TOSHIBA TLP2405

TLP2405
Photocouplers
GaAℓAs Infrared LED & Photo IC
TLP2405
1. Applications
•
High-Speed Digital Interfacing for Instrumentation and Control Devices
•
Communications Equipment
•
Intelligent Power Module Signal Isolation
2. General
The Toshiba TLP2405 consists of a GaAℓAs light-emitting diode coupled with a high-gain, high-speed photo
detector. It is housed in the 8-pin SO8 package.
The detector has a totem-pole output stage with current sourcing and sinking capabilities.
The TLP2405 has an internal Faraday shield that provides a guaranteed common-mode transient immunity of
±15 kV/µs.
The TLP2405 a logic buffer output. An inverter output version, the TLP2408, is also available.
3. Features
(1)
Buffer logic type (totem pole output)
(2)
Package: SO8
(3)
Supply voltage: 4.5 to 20 V
(4)
Threshold input voltage, low to high: IFLH = 1.6 mA (max)
(5)
Propagation delay time: tpHL/tpLH = 250 ns (max)
(6)
Common-mode transient immunity: ±15 kV/µs (min)
(7)
Operating temperature: -40 to 100
(8)
Isolation voltage: 3750 Vrms (min)
(9)
Safety standard
UL-approved: UL1577 File No.E67349
cUL-approved: CSA Component Acceptance Service No.5A, File No.E67349
Note:
VDE-approved: Option (V4) EN60747-5-2 (Note)
When an EN60747-5-2 approved type is needed, please designate the Option (V4)
(V4).
4. Packaging and Pin Configuration
1: NC
2: Anode
3: Cathode
4: NC
5: GND
6: NC
7: VO (output)
8: VCC
SO8
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5. Internal Circuit (Note)
Fig. 5.1 Internal Circuit
Note:
A 0.1-µF bypass capacitor must be connected between pin 8 and pin 5.
6. Principle of Operation
6.1. Truth Table
Input
LED
Output
H
ON
H
L
OFF
L
6.2. Mechanical Parameters
Characteristics
Min
Unit
Creepage distances
4.0
mm
Clearance
4.0
Internal isolation thickness

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7. Absolute Maximum Ratings (Note)
Unless otherwise specified, Ta = 25
Characteristics
LED
Symbol
Note
Rating
Unit
Forward current
(Ta ≤ 85)
IF
25
mA
Forward current derating
(Ta ≥ 85)
∆IF/
-0.67
mA/
VR
5
V
Reverse voltage
Power dissipation
PD
40
mW
(Ta ≥ 85)
∆PD/
-1.0
mW/
Detector Output current
(Ta ≤ 25)
IO
25/-15
mA
Output current
(Ta = 100)
IO
5/-5
Output voltage
VO
-0.5 to 20
Supply voltage
VCC
-0.5 to 20
Topr
-40 to 100
Tstg
-55 to 125
Power dissipation derating
Common Operating temperature
Storage temperature
Lead soldering temperature
Isolation voltage
(10 s)
Tsol
AC, 1 min,
R.H. ≤ 60%
BVS
V

260
(Note 1)
3750
Vrms
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7
and 8 are shorted together.
8. Recommended Operating Conditions (Note)
Characteristics
Symbol
Note
Min
Typ.
Max
Unit
Input on-state current
IF(ON)
2

10
mA
Input off-state voltage
VF(OFF)
0

0.8
V
4.5

20
-40

100
Supply voltage
VCC
Operating temperature
Topr
(Note 1)

Note:
The recommended operating conditions are given as a design guide necessary to obtain the intended
performance of the device. Each parameter is an independent value. When creating a system design using
this device, the electrical characteristics specified in this datasheet should also be considered.
Note: A ceramic capacitor (0.1 µF) should be connected between pin 8 and pin 5 to stabilize the operation of a highgain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor should be
placed within 1 cm of each pin.
Note 1: Denotes the operating range, not the recommended operating condition.
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9. Electrical Characteristics (Note)
Unless otherwise specified, Ta = -40 to 100, VCC = 4.5 to 20 V
Characteristics
Symbol
Note
Test
Circuit
Test Condition
Min
Typ.
Max
Unit
1.40
1.57
1.80
V
-1.8

mV/
VF

IF = 10 mA, Ta = 25
∆VF/∆Ta

IF = 10 mA

Input reverse current
IR

VR = 5 V, Ta = 25


10
µA
Input capacitance
CT

V = 0 V, f = 1 MHz

60

pF
Low-level output voltage
VOL
Fig.
12.1.1
IO = 3.5 mA, VF = 0.8 V

0.2
0.6
V
High-level output voltage
VOH
Fig.
12.1.2
VCC = 4.5 V, IO = -2.6 mA,
IF = 5 mA
2.7
3.5

VCC = 20 V, IO = -2.6 mA,
IF = 5 mA
17.4
19

Input forward voltage
Input temperature coefficient
of forward voltage
Low-level supply current
High-level supply current
(Note 2)
ICCL
ICCH
Fig.
12.1.3
VCC = 5.5 V, VF = 0 V


3.0
VCC = 20 V, VF = 0 V


3.0
Fig.
12.1.4
VCC = 5.5 V, IF = 5 mA


3.0
VCC = 20 V, IF = 5 mA


3.0
80

Low-level short-circuit output
current
IOSL
(Note 1)
Fig.
12.1.5
VCC = VO = 5.5 V, VF = 0 V
15
VCC = VO = 20 V, VF = 0 V
20
90

High-level short-circuit output
current
IOSH
(Note 1)
Fig.
12.1.6
VCC = 5.5 V, IF = 5 mA,
VO = GND
-5
-15

