TDA8947J 4-channel audio amplifier (SE: 1 W to 25 W; BTL: 4 W to 50 W) Rev. 01 — 06 February 2004 Preliminary data 1. General description The TDA8947J contains four identical audio power amplifiers. The TDA8947J can be used as: four Single-Ended (SE) channels with a fixed gain of 26 dB, two times Bridge-Tied Load (BTL) channels with a fixed gain of 32 dB or two times SE channels (26 dB gain) plus one BTL channel (32 dB gain) operating as a 2.1 system. The TDA8947J comes in a 17-pin Dil-Bent-Sil (DBS) power package. The TDA8947J is pin compatible with the TDA8944AJ and TDA8946AJ. The TDA8947J contains a unique protection circuit that is solely based on multiple temperature measurements inside the chip. This gives maximum output power for all supply voltages and load conditions with no unnecessary audio holes. Almost any supply voltage and load impedance combination can be made as long as thermal boundary conditions (number of channels used, external heatsink and ambient temperature) allow it. 2. Features ■ ■ ■ ■ ■ ■ ■ ■ ■ SE: 1 W to 25 W, BTL: 4 W to 50 W operation possibility (2.1 system) Soft clipping Standby and mute mode No on/off switching plops Low standby current High supply voltage ripple rejection Outputs short-circuit protected to ground, supply and across the load Thermally protected Pin compatible with TDA8944AJ and TDA8946AJ. ■ ■ ■ ■ Television PC speakers Boom box Mini and micro audio receivers. 3. Applications TDA8947J Philips Semiconductors 4-channel audio amplifier 4. Quick reference data Table 1: Quick reference data Symbol Parameter Conditions supply voltage VCC Min Typ Max Unit 9 18 26 V - - 28 V - 100 145 mA - - 10 µA VCC = 18 V 7 8.5 - W VCC = 22 V - 14 - W VCC = 18 V 16 18 - W VCC = 22 V - 29 - W SE; Po = 1 W - 0.1 0.5 % BTL; Po = 1 W - 0.05 0.5 % SE 25 26 27 dB BTL 31 32 33 dB SE; f = 1 kHz - 60 - dB BTL; f = 1 kHz - 65 - dB operating [1] no (clipping) signal Iq quiescent supply current Istb standby supply current Po(SE) SE output power Po(BTL) THD Gv(max) SVRR [1] BTL output power total harmonic distortion maximum voltage gain supply voltage ripple rejection VCC = 18 V; RL = ∞ THD = 10 %; RL = 4 Ω THD = 10 %; RL = 8 Ω The amplifier can deliver output power with non clipping output signals into nominal loads as long as the ratings of the IC are not exceeded. 5. Ordering information Table 2: Ordering information Type number Package TDA8947J DBS17P plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) Name Description SOT243-1 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 10779 Preliminary data Version Rev. 01 — 06 February 2004 2 of 24 TDA8947J Philips Semiconductors 4-channel audio amplifier 6. Block diagram VCC1 3 IN1+ VCC2 16 8 1 OUT1+ 60 kΩ IN2+ 6 4 OUT2− 60 kΩ IN3+ 9 14 OUT3− 60 kΩ IN4+ 12 17 OUT4+ 60 kΩ CIV 13 SHORT-CIRCUIT AND TEMPERATURE PROTECTION VCC SVR 11 0.5V CC Vref SGND MODE1 MODE2 7 10 5 STANDBY ALL MUTE ALL ON 1+2 TDA8947J MUTE 3+4 ON 3+4 2 GND1 15 MDB014 GND2 Fig 1. Block diagram. © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 10779 Preliminary data Rev. 01 — 06 February 2004 3 of 24 TDA8947J Philips Semiconductors 4-channel audio amplifier 7. Pinning information 7.1 Pinning OUT1+ 1 GND1 2 VCC1 3 OUT2− 4 MODE2 5 IN2+ 6 SGND 7 IN1+ 8 IN3+ 9 TDA8947J MODE1 10 SVR 11 IN4+ 12 CIV 13 OUT3− 14 GND2 15 VCC2 16 OUT4+ 17 MDB015 Fig 2. Pin configuration. 