TI TMX320C6454BZTZ

TMS320C6454
www.ti.com
SPRS311I – APRIL 2006 – REVISED MARCH 2012
TMS320C6454
Fixed-Point Digital Signal Processor
Check for Samples: TMS320C6454
1 Features
12
• High-Performance Fixed-Point DSP (C6454)
– 1.39-, 1.17-, and 1-ns Instruction Cycle Time
– 720-MHz, 850-MHz, and 1-GHz Clock Rate
– Eight 32-Bit Instructions/Cycle
– 8000 MIPS/MMACS (16-Bits)
– Commercial Temperature [0°C to 90°C]
– Extended Temperature [-40°C to 105°C]
• TMS320C64x+™ DSP Core
– Dedicated SPLOOP Instruction
– Compact Instructions (16-Bit)
– Instruction Set Enhancements
– Exception Handling
• TMS320C64x+ Megamodule L1/L2 Memory
Architecture:
– 256K-Bit (32K-Byte) L1P Program Cache
[Direct Mapped]
– 256K-Bit (32K-Byte) L1D Data Cache
[2-Way Set-Associative]
– 8M-Bit (1048K-Byte) L2 Unified Mapped
RAM/Cache [Flexible Allocation]
– 256K-Bit (32K-Byte) L2 ROM
– Time Stamp Counter
• Endianess: Little Endian, Big Endian
• 64-Bit External Memory Interface (EMIFA)
– Glueless Interface to Asynchronous
Memories (SRAM, Flash, and EEPROM) and
Synchronous Memories (SBSRAM, ZBT
SRAM)
– Supports Interface to Standard Sync Devices
and Custom Logic
(FPGA, CPLD, ASICs, etc.)
– 32M-Byte Total Addressable External
Memory Space
• DDR2 Memory Controller
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
– Interfaces to DDR2-533 SDRAM
– 32-Bit/16-Bit, 533-MHz (data rate) Bus
– 512M-Byte Total Addressable External
Memory Space
EDMA3 Controller (64 Independent Channels)
32-/16-Bit Host-Port Interface (HPI)
32-Bit 33-/66-MHz, 3.3-V Peripheral Component
Interconnect (PCI) Master/Slave Interface
Conforms to PCI Local Bus Specification (v2.3)
One Inter-Integrated Circuit (I2C) Bus
Two McBSPs
10/100/1000 Mb/s Ethernet MAC (EMAC)
– IEEE 802.3 Compliant
– Supports Multiple Media Independent
Interfaces (MII, GMII, RMII, and RGMII)
– 8 Independent Transmit (TX) and
8 Independent Receive (RX) Channels
Two 64-Bit General-Purpose Timers,
Configurable as Four 32-Bit Timers
16 General-Purpose I/O (GPIO) Pins
System PLL and PLL Controller
Secondary PLL and PLL Controller, Dedicated
to EMAC and DDR2 Memory Controller
Advanced Event Triggering (AET) Compatible
Trace-Enabled Device
IEEE-1149.1 (JTAG™) Boundary-ScanCompatible
697-Pin Ball Grid Array (BGA) Package
(CTZ, GTZ, or ZTZ Suffix), 0.8-mm Ball Pitch
0.09-μm/7-Level Cu Metal Process (CMOS)
3.3-/1.8-/1.5-V I/Os,
1.25-/1.2-V Internal
Pin-Compatible with the TMS320C6455 FixedPoint Digital Signal Processor
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of the Texas Instruments standard warranty. Production
processing does not necessarily include testing of all parameters.
Copyright © 2006–2012, Texas Instruments Incorporated
TMS320C6454
SPRS311I – APRIL 2006 – REVISED MARCH 2012
1.1
www.ti.com
CTZ/GTZ/ZTZ BGA Package (Bottom View)
Figure 1-1 shows the TMS320C6454 device 697-pin ball grid array package (bottom view).
AJ
AH
AG
AF
AE
AD
AC
AB
Y
AA
W
V
U
T
R
P
M
N
L
K
J
H
G
F
E
D
C
B
A
1
3
2
5
4
7
6
9
8
11 13 15 17 19 21 23 25 27 29
10 12 14 16 18 20 22 24 26 28
Figure 1-1. CTZ/GTZ/ZTZ BGA Package (Bottom View)
1.2
Description
The TMS320C64x+™ DSPs (including the TMS320C6454 device) are the highest-performance fixed-point
DSP generation in the TMS320C6000™ DSP platform. The C6454 device is based on the third-generation
high-performance, advanced VelociTI™ very-long-instruction-word (VLIW) architecture developed by
Texas Instruments (TI), making these DSPs an excellent choice for applications including video and
telecom infrastructure, imaging/medical, and wireless infrastructure (WI). The C64x+™ devices are
upward code-compatible from previous devices that are part of the C6000™ DSP platform.
The C6454 device offers a lower cost pin-compatible migration path for C6455 customers who don't need
the 2MB of the C6455 or the high-speed interconnect provided by Serial RapidIO. The C6454 device also
provides an excellent migration path for existing C6414/6415/6416 customers who require C6454
advanced peripherals; DDR2 at 533 MHz provides 2x performance boost over older SDRAM interface,
gigabit Ethernet provides low-cost high-performance ubiquitous packet interface, and 66-MHz PCI
(revision 2.3 complaint) provides legacy high-bandwidth interconnect.
Based on 90-nm process technology and with performance of up to 8000 million instructions per second
(MIPS) [or 8000 16-bit MMACs per cycle] at a 1-GHz clock rate, the C6454 device offers cost-effective
solutions to high-performance DSP programming challenges. The C6454 DSP possesses the operational
flexibility of high-speed controllers and the numerical capability of array processors.
The C64x+ DSP core employs eight functional units, two register files, and two data paths. Like the earlier
C6000 devices, two of these eight functional units are multipliers or .M units. Each C64x+ .M unit doubles
the multiply throughput versus the C64x core by performing four 16-bit x 16-bit multiply-accumulates
(MACs) every clock cycle. Thus, eight 16-bit x 16-bit MACs can be executed every cycle on the C64x+
core. At a 1-GHz clock rate, this means 8000 16-bit MMACs can occur every second. Moreover, each
multiplier on the C64x+ core can compute one 32-bit x 32-bit MAC or four 8-bit x 8-bit MACs every clock
cycle.
2
Features
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The C6454 DSP integrates a large amount of on-chip memory organized as a two-level memory system.
The level-1 (L1) program and data memories on the C6454 device are 32KB each. This memory can be
configured as mapped RAM, cache, or some combination of the two. When configured as cache, L1
program (L1P) is a direct mapped cache where as L1 data (L1D) is a two-way set associative cache. The
level-2 (L2) memory is shared between program and data space and is 1048KB in size. L2 memory can
also be configured as mapped RAM, cache, or some combination of the two. The C64x+ Megamodule
also has a 32-bit peripheral configuration (CFG) port, an internal DMA (IDMA) controller, a system
component with reset/boot control, interrupt/exception control, a power-down control, and a free-running
32-bit timer for time stamp.
The peripheral set includes: an inter-integrated circuit bus module (I2C); two multichannel buffered serial
ports (McBSPs); a user-configurable 16-bit or 32-bit host-port interface (HPI16/HPI32); a peripheral
component interconnect (PCI); a 16-pin general-purpose input/output port (GPIO) with programmable
interrupt/event generation modes; an 10/100/1000 Ethernet media access controller (EMAC), which
provides an efficient interface between the C6454 DSP core processor and the network; a management
data input/output (MDIO) module (also part of the EMAC) that continuously polls all 32 MDIO addresses in
order to enumerate all PHY devices in the system; a glueless external memory interface (64-bit EMIFA),
which is capable of interfacing to synchronous and asynchronous peripherals; and a 32-bit DDR2 SDRAM
interface.
The I2C ports on the C6454 device allows the DSP to easily control peripheral devices and communicate
with a host processor. In addition, the standard multichannel buffered serial port (McBSP) may be used to
communicate with serial peripheral interface (SPI) mode peripheral devices.
The C6454 DSP has a complete set of development tools which includes: a new C compiler, an assembly
optimizer to simplify programming and scheduling, and a Windows® debugger interface for visibility into
source code execution.
Features
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TMS320C6454
SPRS311I – APRIL 2006 – REVISED MARCH 2012
1.3
www.ti.com
Functional Block Diagram
Figure 1-2 shows the functional block diagram of the C6454 device.
DDR2 SDRAM
32
C6454
DDR2
Mem Ctlr
PLL2 and
PLL2
(D)
Controller
SBSRAM
64
L2 ROM
32K
(E)
Bytes
L1P SRAM/Cache Direct-Mapped
32K Bytes
ZBT SRAM
EMIFA
SRAM
L1P Memory Controller (Memory Protect/Bandwidth Mgmt)
ROM/FLASH
I/O Devices
(A)
L2
Cache
Memory
1048K
Bytes
Serial
RapidIO
HPI (32/16)
PCI66
(B)
(B)
EMAC
10/100/1000
MII
Primary
Switched
Central
Resource
Instruction Fetch
Control Registers
16-/32-bit
Instruction Dispatch
SPLOOP Buffer
Instruction
Decode
In-Circuit Emulation
M
e
g
a
m
o
d
u
l
e
.L1
Data Path A
Data Path B
A Register File
A31−A16
A15−A0
B Register File
B31−B16
B15−B0
.S1
RMII
.M1
xx .D1
xx
.D2
.M2
xx .S2
xx
.L2
L2 Memory Controller
(Memory Protect/
Bandwidth Mgmt)
McBSP1
(A)
Internal DMA
(IDMA)
McBSP0
Interrupt and Exception Controller
System
Power Control
C64x+ DSP Core
GMII
(D)
RMGII
L1D Memory Controller (Memory Protect/Bandwidth Mgmt)
MDIO
16
(B)
GPIO16
L1D SRAM/Cache
2-Way Set-Associative
32K Bytes Total
I2C
Timer1
(C)
HI
LO
Timer1
HI
LO
EDMA 3.0
PLL1 and
PLL1
Controller
(C)
Secondary
Switched Central
Resource
Device
Configuration
Logic
Boot Configuration
A. McBSPs: Framing Chips - H.100, MVIP, SCSA, T1, E1; AC97 Devices; SPI Devices; Codecs.
B. The PCI peripheral pins are muxed with some of the HPI peripheral pins. For more detailed information, see the Device Configuration section.
C. Each of the TIMER peripherals (TIMER1 and TIMER0) is configurable as a 64-bit general-purpose timer, dual 32-bit general-purpose timers,
or a watchdog timer.
D. The PLL2 controller also generates clocks for the EMAC.
E. When accessing the internal ROM of the DSP, the CPU frequency must always be less than 750 MHz.
Figure 1-2. Functional Block Diagram
4
Features
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SPRS311I – APRIL 2006 – REVISED MARCH 2012
................................................... 1
........ 2
1.2
Description ........................................... 2
1.3
Functional Block Diagram ........................... 4
Revision History .............................................. 6
2 Device Overview ........................................ 7
2.1
Device Characteristics ............................... 7
2.2
CPU (DSP Core) Description ........................ 8
2.3
Memory Map Summary ............................ 11
2.4
Boot Sequence ..................................... 13
2.5
Pin Assignments .................................... 15
2.6
Signal Groups Description ......................... 19
2.7
Terminal Functions ................................. 24
2.8
Development ........................................ 48
3 Device Configuration ................................. 52
3.1
Device Configuration at Device Reset ............. 52
3.2
Peripheral Configuration at Device Reset .......... 54
3.3
Peripheral Selection After Device Reset ........... 55
3.4
Device State Control Registers ..................... 57
3.5
Device Status Register Description ................ 67
3.6
JTAG ID (JTAGID) Register Description ........... 69
3.7
Pullup/Pulldown Resistors .......................... 70
3.8
Configuration Examples ............................ 70
4 System Interconnect .................................. 73
4.1
Internal Buses, Bridges, and Switch Fabrics ....... 73
4.2
Data Switch Fabric Connections ................... 74
4.3
Configuration Switch Fabric ........................ 76
4.4
Bus Priorities ....................................... 78
5 C64x+ Megamodule ................................... 79
5.1
Memory Architecture ............................... 79
5.2
Memory Protection ................................. 81
5.3
Bandwidth Management ............................ 82
5.4
Power-Down Control ............................... 83
1
Features
1.1
CTZ/GTZ/ZTZ BGA Package (Bottom View)
6
7
8
...............................
..............................
5.7
C64x+ Megamodule Register Descriptions ........
Device Operating Conditions .......................
5.5
Megamodule Resets
83
5.6
Megamodule Revision
84
85
93
6.1
Absolute Maximum Ratings Over Operating Case
Temperature Range (Unless Otherwise Noted) .... 93
6.2
6.3
Recommended Operating Conditions .............. 93
Electrical Characteristics Over Recommended
Ranges of Supply Voltage and Operating Case
Temperature (Unless Otherwise Noted) ........... 95
C64x+ Peripheral Information and Electrical
Specifications .......................................... 97
7.1
7.2
Parameter Information .............................. 97
Recommended Clock and Control Signal Transition
Behavior ............................................ 99
7.3
7.4
Power Supplies ..................................... 99
Enhanced Direct Memory Access (EDMA3)
Controller .......................................... 101
..........................................
...................................
7.7
PLL1 and PLL1 Controller .........................
7.8
PLL2 and PLL2 Controller .........................
7.9
DDR2 Memory Controller .........................
7.10 External Memory Interface A (EMIFA) ............
7.11 I2C Peripheral .....................................
7.12 Host-Port Interface (HPI) Peripheral ..............
7.13 Multichannel Buffered Serial Port (McBSP) .......
7.14 Ethernet MAC (EMAC) ............................
7.15 Timers .............................................
7.16 Peripheral Component Interconnect (PCI) ........
7.17 General-Purpose Input/Output (GPIO) ............
7.18 Emulation Features and Capability ...............
Mechanical Data ......................................
8.1
Thermal Data ......................................
8.2
Packaging Information ............................
7.5
Interrupts
116
7.6
Reset Controller
120
Contents
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128
143
152
154
165
170
181
195
213
215
222
224
226
226
226
5
TMS320C6454
SPRS311I – APRIL 2006 – REVISED MARCH 2012
www.ti.com
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
This data manual revision history highlights the technical changes made to the document in this revision.
Scope: Applicable updates to the C64x device family, specifically relating to the TMS320C6454 device,
have been incorporated.
C6454 DSP Revision History
SEE
Section 7.7.1.1
ADDITIONS/MODIFICATIONS/DELETIONS
Internal Clocks and Maximum Operating Frequencies:
Modified values for SYSCLK2 and SYSCLK3 in fifth paragraph
6
Contents
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SPRS311I – APRIL 2006 – REVISED MARCH 2012
2 Device Overview
2.1
Device Characteristics
Table 2-1, provides an overview of the C6454 DSP. The tables show significant features of the C6454
device, including the capacity of on-chip RAM, the peripherals, the CPU frequency, and the package type
with pin count.
Table 2-1. Characteristics of the C6454 Processor
HARDWARE FEATURES
C6454
EMIFA (64-bit bus width)
(clock source = AECLKIN or SYSCLK4)
1
DDR2 Memory Controller (32-bit bus width) [1.8 V I/O]
(clock source = CLKIN2)
1
EDMA3 (64 independent channels) [CPU/3 clock rate]
1
Peripherals
I2C
1
Not all peripherals pins
are available at the same
time (For more detail, see
Section 3, Device
Configuration).
HPI (32- or 16-bit user selectable)
1 (HPI16 or HPI32)
PCI (32-bit), [66-MHz or 33-MHz]
1 (PCI66 or PCI33)
McBSPs (internal CPU/6 or external clock source up
to 100 Mbps)
2
10/100/1000 Ethernet MAC (EMAC)
1
Management Data Input/Output (MDIO)
1
64-Bit Timers (Configurable)
(internal clock source = CPU/6 clock frequency)
2 64-bit or 4 32-bit
General-Purpose Input/Output Port (GPIO)
On-Chip Memory
1144K
Organization
32K-Byte (32KB) L1 Program Memory Controller
[SRAM/Cache]
32KB Data Memory Controller [SRAM/Cache]
1024KB L2 Unified Memory/Cache
32KB L2 ROM
C64x+ Megamodule
Revision ID
Megamodule Revision ID Register (address location:
0181 2000h)
JTAG BSDL_ID
JTAGID register (address location: 0x02A80008)
Frequency
MHz
Cycle Time
16
Size (Bytes)
720, 850, and 1000 (1 GHz)
1.25 V (A-1000/-1000)
1.2 V (-850/-720)
Core (V)
Voltage
1.5/1.8 [EMAC RGMII], and
1.8 and 3.3 V [I/O Supply Voltage]
I/O (V)
PLL1 and PLL1
Controller Options
CLKIN1 frequency multiplier
PLL2
CLKIN2 frequency multiplier
[DDR2 Memory Controller and EMAC support only]
BGA Package
24 x 24 mm
Product Status
(1)
(2)
(2)
See Section 3.6, JTAG ID (JTAGID) Register
Description
1.39 ns (C6454-720), 1.17 ns (C6454-850),
1 ns (C6454 A-1000, -1000) [1-GHz CPU] (1)
ns
Process Technology
See Section 5.6, Megamodule Revision
Bypass (x1), x15, x20, x25, x30, x32
x20
697-Pin Flip-Chip Plastic BGA (CTZ)
697-Pin Plastic BGA (GTZ)
697-Pin Flip-Chip Plastic BGA (ZTZ)
μm
0.09 μm
Product Preview (PP), Advance Information (AI),
or Production Data (PD)
PD
The extended temperature device's (A-1000) electrical characteristics and ac timings are the same as those for the corresponding
commercial temperature devices (-1000).
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Device Overview
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Table 2-1. Characteristics of the C6454 Processor (continued)
HARDWARE FEATURES
Device Part Numbers
2.2
(For more details on the C64x+™ DSP part
numbering, see Figure 2-12)
C6454
TMS320C6454CTZ7/GTZ7/ZTZ7
TMS320C6454CTZ8/GTZ8/ZTZ8
TMS320C6454CTZ/GTZ/ZTZ
CPU (DSP Core) Description
The C64x+ Central Processing Unit (CPU) consists of eight functional units, two register files, and two
data paths as shown in Figure 2-1. The two general-purpose register files (A and B) each contain 32 32bit registers for a total of 64 registers. The general-purpose registers can be used for data or can be data
address pointers. The data types supported include packed 8-bit data, packed 16-bit data, 32-bit data, 40bit data, and 64-bit data. Values larger than 32 bits, such as 40-bit-long or 64-bit-long values are stored in
register pairs, with the 32 LSBs of data placed in an even register and the remaining 8 or 32 MSBs in the
next upper register (which is always an odd-numbered register).
The eight functional units (.M1, .L1, .D1, .S1, .M2, .L2, .D2, and .S2) are each capable of executing one
instruction every clock cycle. The .M functional units perform all multiply operations. The .S and .L units
perform a general set of arithmetic, logical, and branch functions. The .D units primarily load data from
memory to the register file and store results from the register file into memory.
The C64x+ CPU extends the performance of the C64x core through enhancements and new features.
Each C64x+ .M unit can perform one of the following each clock cycle: one 32 x 32 bit multiply, two
16 x 16 bit multiplies, two 16 x 32 bit multiplies, four 8 x 8 bit multiplies, four 8 x 8 bit multiplies with add
operations, and four 16 x 16 multiplies with add/subtract capabilities (including a complex multiply). There
is also support for Galois field multiplication for 8-bit and 32-bit data. Many communications algorithms
such as FFTs and modems require complex multiplication. The complex multiply (CMPY) instruction takes
for 16-bit inputs and produces a 32-bit real and a 32-bit imaginary output. There are also complex
multiplies with rounding capability that produces one 32-bit packed output that contain 16-bit real and 16bit imaginary values. The 32 x 32 bit multiply instructions provide the extended precision necessary for
audio and other high-precision algorithms on a variety of signed and unsigned 32-bit data types.
The .L or (Arithmetic Logic Unit) now incorporates the ability to do parallel add/subtract operations on a
pair of common inputs. Versions of this instruction exist to work on 32-bit data or on pairs of 16-bit data
performing dual 16-bit add and subtracts in parallel. There are also saturated forms of these instructions.
The C64x+ core enhances the .S unit in several ways. In the C64x core, dual 16-bit MIN2 and MAX2
comparisons were only available on the .L units. On the C64x+ core they are also available on the .S unit
which increases the performance of algorithms that do searching and sorting. Finally, to increase data
packing and unpacking throughput, the .S unit allows sustained high performance for the quad 8-bit/16-bit
and dual 16-bit instructions. Unpack instructions prepare 8-bit data for parallel 16-bit operations. Pack
instructions return parallel results to output precision including saturation support.
8
Device Overview
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Other new features include:
• SPLOOP - A small instruction buffer in the CPU that aids in creation of software pipelining loops where
multiple iterations of a loop are executed in parallel. The SPLOOP buffer reduces the code size
associated with software pipelining. Furthermore, loops in the SPLOOP buffer are fully interruptible.
• Compact Instructions - The native instruction size for the C6000 devices is 32 bits. Many common
instructions such as MPY, AND, OR, ADD, and SUB can be expressed as 16 bits if the C64x+
compiler can restrict the code to use certain registers in the register file. This compression is
performed by the code generation tools.
• Instruction Set Enhancements - As noted above, there are new instructions such as 32-bit
multiplications, complex multiplications, packing, sorting, bit manipulation, and 32-bit Galois field
multiplication.
• Exception Handling - Intended to aid the programmer in isolating bugs. The C64x+ CPU is able to
detect and respond to exceptions, both from internally detected sources (such as illegal op-codes) and
from system events (such as a watchdog time expiration).
• Privilege - Defines user and supervisor modes of operation, allowing the operating system to give a
basic level of protection to sensitive resources. Local memory is divided into multiple pages, each with
read, write, and execute permissions.
• Time-Stamp Counter - Primarily targeted for Real-Time Operating System (RTOS) robustness, a freerunning time-stamp counter is implemented in the CPU which is not sensitive to system stalls.
For more details on the C64x+ CPU and its enhancements over the C64x architecture, see the following
documents:
• TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide (literature number SPRU732)
• TMS320C64x+ DSP Cache User's Guide (literature number SPRU862)
• TMS320C64x+ Megamodule Reference Guide (literature number SPRU871)
• TMS320C6455 Technical Reference (literature number SPRU965)
• TMS320C64x to TMS320C64x+ CPU Migration Guide (literature number SPRAA84)
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TMS320C6454
SPRS311I – APRIL 2006 – REVISED MARCH 2012
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www.ti.com
src1
Odd
register
file A
(A1, A3,
A5...A31)
src2
.L1
odd dst
Even
register
file A
(A0, A2,
A4...A30)
(D)
even dst
long src
ST1b
ST1a
32 MSB
32 LSB
long src
8
8
even dst
odd dst
.S1
src1
Data path A
(D)
src2
LD1b
LD1a
32 LSB
DA2
32
32
src2
32 MSB
DA1
LD2a
LD2b
Á
Á
Á
Á
Á
Á
.M1
dst2
dst1
src1
(A)
(B)
(C)
dst
.D1
src1
src2
2x
1x
Odd
register
file B
(B1, B3,
B5...B31)
src2
.D2
32 LSB
32 MSB
src1
dst
src2
.M2
Even
register
file B
(B0, B2,
B4...B30)
(C)
src1
dst2
32
(B)
dst1
32
(A)
src2
src1
.S2 odd dst
even dst
long src
Data path B
ST2a
ST2b
32 MSB
32 LSB
long src
even dst
.L2
(D)
8
8
(D)
odd dst
src2
src1
Control Register
A.
B.
C.
D.
On .M unit, dst2 is 32 MSB.
On .M unit, dst1 is 32 LSB.
On C64x CPU .M unit, src2 is 32 bits; on C64x+ CPU .M unit, src2 is 64 bits.
On .L and .S units, odd dst connects to odd register files and even dst connects to even register files.
Figure 2-1. TMS320C64x+™ CPU (DSP Core) Data Paths
10
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2.3
SPRS311I – APRIL 2006 – REVISED MARCH 2012
Memory Map Summary
Table 2-2 shows the memory map address ranges of the C6454 device. The external memory
configuration register address ranges in the C6454 device begin at the hex address location 0x7000 0000
for EMIFA and hex address location 0x7800 0000 for DDR2 Memory Controller.
Table 2-2. C6454 Memory Map Summary
MEMORY BLOCK DESCRIPTION
Reserved
Internal ROM
Reserved
BLOCK SIZE (BYTES)
HEX ADDRESS RANGE
1024K
0000 0000 - 000F FFFF
32K
0010 0000 - 0010 7FFF
7M - 32K
0010 8000 - 007F FFFF
Internal RAM (L2) [L2 SRAM]
1M
0080 0000 - 008F FFFF
Reserved
5M
0090 0000 - 00DF FFFF
L1P SRAM
Reserved
L1D SRAM
32K
00E0 0000 - 00E0 7FFF
1M - 32K
00E0 8000 - 00EF FFFF
32K
00F0 0000 - 00F0 7FFF
Reserved
1M - 32K
00F0 8000 - 00FF FFFF
Reserved
8M
0100 0000 - 017F FFFF
C64x+ Megamodule Registers
4M
0180 0000 - 01BF FFFF
Reserved
12.5M
01C0 0000 - 0287 FFFF
HPI Control Registers
256K
0288 0000 - 028B FFFF
McBSP 0 Registers
256K
028C 0000 - 028F FFFF
McBSP 1 Registers
256K
0290 0000 - 0293 FFFF
Timer 0 Registers
256K
0294 0000 - 0297 FFFF
Timer 1 Registers
128K
0298 0000 - 0299 FFFF
512
029A 0000 - 029A 01FF
256K - 512
029A 0200 - 029B FFFF
PLL1 Controller (including Reset Controller) Registers
Reserved
PLL2 Controller Registers
512
029C 0000 - 029C 01FF
Reserved
64K
029C 0200 - 029C FFFF
EDMA3 Channel Controller Registers
32K
02A0 0000 - 02A0 7FFF
Reserved
96K
02A0 8000 - 02A1 FFFF
EDMA3 Transfer Controller 0 Registers
32K
02A2 0000 - 02A2 7FFF
EDMA3 Transfer Controller 1 Registers
32K
02A2 8000 - 02A2 FFFF
EDMA3 Transfer Controller 2 Registers
32K
02A3 0000 - 02A3 7FFF
EDMA3 Transfer Controller 3 Registers
32K
02A3 8000 - 02A3 FFFF
Reserved
256K
02A4 0000 - 02A7 FFFF
Chip-Level Registers
256K
02A8 0000 - 02AB FFFF
Device State Control Registers
256K
02AC 0000 - 02AF FFFF
GPIO Registers
16K
02B0 0000 - 02B0 3FFF
I2C Data and Control Registers
256K
02B0 4000 - 02B3 FFFF
Reserved
720K
02B4 0000 - 02BF FFFF
PCI Control Registers
256K
02C0 0000 - 02C3 FFFF
Reserved
256K
02C4 0000 - 02C7 FFFF
EMAC Control
4K
02C8 0000 - 02C8 0FFF
EMAC Control Module Registers
2K
02C8 1000 - 02C8 17FF
MDIO Control Registers
2K
02C8 1800 - 02C8 1FFF
EMAC Descriptor Memory
8K
02C8 2000 - 02C8 3FFF
Reserved
496K
02C8 4000 - 02CF FFFF
Reserved
220M
02D0 0000 - 0FFF FFFF
Reserved
256M
1000 0000 - 1FFF FFFF
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Table 2-2. C6454 Memory Map Summary (continued)
MEMORY BLOCK DESCRIPTION
Reserved
McBSP 0 Data
Reserved
McBSP 1 Data
BLOCK SIZE (BYTES)
HEX ADDRESS RANGE
256M
2000 0000 - 2FFF FFFF
256
3000 0000 - 3000 00FF
64M - 256
3000 0100 - 33FF FFFF
256
3400 0000 - 3400 00FF
Reserved
64M - 256
3400 0100 - 37FF FFFF
Reserved
64M
3800 0000 - 3BFF FFFF
Reserved
2K
3C00 0000 - 3C00 07FF
Reserved
16M - 2K
3C00 0800 - 3CFF FFFF
Reserved
48M
3D00 0000 - 3FFF FFFF
PCI External Memory Space
256M
4000 0000 - 4FFF FFFF
Reserved
256M
5000 0000 - 5FFF FFFF
Reserved
256M
6000 0000 - 6FFF FFFF
EMIFA (EMIF64) Configuration Registers
128M
7000 0000 - 77FF FFFF
DDR2 Memory Controller Configuration Registers
128M
7800 0000 - 7FFF FFFF
Reserved
256M
8000 0000 - 8FFF FFFF
Reserved
256M
9000 0000 - 9FFF FFFF
8M
A000 0000 - A07F FFFF
256M - 8M
A080 0000 - AFFF FFFF
EMIFA CE2 - SBSRAM/Async (1)
Reserved
EMIFA CE3 - SBSRAM/Async (1)
Reserved
EMIFA CE4 - SBSRAM/Async (1)
Reserved
EMIFA CE5 - SBSRAM/Async (1)
Reserved
DDR2 Memory Controller CE0 - DDR2 SDRAM
(1)
12
8M
B000 0000 - B07F FFFF
256M - 8M
B080 0000 - BFFF FFFF
8M
C000 0000 - C07F FFFF
256M - 8M
C080 0000 - CFFF FFFF
8M
D000 0000 - D07F FFFF
256M - 8M
D080 0000 - DFFF FFFF
512M
E000 0000 - FFFF FFFF
The EMIFA CE0 and CE1 are not functionally supported on the C6454 device and, therefore, are not pinned out.
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2.4
SPRS311I – APRIL 2006 – REVISED MARCH 2012
Boot Sequence
The boot sequence is a process by which the DSP's internal memory is loaded with program and data
sections and the DSP's internal registers are programmed with predetermined values. The boot sequence
is started automatically after each power-on reset, warm reset, and system reset. For more details on the
initiators of these resets, see Section 7.6, Reset Controller.
There are several methods by which the memory and register initialization can take place. Each of these
methods is referred to as a boot mode. The boot mode to be used is selected at reset through the
BOOTMODE[3:0] pins.
Each boot mode can be classified as a hardware boot mode or as a software boot mode. Software boot
modes require the use of the on-chip bootloader. The bootloader is DSP code that transfers application
code from an external source into internal or external program memory after the DSP is taken out of reset.
The bootloader is permanently stored in the internal ROM of the DSP starting at byte address 0010
0000h. Hardware boot modes are carried out by the boot configuration logic. The boot configuration logic
is actual hardware that does not require the execution of DSP code. Section 2.4.1, Boot Modes
Supported, describes each boot mode in more detail.
When accessing the internal ROM of the DSP, the CPU frequency must always be less than 750 MHz.
Therefore, when using a software boot mode, care must be taken such that the CPU frequency does not
exceed 750 MHz at any point during the boot sequence. After the boot sequence has completed, the CPU
frequency can be programmed to the frequency required by the application.
2.4.1
Boot Modes Supported
The C6454 device has five boot modes:
• No boot (BOOTMODE[3:0] = 0000b)
With no boot, the CPU executes directly from the internal L2 SRAM located at address 0x80 0000.
Note: device operations is undefined if invalid code is located at address 0x80 0000. This boot mode is
a hardware boot mode.
• Host boot (BOOTMODE[3:0] = 0001b and BOOTMODE[3:0] = 0111b)
If host boot is selected, after reset, the CPU is internally "stalled" while the remainder of the device is
released. During this period, an external host can initialize the CPU's memory space as necessary
through Host Port Interface (HPI) or the Peripheral Component Interconnect (PCI) interface. Internal
configuration registers, such as those that control the EMIF can also be initialized by the host with two
exceptions: Device State Control registers (Section 3.4), PLL1 and PLL2 Controller registers
(Section 7.7 and Section 7.8) cannot be accessed through any host interface, including HPI and PCI.
Once the host is finished with all necessary initialization, it must generate a DSP interrupt (DSPINT) to
complete the boot process. This transition causes boot configuration logic to bring the CPU out of the
"stalled" state. The CPU then begins execution from the internal L2 SRAM located at 0x80 0000. Note
that the DSP interrupt is registered in bit 0 (channel 0) of the EDMA Event Register (ER). This event
must be cleared by software before triggering transfers on DMA channel 0.
All memory, with the exceptions previously described, may be written to and read by the host. This
allows for the host to verify what it sends to the DSP if required. After the CPU is out of the "stalled"
state, the CPU needs to clear the DSPINT, otherwise, no more DSPINTs can be received.
As previously mentioned, for the C6454 device, the Host Port Interface (HPI) and the Peripheral
Component Interconnect (PCI) interface can be used for host boot. To use the HPI for host boot, the
PCI_EN pin (Y29) must be low [default] (enabling the HPI peripheral) and BOOTMODE[3:0] must be
set to 0001b at device reset. Conversely, to use the PCI interface for host boot, the PCI_EN pin (Y29)
must be high (enabling the PCI peripheral) and BOOTMODE[3:0] must be set to 0111b at device reset.
For the HPI host boot, the DSP interrupt can be generated through the use of the DSPINT bit in the
HPI Control (HPIC) register.
For the HPI host boot, the CPU is actually held in reset until a DSP interrupt is generated by the host.
The DSP interrupt can be generated through the use of the DSPINT bit in the HPI Control (HPIC)
register. Since the CPU is held in reset during HPI host boot, it will not respond to emulation software
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•
•
•
2.4.2
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such as Code Composer Studio.
For the PCI host boot, the CPU is out of reset, but it executes an IDLE instruction until a DSP interrupt
is generated by the host. The host can generate a DSP interrupt through the PCI peripheral by setting
the DSPINT bit in the Back-End Application Interrupt Enable Set Register (PCIBINTSET) and the
Status Set Register (PCISTATSET).
Note that the HPI host boot is a hardware boot mode while the PCI host boot is a software boot mode.
If PCI boot is selected, the on-chip bootloader configures the PLL1 Controller such that CLKIN1 is
multiplied by 15. More specifically, PLLM is set to 0Eh (x15) and RATIO is set to 0 (÷1) in the PLL1
Multiplier Control Register (PLLM) and PLL1 Pre-Divider Register (PREDIV), respectively. The CLKIN1
frequency must not be greater than 50 MHz so that the maximum speed of the internal ROM, 750
MHz, is not violated. The CFGGP[2:0] pins must be set to 000b during reset for proper operation of the
PCI boot mode.
As mentioned previously, a DSP interrupt must be generated at the end of the host boot process to
begin execution of the loaded application. Since the DSP interrupt generated by the HPI and PCI is
mapped to the EDMA event DSP_EVT (DMA channel 0), it will get recorded in bit 0 of the EDMA
Event Register (ER). This event must be cleared by software before triggering transfers on DMA
channel 0.
EMIFA 8-bit ROM boot (BOOTMODE[3:0] = 0100b)
After reset, the device will begin executing software out of an Asynchronous 8-bit ROM located in
EMIFA CE3 space using the default settings in the EMIFA registers. This boot mode is a hardware
boot mode.
Master I2C boot (BOOTMODE[3:0] = 0101b)
After reset, the DSP can act as a master to the I2C bus and copy data from an I2C EEPROM or a
device acting as an I2C slave to the DSP using a predefined boot table format. The destination
address and length are contained within the boot table. This boot mode is a software boot mode.
Slave I2C boot (BOOTMODE[3:0] = 0110b)
A Slave I2C boot is also implemented, which programs the DSP as an I2C Slave and simply waits for a
Master to send data using a standard boot table format.
Using the Slave I2C boot, a single DSP or a device acting as an I2C Master can simultaneously boot
multiple slave DSPs connected to the same I2C bus. Note that the Master DSP may require booting
via an I2C EEPROM before acting as a Master and booting other DSPs.
The Slave I2C boot is a software boot mode.
2nd-Level Bootloaders
Any of the boot modes can be used to download a 2nd-level bootloader. A 2nd-level bootloader allows for
any level of customization to current boot methods as well as definition of a completely customized boot.
TI offers a few 2nd-level bootloaders, such as an EMAC bootloader, which can be loaded using the
Master I2C boot.
14
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2.5
SPRS311I – APRIL 2006 – REVISED MARCH 2012
Pin Assignments
2.5.1
Pin Map
Figure 2-2 through Figure 2-5 show the C6454 device pin assigments in four quadrants (A, B, C, and D).
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
AJ
DVDD33
GP[5]
FSX0
CLKS
DR0
TINPL1
DVDD33
VSS
TCK
TMS
RSV26
RSV40
SYSCLK4/
GP[1]
VSS
DVDD33
AJ
AH
VSS
GP[4]
FSR0
NMI
DR1/
GP[8]
TINPL0
TRST
TDO
TDI
EMU17
RSV27
EMU16
EMU9
DVDD33
VSS
AH
AG
CLKR0
GP[7]
GP[6]
FSX1/
GP[11]
DX1/
GP[9]
CLKX0
TOUTL1
EMU6
EMU2
RSV38
RSV39
DVDD33
VSS
RESET
RSV46
AG
AF
DVDD33
VSS
HD11/
AD11
CLKR1/
GP[0]
CLKX1/
GP[3]
DX0
EMU0
TOUTL0
EMU4
EMU3
EMU8
EMU7
EMU14
POR
RSV45
AF
AE
HD22/
AD22
HD0/
AD0
HD10/
AD10
VSS
FSR1/
GP[10]
DVDD33
VSS
DVDD33
EMU15
EMU12
EMU1
EMU5
EMU18
RESETSTAT
DVDD33
AE
AD
HD21/
AD21
HD25/
AD25
HD5/
AD5
HD3/
AD3
DVDD33
VSS
DVDD33
EMU13
RSV37
EMU10
RSV36
EMU11
VSS
DVDD33
VSS
AD
AC
HD19/
AD19
HD13/
AD13
HD23/
AD23
HD29/
AD29
HD27/
AD27
DVDD33
VSS
VSS
DVDD33
VSS
DVDD33
VSS
DVDD33
VSS
RSV64
AC
AB
HD17/
AD17
HD15/
AD15
HD9/
AD9
HD7/
AD7
HD1/
AD1
VSS
DVDD33
AB
AA
DVDD33
VSS
HD31/
AD31
HD28/
AD28
HD30/
AD30
DVDD33
VSS
AA
Y
HD26/
AD26
HD18/
AD18
HD16/
AD16
HD6/
AD6
HD4/
AD4
VSS
DVDD33
W
HD24/
AD24
HD20/
AD20
RSV03
HD14/
AD14
HD8/
AD8
HD2/
AD2
VSS
VSS
CVDD
VSS
CVDD
VSS
W
V
DVDD33
VSS
HHWIL/
PCLK
HD12/
AD12
RSV02
VSS
DVDD33
CVDD
VSS
CVDD
VSS
RSV68
V
U
HDS2/
PCBE1
HDS1/
PSERR
HINT/
PFRAME
HCNTL1/
PDEVSEL
HCNTL0/
PSTOP
HCS/
PPERR
VSS
VSS
CVDD
VSS
CVDD
VSS
U
T
RSV15
RSV16
HAS/
PPAR
HRDY/
PIRDY
HR/W/
PCBE2
VSS
DVDD33
CVDD
VSS
CVDD
VSS
CVDD
T
R
DVDD33
VSS
PIDSEL
PGNT/
GP[12]
PRST/
GP[13]
DVDD33
VSS
VSS
CVDD
VSS
CVDD
VSS
R
1
2
3
4
5
6
7
11
12
13
14
Y
8
9
10
15
Figure 2-2. C6454 Pin Map (Bottom View) [Quadrant A]
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16
17
18
19
20
21
22
23
24
25
26
27
28
29
AJ
VSS
RSV77
RSV56
RSV60
VSS
RSV61
RSV57
RSV78
VSS
DVDD33
AED5
AED6
AED20
DVDD33
AJ
AH
DVDD33
RSV59
RSV55
VSS
RSV76
VSS
RSV58
RSV62
DVDD33
VSS
AED14
AED2
AED18
VSS
AH
AG
VSS
DVDD33
RSV48
RSV52
VSS
RSV53
RSV49
DVDD33
VSS
AED3
SCL
AED9
AED16
AED30
AG
AF
DVDD33
RSV47
RSV51
VSS
RSV75
VSS
RSV54
RSV50
DVDD33
AED1
SDA
AED10
AED15
AED19
AF
AE
VSS
RSV72
VSS
RSV73
VSS
RSV17
VSS
RSV74
VSS
AED7
AED12
AED4
AED13
AED17
AE
AD
RSV66
VSS
DVDD33
VSS
RSV63
VSS
DVDD33
VSS
DVDD33
AED0
AED11
AED8
AED22
AED21
AD
AC
VSS
RSV65
VSS
DVDD33
VSS
DVDD33
VSS
DVDD33
VSS
AED24
AED26
AED28
VSS
DVDD33
AC
AB
VSS
DVDD33
AAWE/
ASWE
AED23
AED25
AED27
AED29
AB
AA
DVDD33
VSS
ABE1
ABE0
AED31
ABE2
ABE3
AA
VSS
DVDD33
RSV43
RSV42
RSV44
AAOE/
ASOE
PCI_EN
Y
ABE7
W
Y
W
RSV70
VSS
RSV71
VSS
DVDD33
VSS
AR/W
ACE3
ACE2
RSV41
V
VSS
RSV69
VSS
CVDD
VSS
DVDD33
ABA1/
EMIFA_EN
ABA0/
DDR2_EN
ACE5
ACE4
U
RSV67
VSS
CVDD
VSS
DVDD33
VSS
AEA0/
CFGGP0
AEA1/
CFGGP1
AEA6/
PCI66
AEA5/
MCBSP1
_EN
RSV20
U
T
VSS
CVDD
VSS
CVDD
VSS
DVDD33
AEA11
AEA2/
CFGGP2
AEA3
AEA4/
SYSCLKOUT
_EN
PLLV1
T
R
CVDD
VSS
CVDD
VSS
DVDD33
VSS
AEA14/
HPI_
WIDTH
ASADS/
ASRE
AEA13/
LENDIAN
AEA12
AHOLD
R
16
17
18
19
23
24
25
26
27
28
29
20
21
22
AECLKOUT V
Figure 2-3. C6454 Pin Map (Bottom View) [Quadrant B]
16
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16
17
18
19
P
VSS
CVDD
VSS
N
CVDD
VSS
M
VSS
L
CVDD
20
21
22
23
24
25
CVDD
RSV30
RSV31
AEA8/
PCI_EEAI
CVDD
VSS
VSS
DVDD33
CVDD
VSS
CVDD
DVDD33
VSS
CVDD
VSS
26
27
28
29
AEA16/
BOOT
MODE0
AEA15/
AECLKIN
_SEL
DVDD33
VSS
P
AEA19/
BOOT
MODE3
AHOLDA
AEA7
CLKIN1
AECLKIN
N
VSS
AEA10/
MACSEL1
VSS
AEA9/
MACSEL0
DVDD33
VSS
M
VSS
DVDD33
AEA17/
BOOT
MODE1
AEA18/
BOOT
MODE2
ABUSREQ
ABE4
ABE5
L
K
DVDD33
VSS
AED33
ABE6
AED32
AED34
AARDY
K
J
VSS
DVDD33
AED38
AED46
AED44
AED42
AED40
J
H
DVDD33
VSS
AED47
AED45
AED43
DVDD33
VSS
H
G
DVDD18
VSS
DVDD18
VSS
DVDD18
VSS
DVDD18
VSS
DVDD18
AED55
AED54
AED50
AED48
AED35
G
F
VSS
DVDD18
RSV19
DVDD18
VSS
DSDDQ
GATE3
VSS
DVDD18
VSS
AED63
AED36
AED56
AED52
AED37
F
E
DEODT0
DEA4
AVDLL2
VSS
DSDDQS2
DSDDQ
GATE2
DVDD18
DSDDQS3
DVDD18
VSS
DVDD33
AED59
DVDD33
VSS
E
D
DEA8
DEA5
DEA0
DED19
DSDDQS2
DED23
DED27
DSDDQS3
RSV11
RSV32
RSV09
AED57
AED58
AED39
D
C
DEA9
DEA6
DEA1
DED18
DSDDQM2
DED22
DED26
DSDDQM3
RSV12
RSV33
RSV23
AED61
AED60
AED41
C
B
DEA10
DEA7
DEA2
DED16
DVDD18
DED21
DED25
DVDD18
DED29
DED31
RSV22
AED49
AED51
VSS
B
A
DEA11
DEODT1
DEA3
DED17
VSS
DED20
DED24
VSS
DED28
DED30
DVDD18MON
AED62
AED53
DVDD33
A
16
17
18
19
20
21
22
23
24
25
26
27
28
29
Figure 2-4. C6454 Pin Map (Bottom View) [Quadrant C]
Device Overview
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1
2
3
4
5
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6
7
8
9
10
11
12
13
14
15
P
PCBE0/
GP[2]
PREQ/
GP[15]
PINTA/
GP[14]
PTRDY
PCBE3
DVDD33
VSS
RSV05
VSS
CVDD
VSS
CVDD
P
N
CVDDMON
VSS
MDIO
MTCLK/
RMREFCLK
MTXD7
RSV29
RSV28
RSV04
CVDD
VSS
CVDD
VSS
N
M
MTXD0/
RMTXD0
MRXD7
MTXD6
MTXD2
MDCLK
VSS
DVDD33
CVDD
VSS
CVDD
VSS
CVDD
M
L
MRXD4
MRXD5
MTXD4
MTXD1/
RMTXD1
MTXD5
DVDD33MON
VSS
VSS
CVDD
VSS
CVDD
VSS
L
K
DVDD33
VSS
MCOL
MTXD3
GMTCLK
VSS
DVDD33
K
J
MRXD2
MRXD0/
RMRXD0
MRXD3
MCRS/
RMCRSDV
MTXEN/
RMTXEN
DVDD33
VSS
J
H
MRCLK
MRXD6
MRXD1/
RMRXD1
MRXER/
RMRXER
MRXDV
VSS
DVDD15
H
G
VSS
DVDD33
CLKIN2
RSV07
VSS
DVDD15
VSS
DVDD18
VSS
DVDD18
VSS
DVDD18
VSS
DVDD18
VSS
G
F
RSV14
RSV13
DVDD15MON
VSS
DVDD15
VSS
DVDD18
VSS
DED11
VSS
DVDD18
VSS
DVDD18
VSS
DVDD18
F
E
RGRXD0
RGRXD1
RGRXC
RGRXD2
VSS
RSV34
VSS
DSDDQS1
DED10
DVDD18
DSDDQS0
DVDD18
RSV18
DCE0
DBA2
E
D
VSS
DVDD15
RGTXCTL
RGTXC
DVDD15
RSV35
DED14
DSDDQS1
DED9
DED7
DSDDQS0
DED3
DSDCAS
DSDCKE
DBA1
D
C
RGRXD3
RGRXCTL
RGTXD2
RGREFCLK
VSS
RSV25
DED15
DSDDQM1
DED8
DED6
DSDDQM0
DED2
DSDRAS
VREFSSTL
DBA0
C
B
VSS
VREFHSTL
RGTXD1
RGMDCLK
DVDD15
RSV24
DED12
DVDD18
DSDDQ
GATE1
DED5
DVDD18
DED1
DSDWE
DDR2
CLKOUT
DEA13
B
A
DVDD15
RGTXD3
RGTXD0
RGMDIO
PLLV2
RSV21
DED13
VSS
DSDDQ
GATE0
DED4
VSS
DED0
AVDLL1
DDR2
CLKOUT
DEA12
A
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Figure 2-5. C6454 Pin Map (Bottom View) [Quadrant D]
18
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2.6
SPRS311I – APRIL 2006 – REVISED MARCH 2012
Signal Groups Description
CLKIN1
(A)
SYSCLK4/GP[1]
Clock/PLL1
and
PLL Controller
PLLV1
Reset and
Interrupts
RESETSTAT
RESET
NMI
POR
CLKIN2
Clock/PLL2
PLLV2
RSV02
RSV03
RSV04
RSV05
RSV06
RSV07
TMS
TDO
TDI
TCK
TRST
Reserved
IEEE Standard
1149.1
(JTAG)
Emulation
EMU0
EMU1
•
•
•
EMU14
EMU15
EMU16
EMU17
EMU18
•
•
•
RSV76
RSV77
RSV78
Peripheral
Enable/Disable
PCI_EN
Control/Status
A.
This pin functions as GP[1] by default. For more details, see Section 3.
Figure 2-6. CPU and Peripheral Signals
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TINPL1
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Timer 1
Timer 0
TOUTL1
TOUTL0
TINPL0
Timers (64-Bit)
PREQ/GP[15](C)
PINTA/GP[14](C)
PRST/GP[13](C)
PGNT/GP[12](C)
FSX1/GP[11](B)
FSR1/GP[10](B)
DX1/GP[9](B)
DR1/GP[8](B)
GP[7]
GP[6]
GP[5]
GP[4]
CLKX1/GP[3](B)
PCBE0/GP[2](C)
SYSCLK4/GP[1](A)
CLKR1/GP[0](B)
GPIO
General-Purpose Input/Output 0 (GPIO) Port
A.
B.
This pin functions as GP[1] by default. For more details, see the Device Configuration section of this document.
These McBSP1 peripheral pins are muxed with the GPIO peripheral pins and by default these signals function as GPIO peripheral pins. For
more details, see the Device Configuration section of this document.
C. These PCI peripheral pins are muxed with the GPIO peripheral pins and by default these signals function as GPIO peripheral pins. For more
details, see the Device Configuration section of this document.
Figure 2-7. Timers/GPIO Peripheral Signals
20
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64
Data
AED[63:0]
AECLKIN
ACE5(A)
ACE4(A)
ACE3(A)
AECLKOUT
Memory Map
Space Select
ACE2(A)
20
Address
AEA[19:0]
ABE7
ABE6
ABE5
ABE4
ABE3
ABE2
ABE1
ABE0
External
Memory I/F
Control
ASWE/AAWE
AARDY
AR/W
AAOE/ASOE
ASADS/ASRE
Byte Enables
Bus
Arbitration
AHOLD
AHOLDA
ABUSREQ
Bank Address
ABA[1:0]
EMIFA (64-bit Data Bus)
32
Memory Map
Space Select
DCE0
14
Address
DEA[13:0]
DSDDQM3
DSDDQM2
DSDDQM1
DSDDQM0
DDR2CLKOUT
DDR2CLKOUT
DSDCKE
DSDCAS
Data
DED[31:0]
External
Memory I/F
Control
DSDRAS
DSDWE
DSDDQS[3:0]
DSDDQS[3:0]
DSDDQGATE[0]
DSDDQGATE[1]
DSDDQGATE[2]
DSDDQGATE[3]
DEODT[1:0]
Byte Enables
Bank Address
DBA[2:0]
DDR2 Memoty Controller (32-bit Data Bus)
Figure 2-8. EMIFA and DDR2 Memory Controller Peripheral Signals
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HD[15:0]/AD[15:0]
HD[31:16]/AD[31:16]
HCNTL0/PSTOP
HCNTL1/PDEVSEL
32
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HPI(A)
(Host-Port Interface)
Data
HAS/PPAR
HR/W/PCBE2
HCS/PPERR
HDS1/PSERR
HDS2/PCBE1
HRDY/PIRDY
HINT/PFRAME
Register Select
Control
HHWIL/PCLK
(HPI16 ONLY)
Half-Word
Select
McBSP1
McBSP0
CLKX1/GP[3]
FSX1/GP[11]
DX1/GP[9]
Transmit
Transmit
CLKR1/GP[0]
FSR1/GP[10]
DR1/GP[8]
Receive
Receive
CLKR0
FSR0
DR0
Clock
Clock
CLKS
(SHARED)
CLKX0
FSX0
DX0
McBSPs
(Multichannel Buffered Serial Ports)(B)
SCL
I2C
A.
B.
SDA
These HPI pins are muxed with the PCI peripheral. By default, these pins function as HPI. When the HPI is enabled, the number of HPI pins
used depends on the HPI configuration (HPI16 or HPI32). For more details on these muxed pins, see the Device Configuration section of this
document.
These McBSP1 peripheral pins are muxed with the GPIO peripheral pins and by default these signals function as GPIO peripheral pins. For
more details, see the Device Configuration section of this document.
Figure 2-9. HPI/McBSP/I2C Peripheral Signals
22
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Ethernet MAC
(EMAC)
Transmit
MII
MTXD[7:2],
MTXD[1:0]/RMTXD[1:0]
RMII
GMII
RGMII(A)
RGTXD[3:0]
MDIO
Input/Output
MII
Receive
RMII
MII
MRXD[7:2],
MRXD[1:0]/RMRXD[1:0]
RMII
MDIO
GMII
RGMII(A)
RGMDIO
GMII
RGMII(A)
RGRXD[3:0]
Error Detect
and Control
MII
MRXER/RMRXER,
MRXDV,
MCRS/RMCRSDV,
MCOL,
MTXEN/RMTXEN
RMII
Clock
MII
RMII
MDCLK
GMII
RGMII(A)
RGMDCLK
GMII
RGMII(A)
RGTXCTL, RGRXCTL
Clocks
MII
MTCLK/RMREFCLK,
MRCLK,
GMTCLK
RMII
GMII
RGTXC,
RGRXC,
RGREFCLK
RGMII(A)
Ethernet MAC (EMAC) and MDIO
A.
RGMII signals are mutually exclusive to all other EMAC signals.
Figure 2-10. EMAC/MDIO [MII, GMII, RMII, and RGMII] Peripheral Signals
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32
HD[15:0]/AD[15:0]
HD[31:16]/AD[31:16]
Data/Address
PCBE3
HR/W/PCBE2
HDS2/PCBE1
PCBE0/GP[2]
Command
Byte Enable
PGNT/GP[12]
Clock
HHWIL/PCLK
PIDSEL
HCNTL1/PDEVSEL
HINT/PFRAME
PINTA/GP[14]
HAS/PPAR
PRST/GP[13]
HRDY/PIRDY
HCNTL0/PSTOP
PTRDY
Control
Arbitration
HDS1/PSERR
HCS/PPERR
Error
PREQ/GP[15]
PCI Interface(A)
A.
These PCI pins are muxed with the HPI or GPIO peripherals. By default, these signals function as HPI or GPIO or EMAC. For more
details on these muxed pins, see the Device Configuration section of this document.
Figure 2-11. PCI Peripheral Signals
2.7
Terminal Functions
The terminal functions table (Table 2-3) identifies the external signal names, the associated pin (ball)
numbers along with the mechanical package designator, the pin type (I, O/Z, or I/O/Z), whether the pin
has any internal pullup/pulldown resistors, and a functional pin description. For more detailed information
on device configuration, peripheral selection, multiplexed/shared pins, and pullup/pulldown resistors, see
Section 3, Device Configuration.
Table 2-3. Terminal Functions
SIGNAL
NAME
NO.
TYPE (1)
IPD/IPU (2)
DESCRIPTION
CLOCK/PLL CONFIGURATIONS
CLKIN1
N28
I
IPD
Clock Input for PLL1.
CLKIN2
G3
I
IPD
Clock Input for PLL2.
PLLV1
T29
A
1.8-V I/O supply voltage for PLL1
PLLV2
A5
A
1.8-V I/O supply voltage for PLL2
SYSCLK4/GP[1] (3)
AJ13
I/O/Z
IPD
TMS
AJ10
I
IPU
JTAG test-port mode select
TDO
AH8
O/Z
IPU
JTAG test-port data out
TDI
AH9
I
IPU
JTAG test-port data in
TCK
AJ9
I
IPU
JTAG test-port clock
TRST
AH7
I
IPD
JTAG test-port reset. For IEEE 1149.1 JTAG compatibility, see
Section 7.18.3.1.1.
EMU0 (4)
AF7
I/O/Z
IPU
Emulation pin 0
SYSCLK4 is the clock output at 1/8 of the device speed (O/Z) or this pin can be
programmed as the GP1 pin (I/O/Z) [default].
JTAG EMULATION
(1)
(2)
(3)
(4)
24
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal
IPD = Internal pulldown, IPU = Internal pullup. For most systems, a 1-kΩ resistor can be used to oppose the IPU/IPD. For more detailed
information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see Section 3.7,
Pullup/Pulldown Resistors.
These pins are multiplexed pins. For more details, see Section 3, Device Configuration.
