TOSHIBA TLP700H

TLP700
TOSHIBA Photocoupler
GaAℓAs IRED + Photo IC
TLP700
Industrial inverters
Inverter for air conditioners
IGBT/Power MOSFET gate drive
Unit in mm
4.58±0.25
6 5 4
Peak output current:
•
Guaranteed performance over temperature: −40 to 100°C
•
Supply current:
2 mA (max)
•
Power supply voltage:
15 to 30 V
Threshold input current:
IFLH = 5 mA (max)
Switching time (tpLH / tpHL):
500 ns (max)
•
Common mode transient immunity:
±15 kV/μs (min)
•
Isolation voltage:
5000 Vrms (min)
•
Construction mechanical rating
•
UL recognized:
7.62-mm pitch
standard type
10.16-mm pitch
TLPXXXF type
7.0 mm (min)
7.0 mm (min)
0.4 mm (min)
8.0 mm (min)
8.0 mm (min)
0.4 mm (min)
+0.25
4.0 −0.20
−0.05
1.27±0.2
1.25±0.25
9.7±0.3
11-5J1
TOSHIBA
11-5J1
Weight: 0.26 g (t y p .)
Pin Configuration (Top View)
UL1577, File No. E67349
1
6
EN60747-5-2
2
5
Maximum operating insulation voltage: 890 Vpk
Highest permissible over voltage:
8000 Vpk
3
Option (D4) type
TÜV approved:
7.62±0.25
0.4±0.1
•
•
3.65 +0.15
−0.25
±2.0 A (max)
•
Creepage Distance
Clearance
Insulation Thickness
1 2 3
0.25± +0.10
•
6.8±0.25
TLP700 consists of a GaAℓAs light-emitting diode and an integrated
photodetector.
This unit is 6-lead SDIP package. The TLP700 is 50% smaller than the 8-pin
DIP and meets the reinforced insulation class requirements of international safety
standards. Therefore the mounting area can be reduced in equipment requiring
safety standard certification.
The TLP700 is suitable for gate driving circuits for IGBTs or power MOSFETs.
In particular, the TLP700 is capable of “direct” gate driving of low-power IGBTs.
SHIELD
4
1: ANODE
2: N.C
3: CATHODE
4: GND
5: VO ( OUTPUT )
6: VCC
( Note ) When a EN60747-5-2 approved type is needed,
please designate the “Option(D4)”
Schematic
ICC
VCC
(M1)
6
IF
1＋
Truth Table
VF
Input
LED
M1
M2
Output
H
ON
ON
OFF
H
L
OFF
OFF
ON
L
(M2)
3－
IO
VO
5
SHIELD
GND
4
A 0.1-μF bypass capacitor must be connected
between pins 6 and 4. (See Note 6.)
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2010-02-23
TLP700
Absolute Maximum Ratings (Ta = 25 °C)
Characteristics
Symbol
Rating
Unit
IF
20
mA
ΔIF/ΔTa
−0.54
mA/°C
IFP
1
A
Forward current
LED
Forward current derating (Ta ≥ 85°C)
Peak transient forward current
(Note 1)
Reverse voltage
VR
5
V
Junction temperature
Tj
125
°C
Ta=-40 to 100 °C
IOPH
−2.0
A
“L” peak output current
(Note 2)
IOPL
2.0
A
Output voltage
VO
35
V
Supply voltage
VCC
35
V
Tj
125
°C
f
50
kHz
Operating temperature range
Topr
−40 to 100
°C
Storage temperature range
Tstg
−55 to 125
°C
Detector
“H” peak output current
Junction temperature
Operating frequency
(Note 3)
Lead soldering temperature (10 s)
(Note 4)
Tsol
260
°C
Isolation voltage (AC, 1 minute, R.H. ≤ 60%)
(Note 5)
BVS
5000
Vr m s
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1:
Note 2:
Note 3:
Note 4:
Note 5:
Pulse width PW ≤ 1 μs, 300 pps
Exponential waveform pulse width PW ≤ 0.3 μs, f ≤15 kHz
Exponential waveform IOPH ≥−1.5 A (≤ 0.3 μs), IOPL ≤+1.5 A (≤ 0.3 μs), Ta=100°C
For the effective lead soldering area
Device considered a two-terminal device: pins 1, 2 and 3 paired with pins 4, 5 and 6 respectively.