7.2 Pin description Table 3: Pin description Symbol Pin Description OUT1+ 1 non inverted loudspeaker output of channel 1 GND1 2 ground of channels 1 and 2 VCC1 3 supply voltage channels 1 and 2 OUT2− 4 inverted loudspeaker output of channel 2 MODE2 5 mode selection 2 input: mute and on for channels 3 and 4 IN2+ 6 input channel 2 SGND 7 signal ground IN1+ 8 input channel 1 IN3+ 9 input channel 3 MODE1 10 mode selection 1 input: standby, mute and on for all channels SVR 11 half supply voltage decoupling (ripple rejection) IN4+ 12 input channel 4 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 10779 Preliminary data Rev. 01 — 06 February 2004 4 of 24 TDA8947J Philips Semiconductors 4-channel audio amplifier Table 3: Pin description…continued Symbol Pin Description CIV 13 common input voltage decoupling OUT3− 14 inverted loudspeaker output of channel 3 GND2 15 ground of channels 3 and 4 VCC2 16 supply voltage channels 3 and 4 OUT4+ 17 non inverted loudspeaker output of channel 4 TAB - back side tab or heats spreader has to be connected to ground 8. Functional description 8.1 Input configuration The input cut-off frequency is: 1 f i ( cut – off ) = ----------------------------2π ( R i × C i ) (1) For SE application Ri = 60 kΩ and Ci = 220 nF: 1 f i ( cut – off ) = ---------------------------------------------------------------- = 12 Hz 3 –9 2π ( 60 × 10 × 220 × 10 ) (2) For BTL application Ri = 30 kΩ and Ci = 470 nF: 1 f i ( cut – off ) = ---------------------------------------------------------------- = 11 Hz 3 –9 2π ( 30 × 10 × 470 × 10 ) (3) As shown in Equation 2 and Equation 3, large capacitor values for the inputs are not necessary, so the switch-on delay during charging of the input capacitors can be minimized. This results in a good low frequency response and good switch-on behavior. 8.2 Power amplifier The power amplifier is a BTL and/or SE amplifier with an all-NPN output stage, capable of delivering a peak output current of 4 A. Using the TDA8947J as a BTL amplifier offers the following advantages: • • • • Low peak value of the supply current Ripple frequency on the supply voltage is twice the signal frequency No expensive DC-blocking capacitor Good low frequency performance. © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 10779 Preliminary data Rev. 01 — 06 February 2004 5 of 24 TDA8947J Philips Semiconductors 4-channel audio amplifier 8.2.1 Output power measurement The output power as a function of the supply voltage is measured on the output pins at THD = 10 %; see Figure 8. The maximum output power is limited by the supply voltage (VCC = 26 V) and the maximum output current (Io = 4 A repetitive peak current). For supply voltages VCC > 22 V, a minimum load is required; see Figure 5: • SE: RL = 3 Ω • BTL: RL = 6 Ω. 8.2.2 Headroom Typical CD music requires at least 12 dB (factor 15.85) dynamic headroom, compared to the average power output, for transferring the loudest parts without distortion. The Average Listening Level (ALL) music power, without any distortion, yields: • SE at Po(SE) = 5 W, VCC = 18 V, RL = 4 Ω and THD = 0.2 %: 3 5 ⋅ 10 P o ( ALL )SE = --------------- = 315 mW 15.85 (4) • BTL at Po(BTL) = 10 W, VCC = 18 V, RL = 8 Ω and THD = 0.1 %: 3 10 ⋅ 10 P o ( ALL )BTL = ------------------ = 630 mW 15.85 (5) The power dissipation can be derived from Figure 9 (SE and BTL) for a headroom of 0 dB and 12 dB, respectively. Table 4: Power rating as function of headroom Headroom Power output SE Power dissipation (all channels driven) BTL 0 dB Po = 5 W Po = 10 W PD = 17 W 12 dB Po(ALL) = 315 mW Po(ALL) = 630 mW PD = 9 W For heatsink calculation at the average listening level, a power dissipation of 9 W can be used. 8.3 Mode selection The TDA8947J has three functional modes which can be selected by applying the proper DC voltage to pin MODE1. Standby — The current consumption is very low and the outputs are floating. The device is in the standby