ETC SY100474-3FCF

SY10/100/101474-3
SY10/100/101474-4
SY10/100/101474-5
SY10474-3/4/5/7
SY10/100/101474-7
SY100474-3/4/5/7
SY101474-3/4/5/7
1K x 4 ECL RAM
SYNERGY
SEMICONDUCTOR
FEATURES
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DESCRIPTION
Address access time, tAA: 3/4/5/7ns max.
Chip select access time, tAC: 2ns max.
Write pulse width, tWW: 3ns min.
Edge rate, tr/tf: 500ps typ.
Power supply current, IEE: –300mA, –220mA
for –5/7ns
Superior immunity against alpha particles provides
virtually no soft error sensitivity
Built with advanced ASSET™ technology
Fully compatible with industry standard 10K/100K
ECL I/O levels
Noise margins improved with on-chip voltage and
temperature compensation
Open emitter output for easy memory expansion
ESD protection of 2000V
Available in 24-pin Flatpack and 28-pin PLCC and
MLCC packages
The Synergy SY10/100/101474 are 4096-bit Random
Access Memories (RAMs), designed with advanced Emitter
Coupled Logic (ECL) circuitry. The devices are organized
as 1024-words-by-4-bits and meet the standard 10K/100K
family signal levels. The SY100474 is also supply voltagecompatible with 100K ECL, while the SY101474 operates
from 10K ECL supply voltage (–5.2V). All feature on-chip
voltage and temperature compensation for improved noise
margin.
The SY10/100/101474 employ proprietary circuit design
techniques and Synergy’s proprietary ASSET advanced
bipolar technology to achieve extremely fast access, write
pulse width and write recovery times. ASSET uses
proprietary technology concepts to achieve significant
reduction in parasitic capacitance while improving device
packing density. Synergy’s circuit design techniques, coupled
with ASSET, result not only in ultra-fast performance, but
also allow device operation with virtually no soft error
sensitivity and with outstanding device reliability in volume
production.
BLOCK DIAGRAM
A1
A0
A2
A3
A4
A5
A6
A7
A8
A9
X-Decoder/
Driver
Y-Decoder/Driver
Memory Cell Array
CS
WE
SA/WA*
SA/WA
SA/WA
SA/WA
DI0 DO0 DI1 DO1 DI2 DO2 DI3 DO3
*
SA = Sense Amplifier
WA = Write Amplifier
Rev.: D
© 1999 Micrel-Synergy
1
Amendment: /1
Issue Date: December 1999
SY10/100/101474-3
SY10/100/101474-4
SY10/100/101474-5
SY10/100/101474-7
SYNERGY
SEMICONDUCTOR
1 28 27 26
DO0
2
VCC
VCCA
NC
3
DO1
DO3
DO2
NC
5
25
DI3
A4
A3
A1
6
24
DI2
A2
7
23
DI1
A2
A1
NC
8
22
NC
A3
9
21
DI0
A4
10
20
CS
A5
19
11
12 13 14 15 16 17 18
WE
PIN NAMES
A7
A8
NC
VEE
A6
A0
Top View
MLCC (M28-1)
or
PLCC (J28-1)
A9
A0
NC
VEE
A6
4
A5
DO2
DO3
VCC
24 23 22 21 20 19
18
17
Top View
16
Flatpack
15
F24-1
14
13
7 8 9 10 11 12
DO0
DO1
DI3
1
2
3
4
5
6
VCCA
WE
CS
DI0
DI1
DI2
A8
A7
A9
PIN CONFIGURATIONS
TRUTH TABLE
Label
Function
A0 - A9
Address Inputs
CS
Input
CS
WE
DIN
Output
Mode
Chip Select
H
X
X
L
Disabled
WE
Write Enable
L
L
H
L
Write “H”
DI0 - DI3
Data Input (DIN)
L
L
L
L
Write “L”
DO0 - DO3
Data Output (DOUT)
L
H
X
DOUT
VCC
GND (0V)
VCCA
Output GND (0V)
VEE
Supply Voltage
NC
No Connect
NOTE:
H = High Voltage Level
L = Low Voltage Level
X = Don’t Care
2
Read
SY10/100/101474-3
SY10/100/101474-4
SY10/100/101474-5
SY10/100/101474-7
SYNERGY
SEMICONDUCTOR
FUNCTIONAL DESCRIPTION
The Synergy SY10/100/101474 are 4096-bit RAMs
organized as 1024-words-by-4-bits. Memory cell selection
is achieved by using the 10 address bits designated as A0
through A9. Each of the 210 possible input address
combinations corresponds to a unique word location in
memory. The active low Chip Select (CS) is provided for
memory expansion. The active low Write Enable (WE)
controls the read and write operation. Data resident on the
DIN inputs (DI0 through DI3) is written into the addressed
location only when WE and CS are held low. In order to
perform a read operation, WE is held high, CS is held low
and the non-inverted output data at the addressed location
is transferred to DOUT (DO0 through DO3) to be read out.
