TB6552FN/FNG/FL/FLG Toshiba Bi-CD Integrated Circuit Silicon Monolithic TB6552FN/FNG, TB6552FL/FLG DUAL-BRIDGE DRIVER IC FOR DC MOTORS The TB6552FN/FNG/FL/FLG is a dual-bridge driver IC for DC motors with output transistors in an LD MOS structure with low ON-resistance. Two input signals, IN1 and IN2, can chose one of four modes such as CW, CCW, short brake, and stop mode. A PWM drive system supports high heat efficiency driving. TB6552FN/FNG Features • Power supply voltage for motor: VM ≤ 15 V (max) • Power supply voltage for control: VCC = 2.7 V to 6.0 V • Output current: 1 A (max) • Low ON resistor: 1.5 Ω (typ.) (Upper side + lower side combined TB6552FL/FLG @ VM = 5 V) • Direct PWM control • Standby system (power saving) • CW/CCW/short brake/stop function modes • Built-in thermal shutdown circuit • Package: SSOP16 for TB6552FN/FNG /QON24 for TB6552FL/FLG TB6552FNG/FLG: The following conditions apply to solderability: *Solderability 1. Use of Sn-37Pb solder bath *solder bath temperature = 230°C *dipping time = 5 seconds *number of times = once *use of R-type flux 2. Use of Sn-3.0Ag-0.5Cu solder bath *solder bath temperature = 245°C *dipping time = 5 seconds *number of times = once *use of R-type flux Weight SSOP16-P-225-0.65B : 0.07 g (typ.) QON24-P-0505-0.50 : 0.05 g (typ.) * This product has a MOS structure and is sensitive to electrostatic discharge. When handling this product, ensure that the environment is protected against electrostatic discharge by using an earth strap, a conductive mat and an ionizer. Ensure also that the ambient temperature and relative humidity are maintained at reasonable levels. 1 2007-4-2 TB6552FN/FNG/FL/FLG Block Diagram VCC BIN1 BIN2 BPWM Control logic BSTBY BO1 (Ch. B) BO2 VM Bridge Driver (Ch. B) TSD Control logic GND AIN1 AIN2 Bridge Driver (Ch. A) (Ch. A) APWM ASTBY AO1 AO2 PGND Pin Functions Pin.Name Pin No FN/FNG FL/FLG Functional Description Remarks GND 1 21 Small-signal GND pin GND for small-signal power supply (VCC) AIN1 2 18 Control signal input 1 (Ch. A) AIN2 3 17 Control signal input 2 (Ch. A) APWM 4 16 PWM control signal input pin (Ch. A) Input PWM signal ASTBY 5 15 Standby control input pin (Ch. A) Ch. A circuit is in standby (power save) state while this signal is Low. AO1 7 13 Output pin 1 (Ch. A) Ch. A connect to motor coil pin AO2 8 11 Output pin 2 (Ch. A) Ch. A connect to motor coil pin PGND 9 10 GND pin for motor GND for motor power supply (VM) VM 6 14 Motor power supply pin VM (ope) = 2.5 V to 13.5 V BO2 10 8 Output pin 2 (Ch. B) Ch. B connect to motor coil pin BO1 11 5 Output pin 1 (Ch. B) Ch. B connect to motor coil pin BSTBY 12 4 Standby control input pin (Ch. B) Ch. B circuit is in standby (power save) state while this signal is Low. BPWM 13 3 PWM control signal input pin (Ch. B) Input PWM signal BIN2 14 2 Control signal input 2 (Ch. B) BIN1 15 1 Control signal input 1 (Ch. B) VCC 16 22 Small-signal power supply pin VCC (ope) = 2.7 V to 5.5 V Note: Pins 6, 7, 9, 12, 19, 20, 23 and 24 on the FL/FLG are NC (not connected) pins. 2 2007-4-2 TB6552FN/FNG/FL/FLG Input/Output Function (common for channel A and B) IN1 IN2 Input STBY Output PWM O1 O2 Mode L L Short brake H L H CW/CCW L L L Short brake H H L CCW/CW L L L Short brake H H H H L L H H H L H H L L H L H H/L H/L L L OFF (high impedance) Stop OFF (high impedance) Standby