TOSHIBA Original CMOS 8-Bit Microcontroller TLCS-870 Series TMP87CH29UG, TMP87CH29NG TMP87CK29UG, TMP87CK29NG TMP87CM29UG, TMP87CM29NG Semiconductor Company Revision History Date Revision 2003/3/20 1 First Release 2008/3/06 2 Contents Revised 2008/9/30 3 Contents Revised Caution in Setting the UART Noise Rejection Time When UART is used, settings of RXDNC are limited depending on the transfer clock specified by BRG. The combination "O" is available but please do not select the combination "–". The transfer clock generated by timer/counter interrupt is calculated by the following equation : Transfer clock [Hz] = Timer/counter source clock [Hz] ÷ TTREG set value RXDNC setting 00 (No noise rejection) 01 (Reject pulses shorter than 31/fc[s] as noise) 10 (Reject pulses shorter than 63/fc[s] as noise) 11 (Reject pulses shorter than 127/fc[s] as noise) fc/13 O O O – fc/8 O – – – fc/16 O O – – fc/32 O O O – O O O O BRG setting Transfer clock [Hz] 000 110 (When the transfer clock generated by timer/counter interrupt is the same as the right side column) The setting except the above TMP87CH29/K29/M29 Document Change Notification The purpose of this notification is to inform customers about the launch of the Pb-free version of the device. The introduction of a Pb-free replacement affects the datasheet. Please understand that this notification is intended as a temporary substitute for a revision of the datasheet. Changes to the datasheet may include the following, though not all of them may apply to this particular device. 1. Part number Example: TMPxxxxxxF → TMPxxxxxxFG All references to the previous part number were left unchanged in body text. The new part number is indicated on the prelims pages (cover page and this notification). 2. Package code and package dimensions Example: LQFP100-P-1414-0.50C → LQFP100-P-1414-0.50F All references to the previous package code and package dimensions were left unchanged in body text. The new ones are indicated on the prelims pages. 3. Addition of notes on lead solderability Now that the device is Pb-free, notes on lead solderability have been added. 4. RESTRICTIONS ON PRODUCT USE The previous (obsolete) provision might be left unchanged on page 1 of body text. A new replacement is included on the next page. 5. Publication date of the datasheet The publication date at the lower right corner of the prelims pages applies to the new device. I 2008-03-06 TMP87CH29/K29/M29 1. Part number 2. Package code and dimensions Previous Part Number Previous Package Code New Part Number (in Body Text) (in Body Text) New Package Code OTP TMP87PM29UG TMP87CH29U P-LQFP64-1010-0.50D TMP87CH29UG LQFP64-P-1010-0.50D TMP87CH29N P-SDIP64-750-1.78 TMP87CH29NG SDIP64-P-750-1.78 TMP87PM29NG TMP87CK29U P-LQFP64-1010-0.50D TMP87CK29UG LQFP64-P-1010-0.50D TMP87PM29UG TMP87CK29N P-SDIP64-750-1.78 TMP87CK29NG SDIP64-P-750-1.78 TMP87PM29NG TMP87CM29U P-LQFP64-1010-0.50D TMP87CM29UG LQFP64-P-1010-0.50D TMP87PM29UG TMP87CM29N P-SDIP64-750-1.78 TMP87CM29NG SDIP64-P-750-1.78 TMP87PM29NG *: For the dimensions of the new package, see the attached Package Dimensions diagram. 3. Addition of notes on lead solderability The following solderability test is conducted on the new device. Lead solderability of Pb-free devices (with the G suffix) Test Solderability Test Conditions (1) Use of Lead (Pb) ·solder bath temperature = 230°C ·dipping time = 5 seconds ·the number of times = once ·use of R-type flux (2) Use of Lead (Pb)-Free ·solder bath temperature = 245°C ·dipping time = 5 seconds ·the number of times = once ·use of R-type flux Remark Leads with over 95% solder coverage till lead forming are acceptable. II 2008-03-06 TMP87CH29/K29/M29 4. RESTRICTIONS ON PRODUCT USE The following replaces the “RESTRICTIONS ON PRODUCT USE” on page 1 of body text. RESTRICTIONS ON PRODUCT USE 20070701-EN • The information contained herein is subject to change without notice. • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk. • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. • Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. • For a discussion of how the reliability of microcontrollers can be predicted, please refer to Section 1.3 of the chapter entitled Quality and Reliability Assurance/Handling Precautions. 5. Publication date of the datasheet The publication date of this datasheet is printed at the lower right corner of this notification. III 2008-03-06 TMP87CH29/K29/M29 (Annex) Package Dimensions LQFP64-P-1010-0.50D Unit: mm 1.25 typ 10.0 0.2 48 33 49 32 64 17 (0~10 ) 0.6 0.15 IV 1.6max 0.25 0.145 0.055 0.08 1.4 0.05 16 0.1 0.05 1 12.0 0.2 10.0 0.2 0.5 0.22 0.05 0.08 M 12.0 0.2 2008-03-06 TMP87CH29/K29/M29 SDIP64-P-750-1.78 Unit: mm V 2008-03-06