The C6454 DSP does not require external pulldown resistors on the EMU0 and EMU1 pins for normal or boundary-scan operation.
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Table 2-3. Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
IPD/IPU (2)
DESCRIPTION
EMU1 (4)
AE11
I/O/Z
IPU
Emulation pin 1
EMU2
AG9
I/O/Z
IPU
Emulation pin 2
EMU3
AF10
I/O/Z
IPU
Emulation pin 3
EMU4
AF9
I/O/Z
IPU
Emulation pin 4
EMU5
AE12
I/O/Z
IPU
Emulation pin 5
EMU6
AG8
I/O/Z
IPU
Emulation pin 6
EMU7
AF12
I/O/Z
IPU
Emulation pin 7
EMU8
AF11
I/O/Z
IPU
Emulation pin 8
EMU9
AH13
I/O/Z
IPU
Emulation pin 9
EMU10
AD10
I/O/Z
IPU
Emulation pin 10
EMU11
AD12
I/O/Z
IPU
Emulation pin 11
EMU12
AE10
I/O/Z
IPU
Emulation pin 12
EMU13
AD8
I/O/Z
IPU
Emulation pin 13
EMU14
AF13
I/O/Z
IPU
Emulation pin 14
EMU15
AE9
I/O/Z
IPU
Emulation pin 15
EMU16
AH12
I/O/Z
IPU
Emulation pin 16
EMU17
AH10
I/O/Z
IPU
Emulation pin 17
EMU18
AE13
I/O/Z
IPU
Emulation pin 18
RESETS, INTERRUPTS, AND GENERAL-PURPOSE INPUT/OUTPUTS
RESET
AG14
I
NMI
AH4
I
RESETSTAT
AE14
O
POR
AF14
I
GP[7]
AG2
I/O/Z
IPD
GP[6]
AG3
I/O/Z
IPD
GP[5]
AJ2
I/O/Z
IPD
GP[4]
AH2
I/O/Z
IPD
P2
I/O/Z
P3
I/O/Z
R5
I/O/Z
PGNT/ GP[12]
R4
I/O/Z
FSX1/GP[11]
AG4
I/O/Z
IPD
FSR1/GP[10]
AE5
I/O/Z
IPD
DX1/GP[9]
AG5
I/O/Z
IPD
DR1/GP[8]
AH5
I/O/Z
IPD
CLKX1/GP[3]
AF5
I/O/Z
IPD
PCBE0/ GP[2]
P1
I/O/Z
PREQ/ GP[15]
PINTA
(5)
/ GP[14]
PRST/ GP[13]
Device reset
IPD
Nonmaskable interrupt, edge-driven (rising edge)
Any noise on the NMI pin may trigger an NMI interrupt; therefore, if the NMI pin
is not used, it is recommended that the NMI pin be grounded versus relying on
the IPD.
Reset Status pin. The RESETSTAT pin indicates when the device is in reset
Power on reset.
General-purpose input/output (GPIO) pins (I/O/Z).
PCI peripheral pins or General-purpose input/output (GPIO) [15:12, 2] pins
(I/O/Z) [default]
SYSCLK4/GP[1]
AJ13
O/Z
IPD
CLKR1/GP[0]
AF4
I/O/Z
IPD
PCI
PCI
PCI
PCI
PCI
bus request (O/Z) or GP[15] (I/O/Z) [default]
interrupt A (O/Z) or GP[14] (I/O/Z) [default]
reset (I) or GP[13] (I/O/Z) [default]
bus grant (I) or GP[12] (I/O/Z) [default]
command/byte enable 0 (I/O/Z) or GP[2] (I/O/Z) [default]
McBSP1 transmit clock (I/O/Z) or GP[3] (I/O/Z) [default]
McBSP1 receive clock (I/O/Z) or GP[0] (I/O/Z) [default]
GP[1] pin (I/O/Z). SYSCLK4 is the clock output at 1/8 of the device speed (O/Z)
or this pin can be programmed as a GP[1] pin (I/O/Z) [default].
HOST-PORT INTERFACE (HPI) or PERIPHERAL COMPONENT INTERCONNECT (PCI)
PCI_EN
(5)
Y29
I
IPD
PCI enable pin. This pin controls the selection (enable/disable) of the HPI and
GP[15:8], or PCI peripherals. This pin works in conjunction with the
MCBSP1_EN (AEA5 pin) to enable/disable other peripherals (for more details,
see Section 3, Device Configuration).
These pins function as open-drain outputs when configured as PCI pins.
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Table 2-3. Terminal Functions (continued)
SIGNAL
TYPE (1)
IPD/IPU (2)
DESCRIPTION
NAME
NO.
HINT/PFRAME
U3
I/O/Z
Host interrupt from DSP to host (O/Z) or PCI frame (I/O/Z)
HCNTL1/PDEVSEL
U4
I/O/Z
Host control - selects between control, address, or data registers (I) [default] or
PCI device select (I/O/Z)
HCNTL0/PSTOP
U5
I/O/Z
Host control - selects between control, address, or data registers (I) [default] or
PCI stop (I/O/Z)
HHWIL/PCLK
V3
I/O/Z
Host half-word select - first or second half-word (not necessarily high or low
order)
[For HPI16 bus width selection only] (I) [default] or PCI clock (I)
HR/W/PCBE2
T5
I/O/Z
Host read or write select (I) [default] or PCI command/byte enable 2 (I/O/Z)
HAS/PPAR
T3
I/O/Z
Host address strobe (I) [default] or PCI parity (I/O/Z)
U6
I/O/Z
Host chip select (I) [default] or PCI parity error (I/O/Z)
U2
I/O/Z
Host data strobe 1 (I) [default] or PCI system error (I/O/Z)
HDS2/PCBE1
U1
I/O/Z
Host data strobe 2 (I) [default] or PCI command/byte enable 1 (I/O/Z)
HRDY/PIRDY
T4
I/O/Z
Host ready from DSP to host (O/Z) [default] or PCI initiator ready (I/O/Z)
PREQ/ GP[15]
P2
I/O/Z
PCI bus request (O/Z) or GP[15] (I/O/Z) [default]
P3
I/O/Z
PCI interrupt A (O/Z) or GP[14] (I/O/Z) default]
PRST/ GP[13]
R5
I/O/Z
PCI reset (I) or GP[13] (I/O/Z) [default]
PGNT/ GP[12]
R4
I/O/Z
or PCI bus grant (I) or GP[12] (I/O/Z)[default]
PCBE0/ GP[2]
P1
I/O/Z
PCI command/byte enable 0 (I/O/Z) or GP[2] (I/O/Z)[default]
PCBE3
P5
I/O/Z
PCI command/byte enable 3 (I/O/Z). By default, this pin has no function.
PIDSEL
R3
I
PCI initialization device select (I). By default, this pin has no function.
PTRDY
P4
I/O/Z
PCI target ready (PRTDY) (I/O/Z). By default, this pin has no function.
I/O/Z
Host-port data [31:16] pin (I/O/Z) [default] or PCI data-address bus [31:16]
(I/O/Z)
HCS/PPERR
HDS1/PSERR
PINTA
(5)
(6)
/ GP[14]
HD31/AD31
AA3
HD30/AD30
AA5
HD29/AD29
AC4
HD28/AD28
AA4
HD27/AD27
AC5
HD26/AD26
Y1
HD25/AD25
AD2
HD24/AD24
W1
HD23/AD23
AC3
HD22/AD22
AE1
HD21/AD21
AD1
HD20/AD20
W2
HD19/AD19
AC1
HD18/AD18
Y2
HD17/AD17
AB1
HD16/AD16
Y3
(6)
26
These pins function as open-drain outputs when configured as PCI pins.
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Table 2-3. Terminal Functions (continued)
SIGNAL
NAME
HD15/AD15
NO.
TYPE (1)
IPD/IPU (2)
DESCRIPTION
AB2
HD14/AD14
W4
HD13/AD13
AC2
HD12/AD12
V4
HD11/AD11
AF3
HD10/AD10
AE3
HD9/AD9
AB3
HD8/AD8
W5
HD7/AD7
AB4
HD6/AD6
Y4
HD5/AD5
AD3
HD4/AD4
Y5
HD3/AD3
AD4
I/O/Z
Host-port data [15:0] pin (I/O/Z) [default] or PCI data-address bus [15:0] (I/O/Z)
HD2/AD2
W6
HD1/AD1
AB5
HD0/AD0
AE2
ABA1/EMIFA_EN
V25
O/Z
IPD
EMIFA bank address control (ABA[1:0])
•
Active-low bank selects for the 64-bit EMIFA.
When interfacing to 16-bit Asynchronous devices, ABA1 carries bit 1 of the
byte address.
For an 8-bit Asynchronous interface, ABA[1:0] are used to carry bits 1 and
0 of the byte address
ABA0/DDR2_EN
V26
O/Z
IPD
DDR2 Memory Controller enable (DDR2_EN) [ABA0]
0 - DDR2 Memory Controller peripheral pins are disabled (default)
1 - DDR2 Memory Controller peripheral pins are enabled
EMIFA (64-BIT) - CONTROL SIGNALS COMMON TO ALL TYPES OF MEMORY
EMIFA enable (EMIFA_EN) [ABA1]
0 - EMIFA peripheral pins are disabled (default)
1 - EMIFA peripheral pins are enabled
ACE5
V27
O/Z
IPU
ACE4
V28
O/Z
IPU
ACE3
W26
O/Z
IPU
ACE2
W27
O/Z
IPU
ABE7
W29
O/Z
IPU
ABE6
K26
O/Z
IPU
ABE5
L29
O/Z
IPU
ABE4
L28
O/Z
IPU
ABE3
AA29
O/Z
IPU
ABE2
AA28
O/Z
IPU
ABE1
AA25
O/Z
IPU
ABE0
AA26
O/Z
IPU
AHOLDA
N26
O
IPU
EMIFA hold-request-acknowledge to the host
AHOLD
R29
I
IPU
EMIFA hold request from the host
ABUSREQ
L27
O
IPU
EMIFA bus request output
EMIFA memory space enables
•
Enabled by bits 28 through 31 of the word address
•
Only one pin is asserted during any external data access
Note: The C6454 device does not have ACE0 and ACE1 pins
EMIFA byte-enable control
•
Decoded from the low-order address bits. The number of address bits or
byte enables used depends on the width of external memory.
•
Byte-write enables for most types of memory.
EMIFA (64-BIT) - BUS ARBITRATION
EMIFA (64-BIT) - ASYNCHRONOUS/SYNCHRONOUS MEMORY CONTROL
AECLKIN
N29
I
IPD
EMIFA external input clock. The EMIFA input clock (AECLKIN or SYSCLK4
clock) is selected at reset via the pullup/pulldown resistor on the AEA[15] pin.
Note: AECLKIN is the default for the EMIFA input clock.
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Table 2-3. Terminal Functions (continued)
SIGNAL
NAME
AECLKOUT
AAWE/ASWE
TYPE (1)
IPD/IPU (2)
V29
O/Z
IPD
EMIFA output clock [at EMIFA input clock (AECLKIN or SYSCLK4) frequency]
AB25
O/Z
IPU
Asynchronous memory write-enable/Programmable synchronous interface
write-enable
NO.
DESCRIPTION
AARDY
K29
I
IPU
Asynchronous memory ready input
AR/W
W25
O/Z
IPU
Asynchronous memory read/write
AAOE/ASOE
Y28
O/Z
IPU
Asynchronous/Programmable synchronous memory output-enable
IPU
Programmable synchronous address strobe or read-enable
•
For programmable synchronous interface, the R_ENABLE field in the Chip
Select x Configuration Register selects between ASADS and ASRE:
– If R_ENABLE = 0, then the ASADS/ASRE signal functions as the
ASADS signal.
– If R_ENABLE = 1, then the ASADS/ASRE signal functions as the
ASRE signal.
ASADS/ASRE
R26
AEA19/BOOTMODE3
N25
AEA18/BOOTMODE2
L26
O/Z
EMIFA (64-BIT) - ADDRESS
AEA17/BOOTMODE1
L25
AEA16/BOOTMODE0
P26
AEA15/AECLKIN_SEL
P27
AEA14/HPI_WIDTH
R25
AEA13/LENDIAN
R27
AEA12
R28
O/Z
IPD
O/Z
IPU
EMIFA external address (word address) (O/Z)
Controls initialization of the DSP modes at reset (I) via pullup/pulldown resistors
[For more detailed information, see Section 3, Device Configuration.]
Note: If a configuration pin must be routed out from the device and 3-stated
(not driven), the internal pullup/pulldown (IPU/IPD) resistor should not be relied
upon; TI recommends the use of an external pullup/pulldown resistor. For more
detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 3.7, Pullup/Pulldown
Resistors.
•
•
AEA11
T25
O/Z
IPD
•
•
Boot mode - device boot mode configurations (BOOTMODE[3:0]) [Note:
the peripheral must be enabled to use the particular boot mode.]
AEA[19:16]:
0000 - No boot (default mode)
0001 - Host boot (HPI)
0010 -Reserved
0011 - Reserved
0100 - EMIFA 8-bit ROM boot
0101 - Master I2C boot
0110 - Slave I2C boot
0111 - Host boot (PCI)
1000 thru 1111 - Reserved
For more detailed information on the boot modes, see Section 2.4, Boot
Sequence.
CFGGP[2:0] pins must be set to 000b during reset for proper operation of
the PCI boot mode.
EMIFA input clock source select
Clock mode select for EMIFA (AECLKIN_SEL)
AEA15:
0 - AECLKIN (default mode)
1 - SYSCLK4 (CPU/x) Clock Rate. The SYSCLK4 clock rate is software
selectable via the Software PLL1 Controller. By default, SYSCLK4 is
selected as CPU/8 clock rate.
HPI peripheral bus width (HPI_WIDTH) select
[Applies only when HPI is enabled; PCI_EN pin = 0]
AEA14:
0 - HPI operates as an HPI16 (default). (HPI bus is 16 bits wide. HD[15:0]
pins are used and the remaining HD[31:16] pins are reserved pins in the
Hi-Z state.)
1 - HPI operates as an HPI32.
Device Endian mode (LENDIAN)
AEA13:
0 - System operates in Big Endian mode
1 - System operates in Little Endian mode(default)
Note: For proper C6454 device operation, the AEA12 and AEA11 pins must
be externally pulled down with a 1-kΩ resistor at device reset.
28
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Table 2-3. Terminal Functions (continued)
SIGNAL
NAME
NO.
AEA10/MACSEL1
M25
AEA9/MACSEL0
M27
AEA8/PCI_EEAI
P25
AEA7
N27
AEA6/PCI66
U27
AEA5/MCBSP1_EN
U28
AEA4/
SYSCLKOUT_EN
T28
AEA3
T27
AEA2/CFGGP2
T26
AEA1/CFGGP1
U26
TYPE (1)
IPD/IPU (2)
DESCRIPTION
•
•
•
O/Z
IPD
•
AEA0/CFGGP0
U25
•
•
EMAC/MDIO interface select bits (MACSEL[1:0])
There are two configuration pins — MACSEL[1:0] — to select the
EMAC/MDIO interface.
AEA[10:9]: MACSEL[1:0]
00 - 10/100 EMAC/MDIO MII Mode Interface (default)
01 - 10/100 EMAC/MDIO RMII Mode Interface
10 - 10/100/1000 EMAC/MDIO GMII Mode Interface
11 - 10/100/1000 with RGMII Mode Interface
[RGMII interface requires a 1.8-V or 1.5-V I/O supply]
PCI I2C EEPROM Auto-Initialization (PCI_EEAI)
AEA8: PCI auto-initialization via external I2C EEPROM
If the PCI peripheral is disabled (PCI_EN pin = 0), this pin must not be
pulled up.
0 - PCI auto-initialization through I2C EEPROM is disabled (default).
1 - PCI auto-initialization through I2C EEPROM is enabled.
PCI Frequency Selection (PCI66)
[The PCI peripheral needs be enabled (PCI_EN = 1) to use this function]
Selects the PCI operating frequency of 66-MHz or 33-MHz PCI operating
frequency is selected at reset via the pullup/pulldown resistor on the PCI66
pin:
AEA6:
0 - PCI operates at 33 MHz (default).
1 - PCI operates at 66 MHz.
Note: If the PCI peripheral is disabled (PCI_EN = 0), this pin must not be
pulled up.
McBSP1 Enable bit (MCBSP1_EN)
Selects which function is enabled on the McBSP1/GPIO muxed pins
AEA5:
0 - GPIO pin functions enabled (default).
1 - McBSP1 pin functions enabled.
SYSCLKOUT Enable pin (SYSCLKOUT_EN)
Selects which function is enabled on the SYSCLK4/GP[1] muxed pin
AEA4:
0 - GP[1] pin function of the SYSCLK4/GP[1] pin enabled (default).
1 - SYSCLK4 pin function of the SYSCLK4/GP[1] pin enabled.
Configuration GPI (CFGGP[2:0]) (AEA[2:0])
These pins are latched during reset and their values are shown in the
DEVSTAT register. These values can be used by software routines for boot
operations.
AEA3:
For proper C6454 device operation, the AEA3 pin must be pulled down to VSS
using a 1-kΩ resistor.
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Table 2-3. Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
IPD/IPU (2)
DESCRIPTION
EMIFA (64-BIT) - DATA
AED63
F25
AED62
A27
AED61
C27
AED60
C28
AED59
E27
AED58
D28
AED57
D27
AED56
F27
AED55
G25
AED54
G26
AED53
A28
AED52
F28
AED51
B28
AED50
G27
AED49
B27
AED48
G28
AED47
H25
AED46
J26
AED45
H26
AED44
J27
AED43
H27
AED42
J28
AED41
C29
AED40
J29
AED39
D29
AED38
J25
AED37
F29
AED36
F26
AED35
G29
AED34
K28
AED33
K25
AED32
K27
AED31
AA27
AED30
AG29
AED29
AB29
AED28
AC27
AED27
AB28
AED26
AC26
AED25
AB27
AED24
AC25
AED23
AB26
AED22
AD28
30
I/O/Z
IPU
EMIFA external data
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Table 2-3. Terminal Functions (continued)
SIGNAL
NAME
AED21
NO.
TYPE (1)
IPD/IPU (2)
I/O/Z
IPU
DESCRIPTION
AD29
AED20
AJ28
AED19
AF29
AED18
AH28
AED17
AE29
AED16
AG28
AED15
AF28
AED14
AH26
AED13
AE28
AED12
AE26
AED11
AD26
AED10
AF27
AED9
AG27
AED8
AD27
AED7
AE25
AED6
AJ27
AED5
AJ26
AED4
AE27
AED3
AG25
AED2
AH27
AED1
AF25
AED0
AD25
EMIFA external data
DDR2 MEMORY CONTROLLER (32-BIT) - CONTROL SIGNALS COMMON TO ALL TYPES OF MEMORY
DDR2 Memory Controller memory space enable. When the DDR2 Memory
Controller is enabled, it always keeps this pin low.
DCE0
E14
O/Z
DBA2
E15
O/Z
DBA1
D15
O/Z
DBA0
C15
O/Z
DDR2CLKOUT
B14
O/Z
DDR2 Memory Controller output clock (CLKIN2 frequency × 10)
DDR2CLKOUT
A14
O/Z
Negative DDR2 Memory Controller output clock (CLKIN2 frequency × 10)
DSDCAS
D13
O/Z
DDR2 Memory Controller SDRAM column-address strobe
DSDRAS
C13
O/Z
DDR2 Memory Controller SDRAM row-address strobe
DSDWE
B13
O/Z
DDR2 Memory Controller SDRAM write-enable
DSDCKE
D14
O/Z
DDR2 Memory Controller SDRAM clock-enable (used for self-refresh mode)
DEODT1
A17
O/Z
DEODT0
E16
O/Z
On-die termination signals to external DDR2 SDRAM. These pins should not be
connected to the DDR2 SDRAM.
Note: There are no on-die termination resistors implemented on the C6454
DSP die.
DSDDQGATE3
F21
I
DSDDQGATE2
E21
O/Z
DSDDQGATE1
B9
I
DSDDQGATE0
A9
O/Z
DSDDQM3
C23
O/Z
DSDDQM2
C20
O/Z
DSDDQM1
C8
O/Z
DSDDQM0
C11
O/Z
DDR2 Memory Controller bank address control
DDR2 Memory Controller data strobe gate [3:0]
For hookup of these signals, see the Implementing DDR2 PCB Layout on the
TMS320C6455/5 application report (literature number SPRAAA7).
DDR2 Memory Controller byte-enable controls
•
Decoded from the low-order address bits. The number of address bits or
byte enables used depends on the width of external memory.
•
Byte-write enables for most types of memory.
•
Can be directly connected to SDRAM read and write mask signal (SDQM).
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Table 2-3. Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
DSDDQS3
E23
I/O/Z
DSDDQS2
E20
I/O/Z
DSDDQS1
E8
I/O/Z
DSDDQS0
E11
I/O/Z
DSDDQS3
D23
I/O/Z
DSDDQS2
D20
I/O/Z
DSDDQS1
D8
I/O/Z
DSDDQS0
D11
I/O/Z
DEA13
B15
DEA12
A15
DEA11
A16
DEA10
B16
DEA9
C16
DEA8
D16
DEA7
B17
DEA6
C17
DEA5
D17
DEA4
E17
DEA3
A18
IPD/IPU (2)
DESCRIPTION
DDR2 Memory Controller data strobe [3:0] positive
DDR2 data strobe [3:0] negative
Note: These pins are used to meet AC timings. For more detailed information,
see the Implementing DDR2 PCB Layout on the TMS320C6454/5 application
report (literature number SPRAAA7).
DDR2 MEMORY CONTROLLER (32-BIT) - ADDRESS
DEA2
B18
DEA1
C18
DEA0
D18
32
O/Z
DDR2 Memory Controller external address
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Table 2-3. Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
IPD/IPU (2)
DESCRIPTION
DDR2 MEMORY CONTROLLER (32-BIT) - DATA
DED31
B25
DED30
A25
DED29
B24
DED28
A24
DED27
D22
DED26
C22
DED25
B22
DED24
A22
DED23
D21
DED22
C21
DED21
B21
DED20
A21
DED19
D19
DED18
C19
DED17
A19
DED16
B19
DED15
C7
DED14
D7
DED13
A7
DED12
B7
DED11
F9
DED10
E9
DED9
D9
DED8
C9
DED7
D10
DED6
C10
DED5
B10
I/O/Z
DDR2 Memory Controller external data
DED4
A10
DED3
D12
DED2
C12
DED1
B12
DED0
A12
TOUTL1
AG7
O/Z
IPD
Timer 1 output pin for lower 32-bit counter
TINPL1
AJ6
I
IPD
Timer 1 input pin for lower 32-bit counter
TOUTL0
AF8
O/Z
IPD
Timer 0 output pin for lower 32-bit counter
TINPL0
AH6
I
IPD
Timer 0 input pin for lower 32-bit counter
TIMER 1
TIMER 0
INTER-INTEGRATED CIRCUIT (I2C)
SCL
AG26
I/O/Z
I2C clock. When the I2C module is used, use an external pullup resistor.
SDA
AF26
I/O/Z
I2C data. When I2C is used, ensure there is an external pullup resistor.
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Table 2-3. Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
IPD/IPU (2)
DESCRIPTION
MULTICHANNEL BUFFERED SERIAL PORT 1 AND MULTICHANNEL BUFFERED SERIAL PORT 0 (McBSP1 and McBSP0)
IPD
McBSP external clock source (as opposed to internal) (I)
[shared by McBSP1 and McBSP0]
CLKS
AJ4
I
CLKR1/GP[0]
AF4
I/O/Z
IPD
McBSP1 receive clock (I/O/Z) or GP[0] (I/O/Z) [default]
FSR1/GP[10]
AE5
I/O/Z
IPD
McBSP1 receive frame sync (I/O/Z) or GP[10] (I/O/Z) [default]
DR1/GP[8]
AH5
I/O/Z
IPD
McBSP1 receive data (I) or GP[8] (I/O/Z) [default]
DX1/GP[9]
AG5
I/O/Z
IPD
McBSP1 transmit data (O/Z) or GP[9] (I/O/Z) [default]
FSX1/GP[11]
AG4
I/O/Z
IPD
McBSP1 transmit frame sync (I/O/Z) or GP[11] (I/O/Z) [default]
CLKX1/GP[3]
AF5
I/O/Z
IPD
McBSP1 transmit clock (I/O/Z) or GP[3] (I/O/Z) [default]
CLKR0
AG1
I/O/Z
IPU
McBSP0 receive clock (I/O/Z)
FSR0
AH3
I/O/Z
IPD
McBSP0 receive frame sync (I/O/Z)
MULTICHANNEL BUFFERED SERIAL PORT 1 (McBSP1)
MULTICHANNEL BUFFERED SERIAL PORT 0 (McBSP0)
DR0
AJ5
I
IPD
McBSP0 receive data (I)
DX0
AF6
I/O/Z
IPD
McBSP0 transmit data (O/Z)
FSX0
AJ3
I/O/Z
IPD
McBSP0 transmit frame sync (I/O/Z)
CLKX0
AG6
I/O/Z
IPU
McBSP0 transmit clock (I/O/Z)
MANAGEMENT DATA INPUT/OUTPUT (MDIO) FOR MII/RMII/GMII
MDCLK
M5
I/O/Z
IPD
MDIO serial clock (MDCLK) for MII/RMII/GMII mode (O)
MDIO
N3
I/O/Z
IPU
MDIO serial data (MDIO) for MII/RMII/GMII mode (I/O)
RGMDCLK
B4
O/Z
MDIO serial clock (RGMII mode) (RGMDCLK) (O)
RGMDIO
A4
I/O/Z
MDIO serial data (RGMII mode) (RGMDIO) (I/O)
MANAGEMENT DATA INPUT/OUTPUT (MDIO) FOR RGMII
ETHERNET MAC (EMAC) [MII/RMII/GMII]
There are two configuration pins - the MAC_SEL[1:0] (AEA[10:9] pins) - that select one of the four interface modes (MII, RMII, GMII, or
RGMII) for the EMAC/MDIO interface. For more detailed information on the EMAC configuration pins, see Section 3, Device Configuration.
This pin is EMAC receive clock (MRCLK) for MII [default] or GMII.
MACSEL[1:0] dependent.
MRCLK
H1
I
MCRS/ RMCRSDV
J4
I/O/Z
MRXER/
RMRXER
H4
I
This pin is EMAC receive error (MRXIR) (I) for MII [default], RMII, or GMII.
MACSEL[1:0] dependent.
MRXDV
H5
I
This pin is EMAC MII [default] or GMII receive data valid (MRXDV) (I).
MACSEL[1:0] dependent.
MRXD7
M2
MRXD6
H2
MRXD5
L2
MRXD4
L1
MRXD3
J3
I
MRXD2
J1
EMAC receive data bus for MII [default], RMII, or GMII These pins function as
EMAC receive data pins for MII [default], RMII, or GMII (MRXD[x:0]) (I).
MACSEL[1:0] dependent.
MRXD1/
RMRXD1
H3
MRXD0/
RMRXD0
J2
GMTCLK
K5
O/Z
This pin is EMAC GMII transmit clock (GMTCLK) (O). MACSEL[1:0] dependent.
MTCLK/ RMREFCLK
N4
I
This pin is either EMAC MII [default] or GMII transmit clock (MTCLK) (I) or the
EMAC RMII reference clock (RMREFCLK) (I). The EMAC function is controlled
by the MACSEL[1:0] (AEA[10:9] pins). For more detailed information, see
Section 3, Device Configuration.
34
This pin is EMAC carrier sense (MCRS) (I) for MII [default] or GMII, or EMAC
carrier sense/receive data valid (RMCRSDV) (I) for RMII. MACSEL[1:0]
dependent.
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Table 2-3. Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
IPD/IPU (2)
DESCRIPTION
MCOL
K3
I/O/Z
This pin is the EMAC collision sense (MCDL) (I) for MII [default] or GMII.
MACSEL[1:0] dependent.
MTXEN/ RMTXEN
J5
I/O/Z
This pin is either the EMAC transmit enable (MTXEN) (O) for MII [default],
RMII, or GMII. MACSEL[1:0] dependent.
MTXD7
N5
MTXD6
M3
MTXD5
L5
MTXD4
L3
MTXD3
K4
MTXD2
M4
MTXD1/
RMTXD1
L4
MTXD0/
RMTXD0
M1
EMAC transmit data bus for MII [default], RMII, or GMII.
O/Z
These pins function as EMAC transmit data pins (MTXD[x:0]) (O) for MII, RMII,
or GMII. MACSEL[1:0] dependent.
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Table 2-3. Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
IPD/IPU (2)
DESCRIPTION
ETHERNET MAC (EMAC) [RGMII]
There are two configuration pins - the MAC_SEL[1:0] (AEA[10:9] pins) - that select one of the four interface modes (MII, RMII, GMII, or
RGMII) for the EMAC/MDIO interface. For more detailed information on the EMAC configuration pins, see Section 3, Device Configuration.
RGREFCLK
C4
O/Z
RGMII reference clock (O). This 125-MHz reference clock is provided as a
convenience. It can be used as a clock source to a PHY, so that the PHY may
generate RXC clock to communicate with the EMAC. This clock is stopped
while the device is in reset. This pin is available only when RGMII mode is
selected ( MACSEL[1:0] =11).
RGTXC
D4
O/Z
RGMII transmit clock (O). This pin is available only when RGMII mode is
selected (MACSEL[1:0] =11).
RGTXD3
A2
RGTXD2
C3
RGTXD1
B3
O/Z
RGMII transmit data [3:0] (O). This pin is available only when RGMII mode is
selected (MACSEL[1:0] =11).
RGTXD0
A3
RGTXCTL
D3
O/Z
RGMII transmit enable (O). This pin is available only when RGMII mode is
selected (MACSEL[1:0] =11).
RGRXC
E3
I
RGRXD3
C1
I
RGRXD2
E4
I
RGRXD1
E2
I
RGRXD0
E1
I
RGRXCTL
C2
I
RSV02
V5
RGMII receive clock (I). This pin is available only when RGMII mode is selected
(MACSEL[1:0] =11).
RGMII receive data [3:0] (I). This pin is available only when RGMII mode is
selected (MACSEL[1:0] =11).
RGMII receive control (I). This pin is available only when RGMII mode is
selected (MACSEL[1:0] =11).
RESERVED FOR TEST
RSV03
W3
RSV04
N11
RSV05
P11
RSV07
G4
I
Reserved. This pin must be connected directly to 1.5-/1.8-V I/O supply
(DVDD15) for proper device operation.
NOTE: If the EMAC RGMII is not used, these pins can be connected directly to
ground (VSS).
RSV09
D26
I
Reserved. This pin must be connected directly to the 1.8-V I/O supply (DVDD18)
for proper device operation.
RSV11
RSV12
RSV13
36
Reserved. These pins must be connected directly to core supply (CVDD) for
proper device operation.
D24
Reserved. This pin must be connected to ground (VSS) via a 200-Ω resistor for
proper device operation.
NOTE: If the DDR2 Memory Controller is not used, the VREFSSTL, RSV11, and
RSV12 pins can be connected directly to ground (VSS) to save power.
However, connecting these pins directly to ground will prevent boundary-scan
from functioning on the DDR2 Memory Controller pins. To preserve boundaryscan functionality on the DDR2 Memory Controller pins, see Section 7.3.4.
C24
Reserved. This pin must be connected to the 1.8-V I/O supply (DVDD18) via a
200-Ω resistor for proper device operation.
NOTE: If the DDR2 Memory Controller is not used, the VREFSSTL, RSV11, and
RSV12 pins can be connected directly to ground (VSS) to save power.
However, connecting these pins directly to ground will prevent boundary-scan
from functioning on the DDR2 Memory Controller pins. To preserve boundaryscan functionality on the DDR2 Memory Controller pins, see Section 7.3.4.
F2
Reserved. This pin must be connected to ground (VSS) via a 200-Ω resistor for
proper device operation.
NOTE: If the RGMII mode of the EMAC is not used, the DVDD15, VREFHSTL,
RSV13, and RSV14 pins can be connected to directly ground (VSS) to save
power. However, connecting these pins directly to ground will prevent
boundary-scan from functioning on the RGMII pins of the EMAC. To preserve
boundary-scan functionality on the RGMII pins, see Section 7.3.4.
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Table 2-3. Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
IPD/IPU (2)
DESCRIPTION
RSV14
F1
Reserved. This pin must be connected to the 1.5/1.8-V I/O supply (DVDD15) via
a 200-Ω resistor for proper device operation.
NOTE: If the RGMII mode of the EMAC is not used, the DVDD15, VREFHSTL,
RSV13, and RSV14 pins can be connected to directly ground (VSS) to save
power. However, connecting these pins directly to ground will prevent
boundary-scan from functioning on the RGMII pins of the EMAC. To preserve
boundary-scan functionality on the RGMII pins, see Section 7.3.4.
RSV15
T1
Reserved. This pin must be connected via a 39-Ω resistor directly to ground
(VSS) for proper device operation. The resistor used should have a minimal
rating of 1/10 W.
RSV16
T2
Reserved. This pin must be connected via a 20-Ω resistor directly to 3.3-V I/O
Supply (DVDD33) for proper device operation. The resistor used should have a
minimal rating of 1/10 W.
RSV17
AE21
A
RSV18
E13
A
RSV19
F18
A
RSV20
U29
A
RSV21
A6
A
RSV22
B26
O
RSV23
C26
O
RSV24
B6
O
RSV25
C6
O
RSV26
AJ11
A
RSV27
AH11
A
RSV36
AD11
I/O/Z
IPU
RSV37
AD9
I/O/Z
IPU
RSV38
AG10
I/O/Z
IPU
RSV39
AG11
I/O/Z
IPU
RSV40
AJ12
I/O/Z
IPU
RSV41
W28
O/Z
IPU
RSV42
Y26
O/Z
IPU
RSV43
Y25
O/Z
IPU
RSV44
Y27
O/Z
Reserved. (Leave unconnected, do not connect to power or ground.)
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Table 2-3. Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
IPD/IPU (2)
DESCRIPTION
RSV45
AF15
RSV46
AG15
I
RSV47
AF17
O/Z
RSV48
AG18
O/Z
RSV49
AG22
O/Z
RSV50
AF23
O/Z
RSV51
AF18
O/Z
RSV52
AG19
O/Z
RSV53
AG21
O/Z
RSV54
AF22
O/Z
RSV55
AH18
I
RSV56
AJ18
I
RSV57
AJ22
I
RSV58
AH22
I
RSV59
AH17
I
RSV60
AJ19
I
RSV61
AJ21
I
RSV62
AH23
I
RSV28
N7
A
RSV29
N6
A
RSV30
P23
A
RSV31
P24
A
RSV32
D25
Reserved. This pin must be connected to the 1.8-V I/O supply (DVDD18) via a 1kΩ resistor for proper device operation.
RSV33
C25
Reserved. This pin must be connected directly to ground for proper device
operation.
RSV34
E6
Reserved. This pin must be connected to the 1.8-V I/O supply (DVDD18) via a 1kΩ resistor for proper device operation.
RSV35
D6
Reserved. This pin must be connected directly to ground for proper device
operation.
RSV63
AD20
I
RSV64
AC15
I
RSV65
AC17
I
RSV66
AD16
I
RSV67
U16
I
RSV68
V15
I
RSV69
V17
I
RSV70
W16
I
RSV71
W18
I
RSV72
AE17
I
RSV73
AE19
I
RSV74
AE23
I
RSV75
AF20
I
RSV76
AH20
I
RSV77
AJ17
I
RSV78
AJ23
I
38
I
Reserved. (Leave unconnected, do not connect to power or ground.)
Reserved. These pins must be connected directly to VSS for proper device
operation.
Reserved. These pins must be connected directly to VSS for proper device
operation.
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Table 2-3. Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
IPD/IPU (2)
DESCRIPTION
SUPPLY VOLTAGE MONITOR PINS
CVDDMON
N1
Die-side 1.2-V core supply (CVDD) voltage monitor pin. The monitor pins
indicate the voltage on the die and, therefore, provide the best probe point for
voltage monitoring purposes. If the CVDDMON pin is not used, it should be
connected directly to the 1.2-V core supply (CVDD).
DVDD33MON
L6
Die-side 3.3-V I/O supply (DVDD33) voltage monitor pin. The monitor pins
indicate the voltage on the die and, therefore, provide the best probe point for
voltage monitoring purposes. If the DVDD33MON pin is not used, it should be
connected directly to the 3.3-V I/O supply (DVDD33).
F3
Die-side 1.5-/1.8-V I/O supply (DVDD15) voltage monitor pin. The monitor pins
indicate the voltage on the die and, therefore, provide the best probe point for
voltage monitoring purposes. If the DVDD15MON pin is not used, it should be
connected directly to the 1.5-/1.8-V I/O supply (DVDD15).
NOTE: If the RGMII mode of the EMAC is not used, the DVDD15, DVDD15MON,
VREFHSTL, RSV13, and RSV14 pins can be connected directly to ground (VSS)
to save power. However, connecting these pins directly to ground will prevent
boundary-scan from functioning on the RGMII pins of the EMAC. To preserve
boundary-scan functionality on the RGMII pins, see Section 7.3.4.
DVDD15MON
DVDD18MON
I
Die-side 1.8-V I/O supply (DVDD18) voltage monitor pin. The monitor pins
indicate the voltage on the die and, therefore, provide the best probe point for
voltage monitoring purposes. If the DVDD18MON pin is not used, it should be
connected directly to the 1.8-V I/O supply (DVDD18).
A26
SUPPLY VOLTAGE PINS
VREFSSTL
C14
VREFHSTL
B2
AVDLL1
A13
AVDLL2
E18
A
(DVDD18/2)-V reference for SSTL buffer (DDR2 Memory Controller). This input
voltage can be generated directly from DVDD18 using two 1-kΩ resistors to form
a resistor divider circuit.
NOTE: The DDR2 Memory Controller is not used, the VREFSSTL, RSV11, and
RSV12 pins can be connected directly to ground (VSS) to save power.
However, connecting these pins directly to ground will prevent boundary-scan
from functioning on the DDR2 Memory Controller pins. To preserve boundaryscan functionality on the DDR2 Memory Controller pins, see Section 7.3.4.
A
(DVDD15/2)-V reference for HSTL buffer (EMAC RGMII). VREFHSTL can be
generated directly from DVDD15 using two 1-kΩ resistors to form a resistor
divider circuit.
NOTE: If the RGMII mode of the EMAC is not used, the DVDD15, VREFHSTL,
RSV13, and RSV14 pins can be connected to directly ground (VSS) to save
power. However, connecting these pins directly to ground will prevent
boundary-scan from functioning on the RGMII pins of the EMAC. To preserve
boundary-scan functionality on the RGMII pins, see Section 7.3.4.
A
1.8-V I/O supply voltage.
S
1.8-V or 1.5-V I/O supply voltage for the RGMII function of the EMAC.
NOTE: If the RGMII mode of the EMAC is not used, the DVDD15, VREFHSTL,
RSV13, and RSV14 pins can be connected to directly ground (VSS) to save
power. However, connecting these pins directly to ground will prevent
boundary-scan from functioning on the RGMII pins of the EMAC. To preserve
boundary-scan functionality on the RGMII pins, see Section 7.3.4.
A1
B5
D2
DVDD15
D5
F5
G6
H7
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Table 2-3. Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
IPD/IPU (2)
DESCRIPTION
B8
B11
B20
B23
E10
E12
E22
E24
F7
F11
F13
F15
DVDD18
F17
S
1.8-V I/O supply voltage (DDR2 Memory Controller)
F19
F23
G8
G10
G12
G14
G16
G18
G20
G22
G24
40
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Table 2-3. Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
IPD/IPU (2)
DESCRIPTION
A29
E26
E28
G2
H23
H28
J6
J24
K1
K7
K23
L24
M7
M23
M28
N24
P6
P28
R1
R6
R23
DVDD33
T7
S
3.3-V I/O supply voltage
T24
U23
V1
V7
V24
W23
Y7
Y24
AA1
AA6
AA23
AB7
AB24
AC6
AC9
AC11
AC13
AC19
AC21
AC23
AC29
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Table 2-3. Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
IPD/IPU (2)
DESCRIPTION
AD5
AD7
AD14
AD18
AD22
AD24
AE6
AE8
AE15
AF1
AF16
DVDD33
AF24
S
3.3-V I/O supply voltage
S
1.25-V core supply voltage (-1000 devices)
1.2-V core supply voltage (-850 and -720 devices)
AG12
AG17
AG23
AH14
AH16
AH24
AJ1
AJ7
AJ15
AJ25
AJ29
L12
L14
L16
L18
M11
M13
M15
M17
M19
N12
CVDD
N14
N16
N18
P13
P15
P17
P19
R12
R14
R16
42
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Table 2-3. Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
IPD/IPU (2)
DESCRIPTION
R18
T11
T13
T15
T17
T19
CVDD
U12
U14
S
1.25-V core supply voltage (-1000 devices)
1.2-V core supply voltage (-850 and -720 devices)
U18
V11
V13
V19
W12
W14
GROUND PINS
A8
A11
A20
A23
B1
B29
C5
D1
E5
VSS
E7
E19
GND
Ground pins
E25
E29
F4
F6
F8
F10
F12
F14
F16
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Table 2-3. Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
IPD/IPU (2)
DESCRIPTION
F20
F22
F24
G1
G5
G7
G9
G11
G13
G15
G17
G19
G21
G23
H6
H24
VSS
H29
GND
Ground pins
J7
J23
K2
K6
K24
L7
L11
L13
L15
L17
L19
L23
M6
M12
M14
44
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Table 2-3. Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
IPD/IPU (2)
DESCRIPTION
M16
M18
M24
M26
M29
N2
N13
N15
N17
N19
N23
P7
P12
P14
P16
P18
VSS
P29
R2
GND
Ground pins
R7
R11
R13
R15
R17
R19
R24
T6
T12
T14
T16
T18
T23
U7
U11
U13
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Table 2-3. Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
IPD/IPU (2)
DESCRIPTION
U15
U17
U19
U24
V2
V6
V12
V14
V16
V18
V23
W7
W11
W13
W15
W17
VSS
W19
GND
Ground pins
W24
Y6
Y23
AA2
AA7
AA24
AB6
AB23
AC7
AC8
AC10
AC12
AC14
AC16
AC18
46
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Table 2-3. Terminal Functions (continued)
SIGNAL
NAME
NO.
TYPE (1)
IPD/IPU (2)
DESCRIPTION
AC20
AC22
AC24
AC28
AD6
AD13
AD15
AD17
AD19
AD21
AD23
AE4
AE7
AE16
AE18
AE20
AE22
VSS
AE24
AF2
GND
Ground pins
AF19
AF21
AG13
AG16
AG20
AG24
AH1
AH15
AH19
AH21
AH25
AH29
AJ8
AJ14
AJ16
AJ20
AJ24
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2.8
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Development
2.8.1
Development Support
In case the customer would like to develop their own features and software on the C6454 device, TI offers
an extensive line of development tools for the TMS320C6000™ DSP platform, including tools to evaluate
the performance of the processors, generate code, develop algorithm implementations, and fully integrate
and debug software and hardware modules. The tool's support documentation is electronically available
within the Code Composer Studio™ Integrated Development Environment (IDE).
The following products support development of C6000™ DSP-based applications:
Software Development Tools: Code Composer Studio™ Integrated Development Environment (IDE):
including Editor C/C++/Assembly Code Generation, and Debug plus additional development tools
Scalable, Real-Time Foundation Software (DSP/BIOS™), which provides the basic run-time target
software needed to support any DSP application.
Hardware Development Tools: Extended Development System (XDS™) Emulator (supports C6000™
DSP multiprocessor system debug) EVM (Evaluation Module)
2.8.2
Device Support
2.8.2.1
Device and Development-Support Tool Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
DSP devices and support tools. Each DSP commercial family member has one of three prefixes: TMX,
TMP, or TMS (e.g., TMS320C6454GTZ). Texas Instruments recommends two of three possible prefix
designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of
product development from engineering prototypes (TMX/TMDX) through fully qualified production
devices/tools (TMS/TMDS).
Device development evolutionary flow:
TMX
Experimental device that is not necessarily representative of the final device's electrical
specifications.
TMP
Final silicon die that conforms to the device's electrical specifications but has not completed
quality and reliability verification.
TMS
Fully qualified production device.
Support tool development evolutionary flow:
TMDX
Development-support product that has not yet completed Texas Instruments internal
qualification testing.
TMDS
Fully qualified development-support product.
TMX and TMP devices and TMDX development-support tools are shipped with against the following
disclaimer:
"Developmental product is intended for internal evaluation purposes."
TMS devices and TMDS development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard
production devices. Texas Instruments recommends that these devices not be used in any production
system because their expected end-use failure rate still is undefined. Only qualified production devices are
to be used.
48
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TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, GTZ), the temperature range (for example, blank is the default commercial
temperature range), and the device speed range, in megahertz (for example, blank is 1000 MHz [1 GHz]).
Figure 2-12 provides a legend for reading the complete device name for any TMS320C64x+™ DSP
generation member.
For device part numbers and further ordering information for TMS320C6454 in the CTZ/GTZ/ZTZ package
type, see the TI website (www.ti.com) or contact your TI sales representative.
TMS
320
C6454
(
)
GTZ
(
)
(
)
PREFIX
TMX = Experimental device
TMS = Qualified device
DEVICE SPEED RANGE
7 = 720 MHz
8 = 850 MHz
Blank = 1 GHz
DEVICE FAMILY
320 = TMS320 DSP family
TEMPERATURE RANGE
Blank = 0°C to 90°C (default commercial temperature)
A = -40°C to 105°C (extended temperature)
DEVICE
C64x+ DSP:
C6454
PACKAGE TYPE
CTZ = 697-pin plastic BGA, with Pb-Free die bump and solder balls
GTZ = 697-pin plastic BGA with Pb-ed solder balls
ZTZ = 697-pin plastic BGA, with Pb-Free solder balls
(A)
(B)
(C)
SILICON REVISION
B = silicon revision 2.1
D = silicon revision 3.1
A.
B.
C.
The extended temperature "A version" devices may have different operating conditions than the commercial
temperature devices. For more details, see Section 6.2, Recommended Operating Conditions.
BGA = Ball Grid Array
For silicon revision information, see the TMS320C6455/54 Digital Signal Processor Silicon Errata (literature number
SPRZ234).
Figure 2-12. TMS320C64x+™ DSP Device Nomenclature (including the TMS320C6454 DSP)
2.8.2.2
Documentation Support
The following documents describe the TMS320C6454 Fixed-Point Digital Signal Processor. Copies of
these documents are available on the Internet at www.ti.com. Tip: Enter the literature number in the
search box provided at www.ti.com.
SPRU871
TMS320C64x+ DSP Megamodule Reference Guide. Describes the TMS320C64x+ digital
signal processor (DSP) megamodule. Included is a discussion on the internal direct memory
access (IDMA) controller, the interrupt controller, the power-down controller, memory
protection, bandwidth management, and the memory and cache.
SPRU732
TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide. Describes the CPU
architecture, pipeline, instruction set, and interrupts for the TMS320C64x and TMS320C64x+
digital signal processors (DSPs) of the TMS320C6000 DSP family. The C64x/C64x+ DSP
generation comprises fixed-point devices in the C6000 DSP platform. The C64x+ DSP is an
enhancement of the C64x DSP with added functionality and an expanded instruction set.
SPRAA84
TMS320C64x to TMS320C64x+ CPU Migration Guide. Describes migrating from the Texas
Instruments TMS320C64x digital signal processor (DSP) to the TMS320C64x+ DSP. The
objective of this document is to indicate differences between the two cores. Functionality in
the devices that is identical is not included.
SPRU889
High-Speed DSP Systems Design Reference Guide. Provides recommendations for
meeting the many challenges of high-speed DSP system design. These recommendations
include information about DSP audio, video, and communications systems for the C5000 and
C6000 DSP platforms.
SPRU971
TMS320C645x DSP External Memory Interface (EMIF) User's Guide. This document
describes the operation of the external memory interface (EMIF) in the TMS320C645x DSPs.
Device Overview
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SPRU970
TMS320C645x DSP DDR2 Memory Controller User's Guide. This document describes the
DDR2 memory controller in the TMS320C645x digital-signal processors (DSPs).
SPRU969
TMS320C645x DSP Host Port Interface (HPI) User's Guide. This guide describes the host
port interface (HPI) on the TMS320C645x digital signal processors (DSPs). The HPI enables
an external host processor (host) to directly access DSP resources (including internal and
external memory) using a 16-bit (HPI16) or 32-bit (HPI32) interface.
SPRUEC6
TMS320C645x/C647x Bootloader User's Guide. This document describes the
the on-chip Bootloader provided with the TMS320C645x/C647x digital signal
(DSPs). Included are descriptions of the available boot modes and any
requirements associated with them, instructions on generating the boot
information on the different versions of the Bootloader.
SPRU966
TMS320C645x DSP Enhanced DMA (EDMA3) Controller User's Guide. This document
describes the Enhanced DMA (EDMA3) Controller on the TMS320C645x digital signal
processors (DSPs).
SPRU580
TMS320C6000 DSP Multichannel Buffered Serial Port (McBSP) Reference Guide.
Describes the operation of the multichannel buffered serial port (McBSP) in the digital signal
processors (DSPs) of the TMS320C6000 DSP family. The McBSP consists of a data path
and a control path that connect to external devices. Separate pins for transmission and
reception communicate data to these external devices. The C6000 CPU communicates to
the McBSP using 32-bit-wide control registers accessible via the internal peripheral bus.
SPRU975
TMS320C645x DSP EMAC/MDIO Module User's Guide. This document provides a
functional description of the Ethernet Media Access Controller (EMAC) and Physical layer
(PHY) device Management Data Input/Output (MDIO) module integrated with the
TMS320C645x digital signal processors (DSPs).
SPRUE60
TMS320C645x DSP Peripheral Component Interconnect (PCI) User's Guide. This
document describes the peripheral component interconnect (PCI) port in the TMS320C645x
digital signal processors (DSPs). See the PCI Specification revision 2.3 for details on the PCI
interface.
SPRUE56
TMS320C645x DSP Software-Programmable Phase-Locked Loop (PLL) Controller
User's Guide. This document describes the operation of the software-programmable phaselocked loop (PLL) controller in the TMS320C645x digital signal processors (DSPs). The PLL
controller offers flexibility and convenience by way of software-configurable multipliers and
dividers to modify the input signal internally. The resulting clock outputs are passed to the
TMS320C645x DSP core, peripherals, and other modules inside the TMS320C645x digital
signal processors (DSPs).
SPRU974
TMS320C645x DSP Inter-Integrated Circuit (I2C) Module User's Guide. This document
describes the inter-integrated circuit (I2C) module in the TMS320C645x Digital Signal
Processor (DSP). The I2C provides an interface between the TMS320C645x device and
other devices compliant with Philips Semiconductors Inter-IC bus (I2C-bus) specification
version 2.1 and connected by way of an I2C-bus. This document assumes the reader is
familiar with the I2C-bus specification.
SPRU968
TMS320C645x DSP 64-Bit Timer User's Guide. This document provides an overview of the
64-bit timer in the TMS320C645x digital signal processors (DSPs). The timer can be
configured as a general-purpose 64-bit timer, dual general-purpose 32-bit timers, or a
watchdog timer. When configured as a dual 32-bit timers, each half can operate in
conjunction (chain mode) or independently (unchained mode) of each other.
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processors
interfacing
table, and
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SPRU724
2.8.2.3
SPRS311I – APRIL 2006 – REVISED MARCH 2012
TMS320C645x DSP General-Purpose Input/Output (GPIO) User's Guide. This document
describes the general-purpose input/output (GPIO) peripheral in the TMS320C645x digital
signal processors (DSPs). The GPIO peripheral provides dedicated general-purpose pins
that can be configured as either inputs or outputs. When configured as an input, you can
detect the state of the input by reading the state of an internal register. When configured as
an output, you can write to an internal register to control the state driven on the output pin.
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Device Overview
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3 Device Configuration
On the C6454 device, certain device configurations like boot mode, pin multiplexing, and endianess, are
selected at device reset. The status of the peripherals (enabled/disabled) is determined after device reset.
By default, the peripherals on the C6454 device are disabled and need to be enabled by software before
being used.
3.1
Device Configuration at Device Reset
Table 3-1 describes the C6454 device configuration pins. The logic level of the AEA[19:0], ABA[1:0], and
PCI_EN pins is latched at reset to determine the device configuration. The logic level on the device
configuration pins can be set by using external pullup/pulldown resistors or by using some control device
(e.g., FPGA/CPLD) to intelligently drive these pins. When using a control device, care should be taken to
ensure there is no contention on the lines when the device is out of reset. The device configuration pins
are sampled during reset and are driven after the reset is removed. To avoid contention, the control device
should only drive the EMIFA pins when RESETSTAT is low.
NOTE
If a configuration pin must be routed out from the device and 3-stated (not driven), the
internal pullup/pulldown (IPU/IPD) resistor should not be relied upon; TI recommends the use
of an external pullup/pulldown resistor. For more detailed information on pullup/pulldown
resistors and situations where external pullup/pulldown resistors are required, see
Section 3.7, Pullup/Pulldown Resistors.
Table 3-1. C6454 Device Configuration Pins (AEA[19:0], ABA[1:0], and PCI_EN)
CONFIGURATION
PIN
NO.
IPD/
IPU (1)
FUNCTIONAL DESCRIPTION
Boot Mode Selections (BOOTMODE [3:0]).
These pins select the boot mode for the device.
AEA[19:16]
[N25,
L26,
L25,
P26]
IPD
0000
No boot (default mode)
0001
Host boot (HPI)
0010
Reserved
0011
Reserved
0100
EMIFA 8-bit ROM boot
0101
Master I2C boot
0110
Slave I2C boot
0111
Host boot (PCI)
1000 thru Reserved
1111
If selected for boot, the corresponding peripheral is automatically enabled after device reset.
For more detailed information on boot modes, see Section 2.4, Boot Sequence.
CFGGP[2:0] pins must be set to 000b during reset for proper operation of the PCI boot
mode.
EMIFA input clock source select (AECLKIN_SEL).
AEA15
(1)
52
P27
IPD
0
AECLKIN (default mode)
1
SYSCLK4 (CPU/x) Clock Rate. The SYSCLK4 clock rate is software selectable
via the Software PLL1 Controller. By default, SYSCLK4 is selected as CPU/8
clock rate.
IPD = Internal pulldown, IPU = Internal pullup. For most systems, a 1-kΩ resistor can be used to oppose the IPU/IPD. For more detailed
information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see Section 3.7,
Pullup/Pulldown Resistors.
Device Configuration
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Table 3-1. C6454 Device Configuration Pins (AEA[19:0], ABA[1:0], and PCI_EN) (continued)
CONFIGURATION
PIN
NO.
IPD/
IPU (1)
FUNCTIONAL DESCRIPTION
HPI peripheral bus width select (HPI_WIDTH).
AEA14
R25
0
HPI operates in HPI16 mode (default).
HPI bus is 16 bits wide; HD[15:0] pins are used and the remaining HD[31:16]
pins are reserved pins in the Hi-Z state.
1
HPI operates in HPI32 mode.
HPI bus is 32 bits wide; HD[31:0] pins are used.
IPD
Applies only when HPI function of HPI/PCI multiplexed pins is selected (PCI_EN pin = 0).
Device Endian mode (LENDIAN).
AEA13
R27
IPU
0
System operates in Big Endian mode.
1
System operates in Little Endian mode (default).
AEA12
R28
IPD
For proper C6454 device operation, this pin must be externally pulled down with a 1-kΩ
resistor at device reset.
AEA11
T25
IPD
For proper C6454 device operation, this pin must be externally pulled down with a 1-kΩ
resistor at device reset.
EMAC Interface Selects (MACSEL[1:0]).
These pins select the interface used by the EMAC/MDIO peripheral.
AEA[10:9]
[M25,
M27]
IPD
00
10/100 EMAC/MDIO with MII Interface [default]
01
10/100 EMAC/MDIO with RMII Interface
10
10/100/1000 EMAC/MDIO with GMII Interface
11
10/100/1000 EMAC/MDIO with RGMII Interface
For more detailed information on the MAC_SEL[1:0] control pin selections, see .
PCI I2C EEPROM Auto-Initialization (PCI_EEAI).