Note 6: A ceramic capacitor (0.1 μF) should be connected from pin 6 to pin 4 to stabilize the operation of the high
gain linear amplifier. Failure to provide the bypassing may impair the switching property.
The total lead length between capacitor and coupler should not exceed 1 cm.
Recommended Operating Conditions
Characteristics
Input current, ON
(Note 7)
Input voltage, OFF
Supply voltage *
Peak output current
Operating temperature
(Note 8)
Symbol
Min
Typ.
Max
Unit
IF (ON)
7.5
⎯
10
mA
VF (OFF)
0
⎯
0.8
V
VCC
15
⎯
30
V
IOPH / IOPL
⎯
⎯
± 1.5
A
Topr
−40
⎯
100
°C
* This item denotes operating ranges, not meaning of recommended operating conditions.
Note : Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
Note 7: Input signal rise time (fall time) ≤ 0.5 μs.
Note 8: If the Vcc rise slope is sharp, an internal circuit might not operate with stability. Please design the Vcc rise
slope under 3.0 V/μs.
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TLP700
Electrical Characteristics (Ta = −40 to 100 °C, unless otherwise specified)
Symbol
Test
Circuit
VF
⎯
∆VF/∆Ta
Input reverse current
Input capacitance
Characteristics
Forward voltage
Temperature coefficient of forward
voltage
“H” Level
Output current
(Note 9)
“L” Level
Min
Typ.*
Max
Unit
IF = 10 mA, Ta = 25 °C
⎯
1.57
1.75
V
⎯
IF = 10 mA
⎯
−1.8
⎯
mV/°C
IR
⎯
VR = 5 V, Ta = 25 °C
⎯
⎯
10
μA
CT
⎯
V =0 V, f = 1 MHz, Ta = 25 °C
⎯
100
⎯
pF
IOPH1
IOPH2
IOPL1
IOPL2
Test Condition
1
VCC = 15 V
IF = 5 mA
V6-5 = 3.5 V
⎯
−1.4
−1.0
V6-5 = 7 V
⎯
⎯
−1.5
2
VCC = 15 V
IF = 0 mA
V5-4 = 2.5 V
1.0
1.4
⎯
1.5
⎯
⎯
11
13.7
⎯
⎯
-14.9
-12.5
IF = 10 mA
⎯
1.3
2.0
IF = 0 mA
⎯
1.3
2.0
V5-4 = 7 V
VCC1=+15V, VEE1=-15V
A
“H” Level
VOH
3
“L” Level
VOL
4
“H” Level
ICCH
5
“L” Level
ICCL
6
VCC = 30 V
VO=Open
Threshold input current
L→H
IFLH
⎯
VCC = 15 V, VO > 1 V
⎯
1.8
5
mA
Threshold input voltage
H→L
VFHL
⎯
VCC = 15 V, VO < 1 V
0.8
⎯
⎯
V
VCC
⎯
15
⎯
30
V
VUVLO+
⎯
VO > 2.5V, IF = 5 mA
11.0
12.5
13.5
V
VUVLO-
⎯
VO < 2.5V, IF = 5 mA
9.5
11.0
12.0
V
UVLOHYS
⎯
⎯
1.5
⎯
V
Output voltage
Supply current
Supply voltage
UVLO thresh hold
UVLO hysteresis
RL = 200Ω, IF = 5 mA
V
VCC1=+15V, VEE1=-15V
RL = 200Ω,VF = 0.8 V
⎯
⎯
mA
( * ): All typical values are at Ta = 25°C
Note 9: Duration of Io time ≤ 50 μs, 1 pulse
Note 10: This product is more sensitive than conventional products to electrostatic discharge (ESD) owing to its low
power consumption design.
It is therefore all the more necessary to observe general precautions regarding ESD when handling this
component.
Isolation Characteristics (Ta = 25 °C)
Characteristic
Symbol
Capacitance input to output
CS
Isolation resistance
RS
Test Condition
Vs = 0 V , f = 1MHz
R.H. ≤ 60 %, VS = 500 V
BVS
(Note 5)
Typ.
