PHILIPS TDA8947J

TDA8947J
4-channel audio amplifier (SE: 1 W to 25 W; BTL: 4 W to 50 W)
Rev. 01 — 06 February 2004
Preliminary data
1. General description
The TDA8947J contains four identical audio power amplifiers. The TDA8947J can be
used as: four Single-Ended (SE) channels with a fixed gain of 26 dB, two times
Bridge-Tied Load (BTL) channels with a fixed gain of 32 dB or two times SE channels
(26 dB gain) plus one BTL channel (32 dB gain) operating as a 2.1 system.
The TDA8947J comes in a 17-pin Dil-Bent-Sil (DBS) power package. The TDA8947J
is pin compatible with the TDA8944AJ and TDA8946AJ.
The TDA8947J contains a unique protection circuit that is solely based on multiple
temperature measurements inside the chip. This gives maximum output power for all
supply voltages and load conditions with no unnecessary audio holes. Almost any
supply voltage and load impedance combination can be made as long as thermal
boundary conditions (number of channels used, external heatsink and ambient
temperature) allow it.
2. Features
■
■
■
■
■
■
■
■
■
SE: 1 W to 25 W, BTL: 4 W to 50 W operation possibility (2.1 system)
Soft clipping
Standby and mute mode
No on/off switching plops
Low standby current
High supply voltage ripple rejection
Outputs short-circuit protected to ground, supply and across the load
Thermally protected
Pin compatible with TDA8944AJ and TDA8946AJ.
■
■
■
■
Television
PC speakers
Boom box
Mini and micro audio receivers.
3. Applications
TDA8947J
Philips Semiconductors
4-channel audio amplifier
4. Quick reference data
Table 1:
Quick reference data
Symbol Parameter
Conditions
supply voltage
VCC
Min
Typ
Max Unit
9
18
26
V
-
-
28
V
-
100
145
mA
-
-
10
µA
VCC = 18 V
7
8.5
-
W
VCC = 22 V
-
14
-
W
VCC = 18 V
16
18
-
W
VCC = 22 V
-
29
-
W
SE; Po = 1 W
-
0.1
0.5
%
BTL; Po = 1 W
-
0.05 0.5
%
SE
25
26
27
dB
BTL
31
32
33
dB
SE; f = 1 kHz
-
60
-
dB
BTL; f = 1 kHz
-
65
-
dB
operating
[1]
no (clipping) signal
Iq
quiescent supply current
Istb
standby supply current
Po(SE)
SE output power
Po(BTL)
THD
Gv(max)
SVRR
[1]
BTL output power
total harmonic distortion
maximum voltage gain
supply voltage ripple
rejection
VCC = 18 V; RL = ∞
THD = 10 %; RL = 4 Ω
THD = 10 %; RL = 8 Ω
The amplifier can deliver output power with non clipping output signals into nominal loads as long as
the ratings of the IC are not exceeded.
5. Ordering information
Table 2:
Ordering information
Type
number
Package
TDA8947J
DBS17P plastic DIL-bent-SIL power package; 17 leads
(lead length 12 mm)
Name
Description
SOT243-1
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
9397 750 10779
Preliminary data
Version
Rev. 01 — 06 February 2004
2 of 24
TDA8947J
Philips Semiconductors
4-channel audio amplifier
6. Block diagram
VCC1
3
IN1+
VCC2
16
8
1
OUT1+
60 kΩ
IN2+
6
4
OUT2−
60 kΩ
IN3+
9
14
OUT3−
60 kΩ
IN4+
12
17
OUT4+
60 kΩ
CIV
13
SHORT-CIRCUIT
AND
TEMPERATURE
PROTECTION
VCC
SVR
11 0.5V
CC
Vref
SGND
MODE1
MODE2
7
10
5
STANDBY ALL
MUTE ALL
ON 1+2
TDA8947J
MUTE 3+4
ON 3+4
2
GND1
15
MDB014
GND2
Fig 1. Block diagram.
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
9397 750 10779
Preliminary data
Rev. 01 — 06 February 2004
3 of 24
TDA8947J
Philips Semiconductors
4-channel audio amplifier
7. Pinning information
7.1 Pinning
OUT1+
1
GND1
2
VCC1
3
OUT2−
4
MODE2
5
IN2+
6
SGND
7
IN1+
8
IN3+
9
TDA8947J
MODE1 10
SVR 11
IN4+ 12
CIV 13
OUT3− 14
GND2 15
VCC2 16
OUT4+ 17
MDB015
Fig 2. Pin configuration.