Open emitter outputs are provided for maximum flexibility
and memory expansion by allowing output wire-OR
connections. External termination of 50Ω to –2.0V or an
equivalent circuit must be used to provide the specified
output levels.
The outputs are brought to a logical low level when the
RAM is being written into (WE = LOW) or when the device
is deselected via the active low chip select pin (CS = HIGH).
ABSOLUTE MAXIMUM RATINGS(1)
Symbol
Rating
GUARANTEED OPERATING CONDITIONS
Value
Unit
Parameter
Voltage(1)
VEE
VEE Pin Potential
to VCC Pin
+0.5 to –7.0
V
VIN
Input Voltage
+0.5 to VEE
V
IOUT
DC Output Current
(Output High)
–30
mA
TC
Temperature Under Bias
–55 to +125
°C
Tstore
Storage Temperature
–65 to +150
°C
Supply
10K
Supply
Typ.
Max. Unit
VEE
–5.46
–5.2
–4.94
V
TC
0
—
75
°C
VEE
–4.8
–4.5
–4.2
V
TC
0
—
85
°C
VEE
–5.46
–5.2
–4.94
V
TC
0
—
85
°C
Symbol
Min.
Typ.
Max.
Unit
Case Temperature
Voltage(1)
100K
Case Temperature
Supply Voltage(1)
101K
Case Temperature
NOTE:
1. Referenced to VCC.
NOTE:
1. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS
are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections
of this data sheet. Exposure to ABSOLUTE MAXIMUM RATlNG conditions
for extended periods may affect device reliability.
RISE AND FALL TIME
Parameter
Symbol Min.
CAPACITANCE
Code(1) Symbol Min. Typ.
Max. Unit
Parameter
Output Rise
Time
F
S
tr
—
—
500
1500
—
—
ps
Input Pin
Capacitance
CIN
—
4
—
pF
Output Fall
Time
F
S
tf
—
—
500
1500
—
—
ps
Output Pin
Capacitance
COUT
—
5
—
pF
NOTE:
1. F = Fast Edge Rate
S = Standard Edge Rate
3
SY10/100/101474-3
SY10/100/101474-4
SY10/100/101474-5
SY10/100/101474-7
SYNERGY
SEMICONDUCTOR
10K DC ELECTRICAL CHARACTERISTICS
VCC = 0V; TC = 0°C to +75°C; VEE = –5.2V; Airflow > 2.5m/s; Output Load = 50Ω to –2.0V
Symbol
Parameter
TC
Min.
Max.
Unit
Condition
VOH
Output High Voltage
0°C
+25°C
+75°C
–1000
–960
–900
–840
–810
–720
mV
VIN = VIH Max. or VIL Min.
VOL
Output Low Voltage
0°C
+25°C
+75°C
–1870
–1850
–1830
–1665
–1650
–1625
mV
VIN = VIH Max. or VIL Min.
VOHC
Output High Voltage
0°C
+25°C
+75°C
–1020
–980
–920
—
—
—
mV
VIN = VIH Min. or VIL Max.