mode when VMODE1 < 0.8 V, or when the MODE1 pin is grounded. In the standby mode, the function of pin MODE2 has been disabled. © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 10779 Preliminary data Rev. 01 — 06 February 2004 6 of 24 TDA8947J Philips Semiconductors 4-channel audio amplifier Mute — The amplifier is DC-biased, but not operational (no audio output). This allows the input coupling capacitors to be charged to avoid pop-noise. The device is in the mute mode when 4.5 V < VMODE1 < (VCC − 3.5 V). On — The amplifier is operating normally. The on mode is activated at VMODE1 > (VCC − 2.0 V). The output of channels 3 and 4 can be set to mute or on mode. The output channels 3 and 4 can be switched on/off by applying a proper DC voltage to pin MODE2, under the condition that the output channels 1 and 2 are in the on mode (see Figure 3). Table 5: Mode selection Voltage on pin MODE1 MODE2 0 to 0.8 V 0 to VCC Channel 1 and 2 Channel 3 and 4 (sub woofer) standby standby 4.5 to (VCC − 3.5 V) 0 to VCC mute mute (VCC − 2.0 V) to VCC 0 to (VCC − 3.5 V) on mute (VCC − 2 V) to VCC on on all standby 0.8 channels 1+2: on channels 3+4: on or mute all mute 4.5 VCC−3.5 VCC−2.0 VCC VMODE1 channels 3+4: mute channels 3+4: on VCC−3.5 MDB016 VCC−2.0 VCC VMODE2 Fig 3. Mode selection. 8.4 Supply voltage ripple rejection The Supply Voltage Ripple Rejection (SVRR) is measured with an electrolytic capacitor of 150 µF on pin SVR using a bandwidth of 20 Hz to 22 kHz. Figure 11 illustrates the SVRR as function of the frequency. A larger capacitor value on pin SVR improves the ripple rejection behavior at the lower frequencies. © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 10779 Preliminary data Rev. 01 — 06 February 2004 7 of 24 TDA8947J Philips Semiconductors 4-channel audio amplifier 8.5 Built-in protection circuits The TDA8947J contains two types of detection sensors: one measures local temperatures of the power stages and one measures the global chip temperature. At a local temperature of approximately 185 °C or a global temperature of approximately 150 °C, this detection circuit switches off the power stages for 2 ms. High impedance of the outputs is the result. After this time period the power stages switch on automatically and the detection will take place again; still a too high temperature switches off the power stages immediately. This protects the TDA8947J against shorts to ground, to the supply voltage and across the load, and against too high chip temperatures. The protection will only be activated when necessary, so even during a short-circuit condition, a certain amount of (pulsed) current will still be flowing through the short, just as much as the power stage can handle without exceeding the critical temperature level. 9. Limiting values Table 6: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter supply voltage VCC Conditions Min Max Unit operating −0.3 +26 V −0.3 +28 V no (clipping) signal [1] VI input voltage −0.3 VCC + 0.3 V IORM repetitive peak output current - 4 A Tstg storage temperature −55 +150 °C Tamb ambient temperature −40 +85 °C Ptot total power dissipation - 69 W VCC(sc) supply voltage to guarantee short-circuit protection - 24 V [1] non-operating The amplifier can deliver output power with non clipping output signals into nominal loads as long as the ratings of the IC are not exceeded. 