400 MHz to 2700 MHz RF Driver Amplifier ADL5320 Operation: 400 MHz to 2700 MHz Gain of 17 dB at 880 MHz OIP3 of 45 dBm at 880 MHz P1dB of 25.4 dBm at 880 MHz Noise figure: 4 dB at 880 MHz Power supply: 5 V Power supply current: 104 mA typical Internal active biasing Thermally efficient SOT-89 package ESD rating of ±4 kV (Class 3A) FUNCTIONAL BLOCK DIAGRAM GND (2) ADL5320 BIAS 1 2 3 RFIN GND RFOUT 05840-001 FEATURES Figure 1. GENERAL DESCRIPTION The ADL5320 is a broadband, linear driver RF amplifier that operates at frequencies from 400 MHz to 2700 MHz. The device can be used in a wide variety of wired and wireless applications, including ISM, WLL, PCS, GSM, CDMA, and W-CDMA. The ADL5320 is fabricated on a GaAs HBT process. The device is packaged in a low cost SOT-89 that uses an exposed paddle for excellent thermal impedance. It operates from −40°C to +85°C, and a fully populated evaluation board is available. The ADL5320 operates with a 5 V supply voltage and a supply current of 104 mA. Rev. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062−9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2008 Analog Devices, Inc. All rights reserved. ADL5320 TABLE OF CONTENTS Features .............................................................................................. 1 Typical Performance Characteristics ..............................................7 Functional Block Diagram .............................................................. 1 Basic Layout Connections ............................................................. 11 General Description ......................................................................... 1 Revision History ............................................................................... 2 Soldering Information and Recommended PCB Land Pattern .......................................................................................... 11 Specifications..................................................................................... 3 Matching Procedure................................................................... 12 Typical Scattering Parameters ..................................................... 4 W-CDMA ACPR Performance ................................................ 13 Absolute Maximum Ratings............................................................ 5 Evaluation Board ............................................................................ 14 ESD Caution .................................................................................. 5 Outline Dimensions ....................................................................... 16 Pin Configuration and Function Descriptions ............................. 6 Ordering Guide .......................................................................... 