PHILIPS GTL2000

INTEGRATED CIRCUITS
GTL2000
22-bit GTL processor voltage clamp
Product specification
Supersedes data of 1999 Apr 05
2000 Jan 25
Philips Semiconductors
Product specification
22-bit GTL processor voltage clamp
GTL2000
FEATURES
PIN CONFIGURATION
• Direct interface with TTL level
• 6.5Ω ON-state connection between port Sn and Dn
GND 1
48
GREF
SREF 2
47
DREF
DESCRIPTION
S1 3
46
D1
The GTL2000 provides twenty-two bits of high-speed voltage
clamps. The low ON-state resistance of the clamp allows
connections to be made with minimal propagation delay.
S2 4
45
D2
S3 5
44
D3
S4 6
43
D4
S5 7
42
D5
S6 8
41
D6
S7 9
40
D7
S8 10
39
D8
S9 11
38
D9
S10 12
37
D10
The device is organized as one 22-bit voltage clamp. When S or D
is low the clamp is in the ON–state and a low resistance connection
exists between the S and D ports. When S port and D port are high,
the clamp is in the OFF-state and a very high impedance exists
between the S and D ports. When the D port is high, the voltage on
the S port is clamped to the applied reference voltage on the GREF
port.
FUNCTION TABLE
Driven
Input
Output of
Driven Input
off
X
X
VTT
on
H
VTT1
H
VTT
nearly off
VTT
H2
L
L
VTT
on
L
L3
L
L
0 – VTT
off
X
X
GREF
DREF
SREF4
Switch
H
H
0V
H
H
H
H = High voltage level
L = Low voltage level
X = Don’t Care
NOTES:
1. The output is not pulled up or pulled down.
2. The output is pulled up to VCC through an external resistor.
3. The driven output can be Sn or Dn; the output of drivn input
follows the input low.
4. GREF must be at least 1.5 V higher than SREF for proper switch
operation.
S11 13
36
D11
S12 14
35
D12
S13 15
34
D13
S14 16
33
D14
S15 17
32
D15
S16 18
31
D16
S17 19
30
D17
S18 20
29
D18
S19 21
28
D19
S20 22
27
D20
S21 23
26
D21
S22 24
25
D22
SA00521
QUICK REFERENCE DATA
SYMBOL
CONDITIONS
Tamb = 25°C; GND = 0V
PARAMETER
TYPICAL
UNIT
tPLH
Propagation delay
Sn to Dn
VDD1 = 3.3 V; VDD2 = 2.5 V;
VREF = 1.5 V; unloaded
1.5
ns
COFF
Channel capacitance (OFF-state)
VS = 1.5 V
7.5
pF
ORDERING INFORMATION
PACKAGES
48-Pin Plastic SSOP Type II
2000 Jan 25
TEMPERATURE RANGE
ORDER CODE
DWG NUMBER
0°C to +85°C
GTL2000 DL
SOT370–1
2
853-2154 23030
Philips Semiconductors
Product specification
22-bit GTL processor voltage clamp
GTL2000
PIN DESCRIPTION
CLAMP SCHEMATIC
PIN
NUMBER
SYMBOL
1
GND
Ground (0V)
2
SREF
Source of reference transistor
NAME AND FUNCTION
3 – 24
Sn
Port S1 to Port S22
25 – 46
Dn
Port D1 to Port D22
47
DREF
Drain of reference transistor
48
GREF
Gate of reference transistor
DREF
GREF
SREF
D1
D22
S1
S22
SA00522
ABSOLUTE MAXIMUM RATINGS1, 2, 3
SYMBOL
RATING
UNIT
VS_REF
DC source reference voltage
PARAMETER
CONDITIONS
–0.5 to +7.0
V
VD_REF
DC drain reference voltage
–0.5 to +7.0
V
VG_REF
DC gate reference voltage
–0.5 to +7.0
V
VSn
DC voltage Port Sn
–0.5 to +7.0
V
VDn
DC voltage Port Dn
–0.5 to +7.0
V
DC reference diode current
VI < 0
–50
mA
ISK
DC diode current Port Sn
VI < 0
–50
mA
IDK
DC diode current Port Dn
VI < 0
–50
mA
Channel in ON-state
±35
mA
–65 to +150
°C
IREFK
