TI TMS320C6670AXCYPA

TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
Data Manual
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Literature Number: SPRS689D
March 2012
TMS320C6670
Data Manual
SPRS689D—March 2012
www.ti.com
Release History
Revision
Date
Description/Comments
D
March 2012
Updated PASS PLL section (block diagram, PASS PLL Control Register, and initialization sequence)
Updated Switch Fabric Matrix tables with bridge numbers and added Switch Fabric block diagrams
Updated the JTAGID register table
Restricted Output_Divide of SECCTL to max value of divide by 2
Changed TPTCn to EDMA3TCn and TPCCn to EDMA3CCn throughout the data manual
Replaced all INTC with CIC and CPT with Tracer throughout the document
Updated main PLL lock time
Added DDR3PLL and PASS PLL Reset bits in DDR3PLLCTL1 and PASSPLLCTL1 registers
Added the DDR3PLL and PASSPLL Initialization Sequence
Added po_vcon_smpserr_intr SmartReflex event
Corrected the SPI and DDR3/Hyperbridge Config Memory Map end address
C
October 2011
Added DEVSPEED Register section
Removed Parameter Information section from chapter 7 as the content was not relevant
Added more description to Boot Sequence section
Changed all footnote references from CORECLK to SYSCLK1
Corrected the typo in the address of MACID2
Re-arranged the wording for description of SYSCLK1
Removed example from footnote
Updated footnote on AIF jitter value to 4 ps RMS
B
August 2011
Revised the INTC1 Events Input table, description for BWADJ field, and power sequencing timing tables and diagrams
Removed all mentions of HHV and the Max parameters for PHY Sync and Radio Sync Pulses
Updated the GMacs and GFlops for 1.2 GHz and changed output skew time for the trace from 500 ps to 1ns
Added thermal values to the thermal resistance characteristics table, and Power Supply to Peripheral I/O Mapping table
Added register and field description table for DDR3PLLCTL1, PASSPLLCTL1, and SerDes status and config registers
Corrected RESET electrical timing parameters
Updated all PLL block Diagrams – Main PLL, DDR PLL, and PASS PLL
Completed all tables in Device Operating Conditions chapter
Updated/Added Master and Priv ID tables, added MasterID Settings table
Added MMR space
A
April 2011
Updated the power-up sequencing section. RESETFULL must always de-assert after POR
Updated the description of VARIANT bit field in JTAGID register
Added Setup and Hold times for RP1CLK and RP1CLK signals, and BWADJ field to DDR3PLLCTL and PASSPLLCTL
Corrected the size of TETBs for the 4 cores from 16k to 4k
Added RSV0A and RSV0B pins to the terminal list table
Revised power rail terminology and changed reference parameter in t2c description from t7 to t6
Added a note on Level Interrupts and EOI values for various modules
Corrected the address range for I2C MMRs and corrected extended temp max to 100C from 105C
SPRS689
February 2011
Initial Release
For detailed revision information, see ‘‘Revision History’’ on page A-219.
2
Release History
Copyright 2012 Texas Instruments Incorporated
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
www.ti.com
Contents
1
TMS320C6670 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
1.1 KeyStone Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
1.2 Device Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
1.3 Functional Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
2
Device Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
3
Device Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Memory Map Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
Boot Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
Boot Modes Supported and PLL Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
2.4.1 Boot Device Field . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
2.4.2 Device Configuration Field . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
2.4.3 PLL Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
Second-Level Bootloaders . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
Terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
2.6.1 Package Terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
2.6.2 Pin Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
Terminal Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41
Development . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64
2.8.1 Development Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64
2.8.2 Device Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64
Related Documentation from Texas Instruments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .66
Device Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67
3.1 Device Configuration at Device Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67
3.2 Peripheral Selection After Device Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68
3.3 Device State Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68
3.3.1 Device Status (DEVSTAT) Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .71
3.3.2 Device Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .72
3.3.3 JTAG ID (JTAGID) Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73
3.3.4 Kicker Mechanism (KICK0 and KICK1) Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73
3.3.5 LRESETNMI PIN Status (LRSTNMIPINSTAT) Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73
3.3.6 LRESETNMI PIN Status Clear (LRSTNMIPINSTAT_CLR) Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .74
3.3.7 Reset Status (RESET_STAT) Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75
3.3.8 Reset Status Clear (RESET_STAT_CLR) Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75
3.3.9 Boot Complete (BOOTCOMPLETE) Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76
3.3.10 Power State Control (PWRSTATECTL) Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
3.3.11 NMI Event Generation to CorePac (NMIGRx) Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
3.3.12 IPC Generation (IPCGRx) Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
3.3.13 IPC Acknowledgement (IPCARx) Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .79
3.3.14 IPC Generation Host (IPCGRH) Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .79
3.3.15 IPC Acknowledgement Host (IPCARH) Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .80
3.3.16 Timer Input Selection Register (TINPSEL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .80
3.3.17 Timer Output Selection Register (TOUTPSEL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .82
3.3.18 Reset Mux (RSTMUXx) Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .83
3.3.19 Device Speed (DEVSPEED) Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .84
3.4 Pullup/Pulldown Resistors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .85
4
System Interconnect. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .86
4.1
4.2
4.3
4.4
5
Internal Buses and Switch Fabrics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .86
Switch Fabric Connections Matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .87
TeraNet Switch Fabric Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .91
Bus Priorities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .97
C66x CorePac . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .98
5.1 Memory Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .99
5.1.1 L1P Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .99
5.1.2 L1D Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
5.1.3 L2 Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Copyright 2012 Texas Instruments Incorporated
Contents
3
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
5.2
5.3
5.4
5.5
5.6
6
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Supply to Peripheral I/O Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
105
106
107
108
TMS320C6670 Peripheral Information and Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
7.1 Recommended Clock and Control Signal Transition Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.2 Power Supplies. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.2.1 Power-Up Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.2.2 Power-Down Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.2.3 Power Supply Decoupling and Bulk Capacitors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.2.4 SmartReflex. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.3 Power Sleep Controller (PSC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.3.1 Power Domains . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.3.2 Clock Domains. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.3.3 PSC Register Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.4 Reset Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.4.1 Power-on Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.4.2 Hard Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.4.3 Soft Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.4.4 Local Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.4.5 Reset Priority . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.4.6 Reset Controller Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.4.7 Reset Electrical Data/Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.5 Main PLL and the PLL Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.5.1 Main PLL Controller Device-Specific Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.5.2 PLL Controller Memory Map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.5.3 Main PLL Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.5.4 Main PLL and PLL Controller Initialization Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.5.5 Main PLL Controller/SRIO/HyperLink/PCIe Clock Input Electrical Data/Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.6 DDR3 PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.6.1 DDR3 PLL Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.6.2 DDR3 PLL Device-Specific Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.6.3 DDR3 PLL Initialization Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.6.4 DDR3 PLL Input Clock Electrical Data/Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.7 PASS PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.7.1 PASS PLL Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.7.2 PASS PLL Device-Specific Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.7.3 PASS PLL Initialization Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.7.4 PASS PLL Input Clock Electrical Data/Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.8 Enhanced Direct Memory Access (EDMA3) Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.8.1 EDMA3 Device-Specific Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.8.2 EDMA3 Channel Controller Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.8.3 EDMA3 Transfer Controller Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.8.4 EDMA3 Channel Synchronization Events. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.9 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.9.1 Interrupt Sources and Interrupt Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.9.2 CIC Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.9.3 Inter-Processor Register Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.9.4 NMI and LRESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.9.5 External Interrupts Electrical Data/Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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5.1.4 MSM SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.1.5 L3 Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memory Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Bandwidth Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power-Down Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CorePac Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
C66x CorePac Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Copyright 2012 Texas Instruments Incorporated
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
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7.10 Memory Protection Unit (MPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.10.1 MPU Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.10.2 MPU Programmable Range Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.11 DDR3 Memory Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.11.1 DDR3 Memory Controller Device-Specific Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.11.2 DDR3 Memory Controller Electrical Data/Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.12 I2C Peripheral . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.12.1 I2C Device-Specific Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.12.2 I2C Peripheral Register Description(s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.12.3 I2C Electrical Data/Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.13 SPI Peripheral . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.13.1 SPI Electrical Data/Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.14 HyperLink Peripheral . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.15 UART Peripheral. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.16 PCIe Peripheral. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.17 Packet Accelerator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.18 Security Accelerator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.19 Gigabit Ethernet (GbE) Switch Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.20 Management Data Input/Output (MDIO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.21 Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.21.1 Timers Device-Specific Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.21.2 Timers Electrical Data/Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.22 Rake Search Accelerator (RSA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.23 Enhanced Viterbi-Decoder Coprocessor (VCP2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.24 Turbo Decoder Coprocessor (TCP3d). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.25 Turbo Encoder Coprocessor (TCP3e) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.26 Bit Rate Coprocessor (BCP). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.27 Serial RapidIO (SRIO) Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.28 General-Purpose Input/Output (GPIO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.28.1 GPIO Device-Specific Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.28.2 GPIO Electrical Data/Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.29 Semaphore2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.30 Antenna Interface Subsystem 2 (AIF2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.31 Receive Accelerator Coprocessor (RAC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.32 Transmit Accelerator Coprocessor (TAC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.33 Fast Fourier Transform Coprocessor (FFTC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.34 Emulation Features and Capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.34.1 Advanced Event Triggering (AET) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.34.2 Trace . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.34.3 IEEE 1149.1 JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
179
182
189
194
194
195
195
195
196
198
200
200
203
205
206
206
207
207
209
210
210
210
211
211
211
211
212
212
212
212
212
213
213
215
216
216
216
216
217
217
A Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 219
B Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221
B.1
B.2
Thermal Data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221
Packaging Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221
Copyright 2012 Texas Instruments Incorporated
Contents
5
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
www.ti.com
List of Figures
Figure 1-1
Figure 2-1
Figure 2-2
Figure 2-3
Figure 2-4
Figure 2-5
Figure 2-6
Figure 2-7
Figure 2-8
Figure 2-9
Figure 2-10
Figure 2-11
Figure 2-12
Figure 2-13
Figure 2-14
Figure 2-15
Figure 2-16
Figure 2-17
Figure 3-1
Figure 3-2
Figure 3-3
Figure 3-4
Figure 3-5
Figure 3-6
Figure 3-7
Figure 3-8
Figure 3-9
Figure 3-10
Figure 3-11
Figure 3-12
Figure 3-13
Figure 3-14
Figure 3-15
Figure 3-16
Figure 3-17
Figure 3-18
Figure 4-1
Figure 4-2
Figure 4-3
Figure 4-4
Figure 4-5
Figure 4-6
Figure 4-7
Figure 5-1
Figure 5-2
Figure 5-3
Figure 5-4
Figure 5-5
Figure 7-1
Figure 7-2
Figure 7-3
Figure 7-4
6
Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
CPU (DSP Core) Data Paths. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
Boot Mode Pin Decoding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
No Boot Configuration Fields . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
Serial Rapid I/O Device Configuration Fields . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
Ethernet (SGMII) Device Configuration Fields . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
PCI Device Configuration Fields . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
I2C Master Mode Device Configuration Fields. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
I2C Passive Mode Device Configuration Fields . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
SPI Device Configuration Fields . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
HyperLink Boot Device Configuration Fields. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
CYP 841-PIN BGA Package (Bottom View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
Pin Map Quadrants (Bottom View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
Upper Left Quadrant—A (Bottom View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
Upper Right Quadrant—B (Bottom View). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
Lower Right Quadrant—C (Bottom View). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
Lower Left Quadrant—D (Bottom View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
C66x™ DSP Device Nomenclature (including the TMS320C6670 DSP). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65
Device Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .71
Device Configuration Register (DEVCFG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .72
JTAG ID (JTAGID) Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73
LRESETNMI PIN Status Register (LRSTNMIPINSTAT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73
LRESETNMI PIN Status Clear Register (LRSTNMIPINSTAT_CLR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .74
Reset Status Register (RESET_STAT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75
Reset Status Clear Register (RESET_STAT_CLR). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75
Boot Complete Register (BOOTCOMPLETE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76
Power State Control Register (PWRSTATECTL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
NMI Generation Register (NMIGRx) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
IPC Generation Registers (IPCGRx) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
IPC Acknowledgement Registers (IPCARx) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .79
IPC Generation Registers (IPCGRH) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .79
IPC Acknowledgement Register (IPCARH) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .80
Timer Input Selection Register (TINPSEL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .80
Timer Output Selection Register (TOUTPSEL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .82
Reset Mux Register (RSTMUX0 through RSTMUX3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .83
Device Speed Register (DEVSPEED) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .84
TeraNet 3A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .91
TeraNet 2A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .92
TeraNet 3P and 3M and 2M . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .93
TeraNet 3P_A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .94
TeraNet 3P_B. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .95
TeraNet 6P_B and 3P_Tracer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .96
Packed DMA Priority Allocation Register (PKTDMA_PRI_ALLOC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .97
C66x CorePac Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .98
L1P Memory Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .99
L1D Memory Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .100
L2 Memory Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .101
CorePac Revision ID Register (MM_REVID) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .104
Core Before IO Power Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .111
IO Before Core Power Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113
SmartReflex 4-Pin VID Interface Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .116
RESETFULL Reset Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .126
List of Figures
Copyright 2012 Texas Instruments Incorporated
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
www.ti.com
Figure 7-5
Figure 7-6
Figure 7-7
Figure 7-8
Figure 7-9
Figure 7-10
Figure 7-11
Figure 7-12
Figure 7-13
Figure 7-14
Figure 7-15
Figure 7-16
Figure 7-17
Figure 7-18
Figure 7-19
Figure 7-20
Figure 7-21
Figure 7-22
Figure 7-23
Figure 7-24
Figure 7-25
Figure 7-26
Figure 7-27
Figure 7-28
Figure 7-29
Figure 7-30
Figure 7-31
Figure 7-32
Figure 7-33
Figure 7-34
Figure 7-35
Figure 7-36
Figure 7-37
Figure 7-38
Figure 7-39
Figure 7-40
Figure 7-41
Figure 7-42
Figure 7-43
Figure 7-44
Figure 7-45
Figure 7-46
Figure 7-47
Figure 7-48
Figure 7-49
Figure 7-50
Figure 7-51
Figure 7-52
Figure 7-53
Figure 7-54
Figure 7-55
Figure 7-56
Figure 7-57
Figure 7-58
Soft/Hard Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .126
Boot Configuration Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .127
Main PLL and PLL Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .128
PLL Secondary Control Register (SECCTL)) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .132
PLL Controller Divider Register (PLLDIVn) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .133
PLL Controller Clock Align Control Register (ALNCTL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .133
PLLDIV Divider Ratio Change Status Register (DCHANGE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .134
SYSCLK Status Register (SYSTAT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .134
Reset Type Status Register (RSTYPE). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .135
Reset Control Register (RSTCTRL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .136
Reset Configuration Register (RSTCFG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .136
Reset Isolation Register (RSISO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .137
Main PLL Control Register (MAINPLLCTL0). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .138
Main PLL Control Register (MAINPLLCTL1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .138
Main PLL Controller/SRIO/HyperLink/PCIe Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .141
Main PLL Transition Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .141
DDR3 PLL Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .142
DDR3 PLL Control Register (DDR3PLLCTL0). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .142
DDR3 PLL Control Register 1 (DDR3PLLCTL1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .143
DDR3 PLL DDRCLK Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .144
PASS PLL Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .145
PASS PLL Control Register (PASSPLLCTL0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .145
PASS PLL Control Register 1 (PASSPLLCTL1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .146
PASS PLL Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .147
Interrupt Topology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .156
NMI and LRESET Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .178
Configuration Register (CONFIG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .187
Programmable Range n Start Address Register (PROGn_MPSAR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .189
Programmable Range n End Address Register (PROGn_MPEAR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .190
Programmable Range n Memory Protection Page Attribute Register (PROGn_MPPA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .191
I2C Module Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .196
I2C Receive Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .198
I2C Transmit Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .199
SPI Master Mode Timing Diagrams — Base Timings for 3-Pin Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .202
SPI Additional Timings for 4-Pin Master Mode with Chip Select Option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .202
HyperLink Station Management Clock Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .204
HyperLink Station Management Transmit Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .204
HyperLink Station Management Receive Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .204
UART Receive Timing Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .205
UART CTS (Clear-to-Send Input) — Autoflow Timing Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .205
UART Transmit Timing Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .206
UART RTS (Request-to-Send Output) – Autoflow Timing Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .206
MACID1 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .207
MACID2 Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .207
RFTCLK Select Register (CPTS_RFTCLK_SEL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .208
MDIO Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .209
MDIO Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .209
Timer Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .210
GPIO Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .213
AIF2 RP1 Frame Synchronization Clock Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .214
AIF2 RP1 Frame Synchronization Burst Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .214
AIF2 Physical Layer Synchronization Pulse Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .215
AIF2 Radio Synchronization Pulse Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .215
AIF2 Timer External Frame Event Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .215
Copyright 2012 Texas Instruments Incorporated
List of Figures
7
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
Figure 7-59
Figure 7-60
8
www.ti.com
Trace Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .217
JTAG Test-Port Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .218
List of Figures
Copyright 2012 Texas Instruments Incorporated
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
www.ti.com
List of Tables
Table 2-1
Table 2-2
Table 2-3
Table 2-4
Table 2-5
Table 2-6
Table 2-7
Table 2-8
Table 2-9
Table 2-10
Table 2-11
Table 2-12
Table 2-13
Table 2-14
Table 2-15
Table 2-16
Table 2-17
Table 2-18
Table 3-1
Table 3-2
Table 3-3
Table 3-4
Table 3-5
Table 3-6
Table 3-7
Table 3-8
Table 3-9
Table 3-10
Table 3-11
Table 3-12
Table 3-13
Table 3-14
Table 3-15
Table 3-16
Table 3-17
Table 3-18
Table 3-19
Table 3-20
Table 4-1
Table 4-2
Table 4-3
Table 4-4
Table 5-1
Table 5-2
Table 6-1
Table 6-2
Table 6-3
Table 6-4
Table 7-1
Table 7-2
Table 7-3
Table 7-4
Characteristics of the C6670 SoC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Memory Map Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
Boot Mode Pins: Boot Device Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
No Boot Configuration Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
Serial Rapid I/O Configuration Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
Ethernet (SGMII) Configuration Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
PCI Device Configuration Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
BAR Config / PCIe Window Sizes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
I2C Master Mode Device Configuration Field Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
I2C Passive Mode Device Configuration Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
SPI Device Configuration Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
HyperLink Boot Device Configuration Field Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
C66x CorePac System PLL Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
I/O Functional Symbol Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41
Terminal Functions — Signals and Control by Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41
Terminal Functions — Power and Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52
Terminal Functions — By Signal Name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
Terminal Functions — By Ball Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57
Device Configuration Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67
Device State Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68
Device Status Register Field Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .72
Device Configuration Register Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .72
JTAG ID Register Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73
LRESETNMI PIN Status Register Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .74
LRESETNMI PIN Status Clear Register Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .74
Reset Status Register Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75
Reset Status Clear Register Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76
Boot Complete Register Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76
Power State Control Register Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
NMI Generation Register Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
IPC Generation Registers Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .78
IPC Acknowledgement Registers Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .79
IPC Generation Registers Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .80
IPC Acknowledgement Register Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .80
Timer Input Selection Field Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .81
Timer Output Selection Field Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .82
Reset Mux Register Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .83
Device Speed Register Field Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .84
Switch Fabric Connection Matrix Section 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .87
Switch Fabric Connection Matrix Section 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .88
Switch Fabric Connection Matrix Section 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .89
Packed DMA Priority Allocation Register Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .97
Available Memory Page Protection Schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .103
CorePac Revision ID Register (MM_REVID) Field Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .104
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .105
Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .106
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .107
Power Supply to Peripheral I/O Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .108
Power Supply Rails on the TMS320C6670. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .109
Core Before IO Power Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .112
IO Before Core Power Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .114
Clock Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .115
Copyright 2012 Texas Instruments Incorporated
List of Tables
9
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
Table 7-5
Table 7-6
Table 7-7
Table 7-8
Table 7-9
Table 7-10
Table 7-11
Table 7-12
Table 7-13
Table 7-14
Table 7-15
Table 7-16
Table 7-17
Table 7-18
Table 7-19
Table 7-20
Table 7-21
Table 7-22
Table 7-23
Table 7-24
Table 7-25
Table 7-26
Table 7-27
Table 7-28
Table 7-29
Table 7-30
Table 7-31
Table 7-32
Table 7-33
Table 7-34
Table 7-35
Table 7-36
Table 7-37
Table 7-38
Table 7-39
Table 7-40
Table 7-41
Table 7-42
Table 7-43
Table 7-44
Table 7-45
Table 7-46
Table 7-47
Table 7-48
Table 7-49
Table 7-50
Table 7-51
Table 7-52
Table 7-53
Table 7-54
Table 7-55
Table 7-56
Table 7-57
Table 7-58
10
www.ti.com
SmartReflex 4-Pin VID Interface Switching Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .116
Power Domains . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .117
Clock Domains . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .118
PSC Register Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .119
Reset Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .122
Reset Timing Requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .126
Reset Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .126
Boot Configuration Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .127
Main PLL Stabilization, Lock, and Reset Times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .130
PLL Controller Registers (Including Reset Controller). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .131
PLL Secondary Control Register Field Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .132
PLL Controller Divider Register Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .133
PLL Controller Clock Align Control Register Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .133
PLLDIV Divider Ratio Change Status Register Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .134
SYSCLK Status Register Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .134
Reset Type Status Register Field Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .135
Reset Control Register Field Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .136
Reset Configuration Register Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .136
Reset Isolation Register Field Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .137
Main PLL Control Register (MAINPLLCTL0) Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .138
Main PLL Control Register (MAINPLLCTL1) Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .138
Main PLL Controller/SRIO/HyperLink/PCIe Clock Input Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .139
DDR3 PLL Control Register 0 Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .143
DDR3 PLL Control Register 1 Field Descriptions (DDR3PLLCTL1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .143
DDR3 PLL DDRCLK(N|P) Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .144
PASS PLL Control Register 0 Field Descriptions (PASSPLLCTL0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .146
PASS PLL Control Register 1 Field Descriptions (PASSPLLCTL1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .146
PASS PLL Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .147
EDMA3 Channel Controller Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .149
EDMA3 Transfer Controller Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .150
EDMA3CC0 Events for C6670 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .150
EDMA3CC1 Events for C6670 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .151
EDMA3CC2 Events for C6670 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .152
System Event Mapping — C66x CorePac Primary Interrupts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .156
CIC0 Event Inputs — C66x CorePac Secondary Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .160
CIC1 Event Inputs (Secondary Events for EDMA3CC1 and EDMA3CC2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .165
CIC2 Event Inputs (Secondary Events for EDMA3CC0 and HyperLink) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .169
CIC0 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .170
CIC1 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .173
CIC2 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .175
IPC Generation Registers (IPCGRx) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .176
LRESET and NMI Decoding. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .177
NMI and LRESET Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .178
MPU Default Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .179
MPU Memory Regions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .179
Master ID Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .179
Privilege ID Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .182
MPU0 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .182
MPU1 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .184
MPU2 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .184
MPU3 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .186
MPU4 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .186
MPU5 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .187
Configuration Register Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .188
List of Tables
Copyright 2012 Texas Instruments Incorporated
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
www.ti.com
Table 7-59
Table 7-60
Table 7-61
Table 7-62
Table 7-63
Table 7-64
Table 7-65
Table 7-66
Table 7-67
Table 7-68
Table 7-69
Table 7-70
Table 7-71
Table 7-72
Table 7-73
Table 7-74
Table 7-75
Table 7-76
Table 7-77
Table 7-78
Table 7-79
Table 7-80
Table 7-81
Table 7-82
Table 7-83
Table 7-84
Table 7-85
Table 7-86
Table 7-87
Table B-1
Programmable Range n Start Address Register Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .189
Programmable Range n Start Address Register (PROGn_MPSAR) Reset Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .189
Programmable Range n End Address Register Field Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .190
Programmable Range n End Address Register (PROGn_MPEAR) Reset Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .190
Programmable Range n Memory Protection Page Attribute Register Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . .191
Programmable Range n Memory Protection Page Attribute Register (PROGn_MPPA) Reset Values . . . . . . . . . . . . . . . . .193
I2C Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .196
I2C Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .198
I2C Switching Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .199
SPI Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .200
SPI Switching Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .200
HyperLink Peripheral Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .203
HyperLink Peripheral Switching Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .203
UART Timing Requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .205
UART Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .206
MACID1 Register Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .207
MACID2 Register Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .207
RFTCLK Select Register Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .208
MDIO Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .209
MDIO Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .209
Timer Input Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .210
Timer Output Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .210
GPIO Input Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .212
GPIO Output Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .212
AIF2 Timer Module Timing Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .213
AIF2 Timer Module Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .215
Trace Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .217
JTAG Test Port Timing Requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .218
JTAG Test Port Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .218
Thermal Resistance Characteristics (PBGA Package) [CYP] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .221
Copyright 2012 Texas Instruments Incorporated
List of Tables
11
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
12
List of Tables
www.ti.com
Copyright 2012 Texas Instruments Incorporated
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
www.ti.com
1 TMS320C6670 Features
• Four TMS320C66x™ DSP Core Subsystems, Each With
– 1.0-GHz or 1.2-GHz C66x Fixed/Floating-Point
DSP Core
› 38.4 GMacs/Core for Fixed Point @ 1.2 GHz
› 19.2 GFlops/Core for Floating Point @ 1.2 GHz
– Memory
› 32K Byte L1P Per Core
› 32K Byte L1D Per Core
› 1024K Byte Local L2 Per Core
• Multicore Shared Memory Controller (MSMC)
– 2048KB MSM SRAM Memory Shared by Four DSP
Cores
– Memory Protection Unit for Both MSM SRAM and
DDR3_EMIF
• Hardware Coprocessors
– Three Enhanced Coprocessors for Turbo Decoding
› Supports WCDMA/HSPA/HSPA+/TD-SCDMA,
LTE, and WiMAX
› Supports up to 548 Mbps for LTE and up to
353 Mbps for WCDMA
› Low DSP Overhead – HW Interleaver Table
Generation and CRC Check
– One Enhanced Coprocessor for Turbo Encoding
› Supports up to 500 Mbps for LTE and WCDMA
– Four Viterbi Decoders
› Supports More Than 38 Mbps @ 40-bit Block
Size
– Two WCDMA Receive Acceleration Coprocessors
› Up to 256 Users @ 8 Fingers w/o Measurement
– WCDMA Transmit Acceleration Coprocessor
› Up to 256 Users with two Radio Links and
Diversity
– Three Fast Fourier Transform Coprocessors
› 2048 pt FFT in 4.8 μs
– Bit Rate Coprocessor
› WCDMA/HSPA+, TD-SCDMA, LTE, and WiMAX
Uplink and Downlink Bit Processing
› Includes Encoding, Rate Matching/Dematching,
Segmentation, Multiplexing, and More
› Supports Up To 914 Mbps for LTE and 405 Mbps
for WCDMA/TD-SCDMA
• Multicore Navigator
– 8192 Multipurpose Hardware Queues with Queue
Manager
– Packet-Based DMA for Zero-Overhead Transfers
• Network Coprocessor
– Packet Accelerator Enables Support for
› Transport Plane IPsec, GTP-U, SCTP, PDCP
› L2 User Plane PDCP (RoHC, Air Ciphering)
› 1 Gbps Wire-Speed Throughput at 1.5 M Packets
Per Second
– Security Accelerator Engine Enables Support for
› IPSec, SRTP, 3GPP and WiMAX Air Interface, and
SSL/TLS Security
› ECB, CBC, CTR, F8, A5/3, CCM, GCM, HMAC,
CMAC, GMAC, AES, DES, 3DES, Kasumi, SNOW
3G, SHA-1, SHA-2 (256-bit Hash), MD5
› Up to 2.8 Gbps Encryption Speed
• Four Rake/Search Accelerators (RSA) for
– Chip-Rate Processing for WCDMA Rel'99, HSDPA,
and HSDPA+
– Reed-Muller Decoding
• Peripherals
– Six-Lane SerDes-Based Antenna Interface (AIF2)
› Operating at up to 6.144 Gbps
› Compliant with OBSAI RP3 and CPRI Standards
for 3G / 4G (WCDMA, LTE TDD, LTE FDD,
TD-SCDMA, and WiMAX)
– Four Lanes of SRIO 2.1
› 5 GBaud Operation Per Lane
› Supports Direct I/O, Message Passing
– Two Lanes PCIe Gen2
› Supports Up To 5 GBaud Per Lane
– Hyperlink
› Supports Connections to Other KeyStone
Architecture Devices Providing Resource
Scalability
› Supports up to 50 Gbaud
– Gigabit Ethernet (GbE) Switch Subsystem
› Two SGMII Ports
› IEEE1588 Support
– 64-Bit DDR3 Interface with Speeds up to 1600 MHz
– UART Interface
– I2C Interface
– Sixteen GPIO pins
– SPI Interface
– Semaphore Module
– Eight 64-Bit Timers
– Three On-Chip PLLs
• Commercial Temperature:
– 0°C to 100°C
• Extended Temperature:
– - 40°C to 100°C
PRODUCTION DATA information is current as of publication date. Products
conform to specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all parameters.
Copyright 2012 Texas Instruments Incorporated
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
www.ti.com
1.1 KeyStone Architecture
TI’s KeyStone Multicore Architecture provides a high-performance structure for integrating RISC and DSP cores
with application-specific coprocessors and I/O. KeyStone is the first of its kind in that it provides adequate internal
bandwidth for nonblocking access to all processing cores, peripherals, coprocessors, and I/O. This is achieved with
four main hardware elements: Multicore Navigator, TeraNet, Multicore Shared Memory Controller, and
HyperLink.
Multicore Navigator is an innovative packet-based manager that controls 8192 queues. When tasks are allocated to
the queues, Multicore Navigator provides hardware-accelerated dispatch that directs tasks to the appropriate
available hardware. The packet-based system on a chip (SoC) uses the 2-Tbps capacity of the TeraNet switched
central resource to move packets. The Multicore Shared Memory Controller enables processing cores to access
shared memory directly without drawing from the TeraNet’s capacity, so packet movement cannot be blocked by
memory access.
HyperLink provides a 50-GBaud chip-level interconnect that allows SoCs to work in tandem. Its low-protocol
overhead and high throughput make Hyperlink an ideal interface for chip-to-chip interconnections. Working with
Multicore Navigator, HyperLink dispatches tasks to tandem devices transparently and executes tasks as if they are
running on local resources.
1.2 Device Description
The TMS320C6670 Communications Infrastructure KeyStone SoC is a member of the C66xx SoC family based on
TI's new KeyStone Multicore SoC Architecture designed specifically for high performance wireless infrastructure
applications. The C6670 provides a very high performance macro basestation platform for developing all wireless
standards including WCDMA/HSPA/HSPA+, TD-SCDMA, GSM, TDD-LTE, FDD-LTE, and WiMAX. Even with
aggregate data rates for 20-MHz LTE systems above 400 Mbps per sector, the C6670 can support two sectors running
at full rate. The C6670 also sets a new standard for clock speed with operating frequencies up to 1.2 GHz.
TI's SoC architecture provides a programmable platform integrating various subsystems (C66x CorePacs, IP
network, radio layers 1 and 2, and transport processing) and uses a queue-based communication system that allows
the SoC resources to operate efficiently and seamlessly. This unique SoC architecture also includes a TeraNet Switch
that enables the wide mix of system elements, from programmable cores to dedicated coprocessors and high speed
IO, to each operate at maximum efficiency with no blocking or stalling.
TI's new C66x core launches a new era of DSP technology by combining fixed-point and floating-point
computational capability in the processor without sacrificing speed, size, or power consumption. The
raw computational performance is an industry-leading 32 GMACS/core and 16 Gflops/core (@ 1.2 GHz operating
frequency). The C66x is also 100% backward compatible with software for C64x+ devices. The C66x core
incorporates 90 new instructions targeted for floating-point (FPi) and vector-math-oriented (VPi) processing.
These enhancements yield tremendous performance improvements in multi-antenna 4.8G signal processing for
algorithms like MIMO and beamforming.
The C6670 contains many wireless basestation coprocessors to offload the bulk of the processing demands of layer 1
and layer 2 base station processing. This keeps the cores free for receiver algorithms and other differentiating
functions. The SoC contains multiple copies of key coprocessors such as the FFTC and TCP3d. A key coprocessor
for enabling high data rates is the bit rate coprocessor (BCP), which handles the entire downlink bit processing chain
and much of the receive bit processing.The architectural elements of the SoC (Multicore Navigator) ensure that all
the bits are processed without any CPU intervention or overhead, allowing the system to make optimal use of its
resources.
14
TMS320C6670 Features
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TI's scalable multicore SoC architecture solutions provide developers with a range of software- and
hardware-compatible devices to minimize development time and maximize reuse across all base station platforms
from Femto to Macro.
The C6670 device has a complete set of development tools that includes: a C compiler, an assembly optimizer to
simplify programming and scheduling, and a Windows debugger interface for visibility into source code execution.
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TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
www.ti.com
1.3 Functional Block Diagram
Figure 1-1 shows the functional block diagram of the TMS320C6670 device.
Figure 1-1
Functional Block Diagram
Coprocessors
Memory Subsystem
2MB
MSM
SRAM
64-Bit
DDR3 EMIF
´2
RAC
MSMC
TAC
RSA
Debug & Trace
RSA
´2
VCP2
´4
TCP3d
´3
Boot ROM
Semaphore
C66x™
CorePac
Power
Management
TCP3e
PLL
32KB L1
P-Cache
´3
32KB L1
D-Cache
FFTC
´3
1024KB L2 Cache
EDMA
´3
BCP
4 Cores @ 1.0 GHz / 1.2 GHz
TeraNet
HyperLink
Multicore Navigator
C6670
16
TMS320C6670 Features
Switch
Ethernet
Switch
´4
SRIO
SGMII
´2
´6
AIF2
SPI
UART
´2
PCIe
I2C
Others
Queue
Manager
Packet
DMA
Security
Accelerator
Packet
Accelerator
Network Coprocessor
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2 Device Overview
2.1 Device Characteristics
Table 2-1 provides an overview of the TMS320C6670 SoC. The table shows the significant features of the device,
including the capacity of on-chip RAM, the peripherals, the CPU frequency, and the package type with pin count.
Table 2-1
Characteristics of the C6670 SoC (Part 1 of 2)
Hardware Features
Peripherals
Encoder/Decoder
Coprocessors
Accelerators
1
EDMA3 (16 independent channels) [CPU/2 clock rate]
1
EDMA3 (64 independent channels) [CPU/3 clock rate]
2
High-speed 1×/2×/4× Serial RapidIO port (4 lanes)
1
Second-generation Antenna Interface (AIF2)
1
I2C
1
SPI
1
PCIe (2 lanes)
1
UART
1
10/100/1000 Ethernet
2
Management Data Input/Output (MDIO)
1
64-Bit Timers (configurable)
(internal clock source = CPU/6 clock frequency)
Eight 64-bit or Sixteen 32-bit
General-Purpose Input/Output Port (GPIO)
16
VCP2 (clock source = CPU/3 clock frequency)
4
TCP3d (clock source = CPU/2 clock frequency)
3
TCP3e (clock source = CPU/3 clock frequency)
1
FFTC (clock source = CPU/3 clock frequency)
3
BCP (clock source = CPU/3 clock frequency)
1
Receive Accelerator (RAC)
2
Transmit Accelerator (TAC)
1
Rake/Search Accelerator (RSA)
4
Packet Accelerator (PA)
1
Security Accelerator
On-Chip Memory
TMS320C6670
DDR3 memory controller (64-bit bus width) [1.5-V I/O]
(clock source = DDRREFCLKN|P)
(1)
(SA)
1
Size (Bytes)
6528K
Organization
128KB L1 Program Memory Controller
[SRAM/Cache] 128KB L1 Data Memory Controller
[SRAM/Cache] 4096KB L2 Unified Memory/Cache
2048KB MSM SRAM
128KB L3 ROM
C66x CorePac
Revision ID
CorePac Revision ID Register (address location: 0181 2000h)
See Section 5.5 ‘‘CorePac Revision’’ on page 104.
JTAG BSDL_ID
JTAGID register (address location: 0x02620018)
See Section 3.3.3 ‘‘JTAG ID (JTAGID) Register
Description’’ on page 73
Frequency
MHz
1200 (1.2 GHz) [-1200]
1000 (1.0 GHz) [-1000]
Cycle Time
ns
0.83 ns [-1200]
1 ns [-1000]
Voltage
Core (V)
SmartReflex variable supply
I/O (V)
1.0 V, 1.5 V, and 1.8 V
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17
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
Table 2-1
www.ti.com
Characteristics of the C6670 SoC (Part 2 of 2)
Hardware Features
BGA Package
Process Technology
Product Status
(2)
TMS320C6670
24 mm × 24 mm
841-Pin Flip-Chip Plastic BGA (CYP)
μm
0.040 μm
Product Preview (PP), Advance Information (AI),
or Production Data (PD)
PD
End of Table 2-1
1 The Security Accelerator function is subject to export control and will be enabled only for approved device shipments.
2 PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production
processing does not necessarily include testing of all parameters.
The C66x Central Processing Unit (CPU) extends the performance of the C64x+ and C674x CPUs through
enhancements and new features. Many of the new features target increased performance for vector processing. The
C64x+ and C674x CPUs support 2-way SIMD operations for 16-bit data and 4-way SIMD operations for 8-bit data.
On the C66x CPU, the vector processing capability is improved by extending the width of the SIMD instructions.
C66x CPUs can execute instructions that operate on 128-bit vectors. For example the QMPY32 instruction is able
to perform the element-to-element multiplication between two vectors of four 32-bit data each. The C66x CPU also
supports SIMD for floating-point operations. Improved vector processing capability (each instruction can process
multiple data in parallel) combined with the natural instruction-level parallelism of C6000 architecture (e.g
execution of up to 8 instructions per cycle) results in a very high level of parallelism that can be exploited by DSP
programmers through the use of TI's optimized C/C++ compiler.
The C66x CPU consists of eight functional units, two register files, and two data paths as shown in Figure 2-1. The
two general-purpose register files (A and B) each contain thirty-two 32-bit registers for a total of 64 registers. The
general-purpose registers can be used for data or can be data address pointers. The data types supported include
packed 8-bit data, packed 16-bit data, 32-bit data, 40-bit data, and 64-bit data. Multiplies also support 128-bit data.
40-bit-long or 64-bit-long values are stored in register pairs, with the 32 LSBs of data placed in an even register and
the remaining 8 or 32 MSBs in the next upper register (which is always an odd-numbered register). 128-bit data
values are stored in register quadruplets, with the 32 LSBs of data placed in a register that is a multiple of 4 and the
remaining 96 MSBs in the next 3 upper registers.
The eight functional units (.M1, .L1, .D1, .S1, .M2, .L2, .D2, and .S2) are each capable of executing one instruction
every clock cycle. The .M functional units perform all multiply operations. The .S and .L units perform a general set
of arithmetic, logical, and branch functions. The .D units primarily load data from memory to the register file and
store results from the register file into memory.
Each C66x .M unit can perform one of the following fixed-point operations each clock cycle: four 32 × 32 bit
multiplies, sixteen 16 × 16 bit multiplies, four 16 × 32 bit multiplies, four 8 × 8 bit multiplies, four 8 × 8 bit multiplies
with add operations, and four 16 × 16 multiplies with add/subtract capabilities. There is also support for Galois field
multiplication for 8-bit and 32-bit data. Many communications algorithms such as FFTs and modems require
complex multiplication. Each C66x .M unit can perform one 16 × 16 bit complex multiply with or without rounding
capabilities, two 16 × 16 bit complex multiplies with rounding capability, and a 32 × 32 bit complex multiply with
rounding capability. The C66x can also perform two 16 × 16 bit and one 32 × 32 bit complex multiply instructions
that multiply a complex number with a complex conjugate of another number with rounding capability.
Communication signal processing also requires an extensive use of matrix operations. Each C66x .M unit is capable
of multiplying a [1 × 2] complex vector by a [2 × 2] complex matrix per cycle with or without rounding capability.
A version also exists allowing multiplication of the conjugate of a [1 × 2] vector with a [2 × 2] complex matrix.
Each C66x .M unit also includes IEEE floating-point multiplication operations from the C674x CPU. This includes
one single-precision multiply each cycle and one double precision multiply every 4 cycles. There is also a
mixed-precision multiply that allows multiplication of a single-precision value by a double-precision value and an
operation allowing multiplication of two single-precision numbers resulting in a double-precision number. The
18
Device Overview
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C66x CPU improves the performance over the C674x double-precision multiplies by adding a instruction allowing
one double-precision multiply per cycle and also reduces the number of delay slots from ten to four. Each C66x .M
unit can also perform one the following floating-point operations each clock cycle: one, two, or four single-precision
multiplies or a complex single-precision multiply.
The .L and .S units can now support up to 64-bit operands. This allows for new versions of many of the arithmetic,
logical, and data packing instructions to allow for more parallel operations per cycle. Additional instructions were
added yielding performance enhancements of the floating point addition and subtraction instructions, including the
ability to perform one double-precision addition or subtraction per cycle. Conversion to/from integer and
single-precision values can now be done on both .L and .S units on the C66x. Also, by taking advantage of the larger
operands, instructions were also added to double the number of these conversions that can be done. The .L unit also
has additional instructions for logical AND and OR instructions, as well as 90 degree or 270 degree rotation of
complex numbers (up to two per cycle). Instructions have also been added that allow for computing the conjugate
of a complex number.
The MFENCE instruction is a new instruction introduced with the C66x DSP. This instruction creates a CPU stall
until the completion of all the CPU-triggered memory transactions, including:
• Cache line fills
• Writes from L1D to L2 or from the CorePac to MSMC and/or other system endpoints
• Victim write backs
• Block or global coherence operations
• Cache mode changes
• Outstanding XMC prefetch requests
This is useful as a simple mechanism for programs to wait for these requests to reach their endpoint. It also provides
ordering guarantees for writes arriving at a single endpoint via multiple paths, multiprocessor algorithms that
depend on ordering, and manual coherence operations.
For more details on the C66x CPU and its enhancements over the C64x+ and C674x architectures, see the following
documents (2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66):
• C66x CPU and Instruction Set Reference Guide
• C66x DSP Cache User Guide
• C66x CorePac User Guide
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Multicore Fixed and Floating-Point System-on-Chip
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Figure 2-1 shows the DSP core functional units and data paths.
Figure 2-1
CPU (DSP Core) Data Paths
Note:
Default bus width
is 64 bits
(i.e. a register pair)
src1
.L1
Register
File A
(A0, A1, A2,
...A31)
src2
dst
ST1
src1
.S1
src2
dst
src1
src1_hi
Data Path A
.M1
src2
src2_hi
dst2
dst1
LD1
32
src1
DA1
32
.D1
dst
32
src2
32
32
2´
1´
src2
DA2
32
.D2
dst
src1
Register
File B
(B0, B1, B2,
...B31)
32
32
32
32
32
LD2
dst1
dst2
src2_hi
.M2
src2
src1_hi
src1
Data Path B
dst
.S2
src2
src1
ST2
dst
.L2
src2
src1
32
66xx
20
Device Overview
Control
Register
32
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2.2 Memory Map Summary
Table 2-2 shows the memory map address ranges of the TMS320C6670 device.
Table 2-2
Memory Map Summary (Part 1 of 9)
Logical 32 bit Address
Physical 36 bit Address
Start
End
Start
End
Bytes
Description
0000 0000
007F FFFF
0 0000 0000
0 007F FFFF
8M
Reserved
0080 0000
008F FFFF
0 0080 0000
0 008F FFFF
1M
L2 SRAM
0090 0000
00DF FFFF
0 0090 0000
0 00DF FFFF
5M
Reserved
00E00000
00E0 7FFF
0 00E00000
0 00E0 7FFF
32K
L1P SRAM
00E08000
00EF FFFF
0 00E08000
0 00EF FFFF
1M-32K
Reserved
00F00000
00F0 7FFF
0 00F00000
0 00F0 7FFF
32K
L1D SRAM
00F08000
00FF FFFF
0 00F08000
0 00FF FFFF
1M-32K
Reserved
0100 0000
01BF FFFF
0 0100 0000
0 01BF FFFF
12 M
C66x CorePac registers
01C0 0000
01CF FFFF
0 01C0 0000
0 01CF FFFF
1M
Reserved
01D0 0000
01D0 007F
0 01D0 0000
0 01D0 007F
128
Tracer 0
01D0 0080
01D0 7FFF
0 01D0 0080
0 01D0 7FFF
32K-128
Reserved
01D0 8000
01D0 807F
0 01D0 8000
0 01D0 807F
128
Tracer 1
01D0 8080
01D0 FFFF
0 01D0 8080
0 01D0 FFFF
32K-128
Reserved
01D1 0000
01D1 007F
0 01D1 0000
0 01D1 007F
128
Tracer 2
01D1 0080
01D1 7FFF
0 01D1 0080
0 01D1 7FFF
32K-128
Reserved
01D1 8000
01D1 807F
0 01D1 8000
0 01D1 807F
128
Tracer 3
01D1 8080
01D1 FFFF
0 01D1 8080
0 01D1 FFFF
32K-128
Reserved
01D2 0000
01D2 007F
0 01D2 0000
0 01D2 007F
128
Tracer 4
01D2 0080
01D2 7FFF
0 01D2 0080
0 01D2 7FFF
32K-128
Reserved
01D2 8000
01D2 807F
0 01D2 8000
0 01D2 807F
128
Tracer 5
01D2 8080
01D2 FFFF
0 01D2 8080
0 01D2 FFFF
32K-128
Reserved
01D3 0000
01D3 007F
0 01D3 0000
0 01D3 007F
128
Tracer 6
01D3 0080
01D3 7FFF
0 01D3 0080
0 01D3 7FFF
32K-128
Reserved
01D3 8000
01D3 807F
0 01D3 8000
0 01D3 807F
128
Tracer 7
01D3 8080
01D3 FFFF
0 01D3 8080
0 01D3 FFFF
32K-128
Reserved
01D4 0000
01D4 007F
0 01D4 0000
0 01D4 007F
128
Tracer 8
01D4 0080
01D4 7FFF
0 01D4 0080
0 01D4 7FFF
32K-128
Reserved
01D4 8000
01D4 807F
0 01D4 8000
0 01D4 807F
128
Tracer 9
01D4 8080
01D4 FFFF
0 01D4 8080
0 01D4 FFFF
32K-128
Reserved
01D5 0000
01D5 007F
0 01D5 0000
0 01D5 007F
128
Tracer 10
01D5 0080
01D5 7FFF
0 01D5 0080
0 01D5 7FFF
32K-128
Reserved
01D5 8000
01D5 807F
0 01D5 8000
0 01D5 807F
128
Tracer 11
01D5 8080
01D5 FFFF
0 01D5 8080
0 01D5 FFFF
32K-128
Reserved
01D6 0000
01D6 007F
0 01D6 0000
0 01D6 007F
128
Tracer 12
01D6 0080
01D6 7FFF
0 01D6 0080
0 01D6 7FFF
32K-128
Reserved
01D6 8000
01D6 807F
0 01D6 8000
0 01D6 807F
128
Tracer 13
01D6 8080
01D6 FFFF
0 01D6 8080
0 01D6 FFFF
32K-128
Reserved
01D7 0000
01D7 007F
0 01D7 0000
0 01D7 007F
128
Tracer 14
01D7 0080
01D7 7FFF
0 01D7 0080
0 01D7 7FFF
32K-128
Reserved
01D7 8000
01D7 807F
0 01D7 8000
0 01D7 807F
128
Tracer 15
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Table 2-2
Logical 32 bit Address
Start
www.ti.com
Memory Map Summary (Part 2 of 9)
End
Physical 36 bit Address
Start
End
Bytes
Description
01D7 8080
01D7 FFFF
0 01D7 8080
0 01D7 FFFF
32K-128
Reserved
01D8 0000
01D8 007F
0 01D8 0000
0 01D8 007F
128
Reserved
01D8 0080
01D8 7FFF
0 01D8 0080
0 01D8 7FFF
32K-128
Reserved
01D8 8000
01DF FFFF
0 01D8 8000
0 01DF FFFF
480K
Reserved
01E0 0000
01E3 FFFF
0 01E0 0000
0 01E3 FFFF
256K
Reserved
01E4 0000
01E7 FFFF
0 01E4 0000
0 01E7 FFFF
256K
Reserved
01E8 0000
01EB FFFF
0 01E8 0000
0 01EB FFFF
256K
Reserved
01EC 0000
01EF FFFF
0 01EC 0000
0 01EF FFFF
256K
Reserved
01F0 0000
01F7 FFFF
0 01F0 0000
0 01F7 FFFF
512K
AIF2 control
01F8 0000
01F8 FFFF
0 01F8 0000
0 01F8 FFFF
64K
RAC_B - FEI control
01F9 0000
01F9 FFFF
0 01F9 0000
0 01F9 FFFF
64K
RAC_B - BEI control
01FA 0000
01FB FFFF
0 01FA 0000
0 01FB FFFF
128K
RAC_B - GCCP 0 control
01FC 0000
01FD FFFF
0 01FC 0000
0 01FD FFFF
128K
RAC_B - GCCP 1 control
01FE 0000
01FF FFFF
0 01FE 0000
0 01FF FFFF
128K
Reserved
0200 0000
020F FFFF
0 0200 0000
0 020F FFFF
1M
Network Coprocessor (Packet Accelerator, Gigabit Ethernet
Switch subsystem, and Security Accelerator)
0210 0000
0210 FFFF
0 0210 0000
0 0210 FFFF
64K
RAC_A - FEI control
0211 0000
0211 FFFF
0 0211 0000
0 0211 FFFF
64K
RAC_A - BEI control
0212 0000
0213 FFFF
0 0212 0000
0 0213 FFFF
128K
RAC_A - GCCP 0 control
0214 0000
0215 FFFF
0 0214 0000
0 0215 FFFF
128K
RAC_A - GCCP 1 control
0216 0000
0217 FFFF
0 0216 0000
0 0217 FFFF
128K
Reserved
0218 0000
0218 7FFF
0 0218 0000
0 0218 7FFF
32K
TAC - FEI control
0218 8000
0218 FFFF
0 0218 8000
0 0218 FFFF
32K
TAC- BEI control
0219 0000
0219 FFFF
0 0219 0000
0 0219 FFFF
64K
TAC - SGCCP 0 control
021A 0000
021A FFFF
0 021A 0000
0 021A FFFF
64K
TAC - SGCCP 1 control
021B 0000
021B FFFF
0 021B 0000
0 021B FFFF
64K
Reserved
021C 0000
021C 03FF
0 021C 0000
0 021C 03FF
1K
TCP3d-A
021C 0400
021C 7FFF
0 021C 0400
0 021C 7FFF
31K
Reserved
021C 8000
021C 83FF
0 021C 8000
0 021C 83FF
1K
TCP3d-B
021C 8400
021C FFFF
0 021C 8400
0 021C FFFF
31K
Reserved
021D 0000
021D 00FF
0 021D 0000
0 021D 00FF
256
VCP2_A
021D 0100
021D 3FFF
0 021D 0100
0 021D 3FFF
16K
Reserved
021D 4000
021D 40FF
0 021D 4000
0 021D 40FF
256
VCP2_B
021D 4100
021D 7FFF
0 021D 4100
0 021D 7FFF
16K
Reserved
021D 8000
021D 80FF
0 021D 8000
0 021D 80FF
256
VCP2_C
021D 8100
021D BFFF
0 021D 8100
0 021D BFFF
16K
Reserved
021D C000
021D C0FF
0 021D C000
0 021D C0FF
256
VCP2_D
021D C100
021D FFFF
0 021D C100
0 021D FFFF
16K
Reserved
021E 0000
021E 0FFF
0 021E 0000
0 021E 0FFF
4K
TCP3e
021E 1000
021E FFFF
0 021E 1000
0 021E FFFF
60K
Reserved
021F 0000
021F 07FF
0 021F 0000
0 021F 07FF
2K
FFTC-A configuration
021F 0800
021F 3FFF
0 021F 0800
0 021F 3FFF
14K
Reserved
021F 4000
021F 47FF
0 021F 4000
0 021F 47FF
2K
FFTC-B configuration
22
Device Overview
Copyright 2012 Texas Instruments Incorporated
Submit Documentation Feedback
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
www.ti.com
Table 2-2
Memory Map Summary (Part 3 of 9)
Logical 32 bit Address
Physical 36 bit Address
Start
End
Start
End
Bytes
Description
021F 4800
021F FFFF
0 021F 4800
0 021F FFFF
46K
Reserved
0220 0000
0220 007F
0 0220 0000
0 0220 007F
128
Timer0
0220 0080
0220 FFFF
0 0220 0080
0 0220 FFFF
64K-128
Reserved
0221 0000
0221 007F
0 0221 0000
0 0221 007F
128
Timer1
0221 0080
0221 FFFF
0 0221 0080
0 0221 FFFF
64K-128
Reserved
0222 0000
0222 007F
0 0222 0000
0 0222 007F
128
Timer2
0222 0080
0222 FFFF
0 0222 0080
0 0222 FFFF
64K-128
Reserved
0223 0000
0223 007F
0 0223 0000
0 0223 007F
128
Timer3
0223 0080
0223 FFFF
0 0223 0080
0 0223 FFFF
64K-128
Reserved
0224 0000
0224 007F
0 0224 0000
0 0224 007F
128
Timer4
0224 0080
0224 FFFF
0 0224 0080
0 0224 FFFF
64K-128
Reserved
0225 0000
0225 007F
0 0225 0000
0 0225 007F
128
Timer5
0225 0080
0225 FFFF
0 0225 0080
0 0225 FFFF
64K-128
Reserved
0226 0000
0226 007F
0 0226 0000
0 0226 007F
128
Timer6
0226 0080
0226 FFFF
0 0226 0080
0 0226 FFFF
64K-128
Reserved
0227 0000
0227 007F
0 0227 0000
0 0227 007F
128
Timer7
0227 0080
0227 FFFF
0 0227 0080
0 0227 FFFF
64K-128
Reserved
0228 0000
0228 007F
0 0228 0000
0 0228 007F
128
Reserved
0228 0080
0228 FFFF
0 0228 0080
0 0228 FFFF
64K-128
Reserved
0229 0000
0229 007F
0 0229 0000
0 0229 007F
128
Reserved
0229 0080
0229 FFFF
0 0229 0080
0 0229 FFFF
64K-128
Reserved
022A 0000
022A 007F
0 022A 0000
0 022A 007F
128
Reserved
022A 0080
022A FFFF
0 022A 0080
0 022A FFFF
64K-128
Reserved
022B 0000
022B 007F
0 022B 0000
0 022B 007F
128
Reserved
022B 0080
022B FFFF
0 022B 0080
0 022B FFFF
64K-128
Reserved
022C 0000
022C 007F
0 022C 0000
0 022C 007F
128
Reserved
022C 0080
022C FFFF
0 022C 0080
0 022C FFFF
64K-128
Reserved
022D 0000
022D 007F
0 022D 0000
0 022D 007F
128
Reserved
022D 0080
022D FFFF
0 022D 0080
0 022D FFFF
64K-128
Reserved
022E 0000
022E 007F
0 022E 0000
0 022E 007F
128
Reserved
022E 0080
022E FFFF
0 022E 0080
0 022E FFFF
64K-128
Reserved
022F 0000
022F 007F
0 022F 0000
0 022F 007F
128
Reserved
022F 0080
022F FFFF
0 022F 0080
0 022F FFFF
64K-128
Reserved
0230 0000
0230 FFFF
0 0230 0000
0 0230 FFFF
64K
Reserved
0231 0000
0231 01FF
0 0231 0000
0 0231 01FF
512
PLL controller
0231 0200
0231 FFFF
0 0231 0200
0 0231 FFFF
64K-512
Reserved
0232 0000
0232 00FF
0 0232 0000
0 0232 00FF
256
GPIO
0232 0100
0232 FFFF
0 0232 0100
0 0232 FFFF
64K-256
Reserved
0233 0000
0233 03FF
0 0233 0000
0 0233 03FF
1K
SmartReflex
0233 0400
0233 FFFF
0 0233 0400
0 0233 FFFF
63K
Reserved
0234 0000
0234 FFFF
0 0234 0000
0 0234 FFFF
64K
Reserved
0235 0000
0235 0FFF
0 0235 0000
0 0235 0FFF
4K
Power Sleep Controller (PSC)
0235 1000
0235 FFFF
0 0235 1000
0 0235 FFFF
64K-4K
Reserved
Copyright 2012 Texas Instruments Incorporated
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Device Overview
23
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
Table 2-2
Logical 32 bit Address
Start
www.ti.com
Memory Map Summary (Part 4 of 9)
End
Physical 36 bit Address
Start
End
Bytes
Description
0236 0000
0236 03FF
0 0236 0000
0 0236 03FF
1K
Memory Protection Unit (MPU) 0
0236 0400
0236 7FFF
0 0236 0400
0 0236 7FFF
31K
Reserved
0236 8000
0236 83FF
0 0236 8000
0 0236 83FF
1K
Memory Protection Unit (MPU) 1
0236 8400
0236 FFFF
0 0236 8400
0 0236 FFFF
31K
Reserved
0237 0000
0237 03FF
0 0237 0000
0 0237 03FF
1K
Memory Protection Unit (MPU) 2
0237 0400
0237 7FFF
0 0237 0400
0 0237 7FFF
31K
Reserved
0237 8000
0237 83FF
0 0237 8000
0 0237 83FF
1K
Memory Protection Unit (MPU) 3
0237 8400
0237 FFFF
0 0237 8400
0 0237 FFFF
31K
Reserved
0238 0000
0238 03FF
0 0238 0000
0 0238 03FF
1K
Memory Protection Unit (MPU) 4
0238 0400
023F FFFF
0 0238 0400
0 023F FFFF
511K
Reserved
0240 0000
0243 FFFF
0 0240 0000
0 0243 FFFF
256K
Reserved
0244 0000
0244 3FFF
0 0244 0000
0 0244 3FFF
16K
DSP trace formatter 0
0244 4000
0244 FFFF
0 0244 4000
0 0244 FFFF
48K
Reserved
0245 0000
0245 3FFF
0 0245 0000
0 0245 3FFF
16K
DSP trace formatter 1
0245 4000
0245 FFFF
0 0245 4000
0 0245 FFFF
48K
Reserved
0246 0000
0246 3FFF
0 0246 0000
0 0246 3FFF
16K
DSP trace formatter 2
0246 4000
0246 FFFF
0 0246 4000
0 0246 FFFF
48K
Reserved
0247 0000
0247 3FFF
0 0247 0000
0 0247 3FFF
16K
DSP trace formatter 3
0247 4000
0247 FFFF
0 0247 4000
0 0247 FFFF
48K
Reserved
0248 0000
0248 3FFF
0 0248 0000
0 0248 3FFF
16K
Reserved
0248 4000
0248 FFFF
0 0248 4000
0 0248 FFFF
48K
Reserved
0249 0000
0249 3FFF
0 0249 0000
0 0249 3FFF
16K
Reserved
0249 4000
0249 FFFF
0 0249 4000
0 0249 FFFF
48K
Reserved
024A 0000
024A 3FFF
0 024A 0000
0 024A 3FFF
16K
Reserved
024A 4000
024A FFFF
0 024A 4000
0 024A FFFF
48K
Reserved
024B 0000
024B 3FFF
0 024B 0000
0 024B 3FFF
16K
Reserved
024B 4000
024B FFFF
0 024B 4000
0 024B FFFF
48K
Reserved
024C 0000
024C 01FF
0 024C 0000
0 024C 01FF
512
Reserved
024C 0200
024C 03FF
0 024C 0200
0 024C 03FF
1K-512
Reserved
024C 0400
024C 07FF
0 024C 0400
0 024C 07FF
1K
Reserved
024C 0800
024C FFFF
0 024C 0800
0 024C FFFF
62K
Reserved
024D 0000
024F FFFF
0 024D 0000
0 024F FFFF
192K
Reserved
0250 0000
0250 007F
0 0250 0000
0 0250 007F
128
Reserved
0250 0080
0250 7FFF
0 0250 0080
0 0250 7FFF
32K-128
Reserved
0250 8000
0250 FFFF
0 0250 8000
0 0250 FFFF
32K
Reserved
0251 0000
0251 FFFF
0 0251 0000
0 0251 FFFF
64K
Reserved
0252 0000
0252 03FF
0 0252 0000
0 0252 03FF
1K
Reserved
0252 0400
0252 FFFF
0 0252 0400
0 0252 FFFF
64K-1K
Reserved
0253 0000
0253 007F
0 0253 0000
0 0253 007F
128
I C data & control
0253 0080
0253 FFFF
0 0253 0080
0 0253 FFFF
64K-128
Reserved
2
0254 0000
0254 003F
0 0254 0000
0 0254 003F
64
UART
0254 0400
0254 FFFF
0 0254 0400
0 0254 FFFF
64K-64
Reserved
0255 0000
0257 FFFF
0 0255 0000
0 0257 FFFF
192K
Reserved
24
Device Overview
Copyright 2012 Texas Instruments Incorporated
Submit Documentation Feedback
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
www.ti.com
Table 2-2
Memory Map Summary (Part 5 of 9)
Logical 32 bit Address
Physical 36 bit Address
Start
End
Start
End
Bytes
Description
0258 0000
025B FFFF
0 0258 0000
025C 0000
025F FFFF
0 025C 0000
0 025B FFFF
256K
Reserved
0 025F FFFF
256K
Reserved
0260 0000
0260 1FFF
0 0260 0000
0 0260 1FFF
8K
Secondary Chip Interrupt Contoller CIC 0
0260 2000
0260 3FFF
0 0260 2000
0 0260 3FFF
8K
Reserved
0260 4000
0260 5FFF
0 0260 4000
0 0260 5FFF
8K
Secondary Chip Interrupt Contoller CIC 1
0260 6000
0260 7FFF
0 0260 6000
0 0260 7FFF
8K
Reserved
0260 8000
0260 9FFF
0 0260 8000
0 0260 9FFF
8K
Secondary Chip Interrupt Contoller CIC 2
0260 A000
0260 BFFF
0 0260 A000
0 0260 BFFF
8K
Reserved
0260 C000
0260 DFFF
0 0260 C000
0 0260 DFFF
8K
Reserved
0260 E000
0260 FFFF
0 0260 E000
0 0260 FFFF
8K
Reserved
0261 0000
0261 FFFF
0 0261 0000
0 0261 FFFF
64K
Reserved
0262 0000
0262 03FF
0 0262 0000
0 0262 03FF
1K
Chip-level registers
0262 0400
0262 FFFF
0 0262 0400
0 0262 FFFF
63K
Reserved
0263 0000
0263 FFFF
0 0263 0000
0 0263 FFFF
64K
Reserved
0264 0000
0264 07FF
0 0264 0000
0 0264 07FF
2K
Semaphore
0264 0800
0264 FFFF
0 0264 0800
0 0264 FFFF
64K-2K
Reserved
0265 0000
026F FFFF
0 0265 0000
0 026F FFFF
704K
Reserved
0270 0000
0270 7FFF
0 0270 0000
0 0270 7FFF
32K
EDMA3 channel controller EDMA3CC0
0270 8000
0271 FFFF
0 0270 8000
0 0271 FFFF
96K
Reserved
0272 0000
0272 7FFF
0 0272 0000
0 0272 7FFF
32K
EDMA3 channel controller EDMA3CC1
0272 8000
0273 FFFF
0 0272 8000
0 0273 FFFF
96K
Reserved
02740000
0274 7FFF
0 02740000
0 0274 7FFF
32K
EDMA3 channel controller EDMA3CC2
0274 8000
0275 FFFF
0 0274 8000
0 0275 FFFF
96K
Reserved
0276 0000
0276 03FF
0 0276 0000
0 0276 03FF
1K
EDMA3CC0 transfer controller EDMA3TC0
0276 0400
0276 7FFF
0 0276 0400
0 0276 7FFF
31K
Reserved
0276 8000
0276 83FF
0 0276 8000
0 0276 83FF
1K
EDMA3CC0 transfer controller EDMA3TC1
0276 8400
0276 FFFF
0 0276 8400
0 0276 FFFF
31K
Reserved
0277 0000
0277 03FF
0 0277 0000
0 0277 03FF
1K
EDMA3CC1 transfer controller EDMA3TC0
0277 0400
0277 7FFF
0 0277 0400
0 0277 7FFF
31K
Reserved
0277 8000
0277 83FF
0 0277 8000
0 0277 83FF
1K
EDMA3CC1 transfer controller EDMA3TC1
0278 0400
0277 FFFF
0 0278 0400
0 0277 FFFF
31K
Reserved
0278 0000
0278 03FF
0 0278 0000
0 0278 03FF
1K
EDMA3CC1 transfer controller EDMA3TC2
0278 0400
0278 7FFF
0 0278 0400
0 0278 7FFF
31K
Reserved
0278 8000
0278 83FF
0 0278 8000
0 0278 83FF
1K
EDMA3CC1 transfer controller EDMA3TC3
0278 8400
0278 FFFF
0 0278 8400
0 0278 FFFF
31K
Reserved
0279 0000
0279 03FF
0 0279 0000
0 0279 03FF
1K
EDMA3CC2 transfer controllerEDMA3TC0
0279 0400
0279 7FFF
0 0279 0400
0 0279 7FFF
31K
Reserved
0279 8000
0279 83FF
0 0279 8000
0 0279 83FF
1K
EDMA3CC2 transfer controller EDMA3TC1
0279 8400
0279 FFFF
0 0279 8400
0 0279 FFFF
31K
Reserved
027A 0000
027A 03FF
0 027A 0000
0 027A 03FF
1K
EDMA3CC2 transfer controllerEDMA3TC2
027A 0400
027A 7FFF
0 027A 0400
0 027A 7FFF
31K
Reserved
027A 8000
027A 83FF
0 027A 8000
0 027A 83FF
1K
EDMA3CC2 transfer controller EDMA3TC3
027A 8400
027A FFFF
0 027A 8400
0 027A FFFF
31K
Reserved
Copyright 2012 Texas Instruments Incorporated
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Device Overview
25
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
Table 2-2
Logical 32 bit Address
Start
www.ti.com
Memory Map Summary (Part 6 of 9)
End
Physical 36 bit Address
Start
End
Bytes
Description
027B 0000
027B FFFF
0 027B 0000
0 027B FFFF
64K
Reserved
027C 0000
027C FFFF
0 027C 0000
0 027C FFFF
64K
Reserved
027D 0000
027D 3FFF
0 027D 0000
0 027D 3FFF
16K
TI embedded trace buffer (TETB) - CorePac0
027D 4000
027D FFFF
0 027D 4000
0 027D FFFF
48K
Reserved
027E 0000
027E 3FFF
0 027E 0000
0 027E 3FFF
16K
TI embedded trace buffer (TETB) - CorePac1
027E 4000
027E FFFF
0 027E 4000
0 027E FFFF
48K
Reserved
027F 0000
027F 3FFF
0 027F 0000
0 027F 3FFF
16K
TI embedded trace buffer (TETB) - CorePac2
027F 4000
027F FFFF
0 027F 4000
0 027F FFFF
48K
Reserved
0280 0000
0280 3FFF
0 0280 0000
0 0280 3FFF
16
TI embedded trace buffer (TETB) - CorePac3
0280 4000
0280 FFFF
0 0280 4000
0 0280 FFFF
48K
Reserved
0281 0000
0281 3FFF
0 0281 0000
0 0281 3FFF
16K
Reserved
0281 4000
0281 FFFF
0 0281 4000
0 0281 FFFF
48K
Reserved
0282 0000
0282 3FFF
0 0282 0000
0 0282 3FFF
16K
Reserved
0282 4000
0282 FFFF
0 0282 4000
0 0282 FFFF
48K
Reserved
0283 0000
0283 3FFF
0 0283 0000
0 0283 3FFF
16K
Reserved
0283 4000
0283 FFFF
0 0283 4000
0 0283 FFFF
48K
Reserved
0284 0000
0284 3FFF
0 0284 0000
0 0284 3FFF
16K
Reserved
0284 4000
0284 FFFF
0 0284 4000
0 0284 FFFF
48K
Reserved
0285 0000
0285 7FFF
0 0285 0000
0 0285 7FFF
32K
TI embedded trace buffer (TETB) - system
0285 8000
0285 FFFF
0 0285 8000
0 0285 FFFF
32K
Reserved
0286 0000
028F FFFF
0 0286 0000
0 028F FFFF
640K
Reserved
0290 0000
0290 0FFF
0 0290 0000
0 0290 0FFF
4K
Serial RapidIO (SRIO) configuration
0290 8000
029F FFFF
0 0290 8000
0 029F FFFF
1M-32K
Reserved
02A0 0000
02AF FFFF
0 02A0 0000
0 02AF FFFF
1M
Queue Manager subsystem configuration
02B0 0000
02BF FFFF
0 02B0 0000
0 02BF FFFF
1M
Reserved
02C0 0000
02FF FFFF
0 02C0 0000
0 02FF FFFF
4M
Reserved
03000 000
07FF FFFF
0 03000 000
0 07FF FFFF
80M
Reserved
0800 0000
0800 FFFF
0 0800 0000
0 0800 FFFF
64K
Extended Memory Controller (XMC) configuration
0801 0000
0BBF FFFF
0 0801 0000
0 0BBF FFFF
60M-64K
Reserved
0BC0 0000
0BCF FFFF
0 0BC0 0000
0 0BCF FFFF
1M
Multicore Shared Memory Controller (MSMC) config
0BD0 0000
0BFF FFFF
0 0BD0 0000
0 0BFF FFFF
3M
Reserved
0C00 0000
0C1F FFFF
0 0C00 0000
0 0C1F FFFF
2M
Multicore Shared Memory (MSM)
0C20 0000
0C3F FFFF
0 0C20 0000
0 0C3F FFFF
2M
Reserved
0C40 0000
0FFF FFFF
0 0C40 0000
0 0FFF FFFF
60M
Reserved
1000 0000
107F FFFF
0 1000 0000
0 107F FFFF
8M
Reserved
1080 0000
108F FFFF
0 1080 0000
0 108F FFFF
1M
CorePac0 L2 SRAM
1090 0000
10DF FFFF
0 1090 0000
0 10DF FFFF
5M
Reserved
10E0 0000
10E0 7FFF
0 10E0 0000
0 10E0 7FFF
32K
CorePac0 L1P SRAM
10E0 8000
10EF FFFF
0 10E0 8000
0 10EF FFFF
1M-32K
Reserved
10F0 0000
10F0 7FFF
0 10F0 0000
0 10F0 7FFF
32K
CorePac0 L1D SRAM
10F0 8000
117F FFFF
0 10F0 8000
0 117F FFFF
9M-32K
Reserved
1180 0000
118F FFFF
0 1180 0000
0 118F FFFF
1M
CorePac1 L2 SRAM
1190 0000
11DF FFFF
0 1190 0000
0 11DF FFFF
5M
Reserved
26
Device Overview
Copyright 2012 Texas Instruments Incorporated
Submit Documentation Feedback
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
www.ti.com
Table 2-2
Memory Map Summary (Part 7 of 9)
Logical 32 bit Address
Start
End
Physical 36 bit Address
Start
End
Bytes
Description
11E0 0000
11E0 7FFF
0 11E0 0000
0 11E0 7FFF
32K
CorePac1 L1P SRAM
11E0 8000
11EF FFFF
0 11E0 8000
0 11EF FFFF
1M-32K
Reserved
11F0 0000
11F0 7FFF
0 11F0 0000
0 11F0 7FFF
32K
CorePac1 L1D SRAM
11F0 8000
127F FFFF
0 11F0 8000
0 127F FFFF
9M-32K
Reserved
1280 0000
128F FFFF
0 1280 0000
0 128F FFFF
1M
CorePac2 L2 SRAM
1290 0000
12DF FFFF
0 1290 0000
0 12DF FFFF
5M
Reserved
12E0 0000
12E0 7FFF
0 12E0 0000
0 12E0 7FFF
32K
CorePac2 L1P SRAM
12E0 8000
12EF FFFF
0 12E0 8000
0 12EF FFFF
1M-32K
Reserved
12F0 0000
12F0 7FFF
0 12F0 0000
0 12F0 7FFF
32K
CorePac2 L1D SRAM
12F0 8000
137F FFFF
0 12F0 8000
0 137F FFFF
9M-32K
Reserved
1380 0000
1388 FFFF
0 1380 0000
0 1388 FFFF
1M
CorePac3 L2 SRAM
1390 0000
13DF FFFF
0 1390 0000
0 13DF FFFF
5M
Reserved
13E0 0000
13E0 7FFF
0 13E0 0000
0 13E0 7FFF
32K
CorePac3 L1P SRAM
13E0 8000
13EF FFFF
0 13E0 8000
0 13EF FFFF
1M-32K
Reserved
13F0 0000
13F0 7FFF
0 13F0 0000
0 13F0 7FFF
32K
CorePac3 L1D SRAM
13F0 8000
147F FFFF
0 13F0 8000
0 147F FFFF
9M-32K
Reserved
1480 0000
1487 FFFF
0 1480 0000
0 1487 FFFF
512K
Reserved
1488 0000
148F FFFF
0 1488 0000
0 148F FFFF
512K
Reserved
1490 0000
14DF FFFF
0 1490 0000
0 14DF FFFF
5M
Reserved
14E0 0000
14E0 7FFF
0 14E0 0000
0 14E0 7FFF
32K
Reserved
14E0 8000
14EF FFFF
0 14E0 8000
0 14EF FFFF
1M-32K
Reserved
14F0 0000
14F0 7FFF
0 14F0 0000
0 14F0 7FFF
32K
Reserved
14F0 8000
157F FFFF
0 14F0 8000
0 157F FFFF
9M-32K
Reserved
1580 0000
1587 FFFF
0 1580 0000
0 1587 FFFF
512K
Reserved
1588 0000
158F FFFF
0 1588 0000
0 158F FFFF
512K
Reserved
1590 0000
15DF FFFF
0 1590 0000
0 15DF FFFF
5M
Reserved
15E0 0000
15E0 7FFF
0 15E0 0000
0 15E0 7FFF
32K
Reserved
15E0 8000
15EF FFFF
0 15E0 8000
0 15EF FFFF
1M-32K
Reserved
15F0 0000
15F0 7FFF
0 15F0 0000
0 15F0 7FFF
32K
Reserved
15F0 8000
167F FFFF
0 15F0 8000
0 167F FFFF
9M-32K
Reserved
1680 0000
1687 FFFF
0 1680 0000
0 1687 FFFF
512K
Reserved
1688 0000
168F FFFF
0 1688 0000
0 168F FFFF
512K
Reserved
1690 0000
16DF FFFF
0 1690 0000
0 16DF FFFF
5M
Reserved
16E0 0000
16E0 7FFF
0 16E0 0000
0 16E0 7FFF
32K
Reserved
16E0 8000
16EF FFFF
0 16E0 8000
0 16EF FFFF
1M-32K
Reserved
16F0 0000
16F0 7FFF
0 16F0 0000
0 16F0 7FFF
32K
Reserved
16F0 8000
177F FFFF
0 16F0 8000
0 177F FFFF
9M-32K
Reserved
1780 0000
1787 FFFF
0 1780 0000
0 1787 FFFF
512K
Reserved
1788 0000
178F FFFF
0 1788 0000
0 178F FFFF
512K
Reserved
1790 0000
17DF FFFF
0 1790 0000
0 17DF FFFF
5M
Reserved
17E0 0000
17E0 7FFF
0 17E0 0000
0 17E0 7FFF
32K
Reserved
17E0 8000
17EF FFFF
0 17E0 8000
0 17EF FFFF
1M-32K
Reserved
17F0 0000
17F0 7FFF
0 17F0 0000
0 17F0 7FFF
32K
Reserved
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27
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
Table 2-2
Logical 32 bit Address
Start
www.ti.com
Memory Map Summary (Part 8 of 9)
End
Physical 36 bit Address
Start
End
Bytes
Description
17F0 8000
1FFF FFFF
0 17F0 8000
0 1FFF FFFF
129M-32K
Reserved
2000 0000
200F FFFF
0 2000 0000
0 200F FFFF
1M
System trace manager (STM) configuration
2010 0000
201F FFFF
0 2010 0000
0 201F FFFF
1M
Reserved
2020 0000
205F FFFF
0 2020 0000
0 205F FFFF
4M
RAC_B data
2060 0000
206F FFFF
0 2060 0000
0 206F FFFF
1M
TCP3d-B data
2070 0000
207F FFFF
0 2070 0000
0 207F FFFF
1M
Reserved
2080 0000
208F FFFF
0 2080 0000
0 208F FFFF
1M
TCP3d-A data
2090 0000
2090 1FFF
0 2090 0000
0 2090 1FFF
8K
TCP3e data write port
2090 2000
2090 3FFF
0 2090 2000
0 2090 3FFF
8K
TCP3e data read port
2090 4000
209F FFFF
0 2090 4000
0 209F FFFF
1M-16K
Reserved
20A0 0000
20A3 FFFF
0 20A0 0000
0 20A3 FFFF
256K
Reserved
20A4 0000
20A4 FFFF
0 20A4 0000
0 20A4 FFFF
64K
Reserved
20A5 0000
20AF FFFF
0 20A5 0000
0 20AF FFFF
704K
Reserved
20B0 0000
20B1 FFFF
0 20B0 0000
0 20B1 FFFF
128K
Boot ROM
20B2 0000
20BE FFFF
0 20B2 0000
0 20BE FFFF
832K
Reserved
20BF 0000
20BF 01FF
0 20BF 0000
0 20BF 01FF
512
SPI
20BF 0400
20BF FFFF
0 20BF 0400
0 20BF FFFF
63K
Reserved
20C0 0000
20C0 00FF
0 20C0 0000
0 20C0 00FF
256
Reserved
20C0 0100
20FF FFFF
0 20C0 0100
0 20FF FFFF
4M-256
Reserved
2100 0000
2100 01FF
1 0000 0000
1 0000 01FF
512
DDR3 EMIF configuration
2100 0200
213F FFFF
0 2100 0200
0 213F FFFF
4M-256
Reserved
2140 0000
2140 00FF
0 2140 0000
0 2140 00FF
256
HyperLink config
2140 0400
217F FFFF
0 2140 0400
0 217F FFFF
4M-1K
Reserved
2180 0000
2180 7FFF
0 2180 0000
0 2180 7FFF
32K
PCIe config
2180 8000
21BF FFFF
0 2180 8000
0 21BF FFFF
4M-32K
Reserved
21C0 0000
21FF FFFF
0 21C0 0000
0 21FF FFFF
4M
Reserved
2200 0000
229F FFFF
0 2200 0000
0 229F FFFF
10M
Reserved
22A0 0000
22A0 FFFF
0 22A0 0000
0 22A0 FFFF
64K
VCP2_A
22A1 0000
22AF FFFF
0 22A1 0000
0 22AF FFFF
1M-64K
Reserved
22B0 0000
22B0 FFFF
0 22B0 0000
0 22B0 FFFF
64K
VCP2_B
22B1 0000
22BF FFFF
0 22B1 0000
0 22BF FFFF
1M-64K
Reserved
22C0 0000
22C0 FFFF
0 22C0 0000
0 22C0 FFFF
64K
VCP2_C
22C1 0000
22CF FFFF
0 22C1 0000
0 22CF FFFF
1M-64K
Reserved
22D0 0000
22D0 FFFF
0 22D0 0000
0 22D0 FFFF
64K
VCP2_D
22D1 0000
22DF FFFF
0 22D1 0000
0 22DF FFFF
1M-64K
Reserved
22E0 0000
23FF FFFF
0 22E0 0000
0 23FF FFFF
18M
Reserved
2400 0000
2FFF FFFF
0 2400 0000
0 2FFF FFFF
192M
Reserved
3000 0000
331F FFFF
0 3000 0000
0 331F FFFF
50M
Reserved
3320 0000
335F FFFF
0 3320 0000
0 335F FFFF
4M
RAC_A data
3360 0000
33FF FFFF
0 3360 0000
0 33FF FFFF
10M
Reserved
3400 0000
341F FFFF
0 3400 0000
0 341F FFFF
2M
Queue Manager subsystem data
3420 0000
342F FFFF
0 3420 0000
0 342F FFFF
1M
Reserved
3430 0000
3439 FFFF
0 3430 0000
0 3439 FFFF
640K
Reserved
28
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Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
www.ti.com
Table 2-2
Memory Map Summary (Part 9 of 9)
Logical 32 bit Address
Physical 36 bit Address
Start
End
Start
End
Bytes
Description
343A 0000
343F FFFF
0 343A 0000
0 343F FFFF
384K
Reserved
3440 0000
347F FFFF
0 3440 0000
0 347F FFFF
4M
Reserved
3480 0000
34BF FFFF
0 3480 0000
0 34BF FFFF
4M
Reserved
34C0 0000
34C2 FFFF
0 34C0 0000
0 34C2 FFFF
192K
TAC data
34C3 0000
34FF FFFF
0 34C3 0000
0 34FF FFFF
4M-192K
Reserved
3500 0000
3500 03FF
0 3500 0000
0 3500 03FF
1K
Memory protection unit (MPU) 5
3500 0400
3500 7FFF
0 3500 0400
0 3500 7FFF
31K
Reserved
3500 8000
3500 81FF
0 3500 8000
0 3500 81FF
512
Reserved
3500 8200
3501 FFFF
0 3500 8200
0 3501 FFFF
95K
Reserved
3502 0000
3502 03FF
0 3502 0000
0 3502 03FF
1K
TCP3d_C config
3502 0400
3503 FFFF
0 3502 0400
0 3503 FFFF
127K
Reserved
3504 0000
3504 07FF
0 3504 0000
0 3504 07FF
2K
FFTC_C config
3504 0800
350F FFFF
0 3504 0800
0 350F FFFF
766K
Reserved
3510 0000
351F FFFF
0 3510 0000
0 351F FFFF
1M
Reserved
3520 0000
3521 FFFF
0 3520 0000
0 3521 FFFF
128K
BCP config
3522 0000
355F FFFF
0 3522 0000
0 355F FFFF
3968K
Reserved
3560 0000
356F FFFF
0 3560 0000
0 356F FFFF
1M
TCP3d_C data
3570 0000
37FF FFFF
0 3570 0000
0 37FF FFFF
41M
Reserved
3800 0000
3FFF FFFF
0 3800 0000
0 3FFF FFFF
128M
Reserved
4000 0000
4FFF FFFF
0 4000 0000
0 4FFF FFFF
256M
HyperLink data
5000 0000
5FFF FFFF
0 5000 0000
0 5FFF FFFF
256M
Reserved
6000 0000
6FFF FFFF
0 6000 0000
0 6FFF FFFF
256M
PCIe data
7000 0000
73FF FFFF
0 7000 0000
0 73FF FFFF
64M
Reserved
7400 0000
77FF FFFF
0 7400 0000
0 77FF FFFF
64M
Reserved
7800 0000
7BFF FFFF
0 7800 0000
0 7BFF FFFF
64M
Reserved
7C00 0000
7FFF FFFF
0 7C00 0000
0 7FFF FFFF
64M
Reserved
8000 0000
FFFF FFFF
8 0000 0000
8 7FFF FFFF
2G
DDR3 EMIF data
End of Table 2-2
2.3 Boot Sequence
The boot sequence is a process by which the DSP's internal memory is loaded with program and data sections. The
DSP's internal registers are programmed with predetermined values. The boot sequence is started automatically
after each power-on reset. A hard reset, soft reset or local reset to an individual C66x CorePac should not affect the
state of the hardware boot controller on the device. For more details on the initiators of the resets, see section
7.4 ‘‘Reset Controller’’ on page 122. The bootloader uses a section of the L2 SRAM (start address 0x008F 2DC0 and
end address 0x008F FFFF) during initial booting of the device. For more details on the type of configurations stored
in this reserved L2 section see the Bootloader for the C66x DSP User Guide in ‘‘Related Documentation from Texas
Instruments’’ on page 66.