16 REVISION HISTORY 2/08—Revision 0: Initial Version Rev. 0 | Page 2 of 16 ADL5320 SPECIFICATIONS VSUP = 5 V and TA = 25°C, unless otherwise noted. Table 1. Parameter OVERALL FUNCTION Frequency Range FREQUENCY = 880 MHz Gain 1 vs. Frequency vs. Temperature vs. Supply Output 1 dB Compression Point Output Third-Order Intercept Noise Figure FREQUENCY = 2140 MHz Gain1 vs. Frequency vs. Temperature vs. Supply Output 1 dB Compression Point Output Third-Order Intercept Noise Figure FREQUENCY = 2600 MHz Gain1 vs. Frequency vs. Temperature vs. Supply Output 1 dB Compression Point Output Third-Order Intercept Noise Figure POWER INTERFACE Supply Voltage Supply Current vs. Temperature Power Dissipation 1 Conditions Min Typ 400 Max Unit 2700 MHz 16.3 16.9 ±0.3 ±0.6 ±0.1 25.4 45 4.1 17.5 dB dB dB dB dBm dBm dB 12.4 13.2 ±0.33 ±0.8 ±0.06 25.7 42 4.4 14.0 dB dB dB dB dBm dBm dB 11.5 12.5 ±0.6 ±1.1 ±0.1 27.4 37 5.1 13.4 dB dB dB dB dBm dBm dB 4.5 5 104 ±6.0 520 5.5 124 V mA mA mW ±50 MHz −40°C ≤ TA ≤ +85°C 4.75 V to 5.25 V ∆f = 1 MHz, POUT = 10 dBm per tone ±50 MHz −40°C ≤ TA ≤ +85°C 4.75 V to 5.25 V ∆f = 1 MHz, POUT = 10 dBm per tone ±100 MHz −40°C ≤ TA ≤ +85°C 4.75 V to 5.25 V ∆f = 1 MHz, POUT = 10 dBm per tone Pin RFOUT −40°C ≤ TA ≤ +85°C VSUP = 5 V Guaranteed maximum and minimum specified limits on this parameter are based on 6 sigma calculations. Rev. 0 | Page 3 of 16 ADL5320 TYPICAL SCATTERING PARAMETERS VSUP = 5 V and TA = 25°C; the effects of the test fixture have been de-embedded up to the pins of the device. Table 2. Freq (MHz) 400 500 550 600 650 700 750 800 850 900 950 1000 1050 1100 1150 1200 1250 1300 1350 1400 1450 1500 1550 1600 1650 1700 1750 1800 1850 1900 1950 2000 2050 2100 2150 2200 2250 2300 2350 2400 2450 2500 2550 2600 2650 2700 S11 Magnitude (dB) −1.51 −1.38 −1.42 −1.46 −1.46 −1.50 −1.56 −1.61 −1.66 −1.72 −1.85 −1.92 −2.02 −2.20 −2.41 −2.62 −2.87 −3.16 −3.65 −4.09 −4.59 −5.28 −6.09 −6.98 −8.06 −9.38 −11.15 −13.20 −15.83 −19.87 −24.51 −22.66 −18.02 −14.34 −12.10 −10.23 −8.65 −7.90 −6.66 −6.35 −5.77 −5.51 −5.35 −5.15 −5.22 −5.06 Angle (°) 164.18 155.33 151.34 147.66 144.12 140.66 137.19 133.97 130.74 127.65 124.15 120.90 117.54 114.21 110.72 107.22 103.77 99.97 96.51 92.23 88.76 84.62 80.71 77.02 72.69 68.92 66.21 63.18 63.73 71.29 103.69 156.61 171.65 174.52 172.15 166.81 160.58 153.80 145.88 138.01 128.87 118.44 112.21 99.40 92.84 82.21 S21 Magnitude (dB) 14.18 14.03 13.79 13.72 13.53 13.45 13.21 13.29 13.04 13.03 12.92 12.93 12.92 12.76 12.97 12.69 12.98 12.87 12.94 12.87 13.04 13.00 12.89 13.13 13.07 13.00 12.97 13.18 13.03 12.84 13.08 12.86 12.88 12.63 12.45 12.65 11.82 11.84 11.55 10.97 10.36 9.65 9.46 7.99 7.70 6.61 Angle (°) +128.37 +118.16 +112.76 +108.71 +104.05 +98.89 +95.44 +90.33 +86.67 +81.59 +77.91 +73.13 +68.80 +64.12 +59.95 +54.62 +50.95 +44.96 +40.47 +35.36 +30.47 +24.40 +19.39 +14.80 +7.27 +2.17 −3.27 −9.57 −17.27 −22.35 −29.10 −36.58 −43.14 −51.83 −55.83 −67.28 −73.99 −79.82 −91.28 −96.39 −108.43 −110.92 −122.10 −130.39 −132.72 −143.64 Rev. 0 | Page 4 of 16 S12 Magnitude (dB) −32.37 −31.75 −31.68 −31.46 −31.56 −31.13 −31.12 −31.00 −30.60 −30.72 −30.31 −30.22 −29.98 −29.80 −29.39 −29.46 −29.03 −28.75 −28.81 −28.26 −28.43 −28.13 −27.96 −27.98 −27.73 −27.49 −27.78 −27.23 −27.36 −27.40 −27.26 −27.33 −27.33 −27.54 −27.77 −27.74 −28.34 −28.62 −28.92 −29.75 −30.13 −30.41 −32.29 −31.60 −33.19 −33.61 Angle (°) +6.77 +1.48 −3.93 −4.60 −6.81 −9.87 −11.14 −13.96 −14.90 −17.78 −20.23 −22.21 −24.19 −28.18 −29.56 −33.00 −37.13 −38.18 −44.64 −46.78 −49.56 −56.47 −59.31 −62.71 −69.93 −73.80 −77.79 −85.28 −89.22 −96.30 −102.96 −109.25 −117.37 −124.60 −132.56 −141.32 −149.30 −161.50 −165.89 +179.97 +170.82 +163.00 +152.20 +138.60 +135.12 +120.22 S22 Magnitude (dB) −3.44 −3.70 −3.79 −3.83 −3.90 −3.99 −4.02 −4.07 −4.12 −4.21 −4.25 −4.27 −4.32 −4.37 −4.43 −4.42 −4.47 −4.44 −4.45 −4.40 −4.37 −4.29 −4.20 −4.05 −3.88 −3.71 −3.59 −3.29 −3.11 −2.93 −2.69 −2.54 −2.50 −2.35 −2.44 −2.42 −2.43 −2.74 −2.62 −2.94 −3.03 −3.24 −3.41 −3.55 −3.80 −3.93 Angle (°) 160.94 156.73 154.66 152.89 151.08 149.38 147.87 146.36 144.94 143.60 142.41 141.31 140.51 139.63 138.68 138.09 137.74 137.08 136.77 136.49 136.43 135.79 135.63 135.39 134.43 133.76 132.94 131.04 129.62 127.46 124.63 122.53 118.78 115.97 112.52 108.19 104.65 100.98 96.52 92.52 88.07 83.25 79.98 73.08 69.85 63.87 ADL5320 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Supply Voltage, VSUP Input Power (50 Ω Impedance) Internal Power Dissipation (Paddle Soldered) θJC (Junction to Paddle) Maximum Junction Temperature Operating Temperature Range Storage Temperature Range Rating 6.5 V 20 dBm 683 mW 28.5°C/W 150°C −40°C to +85°C −65°C to +150°C ESD CAUTION Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. 0 | Page 5 of 16 ADL5320 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS RFIN 1 ADL5320 TOP VIEW (2) GND (Not to Scale) RFOUT 3 05840-002 GND 2 Figure 2. Pin Configuration Table 4. Pin Function Descriptions Pin No. 1 2 3 Exposed Paddle Mnemonic RFIN GND RFOUT Description RF Input. Requires a dc blocking capacitor. Ground. Connect to a low impedance ground plane. RF Output and Supply Voltage. DC bias is provided to this pin through an inductor that is connected to the external power supply. RF path requires a dc blocking capacitor. Expose Paddle. Internally connected to GND. Solder to a low impedance ground plane. Rev. 0 | Page 6 of 16 ADL5320 TYPICAL PERFORMANCE CHARACTERISTICS 50 50 OIP3 (–40°C) 35 OIP3 (+85°C) 40 OIP3 (dBm) 30 P1dB 25 20 15 35 27 26 P1dB (–40°C) 10 P1dB (+85°C) 25 840 05840-003 NF 820 28 30 GAIN 5 860 880 900 FREQUENCY (MHz) 920 940 25 P1dB (+25°C) 20 800 960 Figure 3. Gain, P1dB, OIP3, and Noise Figure vs. Frequency, 800 MHz to 960 MHz 820 840 860 880 900 FREQUENCY (MHz) 920 940 24 960 Figure 6. OIP3 and P1dB vs. Frequency and Temperature, 800 MHz to 960 MHz 19.0 50 930MHz 18.5 18.0 880MHz 46 –40°C 17.5 +25°C 17.0 OIP3 (dBm) GAIN (dB) 29 OIP3 (+25°C) P1dB (dBm) 45 40 05840-006 GAIN, NF (dB); P1dB, OIP3 (dBm) 45 0 800 30 OIP3 (10dBm) +85°C 16.5 16.0 42 960MHz 850MHz 830MHz 38 15.5 15.0 14.5 820 860 880 900 FREQUENCY (MHz) 920 940 30 –2 960 0 2 4 6 8 10 12 14 16 18 20 22 POUT (dBm) Figure 4. Gain vs. Frequency and Temperature, 800 MHz to 960 MHz Figure 7. OIP3 vs. POUT and Frequency, 800 MHz to 960 MHz –25.0 7.0 0 6.0 –10 –26.5 –15 –27.0 –20 S12 –27.5 –25 S11 –28.5 800 850 900 FREQUENCY (MHz) 950 4.5 +25°C 3.5 –30 –40°C 3.0 –35 750 +85°C 5.0 4.0 2.5 05840-005 –29.0 700 5.5 NF (dB) –26.0 –28.0 6.5 –5 S22 S11 (dB) AND S22 (dB) –25.5 S12 (dB) 840 –40 1000 Figure 5. Input Return Loss (S11), Output Return Loss (S22), and Reverse Isolation (S12) vs. Frequency, 800 MHz to 960 MHz 2.0 700 750 800 850 900 FREQUENCY (MHz) 950 1000 05840-008 14.0 800 05870-007 05840-004 34 Figure 8. Noise Figure vs. Frequency and Temperature, 800 MHz to 960 MHz Rev. 0 | Page 7 of 16 ADL5320 28.0 41 30 OIP3 (dBM) P1dB 25 20 15 GAIN 10 OIP3 (+85°C) P1dB (–40°C) 2100 26.5 35 26.0 33 NF 2080 27.5 27.0 37 25.5 P1dB (+25°C) 31 5 OIP3 (+25°C) 39 2120 2140 2160 FREQUENCY (MHz) 2180 2200 2220 P1dB (dBm) 35 28.5 OIP3 (–40°C) 43 25.0 P1dB (+85°C) 29 2060 2080 2100 2120 2140 2160 FREQUENCY (MHz) 2180 2200 24.5 2220 Figure 9. Gain, P1dB, OIP3, and Noise Figure vs. Frequency, 2060 MHz to 2200 MHz Figure 12. OIP3 and P1dB vs. Frequency and Temperature, 2060 MHz to 2200 MHz 16 43 15 41 05840-012 OIP3 (10dBm) 05840-009 GAIN, NF (dB); P1dB, OIP3 (dBm) 40 0 2060 29.0 45 45 2190MHz 2140MHz 2060MHz 2090MHz –40°C 39 +25°C 13 +85°C 35 11 33 2100 2120 2140 2160 FREQUENCY (MHz) 2180 2200 2220 31 –2 –23 8 10 12 14 16 18 20 22 7.5 –15 S11 –26 –20 S12 –25 –27 6.5 6.0 NF (dB) –25 7.0 S11 (dB) AND S22 (dB) –10 S22 –28 2250 +25°C 4.5 4.0 –40°C 2.5 05840-011 2200 5.0 3.0 –35 –40 2300 +85°C 5.5 3.5 –30 2050 2100 2150 FREQUENCY (MHz) 6 8.0 –5 –24 2000 4 Figure 13. OIP3 vs. POUT and Frequency, 2060 MHz to 2200 MHz 0 1950 2 POUT (dBm) Figure 10. Gain vs. Frequency and Temperature, 2060 MHz to 2200 MHz –29 1900 0 Figure 11. Input Return Loss (S11), Output Return Loss (S22), and Reverse Isolation (S12) vs. Frequency, 2060 MHz to 2200 MHz Rev. 0 | Page 8 of 16 2.0 1900 1950 2000 2050 2100 2150 FREQUENCY (MHz) 2200 2250 Figure 14. Noise Figure vs. Frequency and Temperature, 2060 MHz to 2200 MHz 2300 05840-014 2080 05840-010 12 10 2060 S12 (dB) 2220MHz 37 05870-013 OIP3 (dBm) GAIN (dB) 14 ADL5320 39 OIP3 (–40°C) 31 37 OIP3 (+25°C) 35 OIP3 (dBm) 25 20 15 29 34 P1dB (–40°C) 28 33 P1dB (+25°C) 32 GAIN 10 27 31 5 30 OIP3 (+85°C) 36 P1dB NF 0 2500 2520 2540 2560 2580 2600 2620 2640 2660 2680 2700 P1dB (+85°C) 26 30 29 2500 2550 2600 FREQUENCY (MHz) FREQUENCY (MHz) Figure 15. Gain, P1dB, OIP3, and Noise Figure vs. Frequency, 2500 MHz to 2700 MHz P1dB (dBm) 30 05840-015 GAIN, NF (dB); P1dB, OIP3 (dBm) 38 OIP3 (10dBm) 35 32 05840-018 40 25 2700 2650 Figure 18. OIP3 and P1dB vs. Frequency and Temperature, 2500 MHz to 2700 MHz 15 46 44 14 –40°C 42 +25°C 40 12 OIP3 (dBm) GAIN (dB) 13 +85°C 2600MHz 2700MHz 38 36 11 2500MHz 34 10 2550 2600 FREQUENCY (MHz) 2650 2700 30 –3 Figure 16. Gain vs. Frequency and Temperature, 2500 MHz to 2700 MHz –25.5 S11 –27.5 –20 S12 –28.0 –25 –28.5 15 17 19 21 23 +85°C 6.0 –30 –29.0 5.5 +25°C 5.0 4.5 –40°C 4.0 3.5 2500 2550 2600 2650 FREQUENCY (MHz) 2700 2750 2.5 05840-017 2450 –40 2800 Figure 17. Input Return Loss (S11), Output Return Loss (S22), and Reverse Isolation (S12) vs. Frequency, 2500 MHz to 2700 MHz Rev. 0 | Page 9 of 16 2.0 2400 2450 2500 2550 2600 2650 FREQUENCY (MHz) 2700 2750 2800 Figure 20. Noise Figure vs. Frequency and Temperature, 2500 MHz to 2700 MHz 05840-020 3.0 –35 –29.5 –30.0 2400 9 11 13 POUT (dBm) 6.5 NF (dB) S12 (dB) –15 –27.0 7 7.0 S11 (dB) AND S22 (dB) S22 5 7.5 –26.0 –26.5 3 8.0 –5 –10 1 Figure 19. OIP3 vs. POUT and Frequency, 2500 MHz to 2700 MHz 0 –25.0 –1 05840-019 9 2500 05840-016 32 ADL5320 18 50 16 40 12 PERCENTAGE (%) 10 8 6 4 30 20 05840-021 0 42.0 42.8 43.6 44.4 45.2 46.0 46.8 0 47.6 05840-024 10 2 3.80 3.88 3.96 OIP3 (dBm) Figure 21. OIP3 Distribution at 880 MHz 5.25V SUPPLY CURRENT (mA) PERCENTAGE (%) 4.28 115 40 30 20 10 05840-022 24.4 24.8 25.2 25.6 26.0 26.4 25 20 15 10 05840-023 5 16.75 16.85 16.95 17.05 17.15 5.0V 100 95 4.75V 90 0 10 20 30 40 TEMPERATURE (°C) 50 60 70 80 Figure 25. Supply Current vs. Supply Voltage and Temperature (Using 880 MHz Matching Components) 30 16.65 105 80 –40 –30 –20 –10 26.8 Figure 22. P1dB Distribution at 880 MHz 110 85 P1dB (dBm) PERCENTAGE (%) 4.20 120 50 0 4.12 Figure 24. Noise Figure Distribution at 880 MHz 60 0 4.04 NF (dB) 05840-025 PERCENTAGE (%) 14 17.25 GAIN (dB) Figure 23. Gain Distribution at 880 MHz Rev. 0 | Page 10 of 16 ADL5320 BASIC LAYOUT CONNECTIONS The basic connections for operating the ADL5320 are shown in Figure 26. SOLDERING INFORMATION AND RECOMMENDED PCB LAND PATTERN Table 5 lists the required matching components. Capacitors C1, C2, C3, C4, and C7 are Murata GRM155 series (0402 size) and Inductor L1 is a Coilcraft 0603CS series (0603 size). For all frequency bands, the placement of C3 and C7 are critical. From 2300 MHz to 2700 MHz, the placement of C2 is also important. Table 6 lists the recommended component placement for various frequencies. Figure 27 shows the recommended land pattern for the ADL5320. To minimize thermal impedance, the exposed paddle on the SOT-89 package underside is soldered down to a ground plane along with Pin 2. If multiple ground layers exist, they should be stitched together using vias. For more information on land pattern design and layout, refer to the Application Note AN-772, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP). A 5 V dc bias is supplied through L1 which is connected to RFOUT (Pin 3). In addition to C4, 10 nF and 10 μF power supply decoupling capacitors are also required. The typical current consumption for the ADL5320 is 110 mA. GND 1.80mm VSUP (2) GND C6 10µF 3.48mm C5 10nF C41 5.56mm 0.20mm ADL5320 2 3 λ22 λ32 C31 1SEE 2SEE 1 λ42 C2 0.86mm RFOUT C71 0.62mm 1.27mm TABLE 5 FOR FREQUENCY SPECIFIC COMPONENTS. TABLE 10 FOR RECOMMENDED COMPONENT SPACING. 