CY8C201A0 CapSense Express™ -10 Configurable IOs with Slider Features Overview ■ The CapSense Express™ controller allows the control of ten IOs configurable as capacitive sensing buttons or as GPIOs for driving LEDs or interrupt signals based on various button conditions. The GPIOs are also configurable for waking up the device from sleep based on an interrupt input. Ten configurable IOs supporting ❐ CapSense slider ❐ LED drive ❐ Interrupt outputs ❐ WAKE on interrupt input ❐ User defined input/output ■ 2.4V to 5.25V operating voltage ■ Industrial temperature range: –40°C to +85°C ■ I2C slave interface for configuration ■ Reduce BOM cost ❐ Internal oscillator - no external oscillators or crystal ❐ Free development tool - no external tuning components ■ Low operating current ❐ Active current: continuous sensor scan - 1.5 mA ❐ Sleep current: no scan, continuous sleep - 2.6 uA ■ Available in 16-pin QFN and 16-pin SOIC packages The user has the ability to configure buttons, outputs, and parameters through specific commands sent to the I2C port. The IOs have the flexibility in mapping to capacitive buttons and as standard GPIO functions such as interrupt output or input, LED drive and digital mapping of input to output using simple logical operations. This enables easy PCB trace routing and reduces the PCB size and stack up. CapSense Express products are designed for easy integration into complex products. Architecture The logic block diagram shows the internal architecture of CY8C201A0. The user is able to configure registers with parameters needed to adjust the operation and sensitivity of the CapSense system. CY8C201A0 supports a standard I²C serial communication interface that allows the host to configure the device and to read sensor information in real time through easy register access. The CapSense Express Core The CapSense Express Core has a powerful configuration and control block. It encompasses SRAM for data storage, an interrupt controller, sleep and watchdog timers. System resources provide additional capability, such as a configurable I2C slave communication interface and various system resets. The Analog System is composed of the CapSense PSoC block and an internal 1.8V analog reference. Cypress Semiconductor Corporation Document Number: 001-17349 Rev. *B • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised February 11, 2008 [+] Feedback CY8C201A0 Logic Block Diagram E x te rn a l V C C 2 .4 -5 .2 5 V 10 Configurable IOs CapSense ExpressTM Core 2KB Flash 512B SRAM Document Number: 001-17349 Rev. *B Page 2 of 12 [+] Feedback CY8C201A0 Pinouts Figure 1. Pin Diagram - 16 QFN GP0[4] CSInt GP0[3] VDD GP0[0] GP0[2] GP0[1] XRES I2C SCL GP1[4] I2C SDA GP1[3] GP1[0] GP1[1] VSS GP1[2] Table 1. Pin Definitions - 16 QFN Pin Number Name 1 GP0[0] Configurable as CapSense or GPIO 2 GP0[1] Configurable as CapSense or GPIO 3 I2C SCL I2C clock 4 I2C SDA I2C data 5 GP1[0] Configurable as CapSense or GPIO 6 GP1[1] Configurable as CapSense or GPIO 7 VSS 8 GP1[2] Configurable as CapSense or GPIO 9 GP1[3] Configurable as CapSense or GPIO 10 GP1[4] Configurable as CapSense or GPIO 11 XRES Active HIGH external reset with internal pull down 12 GP0[2] Configurable as CapSense or GPIO 13 VDD 14 GP0[3] 15 CSInt 16 GP0[4] Document Number: 001-17349 Rev. *B Description Ground connection Supply voltage Configurable as CapSense or GPIO Integrating Input. The external capacitor is required only if 5:1 SNR is not achieved.Typical range is 1nf to 100nf Configurable as CapSense or GPIO Page 3 of 12 [+] Feedback CY8C201A0 Figure 2. Pin Diagram - 16 SOIC GP0[3] 1 16 VDD CSInt 2 15 GP0[2] GP0[4] 3 14 XRES GP0[0] 4 13 GP1[4] GP0[1] 5 12 GP1[3] I2CSCL 6 11 GP1[2] I2CSDA 7 10 VSS GP1[0] 8 9 SOIC (Top View) GP1[1] Table 2. Pin Definitions - 16 SOIC Pin Number Name 1 GP0[3] 2 CSInt 3 GP0[4] Configurable as CapSense or GPIO 4 GP0[0] Configurable as CapSense or GPIO 5 GP0[1] Configurable as CapSense or GPIO 6 I2C SCL I2C clock 7 I2C SDA I2C data 8 GP1[0] Configurable as CapSense or GPIO 9 GP1[1] Configurable as CapSense or GPIO 10 VSS 11 