The C6670 supports several boot processes that begins execution at the ROM base address, which contains the
bootloader code necessary to support various device boot modes. The boot processes are software-driven and use
the BOOTMODE[12:0] device configuration inputs to determine the software configuration that must be
completed. For more details on boot sequence see the Bootloader for the C66x DSP User Guide in ‘‘Related
Documentation from Texas Instruments’’ on page 66.
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TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
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2.4 Boot Modes Supported and PLL Settings
The device supports several boot processes, which leverage the internal boot ROM. Most boot processes are software
driven, using the BOOTMODE[3:0] device configuration inputs to determine the software configuration that must
be completed. From a hardware perspective, there are two possible boot modes:
• Public ROM Boot - C66x CorePac is released from reset and begins executing from the L3 ROM base address.
2
After performing the boot process (e.g., from I C ROM, Ethernet, or RapidIO), the C66x CorePac then begins
execution from the L2 RAM base address.
• Secure ROM Boot - On secure devices, the C66x CorePac is released from reset and begins executing from
secure ROM. Software in the secure ROM will free up internal RAM pages, after which the C66x CorePac
initiates the boot process. The C66x CorePac performs any authentication and decryption required on the
bootloaded image prior to beginning execution.
The boot process performed by the C66x CorePac in public ROM boot and secure ROM boot is determined by the
BOOTMODE[12:0] value in the DEVSTAT register. The C66x CorePac reads this value, and then executes the
associated boot process in software. Figure 2-2 shows the bits associated with BOOTMODE[12:0]. PLL settings are
shown at the end of this section, and the PLL setup details can be found in Section 7.5 ‘‘Main PLL and the PLL
Controller’’ on page 128
Figure 2-2
Boot Mode Pin Decoding
Boot Mode Pins
12
11
10
9
2
PLL Mult I C /SPI Ext Dev Cfg
8
7
6
5
Device Configuration
4
3
Reserved
(1)
2
1
0
Boot Device
1 BOOTMODE[4:3] are reserved in all modes except No-Boot, Ethernet (SGMII), I2C and SPI boot mode
2.4.1 Boot Device Field
The Boot Device field BOOTMODE[2:0] defines the boot device that is chosen. Table 2-3 shows the supported boot
modes.
Table 2-3
Boot Mode Pins: Boot Device Values
Bit
Field
Description
2-0
Boot Device
Device boot mode
0 = No boot
1 = Serial Rapid I/O
2 = Ethernet (SGMII) (PA driven from core clk)
3 = Ethernet (SGMII) (PA driver from PA clk)
4 = PCI
2
5=I C
6 = SPI
7 = HyperLink
End of Table 2-3
30
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Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
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2.4.2 Device Configuration Field
The device configuration fields BOOTMODE[9:3] are used to configure the boot peripheral and, therefore, the bit
definitions depend on the boot mode.
2.4.2.1 No Boot Device Configuration
Figure 2-3
No Boot Configuration Fields
9
8
7
6
5
3
Reserved
Sub-Mode
Table 2-4
4
No Boot Configuration Field Descriptions
Bit
Field
Description
9-8
Sub-Mode
Sub mode select
0 = No boot
1 - 3 = Reserved
7-3
Reserved
Reserved
End of Table 2-4
2.4.2.2 Serial Rapid I/O Boot Device Configuration
The device ID is always set to 0xff (8-bit node IDs) or 0xffff (16 bit node IDs) at power-on reset.
Figure 2-4
Serial Rapid I/O Device Configuration Fields
9
8
Lane Setup
Table 2-5
7
6
Data Rate
5
Ref Clock
4
3
Reserved
Serial Rapid I/O Configuration Field Descriptions
Bit
Field
Description
9
Lane Setup
SRIO port and lane configuration
0 = Port configured as 4 ports each 1 lane wide (4 -1× ports)
1 = Port configured as 2 ports 2 lanes wide (2 – 2× ports)
8-7
Data Rate
SRIO data rate configuration
0 = 1.25 GBs
1 = 2.5 GBs
2 = 3.125 GBs
3 = 5.0 GBs
6-5
Ref Clock
SRIO reference clock configuration
0 = Reference clock = 156.25 MHz
1 = Reference clock = 250 MHz
2 = Reference clock = 312.5 MHz
3 = Reserved
4-3
Reserved
Reserved
End of Table 2-5
In SRIO boot mode, both the message mode and DirectIO mode will be enabled by default. If use of the memory
reserved for received messages is required and reception of messages cannot be prevented, the master can disable
the message mode by writing to the boot table and generating a boot restart.
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TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
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2.4.2.3 Ethernet (SGMII) Boot Device Configuration
Figure 2-5
Ethernet (SGMII) Device Configuration Fields
9
8
7
SerDes Clock Mult
Table 2-6
6
5
4
Ext connection
3
Dev ID
Ethernet (SGMII) Configuration Field Descriptions
Bit
Field
Description
9-8
SerDes clock mult
SGMII SerDes input clock. The output frequency of the PLL must be 1.25 GBs.
0 = ×8 for input clock of 156.25 MHz
1 = ×5 for input clock of 250 MHz
2 = ×4 for input clock of 312.5 MHz
3 = Reserved
7-6
Ext connection
External connection mode
0 = MAC to MAC connection, master with auto negotiation
1 = MAC to MAC connection, slave, and MAC to PHY
2 = MAC to MAC, forced link
3 = MAC to fiber connection
5-3
Device ID
This value can range from 0 to 7 and is used in the device ID field of the Ethernet-ready frame.
End of Table 2-6
2.4.2.4 PCI Boot Device Configuration
Additional device configuration is provided in the PCI bits in the DEVSTAT register.
Figure 2-6
PCI Device Configuration Fields
9
8
7
Reserved
Table 2-7
6
BAR Config
5
4
3
Reserved
PCI Device Configuration Field Descriptions
Bit
Field
Description
9
Reserved
Reserved
8-5
Bar Config
PCIe BAR registers configuration
This value can range from 0 to 0xf. See Table 2-8.
4-3
Reserved
Reserved
End of Table 2-7
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Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
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Table 2-8
BAR Config / PCIe Window Sizes
32-Bit Address Translation
64-Bit Address Translation
BAR cfg
BAR0
BAR1
BAR2
BAR3
BAR4
BAR5
0b0000
PCIe MMRs
32
32
32
32
Clone of BAR4
BAR2/3
BAR4/5
0b0001
16
16
32
64
0b0010
16
32
32
64
0b0011
32
32
32
64
0b0100
16
16
64
64
0b0101
16
32
64
64
0b0110
32
32
64
64
0b0111
32
32
64
128
0b1000
64
64
128
256
0b1001
4
128
128
128
0b1010
4
128
128
256
0b1011
0b1100
4
128
256
256
256
256
0b1101
512
512
0b1110
1024
1024
0b1111
2048
2048
2.4.2.5 I2C Boot Device Configuration
2.4.2.5.1 I2C Master Mode
In master mode, the I2C device configuration uses ten bits of device configuration instead of seven as used in other
2
boot modes. In this mode, the device will make the initial read of the I C EEPROM while the PLL is in bypass mode.
The initial read will contain the desired clock multiplier, which will be set up prior to any subsequent reads.
I2C Master Mode Device Configuration Fields
Figure 2-7
12
11
10
9
8
Reserved
Speed
Address
Reserved
Mode
Table 2-9
7
6
5
4
3
Parameter Index
I2C Master Mode Device Configuration Field Descriptions
Bit
Field
Description
12
Reserved
Reserved
11
Speed
I C data rate configuration
0 = I2C data rate set to approximately 20 kHz
2
1 = I C fast mode. Data rate set to approximately 400 kHz (will not exceed)
10
Address
I C bus address configuration
2
2
0 = Boot from I C EEPROM at I C bus address 0x50
2
2
1 = Boot from I C EEPROM at I C bus address 0x51
9
Reserved
Reserved
8
Mode
I C operation mode
0 = Master mode
1 = Passive mode (see 2.4.2.5.2 ‘‘I2C Passive Mode’’)
7-3
Parameter Index
Identifies the index of the configuration table initially read from the I C EEPROM.
2
2
2
2
This value can range from 0 to 32.
End of Table 2-9
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Multicore Fixed and Floating-Point System-on-Chip
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2
2.4.2.5.2 I C Passive Mode
In passive mode, the device does not drive the clock, but simply acks data received on the specified address.
I2C Passive Mode Device Configuration Fields
Figure 2-8
9
8
Reserved
Table 2-10
7
6
5
4
2
Mode
3
Reserved
Receive I C Address
I2C Passive Mode Device Configuration Field Descriptions
Bit
Field
Description
9
Reserved
Reserved
8
Mode
I2 C operation mode
0 = Master mode (see ‘‘I2C Master Mode’’ on page 33)
1 = Passive mode
8-5
Receive I C Address
2
2
I C bus address configuration
0 - 7 = The I2C bus address the device will listen to for data
2
The actual value on the bus is 0x19 plus the value in bits [8:5]. For Ex. if bits[8:5] = 0 then the device will listen to I C
bus address 0x19.
4-3
Reserved
Reserved
End of Table 2-10
2.4.2.6 SPI Boot Device Configuration
In SPI boot mode, the SPI device configuration uses ten bits of device configuration instead of seven as used in other
boot modes.
Figure 2-9
SPI Device Configuration Fields
12
11
Mode
Table 2-11
10
9
4, 5 Pin
Addr Width
8
7
Chip Select
6
5
4
3
Parameter Table Index
SPI Device Configuration Field Descriptions
Bit
Field
Description
12-11
Mode
Clk Pol / Phase
0 = Data is output on the rising edge of SPICLK. Input data is latched on the falling edge.
1 = Data is output one half-cycle before the first rising edge of SPICLK and on subsequent falling edges. Input
data is latched on the rising edge of SPICLK.
2 = Data is output on the falling edge of SPICLK. Input data is latched on the rising edge.
3 = Data is output one half-cycle before the first falling edge of SPICLK and on subsequent rising edges. Input
data is latched on the falling edge of SPICLK.
10
4, 5 Pin
SPI operation mode configuration
0 = 4-pin mode used
1 = 5-pin mode used
9
Addr Width
SPI address width configuration
0 = 16-bit address values are used
1 = 24-bit address values are used
8-7
Chip Select
The chip select field value
6-3
Parameter Table Index
Specifies which parameter table is loaded
End of Table 2-11
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2.4.2.7 HyperLink Boot Device Configuration
Figure 2-10
HyperLink Boot Device Configuration Fields
9
8
7
Reserved
Table 2-12
6
Data Rate
5
4
3
Ref Clock
Reserved
HyperLink Boot Device Configuration Field Descriptions
Bit
Field
Description
9
Reserved
Reserved
8-7
Data Rate
HyperLink data rate configuration
0 = 1.25 GBs
1 = 3.125 GBs
2 = 6.25 GBs
3 = Reserved
6-5
Ref Clocks
HyperLink reference clock configuration
0 = 156.25 MHz
1 = 250 MHz
2 = 312.5 MHz
3 = Reserved
4-3
Reserved
Reserved
End of Table 2-12
2.4.3 PLL Settings
The PLL default settings are determined by the BOOTMODE[12:10] bits. Table 2-13 shows settings for various
input clock frequencies. This will set the PLL to the maximum clock setting for the device.
CLK = CLKIN × (PLLM+1) ÷ (2 × (PLLD+1))
The configuration for the PASS PLL is also shown. The PASS PLL is configured with these values only if the Ethernet
boot mode is selected with the input clock set to match the main PLL clock (not the SGMII SerDes clock). See
Table 2-3 for details on configuring Ethernet boot mode. The output from the PASS PLL goes through an on-chip
divider to reduce the operating frequency before reaching the NETCP. The PASS PLL generates 1050 MHz, and after
the chip divider (/3), applies 350 MHz to the NETCP.
The Main PLL is controlled using a PLL controller and a chip-level MMR. The DDR3 PLL and PASS PLL are
controlled by chip level MMRs. For details on how to set up the PLL see Section 7.5 ‘‘Main PLL and the PLL
Controller’’ on page 128. For details on the operation of the PLL controller module, see the Phase Locked Loop (PLL)
Controller for KeyStone Devices User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66.
Table 2-13
BOOTMODE
[12:10]
C66x CorePac System PLL Configuration
Input Clock
Freq (MHz)
800 MHz Device
PLLD
PLLM
DSP ƒ
1000 MHz Device
PLLD
PLLM
DSP ƒ
1200 MHz Device
PLLD
PLLM
DSP ƒ
PA = 350 MHz
PLLD
PLLM
(1)
DSP ƒ (2)
0b000
50.00
0
31
800
0
39
1000
0
47
1200
0
41
1050
0b001
66.67
0
23
800.04
0
29
1000.05
0
35
1200.06
1
62
1050.053
0b010
80.00
0
19
800
0
24
1000
0
29
1200
3
104
1050
0b011
100.00
0
15
800
0
19
1000
0
23
1200
0
20
1050
0b100
156.25
24
255
800
4
63
1000
24
383
1200
24
335
1050
0b101
250.00
4
31
800
0
7
1000
4
47
1200
4
41
1050
0b110
312.50
24
127
800
4
31
1000
24
191
1200
24
167
1050
0b111
122.88
47
624
800
28
471
999.989
31
624
1200
11
204
1049.6
1 The PASS PLL generates 1050 MHz and is internally divided by 3 to feed 350 MHz to the packet accelerator.
2 ƒ represents frequency in MHz.
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SPRS689D—March 2012
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2.5 Second-Level Bootloaders
Any of the boot modes can be used to download a second-level bootloader. A second-level bootloader allows for any
level of customization to current boot methods as well as the definition of a completely customized boot.
2.6 Terminals
2.6.1 Package Terminals
Figure 2-11 shows the TMS320C6670 CYP ball grid array package (bottom view).
Figure 2-11
CYP 841-PIN BGA Package (Bottom View)
AH
AF
AD
AB
Y
V
T
AJ
AG
AE
AC
AA
W
U
R
P
N
M
L
K
J
H
F
D
G
E
C
B
A
3
1
2
5
4
9
7
6
8
11 13 15 17 19 21 23 25 27 29
10 12 14 16 18 20 22 24 26 28
2.6.2 Pin Map
Figure 2-13 through Figure 2-16 show the TMS320C6670 pin assignments in four quadrants (A, B, C, and D).
Figure 2-12
36
Pin Map Quadrants (Bottom View)
Device Overview
A
B
D
C
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Figure 2-13
Upper Left Quadrant—A (Bottom View)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
AJ
VSS
CVDD1
VSS
SGMII1
RXN
SGMII1RXP
VSS
RIORXN2
RIORXP2
VSS
RIORXP0
RIORXN0
VSS
PCIERXP0
PCIERXN0
VSS
AH
CVDD1
VSS
SGMII0
RXN
SGMII0
RXP
VSS
RIORXN3
RIORXP3
VSS
RIORXP1
RIORXN1
VSS
PCIERXN1
PCIERXP1
VSS
CORESEL0
AG
VSS
CVDD1
VSS
SGMII1
TXN
SGMII1TXP
VSS
RIOTXN2
RIOTXP2
VSS
RIOTXP0
RIOTXN0
VSS
PCIETXP0
PCIETXN0
VSS
AF
CVDD1
VSS
SGMII0
TXN
SGMII0
TXP
VSS
RIOTXN3
RIOTXP3
VSS
RIOTXN1
RIOTXP1
VSS
PCIETXN1
PCIETXP1
VSS
VSS
AE
VSS
CVDD1
VSS
VDDT2
RSV17
VDDR3
VSS
RSV15
VSS
VDDT2
VDDR4
VDDT2
VSS
RSV16
VDDR2
AD
CVDD1
VSS
CVDD1
VSS
VDDT2
VSS
VDDT2
VSS
VDDT2
VSS
VDDT2
VSS
VDDT2
VSS
CORESEL2
AC
VSS
DVDD18
VSS
DVDD18
VSS
VDDT2
VSS
VDDT2
VSS
VDDT2
VSS
VDDT2
VSS
VDDT2
VSS
AB
VCNTL3
VSS
VCNTL1
VCNTL0
DVDD18
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
AVDDA3
AA
MCMTX
PMDAT
MCMTX
PMCLK
MCMRX
PMCLK
VCNTL2
VSS
VSS
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
Y
MCMTX
FLCLK
MCMTX
FLDAT
MCMRX
PMDAT
RSV28
DVDD18
VSS
VDDT1
VSS
CVDD
VSS
CVDD1
VSS
CVDD1
VSS
CVDD1
W
MCMCLKP
MCMCLKN
MCMRX
FLDAT
RSV29
VSS
VDDT1
VSS
CVDD
VSS
CVDD
VSS
CVDD1
VSS
CVDD1
VSS
V
MCMREF
CLKOUTN
MCMREF
CLKOUTP
MCMRX
FLCLK
RSV14
DVDD18
VSS
VDDT1
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
CVDD
U
VSS
VSS
VSS
VSS
VSS
VSS
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
T
VSS
MCMRXN0
VSS
VSS
MCMTXN0
VSS
VDDT1
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
CVDD
A
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Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
Figure 2-14
www.ti.com
Upper Right Quadrant—B (Bottom View)
16
17
18
19
20
21
22
23
24
25
26
27
28
29
SRIOSGMII
CLKP
PCIECLKN
PASSCLKP
GPIO08
GPIO00
SPIDOUT
SPISCS1
TIMI0
UARTTXD
RSV01
EMU17
EMU15
DVDD18
VSS
SRIOSGMII
CLKN
PCIECLKP
PASSCLKN
GPIO07
GPIO14
SPISCS0
SPIDIN
TIMO0
UARTCTS
EMU18
DVDD18
EMU16
EMU14
DVDD18
AH
MDIO
RSV24
GPIO01
GPIO10
GPIO06
SPICLK
VSS
TIMI1
UARTRTS
EMU13
VSS
EMU12
EMU11
EMU09
AG
MDCLK
RSV25
GPIO04
DVDD18
VSS
GPIO13
DVDD18
TIMO1
UARTRXD
EMU06
EMU10
EMU08
EMU03
EMU01
AF
RSV22
EXTFRAME
EVENT
GPIO05
GPIO03
GPIO12
GPIO09
LRESET
RESETFULL
DVDD18
EMU07
EMU04
DVDD18
EMU02
EMU00
AE
RSV23
SDA
RESETSTAT
GPIO02
GPIO11
GPIO15
RSV12
PACLKSEL
VSS
EMU05
TRST
VSS
TDI
TCK
AD
CORESEL1
SCL
HOUT
POR
LRESET
NMIEN
BOOT
COMPLETE
RSV13
RSV03
RESET
NMI
TMS
TDO
SYSCLKN
SYSCLKP
AC
VSS
DVDD18
VSS
DVDD18
VSS
DVDD18
VSS
CVDD
VSS
CORE
CLKSEL
RSV20
PHYSYNC
ALTCORE
CLKN
ALTCORE
CLKP
AB
CVDD
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
RSV18
VSS
SYSCLKOUT
RADSYNC
RP1CLKN
RP1FBN
AA
VSS
CVDD1
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
DVDD18
VSS
RSV04
RP1CLKP
RP1FBP
Y
CVDD1
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
AVDDA1
VSS
VSS
RSV05
VSS
VSS
W
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
VDDT3
AIFTXP5
VSS
AIFRXP5
VSS
V
CVDD
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
VDDT3
RSV26
AIFTXN5
AIFTXN4
AIFRXN5
AIFRXP4
U
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
VDDT3
VSS
VDDT3
VSS
AIFTXP4
VSS
AIFRXN4
T
AJ
B
38
Device Overview
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Figure 2-15
Lower Right Quadrant—C (Bottom View)
C
R
CVDD
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
VDDT3
VDDR5
AIFTXN2
VSS
AIFRXN2
VSS
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
VDDT3
VSS
VDDT3
AIFTXP2
AIFTXN3
AIFRXP2
AIFRXN3
P
CVDD
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
VDDT3
VDDR6
VSS
AIFTXP3
VSS
AIFRXP3
N
VSS
CVDD
VSS
CVDD
VSS
CVDD1
VSS
VDDT3
VSS
VDDT3
AIFTXP0
VSS
AIFRXP0
VSS
M
CVDD1
VSS
CVDD
VSS
CVDD1
VSS
CVDD1
VSS
VDDT3
RSV27
AIFTXN0
AIFTXN1
AIFRXN0
AIFRXP1
L
VSS
CVDD1
VSS
CVDD
VSS
CVDD1
VSS
RSV0B
RSV0A
VDDT3
VSS
AIFTXP1
VSS
AIFRXN1
K
CVDD1
VSS
CVDD
VSS
CVDD1
VSS
CVDD1
RSV11
RSV08
RSV09
AVDDA2
VSS
RSV06
VSS
J
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
RSV10
PTV15
DVDD18
DDRSL
RATE1
DDRSL
RATE0
RSV07
DDRCLKN
H
DVDD15
VSS
DVDD15
VSS
DVDD15
VSS
DVDD15
VSS
DVDD15
VSS
RSV21
RSV19
DVDD18
DDRCLKP
G
VSS
DVDD15
VSS
DVDD15
DDRD25
DDRD27
DDRD17
DDRD16
DDRD08
DDRD07
VSS
DVDD15
VSS
VSS
F
DDRA10
DDRA12
DDRCKE1
DDRCB00
VSS
DDRD26
DDRD23
DDRD19
DDRD09
DDRD10
DDRD06
DDRD02
DDRD00
DDRDQM0
E
DDRA11
DDRA14
VSS
DDRCB02
DVDD15
DDRD24
DDRD28
DVDD15
DDRD18
DDRD11
DDRD12
DDRD04
DDRD03
DDRD01
D
DDRA13
DDRA15
DDRCB05
DDRCB04
DDRCB01
DDRD29
DDRD31
VSS
DDRD22
DVDD15
DDRD13
DDRDQM1
DDRDQS0P
DDRDQS0N
C
DDRCLK
OUTN1
VSS
DDRCB06
DDRDQS8N
DDRCB03
DDRDQS3N
DDRD30
DDRD21
DDRDQS2N
VSS
DDRD14
DDRDQS1N
DDRD05
DVDD15
B
DDRCLK
OUTP1
DVDD15
DDRCB07
DDRDQS8P
DDRDQM8
DDRDQS3P
DDRDQM3
DDRD20
DDRDQS2P
DDRDQM2
DDRD15
DDRDQS1P
DVDD15
VSS
A
16
17
18
19
20
21
22
23
24
25
26
27
28
29
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TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
Figure 2-16
www.ti.com
Lower Left Quadrant—D (Bottom View)
D
R
MCMRXP1
MCMRXP0
VSS
MCMTXN1
MCMTXP0
VDDT1
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
P
MCMRXN1
VSS
VSS
MCMTXP1
VSS
VSS
VDDT1
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
CVDD
N
VSS
MCMRXN3
VSS
VSS
MCMTXP3
VDDT1
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
M
MCMRXP2
MCMRXP3
VSS
MCMTXP2
MCMTXN3
VSS
VDDT1
VSS
CVDD1
VSS
CVDD
VSS
CVDD
VSS
CVDD
L
MCMRXN2
VSS
VSS
MCMTXN2
VSS
VSS
VSS
CVDD1
VSS
CVDD1
VSS
CVDD
VSS
CVDD1
VSS
K
VSS
VSS
VSS
VSS
VSS
VDDR1
CVDD1
VSS
CVDD1
VSS
CVDD
VSS
CVDD1
VSS
CVDD1
J
VSS
CVDD1
VSS
CVDD1
VSS
CVDD1
VSS
CVDD1
VSS
CVDD1
VSS
CVDD
VSS
CVDD1
VSS
H
CVDD1
VSS
CVDD1
VSS
CVDD1
VSS
CVDD1
VSS
CVDD1
VSS
CVDD
VSS
CVDD
VSS
CVDD
G
VSS
DVDD15
VSS
DVDD15
VSS
CVDD1
VSS
DVDD15
VSS
DVDD15
VSS
DVDD15
VSS
DVDD15
VSS
F
DDRD63
DDRD60
DDRD61
DDRD56
DVDD15
VSS
DVDD15
VSS
DVDD15
VSS
DVDD15
VSS
DDRA03
DDRA02
DDRA08
E
DDRD62
DDRD58
DVDD15
DDRD53
VSS
DDRD45
DDRD42
DDRD39
DDRD36
DDRD32
DDRRESET
DDRWE
DDRODT1
VREFSSTL
DDRA09
D
DDRDQS7P
DDRD57
VSS
DDRD52
DVDD15
DDRD46
DDRD41
DVDD15
DDRD35
DDRD33
DDRCKE0
DDRCAS
DDRODT0
VSS
DDRA07
C
DDRDQS7N
DDRD59
DDRD55
DDRD54
DDRD48
DDRD47
DDRD43
VSS
DDRD37
DDRRAS
DDRCE0
DDRCE1
DDRBA2
DVDD15
DDRA05
B
DVDD15
DDRD44
DDRD38
DDRDQS4N
DDRD34
VSS
DDRCLK
OUTN0
DDRBA1
DDRA01
DDRA06
A
VSS
DVDD15
DDRDQS6N
DDRD51
DDRD49
DDRDQS5N
DDRD40
DVDD15
DDRCLK
OUTP0
DDRBA0
DDRA00
DDRA04
1
2
3
4
5
6
7
11
12
13
14
15
40
DDRDQM7 DDRDQS6P
Device Overview
DDRD50
DDRDQM6 DDRDQS5P
DDRDQM5 DDRDQS4P DDRDQM4
8
9
10
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Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
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2.7 Terminal Functions
The terminal functions table (Table 2-15) identifies the external signal names, the associated pin (ball) numbers, the
pin type (I, O/Z, or I/O/Z), whether the pin has any internal pullup/pulldown resistors, and gives functional pin
descriptions. This table is arranged by function. The power terminal functions table (Table 2-16) lists the various
power supply pins and ground pins and gives functional pin descriptions. Table 2-17 shows all pins arranged by
signal name. Table 2-18 shows all pins arranged by ball number.
There are 17 pins that have a secondary function as well as a primary function. The secondary function is indicated
with a dagger (†).
For more detailed information on device configuration, peripheral selection, multiplexed/shared pins, and
pullup/pulldown resistors, see chapter 3 ‘‘Device Configuration’’ on page 67.
Use the symbol definitions in Table 2-14 when reading Table 2-15.
Table 2-14
I/O Functional Symbol Definitions
Functional
Symbol
IPD or IPU
A
Definition
Internal 100-μA pulldown or pullup is provided for this terminal. In most systems, a 1-kΩ resistor can
be used to oppose the IPD/IPU. For more detailed information on pulldown/pullup resistors and
situations in which external pulldown/pullup resistors are required, see the Hardware Design Guide for
KeyStone Devices in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66.
Table 2-15
Column Heading
IPD/IPU
Analog signal
Type
Ground
Type
Input terminal
Type
O
Output terminal
Type
S
Supply voltage
Type
Z
Three-state terminal or high impedance
Type
GND
I
End of Table 2-14
Table 2-15
Signal Name
Terminal Functions — Signals and Control by Function (Part 1 of 12)
Ball No. Type IPD/IPU Description
AIF
AIFRXN0
L28
I
AIFRXP0
M28
I
AIFRXN1
K29
I
AIFRXP1
L29
I
AIFRXN2
R28
I
AIFRXP2
P28
I
AIFRXN3
P29
I
AIFRXP3
N29
I
AIFRXN4
T29
I
AIFRXP4
U29
I
AIFRXN5
U28
I
AIFRXP5
V28
I
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Antenna interface receive data (6 links)
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TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
Table 2-15
www.ti.com
Terminal Functions — Signals and Control by Function (Part 2 of 12)
Signal Name
Ball No. Type IPD/IPU Description
AIFTXN0
L26
O
AIFTXP0
M26
O
AIFTXN1
L27
O
AIFTXP1
K27
O
AIFTXN2
R26
O
AIFTXP2
P26
O
AIFTXN3
P27
O
AIFTXP3
N27
O
AIFTXN4
U27
O
AIFTXP4
T27
O
AIFTXN5
U26
O
AIFTXP5
V26
O
Antenna interface transmit data (6 links)
AIF2 Timer (AT) Module
RP1CLKP
Y28
I
RP1CLKN
AA28
I
EXTFRAMEEVENT
AE17
OZ
RP1FBP
Y29
I
RP1FBN
AA29
I
PHYSYNC
AB27
I
Down
Frame sync input for PHY timer
RADSYNC
AA27
I
Down
Frame sync input for radio timer
Frame sync interface clock used to drive the frame synchronization interface (OBSAI RP1 clock)
Down
Frame sync clock output
Frame burst to drive frame indicators to the frame synchronization module (OBSAI RP1)
Boot Configuration Pins
LENDIAN †
AJ20
IOZ
Up
BOOTMODE00 †
AG18
IOZ
Down
BOOTMODE01†
AD19
IOZ
Down
BOOTMODE02 †
AE19
IOZ
Down
BOOTMODE03 †
AF18
IOZ
Down
BOOTMODE04 †
AE18
IOZ
Down
BOOTMODE05 †
AG20
IOZ
Down
BOOTMODE06 †
AH19
IOZ
Down
BOOTMODE07 †
AJ19
IOZ
Down
BOOTMODE08 †
AE21
IOZ
Down
BOOTMODE09 †
AG19
IOZ
Down
BOOTMODE10 †
AD20
IOZ
Down
BOOTMODE11 †
AE20
IOZ
Down
BOOTMODE12 †
AF21
IOZ
Down
PCIESSMODE0 †
AH20
IOZ
Down
PCIESSMODE1 †
AD21
IOZ
Down
PCIESSEN †
AJ23
I
Endian configuration pin (pin shared with GPIO[0])
See Section 2.4 ‘‘Boot Modes Supported and PLL Settings’’ on page 30 for more details
(Pins shared with GPIO[1:13])
PCIe mode selection pins (pins shared with GPIO[14:15])
PCIe module enable (pin shared with TIMI0)
Clock / Reset
SYSCLKP
AC29
I
SYSCLKN
AC28
I
PASSCLKP
AJ18
I
PASSCLKN
AH18
I
42
Device Overview
System clock input to antenna interface and/or main PLL
Network coprocessor reference clock to PASS PLL
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Multicore Fixed and Floating-Point System-on-Chip
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Table 2-15
Terminal Functions — Signals and Control by Function (Part 3 of 12)
Signal Name
Ball No. Type IPD/IPU Description
ALTCORECLKP
AB29
I
ALTCORECLKN
AB28
I
SRIOSGMIICLKP
AJ16
I
SRIOSGMIICLKN
AH16
I
DDRCLKP
G29
I
DDRCLKN
H29
I
PCIECLKP
AH17
I
PCIECLKN
AJ17
I
MCMCLKP
W1
I
MCMCLKN
W2
I
SYSCLKOUT
AA26
OZ
Down
System clock output to be used as a general purpose output clock for debug purposes
CORECLKSEL
AB25
I
Down
Core clock select to select between SYSCLK and ALTCORECCLK to the main PLL
PACLKSEL
AD23
IOZ
Down
PA clock select to choose between PASSCLK and the output of main PLL MUX (dependent on
CORECLKSEL pin) to the PA sub-system PLL
HOUT
AC18
OZ
Up
Interrupt output pulse created by IPCGRH
NMI
AC25
I
Up
Non-maskable Interrupt
LRESET
AE22
I
Up
Local Reset
LRESETNMIEN
AC20
I
Up
Enable for core selects
CORESEL0
AH15
I
Down
CORESEL1
AC16
I
Down
CORESEL2
AD15
I
Down
RESETFULL
AE23
I
Up
Full reset power-on reset
RESET
AC24
I
Up
Reset of non isolated portion on the device
POR
AC19
I
RESETSTAT
AD18
O
Up
Reset status output
BOOTCOMPLETE
AC21
OZ
Down
Boot progress indication output
PTV15
H24
A
DDRDQM0
E29
OZ
DDRDQM1
C27
OZ
DDRDQM2
A25
OZ
DDRDQM3
A22
OZ
DDRDQM4
A10
OZ
DDRDQM5
A8
OZ
DDRDQM6
B5
OZ
Alternate System clock input to main PLL
RapidIO/SGMII reference clock to drive the RapidIO and SGMII SerDes
DDR reference clock input to DDR PLL
PCIe reference clock input to drive PCIe SerDes
HyperLink reference clock input to drive the HyperLink SerDes
Select for the target core for LRESET and NMI. For more details see Table 7-47 ‘‘NMI and LRESET
Timing Requirements’’ on page 178
POR (power-on reset)
PTV Compensation NMOS Reference Input. A precision resistor placed between the PTV15
pin and ground is used to closely tune the output impedance of the DDR interface drivers
to 50 Ohms. Presently, the recommended value for this 1% resistor is 45.3 Ohms.
DDR
DDRDQM7
B2
OZ
DDRDQM8
A20
OZ
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DDR EMIF data masks
Device Overview
43
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
Table 2-15
www.ti.com
Terminal Functions — Signals and Control by Function (Part 4 of 12)
Signal Name
Ball No. Type IPD/IPU Description
DDRDQS0P
C28
DDRDQS0N
C29
IOZ
DDRDQS1P
A27
IOZ
DDRDQS1N
B27
IOZ
DDRDQS2P
A24
IOZ
DDRDQS2N
B24
IOZ
DDRDQS3P
A21
IOZ
DDRDQS3N
B21
IOZ
DDRDQS4P
A9
IOZ
DDRDQS4N
B9
IOZ
DDRDQS5P
B6
IOZ
DDRDQS5N
A6
IOZ
DDRDQS6P
B3
IOZ
DDRDQS6N
A3
IOZ
DDRDQS7P
D1
IOZ
IOZ
DDRDQS7N
C1
IOZ
DDRDQS8P
A19
IOZ
DDRDQS8N
B19
IOZ
DDRCB00
E19
IOZ
DDRCB01
C20
IOZ
DDRCB02
D19
IOZ
DDRCB03
B20
IOZ
DDRCB04
C19
IOZ
DDRCB05
C18
IOZ
DDRCB06
B18
IOZ
DDRCB07
A18
IOZ
44
Device Overview
DDR EMIF data strobe
DDR EMIF check bits
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TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
www.ti.com
Table 2-15
Terminal Functions — Signals and Control by Function (Part 5 of 12)
Signal Name
Ball No. Type IPD/IPU Description
DDRD00
E28
IOZ
DDRD01
D29
IOZ
DDRD02
E27
IOZ
DDRD03
D28
IOZ
DDRD04
D27
IOZ
DDRD05
B28
IOZ
DDRD06
E26
IOZ
DDRD07
F25
IOZ
DDRD08
F24
IOZ
DDRD09
E24
IOZ
DDRD10
E25
IOZ
DDRD11
D25
IOZ
DDRD12
D26
IOZ
DDRD13
C26
IOZ
DDRD14
B26
IOZ
DDRD15
A26
IOZ
DDRD16
F23
IOZ
DDRD17
F22
IOZ
DDRD18
D24
IOZ
DDRD19
E23
IOZ
DDRD20
A23
IOZ
DDRD21
B23
IOZ
DDRD22
C24
IOZ
DDRD23
E22
IOZ
DDRD24
D21
IOZ
DDRD25
F20
IOZ
DDRD26
E21
IOZ
DDRD27
F21
IOZ
DDRD28
D22
IOZ
DDRD29
C21
IOZ
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DDR EMIF data bus
Device Overview
45
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
Table 2-15
www.ti.com
Terminal Functions — Signals and Control by Function (Part 6 of 12)
Signal Name
Ball No. Type IPD/IPU Description
DDRD30
B22
DDRD31
C22
IOZ
DDRD32
E10
IOZ
DDRD33
D10
IOZ
DDRD34
B10
IOZ
DDRD35
D9
IOZ
DDRD36
E9
IOZ
DDRD37
C9
IOZ
DDRD38
B8
IOZ
DDRD39
E8
IOZ
DDRD40
A7
IOZ
DDRD41
D7
IOZ
DDRD42
E7
IOZ
DDRD43
C7
IOZ
DDRD44
B7
IOZ
DDRD45
E6
IOZ
DDRD46
D6
IOZ
DDRD47
C6
IOZ
DDRD48
C5
IOZ
DDRD49
A5
IOZ
DDRD50
B4
IOZ
DDRD51
A4
IOZ
DDRD52
D4
IOZ
DDRD53
E4
IOZ
DDRD54
C4
IOZ
DDRD55
C3
IOZ
DDRD56
F4
IOZ
DDRD57
D2
IOZ
DDRD58
E2
IOZ
DDRD59
C2
IOZ
DDRD60
F2
IOZ
DDRD61
F3
IOZ
DDRD62
E1
IOZ
DDRD63
F1
IOZ
DDRCE0
C11
OZ
DDRCE1
C12
OZ
DDRBA0
A13
OZ
DDRBA1
B13
OZ
DDRBA2
C13
OZ
46
Device Overview
IOZ
DDR EMIF data bus
DDR EMIF chip enables
DDR EMIF bank address
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TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
www.ti.com
Table 2-15
Terminal Functions — Signals and Control by Function (Part 7 of 12)
Signal Name
Ball No. Type IPD/IPU Description
DDRA00
A14
OZ
DDRA01
B14
OZ
DDRA02
F14
OZ
DDRA03
F13
OZ
DDRA04
A15
OZ
DDRA05
C15
OZ
DDRA06
B15
OZ
DDRA07
D15
OZ
DDRA08
F15
OZ
DDRA09
E15
OZ
DDRA10
E16
OZ
DDRA11
D16
OZ
DDRA12
E17
OZ
DDRA13
C16
OZ
DDRA14
D17
OZ
DDRA15
C17
OZ
DDRCAS
D12
OZ
DDR EMIF column address strobe
DDRRAS
C10
OZ
DDR EMIF row address strobe
DDRWE
E12
OZ
DDR EMIF write enable
DDRCKE0
D11
OZ
DDRCKE1
E18
OZ
DDRCLKOUTP0
A12
OZ
DDRCLKOUTN0
B12
OZ
DDRCLKOUTP1
A16
OZ
DDRCLKOUTN1
B16
OZ
DDRODT0
D13
OZ
DDRODT1
E13
OZ
DDRRESET
E11
OZ
DDRSLRATE0
H27
I
Down
DDRSLRATE1
H26
I
Down
VREFSSTL
E14
P
DDR EMIF address bus
DDR EMIF clock enables
DDR EMIF output clocks to drive SDRAMs (one clock pair per SDRAM)
DDR EMIF on-die termination outputs used to set termination on the SDRAMs
DDR reset signal
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DDR slew rate control
Reference voltage input for SSTL15 buffers used by DDR EMIF (VDDS15 ÷ 2)
Device Overview
47
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
Table 2-15
Signal Name
www.ti.com
Terminal Functions — Signals and Control by Function (Part 8 of 12)
Ball No. Type IPD/IPU Description
EMU
EMU00
AE29
IOZ
Up
EMU01
AF29
IOZ
Up
EMU02
AE28
IOZ
Up
EMU03
AF28
IOZ
Up
EMU04
AE26
IOZ
Up
EMU05
AD25
IOZ
Up
EMU06
AF25
IOZ
Up
EMU07
AE25
IOZ
Up
EMU08
AF27
IOZ
Up
EMU09
AG29
IOZ
Up
EMU10
AF26
IOZ
Up
EMU11
AG28
IOZ
Up
EMU12
AG27
IOZ
Up
EMU13
AG25
IOZ
Up
EMU14
AH28
IOZ
Up
EMU15
AJ27
IOZ
Up
EMU16
AH27
IOZ
Up
EMU17
AJ26
IOZ
Up
EMU18
AH25
IOZ
Up
Emulation and trace ports
General Purpose Input/Output (GPIO)
GPIO00
AJ20
IOZ
Up
GPIO01
AG18
IOZ
Down
GPIO02
AD19
IOZ
Down
GPIO03
AE19
IOZ
Down
GPIO04
AF18
IOZ
Down
GPIO05
AE18
IOZ
Down
GPIO06
AG20
IOZ
Down
GPIO07
AH19
IOZ
Down
GPIO08
AJ19
IOZ
Down
GPIO09
AE21
IOZ
Down
GPIO10
AG19
IOZ
Down
GPIO11
AD20
IOZ
Down
GPIO12
AE20
IOZ
Down
GPIO13
AF21
IOZ
Down
GPIO14
AH20
IOZ
Down
GPIO15
AD21
IOZ
Down
48
Device Overview
General purpose input/output
These GPIO pins have secondary functions assigned to them as mentioned in the Boot
Configuration Pins section above.
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TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
www.ti.com
Table 2-15
Terminal Functions — Signals and Control by Function (Part 9 of 12)
Signal Name
Ball No. Type IPD/IPU Description
HyperLink
MCMRXN0
T2
I
MCMRXP0
R2
I
MCMRXN1
P1
I
MCMRXP1
R1
I
MCMRXN2
L1
I
MCMRXP2
M1
I
MCMRXN3
N2
I
MCMRXP3
M2
I
MCMTXN0
T5
O
MCMTXP0
R5
O
MCMTXN1
R4
O
MCMTXP1
P4
O
MCMTXN2
L4
O
MCMTXP2
M4
O
MCMTXN3
M5
O
MCMTXP3
N5
O
Serial HyperLink receive data (4 links)
Serial HyperLink transmit data (4 links)
MCMRXFLCLK
V3
O
Down
MCMRXFLDAT
W3
O
Down
MCMTXFLCLK
Y1
I
Down
MCMTXFLDAT
Y2
I
Down
MCMRXPMCLK
AA3
I
Down
MCMRXPMDAT
Y3
I
Down
MCMTXPMCLK
AA2
O
Down
MCMTXPMDAT
AA1
O
Down
MCMREFCLKOUTP
V2
O
MCMREFCLKOUTN
V1
O
Serial HyperLink sideband signals
HyperLink reference clock output for daisy chain connection
2
I C
2
SCL
AC17
IOZ
I C clock
SDA
AD17
IOZ
I2C data
TCK
AD29
I
Up
JTAG clock input
TDI
AD28
I
Up
JTAG data input
TDO
AC27
OZ
Up
JTAG data output
TMS
AC26
I
Up
JTAG test mode input
TRST
AD26
I
Down
JTAG reset
JTAG
MDIO
MDIO
AG16
IOZ
Up
MDIO data
MDCLK
AF16
O
Down
MDIO clock
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Device Overview
49
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
Table 2-15
Signal Name
www.ti.com
Terminal Functions — Signals and Control by Function (Part 10 of 12)
Ball No. Type IPD/IPU Description
PCIe
PCIERXN0
AJ14
I
PCIERXP0
AJ13
I
PCIERXN1
AH12
I
PCIERXP1
AH13
I
PCIETXN0
AG14
O
PCIETXP0
AG13
O
PCIETXN1
AF12
O
PCIETXP1
AF13
O
RIORXN0
AJ11
I
PCIexpress receive data (2 links)
PCIexpress transmit data (2 links)
Serial RapidIO
RIORXP0
AJ10
I
RIORXN1
AH10
I
RIORXP1
AH9
I
RIORXN2
AJ7
I
RIORXP2
AJ8
I
RIORXN3
AH6
I
RIORXP3
AH7
I
RIOTXN0
AG11
O
RIOTXP0
AG10
O
RIOTXN1
AF9
O
RIOTXP1
AF10
O
RIOTXN2
AG7
O
RIOTXP2
AG8
O
RIOTXN3
AF6
O
RIOTXP3
AF7
O
Serial RapidIO receive data (4 links)
Serial RapidIO transmit data (4 links)
SGMII
SGMII0RXN
AH3
I
SGMII0RXP
AH4
I
SGMII1RXN
AJ4
I
SGMII1RXP
AJ5
I
SGMII0TXN
AF3
O
SGMII0TXP
AF4
O
SGMII1TXN
AG4
O
SGMII1TXP
AG5
O
VCNTL0
AB4
OZ
VCNTL1
AB3
OZ
VCNTL2
AA4
OZ
VCNTL3
AB1
OZ
Ethernet MAC SGMII receive data (2 links)
Ethernet MAC SGMII transmit data (2 links)
SmartReflex
50
Device Overview
Voltage control outputs to variable core power supply
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TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
www.ti.com
Table 2-15
Signal Name
Terminal Functions — Signals and Control by Function (Part 11 of 12)
Ball No. Type IPD/IPU Description
SPI
SPISCS0
AH21
OZ
Up
SPI interface enable 0
SPISCS1
AJ22
OZ
Up
SPI interface enable 1
SPICLK
AG21
OZ
Down
SPI clock
SPIDIN
AH22
I
Down
SPI data in
SPIDOUT
AJ21
OZ
Down
SPI data out
Timer
TIMI0
AJ23
I
Down
TIMI1
AG23
I
Down
TIMO0
AH23
OZ
Down
TIMO1
AF23
OZ
Down
UARTRXD
AF24
I
Down
UART serial data in
UARTTXD
AJ24
OZ
Down
UART serial data out
UARTCTS
AH24
I
Down
UART clear to send
UARTRTS
AG24
OZ
Down
UART request to send
Timer inputs
Timer outputs
UART
Reserved
RSV0A
K24
Reserved - leave unconnected
RSV0B
K23
Reserved - leave unconnected
RSV01
AJ25
IOZ
Down
Reserved - pullup to DVDD18
RSV03
AC23
OZ
Down
Reserved - leave unconnected
RSV04
Y27
O
Reserved - leave unconnected
RSV05
W27
O
Reserved - leave unconnected
RSV06
J28
O
Reserved - leave unconnected
RSV07
H28
O
Reserved - leave unconnected
RSV08
J24
A
Reserved - connect to GND
RSV09
J25
A
Reserved - leave unconnected
RSV10
H23
A
Reserved - leave unconnected
RSV11
J23
A
Reserved - leave unconnected
RSV12
AD22
A
Reserved - leave unconnected
RSV13
AC22
A
Reserved - leave unconnected
RSV14
V4
A
Reserved - leave unconnected
RSV15
AE8
A
Reserved - leave unconnected
RSV16
AE14
A
Reserved - leave unconnected
RSV17
AE5
A
Reserved - leave unconnected
RSV18
AA24
A
Reserved - leave unconnected
RSV19
G27
A
Reserved - leave unconnected
RSV20
AB26
OZ
Down
Reserved - leave unconnected
RSV21
G26
OZ
Down
Reserved - leave unconnected
RSV22
AE16
OZ
Down
Reserved - leave unconnected
RSV23
AD16
A
RSV24
AG17
O
Reserved - leave unconnected
RSV25
AF17
O
Reserved - leave unconnected
RSV26
U25
A
Reserved - leave unconnected
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Reserved - leave unconnected
Device Overview
51
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
Table 2-15
www.ti.com
Terminal Functions — Signals and Control by Function (Part 12 of 12)
Signal Name
Ball No. Type IPD/IPU Description
RSV27
L25
RSV28
Y4
IOZ
Reserved - leave unconnected
RSV29
W4
IOZ
Reserved - leave unconnected
A
Reserved - leave unconnected
End of Table 2-15
Table 2-16
Terminal Functions — Power and Ground
Supply
Ball No.