PCI auto-initialization via external I2C EEPROM
AEA8
P25
IPD
AEA7
N27
IPD
0
PCI auto-initialization through external I2C EEPROM is disabled. The PCI
peripheral uses the specified PCI default values (default).
1
PCI auto-initialization through external I2C EEPROM is enabled. The PCI
peripheral is configured through external I2C EEPROM provided the PCI
peripheral pins are enabled (PCI_EN = 1).
Note: If the PCI pin function is disabled (PCI_EN pin = 0), this pin must not be pulled up.
For proper C6454 device operation, do not oppose the IPD on this pin.
PCI Frequency Selection (PCI66).
Selects the operating frequency of the PCI (either 33 MHz or 66 MHz).
AEA6
U27
IPD
0
PCI operates at 33 MHz (default)
1
PCI operates at 66 MHz
Note: If the PCI pin function is disabled (PCI_EN pin = 0), this pin must not be pulled up.
McBSP1 pin function enable bit (MCBSP1_EN).
Selects which function is enabled on the McBSP1/GPIO multiplexed pins.
AEA5
U28
IPD
0
GPIO pin function enabled (default).
This means all multiplexed McBSP1/GPIO pins function as GPIO pins.
1
McBSP1 pin function enabled.
This means all multiplexed McBSP1/GPIO pins function as McBSP1 pins.
SYSCLKOUT Enable bit (SYSCLKOUT_EN).
Selects which function is enabled on the SYSCLK4/GP[1] muxed pin.
AEA4
T28
IPD
0
GP[1] pin function is enabled (default)
1
SYSCLK4 pin function is enabled
AEA3
T27
IPD
For proper C6454 device operation, the AEA3 pin must be pulled down to VSS using a 1-kΩ
resistor.
AEA[2:0]
[T26,
U26,
U25]
IPD
Configuration General-Purpose Inputs (CFGGP[2:0])
The value of these pins is latched to the Device Status Register following device reset and is
used by the on-chip bootloader for some boot modes. For more information on the boot
modes, see Section 2.4, Boot Sequence.
Device Configuration
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Table 3-1. C6454 Device Configuration Pins (AEA[19:0], ABA[1:0], and PCI_EN) (continued)
CONFIGURATION
PIN
NO.
IPD/
IPU (1)
FUNCTIONAL DESCRIPTION
PCI pin function enable bit (PCI_EN).
Selects which function is enabled on the HPI/PCI multiplexed pins.
PCI_EN
Y29
IPD
0
HPI pin function enabled (default)
This means all multiplexed HPI/PCI pins function as HPI pins.
1
PCI pin function enabled
This means all multiplexed HPI/PCI pins function as PCI pins.
DDR2 Memory Controller enable (DDR2_EN).
ABA0
V26
IPD
0
DDR2 Memory Controller peripheral pins are disabled (default)
1
DDR2 Memory Controller peripheral pins are enabled
EMIFA enable (EMIFA_EN).
ABA1
3.2
V25
IPD
0
EMIFA peripheral pins are disabled (default)
1
EMIFA peripheral pins are enabled
Peripheral Configuration at Device Reset
Some C6454 device peripherals share the same pins (internally multiplexed) and are mutually exclusive.
Therefore, not all peripherals may be used at the same time. The device configuration pins described in
Section 3.1, Device Configuration at Device Reset, determine which function is enabled for the multiplexed
pins.
Note that when the pin function of a peripheral is disabled at device reset, the peripheral is permanently
disabled and cannot be enabled until its pin function is enabled and another device reset is executed.
Also, note that enabling the pin function of a peripheral does not enable the corresponding peripheral. All
peripherals on the C6454 device are disabled by default, except when used for boot, and must be enabled
through software before being used.
Other peripheral options like PCI clock speed and EMAC/MDIO interface mode can also be selected at
device reset through the device configuration pins. The configuration selected is also fixed at device reset
and cannot be changed until another device reset is executed with a different configuration selected.
The multiply factor of the PLL1 Controller is not selected through the configuration pins. The PLL1 multiply
factor is set in software through the PLL1 controller registers after device reset. The PLL2 multiply factor is
fixed. For more information, see Section 7.7, PLL1 and PLL1 Controller, and Section 7.8, PLL2 and PLL2
Controller.
On the C6454 device, the PCI peripheral pins are multiplexed with the HPI pins. The PCI_EN pin selects
the function for the HPI/PCI multiplexed pins. The PCI66, PCI_EEAI, and HPI_WIDTH control other
functions of the PCI and HPI peripherals. Table 3-2 describes the effect of the PCI_EN, PCI66, PCI_EEAI,
and HPI_WIDTH configuration pins.
Table 3-2. PCI_EN, PCI66, PCI_EEAI, and HPI_WIDTH Peripheral Selection (HPI and PCI)
CONFIGURATION PIN SETTING (1)
PERIPHERAL FUNCTION SELECTED
PCI_EN PIN
[Y29]
PCI66
AEA6 PIN
[U27]
PCI_EEAI
AEA8 PIN
[P25] (1)
HPI_WIDTH
AEA14 PIN
[R25]
HPI DATA
LOWER
0
0
0
0
0
0
0
1
1
1
1
X
Disabled
1
1
0
X
Disabled
(1)
54
HPI DATA
UPPER
32-BIT PCI
(66-/33-MHz)
PCI
AUTO-INIT
Enabled
Hi-Z
Disabled
N/A
Enabled
Enabled
Disabled
N/A
Enabled
(66 MHz)
Enabled
(via External I2C
EEPROM)
Disabled
PCI_EEAI is latched at reset as a configuration input. If PCI_EEAI is set as one, then default values are loaded from an external I2C
EEPROM.
Device Configuration
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Table 3-2. PCI_EN, PCI66, PCI_EEAI, and HPI_WIDTH Peripheral Selection (HPI and PCI) (continued)
CONFIGURATION PIN SETTING (1)
PERIPHERAL FUNCTION SELECTED
PCI_EN PIN
[Y29]
PCI66
AEA6 PIN
[U27]
PCI_EEAI
AEA8 PIN
[P25] (1)
HPI_WIDTH
AEA14 PIN
[R25]
1
0
0
X
1
0
1
HPI DATA
LOWER
HPI DATA
UPPER
32-BIT PCI
(66-/33-MHz)
Disabled
X
Enabled
(33 MHz)
Disabled
PCI
AUTO-INIT
Disabled
(default values)
Enabled
(via External I2C
EEPROM)
The MAC_SEL[1:0] configuration pins (AEA[10:9) control which interface is used by the EMAC/MDIO.
Table 3-3 describes the effect of the MACSEL[1:0] configuration pins.
Table 3-3. MAC_SEL[1:0] Peripheral Selection (EMAC)
MAC_SEL[1:0]/
AEA[10:9] PINS [M25, M27]
CONFIGURATION PIN SETTING
(1)
3.3
EMAC/MDIO
PERIPHERAL FUNCTION SELECTED
00b
10/100 EMAC/MDIO with MII Interface [default]
01b
10/100 EMAC/MDIO with RMII Interface
10b
10/100/1000 EMAC/MDIO with GMII Interface
11b
10/100/1000 EMAC/MDIO with RGMII Interface (1)
RGMII interface requires a 1.5-/1.8-V I/O supply.
Peripheral Selection After Device Reset
On the C6454 device, peripherals can be in one of several states. These states are listed in Table 3-4.
Table 3-4. Peripheral States
STATE
Static powerdown
Disabled
Enabled
PERIPHERALS THAT CAN BE
IN THIS STATE
DESCRIPTION
Peripheral pin function has been completely
disabled through the device configuration
pins. Peripheral is held in reset and clock is
turned off.
HPI
PCI
McBSP1
EMAC/MDIO
EMIFA
DDR2 Memory Controller
Peripheral is held in reset and clock is turned
off. Default state for all peripherals not in
static powerdown mode.
I2C
Timer 0
Timer 1
GPIO
EMAC/MDIO
McBSP0
McBSP1
HPI
PCI
Clock to the peripheral is turned on and the
peripheral is taken out of reset.
I2C
Timer 0
Timer 1
GPIO
MDIO
EMAC/MDIO
McBSP0
McBSP1
HPI
PCI
EMIFA
DDR2 Memory Controller
Device Configuration
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Table 3-4. Peripheral States (continued)
STATE
Enable in progress
PERIPHERALS THAT CAN BE
IN THIS STATE
DESCRIPTION
Not a user-programmable state. This is an
intermediate state when transitioning from an
disabled state to an enabled state.
All peripherals that can be in an
enabled state.
Following device reset, all peripherals that are not in the static powerdown state are in the disabled state
by default. Peripherals used for boot such as HPI and PCI are enabled automatically following a device
reset.
Peripherals are only allowed certain transitions between states (see Figure 3-1).
Static
Powerdown
Reset
Enable In
Progress
Disabled
Enabled
Figure 3-1. Peripheral Transitions Between States
Figure 3-2 shows the flow needed to change the state of a given peripheral on the C6454 device.
Unlock the PERCFG0 register by
using the PERLOCK register.
Write to the PERCFG0 register
within 16 SYSCLK3 clock cycles
to change the state of the
peripherals.
Poll the PERSTAT registers to
verify state change.
Figure 3-2. Peripheral State Change Flow
A 32-bit key (value = 0x0F0A 0B00) must be written to the Peripheral Lock register (PERLOCK) in order to
allow access to the PERCFG0 register. Writes to the PERCFG1 register can be done directly without
going through the PERLOCK register.
56
Device Configuration
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NOTE
The instructions that write to the PERLOCK and PERCFG0 registers must be in the same
fetch packet if code is being executed from external memory. If the instructions are in
different fetch packets, fetching the second instruction from external memory may stall the
instruction long enough such that PERCFG0 register will be locked before the instruction is
executed.
3.4
Device State Control Registers
The C6454 device has a set of registers that are used to control the status of its peripherals. These
registers are shown in Table 3-5 and described in the next sections.
NOTE
The device state control registers can only be accessed using the CPU or the emulator.
Table 3-5. Device State Control Registers
HEX ADDRESS RANGE
ACRONYM
02AC 0000
-
02AC 0004
PERLOCK
Peripheral Lock Register
02AC 0008
PERCFG0
Peripheral Configuration Register 0
02AC 000C
-
Reserved
02AC 0010
-
Reserved
02AC 0014
PERSTAT0
Peripheral Status Register 0
02AC 0018
PERSTAT1
Peripheral Status Register 1
02AC 001C - 02AC 001F
-
02AC 0020
EMACCFG
02AC 0024 - 02AC 002B
-
02AC 002C
PERCFG1
02AC 0030 - 02AC 0053
-
02AC 0054
EMUBUFPD
02AC 0058
-
REGISTER NAME
Reserved
Reserved
EMAC Configuration Register
Reserved
Peripheral Configuration Register 1
Reserved
Emulator Buffer Powerdown Register
Reserved
Device Configuration
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Peripheral Lock Register Description
When written with correct 32-bit key (0x0F0A0B00), the Peripheral Lock Register (PERLOCK) allows one
write to the PERCFG0 register within 16 SYSCLK3 cycles.
NOTE
The instructions that write to the PERLOCK and PERCFG0 registers must be in the same
fetch packet if code is being executed from external memory. If the instructions are in
different fetch packets, fetching the second instruction from external memory may stall the
instruction long enough such that PERCFG0 register will be locked before the instruction is
executed.
31
0
LOCKVAL
R/W-F0F0 F0F0
LEGEND: R/W = Read/Write; -n = value after reset
Figure 3-3. Peripheral Lock Register (PERLOCK) - 0x02AC 0004
Table 3-6. Peripheral Lock Register (PERLOCK) Field Descriptions
Bit
31:0
58
Field
LOCKVAL
Value
Description
When programmed with 0x0F0A 0B00 allows one write to the PERCFG0 register within 16
SYSCLK3 clock cycles.
Device Configuration
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Peripheral Configuration Register 0 Description
The Peripheral Configuration Register (PERCFG0) is used to change the state of the peripherals. One
write is allowed to this register within 16 SYSCLK3 cycles after the correct key is written to the PERLOCK
register.
NOTE
The instructions that write to the PERLOCK and PERCFG0 registers must be in the same
fetch packet if code is being executed from external memory. If the instructions are in
different fetch packets, fetching the second instruction from external memory may stall the
instruction long enough that the PERCFG0 register is locked before the instruction is
executed.
31
24
Reserved
R/W-0
23
20
19
18
17
16
Reserved
21
PCICTL
Reserved
HPICTL
Reserved
McBSP1CTL
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
15
14
13
12
11
10
9
8
Reserved
McBSP0CTL
Reserved
I2CCTL
Reserved
GPIOCTL
Reserved
TIMER1CTL
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
3
7
6
5
4
Reserved
TIMER0CTL
Reserved
EMACCTL
R/W-0
R/W-0
R/W-0
R/W-0
0
Reserved
R/W-0
LEGEND: R/W = Read/Write; -n = value after reset
Figure 3-4. Peripheral Configuration Register 0 (PERCFG0) - 0x02AC 0008
Table 3-7. Peripheral Configuration Register 0 (PERCFG0) Field Descriptions
Bit
31:21
20
Field
Value
Reserved
Reserved.
PCICTL
19
Reserved
18
HPICTL
17
Reserved
16
McBSP1CTL
Description
Mode control for PCI. This bit defaults to 1 when host boot is used (BOOTMODE[3:0] = 0111b).
0
Set PCI to disabled mode
1
Set PCI to enabled mode
Reserved.
Mode control for HPI. This bit defaults to 1 when host boot is used (BOOTMODE[3:0] = 0001b).
0
Set HPI to disabled mode
1
Set HPI to enabled mode
1
Reserved.
Mode control for McBSP1
0
Set McBSP1 to disabled mode
1
Set McBSP1 to enabled mode
15
Reserved
Reserved.
14
McBSP0CTL
Mode control for McBSP0
13
Reserved
0
Set McBSP0 to disabled mode
1
Set McBSP0 to enabled mode
Reserved.
Device Configuration
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Table 3-7. Peripheral Configuration Register 0 (PERCFG0) Field Descriptions (continued)
Bit
Field
12
I2CCTL
11
Reserved
10
GPIOCTL
9
Reserved
8
TIMER1CTL
7
Reserved
6
TIMER0CTL
Value
Description
Mode control for I2C
0
Set I2C to disabled mode
1
Set I2C to enabled mode
Reserved.
Mode control for GPIO
0
Set GPIO to disabled mode
1
Set GPIO to enabled mode
Reserved.
Mode control for Timer 1
0
Set Timer 1 to disabled mode
1
Set Timer 1 to enabled mode
Reserved.
Mode control for Timer 0
0
Set Timer 0 to disabled mode
1
Set Timer 0 to enabled mode
5
Reserved
Reserved.
4
EMACCTL
Mode control for EMAC/MDIO
3:0
0
Set EMAC/MDIO to disabled mode
1
Set EMAC/MDIO to enabled mode
Reserved
3.4.3
Reserved.
Peripheral Configuration Register 1 Description
The Peripheral Configuration Register (PERCFG1) is used to enable the EMIFA and DDR2 Memory
Controller. EMIFA and the DDR2 Memory Controller do not have corresponding status bits in the
Peripheral Status Registers. The EMIFA and DDR2 Memory Controller peripherals can be used within 16
SYSCLK3 cycles after EMIFACTL and DDR2CTL are set to 1. Once EMIFACTL and DDR2CTL are set to
1, they cannot be set to 0. Note that if the DDR2 Memory Controller and EMIFA are disabled at reset
through the device configuration pins (DDR2.EN[ABA0] and EMIFA[ABA1]), they cannot be enabled
through the PERCFG1 register.
31
8
Reserved
R-0x00
7
1
0
Reserved
2
DDR2CTL
EMIFACTL
R-0x00
R/W-0
R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 3-5. Peripheral Configuration Register 1 (PERCFG1) - 0x02AC 002C
Table 3-8. Peripheral Configuration Register 1 (PERCFG1) Field Descriptions
Bit
60
Field
31:2
Reserved
1
DDR2CTL
Value
Description
Reserved.
Mode Control for DDR2 Memory Controller. Once this bit is set to 1, it cannot be changed to 0.
0
Set DDR2 to disabled
1
Set DDR2 to enabled
Device Configuration
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Table 3-8. Peripheral Configuration Register 1 (PERCFG1) Field Descriptions (continued)
Bit
0
Field
Value
EMIFACTL
Description
Mode control for EMIFA. Once this bit is set to 1, it cannot be changed to 0. This bit defaults to 1 if
EMIFA 8-bit ROM boot is used (BOOTMODE[3:0] = 0100b).
0
Set EMIFA to disabled
1
Set EMIFA to enabled
Device Configuration
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Peripheral Status Registers Description
The Peripheral Status Registers (PERSTAT0 and PERSTAT1) show the status of the C6454 device
peripherals.
31
30
29
27
26
24
Reserved
HPISTAT
McBSP1STAT
R-0
R-0
R-0
23
21
20
18
17
16
McBSP0STAT
I2CSTAT
GPIOSTAT
R-0
R-0
R-0
15
14
12
11
9
8
GPIOSTAT
TIMER1STAT
TIMER0STAT
EMACSTAT
R-0
R-0
R-0
R-0
7
6
5
0
EMACSTAT
Reserved
R-0
R-0
LEGEND: R = Read only; -n = value after reset
Figure 3-6. Peripheral Status Register 0 (PERSTAT0) - 0x02AC 0014
Table 3-9. Peripheral Status Register 0 (PERSTAT0) Field Descriptions
Bit
Field
31:30
Reserved
29:27
HPISTAT
Value
Reserved.
HPI status
000
HPI is in the disabled state
001
HPI is in the enabled state
011
HPI is in the static powerdown state
100
HPI is in the disable in progress state
101
HPI is in the enable in progress state
Others
26:24
McBSP1STAT
McBSP1 status
McBSP1 is in the disabled state
001
McBSP1 is in the enabled state
011
McBSP1 is in the static powerdown state
100
McBSP1 is in the disable in progress state
101
McBSP1 is in the enable in progress state
McBSP0STAT
Reserved
McBSP0 status
000
McBSP0 is in the disabled state
001
McBSP0 is in the enabled state
011
McBSP0 is in the static powerdown state
100
McBSP0 is in the disable in progress state
101
McBSP0 is in the enable in progress state
Others
62
Reserved
000
Others
23:21
Description
Reserved
Device Configuration
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Table 3-9. Peripheral Status Register 0 (PERSTAT0) Field Descriptions (continued)
Bit
20:18
Field
Value
I2CSTAT
I2C status
000
I2C is in the disabled state
001
I2C is in the enabled state
011
I2C is in the static powerdown state
100
I2C is in the disable in progress state
101
I2C is in the enable in progress state
Others
17:15
GPIOSTAT
GPIO status
GPIO is in the disabled state
001
GPIO is in the enabled state
011
GPIO is in the static powerdown state
100
GPIO is in the disable in progress state
101
GPIO is in the enable in progress state
TIMER1STAT
Timer1 status
Timer1 is in the disabled state
001
Timer1 is in the enabled state
011
Timer1 is in the static powerdown state
100
Timer1 is in the disable in progress state
101
Timer1 is in the enable in progress state
TIMER0STAT
Timer0 status
Timer0 is in the disabled state
001
Timer0 is in the enabled state
011
Timer0 is in the static powerdown state
100
Timer0 is in the disable in progress state
101
Timer0 is in the enable in progress state
EMACSTAT
Reserved
Reserved
EMAC/MDIO status
000
EMAC/MDIO is in the disabled state
001
EMAC/MDIO is in the enabled state
011
EMAC/MDIO is in the static powerdown state
100
EMAC/MDIO is in the disable in progress state
101
EMAC/MDIO is in the enable in progress state
Others
5:0
Reserved
000
Others
8:6
Reserved
000
Others
11:9
Reserved
000
Others
14:12
Description
Reserved
Reserved
31
16
Reserved
R-0
15
5
3
2
0
Reserved
PCISTAT
R-0
R-0
LEGEND: R = Read only; -n = value after reset
Figure 3-7. Peripheral Status Register 1 (PERSTAT1) - 0x02AC 0018
Device Configuration
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Table 3-10. Peripheral Status Register 1 (PERSTAT1) Field Descriptions
Bit
Field
31:3
Reserved
2:0
PCISTAT
Value
Reserved
PCI status
000
PCI is in the disabled state
001
PCI is in the enabled state
011
PCI is in the static powerdown state
101
PCI is in the enable in progress state
Others
64
Description
Reserved
Device Configuration
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3.4.5
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EMAC Configuration Register (EMACCFG) Description
The EMAC Configuration Register (EMACCFG) is used to assert and deassert the reset of the Reduced
Media Independent Interface (RMII) logic of the EMAC. For more details on how to use this register, see
Section 7.14, Ethernet MAC (EMAC).
31
24
Reserved
R/W-0
23
19
18
17
16
Reserved
RMII_RST
Reserved
R/W-0001b
R/W-1
R/W-0
15
0
Reserved
R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 3-8. EMAC Configuration Register (EMACCFG) - 0x02AC 0020
Table 3-11. EMAC Configuration Register (EMACCFG) Field Descriptions
Bit
Field
Value
Description
31:19
Reserved
Reserved. Writes to this register must keep the default values of these bits.
18
RMII_RST
RMII reset bit. This bit is used to reset the RMII logic of the EMAC.
17:0
Reserved
0
RMII logic reset is released.
1
RMII logic reset is asserted.
Reserved. Writes to this register must keep this bit as 0.
Device Configuration
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Emulator Buffer Powerdown Register (EMUBUFPD) Description
The Emulator Buffer Powerdown Register (EMUBUFPD) is used to control the state of the pin buffers of
emulator pins EMU[18:2]. These buffers can be powered down if the device trace feature is not needed.
31
8
Reserved
R-0
7
1
0
Reserved
EMUCTL
R-0
R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 3-9. Emulator Buffer Powerdown Register (EMUBUFPD) - 0x02AC 0054
Table 3-12. Emulator Buffer Powerdown Register (EMUBUFPD) Field Descriptions
Bit
66
Field
31:1
Reserved
0
EMUCTL
Value
Description
Reserved
Buffer powerdown for EMU[18:2] pins
0
Power-up buffers
1
Power-down buffers
Device Configuration
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3.5
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Device Status Register Description
The device status register depicts the device configuration selected upon device reset. Once set, these
bits will remain set until a device reset. For the actual register bit names and their associated bit field
descriptions, see Figure 3-10 and Table 3-13.
Note that enabling or disabling peripherals through the Peripheral Configuration Registers (PERCFG0 and
PERCFG1) does not affect the DEVSTAT register. To determine the status of peripherals following writes
to the PERCFG0 and PERCFG1 registers, read the Peripherals Status Registers (PERSTAT0 and
PERSTAT1).
31
24
Reserved
R-0000 0000
23
22
21
20
19
18
17
16
Reserved
EMIFA_EN
DDR2_EN
PCI_EN
CFGGP2
CFGGP1
CFGGP0
Reserved
R-0
R-0
R-0
R-0
R-0
R-0
R-0
R-1
15
14
13
12
11
10
9
8
SYSCLKOUT_
EN
MCBSP1_EN
PCI66
Reserved
PCI_EEAI
MAC_SEL1
MAC_SEL0
Reserved
R-0
R-0
R-0
R-0
R-0
R-0
R-0
R-1
7
6
5
4
3
2
1
0
Reserved
LENDIAN
HPI_WIDTH
AECLKINSEL
BOOTMODE3
BOOTMODE2
BOOTMODE1
BOOTMODE0
R-0
R-1
R-0
R-0
R-0
R-0
R-0
R-0
LEGEND: R/W = Read/Write; R = Read only; -x = value after reset
Note: The default values of the fields in the DEVSTAT register are latched from device configuration pins, as described in Section 3.1,
Device Configuration at Device Reset. The default values shown here correspond to the setting dictated by the internal pullup or pulldown
resistor.
Figure 3-10. Device Status Register (DEVSTAT) - 0x02A8 0000
Table 3-13. Device Status Register (DEVSTAT) Field Descriptions
Bit
31:23
22
21
20
19:17
Field
Value
Description
Reserved
Reserved. Read-only, writes have no effect.
EMIFA_EN
EMIFA Enable (EMIFA_EN) status bit
Shows the status of whether the EMIFA peripheral pins are enabled/disabled.
0
EMIFA peripheral pins are disabled (default)
1
EMIFA peripheral pins are enabled
DDR2_EN
DDR2 Memory Controller Enable (DDR2_EN) status bit
Shows the status of whether the DDR2 Memory Controller peripheral pins are enabled/disabled.
0
DDR2 Memory Controller peripheral pins are disabled (default)
1
DDR2 Memory Controller peripheral pins are enabled
PCI_EN
PCI Enable (PCI_EN) status bit
Shows the status of which function is enabled on the HPI/PCI multiplexed pins.
0
HPI pin functions are enabled (default)
1
PCI pin functions are enabled
CFGGP[2:0]
Used as General-Purpose inputs for configuration purposes.
These pins are latched at reset. These values can be used by S/W routines for boot operations.
16
Reserved
Reserved. Read-only, writes have no effect.
15
SYSCLKOUT_EN
SYSCLKOUT Enable (SYSCLKOUT_EN) status bit
Shows the status of which function is enabled on the SYSCLK4/GP[1] muxed pin.
0
GP[1] pin function of the SYSCLK4/GP[1] pin enabled (default)
1
SYSCLK4 pin function of the SYSCLK4/GP[1] pin enabled
Device Configuration
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Table 3-13. Device Status Register (DEVSTAT) Field Descriptions (continued)
Bit
Field
14
MCBSP1_EN
13
11
10:9
Value
Description
McBSP1 Enable (MCBSP1_EN) status bit
Shows the status of which function is enabled on the McBSP1/GPIO muxed pins.
0
GPIO pin functions enabled (default)
1
McBSP1 pin functions enabled
PCI66
PCI Frequency Selection (PCI66) status bit
Shows the PCI operating frequency selected at reset.
0
PCI operates at 33 MHz (default)
1
PCI operates at 66 MHz
PCI_EEAI
PCI I2C EEPROM Auto-Initialization (PCI_EEAI) status bit
Shows whether the PCI auto-initialization via external I2C EEPROM is enabled/disabled.
0
PCI auto-initialization through external I2C EEPROM is disabled; the PCI peripheral uses the
specified PCI default values (default).
1
PCI auto-initialization through external I2C EEPROM is enabled; the PCI peripheral is configured
through external I2C EEPROM provided the PCI peripheral pin is enabled (PCI_EN = 1).
MACSEL[1:0]
EMAC Interface Select (MACSEL[1:0]) status bits
Shows which EMAC interface mode has been selected.
00
10/100 EMAC/MDIO with MII Interface (default)
01
10/100 EMAC/MDIO with RMII Interface
10
10/100/1000 EMAC/MDIO with GMII Interface
11
10/100/1000 EMAC/MDIO with RGMII Mode Interface
[RGMII interface requires a 1.8-V or 1.5-V I/O supply]
8:7
Reserved
Reserved. Read-only, writes have no effect.
6
LENDIAN
Device Endian mode (LENDIAN)
Shows the status of whether the system is operating in Big Endian mode or Little Endian mode
(default).
5
4
3:0
0
System is operating in Big Endian mode
1
System is operating in Little Endian mode (default)
HPI_WIDTH
HPI bus width control bit.
Shows the status of whether the HPI bus operates in 32-bit mode or in 16-bit mode (default).
0
HPI operates in 16-bit mode. (default)
1
HPI operates in 32-bit mode
AECLKINSEL
EMIFA input clock select
Shows the status of what clock mode is enabled or disabled for EMIFA.
0
AECLKIN (default mode)
1
SYSCLK4 (CPU/x) Clock Rate. The SYSCLK4 clock rate is software selectable via the PLL1
Controller. By default, SYSCLK4 is selected as CPU/8 clock rate.
BOOTMODE[3:0]
Boot mode configuration bits
Shows the status of what device boot mode configuration is operational.
BOOTMODE[3:0]
[Note: if selected for boot, the corresponding peripheral is automatically enabled after device reset.]
0000
No boot (default mode)
0001
Host boot (HPI)
0010
Reserved
0011
Reserved
0100
EMIFA 8-bit ROM boot
0101
Master I2C boot
0110
Slave I2C boot
0111
Host boot (PCI)
1000
thru
1111
Reserved
For more detailed information on the boot modes, see Section 2.4, Boot Sequence.
68
Device Configuration
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3.6
SPRS311I – APRIL 2006 – REVISED MARCH 2012
JTAG ID (JTAGID) Register Description
The JTAG ID register is a read-only register that identifies to the customer the JTAG/Device ID. For the
C6454 device, the JTAG ID register resides at address location 0x02A8 0008. For the actual register bit
names and their associated bit field descriptions, see Figure 3-11 and Table 3-14.
31
28 27
12 11
1
0
VARIANT
(4-bit)
PART NUMBER
(16-bit)
MANUFACTURER
(11-bit)
LSB
R-n
R-0000 0000 1000 1010b
0000 0010 111b
R-1
LEGEND: R = Read only; -n = value after reset
Figure 3-11. JTAG ID (JTAGID) Register - 0x02A8 0008
Table 3-14. JTAG ID (JTAGID) Register Field Descriptions
Bit
Field
Value
31:28 VARIANT
Description
Variant (4-Bit) value. The value of this field depends on the silicon revision being
used. For more information, see the TMS320C6455/54 Digital Signal Processor
Silicon Errata (literature number SPRZ234).
Note: the VARIANT field may be invalid if no CLKIN1 signal is applied.
27:12 PART NUMBER
Part Number (16-Bit) value. C6454 device value: 0000 0000 1000 1010b.
11:1
MANUFACTURER
Manufacturer (11-Bit) value. C6454 device value: 0000 0010 111b.
LSB
LSB. This bit is read as a "1" for the C6454 device.
0
Device Configuration
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Pullup/Pulldown Resistors
Proper board design should ensure that input pins to the C6454 device always be at a valid logic level and
not floating. This may be achieved via pullup/pulldown resistors. The C6454 device features internal pullup
(IPU) and internal pulldown (IPD) resistors on most pins to eliminate the need, unless otherwise noted, for
external pullup/pulldown resistors.
An external pullup/pulldown resistor needs to be used in the following situations:
• Device Configuration Pins: If the pin is both routed out and 3-stated (not driven), an external
pullup/pulldown resistor must be used, even if the IPU/IPD matches the desired value/state.
• Other Input Pins: If the IPU/IPD does not match the desired value/state, use an external
pullup/pulldown resistor to pull the signal to the opposite rail.
For the device configuration pins (listed in Table 3-1), if they are both routed out and 3-stated (not driven),
it is strongly recommended that an external pullup/pulldown resistor be implemented. Although, internal
pullup/pulldown resistors exist on these pins and they may match the desired configuration value,
providing external connectivity can help ensure that valid logic levels are latched on these device
configuration pins. In addition, applying external pullup/pulldown resistors on the device configuration pins
adds convenience to the user in debugging and flexibility in switching operating modes.
Tips for choosing an external pullup/pulldown resistor:
• Consider the total amount of current that may pass through the pullup or pulldown resistor. Make sure
to include the leakage currents of all the devices connected to the net, as well as any internal pullup or
pulldown resistors.
• Decide a target value for the net. For a pulldown resistor, this should be below the lowest VIL level of
all inputs connected to the net. For a pullup resistor, this should be above the highest VIH level of all
inputs on the net. A reasonable choice would be to target the VOL or VOH levels for the logic family of
the limiting device; which, by definition, have margin to the VIL and VIH levels.
• Select a pullup/pulldown resistor with the largest possible value; but, which can still ensure that the net
will reach the target pulled value when maximum current from all devices on the net is flowing through
the resistor. The current to be considered includes leakage current plus, any other internal and
external pullup/pulldown resistors on the net.
• For bidirectional nets, there is an additional consideration which sets a lower limit on the resistance
value of the external resistor. Verify that the resistance is small enough that the weakest output buffer
can drive the net to the opposite logic level (including margin).
• Remember to include tolerances when selecting the resistor value.
• For pullup resistors, also remember to include tolerances on the DVDD rail.
For most systems, a 1-kΩ resistor can be used to oppose the IPU/IPD while meeting the above criteria.
Users should confirm this resistor value is correct for their specific application.
For most systems, a 20-kΩ resistor can be used to compliment the IPU/IPD on the device configuration
pins while meeting the above criteria. Users should confirm this resistor value is correct for their specific
application.
For more detailed information on input current (II), and the low-/high-level input voltages (VIL and VIH) for
the C6454 device, see Section 6.3, Electrical Characteristics Over Recommended Ranges of Supply
Voltage and Operating Case Temperature.
To determine which pins on the C6454 device include internal pullup/pulldown resistors, see Table 2-3,
Terminal Functions.
3.8
Configuration Examples
Figure 3-12 and Figure 3-13 illustrate examples of peripheral selections/options that are configurable on
the C6454 device.
70
Device Configuration
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32
HD[31:0]
HRDY, HINT
HPI
(32-Bit)
HCNTL0, HCNTL1, HHWIL,
HAS, HR/W, HCS, HDS1, HDS2
64
AED[63:0]
PCI
GP[15:12,2,1]
EMIFA
AECLKIN, AARDY, AHOLD
AEA[22:3], ACE[3:0], ABE[7:0],
AECLKOUT, ASDCKE, AHOLDA,
ABUSREQ, ASADS/ASRE,
AAOE/ASOE, AAWE/ASWE
GPIO
32
CLKIN1, PLLV1
SYSCLK4
CLKR0, FSR0, DR0, CLKS0,
DX0, FSX0, CLKX0
PLL1
and PLL1
Controller
DDR2
EMIF
McBSP1
PLL2
and PLL2
Controller
McBSP0
TIMER1
ED[31:0]
DEA[21:2], DCE[1:0], DBE[3:0], DDRCLK, DDRCLK,
DSDCKE, DDQS, DDQS, DSDCAS, DSDRAS,
DSDWE
CLKIN2, PLLV2
TINP1L
TOUT1L
TINP0
MRXD[7:0], MRXER, MRXDV, MCOL,
MCRS, MTCLK, MRCLK
EMAC
MTXD[7:0], MTXEN,
MDIO, MDCLK
MDIO
TIMER0
I2C
TOUT0
SCL
SDA
Shading denotes a peripheral module not available for this configuration.
DEVSTAT Register: 0x0061 8161
PCI_EN = 0 (PCI disabled, default)
ABA1 (EMIFA_EN) = 1(EMIFA enabled)
ABA0 (DDR2_EN) = 1 (DDR2 Memory Controller enabled)
AEA[19:16] (BOOTMODE[3:0]) = 0001, (HPI Boot)
AEA[15] (AECLKIN_SEL) = 0, (AECLKIN, default)
AEA[14] (HPI_WIDTH) = 1, (HPI, 32-bit Operation)
AEA[13] (LENDIAN) = IPU, (Little Endian Mode, default)
AEA[12] = 0, (do not oppose IPD)
AEA[11] = 0, (do not oppose IPD)
AEA[10:9] (MACSEL[1:0]) = 00, (10/100 MII Mode)
AEA[8] (PCI_EEAI) = 0, (PCI I2C EEPROM Auto-Init disabled, default)
AEA[7] = 0, (do not oppose IPD)
AEA[6] (PCI66) = 0, (PCI 33 MHz [default, don’t care])
AEA[5] (MCBSP1_EN) = 0, (McBSP1 disabled, default)
AEA[4] (SYSCLKOUT_EN) = 1, (SYSCLK4 pin function)
AEA[3] = 0, (do not oppose IPD)
AEA[2:0] (CFGGP[2:0]) = 000, (default)
Figure 3-12. Configuration Example A (McBSP + HPI32 + I2C + EMIFA + DDR2 Memory Controller +
TIMERS + EMAC (MII) + MDIO)
Device Configuration
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32
HD[31:0]
HRDY, HINT
HPI
(32-Bit)
HCNTL0, HCNTL1, HHWIL,
HAS, HR/W, HCS, HDS1, HDS2
64
AED[63:0]
PCI
GP[15:12,2,1]
EMIFA
AECLKIN, AARDY, AHOLD
AEA[22:3], ACE[3:0], ABE[7:0],
AECLKOUT, ASDCKE,
AHOLDA, ABUSREQ,
ASADS/ASRE, AAOE/ASOE,
AAWE/ASWE
GPIO
32
CLKIN1, PLLV1
SYSCLK4
PLL1
and PLL1
Controller
DDR2
EMIF
CLKR1, FSR1, DR1, CLKS1,
DX1, FSX1, CLKX1
McBSP1
PLL2
and PLL2
Controller
CLKR0, FSR0, DR0, CLKS0,
DX0, FSX0, CLKX0
McBSP0
TIMER1
ED[31:0]
DEA[21:2], DCE[1:0], DBE[3:0], DDRCLK, DDRCLK,
DSDCKE, DDQS, DDQS, DSDCAS, DSDRAS,
DSDWE
CLKIN2, PLLV2
TINP1L
TOUT1L
TINP0
MRXD[7:0], MRXER, MRXDV, MCOL,
MCRS, MTCLK, MRCLK
EMAC
MTXD[7:0], MTXEN,
MDIO, MDCLK
MDIO
TIMER0
I2C
TOUT0
SCL
SDA
Shading denotes a peripheral module not available for this configuration.
DEVSTAT Register: 0x0061 C161
PCI_EN = 0 (PCI disabled, default)
ABA1 (EMIFA_EN) = 1(EMIFA enabled)
ABA0 (DDR2_EN) = 1 (DDR2 Memory Controller enabled)
AEA[19:16] (BOOTMODE[3:0]) = 0001, (HPI Boot)
AEA[15] (AECLKIN_SEL) = 0, (AECLKIN, default)
AEA[14] (HPI_WIDTH) = 1, (HPI, 32-bit Operation)
AEA[13] (LENDIAN) = IPU, (Little Endian Mode, default)
AEA[12] = 0, (do not oppose IPD)
AEA[11] = 0, (do not oppose IPD)
AEA[10:9] (MACSEL[1:0]) = 00, (10/100 MII Mode)
AEA[8] (PCI_EEAI) = 0, (PCI I2C EEPROM Auto-Init disabled, default)
AEA[7] = 0, (do not oppose IPD)
AEA[6] (PCI66) = 0, (PCI 33 MHz [default, don’t care])
AEA[5] (MCBSP1_EN) = 1, (McBSP1 enabled)
AEA[4] (SYSCLKOUT_EN) = 1, (SYSCLK4 pin function)
AEA[3] = 0, (do not oppose IPD)
AEA[2:0] (CFGGP[2:0]) = 000, (default)
Figure 3-13. Configuration Example B (2 McBSPs + HPI32 + I2C + EMIFA + DDR2 Memory Controller +
TIMERS + EMAC (GMII) + MDIO
72
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4 System Interconnect
On the C6454 device, the C64x+ Megamodule, the EDMA3 transfer controllers, and the system
peripherals are interconnected through two switch fabrics. The switch fabrics allow for low-latency,
concurrent data transfers between master peripherals and slave peripherals. The switch fabrics also allow
for seamless arbitration between the system masters when accessing system slaves.
4.1
Internal Buses, Bridges, and Switch Fabrics
Two types of buses exist in the C6454 device: data buses and configuration buses. Some C6454 device
peripherals have both a data bus and a configuration bus interface, while others only have one type of
interface. Furthermore, the bus interface width and speed varies from peripheral to peripheral.
Configuration buses are mainly used to access the register space of a peripheral and the data buses are
used mainly for data transfers. However, in some cases, the configuration bus is also used to transfer
data. For example, data is transferred to the McBSP via its configuration bus. Similarly, the data bus can
also be used to access the register space of a peripheral. For example, the EMIFA and DDR2 memory
controller registers are accessed through their data bus interface.
The C64x+ Megamodule, the EDMA3 traffic controllers, and the various system peripherals can be
classified into two categories: masters and slaves. Masters are capable of initiating read and write
transfers in the system and do not rely on the EDMA3 for their data transfers. Slaves on the other hand
rely on the EDMA3 to perform transfers to and from them. Masters include the EDMA3 traffic controllers
and PCI. Slaves include the McBSP and I2C.
The C6454 device contains two switch fabrics through which masters and slaves communicate. The data
switch fabric, known as the data switched central resource (SCR), is a high-throughput interconnect
mainly used to move data across the system (for more information, see Section 4.2). The data SCR
connects masters to slaves via 128-bit data buses running at a SYSCLK2 frequency (SYSCLK2 is
generated from PLL1 controller). Peripherals that have a 128-bit data bus interface running at this speed
can connect directly to the data SCR; other peripherals require a bridge.
The configuration switch fabric, also known as the configuration switch central resource (SCR) is mainly
used by the C64x+ Megamodule to access peripheral registers (for more information, see Section 4.3).
The configuration SCR connects C64x+ Megamodule to slaves via 32-bit configuration buses running at a
SYSCLK2 frequency (SYSCLK2 is generated from PLL1 controller). As with the data SCR, some
peripherals require the use of a bridge to interface to the configuration SCR. Note that the data SCR also
connects to the configuration SCR.
Bridges perform a variety of functions:
• Conversion between configuration bus and data bus.
• Width conversion between peripheral bus width and SCR bus width.
• Frequency conversion between peripheral bus frequency and SCR bus frequency.
For example, the EMIFA and DDR2 memory controller require a bridge to convert their 64-bit data bus
interface into a 128-bit interface so that they can connect to the data SCR.
Note that some peripherals can be accessed through the data SCR and also through the configuration
SCR.
System Interconnect
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Data Switch Fabric Connections
Figure 4-1 shows the connection between slaves and masters through the data switched central resource
(SCR). Masters are shown on the right and slaves on the left. The data SCR connects masters to slaves
via 128-bit data buses running at a SYSCLK2 frequency. SYSCLK2 is supplied by the PLL1 controller and
is fixed at a frequency equal to the CPU frequency divided by 3.
Some peripherals, like PCI and the C64x+ Megamodule, have both slave and master ports. Note that
each EDMA3 transfer controller has an independent connection to the data SCR.
Note that masters can access the configuration SCR through the data SCR. The configuration SCR is
described in Section 4.3.
Not all masters on the C6454 DSP may connect to all slaves. Allowed connections are summarized in
Table 4-1.
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EDMA3 Channel
Controller
Events
MASTER
M0
EDMA3
Transfer
Controllers
M1
M2
M3
Data SCR
128 (SYSCLK2)
S0
128 (SYSCLK2)
M
128 (SYSCLK2)
32 (SYSCLK2)
Bridge
128 (SYSCLK2)
CFG
SCR
S
McBSPs
S
PCI
S
DDR2
Memory
Controller
S
EMIFA
S
Megamodule
S3
128-bit
(SYSCLK2)
32
128
(SYSCLK3) (SYSCLK3)
M
32
(SYSCLK3)
32
(SYSCLK3)
HPI
S
S2
32 (SYSCLK3)
EMAC
128
(SYSCLK2)
S1
M
M
Bridge
32 (SYSCLK3)
Bridge
S
32 (SYSCLK3)
128 (SYSCLK2)
PCI
M
32 (SYSCLK3)
Megamodule
128 (SYSCLK2)
M
S
M
M
128
(SYSCLK2)
128
(SYSCLK2)
M
Bridge
Bridge
64
(SYSCLK2)
64
(SYSCLK2)
128 (SYSCLK2)
Configuration Bus
Data Bus
Figure 4-1. Switched Central Resource Block Diagram
System Interconnect
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Table 4-1. SCR Connection Matrix
McBSPs
CONFIGURATION SCR
PCI
DDR2 MEMORY
CONTROLLER
EMIFA
MEGAMODULE
TC0
N
N
N
Y
Y
Y
TC1
Y
Y
Y
Y
Y
Y
TC2
N
N
Y
Y
Y
Y
TC3
N
N
Y
Y
Y
Y
EMAC
N
N
N
Y
Y
Y
HPI
N
Y
N
Y
Y
Y
PCI
N
Y
N
Y
Y
Y
4.3
Configuration Switch Fabric
Figure 4-2 shows the connection between the C64x+ Megamodule and the configuration switched central
resource (SCR). The configuration SCR is mainly used by the C64x+ Megamodule to access peripheral
registers. The data SCR also has a connection to the configuration SCR which allows masters to access
most peripheral registers. The only registers not accessible by the data SCR through the configuration
SCR are the device configuration registers and the PLL1 and PLL2 controller registers; these can only be
accessed by the C64x+ Megamodule.
The configuration SCR uses 32-bit configuration buses running at SYSCLK2 frequency. SYSCLK2 is
supplied by the PLL1 controller and is fixed at a frequency equal to the CPU frequency divided by 3.
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CFG SCR
32
(SYSCLK3)
S
GPIO
S
McBSPs
S
PCI
S
I2C
S
Timers
S
HPI
S
EMAC/MDIO
S
PLL
Controllers (A)
32
(SYSCLK3)
32
(SYSCLK3)
32
(SYSCLK3)
32
(SYSCLK3)
32-bit
(SYSCLK2)
32
(SYSCLK3)
M
Bridge
7
MUX
32
(SYSCLK3)
32 (SYSCLK2)
32 (SYSCLK2)
Megamodule
M
S
32
(SYSCLK3)
Data SCR
M
32 (SYSCLK2)
S
32
(SYSCLK3)
32
(SYSCLK3)
S
Device
Configuration
Registers (A)
S
EDMA3 CC
S
EDMA3 TC0
S
EDMA3 TC1
S
EDMA3 TC2
S
EDMA3 TC3
32
(SYSCLK2)
32
(SYSCLK2)
M
32
(SYSCLK2)
MUX
32
(SYSCLK2)
32
(SYSCLK2)
32
(SYSCLK2)
Configuration Bus
Data Bus
A.
B.
Only accessible by the C64x+ Megamodule.
All clocks in this figure are generated by the PLL1 controller.
Figure 4-2. C64x+ Megamodule - SCR Connection
System Interconnect
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Bus Priorities
On the C6454 device, bus priority is programmable for each master. The register bit fields and default
priority levels for C6454 bus masters are shown in Table 4-2. The priority levels should be tuned to obtain
the best system performance for a particular application. Lower values indicate higher priorities. For some
masters, the priority values are programmed at the system level by configuring the PRI_ALLOC register.
Details on the PRI_ALLOC register are shown in Figure 4-3. The C64x+ megamodule and EDMA masters
contain registers that control their own priority values.
The priority is enforced when several masters in the system are vying for the same endpoint. Note that the
configuration SCR port on the data SCR is considered a single endpoint meaning priority will be enforced
when multiple masters try to access the configuration SCR. Priority is also enforced on the configuration
SCR side when a master (through the data SCR) tries to access the same endpoint as the C64x+
megamodule.
In the PRI_ALLOC register, the HOST field applies to the priority of the HPI and PCI peripherals. The
EMAC field specifies the priority of the EMAC peripheral.
Table 4-2. C6454 Default Bus Master Priorities
DEFAULT
PRIORITY LEVEL
BUS MASTER
PRIORITY CONTROL
EDMA3TC0
0
QUEPRI.PRIQ0 (EDMA3 register)
EDMA3TC1
0
QUEPRI.PRIQ1 (EDMA3 register)
EDMA3TC2
0
QUEPRI.PRIQ2 (EDMA3 register)
EDMA3TC3
0
QUEPRI.PRIQ3 (EDMA3 register)
EMAC
1
PRI_ALLOC.EMAC
PCI
2
PRI_ALLOC.HOST
HPI
2
PRI_ALLOC.HOST
C64x+ Megamodule (MDMA port)
7
MDMAARBE.PRI (C64x+ Megamodule
Register)
31
16
Reserved
R-0000 0000 0000 0000
15
12
11
9
8
6
5
3
2
0
Reserved
Reserved
Reserved
HOST
EMAC
R-000 0
R/W-001
R-100
R/W-010
R/W-001
LEGEND: R/W = Read/Write; R = Read only; -n = value at reset
Figure 4-3. Priority Allocation Register (PRI_ALLOC)
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5 C64x+ Megamodule
The C64x+ Megamodule consists of several components — the C64x+ CPU, the L1 program and data
memory controllers, the L2 memory controller, the internal DMA (IDMA), the interrupt controller, powerdown controller, and external memory controller. The C64x+ Megamodule also provides support for
memory protection (for L1P, L1D, and L2 memories) and bandwidth management (for resources local to
the C64x+ Megamodule). Figure 5-1 shows a block diagram of the C64x+ Megamodule.
L1P cache/SRAM
256
L1 program memory controller
256
L2
cache/
SRAM
Internal
ROM(A)
256
Cache
control
256
Cache control
Bandwidth management
Memory protection
L2 memory
controller
256
256
C64x+ CPU
Instruction fetch
SPLOOP buffer
16/32−bit instruction dispatch
Instruction decode
Data path 1
Data path 2
Bandwidth
management
Memory
protection
256
IDMA
128
L1
External memory
controller
To Chip
registers
32
256
Slave DMA
128
Master DMA
S1
M1
xx
xx
D1
D2
M2
xx
xx
A register file
Configuration
Registers
128
To primary
switch fabric
Advanced event
triggering
(AET)
256
S2
L2
B register file
64
64
L1 data memory controller
Cache control
Bandwidth management
Memory protection
Interrupt
and exception
controller
Power control
32
L1D cache/SRAM
A. When accessing the internal ROM of the DSP, the CPU frequency must always be less than 750 MHz.
Figure 5-1. 64x+ Megamodule Block Diagram
For more detailed information on the TMS320C64x+ Megamodule on the C6454 device, see the
TMS320C64x+ Megamodule Reference Guide (literature number SPRU871).
5.1
Memory Architecture
The TMS320C6454 device contains a 1024KB level-2 memory (L2), a 32KB level-1 program memory
(L1P), and a 32KB level-1 data memory (L1D).
The L1P memory configuration for the C6454 device is as follows:
• Region 0 size is 0K bytes (disabled).
• Region 1 size is 32K bytes with no wait states.
The L1D memory configuration for the C6454 device is as follows:
• Region 0 size is 0K bytes (disabled).
• Region 1 size is 32K bytes with no wait states.
C64x+ Megamodule
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L1D is a two-way set-associative cache while L1P is a direct-mapped cache.
The L1P and L1D cache can be reconfigured via software through the L1PMODE field of the L1P
Configuration Register (L1PMODE) and the L1DMODE field of the L1D Configuration Register (L1DCFG)
of the C64x+ Megamodule. After device reset, L1P and L1D cache are configured as all cache or all
SRAM. The on-chip Bootloader changes the reset configuration for L1P and L1D. For more information,
see the TMS320C645x Bootloader User's Guide (literature number SPRUEC6).
Figure 5-2 and Figure 5-3 show the available SRAM/cache configurations for L1P and L1D, respectively.
L1P mode bits
000
001
010
011
100
1/2
SRAM
All
SRAM
7/8
SRAM
L1P memory
Block base
address
00E0 0000h
16K bytes
3/4
SRAM
direct
mapped
cache
00E0 4000h
8K bytes
dm
cache
direct
mapped
cache
direct
mapped
cache
00E0 6000h
4K bytes
00E0 7000h
4K bytes
00E0 8000h
Figure 5-2. TMS320C6454 L1P Memory Configurations
L1D mode bits
000
001
010
011
100
1/2
SRAM
All
SRAM
7/8
SRAM
L1D memory
Block base
address
00F0 0000h
16K bytes
3/4
SRAM
2-way
cache
00F0 4000h
8K bytes
2-way
cache
00F0 6000h
4K bytes
2-way
cache
2-way
cache
00F0 7000h
4K bytes
00F0 8000h
Figure 5-3. TMS320C6454 L1D Memory Configurations
The L2 memory configuration for the C6454 device is as follows:
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Port 0 configuration:
– Memory size is 1024KB
– Starting address is 0080 0000h
– 2-cycle latency
– 4 × 128-bit bank configuration
Port 1 configuration:
– Memory size is 32K bytes (this corresponds to the internal ROM)
– Starting address is 0010 0000h
– 1-cycle latency
– 1 × 256-bit bank configuration
L2 memory can be configured as all SRAM or as part 4-way set-associative cache. The amount of L2
memory that is configured as cache is controlled through the L2MODE field of the L2 Configuration
Register (L2CFG) of the C64x+ Megamodule. Figure 5-4 shows the available SRAM/cache configurations
for L2. By default, L2 is configured as all SRAM after device reset.
L2 mode bits
000
001
010
011
111
L2 memory
Block base
address
0080 0000h
3/4
SRAM
All
SRAM
31/32
SRAM
15/16
SRAM
792K bytes
7/8
SRAM
008C 0000h
128K bytes
4-way
cache
008E 0000h
64K bytes
4-way
4-way
cache
4-way
cache
32K bytes
008F 0000h
32K bytes
008F 8000h
0090 0000h
Figure 5-4. TMS320C6454 L2 Memory Configurations
For more information on the operation L1 and L2 caches, see the TMS320C64x+ DSP Cache User's
Guide (literature number SPRU862).
All memory on the C6454 device has a unique location in the memory map (see Table 2-2).
When accessing the internal ROM of the DSP, the CPU frequency must always be less than 750 MHz.
Therefore, when using a software boot mode, care must be taken such that the CPU frequency does not
exceed 750 MHz at any point during the boot sequence. After the boot sequence has completed, the CPU
frequency can be programmed to the frequency required by the application. For more detailed information
ont he boot modes, see Section 2.4, Boot Sequence.
5.2
Memory Protection
Memory protection allows an operating system to define who or what is authorized to access L1D, L1P,
and L2 memory. To accomplish this, the L1D, L1P, and L2 memories are divided into pages. There are 16
pages of L1P (2KB each), 16 pages of L1D (2KB each), and 16 pages of L2 (64KB each). The L1D, L1P,
and L2 memory controllers in the C64x+ Megamodule are equipped with a set of registers that specify the
permissions for each memory page.
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Each page may be assigned with fully orthogonal user and supervisor read, write, and execute
permissions. Additionally, a page may be marked as either (or both) locally or globally accessible. A local
access is a direct CPU access to L1D, L1P, and L2, while a global access is initiated by a DMA (either
IDMA or the EDMA3) or by other system masters. Note that EDMA or IDMA transfers programmed by the
CPU count as global accesses.
The CPU and the system masters on the C6454 device are all assigned a privilege ID of 0. Therefore it is
only possible to specify whether memory pages are locally or globally accessible. The AID0 and LOCAL
bits of the memory protection page attribute registers specify the memory page protection scheme, see
Table 5-1.
Table 5-1. Available Memory Page Protection Schemes
AID0 Bit
LOCAL Bit
0
0
Description
No access to memory page is permitted.
0
1
Only direct access by CPU is permitted.
1
0
Only accesses by system masters and IDMA are permitted (includes EDMA and IDMA
accesses initiated by the CPU).
1
1
All accesses permitted
For more information on memory protection for L1D, L1P, and L2, see the TMS320C64x+ Megamodule
Reference Guide (literature number SPRU871).
5.3
Bandwidth Management
When multiple requestors contend for a single C64x+ Megamodule resource, the conflict is solved by
granting access to the highest priority requestor. The following four resources are managed by the
Bandwidth Management control hardware:
• Level 1 Program (L1P) SRAM/Cache
• Level 1 Data (L1D) SRAM/Cache
• Level 2 (L2) SRAM/Cache
• Memory-mapped registers configuration bus
The priority level for operations initiated within the C64x+ Megamodule; e.g., CPU-initiated transfers, userprogrammed cache coherency operations, and IDMA-initiated transfers, are declared through registers in
the C64x+ Megamodule. The priority level for operations initiated outside the C64x+ Megamodule by
system peripherals is declared through the Priority Allocation Register (PRI_ALLOC), see Section 4.4.
System peripherals with no fields in PRI_ALLOC have their own registers to program their priorities.
More information on the bandwidth management features of the C64x+ Megamodule can be found in the
TMS320C64x+ Megamodule Reference Guide (literature number SPRU871).
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Power-Down Control
The C64x+ Megamodule supports the ability to power-down various parts of the C64x+ Megamodule. The
power-down controller (PDC) of the C64x+ Megamodule can be used to power down L1P, the cache
control hardware, the CPU, and the entire C64x+ Megamodule. These power-down features can be used
to design systems for lower overall system power requirements.
NOTE
The C6454 device does not support power-down modes for the L2 memory at this time.
More information on the power-down features of the C64x+ Megamodule can be found in the
TMS320C64x+ Megamodule Reference Guide (literature number SPRU871).