7.2 Pin description
Table 3:
Pin description
Symbol
Pin
Description
OUT1+
1
non inverted loudspeaker output of channel 1
GND1
2
ground of channels 1 and 2
VCC1
3
supply voltage channels 1 and 2
OUT2−
4
inverted loudspeaker output of channel 2
MODE2
5
mode selection 2 input: mute and on for channels 3 and 4
IN2+
6
input channel 2
SGND
7
signal ground
IN1+
8
input channel 1
IN3+
9
input channel 3
MODE1
10
mode selection 1 input: standby, mute and on for all channels
SVR
11
half supply voltage decoupling (ripple rejection)
IN4+
12
input channel 4
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
9397 750 10779
Preliminary data
Rev. 01 — 06 February 2004
4 of 24
TDA8947J
Philips Semiconductors
4-channel audio amplifier
Table 3:
Pin description…continued
Symbol
Pin
Description
CIV
13
common input voltage decoupling
OUT3−
14
inverted loudspeaker output of channel 3
GND2
15
ground of channels 3 and 4
VCC2
16
supply voltage channels 3 and 4
OUT4+
17
non inverted loudspeaker output of channel 4
TAB
-
back side tab or heats spreader has to be connected to
ground
8. Functional description
8.1 Input configuration
The input cut-off frequency is:
1
f i ( cut – off ) = ----------------------------2π ( R i × C i )
(1)
For SE application Ri = 60 kΩ and Ci = 220 nF:
1
f i ( cut – off ) = ---------------------------------------------------------------- = 12 Hz
3
–9
2π ( 60 × 10 × 220 × 10 )
(2)
For BTL application Ri = 30 kΩ and Ci = 470 nF:
1
f i ( cut – off ) = ---------------------------------------------------------------- = 11 Hz
3
–9
2π ( 30 × 10 × 470 × 10 )
(3)
As shown in Equation 2 and Equation 3, large capacitor values for the inputs are not
necessary, so the switch-on delay during charging of the input capacitors can be
minimized. This results in a good low frequency response and good switch-on
behavior.
8.2 Power amplifier
The power amplifier is a BTL and/or SE amplifier with an all-NPN output stage,
capable of delivering a peak output current of 4 A.
Using the TDA8947J as a BTL amplifier offers the following advantages:
•
•
•
•
Low peak value of the supply current
Ripple frequency on the supply voltage is twice the signal frequency
No expensive DC-blocking capacitor
Good low frequency performance.
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
9397 750 10779
Preliminary data
Rev. 01 — 06 February 2004
5 of 24
TDA8947J
Philips Semiconductors
4-channel audio amplifier
8.2.1
Output power measurement
The output power as a function of the supply voltage is measured on the output pins
at THD = 10 %; see Figure 8.
The maximum output power is limited by the supply voltage (VCC = 26 V) and the
maximum output current (Io = 4 A repetitive peak current).
For supply voltages VCC > 22 V, a minimum load is required; see Figure 5:
• SE: RL = 3 Ω
• BTL: RL = 6 Ω.
8.2.2
Headroom
Typical CD music requires at least 12 dB (factor 15.85) dynamic headroom,
compared to the average power output, for transferring the loudest parts without
distortion.
The Average Listening Level (ALL) music power, without any distortion, yields:
• SE at Po(SE) = 5 W, VCC = 18 V, RL = 4 Ω and THD = 0.2 %:
3
5 ⋅ 10
P o ( ALL )SE = --------------- = 315 mW
15.85
(4)
• BTL at Po(BTL) = 10 W, VCC = 18 V, RL = 8 Ω and THD = 0.1 %:
3
10 ⋅ 10
P o ( ALL )BTL = ------------------ = 630 mW
15.85
(5)
The power dissipation can be derived from Figure 9 (SE and BTL) for a headroom of
0 dB and 12 dB, respectively.
Table 4:
Power rating as function of headroom
Headroom
Power output
SE
Power dissipation
(all channels driven)
BTL
0 dB
Po = 5 W
Po = 10 W
PD = 17 W
12 dB
Po(ALL) = 315 mW
Po(ALL) = 630 mW
PD = 9 W
For heatsink calculation at the average listening level, a power dissipation of 9 W can
be used.
8.3 Mode selection
The TDA8947J has three functional modes which can be selected by applying the
proper DC voltage to pin MODE1.