Volts
Description
AVDDA1
W24
1.8
PLL supply: Main PLL
AVDDA2
J26
1.8
PLL supply: DDR3 PLL
AVDDA3
AB15
1.8
PLL supply: PASS PLL
CVDD
0.9
H11, H13, H15, H17, H19, H21, J12, J18, K11, K19, L12, L18, M11, M13, M15 M17,
to
M19, N8, N10, N12, N14, N16, N18, N20, N22, P9, P11, P13, P15, P17, P19, P21, R8,
R10, R12, R14, R16, R18, R20, R22, T9, T11, T13, T15, T17, T19, T21, U8, U10, U12, U14, 1.1
U16, U18, U20, U22, V9, V11, V13, V15, V17, V19, V21, V23, W8, W10, W18, W20, W22,
Y9, Y19, Y21, Y23, AA8, AA10, AA12, AA14, AA16, AA18, AA20, AA22, AB23
SmartReflex core supply voltage
CVDD1
G6, H1, H3, H5, H7, H9, J2, J4, J6, J8, J10, J14, J16, J20, J22, K7, K9, K13, K15, K17, K21, 1.0
L8, L10, L14, L16, L20, L22, M9, M21, W12, W14, W16, Y11, Y13, Y15, Y17, AD1, AD3,
AE2, AF1, AG2, AH1, AJ2
Fixed core supply voltage
DVDD15
A2, A11, A17, A28, B1, B29, C14, C25, D5, D8, D20, D23, E3, F5, F7, F9, F11, F17, F19,
F27, G2, G4, G8, G10, G12, G14, G16 G18, G20, G22, G24
1.5
DDR IO supply
DVDD18
G28, H25, V5, Y5, Y25, AB5, AB17, AB19, AB21, AC2, AC4, AE24, AE27, AF19, AF22,
AH26, AH29, AJ28
1.8
IO supply
VDDR1
K6
1.5
HyperLink SerDes regulator supply
VDDR2
AE15
1.5
PCIe SerDes regulator supply
VDDR3
AE6
1.5
SGMII SerDes regulator supply
VDDR4
AE11
1.5
SRIO SerDes regulator supply
VDDR5
R25
VDDR6
N25
1.5
AIF SerDes regulator supply
VDDT1
M7, N6, P7, R6, T7, V7, W6, Y7
1.0
HyperLink SerDes termination supply
VDDT2
AC6, AC8, AC10, AC12, AC14, AD5, AD7, AD9, AD11, AD13, AE4, AE10, AE12
1.0
SGMII/SRIO/PCIe SerDes termination supply
VDDT3
K25, L24, M23, M25, N24, P23, P25, R24, T23, T25, U24, V25
VREFSSTL E14
VSS
1.0
AIF SerDes termination supply
0.75
DDR3 reference voltage
A1, A29, B11, B17, B25, C8, C23, D3, D14, D18, E5, E20, F6, F8, F10, F12, F16, F18, F26, Gnd
F28, F29, G1, G3, G5, G7, G9, G11, G13, G15, G17, G19, G21, G23, G25, H2, H4, H6, H8,
H10, H12, H14, H16, H18, H20, H22, J1, J3, J5, J7, J9, J11, J13, J15, J17, J19, J21, J27,
J29, K1, K2, K3, K4, K5, K8, K10, K12, K14, K16, K18, K20, K22, K26, K28, L2, L3,L5, L6,
L7, L9, L11, L13, L15, L17, L19, L21, L23, M3, M6, M8, M10, M12, M14, M16, M18, M20,
M22, M24, M27, M29, N1, N3, N4, N7, N9, N11, N13, N15, N17, N19, N21, N23, N26,
N28, P2, P3, P5, P6, P8, P10, P12, P14, P16, P18, P20, P22, P24, R3, R7, R9, R11, R13,
R15, R17, R19, R21, R23, R27, R29, T1, T3, T4, T6, T8, T10, T12, T14, T16, T18, T20, T22,
T24, T26, T28, U1, U2, U3, U4, U5, U6, U7, U9, U11, U13, U15, U17, U19, U21, U23, V6,
V8, V10, V12, V14, V16, V18, V20, V22, V24, V27, V29, W5, W7, W9, W11, W13, W15,
W17, W19, W21, W23, W25, W26, W28, W29, Y6, Y8, Y10, Y12, Y14, Y16, Y18, Y20,
Y22, Y24, Y26, AA5, AA6, AA7, AA9, AA11, AA13, AA15, AA17, AA19, AA21, AA23,
AA25, AB2, AB6, AB7, AB8, AB9, AB10, AB11, AB12, AB13, AB14, AB16, AB18, AB20,
AB22, AB24, AC1, AC3, AC5, AC7, AC9, AC11, AC13, AC15, AD2, AD4, AD6, AD8,
AD10, AD12, AD14, AD24, AD27, AE1, AE3, AE7, AE9, AE13, AF2, AF5, AF8, AF11,
AF14, AF15, AF20, AG1, AG3, AG6, AG9, AG12, AG15, AG22, AG26, AH2, AH5, AH8,
AH11, AH14, AJ1, AJ3, AJ6, AJ9, AJ12, AJ15, AJ29
Ground
End of Table 2-16
52
Device Overview
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TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
Table 2-17
Terminal Functions
— By Signal Name
(Part 1 of 11)
www.ti.com
Table 2-17
Terminal Functions
— By Signal Name
(Part 2 of 11)
Table 2-17
Terminal Functions
— By Signal Name
(Part 3 of 11)
Ball Number
Signal Name
Ball Number
Signal Name
Ball Number
AIFRXN0
L28
BOOTMODE12 †
AF21
DDRA15
C17
AIFRXN1
K29
CORECLKSEL
AB25
DDRBA0
A13
AIFRXN2
R28
CORESEL0
AH15
DDRBA1
B13
AIFRXN3
P29
CORESEL1
AC16
DDRBA2
C13
AIFRXN4
T29
CORESEL2
AD15
DDRCAS
D12
AIFRXN5
U28
CVDD
H11, H13, H15, H17,
H19, H21, J12, J18,
K11, K19, L12, L18,
M11, M13, M15
M17, M19, N8, N10,
N12, N14, N16, N18,
N20, N22, P9, P11,
P13, P15, P17, P19
DDRCB00
E19
DDRCB01
C20
DDRCB02
D19
DDRCB03
B20
DDRCB04
C19
DDRCB05
C18
Signal Name
AIFRXP0
M28
AIFRXP1
L29
AIFRXP2
P28
AIFRXP3
N29
AIFRXP4
U29
AIFRXP5
V28
AIFTXN0
L26
AIFTXN1
L27
AIFTXN2
R26
AIFTXN3
P27
AIFTXN4
U27
AIFTXN5
U26
AIFTXP0
M26
AIFTXP1
K27
AIFTXP2
P26
AIFTXP3
N27
AIFTXP4
T27
AIFTXP5
V26
ALTCORECLKN
AB28
ALTCORECLKP
AB29
CVDD
CVDD
CVDD1
P21, R8, R10, R12,
R14, R16, R18, R20,
R22, T9, T11, T13,
T15, T17, T19, T21,
U8, U10, U12, U14,
U16, U18, U20, U22,
V9, V11, V13, V15,
V17, V19, V21, V23
DDRCB06
B18
DDRCB07
A18
DDRCE0
C11
DDRCE1
C12
DDRCKE0
D11
W8, W10, W18, W20,
W22, Y9, Y19, Y21,
Y23, AA8, AA10,
AA12, AA14, AA16,
AA18, AA20, AA22,
AB23
DDRCKE1
E18
DDRCLKN
H29
DDRCLKOUTN0
B12
DDRCLKOUTN1
B16
G6, H1, H3, H5, H7,
H9, J2, J4, J6, J8, J10,
J14, J16, J20, J22, K7,
K9, K13, K15, K17,
K21, L8, L10, L14,
L16, L20, L22, M9,
M21, W12, W14,
W16, Y11, Y13, Y15,
Y17, AD1, AD3, AE2,
AF1, AG2, AH1, AJ2
DDRCLKOUTP0
A12
DDRCLKOUTP1
A16
DDRCLKP
G29
DDRD00
E28
DDRD01
D29
DDRD02
E27
DDRD03
D28
AVDDA1
W24
AVDDA2
J26
DDRA00
A14
DDRD04
D27
AVDDA3
AB15
DDRA01
B14
DDRD05
B28
BOOTCOMPLETE
AC21
DDRA02
F14
DDRD06
E26
BOOTMODE00 †
AG18
DDRA03
F13
DDRD07
F25
BOOTMODE01 †
AD19
DDRA04
A15
DDRD08
F24
BOOTMODE02 †
AE19
DDRA05
C15
DDRD09
E24
BOOTMODE03 †
AF18
DDRA06
B15
DDRD10
E25
BOOTMODE04 †
AE18
DDRA07
D15
DDRD11
D25
BOOTMODE05 †
AG20
DDRA08
F15
DDRD12
D26
BOOTMODE06 †
AH19
DDRA09
E15
DDRD13
C26
BOOTMODE07 †
AJ19
DDRA10
E16
DDRD14
B26
BOOTMODE08 †
AE21
DDRA11
D16
DDRD15
A26
BOOTMODE09 †
AG19
DDRA12
E17
DDRD16
F23
BOOTMODE10 †
AD20
DDRA13
C16
DDRD17
F22
BOOTMODE11 †
AE20
DDRA14
D17
DDRD18
D24
53
Device Overview
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TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
www.ti.com
Table 2-17
Signal Name
Terminal Functions
— By Signal Name
(Part 4 of 11)
Table 2-17
Terminal Functions
— By Signal Name
(Part 5 of 11)
Ball Number
Signal Name
DDRD19
E23
DDRD20
A23
DDRD21
B23
DDRD63
F1
DDRD22
C24
DDRDQM0
E29
DDRD23
E22
DDRDQM1
DDRD24
D21
DDRDQM2
DDRD25
F20
DDRDQM3
DDRD26
E21
DDRD27
Table 2-17
Terminal Functions
— By Signal Name
(Part 6 of 11)
Ball Number
Signal Name
Ball Number
DDRD61
F3
DVDD18
DDRD62
E1
G28, H25, V5, Y5,
Y25, AB5, AB17,
AB19, AB21, AC2,
AC4, AE24, AE27,
AF19, AF22, AH26,
AH29, AJ28
C27
EMU00
AE29
A25
EMU01
AF29
A22
EMU02
AE28
DDRDQM4
A10
EMU03
AF28
F21
DDRDQM5
A8
EMU04
AE26
DDRD28
D22
DDRDQM6
B5
EMU05
AD25
DDRD29
C21
DDRDQM7
B2
EMU06
AF25
DDRD30
B22
DDRDQM8
A20
EMU07
AE25
DDRD31
C22
DDRDQS0N
C29
EMU08
AF27
DDRD32
E10
DDRDQS0P
C28
EMU09
AG29
DDRD33
D10
DDRDQS1N
B27
EMU10
AF26
DDRD34
B10
DDRDQS1P
A27
EMU11
AG28
DDRD35
D9
DDRDQS2N
B24
EMU12
AG27
DDRD36
E9
DDRDQS2P
A24
EMU13
AG25
DDRD37
C9
DDRDQS3N
B21
EMU14
AH28
DDRD38
B8
DDRDQS3P
A21
EMU15
AJ27
DDRD39
E8
DDRDQS4N
B9
EMU16
AH27
DDRD40
A7
DDRDQS4P
A9
EMU17
AJ26
DDRD41
D7
DDRDQS5N
A6
EMU18
AH25
DDRD42
E7
DDRDQS5P
B6
EXTFRAMEEVENT
AE17
DDRD43
C7
DDRDQS6N
A3
GPIO00
AJ20
DDRD44
B7
DDRDQS6P
B3
GPIO01
AG18
DDRD45
E6
DDRDQS7N
C1
GPIO02
AD19
DDRD46
D6
DDRDQS7P
D1
GPIO03
AE19
DDRD47
C6
DDRDQS8N
B19
GPIO04
AF18
DDRD48
C5
DDRDQS8P
A19
GPIO05
AE18
DDRD49
A5
DDRODT0
D13
GPIO06
AG20
DDRD50
B4
DDRODT1
E13
GPIO07
AH19
DDRD51
A4
DDRRAS
C10
GPIO08
AJ19
DDRD52
D4
DDRRESET
E11
GPIO09
AE21
DDRD53
E4
DDRSLRATE0
H27
GPIO10
AG19
DDRD54
C4
DDRSLRATE1
H26
GPIO11
AD20
DDRD55
C3
DDRWE
E12
GPIO12
AE20
DDRD56
F4
DVDD15
GPIO13
AF21
DDRD57
D2
DDRD58
E2
DDRD59
C2
DDRD60
F2
A2, A11, A17, A28,
B1, B29, C14, C25,
D5, D8, D20, D23,
E3, F5, F7, F9, F11,
F17, F19, F27, G2,
G4, G8, G10, G12,
G14, G16 G18, G20,
G22, G24
Copyright 2012 Texas Instruments Incorporated
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GPIO14
AH20
GPIO15
AD21
HOUT
AC18
LENDIAN
AJ20 †
Device Overview
54
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
Table 2-17
Terminal Functions
— By Signal Name
(Part 7 of 11)
www.ti.com
Table 2-17
Signal Name
Ball Number
Signal Name
LRESETNMIEN
AC20
LRESET
AE22
MCMCLKN
MCMCLKP
Terminal Functions
— By Signal Name
(Part 8 of 11)
Table 2-17
Terminal Functions
— By Signal Name
(Part 9 of 11)
Ball Number
Signal Name
PCIESSMODE0 †
AH20
RSV0A
K24
PCIESSMODE1 †
AD21
RSV0B
K23
W2
PCIESSEN †
AJ23
RSV10
H23
W1
PCIETXN0
AG14
RSV11
J23
MCMREFCLKOUTN
V1
PCIETXN1
AF12
RSV12
AD22
MCMREFCLKOUTP
V2
PCIETXP0
AG13
RSV13
AC22
MCMRXFLCLK
V3
PCIETXP1
AF13
RSV14
V4
MCMRXFLDAT
W3
PHYSYNC
AB27
RSV15
AE8
MCMRXN0
T2
POR
AC19
RSV16
AE14
MCMRXN1
P1
PTV15
H24
RSV17
AE5
MCMRXN2
L1
RADSYNC
AA27
RSV18
AA24
MCMRXN3
N2
RESETFULL
AE23
RSV19
G27
MCMRXP0
R2
RESETSTAT
AD18
RSV20
AB26
MCMRXP1
R1
RESET
AC24
RSV21
G26
MCMRXP2
M1
RIORXN0
AJ11
RSV22
AE16
MCMRXP3
M2
RIORXN1
AH10
RSV23
AD16
MCMRXPMCLK
AA3
RIORXN2
AJ7
RSV24
AG17
MCMRXPMDAT
Y3
RIORXN3
AH6
RSV25
AF17
MCMTXFLCLK
Y1
RIORXP0
AJ10
RSV26
U25
MCMTXFLDAT
Y2
RIORXP1
AH9
RSV27
L25
MCMTXN0
T5
RIORXP2
AJ8
RSV28
Y4
MCMTXN1
R4
RIORXP3
AH7
RSV29
W4
MCMTXN2
L4
RIOTXN0
AG11
SCL
AC17
MCMTXN3
M5
RIOTXN1
AF9
SDA
AD17
MCMTXP0
R5
RIOTXN2
AG7
SGMII0RXN
AH3
MCMTXP1
P4
RIOTXN3
AF6
SGMII0RXP
AH4
MCMTXP2
M4
RIOTXP0
AG10
SGMII0TXN
AF3
MCMTXP3
N5
RIOTXP1
AF10
SGMII0TXP
AF4
MCMTXPMCLK
AA2
RIOTXP2
AG8
SGMII1RXN
AJ4
MCMTXPMDAT
AA1
RIOTXP3
AF7
SGMII1RXP
AJ5
MDCLK
AF16
RP1CLKN
AA28
SGMII1TXN
AG4
MDIO
AG16
RP1CLKP
Y28
SGMII1TXP
AG5
NMI
AC25
RP1FBN
AA29
SPICLK
AG21
PACLKSEL
AD23
RP1FBP
Y29
SPIDIN
AH22
PASSCLKN
AH18
RSV01
AJ25
SPIDOUT
AJ21
PASSCLKP
AJ18
RSV03
AC23
SPISCS0
AH21
PCIECLKN
AJ17
RSV04
Y27
SPISCS1
AJ22
PCIECLKP
AH17
RSV05
W27
SRIOSGMIICLKN
AH16
PCIERXN0
AJ14
RSV06
J28
SRIOSGMIICLKP
AJ16
PCIERXN1
AH12
RSV07
H28
SYSCLKN
AC28
PCIERXP0
AJ13
RSV08
J24
SYSCLKOUT
AA26
PCIERXP1
AH13
RSV09
J25
SYSCLKP
AC29
55
Device Overview
Ball Number
Copyright 2012 Texas Instruments Incorporated
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TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
www.ti.com
Table 2-17
Terminal Functions
— By Signal Name
(Part 10 of 11)
Table 2-17
Terminal Functions
— By Signal Name
(Part 11 of 11)
Signal Name
Ball Number
Signal Name
Ball Number
TCK
AD29
VSS
TDI
AD28
K22, K26, K28, L2,
L3,L5, L6, L7, L9, L11,
L13, L15, L17, L19,
L21, L23, M3, M6,
M8, M10, M12, M14,
M16, M18, M20,
M22, M24, M27,
M29, N1, N3, N4, N7
VSS
N9, N11, N13, N15,
N17, N19, N21, N23,
N26, N28, P2, P3, P5,
P6, P8, P10, P12,
P14, P16, P18, P20,
P22, P24, R3, R7, R9,
R11, R13, R15, R17,
R19, R21, R23, R27
VSS
R29, T1, T3, T4, T6,
T8, T10, T12, T14,
T16, T18, T20, T22,
T24, T26, T28, U1,
U2, U3, U4, U5, U6,
U7, U9, U11, U13,
U15, U17, U19, U21,
U23, V6, V8, V10
VSS
V12, V14, V16, V18,
V20, V22, V24, V27,
V29, W5, W7, W9,
W11, W13, W15,
W17, W19, W21,
W23, W25, W26,
W28, W29, Y6, Y8,
Y10, Y12, Y14, Y16
VSS
Y18, Y20, Y22, Y24,
Y26, AA5, AA6, AA7,
AA9, AA11, AA13,
AA15, AA17, AA19,
AA21, AA23, AA25,
AB2, AB6, AB7, AB8,
AB9, AB10, AB11,
AB12, AB13, AB14
VSS
AB16, AB18, AB20,
AB22, AB24, AC1,
AC3, AC5, AC7, AC9,
AC11, AC13, AC15,
AD2, AD4, AD6,
AD8, AD10, AD12,
AD14, AD24, AD27,
AE1, AE3, AE7, AE9
VSS
AE13, AF2, AF5, AF8,
AF11, AF14, AF15,
AF20, AG1, AG3,
AG6, AG9, AG12,
AG15, AG22, AG26,
AH2, AH5, AH8,
AH11, AH14, AJ1,
AJ3, AJ6, AJ9, AJ12
VSS
AJ15, AJ29
TDO
AC27
TIMI0
AJ23
TIMI1
AG23
TIMO0
AH23
TIMO1
AF23
TMS
AC26
TRST
AD26
UARTCTS
AH24
UARTRTS
AG24
UARTRXD
AF24
UARTTXD
AJ24
VCNTL0
AB4
VCNTL1
AB3
VCNTL2
AA4
VCNTL3
AB1
VDDR1
K6
VDDR2
AE15
VDDR3
AE6
VDDR4
AE11
VDDR5
R25
VDDR6
N25
VDDT1
M7, N6, P7, R6, T7,
V7, W6, Y7
VDDT2
AC6, AC8, AC10,
AC12, AC14, AD5,
AD7, AD9, AD11,
AD13, AE4, AE10,
AE12
VDDT3
K25, L24, M23, M25,
N24, P23, P25, R24,
T23, T25, U24, V25
VREFSSTL
E14
VSS
A1, A29, B11, B17,
B25, C8, C23, D3,
D14, D18, E5, E20,
F6, F8, F10, F12, F16,
F18, F26, F28, F29,
G1, G3, G5, G7, G9,
G11, G13, G15, G17,
G19, G21, G23, G25
VSS
H2, H4, H6, H8, H10,
H12, H14, H16, H18,
H20, H22, J1, J3, J5,
J7, J9, J11, J13, J15,
J17, J19, J21, J27,
J29, K1, K2, K3, K4,
K5, K8, K10, K12,
K14, K16, K18, K20
Copyright 2012 Texas Instruments Incorporated
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End of Table 2-17
Device Overview
56
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
Table 2-18
Terminal Functions
— By Ball Number
(Part 1 of 21)
www.ti.com
Table 2-18
Terminal Functions
— By Ball Number
(Part 2 of 21)
Table 2-18
Terminal Functions
— By Ball Number
(Part 3 of 21)
Signal Name
Ball Number
Signal Name
Ball Number
Signal Name
A1
VSS
B14
DDRA01
C27
DDRDQM1
A2
DVDD15
B15
DDRA06
C28
DDRDQS0P
A3
DDRDQS6N
B16
DDRCLKOUTN1
C29
DDRDQS0N
A4
DDRD51
B17
VSS
D1
DDRDQS7P
A5
DDRD49
B18
DDRCB06
D2
DDRD57
A6
DDRDQS5N
B19
DDRDQS8N
D3
VSS
A7
DDRD40
B20
DDRCB03
D4
DDRD52
A8
DDRDQM5
B21
DDRDQS3N
D5
DVDD15
A9
DDRDQS4P
B22
DDRD30
D6
DDRD46
A10
DDRDQM4
B23
DDRD21
D7
DDRD41
A11
DVDD15
B24
DDRDQS2N
D8
DVDD15
A12
DDRCLKOUTP0
B25
VSS
D9
DDRD35
A13
DDRBA0
B26
DDRD14
D10
DDRD33
A14
DDRA00
B27
DDRDQS1N
D11
DDRCKE0
A15
DDRA04
B28
DDRD05
D12
DDRCAS
A16
DDRCLKOUTP1
B29
DVDD15
D13
DDRODT0
A17
DVDD15
C1
DDRDQS7N
D14
VSS
A18
DDRCB07
C2
DDRD59
D15
DDRA07
A19
DDRDQS8P
C3
DDRD55
D16
DDRA11
A20
DDRDQM8
C4
DDRD54
D17
DDRA14
A21
DDRDQS3P
C5
DDRD48
D18
VSS
A22
DDRDQM3
C6
DDRD47
D19
DDRCB02
A23
DDRD20
C7
DDRD43
D20
DVDD15
A24
DDRDQS2P
C8
VSS
D21
DDRD24
A25
DDRDQM2
C9
DDRD37
D22
DDRD28
A26
DDRD15
C10
DDRRAS
D23
DVDD15
A27
DDRDQS1P
C11
DDRCE0
D24
DDRD18
A28
DVDD15
C12
DDRCE1
D25
DDRD11
A29
VSS
C13
DDRBA2
D26
DDRD12
B1
DVDD15
C14
DVDD15
D27
DDRD04
B2
DDRDQM7
C15
DDRA05
D28
DDRD03
B3
DDRDQS6P
C16
DDRA13
D29
DDRD01
B4
DDRD50
C17
DDRA15
E1
DDRD62
B5
DDRDQM6
C18
DDRCB05
E2
DDRD58
B6
DDRDQS5P
C19
DDRCB04
E3
DVDD15
B7
DDRD44
C20
DDRCB01
E4
DDRD53
B8
DDRD38
C21
DDRD29
E5
VSS
B9
DDRDQS4N
C22
DDRD31
E6
DDRD45
B10
DDRD34
C23
VSS
E7
DDRD42
B11
VSS
C24
DDRD22
E8
DDRD39
B12
DDRCLKOUTN0
C25
DVDD15
E9
DDRD36
B13
DDRBA1
C26
DDRD13
E10
DDRD32
Ball Number
57
Device Overview
Copyright 2012 Texas Instruments Incorporated
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TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
www.ti.com
Table 2-18
Ball Number
Terminal Functions
— By Ball Number
(Part 4 of 21)
Table 2-18
Terminal Functions
— By Ball Number
(Part 5 of 21)
Table 2-18
Terminal Functions
— By Ball Number
(Part 6 of 21)
Signal Name
Ball Number
Signal Name
Ball Number
E11
DDRRESET
F24
DDRD08
H8
VSS
E12
DDRWE
F25
DDRD07
H9
CVDD1
E13
DDRODT1
F26
VSS
H10
VSS
E14
VREFSSTL
F27
DVDD15
H11
CVDD
E15
DDRA09
F28
VSS
H12
VSS
E16
DDRA10
F29
VSS
H13
CVDD
E17
DDRA12
G1
VSS
H14
VSS
E18
DDRCKE1
G2
DVDD15
H15
CVDD
E19
DDRCB00
G3
VSS
H16
VSS
E20
VSS
G4
DVDD15
H17
CVDD
E21
DDRD26
G5
VSS
H18
VSS
E22
DDRD23
G6
CVDD1
H19
CVDD
E23
DDRD19
G7
VSS
H20
VSS
E24
DDRD09
G8
DVDD15
H21
CVDD
E25
DDRD10
G9
VSS
H22
VSS
E26
DDRD06
G10
DVDD15
H23
RSV10
E27
DDRD02
G11
VSS
H24
PTV15
E28
DDRD00
G12
DVDD15
H25
DVDD18
E29
DDRDQM0
G13
VSS
H26
DDRSLRATE1
F1
DDRD63
G14
DVDD15
H27
DDRSLRATE0
F2
DDRD60
G15
VSS
H28
RSV07
F3
DDRD61
G16
DVDD15
H29
DDRCLKN
F4
DDRD56
G17
VSS
J1
VSS
F5
DVDD15
G18
DVDD15
J2
CVDD1
F6
VSS
G19
VSS
J3
VSS
F7
DVDD15
G20
DVDD15
J4
CVDD1
F8
VSS
G21
VSS
J5
VSS
F9
DVDD15
G22
DVDD15
J6
CVDD1
F10
VSS
G23
VSS
J7
VSS
F11
DVDD15
G24
DVDD15
J8
CVDD1
F12
VSS
G25
VSS
J9
VSS
F13
DDRA03
G26
RSV21
J10
CVDD1
F14
DDRA02
G27
RSV19
J11
VSS
F15
DDRA08
G28
DVDD18
J12
CVDD
F16
VSS
G29
DDRCLKP
J13
VSS
F17
DVDD15
H1
CVDD1
J14
CVDD1
F18
VSS
H2
VSS
J15
VSS
F19
DVDD15
H3
CVDD1
J16
CVDD1
F20
DDRD25
H4
VSS
J17
VSS
F21
DDRD27
H5
CVDD1
J18
CVDD
F22
DDRD17
H6
VSS
J19
VSS
F23
DDRD16
H7
CVDD1
J20
CVDD1
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Device Overview
58
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
Table 2-18
Terminal Functions
— By Ball Number
(Part 7 of 21)
www.ti.com
Table 2-18
Terminal Functions
— By Ball Number
(Part 8 of 21)
Table 2-18
Terminal Functions
— By Ball Number
(Part 9 of 21)
Ball Number
Signal Name
Ball Number
Signal Name
Ball Number
J21
VSS
L5
VSS
M18
VSS
J22
CVDD1
L6
VSS
M19
CVDD
J23
RSV11
L7
VSS
M20
VSS
J24
RSV08
L8
CVDD1
M21
CVDD1
J25
RSV09
L9
VSS
M22
VSS
J26
AVDDA2
L10
CVDD1
M23
VDDT3
J27
VSS
L11
VSS
M24
VSS
J28
RSV06
L12
CVDD
M25
VDDT3
J29
VSS
L13
VSS
M26
AIFTXP0
K1
VSS
L14
CVDD1
M27
VSS
K2
VSS
L15
VSS
M28
AIFRXP0
K3
VSS
L16
CVDD1
M29
VSS
K4
VSS
L17
VSS
N1
VSS
K5
VSS
L18
CVDD
N2
MCMRXN3
K6
VDDR1
L19
VSS
N3
VSS
K7
CVDD1
L20
CVDD1
N4
VSS
K8
VSS
L21
VSS
N5
MCMTXP3
K9
CVDD1
L22
CVDD1
N6
VDDT1
K10
VSS
L23
VSS
N7
VSS
K11
CVDD
L24
VDDT3
N8
CVDD
K12
VSS
L25
RSV27
N9
VSS
K13
CVDD1
L26
AIFTXN0
N10
CVDD
K14
VSS
L27
AIFTXN1
N11
VSS
K15
CVDD1
L28
AIFRXN0
N12
CVDD
K16
VSS
L29
AIFRXP1
N13
VSS
K17
CVDD1
M1
MCMRXP2
N14
CVDD
K18
VSS
M2
MCMRXP3
N15
VSS
K19
CVDD
M3
VSS
N16
CVDD
K20
VSS
M4
MCMTXP2
N17
VSS
K21
CVDD1
M5
MCMTXN3
N18
CVDD
K22
VSS
M6
VSS
N19
VSS
K23
RSV0B
M7
VDDT1
N20
CVDD
K24
RSV0A
M8
VSS
N21
VSS
K25
VDDT3
M9
CVDD1
N22
CVDD
K26
VSS
M10
VSS
N23
VSS
K27
AIFTXP1
M11
CVDD
N24
VDDT3
K28
VSS
M12
VSS
N25
VDDR6
K29
AIFRXN1
M13
CVDD
N26
VSS
L1
MCMRXN2
M14
VSS
N27
AIFTXP3
L2
VSS
M15
CVDD
N28
VSS
L3
VSS
M16
VSS
N29
AIFRXP3
L4
MCMTXN2
M17
CVDD
P1
MCMRXN1
59
Device Overview
Signal Name
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TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
www.ti.com
Table 2-18
Terminal Functions
— By Ball Number
(Part 10 of 21)
Table 2-18
Terminal Functions
— By Ball Number
(Part 11 of 21)
Table 2-18
Terminal Functions
— By Ball Number
(Part 12 of 21)
Ball Number
Signal Name
Ball Number
Signal Name
Ball Number
Signal Name
P2
VSS
R15
VSS
T28
VSS
P3
VSS
R16
CVDD
T29
AIFRXN4
P4
MCMTXP1
R17
VSS
U1
VSS
P5
VSS
R18
CVDD
U2
VSS
P6
VSS
R19
VSS
U3
VSS
P7
VDDT1
R20
CVDD
U4
VSS
P8
VSS
R21
VSS
U5
VSS
P9
CVDD
R22
CVDD
U6
VSS
P10
VSS
R23
VSS
U7
VSS
P11
CVDD
R24
VDDT3
U8
CVDD
P12
VSS
R25
VDDR5
U9
VSS
P13
CVDD
R26
AIFTXN2
U10
CVDD
P14
VSS
R27
VSS
U11
VSS
P15
CVDD
R28
AIFRXN2
U12
CVDD
P16
VSS
R29
VSS
U13
VSS
P17
CVDD
T1
VSS
U14
CVDD
P18
VSS
T2
MCMRXN0
U15
VSS
P19
CVDD
T3
VSS
U16
CVDD
P20
VSS
T4
VSS
U17
VSS
P21
CVDD
T5
MCMTXN0
U18
CVDD
P22
VSS
T6
VSS
U19
VSS
P23
VDDT3
T7
VDDT1
U20
CVDD
P24
VSS
T8
VSS
U21
VSS
P25
VDDT3
T9
CVDD
U22
CVDD
P26
AIFTXP2
T10
VSS
U23
VSS
P27
AIFTXN3
T11
CVDD
U24
VDDT3
P28
AIFRXP2
T12
VSS
U25
RSV26
P29
AIFRXN3
T13
CVDD
U26
AIFTXN5
R1
MCMRXP1
T14
VSS
U27
AIFTXN4
R2
MCMRXP0
T15
CVDD
U28
AIFRXN5
R3
VSS
T16
VSS
U29
AIFRXP4
R4
MCMTXN1
T17
CVDD
V1
MCMREFCLKOUTN
R5
MCMTXP0
T18
VSS
V2
MCMREFCLKOUTP
R6
VDDT1
T19
CVDD
V3
MCMRXFLCLK
R7
VSS
T20
VSS
V4
RSV14
R8
CVDD
T21
CVDD
V5
DVDD18
R9
VSS
T22
VSS
V6
VSS
R10
CVDD
T23
VDDT3
V7
VDDT1
R11
VSS
T24
VSS
V8
VSS
R12
CVDD
T25
VDDT3
V9
CVDD
R13
VSS
T26
VSS
V10
VSS
R14
CVDD
T27
AIFTXP4
V11
CVDD
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60
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
Table 2-18
Terminal Functions
— By Ball Number
(Part 13 of 21)
www.ti.com
Table 2-18
Terminal Functions
— By Ball Number
(Part 14 of 21)
Table 2-18
Terminal Functions
— By Ball Number
(Part 15 of 21)
Ball Number
Signal Name
Ball Number
Signal Name
Ball Number
Signal Name
V12
VSS
W25
VSS
AA9
VSS
V13
CVDD
W26
VSS
AA10
CVDD
V14
VSS
W27
RSV05
AA11
VSS
V15
CVDD
W28
VSS
AA12
CVDD
V16
VSS
W29
VSS
AA13
VSS
V17
CVDD
Y1
MCMTXFLCLK
AA14
CVDD
V18
VSS
Y2
MCMTXFLDAT
AA15
VSS
V19
CVDD
Y3
MCMRXPMDAT
AA16
CVDD
V20
VSS
Y4
RSV28
AA17
VSS
V21
CVDD
Y5
DVDD18
AA18
CVDD
V22
VSS
Y6
VSS
AA19
VSS
V23
CVDD
Y7
VDDT1
AA20
CVDD
V24
VSS
Y8
VSS
AA21
VSS
V25
VDDT3
Y9
CVDD
AA22
CVDD
V26
AIFTXP5
Y10
VSS
AA23
VSS
V27
VSS
Y11
CVDD1
AA24
RSV18
V28
AIFRXP5
Y12
VSS
AA25
VSS
V29
VSS
Y13
CVDD1
AA26
SYSCLKOUT
W1
MCMCLKP
Y14
VSS
AA27
RADSYNC
W2
MCMCLKN
Y15
CVDD1
AA28
RP1CLKN
W3
MCMRXFLDAT
Y16
VSS
AA29
RP1FBN
W4
RSV29
Y17
CVDD1
AB1
VCNTL3
W5
VSS
Y18
VSS
AB2
VSS
W6
VDDT1
Y19
CVDD
AB3
VCNTL1
W7
VSS
Y20
VSS
AB4
VCNTL0
W8
CVDD
Y21
CVDD
AB5
DVDD18
W9
VSS
Y22
VSS
AB6
VSS
W10
CVDD
Y23
CVDD
AB7
VSS
W11
VSS
Y24
VSS
AB8
VSS
W12
CVDD1
Y25
DVDD18
AB9
VSS
W13
VSS
Y26
VSS
AB10
VSS
W14
CVDD1
Y27
RSV04
AB11
VSS
W15
VSS
Y28
RP1CLKP
AB12
VSS
W16
CVDD1
Y29
RP1FBP
AB13
VSS
W17
VSS
AA1
MCMTXPMDAT
AB14
VSS
W18
CVDD
AA2
MCMTXPMCLK
AB15
AVDDA3
W19
VSS
AA3
MCMRXPMCLK
AB16
VSS
W20
CVDD
AA4
VCNTL2
AB17
DVDD18
W21
VSS
AA5
VSS
AB18
VSS
W22
CVDD
AA6
VSS
AB19
DVDD18
W23
VSS
AA7
VSS
AB20
VSS
W24
AVDDA1
AA8
CVDD
AB21
DVDD18
61
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Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
www.ti.com
Table 2-18
Ball Number
Terminal Functions
— By Ball Number
(Part 16 of 21)
Table 2-18
Terminal Functions
— By Ball Number
(Part 17 of 21)
Table 2-18
Terminal Functions
— By Ball Number
(Part 18 of 21)
Signal Name
Ball Number
Signal Name
Ball Number
Signal Name
AB22
VSS
AD6
VSS
AE16
RSV22
AB23
CVDD
AD7
VDDT2
AE17
EXTFRAMEEVENT
AB24
VSS
AD8
VSS
AE18
GPIO05
AB25
CORECLKSEL
AD9
VDDT2
AE18 †
BOOTMODE04
AB26
RSV20
AD10
VSS
AE19
GPIO03
AB27
PHYSYNC
AD11
VDDT2
AE19 †
BOOTMODE02
AB28
ALTCORECLKN
AD12
VSS
AE20
GPIO12
AB29
ALTCORECLKP
AD13
VDDT2
AE20 †
BOOTMODE11
AC1
VSS
AD14
VSS
AE21
GPIO09
AC2
DVDD18
AD15
CORESEL2
AE22
LRESET
AC3
VSS
AD16
RSV23
AE23
RESETFULL
AC4
DVDD18
AD17
SDA
AE24
DVDD18
AC5
VSS
AD18
RESETSTAT
AE25
EMU07
AC6
VDDT2
AD19
GPIO02
AE26
EMU04
AC7
VSS
AD19 †
BOOTMODE01
AE27
DVDD18
AC8
VDDT2
AD20
GPIO11
AE28
EMU02
AC9
VSS
AD20 †
BOOTMODE10
AE29
EMU00
AC10
VDDT2
AD21
GPIO15
AF1
CVDD1
AC11
VSS
AD21 †
PCIESSMODE1
AF2
VSS
AC12
VDDT2
AD22
RSV12
AF3
SGMII0TXN
AC13
VSS
AD23
PACLKSEL
AF4
SGMII0TXP
AC14
VDDT2
AD24
VSS
AF5
VSS
AC15
VSS
AD25
EMU05
AF6
RIOTXN3
AC16
CORESEL1
AD26
TRST
AF7
RIOTXP3
AC17
SCL
AD27
VSS
AF8
VSS
AC18
HOUT
AD28
TDI
AF9
RIOTXN1
AC19
POR
AD29
TCK
AF10
RIOTXP1
AC20
LRESETNMIEN
AE1
VSS
AF11
VSS
AC21
BOOTCOMPLETE
AE2
CVDD1
AF12
PCIETXN1
AC22
RSV13
AE3
VSS
AF13
PCIETXP1
AC23
RSV03
AE4
VDDT2
AF14
VSS
AC24
RESET
AE5
RSV17
AF15
VSS
AC25
NMI
AE6
VDDR3
AF16
MDCLK
AC26
TMS
AE7
VSS
AF17
RSV25
AC27
TDO
AE8
RSV15
AF18
GPIO04
AC28
SYSCLKN
AE9
VSS
AF18 †
BOOTMODE03
AC29
SYSCLKP
AE10
VDDT2
AF19
DVDD18
AD1
CVDD1
AE11
VDDR4
AF20
VSS
AD2
VSS
AE12
VDDT2
AF21
GPIO13
AD3
CVDD1
AE13
VSS
AF21 †
BOOTMODE12
AD4
VSS
AE14
RSV16
AF22
DVDD18
AD5
VDDT2
AE15
VDDR2
AF23
TIMO1
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62
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
Table 2-18
Terminal Functions
— By Ball Number
(Part 19 of 21)
www.ti.com
Table 2-18
Terminal Functions
— By Ball Number
(Part 20 of 21)
Table 2-18
Terminal Functions
— By Ball Number
(Part 21 of 21)
Ball Number
Signal Name
Ball Number
Signal Name
Ball Number
Signal Name
AF24
UARTRXD
AH6
RIORXN3
AJ17
PCIECLKN
AF25
EMU06
AH7
RIORXP3
AJ18
PASSCLKP
AF26
EMU10
AH8
VSS
AJ19
GPIO08
AF27
EMU08
AH9
RIORXP1
AJ19 †
BOOTMODE07
AF28
EMU03
AH10
RIORXN1
AJ20
GPIO00
AF29
EMU01
AH11
VSS
AJ20 †
LENDIAN
AG1
VSS
AH12
PCIERXN1
AJ21
SPIDOUT
AG2
CVDD1
AH13
PCIERXP1
AJ22
SPISCS1
AG3
VSS
AH14
VSS
AJ23
TIMI0
AG4
SGMII1TXN
AH15
CORESEL0
AJ23 †
PCIESSEN
AG5
SGMII1TXP
AH16
SRIOSGMIICLKN
AJ24
UARTTXD
AG6
VSS
AH17
PCIECLKP
AJ25
RSV01
AG7
RIOTXN2
AH18
PASSCLKN
AJ26
EMU17
AG8
RIOTXP2
AH19
GPIO07
AJ27
EMU15
AG9
VSS
AH19 †
BOOTMODE06
AJ28
DVDD18
AG10
RIOTXP0
AH20
GPIO14
AJ29
VSS
AG11
RIOTXN0
AH20 †
PCIESSMODE0
End of Table 2-18
AG12
VSS
AH21
SPISCS0
AG13
PCIETXP0
AH22
SPIDIN
AG14
PCIETXN0
AH23
TIMO0
AG15
VSS
AH24
UARTCTS
AG16
MDIO
AH25
EMU18
AG17
RSV24
AH26
DVDD18
AG18
GPIO01
AH27
EMU16
AG18 †
BOOTMODE00
AH28
EMU14
AG19
GPIO10
AH29
DVDD18
AG20
GPIO06
AJ1
VSS
AG20 †
BOOTMODE05
AJ2
CVDD1
AG21
SPICLK
AJ3
VSS
AG22
VSS
AJ4
SGMII1RXN
AG23
TIMI1
AJ5
SGMII1RXP
AG24
UARTRTS
AJ6
VSS
AG25
EMU13
AJ7
RIORXN2
AG26
VSS
AJ8
RIORXP2
AG27
EMU12
AJ9
VSS
AG28
EMU11
AJ10
RIORXP0
AG29
EMU09
AJ11
RIORXN0
AH1
CVDD1
AJ12
VSS
AH2
VSS
AJ13
PCIERXP0
AH3
SGMII0RXN
AJ14
PCIERXN0
AH4
SGMII0RXP
AJ15
VSS
AH5
VSS
AJ16
SRIOSGMIICLKP
63
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Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
www.ti.com
2.8 Development
2.8.1 Development Support
In case the customer would like to develop their own features and software on the C6670 device, TI offers an
extensive line of development tools for the TMS320C6000™ DSP platform, including tools to evaluate the
performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug
software and hardware modules. The tool's support documentation is electronically available within the Code
Composer Studio™ Integrated Development Environment (IDE).
The following products support development of C6000™ DSP-based applications:
• Software Development Tools:
– Code Composer Studio™ Integrated Development Environment (IDE), including Editor C/C++/Assembly
Code Generation, and Debug plus additional development tools
– Scalable, Real-Time Foundation Software (DSP/BIOS™), which provides the basic run-time target software
needed to support any DSP application.
• Hardware Development Tools:
– Extended Development System (XDS™) Emulator (supports C6000™ DSP multiprocessor system debug)
– EVM (Evaluation Module)
2.8.2 Device Support
2.8.2.1 Device and Development-Support Tool Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all DSP devices
and support tools. Each DSP commercial family member has one of three prefixes: TMX, TMP, or TMS
(e.g., TMX320CMH). Texas Instruments recommends two of three possible prefix designators for its support tools:
TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering
prototypes (TMX/TMDX) through fully qualified production devices/tools (TMS/TMDS).
Device development evolutionary flow:
• TMX: Experimental device that is not necessarily representative of the final device's electrical specifications
• TMP: Final silicon die that conforms to the device's electrical specifications but has not completed quality and
reliability verification
• TMS: Fully qualified production device
Support tool development evolutionary flow:
• TMDX: Development-support product that has not yet completed Texas Instruments internal qualification
testing.
• TMDS: Fully qualified development-support product
TMX and TMP devices and TMDX development-support tools are shipped with the following disclaimer:
Developmental product is intended for internal evaluation purposes.
TMS devices and TMDS development-support tools have been characterized fully, and the quality and reliability of
the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system because their
expected end-use failure rate still is undefined. Only qualified production devices are to be used.
64
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Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
www.ti.com
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for
example, CYP), the temperature range (for example, blank is the default case temperature range), and the device
speed range, in Megahertz (for example, blank is 1000 MHz [1 GHz]).
For device part numbers and further ordering information for TMS320C6670 in the CYP package type, see the TI
website www.ti.com or contact your TI sales representative.
Figure 2-17 provides a legend for reading the complete device name for any C66x+™ DSP generation member.
Figure 2-17
C66x™ DSP Device Nomenclature (including the TMS320C6670 DSP)
TMX
320
C6670
(
) (
) CYP
(
)
(
)
PREFIX
TMX = Experimental device
TMS = Qualified device
DEVICE SPEED RANGE
Blank = 1 GHz
2 = 1.2 GHz
DEVICE FAMILY
320 = TMS320 DSP family
TEMPERATURE RANGE
Blank = 0°C to +100°C (default case temperature)
A = Extended temperature range
(-40°C to +100°C)
DEVICE
C66x DSP: C6670
SILICON REVISION
Blank = Initial Silicon 1.0
A = Silicon Revision 2.0
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PACKAGE TYPE
CYP = 841-pin plastic ball grid array,
with Pb-free solder balls
ENCRYPTION
Blank = Encryption NOT enabled
X = Encryption enabled
Device Overview
65
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
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2.9 Related Documentation from Texas Instruments
These documents describe the TMS320C6670 Multicore Fixed and Floating-Point System-on-Chip. Copies of these
documents are available on the Internet at www.ti.com
64-bit Timer (Timer 64) for KeyStone Devices User Guide
SPRUGV5
Antenna Interface 2 (AIF2) for KeyStone Devices User Guide
SPRUGV7
Bit Coprocessor (BCP) for KeyStone Devices User Guide
SPRUGZ1
Bootloader for the C66x DSP User Guide
SPRUGY5
C66x CorePac User Guide
SPRUGW0
C66x CPU and Instruction Set Reference Guide
SPRUGH7
C66x DSP Cache User Guide
SPRUGY8
DDR3 Design Guide for KeyStone Devices
SPRABI1
DSP Power Consumption Summary for KeyStone Devices
SPRABL4
Emulation and Trace Headers Technical Reference
SPRU655
Enhanced Direct Memory Access 3 (EDMA3) for KeyStone Devices User Guide
SPRUGS5
Fast Fourier Transform Coprocessor (FFTC) for KeyStone Devices User Guide
SPRUGS2
General Purpose Input/Output (GPIO) for KeyStone Devices User Guide
SPRUGV1
Gigabit Ethernet (GbE) Switch Subsystem for KeyStone Devices User Guide
SPRUGV9
Hardware Design Guide for KeyStone Devices
SPRABI2
HyperLink for KeyStone Devices User Guide
SPRUGW8
2
Inter Integrated Circuit (I C) for KeyStone Devices User Guide
SPRUGV3
Chip Interrupt Controller (CIC) for KeyStone Devices User Guide
SPRUGW4
Memory Protection Unit (MPU) for KeyStone Devices User Guide
SPRUGW5
Multicore Navigator for KeyStone Devices User Guide
SPRUGR9
Multicore Shared Memory Controller (MSMC) for KeyStone Devices User Guide
SPRUGW7
Network Coprocessor (NETCP) for KeyStone Devices User Guide
SPRUGZ6
Packet Accelerator (PA) for KeyStone Devices User Guide
SPRUGS4
Peripheral Component Interconnect Express (PCIe) for KeyStone Devices User Guide
SPRUGS6
Phase Locked Loop (PLL) Controller for KeyStone Devices User Guide
SPRUGV2
Power Sleep Controller (PSC) for KeyStone Devices User Guide
SPRUGV4
Serial Peripheral Interface (SPI) for KeyStone Devices User Guide
SPRUGP2
Serial RapidIO (SRIO) for KeyStone Devices User Guide
SPRUGW1
Turbo Decoder Coprocessor 3 (TCP3d) for KeyStone Devices User Guide
SPRUGS0
Turbo Encoder Coprocessor 3 (TCP3e) for KeyStone Devices User Guide
SPRUGS1
Universal Asynchronous Receiver/Transmitter (UART) for KeyStone Devices User Guide
SPRUGP1
Using Advanced Event Triggering to Debug Real-Time Problems in High Speed Embedded Microprocessor Systems
SPRA387
Using Advanced Event Triggering to Find and Fix Intermittent Real-Time Bugs
SPRA753
Using IBIS Models for Timing Analysis
SPRA839
Viterbi Coprocessor (VCP2) for KeyStone Devices User Guide
SPRUGV6
66
Device Overview
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3 Device Configuration
On the TMS320C6670 device, certain device configurations like boot mode and endianess, are selected at device
power-on reset. The status of the peripherals (enabled/disabled) is determined after device power-on reset. By
default, the peripherals on the device are disabled and need to be enabled by software before being used.
3.1 Device Configuration at Device Reset
Table 3-1 describes the device configuration pins. The logic level is latched at power-on reset to determine the device
configuration. The logic level on the device configuration pins can be set by using external pullup/pulldown resistors
or by using some control device (e.g., FPGA/CPLD) to intelligently drive these pins. When using a control device,
care should be taken to ensure there is no contention on the lines when the device is out of reset. The device
configuration pins are sampled during power-on reset and are driven after the reset is removed. To avoid
contention, the control device must stop driving the device configuration pins of the DSP.
Note—If a configuration pin must be routed out from the device and it is not driven (Hi-Z state),
the internal pullup/pulldown (IPU/IPD) resistor should not be relied upon. TI recommends the use of an
external pullup/pulldown resistor. For more detailed information on pullup/pulldown resistors and
situations in which external pullup/pulldown resistors are required, see Section 3.4 ‘‘Pullup/Pulldown
Resistors’’ on page 85.
Table 3-1
Device Configuration Pins
Configuration Pin
LENDIAN
(1) (2)
Pin No.
IPD/IPU
AJ20
IPU
BOOTMODE[12:0] (1) (2) AF21, AE20, AD20, IPD
AG19, AE21, AJ19,
AH19, AG20,
AE18, AF18, AE19,
AD19, AG18
PCIESSMODE[1:0]
(1) (2)
(1)
Functional Description
Device endian mode (LENDIAN)
0 = Device operates in big endian mode
1 = Device operates in little endian mode
Method of boot
See ‘‘Boot Modes Supported and PLL Settings’’ on page 30 for more details. See the
Bootloader for the C66x DSP User Guide in ‘‘Related Documentation from Texas
Instruments’’ on page 66 for detailed information on boot configuration
AD21, AH20
IPD
PCIe subsystem mode selection
00 = PCIe in end point mode
01 = PCIe legacy end point (support for legacy INTx)
10 = PCIe in root complex mode
11 = Reserved
(1) (2)
AJ23
IPD
PCIe subsystem enable/disable
0 = PCIE subsystem is disabled
1 = PCIE subsystem is enabled
CORECLKSEL
(1)
AB25
IPD
Core clock select
0 = SYSCLK is used as the input to Main PLL
1 = ALTCORECLK is used as the input to Main PLL
PACLKSEL(1)
AD23
IPD
Network coprocessor clock select
0 = SYSCLK / ALTCORECLK (controlled by CORECLKSEL pin) is used as the input to PA_SS PLL
1 = PASSCLK is used as the input to PASS PLL
PCIESSEN
End of Table 3-1
1 Internal 100-μA pulldown or pullup is provided for this terminal. In most systems, a 1-kΩ resistor can be used to oppose the IPD/IPU. For more detailed information on
pulldown/pullup resistors and situations in which external pulldown/pullup resistors are required, see Section 3.4 ‘‘Pullup/Pulldown Resistors’’ on page 85.
2 These signal names are the secondary functions of these pins.
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3.2 Peripheral Selection After Device Reset
Several of the peripherals on the TMS320C6670 are controlled by the Power Sleep Controller (PSC). By default, the
PCIe, SRIO, HyperLink, RAC, TAC, FFTC, AIF2, TCP3d, TCP3e, and VCP are held in reset and clock-gated. The
memories in these modules are also in a low-leakage sleep mode. Software is required to turn these memories on.
Then, the software enables the modules (turns on clocks and de-asserts reset) before these modules can be used.
If one of the above modules is used in the selected ROM boot mode, the ROM code will automatically enable the
module.
All other modules come up enabled by default and there is no special software sequence to enable. For more detailed
information on the PSC usage, see the Power Sleep Controller (PSC) for KeyStone Devices User Guide in 2.9 ‘‘Related
Documentation from Texas Instruments’’ on page 66.
3.3 Device State Control Registers
The TMS320C6670 device has a set of registers that are used to control the status of its peripherals. These registers
are shown in Table 3-2.
Table 3-2
Device State Control Registers (Part 1 of 4)
Address Start
Address End
Size
Acronym
0x02620000
0x02620007
8B
Reserved
0x02620008
0x02620017
16B
Reserved
0x02620018
0x0262001B
4B
JTAGID
0x0262001C
0x0262001F
4B
Reserved
0x02620020
0x02620023
4B
DEVSTAT
Description
See section 3.3.3
See section 3.3.1
0x02620024
0x02620037
20B
Reserved
0x02620038
0x0262003B
4B
KICK0
0x0262003C
0x0262003F
4B
KICK1
0x02620040
0x02620043
4B
DSP_BOOT_ADDR0
The boot address for C66x DSP CorePac0
0x02620044
0x02620047
4B
DSP_BOOT_ADDR1
The boot address for C66x DSP CorePac1
0x02620048
0x0262004B
4B
DSP_BOOT_ADDR2
The boot address for C66x DSP CorePac2
The boot address for C66x DSP CorePac3
See section 3.3.4
0x0262004C
0x0262004F
4B
DSP_BOOT_ADDR3
0x02620050
0x02620053
4B
Reserved
0x02620054
0x02620057
4B
Reserved
0x02620058
0x0262005B
4B
Reserved
0x0262005C
0x0262005F
4B
Reserved
0x02620060
0x026200DF
128B
Reserved
0x026200E0
0x0262010F
48B
Reserved
0x02620110
0x02620117
8B
MACID
0x02620118
0x0262012F
24B
Reserved
0x02620130
0x02620133
4B
LRSTNMIPINSTAT_CLR
See section 3.3.6
0x02620134
0x02620137
4B
RESET_STAT_CLR
See section 3.3.8
0x02620138
0x0262013B
4B
Reserved
0x0262013C
0x0262013F
4B
BOOTCOMPLETE
0x02620140
0x02620143
4B
Reserved
0x02620144
0x02620147
4B
RESET_STAT
0x02620148
0x0262014B
4B
LRSTNMIPINSTAT
See section 3.3.5
0x0262014C
0x0262014F
4B
DEVCFG
See section 3.3.2
68
Device Configuration
See section 7.19 ‘‘Gigabit Ethernet (GbE) Switch Subsystem’’ on
page 207
See section 3.3.9
See section 3.3.7
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Table 3-2
Device State Control Registers (Part 2 of 4)
Address Start
Address End
Size
Acronym
Description
0x02620150
0x02620153
4B
PWRSTATECTL
See section 3.3.10
0x02620154
0x02620157
4B
SRIO_SERDES_STS
See ‘‘Related Documentation from Texas Instruments’’ on page 66
0x02620158
0x0262015B
4B
SGMII_SERDES_STS
0x0262015C
0x0262015F
4B
PCIE_SERDES_STS
0x02620160
0x02620160
4B
HYPERLINK_SERDES_STS
0x02620164
0x02620167
4B
AIF2_A_SERDES_STS
0x02620168
0x0262016B
4B
AIF2_B_SERDES_STS
0x0262016C
0x0262017F
20B
Reserved
0x02620180
0x02620183
4B
SmartReflex Class0
0x02620184
0x0262018F
12B
Reserved
0x02620190
0x02620193
4B
Reserved
0x02620194
0x02620197
4B
Reserved
0x02620198
0x0262019B
4B
Reserved
0x0262019C
0x0262019F
4B
Reserved
0x026201A0
0x026201A3
4B
Reserved
0x026201A4
0x026201A7
4B
Reserved
0x026201A8
0x026201AB
4B
Reserved
0x026201AC
0x026201AF
4B
Reserved
0x026201B0
0x026201B3
4B
Reserved
0x026201B4
0x026201B7
4B
Reserved
0x026201B8
0x026201BB
4B
Reserved
0x026201BC
0x026201BF
4B
Reserved
0x026201C0
0x026201C3
4B
Reserved
0x026201C4
0x026201C7
4B
Reserved
0x026201C8
0x026201CB
4B
Reserved
0x026201CC
0x026201CF
4B
Reserved
0x026201D0
0x026201FF
48B
Reserved
0x02620200
0x02620203
4B
NMIGR0
0x02620204
0x02620207
4B
NMIGR1
0x02620208
0x0262020B
4B
NMIGR2
0x0262020C
0x0262020F
4B
NMIGR3
0x02620210
0x02620213
4B
Reserved
0x02620214
0x02620217
4B
Reserved
0x02620218
0x0262021B
4B
Reserved
0x0262021C
0x0262021F
4B
Reserved
0x02620220
0x0262023F
32B
Reserved
0x02620240
0x02620243
4B
IPCGR0
0x02620244
0x02620247
4B
IPCGR1
0x02620248
0x0262024B
4B
IPCGR2
0x0262024C
0x0262024F
4B
IPCGR3
0x02620250
0x02620253
4B
Reserved
0x02620254
0x02620257
4B
Reserved
0x02620258
0x0262025B
4B
Reserved
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See section 3.3.11
See section 3.3.12
Device Configuration
69
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
Table 3-2
www.ti.com
Device State Control Registers (Part 3 of 4)
Address Start
Address End
Size
Acronym
0x0262025C
0x0262025F
4B
Reserved
0x02620260
0x0262027B
28B
Reserved
Description
0x0262027C
0x0262027F
4B
IPCGRH
See section 3.3.14
0x02620280
0x02620283
4B
IPCAR0
See section 3.3.13
0x02620284
0x02620287
4B
IPCAR1
0x02620288
0x0262028B
4B
IPCAR2
0x0262028C
0x0262028F
4B
IPCAR3
0x02620290
0x02620293
4B
Reserved
0x02620294
0x02620297
4B
Reserved
0x02620298
0x0262029B
4B
Reserved
0x0262029C
0x0262029F
4B
Reserved
0x026202A0
0x026202BB
28B
Reserved
0x026202BC
0x026202BF
4B
IPCARH
0x026202C0
0x026202FF
64B
Reserved
See section 3.3.15
0x02620300
0x02620303
4B
TINPSEL
See section 3.3.16
0x02620304
0x02620307
4B
TOUTPSEL
See section 3.3.17
See section 3.3.18
0x02620308
0x0262030B
4B
RSTMUX0
0x0262030C
0x0262030F
4B
RSTMUX1
0x02620310
0x02620313
4B
RSTMUX2
0x02620314
0x02620317
4B
RSTMUX3
0x02620318
0x0262031B
4B
Reserved
0x0262031C
0x0262031F
4B
Reserved
0x02620320
0x02620323
4B
Reserved
0x02620324
0x02620327
4B
Reserved
0x02620328
0x0262032B
4B
MAINPLLCTL0
0x0262032C
0x0262032F
4B
MAINPLLCTL1
0x02620330
0x02620333
4B
DDR3PLLCTL0
0x02620334
0x02620337
4B
DDR3PLLCTL1
0x02620338
0x0262033B
4B
PASSPLLCTL0
0x0262033C
0x0262033F
4B
PASSPLLCTL1
0x02620340
0x02620343
4B
SGMII_SERDES_CFGPLL
0x02620344
0x02620347
4B
SGMII_SERDES_CFGRX0
0x02620348
0x0262034B
4B
SGMII_SERDES_CFGTX0
0x0262034C
0x0262034F
4B
SGMII_SERDES_CFGRX1
0x02620350
0x02620353
4B
SGMII_SERDES_CFGTX1
0x02620354
0x02620357
4B
Reserved
0x02620358
0x0262035B
4B
PCIE_SERDES_CFGPLL
0x0262035C
0x0262035F
4B
Reserved
0x02620360
0x02620363
4B
SRIO_SERDES_CFGPLL
0x02620364
0x02620367
4B
SRIO_SERDES_CFGRX0
0x02620368
0x0262036B
4B
SRIO_SERDES_CFGTX0
0x0262036C
0x0262036F
4B
SRIO_SERDES_CFGRX1
0x02620370
0x02620373
4B
SRIO_SERDES_CFGTX1
70
Device Configuration
See section 7.5 ‘‘Main PLL and the PLL Controller’’ on page 128
See section 7.6 ‘‘DDR3 PLL’’ on page 142
See section 7.7 ‘‘PASS PLL’’ on page 144
See ‘‘Related Documentation from Texas Instruments’’ on page 66
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Table 3-2
Device State Control Registers (Part 4 of 4)
Address Start
Address End
Size
Acronym
Description
0x02620374
0x02620377
4B
SRIO_SERDES_CFGRX2
See ‘‘Related Documentation from Texas Instruments’’ on page 66
0x02620378
0x0262037B
4B
SRIO_SERDES_CFGTX2
0x0262037C
0x0262037F
4B
SRIO_SERDES_CFGRX3
0x02620380
0x02620383
4B
SRIO_SERDES_CFGTX3
0x02620384
0x02620387
4B
Reserved
0x02620388
0x026203AF
28B
Reserved
0x026203B0
0x026203B3
4B
Reserved
0x026203B4
0x026203B7
4B
HYPERLINK_SERDES_CFGPLL
0x026203B8
0x026203BB
4B
HYPERLINK_SERDES_CFGRX0
0x026203BC
0x026203BF
4B
HYPERLINK_SERDES_CFGTX0
0x026203C0
0x026203C3
4B
HYPERLINK_SERDES_CFGRX1
0x026203C4
0x026203C7
4B
HYPERLINK_SERDES_CFGTX1
0x026203C8
0x026203CB
4B
HYPERLINK_SERDES_CFGRX2
0x026203CC
0x026203CF
4B
HYPERLINK_SERDES_CFGTX2
0x026203D0
0x026203D3
4B
HYPERLINK_SERDES_CFGRX3
0x026203D4
0x026203D7
4B
HYPERLINK_SERDES_CFGTX3
0x026203D8
0x026203DB
4B
Reserved
0x026203DC
0x026203F7
28B
Reserved
0x026203F8
0x026203FB
4B
DEVSPEED
0x026203FC
0x026203FF
4B
Reserved
0x02620400
0x02620403
4B
PKTDMA_PRI_ALLOC
0x02620404
0x02620467
100B
Reserved
See ‘‘Related Documentation from Texas Instruments’’ on page 66
See section 3.3.19
See section 4.4 ‘‘Bus Priorities’’ on page 97
End of Table 3-2
3.3.1 Device Status (DEVSTAT) Register
The Device Status Register depicts the device configuration selected upon a power-on reset by either the POR or
RESETFULL pin. Once set, these bits will remain set until a power-on reset. The Device Status Register is shown in
Figure 3-1 and described in Table 3-3.
Figure 3-1
Device Status Register
31
18
Reserved
17
16
PACLKSEL
PCIESSEN
PCIESSMODE[1:0
BOOTMODE[12:0]
R-x
R/W-xx
R/W-xxxxxxxxxxxx
R-0
15
14
13
1
0
LENDIAN
R-x
(1)
Legend: R = Read only; RW = Read/Write; -n = value after reset
1 x indicates the bootstrap value latched via the external pin
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Table 3-3
Bit
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Device Status Register Field Descriptions
Field
Description
31-18
Reserved
Reserved. Read only, writes have no effect.
17
PACLKSEL
PA Clock select to select the reference clock for PA subsystem PLL
0 = Selects output of Main PLL MUX (SYSCLK vs. ALTCORECLK - depending on CORECLKSEL pin)
1 = Selects PASSCLKP/N
16
PCIESSEN
PCIe module enable
0 = PCIe module disabled
1 = PCIe module enabled
15-14
PCIESSMODE[1:0]
PCIe mode selection pins
00b = PCIe in end-point mode
01b = PCIe in legacy end-point mode (support for legacy INTx)
10b = PCIe in root complex mode
11b = Reserved
13-1
BOOTMODE[12:0]
Determines the bootmode configured for the device. For more information on bootmode, see Section 2.4 ‘‘Boot Modes
Supported and PLL Settings’’ on page 30 and see the Bootloader for the C66x DSP User Guide in2.9 ‘‘Related
Documentation from Texas Instruments’’ on page 66.
0
LENDIAN
Device endian mode (LENDIAN) — shows the status of whether the system is operating in big endian mode or little
endian mode (default).
0 = System is operating in big endian mode
1 = System is operating in little endian mode (default)
End of Table 3-3
3.3.2 Device Configuration Register
The Device Configuration Register is one-time writeable through software. The register is reset on all hard resets
and is locked after the first write. The Device Configuration Register is shown in Figure 3-2 and described in
Table 3-4.
Figure 3-2
Device Configuration Register (DEVCFG)
31
1
0
Reserved
SYSCLKOUTEN
R-0
R/W-1
Legend: R = Read only; RW = Read/Write; -n = value after reset
Table 3-4
Device Configuration Register Field Descriptions
Bit
Field
Description
31-1
Reserved
Reserved. Read only, writes have no effect.
0
SYSCLKOUTEN
SYSCLKOUT enable
0 = No clock output
1 = Clock output enabled (default)
End of Table 3-4
72
Device Configuration
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3.3.3 JTAG ID (JTAGID) Register Description
The JTAG ID register is a read-only register that identifies to the customer the JTAG/Device ID. For the device, the
JTAG ID register resides at address location 0x02620018. The JTAG ID Register is shown in the tables below.
Figure 3-3
JTAG ID (JTAGID) Register
31
28
27
12
11
1
0
VARIANT
PART NUMBER
MANUFACTURER
LSB
R-xxxx
R-1011 1001 0100 0001
0000 0010 111b
R-1
Legend: RW = Read/Write; R = Read only; -n = value after reset
Table 3-5
JTAG ID Register Field Descriptions
Bit
Field
Value
Description
31-28
VARIANT
xxxxb
Variant value
27-12
PART NUMBER
1011 1001 0100 0001b
Part Number for boundary scan
11-1
MANUFACTURER
0000 0010 111b
Manufacturer
0
LSB
1b
This bit is read as a 1 for TMS320C6670
End of Table 3-5
Note—The value of the VARIANT and PART NUMBER fields depend on the silicon revision being used.
See the Silicon Errata for details.
3.3.4 Kicker Mechanism (KICK0 and KICK1) Register
The Bootcfg module contains a kicker mechanism to prevent any spurious writes from changing any of the Bootcfg
MMR values. When the kicker is locked (which it is initially after power on reset) none of the Bootcfg MMRs are
writable (they are only readable). This mechanism requires two MMR writes to the KICK0 and KICK1 registers with
exact data values before the kicker lock mechanism is un-locked. See Table 3-2 ‘‘Device State Control Registers’’ on
page 68 for the address location. Once released then all the Bootcfg MMRs having write permissions are writable
(the read only MMRs are still read only). The first KICK0 data is 0x83e70b13. The second KICK1 data is 0x95a4f1e0.
Writing any other data value to either of these kick MMRs will lock the kicker mechanism and block any writes to
Bootcfg MMRs. In order to ensure protection to all Bootcfg MMRs, software must always re-lock the kicker
mechanism after completing the MMR writes.
3.3.5 LRESETNMI PIN Status (LRSTNMIPINSTAT) Register
The LRSTNMIPINSTAT Register is used to latch the status of LRESET and NMI based on the setting of
CORESEL[2:0]. The LRESETNMI PIN Status Register is shown in Figure 3-4 and described in Table 3-6.
Figure 3-4
LRESETNMI PIN Status Register (LRSTNMIPINSTAT)
31
20
19
18
17
16
Reserved
NMI3
NMI2
NMI1
NMI0
R, +000000000000
R-0
R-0
R-0
R-0
15
4
3
2
1
0
Reserved
LR3
LR2
LR1
LR0
R, +000000000000
R-0
R-0
R-0
R-0
Legend: R = Read only; -n = value after reset
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Table 3-6
Bit
www.ti.com
LRESETNMI PIN Status Register Field Descriptions
Field
Description
31-20
Reserved
Reserved
19
NMI3
CorePac3 in NMI
18
NMI2
CorePac2 in NMI
17
NMI1
CorePac1 in NMI
16
NMI0
CorePac0 in NMI
15-4
Reserved
Reserved
3
LR4
CorePac3 in Local Reset
2
LR3
CorePac2 in Local Reset
1
LR31
CorePac1 in Local Reset
0
LR0
CorePac0 in Local Reset
End of Table 3-6
3.3.6 LRESETNMI PIN Status Clear (LRSTNMIPINSTAT_CLR) Register
The LRSTNMIPINSTAT_CLR Register is used to clear the status of LRESET and NMI based on CORESEL[2:0]. The
LRESETNMI PIN Status Clear Register is shown in Figure 3-5 and described in Table 3-7.
Figure 3-5
LRESETNMI PIN Status Clear Register (LRSTNMIPINSTAT_CLR)
31
20
19
18
17
16
Reserved
NMI3
NMI2
NMI1
NMI0
R,+000000000000
WC,+0
WC,+0
WC,+0
WC,+0
15
4
3
2
1
0
Reserved
LR3
LR2
LR1
LR0
R,+000000000000
WC,+0
WC,+0
WC,+0
WC,+0
Legend: R = Read only; -n = value after reset; WC = Write 1 to Clear
Table 3-7
LRESETNMI PIN Status Clear Register Field Descriptions
Bit
Field
Description
31-20
Reserved
Reserved
19
NMI3
CorePac3 in NMI Clear
18
NMI2
CorePac2 in NMI Clear
17
NMI1
CorePac1 in NMI Clear
16
NMI0
CorePac0 in NMI Clear
15-4
Reserved
Reserved
3
LR3
CorePac3 in Local Reset Clear
2
LR2
CorePac2 in Local Reset Clear
1
LR1
CorePac1 in Local Reset Clear
0
LR0
CorePac0 in Local Reset Clear
End of Table 3-7
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3.3.7 Reset Status (RESET_STAT) Register
The reset status register (RESET_STAT) captures the status of Local reset (LRx) for each of the cores and also the
global device reset (GR). Software can use this information to take different device initialization steps, if desired.
• In case of local reset: The LRx bits are written as 1 and GR bit is written as 0 only when the CorePac receives
an local reset without receiving a global reset.
• In case of global reset: The LRx bits are written as 0 and GR bit is written as 1 only when a global reset is
asserted.
The Reset Status Register is shown in Figure 3-6 and described in Table 3-8.
Figure 3-6
31
Reset Status Register (RESET_STAT)
30
4
3
2
1
0
GR
Reserved
LR3
LR2
LR1
LR0
R, +1
R, + 000 0000 0000 0000 0000 0000 0000
R,+0
R,+0
R,+0
R,+0
Legend: R = Read only; -n = value after reset
Table 3-8
Bit
31
Reset Status Register Field Descriptions
Field
Description
GR
Global reset status
0 = Device has not received a global reset.
1 = Device received a global reset.
Reserved
Reserved.
3
LR3
CorePac3 reset status
0 = CorePac3 has not received a local reset.
1 = CorePac3 received a local reset.
2
LR2
CorePac2 reset status
0 = CorePac2 has not received a local reset.
1 = CorePac2 received a local reset.
1
LR1
CorePac1 reset status
0 = CorePac1 has not received a local reset.
1 = CorePac1 received a local reset.
0
LR0
CorePac0 reset status
0 = CorePac0 has not received a local reset.
1 = CorePac0 received a local reset.
30-4
End of Table 3-8
3.3.8 Reset Status Clear (RESET_STAT_CLR) Register
The RESET_STAT bits can be cleared by writing 1 to the corresponding bit in the RESET_STAT_CLR register. The
Reset Status Clear Register is shown in Figure 3-7 and described in Table 3-9.
Figure 3-7
31
Reset Status Clear Register (RESET_STAT_CLR)
30
4
3
2
1
0
GR
Reserved
LR3
LR2
LR1
LR0
RW, +0
R, + 000 0000 0000 0000 0000 0000 0000
RW,+0
RW,+0
RW,+0
RW,+0
Legend: R = Read only; RW = Read/Write; -n = value after reset
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Table 3-9
www.ti.com
Reset Status Clear Register Field Descriptions
Bit
Field
Description
31
GR
Global reset clear bit
0 = Writing a 0 has no effect.
1 = Writing a 1 to the GR bit clears the corresponding bit in the RESET_STAT register.
30-4
Reserved
Reserved.
3
LR3
CorePac3 reset clear bit
0 = Writing a 0 has no effect.
1 = Writing a 1 to the LR3 bit clears the corresponding bit in the RESET_STAT register.
2
LR2
CorePac2 reset clear bit
0 = Writing a 0 has no effect.
1 = Writing a 1 to the LR2 bit clears the corresponding bit in the RESET_STAT register.
1
LR1
CorePac1 reset clear bit
0 = Writing a 0 has no effect.
1 = Writing a 1 to the LR1 bit clears the corresponding bit in the RESET_STAT register.
0
LR0
CorePac0 reset clear bit
0 = Writing a 0 has no effect.
1 = Writing a 1 to the LR0 bit clears the corresponding bit in the RESET_STAT register.
End of Table 3-9
3.3.9 Boot Complete (BOOTCOMPLETE) Register
The BOOTCOMPLETE register controls the BOOTCOMPLETE pin status. The purpose is to indicate the
completion of the ROM booting process. The Boot Complete Register is shown in Figure 3-8 and described in
Table 3-10.