5.5
Megamodule Resets
Table 5-2 shows the reset types supported on the C6454 device and they affect the resetting of the
Megamodule, either both globally or just locally.
Table 5-2. Megamodule Reset (Global or Local)
GLOBAL
MEGAMODULE
RESET
LOCAL
MEGAMODULE
RESET
Power-On Reset
Y
Y
Warm Reset
Y
Y
System Reset
Y
Y
CPU Reset
N
Y
RESET TYPE
For more detailed information on the global and local megamodule resets, see the TMS320C64x+
Megamodule Reference Guide (literature number SPRU871) and for more detailed information on device
resets, see Section 7.6, Reset Controller.
C64x+ Megamodule
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Megamodule Revision
The version and revision of the C64x+ Megamodule can be read from the Megamodule Revision ID
Register (MM_REVID) located at address 0181 2000h. The MM_REVID register is shown in Figure 5-5
and described in Table 5-3. The C64x+ Megamodule revision is dependant on the silicon revision being
used. For more information, see the TMS320C6455/54 Digital Signal Processor Silicon Errata (literature
number SPRZ234).
31
16 15
0
VERSION
REVISION(A)
R-1h
R-n
LEGEND: R = Read only; -n = value after reset
A.
The C64x+ Megamodule revision is dependant on the silicon revision being used. For more information, see
the TMS320C6455/54 Digital Signal Processor Silicon Errata (literature number SPRZ234).
Figure 5-5. Megamodule Revision ID Register (MM_REVID) [Hex Address: 0181 2000h]
Table 5-3. Megamodule Revision ID Register (MM_REVID) Field Descriptions
Bit
Field
31:16
VERSION
15:0
REVISION
84
Value
1h
Description
Version of the C64x+ Megamodule implemented on the device. This field is always read as 1h.
Revision of the C64x+ Megamodule version implemented on the device. The C64x+ Megamodule
revision is dependant on the silicon revision being used. For more information, see the
TMS320C6455/54 Digital Signal Processor Silicon Errata (literature number SPRZ234).
C64x+ Megamodule
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C64x+ Megamodule Register Descriptions
Table 5-4. Megamodule Interrupt Registers
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
0180 0000
EVTFLAG0
Event Flag Register 0 (Events [31:0])
0180 0004
EVTFLAG1
Event Flag Register 1
0180 0008
EVTFLAG2
Event Flag Register 2
0180 000C
EVTFLAG3
Event Flag Register 3
0180 0010 - 0180 001C
-
0180 0020
EVTSET0
Reserved
Event Set Register 0 (Events [31:0])
0180 0024
EVTSET1
Event Set Register 1
0180 0028
EVTSET2
Event Set Register 2
0180 002C
EVTSET3
Event Set Register 3
0180 0030 - 0180 003C
-
0180 0040
EVTCLR0
Event Clear Register 0 (Events [31:0])
0180 0044
EVTCLR1
Event Clear Register 1
0180 0048
EVTCLR2
Event Clear Register 2
0180 004C
EVTCLR3
Event Clear Register 3
Reserved
0180 0050 - 0180 007C
-
0180 0080
EVTMASK0
Reserved
Event Mask Register 0 (Events [31:0])
0180 0084
EVTMASK1
Event Mask Register 1
0180 0088
EVTMASK2
Event Mask Register 2
0180 008C
EVTMASK3
Event Mask Register 3
0180 0090 - 0180 009C
-
0180 00A0
MEVTFLAG0
Masked Event Flag Status Register 0 (Events [31:0])
0180 00A4
MEVTFLAG1
Masked Event Flag Status Register 1
0180 00A8
MEVTFLAG2
Masked Event Flag Status Register 2
0180 00AC
MEVTFLAG3
Masked Event Flag Status Register 3
Reserved
0180 00B0 - 0180 00BC
-
0180 00C0
EXPMASK0
Reserved
Exception Mask Register 0 (Events [31:0])
0180 00C4
EXPMASK1
Exception Mask Register 1
0180 00C8
EXPMASK2
Exception Mask Register 2
0180 00CC
EXPMASK3
Exception Mask Register 3
0180 00D0 - 0180 00DC
-
0180 00E0
MEXPFLAG0
Masked Exception Flag Register 0
0180 00E4
MEXPFLAG1
Masked Exception Flag Register 1
0180 00E8
MEXPFLAG2
Masked Exception Flag Register 2
0180 00EC
MEXPFLAG3
Masked Exception Flag Register 3
0180 00F0 - 0180 00FC
-
Reserved
0180 0100
-
Reserved
0180 0104
INTMUX1
Interrupt Multiplexor Register 1
Reserved
0180 0108
INTMUX2
Interrupt Multiplexor Register 2
0180 010C
INTMUX3
Interrupt Multiplexor Register 3
0180 0110 - 0180 013C
-
0180 0140
AEGMUX0
Advanced Event Generator Mux Register 0
0180 0144
AEGMUX1
Advanced Event Generator Mux Register 1
0180 0148 - 0180 017C
-
0180 0180
INTXSTAT
Interrupt Exception Status Register
0180 0184
INTXCLR
Interrupt Exception Clear Register
Reserved
Reserved
C64x+ Megamodule
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Table 5-4. Megamodule Interrupt Registers (continued)
HEX ADDRESS RANGE
ACRONYM
0180 0188
INTDMASK
0180 0188 - 0180 01BC
-
0180 01C0
EVTASRT
0180 01C4 - 0180 FFFF
-
REGISTER NAME
Dropped Interrupt Mask Register
Reserved
Event Asserting Register
Reserved
Table 5-5. Megamodule Powerdown Control Registers
HEX ADDRESS RANGE
ACRONYM
0181 0000
PDCCMD
0181 0004 - 0181 1FFF
-
REGISTER NAME
Power-down controller command register
Reserved
Table 5-6. Megamodule Revision Register
HEX ADDRESS RANGE
ACRONYM
0181 2000
MM_REVID
0181 2004 - 0181 2FFF
-
REGISTER NAME
Megamodule Revision ID Register
Reserved
Table 5-7. Megamodule IDMA Registers
HEX ADDRESS RANGE
86
ACRONYM
REGISTER NAME
0182 0000
IDMA0STAT
IDMA Channel 0 Status Register
0182 0004
IDMA0MASK
IDMA Channel 0 Mask Register
0182 0008
IMDA0SRC
IDMA Channel 0 Source Address Register
0182 000C
IDMA0DST
IDMA Channel 0 Destination Address Register
IDMA Channel 0 Count Register
0182 0010
IDMA0CNT
0182 0014 - 0182 00FC
-
0182 0100
IDMA1STAT
Reserved
IDMA Channel 1 Status Register
0182 0104
-
0182 0108
IMDA1SRC
Reserved
IDMA Channel 1 Source Address Register
0182 010C
IDMA1DST
IDMA Channel 1 Destination Address Register
IDMA Channel 1 Count Register
0182 0110
IDMA1CNT
0182 0114 - 0182 017C
-
Reserved
0182 0180
-
Reserved
0182 0184 - 0182 01FF
-
Reserved
C64x+ Megamodule
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Table 5-8. Megamodule Cache Configuration Registers
HEX ADDRESS RANGE
ACRONYM
0184 0000
L2CFG
REGISTER NAME
L2 Cache Configuration Register
0184 0004 - 0184 001F
-
0184 0020
L1PCFG
Reserved
L1P Configuration Register
L1P Cache Control Register
0184 0024
L1PCC
0184 0028 - 0184 003F
-
0184 0040
L1DCFG
L1D Configuration Register
L1D Cache Control Register
Reserved
0184 0044
L1DCC
0184 0048 - 0184 0FFF
-
Reserved
0184 1000 - 0184 104F
-
See Table 5-10, CPU Megamodule Bandwidth Management Registers
0184 1050 - 0184 3FFF
-
Reserved
0184 4000
L2WBAR
L2 Writeback Base Address Register - for Block Writebacks
0184 4004
L2WWC
L2 Writeback Word Count Register
0184 4008 - 0184 400C
-
0184 4010
L2WIBAR
L2 Writeback and Invalidate Base Address Register - for Block Writebacks
0184 4014
L2WIWC
L2 Writeback and Invalidate word count register
0184 4018
L2IBAR
L2 Invalidate Base Address Register
0184 401C
L2IWC
L2 Invalidate Word Count Register
0184 4020
L1PIBAR
L1P Invalidate Base Address Register
0184 4024
L1PIWC
L1P Invalidate Word Count Register
0184 4030
L1DWIBAR
L1D Writeback and Invalidate Base Address Register
0184 4034
L1DWIWC
L1D Writeback and Invalidate Word Count Register
0184 4038
-
0184 4040
L1DWBAR
L1D Writeback Base Address Register - for Block Writebacks
0184 4044
L1DWWC
L1D Writeback Word Count Register
0184 4048
L1DIBAR
L1D Invalidate Base Address Register
0184 404C
L1DIWC
L1D Invalidate Word Count Register
Reserved
Reserved
0184 4050 - 0184 4FFF
-
0184 5000
L2WB
Reserved
0184 5004
L2WBINV
0184 5008
L2INV
0184 500C - 0184 5024
-
0184 5028
L1PINV
0184 502C - 0184 503C
-
L2 Global Writeback Register
L2 Global Writeback and Invalidate Register
L2 Global Invalidate Register
Reserved
L1P Global Invalidate Register
Reserved
0184 5040
L1DWB
0184 5044
L1DWBINV
0184 5048
L1DINV
L1D Global Writeback Register
L1D Global Writeback and Invalidate Register
L1D Global Invalidate Register
0184 504C - 0184 7FFF
-
Reserved
0184 8000 - 0184 81FC
MAR0 to
MAR127
Reserved
0184 8200 - 0184 823C
MAR128 to
MAR143
Reserved
0184 8240 - 0184 827C
MAR144 to
MAR159
Reserved
0184 8280
MAR160
Controls EMIFA CE2 Range A000 0000 - A0FF FFFF
0184 8284
MAR161
Controls EMIFA CE2 Range A100 0000 - A1FF FFFF
0184 8288
MAR162
Controls EMIFA CE2 Range A200 0000 - A2FF FFFF
0184 828C
MAR163
Controls EMIFA CE2 Range A300 0000 - A3FF FFFF
0184 8290
MAR164
Controls EMIFA CE2 Range A400 0000 - A4FF FFFF
C64x+ Megamodule
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Table 5-8. Megamodule Cache Configuration Registers (continued)
88
HEX ADDRESS RANGE
ACRONYM
0184 8294
MAR165
Controls EMIFA CE2 Range A500 0000 - A5FF FFFF
REGISTER NAME
0184 8298
MAR166
Controls EMIFA CE2 Range A600 0000 - A6FF FFFF
0184 829C
MAR167
Controls EMIFA CE2 Range A700 0000 - A7FF FFFF
0184 82A0
MAR168
Controls EMIFA CE2 Range A800 0000 - A8FF FFFF
0184 82A4
MAR169
Controls EMIFA CE2 Range A900 0000 - A9FF FFFF
0184 82A8
MAR170
Controls EMIFA CE2 Range AA00 0000 - AAFF FFFF
0184 82AC
MAR171
Controls EMIFA CE2 Range AB00 0000 - ABFF FFFF
0184 82B0
MAR172
Controls EMIFA CE2 Range AC00 0000 - ACFF FFFF
0184 82B4
MAR173
Controls EMIFA CE2 Range AD00 0000 - ADFF FFFF
0184 82B8
MAR174
Controls EMIFA CE2 Range AE00 0000 - AEFF FFFF
0184 82BC
MAR175
Controls EMIFA CE2 Range AF00 0000 - AFFF FFFF
0184 82C0
MAR176
Controls EMIFA CE3 Range B000 0000 - B0FF FFFF
0184 82C4
MAR177
Controls EMIFA CE3 Range B100 0000 - B1FF FFFF
0184 82C8
MAR178
Controls EMIFA CE3 Range B200 0000 - B2FF FFFF
0184 82CC
MAR179
Controls EMIFA CE3 Range B300 0000 - B3FF FFFF
0184 82D0
MAR180
Controls EMIFA CE3 Range B400 0000 - B4FF FFFF
0184 82D4
MAR181
Controls EMIFA CE3 Range B500 0000 - B5FF FFFF
0184 82D8
MAR182
Controls EMIFA CE3 Range B600 0000 - B6FF FFFF
0184 82DC
MAR183
Controls EMIFA CE3 Range B700 0000 - B7FF FFFF
0184 82E0
MAR184
Controls EMIFA CE3 Range B800 0000 - B8FF FFFF
0184 82E4
MAR185
Controls EMIFA CE3 Range B900 0000 - B9FF FFFF
0184 82E8
MAR186
Controls EMIFA CE3 Range BA00 0000 - BAFF FFFF
0184 82EC
MAR187
Controls EMIFA CE3 Range BB00 0000 - BBFF FFFF
0184 82F0
MAR188
Controls EMIFA CE3 Range BC00 0000 - BCFF FFFF
0184 82F4
MAR189
Controls EMIFA CE3 Range BD00 0000 - BDFF FFFF
0184 82F8
MAR190
Controls EMIFA CE3 Range BE00 0000 - BEFF FFFF
0184 82FC
MAR191
Controls EMIFA CE3 Range BF00 0000 - BFFF FFFF
0184 8300
MAR192
Controls EMIFA CE4 Range C000 0000 - C0FF FFFF
0184 8304
MAR193
Controls EMIFA CE4 Range C100 0000 - C1FF FFFF
0184 8308
MAR194
Controls EMIFA CE4 Range C200 0000 - C2FF FFFF
0184 830C
MAR195
Controls EMIFA CE4 Range C300 0000 - C3FF FFFF
0184 8310
MAR196
Controls EMIFA CE4 Range C400 0000 - C4FF FFFF
0184 8314
MAR197
Controls EMIFA CE4 Range C500 0000 - C5FF FFFF
0184 8318
MAR198
Controls EMIFA CE4 Range C600 0000 - C6FF FFFF
0184 831C
MAR199
Controls EMIFA CE4 Range C700 0000 - C7FF FFFF
0184 8320
MAR200
Controls EMIFA CE4 Range C800 0000 - C8FF FFFF
0184 8324
MAR201
Controls EMIFA CE4 Range C900 0000 - C9FF FFFF
0184 8328
MAR202
Controls EMIFA CE4 Range CA00 0000 - CAFF FFFF
0184 832C
MAR203
Controls EMIFA CE4 Range CB00 0000 - CBFF FFFF
0184 8330
MAR204
Controls EMIFA CE4 Range CC00 0000 - CCFF FFFF
0184 8334
MAR205
Controls EMIFA CE4 Range CD00 0000 - CDFF FFFF
0184 8338
MAR206
Controls EMIFA CE4 Range CE00 0000 - CEFF FFFF
0184 833C
MAR207
Controls EMIFA CE4 Range CF00 0000 - CFFF FFFF
0184 8340
MAR208
Controls EMIFA CE5 Range D000 0000 - D0FF FFFF
0184 8344
MAR209
Controls EMIFA CE5 Range D100 0000 - D1FF FFFF
0184 8348
MAR210
Controls EMIFA CE5 Range D200 0000 - D2FF FFFF
0184 834C
MAR211
Controls EMIFA CE5 Range D300 0000 - D3FF FFFF
C64x+ Megamodule
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Table 5-8. Megamodule Cache Configuration Registers (continued)
HEX ADDRESS RANGE
ACRONYM
0184 8350
MAR212
Controls EMIFA CE5 Range D400 0000 - D4FF FFFF
REGISTER NAME
0184 8354
MAR213
Controls EMIFA CE5 Range D500 0000 - D5FF FFFF
0184 8358
MAR214
Controls EMIFA CE5 Range D600 0000 - D6FF FFFF
0184 835C
MAR215
Controls EMIFA CE5 Range D700 0000 - D7FF FFFF
0184 8360
MAR216
Controls EMIFA CE5 Range D800 0000 - D8FF FFFF
0184 8364
MAR217
Controls EMIFA CE5 Range D900 0000 - D9FF FFFF
0184 8368
MAR218
Controls EMIFA CE5 Range DA00 0000 - DAFF FFFF
0184 836C
MAR219
Controls EMIFA CE5 Range DB00 0000 - DBFF FFFF
0184 8370
MAR220
Controls EMIFA CE5 Range DC00 0000 - DCFF FFFF
0184 8374
MAR221
Controls EMIFA CE5 Range DD00 0000 - DDFF FFFF
0184 8378
MAR222
Controls EMIFA CE5 Range DE00 0000 - DEFF FFFF
0184 837C
MAR223
Controls EMIFA CE5 Range DF00 0000 - DFFF FFFF
0184 8380
MAR224
Controls DDR2 CE0 Range E000 0000 - E0FF FFFF
0184 8384
MAR225
Controls DDR2 CE0 Range E100 0000 - E1FF FFFF
0184 8388
MAR226
Controls DDR2 CE0 Range E200 0000 - E2FF FFFF
0184 838C
MAR227
Controls DDR2 CE0 Range E300 0000 - E3FF FFFF
0184 8390
MAR228
Controls DDR2 CE0 Range E400 0000 - E4FF FFFF
0184 8394
MAR229
Controls DDR2 CE0 Range E500 0000 - E5FF FFFF
0184 8398
MAR230
Controls DDR2 CE0 Range E600 0000 - E6FF FFFF
0184 839C
MAR231
Controls DDR2 CE0 Range E700 0000 - E7FF FFFF
0184 83A0
MAR232
Controls DDR2 CE0 Range E800 0000 - E8FF FFFF
0184 83A4
MAR233
Controls DDR2 CE0 Range E900 0000 - E9FF FFFF
0184 83A8
MAR234
Controls DDR2 CE0 Range EA00 0000 - EAFF FFFF
0184 83AC
MAR235
Controls DDR2 CE0 Range EB00 0000 - EBFF FFFF
0184 83B0
MAR236
Controls DDR2 CE0 Range EC00 0000 - ECFF FFFF
0184 83B4
MAR237
Controls DDR2 CE0 Range ED00 0000 - EDFF FFFF
0184 83B8
MAR238
Controls DDR2 CE0 Range EE00 0000 - EEFF FFFF
0184 83BC
MAR239
Controls DDR2 CE0 Range EF00 0000 - EFFF FFFF
0184 83C0 -0184 83FC
MAR240 to
MAR255
Reserved
Table 5-9. Megamodule L1/L2 Memory Protection Registers
HEX ADDRESS RANGE
ACRONYM
0184 A000
L2MPFAR
L2 memory protection fault address register
REGISTER NAME
0184 A004
L2MPFSR
L2 memory protection fault status register
0184 A008
L2MPFCR
L2 memory protection fault command register
0184 A00C - 0184 A0FF
-
0184 A100
L2MPLK0
L2 memory protection lock key bits [31:0]
0184 A104
L2MPLK1
L2 memory protection lock key bits [63:32]
0184 A108
L2MPLK2
L2 memory protection lock key bits [95:64]
0184 A10C
L2MPLK3
L2 memory protection lock key bits [127:96]
Reserved
0184 A110
L2MPLKCMD
L2 memory protection lock key command register
0184 A114
L2MPLKSTAT
L2 memory protection lock key status register
0184 A118 - 0184 A1FF
-
0184 A200
L2MPPA0
L2 memory protection page attribute register 0
0184 A204
L2MPPA1
L2 memory protection page attribute register 1
0184 A208
L2MPPA2
L2 memory protection page attribute register 2
Reserved
C64x+ Megamodule
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Table 5-9. Megamodule L1/L2 Memory Protection Registers (continued)
(1)
(2)
90
HEX ADDRESS RANGE
ACRONYM
0184 A20C
L2MPPA3
L2 memory protection page attribute register 3
REGISTER NAME
0184 A210
L2MPPA4
L2 memory protection page attribute register 4
0184 A214
L2MPPA5
L2 memory protection page attribute register 5
0184 A218
L2MPPA6
L2 memory protection page attribute register 6
0184 A21C
L2MPPA7
L2 memory protection page attribute register 7
0184 A220
L2MPPA8
L2 memory protection page attribute register 8
0184 A224
L2MPPA9
L2 memory protection page attribute register 9
0184 A228
L2MPPA10
L2 memory protection page attribute register 10
0184 A22C
L2MPPA11
L2 memory protection page attribute register 11
0184 A230
L2MPPA12
L2 memory protection page attribute register 12
0184 A234
L2MPPA13
L2 memory protection page attribute register 13
0184 A238
L2MPPA14
L2 memory protection page attribute register 14
0184 A23C
L2MPPA15
L2 memory protection page attribute register 15
0184 A240
L2MPPA16
L2 memory protection page attribute register 16
0184 A244
L2MPPA17
L2 memory protection page attribute register 17
0184 A248
L2MPPA18
L2 memory protection page attribute register 18
0184 A24C
L2MPPA19
L2 memory protection page attribute register 19
0184 A250
L2MPPA20
L2 memory protection page attribute register 20
0184 A254
L2MPPA21
L2 memory protection page attribute register 21
0184 A258
L2MPPA22
L2 memory protection page attribute register 22
0184 A25C
L2MPPA23
L2 memory protection page attribute register 23
0184 A260
L2MPPA24
L2 memory protection page attribute register 24
0184 A264
L2MPPA25
L2 memory protection page attribute register 25
0184 A268
L2MPPA26
L2 memory protection page attribute register 26
0184 A26C
L2MPPA27
L2 memory protection page attribute register 27
0184 A270
L2MPPA28
L2 memory protection page attribute register 28
0184 A274
L2MPPA29
L2 memory protection page attribute register 29
0184 A278
L2MPPA30
L2 memory protection page attribute register 30
0184 A27C
L2MPPA31
L2 memory protection page attribute register 31
0184 A280 - 0184 A2FC (1)
-
Reserved
0184 0300 - 0184 A3FF
-
Reserved
0184 A400
L1PMPFAR
L1 program (L1P) memory protection fault address register
0184 A404
L1PMPFSR
L1P memory protection fault status register
0184 A408
L1PMPFCR
L1P memory protection fault command register
0184 A40C - 0184 A4FF
-
0184 A500
L1PMPLK0
Reserved
L1P memory protection lock key bits [31:0]
0184 A504
L1PMPLK1
L1P memory protection lock key bits [63:32]
0184 A508
L1PMPLK2
L1P memory protection lock key bits [95:64]
0184 A50C
L1PMPLK3
L1P memory protection lock key bits [127:96]
0184 A510
L1PMPLKCMD
L1P memory protection lock key command register
0184 A514
L1PMPLKSTAT
L1P memory protection lock key status register
0184 A518 - 0184 A5FF
-
Reserved
0184 A600 - 0184 A63C (2)
-
Reserved
0184 A640
L1PMPPA16
L1P memory protection page attribute register 16
These addresses correspond to the L2 memory protection page attribute registers 32-63 (L2MPPA32-L2MPPA63) of the C64x+
megamaodule. These registers are not supported for the C6454 device.
These addresses correspond to the L1P memory protection page attribute registers 0-15 (L1PMPPA0-L1PMPPA15) of the C64x+
megamaodule. These registers are not supported for the C6454 device.
C64x+ Megamodule
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Table 5-9. Megamodule L1/L2 Memory Protection Registers (continued)
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
0184 A644
L1PMPPA17
L1P memory protection page attribute register 17
0184 A648
L1PMPPA18
L1P memory protection page attribute register 18
0184 A64C
L1PMPPA19
L1P memory protection page attribute register 19
0184 A650
L1PMPPA20
L1P memory protection page attribute register 20
0184 A654
L1PMPPA21
L1P memory protection page attribute register 21
0184 A658
L1PMPPA22
L1P memory protection page attribute register 22
0184 A65C
L1PMPPA23
L1P memory protection page attribute register 23
0184 A660
L1PMPPA24
L1P memory protection page attribute register 24
0184 A664
L1PMPPA25
L1P memory protection page attribute register 25
0184 A668
L1PMPPA26
L1P memory protection page attribute register 26
0184 A66C
L1PMPPA27
L1P memory protection page attribute register 27
0184 A670
L1PMPPA28
L1P memory protection page attribute register 28
0184 A674
L1PMPPA29
L1P memory protection page attribute register 29
0184 A678
L1PMPPA30
L1P memory protection page attribute register 30
L1P memory protection page attribute register 31
0184 A67C
L1PMPPA31
0184 A680 - 0184 ABFF
-
0184 AC00
L1DMPFAR
L1 data (L1D) memory protection fault address register
0184 AC04
L1DMPFSR
L1D memory protection fault status register
0184 AC08
L1DMPFCR
L1D memory protection fault command register
0184 AC0C - 0184 ACFF
-
0184 AD00
L1DMPLK0
L1D memory protection lock key bits [31:0]
0184 AD04
L1DMPLK1
L1D memory protection lock key bits [63:32]
0184 AD08
L1DMPLK2
L1D memory protection lock key bits [95:64]
0184 AD0C
L1DMPLK3
L1D memory protection lock key bits [127:96]
Reserved
0184 AD10
L1DMPLKCMD
L1D memory protection lock key command register
0184 AD14
L1DMPLKSTAT
L1D memory protection lock key status register
0184 AD18 - 0184 ADFF
-
Reserved
-
Reserved
0184 AE00 - 0184 AE3C
(3)
Reserved
(3)
0184 AE40
L1DMPPA16
L1D memory protection page attribute register 16
0184 AE44
L1DMPPA17
L1D memory protection page attribute register 17
0184 AE48
L1DMPPA18
L1D memory protection page attribute register 18
0184 AE4C
L1DMPPA19
L1D memory protection page attribute register 19
0184 AE50
L1DMPPA20
L1D memory protection page attribute register 20
0184 AE54
L1DMPPA21
L1D memory protection page attribute register 21
0184 AE58
L1DMPPA22
L1D memory protection page attribute register 22
0184 AE5C
L1DMPPA23
L1D memory protection page attribute register 23
0184 AE60
L1DMPPA24
L1D memory protection page attribute register 24
0184 AE64
L1DMPPA25
L1D memory protection page attribute register 25
0184 AE68
L1DMPPA26
L1D memory protection page attribute register 26
0184 AE6C
L1DMPPA27
L1D memory protection page attribute register 27
0184 AE70
L1DMPPA28
L1D memory protection page attribute register 28
0184 AE74
L1DMPPA29
L1D memory protection page attribute register 29
0184 AE78
L1DMPPA30
L1D memory protection page attribute register 30
0184 AE7C
L1DMPPA31
L1D memory protection page attribute register 31
0184 AE80 - 0185 FFFF
-
Reserved
These addresses correspond to the L1D memory protection page attribute registers 0-15 (L1DMPPA0-L1DMPPA15) of the C64x+
megamaodule. These registers are not supported for the C6454 device.
C64x+ Megamodule
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Table 5-10. CPU Megamodule Bandwidth Management Registers
HEX ADDRESS RANGE
ACRONYM
0182 0200
EMCCPUARBE
EMC CPU Arbitration Control Register
REGISTER NAME
0182 0204
EMCIDMAARBE
EMC IDMA Arbitration Control Register
0182 0208
EMCSDMAARBE EMC Slave DMA Arbitration Control Register
0182 020C
EMCMDMAARBE EMC Master DMA Arbitration Control Resgiter
0182 0210 - 0182 02FF
-
0184 1000
L2DCPUARBU
Reserved
L2D CPU Arbitration Control Register
0184 1004
L2DIDMAARBU
L2D IDMA Arbitration Control Register
0184 1008
L2DSDMAARBU
L2D Slave DMA Arbitration Control Register
0184 100C
L2DUCARBU
L2D User Coherence Arbitration Control Resgiter
0184 1010 - 0184 103F
-
0184 1040
L1DCPUARBD
Reserved
L1D CPU Arbitration Control Register
0184 1044
L1DIDMAARBD
L1D IDMA Arbitration Control Register
0184 1048
L1DSDMAARBD
L1D Slave DMA Arbitration Control Register
0184 104C
L1DUCARBD
L1D User Coherence Arbitration Control Resgiter
Table 5-11. Device Configuration Registers (Chip-Level Registers)
HEX ADDRESS RANGE
92
ACRONYM
REGISTER NAME
COMMENTS
Device Status Register
Read-only. Provides status of the
user's device configuration on reset.
Priority Allocation Register
Sets priority for Master peripherals
JTAG and BSDL Identification
Register
Read-only. Provides 32-bit JTAG ID of
the device.
02A8 0000
DEVSTAT
02A8 0004
PRI_ALLOC
02A8 0008
JTAGID
02A8 000C - 02AB FFFF
-
Reserved
02AC 0000
-
Reserved
02AC 0004
PERLOCK
Peripheral Lock Register
02AC 0008
PERCFG0
Peripheral Configuration Register 0
02AC 000C
-
Reserved
02AC 0010
-
Reserved
02AC 0014
PERSTAT0
Peripheral Status Register 0
02AC 0018
PERSTAT1
Peripheral Status Register 1
02AC 001C - 02AC 001F
-
02AC 0020
EMACCFG
Reserved
02AC 0024 - 02AC 002B
-
EMAC Configuration Register
Reserved
02AC 002C
PERCFG1
02AC 0030 - 02AC 0053
-
02AC 0054
EMUBUFPD
02AC 0058
-
Peripheral Configuration Register 1
Reserved
Emulator Buffer Powerdown Register
Reserved
C64x+ Megamodule
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6 Device Operating Conditions
6.1
Absolute Maximum Ratings Over Operating Case Temperature Range (Unless
Otherwise Noted) (1)
Supply voltage range:
CVDD
(2)
DVDD33
-0.5 V to 1.5 V
(2)
-0.5 V to 4.2 V
DVDD15, DVDD18, AVDLL1, AVDLL2
(2)
-0.5 V to 2.5 V
PLLV1, PLLV2 (2)
Input voltage (VI) range:
Output voltage (VO) range:
Operating case temperature range, TC:
-0.5 V to 2.5 V
3.3-V pins (except PCI-capable pins)
-0.5 V to DVDD33 + 0.5 V
PCI-capable pins
-0.5 V to DVDD33 + 0.5 V
RGMII pins
-0.5 V to 2.5 V
DDR2 memory controller pins
-0.5 V to 2.5 V
3.3-V pins (except PCI-capable pins)
-0.5 V to DVDD33 + 0.5 V
PCI-capable pins
-0.5 V to DVDD33 + 0.5 V
RGMII pins
-0.5 V to 2.5 V
DDR2 memory controller pins
-0.5 V to 2.5 V
(default)
0°C to 90°C
(A version) [A-1000 device]
-40°C to 105°C
Storage temperature range, Tstg
(1)
(2)
-65°C to 150°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to VSS.
6.2
Recommended Operating Conditions
MIN
NOM
A-1000/-1000
1.2125
1.25
1.2875
MAX UNIT
V
-850
-720
1.1640
1.20
1.2360
V
CVDD
Supply voltage, Core
DVDD33
Supply voltage, I/O
3.14
3.3
3.46
V
DVDD18
Supply voltage, I/O
1.71
1.8
1.89
V
AVDLL1
Supply voltage, I/O
1.71
1.8
1.89
V
AVDLL2
Supply voltage, I/O
1.71
1.8
1.89
V
VREFSSTL
Reference voltage
0.49DVDD18
0.50DVDD18
0.51DVDD18
V
DVDD15
Supply voltage, I/O
[required only for EMAC RGMII]
1.8-V operation
1.71
1.8
1.89
V
1.5-V operation
1.43
1.5
1.57
V
1.8-V operation
0.855
0.9
0.945
V
1.5-V operation
0.713
0.75
0.787
V
1.71
1.8
1.89
V
0
0
0
V
VREFHSTL
Reference voltage
PLLV1,
PLLV2
Supply voltage, PLL
VSS
Supply ground
Device Operating Conditions
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Recommended Operating Conditions (continued)
MIN
3.3 V pins (except
PCI-capable and
I2C pins)
PCI-capable
pins (1)
VIH
High-level input voltage
I2C pins
RGMII pins
DDR2 memory
controller pins
(DC)
VIL
VOS
TC
(1)
(2)
(3)
94
Low-level input voltage
Maximum voltage during
overshoot/undershoot (PCI-capable
pins) (2) (3)
Operating case temperature
MAX UNIT
2
0.5DVDD33
V
DVDD33 + 0.5
0.7DVDD33
V
V
VREFHSTL + 0.10
DVDD15 + 0.30
V
VREFSSTL + 0.125
DVDD18 + 0.3
V
0.8
V
0.3DVDD33
V
3.3 V pins (except
PCI-capable and
I2C pins)
PCI-capable
pins (1)
NOM
-0.5
I2C pins
0
0.3DVDD33
V
RGMII pins
-0.3
VREFHSTL - 0.1
V
DDR2 memory
controller pins
(DC)
-0.3
VREFSSTL - 0.125
V
I/O VDD = 1.5 V
(EMAC RGMII)
-0.450
1.950
I/O VDD = 1.8 V
(EMAC RGMII,
DDR2)
-0.540
2.340
I/O VDD = 3.3 V
(except PCIcapable pins)
-1.000
4.300
commercial
temperature
0
90
extended
temperature
-40
105
V
°C
These rated numbers are from the PCI Local Bus Specification (version 2.3). The DC specifications and AC specifications are defined in
Table 4-3 and Table 4-4, respectively, of the PCI Local Bus Specification.
PCI-capable pins can withstand a maximum overshoot/undershoot for up to 11 ns as required by the PCI Local Bus Specification
(version 2.3).
Duration of overshoot/undershoot must not exceed 30% of the cycle period.
Device Operating Conditions
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6.3
SPRS311I – APRIL 2006 – REVISED MARCH 2012
Electrical Characteristics Over Recommended Ranges of Supply Voltage and
Operating Case Temperature (Unless Otherwise Noted)
PARAMETER
VOH
High-level
output voltage
TEST CONDITIONS (1)
MIN
IOH = -0.5 mA,
DVDD33 = 3.3 V
0.9DVDD33
V
DVDD15 - 0.4
V
1.4
V
PCI-capable pins (2)
RGMII pins
3.3-V pins (except PCI- DVDD33 = MIN,
capable and I2C pins)
IOL = MAX
0.22DVDD33
V
IOL = 1.5 mA,
DVDD33 = 3.3 V
0.1DVDD33
V
0.4
V
RGMII pins
0.4
V
DDR2 memory
controller pins
0.4
V
1
uA
Low-level output
voltage
I2C pins
Pulled up to 3.3 V, 3 mA sink
current
VI = VSS to DVDD33, pins
without internal pullup or
pulldown resistor
(3)
Input current
[DC]
50
100
400
uA
VI = VSS to DVDD33, pins with
internal pulldown resistor
-400
-100
-50
uA
-10
10
uA
-1000
1000
uA
0.4
V
AECLKOUT,
CLKR1/GP[0],
CLKX1/GP[3],
SYSCLK4/GP[1],
EMU[18:0], CLKR0,
CLKX0
-8
mA
EMIF pins (except
AECLKOUT), NMI,
TOUT0L, TINP0L,
TOUT1L, TINP1L,
PCI_EN, EMACcapable pins (except
RGMII pins),
RESETSTAT, McBSPcapable pins (except
CLKR1/GP[0],
CLKX1/GP[3], CLKR0,
CLKX0), GP[7:4], and
TDO
-4
mA
-0.5
mA
-8
mA
4
mA
0.1DVDD33 ≤ VI ≤ 0.9DVDD33
PCI-capable pins (4)
RGMII pins
High-level
output current
[DC]
PCI-capable pins (2)
RGMII pins
DDR2 memory
controller pins
(1)
(2)
(3)
(4)
-1
3.3-V pins (except PCIVI = VSS to DVDD33, pins with
capable and I2C pins)
internal pullup resistor
I2C pins
IOH
UNIT
V
PCI-capable pins (2)
II
MAX
0.8DVDD33
DDR2 memory
controller pins
VOL
TYP
3.3-V pins (except PCI- DVDD33 = MIN,
capable and I2C pins)
IOH = MAX
For test conditions shown as MIN, MAX, or NOM, use the appropriate value specified in the recommended operating conditions table.
These rated numbers are from the PCI Local Bus Specification (version 2.3). The DC specifications and AC specifications are defined in
Table 4-3 and Table 4-4, respectively, of the PCI Local Bus Specification.
II applies to input-only pins and bi-directional pins. For input-only pins, II indicates the input leakage current. For bi-directional pins, II
includes input leakage current and off-state (hi-Z) output leakage current.
PCI input leakage currents include Hi-Z output leakage for all bidirectional buffers with 3-state outputs.
Device Operating Conditions
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Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Case
Temperature (Unless Otherwise Noted) (continued)
PARAMETER
TEST CONDITIONS (1)
MIN
TYP
AECLKOUT,
CLKR1/GP[0],
CLKX1/GP[3],
SYSCLK4/GP[1],
EMU[18:0], CLKR0,
CLKX0
EMIF pins (except
AECLKOUT), NMI,
TOUT0L, TINP0L,
TOUTP1L, TINP1L,
PCI_EN, EMACLow-level output capable pins (except
current [DC]
RGMII pins),
RESETSTAT, McBSPcapable pins (except
CLKR1/GP[0],
CLKX1/GP[3], CLKR0,
CLKX0), GP[7:4], and
TDO
IOL
PCI-capable pins (2)
RGMII pins
DDR2 memory
controller pins
IOZ
(5)
PCDD
PDDD
Off-state output
current [DC]
3.3-V pins
Core supply power (6)
I/O supply power
(6)
VO = DVDD33 or 0 V
-20
MAX
UNIT
8
mA
4
mA
1.5
mA
8
mA
-4
mA
20
uA
CVDD = 1.25 V,
CPU frequency = 1000 MHz
1.66
W
CVDD = 1.2 V,
CPU frequency = 850 MHz
1.41
W
CVDD = 1.2 V,
CPU frequency = 720 MHz
1.29
W
DVDD33 = 3.3 V,
DVDD18 = 1.8 V,
PLLV1 = PLLV2 = AVDLL1 =
AVDLL2 = 1.8 V,
CPU frequency = 1000 MHz
0.53
W
DVDD33 = 3.3 V,
DVDD18 = 1.8 V,
PLLV1 = PLLV2 = AVDLL1 =
AVDLL2 = 1.8 V,
CPU frequency = 850 MHz
0.53
W
DVDD33 = 3.3 V,
DVDD18 = 1.8 V,
PLLV1 = PLLV2 = AVDLL1 =
AVDLL2 = 1.8 V,
CPU frequency = 720 MHz
0.52
W
Ci
Input capacitance
10
pF
Co
Output capacitance
10
pF
(5)
(6)
96
IOZ applies to output-only pins, indicating off-state (hi-Z) output leakage current.
Assumes the following conditions: 60% CPU utilization; DDR2 at 50% utilization (250 MHz), 50% writes, 32 bits, 50% bit switching; two
2-MHz McBSPs at 100% utilization, 50% switching; two 75-MHz Timers at 100% utilization; device configured for HPI32 mode with pullup resistors on HPI pins; room temperature (25°C). The actual current draw is highly application-dependent. For more details on core
and I/O activity, see the TMS320C6455/54 Power Consumption Summary application report (literature number SPRAAE8).
Device Operating Conditions
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SPRS311I – APRIL 2006 – REVISED MARCH 2012
7 C64x+ Peripheral Information and Electrical Specifications
7.1
Parameter Information
Tester Pin Electronics
42 Ω
Data Sheet Timing Reference Point
Output
Under
Test
3.5 nH
Transmission Line
Z0 = 50 Ω
(see Note)
4.0 pF
Device Pin
(see Note)
1.85 pF
NOTE: The data sheet provides timing at the device pin. For output timing analysis, the tester pin electronics and its transmission line effects must
be taken into account. A transmission line with a delay of 2 ns can be used to produce the desired transmission line effect. The transmission
line is intended as a load only. It is not necessary to add or subtract the transmission line delay (2 ns) from the data sheet timings.
Input requirements in this data sheet are tested with an input slew rate of < 4 Volts per nanosecond (4 V/ns) at the device pin.
Figure 7-1. Test Load Circuit for AC Timing Measurements
The load capacitance value stated is only for characterization and measurement of AC timing signals. This
load capacitance value does not indicate the maximum load the device is capable of driving.
7.1.1
3.3-V Signal Transition Levels
All input and output timing parameters are referenced to 1.5 V for both "0" and "1" logic levels.
Vref = 1.5 V
Figure 7-2. Input and Output Voltage Reference Levels for AC Timing Measurements
All rise and fall transition timing parameters are referenced to VIL MAX and VIH MIN for input clocks,
VOLMAX and VOH MIN for output clocks.
Vref = VIH MIN (or VOH MIN)
Vref = VIL MAX (or VOL MAX)
Figure 7-3. Rise and Fall Transition Time Voltage Reference Levels
7.1.2
3.3-V Signal Transition Rates
All timings are tested with an input edge rate of 4 volts per nanosecond (4 V/ns).
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Timing Parameters and Board Routing Analysis
The timing parameter values specified in this data sheet do not include delays by board routings. As a
good board design practice, such delays must always be taken into account. Timing values may be
adjusted by increasing/decreasing such delays. TI recommends utilizing the available I/O buffer
information specification (IBIS) models to analyze the timing characteristics correctly. To properly use IBIS
models to attain accurate timing analysis for a given system, see the Using IBIS Models for Timing
Analysis application report (literature number SPRA839). If needed, external logic hardware such as
buffers may be used to compensate any timing differences.
For inputs, timing is most impacted by the round-trip propagation delay from the DSP to the external
device and from the external device to the DSP. This round-trip delay tends to negatively impact the input
setup time margin, but also tends to improve the input hold time margins (see Table 7-1 and Figure 7-4).
Figure 7-4 represents a general transfer between the DSP and an external device. The figure also
represents board route delays and how they are perceived by the DSP and the external device.
Table 7-1. Board-Level Timing Example
(see Figure 7-4)
NO.
DESCRIPTION
1
Clock route delay
2
Minimum DSP hold time
3
Minimum DSP setup time
4
External device hold time requirement
5
External device setup time requirement
6
Control signal route delay
7
External device hold time
8
External device access time
9
DSP hold time requirement
10
DSP setup time requirement
11
Data route delay
AECLKOUT
(Output from DSP)
1
AECLKOUT
(Input to External Device)
Signals (A)
Control
(Output from DSP)
2
3
4
5
Control Signals
(Input to External Device)
6
7
Data Signals (B)
(Output from External Device)
8
10
Data Signals (B)
(Input to DSP)
A.
B.
9
11
Control signals include data for Writes.
Data signals are generated during Reads from an external device.
Figure 7-4. Board-Level Input/Output Timings
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7.2
SPRS311I – APRIL 2006 – REVISED MARCH 2012
Recommended Clock and Control Signal Transition Behavior
All clocks and control signals must transition between VIH and VIL (or between VIL and VIH) in a monotonic
manner.
7.3
7.3.1
Power Supplies
Power-Supply Sequencing
TI recommends the power-supply sequence shown in Figure 7-5. After the DVDD33 supply is stable, the
remaining power supplies can be powered up at the same time as CVDD as long as their supply voltage
never exceeds the CVDD voltage during powerup. Some TI power-supply devices include features that
facilitate power sequencing; for example, Auto-Track or Slow-Start/Enable features. For more information,
visit www.ti.com/dsppower.
DVDD33
1
CVDD12
2
All other
power supplies
Figure 7-5. Power-Supply Sequence
Table 7-2. Timing Requirements for Power-Supply Sequence
-720
-850
A-1000/-1000
NO.
1
tsu(DVDD33-CVDD12) Setup time, DVDD33 supply stable before CVDD12 supply stable
2
tsu(CVDD12-ALLSUP)
7.3.2
Setup time, CVDD12 supply stable before all other supplies stable
UNIT
MIN
MAX
0.5
200
ms
0
200
ms
Power-Supply Decoupling
In order to properly decouple the supply planes from system noise, place as many capacitors (caps) as
possible close to the DSP. These caps need to be close to the DSP, no more than 1.25 cm maximum
distance to be effective. Physically smaller caps are better, such as 0402, but need to be evaluated from a
yield/manufacturing point-of-view. Parasitic inductance limits the effectiveness of the decoupling
capacitors, therefore physically smaller capacitors should be used while maintaining the largest available
capacitance value. As with the selection of any component, verification of capacitor availability over the
product's production lifetime should be considered.
7.3.3
Power-Down Operation
One of the power goals for the C6454 device is to reduce power dissipation due to unused peripherals.
There are different ways to power down peripherals on the C6454 device.
Some peripherals can be statically powered down at device reset through the device configuration pins
(see Section 3.1, Device Configuration at Device Reset). Once in a static power-down state, the peripheral
is held in reset and its clock is turned off. Peripherals cannot be enabled once they are in a static powerdown state. To take a peripheral out of the static power-down state, a device reset must be executed with
a different configuration pin setting.
After device reset, all peripherals on the C6454 device are in a disabled state and must be enabled by
software before being used. It is possible to enable only the peripherals needed by the application while
keeping the rest disabled. Note that peripherals in a disabled state are held in reset with their clocks
gated. For more information on how to enable peripherals, see Section 3.3, Peripheral Selection After
Device Reset.
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Peripherals used for booting, like I2C and HPI, are automatically enabled after device reset. It is not
possible to disable these peripherals after the boot process is complete.
The C64x+ Megamodule also allows for software-driven power-down management for all of the C64x+
megamodule components through its Power-Down Controller (PDC). The CPU can power-down part or
the entire C64x+ megamodule through the power-down controller based on its own execution thread or in
response to an external stimulus from a host or global controller. More information on the power-down
features of the C64x+ Megamodule can be found in the TMS320C64x+ Megamodule Reference Guide
(literature number SPRU871).
7.3.4
Preserving Boundary-Scan Functionality on RGMII and DDR2 Memory Pins
When the RGMII mode of the EMAC is not used, the DVDD15, DVDD15MON, VREFHSTL, RSV13, and RSV14
pins can be connected directly to ground (VSS) to save power. However, this will prevent boundary-scan
from functioning on the RGMII pins of the EMAC. To preserve boundary-scan functionality on the RGMII
pins, DVDD15, VREFHSTL, RSV14, and RSV13 should be connected as follows:
• DVDD15 and DVDD15MON - connect these pins to the 1.8-V I/O supply (DVDD18).
• VREFHSTL - connect to a voltage of DVDD18/2. The DVDD18/2 voltage can be generated directly from the
DVDD18 supply using two 1-kΩ resistors to form a resistor divider circuit.
• RSV13 - connect this pin to ground (VSS) via a 200-Ω resistor.
• RSV14 - connect this pin to the 1.8-V I/O supply (DVDD18) via a 200-Ω resistor.
Similarly, when the DDR2 Memory Controller is not used, the VREFSSTL, RSV11, and RSV12 pins can be
connected directly to ground (VSS) to save power. However, this will prevent boundary-scan from
functioning on the DDR2 Memory Controller pins. To preserve boundary-scan functionality on the DDR2
Memory Controller pins, VREFSSTL, RSV11, and RSV12 should be connected as follows:
• VREFSSTL - connect to a voltage of DVDD18/2. The DVDD18/2 voltage can be generated directly from the
DVDD18 supply using two 1-kΩ resistors to form a resistor divider circuit.
• RSV11 - connect this pin to ground (VSS) via a 200-Ω resistor.
• RSV12 - connect this pin to the 1.8-V I/O supply (DVDD18) via a 200-Ω resistor.
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7.4
SPRS311I – APRIL 2006 – REVISED MARCH 2012
Enhanced Direct Memory Access (EDMA3) Controller
The primary purpose of the EDMA3 is to service user-programmed data transfers between two memorymapped slave endpoints on the device. The EDMA3 services software-driven paging transfers (e.g., data
movement between external memory and internal memory), performs sorting or subframe extraction of
various data structures, services event driven peripherals such as the McBSP, and offloads data transfers
from the device CPU.
The EDMA3 includes the following features:
• Fully orthogonal transfer description
– 3 transfer dimensions: array (multiple bytes), frame (multiple arrays), and block (multiple frames)
– Single event can trigger transfer of array, frame, or entire block
– Independent indexes on source and destination
• Flexible transfer definition:
– Increment or FIFO transfer addressing modes
– Linking mechanism allows for ping-pong buffering, circular buffering, and repetitive/continuous
transfers, all with no CPU intervention
– Chaining allows multiple transfers to execute with one event
• 256 PaRAM entries
– Used to define transfer context for channels
– Each PaRAM entry can be used as a DMA entry, QDMA entry, or link entry
• 64 DMA channels
– Manually triggered (CPU writes to channel controller register), external event triggered, and chain
triggered (completion of one transfer triggers another)
• 4 Quick DMA (QDMA) channels
– Used for software-driven transfers
– Triggered upon writing to a single PaRAM set entry
• 4 transfer controllers/event queues with programmable system-level priority
• Interrupt generation for transfer completion and error conditions
• Memory protection support
– Active memory protection for accesses to PaRAM and registers
• Debug visibility
– Queue watermarking/threshold allows detection of maximum usage of event queues
– Error and status recording to facilitate debug
Each of the transfer controllers has a direct connection to the switched central resource (SCR).
NOTE
Although the transfer controllers are directly connected to the SCR, they can only access
certain device resources. For example, only transfer controller 1 (TC1) can access the
McBSPs. lists the device resources that can be accessed by each of the transfer controllers.
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EDMA3 Device-Specific Information
The EDMA supports two addressing modes: constant addressing and increment addressing mode. On the
C6454 DSP, constant addressing mode is not supported by any peripheral or internal memory. For more
information on these two addressing modes, see the TMS320C645x DSP Enhanced DMA (EDMA3)
Controller User's Guide (literature number SPRU966).
A DSP interrupt must be generated at the end of an HPI or PCI boot operation to begin execution of the
loaded application. Since the DSP interrupt generated by the HPI and PCI is mapped to the EDMA event
DSP_EVT (DMA channel 0), it will get recorded in bit 0 of the EDMA Event Register (ER). This event must
be cleared by software before triggering transfers on DMA channel 0. The EDMA3 on the C6454 DSP
supports active memory protection, but it does not support proxied memory protection.
7.4.2
EDMA3 Channel Synchronization Events
The EDMA3 supports up to 64 DMA channels that can be used to service system peripherals and to move
data between system memories. DMA channels can be triggered by synchronization events generated by
system peripherals. Table 7-3 lists the source of the synchronization event associated with each of the
DMA channels. On the C6454 device, the association of each synchronization event and DMA channel is
fixed and cannot be reprogrammed.
For more detailed information on the EDMA3 module and how EDMA3 events are enabled, captured,
processed, prioritized, linked, chained, and cleared, etc., see the TMS320C645x DSP Enhanced DMA
(EDMA3) Controller User's Guide (literature number SPRU966).
Table 7-3. C6454 EDMA3 Channel Synchronization Events (1)
EDMA
CHANNEL
BINARY
EVENT NAME
0 (2)
000 0000
DSP_EVT
HPI/PCI-to-DSP event
1
000 0001
TEVTLO0
Timer 0 lower counter event
2
000 0010
TEVTHI0
Timer 0 high counter event
3
000 0011
-
None
4
000 0100
-
None
5
000 0101
-
None
6
000 0110
-
None
7
000 0111
-
None
8
000 1000
-
None
9
000 1001
-
None
10
000 1010
-
None
11
000 1011
-
None
12
000 1100
XEVT0
McBSP0 transmit event
13
000 1101
REVT0
McBSP0 receive event
14
000 1110
XEVT1
McBSP1 transmit event
15
000 1111
REVT1
McBSP1 receive event
16
001 0000
TEVTLO1
Timer 1 lower counter event
Timer 1 high counter event
(1)
(2)
102
EVENT DESCRIPTION
17
001 0001
TEVTHI1
18-43
-
-
44
010 1100
ICREVT
I2C receive event
45
010 1101
ICXEVT
I2C transmit event
46-47
-
-
None
None
In addition to the events shown in this table, each of the 64 channels can also be synchronized with the transfer completion or alternate
transfer completion events. For more detailed information on EDMA event-transfer chaining, see the TMS320C645x DSP Enhanced
DMA (EDMA3) Controller User's Guide (literature number SPRU966).
HPI boot and PCI boot are terminated using a DSP interrupt. The DSP interrupt is registered in bit 0 (channel 0) of the EDMA Event
Register (ER). This event must be cleared by software before triggering transfers on DMA channel 0.
