TORX147PL(F,T)
FIBER OPTIC RECEIVING MODULE
TORX147PL(F,T)
FIBER OPTIC RECEIVING MODULE
FOR DIGITAL AUDIO INTERFACE
Unit: mm
z For JEITA Standard CP−1212
(Digital Audio Optical Interface
for Consumer Equipment).
z Mini-package with Shutter System
z RoHS Compatible
Shutter Color：Black
4
Pin Connection
1. Output
2. GND
3. Vcc
4. N.C.
5. N.C.
5
3
１
2
1. Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Storage Temperature
Tstg
−40 to 70
°C
Operating Temperature
Topr
−20 to 70
°C
Supply Voltage
VCC
−0.5 to 4.5
V
High Level Output Current
IOH
−2
mA
Low Level Output Current
IOL
2
mA
Soldering Temperature
Tsol
260 (Note 1)
°C
Note 1: Soldering time ≤ 10 seconds (At a distance of 1 mm from the package).
2. Operating Range
Characteristics
Supply Voltage
Symbol
Min
Typ.
Max
Unit
VCC
2.7
3.0
3.6
V
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TORX147PL(F,T)
3. Electrical and Optical Characteristics (Ta = 25°C, VCC = 3 V)
Characteristics
Symbol
Test Condition
(Note 2)
Min
Typ.
Max
Unit
0.1
---
15
Mb / s
Data Rate
NRZ code
Transmission Distance
Using APF (Note 3), Using TOTX147PL(F,T)
0.2
---
5
m
−15
---
15
ns
Pulse Width Distortion
(Note 4)
⊿t w
Pulse Width = 67 ns
Pulse Cycle = 134 ns
CL = 10 pF
Using TOTX147PL(F,T)
Maximum Receivable
Power
(Note 5)
PMAX
15 Mb / s, Using APF
−14.5
---
---
dBm
Minimum Receivable
Power
(Note 5)
PMIN
15 Mb / s, Using APF
---
---
−24
dBm
Current Consumption
ICC
---
10
15
mA
High Level Output Voltage
VOH
2.1
2.5
---
V
Low Level Output Voltage
VOL
---
0.2
0.4
V
Note 2: 7.5Mb/s (max.) Biphase marked signal.
When modulated optical high level signal is received, output signal is high.
When modulated optical low level signal is received, output signal is low.
When non−modulated signal (optical all high or all low level signal) is inputted, output signal is not stable.
Note 3: All Plastic Fiber (980 / 1000 μm).
Note 4: Between input of TOTX147PL(F,T) and output of TORX147PL(F,T).
−9
Note 5: BER ≤ 10 , peak value.
4. Mechanical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
Insertion Force
(Note 6)
Initial value
---
---
39.2
N
Withdrawal Force
(Note 6)
Initial value
5.9
---
39.2
N
Note 6: Square type connector : EIAJ RC-5720B
5. Application Circuit
Fiber optic connector insertion side
Soldered to
PC board
Fiber optic
receiving
module
④
Less than 7mm
③
②
⑤
Soldered to
PC board
①
0.1μF
47μH
Vcc
GND
Output
(Bottom View)
6. Required Optical Fiber with Fiber Optic Connectors
All Plastic Fiber with Square Type Connector ( EIAJ RC-5720B )
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7. Board layout hole pattern (Recommendation)
2－φ1.1±0.05
2－φ1.7±0.05
3－φ0.8±0.05
2.54 TYP.
5.6 TYP.
2.54 TYP.
2.61 TYP.
2.625 TYP.
Unit：mm
Recommended PCB thickness：1.6mm
8. Precautions on Use
(1)
(2)
(3)
(4)
(5)
Absolute maximum rating
The absolute maximum ratings are the limit values which must not be exceeded during operation of
device. None of these rating value must not be exceeded. If the absolute maximum rating value is
exceeded, the characteristics of devices may never be restored properly. In extreme cases, the device
may be permanently damages.
Soldering
Optical modules are comprised of internal semiconductor devices. However, in principle, optical
modules are optical components. During soldering, ensure that flux does not contact with the emitting
surface or the detecting surface. Also ensure that proper flux removal is conducted after soldering.
Some optical modules come with shutter system. The shutter is closed to avoid malfunction when the
optical module is not in use. Note that it is not dust or waterproof.
As mentioned before, optical modules are optical components. Thus, in principle, soldering where
there may be flux residue and flux removal after soldering is not recommended. Toshiba recommend
that soldering be performed without the optical module mounted on the board. Then, after the board
has been cleaned, the optical module should be soldered on to the board manually.