VOLC
Output Low Voltage
0°C
+25°C
+75°C
—
—
—
–1645
–1630
–1605
mV
VIN = VIH Min. or VIL Max.
VIH
Input High Voltage
0°C
+25°C
+75°C
–1145
–1105
–1045
–840
–810
–720
mV
Guaranteed Input Voltage High
for All Inputs
VIL
Input Low Voltage
0°C
+25°C
+75°C
–1870
–1850
–1830
–1490
–1475
–1450
mV
Guaranteed Input Voltage Low
for All Inputs
IIH
Input High Current
0°C to +75°C
0.0
20
µA
VIN = VIH Max.
IIL
Input Low Current
0°C to +75°C
–2
2
µA
VIN = VIL Min.
IIL
CS Input Low Current
0°C to +75°C
30
170
µA
VIN = VIL Min.
IIH
CS Input High Current
0°C to +75°C
40
220
µA
VIN = VIH Max.
IIL
WE Input Low Current
0°C to +75°C
–2
35
µA
VIN = VIL Min.
IIH
WE Input High Current
0°C to +75°C
0.0
60
µA
VIN = VIH Max.
IEE
Power Supply
Current
0°C to +75°C
–300
–220
—
mA
All Inputs and Outputs Open
-3ns, -4ns
-5ns, -7ns
100K/101K DC ELECTRICAL CHARACTERISTICS
VCCA = 0V
VCC = 0V
Symbol
VEE = –4.5V (100K)
VEE = –5.2V (101K)
Parameter
TC = 0°C to +85°C
Min.
Max.
Airflow > 2.5m/s
Output Load = 50Ω to –2.0V
Unit
Condition
VOH
Output High Voltage
–1025
–880
mV
VIN = VIH Max. or VIL Min.
VOL
Output Low Voltage
–1810
–1620
mV
VIN = VIH Max. or VIL Min.
VOHC
Output High Voltage
–1035
—
mV
VIN = VIH Min. or VIL Max.
VOLC
Output Low Voltage
—
–1610
mV
VIN = VIH Min. or VIL Max.
VIH
Input High Voltage
–1165
–880
mV
Guaranteed Input Voltage Highfor All Inputs
VIL
Input Low Voltage
–1810
–1475
mV
Guaranteed Input Voltage Lowfor All Inputs
IIH
Input High Current
0.0
20
µA
VIN = VIH Max.
IIL
Input Low Current
–2
2
µA
VIN = VIL Min.
IIL
CS Input Low Current
30
170
µA
VIN = VIL Min.
IIH
CS Input High Current
40
220
µA
VIN = VIH Max.
IIL
WE Input Low Current
–2
35
µA
VIN = VIL Min.
IIH
WE Input High Current
0.0
60
µA
VIN = VIH Max.
IEE
Power Supply 3ns, 4ns
Current
-5ns, -7ns
—
mA
All Inputs and Outputs Open
–300
–220
4
SY10/100/101474-3
SY10/100/101474-4
SY10/100/101474-5
SY10/100/101474-7
SYNERGY
SEMICONDUCTOR
AC ELECTRICAL CHARACTERISTICS
AC TEST CONDITIONS
VCC = VCCA = 0V
VEE = –5.2V ± 5%(10K)
VEE = –4.5V ± 0.3V(100K)
VEE = –5.2V ± 5%(101K)
Output Load = 50Ω to –2.0V
TC = 0°C to +75°C (10K)
TC = 0°C to +85°C (100K/101K)
Airflow > 2.5m/s
Loading Condition
TC
VIH
VIL
10K
0°C
+25°C
+75°C
–0.933V
–0.90V
–0.863V
–1.733V
–1.70V
–1.663V
100/101K
0°C to +85°C
–0.90V
–1.70V
GND
Input Pulse
VIH
80%
VCCA VCC
20%
OUT
VEE
VIL
tr
CL
RL
tf
tr = tf = 1.0ns typ.
OUTPUT LOAD: RL = 50Ω
CL = 5pF* (typ.)