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Table 7-3. C6454 EDMA3 Channel Synchronization Events(1) (continued)
EDMA
CHANNEL
BINARY
EVENT NAME
48
011 0000
GPINT0
GPIO event 0
49
011 0001
GPINT1
GPIO event 1
50
011 0010
GPINT2
GPIO event 2
51
011 0011
GPINT3
GPIO event 3
52
011 0100
GPINT4
GPIO event 4
53
011 0101
GPINT5
GPIO event 5
54
011 0110
GPINT6
GPIO event 6
55
011 0111
GPINT7
GPIO event 7
56
011 1000
GPINT8
GPIO event 8
57
011 1001
GPINT9
GPIO event 9
58
011 1010
GPINT10
GPIO event 10
59
011 1011
GPINT11
GPIO event 11
60
011 1100
GPINT12
GPIO event 12
61
011 1101
GPINT13
GPIO event 13
62
011 1110
GPINT14
GPIO event 14
63
011 1111
GPINT15
GPIO event 15
7.4.3
EVENT DESCRIPTION
EDMA3 Peripheral Register Descriptions
Table 7-4. EDMA3 Channel Controller Registers
HEX ADDRESS RANGE
ACRONYM
02A0 0000
PID
02A0 0004
CCCFG
REGISTER NAME
Peripheral ID Register
EDMA3CC Configuration Register
02A0 0008 - 02A0 00FC
-
02A0 0100
DCHMAP0
Reserved
DMA Channel 0 Mapping Register
02A0 0104
DCHMAP1
DMA Channel 1 Mapping Register
02A0 0108
DCHMAP2
DMA Channel 2 Mapping Register
02A0 010C
DCHMAP3
DMA Channel 3 Mapping Register
02A0 0110
DCHMAP4
DMA Channel 4 Mapping Register
02A0 0114
DCHMAP5
DMA Channel 5 Mapping Register
02A0 0118
DCHMAP6
DMA Channel 6 Mapping Register
02A0 011C
DCHMAP7
DMA Channel 7 Mapping Register
02A0 0120
DCHMAP8
DMA Channel 8 Mapping Register
02A0 0124
DCHMAP9
DMA Channel 9 Mapping Register
02A0 0128
DCHMAP10
DMA Channel 10 Mapping Register
02A0 012C
DCHMAP11
DMA Channel 11 Mapping Register
02A0 0130
DCHMAP12
DMA Channel 12 Mapping Register
02A0 0134
DCHMAP13
DMA Channel 13 Mapping Register
02A0 0138
DCHMAP14
DMA Channel 14 Mapping Register
02A0 013C
DCHMAP15
DMA Channel 15 Mapping Register
02A0 0140
DCHMAP16
DMA Channel 16 Mapping Register
02A0 0144
DCHMAP17
DMA Channel 17 Mapping Register
02A0 0148
DCHMAP18
DMA Channel 18 Mapping Register
02A0 014C
DCHMAP19
DMA Channel 19 Mapping Register
02A0 0150
DCHMAP20
DMA Channel 20 Mapping Register
02A0 0154
DCHMAP21
DMA Channel 21 Mapping Register
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Table 7-4. EDMA3 Channel Controller Registers (continued)
104
HEX ADDRESS RANGE
ACRONYM
02A0 0158
DCHMAP22
DMA Channel 22 Mapping Register
REGISTER NAME
02A0 015C
DCHMAP23
DMA Channel 23 Mapping Register
02A0 0160
DCHMAP24
DMA Channel 24 Mapping Register
02A0 0164
DCHMAP25
DMA Channel 25 Mapping Register
02A0 0168
DCHMAP26
DMA Channel 26 Mapping Register
02A0 016C
DCHMAP27
DMA Channel 27 Mapping Register
02A0 0170
DCHMAP28
DMA Channel 28 Mapping Register
02A0 0174
DCHMAP29
DMA Channel 29 Mapping Register
02A0 0178
DCHMAP30
DMA Channel 30 Mapping Register
02A0 017C
DCHMAP31
DMA Channel 31 Mapping Register
02A0 0180
DCHMAP32
DMA Channel 32 Mapping Register
02A0 0184
DCHMAP33
DMA Channel 33 Mapping Register
02A0 0188
DCHMAP34
DMA Channel 34 Mapping Register
02A0 018C
DCHMAP35
DMA Channel 35 Mapping Register
02A0 0190
DCHMAP36
DMA Channel 36 Mapping Register
02A0 0194
DCHMAP37
DMA Channel 37 Mapping Register
02A0 0198
DCHMAP38
DMA Channel 38 Mapping Register
02A0 019C
DCHMAP39
DMA Channel 39 Mapping Register
02A0 01A0
DCHMAP40
DMA Channel 40 Mapping Register
02A0 01A4
DCHMAP41
DMA Channel 41 Mapping Register
02A0 01A8
DCHMAP42
DMA Channel 42 Mapping Register
02A0 01AC
DCHMAP43
DMA Channel 43 Mapping Register
02A0 01B0
DCHMAP44
DMA Channel 44 Mapping Register
02A0 01B4
DCHMAP45
DMA Channel 45 Mapping Register
02A0 01B8
DCHMAP46
DMA Channel 46 Mapping Register
02A0 01BC
DCHMAP47
DMA Channel 47 Mapping Register
02A0 01C0
DCHMAP48
DMA Channel 48 Mapping Register
02A0 01C4
DCHMAP49
DMA Channel 49 Mapping Register
02A0 01C8
DCHMAP50
DMA Channel 50 Mapping Register
02A0 01CC
DCHMAP51
DMA Channel 51 Mapping Register
02A0 01D0
DCHMAP52
DMA Channel 52 Mapping Register
02A0 01D4
DCHMAP53
DMA Channel 53 Mapping Register
02A0 01D8
DCHMAP54
DMA Channel 54 Mapping Register
02A0 01DC
DCHMAP55
DMA Channel 55 Mapping Register
02A0 01E0
DCHMAP56
DMA Channel 56 Mapping Register
02A0 01E4
DCHMAP57
DMA Channel 57 Mapping Register
02A0 01E8
DCHMAP58
DMA Channel 58 Mapping Register
02A0 01EC
DCHMAP59
DMA Channel 59 Mapping Register
02A0 01F0
DCHMAP60
DMA Channel 60 Mapping Register
02A0 01F4
DCHMAP61
DMA Channel 61 Mapping Register
02A0 01F8
DCHMAP62
DMA Channel 62 Mapping Register
02A0 01FC
DCHMAP63
DMA Channel 63 Mapping Register
02A0 0200
QCHMAP0
QDMA Channel 0 Mapping Register
02A0 0204
QCHMAP1
QDMA Channel 1 Mapping Register
02A0 0208
QCHMAP2
QDMA Channel 2 Mapping Register
02A0 020C
QCHMAP3
QDMA Channel 3 Mapping Register
02A0 0210 - 02A0 021C
-
Reserved
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Table 7-4. EDMA3 Channel Controller Registers (continued)
HEX ADDRESS RANGE
ACRONYM
02A0 0220 - 02A0 023C
-
REGISTER NAME
02A0 0240
DMAQNUM0
DMA Queue Number Register 0
02A0 0244
DMAQNUM1
DMA Queue Number Register 1
02A0 0248
DMAQNUM2
DMA Queue Number Register 2
02A0 024C
DMAQNUM3
DMA Queue Number Register 3
02A0 0250
DMAQNUM4
DMA Queue Number Register 4
02A0 0254
DMAQNUM5
DMA Queue Number Register 5
Reserved
02A0 0258
DMAQNUM6
DMA Queue Number Register 6
02A0 025C
DMAQNUM7
DMA Queue Number Register 7
02A0 0260
QDMAQNUM
QDMA Queue Number Register
02A0 0264 - 02A0 0280
-
Reserved
02A0 0284
QUEPRI
02A0 0288 - 02A0 02FC
-
Queue Priority Register
02A0 0300
EMR
02A0 0304
EMRH
Event MissedRegister High
02A0 0308
EMCR
Event Missed Clear Register
02A0 030C
EMCRH
Reserved
Event Missed Register
Event Missed Clear Register High
02A0 0310
QEMR
02A0 0314
QEMCR
QDMA Event Missed Clear Register
02A0 0318
CCERR
EDMA3CC Error Register
02A0 031C
CCERRCLR
02A0 0320
EEVAL
02A0 0324 - 02A0 033C
-
02A0 0340
DRAE0
02A0 0344
DRAEH0
02A0 0348
DRAE1
02A0 034C
DRAEH1
QDMA Event Missed Register
EDMA3CC Error Clear Register
Error Evaluate Register
Reserved
02A0 0350
DRAE2
02A0 0354
DRAEH2
02A0 0358
DRAE3
02A0 035C
DRAEH3
02A0 0360
DRAE4
02A0 0364
DRAEH4
02A0 0368
DRAE5
02A0 036C
DRAEH5
02A0 0370
DRAE6
02A0 0374
DRAEH6
DMA Region Access Enable Register for Region 0
DMA Region Access Enable Register High for Region 0
DMA Region Access Enable Register for Region 1
DMA Region Access Enable Register High for Region 1
DMA Region Access Enable Register for Region 2
DMA Region Access Enable Register High for Region 2
DMA Region Access Enable Register for Region 3
DMA Region Access Enable Register High for Region 3
DMA Region Access Enable Register for Region 4
DMA Region Access Enable Register High for Region 4
DMA Region Access Enable Register for Region 5
DMA Region Access Enable Register High for Region 5
DMA Region Access Enable Register for Region 6
DMA Region Access Enable Register High for Region 6
02A0 0378
DRAE7
02A0 037C
DRAEH7
DMA Region Access Enable Register for Region 7
02A0 0380
QRAE0
QDMA Region Access Enable Register for Region 0
02A0 0384
QRAE1
QDMA Region Access Enable Register for Region 1
DMA Region Access Enable Register High for Region 7
02A0 0388
QRAE2
QDMA Region Access Enable Register for Region 2
02A0 038C
QRAE3
QDMA Region Access Enable Register for Region 3
02A0 0390 - 02A0 039C
-
02A0 0400
Q0E0
Event Queue 0 Entry Register 0
02A0 0404
Q0E1
Event Queue 0 Entry Register 1
02A0 0408
Q0E2
Event Queue 0 Entry Register 2
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Reserved
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Table 7-4. EDMA3 Channel Controller Registers (continued)
106
HEX ADDRESS RANGE
ACRONYM
02A0 040C
Q0E3
Event Queue 0 Entry Register 3
REGISTER NAME
02A0 0410
Q0E4
Event Queue 0 Entry Register 4
02A0 0414
Q0E5
Event Queue 0 Entry Register 5
02A0 0418
Q0E6
Event Queue 0 Entry Register 6
02A0 041C
Q0E7
Event Queue 0 Entry Register 7
02A0 0420
Q0E8
Event Queue 0 Entry Register 8
02A0 0424
Q0E9
Event Queue 0 Entry Register 9
02A0 0428
Q0E10
Event Queue 0 Entry Register 10
02A0 042C
Q0E11
Event Queue 0 Entry Register 11
02A0 0430
Q0E12
Event Queue 0 Entry Register 12
02A0 0434
Q0E13
Event Queue 0 Entry Register 13
02A0 0438
Q0E14
Event Queue 0 Entry Register 14
02A0 043C
Q0E15
Event Queue 0 Entry Register 15
02A0 0440
Q1E0
Event Queue 1 Entry Register 0
02A0 0444
Q1E1
Event Queue 1 Entry Register 1
02A0 0448
Q1E2
Event Queue 1 Entry Register 2
02A0 044C
Q1E3
Event Queue 1 Entry Register 3
02A0 0450
Q1E4
Event Queue 1 Entry Register 4
02A0 0454
Q1E5
Event Queue 1 Entry Register 5
02A0 0458
Q1E6
Event Queue 1 Entry Register 6
02A0 045C
Q1E7
Event Queue 1 Entry Register 7
02A0 0460
Q1E8
Event Queue 1 Entry Register 8
02A0 0464
Q1E9
Event Queue 1 Entry Register 9
02A0 0468
Q1E10
Event Queue 1 Entry Register 10
02A0 046C
Q1E11
Event Queue 1 Entry Register 11
02A0 0470
Q1E12
Event Queue 1 Entry Register 12
02A0 0474
Q1E13
Event Queue 1 Entry Register 13
02A0 0478
Q1E14
Event Queue 1 Entry Register 14
02A0 047C
Q1E15
Event Queue 1 Entry Register 15
02A0 0480
Q2E0
Event Queue 2 Entry Register 0
02A0 0484
Q2E1
Event Queue 2 Entry Register 1
02A0 0488
Q2E2
Event Queue 2 Entry Register 2
02A0 048C
Q2E3
Event Queue 2 Entry Register 3
02A0 0490
Q2E4
Event Queue 2 Entry Register 4
02A0 0494
Q2E5
Event Queue 2 Entry Register 5
02A0 0498
Q2E6
Event Queue 2 Entry Register 6
02A0 049C
Q2E7
Event Queue 2 Entry Register 7
02A0 04A0
Q2E8
Event Queue 2 Entry Register 8
02A0 04A4
Q2E9
Event Queue 2 Entry Register 9
02A0 04A8
Q2E10
Event Queue 2 Entry Register 10
02A0 04AC
Q2E11
Event Queue 2 Entry Register 11
02A0 04B0
Q2E12
Event Queue 2 Entry Register 12
02A0 04B4
Q2E13
Event Queue 2 Entry Register 13
02A0 04B8
Q2E14
Event Queue 2 Entry Register 14
02A0 04BC
Q2E15
Event Queue 2 Entry Register 15
02A0 04C0
Q3E0
Event Queue 3 Entry Register 0
02A0 04C4
Q3E1
Event Queue 3 Entry Register 1
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Table 7-4. EDMA3 Channel Controller Registers (continued)
HEX ADDRESS RANGE
ACRONYM
02A0 04C8
Q3E2
Event Queue 3 Entry Register 2
REGISTER NAME
02A0 04CC
Q3E3
Event Queue 3 Entry Register 3
02A0 04D0
Q3E4
Event Queue 3 Entry Register 4
02A0 04D4
Q3E5
Event Queue 3 Entry Register 5
02A0 04D8
Q3E6
Event Queue 3 Entry Register 6
02A0 04DC
Q3E7
Event Queue 3 Entry Register 7
02A0 04E0
Q3E8
Event Queue 3 Entry Register 8
02A0 04E4
Q3E9
Event Queue 3 Entry Register 9
02A0 04E8
Q3E10
Event Queue 3 Entry Register 10
02A0 04EC
Q3E11
Event Queue 3 Entry Register 11
02A0 04F0
Q3E12
Event Queue 3 Entry Register 12
02A0 04F4
Q3E13
Event Queue 3 Entry Register 13
02A0 04F8
Q3E14
Event Queue 3 Entry Register 14
02A0 04FC
Q3E15
Event Queue 3 Entry Register 15
02A0 0500 - 02A0 051C
-
Reserved
02A0 0520 - 02A0 05FC
-
Reserved
02A0 0600
QSTAT0
Queue Status Register 0
02A0 0604
QSTAT1
Queue Status Register 1
02A0 0608
QSTAT2
Queue Status Register 2
02A0 060C
QSTAT3
Queue Status Register 3
02A0 0610 - 02A0 061C
-
Reserved
02A0 0620
QWMTHRA
02A0 0624 - 02A0 063C
-
Queue Watermark Threshold A Register
02A0 0640
CCSTAT
02A0 0644 - 02A0 06FC
-
Reserved
02A0 0700 - 02A0 07FC
-
Reserved
02A0 0800
MPFAR
Memory Protection Fault Address Register
02A0 0804
MPFSR
Memory Protection Fault Status Register
02A0 0808
MPFCR
Memory Protection Fault Command Register
02A0 080C
MPPA0
Memory Protection Page Attribute Register 0
02A0 0810
MPPA1
Memory Protection Page Attribute Register 1
02A0 0814
MPPA2
Memory Protection Page Attribute Register 2
02A0 0818
MPPA3
Memory Protection Page Attribute Register 3
02A0 081C
MPPA4
Memory Protection Page Attribute Register 4
02A0 0820
MPPA5
Memory Protection Page Attribute Register 5
02A0 0824
MPPA6
Memory Protection Page Attribute Register 6
02A0 0828
MPPA7
Memory Protection Page Attribute Register 7
Reserved
EDMA3CC Status Register
02A0 082C - 02A0 0FFC
-
02A0 1000
ER
Reserved
02A0 1004
ERH
Event Register High
02A0 1008
ECR
Event Clear Register
02A0 100C
ECRH
02A0 1010
ESR
02A0 1014
ESRH
Event Set Register High
Chained Event Register
02A0 1018
CER
02A0 101C
CERH
02A0 1020
EER
Copyright © 2006–2012, Texas Instruments Incorporated
Event Register
Event Clear Register High
Event Set Register
Chained Event Register High
Event Enable Register
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Table 7-4. EDMA3 Channel Controller Registers (continued)
HEX ADDRESS RANGE
ACRONYM
02A0 1024
EERH
Event Enable Register High
REGISTER NAME
Event Enable Clear Register
02A0 1028
EECR
02A0 102C
EECRH
02A0 1030
EESR
02A0 1034
EESRH
02A0 1038
SER
02A0 103C
SERH
Secondary Event Register High
02A0 1040
SECR
Secondary Event Clear Register
02A0 1044
SECRH
02A0 1048 - 02A0 104C
-
02A0 1050
IER
02A0 1054
IERH
Interrupt Enable High Register
02A0 1058
IECR
Interrupt Enable Clear Register
02A0 105C
IECRH
Event Enable Clear Register High
Event Enable Set Register
Event Enable Set Register High
Secondary Event Register
Secondary Event Clear Register High
Reserved
Interrupt Enable Register
Interrupt Enable Clear High Register
02A0 1060
IESR
02A0 1064
IESRH
02A0 1068
IPR
02A0 106C
IPRH
02A0 1070
ICR
02A0 1074
ICRH
Interrupt Clear High Register
02A0 1078
IEVAL
Interrupt Evaluate Register
02A0 107C
-
02A0 1080
QER
02A0 1084
QEER
Interrupt Enable Set Register
Interrupt Enable Set High Register
Interrupt Pending Register
Interrupt Pending High Register
Interrupt Clear Register
Reserved
QDMA Event Register
QDMA Event Enable Register
02A0 1088
QEECR
QDMA Event Enable Clear Register
02A0 108C
QEESR
QDMA Event Enable Set Register
02A0 1090
QSER
QDMA Secondary Event Register
02A0 1094
QSECR
02A0 1098 - 02A0 1FFF
-
QDMA Secondary Event Clear Register
Reserved
Shadow Region 0 Channel Registers
108
02A0 2000
ER
Event Register
02A0 2004
ERH
Event Register High
02A0 2008
ECR
Event Clear Register
02A0 200C
ECRH
Event Clear Register High
02A0 2010
ESR
02A0 2014
ESRH
Event Set Register
Event Set Register High
02A0 2018
CER
Chained Event Register
02A0 201C
CERH
02A0 2020
EER
02A0 2024
EERH
Event Enable Register High
02A0 2028
EECR
Event Enable Clear Register
02A0 202C
EECRH
02A0 2030
EESR
02A0 2034
EESRH
Chained Event Register Hig
Event Enable Register
Event Enable Clear Register High
Event Enable Set Register
Event Enable Set Register High
02A0 2038
SER
02A0 203C
SERH
Secondary Event Register
Secondary Event Register High
02A0 2040
SECR
Secondary Event Clear Register
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Table 7-4. EDMA3 Channel Controller Registers (continued)
HEX ADDRESS RANGE
ACRONYM
02A0 2044
SECRH
REGISTER NAME
Secondary Event Clear Register High
02A0 2048 - 02A0 204C
-
02A0 2050
IER
Reserved
02A0 2054
IERH
Interrupt Enable Register High
Interrupt Enable Clear Register
02A0 2058
IECR
02A0 205C
IECRH
02A0 2060
IESR
02A0 2064
IESRH
02A0 2068
IPR
02A0 206C
IPRH
02A0 2070
ICR
Interrupt Enable Register
Interrupt Enable Clear Register High
Interrupt Enable Set Register
Interrupt Enable Set Register High
Interrupt Pending Register
Interrupt Pending Register High
Interrupt Clear Register
02A0 2074
ICRH
Interrupt Clear Register High
02A0 2078
IEVAL
Interrupt Evaluate Register
02A0 207C
-
Reserved
02A0 2080
QER
02A0 2084
QEER
QDMA Event Register
02A0 2088
QEECR
QDMA Event Enable Clear Register
02A0 208C
QEESR
QDMA Event Enable Set Register
02A0 2090
QSER
QDMA Secondary Event Register
02A0 2094
QSECR
02A0 2098 - 02A0 23FF
-
Reserved
QDMA Event Enable Register
QDMA Secondary Event Clear Register
02A0 2400 - 02A0 2497
-
Shadow Region 2 Channel Registers
02A0 2498 - 02A0 25FF
-
Reserved
02A0 2600 - 02A0 2697
-
Shadow Region 3 Channel Registers
02A0 2698 - 02A0 27FF
-
Reserved
02A0 2800 - 02A0 2897
-
Shadow Region 4 Channel Registers
02A0 2898 - 02A0 29FF
-
Reserved
02A0 2A00 - 02A0 2A97
-
Shadow Region 5 Channel Registers
02A0 2A98 - 02A0 2BFF
-
Reserved
02A0 2C00 - 02A0 2C97
-
Shadow Region 6 Channel Registers
02A0 2C98 - 02A0 2DFF
-
Reserved
02A0 2E00 - 02A0 2E97
-
Shadow Region 7 Channel Registers
02A0 2E98 - 02A0 2FFF
-
Reserved
Table 7-5. EDMA3 Parameter RAM (1)
(1)
HEX ADDRESS RANGE
ACRONYM
02A0 4000 - 02A0 401F
-
Parameter Set 0
REGISTER NAME
02A0 4020 - 02A0 403F
-
Parameter Set 1
02A0 4040 - 02A0 405F
-
Parameter Set 2
02A0 4060 - 02A0 407F
-
Parameter Set 3
02A0 4080 - 02A0 409F
-
Parameter Set 4
02A0 40A0 - 02A0 40BF
-
Parameter Set 5
02A0 40C0 - 02A0 40DF
-
Parameter Set 6
02A0 40E0 - 02A0 40FF
-
Parameter Set 7
02A0 4100 - 02A0 411F
-
Parameter Set 8
The C6454 device has 256 EDMA3 parameter sets total. Each parameter set can be used as a DMA entry, a QDMA entry, or a link
entry.
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Table 7-5. EDMA3 Parameter RAM(1) (continued)
HEX ADDRESS RANGE
ACRONYM
02A0 4120 - 02A0 413F
-
...
REGISTER NAME
Parameter Set 9
...
02A0 47E0 - 02A0 47FF
-
Parameter Set 63
02A0 4800 - 02A0 481F
-
Parameter Set 64
02A0 4820 - 02A0 483F
-
Parameter Set 65
...
...
02A0 5FC0 - 02A0 5FDF
-
Parameter Set 254
02A0 5FE0 - 02A0 5FFF
-
Parameter Set 255
Table 7-6. EDMA3 Transfer Controller 0 Registers
HEX ADDRESS RANGE
110
ACRONYM
REGISTER NAME
02A2 0000
PID
Peripheral Identification Register
02A2 0004
TCCFG
EDMA3TC Configuration Register
02A2 0008 - 02A2 00FC
-
02A2 0100
TCSTAT
02A2 0104 - 02A2 011C
-
02A2 0120
ERRSTAT
Reserved
EDMA3TC Channel Status Register
Reserved
Error Register
02A2 0124
ERREN
02A2 0128
ERRCLR
Error Clear Register
02A2 012C
ERRDET
Error Details Register
02A2 0130
ERRCMD
Error Interrupt Command Register
02A2 0134 - 02A2 013C
-
02A2 0140
RDRATE
02A2 0144 - 02A2 023C
-
Error Enable Register
Reserved
Read Rate Register
Reserved
02A2 0240
SAOPT
Source Active Options Register
02A2 0244
SASRC
Source Active Source Address Register
02A2 0248
SACNT
Source Active Count Register
02A2 024C
SADST
Source Active Destination Address Register
02A2 0250
SABIDX
Source Active Source B-Index Register
02A2 0254
SAMPPRXY
Source Active Memory Protection Proxy Register
02A2 0258
SACNTRLD
Source Active Count Reload Register
02A2 025C
SASRCBREF
Source Active Source Address B-Reference Register
02A2 0260
SADSTBREF
Source Active Destination Address B-Reference Register
02A2 0264 - 02A2 027C
-
Reserved
02A2 0280
DFCNTRLD
02A2 0284
DFSRCBREF
Destination FIFO Set Count Reload
Destination FIFO Set Destination Address B Reference Register
02A2 0288
DFDSTBREF
Destination FIFO Set Destination Address B Reference Register
02A2 028C - 02A2 02FC
-
02A2 0300
DFOPT0
Reserved
Destination FIFO Options Register 0
02A2 0304
DFSRC0
Destination FIFO Source Address Register 0
02A2 0308
DFCNT0
Destination FIFO Count Register 0
02A2 030C
DFDST0
Destination FIFO Destination Address Register 0
02A2 0310
DFBIDX0
Destination FIFO BIDX Register 0
02A2 0314
DFMPPRXY0
Destination FIFO Memory Protection Proxy Register 0
02A2 0318 - 02A2 033C
-
02A2 0340
DFOPT1
Reserved
Destination FIFO Options Register 1
02A2 0344
DFSRC1
Destination FIFO Source Address Register 1
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Table 7-6. EDMA3 Transfer Controller 0 Registers (continued)
HEX ADDRESS RANGE
ACRONYM
02A2 0348
DFCNT1
REGISTER NAME
Destination FIFO Count Register 1
02A2 034C
DFDST1
Destination FIFO Destination Address Register 1
02A2 0350
DFBIDX1
Destination FIFO BIDX Register 1
02A2 0354
DFMPPRXY1
Destination FIFO Memory Protection Proxy Register 1
02A2 0358 - 02A2 037C
-
02A2 0380
DFOPT2
Reserved
Destination FIFO Options Register 2
02A2 0384
DFSRC2
Destination FIFO Source Address Register 2
02A2 0388
DFCNT2
Destination FIFO Count Register 2
02A2 038C
DFDST2
Destination FIFO Destination Address Register 2
02A2 0390
DFBIDX2
Destination FIFO BIDX Register 2
02A2 0394
DFMPPRXY2
Destination FIFO Memory Protection Proxy Register 2
02A2 0398 - 02A2 03BC
-
02A2 03C0
DFOPT3
Reserved
Destination FIFO Options Register 3
02A2 03C4
DFSRC3
Destination FIFO Source Address Register 3
02A2 03C8
DFCNT3
Destination FIFO Count Register 3
02A2 03CC
DFDST3
Destination FIFO Destination Address Register 3
02A2 03D0
DFBIDX3
Destination FIFO BIDX Register 3
02A2 03D4
DFMPPRXY3
02A2 03D8 - 02A2 7FFF
-
Destination FIFO Memory Protection Proxy Register 3
Reserved
Table 7-7. EDMA3 Transfer Controller 1 Registers
HEX ADDRESS RANGE
ACRONYM
02A2 8000
PID
REGISTER NAME
Peripheral Identification Register
02A2 8004
TCCFG
EDMA3TC Configuration Register
02A2 8008 - 02A2 80FC
-
02A2 8100
TCSTAT
Reserved
02A2 8104 - 02A2 811C
-
02A2 8120
ERRSTAT
02A2 8124
ERREN
02A2 8128
ERRCLR
Error Clear Register
02A2 812C
ERRDET
Error Details Register
Error Interrupt Command Register
EDMA3TC Channel Status Register
Reserved
02A2 8130
ERRCMD
02A2 8134 - 02A2 813C
-
02A2 8140
RDRATE
Error Register
Error Enable Register
Reserved
Read Rate Register
02A2 8144 - 02A2 823C
-
02A2 8240
SAOPT
Reserved
Source Active Options Register
02A2 8244
SASRC
Source Active Source Address Register
02A2 8248
SACNT
Source Active Count Register
02A2 824C
SADST
Source Active Destination Address Register
02A2 8250
SABIDX
Source Active Source B-Index Register
02A2 8254
SAMPPRXY
Source Active Memory Protection Proxy Register
Source Active Count Reload Register
02A2 8258
SACNTRLD
02A2 825C
SASRCBREF
Source Active Source Address B-Reference Register
02A2 8260
SADSTBREF
Source Active Destination Address B-Reference Register
02A2 8264 - 02A2 827C
-
02A2 8280
DFCNTRLD
02A2 8284
DFSRCBREF
Copyright © 2006–2012, Texas Instruments Incorporated
Reserved
Destination FIFO Set Count Reload
Destination FIFO Set Destination Address B Reference Register
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Table 7-7. EDMA3 Transfer Controller 1 Registers (continued)
HEX ADDRESS RANGE
ACRONYM
02A2 8288
DFDSTBREF
REGISTER NAME
Destination FIFO Set Destination Address B Reference Register
02A2 828C - 02A2 82FC
-
02A2 8300
DFOPT0
Reserved
Destination FIFO Options Register 0
02A2 8304
DFSRC0
Destination FIFO Source Address Register 0
02A2 8308
DFCNT0
Destination FIFO Count Register 0
02A2 830C
DFDST0
Destination FIFO Destination Address Register 0
02A2 8310
DFBIDX0
Destination FIFO BIDX Register 0
02A2 8314
DFMPPRXY0
02A2 8318 - 02A2 833C
-
Destination FIFO Memory Protection Proxy Register 0
02A2 8340
DFOPT1
Destination FIFO Options Register 1
02A2 8344
DFSRC1
Destination FIFO Source Address Register 1
Reserved
02A2 8348
DFCNT1
Destination FIFO Count Register 1
02A2 834C
DFDST1
Destination FIFO Destination Address Register 1
02A2 8350
DFBIDX1
Destination FIFO BIDX Register 1
02A2 8354
DFMPPRXY1
02A2 8358 - 02A2 837C
-
Destination FIFO Memory Protection Proxy Register 1
02A2 8380
DFOPT2
Destination FIFO Options Register 2
02A2 8384
DFSRC2
Destination FIFO Source Address Register 2
02A2 8388
DFCNT2
Destination FIFO Count Register 2
02A2 838C
DFDST2
Destination FIFO Destination Address Register 2
02A2 8390
DFBIDX2
Destination FIFO BIDX Register 2
Reserved
02A2 8394
DFMPPRXY2
02A2 8398 - 02A2 83BC
-
Destination FIFO Memory Protection Proxy Register 2
02A2 83C0
DFOPT3
Destination FIFO Options Register 3
02A2 83C4
DFSRC3
Destination FIFO Source Address Register 3
02A2 83C8
DFCNT3
Destination FIFO Count Register 3
02A2 83CC
DFDST3
Destination FIFO Destination Address Register 3
02A2 83D0
DFBIDX3
Destination FIFO BIDX Register 3
02A2 83D4
DFMPPRXY3
02A2 83D8 - 02A2 FFFF
-
Reserved
Destination FIFO Memory Protection Proxy Register 3
Reserved
Table 7-8. EDMA3 Transfer Controller 2 Registers
112
HEX ADDRESS RANGE
ACRONYM
02A3 0000
PID
Peripheral Identification Register
EDMA3TC Configuration Register
02A3 0004
TCCFG
02A3 0008 - 02A3 00FC
-
02A3 0100
TCSTAT
REGISTER NAME
Reserved
EDMA3TC Channel Status Register
02A3 0104 - 02A3 011C
-
02A3 0120
ERRSTAT
02A3 0124
ERREN
02A3 0128
ERRCLR
Error Clear Register
02A3 012C
ERRDET
Error Details Register
02A3 0130
ERRCMD
Error Interrupt Command Register
02A3 0134 - 02A3 013C
-
02A3 0140
RDRATE
02A3 0144 - 02A3 023C
-
02A3 0240
SAOPT
Reserved
Error Register
Error Enable Register
Reserved
Read Rate Register
Reserved
Source Active Options Register
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Table 7-8. EDMA3 Transfer Controller 2 Registers (continued)
HEX ADDRESS RANGE
ACRONYM
02A3 0244
SASRC
REGISTER NAME
Source Active Source Address Register
02A3 0248
SACNT
Source Active Count Register
02A3 024C
SADST
Source Active Destination Address Register
02A3 0250
SABIDX
Source Active Source B-Index Register
02A3 0254
SAMPPRXY
Source Active Memory Protection Proxy Register
02A3 0258
SACNTRLD
Source Active Count Reload Register
02A3 025C
SASRCBREF
Source Active Source Address B-Reference Register
Source Active Destination Address B-Reference Register
02A3 0260
SADSTBREF
02A3 0264 - 02A3 027C
-
02A3 0280
DFCNTRLD
02A3 0284
DFSRCBREF
Destination FIFO Set Destination Address B Reference Register
Destination FIFO Set Destination Address B Reference Register
Reserved
Destination FIFO Set Count Reload
02A3 0288
DFDSTBREF
02A3 028C - 02A3 02FC
-
02A3 0300
DFOPT0
Destination FIFO Options Register 0
02A3 0304
DFSRC0
Destination FIFO Source Address Register 0
02A3 0308
DFCNT0
Destination FIFO Count Register 0
02A3 030C
DFDST0
Destination FIFO Destination Address Register 0
02A3 0310
DFBIDX0
Destination FIFO BIDX Register 0
02A3 0314
DFMPPRXY0
02A3 0318 - 02A3 033C
-
02A3 0340
DFOPT1
Destination FIFO Options Register 1
02A3 0344
DFSRC1
Destination FIFO Source Address Register 1
02A3 0348
DFCNT1
Destination FIFO Count Register 1
02A3 034C
DFDST1
Destination FIFO Destination Address Register 1
02A3 0350
DFBIDX1
Destination FIFO BIDX Register 1
02A3 0354
DFMPPRXY1
02A3 0358 - 02A3 037C
-
Reserved
Destination FIFO Memory Protection Proxy Register 0
Reserved
Destination FIFO Memory Protection Proxy Register 1
Reserved
02A3 0380
DFOPT2
Destination FIFO Options Register 2
02A3 0384
DFSRC2
Destination FIFO Source Address Register 2
02A3 0388
DFCNT2
Destination FIFO Count Register 2
02A3 038C
DFDST2
Destination FIFO Destination Address Register 2
02A3 0390
DFBIDX2
Destination FIFO BIDX Register 2
02A3 0394
DFMPPRXY2
02A3 0398 - 02A3 03BC
-
Destination FIFO Memory Protection Proxy Register 2
Reserved
02A3 03C0
DFOPT3
Destination FIFO Options Register 3
02A3 03C4
DFSRC3
Destination FIFO Source Address Register 3
02A3 03C8
DFCNT3
Destination FIFO Count Register 3
02A3 03CC
DFDST3
Destination FIFO Destination Address Register 3
02A3 03D0
DFBIDX3
Destination FIFO BIDX Register 3
02A3 03D4
DFMPPRXY3
02A3 03D8 - 02A3 7FFF
-
Destination FIFO Memory Protection Proxy Register 3
Reserved
Table 7-9. EDMA3 Transfer Controller 3 Registers
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
02A3 8000
PID
Peripheral Identification Register
02A3 8004
TCCFG
EDMA3TC Configuration Register
02A3 8008 - 02A3 80FC
-
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Reserved
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Table 7-9. EDMA3 Transfer Controller 3 Registers (continued)
114
HEX ADDRESS RANGE
ACRONYM
02A3 8100
TCSTAT
02A3 8104 - 02A3 811C
-
02A3 8120
ERRSTAT
02A3 8124
ERREN
REGISTER NAME
EDMA3TC Channel Status Register
Reserved
Error Register
Error Enable Register
02A3 8128
ERRCLR
Error Clear Register
02A3 812C
ERRDET
Error Details Register
02A3 8130
ERRCMD
Error Interrupt Command Register
02A3 8134 - 02A3 813C
-
02A3 8140
RDRATE
Reserved
02A3 8144 - 02A3 823C
-
02A3 8240
SAOPT
Source Active Options Register
02A3 8244
SASRC
Source Active Source Address Register
02A3 8248
SACNT
Source Active Count Register
02A3 824C
SADST
Source Active Destination Address Register
02A3 8250
SABIDX
Source Active Source B-Index Register
02A3 8254
SAMPPRXY
Source Active Memory Protection Proxy Register
02A3 8258
SACNTRLD
Source Active Count Reload Register
02A3 825C
SASRCBREF
Source Active Source Address B-Reference Register
02A3 8260
SADSTBREF
Source Active Destination Address B-Reference Register
02A3 8264 - 02A3 827C
-
02A3 8280
DFCNTRLD
02A3 8284
DFSRCBREF
Destination FIFO Set Destination Address B Reference Register
02A3 8288
DFDSTBREF
Destination FIFO Set Destination Address B Reference Register
02A3 828C - 02A3 82FC
-
Read Rate Register
Reserved
Reserved
Destination FIFO Set Count Reload
Reserved
02A3 8300
DFOPT0
Destination FIFO Options Register 0
02A3 8304
DFSRC0
Destination FIFO Source Address Register 0
02A3 8308
DFCNT0
Destination FIFO Count Register 0
02A3 830C
DFDST0
Destination FIFO Destination Address Register 0
02A3 8310
DFBIDX0
Destination FIFO BIDX Register 0
02A3 8314
DFMPPRXY0
02A3 8318 - 02A3 833C
-
Destination FIFO Memory Protection Proxy Register 0
Reserved
02A3 8340
DFOPT1
Destination FIFO Options Register 1
02A3 8344
DFSRC1
Destination FIFO Source Address Register 1
02A3 8348
DFCNT1
Destination FIFO Count Register 1
02A3 834C
DFDST1
Destination FIFO Destination Address Register 1
02A3 8350
DFBIDX1
Destination FIFO BIDX Register 1
02A3 8354
DFMPPRXY1
Destination FIFO Memory Protection Proxy Register 1
02A3 8358 - 02A3 837C
-
02A3 8380
DFOPT2
Reserved
Destination FIFO Options Register 2
02A3 8384
DFSRC2
Destination FIFO Source Address Register 2
02A3 8388
DFCNT2
Destination FIFO Count Register 2
02A3 838C
DFDST2
Destination FIFO Destination Address Register 2
02A3 8390
DFBIDX2
Destination FIFO BIDX Register 2
02A3 8394
DFMPPRXY2
Destination FIFO Memory Protection Proxy Register 2
02A3 8398 - 02A3 83BC
-
02A3 83C0
DFOPT3
Reserved
Destination FIFO Options Register 3
02A3 83C4
DFSRC3
Destination FIFO Source Address Register 3
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Table 7-9. EDMA3 Transfer Controller 3 Registers (continued)
HEX ADDRESS RANGE
ACRONYM
02A3 83C8
DFCNT3
Destination FIFO Count Register 3
02A3 83CC
DFDST3
Destination FIFO Destination Address Register 3
02A3 83D0
DFBIDX3
Destination FIFO BIDX Register 3
02A3 83D4
DFMPPRXY3
02A3 83D8 - 02A3 FFFF
-
Copyright © 2006–2012, Texas Instruments Incorporated
REGISTER NAME
Destination FIFO Memory Protection Proxy Register 3
Reserved
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Interrupts
7.5.1
Interrupt Sources and Interrupt Controller
The CPU interrupts on the C6454 device are configured through the C64x+ Megamodule Interrupt
Controller. The interrupt controller allows for up to 128 system events to be programmed to any of the
twelve CPU interrupt inputs (CPUINT4 - CPUINT15), the CPU exception input (EXCEP), or the advanced
emulation logic. The 128 system events consist of both internally-generated events (within the
megamodule) and chip-level events. Table 7-10 shows the mapping of system events. For more
information on the Interrupt Controller, see the TMS320C64x+ Megamodule Reference Guide (literature
number SPRU871).
Table 7-10. C6454 System Event Mapping
EVENT NUMBER
INTERRUPT EVENT
0 (1)
EVT0
Output of event combiner 0 in interrupt controller, for events 1 - 31.
1 (1)
EVT1
Output of event combiner 1 in interrupt controller, for events 32 - 63.
2 (1)
EVT2
Output of event combiner 2 in interrupt controller, for events 64 - 95.
3 (1)
EVT3
Output of event combiner 3 in interrupt controller, for events 96 127.
4-8
Reserved
9 (1)
116
Reserved. These system events are not connected and, therefore,
not used.
EMU interrupt for:
1. Host scan access
2. DTDMA transfer complete
3. AET interrupt
10
None
11 (1)
EMU_RTDXRX
EMU real-time data exchange (RTDX) receive complete
(1)
EMU_RTDXTX
EMU RTDX transmit complete
12
(1)
EMU_DTDMA
DESCRIPTION
This system event is not connected and, therefore, not used.
13 (1)
IDMA0
IDMA channel 0 interrupt
14 (1)
IDMA1
IDMA channel 1 interrupt
15
DSPINT
HPI/PCI-to-DSP interrupt
16
I2CINT
I2C interrupt
17
MACINT
18
AEASYNCERR
19 - 23
Reserved
24
EDMA3CC_GINT
25 - 39
Reserved
40
RINT0
McBSP0 receive interrupt
41
XINT0
McBSP0 transmit interrupt
42
RINT1
McBSP1 receive interrupt
43
XINT1
McBSP1 transmit interrupt
44 - 50
Reserved
51
GPINT0
GPIO interrupt
52
GPINT1
GPIO interrupt
53
GPINT2
GPIO interrupt
54
GPINT3
GPIO interrupt
55
GPINT4
GPIO interrupt
56
GPINT5
GPIO interrupt
57
GPINT6
GPIO interrupt
Ethernet MAC interrupt
EMIFA error interrupt
Reserved. This system event is not connected and, therefore, not
used.
EDMA3 channel global completion interrupt
Reserved. These system events are not connected and, therefore,
not used.
Reserved. These system events are not connected and, therefore,
not used.
This system event is generated from within the C64x+ megamodule.
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Table 7-10. C6454 System Event Mapping (continued)
EVENT NUMBER
INTERRUPT EVENT
58
GPINT7
GPIO interrupt
59
GPINT8
GPIO interrupt
60
GPINT9
GPIO interrupt
61
GPINT10
GPIO interrupt
62
GPINT11
GPIO interrupt
63
GPINT12
GPIO interrupt
64
GPINT13
GPIO interrupt
65
GPINT14
GPIO interrupt
66
GPINT15
GPIO interrupt
67
TINTLO0
Timer 0 lower counter interrupt
68
TINTHI0
Timer 0 higher counter interrupt
69
TINTLO1
Timer 1 lower counter interrupt
70
TINTHI1
Timer 1 higher counter interrupt
71
EDMA3CC_INT0
EDMA3CC completion interrupt - Mask0
72
EDMA3CC_INT1
EDMA3CC completion interrupt - Mask1
73
EDMA3CC_INT2
EDMA3CC completion interrupt - Mask2
74
EDMA3CC_INT3
EDMA3CC completion interrupt - Mask3
75
EDMA3CC_INT4
EDMA3CC completion interrupt - Mask4
76
EDMA3CC_INT5
EDMA3CC completion interrupt - Mask5
77
EDMA3CC_INT6
EDMA3CC completion interrupt - Mask6
78
EDMA3CC_INT7
EDMA3CC completion interrupt - Mask7
79
EDMA3CC_ERRINT
80
Reserved
81
EDMA3TC0_ERRINT
EDMA3TC0 error interrupt
82
EDMA3TC1_ERRINT
EDMA3TC1 error interrupt
83
EDMA3TC2_ERRINT
EDMA3TC2 error interrupt
84
EDMA3TC3_ERRINT
EDMA3TC3 error interrupt
85 - 95
Reserved
Reserved. These system events are not connected and, therefore,
not used.
96 (2)
INTERR
Interrupt Controller dropped CPU interrupt event
97
(2)
(2)
EMC_IDMAERR
DESCRIPTION
EDMA3CC error interrupt
Reserved. This system event is not connected and, therefore, not
used.
EMC invalid IDMA parameters
98 - 99
Reserved
Reserved. These system events are not connected and, therefore,
not used.
100 (2)
EFIINTA
EFI interrupt from side A
101 (2)
EFIINTB
EFI interrupt from side B
102 - 112
Reserved
Reserved. These system events are not connected and, therefore,
not used.
113 (2)
L1P_ED1
L1P single bit error detected during DMA read
114 - 115
Reserved
Reserved. These system events are not connected and, therefore,
not used.
116 (2)
L2_ED1
L2 single bit error detected
117 (2)
L2_ED2
L2 two bit error detected
118 (2)
PDC_INT
Powerdown sleep interrupt
119
Reserved
Reserved. This system event is not connected and, therefore, not
used.
120 (2)
L1P_CMPA
L1P CPU memory protection fault
121 (2)
L1P_DMPA
L1P DMA memory protection fault
This system event is generated from within the C64x+ megamodule.
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Table 7-10. C6454 System Event Mapping (continued)
EVENT NUMBER
INTERRUPT EVENT
122 (2)
L1D_CMPA
L1D CPU memory protection fault
123 (2)
L1D_DMPA
L1D DMA memory protection fault
124 (2)
L2_CMPA
L2 CPU memory protection fault
125 (2)
L2_DMPA
L2 DMA memory protection fault
126
(2)
127 (2)
118
IDMA_CMPA
IDMA_BUSERR
DESCRIPTION
IDMA CPU memory protection fault
IDMA bus error interrupt
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7.5.2
SPRS311I – APRIL 2006 – REVISED MARCH 2012
External Interrupts Electrical Data/Timing
Table 7-11. Timing Requirements for External Interrupts (1)
(see Figure 7-6)
-720
-850
A-1000/-1000
NO.
MIN
(1)
UNIT
MAX
1
tw(NMIL)
Width of the NMI interrupt pulse low
6P
ns
2
tw(NMIH)
Width of the NMI interrupt pulse high
6P
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.
1
2
NMI
Figure 7-6. NMI Interrupt Timing
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Reset Controller
The reset controller detects the different type of resets supported on the C6454 device and manages the
distribution of those resets throughout the device.
The C6454 device has several types of resets: power-on reset, warm reset, system reset, and CPU reset.
Table 7-12 explains further the types of reset, the reset initiator, and the effects of each reset on the chip.
For more information on the effects of each reset on the PLL controllers and their clocks, see
Section 7.6.7, Reset Electrical Data/Timing.
Table 7-12. Reset Types
TYPE
INITIATOR
EFFECT(s)
Power-on Reset
POR pin
Resets the entire chip including the test and emulation logic.
Warm Reset
RESET pin
Resets everything except for the test and emulation logic and PLL2.
Emulator stays alive during Warm Reset.
System Reset
Emulator
A system reset maintains memory contents and does not reset the
test and emulation circuitry. The device configuration pins are also
not re-latched and the state of the peripherals is also not affected. (1)
CPU Local Reset
HPI/PCI
CPU local reset.
(1)
On the C6454 device, peripherals can be in one of several states. These states are listed in Table 3-4.
7.6.1
Power-on Reset (POR Pin)
Power-on Reset is initiated by the POR pin and is used to reset the entire chip, including the test and
emulation logic. Power-on Reset is also referred to as a cold reset since the device usually goes through a
power-up cycle. During power-up, the POR pin must be asserted (driven low) until the power supplies
have reached their normal operating conditions. Note that a device power-up cycle is not required to
initiate a Power-on Reset.
The following sequence must be followed during a Power-on Reset:
1. Wait for all power supplies to reach normal operating conditions while keeping the POR pin asserted
(driven low).
While POR is asserted, all pins will be set to high-impedance. After the POR pin is deasserted (driven
high), all Z group pins, low group pins, and high group pins are set to their reset state and will remain
at their reset state until the otherwise configured by their respective peripheral. All peripherals, except
those selected for boot purposes, are disabled after a Power-on Reset and must be enabled through
the Device State Control registers; for more details, see Section 3.3, Peripheral Selection After Device
Reset.
2. Once all the power supplies are within valid operating conditions, the POR pin must remain asserted
(low) for a minimum of 256 CLKIN2 cycles. The PLL1 controller input clock, CLKIN1, and the PCI input
clock, PCLK, must also be valid during this time. PCLK is only needed if the PCI module is being used.
If the DDR2 memory controller and the EMAC peripheral are not needed, CLKIN2 can be tied low and,
in this case, the POR pin must remain asserted (low) for a minimum of 256 CLKIN1 cycles after all
power supplies have reached valid operating conditions.
Within the low period of the POR pin, the following happens:
– The reset signals flow to the entire chip (including the test and emulation logic), resetting modules
that use reset asynchronously.
– The PLL1 controller clocks are started at the frequency of the system reference clock. The clocks
are propagated throughout the chip to reset modules that use reset synchronously. By default,
PLL1 is in reset and unlocked.
– The PLL2 controller clocks are started at the frequency of the system reference clock. PLL2 is held
in reset. Since the PLL2 controller always operates in PLL mode, the system reference clock and
all the system clocks are invalid at this point.
– The RESETSTAT pin stays asserted (low), indicating the device is in reset.
3. The POR pin may now be deasserted (driven high).
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When the POR pin is deasserted, the configuration pin values are latched and the PLL controllers
change their system clocks to their default divide-down values. PLL2 is taken out of reset and
automatically starts its locking sequence. Other device initialization is also started.
4. After device initialization is complete, the RESETSTAT pin is deasserted (driven high). By this time,
PLL2 has already completed its locking sequence and is outputting a valid clock. The system clocks of
both PLL controllers are allowed to finish their current cycles and then paused for 10 cycles of their
respective system reference clocks. After the pause the system clocks are restarted at their default
divide-by settings.
5. The device is now out of reset, device execution begins as dictated by the selected boot mode (see
Section 2.4, Boot Sequence).
NOTE
To most of the device, reset is de-asserted only when the POR and RESET pins are both
de-asserted (driven high). Therefore, in the sequence described above, if the RESET pin is
held low past the low period of the POR pin, most of the device will remain in reset. The only
exception being that PLL2 is taken out of reset as soon as POR is de-asserted (driven high),
regardless of the state of the RESET pin. The RESET pin should not be tied together with
the POR pin.
7.6.2
Warm Reset (RESET Pin)
A Warm Reset has the same effects as a Power-on Reset, except that in this case, the test and emulation
logic and PLL2 are not reset.
The following sequence must be followed during a Warm Reset:
1. Hold the RESET pin low for a minimum of 24 CLKIN1 cycles. Within the minimum 24 CLKIN1 cycles.
Within the low period of the RESET pin, the following happens:
– The Z group pins, low group pins, and the high group pins are set to their reset state with one
exception:
The PCI pins are not affected by warm reset if the PCI module was enabled before RESET went
low. In this case, PCI pins stay at whatever their value was before RESET went low.
– The reset signals flow to the entire chip (excluding the test and emulation logic), resetting modules
that use reset asynchronously.
– The PLL1 controller is reset thereby switching back to bypass mode and resetting all its registers to
their default values. PLL1 is placed in reset and loses lock. The PLL1 controller clocks start running
at the frequency of the system reference clock. The clocks are propagated throughout the chip to
reset modules that use reset synchronously.
– The PLL2 controller is reset thereby resetting all its registers to their default values. The PLL2
controller clocks start running at the frequency of the system reference clock. PLL2 is not reset,
therefore it remains locked.
– The RESETSTAT pin becomes active (low), indicating the device is in reset.
2. The RESET pin may now be released (driven inactive high).
When the RESET pin is released, the configuration pin values are latched and the PLL controllers
immediately change their system clocks to their default divide-down values. Other device initialization
is also started.
3. After device initialization is complete, the RESETSTAT pin goes inactive (high). All system clocks are
allowed to finish their current cycles and then paused for 10 cycles of their respective system reference
clocks. After the pause the system clocks are restarted at their default divide-by settings.
4. The device is now out of reset, device execution begins as dictated by the selected boot mode (see
Section 2.4, Boot Sequence).
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NOTE
The POR pin should be held inactive (high) throughout the Warm Reset sequence.
Otherwise, if POR is activated (brought low), the minimum POR pulse width must be met.
The RESET pin should not be tied together with the POR pin.
7.6.3
System Reset
The emulator initiates a System Reset via the ICEPick module. This ICEPick-initiated reset is nonmaskable. To invoke the maximum reset via the ICEPick module, the user can perform the following from
the Code Composer Studio™ menu: Debug → Advanced Resets → System Reset.
The following memory contents are maintained during a System Reset:
• DDR2 Memory Controller: The DDR2 Memory Controller registers are not reset. In addition, the DDR2
SDRAM memory content is retained if the user places the DDR2 SDRAM in self-refresh mode before
invoking the System Reset.
• EMIFA: The contents of the memory connected to the EMIFA are retained. The EMIFA registers are
not reset.
Test, emulation, and clock logic are unaffected. The device configuration pins are also not re-latched and
the state of the peripherals (see Table 3-4) is not affected.
During a System Reset, the following happens:
1. The System Reset is initiated by the emulator.
During this time, the following happens:
– The reset signals flow to the entire chip resetting all the modules on chip except the test and
emulation logic.
– The PLL controllers are not reset. Internal system clocks are unaffected. If PLL1/PLL2 were locked
before the System Reset, they remain locked.
– The RESETSTAT pin goes low to indicate an internal reset is being generated.
2. After device initialization is complete, the RESETSTAT pin is deasserted (driven high). In addition, the
PLL controllers pause their system clocks for about 10 cycles.
At this point:
– The state of the peripherals before the System Reset is not changed. For example, if McBSP0 was
in the enabled state before System Reset, it will remain in the enabled state after System Reset.
– The I/O pins are controlled as dictated by the DEVSTAT register.
– The DDR2 Memory Controller and EMIFA registers retain their previous values. Only the DDR2
Memory Controller and EMIFA state machines are reset by the System Reset.
– The PLL controllers are operating in the mode prior to System Reset. System clocks are
unaffected.
The boot sequence is started after the system clocks are restarted. Since the configuration pins (including
the BOOTMODE[3:0] pins) are not latched with a System Reset, the previous values, as shown in the
DEVSTAT register, are used to select the boot mode.
7.6.4
CPU Reset
A CPU Reset is initiated by the HPI or PCI peripheral. This reset only affects the CPU. During a PCIinitiated CPU Reset, the PCI pins are set to their reset state. With the exception of the HRDY/PIRDY pin,
the PCI pins have a reset state of high-impedance; the HRDY/PIRDY pin goes high during reset.
7.6.5
Reset Priority
If any of the above reset sources occur simultaneously, the PLLCTRL only processes the highest priority
reset request. The rest request priorities are as follows (high to low):
• Power-on Reset
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•
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Warm Reset
System Reset
CPU Reset
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Reset Controller Register
The reset type status (RSTYPE) register (029A 00E4) is the only register for the reset controller. This
register falls in the same memory range as the PLL1 controller registers [029A 0000 - 029A 01FF] (see
Table 7-18).
7.6.6.1
Reset Type Status Register Description
The rest type status (RSTYPE) register latches the cause of the last reset. If multiple reset sources occur
simultaneously, this register latches the highest priority reset source. The reset type status register is
shown in Figure 7-7 and described in Table 7-13.
31
16
Reserved
R-0
15
3
2
1
0
Reserved
4
SRST
Rsvd
WRST
POR
R-0
R-0
R-0
R-0
R-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 7-7. Reset Type Status Register (RSTYPE) [Hex Address: 029A 00E4]
Table 7-13. Reset Type Status Register (RSTYPE) Field Descriptions
Bit
31:4
3
Value
Reserved
Description
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
SRST
System reset.
0
System Reset was not the last reset to occur.
1
System Reset was the last reset to occur.
2
Reserved
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
1
WRST
Warm reset.
0
124
Field
0
Warm Reset was not the last reset to occur.
1
Warm Reset was the last reset to occur.
POR
Power-on reset.
0
Power-on Reset was not the last reset to occur.
1
Power-on Reset was the last reset to occur.
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Reset Electrical Data/Timing
Table 7-14. Timing Requirements for Reset (1)
(2) (3)
(see Figure 7-8 and Figure 7-9)
-720
-850
A-1000/-1000
NO.
MIN
(1)
(2)
(3)
(4)
(5)
UNIT
MAX
256D (4)
ns
24C
ns
tsu(boot)
Setup time, boot mode and configuration pins valid before POR high or
RESET high (5)
6P
ns
th(boot)
Hold time, boot mode and configuration pins valid after POR high or
RESET high (5)
6P
ns
5
tw(POR)
Pulse duration, POR low
6
tw(RESET)
Pulse duration, RESET low
7
8
C = 1/CLKIN1 clock frequency in ns.
D = 1/CLKIN2 clock frequency in ns.
P = 1/CPU clock frequency in nanoseconds (ns). Note that after power-on reset and warm reset the CPU frequency is equal to the
CLKIN1 frequency divided by three due to the PLL1 controller being reset (see Section 7.6, Reset Controller).
If CLKIN2 is not used, tw(POR) must be measured in terms of CLKIN1 cycles; otherwise, use CLKIN2 cycles.
AEA[19:0], ABA[1:0], and PCI_EN are the boot configuration pins during device reset. Note: If a configuration pin must be routed out
from the device and 3-stated (not driven), the internal pullup/pulldown (IPU/IPD) resistor should not be relied upon; TI recommends the
use of an external pullup/pulldown resistor. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 3.7, Pullup/Pulldown Resistors.
Table 7-15. Switching Characteristics Over Recommended Operating Conditions During Reset (1)
(see Figure 7-9)
NO.
PARAMETER
-720
-850
A-1000/-1000
MIN
9
(1)
td(PORH-RSTATH)
Delay time, POR high AND RESET high to RESETSTAT high
UNIT
MAX
15000C
ns
C = 1/CLKIN1 clock frequency in ns.
For Figure 7-8, note the following:
• Z group consists of: all I/O/Z and O/Z pins, except for Low and High group pins. Pins become high
impedance as soon as their respective power supply has reached normal operating coditions. Pins
remain in high impedance until configured otherwise by their respective peripheral.
• Low group consists of: MTXD0/RMTXD0, MTXD1/RMTXD1, MTXD2/RMTXD2, MTXD3/RMTXD3,
MTXD4/RMTXD4, and MTXEN/RMTXEN. Pins become low as soon as their respective power supply
has reached normal operating conditions. Pins remain low until configured otherwise by their
respective peripheral.
• High group consists of: AHOLD, ABUSREQ, and HRDY/PIRDY. Pins become high as soon as their
respective power supply has reached normal operating conditions. Pins remain high until configured
otherwise by their respective peripheral. The ABUSREQ pin remains high until the EMIFA is enabled
through the PERCFG1 register. Once the EMIFA is enabled, the ABUSREQ pin is driven to its inactive
state (driven low).
• All peripherals must be enable through software following a Power-on Reset; for more details, see
Section 7.6.1, Power-on Reset.
• For power-supply sequence requirements, see Section 7.3.1, Power-Supply Sequencing.
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Power Supplies Ramping
Power Supplies Stable
CLKIN1
PCLK
5
POR
RESET
9
RESETSTAT
SYSREFCLK (PLL1C)
SYSCLK2
SYSCLK3
SYSCLK4
SYSCLK5
AECLKOUT (Internal)
7
Boot and Device
Configuration Pins
8
Z Group
Undefined
Low Group
Undefined
High-Z
Low
High
High Group
Undefined
CLKIN2
Internal Reset PLL2C
Undefined
SYSREFCLK (PLL2C)
Undefined
PLL2 Unlocked
SYSCLK1 (PLL2C)
Undefined
PLL2 Unlocked
A.
B.
C.
D.
E.
PLL2 Locked(A)
Clock Valid
Clock Valid (B)
SYSREFCLK of the PLL2 controller runs at CLKIN2 ×10.
SYSCLK1 of PLL2 controller runs at SYSREFCLK/2 (default).
Power supplies, CLKIN1, CLKIN2 (if used), and PCLK (if used) must be stable before the start of tw(POR).
Do not tie the RESET and POR pins together.
The RESET pin can be brought high after the POR pin has been brought high. In this case, the RESET pin must be
held low for a minimum of tw(RESET) after the POR pin has been brought high.
Figure 7-8. Power-Up Timing
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CLKIN1
CLKIN2
POR
6
RESET(A)(B)
9
RESETSTAT
7
8
Boot and
Device Configuration Pins(C)
A.
B.
C.
RESET should only be used after device has been powered up. For more details on the use of the RESET pin, see
Section 7.6, Reset Controller.