Standby — The current consumption is very low and the outputs are floating. The
device is in the standby mode when VMODE1 < 0.8 V, or when the MODE1 pin is
grounded. In the standby mode, the function of pin MODE2 has been disabled.
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
9397 750 10779
Preliminary data
Rev. 01 — 06 February 2004
6 of 24
TDA8947J
Philips Semiconductors
4-channel audio amplifier
Mute — The amplifier is DC-biased, but not operational (no audio output). This allows
the input coupling capacitors to be charged to avoid pop-noise. The device is in the
mute mode when 4.5 V < VMODE1 < (VCC − 3.5 V).
On — The amplifier is operating normally. The on mode is activated at
VMODE1 > (VCC − 2.0 V). The output of channels 3 and 4 can be set to mute or on
mode.
The output channels 3 and 4 can be switched on/off by applying a proper DC voltage
to pin MODE2, under the condition that the output channels 1 and 2 are in the on
mode (see Figure 3).
Table 5:
Mode selection
Voltage on pin
MODE1
MODE2
0 to 0.8 V
0 to VCC
Channel 1 and 2
Channel 3 and 4
(sub woofer)
standby
standby
4.5 to (VCC − 3.5 V)
0 to VCC
mute
mute
(VCC − 2.0 V) to VCC
0 to (VCC − 3.5 V)
on
mute
(VCC − 2 V) to VCC
on
on
all standby
0.8
channels 1+2: on
channels 3+4: on or mute
all mute
4.5
VCC−3.5
VCC−2.0 VCC
VMODE1
channels 3+4: mute
channels 3+4: on
VCC−3.5
MDB016
VCC−2.0 VCC
VMODE2
Fig 3. Mode selection.
8.4 Supply voltage ripple rejection
The Supply Voltage Ripple Rejection (SVRR) is measured with an electrolytic
capacitor of 150 µF on pin SVR using a bandwidth of 20 Hz to 22 kHz. Figure 11
illustrates the SVRR as function of the frequency. A larger capacitor value on pin SVR
improves the ripple rejection behavior at the lower frequencies.
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
9397 750 10779
Preliminary data
Rev. 01 — 06 February 2004
7 of 24
TDA8947J
Philips Semiconductors
4-channel audio amplifier
8.5 Built-in protection circuits
The TDA8947J contains two types of detection sensors: one measures local
temperatures of the power stages and one measures the global chip temperature. At
a local temperature of approximately 185 °C or a global temperature of approximately
150 °C, this detection circuit switches off the power stages for 2 ms. High impedance
of the outputs is the result. After this time period the power stages switch on
automatically and the detection will take place again; still a too high temperature
switches off the power stages immediately. This protects the TDA8947J against
shorts to ground, to the supply voltage and across the load, and against too high chip
temperatures.
The protection will only be activated when necessary, so even during a short-circuit
condition, a certain amount of (pulsed) current will still be flowing through the short,
just as much as the power stage can handle without exceeding the critical
temperature level.
9. Limiting values
Table 6:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
supply voltage
VCC
Conditions
Min
Max
Unit
operating
−0.3
+26
V
−0.3
+28
V
no (clipping) signal
[1]
VI
input voltage
−0.3
VCC + 0.3 V
IORM
repetitive peak output
current
-
4
A
Tstg
storage temperature
−55
+150
°C
Tamb
ambient temperature
−40
+85
°C
Ptot
total power dissipation
-
69
W
VCC(sc)
supply voltage to guarantee
short-circuit protection
-
24
V
[1]
non-operating
The amplifier can deliver output power with non clipping output signals into nominal loads as long as
the ratings of the IC are not exceeded.