Figure 3-8
Boot Complete Register (BOOTCOMPLETE)
31
4
3
2
1
0
Reserved
BC3
BC
BC1
BC0
R, + 0000 0000 0000 0000 0000 0000 0000
RW,+0
RW,+0
RW,+0
RW,+0
Legend: R = Read only; RW = Read/Write; -n = value after reset
Table 3-10
Boot Complete Register Field Descriptions
Bit
Field
Description
31-4
Reserved
Reserved.
3
BC3
CorePac 4 boot status
0 = CorePac 4 boot NOT complete
1 = CorePac 4 boot complete
2
BC2
CorePac3 boot status
0 = CorePac3 boot NOT complete
1 = CorePac3 boot complete
1
BC1
CorePac2 boot status
0 = CorePac2 boot NOT complete
1 = CorePac2 boot complete
0
BC0
CorePac1 boot status
0 = CorePac1 boot NOT complete
1 = CorePac1 boot complete
End of Table 3-10
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The BCx bit indicates the boot complete status of the corresponding CorePac. All BCx bits are sticky bits — that is
they can be set only once by the software after device reset and they will be cleared to 0 on all device resets.
Boot ROM code will be implemented such that each CorePac will set its corresponding BCx bit immediately before
branching to the predefined location in memory.
3.3.10 Power State Control (PWRSTATECTL) Register
The PWRSTATECTL register is controlled by the software to indicate the power-saving mode. ROM code reads this
register to differentiate between the various power saving modes. This register is cleared only by POR and will
survive all other device resets. See the Hardware Design Guide for KeyStone Devices in‘‘Related Documentation from
Texas Instruments’’ on page 66 for more information. The Power State Control Register is shown in Figure 3-9 and
described in Table 3-11.
Figure 3-9
Power State Control Register (PWRSTATECTL)
31
3
2
1
0
GENERAL_PURPOSE
HIBERNATION_MODE
HIBERNATION
STANDBY
RW, +0000 0000 0000 0000 0000 0000 0000 0
RW,+0
RW,+0
RW,+0
Legend: RW = Read/Write; -n = value after reset
Table 3-11
Power State Control Register Field Descriptions
Bit
Field
Description
31-3
GENERAL_PURPOSE
Used to provide a start address for execution out of the hibernation modes. See the Bootloader for the C66x DSP User
Guide in2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66.
2
HIBERNATION_MODE
Indicates whether the device is in hibernation mode 1 or mode 2.
0 = Hibernation mode 1
1 = Hibernation mode 2
1
HIBERNATION
Indicates whether the device is in hibernation mode or not.
0 = Not in hibernation mode
1 = Hibernation mode
0
STANDBY
Indicates whether the device is in standby mode or not.
0 = Not in standby mode
1 = Standby mode
End of Table 3-11
3.3.11 NMI Event Generation to CorePac (NMIGRx) Register
NMIGRx registers are used for generating NMI events to the corresponding CorePac. The C6670 has
four NMIGRx registers (NMIGR0 through NMIGR3). The NMIGR0 register generates an NMI event to CorePac0,
the NMIGR1 register generates an NMI event to CorePac1, and so on. Writing a 1 to the NMIG field generates a
NMI pulse. Writing a 0 has no effect and Reads return 0 and have no other effect. The NMI Event Generation to
CorePac Register is shown in Figure 3-10 and described in Table 3-12.
Figure 3-10
NMI Generation Register (NMIGRx)
31
1
0
Reserved
NMIG
R, +0000 0000 0000 0000 0000 0000 0000 000
RW,+0
Legend: RW = Read/Write; -n = value after reset
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Table 3-12
www.ti.com
NMI Generation Register Field Descriptions
Bit
Field
Description
31-1
Reserved
Reserved
0
NMIG
Reads return 0
Writes:
0 = No effect
1 = Creates NMI pulse to the corresponding CorePac — CorePac0 for NMIGR0, etc.
End of Table 3-12
3.3.12 IPC Generation (IPCGRx) Registers
IPCGRx are the IPC interrupt generation registers to facilitate inter CorePac interrupts.
The C6670 has four IPCGRx registers (IPCGR0 through IPCGR3) registers. This can be used by external hosts or
CorePacs to generate interrupts to other CorePacs. A write of 1 to IPCG field of IPCGRx register will generate an
interrupt pulse to CorePacx (0 <= x <= 3).
These registers also provide a Source ID facility by which up to 28 different sources of interrupts can be identified.
Allocation of source bits to source processor and meaning is entirely based on software convention. The register field
descriptions are given in the following tables. Virtually anything can be a source for these registers as this is
completely controlled by software. Any master that has access to BOOTCFG module space can write to these
registers. The IPC Generation Register is shown in Figure 3-11 and described in Table 3-13.
Figure 3-11
IPC Generation Registers (IPCGRx)
31
30
29
28
SRCS27
SRCS26
SRCS25
SRCS24
RW +0
RW +0
RW +0
RW +0
27
8
7
6
5
4
3
1
0
SRCS23 – SRCS4
SRCS3
SRCS2
SRCS1
SRCS0
Reserved
IPCG
RW +0 (per bit field)
RW +0
RW +0
RW +0
RW +0
R, +000
RW +0
Legend: R = Read only; RW = Read/Write; -n = value after reset
Table 3-13
IPC Generation Registers Field Descriptions
Bit
Field
Description
31-4
SRCSx
Reads return current value of internal register bit.
Writes:
0 = No effect
1 = Sets both SRCSx and the corresponding SRCCx.
3-1
Reserved
0
IPCG
Reserved
Reads return 0.
Writes:
0 = No effect
1 = Creates an inter-DSP interrupt.
End of Table 3-13
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3.3.13 IPC Acknowledgement (IPCARx) Registers
IPCARx are the IPC interrupt-acknowledgement registers to facilitate inter-CorePac core interrupts.
The C6670 has four IPCARx (IPCAR0 through IPCAR3) registers. These registers also provide a Source ID facility
by which up to 28 different sources of interrupts can be identified. Allocation of source bits to source processor and
meaning is entirely based on software convention. The register field descriptions are given in the following tables.
Virtually anything can be a source for these registers as this is completely controlled by software. Any master that
has access to BOOTCFG module space can write to these registers. The IPC Acknowledgement Register is shown in
Figure 3-12 and described in Table 3-14.
Figure 3-12
IPC Acknowledgement Registers (IPCARx)
31
30
29
28
SRCC27
SRCC26
SRCC25
SRCC24
RW +0
RW +0
RW +0
RW +0
27
8
7
6
5
4
3
0
SRCC23 – SRCC4
SRCC3
SRCC2
SRCC1
SRCC0
Reserved
RW +0 (per bit field)
RW +0
RW +0
RW +0
RW +0
R, +0000
Legend: R = Read only; RW = Read/Write; -n = value after reset
Table 3-14
IPC Acknowledgement Registers Field Descriptions
Bit
Field
Description
31-4
SRCCx
Reads return current value of internal register bit.
Writes:
0 = No effect
1 = Clears both SRCCx and the corresponding SRCSx
3-0
Reserved
Reserved
End of Table 3-14
3.3.14 IPC Generation Host (IPCGRH) Register
IPCGRH register is provided to facilitate host CPU interrupt. Operation and use of IPCGRH is the same as other
IPCGR registers. Interrupt output pulse created by IPCGRH is driven on a device pin, host interrupt/event output
(HOUT).
The host interrupt output pulse should be stretched. It should be asserted for 4 bootcfg clock cycles (CPU/6)
followed by a deassertion of 4 bootcfg clock cycles. Generating the pulse will result in 8 CPU/6 cycle pulse blocking
window. Write to IPCGRH with IPCG bit (bit 0) set will only generate a pulse if they are beyond 8 CPU/6 cycle
period. The IPC Generation Host Register is shown in Figure 3-13 and described in Table 3-15.
Figure 3-13
IPC Generation Registers (IPCGRH)
31
30
29
28
SRCS27
SRCS26
SRCS25
SRCS24
RW +0
RW +0
RW +0
RW +0
27
8
7
6
5
4
3
1
0
SRCS23 – SRCS4
SRCS3
SRCS2
SRCS1
SRCS0
Reserved
IPCG
RW +0 (per bit field)
RW +0
RW +0
RW +0
RW +0
R, +000
RW +0
Legend: R = Read only; RW = Read/Write; -n = value after reset
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Table 3-15
www.ti.com
IPC Generation Registers Field Descriptions
Bit
Field
Description
31-4
SRCSx
Reads return current value of internal register bit.
Writes:
0 = No effect
1 = Sets both SRCSx and the corresponding SRCCx.
3-1
Reserved
0
IPCG
Reserved
Reads return 0.
Writes:
0 = No effect
1 = Creates an interrupt pulse on device pin (host interrupt/event output in HOUT pin)
End of Table 3-15
3.3.15 IPC Acknowledgement Host (IPCARH) Register
IPCARH registers are provided to facilitate host CPU interrupt. Operation and use of IPCARH is the same as
other IPCAR registers. The IPC Acknowledgement Host Register is shown in Figure 3-14 and described in
Table 3-16.
Figure 3-14
IPC Acknowledgement Register (IPCARH)
31
30
29
28
27
SRCC27
SRCC26
SRCC25
SRCC24
RW +0
RW +0
RW +0
RW +0
8
7
6
5
4
3
0
SRCC23 – SRCC4
SRCC3
SRCC2
SRCC1
SRCC0
Reserved
RW +0 (per bit field)
RW +0
RW +0
RW +0
RW +0
R, +0000
Legend: R = Read only; RW = Read/Write; -n = value after reset
Table 3-16
IPC Acknowledgement Register Field Descriptions
Bit
Field
Description
31-4
SRCCx
Reads return current value of internal register bit.
Writes:
0 = No effect
1 = Clears both SRCCx and the corresponding SRCSx
3-0
Reserved
Reserved
End of Table 3-16
3.3.16 Timer Input Selection Register (TINPSEL)
Timer input selection is handled within the control register TINPSEL. The Timer Input Selection Register is shown
in Figure 3-15 and described in Table 3-17.
Figure 3-15
Timer Input Selection Register (TINPSEL)
31
16
15
14
13
12
11
10
9
Reserved
TINPHSEL7
TINPLSEL7
TINPHSEL6
TINPLSEL6
TINPHSEL5
TINPLSEL5
TINPHSEL4
0
RW, +1
RW, +0
RW, +1
RW, +0
RW, +1
RW, +0
RW, +1
spacer
8
7
6
5
4
3
2
1
0
TINPLSEL4
TINPHSEL3
TINPLSEL3
TINPHSEL2
TINPLSEL2
TINPHSEL1
TINPLSEL1
TINPHSEL0
TINPLSEL0
RW, +0
RW, +1
RW, +0
RW, +1
RW, +0
RW, +1
RW, +1
RW, +1
RW, +0
Legend: R = Read only; RW = Read/Write; -n = value after reset
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Table 3-17
Bit
Timer Input Selection Field Description
Field
Description
31-16 Reserved
Reserved
15
TINPHSEL7
Input select for TIMER7 high.
0 = TIMI0
1 = TIMI1
14
TINPLSEL7
Input select for TIMER7 low.
0 = TIMI0
1 = TIMI1
13
TINPHSEL6
Input select for TIMER6 high.
0 = TIMI0
1 = TIMI1
12
TINPLSEL6
Input select for TIMER6 low.
0 = TIMI0
1 = TIMI1
11
TINPHSEL5
Input select for TIMER5 high.
0 = TIMI0
1 = TIMI1
10
TINPLSEL5
Input select for TIMER5 low.
0 = TIMI0
1 = TIMI1
9
TINPHSEL4
Input select for TIMER4 high.
0 = TIMI0
1 = TIMI1
8
TINPLSEL4
Input select for TIMER4 low.
0 = TIMI0
1 = TIMI1
7
TINPHSEL3
Input select for TIMER3 high.
0 = TIMI0
1 = TIMI1
6
TINPLSEL3
Input select for TIMER3 low.
0 = TIMI0
1 = TIMI1
5
TINPHSEL2
Input select for TIMER2 high.
0 = TIMI0
1 = TIMI1
4
TINPLSEL2
Input select for TIMER2 low.
0 = TIMI0
1 = TIMI1
3
TINPHSEL1
Input select for TIMER1 high.
0 = TIMI0
1 = TIMI1
2
TINPLSEL1
Input select for TIMER1 low.
0 = TIMI0
1 = TIMI1
1
TINPHSEL0
Input select for TIMER0 high.
0 = TIMI0
1 = TIMI1
0
TINPLSEL0
Input select for TIMER0 low.
0 = TIMI0
1 = TIMI1
End of Table 3-17
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3.3.17 Timer Output Selection Register (TOUTPSEL)
The timer output selection is handled within the control register TOUTSEL. The Timer Output Selection Register
is shown in Figure 3-16 and described in Table 3-18.
Figure 3-16
Timer Output Selection Register (TOUTPSEL)
31
9
8
5
4
3
0
Reserved
TOUTPSEL1
Reserved
TOUTPSEL0
R,+0000000000000000000000000
RW,+0001
0
RW,+0000
Legend: R = Read only; RW = Read/Write; -n = value after reset
Table 3-18
Timer Output Selection Field Description
Bit
Field
Description
31-9
Reserved
Reserved
8-5
TOUTPSEL1
Output select for TIMO1
0000: TOUTL0
0001: TOUTH0
0010: TOUTL1
0011: TOUTH1
0100: TOUTL2
0101: TOUTH2
0110: TOUTL3
0111: TOUTH3
4
Reserved
Reserved
3-0
TOUTPSEL0
Output select for TIMO0
0000: TOUTL0
0001: TOUTH0
0010: TOUTL1
0011: TOUTH1
0100: TOUTL2
0101: TOUTH2
0110: TOUTL3
0111: TOUTH3
1000: TOUTL4
1001: TOUTH4
1010: TOUTL5
1011: TOUTH5
1100: TOUTL6
1101: TOUTH6
1110: TOUTL7
1111: TOUTH7
1000: TOUTL4
1001: TOUTH4
1010: TOUTL5
1011: TOUTH5
1100: TOUTL6
1101: TOUTH6
1110: TOUTL7
1111: TOUTH7
End of Table 3-18
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3.3.18 Reset Mux (RSTMUXx) Register
The software controls the Reset Mux block through the reset multiplex registers using RSTMUX0 through
RSTMUX3 for each of the four CorePacs on the C6670. These registers are located in Bootcfg memory space. The
Timer Output Selection Register is shown in Figure 3-17 and described in Table 3-19.
Figure 3-17
Reset Mux Register (RSTMUX0 through RSTMUX3)
31
10
9
8
7
5
4
3
1
0
Reserved
EVTSTATCLR
Reserved
DELAY
EVTSTAT
OMODE
LOCK
R, +0000 0000 0000 0000 0000 00
RC, +0
R, +0
RW, +100
R, +0
RW, +000
RW, +0
Legend: R = Read only; RW = Read/Write; -n = value after reset; RC = Read only and write 1 to clear
Table 3-19
Reset Mux Register Field Descriptions
Bit
Field
Description
31-10
Reserved
Reserved
9
EVTSTATCLR
Clear event status
0 = Writing 0 has no effect
1 = Writing 1 to this bit clears the EVTSTAT bit
8
Reserved
Reserved
7-5
DELAY
Delay cycles between NMI & local reset
000b = 256 CPU/6 cycles delay between NMI & local reset, when OMODE = 100b
001b = 512 CPU/6 cycles delay between NMI & local reset, when OMODE=100b
010b = 1024 CPU/6 cycles delay between NMI & local reset, when OMODE=100b
011b = 2048 CPU/6 cycles delay between NMI & local reset, when OMODE=100b
100b = 4096 CPU/6 cycles delay between NMI & local reset, when OMODE=100b (default)
101b = 8192 CPU/6 cycles delay between NMI & local reset, when OMODE=100b
110b = 16384 CPU/6 cycles delay between NMI & local reset, when OMODE=100b
111b = 32768 CPU/6 cycles delay between NMI & local reset, when OMODE=100b
4
EVTSTAT
Event status
0 = No event received (Default)
1 = WD timer event received by Reset Mux block
3-1
OMODE
Timer event operation mode
000b = WD timer event input to the Reset Mux block does not cause any output event (default)
001b = Reserved
010b = WD Timer Event input to the Reset Mux block causes local reset input to CorePac
011b = WD Timer Event input to the Reset Mux block causes NMI input to CorePac
100b = WD Timer Event input to the Reset Mux block causes NMI input followed by local reset input to CorePac. Delay
between NMI and local reset is set in DELAY bit field.
101b = WD timer event input to the Reset Mux block causes device reset to C6670
110b = Reserved
111b = Reserved
0
LOCK
Lock register fields
0 = Register fields are not locked (default)
1 = Register fields are locked until the next timer reset
End of Table 3-19
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Multicore Fixed and Floating-Point System-on-Chip
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3.3.19 Device Speed (DEVSPEED) Register
The Device Speed Register shows the device speed grade. The Device Speed Register is shown below.
Figure 3-18
Device Speed Register (DEVSPEED)
31
23
22
0
DEVSPEED
Reserved
R-n
R-n
Legend: R = Read only; -n = value after reset
Table 3-20
Device Speed Register Field Descriptions
Bit
Field
Description
31-23
DEVSPEED
Indicates the speed of the device (read only)
0b0000 0000 0 = 800 MHz
0b0000 0000 1 = 1000 MHz
0b0000 0001 x = 1200 MHz
0b001x xxxx x = 1200 MHz
0b01xx xxxx x = 1000 MHz
0b1xxx xxxx x = 800 MHz
22-0
Reserved
Reserved. Read only
End of Table 3-20
84
Device Configuration
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Multicore Fixed and Floating-Point System-on-Chip
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3.4 Pullup/Pulldown Resistors
Proper board design should ensure that input pins to the device always be at a valid logic level and not floating. This
may be achieved via pullup/pulldown resistors. The device features internal pullup (IPU) and internal pulldown
(IPD) resistors on most pins to eliminate the need, unless otherwise noted, for external pullup/pulldown resistors.
An external pullup/pulldown resistor needs to be used in the following situations:
• Device Configuration Pins: If the pin is both routed out and are not driven (in Hi-Z state), an external
pullup/pulldown resistor must be used, even if the IPU/IPD matches the desired value/state.
• Other Input Pins: If the IPU/IPD does not match the desired value/state, use an external pullup/pulldown
resistor to pull the signal to the opposite rail.
For the device configuration pins (listed in Table 3-1), if they are both routed out and are not driven (in Hi-Z state),
it is strongly recommended that an external pullup/pulldown resistor be implemented. Although, internal
pullup/pulldown resistors exist on these pins and they may match the desired configuration value, providing
external connectivity can help ensure that valid logic levels are latched on these device configuration pins. In
addition, applying external pullup/pulldown resistors on the device configuration pins adds convenience to the user
in debugging and flexibility in switching operating modes.
Tips for choosing an external pullup/pulldown resistor:
• Consider the total amount of current that may pass through the pullup or pulldown resistor. Make sure to
include the leakage currents of all the devices connected to the net, as well as any internal pullup or pulldown
resistors.
• Decide a target value for the net. For a pulldown resistor, this should be below the lowest VIL level of all inputs
connected to the net. For a pullup resistor, this should be above the highest VIH level of all inputs on the net.
A reasonable choice would be to target the VOL or VOH levels for the logic family of the limiting device; which,
by definition, have margin to the VIL and VIH levels.
• Select a pullup/pulldown resistor with the largest possible value that can still ensure that the net will reach the
target pulled value when maximum current from all devices on the net is flowing through the resistor. The
current to be considered includes leakage current plus, any other internal and external pullup/pulldown
resistors on the net.
• For bidirectional nets, there is an additional consideration that sets a lower limit on the resistance value of the
external resistor. Verify that the resistance is small enough that the weakest output buffer can drive the net to
the opposite logic level (including margin).
• Remember to include tolerances when selecting the resistor value.
• For pullup resistors, also remember to include tolerances on the DVDD rail.
For most systems:
• A 1-kΩ resistor can be used to oppose the IPU/IPD while meeting the above criteria. Users should confirm this
resistor value is correct for their specific application.
• A 20-kΩ resistor can be used to compliment the IPU/IPD on the device configuration pins while meeting the
above criteria. Users should confirm this resistor value is correct for their specific application.
For more detailed information on input current (II), and the low-level/high-level input voltages (VIL and VIH) for
the TMS320C6670 device, see Section 6.3 ‘‘Electrical Characteristics’’ on page 107.
To determine which pins on the device include internal pullup/pulldown resistors, see Table 2-16 ‘‘Terminal
Functions — Power and Ground’’ on page 52.
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Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
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4 System Interconnect
On the TMS320C6670 device, the C66x CorePacs, the EDMA3 transfer controllers, and the system peripherals are
interconnected through the TeraNet, which is a non-blocking switch fabric enabling fast and contention-free
internal data movement. The TeraNet provides low-latency, concurrent data transfers between master peripherals
and slave peripherals. The TeraNet also allows for seamless arbitration between the system masters when accessing
system slaves.
4.1 Internal Buses and Switch Fabrics
Two types of buses exist in the device; data buses and configuration buses. Some peripherals have both a data bus
and a configuration bus interface, while others only have one type of interface. Furthermore, the bus interface width
and speed varies from peripheral to peripheral. Configuration buses are mainly used to access the register space of
a peripheral and the data buses are used mainly for data transfers.
The C66x CorePacs, the EDMA3 traffic controllers, and the various system peripherals can be classified into two
categories: masters and slaves. Masters are capable of initiating read and write transfers in the system and do not rely
on the EDMA3 for their data transfers. Slaves on the other hand rely on the masters to perform transfers to and from
them. Examples of masters include the EDMA3 traffic controllers, SRIO, and network coprocessor packet DMA.
2
Examples of slaves include the SPI, UART, and I C.
The masters and slaves in the device are communicating through the TeraNet (switch fabric). The device contains
two switch fabrics. The data switch fabric (data TeraNet) and the configuration switch fabric (configuration
TeraNet). The data TeraNet, is a high-throughput interconnect mainly used to move data across the system. The
data TeraNet connects masters to slaves via data buses. The configuration TeraNet, is mainly used to access
peripheral registers. The configuration TeraNet connects masters to slaves via configuration buses. Note that the
data TeraNet also connects to the configuration TeraNet. For more details see 4.2 ‘‘Switch Fabric Connections
Matrix’’ on page 87.
86
System Interconnect
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Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
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4.2 Switch Fabric Connections Matrix
The tables below list the master and slave end point connections.
Intersecting cells may contain one of the following:
• Y — There is a connection between this master and that slave.
• - — There is NO connection between this master and that slave.
• n — A numeric value indicates that the path between this master and that slave goes through bridge n.
Table 4-1
Switch Fabric Connection Matrix Section 1 (Part 1 of 2)
Boot_ROM
SPI
PCIe_Slave
QM_Slave
HyperLink_Slave
MSMC_SES
MSMC_SMS
STM
TETB_System
TETB0
TETB1
TETB2
TETB3
VCP2(0-4)
TCP3d
TCP_3e_w
TCP3e_r
TAC_BE
RAC_Slave
BCP_FFTCC_TCP3dC_S
1
1
1
1
1
1
1
-
Y
Y
-
-
-
-
-
-
Y
Y
Y
Y
-
-
-
Y
Y
Y
Y
-
-
-
Y
-
Y
Y
-
-
-
-
-
-
-
-
-
-
-
-
-
EDMA3CC0_TC0_RD
2
2
2
2
2
2
2
2
Y
Y
Y
-
Y
-
-
-
-
-
-
-
-
-
-
Y
EDMA3CC0_TC0_WR
2
2
2
2
-
2
2
2
Y
Y
Y
-
-
-
-
-
-
-
-
-
-
-
-
Y
EDMA3CC0_TC1_RD
3
3
3
3
3
3
3
-
Y
Y
Y
-
Y
-
-
-
-
-
-
-
-
-
-
Y
CorePac2_SDMA
1
BCP_FFTCC_TCP3dC
Master
CorePac1_SDMA
HyperLink_Master
Masters
CorePac0_SDMA
CorePac3_SDMA
Slave
EDMA3CC0_TC1_WR
3
3
3
3
-
3
3
-
Y
Y
Y
-
-
-
-
-
-
-
-
-
-
-
-
Y
EDMA3CC1_TC0_RD
Y
Y
Y
Y
Y
Y
Y
-
5
5
5
-
Y
-
-
-
-
-
-
-
-
-
Y
-
EDMA3CC1_TC0_WR
Y
Y
Y
Y
-
Y
Y
-
5
5
5
Y
-
-
-
-
-
-
-
-
-
-
Y
-
EDMA3CC1_TC1_RD
Y
Y
Y
Y
Y
Y
Y
Y
6
6
6
-
-
Y
Y
-
-
-
-
-
-
-
Y
-
EDMA3CC1_TC1_WR
Y
Y
Y
Y
-
Y
Y
Y
6
6
6
-
-
-
-
-
-
-
-
-
-
-
Y
-
EDMA3CC1_TC2_RD
Y
Y
Y
Y
Y
Y
Y
-
7
7
7
-
-
-
-
Y
Y
-
-
-
-
Y
-
-
EDMA3CC1_TC2_WR
Y
Y
Y
Y
-
Y
Y
-
7
7
7
-
-
-
-
-
-
-
-
-
-
Y
-
-
EDMA3CC1_TC3_RD
Y
Y
Y
Y
Y
Y
Y
-
8
8
8
-
Y
-
-
-
-
-
-
-
-
Y
-
-
EDMA3CC1_TC3_WR
Y
Y
Y
Y
-
Y
Y
-
8
8
8
Y
-
-
-
-
-
-
-
-
-
Y
-
-
EDMA3CC2_TC0_RD
Y
Y
Y
Y
Y
Y
Y
-
9
9
9
-
Y
-
-
-
-
Y
Y
Y
Y
-
-
Y
EDMA3CC2_TC0_WR
Y
Y
Y
Y
-
Y
Y
-
9
9
9
Y
-
-
-
-
-
Y
Y
Y
Y
-
-
Y
EDMA3CC2_TC1_RD
Y
Y
Y
Y
Y
Y
Y
Y
10
10
10
-
-
Y
Y
-
-
Y
Y
Y
Y
-
-
Y
EDMA3CC2_TC1_WR
Y
Y
Y
Y
-
Y
Y
Y
10
10
10
-
-
-
-
-
-
Y
Y
Y
Y
-
-
Y
EDMA3CC2_TC2_RD
Y
Y
Y
Y
Y
Y
Y
-
5
5
5
-
Y
-
-
-
-
Y
Y
-
-
-
-
Y
EDMA3CC2_TC2_WR
Y
Y
Y
Y
-
Y
Y
-
5
5
5
Y
-
-
-
-
-
Y
Y
-
-
-
-
Y
EDMA3CC2_TC3_RD
Y
Y
Y
Y
Y
Y
Y
-
6
6
6
-
-
-
-
Y
Y
Y
-
Y
Y
-
-
Y
EDMA3CC2_TC3_WR
Y
Y
Y
Y
-
Y
Y
-
6
6
6
-
-
-
-
-
-
Y
-
Y
Y
-
-
Y
SRIO Packet DMA
Y
Y
Y
Y
-
-
-
Y
-
9
9
-
-
-
-
-
-
-
-
-
-
-
-
-
SRIO_Master
Y
Y
Y
Y
-
Y
-
Y
7
7
7
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
PCIe_Master
Y
Y
Y
Y
-
Y
-
Y
7
7
7
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Network Coprocessor
Packet DMA
Y
Y
Y
Y
-
-
-
Y
-
10
10
-
-
-
-
-
-
-
-
-
-
-
-
-
MSMC_Data_Master
4
4
4
4
4
4
4
4
Y
-
-
Y
-
-
-
-
-
Y
Y
Y
Y
Y
Y
Y
QM_SS_Master
Y
Y
Y
Y
-
-
-
Y
8
8
8
-
-
-
-
-
-
-
-
-
-
-
-
-
QM_SS_Second
Y
Y
Y
Y
-
-
-
-
8
8
8
-
-
-
-
-
-
-
-
-
-
-
-
-
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Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
Table 4-1
www.ti.com
Switch Fabric Connection Matrix Section 1 (Part 2 of 2)
Masters
CorePac0_SDMA
CorePac1_SDMA
CorePac2_SDMA
CorePac3_SDMA
Boot_ROM
SPI
PCIe_Slave
QM_Slave
HyperLink_Slave
MSMC_SES
MSMC_SMS
STM
TETB_System
TETB0
TETB1
TETB2
TETB3
VCP2(0-4)
TCP3d
TCP_3e_w
TCP3e_r
TAC_BE
RAC_Slave
BCP_FFTCC_TCP3dC_S
Slave
DebugSS_Master
Y
Y
Y
Y
Y
Y
Y
Y
10
10
10
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
FFTC
Y
Y
Y
Y
-
-
-
Y
6
6
6
-
-
-
-
-
-
-
-
-
-
-
-
-
RAC_BE0
Y
Y
Y
Y
-
-
-
-
7
7
7
-
-
-
-
-
-
-
-
-
-
-
-
-
RAC_BE1
Y
Y
Y
Y
-
-
-
-
8
8
8
-
-
-
-
-
-
-
-
-
-
-
-
-
AIF_Master
Y
Y
Y
Y
-
-
-
Y
7
7
7
-
-
-
-
-
-
-
-
-
-
Y
Y
-
TAC_FE
Y
Y
Y
Y
-
-
-
-
9
9
9
-
-
-
-
-
-
-
-
-
-
-
-
-
CorePac0_CFG
-
-
-
-
-
-
-
-
-
-
-
-
Y
Y
Y
Y
Y
-
-
-
-
-
-
-
CorePac1_CFG
-
-
-
-
-
-
-
-
-
-
-
-
Y
Y
Y
Y
Y
-
-
-
-
-
-
-
CorePac2_CFG
-
-
-
-
-
-
-
-
-
-
-
-
Y
Y
Y
Y
Y
-
-
-
-
-
-
-
CorePac3_CFG
-
-
-
-
-
-
-
-
-
-
-
-
Y
Y
Y
Y
Y
-
-
-
-
-
-
-
Tracer_Master
-
-
-
-
-
-
-
-
-
-
-
Y
-
-
-
-
-
-
-
-
-
-
-
-
End of Table 4-1
Table 4-2
Switch Fabric Connection Matrix Section 2 (Part 1 of 2)
EDMA3CC1
EDMA3CC2
EDMA3CC0_TC(0-1)
EDMA3CC1_TC(0-3)
EDMA3CC2_TC(0-3)
Semaphore
QM_SS_CFG
CP Tracer(0~15/16)
NETCP_CFG
SRIO_CFG
Timer
GPIO
I C
SEC_CTL
SEC_Key_MGR
Boot_CFG
GPSC
PLL_CTL
CP_CIC
MPU
Debug_SS_CFG
SR_MMR
HyperLink_Master
1,
12
1,
12
1,
12
1,
12
1,
12
1,
12
1,
12
1,
12
1,
12
1,
12
1,
12
1,
12
1,
12
1,
12
1,
12
1,
12
1,
12
1,
12
1,
12
1,
12
1,
12
1,
12
1,
12
BCP_FFTCC_TCP3dC
Master
Y
Y
Y
Y
Y
Y
Y
Y
-
Y
Y
Y
Y
Y
-
-
-
-
-
Y
Y
Y
-
EDMA3CC0_TC0_RD
2,
12
2,
12
2,
12
2,
12
2,
12
2,
12
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
EDMA3CC0_TC0_WR
2,
12
2,
12
2,
12
2,
12
2,
12
2,
12
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
EDMA3CC0_TC1_RD
3,
12
3,
12
3,
12
3,
12
3,
12
3,
12
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
EDMA3CC0_TC1_WR
3,
12
3,
12
3,
12
3,
12
3,
12
3,
12
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
EDMA3CC1_TC0_RD
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
EDMA3CC1_TC0_WR
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
EDMA3CC1_TC1_RD
13
13
13
13
13
13
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
EDMA3CC1_TC1_WR
13
13
13
13
13
13
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
EDMA3CC1_TC2_RD
14
14
14
14
14
14
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
EDMA3CC1_TC2_WR
14
14
14
14
14
14
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
EDMA3CC1_TC3_RD
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
Masters
88
System Interconnect
2
EDMA3CC0
Slave
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Multicore Fixed and Floating-Point System-on-Chip
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Table 4-2
Switch Fabric Connection Matrix Section 2 (Part 2 of 2)
EDMA3CC1
EDMA3CC2
EDMA3CC0_TC(0-1)
EDMA3CC1_TC(0-3)
EDMA3CC2_TC(0-3)
Semaphore
QM_SS_CFG
CP Tracer(0~15/16)
NETCP_CFG
SRIO_CFG
Timer
GPIO
I C
SEC_CTL
SEC_Key_MGR
Boot_CFG
GPSC
PLL_CTL
CP_CIC
MPU
Debug_SS_CFG
SR_MMR
EDMA3CC1_TC3_WR
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
EDMA3CC2_TC0_RD
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
EDMA3CC2_TC0_WR
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
Masters
2
EDMA3CC0
Slave
EDMA3CC2_TC1_RD
13
13
13
13
13
13
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
EDMA3CC2_TC1_WR
13
13
13
13
13
13
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
EDMA3CC2_TC2_RD
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
EDMA3CC2_TC2_WR
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
EDMA3CC2_TC3_RD
14
14
14
14
14
14
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
EDMA3CC2_TC3_WR
14
14
14
14
14
14
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
SRIO Packet DMA
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
SRIO_M
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
PCIe_Master
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
Network Coprocessor
Packet DMA
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
MSMC_Data_Master
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
QM_SS Packet DMA
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
QM_SS Second
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
DebugSS_Master
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
12
FFTC
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
RAC_BE0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
RAC_BE1
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
AIF_Master
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
TAC_FE
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
EDMA3CC0
-
-
-
Y
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
EDMA3CC1
-
-
-
-
Y
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
EDMA3CC2
-
-
-
-
-
Y
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
CorePac0_CFG
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
CorePac1_CFG
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
CorePac2_CFG
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
CorePac3_CFG
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
End of Table 4-2
Table 4-3
Switch Fabric Connection Matrix Section 3 (Part 1 of 2)
Slave
Masters
HyperLink_Master
RAC_CFG
FFTC_CFG
TAC_CFG
TCP3e_CFG
TCP3d_CFG
VCP2_CFG
AIF2_CFG
UART_CFG
1, 12
Y
1, 12
1, 12
1, 12
1, 12
Y
Y
BCP_FFTCC_TCP3dC
Master
Y
Y
Y
Y
Y
Y
Y
Y
EDMA3CC0_TC0_RD
-
-
-
-
-
-
-
-
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Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
Table 4-3
www.ti.com
Switch Fabric Connection Matrix Section 3 (Part 2 of 2)
Slave
Masters
RAC_CFG
FFTC_CFG
TAC_CFG
TCP3e_CFG
TCP3d_CFG
VCP2_CFG
AIF2_CFG
UART_CFG
EDMA3CC0_TC0_WR
-
-
-
-
-
-
-
-
EDMA3CC0_TC1_RD
-
-
-
-
-
-
-
-
EDMA3CC0_TC1_WR
-
-
-
-
-
-
-
-
EDMA3CC1_TC0_RD
12
Y
12
12
12
12
Y
Y
EDMA3CC1_TC0_WR
12
Y
12
12
12
12
Y
Y
EDMA3CC1_TC1_RD
-
-
-
-
-
-
-
-
EDMA3CC1_TC1_WR
-
-
-
-
-
-
-
-
EDMA3CC1_TC2_RD
-
-
-
-
-
-
-
-
EDMA3CC1_TC2_WR
-
-
-
-
-
-
-
-
EDMA3CC1_TC3_RD
12
Y
12
12
12
12
Y
Y
EDMA3CC1_TC3_WR
12
Y
12
12
12
12
Y
Y
EDMA3CC2_TC0_RD
12
Y
12
12
12
12
Y
Y
EDMA3CC2_TC0_WR
12
Y
12
12
12
12
Y
Y
EDMA3CC2_TC1_RD
-
-
-
-
-
-
-
-
EDMA3CC2_TC1_WR
-
-
-
-
-
-
-
-
EDMA3CC2_TC2_RD
12
Y
12
12
12
12
Y
Y
EDMA3CC2_TC2_WR
12
Y
12
12
12
12
Y
Y
EDMA3CC2_TC3_RD
-
-
-
-
-
-
-
-
EDMA3CC2_TC3_WR
-
-
-
-
-
-
-
-
SRIO Packet DMA
-
-
-
-
-
-
-
-
SRIO_M
12
Y
12
12
12
12
Y
Y
PCIe_Master
12
Y
12
12
12
12
Y
Y
-
-
-
-
-
-
-
-
Network Coprocessor
Packet DMA
MSMC_Data_Master
-
-
-
-
-
-
-
-
QM_SS Packet DMA
-
-
-
-
-
-
-
-
QM_SS Second
DebugSS_Master
-
-
-
-
-
-
-
-
12
Y
12
12
12
12
Y
Y
FFTC
-
-
-
-
-
-
-
-
RAC_BE0
-
-
-
-
-
-
-
-
RAC_BE1
-
-
-
-
-
-
-
-
AIF_Master
-
-
-
-
-
-
-
-
TAC_FE
-
-
-
-
-
-
-
-
EDMA3CC0
-
-
-
-
-
-
-
-
EDMA3CC1
-
-
-
-
-
-
-
-
EDMA3CC2
-
-
-
-
-
-
-
-
CorePac0_CFG
Y
Y
Y
Y
Y
Y
Y
Y
CorePac1_CFG
Y
Y
Y
Y
Y
Y
Y
Y
CorePac2_CFG
Y
Y
Y
Y
Y
Y
Y
Y
CorePac3_CFG
Y
Y
Y
Y
Y
Y
Y
Y
End of Table 4-3
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Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
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4.3 TeraNet Switch Fabric Connections
The figures below show the connections between masters and slaves through various sections of the TeraNet.
Figure 4-1
TeraNet 3A
Tracer_L2_0
Bridge_1
Tracer_L2_1
Bridge_2
From TeraNet_2_A
Tracer_L2_2
Bridge_3
Tracer_L2_3
Bridge_4
Tracer_TAC
MPU_1
Tracer_QM_M
SRIO_M
M
SRIO
Packet DMA
M
NETCP
M
QM_SS
Packet DMA
M
QM_SS
Second
M
Debug_SS
M
FFTC_B
Packet DMA
M
FFTC_A
Packet DMA
M
RAC_A_BE1
M
RAC_A_BE0
M
RAC_B_BE1
M
RAC_B_BE0
M
TAC_FE
M
AIF/DMA
M
TC_0
M
M
M
M
EDMA
CC1
TC_1
TC_2
TC_3
TC_0
EDMA
CC2
TC_1
TC_2
TC_3
TNet_3_F
CPU/3
TNet_3_H
CPU/3
TNet_3_D
CPU/3
M
M
M
M
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CPU/3
M
TeraNet 3_A
PCIe
TNet_3_B
CPU/3
Tracer
_RAC
TNet_3_G
CPU/3
TNet_3_E
CPU/3
TNet_6P_A
CPU/3
S
CorePac_0
S
CorePac_1
S
CorePac_2
S
CorePac_3
S
TAC_BE
S
QM_SS
S
TCP3e_r
S
TCP3e_w
S
PCIe
S
VCP2
S
VCP2
S
VCP2
S
VCP2
S
SRIO
S
RAC_A_FE
S
RAC_B_FE
S
TCP3d_A
S
TCP3d_B
S
SPI
S
Boot_ROM
Bridge_5
Bridge_6
Bridge_7
To TeraNet_2_A
Bridge_8
Bridge_9
Bridge_10
Bridge_12
To TeraNet_3P_A
Bridge_13
Bridge_14
System Interconnect
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Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
Figure 4-2
www.ti.com
TeraNet 2A
From TeraNet 2M
M
Bridge_5
Bridge_6
Bridge_7
CPU/2
´4
XMC
S
SES
S
SMS
M
S
MSMC
M
DDR3
Tracer_MSMC0
Tracer_MSMC1
From TeraNet_3_A
Bridge_8
Bridge_9
Bridge_10
HyperLink
M
TC_0
M
M
EDMA
CC0
TC_1
TeraNet 2_A
Tracer_MSMC2
Tracer_MSMC3
Tracer_DDR
S
HyperLink
S
To TeraNet 2A
Bridge_1
Bridge_2
To TeraNet_3_A
Bridge_3
Bridge_4
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M
BCP_
Packet DMA
M
BCP_DIO0
M
BCP_DIO1
M
From TeraNet 2A
TeraNet 3M
CPU/3
FFTC_
Packet DMA
TeraNet 2M
CPU/3
TeraNet 3P and 3M and 2M
M
MPU
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TeraNet 3P
CPU/3
Figure 4-3
S
To TeraNet 2A
S
TCP3d_DMA
S
MPU_CFG
S
TCP3D_CFG
S
FFTC_CFG
S
BCP_CFG
System Interconnect
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TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
Figure 4-4
www.ti.com
TeraNet 3P_A
S
MPUn*
S
TC (× 2)
S
CC0
S
TC (× 4)
S
CC1
S
TC (× 4)
S
CC2
MPU_2
S
QM_SS
MPU_3
S
Semaphore
Bridge_12
Bridge_14
CorePac_0
M
CorePac_1
M
CorePac_2
CorePac_3
M
M
TNet_2P
CPU/2
CPU/3
From TeraNet_3_A
TeraNet 3P_A
Bridge_13
TNet_3P_C
CPU/3
TNet_3P_D
CPU/3
Tracer_QM_CFG
Tracer_SM
TETB (Debug_SS)
TETB (core) (× 4)
TNet_3P_H
CPU/3
MPU_4
S
RAC_A_CFG
S
RAC_B_CFG
Tracer_RAC_CFG
To TeraNet_3P_Tracer
MPU_0
To TeraNet_3P_B
Tracer_CFG
* n indicates the number of MPUs present in the specific device.
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Figure 4-5
TeraNet 3P_B
TeraNet 3P_B
CPU/3
From TeraNet_3P_A
TNet_3P_E
CPU/3
TNet_3P_F
CPU/3
TNet_3P_G
CPU/3
S
Tracer
(×11 / ×12)
S
SRIO
S
NETCP
S
VCP2
S
VCP2
S
VCP2
S
VCP2
S
AIF2
S
TCP3d_A
S
TCP3d_B
S
TCP3e
S
TAC
S
FFTC_A
S
FFTC_B
To TeraNet_6P_B
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Bridge_20
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Figure 4-6
www.ti.com
TeraNet 6P_B and 3P_Tracer
M
Tracer_
MSMC_1
M
Tracer_
MSMC_2
M
Tracer_
MSMC_3
M
Tracer_CFG
M
Tracer_DDR
M
Tracer_SM
M
Tracer_
QM_M
M
Tracer_
QM_P
M
Tracer_L2_
0 to 3
M
Tracer_RAC
M
Tracer_TAC
M
Tracer_
RAC_CFG
M
Bridge_20
From TeraNet_3P_B
96
System Interconnect
TeraNet 6P_B
CPU/6
Tracer_
MSMC_0
TeraNet 3P_Tracer CPU/3
From TeraNet_3P_A
S
Debug_SS
STM
S
Debug_SS
TETB
S
SmartReflex
S
GPIO
S
IC
S
UART
S
BOOTCFG
S
PSC
S
PLL_CTL
S
Debug_SS
S
CIC (×3 / ×4)
S
Timer (× 8)
2
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4.4 Bus Priorities
The priority level of all master peripheral traffic is defined at the TeraNet boundary. User programmable priority
registers will be present to allow software configuration of the data traffic through the TeraNet. Note that a lower
number means higher priority - PRI = 000b = urgent, PRI = 111b = low.
All other masters provide their priority directly and do not need a default priority setting. Examples include the
CorePacs, whose priorities are set through software in the UMC control registers. All the Packet DMA based
peripherals also have internal registers to define the priority level of their initiated transactions.
The Packet DMA secondary port is one master port that does not have priority allocation register inside the IP. The
priority level for transaction from this master port is described by PKTDMA_PRI_ALLOC register in Figure 4-7 and
Table 4-4.
Figure 4-7
Packed DMA Priority Allocation Register (PKTDMA_PRI_ALLOC)
31
3
2
0
Reserved
PKTDMA_PRI
R/W-00000000000000000000001000011
RW-000
Legend: R = Read only; R/W = Read/Write; -n = value after reset
Table 4-4
Packed DMA Priority Allocation Register Field Descriptions
Bit
Field
Description
31-3
Reserved
Reserved.
2-0
PKDTDMA_PRI
Control the priority level for the transactions from packet DMA master port, which access the external linking RAM.
End of Table 4-4
For all other modules, see the respective User Guides in 2.9 ‘‘Related Documentation from Texas Instruments’’ on
page 66 for programmable priority registers.
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5 C66x CorePac
The C66x CorePac consists of several components:
• The C66x DSP core
• Level-one and level-two memories (L1P, L1D, L2)
• RSA accelerator (on cores 1 and 2 only)
• Data Trace Formatter (DTF)
• Embedded Trace Buffer (ETB)
• Interrupt controller
• Power-down controller
• External memory controller
• Extended memory controller
• A dedicated power/sleep controller (LPSC)
The C66x CorePac also provides support for memory protection and bandwidth management (for resources local
to the CorePac). Figure 5-1 shows a block diagram of the C66x CorePac.
Figure 5-1
C66x CorePac Block Diagram
C66x DSP Core
Interrupt and Exception Controller
Instruction Fetch
16-/32-bit Instruction Dispatch
Control Registers
In-Circuit Emulation
Instruction Decode
Data Path B
Data Path A
PLLC
LPSC
A Register File
B Register File
A31-A16
A15-A0
B31-B16
B15-B0
.M1
xx
xx
.M2
xx
xx
GPSC
.L1
.S1
.D1
.D2
.S2
.L2
Data Memory Controller (DMC) With
Memory Protect/Bandwidth Mgmt
RSA
Cores 1 & 2
only
98
C66x CorePac
32KB L1D
L2 Cache/
SRAM
1024KB
MSM
SRAM
2048KB
DDR3
SRAM
DMA Switch
Fabric
External Memory
Controller (EMC)
Boot
Controller
Extended Memory
Controller (XMC)
Memory Controller (PMC) With
Memory Protect/Bandwidth Mgmt
Unified Memory
Controller (UMC)
32KB L1P
CFG Switch
Fabric
RSA
Cores 1 & 2
only
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For more detailed information on the C66x CorePac in the C6670 device, see the C66x CorePac User Guide in
2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66.
5.1 Memory Architecture
Each CorePac of the TMS320C6670 device contains a 1024KB level-2 memory (L2), a 32KB level-1 program
memory (L1P), and a 32KB level-1 data memory (L1D). The device also contain a 2048KB multicore shared memory
(MSM). All memory on the C6670 has a unique location in the memory map (see Table 2-2 ‘‘Memory Map
Summary’’ on page 21.
After device reset, L1P and L1D cache are configured as all cache, by default. The L1P and L1D cache can be
reconfigured via software through the L1PMODE field of the L1P Configuration Register (L1PMODE) and the
L1DMODE field of the L1D Configuration Register (L1DCFG) of the C66x CorePac. L1D is a two-way
set-associative cache, while L1P is a direct-mapped cache.
The on-chip bootloader changes the reset configuration for L1P and L1D. For more information, see the Bootloader
for the C66x DSP User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66.
For more information on the operation L1 and L2 caches, see the C66x DSP Cache User Guide in 2.9 ‘‘Related
Documentation from Texas Instruments’’ on page 66.
5.1.1 L1P Memory
The L1P memory configuration for the C6670 device is as follows:
• Region 0 size is 0K bytes (disabled)
• Region 1 size is 32K bytes with no wait states
Figure 5-2 shows the available SRAM/cache configurations for L1P.
Figure 5-2
L1P Memory Configurations
L1P Mode Bits
000
001
010
Block Base
Address
011
100
L1P Memory
00E0 0000h
1/2
SRAM
All
SRAM
7/8
SRAM
16K bytes
3/4
SRAM
Direct
Mapped
Cache
00E0 4000h
8K bytes
DM
Cache
Direct
Mapped
Cache
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Direct
Mapped
Cache
00E0 6000h
4K bytes
00E0 7000h
4K bytes
00E0 8000h
C66x CorePac
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5.1.2 L1D Memory
The L1D memory configuration for the C6670 device is as follows:
• Region 0 size is 0K bytes (disabled)
• Region 1 size is 32K bytes with no wait states
Figure 5-3 shows the available SRAM/cache configurations for L1D.
Figure 5-3
L1D Memory Configurations
L1D Mode Bits
000
001
010
011
100
L1D Memory
Block Base
Address
00F0 0000h
1/2
SRAM
All
SRAM
7/8
SRAM
16K bytes
3/4
SRAM
2-Way
Cache
00F0 4000h
8K bytes
2-Way
Cache
2-Way
Cache
100
C66x CorePac
2-Way
Cache
00F0 6000h
4K bytes
00F0 7000h
4K bytes
00F0 8000h
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5.1.3 L2 Memory
The L2 memory configuration for the C6670 device is as follows:
• Total memory size is 4096KB
• Each CorePac contains 1024KB of memory
• Local starting address for each CorePac is 0080 0000h
L2 memory can be configured as all SRAM, all 4-way set-associative cache, or a mix of the two. The amount of L2
memory that is configured as cache is controlled through the L2MODE field of the L2 Configuration Register
(L2CFG) of the C66x CorePac. Figure 5-4 shows the available SRAM/cache configurations for L2. By default, L2 is
configured as all SRAM after device reset.
Figure 5-4
L2 Memory Configurations
L2 Mode Bits
000
001
010
011
100
101
110
L2 Memory
Block Base
Address
0080 0000h
1/2
SRAM
512K bytes
3/4
SRAM
ALL
SRAM
31/32
SRAM
15/16
SRAM
7/8
SRAM
4-Way
Cache
0088 0000h
256K bytes
4-Way
Cache
008C 0000h
128K bytes
4-Way
Cache
4-Way
Cache
4-Way
Cache
4-Way
Cache
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008E 0000h
64K bytes
32K bytes
32K bytes
008F 0000h
008F 8000h
008F FFFFh
C66x CorePac
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Global addresses that are accessible to all masters in the system are in all memory local to the processors. In addition,
local memory can be accessed directly by the associated processor through aliased addresses, where the eight MSBs
are masked to 0. The aliasing is handled within the CorePac and allows for common code to be run unmodified on
multiple cores. For example, address location 0x10800000 is the global base address for CorePac0's L2 memory.
CorePac0 can access this location by either using 0x10800000 or 0x00800000. Any other master on the device must
use 0x10800000 only. Conversely, 0x00800000 can by used by any of the four CorePacs as their own L2 base
addresses. For CorePac0, as mentioned, this is equivalent to 0x10800000, for CorePac1 this is equivalent to
0x11800000, and for CorePac2 this is equivalent to 0x12800000. Local addresses should be used only for shared code
or data, allowing a single image to be included in memory. Any code/data targeted to a specific core, or a memory
region allocated during run-time by a particular CorePac should always use the global address only.
5.1.4 MSM SRAM
The MSM SRAM configuration for the C6670 device is as follows:
• Memory size is 2048KB
• The MSM can be configured as shared L2 or shared L3 memory
• Allows extension of external addresses from 2GB to up to 8GB
• Has built in memory protection features
The MSM SRAM is always configured as all SRAM. When configured as a shared L2, its contents can be cached in
L1P and L1D. When configured in shared L3 mode, it’s contents can be cached in L2 also. For more details on
external memory address extension and memory protection features, see the Multicore Shared Memory Controller
(MSMC) for KeyStone Devices User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66.
5.1.5 L3 Memory
The L3 ROM on the device is 128KB. The ROM contains software used to boot the device. There is no requirement
to block accesses from this portion to the ROM.
5.2 Memory Protection
Memory protection allows an operating system to define who or what is authorized to access L1D, L1P, and L2
memory. To accomplish this, the L1D, L1P, and L2 memories are divided into pages. There are 16 pages of L1P (2KB
each), 16 pages of L1D (2KB each), and 32 pages of L2 (32KB each). The L1D, L1P, and L2 memory controllers in
the C66x CorePac are equipped with a set of registers that specify the permissions for each memory page.
Each page may be assigned with fully orthogonal user and supervisor read, write, and execute permissions. In
addition, a page may be marked as either (or both) locally accessible or globally accessible. A local access is a direct
DSP access to L1D, L1P, and L2, while a global access is initiated by a DMA (either IDMA or the EDMA3) or by
other system masters. Note that EDMA or IDMA transfers programmed by the DSP count as global accesses. On a
secure device, pages can be restricted to secure access only (default) or opened up for public, non-secure access.
The DSP and each of the system masters on the device are all assigned a privilege ID. It is only possible to specify
whether memory pages are locally or globally accessible.
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The AIDx and LOCAL bits of the memory protection page attribute registers specify the memory page protection
scheme, see Table 5-1.
Table 5-1
AIDx
(1)
Bit
0
Available Memory Page Protection Schemes
Local Bit
Description
0
No access to memory page is permitted.
0
1
Only direct access by DSP is permitted.
1
0
Only accesses by system masters and IDMA are permitted (includes EDMA and IDMA accesses initiated by the DSP).
1
1
All accesses permitted.
End of Table 5-1
1 x = 0, 1, 2, 3, 4, 5
Faults are handled by software in an interrupt (or an exception, programmable within the CorePac interrupt
controller) service routine. A DSP or DMA access to a page without the proper permissions will:
• Block the access — reads return 0, writes are ignored
• Capture the initiator in a status register — ID, address, and access type are stored
• Signal event to DSP interrupt controller
The software is responsible for taking corrective action to respond to the event and resetting the error status in the
memory controller. For more information on memory protection for L1D, L1P, and L2, see the C66x CorePac User
Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66.
5.3 Bandwidth Management
When multiple requestors contend for a single C66x CorePac resource, the conflict is resolved by granting access to
the highest priority requestor. The following four resources are managed by the Bandwidth Management control
hardware:
• Level 1 Program (L1P) SRAM/Cache
• Level 1 Data (L1D) SRAM/Cache
• Level 2 (L2) SRAM/Cache
• Memory-mapped registers configuration bus
The priority level for operations initiated within the C66x CorePac are declared through registers in the CorePac.
These operations are:
• DSP-initiated transfers
• User-programmed cache coherency operations
• IDMA-initiated transfers
The priority level for operations initiated outside the CorePac by system peripherals is declared through the Priority
Allocation Register (PRI_ALLOC), see Section 4.4 ‘‘Bus Priorities’’ on page 97. System peripherals with no fields
in PRI_ALLOC have their own registers to program their priorities.
More information on the bandwidth management features of the CorePac can be found in the C66x CorePac
Reference Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66.
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5.4 Power-Down Control
The C66x CorePac supports the ability to power-down various parts of the CorePac. The power-down controller
(PDC) of the CorePac can be used to power down L1P, the cache control hardware, the DSP, and the entire CorePac.
These power-down features can be used to design systems for lower overall system power requirements.
Note—The C6670 does not support power-down modes for the L2 memory at this time.
More information on the power-down features of the C66x CorePac can be found in the C66x CorePac Reference
Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66
5.5 CorePac Revision
The version and revision of the C66x CorePac can be read from the CorePac Revision ID Register (MM_REVID)
located at address 0181 2000h. The MM_REVID register is shown in Table 5-2 and described in Table 5-2. The C66x
CorePac revision is dependant on the silicon revision being used.
Figure 5-5
CorePac Revision ID Register (MM_REVID)
31
16
15
0
VERSION
REVISION
R-n
R-n
Legend: R = Read only; R/W = Read/Write; -n = value after reset
Table 5-2
CorePac Revision ID Register (MM_REVID) Field Descriptions
Bit
Name
Value
Description
31-16
VERSION
xxxxh
Version of the C66x CorePac implemented on the device will depend on the silicon being used.
15-0
REVISION
0000h
Revision of the C66x CorePac version implemented on this device.
End of Table 5-2
5.6 C66x CorePac Register Descriptions
See the C66x CorePac User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66 for register
offsets and definitions.
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6 Device Operating Conditions
6.1 Absolute Maximum Ratings
Table 6-1
Absolute Maximum Ratings (1)
Over Operating Case Temperature Range (Unless Otherwise Noted)
Supply voltage range (2):
CVDD
-0.3 V to 1.3 V
CVDD1
-0.3 V to 1.3 V
DVDD15
-0.3 V to 2.45 V
DVDD18
-0.3 V to 2.45 V
VREFSSTL
0.49 × DVDD15 to 0.51 × DVDD15
VDDT1, VDDT2, VDDT3
-0.3 V to 1.3 V
VDDR1, VDDR2, VDDR3
-0.3 V to 2.45 V
VDDR4, VDDR5, VDDR6
AVDDA1, AVDDA2, AVDDA3
-0.3 V to 2.45 V
VSS Ground
0V
LVCMOS (1.8 V)
-0.3 V to DVDD18+0.3 V
DDR3
-0.3 V to 2.45 V
2
Input voltage (VI) range:
IC
-0.3 V to 2.45 V
LVDS
-0.3 V to DVDD18+0.3 V
LJCB
-0.3 V to 1.3 V
SerDes
-0.3 V to CVDD1+0.3 V
LVCMOS (1.8 V)
Output voltage (VO) range:
-0.3 V to DVDD18+0.3 V
DDR3
-0.3 V to 2.45 V
I2C
-0.3 V to 2.45 V
SerDes
Operating case temperature range, TC:
ESD stress voltage, VESD (3)
-0.3 V to CVDD1+0.3 V
Commercial
0°C to 100°C
Extended
HBM (human body model)
-40°C to 100°C
(4)
CDM (charged device model)
±1000 V
(5)
±250 V
LVCMOS (1.8 V)
Overshoot/undershoot
(6)
DDR3
2
20% overshoot/undershoot for 20% of
signal duty cycle
IC
Storage temperature range, Tstg:
-65°C to 150°C
End of Table 6-1
1 Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the
device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions
for extended periods may affect device reliability.
2 All voltage values are with respect to VSS.
3 Electrostatic discharge (ESD) to measure device sensitivity/immunity to damage caused by electrostatic discharges into the device.
4 Level listed above is the passing level per ANSI/ESDA/JEDEC JS-001-2010. JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD
control process, and manufacturing with less than 500 V HBM is possible if necessary precautions are taken. Pins listed as 1000 V may actually have higher performance.
5 Level listed above is the passing level per EIA-JEDEC JESD22-C101E. JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control
process. Pins listed as 250 V may actually have higher performance.
6 Overshoot/Undershoot percentage relative to I/O operating values - for example the maximum overshoot value for 1.8V LVCMOS signals is DVDD18 + 0.20 × DVDD18 and
maximum undershoot value would be VSS - 0.20 × DVDD18
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6.2 Recommended Operating Conditions
Recommended Operating Conditions (1)
Table 6-2
CVDD
SR core supply
CVDD1
Core supply
(2)
Min
Nom
SRVnom*0.95 (3)
0.9-1.1
SRVnom*1.05
Max Unit
V
0.95
1
1.05
V
DVDD18
1.8-V supply I/O voltage
1.71
1.8
1.89
V
DVDD15
1.5-V supply I/O voltage
1.425
1.5
1.575
V
VREFSSTL
DDR3 reference voltage
0.49 × DVDD15
0.5 × DVDD15
0.51 × DVDD15
V
SerDes regulator supply
1.425
1.5
1.575
V
VDDRx
(4)
VDDAx
PLL analog supply
1.71
1.8
1.89
V
VDDTx
SerDes termination supply
0.95
1
1.05
V
VSS
Ground
0
0
0
V
LVCMOS (1.8 V)
VIH
High-level input voltage
2
IC
DDR3 EMIF
0.65 × DVDD18
V
0.7 × DVDD18
V
VREFSSTL + 0.1
V
LVCMOS (1.8 V)
VIL
Low-level input voltage
DDR3 EMIF
-0.3
2
IC
TC
Operating case temperature
Commercial
Extended
0.35 × DVDD18
V
VREFSSTL - 0.1
V
0.3 × DVDD18
V
0
100
°C
-40
100
°C
End of Table 6-2
1 All differential clock inputs comply with the LVDS Electrical Specification, IEEE 1596.3-1996 and all SerDes I/Os comply with the XAUI Electrical Specification, IEEE
802.3ae-2002.
2 All SerDes I/Os comply with the XAUI Electrical Specification, IEEE 802.3ae-2002.
3 SRVnom refers to the unique SmartReflex core supply voltage between 0.9 V and 1.1 V set from the factory for each individual device.
4 Where x = 1, 2, 3, 4... to indicate all supplies of the same kind.
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6.3 Electrical Characteristics
Table 6-3
Electrical Characteristics
Over Recommended Ranges of Supply Voltage and Operating Case Temperature (Unless Otherwise Noted)
Parameter
LVCMOS (1.8 V)
VOH
High-level output voltage
Test Conditions
(1)
IO = IOH
DDR3
Min
Typ
Max Unit
DVDD18 - 0.45
DVDD15 - 0.4
V
2 (2)
IC
LVCMOS (1.8 V)
VOL
Low-level output voltage
0.45
DDR3
2
II (3)
IO = IOL
0.4
IC
IO = 3 mA, pulled up to 1.8 V
No IPD/IPU
-5
LVCMOS (1.8 V)
Internal pullup
50
100
170
-170
-100
-50
I2 C
0.1 × DVDD18 V < VI < 0.9 ×
DVDD18 V
Input current [DC]
Internal pulldown
-10
LVCMOS (1.8 V)
IOH
V
0.4
5
10
μA
μA
-6
High-level output current [DC] DDR3
-8
mA
2 (4)
IC
IOL
Low-level output current [DC]
LVCMOS (1.8 V)
6
DDR3
8
2
IC
IOZ
(5)
Off-state output current [DC]
3
LVCMOS (1.8 V)
-2
2
DDR3
-2
2
-2
2
2
IC
mA
μA
End of Table 6-3
1 For test conditions shown as MIN, MAX, or TYP, use the appropriate value specified in the recommended operating conditions table.
2
2 I C uses open collector IOs and does not have a VOH Minimum.
3 II applies to input-only pins and bidirectional pins. For input-only pins, II indicates the input leakage current. For bidirectional pins, II includes input leakage current and
off-state (Hi-Z) output leakage current.
2
4 I C uses open collector IOs and does not have a IOH Maximum.
5 IOZ applies to output-only pins, indicating off-state (Hi-Z) output leakage current.
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6.4 Power Supply to Peripheral I/O Mapping
Table 6-4
Power Supply to Peripheral I/O Mapping
(1) (2)
Over Recommended Ranges of Supply Voltage and Operating Case Temperature (Unless Otherwise Noted)
Power Supply
I/O Buffer Type
Associated Peripheral
SYSCLK(P|N) PLL input buffer
ALTCORECLK(P|N) PLL input buffer
SRIOSGMIICLK(P|N) SerDes PLL input buffer
CVDD
Supply core voltage
LJCB
DDRCLK(P|N) PLL input buffer
PCIECLK(P|N) SerDes PLL input buffer
MCMCLK(P|N) SerDes PLL input buffer
PASSCLK(P|N) PLL input buffer
DVDD15
1.5-V supply I/O voltage
DDR3 (1.5 V)
All DDR3 memory controller peripheral I/O buffer
All GPIO peripheral I/O buffer
All JTAG and EMU peripheral I/O buffer
All TIMER0-8 peripheral I/O buffer
All SPI peripheral I/O buffer
DVDD18
1.8-V supply I/O voltage
LVCMOS (1.8V)
All AIF peripheral I/O buffer
All RESETs, NMI, control peripheral I/O buffer
All SmartReflex peripheral I/O buffer
All Hyperlink sideband peripheral I/O buffer
All MDIO peripheral I/O buffer
All UART peripheral I/O buffer
2
Open-drain (1.8 V) All I C peripheral I/O buffer
VDDT1
Hyperlink SerDes termination and analogue front-end supply
SerDes/CML
Hyperlink SerDes CML IO buffer
VDDT2
SRIO/SGMII/PCIE SerDes termination and analog front-end
supply
SerDes/CML
SRIO/SGMII/PCIE SerDes CML IO buffer
VDDT3
AIF termination and analog front-end supply
SerDes/CML
AIF SerDes CML IO buffer
End of Table 6-4
1 Please note that this table does not attempt to describe all functions of all power supply terminals but only those whose purpose it is to power peripheral I/O buffers and
clock input buffers.
2 Please see the Hardware Design Guide for KeyStone Devices in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66 for more information about individual
peripheral I/O.
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7 TMS320C6670 Peripheral Information and Electrical Specifications
This chapter covers the various peripherals on the TMS320C6670 device. Peripheral-specific information, timing
diagrams, electrical specifications, and register memory maps are described in this chapter.
7.1 Recommended Clock and Control Signal Transition Behavior
All clocks and control signals must transition between VIH and VIL (or between VIL and VIH) in a monotonic
manner.
7.2 Power Supplies
The following sections describe the proper power-supply sequencing and timing needed to properly power on the
C6670. The various power supply rails and their primary function is listed in Table 7-1.
Table 7-1
Name
Power Supply Rails on the TMS320C6670
Primary Function
Voltage
CVDD
SmartReflex core supply voltage
0.9 - 1.1 V Variable core supply
CVDD1
Core supply voltage for memory
array
1.0 V
Fixed supply at 1.0 V
VDDT1
HyperLink SerDes termination
supply
1.0 V
Filtered version of CVDD1. Special considerations for noise. Filter is not needed if
HyperLink is not in use.
VDDT2
SGMII/SRIO/PCIE SerDes
termination supply
1.0 V
Filtered version of CVDD1. Special considerations for noise. Filter is not needed if
SGMII/SRIO/PCIE is not in use.
VDDT3
AIF SerDes termination supply
1.0 V
Filtered version of CVDD1. Special considerations for noise. Filter is not needed if AIF is
not in use.
DVDD15
1.5-V DDR3 IO supply
1.5 V
Fixed supply at 1.5 V
VDDR1
HyperLink SerDes regulator supply
1.5 V
Filtered version of DVDD15. Special considerations for noise. Filter is not needed if
HyperLink is not in use.
VDDR2
PCIE SerDes regulator supply
1.5 V
Filtered version of DVDD15. Special considerations for noise. Filter is not needed if PCIE
is not in use.
VDDR3
SGMII SerDes regulator supply
1.5 V
Filtered version of DVDD15. Special considerations for noise. Filter is not needed if
SGMII is not in use.
VDDR4
SRIO SerDes regulator supply
1.5 V
Filtered version of DVDD15. Special considerations for noise. Filter is not needed if SRIO
is not in use.
AIF SerDes regulator supply
1.5 V
VDDR5
VDDR6
Notes
Filtered version of DVDD15. Special considerations for noise. Filter is not needed if AIF
is not in use.
DVDD18
1.8-V IO supply
1.8 V
Fixed supply at 1.8 V
AVDDA1
Main PLL supply
1.8 V
Filtered version of DVDD18. Special considerations for noise.
AVDDA2
DDR3 PLL supply
1.8 V
Filtered version of DVDD18. Special considerations for noise.
AVDDA3
PASS PLL supply
1.8 V
Filtered version of DVDD18. Special considerations for noise.
VREFSSTL
0.75-V DDR3 reference voltage
0.75 V
Should track the 1.5-V supply. Use 1.5 V as source.
VSS
Ground
GND
Ground
End of Table 7-1
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7.2.1 Power-Up Sequencing
This section defines the requirements for a power up sequencing from a power-on reset condition. There are two
acceptable power sequences for the device. The first sequence stipulates the core voltages starting before the IO
voltages as shown below.
1. CVDD
2. CVDD1, VDDT1-3
3. DVDD18, AVDD1, AVDD2
4. DVDD15, VDDR1-6
The second sequence provides compatibility with other TI processors with the IO voltage starting before the core
voltages as shown below.