Operating Description • PWM control function Speed can be controlled by inputting the high-level or low-level PWM signal to the pin PWM. When PWM control is provided, normal operation and short brake operation are repeated. To prevent penetrating current, dead time (t2 and t4) is provided in the IC. VM O1 M VM O2 O1 M VM O1 O2 GND M GND GND PWM ON → OFF t2 = 300 ns (typ.) PWM ON t1 PWM OFF t3 VM O1 VM O2 M O2 O1 M GND O2 GND PWM OFF → ON t4 = 300 ns (typ.) PWM ON t5 VCC t5 Output Voltage Waveform (O1) t1 t3 t4 t2 GND Note: Be sure to set the PWM pin to high if the PWM control function is not used. 3 2007-4-2 TB6552FN/FNG/FL/FLG • Switching characteristics of output transistors The switching characteristics between the PWM input and the output transistors are shown below. PWM Input (APWM, BPWM) tpLH Output Voltage (A01, A02, B01, B02) tpHL 90％ 90％ 50％ 50％ 10％ 10％ tr tf <Typical Value> • Item Typical Value tpLH 1000 tpHL 1000 tr 100 tf 100 Unit ns Input pins Input pins AIN1, AIN2, APWM, ASTBY, BIN1, BIN2, BPWM and BSTBY have internal pull-down resistors that are connected to ground. 4 2007-4-2 TB6552FN/FNG/FL/FLG Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating VM 15 VCC 6 Input voltage VIN −0.2 to 6 V Output current IOUT 1 A Supply voltage Unit Remarks V IN1, 2, STBY and PWM pins 0.78 Power dissipation PD W (Note 1) Operating temperature Topr −20 to 85 °C Storage temperature Tstg −55 to 150 °C Note 1: This rating is obtained when the product is mounted on a 50 × 30 × 1.6 mm glass-epoxy PCB of which 40% or more is occupied by copper. Operating Range (Ta = −20 to 85°C) Characteristics Symbol Min Typ. Max Unit Supply voltage (VCC) VCC 2.7 3.0 5.5 V Supply voltage (VM) VM 2.5 5.0 13.5 V Output current Iout ⎯ ⎯ 0.8 A fPWM ⎯ ⎯ 100 kHz PWM frequency 5 2007-4-2 TB6552FN/FNG/FL/FLG Electrical Characteristics (unless otherwise specified, VCC = 3 V, VM = 12 V, Ta = 25°C) Characteristics Supply current Input voltage Control circuit Hysteresis voltage Input current Input voltage Standby circuit Input current Output saturating voltage Output leakage current Symbol Test Circuit ICC (STP) ⎯ ICC (W) ICC (SB) Min Typ. Max Stop mode ⎯ 0.9 1.2 ⎯ CW/CCW mode ⎯ 0.9 1.2 ⎯ Short break mode ⎯ 0.9 1.2 ICC (STB) ⎯ IM (STB) ⎯ VINH Test Condition ⎯ ⎯ 10 ⎯ ⎯ 1 ⎯ 2 ⎯ VCC + 0.2 VINL ⎯ −0.2 ⎯ 0.8 VIN (HIS) ⎯ ⎯ 0.2 ⎯ IINH ⎯ 5 15 25 IINL ⎯ ⎯ ⎯ 1 VINSH ⎯ 2 ⎯ VCC + 0.2 VINSL ⎯ −0.2 ⎯ 0.8 IINSH ⎯ 5 10 20 IINSL ⎯ ⎯ ⎯ 1 Io = 0.2 A ⎯ 0.3 0.4 Io = 0.8 A ⎯ 1.2 1.5 ⎯ ⎯ 1 ⎯ ⎯ 1 Vsat (U + L) IL (U) (Standby mode) (Not tested) VM = 15 V IL (L) Diode forward voltage PWM control circuit Unit mA μA V μA V μA V VF (U) Io = 0.8 A ⎯ 1 1.2 VF (L) Io = 0.8 A ⎯ 1 1.2 μA V PWM frequency fPWM ⎯ ⎯ 100 kHz Minimum clock pulse width tw (PWM) ⎯ ⎯ 10 μs Tr ⎯ 100 ⎯ ⎯ 100 ⎯ tpLH (PWM) ⎯ 1000 ⎯ tpHL (PWM) ⎯ 1000 ⎯ Tf Output transistor switching Thermal shutdown circuit operating temperature Thermal shutdown hysteresis Not tested ns TSD (Not tested) ⎯ 170 ⎯ °C ΔTSD (Not tested) ⎯ 20 ⎯ °C 6 2007-4-2 TB6552FN/FNG/FL/FLG Characteristic Wave Form TB6552FN/FNG PD – Ta 1.2 (1) 50 × 30 × 1.6 mm PCB mounting occupied copper area in excess of 40% 1.0 Power dissipation PD (W) (2) IC only θj-a = 250°C/W 0.8 (1) 0.6 (2) 0.4 0.2 0 0 50 100 150 Ambient temperature Hi-side 180 Ta (°C) VM – Ron Lo-side 3000 VCC – Ron 1000 2500 800 1500 Ta = 