10. Thermal characteristics
Table 7:
Thermal characteristics
Symbol Parameter
Conditions
Value
Unit
Rth(j-a)
thermal resistance from
junction to ambient
in free air
40
K/W
Rth(j-c)
thermal resistance from
junction to case
all channels driven
1.3
K/W
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
9397 750 10779
Preliminary data
Rev. 01 — 06 February 2004
8 of 24
TDA8947J
Philips Semiconductors
4-channel audio amplifier
11. Static characteristics
Table 8:
Static characteristics
VCC = 18 V; Tamb = 25 °C; RL = 8 Ω; VMODE1 = VCC; VMODE2 = VCC; Vi = 0 V; measured in test circuit Figure 12; unless
otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
supply voltage
operating
[1]
9
18
26
V
no (clipping) signal
[2]
-
-
28
V
RL = ∞
[3]
-
100
145
mA
-
-
10
µA
Supply
VCC
Iq
quiescent supply current
Istb
standby supply current
Output pins
VO
∆VOUT
DC output voltage
[4]
-
9
-
V
differential output voltage offset
[5]
-
-
170
mV
VCC − 2.0 -
VCC
V
4.5
-
VCC − 3.5 V
0
-
0.8
V
VCC − 2.0 -
VCC
V
BTL mode
Mode selection pins
VMODE1
selection voltage on pin MODE1 on
mute
standby
[6]
VMODE2
selection voltage on pin MODE2 on: channels 3 and 4
0
-
VCC − 3.5 V
IMODE1
selection current on pin MODE1 0 < VMODE1 < (VCC − 3.5 V)
-
-
20
µA
IMODE2
selection current on pin MODE2 0 < VMODE2 < (VCC − 3.5 V)
-
-
20
µA
mute: channels 3 and 4
[1]
[2]
[3]
[4]
[5]
[6]
A minimum load is required at supply voltages of VCC > 22 V: RL = 3 Ω for SE and RL = 6 Ω for BTL.
The amplifier can deliver output power with non clipping output signals into nominal loads as long as the ratings of the IC are not
exceeded.
With a load connected at the outputs the quiescent current will increase.
The DC output voltage, with respect to ground, is approximately 0.5VCC.
∆VOUT = VOUT+ − VOUT− 
Channels 3 and 4 can only be set to mute or on by MODE2 when VMODE1 > VCC − 2.0 V.
12. Dynamic characteristics
Table 9:
Dynamic characteristics SE
VCC = 18 V; Tamb = 25 °C; RL = 4 Ω; f = 1 kHz; VMODE1 = VCC; VMODE2 = VCC; measured in test circuit Figure 12; unless
otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Po(SE)
SE output power
VCC = 18 V; see Figure 8a
THD = 10 %; RL = 4 Ω
7
8.5
-
W
THD = 0.5 %; RL = 4 Ω
-
6.5
-
W
-
14
-
W
-
0.1
0.5
%
VCC = 22 V
THD = 10 %; RL = 4 Ω
THD
total harmonic distortion
Po = 1 W
Gv
voltage gain
25
26
27
dB
Zi
input impedance
40
60
-
kΩ
Vn(o)
noise output voltage
-
150
-
µV
[1]
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
9397 750 10779
Preliminary data
Rev. 01 — 06 February 2004
9 of 24
TDA8947J
Philips Semiconductors
4-channel audio amplifier
Table 9:
Dynamic characteristics SE…continued
VCC = 18 V; Tamb = 25 °C; RL = 4 Ω; f = 1 kHz; VMODE1 = VCC; VMODE2 = VCC; measured in test circuit Figure 12; unless
otherwise specified.
Symbol
SVRR
Parameter
supply voltage ripple rejection
Vo(mute)
output voltage in mute mode
αcs
channel separation
|Gv|
channel unbalance
[1]
[2]
[3]
Conditions
Min
Typ
Max
Unit
fripple = 1 kHz
[2]
-
60
-
dB
fripple = 100 Hz to 20 kHz
[2]
-
60
-
dB
[3]
-
-
150
µV
50
60
-
dB
-
-
1
dB
Rsource = 0 Ω
The noise output voltage is measured at the output in a frequency range from 20 Hz to 22 kHz (unweighted), with a source impedance
Rsource = 0 Ω at the input.
Supply voltage ripple rejection is measured at the output, with a source impedance Rsource = 0 Ω at the input and with a frequency range
from 20 Hz to 22 kHz (unweighted). The ripple voltage is a sine wave with a frequency fripple and an amplitude of 300 mV (RMS), which
is applied to the positive supply rail.
Output voltage in mute mode is measured with VMODE1 = VMODE2 = 7 V, and Vi = 1 V (RMS) in a bandwidth from 20 Hz to 22 kHz,
including noise.
Table 10: Dynamic characteristics BTL
VCC = 18 V; Tamb = 25 °C; RL = 8 Ω; f = 1 kHz; VMODE1 = VCC; VMODE2 = VCC; measured in test circuit Figure 12; unless
otherwise specified.