A reset signal is generated internally during a Warm Reset. This internal reset signal has the same effect as the
RESET pin during a Warm Reset.
Boot and Device Configurations Inputs (during reset) include: AEA[19:0], ABA[1:0], and PCI_EN.
Figure 7-9. Warm Reset Timing
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PLL1 and PLL1 Controller
The primary PLL controller generates the input clock to the C64x+ megamodule (including the CPU) as
well as most of the system peripherals such as the multichannel buffered serial ports (McBSPs) and the
external memory interface (EMIF).
As shown in Figure 7-10, the PLL1 controller features a software-programmable PLL multiplier controller
(PLLM) and five dividers (PREDIV, D2, D3, D4, and D5). The PLL1 controller uses the device input clock
CLKIN1 to generate a system reference clock (SYSREFCLK) and four system clocks (SYSCLK2,
SYSCLK3, SYSCLK4, and SYSCLK5).
PLL1 power is supplied externally via the PLL1 power-supply pin (PLLV1). An external EMI filter circuit
must be added to PLLV1, as shown in Figure 7-10. The 1.8-V supply of the EMI filter must be from the
same 1.8-V power plane supplying the I/O power-supply pin, DVDD18. TI requires EMI filter manufacturer
Murata, part number NFM18CC222R1C3 or NFM18CC223R1C3.
All PLL external components (C1, C2, and the EMI Filter) must be placed as close to the C64x+ DSP
device as possible. For the best performance, TI recommends that all the PLL external components be on
a single side of the board without jumpers, switches, or components other than the ones shown. For
reduced PLL jitter, maximize the spacing between switching signals and the PLL external components
(C1, C2, and the EMI Filter).
The minimum CLKIN1 rise and fall times should also be observed. For the input clock timing
requirements, see Section 7.7.4, PLL1 Controller Input and Output Clock Electrical Data/Timing.
CAUTION
The PLL controller module as described in the TMS320C645x DSP SoftwareProgrammable Phase-Locked Loop (PLL) Controller User's Guide (literature number
SPRUE56) includes a superset of features, some of which are not supported on the
C6454 DSP. The following sections describe the features that are supported; it should
be assumed that any feature not included in these sections is not supported by the
C6454 DSP.
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TMS320C6454 DSP
+1.8 V
PLLV1
C1
EMI Filter
C2
560 pF 0.1 µF
CLKIN1
(B)
PLL1
PLLOUT
PLLREF
PLL1 Controller
PLLEN (PLLCTL.[0])
SYSREFCLK
(C64x+ MegaModule)
DIVIDER PREDIV
/1, /2, /3
ENA
PLLM
x1, x15,
x20, x25,
x30, x32
DIVIDER D2
(A)
1
0
PREDEN (PREDIV.[15])
SYSCLK2
/3
DIVIDER D3
(A)
SYSCLK3
/6
DIVIDER D4
D4EN (PLLDIV4.[15])
SYSCLK4
(Internal EMIF Clock Input)
/2, /4,
..., /16
ENA
DIVIDER D5
D5EN (PLLDIV5.[15])
/1, /2,
..., /8
ENA
SYSCLK5
(Emulation and Trace)
AECLKIN (External EMIF Clock Input)
GP0
0
(EMIF Input Clock)
1
1
0
SYSCLKOUT_EN
(AEA[4] pin)
EMIFA
AECLKOUT
A.
B.
AECLKINSEL
(AEA[15] pin)
GP1/SYSCLK4
DIVIDER D2 and DIVIDER D3 are always enabled.
CLKIN1 is a 3.3-V signal.
Figure 7-10. PLL1 and PLL1 Controller
7.7.1
PLL1 Controller Device-Specific Information
7.7.1.1
Internal Clocks and Maximum Operating Frequencies
As shown in Figure 7-10, the PLL1 controller generates several internal clocks including the system
reference clock (SYSREFCLK), and the system clocks (SYSCLK2/3/4/5). The high-frequency clock signal
SYSREFCLK is directly used to clock the C64x+ megamodule (including the CPU) and also serves as a
reference clock for the rest of the DSP system.
Dividers D2, D3, D4, and D5 divide the high-frequency clock SYSREFCLK to generate SYSCLK2,
SYSCLK3, SYSCLK4, and SYSCLK5, respectively. The system clocks are used to clock different portions
of the DSP:
• SYSCLK2 is used to clock the switched central resources (SCRs), EDMA3, as well as the data bus
interfaces of the EMIFA and DDR2 Memory Controller.
• SYSCLK3 clocks the PCI, HPI, McBSP, GPIO, TIMER, and I2C peripherals, as well as the
configuration bus of the PLL2 Controller.
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SYSCLK4 is used as the internal clock for the EMIFA. It is also used to clock other logic within the
DSP.
SYSCLK5 clocks the emulation and trace logic of the DSP.
•
The divider ratio bits of dividers D2 and D3 are fixed at ÷3 and ÷6, respectively. The divider ratio bits of
dividers D4 and D5 are programmable through the PLL controller divider registers PLLDIV4 and PLLDIV5,
respectively.
The PLL multiplier controller (PLLM) and the dividers (D4 and D5) must be programmed after reset. There
is no hardware CLKMODE selection on the C6454 device.
Since the divider ratio bits for dividers D2 and D3 are fixed, the frequency of SYSCLK2 and SYSCLK3 is
tied to the frequency of SYSREFCLK. However, the frequency of SYSCLK4 and SYSCLK5 depends on
the configuration of dividers D4 and D5. For example, with PLLM in the PLL1 multiply control register set
to 10011b (x20 mode) and a 50-MHz CLKIN1 input, the PLL output PLLOUT is set to 1000 MHz and
SYSCLK2 and SYSCLK3 run at 333 MHz and 166 MHz, respectively. Divider D4 can be programmed
through the PLLDIV4 register to divide SYSREFCLK by 10 such that SYSCLK4 and, hence, the EMIF
internal clock, runs at 120 MHz.
All hosts (HPI, PCI, etc.) must hold off accesses to the DSP while the frequency of its internal clocks is
changing. A mechanism must be in place such that the DSP notifies the host when the PLL configuration
has completed.
Note that there is a minimum and maximum operating frequency for PLLREF, PLLOUT, SYSCLK4, and
SYSCLK5. The PLL1 Controller must not be configured to exceed any of these constraints (certain
combinations of external clock input, internal dividers, and PLL multiply ratios might not be supported). For
the PLL clocks input and output frequency ranges, see Table 7-16.
Table 7-16. PLL1 Clock Frequency Ranges
CLOCK SIGNAL
MIN
MAX
UNIT
66.6
MHz
33.3
66.6
MHz
400
1000
MHz
25
166
MHz
333
MHz
CLKIN1
PLLREF (PLLEN = 1) (1)
PLLOUT
(1)
SYSCLK4
SYSCLK5
(1)
Only applies when the PLL1 Controller is set to PLL mode (PLLEN = 1 in the PLLCTL register).
7.7.1.2
PLL1 Controller Operating Modes
The PLL1 controller has two modes of operation: bypass mode and PLL mode. The mode of operation is
determined by the PLLEN bit of the PLL control register (PLLCTL). In PLL mode, SYSREFCLK is
generated from the device input clock CLKIN1 using the divider PREDIV and the PLL multiplier PLLM. In
bypass mode, CLKIN1 is fed directly to SYSREFCLK.
All hosts (HPI, PCI, etc.) must hold off accesses to the DSP while the frequency of its internal clocks is
changing. A mechanism must be in place such that the DSP notifies the host when the PLL configuration
has completed.
7.7.1.3
PLL1 Stabilization, Lock, and Reset Times
The PLL stabilization time is the amount of time that must be allotted for the internal PLL regulators to
become stable after device powerup. The PLL should not be operated until this stabilization time has
expired.
The PLL reset time is the amount of wait time needed when resetting the PLL (writing PLLRST = 1), in
order for the PLL to properly reset, before bringing the PLL out of reset (writing PLLRST = 0). For the
PLL1 reset time value, see Table 7-17.
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The PLL lock time is the amount of time needed from when the PLL is taken out of reset (PLLRST = 1
with PLLEN = 0) to when to when the PLL controller can be switched to PLL mode (PLLEN = 1). The
PLL1 lock time is given in Table 7-17.
Table 7-17. PLL1 Stabilization, Lock, and Reset Times
MIN
PLL stabilization time
TYP
UNIT
μs
2000*C (1)
PLL lock time
128*C (1)
PLL reset time
(1)
MAX
150
ns
ns
C = CLKIN1 cycle time in ns. For example, when CLKIN1 frequency is 50 MHz, use C = 20 ns.
7.7.2
PLL1 Controller Memory Map
The memory map of the PLL1 controller is shown in Table 7-18. Note that only registers documented here
are accessible on the TMS320C6454 device. Other addresses in the PLL1 controller memory map should
not be modified.
Table 7-18. PLL1 Controller Registers (Including Reset Controller)
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
029A 0000 - 029A 00E3
-
029A 00E4
RSTYPE
Reserved
029A 00E8 - 029A 00FF
-
029A 0100
PLLCTL
029A 0104
-
Reserved
029A 0108
-
Reserved
029A 010C
-
Reserved
Reset Type Status Register (Reset Controller)
Reserved
PLL Control Register
029A 0110
PLLM
029A 0114
PREDIV
PLL Multiplier Control Register
029A 0118
-
Reserved
029A 011C
-
Reserved
029A 0120
-
Reserved
029A 0124
-
Reserved
PLL Pre-Divider Control Register
029A 0128
-
Reserved
029A 012C
-
Reserved
029A 0130
-
Reserved
029A 0134
-
Reserved
029A 0138
PLLCMD
PLL Controller Command Register
029A 013C
PLLSTAT
PLL Controller Status Register
029A 0140
ALNCTL
PLL Controller Clock Align Control Register
029A 0144
DCHANGE
029A 0148
-
Reserved
029A 014C
-
Reserved
029A 0150
SYSTAT
029A 0154
-
Reserved
029A 0158
-
Reserved
029A 015C
-
Reserved
029A 0160
PLLDIV4
PLL Controller Divider 4 Register
029A 0164
PLLDIV5
PLL Controller Divider 5 Register
029A 0168 - 029B FFFF
-
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PLLDIV Ratio Change Status Register
SYSCLK Status Register
Reserved
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PLL1 Controller Register Descriptions
This section provides a description of the PLL1 controller registers. For details on the operation of the PLL
controller module, see the TMS320C645x DSP Software-Programmable Phase-Locked Loop (PLL)
Controller User's Guide (literature number SPRUE56).
NOTE: The PLL1 controller registers can only be accessed using the CPU or the emulator.
Not all of the registers documented in the TMS320C645x DSP Software-Programmable Phase-Locked
Loop (PLL) Controller User's Guide (literature number SPRUE56) are supported on the TMS320C6454
DSP. Only those registers documented in this section are supported. Furthermore, only the bits within the
registers described here are supported. You should not write to any reserved memory location or change
the value of reserved bits.
7.7.3.1
PLL1 Control Register
The PLL control register (PLLCTL) is shown in Figure 7-11 and described in Table 7-19.
31
16
Reserved
R-0
15
8
7
6
5
4
3
2
1
0
PLLEN
R/W-0
Reserved
Rsvd
Rsvd
Reserved
PLLRST
Rsvd
PLL
PWRDN
R-0
R/W-0
R-1
R/W-0
R/W-1
R-0
R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 7-11. PLL1 Control Register (PLLCTL) [Hex Address: 029A 0100]
Table 7-19. PLL1 Control Register (PLLCTL) Field Descriptions
Bit
Field
Value
Description
31:8
Reserved
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
7
Reserved
Reserved. Writes to this register must keep this bit as 0.
6
Reserved
Reserved. The reserved bit location is always read as 1. A value written to this field has no effect.
5:4
Reserved
Reserved. Writes to this register must keep this bit as 0.
3
PLLRST
PLL reset is released
1
PLL reset is asserted
2
Reserved
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
1
PLLPWRDN
PLL power-down mode select bit
0
132
PLL reset bit
0
0
PLL is operational
1
PLL is placed in power-down state, i.e., all analog circuitry in the PLL is turned-off
PLLEN
PLL enable bit
0
Bypass mode. Divider PREDIV and PLL are bypassed. All the system clocks (SYSCLKn) are
divided down directly from input reference clock.
1
PLL mode. Divider PREDIV and PLL are not bypassed. PLL output path is enabled. All the system
clocks (SYSCLKn) are divided down from PLL output.
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PLL Multiplier Control Register
The PLL multiplier control register (PLLM) is shown in Figure 7-12 and described in Table 7-20. The PLLM
register defines the input reference clock frequency multiplier in conjunction with the PLL divider ratio bits
(RATIO) in the PLL controller pre-divider register (PREDIV).
31
16
Reserved
R-0
15
5
4
0
Reserved
PLLM
R-0
R/W-0h
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 7-12. PLL Multiplier Control Register (PLLM) [Hex Address: 029A 0110]
Table 7-20. PLL Multiplier Control Register (PLLM) Field Descriptions
Bit
Field
31:5
Reserved
4:0
PLLM
Value
0
Description
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
PLL multiplier bits. Defines the frequency multiplier of the input reference clock in conjunction with
the PLL divider ratio bits (RATIO) in PREDIV.
0h
x1 multiplier rate
Eh
x15 multiplier rate
13h
x20 multiplier rate
18h
x25 multiplier rate
1Dh
x30 multiplier rate
1Fh
x32 multiplier rate
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PLL Pre-Divider Control Register
The PLL pre-divider control register (PREDIV) is shown in Figure 7-13 and described in Table 7-21.
31
16
Reserved
R-0
15
14
5
4
0
PREDEN
Reserved
RATIO
R/W-1
R-0
R/W-2h
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 7-13. PLL Pre-Divider Control Register (PREDIV) [Hex Address: 029A 0114]
Table 7-21. PLL Pre-Divider Control Register (PREDIV) Field Descriptions
Bit
Field
31:16
Reserved
15
PREDEN
14:5
Reserved
4:0
RATIO
Value
0
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
Pre-divider enable bit.
0
Pre-divider is disabled. No clock output.
1
Pre-divider is enabled.
0
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
0-1Fh
Divider ratio bits.
0
÷1. Divide frequency by 1.
1h
÷2. Divide frequency by 2.
2h
÷3. Divide frequency by 3.
3h-1Fh
134
Description
Reserved, do not use.
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7.7.3.4
SPRS311I – APRIL 2006 – REVISED MARCH 2012
PLL Controller Divider 4 Register
The PLL controller divider 4 register (PLLDIV4) is shown in Figure 7-14 and described in Table 7-22.
Besides being used as the EMIFA internal clock, SYSCLK4 is also used in other parts of the system.
Disabling this clock will cause unpredictable system behavior. Therefore, the PLLDIV4 register should
never be used to disable SYSCLK4.
31
16
Reserved
R-0
15
14
5
4
0
D4EN
Reserved
RATIO
R/W-1
R-0
R/W-3
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 7-14. PLL Controller Divider 4 Register (PLLDIV4) [Hex Address: 029A 0160]
Table 7-22. PLL Controller Divider 4 Register (PLLDIV4) Field Descriptions
Bit
31:16
15
Field
Reserved
Value
0
D4EN
14:5
Reserved
4:0
RATIO
Description
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
Divider 4 enable bit.
0
Divider 4 is disabled. No clock output.
1
Divider 4 is enabled.
0
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
0-1Fh
Divider ratio bits.
0
÷2. Divide frequency by 2.
1h
÷4. Divide frequency by 4.
2h
÷6. Divide frequency by 6.
3h
÷8. Divide frequency by 8.
4h-7h
8h-1Fh
÷10 to ÷16. Divide frequency by 10 to divide frequency by 16.
Reserved, do not use.
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PLL Controller Divider 5 Register
The PLL controller divider 5 register (PLLDIV5) is shown in Figure 7-15 and described in Table 7-23.
31
16
Reserved
R-0
15
14
5
4
0
D5EN
Reserved
RATIO
R/W-1
R-0
R/W-3
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 7-15. PLL Controller Divider 5 Register (PLLDIV5) [Hex Address: 029A 0164]
Table 7-23. PLL Controller Divider 5 Register (PLLDIV5) Field Descriptions
Bit
31:16
15
Field
Reserved
Value
0
D5EN
14:5
Reserved
4:0
RATIO
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
Divider 5 enable bit.
0
Divider 5 is disabled. No clock output.
1
Divider 5 is enabled.
0
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
0-1Fh
Divider ratio bits.
0
÷1. Divide frequency by 1.
1h
÷2. Divide frequency by 2.
2h
÷3. Divide frequency by 3.
3h
÷4. Divide frequency by 4.
4h-7h
8h-1Fh
136
Description
÷5 to ÷8. Divide frequency by 5 to divide frequency by 8.
Reserved, do not use.
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7.7.3.6
SPRS311I – APRIL 2006 – REVISED MARCH 2012
PLL Controller Command Register
The PLL controller command register (PLLCMD) contains the command bit for GO operation. PLLCMD is
shown in Figure 7-16 and described in Table 7-24.
31
16
Reserved
R-0
15
2
1
Reserved
R-0
0
Rsvd
GOSET
R/W-0
R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 7-16. PLL Controller Command Register (PLLCMD) [Hex Address: 029A 0138]
Table 7-24. PLL Controller Command Register (PLLCMD) Field Descriptions
Bit
Field
Value
0
Description
31:2
Reserved
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
1
Reserved
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
0
GOSET
GO operation command for SYSCLK rate change and phase alignment. Before setting this bit to 1
to initiate a GO operation, check the GOSTAT bit in the PLLSTAT register to ensure all previous
GO operations have completed.
0
No effect. Write of 0 clears bit to 0.
1
Initiates GO operation. Write of 1 initiates GO operation. Once set, GOSET remains set but further
writes of 1 can initiate the GO operation.
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PLL Controller Status Register
The PLL controller status register (PLLSTAT) shows the PLL controller status. PLLSTAT is shown in
Figure 7-17 and described in Table 7-25.
31
16
Reserved
R-0
15
1
0
Reserved
GOSTAT
R-0
R-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 7-17. PLL Controller Status Register (PLLSTAT) [Hex Address: 029A 013C]
Table 7-25. PLL Controller Status Register (PLLSTAT) Field Descriptions
Bit
Field
31:1
Reserved
0
GOSTAT
138
Value
0
Description
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
GO operation status.
0
GO operation is not in progress. SYSCLK divide ratios are not being changed.
1
GO operation is in progress. SYSCLK divide ratios are being changed.
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7.7.3.8
SPRS311I – APRIL 2006 – REVISED MARCH 2012
PLL Controller Clock Align Control Register
The PLL controller clock align control register (ALNCTL) is shown in Figure 7-18 and described in Table 726.
31
16
Reserved
R-0
15
4
3
Reserved
5
ALN5
ALN4
2
Reserved
0
R-0
R-1
R-1
R-1
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 7-18. PLL Controller Clock Align Control Register (ALNCTL) [Hex Address: 029A 0140]
Table 7-26. PLL Controller Clock Align Control Register (ALNCTL) Field Descriptions
Bit
Field
31:5
Reserved
4:3
ALNn
2:0
Reserved
Value
0
Description
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
SYSCLKn alignment. Do not change the default values of these fields.
0
Do not align SYSCLKn to other SYSCLKs during GO operation. If SYSn in DCHANGE is set to 1,
SYSCLKn switches to the new ratio immediately after the GOSET bit in PLLCMD is set.
1
Align SYSCLKn to other SYSCLKs selected in ALNCTL when the GOSET bit in PLLCMD is set.
The SYSCLKn ratio is set to the ratio programmed in the RATIO bit in PLLDIVn.
0
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
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PLLDIV Ratio Change Status Register
Whenever a different ratio is written to the PLLDIVn registers, the PLLCTRL flags the change in the
PLLDIV ratio change status registers (DCHANGE). During the GO operation, the PLL controller will only
change the divide ratio of the SYSCLKs with the bit set in DCHANGE. Note that changed clocks will be
automatically aligned to other clocks. The PLLDIV divider ratio change status register is shown in
Figure 7-19 and described in Table 7-27.
31
16
Reserved
R-0
15
4
3
Reserved
5
SYS5
SYS4
2
Reserved
0
R-0
R-0
R-0
R-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 7-19. PLLDIV Divider Ratio Change Status Register (DCHANGE) [Hex Address: 029A 0144]
Table 7-27. PLLDIV Divider Ratio Change Status Register (DCHANGE) Field Descriptions
Bit
31:5
4
3
2:0
140
Field
Reserved
Value
0
SYS5
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
Identifies when the SYSCLK5 divide ratio has been modified.
0
SYSCLK5 ratio has not been modified. When GOSET is set, SYSCLK5 will not be affected.
1
SYSCLK5 ratio has been modified. When GOSET is set, SYSCLK5 will change to the new ratio.
SYS4
Reserved
Description
Identifies when the SYSCLK4 divide ratio has been modified.
0
SYSCLK4 ratio has not been modified. When GOSET is set, SYSCLK4 will not be affected.
1
SYSCLK4 ratio has been modified. When GOSET is set, SYSCLK4 will change to the new ratio.
0
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
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7.7.3.10 SYSCLK Status Register
The SYSCLK status register (SYSTAT) shows the status of the system clocks (SYSCLKn). SYSTAT is
shown in Figure 7-20 and described in Table 7-28.
31
16
Reserved
R-0
15
8
Reserved
R-0
7
4
3
2
1
0
Reserved
5
SYS5ON
SYS4ON
SYS3ON
SYS2ON
Reserved
R-0
R-1
R-1
R-1
R-1
R-1
LEGEND: R = Read only; -n = value after reset
Figure 7-20. SYSCLK Status Register (SYSTAT) [Hex Address: 029A 0150]
Table 7-28. SYSCLK Status Register (SYSTAT) Field Descriptions
Bit
Field
31:4
Reserved
4:1
SYSnON
0
Reserved
Value
0
Description
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
SYSCLKn on status.
0
SYSCLKn is gated.
1
SYSCLKn is on.
1
Reserved. The reserved bit location is always read as 1. A value written to this field has no effect.
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PLL1 Controller Input and Output Clock Electrical Data/Timing
Table 7-29. Timing Requirements for CLKIN1 Devices (1)
(2) (3)
(see Figure 7-21)
-720
-850
A-1000/-1000
NO.
PLL MODES
x1 (Bypass), x15,
x20, x25, x30, x32
(4)
MIN
MAX
15
30.3
UNIT
1
tc(CLKIN1)
Cycle time, CLKIN1
2
tw(CLKIN1H)
Pulse duration, CLKIN1 high
0.4C
3
tw(CLKIN1L)
Pulse duration, CLKIN1 low
0.4C
4
tt(CLKIN1)
Transition time, CLKIN1
1.2
ns
tJ(CLKIN1)
Period jitter (peak-to-peak), CLKIN1
100
ps
5
(1)
(2)
ns
ns
ns
The reference points for the rise and fall transitions are measured at 3.3 V VIL MAX and VIH MIN.
For more details on the PLL multiplier factors (x1 [BYPASS], x 15, x20, x25, x30, x32), see Section 7.7.1.2, PLL1 Controller Operating
Modes.
C = CLKIN1 cycle time in ns. For example, when CLKIN1 frequency is 50 MHz, use C = 20 ns.
The PLL1 multiplier factors (x1 [BYPASS], x 15, x20, x25, x30, x32) further limit the MIN and MAX values for tc(CLKIN1). For more
detailed information on these limitations, see Section 7.7.1.1, Internal Clocks and Maximum Operating Frequencies.
(3)
(4)
1
5
4
2
CLKIN1
3
4
Figure 7-21. CLKIN1 Timing
Table 7-30. Switching Characteristics Over Recommended Operating Conditions for SYSCLK4 [CPU/8 CPU/12] (1) (2)
(see Figure 7-22)
NO.
-720
-850
A-1000/-1000
PARAMETER
MIN
(1)
(2)
UNIT
MAX
2
tw(CKO3H)
Pulse duration, SYSCLK4 high
4P - 0.7
6P + 0.7
ns
3
tw(CKO3L)
Pulse duration, SYSCLK4 low
4P - 0.7
6P + 0.7
ns
4
tt(CKO3)
Transition time, SYSCLK4
1
ns
The reference points for the rise and fall transitions are measured at 3.3 V VOL MAX and VOH MIN.
P = 1/CPU clock frequency in nanoseconds (ns)
4
2
SYSCLK4
3
4
Figure 7-22. SYSCLK4 Timing
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7.8
SPRS311I – APRIL 2006 – REVISED MARCH 2012
PLL2 and PLL2 Controller
The secondary PLL controller generates interface clocks for the Ethernet media access controller (EMAC)
and the DDR2 memory controller.
As shown in Figure 7-23, the PLL2 controller features a PLL multiplier controller and one divider (D1). The
PLL multiplier is fixed to a x20 multiplier rate and the divider D1 can be programmed to a ÷2 or ÷5 mode.
PLL2 power is supplied externally via the PLL2 power supply (PLLV2). An external PLL filter circuit must
be added to PLLV2 as shown in Figure 7-23. The 1.8-V supply for the EMI filter must be from the same
1.8-V power plane supplying the I/O power-supply pin, DVDD18. TI requires EMI filter manufacturer Murata,
part number NFM18CC222R1C3 or NFM18CC223R1C3.
All PLL external components (C161, C162, and the EMI Filter) should be placed as close to the C64x+
DSP device as possible. For the best performance, TI requires that all the PLL external components be on
a single side of the board without jumpers, switches, or components other than the ones shown. For
reduced PLL jitter, maximize the spacing between switching signals and the PLL external components
(C161, C162, and the EMI Filter). The minimum CLKIN2 rise and fall times should also be observed. For
the input clock timing requirements, see Section 7.8.4, PLL2 Controller Input Clock Electrical Data/Timing.
CAUTION
The PLL controller module as described in the TMS320C645x DSP SoftwareProgrammable Phase-Locked Loop (PLL) Controller User's Guide (literature number
SPRUE56) includes a superset of features, some of which are not supported on the
C6454 DSP. The following sections describe the features that are supported; it should
be assumed that any feature not included in these sections is not supported by the
C6454 DSP.
TMS320C6454 DSP
SYSCLK3 (From PLL1 Controller)
PLLV2
+1.8 V
SYSCLK2 (From PLL1 Controller)
560 pF 0.1 mF
EMI Filter
C161
C162
PLLREF
CLKIN2
PLL2
PLLOUT
DDR2
Memory
Controller
/2
(B)(C)
PLLM
x20
DIVIDER D1
1
0
SYSREFCLK
/x
(A)
SYSCLK1
EMAC
1
PLL2 Controller
A.
B.
C.
/x must be programmed to /2 for GMII (default) and to /5 for RGMII.
If EMAC is enabled with RGMII, or GMII, CLKIN2 frequency must be 25 MHz.
CLKIN2 is a 3.3-V signal.
Figure 7-23. PLL2 Block Diagram
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PLL2 Controller Device-Specific Information
7.8.1.1
Internal Clocks and Maximum Operating Frequencies
As shown in Figure 7-23, the output of PLL2, PLLOUT, is divided by 2 and directly fed to the DDR2
memory controller. This clock is used by the DDR2 memory controller to generate DDR2CLKOUT and
DDR2CLKOUT. Note that, internally, the data bus interface of the DDR2 memory controller is clocked by
SYSCLK2 of the PLL1 controller.
The PLLOUT/2 clock is also fed back into the PLL2 controller where it becomes SYSREFCLK. Divider D1
of the PLL2 controller generates SYSCLK1 for the Ethernet media access controller (EMAC). The EMAC
uses SYSCLK1 to generate the necessary clock for each of its interfaces. Divider D1 should be
programmed to ÷2 mode [default] when using the Gigabit Media Independent Interface (GMII) mode and
to ÷5 mode when using the Reduce Gigabit Media Independent Interface (RGMII). Divider D1 is software
programmable and, if necessary, must be programmed after device reset to ÷5 when the RGMII mode of
the EMAC is used. Note that, internally, the data bus interface of the EMAC is clocked by SYSCLK3 of the
PLL2 controller.
Note that there is a minimum and maximum operating frequency for PLLREF, PLLOUT, and SYSCLK1.
The clock generator must not be configured to exceed any of these constraints. For the PLL clocks input
and output frequency ranges, see Table 7-31. Also, when EMAC is enabled with RGMII or GMII, CLKIN2
must be 25 MHz.
Table 7-31. PLL2 Clock Frequency Ranges
CLOCK SIGNAL
MIN
MAX
UNIT
PLLREF (PLLEN = 1)
12.5
26.7
MHz
PLLOUT
250
533
MHz
SYSCLK1 (1)
50
125
MHz
(1)
SYSCLK1 restriction applies only when the EMAC is enabled and the RGMII or GMII modes are used. SYSCLK1 must be programmed
to 125 MHz when the GMII mode is used and to 50 MHz when the RGMII mode is used.
7.8.1.2
PLL2 Controller Operating Modes
Unlike the PLL1 controller which can operate in bypass and a PLL mode, the PLL2 controller only
operates in PLL mode. In this mode, SYSREFCLK is generated outside the PLL2 controller by dividing the
output of PLL2 by two.
The PLL2 controller is affected by power-on reset and warm reset. During these resets the PLL2 controller
registers get reset to their default values. The internal clocks of the PLL2 controller are also affected as
described in Section 7.6, Reset Controller.
PLL2 is only unlocked during the power-up sequence (see Section 7.6, Reset Controller ) and is locked by
the time the RESETSTAT pin goes high. It does not lose lock during any of the other resets.
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SPRS311I – APRIL 2006 – REVISED MARCH 2012
PLL2 Controller Memory Map
The memory map of the PLL2 controller is shown in Table 7-32. Note that only registers documented here
are accessible on the TMS320C6454 device. Other addresses in the PLL2 controller memory map should
not be modified.
Table 7-32. PLL2 Controller Registers
7.8.3
HEX ADDRESS RANGE
ACRONYM
029C 0000 - 029C 0114
-
029C 0118
PLLDIV1
DESCRIPTION
Reserved
PLL Controller Divider 1 Register
029C 011C - 029C 0134
-
029C 0138
PLLCMD
Reserved
PLL Controller Command Register
029C 013C
PLLSTAT
PLL Controller Status Register
029C 0140
ALNCTL
PLL Controller Clock Align Control Register
029C 0144
DCHANGE
029C 0148
-
Reserved
029C 014C
-
Reserved
PLLDIV Ratio Change Status Register
029C 0150
SYSTAT
029C 0154 - 029C 0190
-
SYSCLK Status Register
Reserved
029C 0194 - 029C 01FF
-
Reserved
029C 0200 - 029C FFFF
-
Reserved
PLL2 Controller Register Descriptions
This section provides a description of the PLL2 controller registers. For details on the operation of the PLL
controller module, see the TMS320C645x DSP Software-Programmable Phase-Locked Loop (PLL)
Controller User's Guide (literature number SPRUE56).
NOTE: The PLL2 controller registers can only be accessed using the CPU or the emulator.
Not all of the registers documented in the TMS320C645x DSP Software-Programmable Phase-Locked
Loop (PLL) Controller User's Guide (literature number SPRUE56) are supported on the TMS320C6454
device. Only those registers documented in this section are supported. Furthermore, only the bits within
the registers described here are supported. You should not write to any reserved memory location or
change the value of reserved bits.
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PLL Controller Divider 1 Register
The PLL controller divider 1 register (PLLDIV1) is shown in Figure 7-24 and described in Table 7-33.
31
16
Reserved
R-0
15
14
5
4
0
D1EN
Reserved
RATIO
R/W-1
R-0
R/W-1
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 7-24. PLL Controller Divider 1 Register (PLLDIV1) [Hex Address: 029C 0118]
Table 7-33. PLL Controller Divider 1 Register (PLLDIV1) Field Descriptions
Bit
31:16
15
Field
Reserved
Value
0
D1EN
14:5
Reserved
4:0
RATIO
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
Divider D1 enable bit.
0
Divider D1 is disabled. No clock output.
1
Divider D1 is enabled.
0
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
0-1Fh
Divider ratio bits.
1h
÷2. Divide frequency by 2.
4h
÷5. Divide frequency by 5.
Others
146
Description
Reserved
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7.8.3.2
SPRS311I – APRIL 2006 – REVISED MARCH 2012
PLL Controller Command Register
The PLL controller command register (PLLCMD) contains the command bit for GO operation. PLLCMD is
shown in Figure 7-25 and described in Table 7-34.
31
16
Reserved
R-0
15
2
1
Reserved
R-0
0
Rsvd
GOSET
R/W-0
R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 7-25. PLL Controller Command Register (PLLCMD) [Hex Address: 029C 0138]
Table 7-34. PLL Controller Command Register (PLLCMD) Field Descriptions
Bit
Field
Value
0
Description
31:2
Reserved
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
1
Reserved
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
0
GOSET
GO operation command for SYSCLK rate change and phase alignment. Before setting this bit to 1
to initiate a GO operation, check the GOSTAT bit in the PLLSTAT register to ensure all previous
GO operations have completed.
0
No effect. Write of 0 clears bit to 0.
1
Initiates GO operation. Write of 1 initiates GO operation. Once set, GOSET remains set but further
writes of 1 can initiate the GO operation.
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PLL Controller Status Register
The PLL controller status register (PLLSTAT) shows the PLL controller status. PLLSTAT is shown in
Figure 7-26 and described in Table 7-35.
31
16
Reserved
R-0
15
1
0
Reserved
GOSTAT
R-0
R-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 7-26. PLL Controller Status Register (PLLSTAT) [Hex Address: 029C 013C]
Table 7-35. PLL Controller Status Register (PLLSTAT) Field Descriptions
Bit
Field
Value
31:1
Reserved
0
GOSTAT
7.8.3.4
0
Description
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
GO operation status.
0
Go operation is not in progress. SYSCLK divide ratios are not being changed.
1
GO operation is in progress. SYSCLK divide ratios are being changed.
PLL Controller Clock Align Control Register
The PLL controller clock align control register (ALNCTL) is shown in Figure 7-27 and described in Table 736.
31
16
Reserved
R-0
15
1
0
Reserved
ALN1
R-0
R/W-1
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 7-27. PLL Controller Clock Align Control Register (ALNCTL) [Hex Address: 029C 0140]
Table 7-36. PLL Controller Clock Align Control Register (ALNCTL) Field Descriptions
Bit
31:1
0
148
Field
Reserved
Value
0
ALN1
Description
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
SYSCLK1 alignment. Do not change the default values of these fields.
0
Do not align SYSCLK1 during GO operation. If SYS1 in DCHANGE is set to 1, SYSCLK1 switches
to the new ratio immediately after the GOSET bit in PLLCMD is set.
1
Align SYSCLK1 when the GOSET bit in PLLCMD is set. The SYSCLK1 ratio is set to the ratio
programmed in the RATIO bit in PLLDIV1.
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PLLDIV Ratio Change Status Register
Whenever a different ratio is written to the PLLDIV1 register, the PLLCTRL flags the change in the
DCHANGE status register. During the GO operation, the PLL controller will only change the divide ratio
SYSCLK1 if SYS1 in DCHANGE is 1. The PLLDIV divider ratio change status register is shown in
Figure 7-28 and described in Table 7-37.
31
16
Reserved
R-0
15
1
0
Reserved
SYS1
R-0
R-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 7-28. PLLDIV Divider Ratio Change Status Register (DCHANGE) [Hex Address: 029C 0144]
Table 7-37. PLLDIV Divider Ratio Change Status Register (DCHANGE) Field Descriptions
Bit
31:1
0
Field
Reserved
Value
0
SYS1
Description
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
SYSCLK1 divide ratio has been modified. SYSCLK1 ratio will be modified during GO operation.
0
SYSCLK1 ratio has not been modified. When GOSET is set, SYSCLK1 will not be affected.
1
SYSCLK1 ratio has been modified. When GOSET is set, SYSCLK1 will change to the new ratio.
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SYSCLK Status Register
The SYSCLK status register (SYSTAT) shows the status of the system clock (SYSCLK1). SYSTAT is
shown in Figure 7-29 and described in Table 7-38.
31
16
Reserved
R-0
15
1
0
Reserved
SYS1ON
R-0
R-1
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 7-29. SYSCLK Status Register [Hex Address: 029C 0150]
Table 7-38. SYSCLK Status Register Field Descriptions
Bit
Field
31:1
Reserved
0
SYS1ON
150
Value
0
Description
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
SYSCLK1 on status.
0
SYSCLK1 is gated.
1
SYSCLK1 is on.
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PLL2 Controller Input Clock Electrical Data/Timing
Table 7-39. Timing Requirements for CLKIN2 (1)
(2) (3)
(see Figure 7-30)
-720
-850
A-1000/-1000
NO.
(1)
(2)
(3)
UNIT
MIN
MAX
80
1
tc(CLKIN2)
Cycle time, CLKIN2
37.5
2
tw(CLKIN2H)
Pulse duration, CLKIN2 high
0.4C
ns
ns
3
tw(CLKIN2L)
Pulse duration, CLKIN2 low
0.4C
ns
4
tt(CLKIN2)
Transition time, CLKIN2
1.2
ns
5
tJ(CLKIN2)
Period jitter (peak-to-peak), CLKIN2
100
ps
The reference points for the rise and fall transitions are measured at 3.3 V VIL MAX and VIH MIN.
C = CLKIN2 cycle time in ns. For example, when CLKIN2 frequency is 25 MHz, use C = 40 ns.
If EMAC is enabled with RGMII or GMII, CLKIN2 cycle time must be 40 ns (25 MHz).
1
5
4
2
CLKIN2
3
4
Figure 7-30. CLKIN2 Timing
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DDR2 Memory Controller
The 32-bit, 533-MHz (data rate) DDR2 Memory Controller bus of the C6454 device is used to interface to
JESD79-2A standard-compliant DDR2 SDRAM devices. The DDR2 external bus only interfaces to DDR2
SDRAM devices (up to 512 MB); it does not share the bus with any other types of peripherals. The
decoupling of DDR2 memories from other devices both simplifies board design and provides I/O
concurrency from a second external memory interface, EMIFA.
The internal data bus clock frequency and DDR2 bus clock frequency directly affect the maximum
throughput of the DDR2 bus. The clock frequency of the DDR2 bus is equal to the CLKIN2 frequency
multiplied by 10. The internal data bus clock frequency of the DDR2 Memory Controller is fixed at a divideby-three ratio of the CPU frequency. The maximum DDR2 throughput is determined by the smaller of the
two bus frequencies. For example, if the internal data bus frequency is 333 MHz (CPU frequency is 1
GHz) and the DDR2 bus frequency is 267 MHz (CLKIN2 frequency is 26.7 MHz), the maximum data rate
achievable by the DDR2 memory controller is 2.1 Gbytes/sec. The DDR2 bus is designed to sustain a
maximum throughput of up to 2.1 Gbytes/sec at a 533-MHz data rate (267-MHz clock rate), as long as
data requests are pending in the DDR2 Memory Controller.
7.9.1
DDR2 Memory Controller Device-Specific Information
The approach to specifying interface timing for the DDR2 memory bus is different than on other interfaces
such as EMIF, HPI, and McBSP. For these other interfaces the device timing was specified in terms of
data manual specifications and I/O buffer information specification (IBIS) models.
For the C6454 DDR2 memory bus, the approach is to specify compatible DDR2 devices and provide the
printed circuit board (PCB) solution and guidelines directly to the user. Texas Instruments (TI) has
performed the simulation and system characterization to ensure all DDR2 interface timings in this solution
are met. The complete DDR2 system solution is documented in the Implementing DDR2 PCB Layout on
the TMS320C6455/C6454 application report (literature number SPRAAA7).
TI only supports designs that follow the board design guidelines outlined in the SPRAAA7
application report.
The DDR2 Memory Controller pins must be enabled by setting the DDR2_EN configuration pin (ABA0)
high during device reset. For more details, see Section 3.1, Device Configuration at Device Reset.
The ODT[1:0] pins of the memory controller must be left unconnected. The ODT pins on the DDR2
memory device(s) must be connected to ground.
The DDR2 memory controller on the C6454 device supports the following memory topologies:
• A 32-bit wide configuration interfacing to two 16-bit wide DDR2 SDRAM devices.
• A 16-bit wide configuration interfacing to a single 16-bit wide DDR2 SDRAM device.
A race condition may exist when certain masters write data to the DDR2 memory controller. For example,
if master A passes a software message via a buffer in external memory and does not wait for indication
that the write completes, when master B attempts to read the software message, then the master B read
may bypass the master A write and, thus, master B may read stale data and, therefore, receive an
incorrect message.
Some master peripherals (e.g., EDMA3 transfer controllers) will always wait for the write to complete
before signaling an interrupt to the system, thus avoiding this race condition. For masters that do not have
hardware guarantee of write-read ordering, it may be necessary to guarantee data ordering via software.
If master A does not wait for indication that a write is complete, it must perform the following workaround:
1. Perform the required write.
2. Perform a dummy write to the DDR2 memory controller module ID and revision register.
3. Perform a dummy read to the DDR2 memory controller module ID and revision register.
4. Indicate to master B that the data is ready to be read after completion of the read in step 3. The
completion of the read in step 3 ensures that the previous write was done.
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DDR2 Memory Controller Peripheral Register Descriptions
Table 7-40. DDR2 Memory Controller Registers
HEX ADDRESS RANGE
7.9.3
ACRONYM
REGISTER NAME
7800 0000
MIDR
7800 0004
DMCSTAT
DDR2 Memory Controller Module and Revision Register
7800 0008
SDCFG
DDR2 Memory Controller SDRAM Configuration Register
7800 000C
SDRFC
DDR2 Memory Controller SDRAM Refresh Control Register
7800 0010
SDTIM1
DDR2 Memory Controller SDRAM Timing 1 Register
7800 0014
SDTIM2
DDR2 Memory Controller SDRAM Timing 2 Register
7800 0018
-
DDR2 Memory Controller Status Register
Reserved
7800 0020
BPRIO
7800 0024 - 7800 004C
-
DDR2 Memory Controller Burst Priority Register
Reserved
7800 0050 - 7800 0078
-
Reserved
7800 007C - 7800 00BC
-
Reserved
7800 00C0 - 7800 00E0
-
Reserved
7800 00E4
DMCCTL
7800 00E8 - 7800 00FC
-
Reserved
7800 0100 - 7FFF FFFF
-
Reserved
DDR2 Memory Controller Control Register
DDR2 Memory Controller Electrical Data/Timing
The Implementing DDR2 PCB Layout on the TMS320C6455/C6454 application report (literature number
SPRAAA7) specifies a complete DDR2 interface solution for the C6454 device as well as a list of
compatible DDR2 devices. TI has performed the simulation and system characterization to ensure all
DDR2 interface timings in this solution are met; therefore, no electrical data/timing information is supplied
here for this interface.
TI only supports designs that follow the board design guidelines outlined in the SPRAAA7
application report.
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7.10 External Memory Interface A (EMIFA)
The EMIFA can interface to a variety of external devices or ASICs, including:
• Pipelined and flow-through Synchronous-Burst SRAM (SBSRAM)
• ZBT (Zero Bus Turnaround) SRAM and Late Write SRAM
• Synchronous FIFOs
• Asynchronous memory, including SRAM, ROM, and Flash
7.10.1 EMIFA Device-Specific Information
Timing analysis must be done to verify all AC timings are met. TI recommends utilizing I/O buffer
information specification (IBIS) to analyze all AC timings.
To properly use IBIS models to attain accurate timing analysis for a given system, see the Using IBIS
Models for Timing Analysis application report (literature number SPRA839).
To maintain signal integrity, serial termination resistors should be inserted into all EMIF output signal lines
(for the EMIF output signals, see Table 2-3, Terminal Functions).
A race condition may exist when certain masters write data to the EMIFA. For example, if master A
passes a software message via a buffer in external memory and does not wait for indication that the write
completes, when master B attempts to read the software message, then the master B read may bypass
the master A write and, thus, master B may read stale data and, therefore, receive an incorrect message.
Some master peripherals (e.g., EDMA3 transfer controllers) will always wait for the write to complete
before signaling an interrupt to the system, thus avoiding this race condition. For masters that do not have
hardware guarantee of write-read ordering, it may be necessary to guarantee data ordering via software.
If master A does not wait for indication that a write is complete, it must perform the following workaround:
1. Perform the required write.
2. Perform a dummy write to the EMIFA module ID and revision register.
3. Perform a dummy read to the EMIFA module ID and revision register.
4. Indicate to master B that the data is ready to be read after completion of the read in step 3. The
completion of the read in step 3 ensures that the previous write was done.
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7.10.2 EMIFA Peripheral Register Descriptions
Table 7-41. EMIFA Registers
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
7000 0000
MIDR
Module ID and Revision Register
7000 0004
STAT
Status Register
7000 0008
-
Reserved
7000 000C - 7000 001C
-
Reserved
7000 0020
BURST_PRIO
7000 0024 - 7000 004C
-
Burst Priority Register
Reserved
7000 0050 - 7000 007C
-
Reserved
7000 0080
CE2CFG
EMIFA CE2 Configuration Register
7000 0084
CE3CFG
EMIFA CE3 Configuration Register
7000 0088
CE4CFG
EMIFA CE4 Configuration Register
EMIFA CE5 Configuration Register
7000 008C
CE5CFG
7000 0090 - 7000 009C
-
7000 00A0
AWCC
7000 00A4 - 7000 00BC
-
7000 00C0
INTRAW
EMIFA Interrupt RAW Register
7000 00C4
INTMSK
EMIFA Interrupt Masked Register
7000 00C8
INTMSKSET
EMIFA Interrupt Mask Set Register
EMIFA Interrupt Mask Clear Register
Reserved
EMIFA Async Wait Cycle Configuration Register
Reserved
7000 00CC
INTMSKCLR
7000 00D0 - 7000 00DC
-
Reserved
7000 00E0 - 77FF FFFF
-
Reserved
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7.10.3 EMIFA Electrical Data/Timing
Table 7-42. Timing Requirements for AECLKIN for EMIFA (1)
(2)
(see Figure 7-31)
-720
-850
A-1000/-1000
NO.
(1)
(2)
(3)
(4)
UNIT
MIN
MAX
40
1
tc(EKI)
Cycle time, AECLKIN
6 (3)
2
tw(EKIH)
Pulse duration, AECLKIN high
2.7
ns
3
tw(EKIL)
Pulse duration, AECLKIN low
2.7
ns
4
tt(EKI)
Transition time, AECLKIN
5
tJ(EKI)
Period Jitter, AECLKIN
ns
2
ns
0.02E (4)
ns
The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN.
E = the EMIF input clock (AECLKIN or SYSCLK4) period in ns for EMIFA.
Minimum AECLKIN cycle times must be met, even when AECLKIN is generated by an internal clock source. Minimum AECLKIN times
are based on internal logic speed; the maximum useable speed of the EMIF may be lower due to AC timing requirements.
This timing only applies when AECLKIN is used for EMIFA.
1
5
4
2
AECLKIN
3
4
Figure 7-31. AECLKIN Timing for EMIFA
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Table 7-43. Switching Characteristics Over Recommended Operating Conditions for AECLKOUT for the
EMIFA Module (1) (2) (3)
(see Figure 7-32)
NO.
-720
-850
A-1000/-1000
PARAMETER
UNIT
MIN
(1)
(2)
(3)
MAX
1
tc(EKO)
Cycle time, AECLKOUT
E - 0.7
E + 0.7
ns
2
tw(EKOH)
Pulse duration, AECLKOUT high
EH - 0.7
EH + 0.7
ns
3
tw(EKOL)
Pulse duration, AECLKOUT low
EL - 0.7
EL + 0.7
ns
4
tt(EKO)
Transition time, AECLKOUT
1
ns
5
td(EKIH-EKOH)
Delay time, AECLKIN high to AECLKOUT high
1
8
ns
6
td(EKIL-EKOL)
Delay time, AECLKIN low to AECLKOUT low
1
8
ns
E = the EMIF input clock (AECLKIN or SYSCLK4) period in ns for EMIFA.
The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN.
EH is the high period of E (EMIF input clock period) in ns and EL is the low period of E (EMIF input clock period) in ns for EMIFA.
AECLKIN
1
6
5
3
2
4
4
AECLKOUT1
Figure 7-32. AECLKOUT Timing for the EMIFA Module
7.10.3.1
Asynchronous Memory Timing
Table 7-44. Timing Requirements for Asynchronous Memory Cycles for EMIFA Module (1)
(2) (3)
(see Figure 7-33 and Figure 7-34)
-720
-850
A-1000/-1000
NO.
MIN
(1)
(2)
(3)
3
tsu(EDV-A OEH)
Setup time, AEDx valid before AAOE high
4
th(AOEH-EDV)
5
tsu(ARDY-EKOH)
6
7
UNIT
MAX
6.5
ns
Hold time, AEDx valid after AAOE high
0
ns
Setup time, AARDY valid before AECLKOUT low
1
ns
th(EKOH-ARDY)
Hold time, AARDY valid after AECLKOUT low
2
ns
tw(ARDY )
Pulse width, AARDY assertion and deassertion
2E + 5
ns
8
td(ARDY-HOLD)
Delay time, from AARDY sampled deasserted on AECLKOUT falling to
beginning of programmed hold period
9
tsu(ARDY-HOLD)
Setup time, before end of programmed strobe period by which AARDY
should be asserted in order to insert extended strobe wait states.
4E
2E
ns
ns
E = AECLKOUT period in ns for EMIFA
To ensure data setup time, simply program the strobe width wide enough.
AARDY is internally synchronized. To use AARDY as an asynchronous input, the pulse width of the AARDY signal should be at least 2E
to ensure setup and hold time is met.
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Table 7-45. Switching Characteristics Over Recommended Operating Conditions for Asynchronous
Memory Cycles for EMIFA Module (1) (2) (3)
(see Figure 7-33 and Figure 7-34)
NO.
-720
-850
A-1000/-1000
PARAMETER
MIN
1
tosu(SELV-AOEL)
Output setup time, select signals valid to AAOE low
RS * E - 1.5
2
toh(AOEH-SELIV)
Output hold time, AAOE high to select signals invalid
RS * E - 1.9
10
td(EKOH-AOEV)
Delay time, AECLKOUT high to AAOE valid
11
tosu(SELV-AWEL)
Output setup time, select signals valid to AAWE low
WS * E - 1.7
12
toh(AWEH-SELIV)
Output hold time, AAWE high to select signals invalid
WH * E - 1.8
13
td(EKOH-AWEV)
Delay time, AECLKOUT high to AAWE valid
(1)
(2)
UNIT
MAX
ns
ns
1
7
ns
ns
ns
1.3
7.1
ns
E = AECLKOUT period in ns for EMIFA
RS = Read setup, RST = Read strobe, RH = Read hold, WS = Write setup, WST = Write strobe, WH = Write hold. These parameters
are programmed via the EMIFA CE Configuration registers (CEnCFG).
Select signals for EMIFA include: ACEx, ABE[7:0], AEA[19:0], ABA[1:0]; and for EMIFA writes, also include AR/W, AED[63:0].
(3)
Strobe = 4
Setup = 1
Hold = 1
AECLKOUT
2
1
ACEx
1
2
Byte Enables
ABE[7:0]
AEA[19:0]/
ABA[1:0]
2
1
Address
3
4
Read Data
AED[63:0]
10
10
AAOE/ASOE(A)
AAWE/ASWE(A)
AR/W
AARDY(B)
DEASSERTED
A AAOE/ASOE and AAWE/ASWE operate as AAOE (identified under select signals) and AAWE, respectively, during asynchronous
memory accesses.
B Polarity of the AARDY signal is programmable through the AP field of the EMIFA Async Wait Cycle Configuration register (AWCC).
Figure 7-33. Asynchronous Memory Read Timing for EMIFA
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Strobe = 4
Hold = 1
Setup = 1
AECLKOUT
12
11
ACEx
11
12
Byte Enables
ABE[7:0]
11
AEA[19:0]/
ABA[1:0]
12
Address
11
12
Write Data
AED[63:0]
AAOE/ASOE(A)
13
13
AAWE/ASWE(A)
11
12
AR/W
DEASSERTED
AARDY(B)
A AAOE/ASOE and AAWE/ASWE operate as AAOE (identified under select signals) and AAWE, respectively, during asynchronous memory
accesses.
B Polarity of the AARDY signal is programmable through the AP field of the EMIFA Async Wait Cycle Configuration register (AWCC).
Figure 7-34. Asynchronous Memory Write Timing for EMIFA
Strobe
Strobe
Setup = 2
Extended Strobe
Hold = 2
8
9
AECLKOUT
6
5
7
7
AARDY(A)
ASSERTED
DEASSERTED
A Polarity of the AARDY signal is programmable through the AP field of the EMIFA Async Wait Cycle Configuration register (AWCC).
Figure 7-35. AARDY Timing
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Programmable Synchronous Interface Timing
Table 7-46. Timing Requirements for Programmable Synchronous Interface Cycles for EMIFA Module
(see Figure 7-36)
-720
-850
A-1000/-1000
NO.
MIN
6
tsu(EDV-EKOH)
Setup time, read AEDx valid before AECLKOUT high
7
th(EKOH-EDV)
Hold time, read AEDx valid after AECLKOUT high
UNIT
MAX
2
ns
1.5
ns
Table 7-47. Switching Characteristics Over Recommended Operating Conditions for Programmable
Synchronous Interface Cycles for EMIFA Module (1)
(see Figure 7-36 through Figure 7-38)
NO.
PARAMETER
-720
-850
A-1000/-1000
MAX
1.3
4.9
ns
4.9
ns
1
td(EKOH-CEV)
Delay time, AECLKOUT high to ACEx valid
2
td(EKOH-BEV)
Delay time, AECLKOUT high to ABEx valid
3
td(EKOH-BEIV)
Delay time, AECLKOUT high to ABEx invalid
4
td(EKOH-EAV)
Delay time, AECLKOUT high to AEAx valid
5
td(EKOH-EAIV)
Delay time, AECLKOUT high to AEAx invalid
1.3
8
td(EKOH-ADSV)
Delay time, AECLKOUT high to ASADS/ASRE valid
1.3
4.9
ns
1.3
4.9
ns
4.9
ns
1.3
9
td(EKOH-OEV)
Delay time, AECLKOUT high to ASOE valid
td(EKOH-EDV)
Delay time, AECLKOUT high to AEDx valid
11
td(EKOH-EDIV)
Delay time, AECLKOUT high to AEDx invalid
1.3
12
td(EKOH-WEV)
Delay time, AECLKOUT high to ASWE valid
1.3
160
ns
4.9
10
(1)
UNIT
MIN
ns
ns
ns
4.9
ns
The following parameters are programmable via the EMIFA CE Configuration registers (CEnCFG):
• Read latency (R_LTNCY): 0-, 1-, 2-, or 3-cycle read latency
• Write latency (W_LTNCY): 0-, 1-, 2-, or 3-cycle write latency
• ACEx assertion length (CE_EXT): For standard SBSRAM or ZBT SRAM interface, ACEx goes inactive after the final command has
been issued (CE_EXT = 0). For synchronous FIFO interface with glue, ACEx is active when ASOE is active (CE_EXT = 1).
• Function of ASADS/ASRE (R_ENABLE): For standard SBSRAM or ZBT SRAM interface, ASADS/ASRE acts as ASADS with
deselect cycles (R_ENABLE = 0). For FIFO interface, ASADS/ASRE acts as ASRE with NO deselect cycles (R_ENABLE = 1).
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READ latency = 2
AECLKOUT
1
1
ACEx
2
BE1
ABE[7:0]
3
BE2
BE3
BE4
4
AEA[19:0]/ABA[1:0]
5
EA1
EA2
EA3
EA4
6
AED[63:0]
7
Q1
Q2
Q3
Q4
8
8
ASADS/ASRE(B)
9
9
AAOE/ASOE(B)
AAWE/ASWE(B)
A The following parameters are programmable via the EMIFA Chip Select n Configuration Register (CESECn):
−Read latency (R_LTNCY): 1-, 2-, or 3-cycle read latency
−Write latency (W_LTNCY): 0-, 1-, 2-, or 3-cycle write latency
−ACEx assertion length (CE_EXT): For standard SBSRAM or ZBT SRAM interface, ACEx goes inactive after the final command has been
issued (CE_EXT = 0). For synchronous FIFO interface, ACEx is active when ASOE is active (CE_EXT = 1).