05840-027 1 05840-026 λ12 RFOUT C11 GND RFIN RFIN L11 1.50mm Figure 26. Basic Connections 3.00mm Figure 27. Recommended Land Pattern Table 5. Recommended Components for Basic Connections Frequency (MHz) 450 to 500 800 to 960 1805 to 1880 1930 to 1990 2110 to 2170 2300 to 2400 2500 to 2700 C1 (pF) 100 47 22 22 22 12 12 C2 (pF) 100 47 22 22 22 2.2 1.0 C3 (pF) 18 6.8 0.5 0.5 0.5 1.2 1.8 C4 (pF) 100 100 22 22 22 12 12 C7 (pF) 6.8 2.2 1.5 1.5 1.5 1.0 0.5 L1 (nH) 47 47 15 15 15 15 15 Table 6. Matching Component Spacing Frequency (MHz) 450 to 500 800 to 960 1805 to 2170 2300 to 2400 2500 to 2700 λ1 (mils) 391 200 300 225 142 λ2 (mils) 75 75 75 75 75 Rev. 0 | Page 11 of 16 λ3 (mils) 364 100 175 125 89 λ4 (mils) 50 350 275 125 75 ADL5320 The ADL5320 is designed to achieve excellent gain and IP3 performance. To achieve this, both input and output matching networks must present specific impedance to the device. The matching components listed in Table 6 were chosen to provide −10 dB input return loss while maximizing OIP3. The load-pull plots (Figure 28, Figure 29, and Figure 30) show the load impedance points on the Smith chart where optimum OIP3, gain, and output power can be achieved. These load impedance values (that is, the impedance that the device sees when looking into the output matching network) are listed in Table 7 and Table 8 for maximum gain and maximum OIP3, respectively. The contours show how each parameter degrades as it is moved away from the optimum point. From the data shown in Table 7 and Table 8 it becomes clear that maximum gain and maximum OIP3 do not occur at the same impedance. This can also be seen on the load-pull contours in Figure 28 through Figure 30. Thus, output matching generally involves compromising between gain and OIP3. In addition, the load-pull plots demonstrate that the quality of the output impedance match must be compromised to optimize gain and/or OIP3. In most applications where line lengths are short and where the next device in the signal chain presents a low input return loss, compromising on the output match is acceptable. 05840-028 MATCHING PROCEDURE Figure 28. Load-Pull Contours, 880 MHz 05840-029 To adjust the output match for operation at a different frequency or if a different trade-off between OIP3, gain, and output impedance is desired, the following procedure is recommended. 1. Install the recommended tuning components for a 800 MHz to 960 MHz tuning band, but do not install C3 and C7. 2. Connect the evaluation board to a vector network analyzer so that input and output return loss can be viewed simultaneously. 