* (Modeled as 50Ω transmission line
terminated to –2V.)
0.01µF
VEE
–2.0V
NOTE:
All timing measurements referenced to 50% input levels.
READ CYCLE
SY10474-3
SY100474-3
SY101474-3
Symbol
Parameter
Min.
SY10474-4
SY100474-4
SY101474-4
SY10474-5
SY100474-5
SY101474-5
SY10474-7
SY100474-7
SY101474-7
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Unit
tAA
TAVQV
Address Access Time
—
3
—
4
—
5
—
7
ns
tAC
TSLQV
Chip Select Access Time
—
2
—
2
—
3
—
3
ns
tRC
TSHQL
Chip Select Recovery Time
—
2
—
2
—
3
—
3
ns
READ CYCLE TIMING DIAGRAM
CS
50%
tAC
Address
tRC
tAA
80%
50%
20%
DOUT
tr
50%
DOUT
tf
5
50%
SY10/100/101474-3
SY10/100/101474-4
SY10/100/101474-5
SY10/100/101474-7
SYNERGY
SEMICONDUCTOR
WRITE CYCLE
Symbol
Parameter
SY10474-3
SY100474-3
SY101474-3
SY10474-4
SY100474-4
SY101474-4
SY10474-5
SY100474-5
SY101474-5
Min.
Max.
Min.
Max.
Min.
Max.
SY10474-7
SY100474-7
SY101474-7
Min.
Max.
Units
tWW
TWLWH
Write Pulse Width
3
—
4
—
5
—
5
—
ns
tWS
TWLQL
Write Disable Time
—
2
—
2
—
3
—
4
ns
tWR
TWHQV
Write Recovery Time
—
3
—
4
—
5
—
5
ns
tSA
TAVWL
Address Set-up Time
1
—
1
—
1
—
1
—
ns
tSC
TSLWL
Chip Select Set-up Time
0
—
0
—
0.5
—
1
—
ns
tSD
TDVWL
Data Set-up Time
0
—
0
—
0.5
—
1
—
ns
tHA
TWHAX
Address Hold Time
1
—
1
—
1
—
1
—
ns
tHC
TWHSX
Chip Select Hold Time
1
—
1
—
1
—
1
—
ns
tHD
TWHDX
Data Hold Time
1
—
1
—
1
—
1
—
ns
WRITE CYCLE TIMING DIAGRAM
CS
Address
DIN
tSD
tHD
WE
tSA
DOUT
tWW
tHC
50%
tSC
tWS
tWR
6
SY10/100/101474-3
SY10/100/101474-4
SY10/100/101474-5
SY10/100/101474-7
SYNERGY
SEMICONDUCTOR
PRODUCT ORDERING CODE
Speed (ns)
Ordering Code
Edge
Rate
Package
Type
Operating
Range
3
SY10/100/101474-3FCF
SY10/100/101474-3MCF
Fast
Fast
F24-1
M28-1
Commercial
Commercial
4
SY10/100/101474-4FCF
SY10/100/101474-4MCF
Fast
Fast
F24-1
M28-1
Commercial
Commercial
5
SY10/100/101474-5FCS
SY10/100/101474-5JCS
SY10/100/101474-5JCSTR
Standard
Standard
Standard
F24-1
J28-1
J28-1
Commercial
Commercial
Commercial
7
SY10/100/101474-7FCS
SY10/100/101474-7JCS
SY10/100/101474-7JCSTR
Standard
Standard
Standard
F24-1
J28-1
J28-1
Commercial
Commercial
Commercial
7
SY10/100/101474-3
SY10/100/101474-4
SY10/100/101474-5
SY10/100/101474-7
SYNERGY
SEMICONDUCTOR
24 LEAD CERPACK (F24-1)
8
SY10/100/101474-3
SY10/100/101474-4
SY10/100/101474-5
SY10/100/101474-7
SYNERGY
SEMICONDUCTOR
28 LEAD PLASTIC LEADED CHIP CARRIER (J28-1)
9
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