GP1[2] Configurable as CapSense or GPIO 12 GP1[3] Configurable as CapSense or GPIO 13 GP1[4] Configurable as CapSense or GPIO 14 XRES Active HIGH external reset with internal pull down 15 GP0[2] Configurable as CapSense or GPIO 16 VDD Document Number: 001-17349 Rev. *B Description Configurable as CapSense or GPIO Integrating Input. The external capacitor is required only if 5:1 SNR is not achieved.Typical range is 1nf to 100nf Ground connection Supply voltage Page 4 of 12 [+] Feedback CY8C201A0 The CapSense Analog System I2C Interface The CapSense analog system contains the capacitive sensing hardware. The CapSense Successive Approximation (CSA) algorithm is supported. This hardware performs capacitive sensing and scanning without external components. Capacitive sensing is configurable on each pin. The two modes of operation for the I2C interface are: Additional System Resources The I2C address is programmable during configuration. It can be locked to prevent accidental change by setting a flag in a configuration register. System resources provide additional capability useful to complete systems. Additional resources are low voltage detection and power on reset. Brief statements describing the merits of each system resource are: ■ The I2C slave provides 50, 100, or 400 kHz communication over two wires. ■ Low Voltage Detection (LVD) interrupts signal the application of falling voltage levels and the advanced POR (Power On Reset) circuit eliminates the need for a system supervisor. ■ Device register configuration and status read or write for controller ■ Command execution CapSense Express Software Tool An easy to use software tool integrated with PSoC Express is available to configure and tune CapSense Express devices. Refer to the Application Note AN42137 for details of the software tool. An internal 1.8V reference provides a stable internal reference so that capacitive sensing functionality is not affected by minor VDD changes. Electrical Specifications Absolute Maximum Ratings Min Typ Max Unit Notes TSTG Parameter Storage temperature Description –55 25 +100 °C Higher storage temperatures reduce data retention time. Recommended storage temperature is +25°C ± 25°C. Extended duration storage temperatures above 65°C degrade reliability. TA Ambient temperature with power applied –40 – +85 °C VDD Supply voltage on VDD relative to VSS –0.5 – +6.0 V VIO DC input voltage VSS – 0.5 – VDD + 0.5 V VIOZ DC voltage applied to tri-state VSS – 0.5 – VDD + 0.5 V IMIO Maximum current into any GPIO pin –25 – +50 mA ESD Electro static discharge voltage 2000 – – V LU Latch up current – – 200 mA Min Typ Max Unit Human body model ESD Operating Temperature Parameter Description TA Ambient temperature -40 – +85 °C TJ Junction temperature -40 – +100 °C Document Number: 001-17349 Rev. *B Notes Page 5 of 12 [+] Feedback CY8C201A0 DC Electrical Characteristics DC Chip Level Specifications Parameter Description VDD Supply voltage Min Typ Max Unit 2.40 – 5.25 V Notes IDD Supply current – 1.5 2.5 mA Conditions are VDD = 3.0V, TA = 25°C ISB Sleep mode current with POR and LVD active. Mid temperature range – 2.6 4 µA VDD = 2.55V, 0°C < TA < 40°C ISB Sleep mode current with POR and LVD active. – 2.8 5 µA VDD = 3.3V, –40°C < TA < 85°C ISB Sleep mode current with POR and LVD active. – 5.2 6.4 µA VDD = 5.25V, –40°C < TA < 85°C This table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C<TA<85C, 3.0V to 3.6V, and -40°C<TA<85°C respectively. Typical parameters apply to 5v and 3.3V at 25°C. These are for design guidance only. 5V and 3.3V DC General Purpose IO Specifications Parameter Description Min Typ Max Unit Notes RPU Pull up resistor 4 5.6 8 kΩ VOH1 High output voltage Port 0 pins VDD – 0.2 – – V IOH < 10 µA, VDD > 3.0V, maximum of 20 mA source current in all IOs. VOH2 High output voltage Port 0 pins VDD – 0.9 – – V IOH = 1 mA, VDD > 3.0V, maximum of 20 mA source current in all IOs. VOH3 High output voltage Port 1 pins VDD – 0.2 – – V IOH < 10 µA, VDD> 3.0V, maximum of 10 mA source current in all IOs. VOH4 High output voltage Port 1 pins VDD – 0.9 – – V IOH = 5 mA, VDD > 3.0V, maximum of 20 mA source current in all IOs. VOH5 High output voltage Port 1 pins with 3.0V LDO regulator enabled High Output Voltage Port 1 pins with 3.0V LDO regulator 2.75 3.0 3.2 V IOH < 10 µA, VDD> 3.1V, maximum of 4 IOs all sourcing 5mA. 2.2 – – V IOH = 5 mA, VDD > 3.1V, maximum of 20 mA source current in all IOs. VOH7 High Output Voltage Port 1 pins with 2.4V LDO regulator 2.1 2.4 2.5 V IOH < 10 µA, VDD > 3.0V, maximum of 20 mA source current in all IOs. VOH8 High Output Voltage Port 1 pins with 2.4V LDO regulator 2 – – V IOH < 200 µA, VDD > 3.0V, maximum of 20 mA source current in all IOs. VOL Low output voltage – – 0.75 V IOL = 20 mA, VDD > 3V, maximum of 60 mA sink current on even port pins and 60 mA sink current on odd port pins - .75 V VDD 3.0 to 3.6V V VDD 3.0 to 3.6V VOH6 VIL Input low voltage - VIH Input high voltage 1.6 VIL Input low voltage – – 0.8 V VDD = 3.6 to 5.25V. VIH Input high voltage 2.0 – – V VDD = 3.6 to 5.25V. VH Input hysteresis voltage – 140 – mV IIL Input leakage – 1 – nA Document Number: 001-17349 Rev. *B Gross tested to 1 µA. Page 6 of 12 [+] Feedback CY8C201A0 5V and 3.3V DC General Purpose IO Specifications (continued) Min Typ Max Unit CIN Parameter Capacitive load on pins as input Description 0.5 1.7 5 pF Package and pin dependent. Temp = 25°C. Notes COUT Capacitive load on pins as output 0.5 1.7 5 pF Package and pin dependent. Temp = 25°C. 2.7 DC General Purpose IO Specifications This table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 2.4V to 3.0V and -40°C<TA<85°C, respectively. Typical parameters apply to 2.7V at 25°C. These are for design guidance only. Parameter Description Min Typ Max Unit Notes RPU Pull up resistor 4 5.6 8 kΩ VOH1 High output voltage Port 0 pins VDD – 0.2 – – V IOH < 10 µA, maximum of 10 mA source current in all IOs. VOH2 High output voltage Port 0 pins VDD – 0.5 – – V IOH = 0.2 mA, maximum of 10 mA source current in all IOs. VOH3 High output voltage Port 1 pins VDD – 0.2 – – V IOH < 10 µA, maximum of 10 mA source current in all IOs. VOH4 High output voltage Port 1 pins VDD – 0.5 – – V IOH = 2 mA, maximum of 10 mA source current in all IOs. VOL Low output voltage – – 0.75 V IOL = 10 mA, maximum of 30 mA sink current on even port pins and 30 mA sink current on odd port pins VOLP1 Low output voltage port 1 pins – – 0.4 V IOL=5 mA Maximum of 50 mA sink current on even port pins and 50 mA sink current on odd port pins 2.4<VDD<3.6V VIL Input low voltage – – 0.75 V VDD= 3.0 to 3.6V VIH Input high voltage 1.6 – – V VDD= 3.0 to 3.6V VIL Input low voltage – – 0.75 V VDD = 2.4 to 3.6V. VIH1 Input high voltage 1.4 – – V VDD = 2.4 to 2.7V. VIH2 Input high voltage 1.6 – – V VDD = 2.7 to 3.6V VH Input hysteresis voltage – 60 – mV IIL Input leakage – 1 – nA Gross tested to 1 µA. CIN Capacitive load on pins as input 0.5 1.7 5 pF Package and pin dependent. Temp = 25°C. COUT Capacitive load on pins as output 0.5 1.7 5 pF Package and pin dependent. Temp = 25°C. DC POR and LVD Specifications Parameter Description Min Typ Max Unit VPPOR0 VPPOR1 VDD Value PPOR Trip VDD= 2.7V VDD= 3.3V,5V – – 2.36 2.60 2.40 2.65 V V VLVD0 VLVD2 VLVD6 VDD Value for LVD trip VDD= 2.7V VDD= 3.3V VDD= 5V 2.39 2.75 3.98 2.45 2.92 4.05 2.51 2.99 4.12 V V V Document Number: 001-17349 Rev. *B Notes VDD must be greater than or equal to 2.5V during startup, reset from the XRES pin, or reset from Watchdog. Page 7 of 12 [+] Feedback CY8C201A0 AC Electrical Characteristics 5.0V and 3.3V AC General Purpose IO Specifications Parameter Description Min Max Unit Notes TRise0 Rise time, strong mode, Cload = 50pF, Port 0 15 80 ns VDD = 3.0V to 3.6V and 4.75V to 5.25V, 10% - 90% TRise1 Rise time, strong mode, Cload = 50pF, Port 1 10 50 ns VDD = 3.0V to 3.6V, 10% - 90% TFall Fall time, strong mode, Cload = 50pF, all ports 10 50 ns VDD = 3.0V to 3.6V and 4.75V to 5.25V, 10% - 90% Min Max Unit Notes 2.7V AC General Purpose IO Specifications Parameter Description TRise0 Rise time, strong mode, Cload = 50pF, Port 0 15 100 ns VDD = 2.4V to 3.0V, 10% - 90% TRise1 Rise time, strong mode, Cload = 50pF, Port 1 10 70 ns VDD = 2.4V to 3.0V, 10% - 90% TFall Fall time, strong mode, Cload = 50pF, all ports 10 70 ns VDD = 2.4V to 3.0V, 10% - 90% AC I2C Specifications Parameter Description Standard Mode Fast Mode Units Min Max Min Max 0 100 0 400 kbps THDSTAI2C Hold time (repeated) START condition. After this period, the first clock pulse is generated. 