CRS08 TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type CRS08 Switching Mode Power Supply Applications Portable Equipment Battery Applications Unit: mm · Forward voltage: VFM = 0.36 V (max) · Average forward current: IF (AV) = 1.5 A · Repetitive peak reverse voltage: VRRM = 30 V · Suitable for compact assembly due to small surface-mount package “S−FLATTM” (Toshiba package name) Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Repetitive peak reverse voltage VRRM 30 V Average forward current IF (AV) Peak one cycle surge forward current (non-repetitive) 1.5 (Note) A IFSM 30 (50 Hz) A JEDEC ― Junction temperature Tj -40~125 °C JEITA ― Storage temperature Tstg -40~150 °C TOSHIBA 3-2A1A Weight: 0.013 g (typ.) Note: Tℓ = 86°C: Rectangular waveform (a = 180°C), VR = 15 V Electrical Characteristics (Ta = 25°C) Characteristics Peak forward voltage Repetitive peak reverse current Junction capacitance Thermal resistance (junction to ambient) Thermal resistance (junction to lead) Symbol Test Condition Min Typ. Max Unit VFM (1) IFM = 0.1 A ¾ 0.23 ¾ VFM (2) IFM = 1.0 A ¾ 0.32 ¾ VFM (3) IFM = 1.5 A ¾ 0.345 0.36 IRRM (1) VRRM = 5 V ¾ 50 ¾ mA IRRM (2) VRRM = 30 V ¾ ¾ 1.0 mA VR = 10 V, f = 1.0 MHz ¾ 90 ¾ pF Device mounted on a ceramic board (soldering land: 2 mm ´ 2 mm) ¾ ¾ 70 Device mounted on a glass-epoxy board (soldering land: 6 mm ´ 6 mm) ¾ ¾ 140 ¾ ¾ 20 Cj Rth (j-a) ¾ Rth (j-ℓ) 1 V °C/W °C/W 2003-02-17 CRS08 Marking Following Indicates the Date of Manufacture Type Code 0 1 2 3 4 5 6 7 8 9 Lot No. S8 Cathode mark Month of manufacture January to December are denoted by letter A to L respectively. Year of manufacture Last decimal digit of the year of manufacture Standard Soldering Pad Unit: mm 1.2 1.2 2.8 Handling Precaution Schottky barrier diodes are having large-reverse-current-leakage characteristic compare to the other rectifier products. This current leakage and improper operating temperature or voltage may cause thermal runaway. Please take forward and reverse loss into consideration when you design. 2 2003-02-17 CRS08 iF – vF PF (AV) – IF (AV) 10 0.7 Average forward power dissipation PF (AV) (W) Instantaneous forward current iF (A) DC 3 Tj = 125°C 1 75°C 0.3 25°C 0.1 0.03 0.01 0 0.1 0.2 0.3 0.4 0.5 Instantaneous forward voltage 0.6 0.7 vF (V) 0.6 180° 0.5 0.4 0.3 a = 60° Rectangular waveform 0.2 0° a 360° 0.1 0 0 0.8 120° Conduction angle a 0.4 0.8 Average forward current 10000 120 Transient thermal impedance rth (j-a) (°C/W) Maximum allowable lead temperature Tℓ MAX (°C) 30000 DC 100 180° a = 60° 60 120° Rectangular waveform 40 20 aa 360° 0° a IF (AV) Conduction angle a VR = 15 V 0 0.4 0.8 1.2 Average forward current 1.6 2.0 IF (AV) (A) Cj – VR ① 10 10 100 1000 50 30 Reverse voltage VR 50 100000 Ta = 25°C (A) Peak surge forward current IFSM 100 30 10000 40 Cj (pF) ② 100 Surge forward current (non-repetitive) 300 10 (A) Time t (ms) Ta = 25°C Junction capacitance 1000 1 1 2.4 500 5 IF (AV) 2.4 ② Device mounted on a glass-epoxy board Soldering land: 6 mm ´ 6 mm f = 1 MHz 3 2.0 ① Device mounted on a ceramic board Soldering land: 2 mm ´ 2 mm (typ.) 1000 10 1 1.6 rth (j-a) – t Tℓ max – IF (AV) 140 80 1.2 f = 50 Hz 30 20 10 0 1 100 (V) 3 5 10 30 50 100 Number of cycles 3 2003-02-17 CRS08 I R – Tj (typ.) PR (AV) – VR 1000 4.8 Average reverse power dissipation PR (AV) (W) Reverse current IR (mA) Pulse test 100 VR = 30 V 10 20 V 10 V 1 5V 3V 0.1 0.01 0 20 40 60 80 Junction temperature Tj 100 120 4.0 VR 3.2 Conduction angle a Tj = 125°C DC 300° 2.4 240° 180° 1.6 120° 60° 0.8 0 140 0° 0 4 8 12 16 20 Reverse voltage VR (°C) 4 (typ.) Rectangular waveform 360° 24 28 (V) 2003-02-17 CRS08 RESTRICTIONS ON PRODUCT USE 000707EAA · TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. · The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. · The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. · The information contained herein is subject to change without notice. 5 2003-02-17