−Function of ASADS/ASRE (R_ENABLE): For standard SBSRAM or ZBT SRAM interface, ASADS/ASRE acts as ASADS with deselect
cycles (R_ENABLE = 0). For FIFO interface, ASADS/ASRE acts as SRE with NO deselect cycles (R_ENABLE = 1).
−In this figure R_LTNCY = 2, CE_EXT = 0, R_ENABLE = 0, and SSEL = 1.
B AAOE/ASOE, and AAWE/ASWE operate as ASOE, and ASWE, respectively, during programmable synchronous interface accesses.
Figure 7-36. Programmable Synchronous Interface Read Timing for EMIFA (With Read Latency = 2)(A)
AECLKOUT
1
1
ACEx
ABE[7:0]
2
BE1
AEA[19:0]/ABA[1:0]
4
EA1
EA2
EA3
EA4
10
Q1
Q2
Q3
Q4
10
AED[63:0]
ASADS/ASRE(B)
8
3
BE2
BE3
BE4
5
11
8
AAOE/ASOE(B)
12
12
AAWE/ASWE(B)
A The following parameters are programmable via the EMIFA Chip Select n Configuration Register (CESECn):
− Read latency (R_LTNCY): 1-, 2-, or 3-cycle read latency
− Write latency (W_LTNCY): 0-, 1-, 2-, or 3-cycle write latency
− ACEx assertion length (CE_EXT): For standard SBSRAM or ZBT SRAM interface, ACEx goes inactive after the final command has been
issued (CE_EXT = 0). For synchronous FIFO interface, ACEx is active when ASOE is active (CE_EXT = 1).
− Function of ASADS/ASRE (R_ENABLE): For standard SBSRAM or ZBT SRAM interface, ASADS/ASRE acts as ASADS with deselect
cycles (R_ENABLE = 0). For FIFO interface, ASADS/ASRE acts as SRE with NO deselect cycles (R_ENABLE = 1).
− In this figure W_LTNCY = 0, CE_EXT = 0, R_ENABLE = 0, and SSEL = 1.
B AAOE/ASOE, and AAWE/ASWE operate as ASOE, and ASWE, respectively, during programmable synchronous interface accesses.
Figure 7-37. Programmable Synchronous Interface Write Timing for EMIFA (With Write Latency = 0)(A)
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Write
Latency =
1 (B)
AECLKOUT
1
1
ACEx
ABE[7:0]
2
BE1
AEA[19:0]/ABA[1:0]
4
EA1
10
AED[63:0]
3
BE2
BE3
BE4
5
EA2
10
EA3
EA4
Q1
Q2
Q3
11
Q4
8
8
ASADS/ASRE (B)
AAOE/ASOE (B)
12
12
AAWE/ASWE (B)
A The following parameters are programmable via the EMIFA Chip Select n Configuration Register (CESECn):
− Read latency (R_LTNCY): 1-, 2-, or 3-cycle read latency
− Write latency (W_LTNCY): 0-, 1-, 2-, or 3-cycle write latency
− ACEx assertion length (CE_EXT): For standard SBSRAM or ZBT SRAM interface, ACEx goes inactive after the final command has been
issued (CE_EXT = 0). For synchronous FIFO interface, ACEx is active when ASOE is active (CE_EXT = 1).
− Function of ASADS/ASRE (R_ENABLE): For standard SBSRAM or ZBT SRAM interface, ASADS/ASRE acts as ASADS with deselect
cycles (R_ENABLE = 0). For FIFO interface, ASADS/ASRE acts as SRE with NO deselect cycles (R_ENABLE = 1).
− In this figure W_LTNCY = 1, CE_EXT = 0, R_ENABLE = 0, and SSEL = 1.
B AAOE/ASOE, and AAWE/ASWE operate as ASOE, and ASWE, respectively, during programmable synchronous interface accesses.
Figure 7-38. Programmable Synchronous Interface Write Timing for EMIFA (With Write Latency = 1) (A)
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7.10.4
SPRS311I – APRIL 2006 – REVISED MARCH 2012
HOLD/HOLDA Timing
Table 7-48. Timing Requirements for the HOLD/HOLDA Cycles for EMIFA Module (1)
(see Figure 7-39)
-720
-850
A-1000/-1000
NO.
MIN
3
(1)
th(HOLDAL-HOLDL)
Hold time, HOLD low after HOLDA low
UNIT
MAX
E
ns
E = the EMIF input clock (ECLKIN) period in ns for EMIFA.
Table 7-49. Switching Characteristics Over Recommended Operating Conditions for the HOLD/HOLDA
Cycles for EMIFA Module (1) (2)
(see Figure 7-39)
NO.
(1)
(2)
(3)
-720
-850
A-1000/-1000
PARAMETER
1
td(HOLDL-EMHZ)
Delay time, HOLD low to EMIFA Bus high impedance
2
td(EMHZ-HOLDAL)
Delay time, EMIF Bus high impedance to HOLDA low
4
td(HOLDH-EMLZ)
Delay time, HOLD high to EMIF Bus low impedance
5
td(EMLZ-HOLDAH)
Delay time, EMIFA Bus low impedance to HOLDA high
UNIT
MIN
MAX
2E
(3)
ns
0
2E
ns
2E
7E
ns
0
2E
ns
E = the EMIF input clock (ECLKIN) period in ns for EMIFA.
EMIFA Bus consists of: ACE[5:2], ABE[7:0], AED[63:0], AEA[19:0], ABA[1:0], AR/W, ASADS/ASRE, AAOE/ ASOE, and AAWE/ASWE.
All pending EMIF transactions are allowed to complete before HOLDA is asserted. If no bus transactions are occurring, then the
minimum delay time can be achieved.
External Requestor
Owns Bus
DSP Owns Bus
DSP Owns Bus
3
HOLD
2
5
HOLDA
1
EMIF Bus (A)
4
DSP
DSP
AECLKOUT
A.
EMIFA Bus consists of: ACE[5:2], ABE[7:0], AED[63:0], AEA[19:0], ABA[1:0], AR/W, ASADS/ASRE, AAOE/ ASOE,
and AAWE/ASWE.
Figure 7-39. HOLD/HOLDA Timing for EMIFA
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7.10.5 BUSREQ Timing
Table 7-50. Switching Characteristics Over Recommended Operating Conditions for the BUSREQ Cycles
for EMIFA Module
(see Figure 7-40)
NO.
1
-720
-850
A-1000/-1000
PARAMETER
td(AEKOH-ABUSRV)
Delay time, AECLKOUT high to ABUSREQ valid
MIN
MAX
1
5.5
UNIT
ns
AECLKOUTx
1
1
ABUSREQ
Figure 7-40. BUSREQ Timing for EMIFA
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7.11 I2C Peripheral
The inter-integrated circuit (I2C) module provides an interface between a C64x+ DSP and other devices
compliant with Philips Semiconductors Inter-IC bus (I2C bus™) specification version 2.1 and connected by
way of an I2C bus. External components attached to this 2-wire serial bus can transmit/receive up to 8-bit
data to/from the DSP through the I2C module.
7.11.1 I2C Device-Specific Information
The C6454 device includes an I2C peripheral module (I2C). NOTE: when using the I2C module, ensure
there are external pullup resistors on the SDA and SCL pins.
The I2C modules on the C6454 device may be used by the DSP to control local peripherals ICs (DACs,
ADCs, etc.) or may be used to communicate with other controllers in a system or to implement a user
interface.
The I2C port supports:
• Compatible with Philips I2C Specification Revision 2.1 (January 2000)
• Fast Mode up to 400 Kbps (no fail-safe I/O buffers)
• Noise Filter to remove noise 50 ns or less
• 7- and 10-Bit Device Addressing Modes
• Multi-Master (Transmit/Receive) and Slave (Transmit/Receive) Functionality
• Events: DMA, Interrupt, or Polling
• Slew-Rate Limited Open-Drain Output Buffers
Figure 7-41 is a block diagram of the I2C module.
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I2C Module
Clock
Prescale
Peripheral Clock
(CPU/6)
I2CPSC
Control
Bit Clock
Generator
SCL
Noise
Filter
I2C Clock
I2CCLKH
I2COAR
Own
Address
I2CSAR
Slave
Address
I2CMDR
Mode
I2CCNT
Data
Count
I2CCLKL
Transmit
I2CXSR
Transmit
Shift
I2CDXR
Transmit
Buffer
SDA
I2C Data
I2CEMDR
Extended
Mode
Interrupt/DMA
Noise
Filter
Receive
I2CIMR
Interrupt
Mask/Status
I2CDRR
Receive
Buffer
I2CSTR
Interrupt
Status
I2CRSR
Receive
Shift
I2CIVR
Interrupt
Vector
Shading denotes control/status registers.
Figure 7-41. I2C Module Block Diagram
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7.11.2 I2C Peripheral Register Descriptions
Table 7-51. I2C Registers
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
02B0 4000
ICOAR
I2C own address register
02B0 4004
ICIMR
I2C interrupt mask/status register
02B0 4008
ICSTR
I2C interrupt status register
02B0 400C
ICCLKL
I2C clock low-time divider register
02B0 4010
ICCLKH
I2C clock high-time divider register
02B0 4014
ICCNT
I2C data count register
02B0 4018
ICDRR
I2C data receive register
02B0 401C
ICSAR
I2C slave address register
02B0 4020
ICDXR
I2C data transmit register
02B0 4024
ICMDR
I2C mode register
02B0 4028
ICIVR
I2C interrupt vector register
02B0 402C
ICEMDR
I2C extended mode register
02B0 4030
ICPSC
I2C prescaler register
02B0 4034
ICPID1
I2C peripheral identification register 1 [Value: 0x0000 0105]
I2C peripheral identification register 2 [Value: 0x0000 0005]
02B0 4038
ICPID2
02B0 403C - 02B0 405C
-
Reserved
02B0 4060 - 02B3 407F
-
Reserved
02B0 4080 - 02B3 FFFF
-
Reserved
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7.11.3 I2C Electrical Data/Timing
Table 7-52. Timing Requirements for I2C Timings (1)
(see Figure 7-42)
-720
-850
A-1000/-1000
NO.
STANDARD MODE
MIN
MAX
UNIT
FAST MODE
MIN
MAX
tc(SCL)
Cycle time, SCL
10
2.5
μs
2
tsu(SCLH-SDAL)
Setup time, SCL high before SDA low (for a
repeated START condition)
4.7
0.6
μs
3
th(SCLL-SDAL)
Hold time, SCL low after SDA low (for a
START and a repeated START condition)
4
0.6
μs
4
tw(SCLL)
Pulse duration, SCL low
4.7
1.3
μs
5
tw(SCLH)
Pulse duration, SCL high
4
0.6
μs
6
tsu(SDAV-SDLH)
Setup time, SDA valid before SCL high
250
100 (2)
ns
7
th(SDA-SDLL)
Hold time, SDA valid after SCL low (For I2C
bus™ devices)
0 (3)
0 (3)
8
tw(SDAH)
Pulse duration, SDA high between STOP and
START
conditions
4.7
1.3
9
tr(SDA)
Rise time, SDA
1000 20 + 0.1Cb
(5)
300
ns
10
tr(SCL)
Rise time, SCL
1000 20 + 0.1Cb
(5)
300
ns
11
tf(SDA)
Fall time, SDA
300 20 + 0.1Cb
(5)
300
ns
300 20 + 0.1Cb
(5)
300
ns
1
12
tf(SCL)
Fall time, SCL
13
tsu(SCLH-SDAH)
Setup time, SCL high before SDA high (for
STOP condition)
14
tw(SP)
Pulse duration, spike (must be suppressed)
15
(5)
(1)
(2)
(3)
(4)
(5)
Cb
4
0.9 (4)
μs
μs
0.6
0
Capacitive load for each bus line
μs
400
50
ns
400
pF
The I2C pins SDA and SCL do not feature fail-safe I/O buffers. These pins could potentially draw current when the device is powered
down.
A Fast-mode I2C-bus™ device can be used in a Standard-mode I2C-bus™ system, but the requirement tsu(SDA-SCLH) ≥250 ns must then
be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch
the LOW period of the SCL signal, it must output the next data bit to the SDA line tr max + tsu(SDA-SCLH) = 1000 + 250 = 1250 ns
(according to the Standard-mode I2C-Bus Specification) before the SCL line is released.
A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIHmin of the SCL signal) to bridge the
undefined region of the falling edge of SCL.
The maximum th(SDA-SCLL) has only to be met if the device does not stretch the low period [tw(SCLL)] of the SCL signal.
Cb = total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed.
11
9
SDA
6
8
14
4
13
5
10
SCL
1
12
3
2
7
3
Stop
Start
Repeated
Start
Stop
Figure 7-42. I2C Receive Timings
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Table 7-53. Switching Characteristics for I2C Timings (1)
(see Figure 7-43)
NO.
-720
-850
A-1000/-1000
PARAMETER
STANDARD MODE
MIN
MIN
MAX
16
tc(SCL)
Cycle time, SCL
10
2.5
μs
17
td(SCLH-SDAL)
Delay time, SCL high to SDA low (for a
repeated START condition)
4.7
0.6
μs
18
td(SDAL-SCLL)
Delay time, SDA low to SCL low (for a START
and a repeated START condition)
4
0.6
μs
19
tw(SCLL)
Pulse duration, SCL low
4.7
1.3
μs
20
tw(SCLH)
Pulse duration, SCL high
4
0.6
μs
21
td(SDAV-SDLH)
Delay time, SDA valid to SCL high
250
100
ns
22
tv(SDLL-SDAV)
Valid time, SDA valid after SCL low
(for I2C bus devices)
0
0
23
tw(SDAH)
Pulse duration, SDA high between STOP and
START conditions
4.7
1.3
24
tr(SDA)
Rise time, SDA
1000 20 + 0.1Cb
(2)
300
ns
25
tr(SCL)
Rise time, SCL
1000 20 + 0.1Cb
(2)
300
ns
26
tf(SDA)
Fall time, SDA
300 20 + 0.1Cb
(2)
300
ns
300 20 + 0.1Cb
(2)
300
ns
27
(1)
(2)
MAX
UNIT
FAST MODE
tf(SCL)
Fall time, SCL
28
td(SCLH-SDAH)
Delay time, SCL high to SDA high (for STOP
condition)
29
Cp
Capacitance for each I2C pin
4
0.9
μs
μs
μs
0.6
10
10
pF
Cb = total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed.
Cb = total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed.
26
24
SDA
21
23
19
28
20
25
SCL
16
27
18
17
22
18
Stop
Start
Repeated
Start
Stop
Figure 7-43. I2C Transmit Timings
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7.12 Host-Port Interface (HPI) Peripheral
7.12.1 HPI Device-Specific Information
The C6454 device includes a user-configurable 16-bit or 32-bit Host-port interface (HPI16/HPI32). The
AEA14 pin controls the HPI_WIDTH, allowing the user to configure the HPI as a 16-bit or 32-bit peripheral.
Software handshaking via the HRDY bit of the Host Port Control Register (HPIC) is not supported on the
C6454 device.
An HPI boot is terminated using a DSP interrupt. The DSP interrupt is registered in bit 0 (channel 0) of the
EDMA Event Register (ER). This event must be cleared by software before triggering transfers on DMA
channel 0.
7.12.2 HPI Peripheral Register Descriptions
Table 7-54. HPI Control Registers
HEX ADDRESS RANGE
ACRONYM
0288 0000
-
REGISTER NAME
Reserved
0288 0004
PWREMU_MGMT
0288 0008 - 0288 0024
-
Reserved
0288 0028
-
Reserved
0288 002C
-
Reserved
0288 0030
HPIC
HPI control register
0288 0034
HPIA
(HPIAW) (2)
HPI address register
(Write)
0288 0038
HPIA
(HPIAR) (2)
HPI address register
(Read)
0288 000C - 028B 007F
-
Reserved
0288 0080 - 028B FFFF
-
Reserved
(1)
(2)
170
COMMENTS
HPI power and emulation management register
The CPU has read/write
access to the
PWREMU_MGMT register;
the Host does not have any
access to this register.
The Host and the CPU have
read/write access to the
HPIC register. (1)
The Host has read/write
access to the HPIA registers.
The CPU has only read
access to the HPIA registers.
The CPU can write 1 to the HINT bit to generate an interrupt to the host and it can write 1 to the DSPINT bit to clear/acknowledge an
interrupt from the host.
There are two 32-bit HPIA registers: HPIAR for read operations and HPIAW for write operations. The HPI can be configured such that
HPIAR and HPIAW act as a single 32-bit HPIA (single-HPIA mode) or as two separate 32-bit HPIAs (dual-HPIA mode) from the
perspective of the host. The CPU can access HPIAW and HPIAR independently. For details about the HPIA registers and their modes,
see the TMS320C645x DSP Host Port Interface (HPI) User's Guide (literature number SPRU969).
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7.12.3 HPI Electrical Data/Timing
Table 7-55. Timing Requirements for Host-Port Interface Cycles (1)
(2)
(see Figure 7-44 through Figure 7-51)
-720
-850
A-1000/-1000
NO.
MIN
9
tsu(HASL-HSTBL)
Setup time, HAS low before HSTROBE low
5
ns
10
th(HSTBL-HASL)
Hold time, HAS low after HSTROBE low
2
ns
11
tsu(SELV-HASL)
Setup time, select signals (3) valid before HAS low
5
ns
(3)
12
th(HASL-SELV)
Hold time, select signals
5
ns
13
tw(HSTBL)
Pulse duration, HSTROBE low
15
ns
14
tw(HSTBH)
Pulse duration, HSTROBE high between consecutive accesses
2M
ns
valid after HAS low
(3)
15
tsu(SELV-HSTBL)
Setup time, select signals
5
ns
16
th(HSTBL-SELV)
Hold time, select signals (3) valid after HSTROBE low
5
ns
17
tsu(HDV-HSTBH)
Setup time, host data valid before HSTROBE high
5
ns
18
th(HSTBH-HDV)
Hold time, host data valid after HSTROBE high
1
ns
37
tsu(HCSL-HSTBL)
Setup time, HCS low before HSTROBE low
0
ns
th(HRDYL-HSTBL)
Hold time, HSTROBE low after HRDY low. HSTROBE should not be
inactivated until HRDY is active (low); otherwise, HPI writes will not
complete properly.
1.1
ns
38
(1)
(2)
(3)
UNIT
MAX
valid before HSTROBE low
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
M = SYSCLK3 period = 6/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use M = 6 ns.
Select signals include: HCNTL[1:0] and HR/W. For HPI16 mode only, select signals also include HHWIL.
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Table 7-56. Switching Characteristics for Host-Port Interface Cycles (1)
(2)
(see Figure 7-44 through Figure 7-51)
NO.
PARAMETER
-720
-850
A-1000/-1000
MIN
Case 1. HPIC or HPIA read
1
td(HSTBL-HDV)
Delay time, HSTROBE low to
DSP data valid
15
9 * M + 20
Case 3. HPID read with auto-increment
and read FIFO initially empty (3)
9 * M + 20
5
15
ns
2
tdis(HSTBH-HDV)
Disable time, HD high-impedance from HSTROBE high
1
4
ns
3
ten(HSTBL-HD)
Enable time, HD driven from HSTROBE low
3
15
ns
4
td(HSTBL-HRDYH)
Delay time, HSTROBE low to HRDY high
12
ns
5
td(HSTBH-HRDYH)
Delay time, HSTROBE high to HRDY high
12
ns
6
7
td(HSTBL-HRDYL)
td(HDV-HRDYL)
Delay time, HSTROBE low to
HRDY low
Case 1. HPID read with no autoincrement (3)
10 * M + 20
Case 2. HPID read with auto-increment
and read FIFO initially empty (3)
10 * M + 20
Delay time, HD valid to HRDY low
Case 1. HPIA write (3)
34
td(DSH-HRDYL)
Delay time, HSTROBE high to
Case 2. HPID write with no autoHRDY low
increment (3)
35
td(HSTBL-HRDYL)
Delay time, HSTROBE low to HRDY low for HPIA write and FIFO not
empty (3)
36
td(HASL-HRDYH)
Delay time, HAS low to HRDY high
172
MAX
5
Case 2. HPID read with no autoincrement (3)
Case 4. HPID read with auto-increment
and data previously prefetched into the
read FIFO
(1)
(2)
(3)
UNIT
ns
0
ns
5 * M + 20
5 * M + 20
ns
40 * M + 20
ns
12
ns
M = SYSCLK3 period = 6/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use M = 6 ns.
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Assumes the HPI is accessing L2/L1 memory and no other master is accessing the same memory location.
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HCS
HAS
HCNTL[1:0]
HR/W
HHWIL
13
16
16
15
15
37
37
14
13
HSTROBE(A)
3
3
1
2
1
2
HD[15:0]
38
4
7
6
HRDY(B)
A.
B.
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with autoincrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed information on
the HPI peripheral, see the TMS320C645x DSP Host Port Interface (HPI) User's Guide (literature number SPRU969).
Figure 7-44. HPI16 Read Timing (HAS Not Used, Tied High)
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HCS
HAS
12
11
12
11
HCNTL[1:0]
12
11
12
11
12
11
12
11
HR/W
HHWIL
10
9
10
9
37
13
37
13
14
HSTROBE(A)
1
3
2
1
3
2
HD[15:0]
7
36
6
38
HRDY(B)
A.
B.
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with autoincrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed information on
the HPI peripheral, see the TMS320C645x DSP Host Port Interface (HPI) User's Guide (literature number SPRU969).
Figure 7-45. HPI16 Read Timing (HAS Used)
174
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HCS
HAS
HCNTL[1:0]
HR/W
HHWIL
16
13
16
15
37
15
37
13
14
HSTROBE(A)
18
18
17
17
HD[15:0]
4
35
38
34
5
34
5
HRDY(B)
A.
B.
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with autoincrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed information on
the HPI peripheral, see the TMS320C645x DSP Host Port Interface (HPI) User's Guide (literature number SPRU969).
Figure 7-46. HPI16 Write Timing (HAS Not Used, Tied High)
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HCS
HAS
12
11
12
11
HCNTL[1:0]
12
11
11
12
11
11
12
HR/W
12
HHWIL
9
10
9
14
37
HSTROBE(A)
10
37
13
13
18
18
17
17
HD[15:0]
34
35
34
5
36
38
5
HRDY(B)
A.
B.
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with autoincrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed information on
the HPI peripheral, see the TMS320C645x DSP Host Port Interface (HPI) User's Guide (literature number SPRU969).
Figure 7-47. HPI16 Write Timing (HAS Used)
176
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HAS (input)
16
15
HCNTL[1:0] (input)
HR/W (input)
13
HSTROBE(A)
(input)
37
HCS (input)
1
2
3
HD[31:0] (output)
38
7
6
4
HRDY(B) (output)
A.
B.
C.
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with autoincrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed information on
the HPI peripheral, see the TMS320C645x DSP Host Port Interface (HPI) User's Guide (literature number SPRU969).
The timing tw(HSTBH), HSTROBE high pulse duration, must be met between consecutive HPI accesses in HPI32
mode.
Figure 7-48. HPI32 Read Timing (HAS Not Used, Tied High)
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10
HAS (input)
12
11
HCNTL[1:0] (input)
HR/W (input)
9
13
HSTROBE(A) (input)
37
HCS (input)
1
2
3
HD[31:0] (output)
7
38
6
36
HRDY(B) (output)
A.
B.
C.
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with autoincrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed information on
the HPI peripheral, see the TMS320C645x DSP Host Port Interface (HPI) User's Guide (literature number SPRU969).
The timing tw(HSTBH), HSTROBE high pulse duration, must be met between consecutive HPI accesses in HPI32
mode.
Figure 7-49. HPI32 Read Timing (HAS Used)
178
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HAS (input)
16
15
HCNTL[1:0]
(input)
HR/W (input)
13
HSTROBE(A)
(input)
37
HCS (input)
18
17
HD[31:0] (input)
38
34
35
5
4
HRDY(B) (output)
A.
B.
C.
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with autoincrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed information on
the HPI peripheral, see the TMS320C645x DSP Host Port Interface (HPI) User's Guide (literature number SPRU969).
The timing tw(HSTBH), HSTROBE high pulse duration, must be met between consecutive HPI accesses in HPI32
mode.
Figure 7-50. HPI32 Write Timing (HAS Not Used, Tied High)
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10
HAS (input)
12
11
HCNTL[1:0]
(input)
HR/W (input)
9
13
HSTROBE(A)
(input)
37
HCS (input)
17
18
HD[31:0] (input)
35
36
34
38
5
HRDY(B) (output)
A.
B.
C.
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with autoincrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed information on
the HPI peripheral, see the TMS320C645x DSP Host Port Interface (HPI) User's Guide (literature number SPRU969).
The timing tw(HSTBH), HSTROBE high pulse duration, must be met between consecutive HPI accesses in HPI32
mode.
Figure 7-51. HPI32 Write Timing (HAS Used)
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7.13 Multichannel Buffered Serial Port (McBSP)
The McBSP provides these functions:
• Full-duplex communication
• Double-buffered data registers, which allow a continuous data stream
• Independent framing and clocking for receive and transmit
• Direct interface to industry-standard codecs, analog interface chips (AICs), and other serially
connected analog-to-digital (A/D) and digital-to-analog (D/A) devices
• External shift clock or an internal, programmable frequency shift clock for data transfer
For more detailed information on the McBSP peripheral, see the TMS320C6000 DSP Multichannel
Buffered Serial Port ( McBSP) Reference Guide (literature number SPRU580).
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7.13.1 McBSP Device-Specific Information
The CLKS signal is shared by both McBSP0 and McBSP1 on this device. Also, the CLKGDV field of the
Sample Rate Generator Register (SRGR) must always be set to a value of 1 or greater.
The McBSP Data Receive Register (DRR) and Data Transmit Register (DXR) can be accessed through
two separate busses: a configuration bus and a data bus. Both paths can be used by the CPU and the
EDMA. The data bus should be used to service the McBSP as this path provides better performance.
However, since the data path shares a bridge with the PCI peripheral (see Figure 4-1), the configuration
path should be used in cases where this peripheral is being used to avoid any performance degradation.
Note that the PCI peripheral consists of an independent master and slave. Performance degradation is
only a concern when this peripheral is used to initiate transactions on the external bus.
7.13.2 McBSP Peripheral Register Descriptions
Table 7-57. McBSP 0 Registers
HEX ADDRESS RANGE
182
ACRONYM
REGISTER NAME
028C 0000
DRR0
McBSP0 Data Receive Register via Configuration Bus
3000 0000
DRR0
McBSP0 Data Receive Register via EDMA3 Bus
028C 0004
DXR0
McBSP0 Data Transmit Register via Configuration Bus
3000 0010
DXR0
McBSP0 Data Transmit Register via EDMA Bus
028C 0008
SPCR0
028C 000C
RCR0
McBSP0 Receive Control Register
028C 0010
XCR0
McBSP0 Transmit Control Register
028C 0014
SRGR0
028C 0018
MCR0
028C 001C
RCERE00
McBSP0 Enhanced Receive Channel Enable
Register 0 Partition A/B
028C 0020
XCERE00
McBSP0 Enhanced Transmit Channel Enable
Register 0 Partition A/B
028C 0024
PCR0
028C 0028
RCERE10
McBSP0 Enhanced Receive Channel Enable
Register 1 Partition C/D
028C 002C
XCERE10
McBSP0 Enhanced Transmit Channel Enable
Register 1 Partition C/D
028C 0030
RCERE20
McBSP0 Enhanced Receive Channel Enable
Register 2 Partition E/F
028C 0034
XCERE20
McBSP0 Enhanced Transmit Channel Enable
Register 2 Partition E/F
028C 0038
RCERE30
McBSP0 Enhanced Receive Channel Enable
Register 3 Partition G/H
028C 003C
XCERE30
McBSP0 Enhanced Transmit Channel Enable
Register 3 Partition G/H
028C 0040 - 028F FFFF
-
COMMENTS
The CPU and EDMA3
controller can only read
this register; they cannot
write to it.
McBSP0 Serial Port Control Register
McBSP0 Sample Rate Generator register
McBSP0 Multichannel Control Register
McBSP0 Pin Control Register
Reserved
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Table 7-58. McBSP 1 Registers
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
0290 0000
DRR1
McBSP1 Data Receive Register via Configuration Bus
3400 0000
DRR1
McBSP1 Data Receive Register via EDMA bus
0290 0004
DXR1
McBSP1 Data Transmit Register via configuration bus
3400 0010
DXR1
McBSP1 Data Transmit Register via EDMA bus
0290 0008
SPCR1
McBSP1 serial port control register
0290 000C
RCR1
McBSP1 Receive Control Register
0290 0010
XCR1
McBSP1 Transmit Control Register
0290 0014
SRGR1
0290 0018
MCR1
0290 001C
RCERE01
McBSP1 Enhanced Receive Channel Enable
Register 0 Partition A/B
0290 0020
XCERE01
McBSP1 Enhanced Transmit Channel Enable
Register 0 Partition A/B
0290 0024
PCR1
0290 0028
RCERE11
McBSP1 Enhanced Receive Channel Enable
Register 1 Partition C/D
0290 002C
XCERE11
McBSP1 Enhanced Transmit Channel Enable
Register 1 Partition C/D
0290 0030
RCERE21
McBSP1 Enhanced Receive Channel Enable
Register 2 Partition E/F
0290 0034
XCERE21
McBSP1 Enhanced Transmit Channel Enable
Register 2 Partition E/F
0290 0038
RCERE31
McBSP1 Enhanced Receive Channel Enable
Register 3 Partition G/H
0290 003C
XCERE31
McBSP1 Enhanced Transmit Channel Enable
Register 3 Partition G/H
0290 0040 - 0293 FFFF
-
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COMMENTS
The CPU and EDMA
controller can only read
this register; they cannot
write to it.
McBSP1 sample rate generator register
McBSP1 multichannel control register
McBSP1 Pin Control Register
Reserved
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7.13.3 McBSP Electrical Data/Timing
Table 7-59. Timing Requirements for McBSP (1)
(see Figure 7-52)
-720
-850
A-1000/-1000
NO.
MIN
2
tc(CKRX)
Cycle time, CLKR/X
CLKR/X ext
6P or 10 (2)
(3)
ns
3
tw(CKRX)
Pulse duration, CLKR/X high or CLKR/X low
CLKR/X ext
0.5tc(CKRX) - 1 (4)
ns
5
tsu(FRH-CKRL)
Setup time, external FSR high before CLKR low
6
th(CKRL-FRH)
Hold time, external FSR high after CLKR low
7
tsu(DRV-CKRL)
Setup time, DR valid before CLKR low
8
th(CKRL-DRV)
Hold time, DR valid after CLKR low
10
tsu(FXH-CKXL)
Setup time, external FSX high before CLKX low
11
th(CKXL-FXH)
Hold time, external FSX high after CLKX low
(1)
(2)
(3)
(4)
184
UNIT
MAX
CLKR int
9
CLKR ext
1.3
CLKR int
6
CLKR ext
3
CLKR int
8
CLKR ext
0.9
CLKR int
3
CLKR ext
3.1
CLKX int
9
CLKX ext
1.3
CLKX int
6
CLKX ext
3
ns
ns
ns
ns
ns
ns
CLKRP = CLKXP = FSRP = FSXP = 0. If polarity of any of the signals is inverted, then the timing references of that signal are also
inverted.
P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.
Use whichever value is greater. Minimum CLKR/X cycle times must be met, even when CLKR/X is generated by an internal clock
source. The minimum CLKR/X cycle times are based on internal logic speed; the maximum usable speed may be lower due to EDMA
limitations and AC timing requirements.
This parameter applies to the maximum McBSP frequency. Operate serial clocks (CLKR/X) in the reasonable range of 40/60 duty cycle.
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Table 7-60. Switching Characteristics Over Recommended Operating Conditions for McBSP (1)
(2)
(see Figure 7-52)
NO.
-720
-850
A-1000/-1000
PARAMETER
MIN
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
1
td(CKSH-CKRXH)
Delay time, CLKS high to CLKR/X high for internal CLKR/X
generated from CLKS input (3)
2
tc(CKRX)
Cycle time, CLKR/X
CLKR/X int
3
tw(CKRX)
Pulse duration, CLKR/X high or CLKR/X low
CLKR/X int
4
td(CKRH-FRV)
Delay time, CLKR high to internal FSR valid
9
td(CKXH-FXV)
Delay time, CLKX high to internal FSX valid
12
tdis(CKXH-DXHZ)
Disable time, DX high impedance following
last data bit from CLKX high
13
td(CKXH-DXV)
Delay time, CLKX high to DX valid
14
td(FXH-DXV)
MAX
1.4
6P or 10 (4)
UNIT
10
(5) (6)
ns
ns
C - 1 (7)
C + 1 (7)
ns
CLKR int
-2.1
3.3
ns
CLKX int
-1.7
3
CLKX ext
1.7
9
CLKX int
-3.9
4
CLKX ext
2.1
9
CLKX int
-3.9 + D1 (8)
4 + D2 (8)
(8)
9 + D2 (8)
CLKX ext
2.1 + D1
Delay time, FSX high to DX valid
FSX int
-2.3 + D1 (9)
5.6 + D2 (9)
ONLY applies when in data
delay 0 (XDATDLY = 00b) mode
FSX ext
1.9 + D1 (9)
9 + D2 (9)
ns
ns
ns
ns
CLKRP = CLKXP = FSRP = FSXP = 0. If polarity of any of the signals is inverted, then the timing references of that signal are also
inverted.
Minimum delay times also represent minimum output hold times.
The CLKS signal is shared by both McBSP0 and McBSP1 on this device.
Minimum CLKR/X cycle times must be met, even when CLKR/X is generated by an internal clock source. Minimum CLKR/X cycle times
are based on internal logic speed; the maximum usable speed may be lower due to EDMA limitations and AC timing requirements.
P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.
Use whichever value is greater.
C = H or L
S = sample rate generator input clock = 6P if CLKSM = 1 (P = 1/CPU clock frequency)
S = sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
H = (CLKGDV + 1)/2 * S if CLKGDV is odd
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
L = (CLKGDV + 1)/2 * S if CLKGDV is odd
CLKGDV should be set appropriately to ensure the McBSP bit rate does not exceed the maximum limit (see (4) above).
Extra delay from CLKX high to DX valid applies only to the first data bit of a device, if and only if DXENA = 1 in SPCR.
if DXENA = 0, then D1 = D2 = 0
if DXENA = 1, then D1 = 6P, D2 = 12P
Extra delay from FSX high to DX valid applies only to the first data bit of a device, if and only if DXENA = 1 in SPCR.
if DXENA = 0, then D1 = D2 = 0
if DXENA = 1, then D1 = 6P, D2 = 12P
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CLKS
1
2
3
3
CLKR
4
4
FSR (int)
5
6
FSR (ext)
7
DR
8
Bit(n-1)
(n-2)
(n-3)
2
3
3
CLKX
9
FSX (int)
11
10
FSX (ext)
FSX (XDATDLY=00b)
12
DX
A.
B.
Bit 0
14
13 (A)
Bit(n-1)
13 (A)
(n-2)
(n-3)
Parameter No. 13 applies to the first data bit only when XDATDLY ≠ 0.
The CLKS signal is shared by both McBSP0 and McBSP1 on this device.
Figure 7-52. McBSP Timing(B)
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Table 7-61. Timing Requirements for FSR When GSYNC = 1
(see Figure 7-53)
-720
-850
A-1000/-1000
NO.
MIN
UNIT
MAX
1
tsu(FRH-CKSH)
Setup time, FSR high before CLKS high
4
ns
2
th(CKSH-FRH)
Hold time, FSR high after CLKS high
4
ns
CLKS
1
2
FSR external
CLKR/X (no need to resync)
CLKR/X (needs resync)
Figure 7-53. FSR Timing When GSYNC = 1
Table 7-62. Timing Requirements for McBSP as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0 (1)
(2)
(see Figure 7-54)
-720
-850
A-1000/-1000
NO.
MASTER
MIN
(1)
(2)
4
tsu(DRV-CKXL)
Setup time, DR valid before CLKX low
5
th(CKXL-DRV)
Hold time, DR valid after CLKX low
UNIT
SLAVE
MAX
MIN
MAX
12
2 - 18P
ns
4
5 + 36P
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.
For all SPI Slave modes, CLKG is programmed as 1/6 of the CPU clock by setting CLKSM = CLKGDV = 1.
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Table 7-63. Switching Characteristics Over Recommended Operating Conditions for McBSP as SPI
Master or Slave: CLKSTP = 10b, CLKXP = 0 (1) (2)
(see Figure 7-54)
NO.
(1)
(2)
(3)
(4)
(5)
-720
-850
A-1000/-1000
PARAMETER
MASTER (3)
UNIT
SLAVE
MIN
MAX
1
th(CKXL-FXL)
Hold time, FSX low after CLKX low (4)
T-2
T+3
2
td(FXL-CKXH)
Delay time, FSX low to CLKX high (5)
L-2
L+3
3
td(CKXH-DXV)
Delay time, CLKX high to DX valid
-2
4
6
tdis(CKXL-DXHZ)
Disable time, DX high impedance following
last data bit from CLKX low
L-2
L+3
7
tdis(FXH-DXHZ)
Disable time, DX high impedance following
last data bit from FSX high
8
td(FXL-DXV)
Delay time, FSX low to DX valid
MIN
MAX
ns
ns
18P + 2.8
30P + 17
ns
ns
6P + 3
18P + 17
ns
12P + 2
24P + 17
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.
For all SPI Slave modes, CLKG is programmed as 1/6 of the CPU clock by setting CLKSM = CLKGDV = 1.
S = Sample rate generator input clock = 6P if CLKSM = 1 (P = 1/CPU clock frequency)
S = Sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
H = (CLKGDV + 1)/2 * S if CLKGDV is odd
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
L = (CLKGDV + 1)/2 * S if CLKGDV is odd
FSRP = FSXP = 1. As a SPI Master, FSX is inverted to provide active-low slave-enable output. As a Slave, the active-low signal input
on FSX and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for Master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for Slave McBSP
FSX should be low before the rising edge of clock to enable Slave devices and then begin a SPI transfer at the rising edge of the Master
clock (CLKX).
CLKX
1
2
FSX
7
6
DX
8
3
Bit 0
Bit(n-1)
4
DR
Bit 0
(n-2)
(n-3)
(n-4)
5
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 7-54. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0
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Table 7-64. Timing Requirements for McBSP as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0 (1)
(2)
(see Figure 7-55)
-720
-850
A-1000/-1000
NO.
MASTER
MIN
(1)
(2)
4
tsu(DRV-CKXH)
Setup time, DR valid before CLKX high
5
th(CKXH-DRV)
Hold time, DR valid after CLKX high
UNIT
SLAVE
MAX
MIN
MAX
12
2 - 18P
ns
4
5 + 36P
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.
For all SPI Slave modes, CLKG is programmed as 1/6 of the CPU clock by setting CLKSM = CLKGDV = 1.
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Table 7-65. Switching Characteristics Over Recommended Operating Conditions for McBSP as SPI
Master or Slave: CLKSTP = 11b, CLKXP = 0 (1) (2)
(see Figure 7-55)
NO.
(1)
(2)
(3)
(4)
(5)
-720
-850
A-1000/-1000
PARAMETER
MASTER (3)
UNIT
SLAVE
MIN
MAX
1
th(CKXL-FXL)
Hold time, FSX low after CLKX low (4)
L-2
L+3
MIN
MAX
2
td(FXL-CKXH)
Delay time, FSX low to CLKX high (5)
T-2
T+3
3
td(CKXL-DXV)
Delay time, CLKX low to DX valid
-2
4
18P + 2.8
30P + 17
ns
6
tdis(CKXL-DXHZ)
Disable time, DX high impedance following
last data bit from CLKX low
-2
4
18P + 3
30P + 17
ns
7
td(FXL-DXV)
Delay time, FSX low to DX valid
H-2
H+4
12P + 2
24P + 17
ns
ns
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.
For all SPI Slave modes, CLKG is programmed as 1/6 of the CPU clock by setting CLKSM = CLKGDV = 1.
S = Sample rate generator input clock = 6P if CLKSM = 1 (P = 1/CPU clock frequency)
S = Sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
H = (CLKGDV + 1)/2 * S if CLKGDV is odd
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
L = (CLKGDV + 1)/2 * S if CLKGDV is odd
FSRP = FSXP = 1. As a SPI Master, FSX is inverted to provide active-low slave-enable output. As a Slave, the active-low signal input
on FSX and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for Master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for Slave McBSP
FSX should be low before the rising edge of clock to enable Slave devices and then begin a SPI transfer at the rising edge of the Master
clock (CLKX).
CLKX
1
2
6
Bit 0
7
FSX
DX
3
Bit(n-1)
4
DR
Bit 0
(n-2)
(n-3)
(n-4)
5
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 7-55. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0
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Table 7-66. Timing Requirements for McBSP as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1 (1)
(2)
(see Figure 7-56)
-720
-850
A-1000/-1000
NO.
MASTER
MIN
(1)
(2)
4
tsu(DRV-CKXH)
Setup time, DR valid before CLKX high
5
th(CKXH-DRV)
Hold time, DR valid after CLKX high
UNIT
SLAVE
MAX
MIN
MAX
12
2 - 18P
ns
4
5 + 36P
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.
For all SPI Slave modes, CLKG is programmed as 1/6 of the CPU clock by setting CLKSM = CLKGDV = 1.
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Table 7-67. Switching Characteristics Over Recommended Operating Conditions for McBSP as SPI
Master or Slave: CLKSTP = 10b, CLKXP = 1 (1) (2)
(see Figure 7-56)
NO.
(1)
(2)
(3)
(4)
(5)
-720
-850
A-1000/-1000
PARAMETER
UNIT
MASTER (3)
SLAVE
MIN
MAX
1
th(CKXH-FXL)
Hold time, FSX low after CLKX high (4)
T-2
T+3
2
td(FXL-CKXL)
Delay time, FSX low to CLKX low (5)
H-2
H+3
3
td(CKXL-DXV)
Delay time, CLKX low to DX valid
-2
4
6
tdis(CKXH-DXHZ)
Disable time, DX high impedance following
last data bit from CLKX high
H-2
H+3
7
tdis(FXH-DXHZ)
Disable time, DX high impedance following
last data bit from FSX high
8
td(FXL-DXV)
Delay time, FSX low to DX valid
MIN
MAX
ns
ns
18P + 2.8
30P + 17
ns
ns
6P + 3
18P + 17
ns
12P + 2
24P + 17
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.
For all SPI Slave modes, CLKG is programmed as 1/6 of the CPU clock by setting CLKSM = CLKGDV = 1.
S = Sample rate generator input clock = 6P if CLKSM = 1 (P = 1/CPU clock frequency)
S = Sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
H = (CLKGDV + 1)/2 * S if CLKGDV is odd
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
L = (CLKGDV + 1)/2 * S if CLKGDV is odd
FSRP = FSXP = 1. As a SPI Master, FSX is inverted to provide active-low slave-enable output. As a Slave, the active-low signal input
on FSX and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for Master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for Slave McBSP
FSX should be low before the rising edge of clock to enable Slave devices and then begin a SPI transfer at the rising edge of the Master
clock (CLKX).
CLKX
1
2
FSX
7
6
DX
8
3
Bit 0
Bit(n-1)
4
DR
Bit 0
(n-2)
(n-3)
(n-4)
5
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 7-56. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1
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Table 7-68. Timing Requirements for McBSP as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1 (1)
(2)
(see Figure 7-57)
-720
-850
A-1000/-1000
NO.
MASTER
MIN
(1)
(2)
4
tsu(DRV-CKXH)
Setup time, DR valid before CLKX high
5
th(CKXH-DRV)
Hold time, DR valid after CLKX high
UNIT
SLAVE
MAX
MIN
MAX
12
2 - 18P
ns
4
5 + 36P
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.
For all SPI Slave modes, CLKG is programmed as 1/6 of the CPU clock by setting CLKSM = CLKGDV = 1.
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Table 7-69. Switching Characteristics Over Recommended Operating Conditions for McBSP as SPI
Master or Slave: CLKSTP = 11b, CLKXP = 1 (1) (2)
(see Figure 7-57)
NO.
(1)
(2)
(3)
(4)
(5)
-720
-850
A-1000/-1000
PARAMETER
UNIT
MASTER (3)
SLAVE
MIN
MAX
1
th(CKXH-FXL)
Hold time, FSX low after CLKX high (4)
H-2
H+3
MIN
MAX
2
td(FXL-CKXL)
Delay time, FSX low to CLKX low (5)
T-2
T+1
3
td(CKXH-DXV)
Delay time, CLKX high to DX valid
-2
4
18P + 2.8
30P + 17
ns
6
tdis(CKXH-DXHZ)
Disable time, DX high impedance following
last data bit from CLKX high
-2
4
18P + 3
30P + 17
ns
7
td(FXL-DXV)
Delay time, FSX low to DX valid
L-2
L+4
12P + 2
24P + 17
ns
ns
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.
For all SPI Slave modes, CLKG is programmed as 1/6 of the CPU clock by setting CLKSM = CLKGDV = 1.
S = Sample rate generator input clock = 6P if CLKSM = 1 (P = 1/CPU clock frequency)
S = Sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
H = (CLKGDV + 1)/2 * S if CLKGDV is odd
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
L = (CLKGDV + 1)/2 * S if CLKGDV is odd
FSRP = FSXP = 1. As a SPI Master, FSX is inverted to provide active-low slave-enable output. As a Slave, the active-low signal input
on FSX and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for Master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for Slave McBSP
FSX should be low before the rising edge of clock to enable Slave devices and then begin a SPI transfer at the rising edge of the Master
clock (CLKX).
CLKX
1
2
FSX
6
DX
7
3
Bit 0
Bit(n-1)
4
DR
Bit 0
(n-2)
(n-3)
(n-4)
5
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 7-57. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1
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7.14 Ethernet MAC (EMAC)
The Ethernet Media Access Controller (EMAC) module provides an efficient interface between the C6454
DSP core processor and the networked community. The EMAC supports 10Base-T (10 Mbits/second
[Mbps]), and 100BaseTX (100 Mbps), in either half- or full-duplex mode, and 1000BaseT (1000 Mbps) in
full-duplex mode, with hardware flow control and quality-of-service (QOS) support.
The EMAC module conforms to the IEEE 802.3-2002 standard, describing the “Carrier Sense Multiple
Access with Collision Detection (CSMA/CD) Access Method and Physical Layer” specifications. The IEEE
802.3 standard has also been adopted by ISO/IEC and re-designated as ISO/IEC 8802-3:2000(E).
Deviation from this standard, the EMAC module does not use the Transmit Coding Error signal MTXER.
Instead of driving the error pin when an underflow condition occurs on a transmitted frame, the EMAC will
intentionally generate an incorrect checksum by inverting the frame CRC, so that the transmitted frame
will be detected as an error by the network.
The EMAC control module is the main interface between the device core processor, the MDIO module,
and the EMAC module. The relationship between these three components is shown in Figure 7-58. The
EMAC control module contains the necessary components to allow the EMAC to make efficient use of
device memory, plus it controls device interrupts. The EMAC control module incorporates 8K-bytes of
internal RAM to hold EMAC buffer descriptors. The relationship between these three components is
shown in Figure 7-58.
Interrupt
Controller
Configuration Bus
DMA Memory
Transfer Controller
Peripheral Bus
EMAC Control Module
EMAC/MDIO
Interrupt
EMAC Module
MDIO Module
Ethernet Bus
MDIO Bus
Figure 7-58. EMAC, MDIO, and EMAC Control Modules
For more detailed information on the EMAC/MDIO, see the TMS320C645x DSP EMAC/MDIO Module
Reference Guide (literature number SPRU975).
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7.14.1 EMAC Device-Specific Information
Interface Modes
The EMAC module on the TMS320C6454 device supports four interface modes: Media Independent
Interface (MII), Reduced Media Independent Interface (RMII), Gigabit Media Independent Interface (GMII),
and Reduced Gigabit Media Independent Interface (RGMII). The MII and GMII interface modes are
defined in the IEEE 802.3-2002 standard.
The RGMII mode of the EMAC conforms to the Reduced Gigabit Media Independent Interface (RGMII)
Specification (version 2.0). The RGMII mode implements the same functionality as the GMII mode, but
with a reduced number of pins. Data and control information is transmitted and received using both edges
of the transmit and receive clocks (TXC and RXC).
Note: The EMAC internally delays the transmit clock (TXC) with respect to the transmit data and control
pins. Therefore, the EMAC conforms to the RGMII-ID operation of the RGMII specification. However, the
EMAC does not delay the receive clock (RXC); this signal must be delayed with respect to the receive
data and control pins outside of the DSP.
The RMII mode of the EMAC conforms to the RMII Specification (revision 1.2), as written by the RMII
Consortium. As the name implies, the Reduced Media Independent Interface (RMII) mode is a reduced
pin count version of the MII mode.
Interface Mode Select
The EMAC uses the same pins for the MII, GMII, and RMII modes. Standalone pins are included for the
RGMII mode due to specific voltage requirements. Only one mode can be used at a time. The mode used
is selected at device reset based on the MACSEL[1:0] configuration pins (for more detailed information,
see Section 3, Device Configuration). Table 7-70 shows which multiplexed pins are used in the MII, GMII,
and RMII modes on the EMAC. For a detailed description of these pin functions, see Table 2-3, Terminal
Functions.
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Table 7-70. EMAC/MDIO Multiplexed Pins (MII, RMII, and GMII Modes)
BALL NUMBER
DEVICE PIN NAME
MII
(MAC_SEL =
00b)
RMII
(MAC_SEL =
01b)
GMII
(MAC_SEL =
10b)
J2
MRXD0/RMRXD0
MRXD0
RMRXD0
MRXD0
H3
MRXD1/RMRXD1
MRXD1
RMRXD1
MRXD1
J1
MRXD2
MRXD2
MRXD2
J3
MRXD3
MRXD3
MRXD3
L1
MRXD4
MRXD4
L2
MRXD5
MRXD5
H2
MRXD6
MRXD6
M2
MRXD7
MRXD7
M1
MTXD0/RMTXD0
MTXD0
RMTXD0
MTXD0
L4
MTXD1/RMTXD1
MTXD1
RMTXD1
MTXD1
M4
MTXD2
MTXD2
MTXD2
K4
MTXD3
MTXD3
MTXD3
L3
MTXD4
MTXD4
L5
MTXD5
MTXD5
M3
MTXD6
MTXD6
N5
MTXD7
MTXD7
H4
MRXER/RMRXER
MRXER
H5
MRXDV
MRXDV
J5
MTXEN/RMTXEN
MTXEN
RMTXEN
MTXEN
J4
MCRS/RMCRSDV
MCRS
RMCRSDV
MCRS
K3
MCOL
MCOL
K5
GMTCLK
H1
MRCLK
MRCLK
N4
MTCLK/REFCLK
MTCLK
N3
GMDIO
M5
GMDCLK
RMRXER
MRXER
MRXDV
MCOL
GMTCLK
MRCLK
RMREFCLK
MTCLK
MDIO
MDIO
MDIO
MDCLK
MDCLK
MDCLK
Using the RMII Mode of the EMAC
The Ethernet Media Access Controller (EMAC) contains logic that allows it to communicate using the
Reduced Media Independent Interface (RMII) protocol. This logic must be taken out of reset before being
used. To use the RMII mode of the EMAC follow these steps:
1. Enable the EMAC/MDIO through the Device State Control Registers.
– Unlock the PERCFG0 register by writing 0x0F0A 0B00 to the PERLOCK register.
– Set bit 4 in the PERCFG0 register within 16 SYSCLK3 clock cycles to enable the EMAC/MDIO.
– Poll the PERSTAT0 register to verify state change.
2. Initialize the EMAC/MDIO as needed.
3. Release the RMII logic from reset by clearing the RMII_RST bit of the EMAC Configuration Register
(see Section 3.4.5).
As described in the previous section, the RMII mode of the EMAC must be selected by setting
MACSEL[1:0] = 01b at device reset.
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Interface Mode Clocking
The on-chip PLL2 and PLL2 Controller generate the clocks to the EMAC module in RGMII or GMII mode.
When the EMAC is enabled with these modes, the input clock to the PLL2 Controller (CLKIN2) must have
a 25-MHz frequency. For more information, see Section 7.8, PLL2 and PLL2 Controller.
The EMAC uses SYSCLK1 of the PLL2 Controller to generate the necessary clocks for the GMII and
RGMII modes. When these modes are used, the frequency of CLKIN2 must be 25 MHz. Also, divider D1
should be programmed to ÷2 mode [default] when using the GMII mode and to ÷5 mode when using the
RGMII mode. Divider D1 is software programmable and, if necessary, must be programmed after device
reset to ÷5 when the RGMII mode of the EMAC is used.
