TK13P25D MOSFETs Silicon N-Channel MOS (π-MOS) TK13P25D 1. Applications • Switching Voltage Regulators 2. Features (1) Low drain-source on-resistance: RDS(ON) = 0.19 Ω (typ.) (2) Low leakage current: IDSS = 10 µA (max) (VDS = 250 V) (3) Enhancement mode: Vth = 1.5 to 3.5 V (VDS = 10 V, ID = 1 mA) 3. Packaging and Internal Circuit 1: Gate (G) 2: Drain (D) 3: Source (S) DPAK unless otherwise specified) 25 4. Absolute Maximum Ratings (Note) (Ta = 25 Characteristics Symbol Rating Unit Drain-source voltage VDSS 250 V Gate-source voltage VGSS ±20 Drain current (DC) (Note 1) ID 13 Drain current (pulsed) (Note 1) IDP 52 PD 96 W Power dissipation (Tc = 25) A Single-pulse avalanche energy (Note 2) EAS 78 mJ Avalanche current (Note 3) IAR 13 A Reverse drain current (DC) (Note 1) IDR 13 Reverse drain current (pulsed) (Note 1) IDRP 52 Channel temperature Tch 150 Storage temperature Tstg -55 to 150 Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). 1 2011-07-06 Rev.2.0 TK13P25D 5. Thermal Characteristics Characteristics Symbol Max Unit /W Channel-to-case thermal resistance Rth(ch-c) 1.3 Channel-to-ambient thermal resistance Rth(ch-a) 125 Note 1: Ensure that the channel temperature does not exceed 150. Note 2: VDD = 50 V, Tch = 25 (initial), L = 0.77 mH, RG = 25 Ω, IAR = 13 A Note 3: Repetitive rating; pulse width limited by maximum channel temperature Note: This transistor is sensitive to electrostatic discharge and should be handled with care. 2 2011-07-06 Rev.2.0 TK13P25D 6. Electrical Characteristics unless otherwise specified) 6.1. Static Characteristics (Ta = 25 25 Characteristics Gate leakage current Drain cut-off current Drain-source breakdown voltage Gate threshold voltage Drain-source on-resistance Symbol Test Condition IGSS VGS = ±20 V, VDS = 0 V IDSS VDS = 250 V, VGS = 0 V Min Typ. Max Unit ±1 µA 10 V(BR)DSS ID = 10 mA, VGS = 0 V 250 Vth VDS = 10 V, ID = 1 mA 1.5 3.5 RDS(ON) VGS = 10 V, ID = 6.5 A 0.19 0.25 Ω Min Typ. Max Unit 1100 pF V unless otherwise specified) 6.2. Dynamic Characteristics (Ta = 25 25 Characteristics Input capacitance Symbol Ciss Test Condition VDS = 100 V, VGS = 0 V, f = 1 MHz Reverse transfer capacitance Crss 8 Output capacitance Coss 66 Gate resistance rg VDS = OPEN, f = 1 MHz 5 Ω Switching time (rise time) tr See Figure 6.2.1. 40 ns Switching time (turn-on time) ton 55 tf 20 toff 130 Switching time (fall time) Switching time (turn-off time) Fig. 6.2.1 Switching Time Test Circuit unless otherwise specified) 25 6.3. Gate Charge Characteristics (Ta = 25 Characteristics Total gate charge (gate-source plus gate-drain) Symbol Qg Test Condition VDD ≈ 200 V, VGS = 10 V, ID = 13 A Min Typ. Max Unit 25 nC Gate-source charge 1 Qgs1 4.2 Gate-drain charge Qgd 8.5 unless otherwise specified) 25 6.4. Source-Drain Characteristics (Ta = 25 Characteristics Symbol Test Condition Min Typ. Max Unit Diode forward voltage VDSF IDR = 13 A, VGS = 0 V -1.7 V Reverse recovery time trr 180 ns Reverse recovery charge Qrr IDR = 13 A, VGS = 0 V -dIDR/dt = 100 A/µs 1.1 µC Peak reverse recovery current Irr 12 A 3 2011-07-06 Rev.2.0 TK13P25D 7. Marking Fig. 7.1 Marking 4 2011-07-06 Rev.2.0 TK13P25D 8. Characteristics Curves (Note) Fig. 8.1 ID - VDS Fig. 8.2 ID - VDS Fig. 8.3 ID - VGS Fig. 8.4 VDS - VGS Fig. 8.5 |Yfs| - ID Fig. 8.6 RDS(ON) - ID 5 2011-07-06 Rev.2.0 TK13P25D Fig. 8.7 RDS(ON) - Ta Fig. 8.8 IDR - VDS Fig. 8.9 C - VDS Fig. 8.10 Vth - Ta Fig. 8.11 PD - Tc (Guaranteed Maximum) Fig. 8.12 Dynamic Input/Output Characteristics 6 2011-07-06 Rev.2.0 TK13P25D Fig. 8.13 rth/Rth(ch-c) - tw (Guaranteed Maximum) Fig. 8.14 Safe Operating Area (Guaranteed Maximum) Fig. 8.15 EAS - Tch (Guaranteed Maximum) Fig. 8.16 Test Circuit/Waveform Note: The above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. 7 2011-07-06 Rev.2.0 TK13P25D Package Dimensions Unit: mm Weight: 0.36 g (typ.) Package Name(s) TOSHIBA: 2-7K1S Nickname: DPAK 8 2011-07-06 Rev.2.0 TK13P25D RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. 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