Max
Unit
⎯
1.0
⎯
pF
⎯
Ω
1×10
12
10
14
5000
⎯
⎯
AC, 1 second, in oil
⎯
10000
⎯
DC, 1 minute, in oil
⎯
10000
⎯
AC, 1 minute
Isolation voltage
(Note 5)
Min
3
Vrms
Vdc
2010-02-23
TLP700
Switching Characteristics (Ta = −40 to 100 °C, unless otherwise specified)
Characteristics
Propagation delay time
Test
Circuit
Symbol
L→H
tpLH
H→L
tpHL
Output rise time (10−90 %)
tr
Output fall time (90−10 %)
tf
Switching time dispersion
between ON and OFF
7
Test Condition
CMH
at HIGH level output
8
Common mode transient immunity
CML
at LOW level output
Typ.*
Max
IF = 0 → 5 mA
50
⎯
500
VCC = 30 V
Rg = 20 Ω
IF = 5 → 0 mA
50
⎯
500
IF = 0 → 5 mA
⎯
50
⎯
Cg = 10 nF
IF = 5 → 0 mA
⎯
50
⎯
IF = 0 ↔ 5 mA
⎯
⎯
250
−15
⎯
⎯
15
⎯
⎯
| tpHL-tpLH |
Common mode transient immunity
Min
IF = 5 mA
VCM =1000 Vp-p V
O (min) = 26 V
Ta = 25 °C
IF = 0 mA
VCC = 30 V
VO (max) = 1 V
Unit
ns
kV/μs
( * ): All typical values are at Ta = 25 °C.
Test Circuit 1: IOPH
1
Test Circuit 2: IOPL
1
6
6
0.1μF
IOPL
A
V6-5
A
IF
IOPH
0.1μF
3
VCC
VCC
3
4
Test Circuit 3: VOH
1
Test Circuit 4: VOL
1
6
0.1μF
IF
RL
V
VOH
3
VCC1
IF
0.1μF
RL
V
VOL
VEE1
4
6
6
VF
3
Test Circuit 5: ICCH
1
V5-4
4
VCC1
VEE1
4
Test Circuit 6: ICCL
ICCH
1
6
ICCL
A
A
0.1μF
0.1μF
VCC
VCC
3
3
4
4
4
2010-02-23
TLP700
Test Circuit 7: tpLH, tpHL, tr, tf, | tpHL-tpLH |
(f=25kHz, duty=50%, less than tr=tf=5ns)
6
1
0.1 μF
IF
VO
Cg = 10nF
IF
Rg = 20 Ω
3
tr
VCC
VOH
tf
90%
50%
10%
VO
4
tpHL
tpLH
VOL
Test Circuit 8: CMH, CML
IF
6
1
VCM
SW
A
0.1μF
VO
B
1000 V
90%
10%
tr
VCC
tf
• SW A: IF = 5 mA
4
3
VO
VCM
+
−
1V
• SW B: IF = 0 mA
CMH = −
CML =
CMH
26V
CML
800 V
tf (μs)
800 V
tr (μs)
CML (CMH) is the maximum rate of rise (fall) of the common mode voltage that can be sustained with the output
voltage in the LOW (HIGH) state.