3. Starting with the recommended values and positions for C3 and C7, adjust the positions of these capacitors along the transmission line until the return loss and gain are acceptable. Push-down capacitors that are mounted on small sticks can be used in this case as an alternative to soldering. If moving the component positions does not yield satisfactory results, then the values of C3 and C7 should be increased or decreased (most likely increased in this case as the user is tuning for a lower frequency). Repeat the process. 4. Once the desired gain and return loss are realized, OIP3 should be measured. Most likely, it will be necessary to go back and forth between return loss/gain and OIP3 measurements (probably compromising most on output return loss) until an acceptable compromise is achieved. Rev. 0 | Page 12 of 16 Figure 29. Load-Pull Contours, 2140 MHz 05840-030 For example, to optimize the ADL5320 for optimum OIP3 and gain at 700 MHz use the following steps: Figure 30. Load-Pull Contours, 2600 MHz ADL5320 ΓLoad (Magnitude) 0.5147 0.6611 0.5835 ΓLoad (°) 159.88 134.40 133.80 Gain MAX (dB) 17.76 13.78 12.36 Table 8. Load Conditions for IP3 MAX Frequency (MHz) 880 2140 2600 ΓLoad (Magnitude) 0.4156 0.5035 0.4595 ΓLoad (°) −138.22 +110.27 +102.48 IP3 MAX (dBm) 46.29 42.72 43.01 W-CDMA ACPR PERFORMANCE Figure 31 shows a plot of adjacent channel power ratio (ACPR) vs. POUT for the ADL5320. The signal type being used is a single W-CDMA carrier (Test Model 1−64) at 2140 MHz. This signal is generated by a very low ACPR source. ACPR is measured at the output by a high dynamic range spectrum analyzer, which incorporates an instrument noise correction function. –30 –40 –50 –60 –70 –80 –90 –20 –15 –10 –5 0 5 POUT (dBm) 10 15 20 05840-031 Frequency (MHz) 880 2140 2600 The ADL5320 achieves an ACPR of −82 dBc at 0 dBm output, at which point device noise and not distortion is beginning to dominate the power in the adjacent channels. At an output power of 10 dBm, ACPR is still very low at −70 dBc making the device particularly suitable for PA driver applications. ACPR @ 5MHz CARRIER OFFSET (dBc) Table 7. Load Conditions for Gain MAX Figure 31. ACPR vs. POUT, Single Carrier W-CDMA (Test Model 1−64) at 2140 MHz Evaluation Board Rev. 0 | Page 13 of 16 ADL5320 EVALUATION BOARD The schematic of the ADL5320 evaluation board is shown in Figure 32. This evaluation board uses 25 mil wide traces and is made from FR4 material. The evaluation board comes tuned for operation in the 1805 MHz to 2140 MHz tuning band. Tuning options for other frequency bands are also provided in Table 9. The recommended placement for these components is provided in Table 10. The inputs and outputs should be ac-coupled with appropriately sized capacitors. DC bias is provided to the amplifier via an inductor connected to the RFOUT pin. A bias voltage of 5 V is recommended. GND 10uF 10nF 22pF C1 22pF 15nH C3 0.5pF C2 22pF C7 1.5pF VSUP (2) GND C6 10µF C5 10nF 05840-033 C4 22pF C3 0.5pF L1 15nH 3 λ2 λ3 λ4 C2 22pF RFOUT Figure 33. Evaluation