1. DVDD18, AVDD1, AVDD2
2. CVDD
3. CVDD1, VDDT1-3
4. DVDD15, VDDR1-6
The clock input buffers for SYSCLK, ALTCORECLK, DDRCLK, PASSCLK, SRIOSGMIICLK, PCIECLK, and
MCMCLK use CVDD as a supply voltage. These clock inputs are not failsafe and must be held in a high-impedance
state until CVDD is at a valid voltage level. Driving these clock inputs high before CVDD is valid could cause damage
to the device. Once CVDD is valid, it is acceptable that the P and N legs of these clocks may be held in a static state
(either high and low or low and high) until a valid clock frequency is needed at that input. To avoid internal
oscillation, the clock inputs should be removed from the high impedance state shortly after CVDD is present.
If a clock input is not used, it must be held in a static state. To accomplish this, the N leg should be pulled to ground
through a 1-kΩ resistor. The P leg should be tied to CVDD to ensure it will not have any voltage present until CVDD
is active. Connections to the IO cells powered by DVDD18 and DVDD15 are not failsafe and should not be driven
high before these voltages are active. Driving these IO cells high before DVDD18 or DVDD15 are valid could cause
damage to the device.
The device initialization is divided into two phases. The first phase consists of the time period from the activation of
the first power supply until the point at which all supplies are active and at a valid voltage level. Either of the
sequencing scenarios described above can be implemented during this phase. The figures below show both the
core-before-IO voltage sequence and the IO-before-core voltage sequence. POR must be held low for the entire
power stabilization phase.
This is followed by the device initialization phase. The rising edge of POR followed by the rising edge of RESETFULL
will trigger the end of the initialization phase but both must be inactive for the initialization to complete. POR must
always go inactive before RESETFULL goes inactive as described below. SYSCLK1 in the following section refers to
the clock that is used by the CorePac, see Figure 7-7 for more details.
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7.2.1.1 Core-Before-IO Power Sequencing
Figure 7-1 shows the power sequencing and reset control of the TMS320C6670 for device initialization. POR may
be removed after the power has been stable for the required 100 μsec. RESETFULL must be held low for a period
after the rising edge of POR, but may be held low for longer periods if necessary. The configuration bits shared with
the GPIO pins will be latched on the rising edge of RESETFULL and must meet the setup and hold times specified.
SYSCLK1 must always be active before POR can be removed. Core-before-IO power sequencing is defined in
Table 7-2.
Note—TI recommends a maximum of 100 ms between one power rail being valid, and the next power rail
in the sequence starting to ramp.
Figure 7-1
Core Before IO Power Sequencing
Power Stabilization Phase
Device Initialization Phase
POR
7
RESETFULL
8
GPIO Config
Bits
4b
9
10
RESET
2c
1
CVDD
6
2a
CVDD1
3
DVDD18
4a
DVDD15
5
SYSCLK1P&N
2b
DDRCLKP&N
RESETSTAT
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Table 7-2
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Core Before IO Power Sequencing
Time
System State
1
Begin Power Stabilization Phase
• CVDD (core AVS) ramps up.
• POR must be held low through the power stabilization phase. Because POR is low, all the core logic that has async reset (created from
POR) is put into the reset state.
2a
• CVDD1 (core constant) ramps at the same time or shortly following CVDD. Although ramping CVDD1 and CVDD simultaneously is
permitted, the voltage for CVDD1 must never exceed CVDD until after CVDD has reached a valid voltage.
• The purpose of ramping up the core supplies close to each other is to reduce crowbar current. CVDD1 should trail CVDD as this will
ensure that the WLs in the memories are turned off and there is no current through the memory bit cells. If, however, CVDD1 (core
constant) ramps up before CVDD (core AVS), then the worst-case current could be on the order of twice the specified draw of CVDD1.
2b
• Once CVDD is valid, the clock drivers should be enabled. Although the clock inputs are not necessary at this time, they should either be
driven with a valid clock or be held in a static state with one leg high and one leg low.
2c
• The DDRCLK and SYSCLK1 may begin to toggle anytime between when CVDD is at a valid level and the setup time before POR goes high
specified by t6.
3
• Filtered versions of 1.8 V can ramp simultaneously with DVDD18.
• RESETSTAT is driven low once the DVDD18 supply is available.
• All LVCMOS input and bidirectional pins must not be driven or pulled high until DVDD18 is present. Driving an input or bidirectional pin
before DVDD18 is valid could cause damage to the device.
4a
• DVDD15 (1.5 V) supply is ramped up following DVDD18. Although ramping DVDD18 and DVDD15 simultaneously is permitted, the
voltage for DVDD15 must never exceed DVDD18.
4b
• RESET may be driven high any time after DVDD18 is at a valid level. In a POR-controlled boot, RESET must be high before POR is driven
high.
5
• POR must continue to remain low for at least 100 μs after power has stabilized.
End power stabilization phase
6
• Device initialization requires 500 SYSCLK1 periods after the Power Stabilization Phase. The maximum clock period is 33.33 nsec, so a delay
of an additional 16 μs is required before a rising edge of POR. The clock must be active during the entire 16 μs.
7
• RESETFULL must be held low for at least 24 transitions of the SYSCLK1 after POR has stabilized at a high level.
8
• The rising edge of the RESETFULL will remove the reset to the efuse farm allowing the scan to begin.
• Once device initialization and the efuse farm scan are complete, the RESETSTAT signal is driven high. This delay will be 10000 to 50000
clock cycles.
End device initialization phase
9
• GPIO configuration bits must be valid for at least 12 transitions of the SYSCLK1 before the rising edge of RESETFULL
10
• GPIO configuration bits must be held valid for at least 12 transitions of the SYSCLK1 after the rising edge of RESETFULL
End of Table 7-2
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7.2.1.2 IO-Before-Core Power Sequencing
The timing diagram for IO-before-core power sequencing is shown in Figure 7-2 and defined in Table 7-3.
Note—TI recommends a maximum of 100 ms between one power rail being valid, and the next power rail
in the sequence starting to ramp.
Figure 7-2
IO Before Core Power Sequencing
Power Stabilization Phase
Device Initialization Phase
POR
5
7
RESETFULL
8
GPIO Config
Bits
2a
9
10
RESET
3c
2b
CVDD
6
3a
CVDD1
1
DVDD18
4
DVDD15
3b
SYSCLK1P&N
DDRCLKP&N
RESETSTAT
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Table 7-3
www.ti.com
IO Before Core Power Sequencing
Time
System State
1
Begin Power Stabilization Phase
• Because POR is low, all the core logic having async reset (created from POR) are put into reset state once the core supply ramps. POR must
remain low through power stabilization phase.
• Filtered versions of 1.8 V can ramp simultaneously with DVDD18.
• RESETSTAT is driven low once the DVDD18 supply is available.
• All input and bidirectional pins must not be driven or pulled high until DVDD18 is present. Driving an input or bidirectional pin before
DVDD18 could cause damage to the device.
2a
• RESET may be driven high anytime after DVDD18 is at a valid level.
2b
• CVDD (core AVS) ramps up.
3a
• CVDD1 (core constant) ramps at the same time or following CVDD. Although ramping CVDD1 and CVDD simultaneously is permitted, the
voltage for CVDD1 must never exceed CVDD until after CVDD has reached a valid voltage.
• The purpose of ramping up the core supplies close to each other is to reduce crowbar current. CVDD1 should trail CVDD as this will ensure
that the WLs in the memories are turned off and there is no current through the memory bit cells. If, however, CVDD1 (core constant)
ramps up before CVDD (core AVS), then the worst case current could be on the order of twice the specified draw of CVDD1.
3b
• Once CVDD is valid, the clock drivers should be enabled. Although the clock inputs are not necessary at this time, they should either be
driven with a valid clock or held in a static state with one leg high and one leg low.
3c
• The DDRCLK and SYSCLK1 may begin to toggle anytime between when CVDD is at a valid level and the setup time before POR goes high
specified by t6.
4
• DVDD15 (1.5 V) supply is ramped up following CVDD1.
5
• POR must continue to remain low for at least 100 μs after power has stabilized.
End power stabilization phase
6
Begin Device Initialization
• Device initialization requires 500 SYSCLK1 periods after the power stabilization phase. The maximum clock period is 33.33 nsec so a delay
of an additional 16 μs is required before a rising edge of POR. The clock must be active during the entire 16 μs.
• POR must remain low.
7
• RESETFULL is held low for at least 24 transitions of the SYSCLK1 after POR has stabilized at a high level.
• The rising edge of the RESETFULL will remove the reset to the efuse farm allowing the scan to begin.
8
• Once device initialization and the efuse farm scan are complete, the RESETSTAT signal is driven high. This delay will be 10000 to 50000
clock cycles.
9
• GPIO configuration bits must be valid for at least 12 transitions of the SYSCLK1 before the rising edge of RESETFULL
10
• GPIO configuration bits must be held valid for at least 12 transitions of the SYSCLK1 after the rising edge of RESETFULL
End device initialization phase
End of Table 7-3
7.2.1.3 Prolonged Resets
Holding the device in POR, RESETFULL, or RESET for long periods of time will affect the long-term reliability of
the part. The device should not be held in a reset for times exceeding one hour at a time and no more than 5% of the
total lifetime for which the device is powered-up. Exceeding these limits will cause a gradual reduction in the
reliability of the part. This can be avoided by allowing the DSP to boot and then configuring it to enter a hibernation
state soon after power is applied. This will satisfy the reset requirement while limiting the power consumption of the
device.
7.2.1.4 Clocking During Power Sequencing
Some of the clock inputs are required to be present for the device to initialize correctly, but behavior of many of the
clocks is contingent on the state of the boot configuration pins. Table 7-4 describes the clock sequencing and the
conditions that affect the clock operation. Note that all clock drivers should be in a high-impedance state until
CVDD is at a valid level and that all clock inputs either be active or in a static state with one leg pulled low and the
other connected to CVDD.
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Table 7-4
Clock Sequencing
Clock
Condition
Sequencing
DDRCLK
None
Must be present 16 μsec before POR transitions high.
CORECLKSEL = 0
SYSCLK used to clock the core PLL. It must be present 16 μsec before POR transitions high.
CORECLKSEL = 1
SYSCLK used only for AIF. Clock must be present before the reset to the AIF is removed.
CORECLKSEL = 0
ALTCORECLK is not used and should be tied to a static state.
SYSCLK
ALTCORECLK
PASSCLK
CORECLKSEL = 1
ALTCORECLK is used to clock the core PLL. It must be present 16 μsec before POR transitions high.
PASSCLKSEL = 0
PASSCLK is not used and should be tied to a static state.
PASSCLKSEL = 1
PASSCLK is used as a source for the PASS PLL. It must be present before the PASS PLL is removed from
reset and programmed.
An SGMII port will be used.
SRIOSGMIICLK must be present 16 μsec before POR transitions high.
SGMII will not be used. SRIO SRIOSGMIICLK must be present 16 μsec before POR transitions high.
will be used as a boot device.
SRIOSGMIICLK SGMII will not be used. SRIO
will be used after boot.
PCIECLK
MCMCLK
SRIOSGMIICLK is used as a source to the SRIO SerDes PLL. It must be present before the SRIO is removed
from reset and programmed.
SGMII will not be used. SRIO
will not be used.
SRIOSGMIICLK is not used and should be tied to a static state.
PCIE will be used as a boot
device.
PCIECLK must be present 16 μsec before POR transitions high.
PCIE will be used after boot.
PCIECLK is used as a source to the PCIE SerDes PLL. It must be present before the PCIe is removed from
reset and programmed.
PCIE will not be used.
PCIECLK is not used and should be tied to a static state.
HyperLink will be used as a
boot device.
MCMCLK must be present 16 μsec before POR transitions high.
HyperLink will be used after
boot.
MCMCLK is used as a source to the HyperLink SerDes PLL. It must be present before the HyperLink is
removed from reset and programmed.
HyperLink will not be used.
MCMCLK is not used and should be tied to a static state.
End of Table 7-4
7.2.2 Power-Down Sequence
The power down sequence is the exact reverse of the power-up sequence described above. The goal is to prevent a
large amount of static current and to prevent overstress of the device. A power-good circuit that monitors all the
supplies for the device should be used in all designs. If a catastrophic power supply failure occurs on any voltage rail,
POR should transition to low to prevent over-current conditions that could possibly impact device reliability.
A system power monitoring solution is needed to shut down power to the board if a power supply fails. Long-term
exposure to an environment in which one of the power supply voltages is no longer present will affect the reliability
of the device. Holding the device in reset is not an acceptable solution because prolonged periods of time with an
active reset can also affect long term reliability.
7.2.3 Power Supply Decoupling and Bulk Capacitors
In order to properly decouple the supply planes on the PCB from system noise, decoupling and bulk capacitors are
required. Bulk capacitors are used to minimize the effects of low frequency current transients and decoupling or
bypass capacitors are used to minimize higher frequency noise. For recommendations on selection of power supply
decoupling and bulk capacitors see the Hardware Design Guide for KeyStone Devices in 2.9 ‘‘Related
Documentation from Texas Instruments’’ on page 66.
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7.2.4 SmartReflex
Increasing the device complexity increases its power consumption and with the smaller transistor structures
responsible for higher achievable clock rates and increased performance, comes an inevitable penalty: increasing
leakage currents. Leakage currents are present in any active circuit, independent of clock rates and usage scenarios.
This static power consumption is mainly determined by transistor type and process technology. Higher clock rates
also increase dynamic power, the power used when transistors switch. The dynamic power depends mainly on a
specific usage scenario, clock rates, and I/O activity.
Texas Instruments SmartReflex technology is used to decrease both static and dynamic power consumption while
maintaining the device performance. SmartReflex in the TMS320C6670 device is a feature that allows the core
voltage to be optimized based on the process corner of the device. This requires a voltage regulator for each
TMS320C6670 device.
To guarantee maximizing performance and minimizing power consumption of the device, SmartReflex is required
to be implemented whenever the TMS320C6670 device is used. The voltage selection is done using 4 VCNTL pins
which are used to select the output voltage of the core voltage regulator.
For information on implementation of SmartReflex see the DSP Power Consumption Summary for KeyStone Devices
Application Report and the Hardware Design Guide for KeyStone Devices in 2.9 ‘‘Related Documentation from
Texas Instruments’’ on page 66.
Table 7-5
SmartReflex 4-Pin VID Interface Switching Characteristics
(see Figure 7-3)
No.
Parameter
1
td(VCNTL[2:0]-VCNTL[3])
Delay time - VCNTL[2:0] valid after VCNTL[3] low
2
toh(VCNTL[3]-VCNTL[2:0])
Output hold time - VCNTL[2:0] valid after VCNTL[3]
Min
0.07
3
td(VCNTL[2:0]-VCNTL[3])
Delay time - VCNTL[2:0] valid after VCNTL[3] high
4
toh(VCNTL[3]-VCNTL[2:0)
Output hold time - VCNTL[2:0] valid after VCNTL[3] high
0.07
Max
Unit
300.00
ns
(1)
ms
172020C
300.00
ns
172020C
ms
End of Table 7-5
1 C = 1/SYSCLK1 frequency (See Figure 7-9)in ms
Figure 7-3
SmartReflex 4-Pin VID Interface Timing
4
VCNTL[3]
1
3
VCNTL[2:0]
LSB VID[2:0]
MSB VID[5:3]
2
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7.3 Power Sleep Controller (PSC)
The Power Sleep Controller (PSC) controls overall device power by turning off unused power domains and gating
off clocks to individual peripherals and modules. The PSC provides the user with an interface to control several
important power and clock operations.
For information on the Power Sleep Controller, see the Power Sleep Controller (PSC) for KeyStone Devices User
Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66.
7.3.1 Power Domains
The device has several power domains that can be turned on for operation or off to minimize power dissipation. The
global power/sleep controller (GPSC) is used to control the power gating of various power domains.
Table 7-6 shows the TMS320C6670 power domains.
Table 7-6
Power Domains
Domain
Block(s)
Note
Power Connection
0
Most peripheral logic
Cannot be disabled
Always on
1
Per-core TETB and system TETB
RAMs can be powered down
Software control
2
Network Coprocessor
Logic can be powered down
Software control
3
PCIe
Logic can be powered down
Software control
4
SRIO
Logic can be powered down
Software control
5
HyperLink
Logic can be powered down
Software control
6
Reserved
Reserved
Reserved
7
MSMC RAM
MSMC RAM can be powered down
Software control
8
RAC_A, RAC_B, and TAC
Logic can be powered down
Software control
9
FFTC_A and FFTC_B
Logic can be powered down
Software control
10
AIF2
RAMs can be powered down
Software control
11
TCP3d_A
RAMs can be powered down
Software control
12
VCP2_B, VCP2_C, and VCP2_D
RAMs can be powered down
Software control
13
C66x Core 0, L1/L2 RAMs
L2 RAMs can sleep
14
C66x Core 1, L1/L2 RAMs
L2 RAMs can sleep
15
C66x Core 2, L1/L2 RAMs
L2 RAMs can sleep
16
C66x Core 3, L1/L2 RAMs
L2 RAMs can sleep
17
TCP3d_B
RAMs can be powered down
Software control
18
BCP, FFTC_C, and TCP3d_C
Logic can be powered down for BCP,
FFTC_C, and RAMs can be powered down
for TCP3d_C
Software control
Software control via C66x CorePac. For details, see
the C66x CorePac Reference Guide.
End of Table 7-6
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7.3.2 Clock Domains
Clock gating to each logic block is managed by the local power/sleep controllers (LPSCs) of each module. For
modules with a dedicated clock or multiple clocks, the LPSC communicates with the PLL controller to enable and
disable that module's clock(s) at the source. For modules that share a clock with other modules, the LPSC controls
the clock gating.
Table 7-7 shows the TMS320C6670 clock domains.
Table 7-7
Clock Domains
LPSC Number
Module(s)
Notes
0
Shared LPSC for all peripherals other than those listed in this table
Always on
1
SmartReflex
Always on
2
DDR3 EMIF
Always on
3
TCP3e
Software control
4
VCP2_A
Software control
5
Debug subsystem and tracers
Software control
6
Per-core TETB and system TETB
Software control
7
Packet Accelerator
Software control
8
Ethernet SGMIIs
Software control
9
Security Accelerator
Software control
10
PCIe
Software control
11
SRIO
Software control
12
HyperLink
Software control
13
Reserved
Reserved
14
MSMC RAM
Software control
15
RAC_A and RAC_B
Software control
16
TAC
Software control
17
FFTC_A and FFTC_B
Software control
18
AIF2
Software control
19
TCP3d_A
Software control
20
VCP2_B
Software control
21
VCP2_C
Software control
22
VCP2_D
Software control
23
C66x CorePac0 and Timer0
Always on
24
C66x CorePac1 and Timer1
Always on
25
C66x CorePac1 RSAs
Software control
26
C66x CorePac2 and Timer2
Always on
27
C66x CorePac2 RSAs
Software control
28
C66x CorePac3 and Timer3
Always on
29
TCP3d_B
Software control
30
BCP, FFTC_C, and TCP3d_C
Software control
No LPSC
Bootcfg, PSC, and PLL Controller
These modules do not use LPSC
End of Table 7-7
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7.3.3 PSC Register Memory Map
Table 7-8 shows the PSC Register memory map.
Table 7-8
PSC Register Memory Map (Part 1 of 3)
Offset
Register
Description
0x000
PID
Peripheral Identification Register
0x004 - 0x010
Reserved
Reserved
0x014
VCNTLID
Voltage Control Identification Register
0x018 - 0x11C
Reserved
Reserved
0x120
PTCMD
Power Domain Transition Command Register
0x124
Reserved
Reserved
0x128
PTSTAT
Power Domain Transition Status Register
0x12C - 0x1FC
Reserved
Reserved
0x200
PDSTAT0
Power Domain Status Register 0 (always on)
0x204
PDSTAT1
Power Domain Status Register 1 (Per-CorePac TETB and System TETB)
0x208
PDSTAT2
Power Domain Status Register 2 (Network Coprocessor)
0x20C
PDSTAT3
Power Domain Status Register 3 (PCIe)
0x210
PDSTAT4
Power Domain Status Register 4 (SRIO)
0x214
PDSTAT5
Power Domain Status Register 5 (HyperLink)
0x218
PDSTAT6
Power Domain Status Register 6 (Reserved)
0x21C
PDSTAT7
Power Domain Status Register 7 (MSMC RAM)
0x220
PDSTAT8
Power Domain Status Register 8 (RAC_A, RAC_B, and TAC)
0x224
PDSTAT9
Power Domain Status Register 9 (FFTC_A and FFTC_B)
0x228
PDSTAT10
Power Domain Status Register 10 (AIF2)
0x22C
PDSTAT11
Power Domain Status Register 11 (TCP3d_A)
0x230
PDSTAT12
Power Domain Status Register 12 (VCP2_B, VCP2_C and VCP2_D)
0x234
PDSTAT13
Power Domain Status Register 13 (C66x CorePac0)
0x238
PDSTAT14
Power Domain Status Register 14 (C66x CorePac1)
0x23C
PDSTAT15
Power Domain Status Register 15 (C66x CorePac2)
0x240
PDSTAT16
Power Domain Status Register 16 (C66x CorePac3)
0x244
PDSTAT17
Power Domain Status Register 17 (TCP3d_B)
0x248
PDSTAT18
Power Domain Status Register 18 (BCP, FFTC_C and TCP3d_C)
0x24C - 0x2FC
Reserved
Reserved
0x300
PDCTL0
Power Domain Control Register 0 (always on)
0x304
PDCTL1
Power Domain Control Register 1 (Per-CorePac TETB and system TETB)
0x308
PDCTL2
Power Domain Control Register 2 (Network Coprocessor)
0x30C
PDCTL3
Power Domain Control Register 3 (PCIe)
0x310
PDCTL4
Power Domain Control Register 4 (SRIO)
0x314
PDCTL5
Power Domain Control Register 5 (HyperLink)
0x318
PDCTL6
Power Domain Control Register 6 (Reserved)
0x31C
PDCTL7
Power Domain Control Register 7 (MSMC RAM)
0x320
PDCTL8
Power Domain Control Register 8 (RAC_A, RAC_B and TAC)
0x324
PDCTL9
Power Domain Control Register 9 (FFTC_A and FFTC_B)
0x328
PDCTL10
Power Domain Control Register 10 (AIF2)
0x32C
PDCTL11
Power Domain Control Register 11 (TCP3d_A)
0x330
PDCTL12
Power Domain Control Register 12 (VCP2_B, VCP2_C and VCP2_D)
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Table 7-8
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PSC Register Memory Map (Part 2 of 3)
Offset
Register
Description
0x334
PDCTL13
Power Domain Control Register 13 (C66x CorePac0)
0x338
PDCTL14
Power Domain Control Register 14 (C66x CorePac1)
0x33C
PDCTL15
Power Domain Control Register 15 (C66x CorePac2)
0x340
PDCTL16
Power Domain Control Register 16 (C66x CorePac3)
0x344
PDCTL17
Power Domain Control Register 17 (TCP3d_B)
0x348
PDCTL18
Power Domain Control Register 18 (BCP, FFTC_C and TCP3d_C)
0x34C - 0x7FC
Reserved
Reserved
0x800
MDSTAT0
Module Status Register 0 (never gated)
0x804
MDSTAT1
Module Status Register 1 (SmartReflex)
0x808
MDSTAT2
Module Status Register 2 (DDR3 EMIF)
0x80C
MDSTAT3
Module Status Register 3 (TCP3e)
0x810
MDSTAT4
Module Status Register 4 (VCP2_A)
0x814
MDSTAT5
Module Status Register 5 (debug subsystem and tracers)
0x818
MDSTAT6
Module Status Register 6 (per-CorePac TETB and system TETB)
0x81C
MDSTAT7
Module Status Register 7 (Packet Accelerator)
0x820
MDSTAT8
Module Status Register 8 (Ethernet SGMIIs)
0x824
MDSTAT9
Module Status Register 9 (Security Accelerator)
0x828
MDSTAT10
Module Status Register 10 (PCIe)
0x82C
MDSTAT11
Module Status Register 11 (SRIO)
0x830
MDSTAT12
Module Status Register 12 (HyperLink)
0x834
MDSTAT13
Module Status Register 13 (Reserved)
0x838
MDSTAT14
Module Status Register 14 (MSMC RAM)
0x83C
MDSTAT15
Module Status Register 15 (RAC_A and RAC_B)
0x840
MDSTAT16
Module Status Register 16 (TAC)
0x844
MDSTAT17
Module Status Register 17 (FFTC_A and FFTC_B)
0x848
MDSTAT18
Module Status Register 18 (AIF2)
0x84C
MDSTAT19
Module Status Register 19 (TCP3d_A)
0x850
MDSTAT20
Module Status Register 20 (VCP2_B)
0x854
MDSTAT21
Module Status Register 21 (VCP2_C)
0x858
MDSTAT22
Module Status Register 22 (VCP2_D)
0x85C
MDSTAT23
Module Status Register 23 (C66x CorePac0 and Timer 0)
0x860
MDSTAT24
Module Status Register 24 (C66x CorePac1 and Timer 1)
0x864
MDSTAT25
Module Status Register 25 (C66x CorePac1 RSAs)
0x868
MDSTAT26
Module Status Register 26 (C66x CorePac2 and Timer 2)
0x86C
MDSTAT27
Module Status Register 27 (C66x CorePac2 RSAs)
0x870
MDSTAT28
Module Status Register 28 (C66x CorePac3 and Timer 3)
0x874
MDSTAT29
Module Status Register 29 (TCP3d_B)
0x878
MDSTAT30
Module Status Register 30 (BCP, FFTC_C and TCP3d_C)
0x87C - 0x9FC
Reserved
Reserved
0xA00
MDCTL0
Module Control Register 0 (never gated)
0xA04
MDCTL1
Module Control Register 1 (SmartReflex)
0xA08
MDCTL2
Module Control Register 2 (DDR3 EMIF)
0xA0C
MDCTL3
Module Control Register 3 (TCP3e)
0xA10
MDCTL4
Module Control Register 4 (VCP2_A)
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Table 7-8
PSC Register Memory Map (Part 3 of 3)
Offset
Register
Description
0xA14
MDCTL5
Module Control Register 5 (debug subsystem and tracers)
0xA18
MDCTL6
Module Control Register 6 (per-CorePac TETB and system TETB)
0xA1C
MDCTL7
Module Control Register 7 (Packet Accelerator)
0xA20
MDCTL8
Module Control Register 8 (Ethernet SGMIIs)
0xA24
MDCTL9
Module Control Register 9 (Security Accelerator)
0xA28
MDCTL10
Module Control Register 10 (PCIe)
0xA2C
MDCTL11
Module Control Register 11 (SRIO)
0xA30
MDCTL12
Module Control Register 12 (HyperLink)
0xA34
MDCTL13
Module Control Register 13 (Reserved)
0xA38
MDCTL14
Module Control Register 14 (MSMC RAM)
0xA3C
MDCTL15
Module Control Register 15 (RAC_A and RAC_B)
0xA40
MDCTL16
Module Control Register 16 (TAC)
0xA44
MDCTL17
Module Control Register 17 (FFTC_A and FFTC_B)
0xA48
MDCTL18
Module Control Register 18 (AIF2)
0xA4C
MDCTL19
Module Control Register 19 (TCP3d_A)
0xA50
MDCTL20
Module Control Register 20 (VCP2_B)
0xA54
MDCTL21
Module Control Register 21 (VCP2_C)
0xA58
MDCTL22
Module Control Register 22 (VCP2_D)
0xA5C
MDCTL23
Module Control Register 23 (C66x CorePac0 and Timer 0)
0xA60
MDCTL24
Module Control Register 24 (C66x CorePac1and Timer 1)
0xA64
MDCTL25
Module Control Register 25 (C66x CorePac1 RSAs)
0xA68
MDCTL26
Module Control Register 26 (C66x Corepac2 and Timer 2)
0xA6C
MDCTL27
Module Control Register 27 (C66x CorePac2 RSAs)
0xA70
MDCTL28
Module Control Register 28 (C66x CorePac3 and Timer 3)
0xA74
MDCTL29
Module Control Register 29 (TCP3d_B)
0xA78
MDCTL30
Module Control Register 30(BCP, FFTC_C and TCP3d_C)
0xA7C - 0xFFC
Reserved
Reserved
End of Table 7-8
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7.4 Reset Controller
The reset controller detects the different type of resets supported on the TMS320C6670 device and manages the
distribution of those resets throughout the device.
The device has the following types of resets:
• Power-on reset
• Hard reset
• Soft reset
• Local reset
Table 7-9 explains further the types of reset, the reset initiator, and the effects of each reset on the device. For more
information on the effects of each reset on the PLL controllers and their clocks, see Section 7.4.7 ‘‘Reset Electrical
Data/Timing’’ on page 126.
Table 7-9
Type
Power-on Reset
Reset Types
Initiator
Effect(s)
POR pin
Resets the entire chip including the test and emulation logic. The device configuration pins are
latched only during power-on reset.
RESETFULL pin
RESET pin
Hard Reset
Soft Reset
PLLCTL (1) register (RSCTRL)
Watchdog timers
Emulation initiated reset is always a hard reset.
Emulation
By default these initiators are configured as Hard reset, but can be configured (Except Emulation)
as soft reset in the RSCFG register of PLLCTL. Contents of DDR3 SDRAM memory can be retained
during a hard reset if the SDRAM is placed in self-refresh mode.
RESET pin
Soft Reset will behave like hard reset except that PCIe MMRs (memory-mapped registers) and
DDR3 EMIF MMRs contents are retained.
PLLCTL register (RSCTRL)
Watchdog timers
Local Reset
Hard reset resets everything except for test, emulation logic and reset isolation modules. This reset
is also different from power-on reset in that the PLLCTL assumes power and clocks are stable when
hard reset is asserted. The device configurations pins are not re-latched.
LRESET pin
Watchdog timer timeout
By default these initiators are configured as hard reset, but can be configured as Soft reset in the
RSCFG register of PLLCTL. Contents of DDR3 SDRAM memory can be retained during a soft reset if
the SDRAM is placed in self-refresh mode.
Resets the CorePac, without disturbing clock alignment or memory contents. The device
configuration pins are not re-latched.
LPSC MMRs
End of Table 7-9
1 All masters in the device have access to the PLLCTL registers.
7.4.1 Power-on Reset
Power-on reset is used to reset the entire device, including the test and emulation logic.
Power-on reset is initiated by the following
1. POR pin
2. RESETFULL pin
During power-up, the POR pin must be asserted (driven low) until the power supplies have reached their normal
operating conditions. Also a RESETFULL pin is provided to allow reset of the entire device, including the
reset-isolated logic, when the device is already powered up. For this reason, the RESETFULL pin, unlike POR, should
be driven by the on-board host control other than the power good circuitry. For power-on reset, the Main PLL
Controller comes up in bypass mode and the PLL is not enabled. Other resets do not affect the state of the PLL or
the dividers in the PLL Controller.
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The following sequence must be followed during a power-on reset:
1. Wait for all power supplies to reach normal operating conditions while keeping the POR pin asserted (driven
low). While POR is asserted, all pins except RESETSTAT will be set to high-impedance. After the POR pin is
de-asserted (driven high), all Z group pins, low group pins, and high group pins are set to their reset state and
will remain at their reset state until otherwise configured by their respective peripheral. All peripherals that are
power managed, are disabled after a power-on reset and must be enabled through the Device State Control
Registers (for more details, see Section Table 3-2 ‘‘Device State Control Registers’’ on page 68).
2. Clocks are reset, and they are propagated throughout the chip to reset any logic that was using reset
synchronously. All logic is now reset and RESETSTAT will be driven low, indicating that the device is in reset.
3. POR must be held active until all supplies on the board are stable, and then for at least an additional period of
time (as specified in Section 7.2.1 ‘‘Power-Up Sequencing’’ on page 110) for the chip-level PLLs to lock.
4. The POR pin can now be de-asserted. Reset-sampled pin values are latched at this point. Then all chip-level
PLLs are taken out of reset, they begin their locking sequence, and all power-on device initialization processes
begin.
5. After device initialization is complete, the RESETSTAT pin is de-asserted (driven high). By this time, the
DDR3 PLL has already completed its locking sequence and is supplying a valid clock. The system clocks of both
PLL controllers are allowed to finish their current cycles and then paused for 10 cycles of their respective
system reference clocks. After the pause, the system clocks are restarted at their default divide by settings.
6. The device is now out of reset and device execution begins as dictated by the selected boot mode.
Note—To most of the device, reset is de-asserted only when the POR and RESET pins are both de-asserted
(driven high). Therefore, in the sequence described above, if the RESET pin is held low past the low period
of the POR pin, most of the device will remain in reset. The RESET pin should not be tied to the POR pin.
7.4.2 Hard Reset
A hard reset will reset everything on the device except the PLLs, test, emulation logic, and reset-isolated modules.
POR should also remain de-asserted during this time.
Hard reset is initiated by the following:
• RESET pin
• RSCTRL Register in PLLCTL
• Watchdog timer
• Emulation
All the above initiators, by default, are configured to act as hard reset. Except emulation, all of the other 3 initiators
can be configured as soft resets in the RSCFG Register in PLLCTL.
The following sequence must be followed during a hard reset:
1. The RESET pin is pulled active low for a minimum of 24 CLKIN1 cycles. During this time the RESET signal is
able to propagate to all modules (except those specifically mentioned above). All I/O are Hi-Z for modules
affected by RESET, to prevent off-chip contention during the warm reset.
2. Once all logic is reset, RESETSTAT is driven active to denote that the device is in reset.
3. The RESET pin can now be released. A minimal device initialization begins to occur. Note that configuration
pins are not re-latched and clocking is unaffected within the device.
4. After device initialization is complete, the RESETSTAT pin is de-asserted (driven high).
Note—The POR pin should be held inactive (high) throughout the warm reset sequence. Otherwise, if POR
is activated (brought low), the minimum POR pulse width must be met. The RESET pin should not be tied
to the POR pin.
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7.4.3 Soft Reset
A soft reset will behave like a hard reset except that the PCIe MMRs (memory-mapped registers) and DDR3 EMIF
MMRs contents are retained. POR should also remain de-asserted during this time.
Soft reset is initiated by the following
• RESET pin
• RSCTRL Register in PLLCTL
• Watchdog timer
All the above initiators by default are configured to act as hard reset. Except emulation, all of the other 3 initiators
can be configured as soft resets in the RSCFG register in PLLCTL.
In the case of a soft reset, the clock logic or the power control logic of the peripherals is not affected, and, therefore,
the enabled/disabled state of the peripherals is not affected. On a soft reset, the DDR3 memory controller registers
are not reset. In addition, the DDR3 SDRAM memory content is retained if the user places the DDR3 SDRAM in
self-refresh mode before invoking the soft reset.
During a soft reset, the following happens:
1. The RESETSTAT pin goes low to indicate an internal reset is being generated. The reset is allowed to propagate
through the system. Internal system clocks are not affected. PLLs also remain locked.
2. After device initialization is complete, the RESETSTAT pin is deasserted (driven high). In addition, the PLL
Controllers pause their system clocks for about 8 cycles.
At this point:
› The state of the peripherals before the soft reset is not changed.
› The I/O pins are controlled as dictated by the DEVSTAT register.
› The DDR3 MMRs and PCIe MMRs retain their previous values. Only the DDR3 memory controller
and PCIe state machines are reset by the soft reset.
› The PLL controllers are operating in the mode prior to soft reset. System clocks are unaffected.
The boot sequence is started after the system clocks are restarted. Because the configuration pins are not latched with
a system reset, the previous values, as shown in the DEVSTAT Register, are used to select the boot mode.
7.4.4 Local Reset
The local reset can be used to reset a particular CorePac without resetting any other device components.
Local reset is initiated by the following (for more details see the Phase Locked Loop (PLL) Controller for KeyStone
Devices User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66):
• LRESET pin
• Watchdog timer should cause one of the below based on the setting of the CORESEL[2:0] and RSTCFG
registers in the PLL Controller. See ‘‘Reset Configuration Register (RSTCFG)’’ on page 136 and ‘‘CIC
Registers’’ on page 170.
– Local reset
– NMI
– NMI followed by a time delay and then a local reset for the CorePac selected
– Hard reset by requesting reset via PLLCTL
• LPSC MMRs (memory-mapped registers)
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7.4.5 Reset Priority
If any of the above reset sources occur simultaneously, the PLLCTL processes only the highest priority reset request.
The reset request priorities are as follows (high to low):
• Power-on reset
• Hard/soft reset
7.4.6 Reset Controller Register
The reset controller register are part of the PLLCTL MMRs. All C6670 device-specific MMRs are covered in Section
7.5.2 ‘‘PLL Controller Memory Map’’ on page 131. For more details on these registers and how to program them,
see the Phase Locked Loop (PLL) Controller for KeyStone Devices User Guide in 2.9 ‘‘Related Documentation from
Texas Instruments’’ on page 66.
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7.4.7 Reset Electrical Data/Timing
Table 7-10
Reset Timing Requirements
(1)
(see Figure 7-4 and Figure 7-5)
No.
Min
Max
Unit
RESETFULL Pin Reset
1
tw(RESETFULL)
Pulse width - pulse width RESETFULL low
2
tw(RESET)
Pulse width - pulse width RESET low
500C
ns
500C
ns
Soft/Hard-Reset
End of Table 7-10
1 C = 1/SYSCLK1 clock frequency in ns
Table 7-11
Reset Switching Characteristics (1)
(see Figure 7-4 and Figure 7-5)
No.
Parameter
Min
Max
Unit
RESETFULL Pin Reset
3
td(RESETFULLH-RESETSTATH)
Delay time - RESETSTAT high after RESETFULL high
50000C ns
Soft/Hard Reset
4
td(RESETH-RESETSTATH)
Delay time - RESETSTAT high after RESET high
50000C ns
End of Table 7-11
1 C = 1/SYSCLK1 clock frequency in ns
Figure 7-4
RESETFULL Reset Timing
POR
1
RESETFULL
RESET
3
RESETSTAT
Figure 7-5
Soft/Hard Reset Timing
POR
RESETFULL
2
RESET
4
RESETSTAT
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Table 7-12
Boot Configuration Timing Requirements
(1)
See Figure 7-6)
No.
Min
Max
Unit
1
tsu(GPIOn-RESETFULL)
Setup time - GPIO valid before RESETFULL asserted
12C
ns
2
th(RESETFULL-GPIOn)
Hold time - GPIO valid after RESETFULL asserted
12C
ns
End of Table 7-12
1 C = 1/SYSCLK1 clock frequency in ns.
Figure 7-6
Boot Configuration Timing
POR
1
RESETFULL
GPIO[15:0]
2
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7.5 Main PLL and the PLL Controller
This section provides a description of the Main PLL and the PLL Controller. For details on the operation of the PLL
Controller module, see the Phase Locked Loop (PLL) Controller for KeyStone Devices User Guide in 2.9 ‘‘Related
Documentation from Texas Instruments’’ on page 66.
The Main PLL is controlled by the standard PLL Controller. The PLL Controller manages the clock ratios,
alignment, and gating for the system clocks to the device. Figure 7-7 shows a block diagram of the Main PLL and the
PLL Controller.
Figure 7-7
Main PLL and PLL Controller
AIF Module
PLL
PLLD
SYSCLK(N|P)
xPLLM
/2
0
ALTCORECLK(N|P)
PLLOUT
OUTPUT
DIVIDE
CORECLKSEL
1
BYPASS
1
0
0
1
PLLEN
0
PLLENSRC
PLL Controller
PLLDIV1
PLLDIV2
PLLDIV3
PLLDIV4
PLLDIV5
PLLDIV6
PLLDIV7
PLLDIV8
PLLDIV9
PLLDIV10
PLLDIV11
128
/1
SYSCLK1
C66x
CorePac
/x
SYSCLK2
/2
SYSCLK3
/3
SYSCLK4
/y
SYSCLK5
/64
SYSCLK6
/6
SYSCLK7
To Switch Fabric,
Peripherals,
Accelerators
/z
SYSCLK8
/12
SYSCLK9
/3
SYSCLK10
/6
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Note—The Main PLL Controller registers can be accessed by any master in the device. The PLLM[5:0] bits
of the multiplier are controlled by the PLLM Register inside the PLL Controller and the PLLM[12:6] bits are
controlled by the chip-level MAINPLLCTL0 Register. The Output Divide and Bypass logic of the PLL
are controlled by fields in the SECCTL Register in the PLL Controller. Only PLLDIV2, PLLDIV5, and
PLLDIV8 are programmable on the device. See the Phase Locked Loop (PLL) Controller for KeyStone Devices
User Guide in section 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66 for more details
on how to program the PLL controller.
The multiplication and division ratios within the PLL and the post-division for each of the chip-level clocks are
determined by a combination of this PLL and the PLL Controller. The PLL Controller also controls reset
propagation through the chip, clock alignment, and test points. The PLL Controller monitors the PLL status and
provides an output signal indicating when the PLL is locked.
Main PLL power is supplied externally via the Main PLL power-supply pin (AVDDA1). An external EMI filter
circuit must be added to all PLL supplies. See the Hardware Design Guide for KeyStone Devices in section
2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66 for detailed recommendations. For the best
performance, TI recommends that all the PLL external components be on a single side of the board without jumpers,
switches, or components other than those shown. For reduced PLL jitter, maximize the spacing between switching
signal traces and the PLL external components (C1, C2, and the EMI Filter).
The minimum SYSCLK rise and fall times should also be observed. For the input clock timing requirements, see
Section 7.5.5 ‘‘Main PLL Controller/SRIO/HyperLink/PCIe Clock Input Electrical Data/Timing’’.
CAUTION—The PLL Controller module as described in the see the Phase Locked Loop (PLL) Controller for
KeyStone Devices User Guide in2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66 includes
a superset of features, some of which are not supported on the TMS320C6670 device. The following sections
describe the registers that are supported; it should be assumed that any registers not included in these
sections is not supported by the device. Furthermore, only the bits within the registers described here are
supported. Avoid writing to any reserved memory location or changing the value of reserved bits.
7.5.1 Main PLL Controller Device-Specific Information
7.5.1.1 Internal Clocks and Maximum Operating Frequencies
The Main PLL, used to drive the CorePacs, the switch fabric, and a majority of the peripheral clocks (all but the
DDR3 and the PASS modules) requires a PLL controller to manage the various clock divisions, gating, and
synchronization. The Main PLL’s PLL Controller has several SYSCLK outputs that are listed below, along with the
clock description. Each SYSCLK has a corresponding divider that divides down the output clock of the PLL. Note
that dividers are not programmable unless explicitly mentioned in the description below.
• SYSCLK1: Full-rate clock for CorePac0~CorePac3, RAC, and RSA.
• SYSCLK2: 1/x-rate clock for CorePac (emulation) and the ADTF module. Default rate for this is 1/3. This is
programmable from /1 to /32, where this clock does not violate the max of 350 MHz. SYSCLK2 can be turned
off by software.
• SYSCLK3: 1/2-rate clock used to clock the MSMC, TCP3d, HyperLink, CPU/2 switch fabric, DDR EMIF and
CPU/2 EDMA.
• SYSCLK4: 1/3-rate clock for the switch fabrics and fast peripherals. The Debug_SS and ETBs will use this as
well.
• SYSCLK5: 1/y-rate clock used for system trace module. Default rate for this clock is 1/5, but is configurable to
a maximum of 210 MHz and a minimum of 32 MHz. SYSCLK5 can be turned off by software.
• SYSCLK6: 1/64-rate clock. 1/64 rate clock (emif_ptv) used to clock the PVT-compensated buffers for DDR3
EMIF.
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•
•
•
•
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SYSCLK7: 1/6-rate clock for slow peripherals and sources the SYSCLKOUT output pin.
SYSCLK8: 1/z-rate clock. This clock is used as slow_sysclck in the system. Default for this is 1/64. This is
programmable from /24 to /80.
SYSCLK9: 1/12-rate clock for SmartReflex.
SYSCLK10: 1/3-rate clock for SRIO only.
SYSCLK11: 1/6-rate clock for PSC only.
Only SYSCLK2, SYSCLK5, and SYSCLK8 are programmable on the TMS320C6670 device.
Note—In case any of the other programmable SYSCLKs are set slower than 1/64 rate, then SYSCLK8
(SLOW_SYSCLK) needs to be programmed to either match, or be slower than, the slowest SYSCLK in the
system.
7.5.1.2 Main PLL Controller Operating Modes
The Main PLL Controller has two modes of operation: bypass mode and PLL mode. The mode of operation is
determined by the BYPASS bit of the PLL Secondary Control Register (SECCTL). In PLL mode, SYSCLK1 is
generated from the PLL output using the values set in the PLLM and PLLD fields in the MAINPLLCTL0 Register.
In bypass mode, PLL input is fed directly out as SYSCLK1.
All hosts must hold off accesses to the DSP while the frequency of its internal clocks is changing. A mechanism must
be in place such that the DSP notifies the host when the PLL configuration has completed.
7.5.1.3 Main PLL Stabilization, Lock, and Reset Times
The PLL stabilization time is the amount of time that must be allotted for the internal PLL regulators to become
stable after device powerup. The PLL should not be operated until this stabilization time has elapsed.
The PLL reset time is the amount of wait time needed when resetting the PLL (writing PLLRST = 1), in order for the
PLL to properly reset, before bringing the PLL out of reset (writing PLLRST = 0). For the Main PLL reset time value,
see Table 7-13.
The PLL lock time is the amount of time needed from when the PLL is taken out of reset (PLLRST = 1) to when to
when the PLL Controller can be switched to PLL mode. The Main PLL lock time is given in Table 7-13.
Table 7-13
Main PLL Stabilization, Lock, and Reset Times
Min
PLL stabilization time
Typ
Unit
100
PLL lock time
PLL reset time
Max
μs
500 ×(PLLD
1000
(1)
+1) × C
(2)
ns
End of Table 7-13
1 PLLD is the value in PLLD bit fields of MAINPLLCTL0 register
2 C = SYSCLK1(N|P) cycle time in ns.
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7.5.2 PLL Controller Memory Map
The memory map of the PLL Controller is shown in Table 7-14. TMS320C6670-specific PLL Controller Register
definitions can be found in the sections following Table 7-14. For other registers in the table, see the Phase Locked
Loop (PLL) Controller for KeyStone Devices User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’
on page 66.
CAUTION—Note that only registers documented here are accessible on the TMS320C6670. Other addresses
in the PLL Controller memory map including the Reserved registers should not be modified. Furthermore,
only the bits within the registers described here are supported. Avoid writing to any Reserved memory
location or changing the value of reserved bits. It is recommended to use read-modify-write sequence to
make any changes to the valid bits in the register.
Table 7-14
PLL Controller Registers (Including Reset Controller) (Part 1 of 2)
Hex Address Range
Acronym
Register Name
0231 0000 - 0231 00E3
-
Reserved
0231 00E4
RSTYPE
Reset Type Status Register (Reset Controller)
0231 00E8
RSTCTRL
Software Reset Control Register (Reset Controller)
0231 00EC
RSTCFG
Reset Configuration Register (Reset Controller)
0231 00F0
RSISO
Reset Isolation Register (Reset Controller)
0231 00F0 - 0231 00FF
-
Reserved
0231 0100
PLLCTL
PLL Control Register
0231 0104
-
Reserved
0231 0108
SECCTL
PLL Secondary Control Register
0231 010C
-
Reserved
0231 0110
PLLM
PLL Multiplier Control Register
0231 0114
-
Reserved
0231 0118
PLLDIV1
Reserved
0231 011C
PLLDIV2
PLL Controller Divider 2 Register
0231 0120
PLLDIV3
Reserved
0231 0124
-
Reserved
0231 0128
-
Reserved
0231 012C - 0231 0134
-
Reserved
0231 0138
PLLCMD
PLL Controller Command Register
0231 013C
PLLSTAT
PLL Controller Status Register
0231 0140
ALNCTL
PLL Controller Clock Align Control Register
0231 0144
DCHANGE
PLLDIV Ratio Change Status Register
0231 0148
CKEN
Reserved
0231 014C
CKSTAT
Reserved
0231 0150
SYSTAT
SYSCLK Status Register
0231 0154 - 0231 015C
-
Reserved
0231 0160
PLLDIV4
Reserved
0231 0164
PLLDIV5
PLL Controller Divider 5 Register
0231 0168
PLLDIV6
Reserved
0231 016C
PLLDIV7
Reserved
0231 0170
PLLDIV8
PLL Controller Divider 8 Register
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Table 7-14
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PLL Controller Registers (Including Reset Controller) (Part 2 of 2)
Hex Address Range
Acronym
Register Name
0231 0174 - 0231 0193
PLLDIV9 - PLLDIV16
Reserved
0231 0194 - 0231 01FF
-
Reserved
End of Table 7-14
7.5.2.1 PLL Secondary Control Register (SECCTL)
The PLL Secondary Control Register contains extra fields to control the Main PLL and is shown in Figure 7-8 and
described in Table 7-15.
Figure 7-8
PLL Secondary Control Register (SECCTL))
31
24
23
22
19
18
0
Reserved
BYPASS
OUTPUT DIVIDE
Reserved
R-0000 0000
RW-1
RW-0001
RW-001 0000 0000 0000 0000
Legend: R/W = Read/Write; R = Read only; -n = value after reset
Table 7-15
PLL Secondary Control Register Field Descriptions
Bit
Field
Description
31-24
Reserved
Reserved
23
BYPASS
Main PLL bypass enable
0 = Main PLL bypass disabled
1 = Main PLL bypass enabled
22-19
OUTPUT DIVIDE
Output divider ratio bits
0h = ÷1. Divide frequency by 1
1h = ÷2. Divide frequency by 2
2h - Fh = Reserved
18-0
Reserved
Reserved
End of Table 7-15
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7.5.2.2 PLL Controller Divider Register (PLLDIV2, PLLDIV5, and PLLDIV8)
The PLL Controller Divider Registers (PLLDIV2, PLLDIV5, and PLLDIV8) are shown in Figure 7-9 and described
in Table 7-16. The default values of the RATIO field on a reset for PLLDIV2, PLLDIV5, and PLLDIV8 are different
and mentioned in the footnote of Figure 7-9.
Figure 7-9
PLL Controller Divider Register (PLLDIVn)
31
16
Reserved
15
Dn
R-0
(1)
14
8
EN
7
Reserved
R/W-1
0
RATIO
R-0
R/W-n
(2)
Legend: R/W = Read/Write; R = Read only; -n = value after reset
1 D2EN for PLLDIV2; D5EN for PLLDIV5; D8EN for PLLDIV8
2 n=02h for PLLDIV2; n=04h for PLLDIV5; n=3Fh for PLLDIV8
Table 7-16
PLL Controller Divider Register Field Descriptions
Bit
Field
Description
31-16
Reserved
Reserved
15
DnEN
Divider Dn enable bit (See footnote of Figure 7-9)
0 = Divider n is disabled
1 = No clock output. Divider n is enabled.
14-8
Reserved
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
7-0
RATIO
Divider ratio bits (See footnote of Figure 7-9)
0h = ÷1. Divide frequency by 1
1h = ÷2. Divide frequency by 2
2h = ÷3. Divide frequency by 3
3h = ÷4. Divide frequency by 4
4h - 4Fh = ÷5 to ÷80. Divide frequency range: divide frequency by 5 to divide frequency by 80.
End of Table 7-16
7.5.2.3 PLL Controller Clock Align Control Register (ALNCTL)
The PLL Controller Clock Align Control Register (ALNCTL) is shown in Figure 7-10 and described in Table 7-17.
Figure 7-10
PLL Controller Clock Align Control Register (ALNCTL)
31
8
7
6
5
4
3
2
1
0
Reserved
ALN8
Reserved
ALN5
Reserved
ALN2
Reserved
R-0
R/W-1
R-0
R/W-1
R-0
R/W-1
R-0
Legend: R/W = Read/Write; R = Read only; -n = value after reset, for reset value
Table 7-17
Bit
PLL Controller Clock Align Control Register Field Descriptions
Field
Description
Reserved
Reserved. This location is always read as 0. A value written to this field has no effect.
7
ALN8
4
ALN5
1
ALN2
SYSCLKn alignment. Do not change the default values of these fields.
0 = Do not align SYSCLKn to other SYSCLKs during GO operation. If SYSn in DCHANGE is set, SYSCLKn switches to the new
ratio immediately after the GOSET bit in PLLCMD is set.
1 = Align SYSCLKn to other SYSCLKs selected in ALNCTL when the GOSET bit in PLLCMD is set and SYSn in DCHANGE is 1.
The SYSCLKn rate is set to the ratio programmed in the RATIO bit in PLLDIVn.
31-8
6-5
3-2
0
End of Table 7-17
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7.5.2.4 PLLDIV Divider Ratio Change Status Register (DCHANGE)
Whenever a different ratio is written to the PLLDIVn registers, the PLLCTL flags the change in the DCHANGE
Status Register. During the GO operation, the PLL controller will change only the divide ratio of the SYSCLKs with
the bit set in DCHANGE. Note that the ALNCTL Register determines if that clock also needs to be aligned to other
clocks. The PLLDIV Divider Ratio Change Status Register is shown in Figure 7-11 and described in Table 7-18.
Figure 7-11
PLLDIV Divider Ratio Change Status Register (DCHANGE)
31
8
7
6
5
4
3
2
1
0
Reserved
SYS8
Reserved
SYS5
Reserved
SYS2
Reserved
R-0
R/W-0
R-0
R/W-0
R-0
R/W-0
R-0
Legend: R/W = Read/Write; R = Read only; -n = value after reset, for reset value
Table 7-18
Bit
PLLDIV Divider Ratio Change Status Register Field Descriptions
Field
Description
Reserved
Reserved. This bit location is always read as 0. A value written to this field has no effect.
7
SYS8
4
SYS5
1
SYS2
Identifies when the SYSCLKn divide ratio has been modified.
0 = SYSCLKn ratio has not been modified. When GOSET is set, SYSCLKn will not be affected.
1 = SYSCLKn ratio has been modified. When GOSET is set, SYSCLKn will change to the new ratio.
31-8
6-5
3-2
0
End of Table 7-18
7.5.2.5 SYSCLK Status Register (SYSTAT)
The SYSCLK Status Register (SYSTAT) shows the status of SYSCLK[11:1]. SYSTAT is shown in Figure 7-12 and
described in Table 7-19.
Figure 7-12
31
SYSCLK Status Register (SYSTAT)
11
Reserved
10
9
SYS11ON SYS10ON
R-n
R-1
R-1
8
7
6
5
4
3
2
1
0
SYS9ON
SYS8ON
SYS7ON
SYS6ON
SYS5ON
SYS4ON
SYS3ON
SYS2ON
SYS1ON
R-1
R-1
R-1
R-1
R-1
R-1
R-1
R-1
R-1
Legend: R/W = Read/Write; R = Read only; -n = value after reset
Table 7-19
SYSCLK Status Register Field Descriptions
Bit
Field
Description
31-11
Reserved
Reserved. This location is always read as 0. A value written to this field has no effect.
10-0
SYS[N (1)]ON
SYSCLK[N] on status
0 = SYSCLK[N] is gated
1 = SYSCLK[N] is on
End of Table 7-19
1 Where N = 1, 2, 3,....N (Not all these output clocks may be used on a specific device. For more information, see the device-specific data manual)
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7.5.2.6 Reset Type Status Register (RSTYPE)
The Reset Type Status (RSTYPE) Register latches the cause of the last reset. If multiple reset sources occur
simultaneously, this register latches the highest priority reset source. The Reset Type Status Register is shown in
Figure 7-13 and described in Table 7-20.
Figure 7-13
31
Reset Type Status Register (RSTYPE)
29
28
27
12
11
8
7
3
2
1
0
Reserved
EMU-RST
Reserved
WDRST[N]
Reserved
PLLCTRLRST
RESET
POR
R-0
R-0
R-0
R-0
R-0
R-0
R-0
R-0
Legend: R = Read only; -n = value after reset
Table 7-20
Reset Type Status Register Field Descriptions
Bit
Field
Description
31-29
Reserved
Reserved. Read only. Always reads as 0. Writes have no effect.
28
EMU-RST
Reset initiated by emulation
0 = Not the last reset to occur
1 = The last reset to occur
27-12
Reserved
Reserved. Read only. Always reads as 0. Writes have no effect.
11
WDRST3
10
WDRST2
9
WDRST1
Reset initiated by Watchdog Timer[N]
0 = Not the last reset to occur
1 = The last reset to occur
8
WDRST0
7-3
Reserved
Reserved. Read only. Always reads as 0. Writes have no effect.
2
PLLCTLRST
Reset initiated by PLLCTL
0 = Not the last reset to occur
1 = The last reset to occur
1
RESET
RESET reset
0 = RESET was not the last reset to occur
1 = RESET was the last reset to occur
0
POR
Power-on reset
0 = Power-on reset was not the last reset to occur
1 = Power-on reset was the last reset to occur
End of Table 7-20
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7.5.2.7 Reset Control Register (RSTCTRL)
This register contains a key that enables writes to the MSB of this register and the RSTCFG register. The key value
is 0x5A69. A valid key will be stored as 0x000C, any other key value is invalid. When the RSTCTRL or the RSTCFG
is written, the key is invalidated. Every write must be set up with a valid key. The Software Reset Control Register
(RSTCTRL) is shown in Figure 7-14 and described in Table 7-21.
Figure 7-14
Reset Control Register (RSTCTRL)
31
17
16
Reserved
15
0
SWRST
R-0x0000
R/W-0x
KEY
(1)
R/W-0x0003
Legend: R = Read only; -n = value after reset;
1 Writes are conditional based on valid key.
Table 7-21
Reset Control Register Field Descriptions
Bit
Field
Description
31-17
Reserved
Reserved
16
SWRST
Software reset
0 = Reset
1 = Not reset
15-0
KEY
Key used to enable writes to RSTCTRL and RSTCFG.
End of Table 7-21
7.5.2.8 Reset Configuration Register (RSTCFG)
This register is used to configure the type of reset initiated by RESET, the watchdog timer, and the PLL Controller’s
RSTCTRL Register; i.e., a hard reset or a soft reset. By default, these resets are hard resets. The Reset Configuration
Register (RSTCFG) is shown in Figure 7-15 and described in Table 7-22.
Figure 7-15
Reset Configuration Register (RSTCFG)
31
16
15
Reserved
14
Reserved
R-0x0000
13
12
PLLCTLRSTTYPE
R-00
R/W-0
(2)
11
RESETTYPE
R/W-0
2
4
Reserved
R-0x0
3
0
(1)
WDTYPE[N
]
2
R/W-0x00
Legend: R = Read only; R/W = Read/Write; -n = value after reset
1 Where N = 1, 2, 3,....N (Not all these output may be used on a specific device. For more information, see the device-specific data manual)
2 Writes are conditional based on valid key. For details, see Section 7.5.2.7 ‘‘Reset Control Register (RSTCTRL)’’.
Table 7-22
Reset Configuration Register Field Descriptions (Part 1 of 2)
Bit
Field
Description
31-14
Reserved
Reserved
13
PLLCTLRSTTYPE
PLL controller initiates a software-driven reset of type:
0 = Hard reset (default)
1 = Soft reset
12
RESETTYPE
RESET initiates a reset of type:
0 = Hard reset (default)
1 = Soft reset
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Table 7-22
Reset Configuration Register Field Descriptions (Part 2 of 2)
Bit
Field
Description
11-4
Reserved
Reserved
3
WDTYPE3
2
WDTYPE2
1
WDTYPE1
Watchdog timer [N] initiates a reset of type:
0 = Hard reset (default)
1 = Soft reset
0
WDTYPE0
End of Table 7-22
7.5.2.9 Reset Isolation Register (RSISO)
This register is used to select the module clocks that must maintain their clocking without pausing through non
power-on reset. Setting any of these bits effectively blocks reset to all PLLCTL Registers in order to maintain current
values of PLL multiplier, divide ratios and other settings. Along with setting module specific bit in RSISO, the
corresponding MDCTLx[12] bit also needs to be set in the PSC to reset-isolate a particular module. For more
information on the MDCTLx Register see the Power Sleep Controller (PSC) for KeyStone Devices User Guide in
2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66. The Reset Isolation register (RSTCTRL) is
shown in Figure 7-16 and described in Table 7-23.
Figure 7-16
Reset Isolation Register (RSISO)
31
16
15
10
9
8
7
4
3
2
0
Reserved
Reserved
SRIOISO
SRISO
Reserved
AIF2ISO
Reserved
R-0x0000
R-0x00
R/W-0
R/W-0
R-0x0
R/W-0
R-000
Legend: R = Read only; R/W = Read/Write; -n = value after reset
Table 7-23
Bit
Reset Isolation Register Field Descriptions
Field
Description
31-10
Reserved
Reserved.
9
SRIOISO
Isolate SRIO module control
0 = Not reset isolated
1 = Reset isolated
8
SRISO
Isolate SmartReflex control
0 = Not reset isolated
1 = Reset isolated
7-4
Reserved
Reserved
3
AIF2ISO
Isolate AIF2 module control
0 = Not reset isolated
1 = Reset isolated
2-0
Reserved
Reserved
End of Table 7-23
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7.5.3 Main PLL Control Registers
The Main PLL uses two chip-level registers (MAINPLLCTL0 and MAINPLLCTL1) along with the PLL Controller
for its configuration. These MMRs (memory-mapped registers) exist inside the Bootcfg space. To write to these
registers, software should go through an un-locking sequence using KICK0/KICK1 registers. For valid configurable
values of the MAINPLLCTL registers, see Section 2.4.3 ‘‘PLL Settings’’ on page 35. See Section 3.3.4 ‘‘Kicker
Mechanism (KICK0 and KICK1) Register’’ on page 73 for the address location of the KICK registers and their
locking and unlocking sequences. These registers reset only on a POR reset. See Figure 7-17 and Table 7-24 for
MAINPLLCTL0 details and Figure 7-18 and Table 7-25 for MAINPLLCTL1 details.
Figure 7-17
Main PLL Control Register (MAINPLLCTL0)
31
24
23
19
18
12
11
6
5
0
BWADJ[7:0]
Reserved
PLLM[12:6]
Reserved
PLLD
RW,+0000 0101
RW - 0000 0
RW,+0000000
RW, +000000
RW,+000000
Legend: RW = Read/Write; -n = value after reset
Table 7-24
Main PLL Control Register (MAINPLLCTL0) Field Descriptions
Bit
Field
Description
31-24
BWADJ[7:0]
BWADJ[11:8] and BWADJ[7:0] are located in MAINPLLCTL0 and MAINPLLCTL1 registers. BWADJ[11:0] should be
programmed to a value equal to half of PLLM[12:0] value (round down if PLLM has an odd value) Example: If PLLM = 15,
then BWADJ = 7
23-19
Reserved
Reserved
18-12
PLLM[12:6]
A 13-bit field that selects the values for the multiplication factor (see note below)
11-6
Reserved
Reserved
5-0
PLLD
A 6-bit field that selects the values for the reference divider
End of Table 7-24
Figure 7-18
Main PLL Control Register (MAINPLLCTL1)
31
7
6
5
4
3
0
Reserved
ENSAT
Reserved
BWADJ[11:8]
RW - 0000000000000000000000000
RW - 0
RW- 00
RW- 0000
Legend: RW = Read/Write; -n = value after reset
Table 7-25
Main PLL Control Register (MAINPLLCTL1) Field Descriptions
Bit
Field
Description
31-7
Reserved
Reserved
6
ENSAT
Needs to be set to 1 for proper operation of the Main PLL
5-4
Reserved
Reserved
3-0
BWADJ[11:8]
BWADJ[11:8] and BWADJ[7:0] are located in MAINPLLCTL0 and MAINPLLCTL1 registers. BWADJ[11:0] should be
programmed to a value equal to half of PLLM[12:0] value (round down if PLLM has an odd value) Example: If PLLM = 15,
then BWADJ = 7
End of Table 7-25
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Note—The PLLM[5:0] bits of the multiplier are controlled by the PLLM register inside the PLL Controller
and the PLLM[12:6] bits are controlled by the above chip-level register. MAINPLLCTL0 register
PLLM[12:6] bits should be written just before writing to PLLM register PLLM[5:0] bits in the controller to
have the complete 13 bit value latched when the GO operation is initiated in the PLL controller. See the
Phase Locked Loop (PLL) Controller for KeyStone Devices User Guide in “Related Documentation from Texas
Instruments” on page 66 for the recommended programming sequence. Output Divide ratio and Bypass
enable/disable of the Main PLL is also controlled by the SECCTL register in the PLL Controller. See the “PLL
Secondary Control Register (SECCTL)” on page 132 for more details.
7.5.4 Main PLL and PLL Controller Initialization Sequence
See the Phase Locked Loop (PLL) Controller for KeyStone Devices User Guide in “Related Documentation from Texas
Instruments” on page 66 for details on the initialization sequence for Main PLL and PLL Controller.
7.5.5 Main PLL Controller/SRIO/HyperLink/PCIe Clock Input Electrical Data/Timing
Table 7-26
Main PLL Controller/SRIO/HyperLink/PCIe Clock Input Timing Requirements
(1)
(see Figure 7-19 and Figure 7-20)
No.
Min
Max
Unit
SYSCLK[P:N]
3.25 or 6.51 or 8.138
(2)
ns
1
tc(SYSCLKN)
Cycle time SYSCLKN cycle time
1
tc(SYSCLKP)
Cycle time SYSCLKP cycle time
3
tw(SYSCLKN)
Pulse width SYSCLKN high
0.45*tc
0.55*tc
ns
2
tw(SYSCLKN)
Pulse width SYSCLKN low
0.45*tc
0.55*tc
ns
2
tw(SYSCLKP)
Pulse width SYSCLKP high
0.45*tc
0.55*tc
ns
3
tw(SYSCLKP)
Pulse width SYSCLKP low
0.45*tc
0.55*tc
ns
4
tr(SYSCLKN_250 mv)
Transition time SYSCLKN rise time (250 mV)
50
350
ps
4
tf(SYSCLKN_250 mv)
Transition time SYSCLKN fall time (250 mV)
50
350
ps
4
tr(SYSCLKP_250 mv)
Transition time SYSCLKP rise time (250 mV)
50
350
ps
4
tf(SYSCLKP_250 mv)
Transition time SYSCLKP fall time (250 mV)
50
350
ps
5
tj(SYSCLKN)
Jitter, peak_to_peak _ periodic SYSCLKN
(3)
5
tj(SYSCLKP)
Jitter, peak_to_peak _ periodic SYSCLKP
1
tc(ALTCORCLKN)
Cycle time ALTCORECLKN cycle time
1
tc(ALTCORECLKP)
Cycle time ALTCORECLKP cycle time
3.2
25
ns
3
tw(ALTCORECLKN)
Pulse width ALTCORECLKN high
0.45*tc(ALTCORECLKN)
0.55*tc(ALTCORECLKN)
ns
3.25 or 6.51 or 8.138
ns
)
ps
100 (4)
ps
25
ns
100 (4
ALTCORECLK[P:N]
3.2
2
tw(ALTCORECLKN)
Pulse width ALTCORECLKN low
0.45*tc(ALTCORECLKN)
0.55*tc(ALTCORECLKN)
ns
2
tw(ALTCORECLKP)
Pulse width ALTCORECLKP high
0.45*tc(ALTCORECLKP)
0.55*tc(ALTCORECLKP)
ns
3
tw(ALTCORECLKP)
Pulse width ALTCORECLKP low
0.45*tc(ALTCORECLKP)
0.55*tc(ALTCORECLKP)
ns
4
tr(ALTCORECLKN_250 mv)
Transition time ALTCORECLKN rise time (250 mV)
50
350
ps
4
tf(ALTCORECLKN_250 mv)
Transition time ALTCORECLKN fall time (250 mV)
50
350
ps
4
tr(ALTCORECLKP_250 mv)
Transition time ALTCORECLKP rise time (250 mV)
50
350
ps
50
4
tf(ALTCORECLKP_250 mv)
Transition time ALTCORECLKP fall time (250 mV)
350
ps
5
tj(ALTCORECLKN)
Jitter, peak_to_peak _ periodic ALTCORECLKN
100
ps
5
tj(ALTCORECLKP)
Jitter, peak_to_peak _ periodic ALTCORECLKP
100
ps
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Main PLL Controller/SRIO/HyperLink/PCIe Clock Input Timing Requirements (1)
(see Figure 7-19 and Figure 7-20)
No.