10. Thermal characteristics Table 7: Thermal characteristics Symbol Parameter Conditions Value Unit Rth(j-a) thermal resistance from junction to ambient in free air 40 K/W Rth(j-c) thermal resistance from junction to case all channels driven 1.3 K/W © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 10779 Preliminary data Rev. 01 — 06 February 2004 8 of 24 TDA8947J Philips Semiconductors 4-channel audio amplifier 11. Static characteristics Table 8: Static characteristics VCC = 18 V; Tamb = 25 °C; RL = 8 Ω; VMODE1 = VCC; VMODE2 = VCC; Vi = 0 V; measured in test circuit Figure 12; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit supply voltage operating [1] 9 18 26 V no (clipping) signal [2] - - 28 V RL = ∞ [3] - 100 145 mA - - 10 µA Supply VCC Iq quiescent supply current Istb standby supply current Output pins VO ∆VOUT DC output voltage [4] - 9 - V differential output voltage offset [5] - - 170 mV VCC − 2.0 - VCC V 4.5 - VCC − 3.5 V 0 - 0.8 V VCC − 2.0 - VCC V BTL mode Mode selection pins VMODE1 selection voltage on pin MODE1 on mute standby [6] VMODE2 selection voltage on pin MODE2 on: channels 3 and 4 0 - VCC − 3.5 V IMODE1 selection current on pin MODE1 0 < VMODE1 < (VCC − 3.5 V) - - 20 µA IMODE2 selection current on pin MODE2 0 < VMODE2 < (VCC − 3.5 V) - - 20 µA mute: channels 3 and 4 [1] [2] [3] [4] [5] [6] A minimum load is required at supply voltages of VCC > 22 V: RL = 3 Ω for SE and RL = 6 Ω for BTL. The amplifier can deliver output power with non clipping output signals into nominal loads as long as the ratings of the IC are not exceeded. With a load connected at the outputs the quiescent current will increase. The DC output voltage, with respect to ground, is approximately 0.5VCC. ∆VOUT = VOUT+ − VOUT− Channels 3 and 4 can only be set to mute or on by MODE2 when VMODE1 > VCC − 2.0 V. 12. Dynamic characteristics Table 9: Dynamic characteristics SE VCC = 18 V; Tamb = 25 °C; RL = 4 Ω; f = 1 kHz; VMODE1 = VCC; VMODE2 = VCC; measured in test circuit Figure 12; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Po(SE) SE output power VCC = 18 V; see Figure 8a THD = 10 %; RL = 4 Ω 7 8.5 - W THD = 0.5 %; RL = 4 Ω - 6.5 - W - 14 - W - 0.1 0.5 % VCC = 22 V THD = 10 %; RL = 4 Ω THD total harmonic distortion Po = 1 W Gv voltage gain 25 26 27 dB Zi input impedance 40 60 - kΩ Vn(o) noise output voltage - 150 - µV [1] © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 10779 Preliminary data Rev. 01 — 06 February 2004 9 of 24 TDA8947J Philips Semiconductors 4-channel audio amplifier Table 9: Dynamic characteristics SE…continued VCC = 18 V; Tamb = 25 °C; RL = 4 Ω; f = 1 kHz; VMODE1 = VCC; VMODE2 = VCC; measured in test circuit Figure 12; unless otherwise specified. Symbol SVRR Parameter supply voltage ripple rejection Vo(mute) output voltage in mute mode αcs channel separation |Gv| channel unbalance [1] [2] [3] Conditions Min Typ Max Unit fripple = 1 kHz [2] - 60 - dB fripple = 100 Hz to 20 kHz [2] - 60 - dB [3] - - 150 µV 50 60 - dB - - 1 dB Rsource = 0 Ω The noise output voltage is measured at the output in a frequency range from 20 Hz to 22 kHz (unweighted), with a source impedance Rsource = 0 Ω at the input. Supply voltage ripple rejection is measured at the output, with a source impedance Rsource = 0 Ω at the input and with a frequency range from 20 Hz to 22 kHz (unweighted). The ripple voltage is a sine wave with a frequency fripple and an amplitude of 300 mV (RMS), which is applied to the positive supply rail. Output voltage in mute mode is measured with VMODE1 = VMODE2 = 7 V, and Vi = 1 V (RMS) in a bandwidth from 20 Hz to 22 kHz, including noise. Table 10: Dynamic characteristics BTL VCC = 18 V; Tamb = 25 °C; RL = 8 Ω; f = 1 kHz; VMODE1 = VCC; VMODE2 = VCC; measured in test circuit Figure 12; unless otherwise specified. Symbol Parameter Conditions Po(BTL) BTL output power VCC = 18 V; see Figure 8b Min Typ Max Unit THD = 10 %; RL = 8 Ω 16 