Symbol
Parameter
Conditions
Po(BTL)
BTL output power
VCC = 18 V; see Figure 8b
Min
Typ
Max
Unit
THD = 10 %; RL = 8 Ω
16
18
-
W
THD = 0.5 %; RL = 8 Ω
-
14
-
W
-
29
-
W
-
0.05
0.5
%
31
32
33
dB
VCC = 22 V
THD = 10 %; RL = 8 Ω
THD
total harmonic distortion
Gv
voltage gain
Zi
input impedance
Vn(o)
noise output voltage
SVRR
supply voltage ripple rejection
Vo(mute)
output voltage in mute mode
αcs
channel separation
|Gv|
channel unbalance
[1]
[2]
[3]
Po = 1 W
20
30
-
kΩ
[1]
-
200
-
µV
fripple = 1 kHz
[2]
-
65
-
dB
fripple = 100 Hz to 20 kHz
[2]
-
65
-
dB
[3]
-
-
250
µV
50
65
-
dB
-
-
1
dB
Rsource = 0 Ω
The noise output voltage is measured at the output in a frequency range from 20 Hz to 22 kHz (unweighted), with a source impedance
Rsource = 0 Ω at the input.
Supply voltage ripple rejection is measured at the output, with a source impedance Rsource = 0 Ω at the input and with a frequency range
from 20 Hz to 22 kHz (unweighted). The ripple voltage is a sine wave with a frequency fripple and an amplitude of 300 mV (RMS), which
is applied to the positive supply rail.
Output voltage in mute mode is measured with VMODE1 = VMODE2 = 7 V, and Vi = 1 V (RMS) in a bandwidth from 20 Hz to 22 kHz,
including noise.
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
9397 750 10779
Preliminary data
Rev. 01 — 06 February 2004
10 of 24
TDA8947J
Philips Semiconductors
4-channel audio amplifier
coc005
107
Vo
(µV)
106
105
104
103
102
10
1
0
4
8
16
20
VMODE1 (V)
12
BTL; VCC = 18 V; Vi = 50 mV.
Fig 4. AC output voltage as function of voltage on pin MODE1.
MCE485
60
MCE484
60
Po
(W)
Po
(W)
40
40
4Ω
6Ω
8Ω
2Ω
3Ω
20
RL = 2 Ω
20
16 Ω
4Ω
RL = 1 Ω
8Ω
0
0
8
12
16
20
24
28
VCC (V)
8
THD = 10 %; one channel.
a.
SE
12
16
20
24
28
VCC (V)
THD = 10 %; one channel.
b.
BTL
Fig 5. Output power as function of supply voltage at various loads
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
9397 750 10779
Preliminary data
Rev. 01 — 06 February 2004
11 of 24
TDA8947J
Philips Semiconductors
4-channel audio amplifier
MCE488
102
THD+N
(%)
THD+N
(%)
10
10
1
1
10−1
10−1
10−2
10−1
1
10
Po (W)
10−2
10−1
102
VCC = 18 V; f = 1 kHz; RL = 4 Ω.
a.
MCE487
102
1
10
102
Po (W)
VCC = 18 V; f = 1 kHz; RL = 8 Ω.
SE
b.
BTL
Fig 6. Total harmonic distortion-plus-noise as function of output power.
MCE489
10
THD+N
(%)
THD+N
(%)
1
1
10−1
10−1
10−2
10
102
103
104
f (Hz)
10−2
10
105
VCC = 18 V; Po = 1 W; RL = 4 Ω.
a.
SE
MCE490
10
102
103
104
f (Hz)
105
VCC = 18 V; Po = 1 W; RL = 8 Ω.
b.
BTL
Fig 7. Total harmonic distortion-plus-noise as function of frequency.
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
9397 750 10779
Preliminary data
Rev. 01 — 06 February 2004
12 of 24
TDA8947J
Philips Semiconductors
4-channel audio amplifier
MCE491
50
Po
(W)
40
40
30
30
20
20
10
10
0
0
8
12
16
20
24
28
VCC (V)
8
THD = 10%; RL = 4 Ω; f = 1 kHz.
a.
MCE492
50
Po
(W)
12
16
20
24
28
VCC (V)
THD = 10%; RL = 8 Ω; f = 1 kHz.
SE
b.
BTL
Fig 8. Output power as function of supply voltage.
MCE493
20
PD
(W)
16
16
12
12
8
8
4
4
0
0
0
4
8
12
16
Po (W)
0
20
VCC = 18 V; RL = 4 Ω.
a.
MCE494
20
PD
(W)
SE
4
8
12
16
Po (W)
20
VCC = 18 V; RL = 8 Ω.
b.
BTL
Fig 9. Total power dissipation as function of channel output power per channel (worst case, all channels driven).
