74ABT162244 16-bit buffer/line driver with 30 Ω series termination resistors; 3-state Rev. 05 — 25 May 2010 Product data sheet 1. General description The 74ABT162244 high-performance Bipolar CMOS (BiCMOS) device combines low static and dynamic power dissipation with high speed and high output drive. The 74ABT162244 is a 16-bit buffer that is ideal for driving bus lines. The device features four output enable inputs (1OE, 2OE, 3OE, 4OE), each controlling four of the 3-state outputs. The 74ABT162244 is designed with 30 Ω series resistance in both the upper and lower output structures. This design reduces line noise in applications such as memory address drivers, clock drivers and bus receivers/transmitters. 2. Features and benefits 16-bit bus interface Multiple VCC and GND pins minimize switching noise Power-up 3-state 3-state buffers Output capability: +12 mA and −32 mA Live insertion and extraction permitted Latch-up performance: JESD 78 Class II ESD protection: HBM JESD-A114E exceeds 2000 V CDM JESD 22-C101-C exceeds 1000 V 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74ABT162244DGG −40 °C to +85 °C TSSOP48 plastic thin shrink small outline package; 48 leads; body width 6.1 mm SOT362-1 74ABT162244DL −40 °C to +85 °C SSOP48 plastic shrink small outline package; 48 leads; body SOT370-1 width 7.5 mm 74ABT162244 NXP Semiconductors 16-bit buffer/line driver with 30 Ω series termination resistors; 3-state 4. Functional diagram 2 47 1A0 46 3Y0 35 1Y1 3A1 1Y2 3A2 5 44 13 3A0 3 1A1 1A2 36 1Y0 1 1OE 48 2OE 25 3OE 24 4OE 14 3Y1 33 16 3Y2 1A0 1A3 6 43 1Y3 3A3 32 17 1A1 3Y3 1A2 1OE 1 3OE 25 1A3 2A0 2A1 8 41 2A0 30 2Y0 2A2 19 4A0 2A3 4Y0 3A0 40 29 9 2A1 2Y1 3A1 20 4A1 4Y1 3A2 3A3 2A2 11 38 2Y2 4A2 27 22 4A0 4Y2 4A1 2A3 2OE 12 37 2Y3 48 4A3 4OE EN1 EN2 EN3 EN4 26 4A2 23 4Y3 4A3 47 46 1 1 2 3 44 5 43 6 41 40 1 2 8 9 38 11 37 12 36 35 1 3 13 14 33 16 32 17 30 29 1 4 19 20 27 22 26 23 1Y0 1Y1 1Y2 1Y3 2Y0 2Y1 2Y2 2Y3 3Y0 3Y1 3Y2 3Y3 4Y0 4Y1 4Y2 4Y3 001aae231 24 mna996 Fig 1. Logic symbol Fig 2. IEC logic symbol VCC output GND Fig 3. 001aac384 Logic diagram one output 74ABT162244 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 05 — 25 May 2010 © NXP B.V. 2010. All rights reserved. 2 of 15 74ABT162244 NXP Semiconductors 16-bit buffer/line driver with 30 Ω series termination resistors; 3-state 5. Pinning information 5.1 Pinning 1OE 1 48 2OE 1Y0 2 47 1A0 1Y1 3 46 1A1 GND 4 45 GND 1Y2 5 44 1A2 1Y3 6 43 1A3 VCC 7 42 VCC 2Y0 8 41 2A0 2Y1 9 40 2A1 GND 10 39 GND 2Y2 11 38 2A2 2Y3 12 37 2A3 74ABT162244 3Y0 13 36 3A0 3Y1 14 35 3A1 GND 15 34 GND 3Y2 16 33 3A2 3Y3 17 32 3A3 VCC 18 31 VCC 4Y0 19 30 4A0 4Y1 20 29 4A1 GND 21 28 GND 4Y2 22 27 4A2 4Y3 23 26 4A3 4OE 24 25 3OE 001aaj890 Fig 4. Pin configuration 5.2 Pin description Table 2. Pin description Symbol Pin Description 1OE 1 1 output enable (LOW active) 1Y[0:3] 2, 3, 5, 6 1 data output 0 to output 3 GND 4 ground (0 V) VCC 7 supply voltage 2Y[0:3] 8, 9, 11, 12 2 data output 0 to output 3 GND 10 ground (0 V) 3Y[0:3] 13, 14, 16, 17 3 data output 0 to output 3 GND 15 ground (0 V) VCC 18 supply voltage 4Y[0:3] 19, 20, 22, 23 4 data output 0 to output 3 GND 21 ground (0 V) 4OE 24 4 output enable (LOW active) 74ABT162244 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 05 — 25 May 2010 © NXP B.V. 2010. All rights reserved. 