18 - W THD = 0.5 %; RL = 8 Ω - 14 - W - 29 - W - 0.05 0.5 % 31 32 33 dB VCC = 22 V THD = 10 %; RL = 8 Ω THD total harmonic distortion Gv voltage gain Zi input impedance Vn(o) noise output voltage SVRR supply voltage ripple rejection Vo(mute) output voltage in mute mode αcs channel separation |Gv| channel unbalance [1] [2] [3] Po = 1 W 20 30 - kΩ [1] - 200 - µV fripple = 1 kHz [2] - 65 - dB fripple = 100 Hz to 20 kHz [2] - 65 - dB [3] - - 250 µV 50 65 - dB - - 1 dB Rsource = 0 Ω The noise output voltage is measured at the output in a frequency range from 20 Hz to 22 kHz (unweighted), with a source impedance Rsource = 0 Ω at the input. Supply voltage ripple rejection is measured at the output, with a source impedance Rsource = 0 Ω at the input and with a frequency range from 20 Hz to 22 kHz (unweighted). The ripple voltage is a sine wave with a frequency fripple and an amplitude of 300 mV (RMS), which is applied to the positive supply rail. Output voltage in mute mode is measured with VMODE1 = VMODE2 = 7 V, and Vi = 1 V (RMS) in a bandwidth from 20 Hz to 22 kHz, including noise. © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 10779 Preliminary data Rev. 01 — 06 February 2004 10 of 24 TDA8947J Philips Semiconductors 4-channel audio amplifier coc005 107 Vo (µV) 106 105 104 103 102 10 1 0 4 8 16 20 VMODE1 (V) 12 BTL; VCC = 18 V; Vi = 50 mV. Fig 4. AC output voltage as function of voltage on pin MODE1. MCE485 60 MCE484 60 Po (W) Po (W) 40 40 4Ω 6Ω 8Ω 2Ω 3Ω 20 RL = 2 Ω 20 16 Ω 4Ω RL = 1 Ω 8Ω 0 0 8 12 16 20 24 28 VCC (V) 8 THD = 10 %; one channel. a. SE 12 16 20 24 28 VCC (V) THD = 10 %; one channel. b. BTL Fig 5. Output power as function of supply voltage at various loads © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 10779 Preliminary data Rev. 01 — 06 February 2004 11 of 24 TDA8947J Philips Semiconductors 4-channel audio amplifier MCE488 102 THD+N (%) THD+N (%) 10 10 1 1 10−1 10−1 10−2 10−1 1 10 Po (W) 10−2 10−1 102 VCC = 18 V; f = 1 kHz; RL = 4 Ω. a. MCE487 102 1 10 102 Po (W) VCC = 18 V; f = 1 kHz; RL = 8 Ω. SE b. BTL Fig 6. Total harmonic distortion-plus-noise as function of output power. MCE489 10 THD+N (%) THD+N (%) 1 1 10−1 10−1 10−2 10 102 103 104 f (Hz) 10−2 10 105 VCC = 18 V; Po = 1 W; RL = 4 Ω. a. SE MCE490 10 102 103 104 f (Hz) 105 VCC = 18 V; Po = 1 W; RL = 8 Ω. b. BTL Fig 7. Total harmonic distortion-plus-noise as function of frequency. © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 10779 Preliminary data Rev. 01 — 06 February 2004 12 of 24 TDA8947J Philips Semiconductors 4-channel audio amplifier MCE491 50 Po (W) 40 40 30 30 20 20 10 10 0 0 8 12 16 20 24 28 VCC (V) 8 THD = 10%; RL = 4 Ω; f = 1 kHz. a. MCE492 50 Po (W) 12 16 20 24 28 VCC (V) THD = 10%; RL = 8 Ω; f = 1 kHz. SE b. BTL Fig 8. Output power as function of supply voltage. MCE493 20 PD (W) 16 16 12 12 8 8 4 4 0 0 0 4 8 12 16 Po (W) 0 20 VCC = 18 V; RL = 4 Ω. a. MCE494 20 PD (W) SE 4 8 12 16 Po (W) 20 VCC = 18 V; RL = 8 Ω. b. BTL Fig 9. Total power dissipation as function of channel output power per channel (worst case, all channels driven). © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 10779 Preliminary data Rev. 01 — 06 February 2004 13 of 24 TDA8947J Philips Semiconductors 4-channel audio amplifier MCE495 0 αcs (dB) αcs (dB) −20 −20 −40 −40 −60 −60 −80 −80 −100 10 102 103 104 MCE496 0 −100 10 105 102 103 104 f (Hz) VCC = 18 V; RL = 4 Ω. a. 105 f (Hz) VCC = 18 V; RL = 8 Ω. SE b. BTL Fig 10. Channel separation as function of frequency (no bandpass filter applied). MCE497 0 SVRR (dB) SVRR (dB) −20 −20 −40 −40 −60 −60 −80 10 a. 102 103 104 f (Hz) MCE498 0 −80 10 105 102 103 104 f (Hz) 