Min
Max
Unit
SRIOSGMIICLK[P:N]
1
tc(SRIOSMGMIICLKN)
Cycle time SRIOSMGMIICLKN cycle time
1
tc(SRIOSMGMIICLKP)
Cycle time SRIOSMGMIICLKP cycle time
3
tw(SRIOSMGMIICLKN)
Pulse width SRIOSMGMIICLKN high
3.2 or 4 or 6.4
ns
3.2 or 4 or 6.4
ns
0.45*tc(SRIOSGMIICLKN) 0.55*tc(SRIOSGMIICLKN)
ns
2
tw(SRIOSMGMIICLKN)
Pulse width SRIOSMGMIICLKN low
0.45*tc(SRIOSGMIICLKN) 0.55*tc(SRIOSGMIICLKN)
ns
2
tw(SRIOSMGMIICLKP)
Pulse width SRIOSMGMIICLKP high
0.45*tc(SRIOSGMIICLKP) 0.55*tc(SRIOSGMIICLKP)
ns
3
tw(SRIOSMGMIICLKP)
Pulse width SRIOSMGMIICLKP low
0.45*tc(SRIOSGMIICLKP) 0.55*tc(SRIOSGMIICLKP)
ns
4
tr(SRIOSMGMIICLKN_250mv)
Transition time SRIOSMGMIICLKN rise time
(250 mV)
50
350
ps
4
tf(SRIOSMGMIICLKN_250mv)
Transition time SRIOSMGMIICLKN fall time
(250 mV)
50
350
ps
4
tr(SRIOSMGMIICLKP_250mv)
Transition time SRIOSMGMIICLKP rise time
(250 mV)
50
350
ps
4
tf(SRIOSMGMIICLKP_250mv)
Transition time SRIOSMGMIICLKP fall time
(250 mV)
50
350
ps
5
tj(SRIOSMGMIICLKN)
Jitter, RMS SRIOSMGMIICLKN
4 ps, RMS
5
tj(SRIOSMGMIICLKP)
Jitter, RMS SRIOSMGMIICLKP
4 ps, RMS
5
tj(SRIOSMGMIICLKN)
Jitter, RMS SRIOSMGMIICLKN (SRIO not used)
8 ps, RMS
5
tj(SRIOSMGMIICLKP)
Jitter, RMS SRIOSMGMIICLKP (SRIO not used)
8 ps, RMS
HyperLink CLK[P:N]
1
tc(MCMCLKN)
Cycle time MCMCLKN cycle time
3.2 or 4 or 6.4
ns
1
tc(MCMCLKP)
Cycle time MCMCLKP cycle time
3.2 or 4 or 6.4
ns
3
tw(MCMCLKN)
Pulse width MCMCLKN high
0.45*tc(MCMCLKN)
0.55*tc(MCMCLKN)
ns
2
tw(MCMCLKN)
Pulse width MCMCLKN low
0.45*tc(MCMCLKN)
0.55*tc(MCMCLKN)
ns
2
tw(MCMCLKP)
Pulse width MCMCLKP high
0.45*tc(MCMCLKP)
0.55*tc(MCMCLKP)
ns
3
tw(MCMCLKP)
Pulse width MCMCLKP low
0.45*tc(MCMCLKP)
0.55*tc(MCMCLKP)
ns
4
tr(MCMCLKN_250mv)
Transition time MCMCLKN rise time (250 mV)
50
350
ps
4
tf(MCMCLKN_250mv)
Transition time MCMCLKN fall time (250 mV)
50
350
ps
4
tr(MCMCLKP_250mv)
Transition time MCMCLKP rise time (250 mV)
50
350
ps
4
tf(MCMCLKP_250mv)
Transition time MCMCLKP fall time (250 mV)
50
350
ps
5
tj(MCMCLKN)
Jitter, RMS MCMCLKN
4 ps, RMS
5
tj(MCMCLKP)
Jitter, RMS MCMCLKP
4 ps, RMS
1
tc(PCIECLKN)
Cycle time PCIECLKN cycle time
PCIECLK[P:N]
3.2 or 4 or 6.4 or 10
ns
1
tc(PCIECLKP)
Cycle time PCIECLKP cycle time
3
tw(PCIECLKN)
Pulse width PCIECLKN high
0.45*tc(PCIECLKN)
3.2 or 4 or 6.4 or 10
0.55*tc(PCIECLKN)
ns
ns
2
tw(PCIECLKN)
Pulse width PCIECLKN low
0.45*tc(PCIECLKN)
0.55*tc(PCIECLKN)
ns
2
tw(PCIECLKP)
Pulse width PCIECLKP high
0.45*tc(PCIECLKP)
0.55*tc(PCIECLKP)
ns
3
tw(PCIECLKP)
Pulse width PCIECLKP low
0.45*tc(PCIECLKP)
0.55*tc(PCIECLKP)
ns
4
tr(PCIECLKN_250mv)
Transition time PCIECLKN rise time (250 mV)
50
350
ps
4
tf(PCIECLKN_250mv)
Transition time PCIECLKN fall time (250 mV)
50
350
ps
4
tr(PCIECLKP_250mv)
Transition time PCIECLKP rise time (250 mV)
50
350
ps
4
tf(PCIECLKP_250mv)
Transition time PCIECLKP fall time (250 mV)
50
350
ps
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Table 7-26
Main PLL Controller/SRIO/HyperLink/PCIe Clock Input Timing Requirements
(1)
(see Figure 7-19 and Figure 7-20)
No.
Min
Max
Unit
5
tj(PCIECLKN)
Jitter, RMS PCIECLKN
4 ps, RMS
5
tj(PCIECLKP)
Jitter, RMS PCIECLKP
4 ps, RMS
End of Table 7-26
1 See the Hardware Design Guide for KeyStone Devices in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66 for detailed recommendations.
2 If AIF2 is being used then SYSCLK(N|P) can be programmed only to fixed values, if AIF2 is not being used then any value in the range between the min and max values can
be used.
3 If AIF2 is used then the Max allowed jitter on SYSCLK(N|P) is 4ps RMS
Figure 7-19
Main PLL Controller/SRIO/HyperLink/PCIe Clock Input Timing
1
2
3
<CLK_NAME>CLKN
<CLK_NAME>CLKP
4
Figure 7-20
5
Main PLL Transition Time
peak-to-peak differential input
voltage (250 mV to 2 V)
0
250 mV peak-to-peak
TR = 50 ps min to 350 ps max (10% to 90 %)
for the 250 mV peak-to-peak centered at zero crossing
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7.6 DDR3 PLL
The DDR3 PLL generates interface clocks for the DDR3 memory controller. When coming out of power-on reset,
DDR3 PLL is programmed to a valid frequency during the boot config before being enabled and used.
DDR3 PLL power is supplied via the DDR3 PLL power-supply pin (AVDDA2). An external EMI filter circuit must
be added to all PLL supplies. See the Hardware Design Guide for KeyStone Devices in 2.9 ‘‘Related Documentation
from Texas Instruments’’ on page 66 for detailed recommendations. For the best performance, TI recommends that
all the PLL external components be on a single side of the board without jumpers, switches, or components other
than those shown. For reduced PLL jitter, maximize the spacing between switching signal traces and the PLL
external components (C1, C2, and the EMI Filter).
Figure 7-21
DDR3 PLL Block Diagram
DDR3 PLL
PLLD
xPLLM
/2
0
DDRCLK(N|P)
PLLOUT
DDR3
PHY
1
BYPASS
7.6.1 DDR3 PLL Control Registers
The DDR3 PLL, which is used to drive the DDR PHY for the EMIF, does not use a PLL controller. DDR3 PLL can
be controlled using the DDR3PLLCTL0 and DDR3PLLCTL1 registers located in the Bootcfg module. This MMR
(memory-mapped register) exists inside the Bootcfg space. To write to these registers, software should go through
an un-locking sequence using KICK0/KICK1 registers. For suggested configurable values see 2.4.3 ‘‘PLL Settings’’
on page 35. See 3.3.4 ‘‘Kicker Mechanism (KICK0 and KICK1) Register’’ on page 73 for the address location of the
registers and locking and unlocking sequences for accessing the registers. These registers are reset on POR only.
.
Figure 7-22
DDR3 PLL Control Register (DDR3PLLCTL0) (1)
31
24
23
22
19
18
6
5
0
BWADJ[7:0]
BYPASS
Reserved
PLLM
PLLD
RW,+0000 1001
RW,+0
RW,+0001
RW,+0000000010011
RW,+000000
Legend: RW = Read/Write; -n = value after reset
1 This register is Reset on POR only
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Table 7-27
DDR3 PLL Control Register 0 Field Descriptions
Bit
Field
Description
31-24
BWADJ[7:0]
BWADJ[11:8] and BWADJ[7:0] are located in DDR3PLLCTL0 and DDR3PLLCTL1 registers. BWADJ[11:0] should be
programmed to a value equal to half of PLLM[12:0] value (round down if PLLM has an odd value) Example: If PLLM = 15,
then BWADJ = 7
23
BYPASS
Enable bypass mode
0 = Bypass disabled
1 = Bypass enabled
22-19
Reserved
Reserved
18-6
PLLM
A 13-bit field that selects the values for the multiplication factor
5-0
PLLD
A 6-bit field that selects the values for the reference divider
End of Table 7-27
Figure 7-23
DDR3 PLL Control Register 1 (DDR3PLLCTL1)
31
14
13
12
7
6
5
4
3
0
Reserved
PLLRST
Reserved
ENSAT
Reserved
BWADJ[11:8]
RW-000000000000000000
RW-0
RW-000000
RW-0
R-0
RW-0000
Legend: RW = Read/Write; -n = value after reset
Table 7-28
DDR3 PLL Control Register 1 Field Descriptions (DDR3PLLCTL1)
Bit
Field
Description
31-14
Reserved
Reserved
13
PLLRST
PLL reset bit.
0 = PLL reset is released.
1 = PLL reset is asserted.
12-7
Reserved
Reserved
6
ENSAT
Needs to be set to 1 for proper operation of PLL
5-4
Reserved
Reserved
3-0
BWADJ[11:8]
BWADJ[11:8] and BWADJ[7:0] are located in DDR3PLLCTL0 and DDR3PLLCTL1 registers. BWADJ[11:0] should be
programmed to a value equal to half of PLLM[12:0] value (round down if PLLM has an odd value) Example: If PLLM = 15,
then BWADJ = 7
End of Table 7-28
7.6.2 DDR3 PLL Device-Specific Information
As shown in Figure 7-21, the output of DDR3 PLL (PLLOUT) is divided by 2 and directly fed to the DDR3 memory
controller. The DDR3 PLL is affected by power-on reset. During power-on resets, the internal clocks of the DDR3
PLL are affected as described in Section 7.4 ‘‘Reset Controller’’ on page 122. DDR3 PLL is unlocked only during the
power-up sequence and is locked by the time the RESETSTAT pin goes high. It does not lose lock during any of the
other resets.
7.6.3 DDR3 PLL Initialization Sequence
The Main PLL and PLL Controller must always be initialized prior to initializing the DDR3 PLL. The sequence
shown below must be followed to initialize the DDR3 PLL.
1. In DDR3PLLCTL1, write ENSAT = 1 (for optimal PLL operation)
2. In DDR3PLLCTL0, write BYPASS = 1 (set the PLL in Bypass)
3. In DDR3PLLCTL1, write PLLRST = 1 (PLL is reset)
4. Program PLLM and PLLD in DDR3PLLCTL0 register
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5. Program BWADJ[7:0] in DDR3PLLCTL0 and BWADJ[11:8] in DDR3PLLCTL1 register. BWADJ value must
be set to ((PLLM + 1) >> 1) - 1)
6. Wait for at least 5 μs based on the reference clock (PLL reset time)
7. In DDR3PLLCTL1, write PLLRST = 0 (PLL reset is released)
8. Wait for at least 500 *REFCLK cycles * (PLLD + 1) (PLL lock time)
9. In DDR3PLLCTL0, write BYPASS = 0 (switch to PLL mode)
CAUTION—Software must always perform Read-modify-write to any register in the PLL. This is to ensure
that only the relevant bits in the register are modified and the rest of the bits including the reserved bits are
not affected.
7.6.4 DDR3 PLL Input Clock Electrical Data/Timing
Table 7-29
DDR3 PLL DDRCLK(N|P) Timing Requirements
(see Figure 7-24 and Figure 7-20)
No.
Min
Max
Unit
DDRCLK[P:N]
1
tc(DDRCLKN)
Cycle time _ DDRCLKN cycle time
3.2
25
ns
1
tc(DDRCLKP)
Cycle time _ DDRCLKP cycle time
3.2
25
ns
3
tw(DDRCLKN)
Pulse width _ DDRCLKN high
0.45*tc(DDRCLKN)
0.55*tc(DDRCLKN)
ns
2
tw(DDRCLKN)
Pulse width _ DDRCLKN low
0.45*tc(DDRCLKN)
0.55*tc(DDRCLKN)
ns
2
tw(DDRCLKP)
Pulse width _ DDRCLKP high
0.45*tc(DDRCLKP)
0.55*tc(DDRCLKP)
ns
3
tw(DDRCLKP)
Pulse width _ DDRCLKP low
0.45*tc(DDRCLKP)
0.55*tc(DDRCLKP)
ns
4
tr(DDRCLKN_250 mv) Transition time _ DDRCLKN rise time (250 mV)
50
350
ps
4
tf(DDRCLKN_250 mv) Transition time _ DDRCLKN fall time (250 mV)
50
350
ps
4
tr(DDRCLKP_250 mv) Transition time _ DDRCLKP rise time (250 mV)
50
350
ps
4
tf(DDRCLKP_250 mv) Transition time _ DDRCLKP fall time (250 mV)
50
350
ps
5
tj(DDRCLKN)
Jitter, peak_to_peak _ periodic DDRCLKN
0.025*tc(DDRCLKN)
ps
5
tj(DDRCLKP)
Jitter, peak_to_peak _ periodic DDRCLKP
0.025*tc(DDRCLKP)
ps
End of Table 7-29
Figure 7-24
DDR3 PLL DDRCLK Timing
1
2
3
DDRCLKN
DDRCLKP
4
5
7.7 PASS PLL
The PASS PLL generates interface clocks for the Network Coprocessor. Using the PACLKSEL pin the user can select
the input source of PASS PLL as either the output of Main PLL mux or the PASSCLK clock reference sources. When
coming out of power-on reset, PASS PLL comes out in a bypass mode and needs to be programmed to a valid
frequency before being enabled and used.
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PASS PLL power is supplied via the PASS PLL power-supply pin (AVDDA3). An external EMI filter circuit must be
added to all PLL supplies. Please see the Hardware Design Guide for KeyStone Devices in 2.9 ‘‘Related
Documentation from Texas Instruments’’ on page 66 for detailed recommendations. For the best performance, TI
recommends that all the PLL external components be on a single side of the board without jumpers, switches, or
components other than those shown. For reduced PLL jitter, maximize the spacing between switching signal traces
and the PLL external components (C1, C2, and the EMI Filter).
Figure 7-25
PASS PLL Block Diagram
SYSCLK(P|N)
PLLOUT
PLL
ALTCORECLK(P|N)
PLL
Controller
SYSCLKn
C66x
CorePac
SYSCLK1
CORECLKSEL
PASS PLL
PLLD
xPLLM
/3
//2
Network
Coprocessor
0
PASSCLK(P|N)
PLLOUT
PACLKSEL
1
BYPASS
PASSPLLCTL1[13]
7.7.1 PASS PLL Control Registers
The PASS PLL, which is used to drive the Network Coprocessor, does not use a PLL controller. PASS PLL can be
controlled using the PAPLLCTL0 and PAPLLCTL1 registers located in Bootcfg module. These MMRs
(memory-mapped registers) exist inside the Bootcfg space. To write to these registers, software should go through
an un-locking sequence using KICK0/KICK1 registers. For suggested configurable values see 2.4.3 ‘‘PLL Settings’’
on page 35. See 3.3.4 ‘‘Kicker Mechanism (KICK0 and KICK1) Register’’ on page 73 for the address location of the
registers and locking and unlocking sequences for accessing these registers. These registers are reset on POR only.
.
Figure 7-26
PASS PLL Control Register (PASSPLLCTL0) (1)
31
24
23
22
19
18
6
5
0
BWADJ[7:0]
BYPASS
Reserved
PLLM
PLLD
RW,+0000 1001
RW,+0
RW,+0001
RW,+0000000010011
RW,+000000
Legend: RW = Read/Write; -n = value after reset
1 This register is Reset on POR only.
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Table 7-30
www.ti.com
PASS PLL Control Register 0 Field Descriptions (PASSPLLCTL0)
Bit
Field
Description
31-24
BWADJ[7:0]
BWADJ[11:8] and BWADJ[7:0] are located in PASSPLLCTL0 and PASSPLLCTL1 registers. BWADJ[11:0] should be
programmed to a value equal to half of PLLM[12:0] value (round down if PLLM has an odd value) Example: If PLLM = 15,
then BWADJ = 7
23
BYPASS
Enable bypass mode
0 = Bypass disabled
1 = Bypass enabled
22-19
Reserved
Reserved
18-6
PLLM
A 13-bit field that selects the values for the multiplication factor (see note below)
5-0
PLLD
A 6-bit field that selects the values for the reference divider
End of Table 7-30
Figure 7-27
PASS PLL Control Register 1 (PASSPLLCTL1)
31
15
14
13
12
7
6
5
4
3
0
Reserved
PLLRST
PLLSELECT
Reserved
ENSAT
Reserved
BWADJ[11:8]
RW-00000000000000000
RW-0
0
RW-0000000
RW-0
R-0
RW-0000
Legend: RW = Read/Write; -n = value after reset
Table 7-31
PASS PLL Control Register 1 Field Descriptions (PASSPLLCTL1)
Bit
Field
Description
31-15
Reserved
Reserved
14
PLLRST
PLL reset bit
0 = PLL reset is released.
1 = PLL reset is asserted.
13
PLLSELECT
PASS PLL Select Bit
0 - Reserved
1 - PASS PLL output clock is used as the input to PASS
12-7
Reserved
Reserved
6
ENSAT
Needs to be set to 1 for proper operation of PLL
5-4
Reserved
Reserved
3-0
BWADJ[11:8]
BWADJ[11:8] and BWADJ[7:0] are located in PASSPLLCTL0 and PASSPLLCTL1 registers. BWADJ[11:0] should be
programmed to a value equal to half of PLLM[12:0] value (round down if PLLM has an odd value) Example: If PLLM = 15,
then BWADJ = 7
End of Table 7-31
7.7.2 PASS PLL Device-Specific Information
As shown in Figure 7-25, the output of PASS PLL (PLLOUT) is divided by 3 and directly fed to the Network
Coprocessor. The PASS PLL is affected by power-on reset. During power-on resets, the internal clocks of the PASS
PLL are affected as described in Section 7.4 ‘‘Reset Controller’’ on page 122. The PASS PLL is unlocked only during
the power-up sequence and is locked by the time the RESETSTAT pin goes high. It does not lose lock during any of
the other resets.
7.7.3 PASS PLL Initialization Sequence
The Main PLL and PLL Controller must always be initialized prior to initializing the PASS PLL. The sequence shown
below must be followed to initialize the PASS PLL.
1. In PASSPLLCTL1, write ENSAT = 1 (for optimal PLL operation)
2. In PASSPLLCTL0, write BYPASS = 1 (set the PLL in Bypass)
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3. In PASSPLLCTL1, write PLLRST = 1 (PLL is reset)
4. Program PLLM and PLLD in PASSPLLCTL0 register
5. Program BWADJ[7:0] in PASSPLLCTL0 and BWADJ[11:8] in PASSPLLCTL1 register. BWADJ value must
be set to ((PLLM + 1) >> 1) - 1)
6. Wait for at least 5 μs based on the reference clock (PLL reset time)
7. In PASSPLLCTL1, write PLLSELECT = 1 (for selecting the output of PASS PLL as the input to PASS)
8. In PASSPLLCTL1, write PLLRST = 0 (PLL reset is released)
9. Wait for at least 500 * REFCLK cycles * (PLLD + 1) (PLL lock time)
10. In PASSPLLCTL0, write BYPASS = 0 (switch to PLL mode)
CAUTION—Software must always perform Read-modify-write to any register in the PLL. This is to ensure
that only the relevant bits in the register are modified and the rest of the bits including the reserved bits are
not affected.
7.7.4 PASS PLL Input Clock Electrical Data/Timing
Table 7-32
PASS PLL Timing Requirements
(See Figure 7-28 and Figure 7-20)
No.
Min
Max
Unit
PASSCLK[P:N]
1
tc(PASSCLKN)
1
tc(PASSCLKP)
Cycle time _ PASSCLKP cycle time
3.2
6.4
ns
3
tw(PASSCLKN)
Pulse width _ PASSCLKN high
0.45*tc(PASSCLKN)
0.55*tc(PASSCLKN)
ns
2
tw(PASSCLKN)
Pulse width _ PASSCLKN low
0.45*tc(PASSCLKN)
0.55*tc(PASSCLKN)
ns
2
tw(PASSCLKP)
Pulse width _ PASSCLKP high
0.45*tc(PASSCLKP)
0.55*tc(PASSCLKP)
ns
3
tw(PASSCLKP)
Pulse width _ PASSCLKP low
0.45*tc(PASSCLKP)
0.55*tc(PASSCLKP)
ns
4
tr(PASSCLKN_250mv) Transition time _ PASSCLKN rise time (250 mV)
50
350
ps
4
tf(PASSCLKN_250mv)
Transition time _ PASSCLKN fall time (250 mV)
50
350
ps
4
tr(PASSCLKP_250mv)
Transition time _ PASSCLKP rise time (250 mV)
50
350
ps
4
tf(PASSCLKP_250mv)
Transition time _ PASSCLKP fall time (250 mV)
50
350
ps
5
tj(PASSCLKN)
Jitter, peak_to_peak _ periodic PASSCLKN
100
ps, pk-pk
5
tj(PASSCLKP)
Jitter, peak_to_peak _ periodic PASSCLKP
100
ps, pk-pk
Figure 7-28
Cycle time _ PASSCLKN cycle time
3.2
6.4
ns
PASS PLL Timing
1
2
3
PASSCLKN
PASSCLKP
4
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7.8 Enhanced Direct Memory Access (EDMA3) Controller
The primary purpose of the EDMA3 is to service user-programmed data transfers between two memory-mapped
slave endpoints on the device. The EDMA3 services software-driven paging transfers (e.g., data movement between
external memory and internal memory), performs sorting or subframe extraction of various data structures, services
event driven peripherals, and offloads data transfers from the device CPU.
There are 3 EDMA channel controllers on the device: EDMA3CC0, EDMA3CC1, and EDMA3CC2.
• EDMA3CC0 has two transfer controllers: EDMA3TC1 andEDMA3TC2.
• EDMA3CC1 has four transfer controllers: EDMA3TC0, EDMA3TC1, EDMA3TC2, and EDMA3TC3.
• EDMA3CC2 has four transfer controllers: EDMA3TC0, EDMA3TC1, EDMA3TC2, and EDMA3TC3.
In the context of this document, EDMA3TCx is associated with EDMA3CCy, and is referred to as EDMA3CCy TCx.
Each of the transfer controllers has a direct connection to the switch fabric. Section 4.2 ‘‘Switch Fabric
Connections Matrix’’ lists the peripherals that can be accessed by the transfer controllers.
EDMA3CC0 is optimized to be used for transfers to/from/within the MSMC and DDR-3 subsytems. The others are
used for the remaining traffic.
Each EDMA3 channel controller includes the following features:
• Fully orthogonal transfer description
– 3 transfer dimensions:
› Array (multiple bytes)
› Frame (multiple arrays)
› Block (multiple frames)
– Single event can trigger transfer of array, frame, or entire block
– Independent indexes on source and destination
• Flexible transfer definition:
– Increment or FIFO transfer addressing modes
– Linking mechanism allows for ping-pong buffering, circular buffering, and repetitive/continuous
transfers, all with no CPU intervention
– Chaining allows multiple transfers to execute with one event
• 128 PaRAM entries for EDMA3CC0, 512 each for EDMA3CC1 and EDMA3CC2
– Used to define transfer context for channels
– Each PaRAM entry can be used as a DMA entry, QDMA entry, or link entry
• 16 DMA channels for EDMA3CC0, 64 each for EDMA3CC1 and EDMA3CC2
– Manually triggered (CPU writes to channel controller register), external event triggered, and chain
triggered (completion of one transfer triggers another)
• 8 Quick DMA (QDMA) channels per EDMA3CCx
– Used for software-driven transfers
– Triggered upon writing to a single PaRAM set entry
• Two transfer controllers and two event queues with programmable system-level priority for EDMA3CC0, four
transfer controllers and four event queues with programmable system-level priority for each of EDMA3CC1
and EDMA3CC2
• Interrupt generation for transfer completion and error conditions
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•
Debug visibility
– Queue watermarking/threshold allows detection of maximum usage of event queues
– Error and status recording to facilitate debug
7.8.1 EDMA3 Device-Specific Information
The EDMA supports two addressing modes: constant addressing and increment addressing mode. Constant
addressing mode is applicable to a very limited set of use cases; for most applications increment mode can be used.
On the C6670 SoC, the EDMA can use constant addressing mode only with the enhanced Viterbi decoder
coprocessor (VCP) and the enhanced turbo decoder coprocessor (TCP). Constant addressing mode is not supported
by any other peripheral or internal memory in the DSP. Note that increment mode is supported by all peripherals,
including VCP and TCP. For more information on these two addressing modes, see the Enhanced Direct Memory
Access 3 (EDMA3) for KeyStone Devices User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on
page 66.
For the range of memory addresses that include EDMA3 channel controller (EDMA3CC) control registers and
EDMA3 transfer controller (EDMA3TC) control register see Section 2.2 ‘‘Memory Map Summary’’ on page 21.
For memory offsets and other details on EDMA3CC and EDMA3TC Control Registers entries, see the Enhanced
Direct Memory Access 3 (EDMA3) for KeyStone Devices User Guide in 2.9 ‘‘Related Documentation from Texas
Instruments’’ on page 66.
7.8.2 EDMA3 Channel Controller Configuration
Table 7-33 provides the configuration for each of the EDMA3 channel controllers present on the device.
Table 7-33
EDMA3 Channel Controller Configuration
Description
EDMA3 CC0
EDMA3 CC1
EDMA3 CC2
Number of DMA channels in channel controller
16
64
64
Number of QDMA channels
8
8
8
Number of interrupt channels
16
64
64
Number of PaRAM set entries
128
512
512
Number of event queues
2
4
4
Number of transfer controllers
2
4
4
Memory protection existence
Yes
Yes
Yes
Number of memory protection and shadow regions
8
8
8
End of Table 7-33
7.8.3 EDMA3 Transfer Controller Configuration
Each transfer controller on the device is designed differently based on considerations like performance
requirements, system topology (like main TeraNet bus width, external memory bus width), etc. The parameters that
determine the transfer controller configurations are:
• FIFOSIZE: Determines the size in bytes for the data FIFO that is the temporary buffer for the in-flight data.
The data FIFO is where the read return data read by the TC read controller from the source endpoint is stored
and subsequently written out to the destination endpoint by the TC write controller.
• BUSWIDTH: The width of the read and write data buses in bytes, for the TC read and write controller,
respectively. This is typically equal to the bus width of the main TeraNet interface.
• Default Burst Size (DBS): The DBS is the maximum number of bytes per read/write command issued by a
transfer controller.
• DSTREGDEPTH: This determines the number of destination FIFO register set. The number of destination
FIFO register set for a transfer controller determines the maximum number of outstanding transfer requests.
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All four parameters listed above are fixed by the design of the device.
Table 7-34 shows the configuration of each of the EDMA3 transfer controllers present on the device.
Table 7-34
EDMA3 Transfer Controller Configuration
EDMA3CC0
Parameter
TC0
TC1
EDMA3CC1
TC0
TC1
EDMA3CC2
TC2
TC3
TC0
TC1
TC2
TC3
FIFOSIZE
1024 bytes
1024 bytes
1024 bytes
512 bytes
1024 bytes
512 bytes
1024 bytes
512 bytes
512 bytes
1024 bytes
BUSWIDTH
32 bytes
32 bytes
16 bytes
16 bytes
16 bytes
16 bytes
16 bytes
16 bytes
16 bytes
16 bytes
DSTREGDEPTH
4 entries
4 entries
4 entries
4 entries
4 entries
4 entries
4 entries
4 entries
4 entries
4 entries
DBS
128 bytes
128 bytes
64 bytes
64 bytes
64 bytes
64 bytes
64 bytes
64 bytes
64 bytes
64 bytes
End of Table 7-34
7.8.4 EDMA3 Channel Synchronization Events
The EDMA3 supports up to 16 DMA channels for CC0, 64 each for CC1 and CC2 that can be used to service system
peripherals and to move data between system memories. DMA channels can be triggered by synchronization events
generated by system peripherals. The following tables lists the source of the synchronization event associated with
each of the EDMA CC DMA channels. On the C6670, the association of each synchronization event and DMA
channel is fixed and cannot be reprogrammed.
For more detailed information on the EDMA3 module and how EDMA3 events are enabled, captured, processed,
prioritized, linked, chained, and cleared, etc., see the Enhanced Direct Memory Access 3 (EDMA3) for KeyStone
Devices User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66.
Table 7-35
EDMA3CC0 Events for C6670
Event Number
Event
Event Description
0
TCP3D_C_REVT0
TCP3d_C Receive event0
1
TCP3D_C_REVT1
TCP3d_C Receive event1
2
FFTC_C_ERROR0
FFTC_C Error event and FFTC_C debug event
3
FFTC_C_ERROR1
FFTC_C Error event and FFTC_C debug event
4
FFTC_C_ERROR2
FFTC_C Error event and FFTC_C debug event
5
FFTC_C_ERROR3
FFTC_C Error event and FFTC_C debug event
6
CIC2_OUT40
Interrupt Controller output
7
CIC2_OUT41
Interrupt Controller output
8
CIC2_OUT0
Interrupt Controller output
9
CIC2_OUT1
Interrupt Controller output
10
CIC2_OUT2
Interrupt Controller output
11
CIC2_OUT3
Interrupt Controller output
12
CIC2_OUT4
Interrupt Controller output
13
CIC2_OUT5
Interrupt Controller output
14
CIC2_OUT6
Interrupt Controller output
15
CIC2_OUT7
Interrupt Controller output
End of Table 7-35
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Table 7-36
EDMA3CC1 Events for C6670 (Part 1 of 2)
Event Number
Event
Event Description
0
SPIINT0
SPI interrupt
1
SPIINT1
SPI interrupt
2
SPIXEVT
Transmit event
3
SPIREVT
Receive event
4
I2CREVT
I2C receive event
5
I2CXEVT
I C transmit event
6
GPINT0
GPIO interrupt
7
GPINT1
GPIO interrupt
8
GPINT2
GPIO interrupt
2
9
GPINT3
GPIO interrupt
10
AIF_SEVT0
AIF radio timing sync event 0
11
AIF_SEVT1
AIF radio timing sync event 1
12
AIF_SEVT2
AIF radio timing sync event 2
13
AIF_SEVT3
AIF radio timing sync event 3
14
AIF_SEVT4
AIF radio timing sync event 4
15
AIF_SEVT5
AIF radio timing sync event 5
16
AIF_SEVT6
AIF radio timing sync event 6
17
AIF_SEVT7
AIF radio timing sync event 7
18
SEMINT0
Semaphore interrupt
19
SEMINT1
Semaphore interrupt
20
SEMINT2
Semaphore interrupt
21
SEMINT3
Semaphore interrupt
22
TINT4L
Timer interrupt low
23
TINT4H
Timer interrupt high
24
TINT5L
Timer interrupt low
25
TINT5H
Timer interrupt high
26
TINT6L
Timer interrupt low
27
TINT6H
Timer interrupt high
28
TINT7L
Timer interrupt low
29
TINT7H
Timer interrupt high
30
RAC_AINT0
RAC_A_ interrupt 0
31
RAC_AINT1
RAC_A_ interrupt 1
32
RAC_AINT2
RAC_A_interrupt 2
33
RAC_AINT3
RAC_A_interrupt 3
34
RAC_ADEVENT0
RAC_A_debug event
35
RAC_ADEVENT1
RAC_A_debug event
36
TAC_INTD
TAC error interrupt
37
TACDEVENT0
TAC debug event
38
TACDEVENT1
TAC debug event
39
RAC_BINT0
RAC_B_ interrupt 0
40
RAC_BINT1
RAC_B_ interrupt 1
41
RAC_BINT2
RAC_B_interrupt 2
42
RAC_BINT3
RAC_B_interrupt 3
43
RAC_BDEVENT0
RAC_B_debug Event
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Table 7-36
www.ti.com
EDMA3CC1 Events for C6670 (Part 2 of 2)
Event Number
Event
Event Description
44
RAC_BDEVENT1
RAC_B_debug Event
45
CIC1_OUT2
Interrupt Controller output
46
CIC1_OUT3
Interrupt Controller output
47
CIC1_OUT4
Interrupt Controller output
48
CIC1_OUT5
Interrupt Controller output
49
CIC1_OUT6
Interrupt Controller output
50
CIC1_OUT7
Interrupt Controller output
51
CIC1_OUT8
Interrupt Controller output
52
CIC1_OUT9
Interrupt Controller output
53
CIC1_OUT10
Interrupt Controller output
54
CIC1_OUT11
Interrupt Controller output
55
CIC1_OUT12
Interrupt Controller output
56
CIC1_OUT13
Interrupt Controller output
57
CIC1_OUT14
Interrupt Controller output
58
CIC1_OUT15
Interrupt Controller output
59
CIC1_OUT16
Interrupt Controller output
60
CIC1_OUT17
Interrupt Controller output
61
CIC1_OUT18
Interrupt Controller output
62
CIC1_OUT19
Interrupt Controller output
63
CIC1_OUT20
Interrupt Controller output
End of Table 7-36
Table 7-37
EDMA3CC2 Events for C6670 (Part 1 of 3)
Event Number
Event
Event Description
0
TCP3D_AREVT0
TCP3D_A receive event0
1
TCP3D_AREVT1
TCP3D_A receive event1
2
TCP3EREVT
TCP3e read event
3
TCP3EWEVT
TCP3e write event
4
URXEVT
UART receive event
5
UTXEVT
UART transmit event
6
GPINT0
GPIO interrupt
7
GPINT1
GPIO interrupt
8
GPINT2
GPIO interrupt
9
GPINT3
GPIO interrupt
10
VCPAREVT
Receive event
11
VCPAXEVT
Transmit event
12
VCPBREVT
Receive event
13
VCPBXEVT
Transmit event
14
VCPCREVT
Receive event
15
VCPCXEVT
Transmit event
16
VCPDREVT
Receive event
17
VCPDXEVT
Transmit event
18
SEMINT0
Semaphore interrupt
19
SEMINT1
Semaphore interrupt
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Table 7-37
EDMA3CC2 Events for C6670 (Part 2 of 3)
Event Number
Event
Event Description
20
SEMINT2
Semaphore interrupt
21
SEMINT3
Semaphore interrupt
22
TINT4L
Timer interrupt low
23
TINT4H
Timer interrupt high
24
TINT5L
Timer interrupt low
25
TINT5H
Timer interrupt high
26
TINT6L
Timer interrupt low
27
TINT6H
Timer interrupt high
28
TINT7L
Timer interrupt low
29
TINT7H
Timer interrupt high
30
SPIXEVT
SPI transmit event
31
SPIREVT
SPI receive event
32
I2CREVT
I C receive event
33
I2CXEVT
I C transmit event
34
TCP3D_BREVT0
TCP3D_B receive event0
35
TCP3D_BREVT1
TCP3D_B receive event1
36
CIC1_OUT23
Interrupt Controller output
37
CIC1_OUT24
Interrupt Controller output
38
CIC1_OUT25
Interrupt Controller output
39
CIC1_OUT26
Interrupt Controller output
40
CIC1_OUT27
Interrupt Controller output
41
CIC1_OUT28
Interrupt Controller output
42
CIC1_OUT29
Interrupt Controller output
43
CIC1_OUT30
Interrupt Controller output
44
CIC1_OUT31
Interrupt Controller output
45
CIC1_OUT32
Interrupt Controller output
46
CIC1_OUT33
Interrupt Controller output
47
CIC1_OUT34
Interrupt Controller output
48
CIC1_OUT35
Interrupt Controller output
49
CIC1_OUT36
Interrupt Controller output
50
CIC1_OUT37
Interrupt Controller output
51
CIC1_OUT38
Interrupt Controller output
52
CIC1_OUT39
Interrupt Controller output
53
CIC1_OUT40
Interrupt Controller output
54
CIC1_OUT41
Interrupt Controller output
55
CIC1_OUT42
Interrupt Controller output
56
CIC1_OUT43
Interrupt Controller output
2
2
57
CIC1_OUT44
Interrupt Controller output
58
TCP3D_C_REVT0
TCP3d_C Receive event0
59
TCP3D_C_REVT1
TCP3d_C Receive event1
60
FFTC_C_ERROR0
FFTC_C Error event and FFTC_C debug event
61
FFTC_C_ERROR1
FFTC_C Error event and FFTC_C debug event
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Table 7-37
www.ti.com
EDMA3CC2 Events for C6670 (Part 3 of 3)
Event Number
Event
Event Description
62
FFTC_C_ERROR2
FFTC_C Error event and FFTC_C debug event
63
FFTC_C_ERROR3
FFTC_C Error event and FFTC_C debug event
End of Table 7-37
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7.9 Interrupts
7.9.1 Interrupt Sources and Interrupt Controller
The CPU interrupts on the C6670 device are configured through the C66x CorePac Interrupt Controller. The
Interrupt Controller allows for up to 128 system events to be programmed to any of the twelve CPU interrupt inputs
(CPUINT4 - CPUINT15), the CPU exception input (EXCEP), or the advanced emulation logic. The 128 system
events consist of 25 internally-generated events (within the CorePac) and 103 chip-level events.
Additional system events are routed to each of the C66x CorePacs to provide chip-level events that are not required
as CPU interrupts/exceptions to be routed to the Interrupt Controller as emulation events. In addition, error-class
events or infrequently used events are also routed through the system event router to offload the C66x CorePac
interrupt selector. This is accomplished through Chip Interrupt Controller (CIC) blocks, CIC[2:0] for C6670 device.
This is clocked using CPU/6.
The event controllers consist of simple combination logic to provide additional events to each C66x CorePac, plus
the EDMA3CC. CIC0 provides 26 additional events (18 that are CorePac-specific plus 8 broadcast) to each of the
C66x CorePacs, CIC1 provides 19 and 21 additional events to CC1 and CC2, respectively, and CIC2 provides 10 and
32 additional events to CC0 and HyperLink, respectively.
The events that are routed to the C66x CorePacs for AET purposes, from those EDMA3CC and FSYNC events that
are not otherwise provided to each C66x CorePac. For more details on the CIC features, please see the Chip Interrupt
Controller (CIC) for KeyStone Devices User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on
page 66.
Note—Modules such as FFTC, TCP3d, TCP3e, TAC, AIF, CP_MPU, BOOT_CFG, and Tracer have level
interrupts and EOI handshaking interface. The EOI value is 0 for TCP3d, TCP3e, TAC, AIF, CP_MPU,
BOOT_CFG, and Tracer. For FFTC, the EOI values are 0 for FFTC_x_INTD0, 1 for FFTC_x_INTD01, 2
for FFTC_x_INTD2, and 3 for FFTC_x_INTD3 (where FFTC_x can be either FFTC_0 or FFTC_1).
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Figure 7-29 shows the C6670 interrupt topology.
Figure 7-29
Interrupt Topology
8 Broadcast Events from AIF
92 Primary Events
18 Secondary Events
Core0
2 Reserved Primary Events
92 Primary Events
18 Secondary Events
9 Reserved Secondary Events
Core1
2 Reserved Primary Events
117 Core-only Secondary Events
CIC0
92 Primary Events
18 Secondary Events
82 Common Events
Core2
2 Reserved Primary Events
92 Primary Events
18 Secondary Events
Core3
2 Reserved Primary Events
8 Broadcast Events from CIC0
12 Reserved Secondary Events
82 Common Events
45 Primary Events
6 Reserved Secondary Events
CIC1
19 Secondary Events
42 Primary Events
72 EDMACC-only Events
22 Secondary Events
32 Queue Events
6 Reserved Secondary Events
32 Secondary Events
EDMA3
CC1
EDMA3
CC2
HyperLink
CIC2
6 Primary Events
58 Events
10 Secondary Events
EDMA3
CC0
6670
Table 7-38 shows the mapping of system events. For more information on the Interrupt Controller, see the C66x
CorePac User Guide in2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66.
Table 7-38
System Event Mapping — C66x CorePac Primary Interrupts (Part 1 of 4)
Event Number
Interrupt Event
Description
0
EVT0
Event combiner 0 output
1
EVT1
Event combiner 1 output
2
EVT2
Event combiner 2 output
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Table 7-38
System Event Mapping — C66x CorePac Primary Interrupts (Part 2 of 4)
Event Number
Interrupt Event
Description
3
EVT3
Event combiner 3 output
4
TETBHFULLINTn
1
TETB is half full
5
TETBFULLINTn
1
TETB is full
6
TETBACQINTn
1
Acquisition has been completed
7
TETBOVFLINTn
1
Overflow condition interrupt
1
Underflow condition interrupt
8
TETBUNFLINTn
9
EMU_DTDMA
10
MSMC_mpf_errorn4
Memory protection fault indicators for local CorePac
11
EMU_RTDXRX
RTDX receive complete
12
EMU_RTDXTX
RTDX transmit complete
13
IDMA0
IDMA channel 0 interrupt
Emulation interrupt for:
1. Host scan access
2. DTDMA transfer complete
3. AET interrupt
14
IDMA1
15
SEMERRn
IDMA channel 1 interrupt
16
SEMINTn2
17
PCIEXpress_MSI_INTn
2
Semaphore error interrupt
Semaphore interrupt
3
Message signaled interrupt mode
3
18
PCIEXpress_MSI_INTn+1
19
RAC_A_INTn
8
Message signaled interrupt mode
RAC_A interrupt
10
20
INTDST(n+16)
21
INTDST(n+20)10
SRIO interrupt
SRIO interrupt
22
CIC0_OUT(64+0+10*n)
7
23
CIC0_OUT(64+1+10*n)
7
Interrupt Controller output
24
CIC0_OUT(64+2+10*n)
7
Interrupt Controller output
25
CIC0_OUT(64+3+10*n)
7
Interrupt Controller output
26
CIC0_OUT(64+4+10*n)
7
Interrupt Controller output
27
CIC0_OUT(64+5+10*n)7
Interrupt Controller output
28
CIC0_OUT(64+6+10*n)
7
Interrupt Controller output
29
CIC0_OUT(64+7+10*n)
7
Interrupt Controller output
30
CIC0_OUT(64+8+10*n)
7
Interrupt Controller output
31
CIC0_OUT(64+9+10*n)
7
Interrupt Controller output
32
QM_INT_LOW_0
QM interrupt for 0~31 queues
33
QM_INT_LOW_1
QM interrupt for 32~63 queues
Interrupt Controller output
34
QM_INT_LOW_2
QM interrupt for 64~95 queues
35
QM_INT_LOW_3
QM interrupt for 96~127 queues
36
QM_INT_LOW_4
QM interrupt for 128~159 queues
37
QM_INT_LOW_5
QM interrupt for 160~191 queues
38
QM_INT_LOW_6
QM interrupt for 192~223 queues
39
QM_INT_LOW_7
QM interrupt for 224~255 queues
40
QM_INT_LOW_8
QM interrupt for 256~287 queues
41
QM_INT_LOW_9
QM interrupt for 288~319 queues
42
QM_INT_LOW_10
QM interrupt for 320~351 queues
43
QM_INT_LOW_11
QM interrupt for 352~383 queues
44
QM_INT_LOW_12
QM interrupt for 384~415 queues
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Table 7-38
www.ti.com
System Event Mapping — C66x CorePac Primary Interrupts (Part 3 of 4)
Event Number
Interrupt Event
Description
45
QM_INT_LOW_13
QM interrupt for 416~447 queues
46
QM_INT_LOW_14
QM interrupt for 448~479 queues
47
QM_INT_LOW_15
QM interrupt for 480~511 queues
48
9
49
50
9
QM interrupt for queue 704 + n
QM_INT_HIGH_n
QM_INT_HIGH_(n+4)
9
QM_INT_HIGH_(n+8)
9
9
QM interrupt for queue 708+n
QM interrupt for queue 712+n9
51
QM_INT_HIGH_(n+12)
9
9
52
QM_INT_HIGH_(n+16)
9
QM interrupt for queue 720+n
53
QM_INT_HIGH_(n+20)
9
QM interrupt for queue 724+n9
54
QM_INT_HIGH_(n+24)
9
QM interrupt for queue 728+n
55
QM_INT_HIGH_(n+28)
9
QM interrupt for queue 732+n
56
CIC0_OUT0
Interrupt Controller output
57
CIC0_OUT1
Interrupt Controller output
58
CIC0_OUT2
Interrupt Controller output
59
CIC0_OUT3
Interrupt Controller output
60
CIC0_OUT4
Interrupt Controller output
61
CIC0_OUT5
Interrupt Controller output
62
CIC0_OUT6
Interrupt Controller output
63
CIC0_OUT7
Interrupt Controller output
QM interrupt for queue 716+n
9
9
9
6
Local Timer interrupt low
6
Local Timer interrupt high
64
TINTLn
65
TINTHn
66
TINT4L
Timer 4 interrupt low
67
TINT4H
Timer 4 interrupt high
68
TINT5L
Timer 5 interrupt low
69
TINT5H
Timer 5 interrupt high
70
TINT6L
Timer 6 interrupt low
71
TINT6H
Timer 6 interrupt high
72
TINT7L
Timer 7 interrupt low
73
TINT7H
Timer 7 interrupt high
74
CIC0_OUT(8+16*n)
7
75
CIC0_OUT(9+16*n)
7
Interrupt Controller output
Interrupt Controller output
76
CIC0_OUT(10+16*n)
7
77
CIC0_OUT(11+16*n)
7
78
GPINT4
Local GPIO interrupt
79
GPINT5
Local GPIO interrupt
80
GPINT6
Local GPIO interrupt
81
GPINT7
Local GPIO interrupt
82
GPINT8
Local GPIO interrupt
83
GPINT9
Local GPIO interrupt
84
GPINT10
Local GPIO interrupt
85
GPINT11
Local GPIO interrupt
86
GPINT12
Local GPIO interrupt
87
GPINT13
Local GPIO interrupt
88
GPINT14
Local GPIO interrupt
158
Interrupt Controller output
Interrupt Controller output
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Table 7-38
System Event Mapping — C66x CorePac Primary Interrupts (Part 4 of 4)
Event Number
Interrupt Event
Description
89
GPINT15
Local GPIO interrupt
90
IPC_LOCAL
Inter DSP interrupt from IPCGRn
91
GPINTn5
Local GPIO interrupt
92
CIC0_OUT(12+16*n)
7
93
CIC0_OUT(13+16*n)
7
Interrupt Controller output
94
CIC0_OUT(14+16*n)
7
Interrupt Controller output
95
CIC0_OUT(15+16*n)
7
Interrupt Controller output
Interrupt Controller output
96
INTERR
Dropped CPU interrupt event
97
EMC_IDMAERR
Invalid IDMA parameters
98
Reserved
99
RAC_B_INTn
100
EFIINTA
EFI interrupt from Side A
101
EFIINTB
EFI interrupt from Side B
102
AIF_SEVT0
AIF system event
103
AIF_SEVT1
AIF system event
104
AIF_SEVT2
AIF system event
105
AIF_SEVT3
AIF system event
106
AIF_SEVT4
AIF system event
107
AIF_SEVT5
AIF system event
108
AIF_SEVT6
AIF system event
109
AIF_SEVT7
AIF system event
110
MDMAERREVT
VbusM error event
111
Reserved
8
RAC_B interrupt
112
EDMA3CC0_EDMACC_AETEVT
EDMA3CC0 AET event
113
PMC_ED
Single bit error detected during DMA read
114
EDMA3CC1_EDMACC_AETEVT
EDMA3CC1 AET event
115
EDMA3CC2_EDMACC_AETEVT
EDMA3CC2 AET event
116
UMC_ED1
Corrected bit error detected
117
UMC_ED2
Uncorrected bit error detected
118
PDC_INT
Power down sleep interrupt
119
SYS_CMPA
SYS CPU MP fault event
120
PMC_CMPA
CPU memory protection fault
121
PMC_DMPA
DMA memory protection fault
122
DMC_CMPA
CPU memory protection fault
123
DMC_DMPA
DMA memory protection fault
124
UMC_CMPA
CPU memory protection fault
125
UMC_DMPA
DMA memory protection fault
126
EMC_CMPA
CPU memory protection fault
127
EMC_BUSERR
Bus error interrupt
End of Table 7-38
1.
2.
3.
4.
5.
Core [n] will receive TETBHFULLINTn, TETBFULLINTn, TETBACQINTn, TETBOVFLINTn and TETBUNFLINTn.
Core [n] will receive SEMINTn and SEMERRn.
Core [n] will receive PCIEXpress_MSI_INTn and PCIEXpress_MSI_INTn+1.
Core [n] will receive MSMC_mpf_errorn.
Core [n] will receive GPINTn.
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6.
7.
8.
9.
10.
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Core [n] will receive TINTLn and TINTHn.
For Core 0~3, it is CIC(interrupt number+17*n).
Core [n] will receive RACINTn.
n is core number.
Core [n] will receive INTDST(n+16) and INTDST(n+20).
Table 7-39
CIC0 Event Inputs — C66x CorePac Secondary Interrupts (Part 1 of 6)
Input Event# on CIC
System Interrupt
Description
0
EDMA3CC1 EDMACC_ERRINT
EDMA3CC1 error interrupt
1
EDMA3CC1 EDMACC_MPINT
EDMA3CC1 memory protection interrupt
2
EDMA3CC1 EDMATC_ERRINT0
EDMA3CC1 TC0 error interrupt
3
EDMA3CC1 EDMATC_ERRINT1
EDMA3CC1 TC1 error interrupt
4
EDMA3CC1 EDMATC_ERRINT2
EDMA3CC1 TC2 error interrupt
5
EDMA3CC1 EDMATC_ERRINT3
EDMA3CC1 TC3 error interrupt
6
EDMA3CC1 EDMACC_GINT
EDMA3CC1 GINT
7
Reserved
8
EDMA3CC1 INT0
EDMA3CC1 individual completion interrupt
9
EDMA3CC1 INT1
EDMA3CC1 individual completion interrupt
10
EDMA3CC1INT2
EDMA3CC1 individual completion interrupt
11
EDMA3CC1 INT3
EDMA3CC1 individual completion interrupt
12
EDMA3CC1 INT4
EDMA3CC1 individual completion interrupt
13
EDMA3CC1 INT5
EDMA3CC1 individual completion interrupt
14
EDMA3CC1 INT6
EDMA3CC1 individual completion interrupt
15
EDMA3CC1 INT7
EDMA3CC1 individual completion interrupt
16
EDMA3CC2 EDMACC_ERRINT
EDMA3CC2 error interrupt
17
EDMA3CC2 EDMACC_MPINT
EDMA3CC2 memory protection interrupt
18
EDMA3CC2 EDMATC_ERRINT0
EDMA3CC2 TC0 error interrupt
19
EDMA3CC2 EDMATC_ERRINT1
EDMA3CC2 TC1 error interrupt
20
EDMA3CC2 EDMATC_ERRINT2
EDMA3CC2 TC2 error interrupt
21
EDMA3CC2 EDMATC_ERRINT3
EDMA3CC2 TC3 error interrupt
22
EDMA3CC2 EDMACC_GINT
EDMA3CC2 GINT
23
Reserved
24
EDMA3CC2 INT0
EDMA3CC2 individual completion interrupt
25
EDMA3CC2 INT1
EDMA3CC2 individual completion interrupt
26
EDMA3CC2 INT2
EDMA3CC2 individual completion interrupt
27
EDMA3CC2 INT3
EDMA3CC2 individual completion interrupt
28
EDMA3CC2 INT4
EDMA3CC2 individual completion interrupt
29
EDMA3CC2 INT5
EDMA3CC2 individual completion interrupt
30
EDMA3CC2 INT6
EDMA3CC2 individual completion interrupt
31
EDMA3CC2 INT7
EDMA3CC2 individual completion interrupt
32
EDMA3CC0 EDMACC_ERRINT
EDMA3CC0 error interrupt
33
EDMA3CC0 EDMACC_MPINT
EDMA3CC0 memory protection interrupt
34
EDMA3CC0 EDMATC_ERRINT0
EDMA3CC0 TC0 error interrupt
35
EDMA3CC0 EDMATC_ERRINT1
EDMA3CC0 TC1 error interrupt
36
EDMA3CC0 EDMACC_GINT
EDMA3CC0 GINT
37
Reserved
38
EDMA3CC0 INT0
EDMA3CC0 individual completion interrupt
39
EDMA3CC0 INT1
EDMA3CC0 individual completion interrupt
160
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Table 7-39
CIC0 Event Inputs — C66x CorePac Secondary Interrupts (Part 2 of 6)
Input Event# on CIC
System Interrupt
Description
40
EDMA3CC0 INT2
EDMA3CC0 individual completion interrupt
41
EDMA3CC0 INT3
EDMA3CC0 individual completion interrupt
42
EDMA3CC0 INT4
EDMA3CC0 individual completion interrupt
43
EDMA3CC0 INT5
EDMA3CC0 individual completion interrupt
44
EDMA3CC0 INT6
EDMA3CC0 individual completion Interrupt
45
EDMA3CC0 INT7
EDMA3CC0 individual completion interrupt
46
Reserved
47
Reserved
48
PCIEXpress_ERR_INT
Protocol error interrupt
49
PCIEXpress_PM_INT
Power management interrupt
50
PCIEXpress_Legacy_INTA
Legacy interrupt mode
51
PCIEXpress_Legacy_INTB
Legacy interrupt mode
52
PCIEXpress_Legacy_INTC
Legacy interrupt mode
53
PCIEXpress_Legacy_INTD
Legacy interrupt mode
54
SPIINT0
SPI interrupt0
55
SPIINT1
SPI interrupt1
56
SPIXEVT
SPI transmit event
57
SPIREVT
SPI receive event
58
I2CINT
I C interrupt
59
I2CREVT
I2C receive event
60
I2CXEVT
I C transmit event
61
Reserved
62
Reserved
63
TETBHFULLINT
TETB is half full
64
TETBFULLINT
TETB is full
65
TETBACQINT
Acquisition has been completed
66
TETBOVFLINT
Overflow condition occurred
67
TETBUNFLINT
Underflow condition occurred
68
mdio_link_intr0
Packet Accelerator subsystem MDIO interrupt
69
mdio_link_intr1
Packet Accelerator subsystem MDIO interrupt
70
mdio_user_intr0
Packet Accelerator subsystem MDIO interrupt
71
mdio_user_intr1
Packet Accelerator subsystem MDIO interrupt
72
misc_intr
Packet Accelerator subsystem misc Interrupt
2
2
73
Tracer_core_0_INTD
Tracer sliding time window interrupt for individual core
74
Tracer_core_1_INTD
Tracer sliding time window interrupt for individual core
75
Tracer_core_2_INTD
Tracer sliding time window interrupt for individual core
76
Tracer_core_3_INTD
Tracer sliding time window interrupt for individual core
77
Tracer_DDR_INTD
Tracer sliding time window interrupt for DDR3 EMIF1
78
Tracer_MSMC_0_INTD
Tracer sliding time window interrupt for MSMC SRAM bank0
79
Tracer_MSMC_1_INTD
Tracer sliding time window interrupt for MSMC SRAM bank1
80
Tracer_MSMC_2_INTD
Tracer sliding time window interrupt for MSMC SRAM bank2
81
Tracer_MSMC_3_INTD
Tracer sliding time window interrupt for MSMC SRAM bank3
82
Tracer_CFG_INTD
Tracer sliding time window interrupt for CFG0 SCR
83
Tracer_QM_SS_CFG_INTD
Tracer sliding time window interrupt for QM_SS CFG
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Table 7-39
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CIC0 Event Inputs — C66x CorePac Secondary Interrupts (Part 3 of 6)
Input Event# on CIC
System Interrupt
Description
84
Tracer_QM_SS_DMA_INTD
Tracer sliding time window interrupt for QM_SS slave
85
Tracer_SEM_INTD
Tracer sliding time window interrupt for Semaphore
86
PSC_ALLINT
Power & Sleep Controller Interrupt
87
MSMC_scrub_cerror
Correctable (1-bit) soft error detected during scrub cycle
88
BOOTCFG_INTD
Chip-level MMR Error Register
89
po_vcon_smpserr_intr
SmartReflex
90
MPU0_INTD
(MPU0_ADDR_ERR_INT and
MPU0_PROT_ERR_INT combined)
MPU0 addressing violation interrupt and protection violation interrupt.
91
BCP_ERROR0
BCP error 0
92
MPU1_INTD
(MPU1_ADDR_ERR_INT and
MPU1_PROT_ERR_INT combined)
MPU1 addressing violation interrupt and protection violation interrupt.
93
BCP_ERROR1
BCP error 1
94
MPU2_INTD
(MPU2_ADDR_ERR_INT and
MPU2_PROT_ERR_INT combined)
MPU2 addressing violation interrupt and protection violation interrupt.
95
BCP_ERROR2
BCP error 2
96
MPU3_INTD
(MPU3_ADDR_ERR_INT and
MPU3_PROT_ERR_INT combined)
MPU3 addressing violation interrupt and protection violation interrupt.
97
BCP_ERROR3
BCP error 3
98
MSMC_dedc_cerror
Correctable (1-bit) soft error detected on SRAM read
99
MSMC_dedc_nc_error
Non-correctable (2-bit) soft error detected on SRAM read
100
MSMC_scrub_nc_error
Non-correctable (2-bit) soft error detected during scrub cycle
101
Reserved
102
MSMC_mpf_error8
Memory protection fault indicators for each system master PrivID
103
MSMC_mpf_error9
Memory protection fault indicators for each system master PrivID
104
MSMC_mpf_error10
Memory protection fault indicators for each system master PrivID
105
MSMC_mpf_error11
Memory protection fault indicators for each system master PrivID
106
MSMC_mpf_error12
Memory protection fault indicators for each system master PrivID
107
MSMC_mpf_error13
Memory protection fault indicators for each system master PrivID
108
MSMC_mpf_error14
Memory protection fault indicators for each system master PrivID
109
MSMC_mpf_error15
Memory protection fault indicators for each system master PrivID
110
DDR3_ERR
DDR3_EMIF Error Interrupt
111
vusr_int_o
HyperLink Interrupt
112
INTDST0
RapidIO Interrupt
113
INTDST1
RapidIO Interrupt
114
INTDST2
RapidIO Interrupt
115
INTDST3
RapidIO Interrupt
116
INTDST4
RapidIO Interrupt
117
INTDST5
RapidIO Interrupt
118
INTDST6
RapidIO Interrupt
119
INTDST7
RapidIO Interrupt
120
INTDST8
RapidIO Interrupt
121
INTDST9
RapidIO Interrupt
122
INTDST10
RapidIO Interrupt
162
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Table 7-39
CIC0 Event Inputs — C66x CorePac Secondary Interrupts (Part 4 of 6)
Input Event# on CIC
System Interrupt
Description
123
INTDST11
RapidIO Interrupt
124
INTDST12
RapidIO Interrupt
125
INTDST13
RapidIO Interrupt
126
INTDST14
RapidIO interrupt
127
INTDST15
RapidIO interrupt
128
RACADEVENT0
RAC_A_debug event
129
RACADEVENT1
RAC_A_debug event
130
TAC_INTD
Error interrupt TACINT
131
TACDEVENT0
TAC debug event
132
TACDEVENT1
TAC debug event
133
AIF_INTD
AIF CPU error interrupt and AIF CPU alarm interrupt and starvation interrupt
134
QM_INT_PASS_TXQ_PEND_22
Queue Manager (Packet Accelerator) pend event
135
QM_INT_PASS_TXQ_PEND_23
Queue Manager (Packet Accelerator) pend event
136
QM_INT_PASS_TXQ_PEND_24
Queue Manager (Packet Accelerator) pend event
137
QM_INT_PASS_TXQ_PEND_25
Queue Manager (Packet Accelerator) pend event
138
QM_INT_PASS_TXQ_PEND_26
Queue Manager (Packet Accelerator) pend event
139
QM_INT_PASS_TXQ_PEND_27
Queue Manager (Packet Accelerator) pend event
140
QM_INT_PASS_TXQ_PEND_28
Queue Manager (Packet Accelerator) pend event
141
QM_INT_PASS_TXQ_PEND_29
Queue Manager (Packet Accelerator) pend event
142
QM_INT_PASS_TXQ_PEND_30
Queue Manager (Packet Accelerator) pend event
143
VCP0INT
Error interrupt
144
VCP1INT
Error interrupt
145
VCP2INT
Error interrupt
146
VCP3INT
Error interrupt
147
VCP0REVT
Receive event
148
VCP0XEVT
Transmit event
149
VCP1REVT
Receive event
150
VCP1XEVT
Transmit event
151
VCP2REVT
Receive event
152
VCP2XEVT
Transmit event
153
VCP3REVT
Receive event
154
VCP3XEVT
Transmit event
155
TCP3D_A_INTD
TCP3d_A error interrupt TCP3DINT0 and TCP3DINT1
156
TCP3D_B_INTD
TCP3d_B error interrupt TCP3DINT0 and TCP3DINT1
157
TCP3D_AREVT0
TCP3d_A receive event0
158
TCP3D_AREVT1
TCP3d_A receive event1
159
TCP3E_INTD
Error interrupt TCP3EINT
160
TCP3EREVT
TCP3e read event
161
TCP3EWEVT
TCP3e write event
162
TCP3D_BREVT0
TCP3d_B receive event0
163
TCP3D_BREVT1
TCP3d_B receive event1
164
UARTINT
UART interrupt
165
URXEVT
UART receive event
166
UTXEVT
UART transmit event
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Table 7-39
www.ti.com
CIC0 Event Inputs — C66x CorePac Secondary Interrupts (Part 5 of 6)
Input Event# on CIC
System Interrupt
Description
167
Tracer_RAC_INTD
Tracer sliding time window interrupt for RAC
168
Tracer_RAC_FE_INTD
Tracer sliding time window interrupt for RAC_FE
169
Tracer_TAC_INTD
Tracer sliding time window interrupt for TAC
170
MSMC_mpf_error4
Memory protection fault indicators for each system master PrivID
171
MSMC_mpf_error5
Memory protection fault indicators for each system master PrivID
172
MSMC_mpf_error6
Memory protection fault indicators for each system master PrivID
173
MSMC_mpf_error7
Memory protection fault indicators for each system master PrivID
174
MPU4_INTD
(MPU4_ADDR_ERR_INT and
MPU4_PROT_ERR_INT combined)
MPU4 addressing violation interrupt and protection violation interrupt.
175
QM_INT_PASS_TXQ_PEND_31
Queue Manager (Packet Accelerator) pend event
176
QM_INT_CDMA_0
QM interrupt for CDMA starvation
177
QM_INT_CDMA_1
QM interrupt for CDMA starvation
178
RapidIO_INT_CDMA_0
RapidIO interrupt for CDMA starvation
179
PASS_INT_CDMA_0
PASS interrupt for CDMA starvation
180
TCP3D_C_ERROR
TCP3D_C_Error event
MPU5_INTD
(MPU5_ADDR_ERR_INT and
MPU5_PROT_ERR_INT combined)
MPU5 Addressing violation interrupt and Protection violation interrupt.
181
SmartReflex_intrreq0
SmartReflex sensor interrupt
182
SmartReflex_intrreq1
SmartReflex sensor interrupt
183
SmartReflex_intrreq2
SmartReflex sensor interrupt
184
SmartReflex_intrreq3
SmartReflex sensor interrupt
185
VPNoSMPSAck
VPVOLTUPDATE has been asserted but SMPS has not been responded to in a defined
time interval
186
VPEqValue
SRSINTERUPT is asserted, but the new voltage is not different from the current SMPS
voltage
187
VPMaxVdd
The new voltage required is equal to or greater than MaxVdd.
188
VPMinVdd
The new voltage required is equal to or less than MinVdd.
189
VPINIDLE
Indicating that the FSM of voltage processor is in idle.
190
VPOPPChangeDone
Indicating that the average frequency error is within the desired limit.
191
Reserved
192
FFTC_A_INTD0
FFTC_A error event and FFTC_A debug event
193
FFTC_A_INTD1
FFTC_A error event and FFTC_A debug event
194
FFTC_A_INTD2
FFTC_A error event and FFTC_A debug event
195
FFTC_A_INTD3
FFTC_A error event and FFTC_A debug event
196
FFTC_B_INTD0
FFTC_B error event and FFTC_B debug event
197
FFTC_B_INTD1
FFTC_B error event and FFTC_B debug event
198
FFTC_B_INTD2
FFTC_B error event and FFTC_B debug event
199
FFTC_B_INTD3
FFTC_B error event and FFTC_B debug event
200
RACBDEVENT0
RAC_B_debug Event
201
RACBDEVENT1
RAC_B_debug Event
202
TCP3D_C_REVT0
TCP3d_C receive event0
203
TCP3D_C_REVT1
TCP3d_C receive event1
204
FFTC_C_ERROR0
FFTC_C Error event and FFTC_C debug event
205
FFTC_C_ERROR1
FFTC_C Error event and FFTC_C debug event
164
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Table 7-39
CIC0 Event Inputs — C66x CorePac Secondary Interrupts (Part 6 of 6)
Input Event# on CIC
System Interrupt
Description
206
FFTC_C_ERROR2
FFTC_C Error event and FFTC_C debug event
207
FFTC_C_ERROR3
FFTC_C Error event and FFTC_C debug event
End of Table 7-39
Table 7-40
CIC1 Event Inputs (Secondary Events for EDMA3CC1 and EDMA3CC2) (Part 1 of 4)
Input Event # on CIC
System Interrupt
Description
0
GPINT8
GPIO interrupt
1
GPINT9
GPIO interrupt
2
GPINT10
GPIO interrupt
3
GPINT11
GPIO interrupt
4
GPINT12
GPIO interrupt
5
GPINT13
GPIO interrupt
6
GPINT14
GPIO interrupt
7
GPINT15
GPIO interrupt
8
TETBHFULLINT
TETB is half full
9
TETBFULLINT
TETB is full
10
TETBACQINT
Acquisition has been completed
11
TETBHFULLINT0
TETB is half full
12
TETBFULLINT0
TETB is full
13
TETBACQINT0
Acquisition has been completed
14
TETBHFULLINT1
TETB is half full
15
TETBFULLINT1
TETB is full
16
TETBACQINT1
Acquisition has been completed
17
TETBHFULLINT2
TETB is half full
18
TETBFULLINT2
TETB is full
19
TETBACQINT2
Acquisition has been completed
20
TETBHFULLINT3
TETB is half full
21
TETBFULLINT3
TETB is full
22
TETBACQINT3
Acquisition has been completed
23
Reserved
24
QM_INT_HIGH_16
QM interrupt
25
QM_INT_HIGH_17
QM interrupt
26
QM_INT_HIGH_18
QM interrupt
27
QM_INT_HIGH_19
QM interrupt
28
QM_INT_HIGH_20
QM interrupt
29
QM_INT_HIGH_21
QM interrupt
30
QM_INT_HIGH_22
QM interrupt
31
QM_INT_HIGH_23
QM interrupt
32
QM_INT_HIGH_24
QM interrupt
33
QM_INT_HIGH_25
QM interrupt
34
QM_INT_HIGH_26
QM interrupt
35
QM_INT_HIGH_27
QM interrupt
36
QM_INT_HIGH_28
QM interrupt
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Table 7-40
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CIC1 Event Inputs (Secondary Events for EDMA3CC1 and EDMA3CC2) (Part 2 of 4)
Input Event # on CIC
System Interrupt
Description
37
QM_INT_HIGH_29
QM interrupt
38
QM_INT_HIGH_30
QM interrupt
39
QM_INT_HIGH_31
QM interrupt
40
MDIO_LINK_INTR0
PASS_MDIO interrupt
41
MDIO_LINK_INTR1
PASS_MDIO interrupt
42
MDIO_USER_INTR0
PASS_MDIO interrupt
43
MDIO_USER_INTR1
PASS_MDIO interrupt
44
MISC_INTR
PASS_MISC interrupt
45
TRACER_CORE_0_INTD
Tracer sliding time window interrupt for individual core
46
TRACER_CORE_1_INTD
Tracer sliding time window interrupt for individual core
47
TRACER_CORE_2_INTD
Tracer sliding time window interrupt for individual core
48
TRACER_CORE_3_INTD
Tracer sliding time window interrupt for individual core
49
TRACER_DDR_INTD
Tracer sliding time window interrupt for DDR3 EMIF1
50
TRACER_MSMC_0_INTD
Tracer sliding time window interrupt for MSMC SRAM bank0
51
TRACER_MSMC_1_INTD
Tracer sliding time window interrupt for MSMC SRAM bank1
52
TRACER_MSMC_2_INTD
Tracer sliding time window interrupt for MSMC SRAM bank2
53
TRACER_MSMC_3_INTD
Tracer sliding time window interrupt for MSMC SRAM bank3
54
TRACER_CFG_INTD
Tracer sliding time window interrupt for CFG0 SCR
55
TRACER_QM_SS_CFG_INTD
Tracer sliding time window interrupt for QM_SS CFG
56
TRACER_QM_SS_DMA_INTD
Tracer sliding time window interrupt for QM_SS slave port
57
TRACER_SEM_INTD
Tracer sliding time window interrupt for Semaphore
58
SEMERR0
Semaphore interrupt
59
SEMERR1
Semaphore interrupt
60
SEMERR2
Semaphore interrupt
61
SEMERR3
Semaphore interrupt
62
BOOTCFG_INTD
Chip-level MMR interrupt
63
PASS_INT_CDMA_0
PASS Interrupt for CDMA starvation
64
MPU0_INTD
(MPU0_ADDR_ERR_INT and
MPU0_PROT_ERR_INT combined)
MPU0 addressing violation interrupt and protection violation interrupt.