Board Layout and Default Component Placement for Operation from 1805 MHz to 2170 MHz 05840-032 2 RFOUT λ1 1 GND RFIN C1 22pF RFIN ADL5320 C7 1.5pF Figure 32. Evaluation Board, 1805 MHz to 2170 MHz Table 9. Evaluation Board Configuration Options Component C1, C2 C4, C5, C6 L1 C3, C7 R1 VSUP, GND Function AC coupling capacitors Power supply bypassing capacitors DC bias inductor Tuning capacitors Power supply connections 450 MHz to 500 MHz 0402, 100 pF 800 MHz to 960 MHz 0402, 47 pF 1805 MHz to 2170 MHz (Default Configuration) 0402, 22pF C4 = 0603 100 pF C5 = 0603 10 nF C6 = 1206 10 μF 0603, 47 nH C4 = 0603 100 pF C5 = 0603 10 nF C6 = 1206 10 μF 0603, 47 nH C4 = 0402 22pF C5 = 0603 10 nF C6 = 1206 10 μF 0603, 15 nH C3 = 0402 18 pF C7 = 0402 6.8 pF C3 = 0402 6.8 pF C7 = 0402 2.2 pF C3 = 0402 0.5 pF C7 = 0402 1.5 pF VSUP red test loop, GND black test loop VSUP red test loop, GND black test loop VSUP red test loop, GND black test loop 2300 MHz to 2400 MHz C1= 0402 12 pF C2 = 0402 2.2 pF C4 = 0603 12 pF C5 = 0603 10 nF C6 = 1206 10 μF 0603, 15 nH 2500 MHz to 2700 MHz C1 = 0402 12 pF C2 = 0402 1.0 pF C4 = 0603 12 pF C5 = 0603 10 nF C6 = 1206 10 μF 0603, 15 nH C3 = 0402 1.2 pF C7 = 0402 1.0 pF R1 = 0402 0 Ω VSUP red test loop, GND black test loop C3 = 0402 1.8 pF C7 = 0402 0.5 pF R1 = 0402 0 Ω VSUP red test loop, GND black test loop Table 10. Recommended Component Spacing on Evaluation Board Frequency (MHz) 450 to 500 800 to 960 1805 to 2170 2300 to 2400 2500 to 2700 λ1 (mils) 391 200 300 225 142 λ2 (mils) 75 75 75 75 75 Rev. 0 | Page 14 of 16 λ3 (mils) 364 100 175 125 89 λ4 (mils) 50 350 275 125 75 ADL5320 10uF 10uF 10nF 10nF 100pF C1 100pF 15nH C3 1.2pF C7 1pF C2 2.2pF R1 0Ω 05840-037 05840-035 C7 6.8pF C3 18pF 12pF C1 12pF C2 100pF 47nH Figure 34. Evaluation Board Layout and Component Placement 450 MHz to 500 MHz Operation Figure 36. Evaluation Board Layout and Component Placement 2300 MHz to 2400 MHz Operation 10uF 10uF 10nF 100pF C1 47pF 47nH 12pF C1 12pF C7 2.2pF 15nH C3 1.8pF C7 0.5pF C2 1.0pF R1 0Ω 05840-036 05840-034 C3 6.8pF 10nF C2 47pF Figure 35. Evaluation Board Layout and Component Placement 800 MHz to 960 MHz Operation Figure 37. Evaluation Board Layout and Component Placement 2500 MHz to 2700 MHz Operation Rev. 0 | Page 15 of 16 ADL5320 OUTLINE DIMENSIONS *1.55 REF (2) 4.25 3.94 1 2 2.60 2.30 3 1.20 0.90 1.50 TYP 3.00 TYP 4.60 4.40 1.60 1.40 0.44 0.35 END VIEW *0.52 0.32 *COMPLIANT TO JEDEC STANDARDS TO-243 WITH EXCEPTION TO DIMENSIONS INDICATED BY AN ASTERISK. 040407-A *0.58 0.40 Figure 38. 3−Lead Small Outline Transistor Package [SOT-89] (RK-3) Dimensions shown in millimeters ORDERING GUIDE Model ADL5320ARKZ-R7 1 ADL5320-EVALZ1 1 Temperature Range −40°C to +85°C Package Description 3-Lead SOT-89, 7“ Tape and Reel Evaluation Board Z = RoHS Compliant Part. ©2008 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D05840-0-2/08(0) Rev. 0 | Page 16 of 16 Package Option RK-3