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7.14.2 EMAC Peripheral Register Descriptions
Table 7-71. Ethernet MAC (EMAC) Control Registers
HEX ADDRESS RANGE
ACRONYM
02C8 0000
TXIDVER
02C8 0004
TXCONTROL
02C8 0008
TXTEARDOWN
02C8 000F
-
02C8 0010
RXIDVER
02C8 0014
RXCONTROL
02C8 0018
RXTEARDOWN
REGISTER NAME
Transmit Identification and Version Register
Transmit Control Register
Transmit Teardown Register
Reserved
Receive Identification and Version Register
Receive Control Register
Receive Teardown Register
02C8 001C
-
Reserved
02C8 0020 - 02C8 007C
-
Reserved
02C8 0080
TXINTSTATRAW
02C8 0084
TXINTSTATMASKED
02C8 0088
TXINTMASKSET
02C8 008C
TXINTMASKCLEAR
02C8 0090
MACINVECTOR
02C8 0094 - 02C8 009C
-
02C8 00A0
RXINTSTATRAW
02C8 00A4
RXINTSTATMASKED
Transmit Interrupt Status (Unmasked) Register
Transmit Interrupt Status (Masked) Register
Transmit Interrupt Mask Set Register
Transmit Interrupt Mask Clear Register
MAC Input Vector Register
Reserved
Receive Interrupt Status (Unmasked) Register
Receive Interrupt Status (Masked) Register
02C8 00A8
RXINTMASKSET
02C8 00AC
RXINTMASKCLEAR
Receive Interrupt Mask Set Register
Receive Interrupt Mask Clear Register
02C8 00B0
MACINTSTATRAW
MAC Interrupt Status (Unmasked) Register
02C8 00B4
MACINTSTATMASKED
02C8 00B8
MACINTMASKSET
02C8 00BC
MACINTMASKCLEAR
02C8 00C0 - 02C8 00FC
-
MAC Interrupt Status (Masked) Register
MAC Interrupt Mask Set Register
MAC Interrupt Mask Clear Register
Reserved
02C8 0100
RXMBPENABLE
Receive Multicast/Broadcast/Promiscuous Channel Enable Register
02C8 0104
RXUNICASTSET
Receive Unicast Enable Set Register
02C8 0108
RXUNICASTCLEAR
02C8 010C
RXMAXLEN
02C8 0110
RXBUFFEROFFSET
02C8 0114
RXFILTERLOWTHRESH
Receive Unicast Clear Register
Receive Maximum Length Register
Receive Buffer Offset Register
Receive Filter Low Priority Frame Threshold Register
02C8 0118 - 02C8 011C
-
02C8 0120
RX0FLOWTHRESH
Reserved
Receive Channel 0 Flow Control Threshold Register
02C8 0124
RX1FLOWTHRESH
Receive Channel 1 Flow Control Threshold Register
02C8 0128
RX2FLOWTHRESH
Receive Channel 2 Flow Control Threshold Register
02C8 012C
RX3FLOWTHRESH
Receive Channel 3 Flow Control Threshold Register
02C8 0130
RX4FLOWTHRESH
Receive Channel 4 Flow Control Threshold Register
02C8 0134
RX5FLOWTHRESH
Receive Channel 5 Flow Control Threshold Register
02C8 0138
RX6FLOWTHRESH
Receive Channel 6 Flow Control Threshold Register
02C8 013C
RX7FLOWTHRESH
Receive Channel 7 Flow Control Threshold Register
02C8 0140
RX0FREEBUFFER
Receive Channel 0 Free Buffer Count Register
02C8 0144
RX1FREEBUFFER
Receive Channel 1 Free Buffer Count Register
02C8 0148
RX2FREEBUFFER
Receive Channel 2 Free Buffer Count Register
02C8 014C
RX3FREEBUFFER
Receive Channel 3 Free Buffer Count Register
02C8 0150
RX4FREEBUFFER
Receive Channel 4 Free Buffer Count Register
02C8 0154
RX5FREEBUFFER
Receive Channel 5 Free Buffer Count Register
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Table 7-71. Ethernet MAC (EMAC) Control Registers (continued)
200
HEX ADDRESS RANGE
ACRONYM
02C8 0158
RX6FREEBUFFER
REGISTER NAME
Receive Channel 6 Free Buffer Count Register
02C8 015C
RX7FREEBUFFER
Receive Channel 7 Free Buffer Count Register
02C8 0160
MACCONTROL
MAC Control Register
02C8 0164
MACSTATUS
MAC Status Register
Emulation Control Register
02C8 0168
EMCONTROL
02C8 016C
FIFOCONTROL
02C8 0170
MACCONFIG
MAC Configuration Register
Soft Reset Register
FIFO Control Register (Transmit and Receive)
02C8 0174
SOFTRESET
02C8 0178 - 02C8 01CC
-
02C8 01D0
MACSRCADDRLO
MAC Source Address Low Bytes Register (Lower 32-bits)
02C8 01D4
MACSRCADDRHI
MAC Source Address High Bytes Register (Upper 32-bits)
Reserved
02C8 01D8
MACHASH1
MAC Hash Address Register 1
02C8 01DC
MACHASH2
MAC Hash Address Register 2
02C8 01E0
BOFFTEST
Back Off Test Register
02C8 01E4
TPACETEST
02C8 01E8
RXPAUSE
Receive Pause Timer Register
02C8 01EC
TXPAUSE
Transmit Pause Timer Register
Transmit Pacing Algorithm Test Register
02C8 01F0 - 02C8 01FC
-
02C8 0200 - 02C8 02FC
(see Table 7-72)
Reserved
02C8 0300 - 02C8 03FC
-
Reserved
02C8 0400 - 02C8 04FC
-
Reserved
02C8 0500
MACADDRLO
MAC Address Low Bytes Register (used in receive address
matching)
02C8 0504
MACADDRHI
MAC Address High Bytes Register (used in receive address
matching)
EMAC Statistics Registers
02C8 0508
MACINDEX
02C8 050C - 02C8 05FC
-
MAC Index Register
02C8 0600
TX0HDP
Transmit Channel 0 DMA Head Descriptor Pointer Register
02C8 0604
TX1HDP
Transmit Channel 1 DMA Head Descriptor Pointer Register
02C8 0608
TX2HDP
Transmit Channel 2 DMA Head Descriptor Pointer Register
02C8 060C
TX3HDP
Transmit Channel 3 DMA Head Descriptor Pointer Register
02C8 0610
TX4HDP
Transmit Channel 4 DMA Head Descriptor Pointer Register
02C8 0614
TX5HDP
Transmit Channel 5 DMA Head Descriptor Pointer Register
02C8 0618
TX6HDP
Transmit Channel 6 DMA Head Descriptor Pointer Register
02C8 061C
TX7HDP
Transmit Channel 7 DMA Head Descriptor Pointer Register
02C8 0620
RX0HDP
Receive Channel 0 DMA Head Descriptor Pointer Register
02C8 0624
RX1HDP
Receive Channel 1 DMA Head Descriptor Pointer Register
02C8 0628
RX2HDP
Receive Channel 2 DMA Head Descriptor Pointer Register
02C8 062C
RX3HDP
Receive Channel 3 DMA Head Descriptor Pointer Register
02C8 0630
RX4HDP
Receive Channel 4 DMA Head Descriptor Pointer Register
02C8 0634
RX5HDP
Receive Channel 5 DMA Head Descriptor Pointer Register
Reserved
02C8 0638
RX6HDP
Receive Channel 6 DMA Head Descriptor Pointer Register
02C8 063C
RX7HDP
Receive Channel 7 DMA Head Descriptor Pointer Register
02C8 0640
TX0CP
Transmit Channel 0 Completion Pointer (Interrupt Acknowledge)
Register
02C8 0644
TX1CP
Transmit Channel 1 Completion Pointer (Interrupt Acknowledge)
Register
02C8 0648
TX2CP
Transmit Channel 2 Completion Pointer (Interrupt Acknowledge)
Register
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Table 7-71. Ethernet MAC (EMAC) Control Registers (continued)
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
02C8 064C
TX3CP
Transmit Channel 3 Completion Pointer (Interrupt Acknowledge)
Register
02C8 0650
TX4CP
Transmit Channel 4 Completion Pointer (Interrupt Acknowledge)
Register
02C8 0654
TX5CP
Transmit Channel 5 Completion Pointer (Interrupt Acknowledge)
Register
02C8 0658
TX6CP
Transmit Channel 6 Completion Pointer (Interrupt Acknowledge)
Register
02C8 065C
TX7CP
Transmit Channel 7 Completion Pointer (Interrupt Acknowledge)
Register
02C8 0660
RX0CP
Receive Channel 0 Completion Pointer (Interrupt Acknowledge)
Register
02C8 0664
RX1CP
Receive Channel 1 Completion Pointer (Interrupt Acknowledge)
Register
02C8 0668
RX2CP
Receive Channel 2 Completion Pointer (Interrupt Acknowledge)
Register
02C8 066C
RX3CP
Receive Channel 3 Completion Pointer (Interrupt Acknowledge)
Register
02C8 0670
RX4CP
Receive Channel 4 Completion Pointer (Interrupt Acknowledge)
Register
02C8 0674
RX5CP
Receive Channel 5 Completion Pointer (Interrupt Acknowledge)
Register
02C8 0678
RX6CP
Receive Channel 6 Completion Pointer (Interrupt Acknowledge)
Register
02C8 067C
RX7CP
Receive Channel 7 Completion Pointer (Interrupt Acknowledge)
Register
02C8 0680 - 02C8 06FC
-
Reserved
02C8 0700 - 02C8 077C
-
Reserved
was State RAM Test Access Registers
Processor Read and Write Access to Head Descriptor Pointers and
Interrupt Acknowledge Registers
02C8 0780 - 02C8 0FFF
-
Reserved
Table 7-72. EMAC Statistics Registers
HEX ADDRESS RANGE
ACRONYM
02C8 0200
RXGOODFRAMES
Good Receive Frames Register
02C8 0204
RXBCASTFRAMES
Broadcast Receive Frames Register
(Total number of good broadcast frames received)
02C8 0208
RXMCASTFRAMES
Multicast Receive Frames Register
(Total number of good multicast frames received)
02C8 020C
RXPAUSEFRAMES
Pause Receive Frames Register
02C8 0210
RXCRCERRORS
02C8 0214
RXALIGNCODEERRORS
02C8 0218
RXOVERSIZED
02C8 021C
RXJABBER
02C8 0220
RXUNDERSIZED
Receive Undersized Frames Register
(Total number of undersized frames received)
02C8 0224
RXFRAGMENTS
Receive Frame Fragments Register
02C8 0228
RXFILTERED
02C8 022C
RXQOSFILTERED
Copyright © 2006–2012, Texas Instruments Incorporated
REGISTER NAME
Receive CRC Errors Register (Total number of frames received with
CRC errors)
Receive Alignment/Code Errors Register
(Total number of frames received with alignment/code errors)
Receive Oversized Frames Register
(Total number of oversized frames received)
Receive Jabber Frames Register
(Total number of jabber frames received)
Filtered Receive Frames Register
Received QOS Filtered Frames Register
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Table 7-72. EMAC Statistics Registers (continued)
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
02C8 0230
RXOCTETS
Receive Octet Frames Register
(Total number of received bytes in good frames)
02C8 0234
TXGOODFRAMES
Good Transmit Frames Register
(Total number of good frames transmitted)
02C8 0238
TXBCASTFRAMES
Broadcast Transmit Frames Register
02C8 023C
TXMCASTFRAMES
Multicast Transmit Frames Register
02C8 0240
TXPAUSEFRAMES
Pause Transmit Frames Register
02C8 0244
TXDEFERRED
Deferred Transmit Frames Register
Transmit Collision Frames Register
02C8 0248
TXCOLLISION
02C8 024C
TXSINGLECOLL
02C8 0250
TXMULTICOLL
02C8 0254
TXEXCESSIVECOLL
02C8 0258
TXLATECOLL
02C8 025C
TXUNDERRUN
02C8 0260
TXCARRIERSENSE
02C8 0264
TXOCTETS
02C8 0268
FRAME64
02C8 026C
FRAME65T127
Transmit and Receive 65 to 127 Octet Frames Register
02C8 0270
FRAME128T255
Transmit and Receive 128 to 255 Octet Frames Register
02C8 0274
FRAME256T511
Transmit and Receive 256 to 511 Octet Frames Register
02C8 0278
FRAME512T1023
Transmit and Receive 512 to 1023 Octet Frames Register
02C8 027C
FRAME1024TUP
Transmit and Receive 1024 to 1518 Octet Frames Register
02C8 0280
NETOCTETS
02C8 0284
RXSOFOVERRUNS
Receive FIFO or DMA Start of Frame Overruns Register
02C8 0288
RXMOFOVERRUNS
Receive FIFO or DMA Middle of Frame Overruns Register
02C8 028C
RXDMAOVERRUNS
Receive DMA Start of Frame and Middle of Frame Overruns
Register
02C8 0290 - 02C8 02FC
-
Transmit Single Collision Frames Register
Transmit Multiple Collision Frames Register
Transmit Excessive Collision Frames Register
Transmit Late Collision Frames Register
Transmit Underrun Error Register
Transmit Carrier Sense Errors Register
Transmit Octet Frames Register
Transmit and Receive 64 Octet Frames Register
Network Octet Frames Register
Reserved
Table 7-73. EMAC Control Module Registers
HEX ADDRESS RANGE
ACRONYM
02C8 1000
-
02C8 1004
EWCTL
02C8 1008
EWINTTCNT
02C8 100C - 02C8 17FF
-
REGISTER NAME
Reserved
EMAC Control Module Interrupt Control Register
EMAC Control Module Interrupt Timer Count Register
Reserved
Table 7-74. EMAC Descriptor Memory
202
HEX ADDRESS RANGE
ACRONYM
02C8 2000 - 02C8 3FFF
-
DESCRIPTION
EMAC Descriptor Memory
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7.14.3 EMAC Electrical Data/Timing
7.14.3.1
EMAC MII and GMII Electrical Data/Timing
Table 7-75. Timing Requirements for MRCLK - MII and GMII Operation
(see Figure 7-59)
-720
-850
A-1000/-1000
NO.
UNIT
1000 Mbps
(GMII Only)
MIN
MAX
100 Mbps
10 Mbps
MIN
MIN
MAX
MAX
1
tc(MRCLK)
Cycle time, MRCLK
8
40
400
ns
2
tw(MRCLKH)
Pulse duration, MRCLK high
2.8
14
140
ns
3
tw(MRCLKL)
Pulse duration, MRCLK low
2.8
14
140
ns
4
tt(MRCLK)
Transition time, MRCLK
1
3
3
ns
4
1
2
4
3
MRCLK
(Input)
Figure 7-59. MRCLK Timing (EMAC - Receive) [MII and GMII Operation]
Table 7-76. Timing Requirements for MTCLK - MII and GMII Operation
(see Figure 7-60)
-720
-850
A-1000/-1000
NO.
100 Mbps
MIN
UNIT
10 Mbps
MAX
MIN
MAX
1
tc(MTCLK)
Cycle time, MTCLK
40
400
ns
2
tw(MTCLKH)
Pulse duration, MTCLK high
14
140
ns
3
tw(MTCLKL)
Pulse duration, MTCLK low
14
140
4
tt(MTCLK)
Transition time, MTCLK
3
ns
3
ns
4
1
2
3
4
MTCLK
(Input)
Figure 7-60. MTCLK Timing (EMAC - Transmit) [MII and GMII Operation]
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Table 7-77. Switching Characteristics Over Recommended Operating Conditions for GMTCLK - GMII
Operation
(see Figure 7-61)
-720
-850
A-1000/-1000
NO.
UNIT
1000 Mbps
MIN
1
tc(GMTCLK)
Cycle time, GMTCLK
2
tw(GMTCLKH)
3
4
MAX
8
ns
Pulse duration, GMTCLK high
2.8
ns
tw(GMTCLKL)
Pulse duration, GMTCLK low
2.8
ns
tt(GMTCLK)
Transition time, GMTCLK
1
ns
4
1
2
4
3
GMTCLK
(Output)
Figure 7-61. GMTCLK Timing (EMAC - Transmit) [GMII Operation]
Table 7-78. Timing Requirements for EMAC MII and GMII Receive 10/100/1000 Mbit/s (1)
(see Figure 7-62)
-720
-850
A-1000/-1000
NO.
1000 Mbps
MIN
(1)
UNIT
100/10 Mbps
MAX
MIN
MAX
1
tsu(MRXD-MRCLKH)
Setup time, receive selected signals valid before
MRCLK high
2
8
ns
2
th(MRCLKH-MRXD)
Hold time, receive selected signals valid after
MRCLK high
0
8
ns
For MII, Receive selected signals include: MRXD[3:0], MRXDV, and MRXER. For GMII, Receive selected signals include: MRXD[7:0],
MRXDV, and MRXER.
1
2
MRCLK (Input)
MRXD7−MRXD4(GMII only),
MRXD3−MRXD0,
MRXDV, MRXER (Inputs)
Figure 7-62. EMAC Receive Interface Timing [MII and GMII Operation]
204
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Table 7-79. Switching Characteristics Over Recommended Operating Conditions for EMAC MII and GMII
Transmit 10/100 Mbit/s (1)
(see Figure 7-63)
NO.
-720
-850
A-1000/-1000
PARAMETER
UNIT
100/10 Mbps
1
(1)
td(MTCLKH-MTXD)
Delay time, MTCLK high to transmit selected signals valid
MIN
MAX
5
25
ns
For MII, Transmit selected signals include: MTXD[3:0] and MTXEN. For GMII, Transmit selected signals include: GMTXD[7:0] and
MTXEN.
1
MTCLK (Input)
MTXD7−MTXD4(GMII only),
MTXD3−MTXD0,
MTXEN (Outputs)
Figure 7-63. EMAC Transmit Interface Timing [MII and GMII Operation]
Table 7-80. Switching Characteristics Over Recommended Operating Conditions for EMAC GMII Transmit
1000 Mbit/s (1)
(see Figure 7-64)
NO.
-720
-850
A-1000/-1000
PARAMETER
UNIT
1000 Mbps
1
(1)
td(GMTCLKH-MTXD)
Delay time, GMTCLK high to transmit selected signals valid
MIN
MAX
0.5
5
ns
For GMII, Transmit selected signals include: GMTXD[7:0] and MTXEN.
1
GMTCLK (Output)
MTXD7−MTXD0,
MTXEN (Outputs)
Figure 7-64. EMAC Transmit Interface Timing [GMII Operation]
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7.14.3.2 EMAC RMII Electrical Data/Timing
The RMREFCLK pin is used to source a clock to the EMAC when it is configured for RMII operation. The
RMREFCLK frequency should be 50 MHz ±50 PPM with a duty cycle between 35% and 65%, inclusive.
Table 7-81. Timing Requirements for RMREFCLK - RMII Operation
(see Figure 7-65)
NO.
-720
-850
A-1000/-1000
PARAMETER
UNIT
MIN
MAX
1
tw(RMREFCLKH)
Pulse duration, RMREFCLK high
7
13
ns
2
tw(RMREFCLKL)
Pulse duration, RMREFCLK low
7
13
ns
3
tt(RMREFCLK)
Transition time, RMREFCLK
2
ns
3
1
RMREFCLK
(Input)
2
3
Figure 7-65. RMREFCLK Timing
Table 7-82. Switching Characteristics Over Recommended Operating Conditions for EMAC RMII Transmit
10/100 Mbit/s (1)
(see Figure 7-66)
NO.
-720
-850
A-1000/-1000
PARAMETER
UNIT
1000 Mbps
1
(1)
td(RMREFCLKH-RMTXD)
Delay time, RMREFCLK high to transmit selected signals valid
MIN
MAX
3
10
ns
For RMII, transmit selected signals include: RMTXD[1:0] and RMTXEN.
1
RMREFCLK
(Input)
RMTXD1-RMTXD0,
RMTXEN (Outputs)
Figure 7-66. EMAC Transmit Interface Timing [RMII Operation]
206
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Table 7-83. Timing Requirements for EMAC RMII Input Receive for 100 Mbps (1)
(see Figure 7-67)
-720
-850
A-1000/-1000
NO.
MIN
1
tsu(RMRXDRMREFCLK)
2
th(RMREFCLKRMRXD)
(1)
UNIT
MAX
Setup time, receive selected signals valid before RMREFCLK (at DSP)
high/low
4.0
ns
Hold time, receive selected signals valid after RMREFCLK (at DSP)
high/low
2.0
ns
For RMII, receive selected signals include: RMRXD[1:0], RMRXER, and RMCRSDV.
3
1
RMREFCLK
(Input)
2
4
3
5
RMRXD1-RMRXD0,
RMCRSDV,
RMRXER (Inputs)
Figure 7-67. EMAC Receive Interface Timing [RMII Operation]
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7.14.3.3 EMAC RGMII Electrical Data/Timing
An extra clock signal, RGREFCLK, running at 125 MHz is included as a convenience to the user. Note
that this reference clock is not a free-running clock. This should only be used by an external device if it
does not expect a valid clock during device reset.
Table 7-84. Switching Characteristics Over Recommended Operating Conditions for EMAC RGREFCLK RGMII Operation
(see Figure 7-68)
NO.
-720
-850
A-1000/-1000
PARAMETER
UNIT
MIN
MAX
1
tc(RGFCLK)
Cycle time, RGREFCLK
8 - 0.8
8 + 0.8
ns
2
tw(RGFCLKH)
Pulse duration, RGREFCLK high
3.2
4.8
ns
3
tw(RGFCLKL)
Pulse duration, RGREFCLK low
3.2
4.8
ns
4
tt(RGFCLK)
Transition time, RGREFCLK
0.75
ns
1
4
2
RGREFCLK
(Output)
3
4
Figure 7-68. RGREFCLK Timing
Table 7-85. Timing Requirements for RGRXC - RGMII Operation
(see Figure 7-69)
-720
-850
A-1000/-1000
NO.
MIN
10 Mbps
1
2
3
4
208
tc(RGRXC)
tw(RGRXCH)
tw(RGRXCL)
tt(RGRXC)
Cycle time, RGRXC
Pulse duration, RGRXC high
Pulse duration, RGRXC low
Transition time, RGRXC
UNIT
MAX
360
440
100 Mbps
36
44
1000 Mbps
7.2
8.8
10 Mbps
0.40*tc(RGRXC)
0.60*tc(RGRXC)
100 Mbps
0.40*tc(RGRXC)
0.60*tc(RGRXC)
1000 Mbps
0.45*tc(RGRXC)
0.55*tc(RGRXC)
10 Mbps
0.40*tc(RGRXC)
0.60*tc(RGRXC)
100 Mbps
0.40*tc(RGRXC)
0.60*tc(RGRXC)
1000 Mbps
0.45*tc(RGRXC)
0.55*tc(RGRXC)
10 Mbps
0.75
100 Mbps
0.75
1000 Mbps
0.75
ns
ns
ns
ns
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Table 7-86. Timing Requirements for EMAC RGMII Input Receive for 10/100/1000 Mbps (1)
(see Figure 7-69)
-720
-850
A-1000/-1000
NO.
MIN
(1)
5
tsu(RGRXD-RGRXCH)
Setup time, receive selected signals valid before RGRXC (at DSP)
high/low
6
th(RGRXCH-RGRXD)
Hold time, receive selected signals valid after RGRXC (at DSP) high/low
UNIT
MAX
1.0
ns
1.0
ns
For RGMII, receive selected signals include: RGRXD[3:0] and RGRXCTL.
1
4
2
4
3
RGRXC
(A)
(at DSP)
5
1st Half-byte
6
2nd Half-byte
RGRXD[3:0]
RGRXCTL
A.
B.
(B)
RGRXD[3:0]
RGRXD[7:4]
RXDV
RXERR
(B)
RGRXC must be externally delayed relative to the data and control pins.
Data and control information is received using both edges of the clocks. RGRXD[3:0] carries data bits 3-0 on the
rising edge of RGRXC and data bits 7-4 on the falling edge of RGRXC. Similarly, RGRXCTL carries RXDV on rising
edge of RGRXC and RXERR on falling edge.
Figure 7-69. EMAC Receive Interface Timing [RGMII Operation]
Table 7-87. Switching Characteristics Over Recommended Operating Conditions for RGTXC - RGMII
Operation for 10/100/1000 Mbit/s
(see Figure 7-70)
-720
-850
A-1000/-1000
NO.
MIN
1
tc(RGTXC)
Cycle time, RGTXC
3
4
tw(RGTXCH)
tw(RGTXCL)
tt(RGTXC)
Pulse duration, RGTXC high
Pulse duration, RGTXC low
Transition time, RGTXC
Copyright © 2006–2012, Texas Instruments Incorporated
MAX
10 Mbps
360
440
100 Mbps
36
44
1000 Mbps
2
UNIT
7.2
8.8
10 Mbps
0.40*tc(RGTXC)
0.60*tc(RGTXC)
100 Mbps
0.40*tc(RGTXC)
0.60*tc(RGTXC)
1000 Mbps
0.45*tc(RGTXC)
0.55*tc(RGTXC)
10 Mbps
0.40*tc(RGTXC)
0.60*tc(RGTXC)
100 Mbps
0.40*tc(RGTXC)
0.60*tc(RGTXC)
1000 Mbps
0.45*tc(RGTXC)
0.55*tc(RGTXC)
10 Mbps
0.75
100 Mbps
0.75
1000 Mbps
0.75
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ns
ns
ns
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Table 7-88. Switching Characteristics Over Recommended Operating Conditions for EMAC RGMII
Transmit (1)
(see Figure 7-70)
NO.
-720
-850
A-1000/-1000
PARAMETER
MIN
(1)
5
tsu(RGTXD-RGTXCH)
Setup time, transmit selected signals valid before RGTXC (at DSP)
high/low
1.2
6
th(RGTXCH-RGTXD)
Hold time, transmit selected signals valid after RGTXC (at DSP) high/low
1.2
UNIT
MAX
ns
For RGMII, transmit selected signals include: RGTXD[3:0] and RGTXCTL.
RGTXC at DSP pins
1
2
RGTXC
(A)
(at DSP)
Internal RGTXC
3
4
4
1
5
(B)
RGTXD[3:0]
1st Half-byte
2nd Half-byte
6
2
RGTXCTL
A.
B.
(B)
TXEN
TXERR
RGTXC is delayed internally before being driven to the RGTXC pin.
Data and control information is transmitted using both edges of the clocks. RGTXD[3:0] carries data bits 3-0 on the
rising edge of RGTXC and data bits 7-4 on the falling edge of RGTXC. Similarly, RGTXCTL carries TXEN on rising
edge of RGTXC and TXERR of falling edge.
Figure 7-70. EMAC Transmit Interface Timing [RGMII Operation]
210
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7.14.4
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Management Data Input/Output (MDIO)
The Management Data Input/Output (MDIO) module implements the 802.3 serial management interface to
interrogate and controls up to 32 Ethernet PHY(s) connected to the device, using a shared two-wire bus.
Application software uses the MDIO module to configure the auto-negotiation parameters of each PHY
attached to the EMAC, retrieve the negotiation results, and configure required parameters in the EMAC
module for correct operation. The module is designed to allow almost transparent operation of the MDIO
interface, with very little maintenance from the core processor.
The EMAC control module is the main interface between the device core processor, the MDIO module,
and the EMAC module. The relationship between these three components is shown in Figure 7-58.
The MDIO uses the same pins for the MII, GMII, and RMII modes. Standalone pins are included for the
RGMII mode due to specific voltage requirements. Only one mode can be used at a time. The mode used
is selected at device reset based on the MACSEL[1:0] configuration pins (for more detailed information,
see Section 3, Device Configuration). Table 7-70 above shows which multiplexed pin are used in the MII,
GMII, and RMII modes on the MDIO.
For more detailed information on the EMAC/MDIO, see the TMS320C645x DSP EMAC/MDIO Module
Reference Guide (literature number SPRU975).
7.14.4.1 MDIO Device-Specific Information
Clocking Information
The MDIO clock is based on a divide-down of the SYSCLK3 (from the PLL1 controller) and is specified to
run up to 2.5 MHz, although typical operation is 1.0 MHz. Since the peripheral clock frequency is variable,
the application software or driver controls the divide-down amount.
7.14.4.2 MDIO Peripheral Register Descriptions
Table 7-89. MDIO Registers
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
02C8 1800
VERSION
MDIO Version Register
02C8 1804
CONTROL
MDIO Control Register
02C8 1808
ALIVE
MDIO PHY Alive Status Register
02C8 180C
LINK
MDIO PHY Link Status Register
02C8 1810
LINKINTRAW
02C8 1814
LINKINTMASKED
02C8 1818 - 02C8 181C
-
MDIO Link Status Change Interrupt (Unmasked) Register
MDIO Link Status Change Interrupt (Masked) Register
Reserved
02C8 1820
USERINTRAW
02C8 1824
USERINTMASKED
MDIO User Command Complete Interrupt (Unmasked) Register
MDIO User Command Complete Interrupt (Masked) Register
02C8 1828
USERINTMASKSET
MDIO User Command Complete Interrupt Mask Set Register
02C8 182C
USERINTMASKCLEAR
02C8 1830 - 02C8 187C
-
MDIO User Command Complete Interrupt Mask Clear Register
02C8 1880
USERACCESS0
MDIO User Access Register 0
02C8 1884
USERPHYSEL0
MDIO User PHY Select Register 0
Reserved
02C8 1888
USERACCESS1
MDIO User Access Register 1
02C8 188C
USERPHYSEL1
MDIO User PHY Select Register 1
02C8 1890 - 02C8 1FFF
-
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Reserved
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7.14.4.3 MDIO Electrical Data/Timing
Table 7-90. Timing Requirements for MDIO Input (R)(G)MII
(see Figure 7-71)
-720
-850
A-1000/-1000
NO.
MIN
UNIT
MAX
1
tc(MDCLK)
Cycle time, MDCLK
400
ns
2a
tw(MDCLK)
Pulse duration, MDCLK high
180
ns
2b
tw(MDCLK)
Pulse duration, MDCLK low
180
3
tt(MDCLK)
Transition time, MDCLK
4
tsu(MDIO-MDCLKH)
Setup time, MDIO data input valid before MDCLK high
10
ns
5
th(MDCLKH-MDIO)
Hold time, MDIO data input valid after MDCLK high
10
ns
ns
5
ns
1
MDCLK
3
4
MDIO
(input)
Figure 7-71. MDIO Input Timing
Table 7-91. Switching Characteristics Over Recommended Operating Conditions for MDIO Output
(see Figure 7-72)
NO.
PARAMETER
-720
-850
A-1000/-1000
MIN
7
td(MDCLKL-MDIO)
Delay time, MDCLK low to MDIO data output valid
UNIT
MAX
100
ns
1
MDCLK
7
MDIO
(output)
Figure 7-72. MDIO Output Timing
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7.15 Timers
The timers can be used to: time events, count events, generate pulses, interrupt the CPU, and send
synchronization events to the EDMA3 channel controller.
7.15.1 Timers Device-Specific Information
The C6454 device has two general-purpose timers, Timer0 and Timer1, each of which can be configured
as a general-purpose timer or a watchdog timer. When configured as a general-purpose timer, each timer
can be programmed as a 64-bit timer or as two separate 32-bit timers.
Each timer is made up of two 32-bit counters: a high counter and a low counter. The timer pins, TINPLx
and TOUTLx are connected to the low counter. The high counter does not have any external device pins.
7.15.2 Timers Peripheral Register Descriptions
Table 7-92. Timer 0 Registers
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
0294 0000
-
0294 0004
EMUMGT_CLKSPD0
0294 0008
-
Reserved
0294 000C
-
Reserved
0294 0010
CNTLO0
Timer 0 Counter Register Low
0294 0014
CNTHI0
Timer 0 Counter Register High
COMMENTS
Reserved
Timer 0 Emulation Management/Clock Speed
Register
0294 0018
PRDLO0
Timer 0 Period Register Low
0294 001C
PRDHI0
Timer 0 Period Register High
0294 0020
TCR0
Timer 0 Control Register
0294 0024
TGCR0
0294 0028
WDTCR0
Timer 0 Global Control Register
0294 002C
-
Reserved
0294 0030
-
Reserved
0294 0034 - 0297 FFFF
-
Reserved
Timer 0 Watchdog Timer Control Register
Table 7-93. Timer 1 Registers
HEX ADDRESS RANGE
ACRONYM
0298 0000
-
0298 0004
EMUMGT_CLKSPD1
REGISTER NAME
Timer 1 Emulation Management/Clock Speed Register
0298 0008
-
Reserved
0298 000C
-
Reserved
0298 0010
CNTLO1
Timer 1 Counter Register Low
0298 0014
CNTHI1
Timer 1 Counter Register High
0298 0018
PRDLO1
Timer 1 Period Register Low
0298 001C
PRDHI1
Timer 1 Period Register High
0298 0020
TCR1
Timer 1 Control Register
0298 0024
TGCR1
0298 0028
WDTCR1
0298 002C
-
Reserved
0298 0030
-
Reserved
0298 0034 - 0299 FFFF
-
Reserved
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COMMENTS
Reserved
Timer 1 Global Control Register
Timer 1 Watchdog Timer Control Register
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7.15.3 Timers Electrical Data/Timing
Table 7-94. Timing Requirements for Timer Inputs (1)
(see Figure 7-73)
-720
-850
A-1000/-1000
NO.
MIN
(1)
UNIT
MAX
1
tw(TINPH)
Pulse duration, TINPLx high
12P
ns
2
tw(TINPL)
Pulse duration, TINPLx low
12P
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.
Table 7-95. Switching Characteristics Over Recommended Operating Conditions for Timer Outputs (1)
(see Figure 7-73)
NO.
-720
-850
A-1000/-1000
PARAMETER
MIN
(1)
UNIT
MAX
3
tw(TOUTH)
Pulse duration, TOUTLx high
12P - 3
ns
4
tw(TOUTL)
Pulse duration, TOUTLx low
12P - 3
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.
2
1
TINPLx
4
3
TOUTLx
Figure 7-73. Timer Timing
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7.16 Peripheral Component Interconnect (PCI)
The C6454 DSP supports connections to a PCI backplane via the integrated PCI master/slave bus
interface. The PCI port interfaces to DSP internal resources via the data switched central resource. The
data switched central resource is described in more detail in Section 4.
For more detailed information on the PCI port peripheral module, see the TMS320C645x DSP Peripheral
Component Interconnect (PCI) User's Guide (literature number SPRUE60).
7.16.1 PCI Device-Specific Information
The PCI peripheral on the C6454 DSP conforms to the PCI Local Bus Specification (version 2.3). The PCI
peripheral can act both as a PCI bus master and as a target. It supports PCI bus operation of speeds up
to 66 MHz and uses a 32-bit data/address bus.
On the C6454 device, the pins of the PCI peripheral are multiplexed with the pins of the HPI and GPIO
peripherals. PCI functionality for these pins is controlled (enabled/disabled) by the PCI_EN pin (Y29). The
maximum speed of the PCI, 33 MHz or 66 MHz, is controlled through the PCI66 pin (U27). For more
detailed information on the peripheral control, see Section 3, Device Configuration.
The C6454 device provides an initialization mechanism through which the default values for some of the
PCI configuration registers can be read from an I2C EEPROM. Table 7-96 shows the registers which can
be initialized through the PCI auto-initialization. Also shown is the default value of these registers when
PCI auto-initialization is not used. PCI auto-initialization is controlled (enabled/disabled) through the
PCI_EEAI pin (P25). For more information on this feature, see the TMS320C645x DSP Peripheral
Component Interconnect (PCI) User's Guide (literature number SPRUE60) and the TMS320C645x
Bootloader User's Guide (literature number SPRUEC6).
Table 7-96. Default Values for PCI Configuration
Registers
DEFAULT
VALUE
REGISTER
Vendor ID/Device ID Register (PCIVENDEV)
104C B000h
Class Code/Revision ID Register (PCICLREV)
0000 0001h
Subsystem Vendor ID/Subsystem ID Register
(PCISUBID)
0000 0000h
Max Latency/Min Grant/Interrupt Pin/Interrupt Line
Register (PCILGINT)
0000 0100h
The on-chip Bootloader supports a host boot which allows an external PCI device to load application code
into the DSP's memory space. The PCI boot is terminated when the Host generates a DSP interrupt. The
Host can generate a DSP interrupt through the PCI peripheral by setting the DSPINT bit in the Back-End
Application Interrupt Enable Set Register (PCIBINTSET) and the Status Set Register (PCISTATSET). For
more information on the boot sequence of the C6454 DSP, see Section 2.4.
NOTE
After the host boot is complete, the DSP interrupt is registered in bit 0 (channel 0) of the
EDMA Event Register (ER). This event must be cleared by software before triggering
transfers on DMA channel 0.
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7.16.2 PCI Peripheral Register Descriptions
Table 7-97. PCI Configuration Registers
PCI HOST ACCESS
HEX ADDRESS OFFSET
ACRONYM
0x00
PCIVENDEV
0x04
PCICSR
0x08
PCICLREV
Class Code/Revision ID
0x0C
PCICLINE
BIST/Header Type/Latency Timer/Cacheline Size
0x10
PCIBAR0
Base Address 0
0x14
PCIBAR1
Base Address 1
PCI HOST ACCESS REGISTER NAME
Vendor ID/Device ID
Command/Status
0x18
PCIBAR2
Base Address 2
0x1C
PCIBAR3
Base Address 3
0x20
PCIBAR4
Base Address 4
Base Address 5
0x24
PCIBAR5
0x28 - 0x2B
-
0x2C
PCISUBID
0x30
-
0x34
PCICPBPTR
0x38 - 0x3B
-
0x3C
PCILGINT
0x40 - 0x7F
-
Reserved
Subsystem Vendor ID/Subsystem ID
Reserved
Capabilities Pointer
Reserved
Max Latency/Min Grant/Interrupt Pin/Interrupt Line
Reserved
Table 7-98. PCI Back-End Configuration Registers
DSP ACCESS
HEX ADDRESS RANGE
DSP ACCESS REGISTER NAME
02C0 0000 - 02C0 000F
-
02C0 0010
PCISTATSET
PCI Status Set Register
Reserved
PCI Status Clear Register
02C0 0014
PCISTATCLR
02C0 0018 - 02C0 001F
-
02C0 0020
PCIHINTSET
PCI Host Interrupt Enable Set Register
PCI Host Interrupt Enable Clear Register
Reserved
02C0 0024
PCIHINTCLR
02C0 0028 - 02C0 002F
-
02C0 0030
PCIBINTSET
PCI Back End Application Interrupt Enable Set Register
02C0 0034
PCIBINTCLR
PCI Back End Application Interrupt Enable Clear Register
02C0 0038
PCIBCLKMGT
PCI Back End Application Clock Management Register
02C0 003C - 02C0 00FF
-
02C0 0100
216
ACRONYM
Reserved
Reserved
PCIVENDEVMIR PCI Vendor ID/Device ID Mirror Register
02C0 0104
PCICSRMIR
02C0 0108
PCICLREVMIR
PCI Command/Status Mirror Register
PCI Class Code/Revision ID Mirror Register
02C0 010C
PCICLINEMIR
PCI BIST/Header Type/Latency Timer/Cacheline Size Mirror Register
02C0 0110
PCIBAR0MSK
PCI Base Address Mask Register 0
02C0 0114
PCIBAR1MSK
PCI Base Address Mask Register 1
02C0 0118
PCIBAR2MSK
PCI Base Address Mask Register 2
02C0 011C
PCIBAR3MSK
PCI Base Address Mask Register 3
02C0 0120
PCIBAR4MSK
PCI Base Address Mask Register 4
02C0 0124
PCIBAR5MSK
PCI Base Address Mask Register 5
02C0 0128 - 02C0 012B
-
02C0 012C
PCISUBIDMIR
02C0 0130
-
Reserved
PCI Subsystem Vendor ID/Subsystem ID Mirror Register
Reserved
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Table 7-98. PCI Back-End Configuration Registers (continued)
DSP ACCESS
HEX ADDRESS RANGE
ACRONYM
02C0 0134
PCICPBPTRMIR
02C0 0138 - 02C0 013B
-
02C0 013C
PCILGINTMIR
DSP ACCESS REGISTER NAME
PCI Capabilities Pointer Mirror Register
Reserved
PCI Max Latency/Min Grant/Interrupt Pin/Interrupt Line Mirror Register
02C0 0140 - 02C0 017F
-
02C0 0180
PCISLVCNTL
Reserved
02C0 0184 - 02C0 01BF
-
02C0 01C0
PCIBAR0TRL
PCI Slave Base Address 0 Translation Register
02C0 01C4
PCIBAR1TRL
PCI Slave Base Address 1 Translation Register
02C0 01C8
PCIBAR2TRL
PCI Slave Base Address 2 Translation Register
02C0 01CC
PCIBAR3TRL
PCI Slave Base Address 3 Translation Register
02C0 01D0
PCIBAR4TRL
PCI Slave Base Address 4 Translation Register
02C0 01D4
PCIBAR5TRL
PCI Slave Base Address 5 Translation Register
02C0 01D8 - 02C0 01DF
-
02C0 01E0
PCIBAR0MIR
PCI Base Address Register 0 Mirror Register
02C0 01E4
PCIBAR1MIR
PCI Base Address Register 1 Mirror Register
02C0 01E8
PCIBAR2MIR
PCI Base Address Register 2 Mirror Register
02C0 01EC
PCIBAR3MIR
PCI Base Address Register 3 Mirror Register
02C0 01F0
PCIBAR4MIR
PCI Base Address Register 4 Mirror Register
02C0 01F4
PCIBAR5MIR
PCI Base Address Register 5 Mirror Register
02C0 01F8 - 02C0 02FF
-
PCI Slave Control Register
Reserved
Reserved
Reserved
02C0 0300
PCIMCFGDAT
PCI Master Configuration/IO Access Data Register
02C0 0304
PCIMCFGADR
PCI Master Configuration/IO Access Address Register
02C0 0308
PCIMCFGCMD
PCI Master Configuration/IO Access Command Register
02C0 030C - 02C0 030F
-
02C0 0310
PCIMSTCFG
Reserved
PCI Master Configuration Register
Table 7-99. DSP-to-PCI Address Translation Registers
DSP ACCESS
HEX ADDRESS RANGE
ACRONYM
02C0 0314
PCIADDSUB0
PCI Address Substitute 0 Register
DSP ACCESS REGISTER NAME
02C0 0318
PCIADDSUB1
PCI Address Substitute 1 Register
02C0 031C
PCIADDSUB2
PCI Address Substitute 2 Register
02C0 0320
PCIADDSUB3
PCI Address Substitute 3 Register
02C0 0324
PCIADDSUB4
PCI Address Substitute 4 Register
02C0 0328
PCIADDSUB5
PCI Address Substitute 5 Register
02C0 032C
PCIADDSUB6
PCI Address Substitute 6 Register
02C0 0330
PCIADDSUB7
PCI Address Substitute 7 Register
02C0 0334
PCIADDSUB8
PCI Address Substitute 8 Register
02C0 0338
PCIADDSUB9
PCI Address Substitute 9 Register
02C0 033C
PCIADDSUB10
PCI Address Substitute 10 Register
02C0 0340
PCIADDSUB11
PCI Address Substitute 11 Register
02C0 0344
PCIADDSUB12
PCI Address Substitute 12 Register
02C0 0348
PCIADDSUB13
PCI Address Substitute 13 Register
02C0 034C
PCIADDSUB14
PCI Address Substitute 14 Register
02C0 0350
PCIADDSUB15
PCI Address Substitute 15 Register
02C0 0354
PCIADDSUB16
PCI Address Substitute 16 Register
02C0 0358
PCIADDSUB17
PCI Address Substitute 17 Register
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Table 7-99. DSP-to-PCI Address Translation Registers (continued)
218
DSP ACCESS
HEX ADDRESS RANGE
ACRONYM
02C0 035C
PCIADDSUB18
PCI Address Substitute 18 Register
02C0 0360
PCIADDSUB19
PCI Address Substitute 19 Register
02C0 0364
PCIADDSUB20
PCI Address Substitute 20 Register
DSP ACCESS REGISTER NAME
02C0 0368
PCIADDSUB21
PCI Address Substitute 21 Register
02C0 036C
PCIADDSUB22
PCI Address Substitute 22 Register
02C0 0370
PCIADDSUB23
PCI Address Substitute 23 Register
02C0 0374
PCIADDSUB24
PCI Address Substitute 24 Register
02C0 0378
PCIADDSUB25
PCI Address Substitute 25 Register
02C0 037C
PCIADDSUB26
PCI Address Substitute 26 Register
02C0 0380
PCIADDSUB27
PCI Address Substitute 27 Register
02C0 0384
PCIADDSUB28
PCI Address Substitute 28 Register
02C0 0388
PCIADDSUB29
PCI Address Substitute 29 Register
02C0 038C
PCIADDSUB30
PCI Address Substitute 30 Register
02C0 0390
PCIADDSUB31
PCI Address Substitute 31 Register
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Table 7-100. PCI Hook Configuration Registers
DSP ACCESS
HEX ADDRESS RANGE
02C0 0394
02C0 0398
ACRONYM
PCIVENDEVPRG
DSP ACCESS REGISTER NAME
PCI Vendor ID and Device ID Program Register
PCICMDSTATPRG PCI Command and Status Program Register
02C0 039C
PCICLREVPRG
PCI Class Code and Revision ID Program Register
02C0 03A0
PCISUBIDPRG
PCI Subsystem Vendor ID and Subsystem ID Program Register
02C0 03A4
PCIMAXLGPRG
PCI Max Latency and Min Grant Program Register
02C0 03A8
PCILRSTREG
PCI LRESET Register
02C0 03AC
PCICFGDONE
PCI Configuration Done Register
02C0 03B0
PCIBAR0MPRG
PCI Base Address Mask Register 0 Program Register
02C0 03B4
PCIBAR1MPRG
PCI Base Address Mask Register 1 Program Register
02C0 03B8
PCIBAR2MPRG
PCI Base Address Mask Register 2 Program Register
02C0 03BC
PCIBAR3MPRG
PCI Base Address Mask Register 3 Program Register
02C0 03C0
PCIBAR4MPRG
PCI Base Address Mask Register 4 Program Register
02C0 03C4
PCIBAR5MPRG
PCI Base Address Mask Register 5 Program Register
02C0 03C8
PCIBAR0PRG
PCI Base Address Register 0 Program Register
02C0 03CC
PCIBAR1PRG
PCI Base Address Register 1 Program Register
02C0 03D0
PCIBAR2PRG
PCI Base Address Register 2 Program Register
02C0 03D4
PCIBAR3PRG
PCI Base Address Register 3 Program Register
02C0 03D8
PCIBAR4PRG
PCI Base Address Register 4 Program Register
02C0 03DC
PCIBAR5PRG
PCI Base Address Register 5 Program Register
02C0 03E0
PCIBAR0TRLPRG PCI Base Address Translation Register 0 Program Register
02C0 03E4
PCIBAR1TRLPRG PCI Base Address Translation Register 1 Program Register
02C0 03E8
PCIBAR2TRLPRG PCI Base Address Translation Register 2 Program Register
02C0 03EC
PCIBAR3TRLPRG PCI Base Address Translation Register 3 Program Register
02C0 03F0
PCIBAR4TRLPRG PCI Base Address Translation Register 4 Program Register
02C0 03F4
PCIBAR5TRLPRG PCI Base Address Translation Register 5 Program Register
02C0 03F8
PCIBASENPRG
02C0 03FC - 02C0 03FF
-
PCI Base En Prog Register
Reserved
Table 7-101. PCI External Memory Space
HEX ADDRESS OFFSET
ACRONYM
4000 0000 - 407F FFFF
-
PCI Master Window 0
REGISTER NAME
4080 0000 - 40FF FFFF
-
PCI Master Window 1
4100 0000 - 417F FFFF
-
PCI Master Window 2
4180 0000 - 41FF FFFF
-
PCI Master Window 3
4200 0000 - 427F FFFF
-
PCI Master Window 4
4280 0000 - 42FF FFFF
-
PCI Master Window 5
4300 0000 - 437F FFFF
-
PCI Master Window 6
4380 0000 - 43FF FFFF
-
PCI Master Window 7
4400 0000 - 447F FFFF
-
PCI Master Window 8
4480 0000 - 44FF FFFF
-
PCI Master Window 9
4500 0000 - 457F FFFF
-
PCI Master Window 10
4580 0000 - 45FF FFFF
-
PCI Master Window 11
4600 0000 - 467F FFFF
-
PCI Master Window 12
4680 0000 - 46FF FFFF
-
PCI Master Window 13
4700 0000 - 477F FFFF
-
PCI Master Window 14
4780 0000 - 47FF FFFF
-
PCI Master Window 15
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Table 7-101. PCI External Memory Space (continued)
220
HEX ADDRESS OFFSET
ACRONYM
4800 0000 - 487F FFFF
-
PCI Master Window 16
REGISTER NAME
4880 0000 - 48FF FFFF
-
PCI Master Window 17
4900 0000 - 497F FFFF
-
PCI Master Window 18
4980 0000 - 49FF FFFF
-
PCI Master Window 19
4A00 0000 - 4A7F FFFF
-
PCI Master Window 20
4A80 0000 - 4AFF FFFF
-
PCI Master Window 21
4B00 0000 - 4B7F FFFF
-
PCI Master Window 22
4B80 0000 - 4BFF FFFF
-
PCI Master Window 23
4C00 0000 - 4C7F FFFF
-
PCI Master Window 24
4C80 0000 - 4CFF FFFF
-
PCI Master Window 25
4D00 0000 - 4D7F FFFF
-
PCI Master Window 26
4D80 0000 - 4DFF FFFF
-
PCI Master Window 27
4E00 0000 - 4E7F FFFF
-
PCI Master Window 28
4E80 0000 - 4EFF FFFF
-
PCI Master Window 29
4F00 0000 - 4F7F FFFF
-
PCI Master Window 30
4F80 0000 - 4FFF FFFF
-
PCI Master Window 31
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7.16.3 PCI Electrical Data/Timing
Texas Instruments (TI) has performed the simulation and system characterization to ensure that the PCI
peripheral meets all AC timing specifications as required by the PCI Local Bus Specification (version 2.3).
The AC timing specifications are not reproduced here. For more information on the AC timing
specifications, see section 4.2.3, Timing Specification (33 MHz timing), and section 7.6.4, Timing
Specification (66 MHz timing), of the PCI Local Bus Specification (version 2.3). Note that the C6454 PCI
peripheral only supports 3.3-V signaling.
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7.17 General-Purpose Input/Output (GPIO)
7.17.1 GPIO Device-Specific Information
On the C6454 device, the GPIO peripheral pins GP[15:8] and GP[3:0] are muxed with the PCI and
McBSP1 peripheral pins and the SYSCLK4 signal. For more detailed information on device/peripheral
configuration and the C6454 device pin muxing, see Section 3, Device Configuration.
7.17.2 GPIO Peripheral Register Descriptions
Table 7-102. GPIO Registers
222
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
02B0 0008
BINTEN
02B0 000C
-
GPIO interrupt per bank enable register
02B0 0010
DIR
02B0 0014
OUT_DATA
GPIO Output Data register
Reserved
GPIO Direction Register
02B0 0018
SET_DATA
GPIO Set Data register
02B0 001C
CLR_DATA
GPIO Clear Data Register
02B0 0020
IN_DATA
GPIO Input Data Register
02B0 0024
SET_RIS_TRIG
GPIO Set Rising Edge Interrupt Register
02B0 0028
CLR_RIS_TRIG
GPIO Clear Rising Edge Interrupt Register
02B0 002C
SET_FAL_TRIG
GPIO Set Falling Edge Interrupt Register
GPIO Clear Falling Edge Interrupt Register
02B0 0030
CLR_FAL_TRIG
02B0 008C
-
Reserved
02B0 0090 - 02B0 00FF
-
Reserved
02B0 0100 - 02B0 3FFF
-
Reserved
C64x+ Peripheral Information and Electrical Specifications
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7.17.3 GPIO Electrical Data/Timing
Table 7-103. Timing Requirements for GPIO Inputs (1)
(2)
(see Figure 7-74)
-720
-850
A-1000/-1000
NO.
MIN
(1)
(2)
UNIT
MAX
1
tw(GPIH)
Pulse duration, GPIx high
12P
ns
2
tw(GPIL)
Pulse duration, GPIx low
12P
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.
The pulse width given is sufficient to generate a CPU interrupt or an EDMA event. However, if a user wants to have the DSP recognize
the GPIx changes through software polling of the GPIO register, the GPIx duration must be extended to at least 24P to allow the DSP
enough time to access the GPIO register through the CFGBUS.
Table 7-104. Switching Characteristics Over Recommended Operating Conditions for GPIO Outputs (1)
(see Figure 7-74)
NO.
-720
-850
A-1000/-1000
PARAMETER
MIN
(1)
(2)
UNIT
MAX
3
tw(GPOH)
Pulse duration, GPOx high
36P - 8 (2)
ns
4
tw(GPOL)
Pulse duration, GPOx low
36P - 8 (2)
ns
P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.
This parameter value should not be used as a maximum performance specification. Actual performance of back-to-back accesses of the
GPIO is dependent upon internal bus activity.
2
1
GPIx
4
3
GPOx
Figure 7-74. GPIO Port Timing
Copyright © 2006–2012, Texas Instruments Incorporated
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7.18 Emulation Features and Capability
7.18.1 Advanced Event Triggering (AET)
The C6454 device supports Advanced Event Triggering (AET). This capability can be used to debug
complex problems as well as understand performance characteristics of user applications. AET provides
the following capabilities:
• Hardware Program Breakpoints: specify addresses or address ranges that can generate events such
as halting the processor or triggering the trace capture.
• Data Watchpoints: specify data variable addresses, address ranges, or data values that can generate
events such as halting the processor or triggering the trace capture.
• Counters: count the occurrence of an event or cycles for performance monitoring.
• State Sequencing: allows combinations of hardware program breakpoints and data watchpoints to
precisely generate events for complex sequences.
For more information on AET, see the following documents:
Using Advanced Event Triggering to Find and Fix Intermittent Real-Time Bugs application report (literature
number SPRA753)
Using Advanced Event Triggering to Debug Real-Time Problems in High Speed Embedded
Microprocessor Systems application report (literature number SPRA387)
7.18.2 Trace
The C6454 device supports Trace. Trace is a debug technology that provides a detailed, historical
account of application code execution, timing, and data accesses. Trace collects, compresses, and
exports debug information for analysis. Trace works in real-time and does not impact the execution of the
system.
For more information on board design guidelines for Trace Advanced Emulation, see the Emulation and
Trace Headers Technical Reference Manual (literature number SPRU655).
224
C64x+ Peripheral Information and Electrical Specifications
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7.18.3 IEEE 1149.1 JTAG
7.18.3.1 JTAG Device-Specific Information
7.18.3.1.1 IEEE 1149.1 JTAG Compatibility Statement
For maximum reliability, the C6454 DSP includes an internal pulldown (IPD) on the TRST pin to ensure
that TRST will always be asserted upon power up and the DSP's internal emulation logic will always be
properly initialized when this pin is not routed out. JTAG controllers from Texas Instruments actively drive
TRST high. However, some third-party JTAG controllers may not drive TRST high but expect the use of
an external pullup resistor on TRST. When using this type of JTAG controller, assert TRST to initialize the
DSP after powerup and externally drive TRST high before attempting any emulation or boundary scan
operations.
7.18.4 JTAG Peripheral Register Descriptions
7.18.5 JTAG Electrical Data/Timing
Table 7-105. Timing Requirements for JTAG Test Port
(see Figure 7-75)
-720
-850
A-1000/-1000
NO.
MIN
1
tc(TCK)
Cycle time, TCK
3
tsu(TDIV-TCKH)
4
th(TCKH-TDIV)
UNIT
MAX
35
ns
Setup time, TDI/TMS/TRST valid before TCK high
6
ns
Hold time, TDI/TMS/TRST valid after TCK high
9
ns
Table 7-106. Switching Characteristics Over Recommended Operating Conditions for JTAG Test Port
(see Figure 7-75)
NO.
2
-720
-850
A-1000/-1000
PARAMETER
td(TCKL-TDOV)
Delay time, TCK low to TDO valid
UNIT
MIN
MAX
-3
11
ns
1
TCK
2
2
TDO
4
3
TDI/TMS/TRST
Figure 7-75. JTAG Test-Port Timing
Copyright © 2006–2012, Texas Instruments Incorporated
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8 Mechanical Data
8.1
Thermal Data
Table 8-1 shows the thermal resistance characteristics for the PBGA - CTZ/GTZ/ZTZ mechanical
package.
Table 8-1. Thermal Resistance Characteristics (S-PBGA Package) [CTZ/GTZ/ZTZ]
NO.
N/A
RΘJC
Junction-to-case
1.45
2
RΘJB
Junction-to-board
8.34
N/A
16.1
0.00
13.0
1.0
11.9
2.0
4
5
RΘJA
Junction-to-free air
6
7
8
8.2
AIR FLOW
(m/s) (1)
1
3
(1)
°C/W
PsiJT
PsiJB
Junction-to-package top
Junction-to-board
10.7
3.0
0.37
0.00
0.89
1.0
1.01
1.5
1.17
3.00
7.6
0.00
6.7
1.0
6.4
1.5
5.8
3.00
m/s = meters per second
Packaging Information
The following packaging information reflects the most current released data available for the designated
device(s). This data is subject to change without notice and without revision of this document.
226
Mechanical Data
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PACKAGE OPTION ADDENDUM
www.ti.com
27-Oct-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TMS320C6454BCTZ
ACTIVE
FCBGA
CTZ
697
44
Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-245C-72HR
TMS320C6454BCTZ7
ACTIVE
FCBGA
CTZ
697
44
Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-245C-72HR
TMS320C6454BGTZ
OBSOLETE
FCBGA
GTZ
697
TBD
Call TI
Call TI
TMS320C6454BGTZA
LIFEBUY
FCBGA
GTZ
697
TBD
Call TI
Level-4-220C-72 HR
TMS320C6454BZTZ
LIFEBUY
FCBGA
ZTZ
697
Pb-Free (RoHS
Exempt)
SNAGCU
Level-4-260C-72HR
TMS
1GHZ
320C6454
ZTZ
TMS320C6454BZTZ7
LIFEBUY
FCBGA
ZTZ
697
Pb-Free (RoHS
Exempt)
SNAGCU
Level-4-260C-72HR
TMS
7
320C6454
ZTZ
TMS320C6454BZTZ8
LIFEBUY
FCBGA
ZTZ
697
Pb-Free (RoHS
Exempt)
SNAGCU
Level-4-260C-72HR
TMS
320C6454
ZTZ
TMS320C6454BZTZA
OBSOLETE
FCBGA
ZTZ
697
Pb-Free (RoHS
Exempt)
SNAGCU
Level-4-260C-72HR
TMS320C6454BZTZA7
OBSOLETE
FCBGA
ZTZ
697
TBD
Call TI
Call TI
TMX320C6454BZTZ
OBSOLETE
FCBGA
ZTZ
697
TBD
Call TI
Call TI
TMX320C6454BZTZ7
OBSOLETE
FCBGA
ZTZ
697
TBD
Call TI
Call TI
44
Addendum-Page 1
0 to 90
TMS
@2005 TI
320C6454CTZ
1GHZ
TMS
@2005 TI
320C6454CTZ
7
TMS
1GHZ
320C6454
GTZ
-40 to 105
-40 to 105
TMS
(@2005 TI ~ A1GHZ)
320C6454
GTZ
TMS
A1GHZ
320C6454
ZTZ
TMS
A7
320C6454
ZTZ
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
27-Oct-2013
Status
(1)
TMX320C6454BZTZ8
OBSOLETE
Package Type Package Pins Package
Drawing
Qty
FCBGA
ZTZ
697
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
TBD
Call TI
Call TI
Op Temp (°C)
Device Marking
(4/5)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
Samples
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