105 VCC = 18 V; Rsource = 0 Ω; Vripple = 300 mV (RMS). VCC = 18 V; Rsource = 0 Ω; Vripple = 300 mV (RMS). A bandpass filter of 20 Hz to 22 kHz has been applied. A bandpass filter of 20 Hz to 22 kHz has been applied. Inputs short-circuited. Inputs short-circuited. SE b. BTL Fig 11. Supply voltage ripple rejection as function of frequency. © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 10779 Preliminary data Rev. 01 — 06 February 2004 14 of 24 TDA8947J Philips Semiconductors 4-channel audio amplifier 13. Application information 13.1 Application diagrams VCC VCC1 3 220 nF 16 IN1+ 8 Vi 1000 µF 100 nF VCC2 1 OUT1+ + 60 kΩ 220 nF − IN2+ 6 Vi 4 OUT2− − 60 kΩ + Vi RL 4Ω 14 OUT3− IN3+ 9 470 nF RL 4Ω − 60 kΩ + 17 OUT4+ IN4+ 12 470 µF RL 8Ω 60 kΩ CIV 13 SHORT-CIRCUIT AND TEMPERATURE PROTECTION VCC VCC 10 kΩ 50 kΩ 100 kΩ microcontroller 270 Ω BC547 7.5 V BC547 22 µF 2.2 µF SVR 11 0.5V CC Vref 47 µF SGND 7 1.5 kΩ MODE1 10 VCC MODE2 5 STANDBY ALL MUTE ALL ON 1 + 2 MUTE 3 + 4 ON 3 + 4 TDA8947J 2 15 GND1 GND2 mdb017 Fig 12. Typical application diagram without on/off switching plops. Table 11: Amplifier selection by microcontroller Microcontroller with open-collector output; see Figure 12 Microcontroller Channels 1 and 2 Channels 3 and 4 LOW on on HIGH mute mute © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 10779 Preliminary data Rev. 01 — 06 February 2004 15 of 24 TDA8947J Philips Semiconductors 4-channel audio amplifier VCC VCC1 3 220 nF 16 IN1+ 8 Vi 1000 µF 100 nF VCC2 1 OUT1+ + 60 kΩ 220 nF − IN2+ 6 4 OUT2− − Vi 60 kΩ + − 60 kΩ + Vi RL 4Ω 14 OUT3− IN3+ 9 470 nF RL 4Ω 450 µF RL 8Ω 17 OUT4+ IN4+ 12 60 kΩ CIV 13 SHORT-CIRCUIT AND TEMPERATURE PROTECTION VCC 22 µF SVR 11 0.5V CC 150 µF Vref SGND 7 MODE1 10 MICROCONTROLLER VCC MODE2 5 STANDBY ALL MUTE ALL ON 1+2 TDA8947J MUTE 3+4 ON 3+4 2 15 GND1 GND2 MDB018 Fig 13. Application diagram with one pin control and reduction of capacitor. Remark: Because of switching inductive loads, the output voltage can rise beyond the maximum supply voltage of 28 V. At high supply voltages, it is recommended to use (Schottky) diodes to the supply voltage and ground. © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 10779 Preliminary data Rev. 01 — 06 February 2004 16 of 24 TDA8947J Philips Semiconductors 4-channel audio amplifier 13.2 Printed-circuit board 13.2.1 Layout and grounding To obtain a high-level system performance, certain grounding techniques are essential. The input reference grounds have to be tied with their respective source grounds and must have separate tracks from the power ground tracks; this will prevent the large (output) signal currents from interfering with the small AC input signals. The small-signal ground tracks should be physically located as far as possible from the power ground tracks. Supply and output tracks should be as wide as possible for delivering maximum output power. AUDIO POWER CS NIJMEGEN PF / 3002 .naJ 72 TVA 220 nF 220 nF 100 nF 4Ω 1 4Ω 1 BTL4/3 4Ω 220 nF BTL1/2 4Ω 220 nF 4Ω 220 nF CIV 4.7 nF 220 nF +SE3− 4Ω 1000 µF 22 220 µF µF 1000 µF 1000 µF +SE2− 1000 µF SVF −SE4+ MODE1 BTL3/4 MODE2 +SE1− 150 µF OFF 10 kΩ + Vp IN2+ IN1+ IN3+ IN4+ VOL.Sgnd 10 kΩ SB ON MUTE ON MCE483 Fig 14. Printed-circuit board layout (single-sided); components view. 13.2.2 Power supply decoupling Proper supply bypassing is critical for low-noise performance and high supply voltage ripple rejection. The respective capacitor location should be as close as possible to the device and grounded to the power ground. Proper power supply decoupling also prevents oscillations. For suppressing higher frequency transients (spikes) on the supply