65
MSMC_SCRUB_CERROR
Correctable (1-bit) soft error detected during scrub cycle
66
MPU1_INTD
(MPU1_ADDR_ERR_INT and
MPU1_PROT_ERR_INT combined)
MPU1 addressing violation interrupt and protection violation interrupt.
67
RapidIO_INT_CDMA_0
RapidIO interrupt for CDMA starvation
68
MPU2_INTD
(MPU2_ADDR_ERR_INT and
MPU2_PROT_ERR_INT combined)
MPU2 addressing violation interrupt and protection violation interrupt.
69
QM_INT_CDMA_0
QM Interrupt for CDMA starvation
70
MPU3_INTD
(MPU3_ADDR_ERR_INT and
MPU3_PROT_ERR_INT combined)
MPU3 addressing violation interrupt and protection violation interrupt.
71
QM_INT_CDMA_1
QM interrupt for CDMA starvation
72
MSMC_DEDC_CERROR
Correctable (1-bit) soft error detected on SRAM read
73
MSMC_DEDC_NC_ERROR
Non-correctable (2-bit) soft error detected on SRAM read
74
MSMC_SCRUB_NC_ERROR
Non-correctable (2-bit) soft error detected during scrub cycle
75
Reserved
166
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Table 7-40
CIC1 Event Inputs (Secondary Events for EDMA3CC1 and EDMA3CC2) (Part 3 of 4)
Input Event # on CIC
System Interrupt
Description
76
MSMC_MPF_ERROR0
Memory protection fault indicators for each system master PrivID
77
MSMC_MPF_ERROR1
Memory protection fault indicators for each system master PrivID
78
MSMC_MPF_ERROR2
Memory protection fault indicators for each system master PrivID
79
MSMC_MPF_ERROR3
Memory protection fault indicators for each system master PrivID
80
MSMC_MPF_ERROR4
Memory protection fault indicators for each system master PrivID
81
MSMC_MPF_ERROR5
Memory protection fault indicators for each system master PrivID
82
MSMC_MPF_ERROR6
Memory protection fault indicators for each system master PrivID
83
MSMC_MPF_ERROR7
Memory protection fault indicators for each system master PrivID
84
MSMC_MPF_ERROR8
Memory protection fault indicators for each system master PrivID
85
MSMC_MPF_ERROR9
Memory protection fault indicators for each system master PrivID
86
MSMC_MPF_ERROR10
Memory protection fault indicators for each system master PrivID
87
MSMC_MPF_ERROR11
Memory protection fault indicators for each system master PrivID
88
MSMC_MPF_ERROR12
Memory protection fault indicators for each system master PrivID
89
MSMC_MPF_ERROR13
Memory protection fault indicators for each system master PrivID
90
MSMC_MPF_ERROR14
Memory protection fault indicators for each system master PrivID
91
MSMC_MPF_ERROR15
Memory protection fault indicators for each system master PrivID
92
Reserved
93
INTDST0
RapidIO interrupt
94
INTDST1
RapidIO interrupt
95
INTDST2
RapidIO interrupt
96
INTDST3
RapidIO interrupt
97
INTDST4
RapidIO interrupt
98
INTDST5
RapidIO interrupt
99
INTDST6
RapidIO interrupt
100
INTDST7
RapidIO interrupt
101
INTDST8
RapidIO interrupt
102
INTDST9
RapidIO interrupt
103
INTDST10
RapidIO interrupt
104
INTDST11
RapidIO interrupt
105
INTDST12
RapidIO interrupt
106
INTDST13
RapidIO interrupt
107
INTDST14
RapidIO interrupt
108
INTDST15
RapidIO interrupt
109
INTDST16
RapidIO interrupt
110
INTDST17
RapidIO interrupt
111
INTDST18
RapidIO interrupt
112
INTDST19
RapidIO interrupt
113
INTDST20
RapidIO interrupt
114
INTDST21
RapidIO interrupt
115
INTDST22
RapidIO interrupt
116
INTDST23
RapidIO interrupt
117
AIF_INTD
AIF CPU error interrupt and AIF CPU alarm interrupt and starvation interrupt
118
Reserved
119
VCPAINT
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Table 7-40
www.ti.com
CIC1 Event Inputs (Secondary Events for EDMA3CC1 and EDMA3CC2) (Part 4 of 4)
Input Event # on CIC
System Interrupt
Description
120
VCPBINT
Error interrupt
121
VCPCINT
Error interrupt
122
VCPDINT
Error interrupt
123
TCP3D_A_INTD
Error interrupt TCP3DINT0 and TCP3DINT1
124
TCP3D_B_INTD
Error interrupt TCP3DINT0 and TCP3DINT1
125
TCP3E_INTD
Error interrupt TCP3EINT
126
FFTC_B_INTD0
FFTC_B error event and FFTC_B debug event
127
FFTC_B_INTD1
FFTC_B error event and FFTC_B debug event
128
GPINT4
GPIO interrupt
129
GPINT5
GPIO interrupt
130
GPINT6
GPIO interrupt
131
GPINT7
GPIO interrupt
132
TRACER_RAC_INTD
Tracer sliding time window interrupt for RAC
133
TRACER_RAC_FE_INTD
Tracer sliding time window interrupt for RAC_FE
134
TRACER_TAC_INTD
Tracer sliding time window interrupt for TAC
135
MPU4_INTD
MPU4 addressing violation interrupt and protection violation interrupt.
136
Reserved
137
QM_INT_HIGH_0
QM interrupt
138
QM_INT_HIGH_1
QM interrupt
139
QM_INT_HIGH_2
QM interrupt
140
QM_INT_HIGH_3
QM interrupt
141
QM_INT_HIGH_4
QM interrupt
142
QM_INT_HIGH_5
QM interrupt
143
QM_INT_HIGH_6
QM interrupt
144
QM_INT_HIGH_7
QM interrupt
145
QM_INT_HIGH_8
QM interrupt
146
QM_INT_HIGH_9
QM interrupt
147
QM_INT_HIGH_10
QM interrupt
148
QM_INT_HIGH_11
QM interrupt
149
QM_INT_HIGH_12
QM interrupt
150
QM_INT_HIGH_13
QM interrupt
151
QM_INT_HIGH_14
QM interrupt
152
QM_INT_HIGH_15
QM interrupt
153
FFTC_A_INTD0
FFTC_A error event and FFTC_A debug event
154
FFTC_A_INTD1
FFTC_A error event and FFTC_A debug event
155
FFTC_A_INTD2
FFTC_A error event and FFTC_A debug event
156
FFTC_A_INTD3
FFTC_A error event and FFTC_A debug event
157
FFTC_B_INTD2
FFTC_B error event and FFTC_B debug event
158
FFTC_B_INTD3
FFTC_B error event and FFTC_B debug event
159
Reserved
Reserved inputs
End of Table 7-40
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Table 7-41
CIC2 Event Inputs (Secondary Events for EDMA3CC0 and HyperLink) (Part 1 of 2)
Input Event # on CIC
System Interrupt
Description
0
GPINT0
GPIO interrupt
1
GPINT1
GPIO interrupt
2
GPINT2
GPIO interrupt
3
GPINT3
GPIO interrupt
4
GPINT4
GPIO interrupt
5
GPINT5
GPIO interrupt
6
GPINT6
GPIO interrupt
7
GPINT7
GPIO interrupt
8
GPINT8
GPIO interrupt
9
GPINT9
GPIO interrupt
10
GPINT10
GPIO interrupt
11
GPINT11
GPIO interrupt
12
GPINT12
GPIO interrupt
13
GPINT13
GPIO interrupt
14
GPINT14
GPIO interrupt
15
GPINT15
GPIO interrupt
16
TETBHFULLINT
System TETB is half full
17
TETBFULLINT
System TETB is full
18
TETBACQINT
System acquisition has been completed
19
TETBHFULLINT0
TETB0 is half full
20
TETBFULLINT0
TETB0 is full
21
TETBACQINT0
TETB0 acquisition has been completed
22
TETBHFULLINT1
TETB1 is half full
23
TETBFULLINT1
TETB1 is full
24
TETBACQINT1
TETB1 acquisition has been completed
25
TETBHFULLINT2
TETB2 is half full
26
TETBFULLINT2
TETB2 is full
27
TETBACQINT2
TETB2 acquisition has been completed
28
TETBHFULLINT3
TETB3 is half full
29
TETBFULLINT3
TETB3 is full
30
TETBACQINT3
TETB3 acquisition has been completed
31
TRACER_CORE_0_INTD
Tracer sliding time window interrupt for individual core
32
TRACER_CORE_1_INTD
Tracer sliding time window interrupt for individual core
33
TRACER_CORE_2_INTD
Tracer sliding time window interrupt for individual core
34
TRACER_CORE_3_INTD
Tracer sliding time window interrupt for individual core
35
TRACER_DDR_INTD
Tracer sliding time window interrupt for DDR3 EMIF1
36
TRACER_MSMC_0_INTD
Tracer sliding time window interrupt for MSMC SRAM bank0
37
TRACER_MSMC_1_INTD
Tracer sliding time window interrupt for MSMC SRAM bank1
38
TRACER_MSMC_2_INTD
Tracer sliding time window interrupt for MSMC SRAM bank2
39
TRACER_MSMC_3_INTD
Tracer sliding time window interrupt for MSMC SRAM bank3
40
TRACER_CFG_INTD
Tracer sliding time window interrupt for CFG0 SCR
41
TRACER_QM_SS_CFG_INTD
Tracer sliding time window interrupt for QM_SS CFG
42
TRACER_QM_SS_DMA_INTD
Tracer sliding time window interrupt for QM_SS slave port
43
TRACER_SEM_INTD
Tracer sliding time window interrupt for Semaphore
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Table 7-41
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CIC2 Event Inputs (Secondary Events for EDMA3CC0 and HyperLink) (Part 2 of 2)
Input Event # on CIC
System Interrupt
Description
44
VUSR_INT_O
HyperLink interrupt
45
TRACER_RAC_INTD
Tracer sliding time window interrupt for RAC
46
TRACER_RAC_FE_INTD
Tracer sliding time window interrupt for RAC_FE
47
TRACER_TAC_INTD
Tracer sliding time window interrupt for TAC
48
TCP3D_C_ERROR
TCP3D_C Error Event
MPU5_INTD
(MPU5_ADDR_ERR_INT and
MPU5_PROT_ERR_INT
combined)
MPU5 Addressing violation interrupt and Protection violation interrupt.
49
TINT4L
Timer64_4 interrupt low
50
TINT4H
Timer64_4 interrupt high
51
TINT5L
Timer64_5 interrupt low
52
TINT5H
timer64_5 interrupt high
53
TINT6L
Timer64_6 interrupt low
54
TINT6H
Timer64_6 interrupt high
55
TINT7L
Timer64_7 interrupt low
56
TINT7H
Timer64_7 interrupt high
57
Reserved
58
Reserved
59
Reserved
60
Reserved
61
DDR3_ERR
62
Reserved
63
Reserved
DDR3 EMIF error interrupt
End of Table 7-41
7.9.2 CIC Registers
This section includes the CIC memory map information and registers.
7.9.2.1 CIC0 Register Map
Table 7-42
CIC0 Registers (Part 1 of 4)
Address Offset
Register Mnemonic
Register Name
0x0
REVISION_REG
Revision Register
0x4
Reserved
0xc
Reserved
0x10
GLOBAL_ENABLE_HINT_REG
Global Host Int Enable Register
0x20
STATUS_SET_INDEX_REG
Status Set Index Register
0x24
STATUS_CLR_INDEX_REG
Status Clear Index Register
0x28
ENABLE_SET_INDEX_REG
Enable Set Index Register
0x2c
ENABLE_CLR_INDEX_REG
Enable Clear Index Register
0x34
HINT_ENABLE_SET_INDEX_REG
Host Int Enable Set Index Register
0x38
HINT_ENABLE_CLR_INDEX_REG
Host Int Enable Clear Index Register
0x200
RAW_STATUS_REG0
Raw Status Register 0
0x204
RAW_STATUS_REG1
Raw Status Register 1
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Table 7-42
CIC0 Registers (Part 2 of 4)
Address Offset
Register Mnemonic
Register Name
0x208
RAW_STATUS_REG2
Raw Status Register 2
0x20c
RAW_STATUS_REG3
Raw Status Register 3
0x210
RAW_STATUS_REG4
Raw Status Register 4
0x214
RAW_STATUS_REG5
Raw Status Register 5
0x218
RAW_STATUS_REG6
Raw Status Register 6
0x280
ENA_STATUS_REG0
Enabled Status Register 0
0x284
ENA_STATUS_REG1
Enabled Status Register 1
0x288
ENA_STATUS_REG2
Enabled Status Register 2
0x28c
ENA_STATUS_REG3
Enabled Status Register 3
0x290
ENA_STATUS_REG4
Enabled Status Register 4
0x294
ENA_STATUS_REG5
Enabled Status Register 5
0x298
ENA_STATUS_REG6
Enabled Status Register 6
0x300
ENABLE_REG0
Enable Register 0
0x304
ENABLE_REG1
Enable Register 1
0x308
ENABLE_REG2
Enable Register 2
0x30c
ENABLE_REG3
Enable Register 3
0x310
ENABLE_REG4
Enable Register 4
0x314
ENABLE_REG5
Enable Register 5
0x318
ENABLE_REG6
Enable Register 6
0x380
ENABLE_CLR_REG0
Enable Clear Register 0
0x384
ENABLE_CLR_REG1
Enable Clear Register 1
0x388
ENABLE_CLR_REG2
Enable Clear Register 2
0x38c
ENABLE_CLR_REG3
Enable Clear Register 3
0x390
ENABLE_CLR_REG4
Enable Clear Register 4
0x394
ENABLE_CLR_REG5
Enable Clear Register 5
0x398
ENABLE_CLR_REG6
Enable Clear Register 6
0x400
CH_MAP_REG0
Interrupt Channel Map Register for 0 to 0+3
0x404
CH_MAP_REG1
Interrupt Channel Map Register for 4 to 4+3
0x408
CH_MAP_REG2
Interrupt Channel Map Register for 8 to 8+3
0x40c
CH_MAP_REG3
Interrupt Channel Map Register for 12 to 12+3
0x410
CH_MAP_REG4
Interrupt Channel Map Register for 16 to 16+3
0x414
CH_MAP_REG5
Interrupt Channel Map Register for 20 to 20+3
0x418
CH_MAP_REG6
Interrupt Channel Map Register for 24 to 24+3
0x41c
CH_MAP_REG7
Interrupt Channel Map Register for 28 to 28+3
0x420
CH_MAP_REG8
Interrupt Channel Map Register for 32 to 32+3
0x424
CH_MAP_REG9
Interrupt Channel Map Register for 36 to 36+3
0x428
CH_MAP_REG10
Interrupt Channel Map Register for 40 to 40+3
0x42c
CH_MAP_REG11
Interrupt Channel Map Register for 44 to 44+3
0x430
CH_MAP_REG12
Interrupt Channel Map Register for 48 to 48+3
0x434
CH_MAP_REG13
Interrupt Channel Map Register for 52 to 52+3
0x438
CH_MAP_REG14
Interrupt Channel Map Register for 56 to 56+3
0x43c
CH_MAP_REG15
Interrupt Channel Map Register for 60 to 60+3
0x440
CH_MAP_REG16
Interrupt Channel Map Register for 64 to 64+3
0x444
CH_MAP_REG17
Interrupt Channel Map Register for 68 to 68+3
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Table 7-42
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CIC0 Registers (Part 3 of 4)
Address Offset
Register Mnemonic
Register Name
0x448
CH_MAP_REG18
Interrupt Channel Map Register for 72 to 72+3
0x44c
CH_MAP_REG19
Interrupt Channel Map Register for 76 to 76+3
0x450
CH_MAP_REG20
Interrupt Channel Map Register for 80 to 80+3
0x454
CH_MAP_REG21
Interrupt Channel Map Register for 84 to 84+3
0x458
CH_MAP_REG22
Interrupt Channel Map Register for 88 to 88+3
0x45c
CH_MAP_REG23
Interrupt Channel Map Register for 92 to 92+3
0x460
CH_MAP_REG24
Interrupt Channel Map Register for 96 to 96+3
0x464
CH_MAP_REG25
Interrupt Channel Map Register for 100 to 100+3
0x468
CH_MAP_REG26
Interrupt Channel Map Register for 104 to 104+3
0x46c
CH_MAP_REG27
Interrupt Channel Map Register for 108 to 108+3
0x470
CH_MAP_REG28
Interrupt Channel Map Register for 112 to 112+3
0x474
CH_MAP_REG29
Interrupt Channel Map Register for 116 to 116+3
0x478
CH_MAP_REG30
Interrupt Channel Map Register for 120 to 120+3
0x47c
CH_MAP_REG31
Interrupt Channel Map Register for 124 to 124+3
0x480
CH_MAP_REG32
Interrupt Channel Map Register for 128 to 128+3
0x484
CH_MAP_REG33
Interrupt Channel Map Register for 132 to 132+3
0x488
CH_MAP_REG34
Interrupt Channel Map Register for 136 to 136+3
0x48c
CH_MAP_REG35
Interrupt Channel Map Register for 140 to 140+3
0x490
CH_MAP_REG36
Interrupt Channel Map Register for 144 to 144+3
0x494
CH_MAP_REG37
Interrupt Channel Map Register for 148 to 148+3
0x498
CH_MAP_REG38
Interrupt Channel Map Register for 152 to 152+3
0x49c
CH_MAP_REG39
Interrupt Channel Map Register for 156 to 156+3
0x4a0
CH_MAP_REG40
Interrupt Channel Map Register for 160 to 160+3
0x4a4
CH_MAP_REG41
Interrupt Channel Map Register for 164 to 164+3
0x4a8
CH_MAP_REG42
Interrupt Channel Map Register for 168 to 168+3
0x4ac
CH_MAP_REG43
Interrupt Channel Map Register for 172 to 172+3
0x4b0
CH_MAP_REG44
Interrupt Channel Map Register for 176 to 176+3
0x4b4
CH_MAP_REG45
Interrupt Channel Map Register for 180 to 180+3
0x4b8
CH_MAP_REG46
Interrupt Channel Map Register for 184 to 184+3
0x4bc
CH_MAP_REG47
Interrupt Channel Map Register for 188 to 188+3
0x4c0
CH_MAP_REG48
Interrupt Channel Map Register for 192 to 192+3
0x4c4
CH_MAP_REG49
Interrupt Channel Map Register for 196 to 196+3
0x4c8
CH_MAP_REG50
Interrupt Channel Map Register for 200 to 200+3
0x4cc
CH_MAP_REG51
Interrupt Channel Map Register for 204 to 204+3
0x800
HINT_MAP_REG0
Host Interrupt Map Register for 0 to 0+3
0x804
HINT_MAP_REG1
Host Interrupt Map Register for 4 to 4+3
0x808
HINT_MAP_REG2
Host Interrupt Map Register for 8 to 8+3
0x80c
HINT_MAP_REG3
Host Interrupt Map Register for 12 to 12+3
0x810
HINT_MAP_REG4
Host Interrupt Map Register for 16 to 16+3
0x814
HINT_MAP_REG5
Host Interrupt Map Register for 20 to 20+3
0x818
HINT_MAP_REG6
Host Interrupt Map Register for 24 to 24+3
0x81c
HINT_MAP_REG7
Host Interrupt Map Register for 28 to 28+3
0x820
HINT_MAP_REG8
Host Interrupt Map Register for 32 to 32+3
0x824
HINT_MAP_REG9
Host Interrupt Map Register for 36 to 36+3
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Table 7-42
CIC0 Registers (Part 4 of 4)
Address Offset
Register Mnemonic
Register Name
0x828
HINT_MAP_REG10
Host Interrupt Map Register for 40 to 40+3
0x82c
HINT_MAP_REG11
Host Interrupt Map Register for 44 to 44+3
0x830
HINT_MAP_REG12
Host Interrupt Map Register for 48 to 48+3
0x834
HINT_MAP_REG13
Host Interrupt Map Register for 52 to 52+3
0x838
HINT_MAP_REG14
Host Interrupt Map Register for 56 to 56+3
0x83c
HINT_MAP_REG15
Host Interrupt Map Register for 60 to 60+3
0x840
HINT_MAP_REG16
Host Interrupt Map Register for 64 to 64+3
0x844
HINT_MAP_REG17
Host Interrupt Map Register for 68 to 68+3
0x848
HINT_MAP_REG18
Host Interrupt Map Register for 72 to 72+3
0x84c
HINT_MAP_REG19
Host Interrupt Map Register for 76 to 76+3
0x1500
ENABLE_HINT_REG0
Host Int Enable Register 0
0x1504
ENABLE_HINT_REG1
Host Int Enable Register 1
0x1508
ENABLE_HINT_REG2
Host Int Enable Register 2
End of Table 7-42
7.9.2.2 CIC1 Register Map
Table 7-43
CIC1 Registers (Part 1 of 3)
Address Offset
Register Mnemonic
Register Name
0x0
REVISION_REG
Revision Register
0x10
GLOBAL_ENABLE_HINT_REG
Global Host Int Enable Register
0x20
STATUS_SET_INDEX_REG
Status Set Index Register
0x24
STATUS_CLR_INDEX_REG
Status Clear Index Register
0x28
ENABLE_SET_INDEX_REG
Enable Set Index Register
0x2c
ENABLE_CLR_INDEX_REG
Enable Clear Index Register
0x34
HINT_ENABLE_SET_INDEX_REG
Host Int Enable Set Index Register
0x38
HINT_ENABLE_CLR_INDEX_REG
Host Int Enable Clear Index Register
0x200
RAW_STATUS_REG0
Raw Status Register 0
0x204
RAW_STATUS_REG1
Raw Status Register 1
0x208
RAW_STATUS_REG2
Raw Status Register 2
0x20c
RAW_STATUS_REG3
Raw Status Register 3
0x210
RAW_STATUS_REG4
Raw Status Register 4
0x280
ENA_STATUS_REG0
Enabled Status Register 0
0x284
ENA_STATUS_REG1
Enabled Status Register 1
0x288
ENA_STATUS_REG2
Enabled Status Register 2
0x28c
ENA_STATUS_REG3
Enabled Status Register 3
0x290
ENA_STATUS_REG4
Enabled Status Register 4
0x300
ENABLE_REG0
Enable Register 0
0x304
ENABLE_REG1
Enable Register 1
0x308
ENABLE_REG2
Enable Register 2
0x30c
ENABLE_REG3
Enable Register 3
0x310
ENABLE_REG4
Enable Register 4
0x380
ENABLE_CLR_REG0
Enable Clear Register 0
0x384
ENABLE_CLR_REG1
Enable Clear Register 1
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Table 7-43
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CIC1 Registers (Part 2 of 3)
Address Offset
Register Mnemonic
Register Name
0x388
ENABLE_CLR_REG2
Enable Clear Register 2
0x38c
ENABLE_CLR_REG3
Enable Clear Register 3
0x390
ENABLE_CLR_REG4
Enable Clear Register 4
0x400
CH_MAP_REG0
Interrupt Channel Map Register for 0 to 0+3
0x404
CH_MAP_REG1
Interrupt Channel Map Register for 4 to 4+3
0x408
CH_MAP_REG2
Interrupt Channel Map Register for 8 to 8+3
0x40c
CH_MAP_REG3
Interrupt Channel Map Register for 12 to 12+3
0x410
CH_MAP_REG4
Interrupt Channel Map Register for 16 to 16+3
0x414
CH_MAP_REG5
Interrupt Channel Map Register for 20 to 20+3
0x418
CH_MAP_REG6
Interrupt Channel Map Register for 24 to 24+3
0x41c
CH_MAP_REG7
Interrupt Channel Map Register for 28 to 28+3
0x420
CH_MAP_REG8
Interrupt Channel Map Register for 32 to 32+3
0x424
CH_MAP_REG9
Interrupt Channel Map Register for 36 to 36+3
0x428
CH_MAP_REG10
Interrupt Channel Map Register for 40 to 40+3
0x42c
CH_MAP_REG11
Interrupt Channel Map Register for 44 to 44+3
0x430
CH_MAP_REG12
Interrupt Channel Map Register for 48 to 48+3
0x434
CH_MAP_REG13
Interrupt Channel Map Register for 52 to 52+3
0x438
CH_MAP_REG14
Interrupt Channel Map Register for 56 to 56+3
0x43c
CH_MAP_REG15
Interrupt Channel Map Register for 60 to 60+3
0x440
CH_MAP_REG16
Interrupt Channel Map Register for 64 to 64+3
0x444
CH_MAP_REG17
Interrupt Channel Map Register for 68 to 68+3
0x448
CH_MAP_REG18
Interrupt Channel Map Register for 72 to 72+3
0x44c
CH_MAP_REG19
Interrupt Channel Map Register for 76 to 76+3
0x450
CH_MAP_REG20
Interrupt Channel Map Register for 80 to 80+3
0x454
CH_MAP_REG21
Interrupt Channel Map Register for 84 to 84+3
0x458
CH_MAP_REG22
Interrupt Channel Map Register for 88 to 88+3
0x45c
CH_MAP_REG23
Interrupt Channel Map Register for 92 to 92+3
0x460
CH_MAP_REG24
Interrupt Channel Map Register for 96 to 96+3
0x464
CH_MAP_REG25
Interrupt Channel Map Register for 100 to 100+3
0x468
CH_MAP_REG26
Interrupt Channel Map Register for 104 to 104+3
0x46c
CH_MAP_REG27
Interrupt Channel Map Register for 108 to 108+3
0x470
CH_MAP_REG28
Interrupt Channel Map Register for 112 to 112+3
0x474
CH_MAP_REG29
Interrupt Channel Map Register for 116 to 116+3
0x478
CH_MAP_REG30
Interrupt Channel Map Register for 120 to 120+3
0x47c
CH_MAP_REG31
Interrupt Channel Map Register for 124 to 124+3
0x480
CH_MAP_REG32
Interrupt Channel Map Register for 128 to 128+3
0x484
CH_MAP_REG33
Interrupt Channel Map Register for 132 to 132+3
0x488
CH_MAP_REG34
Interrupt Channel Map Register for 136 to 136+3
0x48c
CH_MAP_REG35
Interrupt Channel Map Register for 140 to 140+3
0x490
CH_MAP_REG36
Interrupt Channel Map Register for 144 to 144+3
0x494
CH_MAP_REG37
Interrupt Channel Map Register for 148 to 148+3
0x498
CH_MAP_REG38
Interrupt Channel Map Register for 152 to 152+3
0x49c
CH_MAP_REG39
Interrupt Channel Map Register for 156 to 156+3
0x800
HINT_MAP_REG0
Host Interrupt Map Register for 0 to 0+3
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Table 7-43
CIC1 Registers (Part 3 of 3)
Address Offset
Register Mnemonic
Register Name
0x804
HINT_MAP_REG1
Host Interrupt Map Register for 4 to 4+3
0x808
HINT_MAP_REG2
Host Interrupt Map Register for 8 to 8+3
0x80c
HINT_MAP_REG3
Host Interrupt Map Register for 12 to 12+3
0x810
HINT_MAP_REG4
Host Interrupt Map Register for 16 to 16+3
0x814
HINT_MAP_REG5
Host Interrupt Map Register for 20 to 20+3
0x818
HINT_MAP_REG6
Host Interrupt Map Register for 24 to 24+3
0x81c
HINT_MAP_REG7
Host Interrupt Map Register for 28 to 28+3
0x820
HINT_MAP_REG8
Host Interrupt Map Register for 32 to 32+3
0x824
HINT_MAP_REG9
Host Interrupt Map Register for 36 to 36+3
0x828
HINT_MAP_REG10
Host Interrupt Map Register for 40 to 40+3
0x82c
HINT_MAP_REG11
Host Interrupt Map Register for 44 to 44+3
0x830
HINT_MAP_REG12
Host Interrupt Map Register for 48 to 48+3
0x834
HINT_MAP_REG13
Host Interrupt Map Register for 52 to 52+3
0x1500
ENABLE_HINT_REG0
Host Int Enable Register 0
0x1504
ENABLE_HINT_REG1
Host Int Enable Register 1
End of Table 7-43
7.9.2.3 CIC2 Register Map
Table 7-44
CIC2 Registers (Part 1 of 2)
Address Offset
Register Mnemonic
Register Name
0x0
REVISION_REG
Revision Register
0x10
GLOBAL_ENABLE_HINT_REG
Global Host Int Enable Register
0x20
STATUS_SET_INDEX_REG
Status Set Index Register
0x24
STATUS_CLR_INDEX_REG
Status Clear Index Register
0x28
ENABLE_SET_INDEX_REG
Enable Set Index Register
0x2c
ENABLE_CLR_INDEX_REG
Enable Clear Index Register
0x34
HINT_ENABLE_SET_INDEX_REG
Host Int Enable Set Index Register
0x38
HINT_ENABLE_CLR_INDEX_REG
Host Int Enable Clear Index Register
0x200
RAW_STATUS_REG0
Raw Status Register 0
0x204
RAW_STATUS_REG1
Raw Status Register 1
0x280
ENA_STATUS_REG0
Enabled Status Register 0
0x284
ENA_STATUS_REG1
Enabled Status Register 1
0x300
ENABLE_REG0
Enable Register 0
0x304
ENABLE_REG1
Enable Register 1
0x380
ENABLE_CLR_REG0
Enable Clear Register 0
0x384
ENABLE_CLR_REG1
Enable Clear Register 1
0x400
CH_MAP_REG0
Interrupt Channel Map Register for 0 to 0+3
0x404
CH_MAP_REG1
Interrupt Channel Map Register for 4 to 4+3
0x408
CH_MAP_REG2
Interrupt Channel Map Register for 8 to 8+3
0x40c
CH_MAP_REG3
Interrupt Channel Map Register for 12 to 12+3
0x410
CH_MAP_REG4
Interrupt Channel Map Register for 16 to 16+3
0x414
CH_MAP_REG5
Interrupt Channel Map Register for 20 to 20+3
0x418
CH_MAP_REG6
Interrupt Channel Map Register for 24 to 24+3
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CIC2 Registers (Part 2 of 2)
Address Offset
Register Mnemonic
Register Name
0x41c
CH_MAP_REG7
Interrupt Channel Map Register for 28 to 28+3
0x420
CH_MAP_REG8
Interrupt Channel Map Register for 32 to 32+3
0x424
CH_MAP_REG9
Interrupt Channel Map Register for 36 to 36+3
0x428
CH_MAP_REG10
Interrupt Channel Map Register for 40 to 40+3
0x42c
CH_MAP_REG11
Interrupt Channel Map Register for 44 to 44+3
0x430
CH_MAP_REG12
Interrupt Channel Map Register for 48 to 48+3
0x434
CH_MAP_REG13
Interrupt Channel Map Register for 52 to 52+3
0x438
CH_MAP_REG14
Interrupt Channel Map Register for 56 to 56+3
0x43c
CH_MAP_REG15
Interrupt Channel Map Register for 60 to 60+3
0x800
HINT_MAP_REG0
Host Interrupt Map Register for 0 to 0+3
0x804
HINT_MAP_REG1
Host Interrupt Map Register for 4 to 4+3
0x808
HINT_MAP_REG2
Host Interrupt Map Register for 8 to 8+3
0x80c
HINT_MAP_REG3
Host Interrupt Map Register for 12 to 12+3
0x810
HINT_MAP_REG4
Host Interrupt Map Register for 16 to 16+3
0x814
HINT_MAP_REG5
Host Interrupt Map Register for 20 to 20+3
0x818
HINT_MAP_REG6
Host Interrupt Map Register for 24 to 24+3
0x81c
HINT_MAP_REG7
Host Interrupt Map Register for 28 to 28+3
0x820
HINT_MAP_REG8
Host Interrupt Map Register for 32 to 32+3
0x824
HINT_MAP_REG9
Host Interrupt Map Register for 36 to 36+3
0x828
HINT_MAP_REG10
Host Interrupt Map Register for 40 to 40+3
0x1500
ENABLE_HINT_REG0
Host Int Enable Register 0
0x1504
ENABLE_HINT_REG1
Host Int Enable Register 1
End of Table 7-44
7.9.3 Inter-Processor Register Map
Table 7-45
IPC Generation Registers (IPCGRx) (Part 1 of 2)
Address Start
Address End
Size
Register Name
Description
0x02620200
0x02620203
4B
NMIGR0
NMI Event Generation Register for CorePac0
0x02620204
0x02620207
4B
NMIGR1
NMI Event Generation Register for CorePac1
0x02620208
0x0262020B
4B
NMIGR2
NMI Event Generation Register for CorePac2
0x0262020C
0x0262020F
4B
NMIGR3
NMI Event Generation Register for CorePac3
0x02620210
0x02620213
4B
Reserved
Reserved
0x02620214
0x02620217
4B
Reserved
Reserved
0x02620218
0x0262021B
4B
Reserved
Reserved
0x0262021C
0x0262021F
4B
Reserved
Reserved
0x02620220
0x0262023F
32B
Reserved
Reserved
0x02620240
0x02620243
4B
IPCGR0
IPC Generation Register for CorePac0
0x02620244
0x02620247
4B
IPCGR1
IPC Generation Register for CorePac1
0x02620248
0x0262024B
4B
IPCGR2
IPC Generation Register for CorePac2
0x0262024C
0x0262024F
4B
IPCGR3
IPC Generation Register for CorePac3
0x02620250
0x02620253
4B
Reserved
Reserved
0x02620254
0x02620257
4B
Reserved
Reserved
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Table 7-45
IPC Generation Registers (IPCGRx) (Part 2 of 2)
Address Start
Address End
Size
Register Name
Description
0x02620258
0x0262025B
4B
Reserved
Reserved
0x0262025C
0x0262025F
4B
Reserved
Reserved
0x02620260
0x0262027B
28B
Reserved
Reserved
0x0262027C
0x0262027F
4B
IPCGRH
IPC Generation Register for Host
0x02620280
0x02620283
4B
IPCAR0
IPC Acknowledgement Register for CorePac0
0x02620284
0x02620287
4B
IPCAR1
IPC Acknowledgement Register for CorePac1
0x02620288
0x0262028B
4B
IPCAR2
IPC Acknowledgement Register for CorePac2
0x0262028C
0x0262028F
4B
IPCAR3
IPC Acknowledgement Register for CorePac3
0x02620290
0x02620293
4B
Reserved
Reserved
0x02620294
0x02620297
4B
Reserved
Reserved
0x02620298
0x0262029B
4B
Reserved
Reserved
0x0262029C
0x0262029F
4B
Reserved
Reserved
0x026202A0
0x026202BB
28B
Reserved
Reserved
0x026202BC
0x026202BF
4B
IPCARH
IPC Acknowledgement Register for host
End of Table 7-45
7.9.4 NMI and LRESET
The Non-Maskable Interrupts (NMI) can be generated by chip-level registers and the LRESET can be generated by
software writing into LPSC registers. LRESET and NMI can also be asserted by device pins or watchdog timers. One
NMI pin and one LRESET pin are shared by all four CorePacs on the device. The CORESEL[2:0] pins can be
configured to select between the four CorePacs available as shown in Table 7-46.
Table 7-46
LRESET and NMI Decoding
CORESEL[2:0] Pin Input LRESET Pin Input NMI Pin Input
LRESETNMIEN Pin Input
Reset Mux Block Output
XXX
X
X
1
No local reset or NMI assertion
000
0
X
0
Assert local reset to CorePac0
001
0
X
0
Assert local reset to CorePac1
010
0
X
0
Assert local reset to CorePac2
011
0
X
0
Assert local reset to CorePac3
1xx
0
X
0
Assert local reset to all CorePacs
000
1
1
0
De-assert local reset & NMI to CorePac0
001
1
1
0
De-assert local reset & NMI to CorePac1
010
1
1
0
De-assert local reset & NMI to CorePac2
011
1
1
0
De-assert local reset & NMI to CorePac3
1xx
1
1
0
De-assert local reset & NMI to all CorePacs
000
1
0
0
Assert NMI to CorePac0
001
1
0
0
Assert NMI to CorePac1
010
1
0
0
Assert NMI to CorePac2
011
1
0
0
Assert NMI to CorePac3
1xx
1
0
0
Assert NMI to all CorePacs
End of Table 7-46
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7.9.5 External Interrupts Electrical Data/Timing
Table 7-47
NMI and LRESET Timing Requirements
(1)
(see Figure 7-30)
No.
Min
Max
Unit
1
tsu(LRESET-LRESETNMIENL)
Setup time - LRESET valid before LRESETNMIEN low
12*P
ns
1
tsu(NMI-LRESETNMIENL)
Setup time - NMI valid before LRESETNMIEN low
12*P
ns
1
tsu(CORESELn-LRESETNMIENL)
Setup time - CORESEL[2:0] valid before LRESETNMIEN low
12*P
ns
2
th(LRESETNMIENL-LRESET)
Hold time - LRESET valid after LRESETNMIEN high
12*P
ns
2
th(LRESETNMIENL-NMI)
Hold time - NMI valid after LRESETNMIEN high
12*P
ns
2
th(LRESETNMIENL-CORESELn)
Hold time - CORESEL[2:0] valid after LRESETNMIEN high
12*P
ns
3
tw(LRESETNMIEN)
Pulsewidth - LRESETNMIEN low width
12*P
ns
End of Table 7-47
1 P = 1/SYSCLK1 clock frequency in ns.
Figure 7-30
NMI and LRESET Timing
1
2
CORESEL[3:0]/
LRESET/
NMI
3
LRESETNMIEN
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7.10 Memory Protection Unit (MPU)
The C6670 supports six MPUs:
• One MPU is used to protect main CORE/3 CFG TeraNet (CFG space of all slave devices on the TeraNet is
protected by the MPU).
• Two MPUs are used for packet DMA (one for DATA PORT and another is for CFG PORT).
• One MPU is used for Semaphore.
• One MPU is used for the RAC.
• One MPU is used to protect the main CFG TeraNet of the TE_SCR_3M.
This section contains MPU register map and details of device-specific MPU registers only. For MPU features and
details of generic MPU registers, see the Memory Protection Unit (MPU) for KeyStone Devices User Guide in
2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66.
The following tables show the configuration of each MPU and the memory regions protected by each MPU.
Table 7-48
MPU Default Configuration
Setting
MPU0
Main CFG SCR
MPU1
MPU2
MPU3
(QM_SS DATA PORT) (QM_SS CFG PORT) Semaphore
MPU4
RAC
MPU5
TE_SCR_3M
Default permission
Assume allowed Assume allowed
Assume allowed
Assume allowed Assume allowed Assume allowed
Number of allowed IDs
supported
16
16
16
16
16
16
Number of programmable
ranges supported
16
5
16
1
2
3
Compare width
1KB granularity
1KB granularity
1KB granularity
1KB granularity
1KB granularity
1KB granularity
End of Table 7-48
Table 7-49
MPU Memory Regions
Memory Protection
Start Address
End Address
MPU0
Main CFG SCR
0x01D00000
0x026203FF
MPU1
QM_SS DATA PORT
0x34000000
0x340BFFFF
MPU2
QM_SS CFG PORT
0x02A00000
0x02ABFFFF
MPU3
Semaphore
0x02640000
0x026407FF
MPU4
RAC
0x01F80000
0x0215FFFF
MPU5
TE_SCR_3M
0x35000000
0x350003FF
End of Table 7-49
Table 7-50 shows the unique Master ID assigned to each CorePac and peripherals on the device.
Table 7-50
Master ID Settings (Part 1 of 3)
Master ID
C6670
0
CorePac0
1
CorePac1
2
CorePac2
3
CorePac3
4
Reserved
5
Reserved
6
Reserved
7
Reserved
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Table 7-50
www.ti.com
Master ID Settings (Part 2 of 3)
Master ID
C6670
8
CorePac0 CFG
9
CorePac1 CFG
10
CorePac2 CFG
11
CorePac3 CFG
12
Reserved
13
Reserved
14
Reserved
15
Reserved
16
EDMA0_TC0 read
17
EDMA0_TC0 write
18
EDMA0_TC1 read
19
EDMA0_TC1 write
20
EDMA1_TC0 read
21
EDMA1_TC0 write
22
EDMA1_TC1 read
23
EDMA1_TC1write
24
EDMA1_TC2 read
25
EDMA1_TC2 write
26
EDMA1_TC3 read
27
EDMA1_TC3 write
28
EDMA2_TC0 read
29
EDMA2_TC0 write
30
EDMA2_TC1 read
31
EDMA2_TC1 write
32
EDMA2_TC2 read
33
EDMA2_TC2 write
34
EDMA2_TC3 read
35
EDMA2_TC3 write
36 to 37
Reserved
38 to 39
SRIO PKTDMA
40
FFTC_A
41
Reserved
42
FFTC_B
43
Reserved
44
RAC_B_BE0
45
RAC_B_BE1
46
RAC_A_BE0
47
RAC_A_BE1
48
DebugSS
49
EDMA3CC0
50
EDMA3CC1
51
EDMA3CC2
52
MSMC
53
PCIe
180
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Table 7-50
Master ID Settings (Part 3 of 3)
Master ID
C6670
54
SRIO_M
55
HyperLink
56 to 59
Queue Manager
60 to 63
Reserved
64 to 71
AIF2
72 to 85
Reserved
86
Reserved
87
Reserved
88 to 91
Queue Manager packet DMA
92 to 93
Packet Coprocessor
94
TAC
95
Reserved
96 to 127
TE_SS
128
Tracer_L2_0
129
Tracer_L2_1
130
Tracer_L2_2
131
Tracer_L2_3
132
Reserved
133
Reserved
134
Reserved
135
Reserved
136
Tracer_MSMC0
137
Tracer_MSMC1
138
Tracer_MSMC2
139
Tracer_MSMC3
(2)
140
Tracer_DDR
141
Tracer_SM
142
Tracer_QM_P
143
Tracer_QM_M
144
Tracer_CFG
145
Tracer_RAC
146
Tracer_RAC_CFG
147
Tracer_TAC
End of Table 7-50
1 The master ID for MSMC is for the transactions initiated by MSMC internally and sent to the DDR.
2 All Traces are set to the same master ID and bit 7 of the master ID needs to be 1.
Note—Some of the PKTDMA based-peripherals require multiple master IDs. Queue Manager Packet DMA
is assigned with 88, 89, 90, 91, but only 88-89 are actually used. For Queue Manager port, 56, 57, 58, 59 are
assigned while only 1 (56) is actually used. For AIF2, 64, 65, 66, 67, 68, 69, 70, 71 are assigned while only 4
(64-67) are actually used. There are two master ID values are assigned for the Queue Manager_second
master port, one master ID for external linking RAM and the other one for the PDSP/MCDM accesses.
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Table 7-51 shows the privilege ID of each CorePac and every mastering peripheral. Table 7-51 also shows the
privilege level (supervisor vs. user), security level (secure vs. non-secure), and access type (instruction read vs.
data/DMA read or write) of each master on the device. In some cases, a particular setting depends on software being
executed at the time of the access or the configuration of the master peripheral.
Table 7-51
Privilege ID
Privilege ID Settings
Master
Privilege Level
Security Level
Access Type
0
CorePac0
SW dependant, driven by MSMC
SW dependant
DMA
1
CorePac1
SW dependant, driven by MSMC
SW dependant
DMA
2
CorePac2
SW dependant, driven by MSMC
SW dependant
DMA
3
CorePac3
SW dependant, driven by MSMC
SW dependant
DMA
4
AIF
User
Non-secure
DMA
5
TAC
User
Non-secure
DMA
6
RAC
User
Non-secure
DMA
7
FFTC
User
Non-secure
DMA
8
QM_SS Second
User
Non-secure
DMA
9
SRIO Packet
DMA/SRIO_M
User/driven by SRIO block, user mode and supervisor mode is determined Non-secure
by per transaction basis. Only the transaction with source ID matching the
value in SupervisorID register is granted supervisor mode.
DMA
10
QM_SS Packet
User
DMA/NETCP Packet DMA
Non-secure
11
PCIe
Supervisor
Non-secure
DMA
12
DebugSS
Driven by Debug_SS
Driven by
debug_SS
DMA
13
HyperLink
Supervisor
Non-secure
DMA
DMA
14
HyperLink
Supervisor
Non-secure
DMA
15
TE_SCR_3M
User
Non-secure
DMA
End of Table 7-51
7.10.1 MPU Registers
This section includes the offsets for MPU registers and definitions for device-specific MPU registers.
7.10.1.1 MPU Register Map
Table 7-52
MPU0 Registers (Part 1 of 3)
Offset
Name
Description
0h
REVID
Revision ID
4h
CONFIG
Configuration
10h
IRAWSTAT
Interrupt raw status/set
14h
IENSTAT
Interrupt enable status/clear
18h
IENSET
Interrupt enable
1Ch
IENCLR
Interrupt enable clear
20h
EOI
End of interrupt
200h
PROG0_MPSAR
Programmable range 0, start address
204h
PROG0_MPEAR
Programmable range 0, end address
208h
PROG0_MPPA
Programmable range 0, memory page protection attributes
210h
PROG1_MPSAR
Programmable range 1, start address
214h
PROG1_MPEAR
Programmable range 1, end address
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Table 7-52
MPU0 Registers (Part 2 of 3)
Offset
Name
Description
218h
PROG1_MPPA
Programmable range 1, memory page protection attributes
220h
PROG2_MPSAR
Programmable range 2, start address
224h
PROG2_MPEAR
Programmable range 2, end address
228h
PROG2_MPPA
Programmable range 2, memory page protection attributes
230h
PROG3_MPSAR
Programmable range 3, start address
234h
PROG3_MPEAR
Programmable range 3, end address
238h
PROG3_MPPA
Programmable range 3, memory page protection attributes
240h
PROG4_MPSAR
Programmable range 4, start address
244h
PROG4_MPEAR
Programmable range 4, end address
248h
PROG4_MPPA
Programmable range 4, memory page protection attributes
250h
PROG5_MPSAR
Programmable range 5, start address
254h
PROG5_MPEAR
Programmable range 5, end address
258h
PROG5_MPPA
Programmable range 5, memory page protection attributes
260h
PROG6_MPSAR
Programmable range 6, start address
264h
PROG6_MPEAR
Programmable range 6, end address
268h
PROG6_MPPA
Programmable range 6, memory page protection attributes
270h
PROG7_MPSAR
Programmable range 7, start address
274h
PROG7_MPEAR
Programmable range 7, end address
278h
PROG7_MPPA
Programmable range 7, memory page protection attributes
280h
PROG8_MPSAR
Programmable range 8, start address
284h
PROG8_MPEAR
Programmable range 8, end address
288h
PROG8_MPPA
Programmable range 8, memory page protection attributes
290h
PROG9_MPSAR
Programmable range 9, start address
294h
PROG9_MPEAR
Programmable range 9, end address
298h
PROG9_MPPA
Programmable range 9, memory page protection attributes
2A0h
PROG10_MPSAR
Programmable range 10, start address
2A4h
PROG10_MPEAR
Programmable range 10, end address
2A8h
PROG10_MPPA
Programmable range 10, memory page protection attributes
2B0h
PROG11_MPSAR
Programmable range 11, start address
2B4h
PROG11_MPEAR
Programmable range 11, end address
2B8h
PROG11_MPPA
Programmable range 11, memory page protection attributes
2C0h
PROG12_MPSAR
Programmable range 12, start address
2C4h
PROG12_MPEAR
Programmable range 12, end address
2C8h
PROG12_MPPA
Programmable range 12, memory page protection attributes
2D0h
PROG13_MPSAR
Programmable range 13, start address
2D4h
PROG13_MPEAR
Programmable range 13, end address
2Dh
PROG13_MPPA
Programmable range 13, memory page protection attributes
2E0h
PROG14_MPSAR
Programmable range 14, start address
2E4h
PROG14_MPEAR
Programmable range 14, end address
2E8h
PROG14_MPPA
Programmable range 14, memory page protection attributes
2F0h
PROG15_MPSAR
Programmable range 15, start address
2F4h
PROG15_MPEAR
Programmable range 15, end address
2F8h
PROG15_MPPA
Programmable range 15, memory page protection attributes
300h
FLTADDRR
Fault address
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Table 7-52
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MPU0 Registers (Part 3 of 3)
Offset
Name
Description
304h
FLTSTAT
Fault status
308h
FLTCLR
Fault clear
End of Table 7-52
Table 7-53
MPU1 Registers
Offset
Name
Description
0h
REVID
Revision ID
4h
CONFIG
Configuration
10h
IRAWSTAT
Interrupt raw status/set
14h
IENSTAT
Interrupt enable status/clear
18h
IENSET
Interrupt enable
1Ch
IENCLR
Interrupt enable clear
20h
EOI
End of interrupt
200h
PROG0_MPSAR
Programmable range 0, start address
204h
PROG0_MPEAR
Programmable range 0, end address
208h
PROG0_MPPA
Programmable range 0, memory page protection attributes
210h
PROG1_MPSAR
Programmable range 1, start address
214h
PROG1_MPEAR
Programmable range 1, end address
218h
PROG1_MPPA
Programmable range 1, memory page protection attributes
220h
PROG2_MPSAR
Programmable range 2, start address
224h
PROG2_MPEAR
Programmable range 2, end address
228h
PROG2_MPPA
Programmable range 2, memory page protection attributes
230h
PROG3_MPSAR
Programmable range 3, start address
234h
PROG3_MPEAR
Programmable range 3, end address
238h
PROG3_MPPA
Programmable range 3, memory page protection attributes
300h
FLTADDRR
Fault address
304h
FLTSTAT
Fault status
308h
FLTCLR
Fault clear
End of Table 7-53
Table 7-54
MPU2 Registers (Part 1 of 3)
Offset
Name
Description
0h
REVID
Revision ID
4h
CONFIG
Configuration
10h
IRAWSTAT
Interrupt raw status/set
14h
IENSTAT
Interrupt enable status/clear
18h
IENSET
Interrupt enable
1Ch
IENCLR
Interrupt enable clear
20h
EOI
End of interrupt
200h
PROG0_MPSAR
Programmable range 0, start address
204h
PROG0_MPEAR
Programmable range 0, end address
208h
PROG0_MPPA
Programmable range 0, memory page protection attributes
210h
PROG1_MPSAR
Programmable range 1, start address
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Table 7-54
MPU2 Registers (Part 2 of 3)
Offset
Name
Description
214h
PROG1_MPEAR
Programmable range 1, end address
218h
PROG1_MPPA
Programmable range 1, memory page protection attributes
220h
PROG2_MPSAR
Programmable range 2, start address
224h
PROG2_MPEAR
Programmable range 2, end address
228h
PROG2_MPPA
Programmable range 2, memory page protection attributes
230h
PROG3_MPSAR
Programmable range 3, start address
234h
PROG3_MPEAR
Programmable range 3, end address
238h
PROG3_MPPA
Programmable range 3, memory page protection attributes
240h
PROG4_MPSAR
Programmable range 4, start address
244h
PROG4_MPEAR
Programmable range 4, end address
248h
PROG4_MPPA
Programmable range 4, memory page protection attributes
250h
PROG5_MPSAR
Programmable range 5, start address
254h
PROG5_MPEAR
Programmable range 5, end address
258h
PROG5_MPPA
Programmable range 5, memory page protection attributes
260h
PROG6_MPSAR
Programmable range 6, start address
264h
PROG6_MPEAR
Programmable range 6, end address
268h
PROG6_MPPA
Programmable range 6, memory page protection attributes
270h
PROG7_MPSAR
Programmable range 7, start address
274h
PROG7_MPEAR
Programmable range 7, end address
278h
PROG7_MPPA
Programmable range 7, memory page protection attributes
280h
PROG8_MPSAR
Programmable range 8, start address
284h
PROG8_MPEAR
Programmable range 8, end address
288h
PROG8_MPPA
Programmable range 8, memory page protection attributes
290h
PROG9_MPSAR
Programmable range 9, start address
294h
PROG9_MPEAR
Programmable range 9, end address
298h
PROG9_MPPA
Programmable range 9, memory page protection attributes
2A0h
PROG10_MPSAR
Programmable range 10, start address
2A4h
PROG10_MPEAR
Programmable range 10, end address
2A8h
PROG10_MPPA
Programmable range 10, memory page protection attributes
2B0h
PROG11_MPSAR
Programmable range 11, start address
2B4h
PROG11_MPEAR
Programmable range 11, end address
2B8h
PROG11_MPPA
Programmable range 11, memory page protection attributes
2C0h
PROG12_MPSAR
Programmable range 12, start address
2C4h
PROG12_MPEAR
Programmable range 12, end address
2C8h
PROG12_MPPA
Programmable range 12, memory page protection attributes
2D0h
PROG13_MPSAR
Programmable range 13, start address
2D4h
PROG13_MPEAR
Programmable range 13, end address
2Dh
PROG13_MPPA
Programmable range 13, memory page protection attributes
2E0h
PROG14_MPSAR
Programmable range 14, start address
2E4h
PROG14_MPEAR
Programmable range 14, end address
2E8h
PROG14_MPPA
Programmable range 14, memory page protection attributes
2F0h
PROG15_MPSAR
Programmable range 15, start address
2F4h
PROG15_MPEAR
Programmable range 15, end address
2F8h
PROG15_MPPA
Programmable range 15, memory page protection attributes
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Table 7-54
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MPU2 Registers (Part 3 of 3)
Offset
Name
Description
300h
FLTADDRR
Fault address
304h
FLTSTAT
Fault status
308h
FLTCLR
Fault clear
End of Table 7-54
Table 7-55
MPU3 Registers
Offset
Name
Description
0h
REVID
Revision ID
4h
CONFIG
Configuration
10h
IRAWSTAT
Interrupt raw status/set
14h
IENSTAT
Interrupt enable status/clear
18h
IENSET
Interrupt enable
1Ch
IENCLR
Interrupt enable clear
20h
EOI
End of interrupt
200h
PROG0_MPSAR
Programmable range 0, start address
204h
PROG0_MPEAR
Programmable range 0, end address
208h
PROG0_MPPA
Programmable range 0, memory page protection attributes
300h
FLTADDRR
Fault address
304h
FLTSTAT
Fault status
308h
FLTCLR
Fault clear
End of Table 7-55
Table 7-56
Offset
MPU4 Registers
Name
Description
0h
REVID
Revision ID
4h
CONFIG
Configuration
10h
IRAWSTAT
Interrupt raw status/set
14h
IENSTAT
Interrupt enable status/clear
18h
IENSET
Interrupt enable
1Ch
IENCLR
Interrupt enable clear
20h
EOI
End of interrupt
200h
PROG0_MPSAR
Programmable range 0, start address
204h
PROG0_MPEAR
Programmable range 0, end address
208h
PROG0_MPPA
Programmable range 0, memory page protection attributes
210h
PROG1_MPSAR
Programmable range 1, start address
214h
PROG1_MPEAR
Programmable range 1, end address
218h
PROG1_MPPA
Programmable range 1, memory page protection attributes
300h
FLTADDRR
Fault address
304h
FLTSTAT
Fault status
308h
FLTCLR
Fault clear
End of Table 7-56
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Table 7-57
Offset
MPU5 Registers
Name
Description
0h
REVID
Revision ID
4h
CONFIG
Configuration
10h
IRAWSTAT
Interrupt raw status/set
14h
IENSTAT
Interrupt enable status/clear
18h
IENSET
Interrupt enable
1Ch
IENCLR
Interrupt enable clear
20h
EOI
End of interrupt
200h
PROG0_MPSAR
Programmable range 0, start address
204h
PROG0_MPEAR
Programmable range 0, end address
208h
PROG0_MPPA
Programmable range 0, memory page protection attributes
210h
PROG1_MPSAR
Programmable range 1, start address
214h
PROG1_MPEAR
Programmable range 1, end address
218h
PROG1_MPPA
Programmable range 1, memory page protection attributes
220h
PROG2_MPSAR
Programmable range 2, start address
224h
PROG2_MPEAR
Programmable range 2, end address
228h
PROG2_MPPA
Programmable range 2, memory page protection attributes
300h
FLTADDRR
Fault address
304h
FLTSTAT
Fault status
308h
FLTCLR
Fault clear
End of Table 7-57
7.10.1.2 Device-Specific MPU Registers
7.10.1.2.1 Configuration Register (CONFIG)
The configuration register (CONFIG) contains the configuration value of the MPU.
Figure 7-31
Configuration Register (CONFIG)
31
24
23
20
19
16
15
12
11
1
0
ADDR_WIDTH
NUM_FIXED
NUM_PROG
NUM_AIDS
Reserved
ASSUME_ALLOWED
MPU0
R-0
R-0
R-16
R-16
R-0
R-1
MPU1
R-0
R-0
R-5
R-16
R-0
R-1
MPU2
R-0
R-0
R-16
R-16
R-0
R-1
MPU3
R-0
R-0
R-1
R-16
R-0
R-1
MPU4
R-0
R-0
R-2
R-16
R-0
R-1
MPU5
R-0
R-0
R-3
R-16
R-0
R-1
Reset Values
Legend: R = Read only; -n = value after reset
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Configuration Register Field Descriptions
Bits
Field
Description
31 – 24
ADDR_WIDTH
Address alignment for range checking
0 = 1KB alignment
6 = 64KB alignment
23 – 20
NUM_FIXED
Number of fixed address ranges
19 – 16
NUM_PROG
Number of programmable address ranges
15 – 12
NUM_AIDS
Number of supported AIDs
11 – 1
Reserved
Reserved. Always read as 0.
0
ASSUME_ALLOWED
Assume allowed bit. When an address is not covered by any MPU protection range, this bit determines whether the
transfer is assumed to be allowed or not.
0 = Assume disallowed
1 = Assume allowed
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7.10.2 MPU Programmable Range Registers
7.10.2.1 Programmable Range n Start Address Register (PROGn_MPSAR)
The Programmable Address Start Register holds the start address for the range. This register is writeable by a
supervisor entity only. If NS = 0 (non-secure mode) in the associated MPPA register, then the register is also
writeable only by a secure entity.
The start address must be aligned on a page boundary. The size of the page is 1K byte. The size of the page determines
the width of the address field in MPSAR and MPEAR.
Figure 7-32
Programmable Range n Start Address Register (PROGn_MPSAR)
31
10
9
0
START_ADDR
Reserved
R/W
R
Legend: R = Read only; R/W = Read/Write
Table 7-59
Programmable Range n Start Address Register Field Descriptions
Bit
Field
Description
31 – 10
START_ADDR
Start address for range n
9–0
Reserved
Reserved. Always read as 0.
End of Table 7-59
Table 7-60
Programmable Range n Start Address Register (PROGn_MPSAR) Reset Values
Register
MPU0
MPU1
MPU2
MPU3
MPU4
PROG0_MPSAR
0x01D0_0000
0x3400_0000
0x02A0_0000
0x0264_0000
0x0210_0000
0x3502_0000
PROG1_MPSAR
0x01F0_0000
0x3402_0000
0x02A2_0000
N/A
0x01F8_0000
0x3504_0000
PROG2_MPSAR
0x0200_0000
0x3406_0000
0x02A4_0000
N/A
N/A
0x3520_0000
PROG3_MPSAR
0x0218_0000
0x3406_8000
0x02A6_0000
N/A
N/A
PROG4_MPSAR
0x021C_0000
0x340B_8000
0x02A6_8000
N/A
N/A
PROG5_MPSAR
0x021F_0000
N/A
0x02A6_9000
N/A
N/A
PROG6_MPSAR
0x0220_0000
N/A
0x02A6_A000
N/A
N/A
PROG7_MPSAR
0x0231_0000
N/A
0x02A6_B000
N/A
N/A
PROG8_MPSAR
0x0232_0000
N/A
0x02A6_C000
N/A
N/A
PROG9_MPSAR
0x0233_0000
N/A
0x02A6_E000
N/A
N/A
PROG10_MPSAR
0x0235_0000
N/A
0x02A8_0000
N/A
N/A
PROG11_MPSAR
0x0240_0000
N/A
0x02A9_0000
N/A
N/A
PROG12_MPSAR
0x0250_0000
N/A
0x02AA_0000
N/A
N/A
PROG13_MPSAR
0x0253_0000
N/A
0x02AA_8000
N/A
N/A
PROG14_MPSAR
0x0260_0000
N/A
0x02AB_0000
N/A
N/A
PROG15_MPSAR
0x0262_0000
N/A
0x02AB_8000
N/A
N/A
MPU5
End of Table 7-60
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7.10.2.2 Programmable Range n - End Address Register (PROGn_MPEAR)
The programmable address end register holds the end address for the range. This register is writeable by a supervisor
entity only. If NS = 0 (non-secure mode) in the associated MPPA register then the register is also writeable only by
a secure entity.
The end address must be aligned on a page boundary. The size of the page depends on the MPU number. The page
size for MPU1 is 1K byte and for MPU2 it is 64K bytes. The size of the page determines the width of the address field
in MPSAR and MPEAR
Figure 7-33
Programmable Range n End Address Register (PROGn_MPEAR)
31
10
9
0
END_ADDR
Reserved
R/W
R
Legend: R = Read only; R/W = Read/Write
Table 7-61
Programmable Range n End Address Register Field Descriptions
Bit
Field
Description
31 – 10
END_ADDR
End address for range n
9–0
Reserved
Reserved. Always read as 3FFh.
End of Table 7-61
Table 7-62
Programmable Range n End Address Register (PROGn_MPEAR) Reset Values
Register
MPU0
MPU1
MPU2
MPU3
MPU4
MPU5
PROG0_MPEAR
0x01D8_03FF
0x3401_FFFF
0x02A1_FFFF
0x0264_07FF
0x0215_FFFF
0x3502_03FF
PROG1_MPEAR
0x01F7_FFFF
0x3405_FFFF
0x02A3_FFFF
N/A
0x01FD_FFFF
0x3504_07FF
PROG2_MPEAR
0x0209_FFFF
0x3406_7FFF
0x02A5_FFFF
N/A
N/A
0x3521_FFFF
PROG3_MPEAR
0x021A_FFFF
0x340B_7FFF
0x02A6_7FFF
N/A
N/A
PROG4_MPEAR
0x021E_0FFF
0x340B_FFFF
0x02A6_8FFF
N/A
N/A
PROG5_MPEAR
0x021F_7FFF
N/A
0x02A6_9FFF
N/A
N/A
PROG6_MPEAR
0x022F_03FF
N/A
0x02A6_AFFF
N/A
N/A
PROG7_MPEAR
0x0231_03FF
N/A
0x02A6_BFFF
N/A
N/A
PROG8_MPEAR
0x0232_03FF
N/A
0x02A6_DFFF
N/A
N/A
PROG9_MPEAR
0x0233_03FF
N/A
0x02A6_FFFF
N/A
N/A
PROG10_MPEAR
0x0235_0FFF
N/A
0x02A8_FFFF
N/A
N/A
PROG11_MPEAR
0x024B_3FFF
N/A
0x02A9_FFFF
N/A
N/A
PROG12_MPEAR
0x0252_03FF
N/A
0x02AA_7FFF
N/A
N/A
PROG13_MPEAR
0x0254_03FF
N/A
0x02AA_FFFF
N/A
N/A
PROG14_MPEAR
0x0260_FFFF
N/A
0x02AB_7FFF
N/A
N/A
PROG15_MPEAR
0x0262_07FF
N/A
0x02AB_FFFF
N/A
N/A
End of Table 7-62
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7.10.2.3 Programmable Range n Memory Protection Page Attribute Register (PROGn_MPPA)
The programmable address memory protection page attribute register holds the permissions for the region. This
register is writeable only by a non-debug supervisor entity. If NS = 0 (secure mode) then the register is also writeable
only by a non-debug secure entity. The NS bit is writeable only by a non-debug secure entity. For debug accesses,
the register is writeable only when NS = 1 or EMU = 1.
Figure 7-34
Programmable Range n Memory Protection Page Attribute Register (PROGn_MPPA)
31
26
25
24
23
22
21
20
19
18
17
16
15
Reserved
AID15
AID14
AID13
AID12
AID11
AID10
AID9
AID8
AID7
AID6
AID5
R
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
AID4
AID3
AID2
AID1
AID0
AIDX
Reserved
NS
EMU
SR
SW
SX
UR
UW
UX
R/W
R/W
R/W
R/W
R/W
R/W
R
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Legend: R = Read only; R/W = Read/Write
Table 7-63
Programmable Range n Memory Protection Page Attribute Register Field Descriptions (Part 1 of 2)
Bits
Name
Description
31 – 26
Reserved
Reserved. Always read as 0.
25
AID15
Controls access from ID = 15
0 = Access denied
1 = Access granted
24
AID14
Controls access from ID = 14
0 = Access denied
1 = Access granted
23
AID13
Controls access from ID = 13
0 = Access denied
1 = Access granted
22
AID12
Controls access from ID = 12
0 = Access denied
1 = Access granted
21
AID11
Controls access from ID = 11
0 = Access denied
1 = Access granted
20
AID10
Controls access from ID = 10
0 = Access denied
1 = Access granted
19
AID9
Controls access from ID = 9
0 = Access denied
1 = Access granted
18
AID8
Controls access from ID = 8
0 = Access denied
1 = Access granted
17
AID7
Controls access from ID = 7
0 = Access denied
1 = Access granted
16
AID6
Controls access from ID = 6
0 = Access denied
1 = Access granted
15
AID5
Controls access from ID = 5
0 = Access denied
1 = Access granted
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Programmable Range n Memory Protection Page Attribute Register Field Descriptions (Part 2 of 2)
Bits
Name
Description
14
AID4
Controls access from ID = 4
0 = Access denied
1 = Access granted
13
AID3
Controls access from ID = 3
0 = Access denied
1 = Access granted
12
AID2
Controls access from ID = 2
0 = Access denied
1 = Access granted
11
AID1
Controls access from ID = 1
0 = Access denied
1 = Access granted
10
AID0
Controls access from ID = 0
0 = Access denied
1 = Access granted
9
AIDX
Controls access from ID > 15
0 = Access denied
1 = Access granted
8
Reserved
Reserved. Always reads as 0.