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TLP700
IF － VF
⊿VF/⊿Ta － IF
-3.2
C o e f f i c i e n t ⊿VF/⊿Ta [mＶ/°C]
F o r w a r d C u r r e n t IF [mA]
100
Ta=-40°C
Ta=25°C
Ta=100°C
10
1
0.1
1
1.2
1.4
1.6
1.8
-2
-1.6
-1.2
0.1
1
F o r w a r d C u r r e n t IF [mA]
VOL － Ta
VOH － Ta
30
VF=0.8V, RL=200Ω
-20
VCC1=15V, VEE1=-15V
-15
-10
VCC1=7.5V, VEE1=-7.5V
-5
0
-40 -20
0
20
40
60
80
25
IF=5mA, RL=200Ω
20
VCC1=15V, VEE1=-15V
15
10
VCC1=7.5V, VEE1=-7.5V
5
0
-40 -20
100
Ambient Temperature Ta [°C]
0
IF=0mA
VCC=30V
3
2
1
0
-40 -20
0
20
40
40
60
80
100
ICCH － Ta
High level supply current ICCH [mA]
Low level supply current ICCL [mA]
4
20
Ambient Temperature Ta [°C]
ICCL － Ta
5
10
F o r w a r d Vo l t a g e VF [V]
High Level Output Voltage VOH [V]
Low Level Output Voltage VOL [V]
-2.4
2
-30
-25
-2.8
60
80
100
Ambient Temperature Ta [°C]
5
4
IF=10mA
VCC=30V
3
2
1
0
-40 -20
0
20
40
60
80
100
Ambient Temperature Ta [°C]
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2010-02-23
TLP700
Propagation delay time tpHL, tpLH [ns]
500
tPLH, tPHL － VCC
IF=5mA, VCC=30V
Rg=20Ω, Cg=10nF
400
tpHL
300
200
tpLH
100
0
-40 -20
500
0
20
40
60
80
Threshold input current IFLH [mA]
tpHL
100
3
8
10
12
14
16
18
0
15
20
25
30
4
VCC=15V, VO>1V
IO=0mA
3
2
1
0
20
40
60
80
Ambient Temperature Ta [°C]
IOPL－ Ta
IOPH－ Ta
（Note 9）
V5-4=7.0V
V5-4=2.5V
1
0
-40 -20
100
Forward current IF [mA]
IOPL
MAX
2
tpLH
0
-40 -20
20
IF=0mA, VCC=15V
4
200
5
200
5
tpHL
IFLH － Ta
tpLH
6
300
tPLH, tPHL － IF
Rg=20Ω, Cg=10nF
4
Cg=10nF
Supply Voltage VCC [V]
300
0
400
Ambient Temperature Ta [°C]
VCC=30V
400
500 I =5mA
F I =5mA, R =20Ω
F
g
100
High Level Peak Output Current IOPH [A]
Low Level Peak Output Current IOPL [A]
Propagation delay time tpHL, tpLH [ns]
Propagation delay time tpHL, tpLH [ns]
tPLH, tPHL － Ta
0
20
40
60
80
100
Ambient Temperature Ta [°C]
0
100
IF=5mA, VCC=15V
-1
（Note 9）
V6-5=-3.5V
-2
IOPH
MAX
-3
V6-5=-7.0V
-4
-5
-40 -20
0
20
40
60
80
100
Ambient Temperature Ta [°C]
7
2010-02-23
TLP700
V5-4 － IOPL
V6-5 － IOPH
6
0
IF=0mA, VCC=15V
Ta=100°C
5
Ta=25°C
4
Ta=-40°C
3
2
（Note9）
-2
Ta=-40°C
-3
-4
Ta=100°C
-5
Ta=25°C
-6
1
0
IF=5mA, VCC=15V
-1
（Note9）
Output Voltage V6-5 [V]
Output Voltage V5-4 [V]
7
0.5
1
1.5
-7
2
Low Level Output Peak Current IOPL [A]
0
-0.5
-1
-1.5
-2
High Level Output Peak Current IOPH [A]
VO(VUVLO)** - VCC
14
Output Voltage VO [V]
12
IF=5mA, VO>2.5V
**Test Circuit : VO(VUVLO) - VCC
UVLOHYS
10
1
8
6
+VUVLO
-VUVLO
6
VO
IF
VCC
4
3
2
0
5
10
15
4
20
Supply Voltage VCC [V]
*: The above graphs show typical characteristics.
8
2010-02-23
TLP700
Soldering and Storage
(1) Precautions for Soldering
1) When Using Soldering Reflow
z
An example of a temperature profile when Sn-Pb eutectic solder is used:
z
An example of a temperature profile when lead(Pb)-free solder is used:
z Reflow soldering must be performed once or twice.
z The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
2) When using soldering Flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)
z Apply preheating of 150 deg.C for 60 to 120 seconds.
z Mounting condition of 260 deg.C or less within 10 seconds is recommended.
z Flow soldering must be performed once
3) When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)
z Complete soldering within 10 seconds for lead temperature not exceeding 260 deg.C or within 3 seconds
not exceeding 350 deg.C.
z Heating by soldering iron must be only once per 1 lead
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TLP700
(2) Precautions for General Storage
1) Do not store devices at any place where they will be exposed to moisture or direct sunlight.