4.0 – 0.6 – µs TLOWI2C LOW period of the SCL clock 4.7 – 1.3 – µs I2C HIGH period of the SCL clock 4.0 – 0.6 – µs 4.7 – 0.6 – µs 0 – 0 – µs 250 – 100 – ns FSCLI2C THIGH SCL clock frequency 2 TSUSTAI C Setup time for a repeated START condition THDDATI2C Data hold time TSUDATI2C TSUSTOI2C TBUFI2C TSPI2C Data setup time Setup time for STOP condition 4.0 – 0.6 – µs BUS free time between a STOP and START condition 4.7 – 1.3 – µs Pulse width of spikes suppressed by the input filter – – 0 50 ns Document Number: 001-17349 Rev. *B Notes Fast mode not supported for VDD < 3.0V Page 8 of 12 [+] Feedback CY8C201A0 Figure 3. Definition for Timing for Fast/Standard Mode on the I2C Bus Document Number: 001-17349 Rev. *B Page 9 of 12 [+] Feedback CY8C201A0 Ordering Information Package Type Operating Temperature 001-09116 16 QFN Industrial 51-85068 16 SOIC Industrial Ordering Code Package Diagram CY8C201A0-LDX2I CY8C201A0-SX2I Thermal Impedances by Package Package Typical θJA[1] 16 QFN 46 °C/W 16 SOIC 79.96 °C/W Note 1. TJ = TA + Power x θJA Solder Reflow Peak Temperature Package Minimum Peak Temperature[2] Maximum Peak Temperature 16 QFN 240 °C 260 °C 16 SOIC 240 °C 260 °C Note 2. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5°C with Sn-Pb or 245 ± 5°C with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications. Document Number: 001-17349 Rev. *B Page 10 of 12 [+] Feedback CY8C201A0 Package Diagram Figure 4. 16 Pin Chip On Pb-free 3x3 mm (Sawn) QFN (001-09116) DIMENSIONS IN mm MIN. MAX. 2.9 3.1 0.20 min 0.45 0.55 1.5 (NOM) 1 2 2 2.9 3.1 1 0.152 REF. 0.20 DIA TYP. 0.05 MAX 0.60 MAX PIN #1 ID 0.30 0.18 0.50 1.5 SEATING PLANE TOP VIEW PART NO. LG16A LD16A SIDE VIEW BOTTOM VIEW JEDEC # MO-220 Package Weight: 0.014g DESCRIPTION LEAD-FREE STANDARD 001-09116-*C Figure 5. 16 Pin (150-Mil) SOIC (51-85068) 51-85068-*B Document Number: 001-17349 Rev. *B Page 11 of 12 [+] Feedback CY8C201A0 Document History Page Document Title: CY8C201A0 CapSense Express™ -10 Configurable IOs with Slider Document Number: 001-17349 Orig. of Change REV. ECN. Issue Date Description of Change ** 1494145 See ECN TUP/AESA New Datasheet *A 1773608 See ECN TUP/AESA Removed table - 3V DC General Purpose IO Specifications Updated Logic Block Diagram Updated table - DC POR and LVD Specifications Updated table - DC Chip Level Specifications Updated table - 5V and 3.3V DC General Purpose IO Specifications Updated table - 2.7V DC General Purpose IO Specifications Updated table - AC GPIO Specifications and split it into two tables for 5V/3.3V and 2.7V Added section on CapSense ExpressTM Software tool Updated 16-QFN Package Diagram *B 2091026 See ECN DZU/MOHD Updated table-DC Chip Level Specifications /AESA Updated table-Pin Definitions 16 pin QFN Updated table-Pin Definitions 16 pin SOIC Updated table-5V and 3.3V DC General Purpose IO Specifications Updated table - 2.7V DC General Purpose IO Specifications Changed definition for Timing for Fast/Standard Mode on the I2C Bus diagram © Cypress Semiconductor Corporation, 2007-2008. 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Document Number: 001-17349 Rev. *B Revised February 11, 2008 Page 12 of 12 PSoC Designer™, Programmable System-on-Chip™, and PSoC Express™ are trademarks and PSoC® is a registered trademark of Cypress Semiconductor Corp. All other trademarks or registered trademarks referenced herein are property of the respective corporations. Purchase of I2C components from Cypress or one of its sublicensed Associated Companies conveys a license under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips. All products and company names mentioned in this document may be the trademarks of their respective holders. [+] Feedback