If the optical module cannot be soldered manually, use non−halogen (chlorine−free) flux and make
sure, without cleaning, there is no residue such as chlorine. This is one of the ways to eliminate the
effects of flux. In such a cases, be sure to check the devices' reliability.
Noise resistance
It is believed that the use of optical transfer devices improve noise resistance. In theory, optical fiber
is not affected by noise at all. However, receiving modules which handle signals whose level is
extremely small, are susceptible to noise.
TOSLINK improve noise resistance to use a conductive case. However, the current signal output by
the optical receiving modules' photodiode is extremely small. Thus, in some environments, shielding
the case may not achieve sufficient noise resistance.
For systems which incorporate TOSLINK, Toshiba recommend testing using the actual device to
check its noise resistance.
Use a simple noise filter on TOSLINK fiber optic transceiving module's power line. If the ripple in the
power supply used is significant, reinforce the filter.
The optical module is to be used in an area which is susceptible to radiated noise, increase the
shielding by covering the optical module and the power line filter with a metallic cover.
Vibration and shock
This module is plastic sealed and has its wire fixed by resin. This structure is relatively resistant to
vibration and shock. In actual equipment, there are sometime cases in which vibration, shock, or
stress is applied to soldered parts or connected parts, resulting in lines cut. A care must be taken in
the design of equipment which will be subject to high levels of vibration.
Support pins
The TORX147PL(F,T) has support pins in order to fix itself to the PCB temporary. Please make the
hole for these pins in the PCB under the condition described in board layout hole pattern.
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TORX147PL(F,T)
(6)
Attaching the fiber optic receiving module
Solder the fixed pins (pins 4 and 5) of the fiber optic receiving module TORX147PL(F,T) to the printed
circuit board in order to fix it to the board.
(7) Solvent
When using solvent for flux removal, do not use a high acid or high alkali solvent. Be careful not to
pour solvent in to the optical connector ports. If solvent is inadvertently poured in to them, clean it off
using cotton tips.
(8) Supply voltage
Use the supply voltage within the recommended operating condition (VCC = 2.7 to 3.6 V). Make sure
that supply voltage does not exceed the maximum rating value of 4.5 V, even for an instant.
(9) Output
If the receiver output is at low and is connected to the power supply, or if the output is high and is
connected to GND, the internal IC may be destroyed.
(10) Soldering condition
Solder at 260°C or less for no more than ten seconds.
(11) Case(receptacle) material
The case is made of polycarbonate. Polycarbonate is usually stable with acid, alcohol, and
aliphatic hydrocarbons however, with petrochemicals (such as benzene, toluene, and acetone),
alkali, aromatic hydrocarbons, or chloric hydrocarbons, polycarbonate becomes cracked, swollen,
or melted. Please take care when choosing a packaging material by referencing the table below.
〈Chemicals to avoid with polycarbonate〉
A
B
PHENOMENON
Little deterioration
But staining
Cracked crazed,
or Swollen
C
Melted
｛ ｝：used as solvent
D
Decomposed
CHEMICALS
・nitric acid(low concentration) , hydrogen peroxide, chlorine
・acetic acid(70% or more)
・gasoline
・methyl isobutyl ketone, ethyl acetate, butyl acetate
・methyl methacrylate, ethyl ether, MEK
・acetone, m-amino alcohol, carbon tetrachloride
・carbon disulfide, trichloroethylene, cresol
・thinners, oil of turpentine
・triethanolamine
・concentrated sulfuric acid
・benzene
・styrene, acrylonitrile, vinyl acetate
・ethylenediamine, diethylenediamine
・{chloroform, methyl chloride, tetrachloromethane, dioxane}
{1,2-dichloroethane}
・ammonia water
・other alkali
(12) Precautions when disposing of devices and packing materials.
When disposing devices and packing materials, follow the procedures stipulated by local regulations
in order to protect the environment against contamination.
(13) Precautions during use
Toshiba is continually working to improve the quality and the reliability of their products.
Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical
sensitivity and their vulnerability to physical stress. It is the responsibility of the buyer, when
utilizing Toshiba products, to observe standards of safety, and to avoid situations in which the
malfunction or failure of a Toshiba product could cause loss of human life, bodily injury or damage to
property.
When developing equipment, please ensure that Toshiba products are used within the specified
operating ranges set forth in the most recent product specifications. Also, please keep in mind the
precautions and conditions set forth in the Toshiba Semiconductor Reliability Handbook.
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TORX147PL(F,T)
RESTRICTIONS ON PRODUCT USE
20070701-EN
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
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