line a capacitor with low ESR, typical 100 nF, has to be placed as close as possible to the device. For suppressing lower frequency noise and ripple signals, a large electrolytic capacitor, e.g. 1000 µF or greater, must be placed close to the device. The bypass capacitor on pin SVR reduces the noise and ripple on the mid rail voltage. For good THD and noise performance a low ESR capacitor is recommended. © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 10779 Preliminary data Rev. 01 — 06 February 2004 17 of 24 TDA8947J Philips Semiconductors 4-channel audio amplifier 13.3 Thermal behavior and heatsink calculation The measured maximum thermal resistance of the IC package, Rth(j-mb), is 1.3 K/W. A calculation for the heatsink can be made, with the following parameters: Tamb(max) = 60 °C (example) VCC = 18 V and RL = 4 Ω (SE) Tj(max) = 150 °C (specification) Rth(tot) is the total thermal resistance between the junction and the ambient including the heatsink. This can be calculated using the maximum temperature increase divided by the power dissipation: Rth(tot) = (Tj(max) − Tamb(max))/PD At VCC = 18 V and RL = 4 Ω (4 × SE) the measured worst-case sine-wave dissipation is 17 W; see Figure 9. For Tj(max) = 150 °C the temperature raise, caused by the power dissipation, is: 150 − 60 = 90 °C: P × Rth(tot) = 90 °C Rth(tot) = 90/17 = 5.29 K/W Rth(h-a) = Rth(tot) − Rth(j-mb) = 5.29 − 1.3 = 3.99 K/W This calculation is for an application at worst-case (stereo) sine-wave output signals. In practice music signals will be applied, which decreases the maximum power dissipation to approximately half of the sine-wave power dissipation of 9 W (see Section 8.2.2). This allows for the use of a smaller heatsink: P × Rth(tot) = 90 °C Rth(tot) = 90/9 = 10 K/W Rth(h-a) = Rth(tot) − Rth(j-mb) = 10 − 1.3 = 8.7 K/W © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 10779 Preliminary data Rev. 01 — 06 February 2004 18 of 24 TDA8947J Philips Semiconductors 4-channel audio amplifier mce499 150 Tj (˚C) Tj (˚C) (1) (2) (3) (4) (1) (5) 100 100 50 50 (2) (3) (4) (5) 0 0 8 a. mce500 150 12 20 16 8 24 28 VCC (V) 12 16 20 24 28 VCC (V) Tamb = 25 °C; external heatsink of 5 K/W. Tamb = 25 °C; external heatsink of 5 K/W. (1) RL = 1 Ω. (1) RL = 2 Ω. (2) RL = 2 Ω. (2) RL = 4 Ω. (3) RL = 3 Ω. (3) RL = 6 Ω. (4) RL = 4 Ω. (4) RL = 8 Ω. (5) RL = 8 Ω. (5) RL = 16 Ω. 4 times various SE loads with music signals. b. 2 times various BTL loads with music signals. Fig 15. Junction temperature as function of supply voltage for various loads with music signals. 14. Test information 14.1 Quality information The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable. © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 10779 Preliminary data Rev. 01 — 06 February 2004 19 of 24 TDA8947J Philips Semiconductors 4-channel audio amplifier 15. Package outline DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L3 L Q c 1 v M 17 e1 Z bp e e2 m w M 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 bp c D (1) d Dh E (1) mm 17.0 15.5 4.6 4.4 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 12.2 11.8 e e2 Eh j L L3 m Q v w x Z (1) 5.08 6 3.4 3.1 12.4 11.0 2.4 1.6 4.3 2.1 1.8 0.8 0.4 0.03 2.00 1.45 e1 2.54 1.27 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-17 03-03-12 SOT243-1 Fig 16. Package outline. © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 10779 Preliminary data Rev. 01 — 06 February 2004 20 of 24 TDA8947J Philips Semiconductors 4-channel audio amplifier 16. Soldering 16.1 Introduction to soldering through-hole mount packages This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board. 