VCC = 20 V, IF = 5 mA,
VO = GND
-10
-20

mA
Threshold input current, low
to high
IFLH

IO = -2.6 mA, VO > 2.4 V

0.4
1.6
Threshold input voltage, high
to low
VFHL

IO = 3.5 mA, VO < 0.6 V
0.8


V
Input current hysteresis
IHYS

VCC = 5 V

0.05

mA
Min
Typ.
Max
Unit

1.0

pF
1×1012
1014

Ω
Vrms
Note: All typical values are at Ta = 25.
Note 1: Duration of output short circuit time should not exceed 10 ms.
Note 2: VOH = VCC - VO (V)
10. Isolation Characteristics
Unless otherwise specified, Ta = 25
Characteristics
Symbol
Capacitance (input to output)
CS
Isolation resistance
RS
Isolation voltage
BVS
Note
Test Conditions
(Note 1) VS = 0 V, f = 1 MHz
VS = 500 V, R.H. ≤ 60%
3750


AC, 1 s in oil

10000

DC, 1 min in oil

10000

AC, 1 min
VDC
Note 1: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7
and 8 are shorted together.
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11. Switching Characteristics (Note)
Unless otherwise specified, Ta = -40 to 100, VCC = 4.5 to 20 V
Characteristics
Symbol
Propagation delay time
to logic high output
tpLH
Propagation delay time
to logic low output
tpHL
Pulse width distortion
Note
Test
Circuit
Fig.
12.1.7,
Fig.
12.1.8
|tpLH - tpHL|
Test Condition
Min
Typ.
Max
Unit
IF = 0 → 3 mA
30
90
250
ns
IF = 3 → 0 mA
30
120
250



220
Rise time
tr
IF = 0 → 3 mA, VCC = 5 V

30
75
Fall time
tf
IF = 3 → 0 mA, VCC = 5 V

30
75
VCM = 1000 Vp-p, IF = 5 mA,
VCC = 20 V, Ta = 25
-15


VCM = 1000 Vp-p, IF = 0 mA,
VCC = 20 V, Ta = 25
15


Common-mode
transient immunity at
output high
CMH
Common-mode
transient immunity at
output low
CML
Note:
Fig.
12.1.9
kV/µs
All typical values are at Ta = 25.
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TLP2405
12. Test Circuits and Characteristics Curves
12.1. Test Circuits
Fig. 12.1.1 VOL Test Circuit
Fig. 12.1.2 VOH Test Circuit
Fig. 12.1.3 ICCL Test Circuit
Fig. 12.1.4 ICCH Test Circuit
Fig. 12.1.5 IOSL Test Circuit
Fig. 12.1.6 IOSH Test Circuit
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Fig. 12.1.7 Switching Time Test Circuit
Fig. 12.1.8 Switching Time Test Circuit
Fig. 12.1.9 Common-Mode Transient Immunity Test Circuit
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13. Soldering and Storage
13.1. Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective
of whether a soldering iron or a reflow soldering method is used.
•
When using soldering reflow (See Fig. 13.1.1 and 13.1.2)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
Fig. 13.1.1 An example of a temperature profile
when Sn-Pb eutectic solder is used
•
Fig. 13.1.2 An example of a temperature profile
when lead(Pb)-free solder is used
When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Apply preheating of 150 for 60 to 120 seconds.
Mounting condition of 260 within 10 seconds is recommended.
Flow soldering must be performed once.
•
When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not
exceeding 350
Heating by soldering iron must be done only once per lead.
13.2. Precautions for General Storage
•
Avoid storage locations where devices may be exposed to moisture or direct sunlight.
•
Follow the precautions printed on the packing label of the device for transportation and storage.
•
Keep the storage location temperature and humidity within a range of 5 to 35 and 45% to 75%,
respectively.
•
Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
•
Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
•
When restoring devices after removal from their packing, use anti-static containers.
•
Do not allow loads to be applied directly to devices while they are in storage.
•
If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
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14. Land pattern dimensions for reference only
Fig. 14.1 Land pattern dimensions for reference only
15. Marking
Fig. 15.1 Marking
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16. EN60747-5-2 Option (V4) Specification
•
Part number: TLP2405(F) (Note)
•
The following part naming conventions are used for the devices that have been qualified according to
option (V4) of EN60747.
Example: TLP2405(V4-TPL,F)
V4: EN60747 option
TPL: tape and reel type
F:[[G]]/RoHS COMPATIBLE (Note 1)
Note:
Use TOSHIBA standard type number for safety standard application.
e.g., TLP2405(V4-TPL,F) → TLP2405
Note 1: Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS
compatibility of Product.
RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the
restriction of the use of certain hazardous substances in electrical and electronics equipment.
Fig. 16.1 EN60747 Insulation Characteristics
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TLP2405
Fig. 16.2 Insulation Related Specification (Note)
Note:
Note:
If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value. (e.
g., at a standard distance between soldering eye centres of 3.5mm). If this is not permissible, the user shall
take suitable measures.
This photocoupler is suitable for safe electrical isolation only within the safety limit data.
Maintenance of the safety data shall be ensured by means of protective circuits.
Fig. 16.3 Marking Example (Note)
Note:
The above marking is applied to the photocouplers that have been qualified according to option (V4) of EN60747.
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Fig. 16.4 Test Results
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Package Dimensions
Unit: mm
Weight: 0.11 g (typ.)
Package Name(s)
TOSHIBA: 11-5K1S
Nickname: SO8
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• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
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written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating
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Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
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• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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