2) When transportation or storage of devices, follow the cautions indicated on the carton box.
3) The storage area temperature should be kept within a temperature range of 5 degree C
to 35 degree C, and relative humidity should be maintained at between 45% and 75%.
4) Do not store devices in the presence of harmful (especially corrosive)gases, or in dusty conditions.
5) Use storage areas where there is minimal temperature fluctuation. Because rapid temperature
changes can cause condensation to occur on stored devices, resulting in lead oxidation or corrosion,
as a result, the solderability of the leads will be degraded.
6) When repacking devices, use anti-static containers.
7) Do not apply any external force or load directly to devices while they are in storage.
8) If devices have been stored for more than two years, even though the above conditions have been
followed, it is recommended that solderability of them should be tested before they are used.
10
2010-02-23
TLP700
Specifications for Embossed-Tape Packing
(TP) for SDIP6 Type Photocoupler
1. Applicable Package
Package Name
Product Type
SDIP6
Photocouplers
2. Product Naming System
Type of package used for shipment is denoted by a symbol suffix after a product number. The method of
classification is as below.
(Example)
TLP700 (TP, F)
[[G]]/RoHS COMPATIBLE (Note11)
Tape type
Device name
3. Tape Dimensions
3.1
Orientation of Devices in Relation to Direction of Tape Movement
Device orientation in the recesses is as shown in Figure 1.
Tape feed
Figure 1 Device Orientation
3.2
Tape Packing Quantity: 1500 devices per reel
3.3
Empty Device Recesses Are as Shown in Table 1.
Table 1 Empty Device Recesses
Standard
Occurrences of 2 or more
successive empty device
recesses
Single empty device
recesses
3.4
Remarks
Within any given 40-mm section of
tape, not including leader and trailer
0
6 devices (max) per reel
Not including leader and trailer
Start and End of Tape:
The start of the tape has 30 or more empty holes. The end of the tape has 30 or more empty holes
and two empty turns only for a cover tape.
11
2010-02-23
TLP700
Tape material: Plastic (protection against electrostatics)
Dimensions: The tape dimensions are as shown in Figure 2 and Table 2.
2.0 ± 0.1
+0.1
0.4 ± 0.05 φ1.5 −0
G
K0
φ1.6 ± 0.1
16.0 ± 0.3
E
F
D
(1)
(2)
Tape Specification
B
3.5
A
4.55 ± 0.2
Figure 2 Tape Forms
Table 2 Tape Dimension
Unit: mm
Unless otherwise specified: ±0.1
Symbol
Dimension
Remark
A
10.4
⎯
B
5.1
⎯
D
7.5
Center line of indented square hole and sprocket hole
E
1.75
F
12.0
G
4.0
Distance between tape edge and hole center
+0.1
Cumulative error −0.3 (max) per 10 feed holes
+0.1
Cumulative error −0.3 (max) per 10 feed holes
K0
4.1
Internal space
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2010-02-23
TLP700
3.6
Reel
(1)
(2)
Material: Plastic
Dimensions: The reel dimensions are as shown in Figure 3 and Table 3.
Table 3 Reel Dimension
Unit: mm
E
A
C
U
B
記
号
寸
法
A
φ380 ± 2
B
φ80 ± 1
C
φ13 ± 0.5
E
2.0 ± 0.5
U
4.0 ± 0.5
W1
17.5 ± 0.5
W2
21.5 ± 1.0
W1
W2
Figure 3 Reel Forms
4. Packing
Either one reel or five reels of photocouplers are packed in a shipping carton.
5. Label Indication
The carton bears a label indicating the product number, the symbol representing classification of
standard, the quantity, the lot number and the Toshiba company name.
6. Ordering Method
When placing an order, please specify the product number, the CTR rank, the tape type and the quantity
as shown in the following example.
(Example) TLP700 (TP, F) 1500 pcs
Quantity (must be a multiple of 1500)
[[G]]/RoHS COMPATIBLE (Note 11)
Tape type
Device name
Note 11 :Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS
compatibility of Product.
RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the
restriction of the use of certain hazardous substances in electrical and electronics equipment.