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
9397 750 10779
Preliminary data
Rev. 01 — 06 February 2004
13 of 24
TDA8947J
Philips Semiconductors
4-channel audio amplifier
MCE495
0
αcs
(dB)
αcs
(dB)
−20
−20
−40
−40
−60
−60
−80
−80
−100
10
102
103
104
MCE496
0
−100
10
105
102
103
104
f (Hz)
VCC = 18 V; RL = 4 Ω.
a.
105
f (Hz)
VCC = 18 V; RL = 8 Ω.
SE
b.
BTL
Fig 10. Channel separation as function of frequency (no bandpass filter applied).
MCE497
0
SVRR
(dB)
SVRR
(dB)
−20
−20
−40
−40
−60
−60
−80
10
a.
102
103
104
f (Hz)
MCE498
0
−80
10
105
102
103
104
f (Hz)
105
VCC = 18 V; Rsource = 0 Ω; Vripple = 300 mV (RMS).
VCC = 18 V; Rsource = 0 Ω; Vripple = 300 mV (RMS).
A bandpass filter of 20 Hz to 22 kHz has been applied.
A bandpass filter of 20 Hz to 22 kHz has been applied.
Inputs short-circuited.
Inputs short-circuited.
SE
b.
BTL
Fig 11. Supply voltage ripple rejection as function of frequency.
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
9397 750 10779
Preliminary data
Rev. 01 — 06 February 2004
14 of 24
TDA8947J
Philips Semiconductors
4-channel audio amplifier
13. Application information
13.1 Application diagrams
VCC
VCC1
3
220 nF
16
IN1+ 8
Vi
1000 µF
100 nF
VCC2
1 OUT1+
+
60 kΩ
220 nF
−
IN2+ 6
Vi
4 OUT2−
−
60 kΩ
+
Vi
RL
4Ω
14 OUT3−
IN3+ 9
470 nF
RL
4Ω
−
60 kΩ
+
17 OUT4+
IN4+ 12
470 µF
RL
8Ω
60 kΩ
CIV 13
SHORT-CIRCUIT
AND
TEMPERATURE
PROTECTION
VCC
VCC
10
kΩ
50
kΩ
100
kΩ
microcontroller
270 Ω
BC547
7.5 V
BC547
22 µF
2.2
µF
SVR 11 0.5V
CC
Vref
47
µF
SGND 7
1.5
kΩ
MODE1 10
VCC
MODE2 5
STANDBY ALL
MUTE ALL
ON 1 + 2
MUTE 3 + 4
ON 3 + 4
TDA8947J
2
15
GND1
GND2
mdb017
Fig 12. Typical application diagram without on/off switching plops.
Table 11: Amplifier selection by microcontroller
Microcontroller with open-collector output; see Figure 12
Microcontroller
Channels 1 and 2
Channels 3 and 4
LOW
on
on
HIGH
mute
mute
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9397 750 10779
Preliminary data
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TDA8947J
Philips Semiconductors
4-channel audio amplifier
VCC
VCC1
3
220 nF
16
IN1+ 8
Vi
1000 µF
100 nF
VCC2
1 OUT1+
+
60 kΩ
220 nF
−
IN2+ 6
4 OUT2−
−
Vi
60 kΩ
+
−
60 kΩ
+
Vi
RL
4Ω
14 OUT3−
IN3+ 9
470 nF
RL
4Ω
450 µF
RL
8Ω
17 OUT4+
IN4+ 12
60 kΩ
CIV 13
SHORT-CIRCUIT
AND
TEMPERATURE
PROTECTION
VCC
22 µF
SVR 11 0.5V
CC
150 µF
Vref
SGND 7
MODE1 10
MICROCONTROLLER
VCC
MODE2 5
STANDBY ALL
MUTE ALL
ON 1+2
TDA8947J
MUTE 3+4
ON 3+4
2
15
GND1
GND2
MDB018
Fig 13. Application diagram with one pin control and reduction of capacitor.
Remark: Because of switching inductive loads, the output voltage can rise beyond
the maximum supply voltage of 28 V. At high supply voltages, it is recommended to
use (Schottky) diodes to the supply voltage and ground.
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9397 750 10779
Preliminary data
Rev. 01 — 06 February 2004
16 of 24
TDA8947J
Philips Semiconductors
4-channel audio amplifier
13.2 Printed-circuit board
13.2.1
Layout and grounding
To obtain a high-level system performance, certain grounding techniques are
essential. The input reference grounds have to be tied with their respective source
grounds and must have separate tracks from the power ground tracks; this will
prevent the large (output) signal currents from interfering with the small AC input
signals. The small-signal ground tracks should be physically located as far as
possible from the power ground tracks. Supply and output tracks should be as wide
as possible for delivering maximum output power.