85°C Ta = 85°C 600 Ta = 25°C 400 Ta = 25°C 1000 Ta = −20°C 200 Ta = −20°C 500 0 1 Ron (mΩ) Ron (mΩ) 2000 2 3 4 5 0 1 6 VM (V) 2 3 VCC 7 4 5 6 (V) 2007-4-2 TB6552FN/FNG/FL/FLG Typical Application Diagram 5V 3V VDD VM Note 1 Note 1 VM VCC PWM PORT1 APWM PORT2 AIN1 PORT3 AIN2 PORT4 ASTBY AO1 Microcontroller M AO2 Note 2 TB6552 PWM PORT5 BPWM PORT6 BIN1 PORT7 BIN2 PORT8 BSTBY BO1 M BO2 GND Note 2 GND PGND Note 3 Note 1: The power supply capacitor should be connected as close as possible to the IC. Note 2: When connecting the motor pins through the capacitor for reducing noise, connect a resistor to the capacitor to limit the charge current. Note 3: Avoid using common impedance for GND and PGND. Note 4: Utmost care is necessary in the design of the output, VCC, VM, and GND lines since the IC may be destroyed by short-circuiting between outputs, air contamination faults, or faults due to improper grounding, or by short-circuiting between contiguous pins. 8 2007-4-2 TB6552FN/FNG/FL/FLG Requests Concerning Use of QON Outline Drawing of Package Upper surface Lower surface When using QON, take into account the following items. Caution (1) (2) Do not carry out soldering on the island sections in the four corners of the package (indicated by the hatched sections in the figure for the lower surface, above left) with the aim of increasing mechanical strength. The projecting island sections on the package surfaces (indicated by the hatched sections in the figures for the upper and lower surfaces above) must be electrically insulated from outside when used. Note 6: Ensure that the island sections (indicated by the hatched sections in the figure for the lower surface, above left) do not come into contact with solder from through-holes on the board layout. • When mounting or soldering, take care to ensure that neither static electricity nor electrical overstress is applied to the IC. (Measures to prevent electrostatic discharge, leaks, etc.) • When incorporating the IC into a set, adopt a set design that does not apply voltage directly to the island section. 9 2007-4-2 TB6552FN/FNG/FL/FLG Package Dimensions Weight: 0.07 g (typ.) 10 2007-4-2 TB6552FN/FNG/FL/FLG Package Dimensions Do not carry out soldering at the four corners of the package. Weight: 0.05 g (typ.) 11 2007-4-2 TB6552FN/FNG/FL/FLG Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on handling of ICs [1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. 12 2007-4-2 TB6552FN/FNG/FL/FLG Points to remember on handling of ICs (1) Thermal Shutdown Circuit Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation. (2) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (TJ) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (3) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. 13 2007-4-2 TB6552FN/FNG/FL/FLG RESTRICTIONS ON PRODUCT USE 070122EBA_R6 • The information contained herein is subject to change without notice. 021023_D • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. 021023_A • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. 021023_B • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. 070122_C • Please use this product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 060819_AF • The products described in this document are subject to foreign exchange and foreign trade control laws. 060925_E 14 2007-4-2