7
NS
Non-secure access permission
0 = Only secure access allowed
1 = Non-secure access allowed
6
EMU
Emulation (debug) access permission. This bit is ignored if NS = 1
0 = Debug access not allowed
1 = Debug access allowed
5
SR
Supervisor Read permission
0 = Access not allowed
1 = Access allowed
4
SW
Supervisor Write permission
0 = Access not allowed
1 = Access allowed
3
SX
Supervisor Execute permission
0 = Access not allowed
1 = Access allowed
2
UR
User Read permission
0 = Access not allowed
1 = Access allowed
1
UW
User Write permission
0 = Access not allowed
1 = Access allowed
0
UX
User Execute permission
0 = Access not allowed
1 = Access allowed
End of Table 7-631
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Table 7-64
Programmable Range n Memory Protection Page Attribute Register (PROGn_MPPA) Reset Values
Register
MPU0
MPU1
MPU2
MPU3
MPU4
MPU5
Register 0
0X03FF_FCB6
0X03FF_FC80
0x03FF_FCA4
0X0003_FCB6
0X0003_FCB6
0X03FF_FCB6
Register 1
0X03FF_FCB6
0X0003_FCB6
0X0003_FCB6
N/A
0X0003_FCB6
0X03FF_FCB6
Register 2
0X03FF_FCB6
0X0003_FCB4
0X0003_FCB6
N/A
N/A
0X03FF_FCB6
Register 3
0X03FF_FCB6
0X0003_FC80
0X0003_FCB4
N/A
N/A
N/A
Register 4
0X03FF_FCB6
0X0003_FCB6
0X0003_FCB4
N/A
N/A
N/A
Register 5
0X03FF_FCB6
N/A
0X0003_FCB4
N/A
N/A
N/A
Register 6
0X03FF_FCB6
N/A
0X0003_FCB4
N/A
N/A
N/A
Register 7
0X03FF_FCB4
N/A
0X0003_FCB4
N/A
N/A
N/A
Register 8
0X03FF_FCB4
N/A
0X0003_FCB4
N/A
N/A
N/A
Register 9
0X03FF_FCB4
N/A
0X0003_FCB4
N/A
N/A
N/A
Register 10
0X03FF_FCB4
N/A
0X0003_FCA4
N/A
N/A
N/A
Register 11
0X03FF_FCB6
N/A
0X0003_FCB4
N/A
N/A
N/A
Register 12
0X03FF_FCB4
N/A
0X0003_FCB4
N/A
N/A
N/A
Register 13
0X03FF_FCB6
N/A
0X0003_FCB4
N/A
N/A
N/A
Register 14
0X03FF_FCB4
N/A
0X0003_FCB4
N/A
N/A
N/A
Register 15
0X03FF_FCB4
N/A
0X0003_FCB6
N/A
N/A
N/A
End of Table 7-64
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7.11 DDR3 Memory Controller
The 64-bit DDR3 Memory Controller bus of the TMS320C6670 is used to interface to JEDEC standard-compliant
DDR3 SDRAM devices. The DDR3 external bus interfaces only to DDR3 SDRAM devices; it does not share the bus
with any other types of peripherals.
7.11.1 DDR3 Memory Controller Device-Specific Information
The TMS320C6670 includes one 64-bit wide, 1.5-V DDR3 SDRAM EMIF interface. The DDR3 interface can operate
at 800 mega transfers per second (MTS), 1033 MTS, 1333 MTS, and 1600 MTS.
Due to the complicated nature of the interface, a limited number of topologies will be supported to provide a 16-bit,
32-bit, or 64-bit interface.
The DDR3 electrical requirements are fully specified in the DDR Jedec Specification JESD79-3C. Standard DDR3
SDRAMs are available in 8-bit and 16-bit versions, allowing for the following bank topologies to be supported by
the interface:
• 72-bit: Five 16-bit SDRAMs (including 8 bits of ECC)
• 72-bit: Nine 8-bit SDRAMs (including 8 bits of ECC)
• 36-bit: Three 16-bit SDRAMs (including 4 bits of ECC)
• 36-bit: Five 8-bit SDRAMs (including 4 bits of ECC)
• 64-bit: Four 16-bit SDRAMs
• 64-bit: Eight 8-bit SDRAMs
• 32-bit: Two 16-bit SDRAMs
• 32-bit: Four 8-bit SDRAMs
• 16-bit: One 16-bit SDRAM
• 16-bit: Two 8-bit SDRAMs
The approach to specifying interface timing for the DDR3 memory bus is different than on other interfaces such as
I2C or SPI. For these other interfaces, the device timing was specified in terms of data manual specifications and I/O
buffer information specification (IBIS) models. For the DDR3 memory bus, the approach is to specify compatible
DDR3 devices and provide the printed circuit board (PCB) solution and guidelines directly to the user.
A race condition may exist when certain masters write data to the DDR3 memory controller. For example, if
master A passes a software message via a buffer in external memory and does not wait for an indication that the write
completes, before signaling to master B that the message is ready, when master B attempts to read the software
message, then the master B read may bypass the master A write and, thus, master B may read stale data and,
therefore, receive an incorrect message.
Some master peripherals (e.g., EDMA3 transfer controllers with TCCMOD=0) will always wait for the write to
complete before signaling an interrupt to the system, thus avoiding this race condition. For masters that do not have
a hardware specification of write-read ordering, it may be necessary to specify data ordering via software.
If master A does not wait for indication that a write is complete, it must perform the following workaround:
1. Perform the required write to DDR3 memory space.
2. Perform a dummy write to the DDR3 memory controller module ID and revision register.
3. Perform a dummy read to the DDR3 memory controller module ID and revision register.
4. Indicate to master B that the data is ready to be read after completion of the read in step 3. The completion of
the read in step 3 ensures that the previous write was done.
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7.11.2 DDR3 Memory Controller Electrical Data/Timing
The DDR3 Implementation Guidelines Application Report in 2.9 ‘‘Related Documentation from Texas
Instruments’’ on page 66 specifies a complete DDR3 interface solution as well as a list of compatible DDR3 devices.
The DDR3 electrical requirements are fully specified in the DDR3 Jedec Specification JESD79-3C. TI has performed
the simulation and system characterization to ensure all DDR3 interface timings in this solution are met; therefore,
no electrical data/timing information is supplied here for this interface.
Note—TI supports only designs that follow the board design guidelines outlined in the application report.
7.12 I2C Peripheral
The Inter-Integrated Circuit (I2C) module provides an interface between DSP and other devices compliant with
2
2
Philips Semiconductors Inter-IC bus (I C bus) specification version 2.1 and connected by way of an I C bus.
External components attached to this 2-wire serial bus can transmit/receive up to 8-bit data to/from the SoC through
the I2C module.
2
7.12.1 I C Device-Specific Information
2
2
The TMS320C6670 device includes an I C peripheral module. NOTE: when using the I C module, ensure there are
external pullup resistors on the SDA and SCL pins.
2
The I C modules on the C6670 may be used by the DSP to control local peripheral ICs (DACs, ADCs, etc.) or may
be used to communicate with other controllers in a system or to implement a user interface.
2
The I C port supports:
2
• Compatibility with Philips I C specification revision 2.1 (January 2000)
• Fast mode up to 400 kbps (no fail-safe I/O buffers)
• Noise filter to remove noise of 50 ns or less
• 7-bit and 10-bit device addressing modes
• Multi-master (transmit/receive) and slave (transmit/receive) functionality
• Events: DMA, interrupt, or polling
• Slew-rate limited open-drain output buffers
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2
Figure 7-35 shows a block diagram of the I C module.
Figure 7-35
I2C Module Block Diagram
2
I C Module
Clock
Prescale
Peripheral Clock
(CPU/6)
2
I CPSC
Control
Bit Clock
Generator
SCL
Noise
Filter
2
I C Clock
I COAR
Own
Address
I2CSAR
Slave
Address
I2CMDR
Mode
2
2
I CCLKH
I2CCLKL
2
I CCNT
Transmit
I2CXSR
2
I CDXR
Transmit
Shift
I2CEMDR
Extended
Mode
Transmit
Buffer
SDA
Interrupt/DMA
Noise
Filter
I2C Data
Data
Count
I2CDRR
2
I CRSR
2
Interrupt
Mask/Status
2
Interrupt
Status
I CIMR
Receive
Receive
Buffer
I CSTR
Receive
Shift
I CIVR
2
Interrupt
Vector
Shading denotes control/status registers.
2
7.12.2 I C Peripheral Register Description(s)
Table 7-65
I2C Registers (Part 1 of 2)
Hex Address Range
Acronym
Register Name
0253 0000
ICOAR
I2C own Address Register
0253 0004
ICIMR
I C Interrupt Mask/status Register
0253 0008
ICSTR
I C Interrupt Status Register
0253 000C
ICCLKL
I2C Clock Low-time Divider Register
0253 0010
ICCLKH
I C Clock High-time Divider Register
0253 0014
ICCNT
I C Data Count Register
0253 0018
ICDRR
I2C Data Receive Register
0253 001C
ICSAR
I C Slave Address Register
0253 0020
ICDXR
I C Data Transmit Register
0253 0024
ICMDR
I2C Mode Register
0253 0028
ICIVR
I C Interrupt Vector Register
0253 002C
ICEMDR
I C Extended Mode Register
0253 0030
ICPSC
I2C Prescaler Register
196
2
2
2
2
2
2
2
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Table 7-65
2
I C Registers (Part 2 of 2)
Hex Address Range
Acronym
Register Name
0253 0034
ICPID1
I2C Peripheral Identification Register 1 [value: 0x0000 0105]
0253 0038
ICPID2
I C Peripheral Identification Register 2 [value: 0x0000 0005]
0253 003C -0253 007F
-
Reserved
2
End of Table 7-65
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2
7.12.3 I C Electrical Data/Timing
2
7.12.3.1 Inter-Integrated Circuits (I C) Timing
I2C Timing Requirements
Table 7-66
(1)
(see Figure 7-36)
Standard Mode
No.
Min
Max
Fast Mode
Min
Max Units
tc(SCL)
Cycle time, SCL
10
2.5
μs
tsu(SCLH-SDAL)
Setup time, SCL high before SDA low (for a repeated START
condition)
4.7
0.6
μs
th(SDAL-SCLL)
Hold time, SCL low after SDA low (for a START and a repeated
START condition)
4
0.6
μs
4
tw(SCLL)
Pulse duration, SCL low
4.7
1.3
μs
5
tw(SCLH)
Pulse duration, SCL high
0.6
μs
6
tsu(SDAV-SCLH)
Setup time, SDA valid before SCL high
1
2
3
4
250
2
(3)
7
th(SCLL-SDAV)
Hold time, SDA valid after SCL low (for I C bus devices)
0
8
tw(SDAH)
Pulse duration, SDA high between STOP and START conditions
4.7
100
(2)
0
(3)
3.45
ns
0.9
(4)
1.3
μs
μs
9
tr(SDA)
Rise time, SDA
1000
20 + 0.1Cb
(5)
300
ns
10
tr(SCL)
Rise time, SCL
1000
20 + 0.1Cb
(5)
300
ns
300
ns
300
ns
11
tf(SDA)
Fall time, SDA
300
20 + 0.1Cb
(5)
12
tf(SCL)
Fall time, SCL
300
20 + 0.1Cb
(5)
13
tsu(SCLH-SDAH)
Setup time, SCL high before SDA high (for STOP condition)
14
tw(SP)
Pulse duration, spike (must be suppressed)
Cb
(5)
4
0.6
μs
0
Capacitive load for each bus line
400
50
ns
400
pF
End of Table 7-66
1 The I2C pins SDA and SCL do not feature fail-safe I/O buffers. These pins could potentially draw current when the device is powered down
2
2
2 A Fast-mode I C-bus™ device can be used in a Standard-mode I C-bus™ system, but the requirement tsu(SDA-SCLH) ≥ 250 ns must then be met. This will automatically be the
case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the
SDA line tr max + tsu(SDA-SCLH) = 1000 + 250 = 1250 ns (according to the Standard-mode I2C-Bus Specification) before the SCL line is released.
3 A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIHmin of the SCL signal) to bridge the undefined region of the falling edge
of SCL.
4 The maximum th(SDA-SCLL) has to be met only if the device does not stretch the low period [tw(SCLL)] of the SCL signal.
5 Cb = total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed.
Figure 7-36
I2C Receive Timings
11
9
SDA
8
6
4
14
13
5
10
SCL
1
3
12
7
2
3
Stop
198
Start
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Start
Stop
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I2C Switching Characteristics (1)
Table 7-67
(see Figure 7-37)
Standard Mode
No.
Parameter
Min
Max
Fast Mode
Min
Max Unit
16
tc(SCL)
Cycle time, SCL
10
2.5
ms
17
tsu(SCLH-SDAL)
Setup time, SCL high to SDA low (for a repeated START condition)
4.7
0.6
ms
th(SDAL-SCLL)
Hold time, SDA low after SCL low (for a START and a repeated START
condition)
4
0.6
ms
19
tw(SCLL)
Pulse duration, SCL low
4.7
1.3
ms
20
tw(SCLH)
Pulse duration, SCL high
4
0.6
ms
21
td(SDAV-SDLH)
Delay time, SDA valid to SCL high
250
100
ns
18
2
22
tv(SDLL-SDAV)
Valid time, SDA valid after SCL low (for I C bus devices)
23
tw(SDAH)
Pulse duration, SDA high between STOP and START conditions
0
0
4.7
1.3
0.9
ms
ms
24
tr(SDA)
Rise time, SDA
1000
20 + 0.1Cb
(1)
300
ns
25
tr(SCL)
Rise time, SCL
1000
20 + 0.1Cb
(1)
300
ns
(1)
300
ns
300
ns
10
pF
26
tf(SDA)
Fall time, SDA
300
20 + 0.1Cb
27
tf(SCL)
Fall time, SCL
300
20 + 0.1Cb (1)
28
td(SCLH-SDAH)
Delay time, SCL high to SDA high (for STOP condition)
Cp
Capacitance for each I C pin
4
0.6
2
10
ms
End of Table 7-67
1 Cb = total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed.
Figure 7-37
2
I C Transmit Timings
26
24
SDA
23
21
19
28
20
25
SCL
16
18
27
22
17
18
Stop
Start
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7.13 SPI Peripheral
The Serial Peripheral Interconnect (SPI) module provides an interface between the DSP and other SPI-compliant
devices. The primary intent of this interface is to allow for connection to a SPI ROM for boot. The SPI module on
C6670 is supported only in Master mode. Additional chip-level components can also be included, such as
temperature sensors or an I/O expander.
7.13.1 SPI Electrical Data/Timing
Table 7-68
SPI Timing Requirements
See Figure 7-38)
No.
Min
Max
Unit
Master Mode Timing Diagrams — Base Timings for 3 Pin Mode
7
tsu(SOMI-SPC)
Input setup time, SPIx_SOMI valid before receive edge of SPIx_CLk. Polarity = 0 Phase = 0
2
ns
7
tsu(SOMI-SPC)
Input setup time, SPIx_SOMI valid before receive edge of SPIx_CLk. Polarity = 0 Phase = 1
2
ns
7
tsu(SOMI-SPC)
Input setup time, SPIx_SOMI valid before receive edge of SPIx_CLk. Polarity = 1 Phase = 0
2
ns
7
tsu(SOMI-SPC)
Input setup time, SPIx_SOMI valid before receive edge of SPIx_CLk. Polarity = 1 Phase = 1
2
ns
8
th(SPC-SOMI)
Input hold time, SPIx_SOMI valid after receive edge of SPIx_CLK. Polarity = 0 Phase = 0
5
ns
8
th(SPC-SOMI)
Input hold time, SPIx_SOMI valid after receive edge of SPIx_CLK. Polarity = 0 Phase = 1
5
ns
8
th(SPC-SOMI)
Input hold time, SPIx_SOMI valid after receive edge of SPIx_CLK. Polarity = 1 Phase = 0
5
ns
8
th(SPC-SOMI)
Input hold time, SPIx_SOMI valid after receive edge of SPIx_CLK. Polarity = 1 Phase = 1
5
ns
End of Table 7-68
Table 7-69
SPI Switching Characteristics (Part 1 of 2)
(See Figure 7-38 and Figure 7-39)
No.
Parameter
Min
Max
Unit
Master Mode Timing Diagrams — Base Timings for 3 Pin Mode
1
tc(SPC)
Cycle time, SPIx_CLK, all master modes
3*P2
(1)
ns
2
tw(SPCH)
Pulse width high, SPIx_CLK, all master modes
0.5*(3*P2) - 1
ns
3
tw(SPCL)
Pulse width low, SPIx_CLK, all master modes
0.5*(3*P2) - 1
ns
4
td(SIMO-SPC)
Setup (Delay), initial data bit valid on SPIx_SIMO to initial edge on SPIx_CLK.
Polarity = 0, Phase = 0.
5
4
td(SIMO-SPC)
Setup (Delay), initial data bit valid on SPIx_SIMO to initial edge on SPIx_CLK.
Polarity = 0, Phase = 1.
5
4
td(SIMO-SPC)
Setup (Delay), initial data bit valid on SPIx_SIMO to initial edge on SPIx_CLK
Polarity = 1, Phase = 0
5
4
td(SIMO-SPC)
Setup (Delay), initial data bit valid on SPIx_SIMO to initial edge on SPIx_CLK
Polarity = 1, Phase = 1
5
5
td(SPC-SIMO)
Setup (Delay), subsequent data bits valid on SPIx_SIMO to initial edge on
SPIx_CLK. Polarity = 0 Phase = 0
2
5
td(SPC-SIMO)
Setup (Delay), subsequent data bits valid on SPIx_SIMO to initial edge on
SPIx_CLK Polarity = 0 Phase = 1
2
5
td(SPC-SIMO)
Setup (Delay), subsequent data bits valid on SPIx_SIMO to initial edge on
SPIx_CLK Polarity = 1 Phase = 0
2
5
td(SPC-SIMO)
Setup (Delay), subsequent data bits valid on SPIx_SIMO to initial edge on
SPIx_CLK Polarity = 1 Phase = 1
2
6
toh(SPC-SIMO)
Output hold time, SPIx_SIMO valid after receive edge of SPIx_CLK except for
final bit. Polarity = 0 Phase = 0
0.5*tc - 2
6
toh(SPC-SIMO)
Output hold time, SPIx_SIMO valid after receive edge of SPIx_CLK except for
final bit. Polarity = 0 Phase = 1
0.5*tc - 2
6
toh(SPC-SIMO)
Output hold time, SPIx_SIMO valid after receive edge of SPIx_CLK except for
final bit. Polarity = 1 Phase = 0
0.5*tc - 2
200
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ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
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Table 7-69
SPI Switching Characteristics (Part 2 of 2)
(See Figure 7-38 and Figure 7-39)
No.
Parameter
Min
6
toh(SPC-SIMO)
Output hold time, SPIx_SIMO valid after receive edge of SPIx_CLK except for
final bit. Polarity = 1 Phase = 1
19
td(SCS-SPC)
Delay from SPIx_SCS\ active to first SPIx_CLK. Polarity = 0 Phase = 0
Max
Unit
ns
0.5*tc - 2
Additional SPI Master Timings — 4 Pin Mode with Chip Select Option
19
td(SCS-SPC)
Delay from SPIx_SCS\ active to first SPIx_CLK. Polarity = 0 Phase = 1
19
td(SCS-SPC)
Delay from SPIx_SCS\ active to first SPIx_CLK. Polarity = 1 Phase = 0
19
td(SCS-SPC)
Delay from SPIx_SCS\ active to first SPIx_CLK. Polarity = 1 Phase = 1
20
td(SPC-SCS)
Delay from final SPIx_CLK edge to master deasserting SPIx_SCS\. Polarity = 0
Phase = 0
20
td(SPC-SCS)
Delay from final SPIx_CLK edge to master deasserting SPIx_SCS\. Polarity = 0
Phase = 1
20
td(SPC-SCS)
Delay from final SPIx_CLK edge to master deasserting SPIx_SCS\. Polarity = 1
Phase = 0
20
td(SPC-SCS)
Delay from final SPIx_CLK edge to master deasserting SPIx_SCS\. Polarity = 1
Phase = 1
tw(SCSH)
Minimum inactive time on SPIx_SCS\ pin between two transfers when
SPIx_SCS\ is not held using the CSHOLD feature.
2*P2 - 5
2*P2 + 5 ns
0.5*tc + (2*P2) - 5 0.5*tc + (2*P2) + 5 ns
2*P2 - 5
2*P2 + 5 ns
0.5*tc + (2*P2) - 5 0.5*tc + (2*P2) + 5 ns
1*P2 - 5
1*P2 + 5
0.5*tc + (1*P2) - 5 0.5*tc + (1*P2) + 5
1*P2 - 5
1*P2 + 5
0.5*tc + (1*P2) - 5 0.5*tc + (1*P2) + 5
2*P2 - 5
ns
ns
ns
ns
ns
End of Table 7-69
1 P2=1/SYSCLK7
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Figure 7-38
www.ti.com
SPI Master Mode Timing Diagrams — Base Timings for 3-Pin Mode
1
2
MASTER MODE
POLARITY = 0 PHASE = 0
3
SPIx_CLK
5
4
SPIx_SIMO
MO(0)
7
SPIx_SOMI
6
MO(1)
MO(n-1)
MO(n)
8
MI(0)
MI(1)
MI(n-1)
MI(n)
MASTER MODE
POLARITY = 0 PHASE = 1
4
SPIx_CLK
6
5
SPIx_SIMO
MO(0)
7
SPIx_SOMI
MO(1)
MO(n-1)
MI(1)
MI(n-1)
MO(n)
8
MI(0)
4
MI(n)
MASTER MODE
POLARITY = 1 PHASE = 0
SPIx_CLK
5
SPIx_SIMO
6
MO(0)
7
SPIx_SOMI
MO(1)
MO(n-1)
MO(n)
8
MI(0)
MI(1)
MI(n-1)
MI(n)
MASTER MODE
POLARITY = 1 PHASE = 1
SPIx_CLK
5
4
SPIx_SIMO
MO(0)
7
SPIx_SOMI
Figure 7-39
6
MO(1)
MO(n-1)
MI(1)
MI(n-1)
MO(n)
8
MI(0)
MI(n)
SPI Additional Timings for 4-Pin Master Mode with Chip Select Option
MASTER MODE 4 PIN WITH CHIP SELECT
19
20
SPIx_CLK
SPIx_SIMO
SPIx_SOMI
MO(0)
MI(0)
MO(1)
MO(n-1)
MO(n)
MI(1)
MI(n-1)
MI(n)
SPIx_SCS
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7.14 HyperLink Peripheral
The TMS320C6670 includes the HyperLink for companion chip/die interfaces. This is a four-lane SerDes interface
designed to operate up to 12.5 Gbps per lane from pin-to-pin. The interface is used to connect with external
accelerators that are manufactured using TI libraries. The Hyperbridge links must be connected with DC coupling.
The interface includes the serial station management interfaces used to send power management and flow messages
between devices. This consists of four LVCMOS inputs and four LVCMOS outputs configured as two 2-wire output
buses and two 2-wire input buses. Each 2-wire bus includes a data signal and a clock signal.
Table 7-70
HyperLink Peripheral Timing Requirements
(see Figure 7-40, Figure 7-41 and Figure 7-42)
No.
Min
Max
Unit
FL Interface
1
tc(MCMTXFLCLK)
Clock period - MCMTXFLCLK (C1)
5.75
ns
2
tw(MCMTXFLCLKH)
High pulse width - MCMTXFLCLK
0.4*C1 0.6*C1
ns
3
tw(MCMTXFLCLKL)
Low pulse width - MCMTXFLCLK
0.4*C1 0.6*C1
ns
6
tsu(MCMTXFLDAT-MCMTXFLCLKH)
Setup time - MCMTXFLDAT valid before MCMTXFLCLK high
1
ns
7
th(MCMTXFLCLKH-MCMTXFLDAT)
Hold time - MCMTXFLDAT valid after MCMTXFLCLK high
1
ns
6
tsu(MCMTXFLDAT-MCMTXFLCLKL)
Setup time - MCMTXFLDAT valid before MCMTXFLCLK low
1
ns
7
th(MCMTXFLCLKL-MCMTXFLDAT)
Hold time - MCMTXFLDAT valid after MCMTXFLCLK low
1
ns
1
tc(MCMRXPMCLK)
Clock period - MCMRXPMCLK (C3)
5.75
ns
PM Interface
2
tw(MCMRXPMCLK)
High pulse width - MCMRXPMCLK
0.4*C3 0.6*C3
ns
3
tw(MCMRXPMCLK)
Low pulse width - MCMRXPMCLK
0.4*C3 0.6*C3
ns
6
tsu(MCMRXPMDAT-MCMRXPMCLKH) Setup time - MCMRXPMDAT valid before MCMRXPMCLK high
1
ns
7
th(MCMRXPMCLKH-MCMRXPMDAT)
Hold time - MCMRXPMDAT valid after MCMRXPMCLK high
1
ns
6
tsu(MCMRXPMDAT-MCMRXPMCLKL)
Setup time - MCMRXPMDAT valid before MCMRXPMCLK low
1
ns
7
th(MCMRXPMCLKL-MCMRXPMDAT)
Hold time - MCMRXPMDAT valid after MCMRXPMCLK low
1
ns
End of Table 7-70
Table 7-71
HyperLink Peripheral Switching Characteristics (Part 1 of 2)
(see Figure 7-40, Figure 7-41 and Figure 7-42)
No.
Parameter
Min
Max
Unit
FL Interface
1
tc(MCMRXFLCLK)
Clock period - MCMRXFLCLK (C2)
6.4
ns
2
tw(MCMRXFLCLKH)
High pulse width - MCMRXFLCLK
0.4*C2
0.6*C2
ns
3
tw(MCMRXFLCLKL)
Low pulse width - MCMRXFLCLK
0.4*C2
0.6*C2
ns
4
tosu(MCMRXFLDAT-MCMRXFLCLKH)
Setup time - MCMRXFLDAT valid before MCMRXFLCLK high
0.25*C2-0.4
ns
5
toh(MCMRXFLCLKH-MCMRXFLDAT)
Hold time - MCMRXFLDAT valid after MCMRXFLCLK high
0.25*C2-0.4
ns
4
tosu(MCMRXFLDAT-MCMRXFLCLKL)
Setup time - MCMRXFLDAT valid before MCMRXFLCLK low
0.25*C2-0.4
ns
5
toh(MCMRXFLCLKL-MCMRXFLDAT)
Hold time - MCMRXFLDAT valid after MCMRXFLCLK low
0.25*C2-0.4
ns
1
tc(MCMTXPMCLK)
Clock period - MCMTXPMCLK (C4)
6.4
ns
2
tw(MCMTXPMCLK)
High pulse width - MCMTXPMCLK
0.4*C4
0.6*C4
ns
3
tw(MCMTXPMCLK)
Low pulse width - MCMTXPMCLK
0.4*C4
0.6*C4
ns
4
tosu(MCMTXPMDAT-MCMTXPMCLKH) Setup time - MCMTXPMDAT valid before MCMTXPMCLK high
0.25*C2-0.4
ns
5
toh(MCMTXPMCLKH-MCMTXPMDAT)
0.25*C2-0.4
ns
PM Interface
Hold time - MCMTXPMDAT valid after MCMTXPMCLK high
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Table 7-71
www.ti.com
HyperLink Peripheral Switching Characteristics (Part 2 of 2)
(see Figure 7-40, Figure 7-41 and Figure 7-42)
No.
Parameter
Min
Max
Unit
4
tosu(MCMTXPMDAT-MCMTXPMCLKL)
Setup time - MCMTXPMDAT valid before MCMTXPMCLK low
0.25*C2-0.4
ns
5
toh(MCMTXPMCLKL-MCMTXPMDAT)
Hold time - MCMTXPMDAT valid after MCMTXPMCLK low
0.25*C2-0.4
ns
End of Table 7-71
Figure 7-40
HyperLink Station Management Clock Timing
1
2
Figure 7-41
3
HyperLink Station Management Transmit Timing
4
5
4
5
7
6
7
MCMTX<xx>CLK
MCMTX<xx>DAT
<xx> represents the interface that is being used: PM or FL
Figure 7-42
HyperLink Station Management Receive Timing
6
MCMRX<xx>CLK
MCMRX<xx>DAT
<xx> represents the interface that is being used: PM or FL
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7.15 UART Peripheral
The universal asynchronous receiver/transmitter (UART) module provides an interface between the DSP and a
UART terminal interface or other UART-based peripheral. The UART is based on the industry standard TL16C550
asynchronous communications element, which, in turn, is a functional upgrade of the TL16C450. Functionally
similar to the TL16C450 on power up (single character or TL16C450 mode), the UART can be placed in an alternate
FIFO (TL16C550) mode. This relieves the DSP of excessive software overhead by buffering received and transmitted
characters. The receiver and transmitter FIFOs store up to 16 bytes including three additional bits of error status per
byte for the receiver FIFO.
The UART performs serial-to-parallel conversions on data received from a peripheral device and parallel-to-serial
conversion on data received from the DSP. The DSP can read the UART status at any time. The UART includes
control capability and a processor interrupt system that can be tailored to minimize software management of the
communications link. For more information on UART, see the Universal Asynchronous Receiver/Transmitter
(UART) for KeyStone Devices User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66.
Table 7-72
UART Timing Requirements
(see Figure 7-43 and Figure 7-44)
No.
Min
Max
Unit
Receive Timing
Pulse width, receive start bit
0.96U
(1)
1.05U
ns
4
tw(RXSTART)
5
tw(RXH)
Pulse width, receive data/parity bit high
0.96U
1.05U
ns
5
tw(RXL)
Pulse width, receive data/parity bit low
0.96U
1.05U
ns
6
tw(RXSTOP1)
Pulse width, receive stop bit 1
0.96U
1.05U
ns
6
tw(RXSTOP15)
Pulse width, receive stop bit 1.5
0.96U
1.05U
ns
6
tw(RXSTOP2)
Pulse width, receive stop bit 2
0.96U
1.05U
ns
(2)
5P
ns
Autoflow Timing Requirements
8
td(CTSL-TX)
Delay time, CTS asserted to START bit transmit
P
End of Table 7-72
1 U = UART baud time = 1/programmed baud rate
2 P = 1/SYSCLK7
Figure 7-43
UART Receive Timing Waveform
5
4
RXD
Figure 7-44
Stop/Idle
Start
5
Bit 0
Bit 1
Bit N-1
Bit N
6
Parity
Stop
Idle
Start
UART CTS (Clear-to-Send Input) — Autoflow Timing Waveform
8
TXD
Bit N-1
Bit N
Stop
Start
Bit 0
CTS
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Table 7-73
www.ti.com
UART Switching Characteristics
(See Figure 7-45 and Figure 7-46)
No.
Parameter
Min
Max
Unit
Transmit Timing
(1)
-2
U+2
ns
Pulse width, transmit data/parity bit high
U-2
U+2
ns
tw(TXL)
Pulse width, transmit data/parity bit low
U-2
U+2
ns
tw(TXSTOP1)
Pulse width, transmit stop bit 1
U-2
U+2
ns
3
tw(TXSTOP15)
Pulse width, transmit stop bit 1.5
1.5 * (U - 2) 1.5 * ('U + 2)
ns
3
tw(TXSTOP2)
Pulse width, transmit stop bit 2
1
tw(TXSTART)
Pulse width, transmit start bit
2
tw(TXH)
2
3
U
2 * (U - 2)
2 * ('U + 2)
ns
P (2)
5P
ns
Autoflow Timing Requirements
7
Delay time, STOP bit received to RTS deasserted
td(RX-RTSH)
End of Table 7-73
1 U = UART baud time = 1/programmed baud rate
2 P = 1/SYSCLK7
Figure 7-45
UART Transmit Timing Waveform
1
TXD
Start
Stop/Idle
Figure 7-46
2
Bit 0
2
Bit 1
Bit N-1
Bit N
Parity
3
Stop
Idle
Start
UART RTS (Request-to-Send Output) – Autoflow Timing Waveform
7
RXD
Bit N-1
Bit N
Stop
Start
CTS
7.16 PCIe Peripheral
The 2-lane PCI express (PCIe) module on TMS320C6670 provides an interface between the SoC and other
PCIe-compliant devices. The PCI express module provides low pin-count, high-reliability, and high-speed data
transfer at rates of 5.0 Gbps per lane on the serial links. For more information, see the Peripheral Component
Interconnect Express (PCIe) for KeyStone Devices User Guide in 2.9 ‘‘Related Documentation from Texas
Instruments’’ on page 66.
7.17 Packet Accelerator
The Packet Accelerator provides L2 to L4 classification functionalities. It supports classification for Ethernet, VLAN,
MPLS over Ethernet, IPv4/6, GRE over IP, and other session identification over IP such as TCP and UDP ports. It
maintains 8k multiple-in, multiple-out hardware queues. It also provides checksum capability as well as some QoS
capabilities. It enables a single IP address to be used for a multi-core device. It can process up to 1.5 Mpps. The Packet
Accelerator is coupled with the Network Coprocessor. For more information, see the Packet Accelerator (PA) for
KeyStone Devices User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66.
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7.18 Security Accelerator
The Security Accelerator provides wire-speed processing on 1-Gbps Ethernet traffic on IPSec, SRTP, and 3GPP Air
interface security protocols. It functions on the packet level with the packet and the associated security context being
one of these above three types. The Security Accelerator is coupled with network coprocessor, and receives the
packet descriptor containing the security context in the buffer descriptor, and the data to be encrypted/decrypted in
the linked buffer descriptor. For more information, see the Security Accelerator (SA) for KeyStone Devices User
Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66.
7.19 Gigabit Ethernet (GbE) Switch Subsystem
The gigabit Ethernet (GbE) switch subsystem provide an efficient interface between the TMS320C6670 SoC and the
networked community. The EMAC supports 10Base-T (10 Mbits/second [Mbps]), and 100BaseTX (100 Mbps), in
half- or full-duplex mode, and 1000BaseT (1000 Mbps) in full-duplex mode, with hardware flow control and
quality-of-service (QOS) support. The GbE switch subsystem is coupled with network coprocessor. For more
information, see the Gigabit Ethernet (GbE) Switch Subsystem for KeyStone Devices User Guide in 2.9 ‘‘Related
Documentation from Texas Instruments’’ on page 66.
Each device has a unique MAC address. There are two registers to hold these values, MACID1 (0x02620110) and
MACID2 (0x02620114). All bits of these registers are defined as follows:
Figure 7-47
MACID1 Register
31
0
MACID[31:0]
R,+xxxx xxxx xxxx xxxx xxxx xxxx xxxx xxxx
Legend: R = Read only; -x, value is indeterminate
Table 7-74
MACID1 Register Field Descriptions
Bit
Field
Description
31-0
MAC ID[31-0]
MAC ID. A range will be assigned to this device. Each device will consume only one MAC address.
End of Table 7-74
Figure 7-48
MACID2 Register
31
24
23
18
17
16
15
0
CRC
Reserved
FLOW
BCAST
MACID[47:32]
R+,cccc cccc
R,+rr rrrr
R,+z
R,+y
R,+xxxx xxxx xxxx xxxx
Legend: R = Read only; -x, value is indeterminate
Table 7-75
Bit
MACID2 Register Field Descriptions
Field
Description
31-24
Reserved
Variable
23-18
Reserved
000000
17
FLOW
MAC Flow Control
0 = Off
1 = On
16
BCAST
Default m/b-cast reception
0 = Broadcast
1 = Disabled
15-0
MAC ID[47-0]
MAC ID. A range will be assigned to this device. Each device will consume only one MAC address.
End of Table 7-75
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There is a Central Processor Time Synchronization (CPTS) submodule in the Ethernet switch module that can be
used for time synchronization. Programming this register selects the clock source for the CPTS_RCLK. Please see
the see the Gigabit Ethernet (GbE) Switch Subsystem for KeyStone Devices User Guide in 2.9 ‘‘Related
Documentation from Texas Instruments’’ on page 66 for the register address and other details about the time
synchronization module. The register CPTS_RFTCLK_SEL for reference clock selection of time synchronization
submodule is shown in Figure 7-49.
Figure 7-49
RFTCLK Select Register (CPTS_RFTCLK_SEL)
31
3
2
0
Reserved
CPTS_RFTCLK_SEL
R-0
RW - 0
Legend: R = Read only; -x, value is indeterminate
Table 7-76
RFTCLK Select Register Field Descriptions
Bit
Field
Description
31-3
Reserved
Reserved. Read as zero.
2-0
CPTS_RFTCLK_SEL
Reference clock select. This signal is used to control an external multiplexer that selects one of 8 clocks for time sync
reference (RFTCLK). This CPTS_RFTCLK_SEL value can be written only when the CPTS_EN bit is cleared to 0 in the
TS_CTL register.
000 = SYSCLK2
001 = SYSCLK3
010 = TIMI0
011 = TIMI1
1xx = Reserved
End of Table 7-76
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7.20 Management Data Input/Output (MDIO)
The management data input/output (MDIO) module implements the 802.3 serial management interface to
interrogate and controls up to 32 Ethernet PHY(s) connected to the device, using a shared two-wire bus. Application
software uses the MDIO module to configure the auto-negotiation parameters of each PHY attached to the EMAC,
retrieve the negotiation results, and configure required parameters in the to gigabit Ethernet (GbE) switch
subsystem for correct operation. The module is designed to allow almost transparent operation of the MDIO
interface, with very little attention from the CorePac. For more information, see the Gigabit Ethernet (GbE) Switch
Subsystem for KeyStone Devices User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66.
Table 7-77
MDIO Timing Requirements
(see Figure 7-50)
No.
Min
Max
Unit
1
tc(MDCLK)
Cycle time, MDCLK
400
ns
2
tw(MDCLKH)
Pulse duration, MDCLK high
180
ns
3
tw(MDCLKL)
Pulse duration, MDCLK low
180
ns
4
tsu(MDIO-MDCLKH)
Setup time, MDIO data input valid before MDCLK high
10
ns
5
th(MDCLKH-MDIO)
Hold time, MDIO data input valid after MDCLK high
10
tt(MDCLK)
Transition time, MDCLK
ns
5
ns
End of Table 7-77
Figure 7-50
MDIO Input Timing
1
MDCLK
2
3
4
5
MDIO
(Input)
Table 7-78
MDIO Switching Characteristics
(see Figure 7-51)
No.
6
Parameter
td(MDCLKL-MDIO)
Min
Delay time, MDCLK low to MDIO data output valid
Max
Unit
100
ns
End of Table 7-78
Figure 7-51
MDIO Output Timing
1
MDCLK
6
MDIO
(Ouput)
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7.21 Timers
The timers can be used to time events, count events, generate pulses, interrupt the CPU, and send synchronization
events to the EDMA3 channel controller.
7.21.1 Timers Device-Specific Information
The TMS320C6670 device has eight 64-bit timers in total. Of which Timer0 through Timer3 are dedicated to each
of the four CorePacs as a watchdog timer and can also be used as general-purpose timers. Each of other four timers
can also be configured as a general-purpose timer only, with each timer programmed as a 64-bit timer or as two
separate 32-bit timers.
When operating in 64-bit mode, the timer counts either VBUS clock cycles or input (TINPLx) pulses (rising edge)
and generates an output pulse/waveform (TOUTLx) plus an internal event (TINTLx) on a software-programmable
period. When operating in 32-bit mode, the timer is split into two independent 32-bit timers. Each timer is made up
of two 32-bit counters: a high counter and a low counter. The timer pins, TINPLx and TOUTLx are connected to
the low counter. The timer pins, TINPHx and TOUTHx are connected to the high counter.
When operating in watchdog mode, the timer counts down to 0 and generates an event. It is a requirement that
software writes to the timer before the count expires, after which the count begins again. If the count ever
reaches 0, the timer event output is asserted. Reset initiated by a watchdog timer can be set by programming ‘‘Reset
Type Status Register (RSTYPE)’’ on page 135 and the type of reset initiated can set by programming ‘‘Reset
Configuration Register (RSTCFG)’’ on page 136. For more information, see the 64-bit Timer (Timer 64) for KeyStone
Devices User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66.
7.21.2 Timers Electrical Data/Timing
The tables and figures below describe the timing requirements and switching characteristics of Timer0 - Timer7.
Table 7-79
Timer Input Timing Requirements (1)
(see Figure 7-52)
No.
Min
Max
Unit
1
tw(TINPH)
Pulse duration, high
12C
ns
2
tw(TINPL)
Pulse duration, low
12C
ns
End of Table 7-79
1 C = 1/SYSCLK1 clock frequency in ns
Table 7-80
Timer Output Switching Characteristics (1)
(see Figure 7-52)
No.
Parameter
Min
Max
Unit
3
tw(TOUTH)
Pulse duration, high
12C - 3
ns
4
tw(TOUTL)
Pulse duration, low
12C - 3
ns
End of Table 7-80
1 C = 1/SYSCLK1 clock frequency in ns.
Figure 7-52
Timer Timing
1
2
TIMIx
3
4
TIMOx
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7.22 Rake Search Accelerator (RSA)
There are four Rake Search Accelerators (RSAs) on the device. CorePac1 and CorePac2 each have one set of
directly-connected RSA pairs. The RSA is an extension of the C66x CPU. The CPU performs send/receive to the
RSAs via the .L and .S functional units.
7.23 Enhanced Viterbi-Decoder Coprocessor (VCP2)
The device has four high-performance embedded Viterbi Decoder Coprocessors (VCP2) that significantly speed up
channel-decoding operations on-chip. Each VCP2, operating at CPU clock divided-by-3, can decode more than 694
7.95-Kbps adaptive multi-rate (AMR) [K = 9, R = 1/3] voice channels. The VCP2 supports constraint lengths K = 5,
6, 7, 8, and 9, rates R = 3/4, 1/2, 1/3, 1/4, and 1/5, and flexible polynomials, while generating hard decisions or soft
decisions. Communications between the VCP2 and the CPU are carried out through the EDMA3 controller. The
VCP2 supports:
• Unlimited frame sizes
• Code rates 3/4, 1/2, 1/3, 1/4, and 1/5
• Constraint lengths 5, 6, 7, 8, and 9
• Programmable encoder polynomials
• Programmable reliability and convergence lengths
• Hard and soft decoded decisions
• Tail and convergent modes
• Yamamoto logic
• Tail biting logic
• Various input and output FIFO lengths
For more information, see the Viterbi Coprocessor (VCP2) for KeyStone Devices User Guide in 2.9 ‘‘Related
Documentation from Texas Instruments’’ on page 66.
7.24 Turbo Decoder Coprocessor (TCP3d)
The C6670 has two high-performance embedded Turbo-Decoder Coprocessors (TCP3d) that significantly speed up
channel-decoding operations on-chip for WCDMA, HSPA, HSPA+, TD-SCDMA, LTE, and WiMAX. Operating at
CPU clock divided-by-2, the TCP3d is capable of processing data channels at a throughput of >100 Mbps. For more
information, see the Turbo Decoder Coprocessor 3 (TCP3d) for KeyStone Devices User Guide in 2.9 ‘‘Related
Documentation from Texas Instruments’’ on page 66.
7.25 Turbo Encoder Coprocessor (TCP3e)
The C6670 has a high-performance embedded Turbo-Encoder Coprocessor (TCP3e) that significantly speeds up
channel-encoding operations on-chip for WCDMA, HSPA, HSPA+, TD-SCDMA, LTE, and WiMAX. Operating at
CPU clock divided-by-3, the TCP3e is capable of processing data channels at a throughput of >200 Mbps. For more
information, see the Turbo Encoder Coprocessor 3 (TCP3e) for KeyStone Devices User Guide in 2.9 ‘‘Related
Documentation from Texas Instruments’’ on page 66.
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7.26 Bit Rate Coprocessor (BCP)
The BCP is a hardware accelerator for wireless infrastructure. It performs most of the uplink and downlink layer 1
bit processing for 3G and 4G wireless standards. It supports LTE, FDD WCDMA, TD-SCDMA, and WiMAX
802.16-2009 standards. It supports various downlink processing blocks like CRC attachment, turbo encoding, rate
matching, code block concatenation, scrambling, and modulation. It supports various uplink processing blocks like
soft slicer, de-scrambler, de-concatenation, rate de-matching and LLR combining. For more information, see the Bit
Coprocessor (BCP) for KeyStone Devices User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on
page 66.
7.27 Serial RapidIO (SRIO) Port
The SRIO port on the device is a high-performance, low pin-count SerDes interconnect. The use of the RapidIO
interconnect in a baseband board design can create a homogeneous interconnect environment, providing
connectivity and control among the components. RapidIO is based on the memory and device addressing concepts
of processor buses in which the transaction processing is managed completely by hardware. This enables the
RapidIO interconnect to lower the system cost by providing lower latency, reduced overhead of packet data
processing, and higher system bandwidth, all of which are key for wireless interfaces. For more information, see the
Serial RapidIO (SRIO) for KeyStone Devices User Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’
on page 66.
7.28 General-Purpose Input/Output (GPIO)
7.28.1 GPIO Device-Specific Information
On the TMS320C6670, the GPIO peripheral pins GP[15:0] are also used to latch configuration pins. For more
detailed information on device/peripheral configuration and the C6670 device pin muxing, see ‘‘Device
Configuration’’ on page 67.
7.28.2 GPIO Electrical Data/Timing
Table 7-81
GPIO Input Timing Requirements
(1)
(see Figure 7-53)
No.
Min
Max
Unit
1
tw(GPOH)
Pulse duration, GPOx high
12C
ns
2
tw(GPOL)
Pulse duration, GPOx low
12C
ns
End of Table 7-81
1 C = 1/SYSCLK1 clock frequency in ns
Table 7-82
GPIO Output Switching Characteristics
(1)
(see Figure 7-53)
No.
Parameter
Min
Max
Unit
3
tw(GPOH)
Pulse duration, GPOx high
36C - 8
ns
4
tw(GPOL)
Pulse duration, GPOx low
36C - 8
ns
End of Table 7-82
1 C = 1/SYSCLK1 clock frequency in ns
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Figure 7-53
GPIO Timing
1
2
GPIx
3
4
GPOx
7.29 Semaphore2
The device contains an enhanced Semaphore module for the management of shared resources of the CorePacs. The
Semaphore enforces atomic accesses to shared chip-level resources so that the read-modify-write sequence is not
broken. The Semaphore block has unique interrupts to each of the CorePacs to identify when that CorePac has
acquired the resource.
Semaphore resources within the module are not tied to specific hardware resources. It is a software requirement to
allocate semaphore resources to the hardware resource(s) to be arbitrated.
The Semaphore module supports 3 masters and contains 32 semaphores to be used within the system.
There are two methods of accessing a semaphore resource:
• Direct Access: A CorePac directly accesses a semaphore resource. If free, the semaphore will be granted. If not,
the semaphore is not granted.
• Indirect Access: A CorePac indirectly accesses a semaphore resource by writing it. Once it is free, an interrupt
notifies the CPU that it is available.
7.30 Antenna Interface Subsystem 2 (AIF2)
The enhanced Antenna Interface subsystem (AIF2) consists of the Antenna Interface module and two SerDes
macros. The AIF2 relies on the performance SerDes macro (high-speed serial link) along with a logic layer for the
OBSAI RP3 and CPRI protocols. The AIF is used to connect to the backplane for transmission and reception of
antenna data, as well as to connect to additional device peripherals.
The AIF2 has 11 timer synchronization events from the AIF2 Timer (AT) module. Timer synchronization events
0-7 are routed as primary events to the EDMA3CC1 and also as secondary events to the C66x CorePacs via CIC0.
Timer synchronization events 8, 9, and 10 are hard-wired to TAC, RAC_A, and RAC_B respectively.
Table 7-83
AIF2 Timer Module Timing Requirements (Part 1 of 2)
See Figure 7-52, Figure 7-55, Figure 7-56, and Figure 7-57
No.
Min
Max
Unit
RP1 Clock and Frameburst
1
tc(RP1CLKN)
Cycle time, RP1CLK(N)
1
tc(RP1CLKP)
Cycle time, RP1CLK(P)
2
tw(RP1CLKNL)
Pulse duration, RP1CLK(N) low
3
tw(RP1CLKNH)
3
tw(RP1CLKPL)
2
tw(RP1CLKPH)
Pulse duration, RP1CLK(P) high
4
tr(RP1CLKN)
Rise time - RP1CLKN 10% to 90%
4
tf(RP1CLKN)
Fall time - RP1CLKN 90% to 10%
32.55
32.55
ns
32.55
32.55
ns
0.4 * C1 (1)
0.6 * C1
ns
Pulse duration, RP1CLK(N) high
0.4 * C1
0.6 * C1
ns
Pulse duration, RP1CLK(P) low
0.4 * C1
0.6 * C1
ns
0.4 * C1
0.6 * C1
ns
350.00
ps
350.00
ps
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Table 7-83
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AIF2 Timer Module Timing Requirements (Part 2 of 2)
See Figure 7-52, Figure 7-55, Figure 7-56, and Figure 7-57
No.
Min
Max
Unit
4
tr(RP1CLKP)
Rise time - RP1CLKP 10% to 90%
350.00
ps
4
tf(RP1CLKP)
Fall time - RP1CLKP 90% to 10%
350.00
ps
5
tj(RP1CLKN)
Period jitter (peak-to-peak), RP1CLK(N)
600
ps
5
tj(RP1CLKP)
Period jitter (peak-to-peak), RP1CLK(P)
600
ps
6
tw(RP1FBN)
Bit period, RP1FB(N)
8 * C1
8 * C1
ns
6
tw(RP1FBP)
Bit period, RP1FB(P)
8 * C1
8 * C1
ns
7
tr(RP1CLKN)
Rise time - RP1FBN 10% to 90%
350.00
ps
7
tf(RP1CLKN)
Fall time - RP1FBN 90% to 10%
350.00
ps
7
tr(RP1CLKP)
Rise time - RP1FBP 10% to 90%
350.00
ps
7
tf(RP1CLKP)
Fall time - RP1FBP 90% to 10%
350.00
ps
8
tsu(RP1FBN-RP1CLKP)
Setup time - RP1FBN valid before RP1CLKP high
2
ns
8
tsu(RP1FBN-RP1CLKN)
Setup time - RP1FBN valid before RP1CLKN low
2
ns
8
tsu(RP1FBN-RP1CLKP)
Setup time - RP1FBP valid before RP1CLKP high
2
ns
8
tsu(RP1FBN-RP1CLKN)
Setup time - RP1FBP valid before RP1CLKN low
2
ns
9
th(RP1FBN-RP1CLKP)
Hold time - RP1FBN valid after RP1CLKP high
2
ns
9
th(RP1FBN-RP1CLKN)
Hold time - RP1FBN valid after RP1CLKN low
2
ns
9
th(RP1FBN-RP1CLKP)
Hold time - RP1FBP valid after RP1CLKP high
2
ns
9
th(RP1FBN-RP1CLKN)
Hold time - RP1FBP valid after RP1CLKN low
2
ns
10
tw(PHYSYNCH)
Pulse duration, PHYSYNC high
6.50
ns
11
tc(PHYSYNC)
Cycle time, PHYSYNC pulse to PHYSYNC pulse
10.00
ms
12
tw(RADSYNCH)
Pulse duration, RADSYNC high
6.50
ns
13
tc(RADSYNC)
Cycle time, RADSYNC pulse to RADSYNC pulse
1.00
ms
PHY Sync and Radio Sync Pulses
End of Table 7-83
1 C1 = tc(RP1CLKN/P)
Figure 7-54
AIF2 RP1 Frame Synchronization Clock Timing
1
2
3
RP1CLKN
RP1CLKP
4
Figure 7-55
5
AIF2 RP1 Frame Synchronization Burst Timing
6
RP1CLKN
RP1CLKP
RP1FBP/N
RP1 Frame Burst BIT 0
7
214
8
RP1 Frame Burst BIT 2
RP1 Frame Burst BIT N
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Figure 7-56
AIF2 Physical Layer Synchronization Pulse Timing
11
10
PHYSYNC
Figure 7-57
AIF2 Radio Synchronization Pulse Timing
13
12
RADSYNC
Table 7-84
AIF2 Timer Module Switching Characteristics
(see Figure 7-58)
No.
Parameter
Min
Max
Unit
External Frame Event
14
tw(EXTFRAMEEVENTH)
Pulse width, EXTFRAMEEVENT output high
4 * C1 (1)
ns
15
tw(EXTFRAMEEVENTL)
Pulse width, EXTFRAMEEVENT output low
4 * C1
ns
End of Table 7-84
1 C1 = tc(RP1CLKN/P)
Figure 7-58
AIF2 Timer External Frame Event Timing
14
15
EXT FRAME EVENT
7.31 Receive Accelerator Coprocessor (RAC)
The TMS320C6670 has two Receive Accelerator Coprocessor (RAC) subsystems. Each RAC subsystem is a receive
chip-rate accelerator based on a generic correlator coprocessor (GCCP). It supports UMTS (Universal Mobile
Telecommunications System) operations and assists in transferring data received from the antenna to the receive
core and performs receive functions that target the W-CDMA macro bits.
The RAC subsystem consists of several components:
• Two GCCP accelerators for finger despread (FD), path monitor (PM), preamble detection (PD), and stream
power estimator (SPE).
• Back-end interface (BEI) for management of the RAC configuration and the data output.
• Front-end interface (FEI) for reception of the antenna data for processing and access to all MMRs
(memory-mapped registers) and memories in the RAC components.
The RAC has a total of three ports connected to the switch fabric:
• BEI includes two master connections to the switch fabric for output data to device memory. One is 128-bit and
the other is 64-bit, both are clocked at CPU/3 rate.
• The FEI has a 64-bit slave connection to the switch fabric for input data as well as direct memory access (to
facilitate debug).
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7.32 Transmit Accelerator Coprocessor (TAC)
The Transmit Accelerator Coprocessor (TAC) subsystem is a transmit chip-rate accelerator intended to support
UMTS (Universal Mobile Telecommunications System) applications.
7.33 Fast Fourier Transform Coprocessor (FFTC)
There are three fast Fourier transform coprocessors (FFTC) intended to accelerate FFT, IFFT, DFT, and IDFT
operations. For more information, see the Fast Fourier Transform Coprocessor (FFTC) for KeyStone Devices User
Guide in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66.
7.34 Emulation Features and Capability
7.34.1 Advanced Event Triggering (AET)
The device supports advanced event triggering (AET). This capability can be used to debug complex problems as
well as understand performance characteristics of user applications. AET provides the following capabilities:
• Hardware program breakpoints: specify addresses or address ranges that can generate events such as halting
the processor or triggering the trace capture.
• Data watchpoints: specify data variable addresses, address ranges, or data values that can generate events such
as halting the processor or triggering the trace capture.
• Counters: count the occurrence of an event or cycles for performance monitoring.
• State sequencing: allows combinations of hardware program breakpoints and data watchpoints to precisely
generate events for complex sequences.
For more information on the AET, see the following documents in 2.9 ‘‘Related Documentation from Texas
Instruments’’ on page 66:
• Using Advanced Event Triggering to Find and Fix Intermittent Real-Time Bugs application report
• Using Advanced Event Triggering to Debug Real-Time Problems in High Speed Embedded Microprocessor
Systems application report
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7.34.2 Trace
The C6670 device supports trace. Trace is a debug technology that provides a detailed, historical account of
application code execution, timing, and data accesses. Trace collects, compresses, and exports debug information
for analysis. Trace works in real-time and does not impact the execution of the system.
For more information on board design guidelines for trace advanced emulation, see the Emulation and Trace
Headers Technical Reference in 2.9 ‘‘Related Documentation from Texas Instruments’’ on page 66.
7.34.2.1 Trace Electrical Data/Timing
Table 7-85
Trace Switching Characteristics
(see Figure 7-59)
No.
Parameter
1
tw(DPnH)
1
2
Min
Pulse duration, DPn/EMUn high
Max Unit
2.4
ns
tw(DPnH)90% Pulse duration, DPn/EMUn high detected at 90% Voh
1.5
ns
tw(DPnL)
Pulse duration, DPn/EMUn low
2.4
ns
2
tw(DPnL)10%
Pulse duration, DPn/EMUn low detected at 10% Voh
1.5
3
tsko(DPn)
Output skew time, time delay difference between DPn/EMUn pins configured as trace
tskp(DPn)
Pulse skew, magnitude of difference between high-to-low (tphl) and low-to-high (tplh) propagation delays.
tsldp_o(DPn)
Output slew rate DPn/EMUn
ns
-1
1
600
3.3
ns
ps
V/ns
End of Table 7-85
Figure 7-59
Trace Timing
A
TPLH
TPHL
1
2
B
3
C
7.34.3 IEEE 1149.1 JTAG
The JTAG (Joint Test Action Group) interface is used to support boundary scan and emulation of the device. The
boundary scan supported allows for an asynchronous TRST (test reset) and only the 5 baseline JTAG signals (e.g.,
no EMU[1:0]) required for boundary scan. Most interfaces on the device follow the Boundary Scan Test
Specification (IEEE1149.1), while all of the SerDes (SRIO and SGMII) support the AC-coupled net test defined in
AC-Coupled Net Test Specification (IEEE1149.6).
It is expected that all compliant devices are connected through the same JTAG interface, in daisy-chain fashion, in
accordance with the specification. The JTAG interface uses 1.8-V LVCMOS buffers, compliant with the Power
Supply Voltage and Interface Standard for Nonterminated Digital Integrated Circuit Specification (EAI/JESD8-5).
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7.34.3.1 IEEE 1149.1 JTAG Compatibility Statement
For maximum reliability, the C6670 DSP includes an internal pulldown (IPD) on the TRST pin to ensure that TRST
will always be asserted upon power up and the DSP's internal emulation logic will always be properly initialized
when this pin is not routed out. JTAG controllers from Texas Instruments actively drive TRST high. However, some
third-party JTAG controllers may not drive TRST high but expect the use of an external pullup resistor on TRST.
When using this type of JTAG controller, assert TRST to initialize the DSP after powerup and externally drive TRST
high before attempting any emulation or boundary scan operations.
7.34.3.2 JTAG Electrical Data/Timing
Table 7-86
JTAG Test Port Timing Requirements
(see Figure 7-60)
No.
Min
Cycle time, TCK
1
tc(TCK)
1a
tw(TCKH)
1b
tw(TCKL)
3
tsu(TDI-TCK)
3
tsu(TMS-TCK)
4
th(TCK-TDI)
4
th(TCK-TMS)
Max
Unit
34
ns
Pulse duration, TCK high (40% of tc)
13.6
ns
Pulse duration, TCK low (40% of tc)
13.6
ns
Input setup time, TDI valid to TCK high
3.4
ns
Input setup time, TMS valid to TCK high
3.4
ns
Input hold time, TDI valid from TCK high
17
ns
Input hold time, TMS valid from TCK high
17
ns
End of Table 7-86
Table 7-87
JTAG Test Port Switching Characteristics
(see Figure 7-60)
No.
2
Parameter
Min
Delay time, TCK low to TDO valid
td(TCKL-TDOV)
Max
Unit
13.6
ns
End of Table 7-87
Figure 7-60
JTAG Test-Port Timing
1
1b
1a
TCK
2
TDO
3
4
TDI / TMS
218
TMS320C6670 Peripheral Information and Electrical Specifications
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SPRS689D—March 2012
A Revision History
Revision D
Added PLLSELECT bit to PASSPLLCTL1 Register (Page 146)
Added bridge numbers to the Switch Fabric Connection Matrix tables (Page 87)
Updated DEVSPEED Register (Page 84)
Updated the Interrupt Topology figure (Page 156)
Updated the JTAGID register table (Page 73)
Restricted Output Divide of SECCTL to max value of divide by 2 (Page 132)
Changed TPTCn to EDMA3TCn and TPCCn to EDMA3CCn through-out the document (Page 25)
Marked PBIST_CTL as Reserved (Page 29)
Replaced all CPT with Tracer in the entire document (Page 181)
Replaced all INTC with CIC throughout the document (Page 155)
Updated main PLL lock time (Page 130)
Added PLL Reset bit (Page 146)
Added PLL Reset bit (Page 143)
Marked as Reserved (Page 170)
Marked as Reserved (Page 170)
Added the DDR3 PLL Initialization Sequence (Page 143)
Added the Main PLL and PLL Controller Initialization Sequence (Page 139)
Added the PASS PLL Initialization Sequence (Page 146)
Added po_vcon_smpserr_intr event (Page 162)
Corrected the SPI and DDR3/Hyperbridge Config end addressed (Page 28)
Revision C
Added DEVSPEED Register section (Page 84)
Removed Parameter Information section as the content was not relevant (Page 109)
Added more description to Boot Sequence section (Page 29)
Changed all footnote references from CORECLK to SYSCLK1 (Page 212)
Corrected the typo in the address of MACID2 (Page 207)
Corrected a typo — Changed DDRCLKN to DDRCLKP (Page 144)
Re-arranged the wording for description of SYSCLK1 (Page 110)
Removed example from footnote (Page 178)
Updated footnote on AIF jitter value to 4 ps RMS (Page 141)
Revision B
Changed output skew time for the trace from 500 ps to 1 ns (Page 217)
Corrected description of race condition in DDR3 (Page 194)
Removed all mentions of HHV (Page 110)
Updated description for BWADJ field (Page 138)
Added footnote description for U to UART Timing Requirements (Page 205)
Improved the INTC1 Events Input table (Page 168)
Updated the description for the tc(SPC) parameter (Page 200)
Removed the Max parameters for PHY Sync and Radio Sync Pulses (Page 214)
Added SERDES PLL Status and Config registers (Page 69)
Added table MasterID Settings (Page 179)
Marked event 101 as Reserved (Page 162)
Removed EDMA3 Parameter RAM Memory offset address table. Moved to EDMA UG. (Page 149)
Updated the GMacs and GFlops for 1.2 GHz (Page 13)
Added thermal values into the Thermal Resistance Characteristics table. (Page 221)
Added DDR3PLLCTL1 register and field description table (Page 143)
Added PASSPLLCTL1 register and field descriptions (Page 146)
Added the table of Power Supply to Peripheral I/O Mapping (Page 108)
Marked PREDIV and POSTDIV as reserved registers (Page 131)
Copyright 2012 Texas Instruments Incorporated
Revision History
219
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Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
www.ti.com
Corrected RESET Electrical timing parameters (Page 126)
Removed RESETFULLz parameter from t4b timing description (Page 112)
Revision A
Updated the complete Power-up sequencing section. RESETFULLz must always de-assert after PORz (Page 110)
Updated the description of VARIANT bit field in JTAGID register (Page 73)
Added Setup and Hold times for RP1CLK and RP1CLK signals. (Page 213)
Corrected the size of TETBs for the 4 cores from 16k to 4k (Page 26)
Added RSV0A and RSV0B pins to the Terminal list table (Page 51)
Changed DDR3PLLCTL0 to DDR3PLLCTL and PAPLLCTL0 to PASSPLLCTL (Page 70)
Cleaned up power rail terminology and changed reference parameter in t2c description from t7 to t6 (Page 112)
Added a note on Level Interrupts and EOI values for various modules. (Page 155)
Corrected the address range for I2C MMRs (Page 196)
Corrected Extended Temp max to 100C from 105C (Page 13)
Added BWADJ field to DDR3PLLCTL (Page 143)
Added BWADJ field to PASSPLLCTL (Page 146)
220
Revision History
Copyright 2012 Texas Instruments Incorporated
TMS320C6670
Multicore Fixed and Floating-Point System-on-Chip
SPRS689D—March 2012
www.ti.com
B Mechanical Data
B.1 Thermal Data
Table B-1 shows the thermal resistance characteristics for the PBGA - CYP mechanical package.
Table B-1
Thermal Resistance Characteristics (PBGA Package) [CYP]
No.
°C/W
1
RθJC
Junction-to-case
0.15
2
RθJB
Junction-to-board
3.04
End of Table B-1
B.2 Packaging Information
The following packaging information reflects the most current released data available for the designated device(s).
This data is subject to change without notice and without revision of this document.
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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TMS320C6670ACYP2
ACTIVE
FCBGA
CYP
841
44
Green (RoHS SN3%AGCU | SNAGCU
& no Sb/Br)
Level-4-245C-72HR
0 to 85
TMS320C6670CYP
@2010 TI
1.2GHZ
TMS320C6670ACYPA
ACTIVE
FCBGA
CYP
841
44
Green (RoHS SN3%AGCU | SNAGCU
& no Sb/Br)
Level-4-245C-72HR
-40 to 100
TMS320C6670CYP
@2010 TI
A1GHZ
TMS320C6670ACYPA2
ACTIVE
FCBGA
CYP
841
44
Green (RoHS SN3%AGCU | SNAGCU
& no Sb/Br)
Level-4-245C-72HR
-40 to 100
TMS320C6670CYP
@2010 TI
A1.2GHZ
TMS320C6670AXCYP
ACTIVE
FCBGA
CYP
841
44
Green (RoHS SN3%AGCU | SNAGCU
& no Sb/Br)
Level-4-245C-72HR
0 to 85
TMS320C6670XCYP
@2010 TI
TMS320C6670AXCYP2
ACTIVE
FCBGA
CYP
841
44
Green (RoHS SN3%AGCU | SNAGCU
& no Sb/Br)
Level-4-245C-72HR
0 to 85
TMS320C6670XCYP
@2010 TI
1.2GHZ
TMS320C6670AXCYPA
ACTIVE
FCBGA
CYP
841
44
Green (RoHS SN3%AGCU | SNAGCU
& no Sb/Br)
Level-4-245C-72HR
-40 to 100
TMS320C6670XCYP
@2010 TI
A1GHZ
TMS320C6670AXCYPA2
ACTIVE
FCBGA
CYP
841
44
Green (RoHS SN3%AGCU | SNAGCU
& no Sb/Br)
Level-4-245C-72HR
-40 to 100
TMS320C6670XCYP
@2010 TI
A1.2GHZ
TMS320C6670CYP
OBSOLETE
FCBGA
CYP
841
Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-245C-72HR
0 to 85
TMS320C6670CYP
@2010 TI
TMS320C6670CYP2
OBSOLETE
FCBGA
CYP
841
Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-245C-72HR
0 to 85
TMS320C6670CYP
@2010 TI
1.2GHZ
TMS320C6670CYPA
OBSOLETE
FCBGA
CYP
841
TBD
Call TI
Call TI
-40 to 100
TMS320C6670CYP
@2010 TI
A1GHZ
TMS320C6670CYPA2
ACTIVE
FCBGA
CYP
841
Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-245C-72HR
-40 to 100
TMS320C6670CYP
@2010 TI
A1.2GHZ
TMS320C6670XCPY2
ACTIVE
FCBGA
CYP
841
TBD
Call TI
Call TI
0 to 85
TMS320C6670XCYP
OBSOLETE
FCBGA
CYP
841
Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-245C-72HR
0 to 85
Addendum-Page 1
TMS320C6670XCYP
@2010 TI
Samples
PACKAGE OPTION ADDENDUM
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Orderable Device
29-Oct-2013
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TMS320C6670XCYPA
ACTIVE
FCBGA
CYP
841
Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-245C-72HR
-40 to 100
TMS320C6670XCYP
@2010 TI
A1GHZ
TMS320C6670XCYPA2
ACTIVE
FCBGA
CYP
841
Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-245C-72HR
-40 to 100
TMS320C6670XCYP
@2010 TI
A1.2GHZ
TMX320C6670AXCYP
OBSOLETE
FCBGA
CYP
841
TBD
Call TI
Call TI
0 to 85
TMX320C6670CYP
OBSOLETE
FCBGA
CYP
841
TBD
Call TI
Call TI
0 to 85
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
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(2)
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information and additional product content details.
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Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
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the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
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in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
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(5)
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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