AUDIO POWER CS NIJMEGEN
PF / 3002 .naJ 72
TVA
220 nF
220 nF
100 nF
4Ω
1
4Ω
1
BTL4/3
4Ω
220 nF
BTL1/2
4Ω
220 nF
4Ω
220 nF
CIV
4.7 nF
220 nF
+SE3−
4Ω
1000 µF
22
220 µF
µF
1000 µF
1000 µF
+SE2−
1000 µF
SVF
−SE4+
MODE1
BTL3/4
MODE2
+SE1−
150
µF
OFF
10 kΩ
+ Vp
IN2+
IN1+
IN3+
IN4+
VOL.Sgnd
10 kΩ
SB ON
MUTE
ON
MCE483
Fig 14. Printed-circuit board layout (single-sided); components view.
13.2.2
Power supply decoupling
Proper supply bypassing is critical for low-noise performance and high supply voltage
ripple rejection. The respective capacitor location should be as close as possible to
the device and grounded to the power ground. Proper power supply decoupling also
prevents oscillations.
For suppressing higher frequency transients (spikes) on the supply line a capacitor
with low ESR, typical 100 nF, has to be placed as close as possible to the device. For
suppressing lower frequency noise and ripple signals, a large electrolytic capacitor,
e.g. 1000 µF or greater, must be placed close to the device.
The bypass capacitor on pin SVR reduces the noise and ripple on the mid rail
voltage. For good THD and noise performance a low ESR capacitor is recommended.
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
9397 750 10779
Preliminary data
Rev. 01 — 06 February 2004
17 of 24
TDA8947J
Philips Semiconductors
4-channel audio amplifier
13.3 Thermal behavior and heatsink calculation
The measured maximum thermal resistance of the IC package, Rth(j-mb), is 1.3 K/W.
A calculation for the heatsink can be made, with the following parameters:
Tamb(max) = 60 °C (example)
VCC = 18 V and RL = 4 Ω (SE)
Tj(max) = 150 °C (specification)
Rth(tot) is the total thermal resistance between the junction and the ambient including
the heatsink. This can be calculated using the maximum temperature increase
divided by the power dissipation:
Rth(tot) = (Tj(max) − Tamb(max))/PD
At VCC = 18 V and RL = 4 Ω (4 × SE) the measured worst-case sine-wave dissipation
is 17 W; see Figure 9. For Tj(max) = 150 °C the temperature raise, caused by the
power dissipation, is: 150 − 60 = 90 °C:
P × Rth(tot) = 90 °C
Rth(tot) = 90/17 = 5.29 K/W
Rth(h-a) = Rth(tot) − Rth(j-mb) = 5.29 − 1.3 = 3.99 K/W
This calculation is for an application at worst-case (stereo) sine-wave output signals.
In practice music signals will be applied, which decreases the maximum power
dissipation to approximately half of the sine-wave power dissipation of 9 W (see
Section 8.2.2). This allows for the use of a smaller heatsink:
P × Rth(tot) = 90 °C
Rth(tot) = 90/9 = 10 K/W
Rth(h-a) = Rth(tot) − Rth(j-mb) = 10 − 1.3 = 8.7 K/W
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9397 750 10779
Preliminary data
Rev. 01 — 06 February 2004
18 of 24
TDA8947J
Philips Semiconductors
4-channel audio amplifier
mce499
150
Tj
(˚C)
Tj
(˚C)
(1)
(2)
(3)
(4)
(1)
(5)
100
100
50
50
(2)
(3)
(4)
(5)
0
0
8
a.
mce500
150
12
20
16
8
24
28
VCC (V)
12
16
20
24
28
VCC (V)
Tamb = 25 °C; external heatsink of 5 K/W.
Tamb = 25 °C; external heatsink of 5 K/W.
(1) RL = 1 Ω.
(1) RL = 2 Ω.
(2) RL = 2 Ω.
(2) RL = 4 Ω.
(3) RL = 3 Ω.
(3) RL = 6 Ω.
(4) RL = 4 Ω.
(4) RL = 8 Ω.
(5) RL = 8 Ω.
(5) RL = 16 Ω.
4 times various SE loads with music signals.
b.