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2010-02-23
TLP700
EN60747-5-2 Option:(D4)
Attachment
: Specifications for EN60747-5-2 option: (D4)
Types
: TLP700, TLP700F
Type designations for “option: (D4)”, which are tested under EN60747 requirements.
Ex.: TLP700 (D4-TP,F)
D4 : EN60747 option
TP : Standard tape & reel type
F : [[G]]/RoHS COMPATIBLE (Note 11)
Note: Use TOSHIBA standard type number for safety standard application.
Ex.: TLP700 (D4-TP,F) → TLP700
EN60747 Isolation Characteristics
Description
Symbol
Rating
Unit
Application classification
Climatic classification
Pollution degree
TLPxxx type
Maximum operating insulation voltage
VIORM
TLPxxxFtype
Input to output test voltage, method A
Vpr=1.5×VIORM, type and sample test
tp=10s, partial discharge<5pC
40/ 100 / 21
—
2
—
890
Vpk
1140
TLPxxx type
1335
Vpr
TLPxxxFtype
Vpk
1710
TLPxxx type
Input to output test voltage, method B
Vpr=1.875×VIORM, 100% production test
tp=1s, partial discharge<5pC
1670
Vpr
TLPxxxFtype
Highest permissible overvoltage
(transient overvoltage, tpr = 60s)
Safety limiting values (max. permissible ratings in case of
fault, also refer to thermal derating curve)
current (input current IF, Psi = 0)
power (output or total power dissipation)
temperature
Insulation resistance,
—
I-IV
I-III
for rated mains voltage≤300Vrms
for rated mains voltage≤600Vrms
VIO =500V, Ta=25°C
VIO =500V, Ta=100°C
VIO =500V, Ta=Tsi
Vpk
2140
VTR
8000
Vpk
Isi
Psi
Tsi
300
700
150
mA
mW
℃
Rsi
≥ 10
≥ 1011
≥ 109
12
14
Ω
2010-02-23
TLP700
Insulation Related Specifications
7.62mm pitch
TLPxxx type
10.16mm pitch
TLPxxxF type
Minimum creepage distance
Cr
7.0mm
8.0mm
Minimum clearance
Cl
7.0mm
8.0mm
Minimum insulation thickness
ti
0.4mm
CTI
175
Comperative tracking index
1．If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this
value. (e.g.at a standard distance between soldering eye centres of 7.5mm). If this is not permissible,
the user shall take suitable measures.
2．This photocoupler is suitable for ‘safe electrical isolation’ only within the safety limit data.
Maintenance of the safety data shall be ensured by means of protective circuits.
Marking on product for EN60747 ：
4
Marking Example：
6
4
Lot.Code
P700
Type name without “TL”
4
Mark for option(D4)
1
3
1pin indication
15
2010-02-23
TLP700
Figure
1 Partial discharge measurement procedure according to EN60747
Destructive test for qualification and sampling tests.
Method A
(for type and sampling tests,
destructive tests)
t 1, t 2
t 3, t 4
tp(Measuring time for
partial discharge)
tb
tini
Figure
VINITIAL(8kV)
V
Vpr(1335V for TLPxxx)
(1710V for TLPxxxF)
= 1 to 10 s
=1s
VIORM(890V for TLPxxx)
(1140V for TLPxxxF)
= 10 s
= 12 s
= 60 s
0
t1
tini
t3
tP
t2
tb
2 Partial discharge measurement procedure according to EN60747
Non-destructive test for100% inspection.
Method B
t 3, t 4
tp(Measuring time for
partial discharge)
tb
Vpr(1670V for TLPxxx)
(2140V for TLPxxxF)
V
(for sample test,nondestructive test)
VIORM(890V for TLPxxx)
(1140V for TLPxxxF)
= 0.1 s
=1s
= 1.2 s
Isi
(mA)
t
tP
t3
Figure
t
t4
tb
t4
3 Dependency of maximum safety ratings on ambient temperature
500
1000
400
800
300
600
400
200
←
100
0
Psi
(mW)
0
25
50
Psi →
Isi
75
100
125
200
150
0
175
Ta (°C)
16
2010-02-23
TLP700
RESTRICTIONS ON PRODUCT USE
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in this document, and related hardware, software and systems (collectively “Product”) without notice.
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responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
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all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
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17
2010-02-23