3 of 15 74ABT162244 NXP Semiconductors 16-bit buffer/line driver with 30 Ω series termination resistors; 3-state Table 2. Pin description …continued Symbol Pin Description 3OE 25 3 output enable (LOW active) GND 28 ground (0 V) 4A[0:3] 30, 29, 27, 26 4 data input 0 to input 3 VCC 31 supply voltage GND 34 ground (0 V) 3A[0:3] 36, 35, 33, 32 3 data input 0 to input 3 GND 39 ground (0 V) 2A[0:3] 41, 40, 38, 37 2 data input 0 to input 3 VCC 42 supply voltage GND 45 ground (0 V) 1A[0:3] 47, 46, 44, 43 1 data input 0 to input 3 2OE 48 74ABT162244 Product data sheet 2 output enable (LOW active) All information provided in this document is subject to legal disclaimers. Rev. 05 — 25 May 2010 © NXP B.V. 2010. All rights reserved. 4 of 15 74ABT162244 NXP Semiconductors 16-bit buffer/line driver with 30 Ω series termination resistors; 3-state 6. Functional description Table 3. Function table[1] Control Input Output nOE nAn nYn L L L L H H H X Z [1] H = HIGH voltage level; L = LOW voltage level; X = don t care; Z = high-impedance OFF-state. 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VCC supply voltage Conditions Min Max Unit −0.5 +7.0 V [1] −1.2 +7.0 V [1] −0.5 +5.5 V VI input voltage VO output voltage output in OFF-state or HIGH-state IIK input clamping current VI < 0 V −18 - mA IOK output clamping current VO < 0 V −50 - mA IO output current output in LOW-state - 128 mA output in HIGH-state - −64 mA - 150 °C −65 +150 °C Tj junction temperature Tstg storage temperature [2] [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. 8. Recommended operating conditions Table 5. Operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter Min Typ Max Unit VCC supply voltage 4.5 - 5.5 V VI input voltage 0 - VCC V VIH HIGH-level input voltage 2.0 - - V VIL LOW-level Input voltage - - 0.8 V IOH HIGH-level output current −32 - - mA IOL LOW-level output current - - 12 mA Δt/ΔV input transition rise and fall rate - - 10 ns/V Tamb ambient temperature −40 - +85 °C 74ABT162244 Product data sheet Conditions in free air All information provided in this document is subject to legal disclaimers. Rev. 05 — 25 May 2010 © NXP B.V. 2010. All rights reserved. 5 of 15 74ABT162244 NXP Semiconductors 16-bit buffer/line driver with 30 Ω series termination resistors; 3-state 9. Static characteristics Table 6. Static characteristics Symbol Parameter 25 °C Conditions Min Typ Max Min Max - −0.9 −1.2 - −1.2 V VCC = 4.5 V; IOH = −3 mA 2.5 2.9 - 2.5 - V VCC = 5.0 V; IOH = −3 mA 3.0 3.4 - 3.0 - V VCC = 4.5 V; IOH = −32 mA 2.0 2.4 - 2.0 - V VCC = 4.5 V; IOL = 8 mA - - 0.65 - 0.65 V VCC = 4.5 V; IOL = 12 mA - - 0.80 - 0.80 V VIK input clamping voltage VCC = 4.5 V; IIK = −18 mA VOH HIGH-level output voltage LOW-level output voltage VOL −40 °C to +85 °C Unit VI = VIL or VIH VI = VIL or VIH II input leakage current VCC = 5.5 V; VI = VCC or GND - ±0.01 ±1.0 - ±1.0 μA IOFF power-off leakage current VCC = 0 V; VI or VO ≤ 4.5 V - ±5.0 ±100 - ±100 μA IO(pu/pd) power-up/power-down VCC = 2.0 V; VO = 0.5 V; output current VI = GND or VCC; nOE = HIGH - ±5.0 ±50 - ±50 μA IOZ OFF-state output current output HIGH-state at VO = 5.5 V - 0.1 10 - 10 μA output LOW-state at VO = 0 V - −0.1 −10 - −10 μA - 5.0 50 - 50 μA −50 −180 mA - 1.0 mA [1] VCC = 5.5 V; VI = VIL or VIH ILO output leakage current HIGH-state; VO = 5.5 V; VCC = 5.5 V; VI = GND or VCC IO output current VCC = 5.5 V; VO = 2.5 V ICC supply current VCC = 5.5 V; VI = GND or VCC [2] −50 −100 −180 outputs HIGH-state - 0.50 1.0 outputs LOW-state - 10 19 - 19 mA outputs 3-state - 0.50 1.0 - 1.0 mA - 100 250 - 250 μA ΔICC additional supply