC, up to 330 MHz sample frequency Table 6: Characteristics …continued Typical values measured at VDDA = 3.3 V; RRSET = 560 Ω; Tamb = 25 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit THD total harmonic distortion fCLK = 240 MHz fOUT = 1 MHz - 60 - dB fOUT = 2.2 MHz - 60 - dB fOUT = 4.7 MHz - 60 - dB fOUT = 12 MHz - 60 - dB fOUT = 22 MHz - 54 - dB fOUT = 39 MHz - 51 - dB fOUT = 1 MHz - 60 - dB fOUT = 2.2 MHz - 60 - dB fOUT = 4.7 MHz - 60 - dB fOUT = 12 MHz - 60 - dB fOUT = 22 MHz - 52 - dB fOUT = 39 MHz - 43 - dB fOUT = 1 MHz - 62 - dB fOUT = 2.2 MHz - 62 - dB fOUT = 4.7 MHz - 63 - dB fOUT = 12 MHz - 63 - dB fOUT = 22 MHz - 61 - dB fOUT = 39 MHz - 61 - dB fOUT = 1 MHz - 61 - dB fOUT = 2.2 MHz - 61 - dB fOUT = 4.7 MHz - 63 - dB fOUT = 12 MHz - 56 - dB fOUT = 22 MHz - 58 - dB fOUT = 39 MHz - 52 - dB fOUT = 1 MHz - 59 - dB fOUT = 2.2 MHz - 59 - dB fOUT = 4.7 MHz - 54 - dB fOUT = 12 MHz - 53 - dB fOUT = 22 MHz - 54 - dB fOUT = 39 MHz - 47 - dB fCLK = 330 MHz SFDR spurious-free dynamic range to Nyquist limit fCLK = 140 MHz fCLK = 240 MHz fCLK = 330 MHz Outputs VO(compl) output voltage compliance 0 - 1.4 V ZOUT output impedance - <tbd> - kΩ COUT output capacitance - <tbd> - pF TDA8777_3 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 03 — 15 August 2005 8 of 18 TDA8777 Philips Semiconductors Triple 10-bit video DAC, up to 330 MHz sample frequency Table 6: Characteristics …continued Typical values measured at VDDA = 3.3 V; RRSET = 560 Ω; Tamb = 25 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit TDA8777HL/14/C1 - - 140 MHz TDA8777HL/24/C1 - - 240 MHz TDA8777HL/33/C1 - - 330 MHz in clock cycles 2.5 2.5 2.5 Timing fCLK clock frequency td(p) pipeline delay tsu(i) input setup time see Figure 4 0.15 - - ns th(i) input hold time see Figure 4 0 - - ns td(o) output delay time see Figure 4 - 3.75 - ns CLK th(i) Digital inputs (R9 to R0, G9 to G0, B9 to B0, SYNC, BLANK) DATA tsu(i) td(o) Analog outputs (OUTB, OUTB, OUTG, OUTG OUTR, OUTR) 001aaa892 Output delay (td(o)) is measured from the 50 % point of the rising edge of CLK to the 50 % point of full-scale transition. Fig 4. Timing diagram digital inputs and analog outputs TDA8777_3 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 03 — 15 August 2005 9 of 18 TDA8777 Philips Semiconductors Triple 10-bit video DAC, up to 330 MHz sample frequency 12. Application information 001aad345 0 THD (dB) 001aad347 0 THD (dB) −20 −20 −40 −40 −60 −60 −80 1 102 10 −80 1 fOUT (MHz) Sampling frequency = 140 MHz. Sampling frequency = 240 MHz. Fig 5. THD as a function of fOUT, typical values 001aad348 0 102 10 fOUT (MHz) THD (dB) Fig 6. THD as a function of fOUT, typical values 001aad427 0 SFDR (dB) −20 −20 −40 −40 −60 −60 −80 1 102 10 −80 1 fOUT (MHz) fOUT (MHz) Sampling frequency = 330 MHz. Sampling frequency = 140 MHz. Fig 7. THD as a function of fOUT, typical values Fig 8. SFDR as a function of fOUT, typical values TDA8777_3 Preliminary data sheet 102 10 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 03 — 15 August 2005 10 of 18 TDA8777 Philips Semiconductors Triple 10-bit video DAC, up to 330 MHz sample frequency 001aad428 0 001aad429 0 SFDR (dB) SFDR (dB) −20 −20 −40 −40 −60 −60 −80 1 −80 102 10 1 102 10 fOUT (MHz) fOUT (MHz) Sampling frequency = 240 MHz Sampling frequency = 330 MHz. Fig 9. SFDR as a function of fOUT, typical values. Fig 10. SFDR as a function of fOUT, typical values 48 SYNC RSET PSAVE R0 R1 R2 R3 R4 R5 R6 R7 VDDA 37 1 36 2 35 3 34 4 33 5 32 6 31 TDA8777 7 30 8 29 9 28 10 27 11 26 12 25 VDDA1 13 14 15 16 17 18 19 20 21 22 23 VREF COMP 0.1 µF OUTR OUTR OUTG OUTG VDDA3 VDDA2 OUTB OUTB VSSA2 VSSA1 24 CLK BLANK 38 B9 G9 39 B8 G8 40 B7 G7 41 B6 G6 42 B5 G5 43 B4 G4 44 B3 G3 45 B2 G2 46 B1 G1 47 B0 G0 R8 R9 560 Ω 001aaa890 VDDA Fig 11. Application diagram TDA8777_3 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 03 — 15 August 2005 11 of 18 TDA8777 Philips Semiconductors Triple 10-bit video DAC, up to 330 MHz sample frequency 13. Package outline LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm SOT313-2 c y X 36 25 A 37 24 ZE e E HE A A2 (A 3) A1 w M θ bp pin 1 index Lp L 13 48 1 detail X 12 ZD e v M A w M bp D B HD v M B 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp v w y mm 1.6 0.20 0.05 1.45 1.35 0.25 0.27 0.17 0.18 0.12 7.1 6.9 7.1 6.9 0.5 9.15 8.85 9.15 8.85 1 0.75 0.45 0.2 0.12 0.1 Z D (1) Z E (1) θ 0.95 0.55 7 o 0 0.95 0.55 o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT313-2 136E05 MS-026 JEITA EUROPEAN PROJECTION ISSUE DATE 00-01-19 03-02-25 Fig 12. Package outline SOT313-2 (LQFP48) TDA8777_3 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 03 — 15 August 2005 12 of 18 TDA8777 Philips Semiconductors Triple 10-bit video DAC, up to 330 MHz sample frequency 14. Soldering 14.