TLP3020, TLP3021, TLP3022, TLP3023 TOSHIBA PHOTOCOUPLER GaAs IRED & PHOTO-TRIAC TLP3020,TLP3021,TLP3022,TLP3023 Unit: mm OFFICE MACHINE HOUSEHOLD USE EQUIPMENT TRIAC DRIVER SOLID STATE RELAY The TOSHIBA TLP3020, TLP3021, TLP3022 and TLP3023 consist of a photo-triac optically coupled to a gallium arsenide infrared emitting diode in a six lead plastic DIP package. l Peak Off-State Voltage : 400 V (Min.) l Trigger LED Current : 30mA (Max.) (TLP3020) 15 mA (Max.) (TLP3021) 10 mA (Max.) (TLP3022) 5 mA (Max.) (TLP3023) l On-State Current : 100 mA (Max.) JEDEC ― l UL Recognized : UL1577, File No. E67349 EIAJ ― l Isolation Voltage : 5000 Vrms (Min.) TOSHIBA l Option (D4) Type l VDE Approved 11-9A2 Weight: 0.44g : DIN VDE0884 / 08.87, Certificate No. 68329 PIN CONFIGURATION (TOP VIEW) Maximum Operating Insulation Voltage: 630 VPK Highest Permissible Over Voltage: 6000 VPK Note: When a VDE0884 approved type is needed, please designate the ” Option (D4) ” l Creepage Distance : Clearance : Insulation Thickness : 7.62mm pich standard type 7.0 mm (Min.) 7.0 mm (Min.) 0.5 mm (Min.) 10.16 mm pich (LF2) type 8.0 mm (Min.) 8.0 mm (Min.) 0.5 mm (Min.) 1: 2: 3: 4: 6: 1 ANODE CATHODE N.C. TERMINAL 1 TERMINAL 2 2001-06-13 TLP3020, TLP3021, TLP3022, TLP3023 MAXIMUM RATINGS (Ta=25°°C) CHARACTERISTIC SYMBOL RATING UNIT IF 50 mA DIF/°C −0.7 mA/°C Peak Forward Current (100ms pulse, 100pps) IFP 1 A Power Dissipation PD 100 mW DPD/°C −1.0 mW/°C Reverse Voltage VR 5 V Junction Temperature Tj 125 °C VDRM 400 V Forward Current LED Forward Current Derating (Ta ≥ 53°C) Power Dissipation Derating (Ta ≥ 25°C) DETECTOR Off-State Output Terminal Voltage On-Stage RMS Ta=25°C Current Ta=70°C 100 IT(RMS) On-State Current Derating (Ta ≥ 25°C) Peak On-Stage Current (100ms pulse, 120pps) Peak Nonrepetitive Surge Current (PW =10ms, DC=10%) Power Dissipation Power Dissipation Derating (Ta ≥ 25°C) mA 50 DIT/°C −1.1 mA/°C ITP 2 A ITSM 1.2 A PD 300 mW DPD/°C −4.0 mW/°C Tj 115 °C Storage Temperature Range Tstg −55 ~ 150 °C Operating Temperature Range Topr −40 ~ 100 °C Lead Soldering Temperature (10s) Tsol 260 °C Total Package Power Dissipation PT 330 mW Total Package Power Dissipation Derating (Ta ≥ 25°C) DPT/°C −4.4 mW/°C Isolation Voltage (AC, 1 min., R.H. ≤ 60%) (Note 1) BVS 5000 Vrms Junction Temperature Note 1: Device considered a two terminal device together. :Pins 1, 2 and 3 shorted together and pins 4 and 6 shorted RECOMMENDED OPERATING CONDISTIONS CHARACTERISTICS SYMBOL MIN TYP. MAX UNIT Supply Voltage VAC ¾ ¾ 120 Vac Forward Current IF* 15 20 25 mA Peak On-Stage Current ITP ¾ ¾ 1 A Operating Temperature Topr −25 ¾ 85 °C *: In the case of TLP3022 2 2001-06-13 TLP3020, TLP3021, TLP3022, TLP3023 INDIVIDUAL ELECTRICAL CHARACTERISTICS (Ta=25°°C) DETECTOR LED CHARACTERISTIC SYMBOL TEST CONDITION MIN TYP. MAX UNIT Forward Voltage VF IF=10mA 1.0 1.15 1.3 V Reverse Current IR VR=5V ¾ ¾ 10 mA Capacitance CT V=0, f=1MHz ¾ 10 ¾ pF Peak Off-State Current IDRM VDRM=400V ¾ 10 100 nA Peak On-Stage Voltage VTM ITM=100mA ¾ 1.7 3.0 V IH ¾ ¾ 0.6 ¾ mA dv / dt Vin=120Vrms, Ta=85°C (Fig.1) 200 500 ¾ V/ms dv / dt(c) Vin=30Vrms, IF=15mA (Fig.1) ¾ 0.2 ¾ V/ms MIN TYP. MAX UNIT ¾ ¾ 30 ¾ ¾ 15 ¾ 5 10 ¾ ¾ 5 0.8 ¾ pF ¾ W ¾ ¾ Vrms Holding Current Critical Rate of Rise of OffState Voltage Critical Rate of Rise of Commutating Voltage COUPLED ELECTRICAL CHARACTERISTICS (Ta=25°°C) CHARACTERISTIC SYMBOL TEST CONDITION TLP3020 Trigger LED Current TLP3021 TLP3022 IFT VT=3V TLP3023 Capacitance Input to Output Isolation Resistance CS RS VS=0, f=1MHz VS=500V (R.H. ≤ 60%) ¾ 10 5´10 AC, 1 minute Isolation Voltage BVS 14 10 AC, 1 second (in oil) ¾ 10000 ¾ DC, 1 minute (in oil) ¾ 10000 ¾ mA Vdc Fig. 1 dv/dt TEST CIRCUIT 3 2001-06-13 TLP3020, TLP3021, TLP3022, TLP3023 IF - Ta IT IFP -DR (RMS) - Ta I F - VF DV F /DTa - I F IFP - VFP 4 2001-06-13 TLP3020, TLP3021, TLP3022, TLP3023 NORMALIZED IH - Ta NORMALIZED IFT - Ta NORMALIZED IDRM - Ta NORMALIZED VDRM - Ta NORMALIZED LED CURRENT - LED CURRENT PULSE WIDTH 5 2001-06-13 TLP3020, TLP3021, TLP3022, TLP3023 RESTRICTIONS ON PRODUCT USE 000707EBC · TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. · The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. · Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with domestic garbage. · The products described in this document are subject to the foreign exchange and foreign trade laws. · The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. · The information contained herein is subject to change without notice. 6 2001-06-13