current per input pin; VCC = 5.5 V; one input at 3.4 V and other inputs at VCC or GND CI input capacitance VI = 0 V or VCC - 3 - - - pF CI/O input/output capacitance outputs disabled; VO = 0 V or VCC - 7 - - - pF [3][4] [1] This parameter is valid for any VCC between 0 V and 2.1 V, with a transition time of up to 10 ms. From VCC = 2.1 V to VCC = 5 V ± 10 %, a transition time of up to 100 μs is permitted. [2] Not more than one output should be tested at a time, and the duration of the test should not exceed one second. [3] This is the increase in supply current for each input at 3.4 V. [4] This data sheet limit may vary among suppliers. 74ABT162244 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 05 — 25 May 2010 © NXP B.V. 2010. All rights reserved. 6 of 15 74ABT162244 NXP Semiconductors 16-bit buffer/line driver with 30 Ω series termination resistors; 3-state 10. Dynamic characteristics Table 7. Dynamic characteristics GND = 0 V. For test circuit, see Figure 7. Symbol Parameter 25 °C; VCC = 5.0 V Conditions −40 °C to +85 °C; Unit VCC = 5.0 V ± 0.5 V Min Typ Max Min Max tPLH LOW to HIGH propagation delay nAn to nYn, see Figure 5 1.0 1.8 2.4 1.0 2.7 tPHL HIGH to LOW propagation delay nAn to nYn, see Figure 5 1.6 3.2 4.0 1.6 4.4 tPZH OFF-state to HIGH propagation delay nOE to nYn; see Figure 6 1.2 2.7 3.5 1.2 4.3 ns tPZL OFF-state to LOW propagation delay nOE to nYn; see Figure 6 2.6 5.0 6.2 2.6 7.3 ns tPHZ HIGH to OFF-state propagation delay nOE to nYn; see Figure 6 1.5 3.0 3.8 1.5 4.5 ns tPLZ LOW to OFF-state propagation delay nOE to nYn; see Figure 6 1.3 2.6 3.3 1.3 4.6 ns 74ABT162244 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 05 — 25 May 2010 ns © NXP B.V. 2010. All rights reserved. 7 of 15 74ABT162244 NXP Semiconductors 16-bit buffer/line driver with 30 Ω series termination resistors; 3-state 11. Waveforms VI VM VM input nAn 0V tPHL tPLH VOH VM output nYn VM VOL 001aaj028 VM = 1.5 V VOL and VOH are typical voltage output levels that occur with the output load. Fig 5. Input (nAn) to output (nYn) propagation delay VI VM nOE input GND tPZL tPLZ 3.5 V VM nYn output VOL + 0.3 V VOL tPZH tPHZ VOH VM nYn output VOH − 0.3 V 0V 001aaj892 VM = 1.5 V VOL and VOH are typical voltage output levels that occur with the output load. Fig 6. 3-state output enable and disable times 74ABT162244 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 05 — 25 May 2010 © NXP B.V. 2010. All rights reserved. 8 of 15 74ABT162244 NXP Semiconductors 16-bit buffer/line driver with 30 Ω series termination resistors; 3-state 12. Test information VI tW 90 % 90 % negative pulse VM 10 % 10 % 0V VI tf tr tr tf 90 % positive pulse 0V VM 90 % VM VM 10 % 10 % tW 001aai298 VM = 1.5 V a. Input pulse definition VEXT VCC PULSE GENERATOR VI RL VO DUT CL RT RL 001aac764 Test data is given in Table 8. Definitions test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to output impedance Zo of the pulse generator. b. Test circuit for 3-state outputs Fig 7. Table 8. Load circuitry for switching times Test data Input Load VEXT VI fi tW tr, tf CL RL tPHZ, tPZH tPLZ, tPZL tPLH, tPHL 3.0 V 1 MHz 500 ns 2.5 ns 50 pF 500 Ω open 7.0 V open 74ABT162244 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 05 — 25 May 2010 © NXP B.V. 2010. All rights reserved. 9 of 15 74ABT162244 NXP Semiconductors 16-bit buffer/line driver with 30 Ω series termination resistors; 3-state 13. Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm SOT362-1 E D A X c HE y v M A Z 48 25 Q A2 (A 3) A1 pin 1 index A θ Lp L 1 detail X 24 w M bp e 2.5 0 5 mm scale DIMENSIONS (mm are the original dimensions). UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z θ mm 1.2 0.15 0.05 1.05 0.85 0.25 0.28 0.17 0.2 0.1 12.6 12.4 6.2 6.0 0.5 8.3 7.9 1 0.8 0.4 0.50 0.35 0.25 0.08 0.1 0.8 0.4 8 o 0 o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT362-1 Fig 8. REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-153 Package outline SOT362-1 (TSSOP48) 74ABT162244 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 05 — 25 May 2010 © NXP B.V. 2010. All rights reserved. 10 of 15 74ABT162244 NXP Semiconductors 16-bit buffer/line driver with 30 Ω series termination resistors; 3-state SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm SOT370-1 D E A X c y HE v M A Z 25 48 Q A2 A1 A (A 3) θ pin 1 index Lp L 24 1 detail X w M bp e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) θ mm 2.8 0.4 0.2 2.35 2.20 0.25 0.3 0.2 0.22 0.13 16.00 15.75 7.6 7.4 0.635 10.4 10.1 1.4 1.0 0.6 1.2 1.0 0.25 0.18 0.1 0.85 0.40 8 o 0 o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT370-1 Fig 9. REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-118 Package outline SOT370-1 (SSOP48) 74ABT162244 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 05 — 25 May 2010 © NXP B.V. 2010. All rights reserved. 11 of 15 74ABT162244 NXP Semiconductors 16-bit buffer/line driver with 30 Ω series termination resistors; 3-state 14. Abbreviations Table 9. Abbreviations Acronym Description CDM Charged Device Model ESD ElectroStatic Discharge HBM Human Body Model 15. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes 74ABT162244 v5 20100525 Product data sheet - 74ABT162244_4 - 74ABT_H162244_3 Modifications: 74ABT162244_4 Modifications: • Table 6, Table note 1 transition time added. 20090409 Product data sheet • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • Legal texts have been adapted to the new company name where appropriate. 74ABTH162244 removed 74ABT_H162244_3 19981022 Product specification - 74ABT_H162244_2 74ABT_H162244_2 19980225 Product specification - 74ABT_H162244_1 74ABT_H162244_1 19961023 Product specification - - 74ABT162244 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 05 — 25 May 2010 © NXP B.V. 2010. All rights reserved. 12 of 15 74ABT162244 NXP Semiconductors 16-bit buffer/line driver with 30 Ω series termination resistors; 3-state 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 16.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. The product is not designed, authorized or warranted to be 74ABT162244 Product data sheet suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 05 — 25 May 2010 © NXP B.V. 2010. All rights reserved. 13 of 15 74ABT162244 NXP Semiconductors 16-bit buffer/line driver with 30 Ω series termination resistors; 3-state Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 74ABT162244 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 05 — 25 May 2010 © NXP B.V. 2010. All rights reserved. 14 of 15 74ABT162244 NXP Semiconductors 16-bit buffer/line driver with 30 Ω series termination resistors; 3-state 18. Contents 1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Recommended operating conditions. . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Contact information. . . . . . . . . . . . . . . . . . . . . 14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 25 May 2010 Document identifier: 74ABT162244