IMAX
DC clamp current per channel
Tstg
Storage temperature range
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3. The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
CONDITIONS
LIMITS
Min
Max
UNIT
VS_REF
DC source reference voltage
1.0
4.4
V
VD_REF
DC drain reference voltage
VS_REF + 0.6
5
V
VG_REF
DC gate reference voltage
VS_REF + 0.6
5
V
VS_REF
5
V
VSn
DC voltage Port Sn (OFF-state)
VSn
DC voltage Port Sn (ON-state)
0
0.2
V
VDn
DC voltage Port Dn (OFF-state)
VS_REF
5
V
VDn
DC voltage Port Dn (ON-state)
0
0.4
V
IS
Switch input leakage current
(OFF-state) for Sn and Dn I/O
VS , VD = 5 V
15
µA
II
GREF input leakage current
VG = 5 V
2.5
µA
Operating ambient temperature range
In free air
+85
°C
Tamb
2000 Jan 25
0
3
Philips Semiconductors
Product specification
22-bit GTL processor voltage clamp
GTL2000
DC CHARACTERISTICS for VDD1 = 3.0 to 3.6 V; VDD2 = 2.36 to 2.64 V; VREF = 1.365 to 1.635 V range
Over recommended operating conditions. Voltage are referenced to GND (ground = 0 V). Refer to the Test Circuit diagram.
LIMITS
SYMBOL
PARAMETER
TEST CONDITIONS
Tamb = 0°C to +85°C
MIN
VOL
LOW level output voltage
VS = 0.175 V; ICLAMP = 15.2 mA
TYP1
MAX
260
350
UNIT
mV
NOTE:
1. All typical values are measured at VDD1 = 3.3 V, VDD2 = 2.5 V, VREF = 1.5 V and Tamb = 25°C
AC CHARACTERISTICS for VDD1 = 3.0 to 3.6 V; VDD2 = 2.36 to 2.64 V; VREF = 1.365 to 1.635 V range
GND = 0V; tr = tf ≤ 3.0 ns. Refer to the Test Circuit diagram.
LIMITS
SYMBOL
PARAMETER
Tamb = 0°C to +85°C
WAVEFORM
Propagation delay
Sn to Dn; Dn to Sn
tPLH2
MIN
TYP1
MAX
0.5
1.5
5.5
UNIT
ns
NOTES:
1. All typical values are measured at VDD1 = 3.3 V, VDD2 = 2.5 V, VREF = 1.5 V and Tamb = 25°C.
2. Propagation delay guaranteed by characterization.
3. CON,MAX of 30 pF and a COFF,MAX of 15 pF is guaranteed by design.
AC WAVEFORMS
TEST CIRCUIT
VDD1
VDD2
VDD2
VDD2
VI
INPUT
150Ω
200KΩ
VM
150Ω
150Ω
VM
GND
OUTPUT
HIGH-to-LOW
LOW-to-HIGH
VOL
VDD2
OUTPUT
HIGH-to-LOW
LOW-to-HIGH
VOL
DUT
tPLH
tPHL
VDD2
0
0
DREF
VM
GREF
D1
D22
S1
S22
VM
tPHL
tPLH
tPHL
tPLH
1
1
VM
SREF
VM
SA00524
VREF
Waveform 1. The Input (Sn) to Output (Dn) Propagation Delays
PULSE
GENERATOR
SA00523
Waveform 2. Load circuit
2000 Jan 25
4
Philips Semiconductors
Product specification
22-bit GTL processor voltage clamp
GTL2000
SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm
2000 Jan 25
5
SOT370-1
Philips Semiconductors
Product specification
22-bit GTL processor voltage clamp
GTL2000
Data sheet status
Data sheet
status
Product
status
Definition [1]
Objective
specification
Development
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
Preliminary
specification
Qualification
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
Product
specification
Production
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
 Copyright Philips Electronics North America Corporation 2000
All rights reserved. Printed in U.S.A.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Date of release: 01-00
Document order number:
2000 Jan 25
6
9397–750-06818