TOSHIBA CLH01

CLH01
TOSHIBA High-Efficiency Rectifier
Silicon Epitaxial Type
CLH01
○ Switching Mode Power Supply Applications
•
Unit: mm
②
Forward voltage: VFM = 0.98 V (Max.)
•
Average forward current: IF (AV) = 3 A
•
Repetitive peak reverse voltage: VRRM = 200 V
•
Surface-mount package
L−FLAT” (Toshiba package name)
Absolute Maximum Ratings (Ta = 25°C)
Symbol
Rating
Unit
Repetitive peak reverse voltage
VRRM
200
V
Average forward current
IF(AV)
3 (Note 1)
A
Peak one cycle surge forward current
(non-repetitive)
IFSM
60 (50 Hz)
A
①ANODE
① アノード
Tj
−40~150
°C
②CATHODE
Tstg
−40~150
°C
Junction temperature
Storage temperature range
Note 1: Tℓ = 132°C
Rectangular waveform : (α = 180°)
3 .2±0.2
Characteristics
①
② カソード
JEDEC
⎯
JEITA
⎯
TOSHIBA
3-4F1A
Note 2: Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in
Weight: 0.15 g (typ.)
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are
within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
VFM (1)
IFM = 0.7 A (pulse test)
⎯
0.76
⎯
VFM (2)
IFM = 1.0A (pulse test)
⎯
0.78
⎯
VFM (3)
IFM = 3.0 A (pulse test)
⎯
0.88
0.98
IRRM
VRRM = 200V (pulse test)
⎯
⎯
10
μA
Reverse recovery time
trr
IF = 2A, di/dt = − 50 A/μs
⎯
⎯
35
ns
Forward recovery time
tfr
IF = 1.0 A
⎯
⎯
100
ns
Device mounted on a glass-epoxy
board (board size:50mm x 50mm)
(board thickness:1.6t)
(soldering land)
Cathode:5.7mm x 6.2mm
Anode :4.5mm x 3.4mm
⎯
⎯
100
°C/W
⎯
⎯
5
°C/W
Peak forward voltage
Repetitive peak reverse current
Themal resistance
(junction to ambient)
Rth (j-a)
Themal resistance
(junction to lead)
Rth (j-ℓ)
⎯
1
V
2006-11-08
CLH01
Marking
Abbreviation Code
H01
Part No.
CLH01
Standard Soldering Pad
Unit: mm
2.9
2.5
5.9
1.8
2.6
4.8
Handling Precautions
1)
The absolute maximum rating denotes the absolute maximum ratings, which are rated values that must not
be exceeded during operation, even for an instant. The following are the general derating methods that we
recommend for designing a circuit incorporating this device:
VRRM: Use this rating with reference to (1) above. The VRRM has a temperature coefficient of 0.1%/°C.
Take this temperature coefficient into account when designing a device at low temperature.
IF (AV): We recommend that the worst case current be no greater than 80% of the absolute maximum
rating of IF(AV) and that Tj be below 120°C.When using this device, take the margin into
consideration by using an allowable Ta (max)-IF (AV) curve.
IFSM: This rating specifies the non-repetitive peak current. This applies to abnormal operation only. When using
a device, design a circuit board and a soldering land size to match the appropriate thermal
resistance value.
IFSM: This rating specifies the non-repetitive peak current. This applies to abnormal operation only, When using
the device, design the circuit board and the soldering land size to match the appropriate thermal
resistance value.
Tj:
Derate this rating when using the device to ensure high reliability. We recommend that the device be
used at a Tj of below 120°C.
2)
The thermal resistance between junction and ambient varies depending on the mounting condition of the
device. When using the device, design the circuit board and the soldering land size to match the appropriate
thermal resistance value.
3) See the Rectifiers databook for further information information.
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2006-11-08
CLH01
PF (AV) – IF (AV)
iF – vF
4.0
Tj = 150°C
10
Instantaneous forward current
Average forward power dissipation
PF (AV) (W)
iF (A)
100
75°C
1
25°C
0.1
Pulse test
0.01
0.0
0.2
0.6
0.4
0.8
1.0
1.2
Instantaneous forward voltage
1.4
vF
DC
3.0
α = 60°
2.0
0° α
0
1
2
Maximum allowable ambient temperature
Ta max (°C)
180°
DC
Rectangular
waveform
60
40
0° α 360°
20
0
α
Conduction angle
0
1
2
3
Average forward current
IF (AV)
5
(A)
4
IF (AV)
5
140
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(board thickness:1.6 t
(soldering land)
Cathode 5.7 mm × 6.2 mm
Anode 4.5 mm × 3.4 mm
120
100
80
α = 60°
120°
60
Rectangular
waveform
180°
DC
40
0° α 360°
20
0
α
Conduction angle
0
(A)
1
2
3
Average forward current
4
IF (AV)
5
(A)
rth (j-a) – t
1000
500
300
Transient thermal impedance
rth (j-a) (°C/W)
Maximum allowable lead temperature
Tℓ max (°C)
120
80
4
Ta max – IF (AV)
140
120°
3
Average forward current
Tℓ max – IF (AV)
α = 60°
360°
α
Conduction angle
(V)
160
100
Rectangular
waveform
1.0
0.0
1.6
180°
120°
100
50
30
10
5
3
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(board thickness:1.6 t
(soldering land)
Cathode 5.7 mm × 6.2 mm
Anode 4.5 mm × 3.4 mm
1
0.5
0.3
0.1
0.001
0.003
0.01
0.03
0.1
0.3
Time
1
3
t
3
10
30
100
300
1000
(s)
2006-11-08
CLH01
Surge forward current
Cj – V R
(Typ.)
(non-repetitive)
1000
80
f = 1 MHz
(pF)
100
Peak surge forward current
Cj
Junction capacitance
IFSM (A)
Ta = 25°C
10
1
1
3
5
10
Reverse voltage
30
50
100
Ta = 25°C
f = 50 Hz
60
40
20
0
VR (V)
1
3
5
10
30
100
Number of cycles
4
2006-11-08
CLH01
RESTRICTIONS ON PRODUCT USE
20070701-EN
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
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2006-11-08