2 times various BTL loads with music signals.
Fig 15. Junction temperature as function of supply voltage for various loads with music signals.
14. Test information
14.1 Quality information
The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable.
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
9397 750 10779
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Rev. 01 — 06 February 2004
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TDA8947J
Philips Semiconductors
4-channel audio amplifier
15. Package outline
DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)
SOT243-1
non-concave
Dh
x
D
Eh
view B: mounting base side
A2
d
B
j
E
A
L3
L
Q
c
1
v M
17
e1
Z
bp
e
e2
m
w M
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A2
bp
c
D (1)
d
Dh
E (1)
mm
17.0
15.5
4.6
4.4
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
10
12.2
11.8
e
e2
Eh
j
L
L3
m
Q
v
w
x
Z (1)
5.08
6
3.4
3.1
12.4
11.0
2.4
1.6
4.3
2.1
1.8
0.8
0.4
0.03
2.00
1.45
e1
2.54 1.27
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-17
03-03-12
SOT243-1
Fig 16. Package outline.
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
9397 750 10779
Preliminary data
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20 of 24
TDA8947J
Philips Semiconductors
4-channel audio amplifier
16. Soldering
16.1 Introduction to soldering through-hole mount packages
This text gives a brief insight to wave, dip and manual soldering. A more in-depth
account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC
packages on a printed-circuit board.
16.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or
Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specified maximum storage temperature (Tstg(max)).
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
16.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400 °C, contact may be up to 5 seconds.
16.4 Package related soldering information
Table 12:
Suitability of through-hole mount IC packages for dipping and wave
soldering methods
Package
Soldering method
Dipping
Wave
DBS, DIP, HDIP, RDBS, SDIP, SIL
suitable
suitable[1]
PMFP[2]
−
not suitable
[1]
[2]
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
For PMFP packages hot bar soldering or manual soldering is suitable.
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TDA8947J
Philips Semiconductors
4-channel audio amplifier
17. Revision history
Table 13:
Revision history
Rev Date
01
20040206
CPCN
Description
-
Preliminary data (9397 750 10779)
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9397 750 10779
Preliminary data
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TDA8947J
Philips Semiconductors
4-channel audio amplifier
18. Data sheet status
Level
Data sheet status[1]
Product status[2][3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
[2]
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
19. Definitions
20. Disclaimers
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
Contact information
For additional information, please visit http://www.semiconductors.philips.com.
For sales office addresses, send e-mail to: [email protected].
Preliminary data
Fax: +31 40 27 24825
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
9397 750 10779
Rev. 01 — 06 February 2004
23 of 24
Philips Semiconductors
TDA8947J
4-channel audio amplifier
Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.2.1
8.2.2
8.3
8.4
8.5
9
10
11
12
13
13.1
13.2
13.2.1
13.2.2
13.3
14
14.1
15
16
16.1
16.2
16.3
16.4
17
18
19
20
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Input configuration . . . . . . . . . . . . . . . . . . . . . . 5
Power amplifier . . . . . . . . . . . . . . . . . . . . . . . . . 5
Output power measurement . . . . . . . . . . . . . . . 6
Headroom . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Mode selection . . . . . . . . . . . . . . . . . . . . . . . . . 6
Supply voltage ripple rejection . . . . . . . . . . . . . 7
Built-in protection circuits . . . . . . . . . . . . . . . . . 8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8
Thermal characteristics. . . . . . . . . . . . . . . . . . . 8
Static characteristics. . . . . . . . . . . . . . . . . . . . . 9
Dynamic characteristics . . . . . . . . . . . . . . . . . . 9
Application information. . . . . . . . . . . . . . . . . . 15
Application diagrams . . . . . . . . . . . . . . . . . . . 15
Printed-circuit board . . . . . . . . . . . . . . . . . . . . 17
Layout and grounding . . . . . . . . . . . . . . . . . . . 17
Power supply decoupling . . . . . . . . . . . . . . . . 17
Thermal behavior and heatsink calculation . . 18
Test information . . . . . . . . . . . . . . . . . . . . . . . . 19
Quality information . . . . . . . . . . . . . . . . . . . . . 19
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Introduction to soldering through-hole
mount packages . . . . . . . . . . . . . . . . . . . . . . 21
Soldering by dipping or by solder wave . . . . . 21
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 21
Package related soldering information . . . . . . 21
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 22
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 23
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
© Koninklijke Philips Electronics N.V. 2004.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 06 February 2004
Document order number: 9397 750 10779