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 14.2 Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 °C to 270 °C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: • below 225 °C (SnPb process) or below 245 °C (Pb-free process) – for all BGA, HTSSON..T and SSOP..T packages – for packages with a thickness ≥ 2.5 mm – for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called thick/large packages. • below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. 14.3 Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; TDA8777_3 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 03 — 15 August 2005 13 of 18 TDA8777 Philips Semiconductors Triple 10-bit video DAC, up to 330 MHz sample frequency – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 14.4 Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 °C and 320 °C. 14.5 Package related soldering information Table 7: Suitability of surface mount IC packages for wave and reflow soldering methods Package [1] Soldering method Wave Reflow [2] BGA, HTSSON..T [3], LBGA, LFBGA, SQFP, SSOP..T [3], TFBGA, VFBGA, XSON not suitable suitable DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS not suitable [4] suitable PLCC [5], SO, SOJ suitable suitable not recommended [5] [6] suitable SSOP, TSSOP, VSO, VSSOP not recommended [7] suitable CWQCCN..L [8], PMFP [9], WQCCN..L [8] not suitable LQFP, QFP, TQFP [1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. [2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. [3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. TDA8777_3 Preliminary data sheet not suitable © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 03 — 15 August 2005 14 of 18 TDA8777 Philips Semiconductors Triple 10-bit video DAC, up to 330 MHz sample frequency [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. [5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. [6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. [7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. [8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. [9] Hot bar soldering or manual soldering is suitable for PMFP packages. TDA8777_3 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 03 — 15 August 2005 15 of 18 TDA8777 Philips Semiconductors Triple 10-bit video DAC, up to 330 MHz sample frequency 15. Revision history Table 8: Revision history Document ID Release date Data sheet status Change notice Doc. number Supersedes TDA8777_3 20050815 Preliminary data sheet - - TDA8777_2 Modifications: • The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors. • • • • Status changed to Preliminary data sheet. Characteristics table revised, SPDR and THD data added, see Table 6. Figure 4 corrected. Figure 5 through to Figure 10 added. TDA8777_2 20040517 Objective specification - - TDA8777_1 TDA8777_1 20040108 Objective specification - - - TDA8777_3 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 03 — 15 August 2005 16 of 18 TDA8777 Philips Semiconductors Triple 10-bit video DAC, up to 330 MHz sample frequency 16. Data sheet status Level Data sheet status [1] Product status [2] [3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 17. Definitions customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 19. Trademarks 18. Disclaimers Notice — All referenced brands, product names, service names and trademarks are the property of their respective owners. Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors 20. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: [email protected] TDA8777_3 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Rev. 03 — 15 August 2005 17 of 18 TDA8777 Philips Semiconductors Triple 10-bit video DAC, up to 330 MHz sample frequency 21. Contents 1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 9 10 11 12 13 14 14.1 14.2 14.3 14.4 14.5 15 16 17 18 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Voltage reference . . . . . . . . . . . . . . . . . . . . . . . 5 Blanking and sync pulse insertion . . . . . . . . . . 6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Application information. . . . . . . . . . . . . . . . . . 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 13 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 13 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 14 Package related soldering information . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Contact information . . . . . . . . . . . . . . . . . . . . 17 © Koninklijke Philips Electronics N.V. 2005 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 15 August 2005 Document number: TDA8777_3 Published in The Netherlands