16.2 Soldering by dipping or by solder wave Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 16.3 Manual soldering Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. 16.4 Package related soldering information Table 12: Suitability of through-hole mount IC packages for dipping and wave soldering methods Package Soldering method Dipping Wave DBS, DIP, HDIP, RDBS, SDIP, SIL suitable suitable[1] PMFP[2] − not suitable [1] [2] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. For PMFP packages hot bar soldering or manual soldering is suitable. © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 10779 Preliminary data Rev. 01 — 06 February 2004 21 of 24 TDA8947J Philips Semiconductors 4-channel audio amplifier 17. Revision history Table 13: Revision history Rev Date 01 20040206 CPCN Description - Preliminary data (9397 750 10779) © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 10779 Preliminary data Rev. 01 — 06 February 2004 22 of 24 TDA8947J Philips Semiconductors 4-channel audio amplifier 18. Data sheet status Level Data sheet status[1] Product status[2][3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 19. Definitions 20. Disclaimers Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Contact information For additional information, please visit http://www.semiconductors.philips.com. For sales office addresses, send e-mail to: [email protected]. Preliminary data Fax: +31 40 27 24825 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 9397 750 10779 Rev. 01 — 06 February 2004 23 of 24 Philips Semiconductors TDA8947J 4-channel audio amplifier Contents 1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 8.2.1 8.2.2 8.3 8.4 8.5 9 10 11 12 13 13.1 13.2 13.2.1 13.2.2 13.3 14 14.1 15 16 16.1 16.2 16.3 16.4 17 18 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Input configuration . . . . . . . . . . . . . . . . . . . . . . 5 Power amplifier . . . . . . . . . . . . . . . . . . . . . . . . . 5 Output power measurement . . . . . . . . . . . . . . . 6 Headroom . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Mode selection . . . . . . . . . . . . . . . . . . . . . . . . . 6 Supply voltage ripple rejection . . . . . . . . . . . . . 7 Built-in protection circuits . . . . . . . . . . . . . . . . . 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8 Thermal characteristics. . . . . . . . . . . . . . . . . . . 8 Static characteristics. . . . . . . . . . . . . . . . . . . . . 9 Dynamic characteristics . . . . . . . . . . . . . . . . . . 9 Application information. . . . . . . . . . . . . . . . . . 15 Application diagrams . . . . . . . . . . . . . . . . . . . 15 Printed-circuit board . . . . . . . . . . . . . . . . . . . . 17 Layout and grounding . . . . . . . . . . . . . . . . . . . 17 Power supply decoupling . . . . . . . . . . . . . . . . 17 Thermal behavior and heatsink calculation . . 18 Test information . . . . . . . . . . . . . . . . . . . . . . . . 19 Quality information . . . . . . . . . . . . . . . . . . . . . 19 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Introduction to soldering through-hole mount packages . . . . . . . . . . . . . . . . . . . . . . 21 Soldering by dipping or by solder wave . . . . . 21 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 21 Package related soldering information . . . . . . 21 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 22 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 23 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 © Koninklijke Philips Electronics N.V. 2004. Printed in The Netherlands All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 06 February 2004 Document order number: 9397 750 10779